Datenblatt für PIC12(L)F1840 von Microchip Technology

6‘ MICROCHIP
2011-2015 Microchip Technology Inc. DS40001441F-page 1
High-Performance RISC CPU
• Only 49 Instructions to Learn:
- All single-cycle instructions except branches
• Operating Speed:
- DC – 32 MHz oscillator/clock input
- DC – 125 ns instruction cycle
• Interrupt Capability with Automatic Context
Saving
• 16-Level Deep Hardware Stack with Optional
Overflow/Underflow Reset
• Direct, Indirect and Relative Addressing modes:
- Two full 16-bit File Select Registers (FSRs)
- FSRs can read program and data memory
Flexible Oscillator Structure
• Precision 32 MHz Internal Oscillator Block:
- Factory calibrated to ± 1%, typical
- Software selectable frequencies range of
31 kHz to 32 MHz
• 31 kHz Low-Power Internal Oscillator
• Four Crystal modes up to 32 MHz
• Three External Clock modes up to 32 MHz
• 4X Phase Lock Loop (PLL)
• Fail-Safe Clock Monitor:
- Allows for safe shutdown if peripheral clock
stops
• Two-Speed Oscillator Start-up
• Reference Clock module:
- Programmable clock output frequency and
duty-cycle
Special Microcontroller Features
• Operating Voltage Range:
- 2.3V-5.5V (PIC12F1840)
- 1.8V-3.6V (PIC12LF1840)
• Self-Reprogrammable under Software Control
• Power-on Reset (POR), Power-up Timer (PWRT)
and Oscillator Start-up Timer (OST)
• Programmable Brown-out Reset (BOR)
• Extended Watchdog Timer (WDT)
• In-Circuit Serial Programming™ (ICSP™) via
Two Pins
• In-Circuit Debug (ICD) via Two Pins
• Enhanced Low-Voltage Programming (LVP)
• Programmable Code Protection
• Power-Saving Sleep mode
Extreme Low-Power Management with
PIC12LF1840 XLP
• Sleep mode: 20 nA @ 1.8V, typical
• Watchdog Timer: 500 nA @ 1.8V, typical
• Timer1 Oscillator: 300 nA @ 32 kHz, 1.8V, typical
• Operating Current: 30 A/MHz @ 1.8V, typical
Analog Features
• Analog-to-Digital Converter (ADC) module:
- 10-bit resolution, 4 channels
- Conversion available during Sleep
• Analog Comparator module:
- One rail-to-rail analog comparator
- Power mode control
- Software controllable hysteresis
• Voltage Reference module:
- Fixed Voltage Reference (FVR) with 1.024V,
2.048V and 4.096V output levels
- 5-bit rail-to-rail resistive DAC with positive
and negative reference selection
Peripheral Highlights
• 5 I/O Pins and 1 Input-Only Pin:
- High current sink/source 25 mA/25 mA
- Programmable weak pull-ups
- Programmable interrupt-on-change pins
• Timer0: 8-Bit Timer/Counter with 8-Bit Prescaler
• Enhanced Timer1:
- 16-bit timer/counter with prescaler
- External Gate Input mode
- Dedicated, low-power 32 kHz oscillator driver
• Timer2: 8-Bit Timer/Counter with 8-Bit Period
Register, Prescaler and Postscaler
• Enhanced CCP (ECCP) module:
- Software selectable time bases
- Auto-shutdown and auto-restart
- PWM steering
• Master Synchronous Serial Port (MSSP) with SPI
and I2CTM with:
- 7-bit address masking
- SMBus/PMBusTM compatibility
• Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module:
- RS-232, RS-485 and LIN compatible
- Auto-Baud Detect
• Capacitive Sensing (CPS) module (mTouchTM):
- 4 input channels
PIC12(L)F1840
8-Pin Flash Microcontrollers with XLP Technology
PIC12(L)F1840
DS40001441F-page 2 2011-2015 Microchip Technology Inc.
Peripheral Features (Continued)
• Data Signal Modulator module:
- Selectable modulator and carrier sources
•SR Latch:
- Multiple Set/Reset input options
- Emulates 555 Timer applications
PIC12(L)F1822/1840/PIC16(L)F182X/1847 Family Types
Device
Data Sheet Index
Program Memory
Flash (words)
Data EEPROM
(bytes)
Data SRAM
(bytes)
I/O’s(2)
10-bit ADC (ch)
CapSense (ch)
Comparators
Timers
(8/16-bit)
EUSART
MSSP (I2C™/SPI)
ECCP (Full-Bridge)
ECCP (Half-Bridge)
CCP
SR Latch
Debug(1)
XLP
PIC12(L)F1822 (1) 2K 256 128 6 4 4 1 2/1 1 1 0/1/0 YI/H Y
PIC12(L)F1840 (2) 4K 256 256 6 4 4 1 2/1 1 1 0/1/0 Y I/H Y
PIC16(L)F1823 (1) 2K 256 128 12 8822/1 1 1 1/0/0 YI/H Y
PIC16(L)F1824 (3) 4K 256 256 12 8824/1 1 1 1/1/2 YI/H Y
PIC16(L)F1825 (4) 8K 256 1024 12 8824/1 1 1 1/1/2 YI/H Y
PIC16(L)F1826 (5) 2K 256 256 16 12 12 22/1 1 1 1/0/0 YI/H Y
PIC16(L)F1827 (5) 4K 256 384 16 12 12 24/1 1 2 1/1/2 YI/H Y
PIC16(L)F1828 (3) 4K 256 256 18 12 12 24/1 1 1 1/1/2 YI/H Y
PIC16(L)F1829 (4) 8K 256 1024 18 12 12 24/1 1 2 1/1/2 YI/H Y
PIC16(L)F1847 (6) 8K 256 1024 16 12 12 24/1 1 2 1/1/2 YI/H Y
Note 1: I - Debugging, Integrated on Chip; H - Debugging, available using Debug Header.
2: One pin is input-only.
Data Sheet Index: (Unshaded devices are described in this document.)
1: DS41413 PIC12(L)F1822/PIC16(L)F1823 Data Sheet, 8/14-Pin Flash Microcontrollers.
2: DS41441 PIC12(L)F1840 Data Sheet, 8-Pin Flash Microcontrollers.
3: DS41419 PIC16(L)F1824/1828 Data Sheet, 28/40/44-Pin Flash Microcontrollers.
4: DS41440 PIC16(L)F1825/1829 Data Sheet, 14/20-Pin Flash Microcontrollers.
5: DS41391 PIC16(L)F1826/1827 Data Sheet, 18/20/28-Pin Flash Microcontrollers.
6: DS41453 PIC16(L)F1847 Data Sheet, 18/20/28-Pin Flash Microcontrollers.
Note: For other small form-factor package availability and marking information, please visit
http://www.microchip.com/packaging or contact your local sales office.
MCLR mmmm x_u_u_n_: RAD AND DACOUT CPSU (:th. PIB TX \oc MDOUT ICSPDAT Gm a“) m m m) m
2011-2015 Microchip Technology Inc. DS40001441F-page 3
PIC12(L)F1840
FIGURE 1: 8-PIN DIAGRAM FOR PIC12(L)F1840
TABLE 1: 8-PIN ALLOCATION TABLE (PIC12(L)F1840)
I/O
8-Pin PDIP/SOIC/DFN/UDFN
ADC
Reference
Cap Sense
Comparator
SR Latch
Timers
ECCP
EUSART
MSSP
Interrupt
Modulator
Pull-up
Basic
RA0 7AN0 DACOUT CPS0 C1IN+ — — P1B TX
CK
SDO
SS(1) IOC MDOUT YICSPDAT
ICDDAT
RA1 6 AN1 VREF CPS1 C1IN0- SRI — — RX
DT
SCL
SCK
IOC MDMIN YICSPCLK
ICPCLK
RA2 5AN2 —CPS2 C1OUT SRQ T0CKI CCP1
P1A
FLT0
—SDA
SDI
INT/
IOC
MDCIN1 Y —
RA34—— —— —T1G
(1) ——
SS IOC — YMCLR
VPP
RA4 3AN3 —CPS3 C1IN1- —T1G
T1OSO
P1B(1) TX(1)
CK(1) SDO(1) IOC MDCIN2 YOSC2
CLKOUT
CLKR
RA5 2 — — — — SRNQ T1CKI
T1OSI
CCP1(1)
P1A(1) RX(1)
DT(1) —IOC—YOSC1
CLKIN
VDD 1———————————— VDD
VSS 8———————————
—VSS
Note 1: Alternate pin function selected with the APFCON (Register 12-1) register.
PDIP, SOIC, DFN, UDFN
1
2
3
4
8
7
6
5
VDD
RA5
RA4
MCLR/VPP/RA3
VSS
RA0/ICSPDAT
RA1/ICSPCLK
RA2
Note 1: See Ta b le 1 for the location of all peripheral functions.
PIC12(L)F1840
PIC12(L)F1840
DS40001441F-page 4 2011-2015 Microchip Technology Inc.
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Enhanced Mid-range CPU ......................................................................................................................................................... 10
3.0 Memory Organization ................................................................................................................................................................. 12
4.0 Device Configuration .................................................................................................................................................................. 32
5.0 Oscillator Module (with Fail-Safe Clock Monitor) ....................................................................................................................... 38
6.0 Reference Clock Module ............................................................................................................................................................ 56
7.0 Resets ........................................................................................................................................................................................ 59
8.0 Interrupts .................................................................................................................................................................................... 67
9.0 Power-Down Mode (Sleep) ........................................................................................................................................................ 77
10.0 Watchdog Timer (WDT) ............................................................................................................................................................. 81
11.0 Data EEPROM and Flash Program Memory Control ................................................................................................................. 85
12.0 I/O Ports ..................................................................................................................................................................................... 98
13.0 Interrupt-on-Change ................................................................................................................................................................. 105
14.0 Fixed Voltage Reference (FVR) ............................................................................................................................................... 109
15.0 Temperature Indicator Module ................................................................................................................................................. 112
16.0 Analog-to-Digital Converter (ADC) Module .............................................................................................................................. 114
17.0 Digital-to-Analog Converter (DAC) Module .............................................................................................................................. 127
18.0 SR Latch................................................................................................................................................................................... 131
19.0 Comparator Module.................................................................................................................................................................. 135
20.0 Timer0 Module ......................................................................................................................................................................... 143
21.0 Timer1 Module with Gate Control............................................................................................................................................. 146
22.0 Timer2 Module ......................................................................................................................................................................... 157
23.0 Data Signal Modulator.............................................................................................................................................................. 161
24.0 Capture/Compare/PWM Modules ............................................................................................................................................ 171
25.0 Master Synchronous Serial Port Module.................................................................................................................................. 192
26.0 Enhanced Universal Synchronous Asynchronous Receiver Transmitter (EUSART) ............................................................... 247
27.0 Capacitive Sensing (CPS) Module ........................................................................................................................................... 276
28.0 In-Circuit Serial Programming™ (ICSP™) ............................................................................................................................... 284
29.0 Instruction Set Summary .......................................................................................................................................................... 288
30.0 Electrical Specifications............................................................................................................................................................ 302
31.0 DC and AC Characteristics Graphs and Charts ....................................................................................................................... 339
32.0 Development Support............................................................................................................................................................... 376
33.0 Packaging Information.............................................................................................................................................................. 380
Appendix A: Data Sheet Revision History.......................................................................................................................................... 393
Appendix B: Migrating From Other PIC® Devices ............................................................................................................................. 393
The Microchip Web Site ..................................................................................................................................................................... 394
Customer Change Notification Service .............................................................................................................................................. 394
Customer Support .............................................................................................................................................................................. 394
Product Identification System............................................................................................................................................................. 395
2011-2015 Microchip Technology Inc. DS40001441F-page 5
PIC12(L)F1840
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PIC12(L)F1840
DS40001441F-page 6 2011-2015 Microchip Technology Inc.
1.0 DEVICE OVERVIEW
The PIC12(L)F1840 are described within this data sheet.
They are available in 8-pin packages. Figure 1-1 shows a
block diagram of the PIC12(L)F1840 devices. Tabl e 1- 2
shows the pinout descriptions.
Reference Table 1 -1 for peripherals available per
device.
TABLE 1-1: DEVICE PERIPHERAL
SUMMARY
Peripheral
PIC12(L)F1840
ADC ●
Capacitive Sensing (CPS) Module ●
Data EEPROM ●
Digital-to-Analog Converter (DAC) ●
Digital Signal Modulator (DSM) ●
EUSART ●
Fixed Voltage Reference (FVR) ●
SR Latch ●
Capture/Compare/PWM Modules
ECCP1 ●
Comparators
C1 ●
Master Synchronous Serial Ports
MSSP ●
Timers
Timer0 ●
Timer1 ●
Timer2 ●
MCLR XF‘ <——> <——>
2011-2015 Microchip Technology Inc. DS40001441F-page 7
PIC12(L)F1840
FIGURE 1-1: PIC12(L)F1840 BLOCK DIAGRAM
PORTA
EUSART
Comparators
MSSP
Timer1Timer0
ECCP1
ADC
10-Bit
SR
Latch
Note 1: See applicable chapters for more information on peripherals.
2: See Ta b le 1 - 1 for peripherals available on specific devices.
CPU
Program
Flash Memory
EEPROM
RAM
Timing
Generation
INTRC
Oscillator
MCLR
(Figure 2-1)
Modulator CapSense
Clock
CLKR
Reference
DAC
FVR
OSC1/CLKIN
OSC2/CLKOUT
PIC12(L)F1840
DS40001441F-page 8 2011-2015 Microchip Technology Inc.
TABLE 1-2: PIC12(L)F1840 PINOUT DESCRIPTION
Name Function Input
Type
Output
Type Description
RA0/AN0/CPS0/C1IN+/
DACOUT/TX/CK/SDO/
SS(1)/P1B/MDOUT/ICSPDAT/
ICDDAT
RA0 TTL CMOS General purpose I/O.
AN0 AN — ADC Channel 0 input.
CPS0 AN — Capacitive sensing input 0.
C1IN+ AN — Comparator C1 positive input.
DACOUT — AN Digital-to-Analog Converter output.
TX — CMOS USART asynchronous transmit.
CK ST CMOS USART synchronous clock.
SDO — CMOS SPI data output.
SS ST — Slave Select input.
P1B — CMOS PWM output.
MDOUT — CMOS Modulator output.
ICSPDAT ST CMOS ICSP™ Data I/O.
RA1/AN1/CPS1/VREF/C1IN0-/
SRI/RX/DT/SCL/SCK/
MDMIN/ICSPCLK/ICDCLK
RA1 TTL CMOS General purpose I/O.
AN1 AN — ADC Channel 1 input.
CPS1 AN — Capacitive sensing input 1.
VREF AN — ADC and DAC Positive Voltage Reference input.
C1IN0- AN — Comparator C1 negative input.
SRI ST — SR Latch input.
RX ST — USART asynchronous input.
DT ST CMOS USART synchronous data.
SCL I2C™ OD I2C™ clock.
SCK ST CMOS SPI clock.
MDMIN ST — Modulator source input.
ICSPCLK ST — Serial Programming Clock.
RA2/AN2/CPS2/C1OUT/SRQ/
T0CKI/CCP1/P1A/FLT0/
SDA/SDI/INT/MDCIN1
RA2 ST CMOS General purpose I/O.
AN2 AN — ADC Channel 2 input.
CPS2 AN — Capacitive sensing input 2.
C1OUT — CMOS Comparator C1 output.
SRQ — CMOS SR Latch non-inverting output.
T0CKI ST — Timer0 clock input.
CCP1 ST CMOS Capture/Compare/PWM 1.
P1A — CMOS PWM output.
FLT0 ST — ECCP Auto-Shutdown Fault input.
SDA I2C™ OD I2C™ data input/output.
SDI CMOS — SPI data input.
INT ST — External interrupt.
MDCIN1 ST — Modulator Carrier Input 1.
RA3/SS/T1G(1)/VPP/MCLR RA3 TTL — General purpose input.
SS ST — Slave Select input.
T1G ST — Timer1 Gate input.
VPP HV — Programming voltage.
MCLR ST — Master Clear with internal pull-up.
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Alternate pin function selected with the APFCON (Register 12-1) register.
2011-2015 Microchip Technology Inc. DS40001441F-page 9
PIC12(L)F1840
RA4/AN3/CPS3/OSC2/
CLKOUT/T1OSO/C1IN1-/CLKR/
SDO(1)/CK(1)/TX(1)/P1B(1)/
T1G/MDCIN2
RA4 TTL CMOS General purpose I/O.
AN3 AN — ADC Channel 3 input.
CPS3 AN — Capacitive sensing input 3.
OSC2 — XTAL Crystal/Resonator (LP, XT, HS modes).
CLKOUT — CMOS FOSC/4 output.
T1OSO XTAL XTAL Timer1 oscillator connection.
C1IN1- AN — Comparator C1 negative input.
CLKR — CMOS Clock Reference output.
SDO — CMOS SPI data output.
CK ST CMOS USART synchronous clock.
TX — CMOS USART asynchronous transmit.
P1B — CMOS PWM output.
T1G ST — Timer1 Gate input.
MDCIN2 ST — Modulator Carrier Input 2.
RA5/CLKIN/OSC1/T1OSI/
T1CKI/SRNQ/P1A(1)/CCP1(1)/
DT(1)/RX(1)
RA5 TTL CMOS General purpose I/O.
CLKIN CMOS — External clock input (EC mode).
OSC1 XTAL — Crystal/Resonator (LP, XT, HS modes).
T1OSI XTAL XTAL Timer1 oscillator connection.
T1CKI ST — Timer1 clock input.
SRNQ — CMOS SR Latch inverting output.
P1A — CMOS PWM output.
CCP1 ST CMOS Capture/Compare/PWM 1.
DT ST CMOS USART synchronous data.
RX ST — USART asynchronous input.
VDD VDD Power — Positive supply.
VSS VSS Power — Ground reference.
TABLE 1-2: PIC12(L)F1840 PINOUT DESCRIPTION (CONTINUED)
Name Function Input
Type
Output
Type Description
Legend: AN = Analog input or output CMOS= CMOS compatible input or output OD = Open Drain
TTL = TTL compatible input ST = Schmitt Trigger input with CMOS levels I2C™ = Schmitt Trigger input with I2C
HV = High Voltage XTAL = Crystal levels
Note 1: Alternate pin function selected with the APFCON (Register 12-1) register.
CCCCCC gg
PIC12(L)F1840
DS40001441F-page 10 2011-2015 Microchip Technology Inc.
2.0 ENHANCED MID-RANGE CPU
This family of devices contain an enhanced mid-range
8-bit CPU core. The CPU has 49 instructions. Interrupt
capability includes automatic context saving. The
hardware stack is 16 levels deep and has Overflow and
Underflow Reset capability. Direct, Indirect, and
Relative addressing modes are available. Two File
Select Registers (FSRs) provide the ability to read
program and data memory.
• Automatic Interrupt Context Saving
• 16-level Stack with Overflow and Underflow
• File Select Registers
• Instruction Set
FIGURE 2-1: CORE BLOCK DIAGRAM
Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
Direct Addr 7
12
Addr MUX
FSR reg
STATUS reg
MUX
ALU
Power-up
Timer
Oscillator
Start-up Timer
Power-on
Reset
Watchdog
Timer
Instruction
Decode &
Control
Timing
Generation
OSC1/CLKIN
OSC2/CLKOUT
VDD
8
8
Brown-out
Reset
12
3
VSS
Internal
Oscillator
Block
Configuration
Data Bus 8
14
Program
Bus
Instruction reg
Program Counter
8 Level Stack
(13-bit)
Direct Addr 7
Addr MUX
FSR reg
STATUS reg
MUX
ALU
W Reg
Instruction
Decode &
Control
Timing
Generation
VDD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
15 Data Bus 8
14
Program
Bus
Instruction Reg
Program Counter
16-Level Stack
(15-bit)
Direct Addr 7
RAM Addr
Addr MUX
Indirect
Addr
FSR0 Reg
STATUS Reg
MUX
ALU
Instruction
Decode and
Control
Timing
Generation
VDD
8
8
3
VSS
Internal
Oscillator
Block
Configuration
Flash
Program
Memory RAM
FSR regFSR reg
FSR1 Reg
15
15
MUX
15
Program Memory
Read (PMR)
12
FSR regFSR reg
BSR Reg
5
2011-2015 Microchip Technology Inc. DS40001441F-page 11
PIC12(L)F1840
2.1 Automatic Interrupt Context
Saving
During interrupts, certain registers are automatically
saved in shadow registers and restored when returning
from the interrupt. This saves stack space and user
code. See Section 8.5 “Automatic Context Saving”,
for more information.
2.2 16-level Stack with Overflow and
Underflow
These devices have an external stack memory 15 bits
wide and 16 words deep. A Stack Overflow or Under-
flow will set the appropriate bit (STKOVF or STKUNF)
in the PCON register, and if enabled will cause a soft-
ware Reset. See Section 3.5 “Stack” for more details.
2.3 File Select Registers
There are two 16-bit File Select Registers (FSR). FSRs
can access all file registers and program memory,
which allows one Data Pointer for all memory. When an
FSR points to program memory, there is one additional
instruction cycle in instructions using INDF to allow the
data to be fetched. General purpose memory can now
also be addressed linearly, providing the ability to
access contiguous data larger than 80 bytes. There are
also new instructions to support the FSRs. See
Section 3.6 “Indirect Addressing” for more details.
2.4 Instruction Set
There are 49 instructions for the enhanced mid-range
CPU to support the features of the CPU. See
Section 29.0 “Instruction Set Summary” for more
details.
PIC12(L)F1840
DS40001441F-page 12 2011-2015 Microchip Technology Inc.
3.0 MEMORY ORGANIZATION
These devices contain the following types of memory:
• Program Memory
- Configuration Words
-Device ID
-User ID
- Flash Program Memory
• Data Memory
- Core Registers
- Special Function Registers
- General Purpose RAM
- Common RAM
•Data EEPROM memory(1)
The following features are associated with access and
control of program memory and data memory:
• PCL and PCLATH
•Stack
• Indirect Addressing
3.1 Program Memory Organization
The enhanced mid-range core has a 15-bit program
counter capable of addressing a 32K x 14 program
memory space. Table 3-1 shows the memory sizes
implemented for the PIC12(L)F1840 family. Accessing a
location above these boundaries will cause a
wrap-around within the implemented memory space.
The Reset vector is at 0000h and the interrupt vector is
at 0004h (see Figure 3-1).
Note 1: The Data EEPROM Memory and the
method to access Flash memory through
the EECON registers is described in
Section 11.0 “Data EEPROM and Flash
Program Memory Control”.
TABLE 3-1: DEVICE SIZES AND ADDRESSES
Device Program Memory Space (Words) Last Program Memory Address
PIC12(L)F1840 4, 096 0FFFh
2011-2015 Microchip Technology Inc. DS40001441F-page 13
PIC12(L)F1840
FIGURE 3-1: PROGRAM MEMORY MAP
AND STACK FOR
PIC12(L)F1840
3.1.1 READING PROGRAM MEMORY AS
DATA
There are two methods of accessing constants in
program memory. The first method is to use tables of
RETLW instructions. The second method is to set an
FSR to point to the program memory.
3.1.1.1 RETLW Instruction
The RETLW instruction can be used to provide access
to tables of constants. The recommended way to create
such a table is shown in Example 3-1.
EXAMPLE 3-1: RETLW INSTRUCTION
The BRW instruction makes this type of table very
simple to implement. If your code must remain portable
with previous generations of microcontrollers, then the
BRW instruction is not available so the older table read
method must be used.
