NXP Semiconductors

Kinetis KL03 20-pin Chip-Scale Package MCU Family

The Kinetis KL03 chip-scale package (CSP) is the next world’s smallest ARM Powered® MCU

Kinetis KL03 20-pin Chip-Scale Package MCU Family NXP's Kinetis KL03 chip-scale package (CSP) is available in the ultra-small 1.6 mm2 x 2.0 mm2 wafer-level CSP. The Kinetis KL03 CSP reduces board space while integrating even more rich MCU features than previously seen in the market. The Kinetis KL03 CSP consumes 35% less PCB area, yet delivers 60% more GPIO than the nearest competing MCU. As part of Freescale's Kinetis mini-MCU portfolio, the Kinetis KL03 CSP allows designers to dramatically reduce their board size without compromising the performance, feature integration and power consumption of their end products.

Features
  • Core platform clock up to 48 MHz, bus clock up to 24 MHz
  • Memory option is up to 32 KB flash, 2 KB RAM and 8 KB ROM with build-in boot loader
  • Wide operating voltage ranges from 1.71 V to 3.6 V with fully functional flash program/erase/read operations
  • Multiple package options from 16-pin to 24-pin
  • Ambient operating temperature ranges from -40°C to +85°C for WLCSP package and -40°C to +105°C for all the other packages.
Applications
  • Ingestible healthcare sensing
  • Low-power devices
  • Miniaturized wearables
  • Portable consumer devices
  • Remote sensing nodes
Veröffentlicht: 2014-08-28