Telecommunications

Key Components for Infrastructure

  • Modems
  • Radio Links
  • Baseband Unit
  • Optical Nodes
  • Gateways - Routers, Switches, Access Points, Hubs, WiFi6e, Bridges, Repearters

Modems

Ceramic Capacitors

X1/Y1 safety rating (acc. to IEC 60384-14, 3rd edition)

  • AC Line Rated Ceramic Disc Capacitors
  • Highest reliability and lifetime, operating temperature - 40 °C to + 125 °C

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • TrenchFET® Gen IV power MOSFET
  • Very low RDS - Qg figure-of-merit (FOM). Tuned for the lowest RDS - Qoss FOM
  • Compact thermally efficient PowerPAK® 1212-8S package

Diodes and Rectifiers

Surface-Mount TRANSZORB® Transient Voltage Suppressors

  • 400 W peak pulse power capability with 10/1000 µs waveform
  • AEC-Q101 qualified

Resistors

Power Metal Strip® Resistors, Low Value (Down to 0.001 Ω), Surface-Mount

  • Low TCR element (< 20 ppm) results in accurate current sensing in applications
  • Power Metal Strip® construction offers high reliability in critical applications

Ceramic Capacitors

Ultra Stable Dielectric Material for High Frequency

  • Small sizes 0402, 0603, 0805 including sub-pico range
  • Terminations 100% matte tin, non-magnetic for conductive assembly

Power ICs

3 V to 24 V Input, 24 A microBUCK® DC/DC Converter

  • Wide input range 3 V to 24 V
  • Compact MLP 4x4 package for high power density

Ceramic Capacitors

Safety certified capacitors, Class X1/Y2 and X2 for 250 VAC in C0G (NP0) and X7R

  • Approved IEC 60384-14
  • Surface-mount design for simpler assembly
  • Available in NP0 (C0G) or X7R dielectrics with higher capacitance, smaller sizes

Inductors

Low Profile, High Current Inductors

  • Magnetic alloy power choke coil, minature size (2.0 mm x 1.6 mm), and low profile
  • Low acoustic noise and high efficiency

Resistors

Metal Foil Current Sense Resistors, Very High Power (to 2 W)

  • Ultra low sensing resistance minimizes power dissipation, improving efficiency
  • Wide side terminal construction (0508 and 0612) for lower ESL
  • High power to foot print size ratio (2 W in 0612 and 0.5 W in 0508

Radio Links

Inductors

IHLP® Commercial Inductors, High Saturation Series

  • Compact composite inductor for high efficiency DC/DC conversion
  • Handles high transient current spikes without saturation

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • Latest TrenchFET® generation
  • Great safe operation area with clip technology
  • Only 3.6 m? in industry standard PowerPAK® SO-8

MOSFETs

Gen 5 Silicon Power MOSFET

  • Optimized switching performance with lowest Qoss
  • 150 VDS, 7.9 mΩ in PowerPAK® SO8
  • Less than 8 mΩ in industry standard PowerPAK SO8

Power ICs

3 V to 28 V Input, 8 A, 12 A microBUCK® DC/DC Converters

  • Internal compensation, small solution, high efficiency up to 97 %
  • Scalable solution 8 A and 12 A, adjustable output voltage down to 0.6 V
  • Cycle-by-cycle current limit, OVP, UV, power good flag, over temperature protection

Resistors

High Frequency, 50 GHz, Thin Film Chip Resistors

  • Operating frequency 50 GHz
  • Thin film microwave resistors

Power ICs

4.5 V to 20 V Input, 25 A microBUCK® DC/DC Converter with PMBus Interface

  • Versatile, highly efficient, highly configurable, and robust and reliable
  • Single supply operation from 4.5 V to 20 V input voltage
  • Fast transient response allows smaller output capacitors

Ceramic Capacitors

Ultra Stable Dielectric Material for High Frequency, High Temperature (175 °C / 200 °C)

  • Small sizes 0402, 0505, 0603, 0805, 1111 including sub-pico range
  • Voltage range from 25 VDC up to 500 VDC

Diodes and Rectifiers

High Current Density Surface-Mount (TMBS®) Trench MOS Barrier Schottky Rectifier

  • Ultra Low VF = 0.53 V at IF = 5 A
  • Compact, thermally efficient FlatPAK 5 x 6

Resistors

Metal Foil Current Sense Resistors, Very High Power (to 2 W)

  • Ultra low sensing resistance minimizes power dissipation, improving efficiency
  • Wide side terminal construction (0508 and 0612) for lower ESL
  • High power to foot print size ratio (2 W in 0612 and 0.5 W in 0508

Baseband Unit

Inductors

Low-Profile, High-Current IHLP® Inductors

  • Large size, high-current, low-saturation SMD inductor
  • DC/DC conversion, filter applications

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • Latest TrenchFET® generation
  • Great safe operation area with clip technology
  • Only 3.6 m? in industry standard PowerPAK® SO-8

MOSFETs

Gen 5 Silicon Power MOSFET

  • Optimized switching performance with lowest Qoss
  • 150 VDS, 7.9 mΩ in PowerPAK® SO8
  • Less than 8 mΩ in industry standard PowerPAK SO8

Power ICs

80 A VRPower®, Smart Power Stage With Current Sensing and Temperature Monitor

  • 80 A with lossless current sensing- no shunt needed
  • Temperature and current monitoring
  • Integrated MOSFET driver

Inductors

IHLP® Commercial Inductors, High Saturation Series

  • Compact composite inductor for high efficiency DC/DC conversion
  • High frequency operation out to 5 MHz, excellent saturation
  • Reduced emission of EMI

