Datenblatt für WP710A10WG1C von Kingbright

Kl'ngbrl'ghI A M 11.6 o.1a1)tu.3 27(|.063)M\N. V.5(0.059)i| 7 913.2(0JZE) ’3 i CATHUDE ‘ ’3 ‘ 7 ‘ RECOVMENDED PCB LAYOUT 2177 (x if
SPEC NO: DSAL4967 REV NO: V.2B DATE: MAR/15/2014 PAGE: 1 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1101030219
T-1 (3mm) SOLID STATE LAMP
ATTENTION
OBSERVE PRECAUTIONS
FOR HANDLING
ELECTROSTATIC
DISCHARGE
SENSITIVE
DEVICES
Part Number: WP710A10WG1C Green
Features
Low power consumption.
Popular T-1 diameter package.
General purpose leads.
Reliable and rugged.
Long life - solid state reliability.
Available on tape and reel.
RoHS compliant.
Descriptions
The Green source color devices are made with
InGaN Light Emitting Diode.
Electrostatic discharge and power surge could damage
the LEDs.
It is recommended to use a wrist band or
antielectrostatic glove when handling the LEDs.
All devices, equipments and machineries must be
electrically grounded.
Package Dimensions
Notes:
1. All dimensions are in millimeters (inches).
2. Tolerance is ±0.25(0.01") unless otherwise noted.
3. Lead spacing is measured where the leads emerge from the package.
4. The specifications, characteristics and technical data described in the datasheet are subject to change without prior
notice.
Kl'ngbrl'ghI
SPEC NO: DSAL4967 REV NO: V.2B DATE: MAR/15/2014 PAGE: 2 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1101030219
Selection Guide
Notes:
1. θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 of the optical peak value.
2. Luminous intensity/ luminous Flux: +/-15%.
3. Luminous intensity value is traceable to the CIE127-2007 compliant national standards.
Absolute Maximum Ratings at TA=25°C
Electrical / Optical Characteristics at TA=25°C
Notes:
1.Wavelength: +/-1nm.
2. Forward Voltage: +/-0.1V.
3. Wavelength value is traceable to the CIE127-2007 compliant national standards.
Notes:
1. 1/10 Duty Cycle, 0.1ms Pulse Width.
2. 2mm below package base.
3. 5mm below package base.
Part No. Dice Lens Type
V
iewing
Angle [1]
Min. Typ. 2θ1/2
WP710A10WG1C Green (InGaN) Water Clear 3000 5800 34°
Iv (mcd) [2]
@ 20mA
Symbol Parameter Device Typ. Max. Units Test Conditions
λpeak Peak Wavelength Green 505 nm IF=20mA
λD [1] Dominant Wavelength Green 505 nm IF=20mA
Δλ1/2 Spectral Line Half-width Green 28 nm IF=20mA
C Capacitance Green 45 pF VF=0V;f=1MHz
VF [2] Forward Voltage Green 3.2 3.8 V IF=20mA
IR Reverse Current Green 10 uA VR = 5V
Parameter Green Units
Power dissipation 95 mW
DC Forward Current 25 mA
Peak Forward Current [1] 150 mA
Reverse Voltage 5 V
Operating/Storage Temperature -40°C To +85°C
Lead Solder Temperature [2] 260°C For 3 Seconds
Lead Solder Temperature [3] 260°C For 5 Seconds
Kl'ngbrl'ghI GREEN .> no '5 = 2 5 0.5 .6 u m a) .2 7°. 0 k 350 400 A50 500 550 500 650 wavelenglh x (nm) RELATIVE INTENSITY Vs. WAVELENGTH 56 ‘25 1? E 5 m 32.0 E 30 is us u g g E 20 5 5 ‘-° E m L2” 3 E 0 3 Q“ a 2,5 2,5 3,0 3.2 3.4 3.6 a lo 20 so 40 50 Fovwavd Vanug.(v) lFirnrwmd swam (MA) FORWARD CURRENT VS. LUMINDUS INTENS‘TV Vs, FORWARD VOLTAGE FORWARD CURRENY > 2.5 2‘ E E a 2.0 T: 3 t n 1.5 E E Lu § 3 E 2 “‘5 o T: u a 20 AD so xu mu m '40 '2“ B 1’3 4° 5° 50 Ambrem Temperalw: n (-c) ronwmn cuxnzm DERAHNG CURVE Ambiem Tamparuiwu m-c) LuwNous mTENsmr Vs. mam" TEMPERATukE 50' AD- szr su- 70' my ao~ o SPAIIAL mswaunoN 0.5
SPEC NO: DSAL4967 REV NO: V.2B DATE: MAR/15/2014 PAGE: 3 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1101030219
Green WP710A10WG1C
Kl'ngbrl'ghI King right outs"): / LABEL if: EU 9
SPEC NO: DSAL4967 REV NO: V.2B DATE: MAR/15/2014 PAGE: 4 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1101030219
PACKING & LABEL SPECIFICATIONS WP710A10WG1C
Terms and conditions for the usage of this document
1.The information included in this document reflects representative usage scenarios and is intended
for technical reference only.
2.The part number, type, and specifications mentioned in this document are subject to future change
and improvement without notice. Before production usage customer should refer to the latest
datasheet for the updated specifications.
3.When using the products referenced in this document, please make sure the product is being
operated within the environmental and electrical limits specified in the datasheet. If customer usage
exceeds the specified limits, Kingbright will not be responsible for any subsequent issues.
4.The information in this document applies to typical usage in consumer electronics applications.
If customer's application has special reliability requirements or have life-threatening liabilities,
such as automotive or medical usage, please consult with Kingbright representative for further
assistance.
5.The contents and information of this document may not be reproduced or re-transmitted without
permission by Kingbright.
6.All design applications should refer to Kingbright application notes available at
http://www.KingbrightUSA.com/ApplicationNotes
Kl'ngbrl'ght PRECAUTIONS ‘l. The lead pitch of the LED must match the pitch of the mounting holes on the PCB during component placement. Lead—forming may be required to insure the lead pitch matches the hole pitch. Refer to the figure below for proper lead forming procedures. (Fig. i) LLB LCE‘K L” m LED§ Pcs NM. ‘ L\ca PCB m 16:” Cuthod ’ iAnada AS‘MAX. AS'MAX. LED ‘\ § PCB Cathcdl I lAnoda % >45' n5- X X X Fig.1 " ” Correct mountin method "X" incorrect mountin method 9 9 2. When soldering wire to the LED, use individual heat—shrink tubing to insulate the exposed leads to prevent accidental Contact shorticircuit. (Fig-2) 3. Use standioffs (Fig.3) or spacers (Fig.4) to securely position the LED above the PCB. (a LED LLB HEAT SHRINK msume LED HEAI sxnmx msuumou l snczn :‘li / K / %fi ’ \ m 5mm arr ': ww: ‘ w: /W O X Fig. 2 Fig. 3 Fig. A 4. Maintain a minimum of 3mm clearance between the base of the LED lens and the first lead bend. (Fig. 5 and 6) 5. During lead forming. use tools or jigs to hold the leads securely so that the bending force will not be transmitted to the LED lens and its internal structures. Do not perform lead forming once the component has been mounted onto the PCB. (Fig. 7)
SPEC NO: DSAL4967 REV NO: V.2B DATE: MAR/15/2014 PAGE: 5 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1101030219
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SPEC NO: DSAL4967 REV NO: V.2B DATE: MAR/15/2014 PAGE: 6 OF 6
APPROVED: WYNEC CHECKED: Allen Liu DRAWN: L.Q.Xie ERP: 1101030219