PC<14:0>
15
0000h
0004h
Stack Level 0
Stack Level 15
Reset Vector
Interrupt Vector
CALL, CALLW
RETURN, RETLW
Stack Level 1
0005h
On-chip
Program
Memory
Page 0
07FFh
Rollover to Page 0
0800h
0FFFh
1000h
7FFFh
Page 1
Rollover to Page 1
Interrupt, RETFIE
constants
BRW ;Add Index in W to
;program counter to
;select data
RETLW DATA0 ;Index0 data
RETLW DATA1 ;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLW DATA_INDEX
call constants
;… THE CONSTANT IS IN W
PIC12(L)F1840
DS40001441F-page 14 2011-2015 Microchip Technology Inc.
3.1.1.2 Indirect Read with FSR
The program memory can be accessed as data by
setting bit 7 of the FSRxH register and reading the
matching INDFx register. The MOVIW instruction will
place the lower eight bits of the addressed word in the
W register. Writes to the program memory cannot be
performed via the INDF registers. Instructions that
access the program memory via the FSR require one
extra instruction cycle to complete. Example 3-2
demonstrates accessing the program memory via an
FSR.
The High directive will set bit<7> if a label points to a
location in program memory.
EXAMPLE 3-2: ACCESSING PROGRAM
MEMORY VIA FSR
3.2 Data Memory Organization
The data memory is partitioned in 32 memory banks
with 128 bytes in a bank. Each bank consists of
(Figure 3-2):
• 12 core registers
• 20 Special Function Registers (SFR)
• Up to 80 bytes of General Purpose RAM (GPR)
• 16 bytes of common RAM
The active bank is selected by writing the bank number
into the Bank Select Register (BSR). Unimplemented
memory will read as ‘0’. All data memory can be
accessed either directly (via instructions that use the
file registers) or indirectly via the two File Select
Registers (FSR). See Section 3.6 “Indirect
Addressing” for more information.
3.2.1 CORE REGISTERS
The core registers contain the registers that directly
affect the basic operation. The core registers occupy
the first 12 addresses of every data memory bank
(addresses x00h/x08h through x0Bh/x8Bh). These
registers are listed below in Ta bl e 3- 2. For detailed
information, see Tabl e 3-5 .
TABLE 3-2: CORE REGISTERS
constants
RETLW DATA0 ;Index0 data
RETLW DATA1 ;Index1 data
RETLW DATA2
RETLW DATA3
my_function
;… LOTS OF CODE…
MOVLW LOW constants
MOVWF FSR1L
MOVLW HIGH constants
MOVWF FSR1H
MOVIW 0[FSR1]
;THE PROGRAM MEMORY IS IN W
Addresses BANKx
x00h or x80h INDF0
x01h or x81h INDF1
x02h or x82h PCL
x03h or x83h STATUS
x04h or x84h FSR0L
x05h or x85h FSR0H
x06h or x86h FSR1L
x07h or x87h FSR1H
x08h or x88h BSR
x09h or x89h WREG
x0Ah or x8Ah PCLATH
x0Bh or x8Bh INTCON
Borrow Digxl Borrow su blracfion. PD Dd“ Cm Borrow y/ngi: Borrow y/Borrow
2011-2015 Microchip Technology Inc. DS40001441F-page 15
PIC12(L)F1840
3.2.1.1 STATUS Register
The STATUS register, shown in Register 3-1, contains:
• the arithmetic status of the ALU
• the Reset status
The STATUS register can be the destination for any
instruction, like any other register. If the STATUS
register is the destination for an instruction that affects
the Z, DC or C bits, then the write to these three bits is
disabled. These bits are set or cleared according to the
device logic. Furthermore, the TO and PD bits are not
writable. Therefore, the result of an instruction with the
STATUS register as destination may be different than
intended.
For example, CLRF STATUS will clear the upper three
bits and set the Z bit. This leaves the STATUS register
as ‘000u u1uu’ (where u = unchanged).
It is recommended, therefore, that only BCF, BSF,
SWAPF and MOVWF instructions are used to alter the
STATUS register, because these instructions do not
affect any Status bits. For other instructions not
affecting any Status bits (Refer to Section 29.0
“Instruction Set Summary”).
3.3 Register Definitions: Status
Note 1: The C and DC bits operate as Borrow
and Digit Borrow out bits, respectively, in
subtraction.
REGISTER 3-1: STATUS: STATUS REGISTER
U-0 U-0 U-0 R-1/q R-1/q R/W-0/u R/W-0/u R/W-0/u
— — — TO PD ZDC
(1) C(1)
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7-5 Unimplemented: Read as ‘0’
bit 4 TO: Time-Out bit
1 = After power-up, CLRWDT instruction or SLEEP instruction
0 = A WDT time-out occurred
bit 3 PD: Power-Down bit
1 = After power-up or by the CLRWDT instruction
0 = By execution of the SLEEP instruction
bit 2 Z: Zero bit
1 = The result of an arithmetic or logic operation is zero
0 = The result of an arithmetic or logic operation is not zero
bit 1 DC: Digit Carry/Digit Borrow bit (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the 4th low-order bit of the result occurred
0 = No carry-out from the 4th low-order bit of the result
bit 0 C: Carry/Borrow bit(1) (ADDWF, ADDLW, SUBLW, SUBWF instructions)(1)
1 = A carry-out from the Most Significant bit of the result occurred
0 = No carry-out from the Most Significant bit of the result occurred
Note 1: For Borrow, the polarity is reversed. A subtraction is executed by adding the two’s complement of the
second operand.
PIC12(L)F1840
DS40001441F-page 16 2011-2015 Microchip Technology Inc.
3.3.1 SPECIAL FUNCTION REGISTER
The Special Function Registers are registers used by
the application to control the desired operation of
peripheral functions in the device. The Special Function
Registers occupy the 20 bytes after the core registers of
every data memory bank (addresses x0Ch/x8Ch
through x1Fh/x9Fh). The registers associated with the
operation of the peripherals are described in the appro-
priate peripheral chapter of this data sheet.
3.3.2 GENERAL PURPOSE RAM
There are up to 80 bytes of GPR in each data memory
bank. The Special Function Registers occupy the 20
bytes after the core registers of every data memory
bank (addresses x0Ch/x8Ch through x1Fh/x9Fh).
3.3.2.1 Linear Access to GPR
The general purpose RAM can be accessed in a
non-banked method via the FSRs. This can simplify
access to large memory structures. See Section 3.6.2
“Linear Data Memory” for more information.
3.3.3 COMMON RAM
There are 16 bytes of common RAM accessible from all
banks.
FIGURE 3-2: BANKED MEMORY
PARTITIONING
3.3.4 DEVICE MEMORY MAPS
The memory maps for the device family are as shown
in Table 3-3.
0Bh
0Ch
1Fh
20h
6Fh
70h
7Fh
00h
Common RAM
(16 bytes)
General Purpose RAM
(80 bytes maximum)
Core Registers
(12 bytes)
Special Function Registers
(20 bytes maximum)
Memory Region
7-bit Bank Offset
PIC12(L)F1840
DS40001441F-page 17 2011-2015 Microchip Technology Inc.
TABLE 3-3: PIC12(L)F1840 MEMORY MAP, BANKS 0-7
Legend: = Unimplemented data memory locations, read as ‘0’.
Note 1: Available only on PIC12F1840.
BANK 0 BANK 1 BANK 2 BANK 3 BANK 4 BANK 5 BANK 6 BANK 7
000h
Core Registers
(Tab l e 3- 2 )
080h
Core Registers
(Tab l e 3- 2 )
100h
Core Registers
(Table 3-2)
180h
Core Registers
(Table 3-2)
200h
Core Registers
(Table 3-2)
280h
Core Registers
(Table 3-2)
300h
Core Registers
(Table 3-2)
380h
Core Registers
(Table 3-2)
00Bh 08Bh 10Bh 18Bh 20Bh 28Bh 30Bh 38Bh
00Ch PORTA 08Ch TRISA 10Ch LATA 18Ch ANSELA 20Ch WPUA 28Ch — 30Ch — 38Ch —
00Dh — 08Dh — 10Dh — 18Dh — 20Dh — 28Dh — 30Dh — 38Dh —
00Eh —08Eh—10Eh—18Eh—20Eh—28Eh—30Eh—38Eh—
00Fh —08Fh—10Fh—18Fh—20Fh—28Fh—30Fh—38Fh—
010h —090h—110h—190h—210h—290h— 310h — 390h —
011h PIR1 091h PIE1 111h CM1CON0 191h EEADRL 211h SSPBUF 291h CCPR1L 311h — 391h IOCAP
012h PIR2 092h PIE2 112h CM1CON1 192h EEADRH 212h SSPADD 292h CCPR1H 312h — 392h IOCAN
013h —093h—113h— 193h EEDATL 213h SSPMASK 293h CCP1CON 313h — 393h IOCAF
014h —094h—114h— 194h EEDATH 214h SSPSTAT 294h PWM1CON 314h — 394h —
015h TMR0 095h OPTION_REG 115h CMOUT 195h EECON1 215h SSP1CON1 295h CCP1AS 315h — 395h —
016h TMR1L 096h PCON 116h BORCON 196h EECON2 216h SSP1CON2 296h PSTR1CON 316h — 396h —
017h TMR1H 097h WDTCON 117h FVRCON 197h VREGCON(1) 217h SSP1CON3 297h — 317h — 397h —
018h T1CON 098h OSCTUNE 118h DACCON0 198h —218h—298h—318h —398h —
019h T1GCON 099h OSCCON 119h DACCON1 199h RCREG 219h —299h —319h —399h —
01Ah TMR2 09Ah OSCSTAT 11Ah SRCON0 19Ah TXREG 21Ah —29Ah —31Ah —39Ah CLKRCON
01Bh PR2 09Bh ADRESL 11Bh SRCON1 19Bh SPBRGL 21Bh —29Bh —31Bh —39Bh—
01Ch T2CON 09Ch ADRESH 11Ch — 19Ch SPBRGH 21Ch —29Ch —31Ch — 39Ch MDCON
01Dh — 09Dh ADCON0 11Dh APFCON 19Dh RCSTA 21Dh — 29Dh — 31Dh —39Dh MDSRC
01Eh CPSCON0 09Eh ADCON1 11Eh —19Eh TXSTA 21Eh —29Eh—31Eh—39Eh MDCARL
01Fh CPSCON1 09Fh —11Fh— 19Fh BAUDCON 21Fh —29Fh—31Fh—39Fh
MDCARH
020h
General
Purpose
Register
80 Bytes
0A0h
General
Purpose
Register
80 Bytes
120h
General
Purpose
Register
80 Bytes
1A0h
Unimplemented
Read as ‘0’
220h
Unimplemented
Read as ‘0’
2A0h
Unimplemented
Read as ‘0’
320h
Unimplemented
Read as ‘0’
3A0h
Unimplemented
Read as ‘0’
06Fh 0EFh 16Fh 1EFh 26Fh 2EFh 36Fh 3EFh
070h
Common RAM
0F0h
Accesses
70h – 7Fh
170h
Accesses
70h – 7Fh
1F0h
Accesses
70h – 7Fh
270h
Accesses
70h – 7Fh
2F0h
Accesses
70h – 7Fh
370h
Accesses
70h – 7Fh
3F0h
Accesses
70h – 7Fh
07Fh 0FFh 17Fh 1FFh 27Fh 2FFh 37Fh 3FFh
2011-2015 Microchip Technology Inc. DS40001441F-page 18
PIC12(L)F1840
TABLE 3-3: PIC12(L)F1840 MEMORY MAP (CONTINUED)
Legend: = Unimplemented data memory locations, read as ‘0’
BANK 24 BANK 25 BANK 26 BANK 27 BANK 28 BANK 29 BANK 30
C00h
C0Bh
Core Registers
(Ta b l e 3- 2 )
C80h
C8Bh
Core Registers
(Ta b l e 3- 2 )
D00h
D0Bh
Core Registers
(Ta b l e 3- 2 )
D80h
D8Bh
Core Registers
(Ta b l e 3- 2 )
E00h
E0Bh
Core Registers
(Ta b l e 3- 2 )
E80h
E8Bh
Core Registers
(Ta b l e 3- 2 )
F00h
F0Bh
Core Registers
(Ta b l e 3- 2 )
C0Ch
C6Fh
Unimplemented
Read as ‘0’
C8Ch
CEFh
Unimplemented
Read as ‘0’
D0Ch
D6Fh
Unimplemented
Read as ‘0’
D8Ch
DEFh
Unimplemented
Read as ‘0’
E0Ch
E6Fh
Unimplemented
Read as ‘0’
E8Ch
EEFh
Unimplemented
Read as ‘0’
F0Ch
F6Fh
Unimplemented
Read as ‘0’
C70h Common RAM
(Accesses
70h – 7Fh)
CF0h Common RAM
(Accesses
70h – 7Fh)
D70h Common RAM
(Accesses
70h – 7Fh)
DF0h Common RAM
(Accesses
70h – 7Fh)
E70h Common RAM
(Accesses
70h – 7Fh)
EF0h Common RAM
(Accesses
70h – 7Fh)
F70h Common RAM
(Accesses
70h – 7Fh)
C7Fh CFFh D7Fh DFFh E7Fh EFFh F7Fh
rea STKPTR TOSL TOSH
2011-2015 Microchip Technology Inc. DS40001441F-page 19
PIC12(L)F1840
TABLE 3-4: PIC12(L)F1840 MEMORY MAP,
BANK 31
Legend: = Unimplemented data memory locations,
read as ‘0’.
Bank 31
FA0h
FE3h
Unimplemented
Read as ‘0’
FE4h STATUS_SHAD
FE5h WREG_SHAD
FE6h BSR_SHAD
FE7h PCLATH_SHAD
FE8h FSR0L_SHAD
FE9h FSR0H_SHAD
FEAh FSR1L_SHAD
FEBh FSR1H_SHAD
FECh —
FEDh STKPTR
FEEh TOSL
FEFh TOSH
PIC12(L)F1840
DS40001441F-page 20 2011-2015 Microchip Technology Inc.
3.3.5 CORE FUNCTION REGISTERS
SUMMARY
The Core Function registers listed in Tabl e 3-5 can be
addressed from any Bank.
TABLE 3-5: CORE FUNCTION REGISTERS SUMMARY
Addr Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other Resets
Bank 0-31
x00h or
x80h INDF0 Addressing this location uses contents of FSR0H/FSR0L to address data memory
(not a physical register) xxxx xxxx uuuu uuuu
x01h or
x81h INDF1 Addressing this location uses contents of FSR1H/FSR1L to address data memory
(not a physical register) xxxx xxxx uuuu uuuu
x02h or
x82h PCL Program Counter (PC) Least Significant Byte 0000 0000 0000 0000
x03h or
x83h STATUS — — —TOPD ZDCC---1 1000 ---q quuu
x04h or
x84h FSR0L Indirect Data Memory Address 0 Low Pointer 0000 0000 uuuu uuuu
x05h or
x85h FSR0H Indirect Data Memory Address 0 High Pointer 0000 0000 0000 0000
x06h or
x86h FSR1L Indirect Data Memory Address 1 Low Pointer 0000 0000 uuuu uuuu
x07h or
x87h FSR1H Indirect Data Memory Address 1 High Pointer 0000 0000 0000 0000
x08h or
x88h BSR — — — BSR4 BSR3 BSR2 BSR1 BSR0 ---0 0000 ---0 0000
x09h or
x89h WREG Working Register 0000 0000 uuuu uuuu
x0Ah or
x8Ah PCLATH — Write Buffer for the upper 7 bits of the Program Counter -000 0000 -000 0000
x0Bh or
x8Bh INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 0000 0000 0000 0000
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, read as ‘0’, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
NSYNC
2011-2015 Microchip Technology Inc. DS40001441F-page 21
PIC12(L)F1840
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Bank 0
00Ch PORTA —— RA5 RA4 RA3 RA2 RA1 RA0 --xx xxxx --xx xxxx
00Dh
to
010h
—Unimplemented — —
011h PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 0000 0000 0000 0000
012h PIR2 OSFIF — C1IF EEIF BCL1IF — — — 0-00 0--- 0-00 0---
013h —Unimplemented — —
014h —Unimplemented — —
015h TMR0 Timer0 Module Register xxxx xxxx uuuu uuuu
016h TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
017h TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register xxxx xxxx uuuu uuuu
018h T1CON TMR1CS1 TMR1CS0 T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON0000 00-0 uuuu uu-u
019h T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0> 0000 0x00 uuuu uxuu
01Ah TMR2 Timer2 Module Register 0000 0000 0000 0000
01Bh PR2 Timer2 Period Register 1111 1111 1111 1111
01Ch T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> -000 0000 -000 0000
01Dh —Unimplemented — —
01Eh CPSCON0 CPSON CPSRM —— CPSRNG<1:0> CPSOUT T0XCS 00-- 0000 00-- 0000
01Fh CPSCON1 — — — — — — CPSCH<1:0> ---- --00 ---- --00
Bank 1
08Ch TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 --11 1111 --11 1111
08Dh
to
090h
—Unimplemented — —
091h PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 0000 0000 0000 0000
092h PIE2 OSFIE — C1IE EEIE BCL1IE — — — 0-00 0--- 0-00 0---
093h —Unimplemented — —
094h —Unimplemented — —
095h
OPTION_REG
WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 1111 1111 1111 1111
096h PCON STKOVF STKUNF ——RMCLRRI POR BOR 00-- 11qq qq-- qquu
097h WDTCON —— WDTPS<4:0> SWDTEN --01 0110 --01 0110
098h OSCTUNE —— TUN<5:0> --00 0000 --00 0000
099h OSCCON SPLLEN IRCF<3:0> —SCS<1:0>0011 1-00 0011 1-00
09Ah OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 10q0 0q00 qqqq qq0q
09Bh ADRESL ADC Result Register Low xxxx xxxx uuuu uuuu
09Ch ADRESH ADC Result Register High xxxx xxxx uuuu uuuu
09Dh ADCON0 — CHS<4:0>
GO/DONE
ADON -000 0000 -000 0000
09Eh ADCON1 ADFM ADCS<2:0> — —
ADPREF<1:0>
0000 --00 0000 --00
09Fh —Unimplemented — —
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: PIC12F1840 only.
3: Unimplemented, read as ‘1’.
PIC12(L)F1840
DS40001441F-page 22 2011-2015 Microchip Technology Inc.
Bank 2
10Ch LATA ——LATA5LATA4—LATA2LATA1LATA0--xx -xxx --uu -uuu
10Dh
to
110h
—Unimplemented — —
111h CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 0000 -100 0000 -100
112h CM1CON1 C1INTP C1INTN C1PCH<1:0> — — — C1NCH 0000 ---0 0000 ---0
113h —Unimplemented — —
114h —Unimplemented — —
115h CMOUT — — — — — — —MC1OUT---- ---0 ---- ---0
116h BORCON SBOREN BORFS — — — — — BORRDY 10-- ---q uu-- ---u
117h FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 0q00 0000 0q00 0000
118h DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — — 000- 00-- 000- 00--
119h DACCON1 — — — DACR<4:0> ---0 0000 ---0 0000
11Ah SRCON0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR 0000 0000 0000 0000
11Bh SRCON1 SRSPE SRSCKE Reserved SRSC1E SRRPE SRRCKE Reserved SRRC1E 0000 0000 0000 0000
11Ch —Unimplemented — —
11Dh APFCON RXDTSEL SDOSEL SSSEL --- T1GSEL TXCKSEL P1BSEL CCP1SEL 000- 0000 000- 0000
11Eh —Unimplemented — —
11Fh —Unimplemented — —
Bank 3
18Ch ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 ---1 -111 ---1 -111
18Dh
to
190h
—Unimplemented — —
191h EEADRL EEPROM/Program Memory Address Register Low Byte 0000 0000 0000 0000
192h EEADRH —(3) EEPROM / Program Memory Address Register High Byte 1000 0000 1000 0000
193h EEDATL EEPROM/Program Memory Read Data Register Low Byte xxxx xxxx uuuu uuuu
194h EEDATH —— EEPROM / Program Memory Read Data Register High Byte --xx xxxx --uu uuuu
195h EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 0000 x000 0000 q000
196h EECON2 EEPROM control register 2 0000 0000 0000 0000
197h VREGCON(2) — — — — — —VREGPMReserved ---- --01 ---- --01
198h —Unimplemented — —
199h RCREG USART Receive Data Register 0000 0000 0000 0000
19Ah TXREG USART Transmit Data Register 0000 0000 0000 0000
19Bh SPBRGL Baud Rate Generator Data Register Low 0000 0000 0000 0000
19Ch SPBRGH Baud Rate Generator Data Register High 0000 0000 0000 0000
19Dh RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 0000 000x 0000 000x
19Eh TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 0000 0010 0000 0010
19Fh BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUEABDEN01-0 0-00 01-0 0-00
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: PIC12F1840 only.
3: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001441F-page 23
PIC12(L)F1840
Bank 4
20Ch WPUA —— WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 --11 1111 --11 1111
20Dh
to
210h
—Unimplemented — —
211h SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register xxxx xxxx uuuu uuuu
212h SSP1ADD ADD<7:0> 0000 0000 0000 0000
213h SSP1MSK MSK<7:0> 1111 1111 1111 1111
214h SSP1STAT SMP CKE D/A PSR/WUA BF 0000 0000 0000 0000
215h SSP1CON1 WCOL SSP1OV SSP1EN CKP SSP1M<3:0> 0000 0000 0000 0000
216h SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 0000 0000 0000 0000
217h SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 0000 0000 0000 0000
218h
to
21Fh
—Unimplemented — —
Bank 5
28Ch
to
290h
—Unimplemented — —
291h CCPR1L Capture/Compare/PWM Register 1 (LSB) xxxx xxxx uuuu uuuu
292h CCPR1H Capture/Compare/PWM Register 1 (MSB) xxxx xxxx uuuu uuuu
293h CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 0000 0000 0000 0000
294h PWM1CON P1RSEN P1DC<6:0> 0000 0000 0000 0000
295h CCP1AS CCP1ASE CCP1AS<2:0> PSS1AC<1:0> PSS1BD<1:0> 0000 0000 0000 0000
296h PSTR1CON — — — STR1SYNC Reserved Reserved STR1B STR1A ---0 rr01 ---0 rr01
297h
to
29Fh
—Unimplemented — —
Bank 6
30Ch
to
31Fh
—Unimplemented — —
Bank 7
38Ch
to
390h
—Unimplemented — —
391h IOCAP —— IOCAP5 IOCAP4 IOCAP3
IOCAP2 IOCAP1 IOCAP0
--00 0000 --00 0000
392h IOCAN —— IOCAN5 IOCAN4 IOCAN3
IOCAN2 IOCAN1 IOCAN0
--00 0000 --00 0000
393h IOCAF —— IOCAF5 IOCAF4 IOCAF3
IOCAF2 IOCAF1 IOCAF0
--00 0000 --00 0000
394h
to
399h
—Unimplemented — —
39Ah CLKRCON CLKREN CLKROE CLKRSLR CLKRDC<1:0>
CLKRDIV
<2:0> 0011 0000 0011 0000
39Bh —Unimplemented — —
39Ch MDCON MDEN MDOE MDSLR MDOPOL MDOUT — —
MDBIT
0010 ---0 0010 ---0
39Dh MDSRC MDMSODIS — — —
MDMS<3:0>
x--- xxxx u--- uuuu
39Eh MDCARL MDCLODIS MDCLPOL MDCLSYNC —
MDCL<3:0>
xxx- xxxx uuu- uuuu
39Fh MDCARH MDCHODIS MDCHPOL MDCHSYNC —
MDCH<3:0>
xxx- xxxx uuu- uuuu
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: PIC12F1840 only.