Resistors

Power Metal Strip® Resistors, Low Value (Down to 0.0005 Ω), Surface-Mount

  • Extremely low resistance values from 0.0005 Ω to 0.5 Ω and tolerance of 1 %
  • Power Metal Strip all-welded construction offers high pulse capacity

Diodes and Rectifiers

High Current Density Surface-Mount (TMBS®) Trench MOS Barrier Schottky Rectifier

  • Ultra Low VF = 0.53 V at IF = 5 A
  • Compact, thermally efficient FlatPAK 5 x 6

Resistors

Metal Foil Current Sense Resistors, Very High Power (to 2 W)

  • Ultra low sensing resistance minimizes power dissipation, improving efficiency
  • Wide side terminal construction (0508 and 0612) for lower ESL
  • High power to foot print size ratio (2 W in 0612 and 0.5 W in 0508

Inductors

Ultra Low DCR Inductors, High Temperature (155 °C) Series

  • Lowest DCR/μH, in this package size. Inductance values up to 100nH
  • Excellent DC/DC energy storage up to 10 MHz.
  • Shielded construction.  Handles high transient current spikes without saturation

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • TrenchFET® Gen IV power MOSFET
  • Very low RDS - Qg figure-of-merit (FOM). Tuned for the lowest RDS - Qoss FOM
  • Compact thermally efficient PowerPAK® 1212-8S package

Power ICs

3 V to 28 V Input, 8 A, 12 A microBUCK® DC/DC Converters

  • Internal compensation, small solution, high efficiency up to 97 %
  • Scalable solution 8 A and 12 A, adjustable output voltage down to 0.6 V
  • Cycle-by-cycle current limit, OVP, UV, power good flag, over temperature protection

Optical Nodes

Power ICs

3 V to 28 V Input, 8 A, 12 A microBUCK® DC/DC Converters

  • Internal compensation, small solution, high efficiency up to 97 %
  • Scalable solution 8 A and 12 A, adjustable output voltage down to 0.6 V
  • Cycle-by-cycle current limit, OVP, UV, power good flag, over temperature protection

Power ICs

4.5 V to 20 V Input, 25 A microBUCK® DC/DC Converter with PMBus Interface

  • Versatile, highly efficient, highly configurable, and robust and reliable
  • Single supply operation from 4.5 V to 20 V input voltage
  • Fast transient response allows smaller output capacitors

Inductors

IHLP® Commercial Inductors, High Saturation Series

  • Compact composite inductor for high efficiency DC/DC conversion
  • Handles high transient current spikes without saturation

Resistors

High Frequency (Up to 40 GHz) Resistor, Thin Film Surface Mount Chip

  • Small standard size 0402 case size, Edge trimmed block resistors
  • Small internal reactance (< 10 mΩ), Low TCR (down to ± 25 ppm/°C)
  • High purity alumina substrate

Resistors

Metal Foil Current Sense Resistors, Very High Power (to 2 W)

  • Ultra low sensing resistance minimizes power dissipation, improving efficiency
  • Wide side terminal construction (0508 and 0612) for lower ESL
  • High power to foot print size ratio (2 W in 0612 and 0.5 W in 0508

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • TrenchFET® Gen IV power MOSFET
  • Very low RDS - Qg figure-of-merit (FOM). Tuned for the lowest RDS - Qoss FOM
  • Compact thermally efficient PowerPAK® 1212-8S package

Thermistors

SMD 0603, Glass Protected NTC Thermistors

  • Standard series, AEC-Q200 qualified
  • Glass protected with soft terminations

Gateways - Routers, Switches, Access Points, Hubs, WiFi6e, Bridges, Repearters

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • Latest TrenchFET® generation
  • Great safe operation area with clip technology
  • Only 3.6 m? in industry standard PowerPAK® SO-8

Power ICs

3 V to 28 V Input, 8 A, 12 A microBUCK® DC/DC Converters

  • Internal compensation, small solution, high efficiency up to 97 %
  • Scalable solution 8 A and 12 A, adjustable output voltage down to 0.6 V
  • Cycle-by-cycle current limit, OVP, UV, power good flag, over temperature protection

Inductors

IHLP® Commercial Inductors, High Saturation Series

  • Compact composite inductor for high efficiency DC/DC conversion
  • Handles high transient current spikes without saturation

Resistors

Pulse Proof, High Power Thick Film Chip Resistors

  • Excellent pulse load capability
  • Enhanced power rating, double-side printed resistor element
  • High power thick film chip resistors is the perfect choice for power measurement

Resistors

Metal Foil Current Sense Resistors, Very High Power (to 2 W)

  • Ultra low sensing resistance minimizes power dissipation, improving efficiency
  • Wide side terminal construction (0508 and 0612) for lower ESL
  • High power to foot print size ratio (2 W in 0612 and 0.5 W in 0508

MOSFETs

N-Channel 100 V (D-S) MOSFET

  • TrenchFET® Gen IV power MOSFET
  • Very low RDS - Qg figure-of-merit (FOM). Tuned for the lowest RDS - Qoss FOM
  • Compact thermally efficient PowerPAK® 1212-8S package

Optoelectronics

Phototransistor Optocoupler in Small SSOP-4 Half-Pitch Mini-Flat Package

  • High current transfer ratio
  • Low input current IF = 1 mA with current transfer ratios of 600 % maximum
  • Isolation voltage 3750 VRMS, operating temperature range -55 °C to +110 °C