Before reviewing features of the next series in the OKL product family, this slide will cover some of the background behind its unique iLGA technology. Traditional LGA (or Land Grid Array) is a grid-array SMT package with terminal pads on the bottom surface. Conventional packages often do not, however, allow for access to all LGA solder joints. Meanwhile, iLGA is an innovative LGA package design that allows easy access of signal pads for inspection of LGA solder joints as can be seen in the product photo.