3: Unimplemented, read as ‘1’.
PIC12(L)F1840
DS40001441F-page 24 2011-2015 Microchip Technology Inc.
Banks 8-30
x0Ch/
x8Ch
—
x1Fh/
x9Fh
—Unimplemented — —
Bank 31
F8Ch
—
FE3h
—Unimplemented — —
FE4h STATUS_
SHAD
— — — — — Z_SHAD DC_SHAD C_SHAD ---- -xxx ---- -uuu
FE5h WREG_
SHAD
Working Register Shadow 0000 0000 uuuu uuuu
FE6h BSR_
SHAD
— — — Bank Select Register Shadow ---x xxxx ---u uuuu
FE7h PCLATH_
SHAD
— Program Counter Latch High Register Shadow -xxx xxxx uuuu uuuu
FE8h FSR0L_
SHAD
Indirect Data Memory Address 0 Low Pointer Shadow xxxx xxxx uuuu uuuu
FE9h FSR0H_
SHAD
Indirect Data Memory Address 0 High Pointer Shadow xxxx xxxx uuuu uuuu
FEAh FSR1L_
SHAD
Indirect Data Memory Address 1 Low Pointer Shadow xxxx xxxx uuuu uuuu
FEBh FSR1H_
SHAD
Indirect Data Memory Address 1 High Pointer Shadow xxxx xxxx uuuu uuuu
FECh —Unimplemented — —
FEDh STKPTR — — — Current Stack Pointer ---1 1111 ---1 1111
FEEh TOSL Top-of-Stack Low byte xxxx xxxx uuuu uuuu
FEFh TOSH — Top-of-Stack High byte -xxx xxxx -uuu uuuu
TABLE 3-6: SPECIAL FUNCTION REGISTER SUMMARY (CONTINUED)
Address Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Value on
POR, BOR
Value on all
other
Resets
Legend: x = unknown, u = unchanged, q = value depends on condition, - = unimplemented, r = reserved.
Shaded locations are unimplemented, read as ‘0’.
Note 1: These registers can be addressed from any bank.
2: PIC12F1840 only.
3: Unimplemented, read as ‘1’.
2011-2015 Microchip Technology Inc. DS40001441F-page 25
PIC12(L)F1840
3.4 PCL and PCLATH
The Program Counter (PC) is 15 bits wide. The low byte
comes from the PCL register, which is a readable and
writable register. The high byte (PC<14:8>) is not directly
readable or writable and comes from PCLATH. On any
Reset, the PC is cleared. Figure 3-3 shows the five
situations for the loading of the PC.
FIGURE 3-3: LOADING OF PC IN
DIFFERENT SITUATIONS
3.4.1 MODIFYING PCL
Executing any instruction with the PCL register as the
destination simultaneously causes the Program
Counter PC<14:8> bits (PCH) to be replaced by the
contents of the PCLATH register. This allows the entire
contents of the program counter to be changed by
writing the desired upper seven bits to the PCLATH
register. When the lower eight bits are written to the
PCL register, all 15 bits of the program counter will
change to the values contained in the PCLATH register
and those being written to the PCL register.
3.4.2 COMPUTED GOTO
A computed GOTO is accomplished by adding an offset to
the program counter (ADDWF PCL). When performing a
table read using a computed GOTO method, care should
be exercised if the table location crosses a PCL memory
boundary (each 256-byte block). Refer to Application
Note AN556, “Implementing a Table Read” (DS00556).
3.4.3 COMPUTED FUNCTION CALLS
A computed function CALL allows programs to maintain
tables of functions and provide another way to execute
state machines or look-up tables. When performing a
table read using a computed function CALL, care
should be exercised if the table location crosses a PCL
memory boundary (each 256-byte block).
If using the CALL instruction, the PCH<2:0> and PCL
registers are loaded with the operand of the CALL
instruction. PCH<6:3> is loaded with PCLATH<6:3>.
The CALLW instruction enables computed calls by com-
bining PCLATH and W to form the destination address.
A computed CALLW is accomplished by loading the W
register with the desired address and executing CALLW.
The PCL register is loaded with the value of W and
PCH is loaded with PCLATH.
3.4.4 BRANCHING
The branching instructions add an offset to the PC.
This allows relocatable code and code that crosses
page boundaries. There are two forms of branching,
BRW and BRA. The PC will have incremented to fetch
the next instruction in both cases. When using either
branching instruction, a PCL memory boundary may be
crossed.
If using BRW, load the W register with the desired
unsigned address and execute BRW. The entire PC will
be loaded with the address PC + 1 + W.
If using BRA, the entire PC will be loaded with PC + 1 +,
the signed value of the operand of the BRA instruction.
PCLPCH 0
14
PC
06 7
ALU Result
8
PCLATH
PCLPCH 0
14
PC
06 4
OPCODE <10:0>
11
PCLATH
PCLPCH 0
14
PC
06 7
W
8
PCLATH
Instruction with
PCL as
Destination
GOTO, CALL
CALLW
PCL
PCH 0
14
PC
PC + W
15
BRW
PCLPCH 0
14
PC
PC + OPCODE <8:0>
15
BRA
PIC12(L)F1840
DS40001441F-page 26 2011-2015 Microchip Technology Inc.
3.5 Stack
All devices have a 16-level x 15-bit wide hardware
stack (refer to Figures 3-4 through and 3-7). The stack
space is not part of either program or data space. The
PC is PUSHed onto the stack when CALL or CALLW
instructions are executed or an interrupt causes a
branch. The stack is POPed in the event of a RETURN,
RETLW or a RETFIE instruction execution. PCLATH is
not affected by a PUSH or POP operation.
The stack operates as a circular buffer if the STVREN
bit is programmed to ‘0‘ (Configuration Words). This
means that after the stack has been PUSHed sixteen
times, the seventeenth PUSH overwrites the value that
was stored from the first PUSH. The eighteenth PUSH
overwrites the second PUSH (and so on). The
STKOVF and STKUNF flag bits will be set on an Over-
flow/Underflow, regardless of whether the Reset is
enabled.
3.5.1 ACCESSING THE STACK
The stack is available through the TOSH, TOSL and
STKPTR registers. STKPTR is the current value of the
Stack Pointer. TOSH:TOSL register pair points to the
TOP of the stack. Both registers are read/writable. TOS
is split into TOSH and TOSL due to the 15-bit size of the
PC. To access the stack, adjust the value of STKPTR,
which will position TOSH:TOSL, then read/write to
TOSH:TOSL. STKPTR is five bits to allow detection of
overflow and underflow.
During normal program operation, CALL, CALLW and
Interrupts will increment STKPTR while RETLW,
RETURN, and RETFIE will decrement STKPTR. At any
time, STKPTR can be inspected to see how much
stack is left. The STKPTR always points at the currently
used place on the stack. Therefore, a CALL or CALLW
will increment the STKPTR and then write the PC, and
a return will unload the PC and then decrement the
STKPTR.
Reference Figure 3-4 through Figure 3-7 for examples
of accessing the stack.
FIGURE 3-4: ACCESSING THE STACK EXAMPLE 1
Note 1: There are no instructions/mnemonics
called PUSH or POP. These are actions
that occur from the execution of the
CALL, CALLW, RETURN, RETLW and
RETFIE instructions or the vectoring to
an interrupt address.
Note: Care should be taken when modifying the
STKPTR while interrupts are enabled.
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
0x00
0x0000
STKPTR = 0x1F
Initial Stack Configuration:
After Reset, the stack is empty. The
empty stack is initialized so the Stack
Pointer is pointing at 0x1F. If the Stack
Overflow/Underflow Reset is enabled, the
TOSH/TOSL registers will return ‘0’. If
the Stack Overflow/Underflow Reset is
disabled, the TOSH/TOSL registers will
return the contents of stack address 0x0F.
0x1F STKPTR = 0x1F
Stack Reset Disabled
(STVREN = 0)
Stack Reset Enabled
(STVREN = 1)
TOSH:TOSL
TOSH:TOSL
2011-2015 Microchip Technology Inc. DS40001441F-page 27
PIC12(L)F1840
FIGURE 3-5: ACCESSING THE STACK EXAMPLE 2
FIGURE 3-6: ACCESSING THE STACK EXAMPLE 3
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
Return Address0x00 STKPTR = 0x00
This figure shows the stack configuration
after the first CALL or a single interrupt.
If a RETURN instruction is executed, the
return address will be placed in the
Program Counter and the Stack Pointer
decremented to the empty state (0x1F).
TOSH:TOSL
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
Return Address0x06
Return Address0x05
Return Address0x04
Return Address0x03
Return Address0x02
Return Address0x01
Return Address0x00
STKPTR = 0x06
After seven CALLs or six CALLs and an
interrupt, the stack looks like the figure
on the left. A series of RETURN instructions
will repeatedly place the return addresses
into the Program Counter and pop the stack.
TOSH:TOSL
PIC12(L)F1840
DS40001441F-page 28 2011-2015 Microchip Technology Inc.
FIGURE 3-7: ACCESSING THE STACK EXAMPLE 4
3.5.2 OVERFLOW/UNDERFLOW RESET
If the STVREN bit in Configuration Words is
programmed to ‘1’, the device will be reset if the stack
is PUSHed beyond the sixteenth level or POPed
beyond the first level, setting the appropriate bits
(STKOVF or STKUNF, respectively) in the PCON
register.
3.6 Indirect Addressing
The INDFn registers are not physical registers. Any
instruction that accesses an INDFn register actually
accesses the register at the address specified by the
File Select Registers (FSR). If the FSRn address
specifies one of the two INDFn registers, the read will
return ‘0’ and the write will not occur (though Status bits
may be affected). The FSRn register value is created
by the pair FSRnH and FSRnL.
The FSR registers form a 16-bit address that allows an
addressing space with 65536 locations. These locations
are divided into three memory regions:
• Traditional Data Memory
• Linear Data Memory
• Program Flash Memory
0x0F
0x0E
0x0D
0x0C
0x0B
0x0A
0x09
0x08
0x07
0x06
0x05
0x04
0x03
0x02
0x01
Return Address0x00 STKPTR = 0x10
When the stack is full, the next CALL or
an interrupt will set the Stack Pointer to
0x10. This is identical to address 0x00
so the stack will wrap and overwrite the
return address at 0x00. If the Stack
Overflow/Underflow Reset is enabled, a
Reset will occur and location 0x00 will
not be overwritten.
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
Return Address
TOSH:TOSL
2011-2015 Microchip Technology Inc. DS40001441F-page 29
PIC12(L)F1840
FIGURE 3-8: INDIRECT ADDRESSING
0x0000
0x0FFF
Traditional
FSR
Address
Range
Data Memory
0x1000 Reserved
Linear
Data Memory
Reserved
0x2000
0x29AF
0x29B0
0x7FFF
0x8000
0xFFFF
0x0000
0x0FFF
0x0000
0x7FFF
Program
Flash Memory
Note: Not all memory regions are completely implemented. Consult device memory tables for memory limits.
0x1FFF
%~¢ T
PIC12(L)F1840
DS40001441F-page 30 2011-2015 Microchip Technology Inc.
3.6.1 TRADITIONAL DATA MEMORY
The traditional data memory is a region from FSR
address 0x000 to FSR address 0xFFF. The addresses
correspond to the absolute addresses of all SFR, GPR
and common registers.
FIGURE 3-9: TRADITIONAL DATA MEMORY MAP
Indirect AddressingDirect Addressing
Bank Select Location Select
4BSR 6 0
From Opcode FSRxL70
Bank Select Location Select
00000 00001 00010 11111
0x00
0x7F
Bank 0 Bank 1 Bank 2 Bank 31
0FSRxH70
0000
mm mm %
2011-2015 Microchip Technology Inc. DS40001441F-page 31
PIC12(L)F1840
3.6.2 LINEAR DATA MEMORY
The linear data memory is the region from FSR
address 0x2000 to FSR address 0x29AF. This region is
a virtual region that points back to the 80-byte blocks of
GPR memory in all the banks.
Unimplemented memory reads as 0x00. Use of the
linear data memory region allows buffers to be larger
than 80 bytes because incrementing the FSR beyond
one bank will go directly to the GPR memory of the next
bank.
The 16 bytes of common memory are not included in
the linear data memory region.
FIGURE 3-10: LINEAR DATA MEMORY
MAP
3.6.3 PROGRAM FLASH MEMORY
To make constant data access easier, the entire
program Flash memory is mapped to the upper half of
the FSR address space. When the MSB of FSRnH is
set, the lower 15 bits are the address in program
memory which will be accessed through INDF. Only the
lower eight bits of each memory location is accessible
via INDF. Writing to the program Flash memory cannot
be accomplished via the FSR/INDF interface. All
instructions that access program Flash memory via the
FSR/INDF interface will require one additional
instruction cycle to complete.
FIGURE 3-11: PROGRAM FLASH
MEMORY MAP
7
01
7
00
Location Select 0x2000
FSRnH FSRnL
0x020
Bank 0
0x06F
0x0A0
Bank 1
0x0EF
0x120
Bank 2
0x16F
0xF20
Bank 30
0xF6F
0x29AF
0
7
1
7
00
Location Select 0x8000
FSRnH FSRnL
0x0000
0x7FFF
0xFFFF
Program
Flash
Memory
(low 8
bits)
DEBUG
PIC12(L)F1840
DS40001441F-page 32 2011-2015 Microchip Technology Inc.
4.0 DEVICE CONFIGURATION
Device configuration consists of Configuration Words,
Code Protection and Device ID.
4.1 Configuration Words
There are several Configuration Word bits that allow
different oscillator and memory protection options.
These are implemented as Configuration Word 1 at
8007h and Configuration Word 2 at 8008h.
Note: The DEBUG bit in Configuration Word 2 is
managed automatically by device
development tools including debuggers
and programmers. For normal device
operation, this bit should be maintained as
a '1'.
CLKOUTEN CPD CF' PWRTE If FOSC configurafion bus are set to LP XT HS modes AH omer FOSC modes MCLR If LVP bi‘ : 1 If LVP b' MCLR/VPP pin fundion \s MCLR MCLR/VPP pin fundion \s digiLal input. MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 33
PIC12(L)F1840
4.2 Register Definitions: Configuration Words
REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
FCMEN IESO CLKOUTEN BOREN<1:0> CPD
bit 13 bit 8
R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1 R/P-1
CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 FCMEN: Fail-Safe Clock Monitor Enable bit
1 = Fail-Safe Clock Monitor is enabled
0 = Fail-Safe Clock Monitor is disabled
bit 12 IESO: Internal External Switchover bit
1 = Internal/External Switchover mode is enabled
0 = Internal/External Switchover mode is disabled
bit 11 CLKOUTEN: Clock Out Enable bit
If FOSC configuration bits are set to LP, XT, HS modes:
This bit is ignored, CLKOUT function is disabled. Oscillator function on the CLKOUT pin.
All other FOSC modes:
1 = CLKOUT function is disabled. I/O function on the CLKOUT pin.
0 = CLKOUT function is enabled on the CLKOUT pin
bit 10-9 BOREN<1:0>: Brown-out Reset Enable bits(1)
11 = BOR enabled
10 = BOR enabled during operation and disabled in Sleep
01 = BOR controlled by SBOREN bit of the BORCON register
00 = BOR disabled
bit 8 CPD: Data Code Protection bit(2)
1 = Data memory code protection is disabled
0 = Data memory code protection is enabled
bit 7 CP: Code Protection bit(3)
1 = Program memory code protection is disabled
0 = Program memory code protection is enabled
bit 6 MCLRE: MCLR/VPP Pin Function Select bit
If LVP bit = 1:
This bit is ignored.
If LVP bit = 0:
1 =MCLR
/VPP pin function is MCLR; Weak pull-up enabled.
0 =MCLR
/VPP pin function is digital input; MCLR internally disabled; Weak pull-up under control of
WPUE3 bit.
bit 5 PWRTE: Power-up Timer Enable bit(1)
1 = PWRT disabled
0 = PWRT enabled
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire data EEPROM will be erased when the code protection is turned off during an erase.
3: The entire program memory will be erased when the code protection is turned off.
PIC12(L)F1840
DS40001441F-page 34 2011-2015 Microchip Technology Inc.
bit 4-3 WDTE<1:0>: Watchdog Timer Enable bit
11 = WDT enabled
10 = WDT enabled while running and disabled in Sleep
01 = WDT controlled by the SWDTEN bit in the WDTCON register
00 = WDT disabled
bit 2-0 FOSC<2:0>: Oscillator Selection bits
111 = ECH: External Clock, High-Power mode (4-20 MHz): device clock supplied to CLKIN pin
110 = ECM: External Clock, Medium-Power mode (0.5-4 MHz): device clock supplied to CLKIN pin
101 = ECL: External Clock, Low-Power mode (0-0.5 MHz): device clock supplied to CLKIN pin
100 = INTOSC oscillator: I/O function on CLKIN pin
011 = EXTRC oscillator: External RC circuit connected to CLKIN pin
010 = HS oscillator: High-speed crystal/resonator connected between OSC1 and OSC2 pins
001 = XT oscillator: Crystal/resonator connected between OSC1 and OSC2 pins
000 = LP oscillator: Low-power crystal connected between OSC1 and OSC2 pins
REGISTER 4-1: CONFIG1: CONFIGURATION WORD 1 (CONTINUED)
Note 1: Enabling Brown-out Reset does not automatically enable Power-up Timer.
2: The entire data EEPROM will be erased when the code protection is turned off during an erase.
3: The entire program memory will be erased when the code protection is turned off.
LVP“) DEBUGW MCLR DEBUG
2011-2015 Microchip Technology Inc. DS40001441F-page 35
PIC12(L)F1840
REGISTER 4-2: CONFIG2: CONFIGURATION WORD 2
R/P-1 R/P-1 U-1 R/P-1 R/P-1 R/P-1
LVP(1) DEBUG(2) — BORV STVREN PLLEN
bit 13 bit 8
U-1 U-1 R-1 U-1 U-1 U-1 R/P-1 R/P-1
— — Reserved ———WRT<1:0>
bit 7 bit 0
Legend:
R = Readable bit P = Programmable bit U = Unimplemented bit, read as ‘1’
‘0’ = Bit is cleared ‘1’ = Bit is set -n = Value when blank or after Bulk Erase
bit 13 LVP: Low-Voltage Programming Enable bit(1)
1 = Low-voltage programming enabled
0 = High-voltage on MCLR must be used for programming
bit 12 DEBUG: In-Circuit Debugger Mode bit(2)
1 = In-Circuit Debugger disabled, ICSPCLK and ICSPDAT are general purpose I/O pins
0 = In-Circuit Debugger enabled, ICSPCLK and ICSPDAT are dedicated to the debugger
bit 11 Unimplemented: Read as ‘1’
bit 10 BORV: Brown-out Reset Voltage Selection bit(3)
1 = Brown-out Reset voltage (Vbor), low trip point selected.
0 = Brown-out Reset voltage (Vbor), high trip point selected.
bit 9 STVREN: Stack Overflow/Underflow Reset Enable bit
1 = Stack Overflow or Underflow will cause a Reset
0 = Stack Overflow or Underflow will not cause a Reset
bit 8 PLLEN: PLL Enable bit
1 = 4xPLL enabled
0 = 4xPLL disabled
bit 7-5 Unimplemented: Read as ‘1’
bit 4 Reserved: This location should be programmed to a ‘1’.
bit 3-2 Unimplemented: Read as ‘1’
bit 1-0 WRT<1:0>: Flash Memory Self-Write Protection bits
11 = Write protection off
10 = 000h to 1FFh write-protected, 200h to FFFh may be modified
01 = 000h to 7FFh write-protected, 800h to FFFh may be modified
00 = 000h to FFFh write-protected, no addresses may be modified
Note 1: The LVP bit cannot be programmed to ‘0’ when Programming mode is entered via LVP.
2: The DEBUG bit in Configuration Words is managed automatically by device development tools including
debuggers and programmers. For normal device operation, this bit should be maintained as a '1'.
3: See Vbor parameter for specific trip point voltages.
CPD CPD
PIC12(L)F1840
DS40001441F-page 36 2011-2015 Microchip Technology Inc.
4.3 Code Protection
Code protection allows the device to be protected from
unauthorized access. Program memory protection and
data EEPROM protection are controlled independently.
Internal access to the program memory and data
EEPROM are unaffected by any code protection
setting.
4.3.1 PROGRAM MEMORY PROTECTION
The entire program memory space is protected from
external reads and writes by the CP bit in Configuration
Words. When CP = 0, external reads and writes of
program memory are inhibited and a read will return all
‘0’s. The CPU can continue to read program memory,
regardless of the protection bit settings. Writing the
program memory is dependent upon the write
protection setting. See Section 4.4 “Write
Protection” for more information.
4.3.2 DATA EEPROM PROTECTION
The entire data EEPROM is protected from external
reads and writes by the CPD bit. When CPD = 0,
external reads and writes of data EEPROM are
inhibited. The CPU can continue to read and write data
EEPROM regardless of the protection bit settings.
4.4 Write Protection
Write protection allows the device to be protected from
unintended self-writes. Applications, such as
bootloader software, can be protected while allowing
other regions of the program memory to be modified.
The WRT<1:0> bits in Configuration Words define the
size of the program memory block that is protected.
4.5 User ID
Four memory locations (8000h-8003h) are designated as
ID locations where the user can store checksum or other
code identification numbers. These locations are
readable and writable during normal execution. See
Section 11.5 “User ID, Device ID and Configuration
Word Access” for more information on accessing these
memory locations. For more information on checksum
calculation, see the “PIC16F/LF1847/PIC12F/LF1840
Memory Programming Specification” (DS41439).
2011-2015 Microchip Technology Inc. DS40001441F-page 37
PIC12(L)F1840
4.6 Device ID and Revision ID
The memory location 8006h is where the Device ID and
Revision ID are stored. The upper nine bits hold the
Device ID. The lower five bits hold the Revision ID. See
Section 11.5 “User ID, Device ID and Configuration
Word Access” for more information on accessing
these memory locations.
Development tools, such as device programmers and
debuggers, may be used to read the Device ID and
Revision ID.
REGISTER 4-3: DEVID: DEVICE ID REGISTER
RRRRRR
DEV<8:3>
bit 13 bit 8
RRRRRRRR
DEV<2:0> REV<4:0>
bit 7 bit 0
Legend:
R = Readable bit
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 13-5 DEV<8:0>: Device ID bits
bit 4-0 REV<4:0>: Revision ID bits
These bits are used to identify the revision (see Table under DEV<8:0> above).
Device
DEVID<13:0> Values
DEV<8:0> REV<4:0>
PIC12F1840 011 011 100 x xxxx
PIC12LF1840 011 011 110 x xxxx
PIC12(L)F1840
DS40001441F-page 38 2011-2015 Microchip Technology Inc.
5.0 OSCILLATOR MODULE (WITH
FAIL-SAFE CLOCK MONITOR)
5.1 Overview
The oscillator module has a wide variety of clock
sources and selection features that allow it to be used
in a wide range of applications while maximizing perfor-
mance and minimizing power consumption. Figure 5-1
illustrates a block diagram of the oscillator module.
Clock sources can be supplied from external oscillators,
quartz crystal resonators, ceramic resonators and
Resistor-Capacitor (RC) circuits. In addition, the system
clock source can be supplied from one of two internal
oscillators and PLL circuits, with a choice of speeds
selectable via software. Additional clock features
include:
• Selectable system clock source between external
or internal sources via software.
