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Tflex™ SF600D Series
Compliant silicone-free 2.8-3.0 W/mK thermally conductive gap filler
Laird Technologies' Tflex SF600 DF is a high performance, silicone-free thermal gap filler with a conductivity of 2.8 W/mK to 3.0 W/mK. Tflex SF600 DF is designed for applications which are silicone sensitive. This material is certified to UL 94V0 flammability ratings.
Features
- Silicone-free gap pad
- 2.8 W/mK thermal conductivity for material thicknesses of 10 to 30 mils
- 3.0 W/mK thermal conductivity for material thicknesses of 40 to 60 mils
- Available in thicknesses from 0.010 inch (0.25 mm) through 0.060 inch (1.5 mm) in 0.010 inch increments
- Differential tack on one side for easy assembly and rework
Applications
- Automotive applications
- Applications involving optical components
- Flat panel displays
- Hard drives
Tflex SF600D Series
| Abbildung | Hersteller-Teilenummer | Beschreibung | Verfügbare Menge | Preis | ||
|---|---|---|---|---|---|---|
 |  | A16367-04 | THERM PAD 228.6MMX215.9MM PINK | 57 - Sofort | $67.44 | Details anzeigen |
|  | A16367-02 | THERM PAD 228.6MMX215.9MM PINK | 186 - Sofort | $46.44 | Details anzeigen |
|  | A16367-06 | THERM PAD 228.6MMX215.9MM PINK | 4 - Sofort | $97.66 | Details anzeigen |
Veröffentlicht: 2012-06-29
Österreich