• Two-Speed Start-up mode, which minimizes
latency between external oscillator start-up and
code execution.
• Fail-Safe Clock Monitor (FSCM) designed to
detect a failure of the external clock source (LP,
XT, HS, EC or RC modes) and switch
automatically to the internal oscillator.
• Oscillator Start-up Timer (OST) ensures stability
of crystal oscillator sources.
The oscillator module can be configured in one of eight
clock modes.
1. ECL – External Clock Low-Power mode
(0 MHz to 0.5 MHz)
2. ECM – External Clock Medium-Power mode
(0.5 MHz to 4 MHz)
3. ECH – External Clock High-Power mode
(4 MHz to 32 MHz)
4. LP – 32 kHz Low-Power Crystal mode.
5. XT – Medium Gain Crystal or Ceramic Resonator
Oscillator mode (up to 4 MHz)
6. HS – High Gain Crystal or Ceramic Resonator
mode (4 MHz to 20 MHz)
7. RC – External Resistor-Capacitor (RC).
8. INTOSC – Internal oscillator (31 kHz to 32 MHz).
Clock Source modes are selected by the FOSC<2:0>
bits in the Configuration Words. The FOSC bits
determine the type of oscillator that will be used when
the device is first powered.
The EC clock mode relies on an external logic level
signal as the device clock source. The LP, XT, and HS
clock modes require an external crystal or resonator to
be connected to the device. Each mode is optimized for
a different frequency range. The RC clock mode
requires an external resistor and capacitor to set the
oscillator frequency.
The INTOSC internal oscillator block produces low,
medium, and high-frequency clock sources,
designated LFINTOSC, MFINTOSC and HFINTOSC.
(see Internal Oscillator Block, Figure 5-1). A wide
selection of device clock frequencies may be derived
from these three clock sources.
2011-2015 Microchip Technology Inc. DS40001441F-page 39
PIC12(L)F1840
FIGURE 5-1: SIMPLIFIED PIC® MCU CLOCK SOURCE BLOCK DIAGRAM
4 x PLL
FOSC<2:0>
Oscillator
T1OSCEN
Enable
Oscillator
T1OSO
T1OSI
Clock Source Option
for other modules
OSC1
OSC2
Sleep
LP, XT, HS, RC, EC
T1OSC CPU and
Postscaler
MUX
MUX
16 MHz
8 MHz
4 MHz
2 MHz
1 MHz
250 kHz
500 kHz
IRCF<3:0>
31 kHz
500 kHz
Source
Internal
Oscillator
Block
WDT, PWRT, Fail-Safe Clock Monitor
16 MHz
Internal Oscillator
(HFINTOSC)
Clock
Control
SCS<1:0>
HFPLL
31 kHz (LFINTOSC)
Two-Speed Start-up and other modules
Oscillator
31 kHz
Source
500 kHz
(MFINTOSC)
125 kHz
31.25 kHz
62.5 kHz
FOSC<2:0> = 100
Peripherals
Sleep
External
Timer1
PIC12(L)F1840
DS40001441F-page 40 2011-2015 Microchip Technology Inc.
5.2 Clock Source Types
Clock sources can be classified as external or internal.
External clock sources rely on external circuitry for the
clock source to function. Examples are: oscillator mod-
ules (EC mode), quartz crystal resonators or ceramic
resonators (LP, XT and HS modes) and Resis-
tor-Capacitor (RC) mode circuits.
Internal clock sources are contained within the oscilla-
tor module. The internal oscillator block has two inter-
nal oscillators and a dedicated Phase-Lock Loop
(HFPLL) that are used to generate three internal
system clock sources: the 16 MHz High-Frequency
Internal Oscillator (HFINTOSC), 500 kHz (MFINTOSC)
and the 31 kHz Low-Frequency Internal Oscillator
(LFINTOSC).
The system clock can be selected between external or
internal clock sources via the System Clock Select
(SCS) bits in the OSCCON register. See Section 5.3
“Clock Switching” for additional information.
5.2.1 EXTERNAL CLOCK SOURCES
An external clock source can be used as the device
system clock by performing one of the following
actions:
• Program the FOSC<2:0> bits in the Configuration
Words to select an external clock source that will
be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to:
- Timer1 oscillator during run-time, or
- An external clock source determined by the
value of the FOSC bits.
See Section 5.3 “Clock Switching”for more informa-
tion.
5.2.1.1 EC Mode
The External Clock (EC) mode allows an externally
generated logic level signal to be the system clock
source. When operating in this mode, an external clock
source is connected to the OSC1 input.
OSC2/CLKOUT is available for general purpose I/O or
CLKOUT. Figure 5-2 shows the pin connections for EC
mode.
EC mode has three power modes to select from through
Configuration Words:
• High power, 4-32 MHz (FOSC = 111)
• Medium power, 0.5-4 MHz (FOSC = 110)
• Low power, 0-0.5 MHz (FOSC = 101)
The Oscillator Start-up Timer (OST) is disabled when
EC mode is selected. Therefore, there is no delay in
operation after a Power-on Reset (POR) or wake-up
from Sleep. Because the PIC® MCU design is fully
static, stopping the external clock input will have the
effect of halting the device while leaving all data intact.
Upon restarting the external clock, the device will
resume operation as if no time had elapsed.
FIGURE 5-2: EXTERNAL CLOCK (EC)
MODE OPERATION
5.2.1.2 LP, XT, HS Modes
The LP, XT and HS modes support the use of quartz
crystal resonators or ceramic resonators connected to
OSC1 and OSC2 (Figure 5-3). The three modes select
a low, medium or high gain setting of the internal
inverter-amplifier to support various resonator types
and speed.
LP Oscillator mode selects the lowest gain setting of the
internal inverter-amplifier. LP mode current consumption
is the least of the three modes. This mode is designed to
drive only 32.768 kHz tuning-fork type crystals (watch
crystals).
XT Oscillator mode selects the intermediate gain
setting of the internal inverter-amplifier. XT mode
current consumption is the medium of the three modes.
This mode is best suited to drive resonators with a
medium drive level specification.
HS Oscillator mode selects the highest gain setting of the
internal inverter-amplifier. HS mode current consumption
is the highest of the three modes. This mode is best
suited for resonators that require a high drive setting.
Figure 5-3 and Figure 5-4 show typical circuits for
quartz crystal and ceramic resonators, respectively.
OSC1/CLKIN
OSC2/CLKOUT
Clock from
Ext. System
PIC® MCU
FOSC/4 or I/O(1)
Note 1: Output depends upon CLKOUTEN bit of the
Configuration Words.
2011-2015 Microchip Technology Inc. DS40001441F-page 41
PIC12(L)F1840
FIGURE 5-3: QUARTZ CRYSTAL
OPERATION (LP, XT OR
HS MODE)
FIGURE 5-4: CERAMIC RESONATOR
OPERATION
(XT OR HS MODE)
5.2.1.3 Oscillator Start-up Timer (OST)
If the oscillator module is configured for LP, XT or HS
modes, the Oscillator Start-up Timer (OST) counts
1024 oscillations from OSC1. This occurs following a
Power-on Reset (POR) and when the Power-up Timer
(PWRT) has expired (if configured), or a wake-up from
Sleep. During this time, the program counter does not
increment and program execution is suspended,
unless either FSCM or Two-Speed Start-Up are
enabled. In this case, code will continue to execute at
the selected INTOSC frequency while the OST is
counting. The OST ensures that the oscillator circuit,
using a quartz crystal resonator or ceramic resonator,
has started and is providing a stable system clock to
the oscillator module.
In order to minimize latency between external oscillator
start-up and code execution, the Two-Speed Clock
Start-up mode can be selected (see Section 5.4
“Two-Speed Clock Start-up Mode”).
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
Note 1: A series resistor (RS) may be required for
quartz crystals with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
C1
C2
Quartz
RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
Crystal
OSC2/CLKOUT
Note 1: A series resistor (RS) may be required for
ceramic resonators with low drive level.
2: The value of RF varies with the Oscillator mode
selected (typically between 2 M to 10 M.
3: An additional parallel feedback resistor (RP)
may be required for proper ceramic resonator
operation.
C1
C2 Ceramic RS(1)
OSC1/CLKIN
RF(2) Sleep
To Internal
Logic
PIC® MCU
RP(3)
Resonator
OSC2/CLKOUT
(DSO1288) CLKOUTEN
PIC12(L)F1840
DS40001441F-page 42 2011-2015 Microchip Technology Inc.
5.2.1.4 4x PLL
The oscillator module contains a 4x PLL that can be
used with both external and internal clock sources to
provide a system clock source. The input frequency for
the 4x PLL must fall within specifications. See the PLL
Clock Timing Specifications in Section 30.0
“Electrical Specifications”.
The 4x PLL may be enabled for use by one of two
methods:
1. Program the PLLEN bit in Configuration Words
to a ‘1’.
2. Write the SPLLEN bit in the OSCCON register to
a ‘1’. If the PLLEN bit in Configuration Words is
programmed to a ‘1’, then the value of SPLLEN
is ignored.
5.2.1.5 TIMER1 Oscillator
The Timer1 oscillator is a separate crystal oscillator
that is associated with the Timer1 peripheral. It is opti-
mized for timekeeping operations with a 32.768 kHz
crystal connected between the T1OSO and T1OSI
device pins.
The Timer1 oscillator can be used as an alternate
system clock source and can be selected during
run-time using clock switching. Refer to Section 5.3
“Clock Switching” for more information.
FIGURE 5-5: QUARTZ CRYSTAL
OPERATION (TIMER1
OSCILLATOR)
5.2.1.6 External RC Mode
The external Resistor-Capacitor (RC) modes support
the use of an external RC circuit. This allows the
designer maximum flexibility in frequency choice while
keeping costs to a minimum when clock accuracy is not
required.
The RC circuit connects to OSC1. OSC2/CLKOUT is
available for general purpose I/O or CLKOUT. The
function of the OSC2/CLKOUT pin is determined by the
CLKOUTEN bit in Configuration Words.
Figure 5-6 shows the external RC mode connections.
C1
C2
32.768 kHz
T1OSI
To Internal
Logic
PIC® MCU
Crystal
T1OSO
Quartz
Note 1: Quartz crystal characteristics vary
according to type, package and
manufacturer. The user should consult the
manufacturer data sheets for specifications
and recommended application.
2: Always verify oscillator performance over
the VDD and temperature range that is
expected for the application.
3: For oscillator design assistance, reference
the following Microchip Applications Notes:
• AN826, “Crystal Oscillator Basics and
Crystal Selection for rfPIC® and PIC®
Devices” (DS00826)
• AN849, “Basic PIC® Oscillator Design”
(DS00849)
• AN943, “Practical PIC® Oscillator
Analysis and Design” (DS00943)
• AN949, “Making Your Oscillator Work”
(DS00949)
• TB097, “Interfacing a Micro Crystal
MS1V-T1K 32.768 kHz Tuning Fork
Crystal to a PIC16F690/SS” (DS91097)
• AN1288, “Design Practices for
Low-Power External Oscillators”
(DS01288)
CCCCCCCC
2011-2015 Microchip Technology Inc. DS40001441F-page 43
PIC12(L)F1840
FIGURE 5-6: EXTERNAL RC MODES
The RC oscillator frequency is a function of the supply
voltage, the resistor (REXT) and capacitor (CEXT) values
and the operating temperature. Other factors affecting
the oscillator frequency are:
• threshold voltage variation
• component tolerances
• packaging variations in capacitance
The user also needs to take into account variation due
to tolerance of external RC components used.
5.2.2 INTERNAL CLOCK SOURCES
The device may be configured to use the internal
oscillator block as the system clock by performing one
of the following actions:
• Program the FOSC<2:0> bits in Configuration
Words to select the INTOSC clock source, which
will be used as the default system clock upon a
device Reset.
• Write the SCS<1:0> bits in the OSCCON register
to switch the system clock source to the internal
oscillator during run-time. See Section 5.3
“Clock Switching”for more information.
In INTOSC mode, OSC1/CLKIN is available for general
purpose I/O. OSC2/CLKOUT is available for general
purpose I/O or CLKOUT.
The function of the OSC2/CLKOUT pin is determined
by the CLKOUTEN bit in Configuration Words.
The internal oscillator block has two independent
oscillators and a dedicated Phase-Lock Loop, HFPLL
that can produce one of three internal system clock
sources.
1. The HFINTOSC (High-Frequency Internal
Oscillator) is factory calibrated and operates at
16 MHz. The HFINTOSC source is generated
from the 500 kHz MFINTOSC source and the
dedicated Phase-Lock Loop, HFPLL. The
frequency of the HFINTOSC can be
user-adjusted via software using the OSCTUNE
register (Register 5-3).
2. The MFINTOSC (Medium-Frequency Internal
Oscillator) is factory calibrated and operates at
500 kHz. The frequency of the MFINTOSC can
be user-adjusted via software using the
OSCTUNE register (Register 5-3).
3. The LFINTOSC (Low-Frequency Internal
Oscillator) is uncalibrated and operates at
31 kHz.
OSC2/CLKOUT
CEXT
REXT
PIC® MCU
OSC1/CLKIN
FOSC/4 or
Internal
Clock
VDD
VSS
Recommended values: 10 k REXT 100 k, <3V
3 k REXT 100 k, 3-5V
CEXT > 20 pF, 2-5V
Note 1: Output depends upon CLKOUTEN bit of the
Configuration Words.
I/O(1)
PIC12(L)F1840
DS40001441F-page 44 2011-2015 Microchip Technology Inc.
5.2.2.1 HFINTOSC
The High-Frequency Internal Oscillator (HFINTOSC) is
a factory calibrated 16 MHz internal clock source. The
frequency of the HFINTOSC can be altered via
software using the OSCTUNE register (Register 5-3).
The output of the HFINTOSC connects to a postscaler
and multiplexer (see Figure 5-1). One of multiple
frequencies derived from the HFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section 5.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The HFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’.
A fast start-up oscillator allows internal circuits to power
up and stabilize before switching to HFINTOSC.
The High-Frequency Internal Oscillator Ready bit
(HFIOFR) of the OSCSTAT register indicates when the
HFINTOSC is running.
The High-Frequency Internal Oscillator Status Locked
bit (HFIOFL) of the OSCSTAT register indicates when
the HFINTOSC is running within 2% of its final value.
The High-Frequency Internal Oscillator Stable bit
(HFIOFS) of the OSCSTAT register indicates when the
HFINTOSC is running within 0.5% of its final value.
5.2.2.2 MFINTOSC
The Medium-Frequency Internal Oscillator
(MFINTOSC) is a factory calibrated 500 kHz internal
clock source. The frequency of the MFINTOSC can be
altered via software using the OSCTUNE register
(Register 5-3).
The output of the MFINTOSC connects to a postscaler
and multiplexer (see Figure 5-1). One of nine
frequencies derived from the MFINTOSC can be
selected via software using the IRCF<3:0> bits of the
OSCCON register. See Section 5.2.2.7 “Internal
Oscillator Clock Switch Timing” for more information.
The MFINTOSC is enabled by:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired HF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
The Medium Frequency Internal Oscillator Ready bit
(MFIOFR) of the OSCSTAT register indicates when the
MFINTOSC is running.
5.2.2.3 Internal Oscillator Frequency
Adjustment
The 500 kHz internal oscillator is factory calibrated.
This internal oscillator can be adjusted in software by
writing to the OSCTUNE register (Register 5-3). Since
the HFINTOSC and MFINTOSC clock sources are
derived from the 500 kHz internal oscillator a change in
the OSCTUNE register value will apply to both.
The default value of the OSCTUNE register is ‘0’. The
value is a 6-bit two’s complement number. A value of
1Fh will provide an adjustment to the maximum
frequency. A value of 20h will provide an adjustment to
the minimum frequency.
When the OSCTUNE register is modified, the oscillator
frequency will begin shifting to the new frequency. Code
execution continues during this shift. There is no
indication that the shift has occurred.
OSCTUNE does not affect the LFINTOSC frequency.
Operation of features that depend on the LFINTOSC
clock source frequency, such as the Power-up Timer
(PWRT), Watchdog Timer (WDT), Fail-Safe Clock
Monitor (FSCM) and peripherals, are not affected by the
change in frequency.
5.2.2.4 LFINTOSC
The Low-Frequency Internal Oscillator (LFINTOSC) is
an uncalibrated 31 kHz internal clock source.
The output of the LFINTOSC connects to a multiplexer
(see Figure 5-1). Select 31 kHz, via software, using the
IRCF<3:0> bits of the OSCCON register. See
Section 5.2.2.7 “Internal Oscillator Clock Switch
Timing” for more information. The LFINTOSC is also
the frequency for the Power-up Timer (PWRT),
Watchdog Timer (WDT) and Fail-Safe Clock Monitor
(FSCM).
The LFINTOSC is enabled by selecting 31 kHz
(IRCF<3:0> bits of the OSCCON register = 000) as the
system clock source (SCS bits of the OSCCON
register = 1x), or when any of the following are
enabled:
• Configure the IRCF<3:0> bits of the OSCCON
register for the desired LF frequency, and
•FOSC<2:0> = 100, or
• Set the System Clock Source (SCS) bits of the
OSCCON register to ‘1x’
Peripherals that use the LFINTOSC are:
• Power-up Timer (PWRT)
• Watchdog Timer (WDT)
• Fail-Safe Clock Monitor (FSCM)
The Low-Frequency Internal Oscillator Ready bit
(LFIOFR) of the OSCSTAT register indicates when the
LFINTOSC is running.
2011-2015 Microchip Technology Inc. DS40001441F-page 45
PIC12(L)F1840
5.2.2.5 Internal Oscillator Frequency
Selection
The system clock speed can be selected via software
using the Internal Oscillator Frequency Select bits
IRCF<3:0> of the OSCCON register.
The output of the 16 MHz HFINTOSC postscaler and
LFINTOSC connects to a multiplexer (see Figure 5-1).
The Internal Oscillator Frequency Select bits
IRCF<3:0> of the OSCCON register select the
frequency output of the internal oscillators. One of the
following frequencies can be selected via software:
• 32 MHz (requires 4x PLL)
•16 MHz
•8 MHz
•4 MHz
•2 MHz
•1 MHz
• 500 kHz (default after Reset)
• 250 kHz
• 125 kHz
• 62.5 kHz
• 31.25 kHz
• 31 kHz (LFINTOSC)
The IRCF<3:0> bits of the OSCCON register allow
duplicate selections for some frequencies. These dupli-
cate choices can offer system design trade-offs. Lower
power consumption can be obtained when changing
oscillator sources for a given frequency. Faster transi-
tion times can be obtained between frequency changes
that use the same oscillator source.
5.2.2.6 32 MHz Internal Oscillator
Frequency Selection
The Internal Oscillator Block can be used with the 4x
PLL associated with the External Oscillator Block to
produce a 32 MHz internal system clock source. The
following settings are required to use the 32 MHz inter-
nal clock source:
• The FOSC bits in Configuration Words must be
set to use the INTOSC source as the device
system clock (FOSC<2:0> = 100).
• The SCS bits in the OSCCON register must be
cleared to use the clock determined by
FOSC<2:0> in Configuration Words
(SCS<1:0> = 00).
• The IRCF bits in the OSCCON register must be
set to the 8 MHz HFINTOSC set to use
(IRCF<3:0> = 1110).
• The SPLLEN bit in the OSCCON register must be
set to enable the 4xPLL, or the PLLEN bit of the
Configuration Words must be programmed to a
‘1’.
The 4x PLL is not available for use with the internal
oscillator when the SCS bits of the OSCCON register
are set to ‘1x’. The SCS bits must be set to ‘00’ to use
the 4x PLL with the internal oscillator.
Note: Following any Reset, the IRCF<3:0> bits
of the OSCCON register are set to ‘0111’
and the frequency selection is set to
500 kHz. The user can modify the IRCF
bits to select a different frequency.
Note: When using the PLLEN bit of the
Configuration Words, the 4x PLL cannot
be disabled by software and the 8 MHz
HFINTOSC option will no longer be
available.
PIC12(L)F1840
DS40001441F-page 46 2011-2015 Microchip Technology Inc.
5.2.2.7 Internal Oscillator Clock Switch
Timing
When switching between the HFINTOSC, MFINTOSC
and the LFINTOSC, the new oscillator may already be
shut down to save power (see Figure 5-7). If this is the
case, there is a delay after the IRCF<3:0> bits of the
OSCCON register are modified before the frequency
selection takes place. The OSCSTAT register will
reflect the current active status of the HFINTOSC,
MFINTOSC and LFINTOSC oscillators. The sequence
of a frequency selection is as follows:
1. IRCF<3:0> bits of the OSCCON register are
modified.
2. If the new clock is shut down, a clock start-up
delay is started.
3. Clock switch circuitry waits for a falling edge of
the current clock.
4. The current clock is held low and the clock
switch circuitry waits for a rising edge in the new
clock.
5. The new clock is now active.
6. The OSCSTAT register is updated as required.
7. Clock switch is complete.
See Figure 5-7 for more details.
If the internal oscillator speed is switched between two
clocks of the same source, there is no start-up delay
before the new frequency is selected. Clock switching
time delays are shown in Table 5-1.
Start-up delay specifications are located in the
oscillator tables of Section 30.0 “Electrical
Specifications”
&§ I—\ l—\ l—\
2011-2015 Microchip Technology Inc. DS40001441F-page 47
PIC12(L)F1840
FIGURE 5-7: INTERNAL OSCILLATOR SWITCH TIMING
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
HFINTOSC/
LFINTOSC
IRCF <3:0>
System Clock
00
00
Oscillator Delay(1) 2-cycle Sync Running
2-cycle Sync Running
HFINTOSC/ LFINTOSC (FSCM and WDT disabled)
HFINTOSC/ LFINTOSC (Either FSCM or WDT enabled)
LFINTOSC
HFINTOSC/
IRCF <3:0>
System Clock
= 0 0
Oscillator Delay(1) 2-cycle Sync Running
LFINTOSC HFINTOSC/MFINTOSC LFINTOSC turns off unless WDT or FSCM is enabled
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
MFINTOSC
Note 1: See Table 5-1, Oscillator Switching Delays, for more information.
PIC12(L)F1840
DS40001441F-page 48 2011-2015 Microchip Technology Inc.
5.3 Clock Switching
The system clock source can be switched between
external and internal clock sources via software using
the System Clock Select (SCS) bits of the OSCCON
register. The following clock sources can be selected
using the SCS bits:
• Default system oscillator determined by FOSC
bits in Configuration Words
• Timer1 32 kHz crystal oscillator
• Internal Oscillator Block (INTOSC)
5.3.1 SYSTEM CLOCK SELECT (SCS)
BITS
The System Clock Select (SCS) bits of the OSCCON
register selects the system clock source that is used for
the CPU and peripherals.
• When the SCS bits of the OSCCON register = 00,
the system clock source is determined by value of
the FOSC<2:0> bits in the Configuration Words.
• When the SCS bits of the OSCCON register = 01,
the system clock source is the Timer1 oscillator.
• When the SCS bits of the OSCCON register = 1x,
the system clock source is chosen by the internal
oscillator frequency selected by the IRCF<3:0>
bits of the OSCCON register. After a Reset, the
SCS bits of the OSCCON register are always
cleared.
When switching between clock sources, a delay is
required to allow the new clock to stabilize. These
oscillator delays are shown in Table 5-1.
5.3.2 OSCILLATOR START-UP TIMER
STATUS (OSTS) BIT
The Oscillator Start-up Timer Status (OSTS) bit of the
OSCSTAT register indicates whether the system clock
is running from the external clock source, as defined by
the FOSC<2:0> bits in the Configuration Words, or
from the internal clock source. In particular, OSTS
indicates that the Oscillator Start-up Timer (OST) has
timed out for LP, XT or HS modes. The OST does not
reflect the status of the Timer1 oscillator.
5.3.3 TIMER1 OSCILLATOR
The Timer1 oscillator is a separate crystal oscillator
associated with the Timer1 peripheral. It is optimized
for timekeeping operations with a 32.768 kHz crystal
connected between the T1OSO and T1OSI device
pins.
The Timer1 oscillator is enabled using the T1OSCEN
control bit in the T1CON register. See Section 21.0
“Timer1 Module with Gate Control” for more
information about the Timer1 peripheral.
5.3.4 TIMER1 OSCILLATOR READY
(T1OSCR) BIT
The user must ensure that the Timer1 oscillator is
ready to be used before it is selected as a system clock
source. The Timer1 Oscillator Ready (T1OSCR) bit of
the OSCSTAT register indicates whether the Timer1
oscillator is ready to be used. After the T1OSCR bit is
set, the SCS bits can be configured to select the Timer1
oscillator.
Note: Any automatic clock switch, which may
occur from Two-Speed Start-up or
Fail-Safe Clock Monitor, does not update
the SCS bits of the OSCCON register. The
user can monitor the OSTS bit of the
OSCSTAT register to determine the current
system clock source.
remain clear.
2011-2015 Microchip Technology Inc. DS40001441F-page 49
PIC12(L)F1840
5.4 Two-Speed Clock Start-up Mode
Two-Speed Start-up mode provides additional power
savings by minimizing the latency between external
oscillator start-up and code execution. In applications
that make heavy use of the Sleep mode, Two-Speed
Start-up will remove the external oscillator start-up
time from the time spent awake and can reduce the
overall power consumption of the device. This mode
allows the application to wake-up from Sleep, perform
a few instructions using the INTOSC internal oscillator
block as the clock source and go back to Sleep without
waiting for the external oscillator to become stable.
Two-Speed Start-up provides benefits when the oscil-
lator module is configured for LP, XT or HS modes.
The Oscillator Start-up Timer (OST) is enabled for
these modes and must count 1024 oscillations before
the oscillator can be used as the system clock source.
If the oscillator module is configured for any mode
other than LP, XT or HS mode, then Two-Speed
Start-up is disabled. This is because the external clock
oscillator does not require any stabilization time after
POR or an exit from Sleep.
If the OST count reaches 1024 before the device
enters Sleep mode, the OSTS bit of the OSCSTAT
register is set and program execution switches to the
external oscillator. However, the system may never
operate from the external oscillator if the time spent
awake is very short.
5.4.1 TWO-SPEED START-UP MODE
CONFIGURATION
Two-Speed Start-up mode is configured by the
following settings:
• IESO (of the Configuration Words) = 1; Inter-
nal/External Switchover bit (Two-Speed Start-up
mode enabled).
• SCS (of the OSCCON register) = 00.
• FOSC<2:0> bits in the Configuration Words
configured for LP, XT or HS mode.
Two-Speed Start-up mode is entered after:
• Power-on Reset (POR) and, if enabled, after
Power-up Timer (PWRT) has expired, or
• Wake-up from Sleep.
TABLE 5-1: OSCILLATOR SWITCHING DELAYS
Note: Executing a SLEEP instruction will abort
the oscillator start-up time and will cause
the OSTS bit of the OSCSTAT register to
remain clear.
Switch From Switch To Frequency Oscillator Delay
Sleep/POR
LFINTOSC(1)
MFINTOSC(1)
HFINTOSC(1)
31 kHz
31.25 kHz-500 kHz
31.25kHz-16MHz
Oscillator Warm-up Delay (TWARM)
Sleep/POR EC, RC(1) DC – 32 MHz 2 cycles
LFINTOSC EC, RC(1) DC – 32 MHz 1 cycle of each
Sleep/POR Timer1 Oscillator
LP, XT, HS(1) 32 kHz-20 MHz 1024 Clock Cycles (OST)
Any clock source MFINTOSC(1)
HFINTOSC(1)
31.25 kHz-500 kHz
31.25kHz-16MHz 2s (approx.)
Any clock source LFINTOSC(1) 31 kHz 1 cycle of each
Any clock source Timer1 Oscillator 32 kHz 1024 Clock Cycles (OST)
PLL inactive PLL active 16-32 MHz 2 ms (approx.)
Note 1: PLL inactive.
PIC12(L)F1840
DS40001441F-page 50 2011-2015 Microchip Technology Inc.
5.4.2 TWO-SPEED START-UP
SEQUENCE
1. Wake-up from Power-on Reset or Sleep.
2. Instructions begin execution by the internal
oscillator at the frequency set in the IRCF<3:0>
bits of the OSCCON register.
3. OST enabled to count 1024 clock cycles.
4. OST timed out, wait for falling edge of the
internal oscillator.
5. OSTS is set.
6. System clock held low until the next falling edge
of new clock (LP, XT or HS mode).
7. System clock is switched to external clock
source.
5.4.3 CHECKING TWO-SPEED CLOCK
STATUS
Checking the state of the OSTS bit of the OSCSTAT
register will confirm if the microcontroller is running
from the external clock source, as defined by the
FOSC<2:0> bits in the Configuration Words, or the
internal oscillator.
FIGURE 5-8: TWO-SPEED START-UP
0 1 1022 1023
PC + 1
TOSTT
INTOSC
OSC1
OSC2
Program Counter
System Clock
PC - N PC
comp‘emd.
2011-2015 Microchip Technology Inc. DS40001441F-page 51
PIC12(L)F1840
5.5 Fail-Safe Clock Monitor
The Fail-Safe Clock Monitor (FSCM) allows the device
to continue operating should the external oscillator fail.
The FSCM can detect oscillator failure any time after
the Oscillator Start-up Timer (OST) has expired. The
FSCM is enabled by setting the FCMEN bit in the
Configuration Words. The FSCM is applicable to all
external Oscillator modes (LP, XT, HS, EC, Timer1
Oscillator and RC).
FIGURE 5-9: FSCM BLOCK DIAGRAM
5.5.1 FAIL-SAFE DETECTION
The FSCM module detects a failed oscillator by
comparing the external oscillator to the FSCM sample
clock. The sample clock is generated by dividing the
LFINTOSC by 64. See Figure 5-9. Inside the fail
detector block is a latch. The external clock sets the
latch on each falling edge of the external clock. The
sample clock clears the latch on each rising edge of the
sample clock. A failure is detected when an entire
half-cycle of the sample clock elapses before the
external clock goes low.
5.5.2 FAIL-SAFE OPERATION
When the external clock fails, the FSCM switches the
device clock to an internal clock source and sets the bit
flag OSFIF of the PIR2 register. Setting this flag will
generate an interrupt if the OSFIE bit of the PIE2
register is also set. The device firmware can then take
steps to mitigate the problems that may arise from a
failed clock. The system clock will continue to be
sourced from the internal clock source until the device
firmware successfully restarts the external oscillator
and switches back to external operation.
The internal clock source chosen by the FSCM is
determined by the IRCF<3:0> bits of the OSCCON
register. This allows the internal oscillator to be
configured before a failure occurs.
5.5.3 FAIL-SAFE CONDITION CLEARING
The Fail-Safe condition is cleared after a Reset,
executing a SLEEP instruction or changing the SCS bits
of the OSCCON register. When the SCS bits are
changed, the OST is restarted. While the OST is
running, the device continues to operate from the
INTOSC selected in OSCCON. When the OST times
out, the Fail-Safe condition is cleared after successfully
switching to the external clock source. The OSFIF bit
should be cleared prior to switching to the external
clock source. If the Fail-Safe condition still exists, the
OSFIF flag will again become set by hardware.
5.5.4 RESET OR WAKE-UP FROM SLEEP
The FSCM is designed to detect an oscillator failure
after the Oscillator Start-up Timer (OST) has expired.
The OST is used after waking up from Sleep and after
any type of Reset. The OST is not used with the EC or
RC Clock modes so that the FSCM will be active as
soon as the Reset or wake-up has completed. When
the FSCM is enabled, the Two-Speed Start-up is also
enabled. Therefore, the device will always be executing
code while the OST is operating.
External
LFINTOSC ÷ 64
S
R
Q
31 kHz
(~32 s)
488 Hz
(~2 ms)
Clock Monitor
Latch
Clock
Failure
Detected
Oscillator
Clock
Q
Sample Clock
Note: Due to the wide range of oscillator start-up
times, the Fail-Safe circuit is not active
during oscillator start-up (i.e., after exiting
Reset or Sleep). After an appropriate
amount of time, the user should check the
Status bits in the OSCSTAT register to
verify the oscillator start-up and that the
system clock switchover has successfully
completed.
PIC12(L)F1840
DS40001441F-page 52 2011-2015 Microchip Technology Inc.
FIGURE 5-10: FSCM TIMING DIAGRAM
OSCFIF
System
Clock
Output
Sample Clock
Failure
Detected
Oscillator
Failure
Note: The system clock is normally at a much higher frequency than the sample clock. The relative frequencies in
this example have been chosen for clarity.
(Q)
Te s t Test Test
Clock Monitor Output
If PLLEN m Configurahon Words : . If PLLEN m Configurahon Words : .
2011-2015 Microchip Technology Inc. DS40001441F-page 53
PIC12(L)F1840
5.6 Register Definitions: Oscillator Control
REGISTER 5-1: OSCCON: OSCILLATOR CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-1/1 U-0 R/W-0/0 R/W-0/0
SPLLEN IRCF<3:0> —SCS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SPLLEN: Software PLL Enable bit
If PLLEN in Configuration Words = 1:
SPLLEN bit is ignored. 4x PLL is always enabled (subject to oscillator requirements)
If PLLEN in Configuration Words = 0:
1 = 4x PLL Is enabled
0 = 4x PLL is disabled
bit 6-3 IRCF<3:0>: Internal Oscillator Frequency Select bits
1111 = 16 MHz HF
1110 = 8 MHz or 32 MHz HF(see Section 5.2.2.1 “HFINTOSC”)
1101 =4MHz HF
1100 =2MHz HF
1011 =1MHz HF
1010 =500kHz HF
(1)
1001 =250kHz HF
(1)
1000 =125kHz HF
(1)
0111 = 500 kHz MF (default upon Reset)
0110 =250kHz MF
0101 =125kHz MF
0100 =62.5kHz MF
0011 =31.25kHz HF
(1)
0010 =31.25kHz MF
000x =31kHz LF
bit 2 Unimplemented: Read as ‘0’
bit 1-0 SCS<1:0>: System Clock Select bits
1x = Internal oscillator block
01 = Timer1 oscillator
00 = Clock determined by FOSC<2:0> in Configuration Words.
Note 1: Duplicate frequency derived from HFINTOSC.
"TWOSCEN : l "TWOSCEN : 0
PIC12(L)F1840
DS40001441F-page 54 2011-2015 Microchip Technology Inc.
REGISTER 5-2: OSCSTAT: OSCILLATOR STATUS REGISTER
R-1/q R-0/q R-q/q R-0/q R-0/q R-q/q R-0/0 R-0/q
T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Conditional
bit 7 T1OSCR: Timer1 Oscillator Ready bit
If T1OSCEN = 1:
1 = Timer1 oscillator is ready
0 = Timer1 oscillator is not ready
If T1OSCEN = 0:
1 = Timer1 clock source is always ready
bit 6 PLLR: 4x PLL Ready bit
1 = 4x PLL is ready
0 = 4x PLL is not ready
bit 5 OSTS: Oscillator Start-up Timer Status bit
1 = Running from the clock defined by the FOSC<2:0> bits of the Configuration Words
0 = Running from an internal oscillator (FOSC<2:0> = 100)
bit 4 HFIOFR: High-Frequency Internal Oscillator Ready bit
1 = HFINTOSC is ready
0 = HFINTOSC is not ready
bit 3 HFIOFL: High-Frequency Internal Oscillator Locked bit
1 = HFINTOSC is at least 2% accurate
0 = HFINTOSC is not 2% accurate
bit 2 MFIOFR: Medium-Frequency Internal Oscillator Ready bit
1 = MFINTOSC is ready
0 = MFINTOSC is not ready
bit 1 LFIOFR: Low-Frequency Internal Oscillator Ready bit
1 = LFINTOSC is ready
0 = LFINTOSC is not ready
bit 0 HFIOFS: High-Frequency Internal Oscillator Stable bit
1 = HFINTOSC is at least 0.5% accurate
0 = HFINTOSC is not 0.5% accurate
2011-2015 Microchip Technology Inc. DS40001441F-page 55
PIC12(L)F1840
TABLE 5-2: SUMMARY OF REGISTERS ASSOCIATED WITH CLOCK SOURCES
TABLE 5-3: SUMMARY OF CONFIGURATION WORD WITH CLOCK SOURCES
REGISTER 5-3: OSCTUNE: OSCILLATOR TUNING REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— TUN<5:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 TUN<5:0>: Frequency Tuning bits
100000 = Minimum frequency
•
•
•
111111
000000 = Oscillator module is running at the factory-calibrated frequency.
000001
•
•
•
011110
011111 = Maximum frequency
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON SPLLEN IRCF<3:0> —SCS<1:0>53
OSCSTAT T1OSCR PLLR OSTS HFIOFR HFIOFL MFIOFR LFIOFR HFIOFS 54
OSCTUNE ——TUN<5:0>55
PIE2 OSFIE —C1IE EEIE BCL1IE — — — 74
PIR2 OSFIF —C1IF EEIF BCL1IF — — — 76
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON 154
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 —— FCMEN IESO CLKOUTEN BOREN<1:0> CPD 33
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by clock sources.
CLKOUTEN
PIC12(L)F1840
DS40001441F-page 56 2011-2015 Microchip Technology Inc.
6.0 REFERENCE CLOCK MODULE
The reference clock module provides the ability to send
a divided clock to the clock output pin of the device
(CLKR) and provide a secondary internal clock source
to the modulator module. This module is available in all
oscillator configurations and allows the user to select a
greater range of clock sub-multiples to drive external
devices in the application. The reference clock module
includes the following features:
• System clock is the source
• Available in all oscillator configurations
• Programmable clock divider
• Output enable to a port pin
• Selectable duty cycle
• Slew rate control
The reference clock module is controlled by the
CLKRCON register (Register 6-1) and is enabled
when setting the CLKREN bit. To output the divided
clock signal to the CLKR port pin, the CLKROE bit
must be set. The CLKRDIV<2:0> bits enable the
selection of eight different clock divider options. The
CLKRDC<1:0> bits can be used to modify the duty
cycle of the output clock(1). The CLKRSLR bit controls
slew rate limiting.
For information on using the reference clock output
with the modulator module, see Section 23.0 “Data
Signal Modulator”.
6.1 Slew Rate
The slew rate limitation on the output port pin can be
disabled. The slew rate limitation is removed by
clearing the CLKRSLR bit in the CLKRCON register.
6.2 Effects of a Reset
Upon any device Reset, the reference clock module is
disabled. The user’s firmware is responsible for
initializing the module before enabling the output. The
registers are reset to their default values.
6.3 Conflicts with the CLKR Pin
There are two cases when the reference clock output
signal cannot be output to the CLKR pin, if:
• LP, XT or HS Oscillator mode is selected.
• CLKOUT function is enabled.
Even if either of these cases are true, the module can
still be enabled and the reference clock signal may be
used in conjunction with the modulator module.
6.3.1 OSCILLATOR MODES
If LP, XT or HS oscillator modes are selected, the
OSC2/CLKR pin must be used as an oscillator input pin
and the CLKR output cannot be enabled. See
Section 5.2 “Clock Source Types” for more
information on different oscillator modes.
6.3.2 CLKOUT FUNCTION
The CLKOUT function has a higher priority than the
reference clock module. Therefore, if the CLKOUT
function is enabled by the CLKOUTEN bit in Configura-
tion Words, FOSC/4 will always be output on the port
pin. Reference Section 4.0 “Device Configuration”
for more information.
6.4 Operation During Sleep
As the reference clock module relies on the system
clock as its source, and the system clock is disabled in
Sleep, the module does not function in Sleep, even if
an external clock source or the Timer1 clock source is
configured as the system clock. The module outputs
will remain in their current state until the device exits
Sleep.
Note 1: If the base clock rate is selected without
a divider, the output clock will always
have a duty cycle equal to that of the
source clock, unless a 0% duty cycle is
selected. If the clock divider is set to base
clock/2, then 25% and 75% duty cycle
accuracy will be dependent upon the
source clock.
CLKOUTEN CLKOUTEN
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PIC12(L)F1840
6.5 Register Definition: Reference Clock Control
REGISTER 6-1: CLKRCON: REFERENCE CLOCK CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
CLKREN CLKROE CLKRSLR CLKRDC<1:0> CLKRDIV<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CLKREN: Reference Clock Module Enable bit
1 = Reference clock module is enabled
0 = Reference clock module is disabled
bit 6 CLKROE: Reference Clock Output Enable bit(3)
1 = Reference clock output is enabled on CLKR pin
0 = Reference clock output disabled on CLKR pin
bit 5 CLKRSLR: Reference Clock Slew Rate Control Limiting Enable bit
1 = Slew rate limiting is enabled
0 = Slew rate limiting is disabled
bit 4-3 CLKRDC<1:0>: Reference Clock Duty Cycle bits
11 = Clock outputs duty cycle of 75%
10 = Clock outputs duty cycle of 50%
01 = Clock outputs duty cycle of 25%
00 = Clock outputs duty cycle of 0%
bit 2-0 CLKRDIV<2:0> Reference Clock Divider bits
111 = Base clock value divided by 128
110 = Base clock value divided by 64
101 = Base clock value divided by 32
100 = Base clock value divided by 16
011 = Base clock value divided by 8
010 = Base clock value divided by 4
001 = Base clock value divided by 2(1)
000 = Base clock value(2)
Note 1: In this mode, the 25% and 75% duty cycle accuracy will be dependent on the source clock duty cycle.
2: In this mode, the duty cycle will always be equal to the source clock duty cycle, unless a duty cycle of 0%
is selected.
3: To route CLKR to pin, CLKOUTEN of Configuration Words = 1 is required. CLKOUTEN of Configuration
Words = 0 will result in FOSC/4. See Section 6.3 “Conflicts with the CLKR Pin” for details.
PIC12(L)F1840
DS40001441F-page 58 2011-2015 Microchip Technology Inc.
TABLE 6-1: SUMMARY OF REGISTERS ASSOCIATED WITH REFERENCE CLOCK SOURCES
TABLE 6-2: SUMMARY OF CONFIGURATION WORD WITH REFERENCE CLOCK SOURCES
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CLKRCON CLKREN CLKROE CLKRSLR CLKRDC<1:0>
CLKRDIV
<2:0> 57
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 33
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by reference clock sources.
Egg
2011-2015 Microchip Technology Inc. DS40001441F-page 59
PIC12(L)F1840
7.0 RESETS
There are multiple ways to reset this device:
• Power-On Reset (POR)
• Brown-Out Reset (BOR)
•MCLR
Reset
•WDT Reset
•RESET instruction
• Stack Overflow
• Stack Underflow
• Programming mode exit
To a l lo w V DD to stabilize, an optional power-up timer
can be enabled to extend the Reset time after a BOR
or POR event.
A simplified block diagram of the On-Chip Reset Circuit
is shown in Figure 7-1.
FIGURE 7-1: SIMPLIFIED BLOCK DIAGRAM OF ON-CHIP RESET CIRCUIT
External Reset
MCLR
VDD
WDT
Time-out
Power-on
Reset
LFINTOSC
PWRT
64 ms
PWRTEN
Brown-out
Reset
BOR
RESET Instruction
Stack
Pointer
Stack Overflow/Underflow Reset
Sleep
MCLRE
Enable
Device
Reset
Zero
Programming Mode Exit
MCLR PWRTE
PIC12(L)F1840
DS40001441F-page 60 2011-2015 Microchip Technology Inc.
7.1 Power-On Reset (POR)
The POR circuit holds the device in Reset until VDD has
reached an acceptable level for minimum operation.
Slow rising VDD, fast operating speeds or analog
performance may require greater than minimum VDD.
The PWRT, BOR or MCLR features can be used to
extend the start-up period until all device operation
conditions have been met.
7.1.1 POWER-UP TIMER (PWRT)
The Power-up Timer provides a nominal 64 ms time-
out on POR or Brown-out Reset.
The device is held in Reset as long as PWRT is active.
The PWRT delay allows additional time for the VDD to
rise to an acceptable level. The Power-up Timer is
enabled by clearing the PWRTE bit in Configuration
Words.
The Power-up Timer starts after the release of the POR
and BOR.
For additional information, refer to Application Note
AN607, “Power-up Trouble Shooting” (DS00607).
7.2 Brown-Out Reset (BOR)
The BOR circuit holds the device in Reset when VDD
reaches a selectable minimum level. Between the
POR and BOR, complete voltage range coverage for
execution protection can be implemented.
The Brown-out Reset module has four operating
modes controlled by the BOREN<1:0> bits in
Configuration Words. The four operating modes are:
• BOR is always on
• BOR is off when in Sleep
• BOR is controlled by software
• BOR is always off
Refer to Tab le 7 -1 for more information.
The Brown-out Reset voltage level is selectable by
configuring the BORV bit in Configuration Words.
A VDD noise rejection filter prevents the BOR from
triggering on small events. If VDD falls below VBOR for
a duration greater than parameter TBORDC, the device
will reset. See Figure 7-2 for more information.
TABLE 7-1: BOR OPERATING MODES
7.2.1 BOR IS ALWAYS ON
When the BOREN bits of Configuration Words are
programmed to ‘11’, the BOR is always on. The device
start-up will be delayed until the BOR is ready and VDD
is higher than the BOR threshold.
BOR protection is active during Sleep. The BOR does
not delay wake-up from Sleep.
7.2.2 BOR IS OFF IN SLEEP
When the BOREN bits of Configuration Words are
programmed to ‘10’, the BOR is on, except in Sleep.
The device start-up will be delayed until the BOR is
ready and VDD is higher than the BOR threshold.
BOR protection is not active during Sleep. The device
wake-up will be delayed until the BOR is ready.
7.2.3 BOR CONTROLLED BY SOFTWARE
When the BOREN bits of Configuration Words are
programmed to ‘01’, the BOR is controlled by the
SBOREN bit of the BORCON register. The device start-
up is not delayed by the BOR ready condition or the
VDD level.
BOR protection begins as soon as the BOR circuit is
ready. The status of the BOR circuit is reflected in the
BORRDY bit of the BORCON register.
BOR protection is unchanged by Sleep.
BOREN<1:0> SBOREN Device Mode BOR Mode Instruction Execution upon:
Release of POR or Wake-up from Sleep
11 X X Active Waits for BOR ready(1) (BORRDY = 1)
10 X Awake Active Waits for BOR ready (BORRDY = 1)
Sleep Disabled
01 1X Active Waits for BOR ready(1) (BORRDY = 1)
0XDisabled
Begins immediately (BORRDY = x)
00 X XDisabled
Note 1: In these specific cases, “Release of POR” and “Wake-up from Sleep”, there is no delay in start-up. The BOR
ready flag, (BORRDY = 1), will be set before the CPU is ready to execute instructions because the BOR
circuit is forced on by the BOREN<1:0> bits.
If BOREN <1 :0=""> In Conflgurat‘on Words ; 7 If BOREN <1 :0=""> In Conflgurat‘on Words = 7 If BOREN<1.0> :A (Alwa s on) or BOREN<1.0> : , (Alwa s am If BOREN <1.0> : 10 (stabled in Sleep) or BOREN<1.0> : 01 (Under soflware control).
2011-2015 Microchip Technology Inc. DS40001441F-page 61
PIC12(L)F1840
FIGURE 7-2: BROWN-OUT SITUATIONS
7.3 Register Definitions: BOR Control
REGISTER 7-1: BORCON: BROWN-OUT RESET CONTROL REGISTER
R/W-1/u R/W-0/u U-0 U-0 U-0 U-0 U-0 R-q/u
SBOREN BORFS — — — — —BORRDY
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 SBOREN: Software Brown-out Reset Enable bit
If BOREN <1:0> in Configuration Words 01:
SBOREN is read/write, but has no effect on the BOR.
If BOREN <1:0> in Configuration Words = 01:
1 = BOR Enabled
0 = BOR Disabled
bit 6 BORFS: Brown-out Reset Fast Start bit(1)
If BOREN<1:0> = 11 (Always on) or BOREN<1:0> = 00 (Always off)
BORFS is Read/Write, but has no effect.
If BOREN <1:0> = 10 (Disabled in Sleep) or BOREN<1:0> = 01 (Under software control):
1 = Band gap is forced on always (covers sleep/wake-up/operating cases)
0 = Band gap operates normally, and may turn off
bit 5-1 Unimplemented: Read as ‘0’
bit 0 BORRDY: Brown-out Reset Circuit Ready Status bit
1 = The Brown-out Reset circuit is active
0 = The Brown-out Reset circuit is inactive
Note 1: BOREN<1:0> bits are located in Configuration Words.
TPWRT(1)
VBOR
VDD
Internal
Reset
VBOR
VDD
Internal
Reset TPWRT(1)
< TPWRT
TPWRT(1)
VBOR
VDD
Internal
Reset
Note 1: TPWRT delay only if PWRTE bit is programmed to ‘0’.
MCLR MCLR PWRTE MCLR 7 W MCLR MCLR e MCLR 7 «y of MCLR fMCLR MCLR MCLR m he fi :1 fi
PIC12(L)F1840
DS40001441F-page 62 2011-2015 Microchip Technology Inc.
7.4 MCLR
The MCLR is an optional external input that can reset
the device. The MCLR function is controlled by the
MCLRE bit of Configuration Words and the LVP bit of
Configuration Words (Table 7-2).
7.4.1 MCLR ENABLED
When MCLR is enabled and the pin is held low, the
device is held in Reset. The MCLR pin is connected to
VDD through an internal weak pull-up.
The device has a noise filter in the MCLR Reset path.
The filter will detect and ignore small pulses.
7.4.2 MCLR DISABLED
When MCLR is disabled, the pin functions as a general
purpose input and the internal weak pull-up is under
software control. See Section 12.2 “PORTA Registers”
for more information.
7.5 Watchdog Timer (WDT) Reset
The Watchdog Timer generates a Reset if the firmware
does not issue a CLRWDT instruction within the time-out
period. The TO and PD bits in the STATUS register are
changed to indicate the WDT Reset. See Section 10.0
“Watchdog Timer (WDT)” for more information.
7.6 RESET Instruction
A RESET instruction will cause a device Reset. The RI
bit in the PCON register will be set to ‘0’. See Tab le 7 -4
for default conditions after a RESET instruction has
occurred.
7.7 Stack Overflow/Underflow Reset
The device can reset when the Stack Overflows or
Underflows. The STKOVF or STKUNF bits of the PCON
register indicate the Reset condition. These Resets are
enabled by setting the STVREN bit in Configuration
Word 2. See Section 3.5.2 “Overflow/Underflow
Reset” for more information.
7.8 Programming Mode Exit
Upon exit of Programming mode, the device will
behave as if a POR had just occurred.
7.9 Power-Up Timer
The Power-up Timer optionally delays device execution
after a BOR or POR event. This timer is typically used to
allow VDD to stabilize before allowing the device to start
running.
The Power-up Timer is controlled by the PWRTE bit of
Configuration Words.
7.10 Start-up Sequence
Upon the release of a POR or BOR, the following must
occur before the device will begin executing:
1. Power-up Timer runs to completion (if enabled).
2. Oscillator start-up timer runs to completion (if
required for oscillator source).
3. MCLR must be released (if enabled).
The total time-out will vary based on oscillator configu-
ration and Power-up Timer configuration. See
Section 5.0 “Oscillator Module (with Fail-Safe
Clock Monitor)” for more information.
The Power-up Timer and oscillator start-up timer run
independently of MCLR Reset. If MCLR is kept low long
enough, the Power-up Timer and oscillator start-up
timer will expire. Upon bringing MCLR high, the device
will begin execution immediately (see Figure 7-3). This
is useful for testing purposes or to synchronize more
than one device operating in parallel.
TABLE 7-2: MCLR CONFIGURATION
MCLRE LVP MCLR
00Disabled
10Enabled
x1Enabled
Note: A Reset does not drive the MCLR pin low.
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PIC12(L)F1840
FIGURE 7-3: RESET START-UP SEQUENCE
TOST
TMCLR
TPWRT
VDD
Internal POR
Power-Up Timer
MCLR
Internal RESET
Oscillator Modes
Oscillator Start-Up Timer
Oscillator
FOSC
Internal Oscillator
Oscillator
FOSC
External Clock (EC)
CLKIN
FOSC
External Crystal
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DS40001441F-page 64 2011-2015 Microchip Technology Inc.
7.11 Determining the Cause of a Reset
Upon any Reset, multiple bits in the STATUS and
PCON register are updated to indicate the cause of the
Reset. Ta bl e 7 -3 and Tabl e 7-4 show the Reset
conditions of these registers.
TABLE 7-3: RESET STATUS BITS AND THEIR SIGNIFICANCE
TABLE 7-4: RESET CONDITION FOR SPECIAL REGISTERS
STKOVF STKUNF RMCLR RI POR BOR TO PD Condition
00110x11Power-on Reset
00110x0xIllegal, TO is set on POR
00110xx0Illegal, PD is set on POR
0011u011Brown-out Reset
uuuuuu0uWDT Reset
uuuuuu00WDT Wake-up from Sleep
uuuuuu10Interrupt Wake-up from Sleep
uu0uuuuuMCLR Reset during normal operation
uu0uuu10MCLR Reset during Sleep
u u u 0 u u u u RESET Instruction Executed
1uuuuuuuStack Overflow Reset (STVREN = 1)
u1uuuuuuStack Underflow Reset (STVREN = 1)
Condition Program
Counter
STATUS
Register
PCON
Register
Power-on Reset 0000h ---1 1000 00-- 110x
MCLR Reset during normal operation 0000h ---u uuuu uu-- 0uuu
MCLR Reset during Sleep 0000h ---1 0uuu uu-- 0uuu
WDT Reset 0000h ---0 uuuu uu-- uuuu
WDT Wake-up from Sleep PC + 1 ---0 0uuu uu-- uuuu
Brown-out Reset 0000h ---1 1uuu 00-- 11u0
Interrupt Wake-up from Sleep PC + 1(1) ---1 0uuu uu-- uuuu
RESET Instruction Executed 0000h ---u uuuu uu-- u0uu
Stack Overflow Reset (STVREN = 1) 0000h ---u uuuu 1u-- uuuu
Stack Underflow Reset (STVREN = 1) 0000h ---u uuuu u1-- uuuu
Legend: u = unchanged, x = unknown, - = unimplemented bit, reads as ‘0’.
Note 1: When the wake-up is due to an interrupt and Global Enable bit (GIE) is set, the return address is pushed on
the stack and PC is loaded with the interrupt vector (0004h) after execution of PC + 1.
BOR fi MCLR (RMCLR RMCLR fl POR BOR MCLR MCLR MCLR MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 65
PIC12(L)F1840
7.12 Power Control (PCON) Register
The Power Control (PCON) register contains flag bits
to differentiate between a:
• Power-on Reset (POR)
• Brown-out Reset (BOR)
• Reset Instruction Reset (RI)
• Stack Overflow Reset (STKOVF)
• Stack Underflow Reset (STKUNF)
•MCLR
Reset (RMCLR)
The PCON register bits are shown in Register 7-2.
7.13 Register Definitions: Power Control
REGISTER 7-2: PCON: POWER CONTROL REGISTER
R/W/HS-0/q R/W/HS-0/q U-0 U-0 R/W/HC-1/q R/W/HC-1/q R/W/HC-q/u R/W/HC-q/u
STKOVF STKUNF — — RMCLR RI POR BOR
bit 7 bit 0
Legend:
HC = Bit is cleared by hardware HS = Bit is set by hardware
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 STKOVF: Stack Overflow Flag bit
1 = A Stack Overflow occurred
0 = A Stack Overflow has not occurred or set to ‘0’ by firmware
bit 6 STKUNF: Stack Underflow Flag bit
1 = A Stack Underflow occurred
0 = A Stack Underflow has not occurred or set to ‘0’ by firmware
bit 5-4 Unimplemented: Read as ‘0’
bit 3 RMCLR: MCLR Reset Flag bit
1 = A MCLR Reset has not occurred or set to ‘1’ by firmware
0 = A MCLR Reset has occurred (set to ‘0’ in hardware when a MCLR Reset occurs)
bit 2 RI: RESET Instruction Flag bit
1 = A RESET instruction has not been executed or set to ‘1’ by firmware
0 = A RESET instruction has been executed (set to ‘0’ in hardware upon executing a RESET instruction)
bit 1 POR: Power-on Reset Status bit
1 = No Power-on Reset occurred
0 = A Power-on Reset occurred (must be set in software after a Power-on Reset occurs)
bit 0 BOR: Brown-out Reset Status bit
1 = No Brown-out Reset occurred
0 = A Brown-out Reset occurred (must be set in software after a Power-on Reset or Brown-out Reset
occurs)
PIC12(L)F1840
DS40001441F-page 66 2011-2015 Microchip Technology Inc.
TABLE 7-5: SUMMARY OF REGISTERS ASSOCIATED WITH RESETS
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BORCON SBOREN BORFS ————— BORRDY 61
PCON STKOVF STKUNF ——RMCLRRI POR BOR 65
STATUS — — —TOPD ZDC C15
WDTCON —— WDTPS<4:0> SWDTEN 83
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by Resets.
) P\R| Pan<7> (TMR’HE) P‘E1
2011-2015 Microchip Technology Inc. DS40001441F-page 67
PIC12(L)F1840
8.0 INTERRUPTS
The interrupt feature allows certain events to preempt
normal program flow. Firmware is used to determine
the source of the interrupt and act accordingly. Some
interrupts can be configured to wake the MCU from
Sleep mode.
This chapter contains the following information for
Interrupts:
• Operation
• Interrupt Latency
• Interrupts During Sleep
•INT Pin
• Automatic Context Saving
Many peripherals produce interrupts. Refer to the
corresponding chapters for details.
A block diagram of the interrupt logic is shown in
Figure 8-1.
FIGURE 8-1: INTERRUPT LOGIC
TMR0IF
TMR0IE
INTF
INTE
IOCIF
IOCIE Interrupt
to CPU
Wake-up
(If in Sleep mode)
GIE
(TMR1IF) PIR1<0>
PIRn<7>
PEIE
(TMR1IE) PIE1<0>
Peripheral Interrupts
PIEn<7>
PIC12(L)F1840
DS40001441F-page 68 2011-2015 Microchip Technology Inc.
8.1 Operation
Interrupts are disabled upon any device Reset. They
are enabled by setting the following bits:
• GIE bit of the INTCON register
• Interrupt Enable bit(s) for the specific interrupt
event(s)
• PEIE bit of the INTCON register (if the Interrupt
Enable bit of the interrupt event is contained in the
PIEx register)
The INTCON, PIR1 and PIR2 registers record individual
interrupts via interrupt flag bits. Interrupt flag bits will be
set, regardless of the status of the GIE, PEIE and
individual interrupt enable bits.
The following events happen when an interrupt event
occurs while the GIE bit is set:
• Current prefetched instruction is flushed
• GIE bit is cleared
• Current Program Counter (PC) is pushed onto the
stack
• Critical registers are automatically saved to the
shadow registers (See Section 8.5 “Automatic
Context Saving”)
• PC is loaded with the interrupt vector 0004h
The firmware within the Interrupt Service Routine (ISR)
should determine the source of the interrupt by polling
the interrupt flag bits. The interrupt flag bits must be
cleared before exiting the ISR to avoid repeated
interrupts. Because the GIE bit is cleared, any interrupt
that occurs while executing the ISR will be recorded
through its interrupt flag, but will not cause the
processor to redirect to the interrupt vector.
The RETFIE instruction exits the ISR by popping the
previous address from the stack, restoring the saved
context from the shadow registers and setting the GIE
bit.
For additional information on a specific interrupt
operation, refer to its peripheral chapter.
8.2 Interrupt Latency
Interrupt latency is defined as the time from when the
interrupt event occurs to the time code execution at the
interrupt vector begins. The latency for synchronous
interrupts is three or four instruction cycles. For
asynchronous interrupts, the latency is three to five
instruction cycles, depending on when the interrupt
occurs. See Figure 8-2 and Figure 8-3 for more details.
Note 1: Individual interrupt flag bits are set,
regardless of the state of any other
enable bits.
2: All interrupts will be ignored while the GIE
bit is cleared. Any interrupt occurring
while the GIE bit is clear will be serviced
when the GIE bit is set again.
2011-2015 Microchip Technology Inc. DS40001441F-page 69
PIC12(L)F1840
FIGURE 8-2: INTERRUPT LATENCY
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
CLKOUT
PC 0004h 0005h
PC
Inst(0004h)NOP
GIE
Q1 Q2 Q3 Q4Q1 Q2 Q3 Q4
1 Cycle Instruction at PC
PC
Inst(0004h)NOP
2 Cycle Instruction at PC
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3 Cycle Instruction at PC
Execute
Interrupt
Inst(PC)
Interrupt Sampled
during Q1
Inst(PC)
PC-1 PC+1
NOP
PC New PC/
PC+1 0005hPC-1 PC+1/FSR
ADDR 0004h
NOP
Interrupt
GIE
Interrupt
INST(PC) NOPNOP
FSR ADDR PC+1 PC+2 0004h 0005h
PC
Inst(0004h)NOP
GIE
PCPC-1
3 Cycle Instruction at PC
Interrupt
INST(PC) NOPNOP NOP
Inst(0005h)
Execute
Execute
Execute
PIC12(L)F1840
DS40001441F-page 70 2011-2015 Microchip Technology Inc.
FIGURE 8-3: INT PIN INTERRUPT TIMING
Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4 Q2Q1 Q3 Q4
OSC1
CLKOUT
INT pin
INTF
GIE
INSTRUCTION FLOW
PC
Instruction
Fetched
Instruction
Executed
Interrupt Latency
PC PC + 1 PC + 1 0004h 0005h
Inst (0004h) Inst (0005h)
Dummy Cycle
Inst (PC) Inst (PC + 1)
Inst (PC – 1) Inst (0004h)
Dummy Cycle
Inst (PC)
—
Note 1: INTF flag is sampled here (every Q1).
2: Asynchronous interrupt latency = 3-5 TCY. Synchronous latency = 3-4 TCY, where TCY = instruction cycle time.
Latency is the same whether Inst (PC) is a single cycle or a 2-cycle instruction.
3: CLKOUT not available in all oscillator modes.
4: For minimum width of INT pulse, refer to AC specifications in Section 30.0 “Electrical Specifications”.
5: INTF is enabled to be set any time during the Q4-Q1 cycles.
(1)
(2)
(3)
(4)
(5)
(1)
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PIC12(L)F1840
8.3 Interrupts During Sleep
Some interrupts can be used to wake from Sleep. To
wake from Sleep, the peripheral must be able to
operate without the system clock. The interrupt source
must have the appropriate Interrupt Enable bit(s) set
prior to entering Sleep.
On waking from Sleep, if the GIE bit is also set, the
processor will branch to the interrupt vector. Otherwise,
the processor will continue executing instructions after
the SLEEP instruction. The instruction directly after the
SLEEP instruction will always be executed before
branching to the ISR. Refer to the Section 9.0 “Power-
Down Mode (Sleep)” for more details.
8.4 INT Pin
The INT pin can be used to generate an asynchronous
edge-triggered interrupt. This interrupt is enabled by
setting the INTE bit of the INTCON register. The
INTEDG bit of the OPTION_REG register determines
on which edge the interrupt will occur. When the
INTEDG bit is set, the rising edge will cause the
interrupt. When the INTEDG bit is clear, the falling edge
will cause the interrupt. The INTF bit of the INTCON
register will be set when a valid edge appears on the INT
pin. If the GIE and INTE bits are also set, the processor
will redirect program execution to the interrupt vector.
8.5 Automatic Context Saving
Upon entering an interrupt, the return PC address is
saved on the stack. Additionally, the following registers
are automatically saved in the shadow registers:
• W register
• STATUS register (except for TO and PD)
• BSR register
• FSR registers
• PCLATH register
Upon exiting the Interrupt Service Routine, these
registers are automatically restored. Any modifications
to these registers during the ISR will be lost. If
modifications to any of these registers are desired, the
corresponding shadow register should be modified and
the value will be restored when exiting the ISR. The
shadow registers are available in Bank 31 and are
readable and writable. Depending on the user’s
application, other registers may also need to be saved.
PIC12(L)F1840
DS40001441F-page 72 2011-2015 Microchip Technology Inc.
8.6 Register Definitions: Interrupt Control
REGISTER 8-1: INTCON: INTERRUPT CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0
GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 GIE: Global Interrupt Enable bit
1 = Enables all active interrupts
0 = Disables all interrupts
bit 6 PEIE: Peripheral Interrupt Enable bit
1 = Enables all active peripheral interrupts
0 = Disables all peripheral interrupts
bit 5 TMR0IE: Timer0 Overflow Interrupt Enable bit
1 = Enables the Timer0 interrupt
0 = Disables the Timer0 interrupt
bit 4 INTE: INT External Interrupt Enable bit
1 = Enables the INT external interrupt
0 = Disables the INT external interrupt
bit 3 IOCIE: Interrupt-on-Change Enable bit
1 = Enables the interrupt-on-change
0 = Disables the interrupt-on-change
bit 2 TMR0IF: Timer0 Overflow Interrupt Flag bit
1 = TMR0 register has overflowed
0 = TMR0 register did not overflow
bit 1 INTF: INT External Interrupt Flag bit
1 = The INT external interrupt occurred
0 = The INT external interrupt did not occur
bit 0 IOCIF: Interrupt-on-Change Interrupt Flag bit(1)
1 = When at least one of the interrupt-on-change pins changed state
0 = None of the interrupt-on-change pins have changed state
Note 1: The IOCIF Flag bit is read-only and cleared when all the Interrupt-on-Change flags in the IOCAF register
have been cleared by software.
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear
prior to enabling an interrupt.
sel Io enable an; éeriéheral imerruét
2011-2015 Microchip Technology Inc. DS40001441F-page 73
PIC12(L)F1840
REGISTER 8-2: PIE1: PERIPHERAL INTERRUPT ENABLE REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIE: Timer1 Gate Interrupt Enable bit
1 = Enables the Timer1 Gate Acquisition interrupt
0 = Disables the Timer1 Gate Acquisition interrupt
bit 6 ADIE: Analog-to-Digital Converter (ADC) Interrupt Enable bit
1 = Enables the ADC interrupt
0 = Disables the ADC interrupt
bit 5 RCIE: USART Receive Interrupt Enable bit
1 = Enables the USART receive interrupt
0 = Disables the USART receive interrupt
bit 4 TXIE: USART Transmit Interrupt Enable bit
1 = Enables the USART transmit interrupt
0 = Disables the USART transmit interrupt
bit 3 SSP1IE: Synchronous Serial Port (MSSP) Interrupt Enable bit
1 = Enables the MSSP interrupt
0 = Disables the MSSP interrupt
bit 2 CCP1IE: CCP1 Interrupt Enable bit
1 = Enables the CCP1 interrupt
0 = Disables the CCP1 interrupt
bit 1 TMR2IE: TMR2 to PR2 Match Interrupt Enable bit
1 = Enables the Timer2 to PR2 match interrupt
0 = Disables the Timer2 to PR2 match interrupt
bit 0 TMR1IE: Timer1 Overflow Interrupt Enable bit
1 = Enables the Timer1 overflow interrupt
0 = Disables the Timer1 overflow interrupt
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
sel Io enable an; éeriéheral imerruét
PIC12(L)F1840
DS40001441F-page 74 2011-2015 Microchip Technology Inc.
REGISTER 8-3: PIE2: PERIPHERAL INTERRUPT ENABLE REGISTER 2
R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0
OSFIE — C1IE EEIE BCL1IE — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 OSFIE: Oscillator Fail Interrupt Enable bit
1 = Enables the Oscillator Fail interrupt
0 = Disables the Oscillator Fail interrupt
bit 6 Unimplemented: Read as ‘0’
bit 5 C1IE: Comparator C1 Interrupt Enable bit
1 = Enables the Comparator C1 interrupt
0 = Disables the Comparator C1 interrupt
bit 4 EEIE: EEPROM Write Completion Interrupt Enable bit
1 = Enables the EEPROM Write Completion interrupt
0 = Disables the EEPROM Write Completion interrupt
bit 3 BCL1IE: MSSP Bus Collision Interrupt Enable bit
1 = Enables the MSSP Bus Collision Interrupt
0 = Disables the MSSP Bus Collision Interrupt
bit 2-0 Unimplemented: Read as ‘0’
Note: Bit PEIE of the INTCON register must be
set to enable any peripheral interrupt.
Io enablin an \merru :
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PIC12(L)F1840
REGISTER 8-4: PIR1: PERIPHERAL INTERRUPT REQUEST REGISTER 1
R/W-0/0 R/W-0/0 R-0/0 R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 TMR1GIF: Timer1 Gate Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6 ADIF: ADC Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 5 RCIF: USART Receive Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4 TXIF: USART Transmit Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3 SSP1IF: Synchronous Serial Port (MSSP) Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2 CCP1IF: CCP1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 1 TMR2IF: Timer2 to PR2 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 0 TMR1IF: Timer1 Overflow Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
Io enablln an \merru :
PIC12(L)F1840
DS40001441F-page 76 2011-2015 Microchip Technology Inc.
TABLE 8-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPTS
REGISTER 8-5: PIR2: PERIPHERAL INTERRUPT REQUEST REGISTER 2
R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0
OSFIF — C1IF EEIF BCL1IF — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 OSFIF: Oscillator Fail Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 6 Unimplemented: Read as ‘0’
bit 5 C1IF: Comparator C1 Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 4 EEIF: EEPROM Write Completion Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 3 BCL1IF: MSSP Bus Collision Interrupt Flag bit
1 = Interrupt is pending
0 = Interrupt is not pending
bit 2-0 Unimplemented: Read as ‘0’
Note: Interrupt flag bits are set when an interrupt
condition occurs, regardless of the state of
its corresponding enable bit or the Global
Enable bit, GIE, of the INTCON register.
User software should ensure the
appropriate interrupt flag bits are clear prior
to enabling an interrupt.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 145
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIE2 OSFIE — C1IE EEIE BCL1IE — — — 74
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PIR2 OSFIF — C1IF EEIF BCL1IF — — — 76
Legend: — = unimplemented locations read as ‘0’. Shaded cells are not used by Interrupts.
MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 77
PIC12(L)F1840
9.0 POWER-DOWN MODE (SLEEP)
The Power-Down mode is entered by executing a
SLEEP instruction.
Upon entering Sleep mode, the following conditions
exist:
1. WDT will be cleared but keeps running, if
enabled for operation during Sleep.
2. PD bit of the STATUS register is cleared.
3. TO bit of the STATUS register is set.
4. CPU clock is disabled.
5. 31 kHz LFINTOSC is unaffected and peripherals
that operate from it may continue operation in
Sleep.
6. Timer1 and peripherals that operate from
Timer1 continue operation in Sleep when the
Timer1 clock source selected is:
•T1CKI
• Timer1 oscillator
• CapSense oscillator
7. ADC is unaffected, if the dedicated FRC oscillator
is selected.
8. Capacitive Sensing oscillator is unaffected.
9. I/O ports maintain the status they had before
SLEEP was executed (driving high, low or high-
impedance).
10. Resets other than WDT are not affected by
Sleep mode.
Refer to individual chapters for more details on
peripheral operation during Sleep.
To minimize current consumption, the following
conditions should be considered:
• I/O pins should not be floating
• External circuitry sinking current from I/O pins
• Internal circuitry sourcing current from I/O pins
• Current draw from pins with internal weak pull-ups
• Modules using 31 kHz LFINTOSC
• Modules using Timer1 oscillator
I/O pins that are high-impedance inputs should be
pulled to VDD or VSS externally to avoid switching
currents caused by floating inputs.
Examples of internal circuitry that might be sourcing
current include modules such as the DAC and FVR
modules. See Section 17.0 “Digital-to-Analog
Converter (DAC) Module” and Section 14.0 “Fixed
Voltage Reference (FVR)” for more information on
these modules.
9.1 Wake-up from Sleep
The device can wake-up from Sleep through one of the
following events:
1. External Reset input on MCLR pin, if enabled
2. BOR Reset, if enabled
3. POR Reset
4. Watchdog Timer, if enabled
5. Any external interrupt
6. Interrupts by peripherals capable of running
during Sleep (see individual peripheral for more
information)
The first three events will cause a device Reset. The
last three events are considered a continuation of
program execution. To determine whether a device
Reset or wake-up event occurred, refer to Section 7.11
“Determining the Cause of a Reset”.
When the SLEEP instruction is being executed, the next
instruction (PC + 1) is prefetched. For the device to
wake-up through an interrupt event, the corresponding
interrupt enable bit must be enabled. Wake-up will
occur regardless of the state of the GIE bit. If the GIE
bit is disabled, the device continues execution at the
instruction after the SLEEP instruction. If the GIE bit is
enabled, the device executes the instruction after the
SLEEP instruction, the device will then call the Interrupt
Service Routine. In cases where the execution of the
instruction following SLEEP is not desirable, the user
should have a NOP after the SLEEP instruction.
The WDT is cleared when the device wakes up from
Sleep, regardless of the source of wake-up.
PIC12(L)F1840
DS40001441F-page 78 2011-2015 Microchip Technology Inc.
9.1.1 WAKE-UP USING INTERRUPTS
When global interrupts are disabled (GIE cleared) and
any interrupt source has both its interrupt enable bit
and interrupt flag bit set, one of the following will occur:
• If the interrupt occurs before the execution of a
SLEEP instruction
-SLEEP instruction will execute as a NOP.
- WDT and WDT prescaler will not be cleared
-TO
bit of the STATUS register will not be set
-PD
bit of the STATUS register will not be
cleared.
• If the interrupt occurs during or after the
execution of a SLEEP instruction
-SLEEP instruction will be completely
executed
- Device will immediately wake-up from Sleep
- WDT and WDT prescaler will be cleared
-TO
bit of the STATUS register will be set
-PD bit of the STATUS register will be cleared.
Even if the flag bits were checked before executing a
SLEEP instruction, it may be possible for flag bits to
become set before the SLEEP instruction completes. To
determine whether a SLEEP instruction executed, test
the PD bit. If the PD bit is set, the SLEEP instruction
was executed as a NOP.
FIGURE 9-1: WAKE-UP FROM SLEEP THROUGH INTERRUPT
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1(1)
CLKOUT(2)
Interrupt flag
GIE bit
(INTCON reg.)
Instruction Flow
PC
Instruction
Fetched
Instruction
Executed
PC PC + 1 PC + 2
Inst(PC) = Sleep
Inst(PC - 1)
Inst(PC + 1)
Sleep
Processor in
Sleep
Interrupt Latency(4)
Inst(PC + 2)
Inst(PC + 1)
Inst(0004h) Inst(0005h)
Inst(0004h)
Forced NOP
PC + 2 0004h 0005h
Forced NOP
T1OSC(3)
PC + 2
Note 1: XT, HS or LP Oscillator mode assumed.
2: CLKOUT is shown here for timing reference.
3: T1OSC; See Section 30.0 “Electrical Specifications”.
4: GIE = 1 assumed. In this case after wake-up, the processor calls the ISR at 0004h. If GIE = 0, execution will continue in-line.
2011-2015 Microchip Technology Inc. DS40001441F-page 79
PIC12(L)F1840
9.2 Low-Power Sleep Mode
The PIC12F1840 device contains an internal Low
Dropout (LDO) voltage regulator, which allows the
device I/O pins to operate at voltages up to 5.5V while
the internal device logic operates at a lower voltage.
The LDO and its associated reference circuitry must
remain active when the device is in Sleep mode. The
PIC12F1840 allows the user to optimize the operating
current in Sleep, depending on the application
requirements.
A Low-Power Sleep mode can be selected by setting
the VREGPM bit of the VREGCON register. With this
bit set, the LDO and reference circuitry are placed in a
low-power state when the device is in Sleep.
9.2.1 SLEEP CURRENT VS. WAKE-UP
TIME
In the default operating mode, the LDO and reference
circuitry remain in the normal configuration while in
Sleep. The device is able to exit Sleep mode quickly
since all circuits remain active. In Low-Power Sleep
mode, when waking up from Sleep, an extra delay time
is required for these circuits to return to the normal
configuration and stabilize.
The Low-Power Sleep mode is beneficial for
applications that stay in Sleep mode for long periods of
time. The normal mode is beneficial for applications
that need to wake from Sleep quickly and frequently.
9.2.2 PERIPHERAL USAGE IN SLEEP
Some peripherals that can operate in Sleep mode will
not operate properly with the Low-Power Sleep mode
selected. The LDO will remain in the normal power
mode when those peripherals are enabled. The Low-
Power Sleep mode is intended for use with these
peripherals:
• Brown-Out Reset (BOR)
• Watchdog Timer (WDT)
• External interrupt pin/Interrupt-on-change pins
• Timer1 (with external clock source)
• Comparator
• ECCP (Capture mode)
Note: The PIC12LF1840 does not have a con-
figurable Low-Power Sleep mode.
PIC12LF1840 is an unregulated device
and is always in the lowest power state
when in Sleep, with no wake-up time pen-
alty. This device has a lower maximum
VDD and I/O voltage than the
PIC12F1840. See Section 30.0 “Electri-
cal Specifications” for more information.
PIC12(L)F1840
DS40001441F-page 80 2011-2015 Microchip Technology Inc.
9.3 Register Definitions: Voltage Regulator Control
TABLE 9-1: SUMMARY OF REGISTERS ASSOCIATED WITH POWER-DOWN MODE
REGISTER 9-1: VREGCON: VOLTAGE REGULATOR CONTROL REGISTER(1)
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-1/1
— — — — — —VREGPMReserved
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1 VREGPM: Voltage Regulator Power Mode Selection bit
1 = Low-Power Sleep mode enabled in Sleep(2)
Draws lowest current in Sleep, slower wake-up
0 = Normal-Power mode enabled in Sleep(2)
Draws higher current in Sleep, faster wake-up
bit 0 Reserved: Read as ‘1’. Maintain this bit set.
Note 1: PIC12F1840 only.
2: See Section 30.0 “Electrical Specifications”.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
IOCAF —— IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 107
IOCAN —— IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 107
IOCAP —— IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 107
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIE2 OSFIE —C1IEEEIEBCL1IE ———74
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PIR2 OSFIF —C1IFEEIFBCL1IF ———76
STATUS — — —TOPD ZDC C15
VREGCON(1) ——————VREGPMReserved 80
WDTCON ——WDTPS<4:0>SWDTEN83
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in Power-Down mode.
Note 1: PIC12F1840 only.
S‘eep
2011-2015 Microchip Technology Inc. DS40001441F-page 81
PIC12(L)F1840
10.0 WATCHDOG TIMER (WDT)
The Watchdog Timer is a system timer that generates
a Reset if the firmware does not issue a CLRWDT
instruction within the time-out period. The Watchdog
Timer is typically used to recover the system from
unexpected events.
The WDT has the following features:
• Independent clock source
• Multiple operating modes
- WDT is always on
- WDT is off when in Sleep
- WDT is controlled by software
- WDT is always off
• Configurable time-out period is from 1 ms to 256
seconds (nominal)
• Multiple Reset conditions
• Operation during Sleep
FIGURE 10-1: WATCHDOG TIMER BLOCK DIAGRAM
LFINTOSC 23-bit Programmable
Prescaler WDT WDT Time-out
WDTPS<4:0>
SWDTEN
Sleep
WDTE<1:0> = 11
WDTE<1:0> = 01
WDTE<1:0> = 10
PIC12(L)F1840
DS40001441F-page 82 2011-2015 Microchip Technology Inc.
10.1 Independent Clock Source
The WDT derives its time base from the 31 kHz
LFINTOSC internal oscillator. Time intervals in this
chapter are based on a nominal interval of 1 ms. See
Section 30.0 “Electrical Specifications” for the
LFINTOSC tolerances.
10.2 WDT Operating Modes
The Watchdog Timer module has four operating modes
controlled by the WDTE<1:0> bits in Configuration
Words. See Table 10-1.
10.2.1 WDT IS ALWAYS ON
When the WDTE bits of Configuration Words are set to
‘11’, the WDT is always on.
WDT protection is active during Sleep.
10.2.2 WDT IS OFF IN SLEEP
When the WDTE bits of Configuration Words are set to
‘10’, the WDT is on, except in Sleep.
WDT protection is not active during Sleep.
10.2.3 WDT CONTROLLED BY SOFTWARE
When the WDTE bits of Configuration Words are set to
‘01’, the WDT is controlled by the SWDTEN bit of the
WDTCON register.
WDT protection is unchanged by Sleep. See
Table 10-1 for more details.
TABLE 10-1: WDT OPERATING MODES
10.3 Time-out Period
The WDTPS bits of the WDTCON register set the
time-out period from 1 ms to 256 seconds (nominal).
After a Reset, the default time-out period is two
seconds.
10.4 Clearing the WDT
The WDT is cleared when any of the following
conditions occur:
•Any Reset
•CLRWDT instruction is executed
• Device enters Sleep
• Device wakes up from Sleep
• Oscillator fail
• WDT is disabled
•OST is running
See Table 10-2 for more information.
10.5 Operation During Sleep
When the device enters Sleep, the WDT is cleared. If
the WDT is enabled during Sleep, the WDT resumes
counting.
When the device exits Sleep, the WDT is cleared
again. The WDT remains clear until the OST, if
enabled, completes. See Section 5.0 “Oscillator
Module (with Fail-Safe Clock Monitor)” for more
information on the OST.
When a WDT time-out occurs while the device is in
Sleep, no Reset is generated. Instead, the device
wakes up and resumes operation. The TO and PD bits
in the STATUS register are changed to indicate the
event. See Section 3.0 “Memory Organization” and
The STATUS register (Register 3-1) for more
information.
WDTE<1:0> SWDTEN Device
Mode
WDT
Mode
11 X XActive
10 X Awake Active
Sleep Disabled
01 1XActive
0X Disabled
00 X X Disabled
TABLE 10-2: WDT CLEARING CONDITIONS
Conditions WDT
WDTE<1:0> = 00
Cleared
WDTE<1:0> = 01 and SWDTEN = 0
WDTE<1:0> = 10 and enter Sleep
CLRWDT Command
Oscillator Fail Detected
Exit Sleep + System Clock = T1OSC, EXTRC, INTOSC, EXTCLK
Exit Sleep + System Clock = XT, HS, LP Cleared until the end of OST
Change INTOSC divider (IRCF bits) Unaffected
If WDTE<1 .0=""> : ()0 If WDTE<1.0> : ()l If WDTE<1.>
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PIC12(L)F1840
10.6 Register Definitions: Watchdog Control
REGISTER 10-1: WDTCON: WATCHDOG TIMER CONTROL REGISTER
U-0 U-0 R/W-0/0 R/W-1/1 R/W-0/0 R/W-1/1 R/W-1/1 R/W-0/0
—— WDTPS<4:0> SWDTEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -m/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-1 WDTPS<4:0>: Watchdog Timer Period Select bits
Bit Value = Prescale Rate
11111 = Reserved. Results in minimum interval (1:32)
•
•
•
10011 = Reserved. Results in minimum interval (1:32)
10010 = 1:8388608 (223) (Interval 256s nominal)
10001 = 1:4194304 (222) (Interval 128s nominal)
10000 = 1:2097152 (221) (Interval 64s nominal)
01111 = 1:1048576 (220) (Interval 32s nominal)
01110 = 1:524288 (219) (Interval 16s nominal)
01101 = 1:262144 (218) (Interval 8s nominal)
01100 = 1:131072 (217) (Interval 4s nominal)
01011 = 1:65536 (Interval 2s nominal) (Reset value)
01010 = 1:32768 (Interval 1s nominal)
01001 = 1:16384 (Interval 512 ms nominal)
01000 = 1:8192 (Interval 256 ms nominal)
00111 = 1:4096 (Interval 128 ms nominal)
00110 = 1:2048 (Interval 64 ms nominal)
00101 = 1:1024 (Interval 32 ms nominal)
00100 = 1:512 (Interval 16 ms nominal)
00011 = 1:256 (Interval 8 ms nominal)
00010 = 1:128 (Interval 4 ms nominal)
00001 = 1:64 (Interval 2 ms nominal)
00000 = 1:32 (Interval 1 ms nominal)
bit 0 SWDTEN: Software Enable/Disable for Watchdog Timer bit
If WDTE<1:0> = 00:
This bit is ignored.
If WDTE<1:0> = 01:
1 = WDT is turned on
0 = WDT is turned off
If WDTE<1:0> = 1x:
This bit is ignored.
PIC12(L)F1840
DS40001441F-page 84 2011-2015 Microchip Technology Inc.
TABLE 10-3: SUMMARY OF REGISTERS ASSOCIATED WITH WATCHDOG TIMER
TABLE 10-4: SUMMARY OF CONFIGURATION WORD WITH WATCHDOG TIMER
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
OSCCON SPLLEN IRCF<3:0> —SCS<1:0>
53
STATUS ———TOPD ZDC C15
WDTCON —— WDTPS<4:0> SWDTEN 83
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by Watchdog Timer.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> —33
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Watchdog Timer.
2011-2015 Microchip Technology Inc. DS40001441F-page 85
PIC12(L)F1840
11.0 DATA EEPROM AND FLASH
PROGRAM MEMORY
CONTROL
The data EEPROM and Flash program memory are
readable and writable during normal operation (full VDD
range). These memories are not directly mapped in the
register file space. Instead, they are indirectly
addressed through the Special Function Registers
(SFRs). There are six SFRs used to access these
memories:
• EECON1
• EECON2
• EEDATL
•EEDATH
• EEADRL
•EEADRH
When interfacing the data memory block, EEDATL
holds the 8-bit data for read/write, and EEADRL holds
the address of the EEDATL location being accessed.
These devices have 256 bytes of data EEPROM with
an address range from 0h to 0FFh.
When accessing the program memory block, the
EEDATH:EEDATL register pair forms a 2-byte word
that holds the 14-bit data for read/write, and the
EEADRL and EEADRH registers form a 2-byte word
that holds the 15-bit address of the program memory
location being read.
The EEPROM data memory allows byte read and write.
An EEPROM byte write automatically erases the
location and writes the new data (erase before write).
The write time is controlled by an on-chip timer. The
write/erase voltages are generated by an on-chip
charge pump rated to operate over the voltage range of
the device for byte or word operations.
Depending on the setting of the Flash Program
Memory Self Write Enable bits WRT<1:0> of the
Configuration Words, the device may or may not be
able to write certain blocks of the program memory.
However, reads from the program memory are always
allowed.
When the device is code-protected, the device
programmer can no longer access data or program
memory. When code-protected, the CPU may continue
to read and write the data EEPROM memory and Flash
program memory.
11.1 EEADRL and EEADRH Registers
The EEADRH:EEADRL register pair can address up to
a maximum of 256 bytes of data EEPROM or up to a
maximum of 32K words of program memory.
When selecting a program address value, the MSB of
the address is written to the EEADRH register and the
LSB is written to the EEADRL register. When selecting
a EEPROM address value, only the LSB of the address
is written to the EEADRL register.
11.1.1 EECON1 AND EECON2 REGISTERS
EECON1 is the control register for EE memory
accesses.
Control bit EEPGD determines if the access will be a
program or data memory access. When clear, any
subsequent operations will operate on the EEPROM
memory. When set, any subsequent operations will
operate on the program memory. On Reset, EEPROM is
selected by default.
Control bits RD and WR initiate read and write,
respectively. These bits cannot be cleared, only set, in
software. They are cleared in hardware at completion
of the read or write operation. The inability to clear the
WR bit in software prevents the accidental, premature
termination of a write operation.
The WREN bit, when set, will allow a write operation to
occur. On power-up, the WREN bit is clear. The
WRERR bit is set when a write operation is interrupted
by a Reset during normal operation. In these situations,
following Reset, the user can check the WRERR bit
and execute the appropriate error handling routine.
Interrupt flag bit EEIF of the PIR2 register is set when
write is complete. It must be cleared in the software.
Reading EECON2 will read all ‘0’s. The EECON2
register is used exclusively in the data EEPROM write
sequence. To enable writes, a specific pattern must be
written to EECON2.
CPD CPD
PIC12(L)F1840
DS40001441F-page 86 2011-2015 Microchip Technology Inc.
11.2 Using the Data EEPROM
The data EEPROM is a high-endurance, byte
addressable array that has been optimized for the
storage of frequently changing information (e.g.,
program variables or other data that are updated
often). When variables in one section change
frequently, while variables in another section do not
change, it is possible to exceed the total number of
write cycles to the EEPROM without exceeding the
total number of write cycles to a single byte. Refer to
Section 30.0 “Electrical Specifications”. If this is the
case, then a refresh of the array must be performed.
For this reason, variables that change infrequently
(such as constants, IDs, calibration, etc.) should be
stored in Flash program memory.
11.2.1 READING THE DATA EEPROM
MEMORY
To read a data memory location, the user must write the
address to the EEADRL register, clear the EEPGD and
CFGS control bits of the EECON1 register, and then
set control bit RD. The data is available at the very next
cycle, in the EEDATL register; therefore, it can be read
in the next instruction. EEDATL will hold this value until
another read or until it is written to by the user (during
a write operation).
EXAMPLE 11-1: DATA EEPROM READ
11.2.2 WRITING TO THE DATA EEPROM
MEMORY
To write an EEPROM data location, the user must first
write the address to the EEADRL register and the data
to the EEDATL register. Then the user must follow a
specific sequence to initiate the write for each byte.
The write will not initiate if the above sequence is not
followed exactly (write 55h to EECON2, write AAh to
EECON2, then set the WR bit) for each byte. Interrupts
should be disabled during this code segment.
Additionally, the WREN bit in EECON1 must be set to
enable write. This mechanism prevents accidental
writes to data EEPROM due to errant (unexpected)
code execution (i.e., lost programs). The user should
keep the WREN bit clear at all times, except when
updating EEPROM. The WREN bit is not cleared
by hardware.
After a write sequence has been initiated, clearing the
WREN bit will not affect this write cycle. The WR bit will
be inhibited from being set unless the WREN bit is set.
At the completion of the write cycle, the WR bit is
cleared in hardware and the EE Write Complete
Interrupt Flag bit (EEIF) is set. The user can either
enable this interrupt or poll this bit. EEIF must be
cleared by software.
11.2.3 PROTECTION AGAINST SPURIOUS
WRITE
There are conditions when the user may not want to
write to the data EEPROM memory. To protect against
spurious EEPROM writes, various mechanisms have
been built-in. On power-up, WREN is cleared. Also, the
Power-up Timer (64 ms duration) prevents EEPROM
write.
The write initiate sequence and the WREN bit together
help prevent an accidental write during:
• Brown-out
• Power Glitch
• Software Malfunction
11.2.4 DATA EEPROM OPERATION
DURING CODE-PROTECT
Data memory can be code-protected by programming
the CPD bit in the Configuration Words to ‘0’.
When the data memory is code-protected, only the
CPU is able to read and write data to the data
EEPROM. It is recommended to code-protect the pro-
gram memory when code-protecting data memory.
This prevents anyone from replacing your program with
a program that will access the contents of the data
EEPROM.
Note: Data EEPROM can be read regardless of
the setting of the CPD bit.
BANKSEL EEADRL ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADRL ;Data Memory
;Address to read
BCF EECON1, CFGS ;Deselect Config space
BCF EECON1, EEPGD;Point to DATA memory
BSF EECON1, RD ;EE Read
MOVF EEDATL, W ;W = EEDATL
HHHHJHHHHHHHH < x="" x="" x="" x="" x="" )="">
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PIC12(L)F1840
EXAMPLE 11-2: DATA EEPROM WRITE
FIGURE 11-1: FLASH PROGRAM MEMORY READ CYCLE EXECUTION
BANKSEL EEADRL ;
MOVLW DATA_EE_ADDR ;
MOVWF EEADRL ;Data Memory Address to write
MOVLW DATA_EE_DATA ;
MOVWF EEDATL ;Data Memory Value to write
BCF EECON1, CFGS ;Deselect Configuration space
BCF EECON1, EEPGD ;Point to DATA memory
BSF EECON1, WREN ;Enable writes
BCF INTCON, GIE ;Disable INTs.
MOVLW 55h ;
MOVWF EECON2 ;Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ;Write AAh
BSF EECON1, WR ;Set WR bit to begin write
BSF INTCON, GIE ;Enable Interrupts
BCF EECON1, WREN ;Disable writes
BTFSC EECON1, WR ;Wait for write to complete
GOTO $-2 ;Done
Required
Sequence
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
BSF EECON1,RD
executed here INSTR(PC + 1)
executed here Forced NOP
executed here
PC
PC + 1 EEADRH,EEADRL PC+3 PC + 5
Flash ADDR
RD bit
EEDATH,EEDATL
PC + 3 PC + 4
INSTR (PC + 1)
INSTR(PC - 1)
executed here INSTR(PC + 3)
executed here INSTR(PC + 4)
executed here
Flash Data
EEDATH
EEDATL
Register
INSTR (PC) INSTR (PC + 3) INSTR (PC + 4)
PIC12(L)F1840
DS40001441F-page 88 2011-2015 Microchip Technology Inc.
11.3 Flash Program Memory Overview
It is important to understand the Flash program
memory structure for erase and programming
operations. Flash program memory is arranged in
rows. A row consists of a fixed number of 14-bit
program memory words. A row is the minimum block
size that can be erased by user software.
Flash program memory may only be written or erased
if the destination address is in a segment of memory
that is not write-protected, as defined in bits WRT<1:0>
of Configuration Words.
After a row has been erased, the user can reprogram
all or a portion of this row. Data to be written into the
program memory row is written to 14-bit wide data write
latches. These write latches are not directly accessible
to the user, but may be loaded via sequential writes to
the EEDATH:EEDATL register pair.
The number of data write latches may not be equivalent
to the number of row locations. During programming,
user software may need to fill the set of write latches
and initiate a programming operation multiple times in
order to fully reprogram an erased row. For example, a
device with a row size of 32 words and eight write
latches will need to load the write latches with data and
initiate a programming operation four times.
The size of a program memory row and the number of
program memory write latches may vary by device.
See Table 11-1 for details.
11.3.1 READING THE FLASH PROGRAM
MEMORY
To read a program memory location, the user must:
1. Write the Least and Most Significant address
bits to the EEADRH:EEADRL register pair.
2. Clear the CFGS bit of the EECON1 register.
3. Set the EEPGD control bit of the EECON1
register.
4. Then, set control bit RD of the EECON1 register.
Once the read control bit is set, the program memory
Flash controller will use the second instruction cycle to
read the data. This causes the second instruction
immediately following the “BSF EECON1,RD” instruction
to be ignored. The data is available in the very next cycle,
in the EEDATH:EEDATL register pair; therefore, it can
be read as two bytes in the following instructions.
EEDATH:EEDATL register pair will hold this value until
another read or until it is written to by the user.
Note: If the user wants to modify only a portion
of a previously programmed row, then the
contents of the entire row must be read
and saved in RAM prior to the erase.
TABLE 11-1: FLASH MEMORY
ORGANIZATION BY DEVICE
Device
Erase Block
(Row) Size/
Boundary
Number of
Write Latches/
Boundary
PIC12(L)F1840 32 words,
EEADRL<4:0>
= 00000
32 words,
EEADRL<4:0>
= 00000
Note 1: The two instructions following a program
memory read are required to be NOPs.
This prevents the user from executing a
two-cycle instruction on the next
instruction after the RD bit is set.
2: Flash program memory can be read
regardless of the setting of the CP bit.
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PIC12(L)F1840
EXAMPLE 11-3: FLASH PROGRAM MEMORY READ
* This code block will read 1 word of program
* memory at the memory address:
PROG_ADDR_HI: PROG_ADDR_LO
* data will be returned in the variables;
* PROG_DATA_HI, PROG_DATA_LO
BANKSEL EEADRL ; Select Bank for EEPROM registers
MOVLW PROG_ADDR_LO ;
MOVWF EEADRL ; Store LSB of address
MOVLW PROG_ADDR_HI ;
MOVWL EEADRH ; Store MSB of address
BCF EECON1,CFGS ; Do not select Configuration Space
BSF EECON1,EEPGD ; Select Program Memory
BCF INTCON,GIE ; Disable interrupts
BSF EECON1,RD ; Initiate read
NOP ; Executed (Figure 11-1)
NOP ; Ignored (Figure 11-1)
BSF INTCON,GIE ; Restore interrupts
MOVF EEDATL,W ; Get LSB of word
MOVWF PROG_DATA_LO ; Store in user location
MOVF EEDATH,W ; Get MSB of word
MOVWF PROG_DATA_HI ; Store in user location
PIC12(L)F1840
DS40001441F-page 90 2011-2015 Microchip Technology Inc.
11.3.2 ERASING FLASH PROGRAM
MEMORY
While executing code, program memory can only be
erased by rows. To erase a row:
1. Load the EEADRH:EEADRL register pair with
the address of new row to be erased.
2. Clear the CFGS bit of the EECON1 register.
3. Set the EEPGD, FREE and WREN bits of the
EECON1 register.
4. Write 55h, then AAh, to EECON2 (Flash
programming unlock sequence).
5. Set control bit WR of the EECON1 register to
begin the erase operation.
6. Poll the FREE bit in the EECON1 register to
determine when the row erase has completed.
See Example 11-4.
After the “BSF EECON1,WR” instruction, the processor
requires two cycles to set up the erase operation. The
user must place two NOP instructions after the WR bit is
set. The processor will halt internal operations for the
typical 2 ms erase time. This is not Sleep mode as the
clocks and peripherals will continue to run. After the
erase cycle, the processor will resume operation with
the third instruction after the EECON1 write instruction.
11.3.3 WRITING TO FLASH PROGRAM
MEMORY
Program memory is programmed using the following
steps:
1. Load the starting address of the word(s) to be
programmed.
2. Load the write latches with data.
3. Initiate a programming operation.
4. Repeat steps 1 through 3 until all data is written.
Before writing to program memory, the word(s) to be
written must be erased or previously unwritten.
Program memory can only be erased one row at a time.
No automatic erase occurs upon the initiation of the
write.
Program memory can be written one or more words at
a time. The maximum number of words written at one
time is equal to the number of write latches. See
Figure 11-2 (block writes to program memory with 32
write latches) for more details. The write latches are
aligned to the address boundary defined by EEADRL
as shown in Ta bl e 11-1 . Write operations do not cross
these boundaries. At the completion of a program
memory write operation, the write latches are reset to
contain 0x3FFF.
The following steps should be completed to load the
write latches and program a block of program memory.
These steps are divided into two parts. First, all write
latches are loaded with data except for the last program
memory location. Then, the last write latch is loaded
and the programming sequence is initiated. A special
unlock sequence is required to load a write latch with
data or initiate a Flash programming operation. This
unlock sequence should not be interrupted.
1. Set the EEPGD and WREN bits of the EECON1
register.
2. Clear the CFGS bit of the EECON1 register.
3. Set the LWLO bit of the EECON1 register. When
the LWLO bit of the EECON1 register is ‘1’, the
write sequence will only load the write latches
and will not initiate the write to Flash program
memory.
4. Load the EEADRH:EEADRL register pair with
the address of the location to be written.
5. Load the EEDATH:EEDATL register pair with
the program memory data to be written.
6. Write 55h, then AAh, to EECON2, then set the
WR bit of the EECON1 register (Flash
programming unlock sequence). The write latch
is now loaded.
7. Increment the EEADRH:EEADRL register pair
to point to the next location.
8. Repeat steps 5 through 7 until all but the last
write latch has been loaded.
9. Clear the LWLO bit of the EECON1 register.
When the LWLO bit of the EECON1 register is
‘0’, the write sequence will initiate the write to
Flash program memory.
10. Load the EEDATH:EEDATL register pair with
the program memory data to be written.
11. Write 55h, then AAh, to EECON2, then set the
WR bit of the EECON1 register (Flash
programming unlock sequence). The entire
latch block is now written to Flash program
memory.
It is not necessary to load the entire write latch block
with user program data. However, the entire write latch
block will be written to program memory.
An example of the complete write sequence for 32
words is shown in Example 11-5. The initial address is
loaded into the EEADRH:EEADRL register pair; the 32
words of data are loaded using indirect addressing.
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PIC12(L)F1840
After the “BSF EECON1,WR” instruction, the processor
requires two cycles to set up the write operation. The
user must place two NOP instructions after the WR bit is
set. The processor will halt internal operations for the
typical 2 ms, only during the cycle in which the write
takes place (i.e., the last word of the block write). This
is not Sleep mode as the clocks and peripherals will
continue to run. The processor does not stall when
LWLO = 1, loading the write latches. After the write
cycle, the processor will resume operation with the third
instruction after the EECON1 WRITE instruction.
FIGURE 11-2: BLOCK WRITES TO FLASH PROGRAM MEMORY WITH 32 WRITE LATCHES
EXAMPLE 11-4: ERASING ONE ROW OF PROGRAM MEMORY
14 14 14 14
Program Memory
Buffer Register
EEADRL<4:0> = 00000
Buffer Register
EEADRL<4:0> = 00001
Buffer Register
EEADRL<4:0> = 00010
Buffer Register
EEADRL<4:0> = 11111
EEDATA
EEDATH
75 07 0
68
First word of block
to be written
Last word of block
to be written
; This row erase routine assumes the following:
; 1. A valid address within the erase block is loaded in ADDRH:ADDRL
; 2. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F
BCF INTCON,GIE ; Disable ints so required sequences will execute properly
BANKSEL EEADRL
MOVF ADDRL,W ; Load lower 8 bits of erase address boundary
MOVWF EEADRL
MOVF ADDRH,W ; Load upper 6 bits of erase address boundary
MOVWF EEADRH
BSF EECON1,EEPGD ; Point to program memory
BCF EECON1,CFGS ; Not configuration space
BSF EECON1,FREE ; Specify an erase operation
BSF EECON1,WREN ; Enable writes
MOVLW 55h ; Start of required sequence to initiate erase
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1,WR ; Set WR bit to begin erase
NOP ; Any instructions here are ignored as processor
; halts to begin erase sequence
NOP ; Processor will stop here and wait for erase complete.
; after erase processor continues with 3rd instruction
BCF EECON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts
Required
Sequence
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DS40001441F-page 92 2011-2015 Microchip Technology Inc.
EXAMPLE 11-5: WRITING TO FLASH PROGRAM MEMORY
; This write routine assumes the following:
; 1. The 64 bytes of data are loaded, starting at the address in DATA_ADDR
; 2. Each word of data to be written is made up of two adjacent bytes in DATA_ADDR,
; stored in little endian format
; 3. A valid starting address (the least significant bits = 00000) is loaded in ADDRH:ADDRL
; 4. ADDRH and ADDRL are located in shared data memory 0x70 - 0x7F
;
BCF INTCON,GIE ; Disable ints so required sequences will execute properly
BANKSEL EEADRH ; Bank 3
MOVF ADDRH,W ; Load initial address
MOVWF EEADRH ;
MOVF ADDRL,W ;
MOVWF EEADRL ;
MOVLW LOW DATA_ADDR ; Load initial data address
MOVWF FSR0L ;
MOVLW HIGH DATA_ADDR ; Load initial data address
MOVWF FSR0H ;
BSF EECON1,EEPGD ; Point to program memory
BCF EECON1,CFGS ; Not configuration space
BSF EECON1,WREN ; Enable writes
BSF EECON1,LWLO ; Only Load Write Latches
LOOP
MOVIW FSR0++ ; Load first data byte into lower
MOVWF EEDATL ;
MOVIW FSR0++ ; Load second data byte into upper
MOVWF EEDATH ;
MOVF EEADRL,W ; Check if lower bits of address are '00000'
XORLW 0x1F ; Check if we're on the last of 32 addresses
ANDLW 0x1F ;
BTFSC STATUS,Z ; Exit if last of 32 words,
GOTO START_WRITE ;
MOVLW 55h ; Start of required write sequence:
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1,WR ; Set WR bit to begin write
NOP ; Any instructions here are ignored as processor
; halts to begin write sequence
NOP ; Processor will stop here and wait for write to complete.
; After write processor continues with 3rd instruction.
INCF EEADRL,F ; Still loading latches Increment address
GOTO LOOP ; Write next latches
START_WRITE
BCF EECON1,LWLO ; No more loading latches - Actually start Flash program
; memory write
MOVLW 55h ; Start of required write sequence:
MOVWF EECON2 ; Write 55h
MOVLW 0AAh ;
MOVWF EECON2 ; Write AAh
BSF EECON1,WR ; Set WR bit to begin write
NOP ; Any instructions here are ignored as processor
; halts to begin write sequence
NOP ; Processor will stop here and wait for write complete.
; after write processor continues with 3rd instruction
BCF EECON1,WREN ; Disable writes
BSF INTCON,GIE ; Enable interrupts
Required
Sequence
Required
Sequence
BOOOhVBOOSh
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11.4 Modifying Flash Program Memory
When modifying existing data in a program memory
row, and data within that row must be preserved, it must
first be read and saved in a RAM image. Program
memory is modified using the following steps:
1. Load the starting address of the row to be
modified.
2. Read the existing data from the row into a RAM
image.
3. Modify the RAM image to contain the new data
to be written into program memory.
4. Load the starting address of the row to be rewritten.
5. Erase the program memory row.
6. Load the write latches with data from the RAM
image.
7. Initiate a programming operation.
8. Repeat steps 6 and 7 as many times as required
to reprogram the erased row.
11.5 User ID, Device ID and
Configuration Word Access
Instead of accessing program memory or EEPROM
data memory, the User ID’s, Device ID/Revision ID and
Configuration Words can be accessed when CFGS = 1
in the EECON1 register. This is the region that would
be pointed to by PC<15> = 1, but not all addresses are
accessible. Different access may exist for reads and
writes. Refer to Table 11-2.
When read access is initiated on an address outside the
parameters listed in Table 11-2, the EEDATH:EEDATL
register pair is cleared.
TABLE 11-2: USER ID, DEVICE ID AND CONFIGURATION WORD ACCESS (CFGS = 1)
EXAMPLE 11-3: CONFIGURATION WORD AND DEVICE ID ACCESS
Address Function Read Access Write Access
8000h-8003h User IDs Yes Yes
8006h Device ID/Revision ID Yes No
8007h-8008h Configuration Words 1 and 2 Yes No
* This code block will read 1 word of program memory at the memory address:
* PROG_ADDR_LO (must be 00h-08h) data will be returned in the variables;
* PROG_DATA_HI, PROG_DATA_LO
BANKSEL EEADRL ; Select correct Bank
MOVLW PROG_ADDR_LO ;
MOVWF EEADRL ; Store LSB of address
CLRF EEADRH ; Clear MSB of address
BSF EECON1,CFGS ; Select Configuration Space
BCF INTCON,GIE ; Disable interrupts
BSF EECON1,RD ; Initiate read
NOP ; Executed (See Figure 11-1)
NOP ; Ignored (See Figure 11-1)
BSF INTCON,GIE ; Restore interrupts
MOVF EEDATL,W ; Get LSB of word
MOVWF PROG_DATA_LO ; Store in user location
MOVF EEDATH,W ; Get MSB of word
MOVWF PROG_DATA_HI ; Store in user location
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11.6 Write Verify
Depending on the application, good programming
practice may dictate that the value written to the data
EEPROM or program memory should be verified (see
Example 11-6) to the desired value to be written.
Example 11-6 shows how to verify a write to EEPROM.
EXAMPLE 11-6: EEPROM WRITE VERIFY
BANKSEL EEDATL ;
MOVF EEDATL, W ;EEDATL not changed
;from previous write
BSF EECON1, RD ;YES, Read the
;value written
XORWF EEDATL, W ;
BTFSS STATUS, Z ;Is data the same
GOTO WRITE_ERR ;No, handle error
: ;Yes, continue
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11.7 Register Definitions: EEPROM and Flash Control
REGISTER 11-1: EEDATL: EEPROM DATA LOW BYTE REGISTER
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
EEDAT<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 EEDAT<7:0>: Read/write value for EEPROM data byte or Least Significant bits of program memory
REGISTER 11-2: EEDATH: EEPROM DATA HIGH BYTE REGISTER
U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
—— EEDAT<13:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 EEDAT<13:8>: Read/write value for Most Significant bits of program memory
REGISTER 11-3: EEADRL: EEPROM ADDRESS REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
EEADR<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 EEADR<7:0>: Specifies the Least Significant bits for program memory address or EEPROM address
REGISTER 11-4: EEADRH: EEPROM ADDRESS HIGH BYTE REGISTER
U-1 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—(1) EEADR<14:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘1’
bit 6-0 EEADR<14:8>: Specifies the Most Significant bits for program memory address or EEPROM address
Note 1: Unimplemented, read as ‘1’.
If CFGS : 3 (Configuration space) CFGS : Land EEPGD : JDroqram Fiasni If CFGS If CFGS : 3 (Configuration space) CFGS : iand EEPGD : g (Droqram Flash) If EEPGD and CFGS
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REGISTER 11-5: EECON1: EEPROM CONTROL 1 REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W/HC-0/0 R/W-x/q R/W-0/0 R/S/HC-0/0 R/S/HC-0/0
EEPGD CFGS LWLO FREE WRERR WREN WR RD
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
bit 7 EEPGD: Flash Program/Data EEPROM Memory Select bit
1 = Accesses program space Flash memory
0 = Accesses data EEPROM memory
bit 6 CFGS: Flash Program/Data EEPROM or Configuration Select bit
1 = Accesses Configuration, User ID and Device ID Registers
0 = Accesses Flash Program or data EEPROM Memory
bit 5 LWLO: Load Write Latches Only bit
If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash):
1 = The next WR command does not initiate a write; only the program memory latches are
updated.
0 = The next WR command writes a value from EEDATH:EEDATL into program memory latches
and initiates a write of all the data stored in the program memory latches.
If CFGS = 0 and EEPGD = 0: (Accessing data EEPROM)
LWLO is ignored. The next WR command initiates a write to the data EEPROM.
bit 4 FREE: Program Flash Erase Enable bit
If CFGS = 1 (Configuration space) OR CFGS = 0 and EEPGD = 1 (program Flash):
1 = Performs an erase operation on the next WR command (cleared by hardware after comple-
tion of erase).
0 = Performs a write operation on the next WR command.
If EEPGD = 0 and CFGS = 0: (Accessing data EEPROM)
FREE is ignored. The next WR command will initiate both a erase cycle and a write cycle.
bit 3 WRERR: EEPROM Error Flag bit
1 = Condition indicates an improper program or erase sequence attempt or termination (bit is set
automatically on any set attempt (write ‘1’) of the WR bit).
0 = The program or erase operation completed normally.
bit 2 WREN: Program/Erase Enable bit
1 = Allows program/erase cycles
0 = Inhibits programming/erasing of program Flash and data EEPROM
bit 1 WR: Write Control bit
1 = Initiates a program Flash or data EEPROM program/erase operation.
The operation is self-timed and the bit is cleared by hardware once operation is complete.
The WR bit can only be set (not cleared) in software.
0 = Program/erase operation to the Flash or data EEPROM is complete and inactive.
bit 0 RD: Read Control bit
1 = Initiates a program Flash or data EEPROM read. Read takes one cycle. RD is cleared in
hardware. The RD bit can only be set (not cleared) in software.
0 = Does not initiate a program Flash or data EEPROM data read.
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TABLE 11-3: SUMMARY OF REGISTERS ASSOCIATED WITH DATA EEPROM
REGISTER 11-6: EECON2: EEPROM CONTROL 2 REGISTER
W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0 W-0/0
EEPROM Control Register 2
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
S = Bit can only be set x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 Data EEPROM Unlock Pattern bits
To unlock writes, a 55h must be written first, followed by an AAh, before setting the WR bit of the
EECON1 register. The value written to this register is used to unlock the writes. There are specific
timing requirements on these writes. Refer to Section 11.2.2 “Writing to the Data EEPROM
Memory” for more information.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
EECON1 EEPGD CFGS LWLO FREE WRERR WREN WR RD 96
EECON2 EEPROM Control Register 2 (not a physical register) 97*
EEADRL EEADRL<7:0> 95
EEADRH —(1) EEADRH<6:0 95
EEDATL EEDATL<7:0> 95
EEDATH —— EEDATH<5:0> 95
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE2 OSFIE —C1IE EEIE BCL1IE ——— 74
PIR2 OSFIF —C1IF EEIF BCL1IF ——— 76
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by Data EEPROM module.
* Page provides register information.
Note 1: Unimplemented, read as ‘1’.
Wme LATx me PDRTx
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12.0 I/O PORTS
In general, when a peripheral is enabled, that pin may
not be used as a general purpose I/O pin.
The port has three registers for its operation. These
registers are:
• TRISA register (data direction register)
• PORTA register (reads the levels on the pins of
the device)
• LATA register (output latch)
PORTA has the following additional registers. They
are:
• ANSELA (analog select)
• WPUA (weak pull-up)
The Data Latch (LATA register) is useful for
read-modify-write operations on the value that the I/O
pins are driving.
A write operation to the LATA register has the same
affect as a write to the corresponding PORTA register.
A read of the LATA register reads of the values held in
the I/O PORT latches, while a read of the PORTA
register reads the actual I/O pin value.
The port has analog functions and has an ANSELA.
register which can disable the digital input and save
power. A simplified model of a generic I/O port, without
the interfaces to other peripherals, is shown in
Figure 12-1.
FIGURE 12-1: GENERIC I/O PORT
OPERATION
12.1 Alternate Pin Function
The Alternate Pin Function Control (APFCON) register
is used to steer specific peripheral input and output
functions between different pins. The APFCON register
is shown in Register 12-1. For this device family, the
following functions can be moved between different
pins.
•RX/DT
•TX/CK
•SDO
•SS
(Slave Select)
•T1G
•P1B
• CCP1/P1A
These bits have no effect on the values of any TRIS
register. PORT and TRIS overrides will be routed to the
correct pin. The unselected pin will be unaffected.
QD
CK
Write LATx
Data Register
I/O pin
Read PORTx
Write PORTx
TRISx
Read LATx
Data Bus
To digital peripherals
ANSELx
VDD
VSS
To analog peripherals
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REGISTER 12-1: APFCON: ALTERNATE PIN FUNCTION CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
RXDTSEL SDOSEL SSSEL —T1GSEL TXCKSEL P1BSEL CCP1SEL
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 RXDTSEL: Pin Selection bit
1 = RX/DT function is on RA5
0 = RX/DT function is on RA1
bit 6 SDOSEL: Pin Selection bit
1 = SDO function is on RA4
0 = SDO function is on RA0
bit 5 SSSEL: Pin Selection bit
1 =SS function is on RA0
0 =SS function is on RA3
bit 4 Unimplemented: Read as ‘0’
bit 3 T1GSEL: Pin Selection bit
1 = T1G function is on RA3
0 = T1G function is on RA4
bit 2 TXCKSEL: Pin Selection bit
1 = TX/CK function is on RA4
0 = TX/CK function is on RA0
bit 1 P1BSEL: Pin Selection bit
1 = P1B function is on RA4
0 = P1B function is on RA0
bit 0 CCP1SEL: Pin Selection bit
1 = CCP1/P1A function is on RA5
0 = CCP1/P1A function is on RA2
wxll read '0'
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12.2 PORTA Registers
12.2.1 DATA REGISTER
PORTA is a 6-bit wide, bidirectional port. The
corresponding data direction register is TRISA
(Register 12-3). Setting a TRISA bit (= 1) will make the
corresponding PORTA pin an input (i.e., disable the
output driver). Clearing a TRISA bit (= 0) will make the
corresponding PORTA pin an output (i.e., enables
output driver and puts the contents of the output latch
on the selected pin). The exception is RA3, which is
input only and its TRIS bit will always read as ‘1’.
Example 12-1 shows how to initialize PORTA.
Reading the PORTA register (Register 12-2) reads the
status of the pins, whereas writing to it will write to the
PORT latch. All write operations are read-modify-write
operations. Therefore, a write to a port implies that the
port pins are read, this value is modified and then
written to the PORT data latch (LATA).
12.2.2 DIRECTION CONTROL
The TRISA register (Register 12-3) controls the
PORTA pin output drivers, even when they are being
used as analog inputs. The user should ensure the bits
in the TRISA register are maintained set when using
them as analog inputs. I/O pins configured as analog
input always read ‘0’.
12.2.3 ANSELA REGISTER
The ANSELA register (Register 12-5) is used to
configure the Input mode of an I/O pin to analog.
Setting the appropriate ANSELA bit high will cause all
digital reads on the pin to be read as ‘0’ and allow
analog functions on the pin to operate correctly.
The state of the ANSELA bits has no affect on digital
output functions. A pin with TRIS clear and ANSEL set
will still operate as a digital output, but the Input mode
will be analog. This can cause unexpected behavior
when executing read-modify-write instructions on the
affected port.
EXAMPLE 12-1: INITIALIZING PORTA
Note: The ANSELA register must be initialized
to configure an analog channel as a digital
input. Pins configured as analog inputs
will read ‘0’.
BANKSEL PORTA ;
CLRF PORTA ;Init PORTA
BANKSEL LATA ;Data Latch
CLRF LATA ;
BANKSEL ANSELA ;
CLRF ANSELA ;digital I/O
BANKSEL TRISA ;
MOVLW B'00111000' ;Set RA<5:3> as inputs
MOVWF TRISA ;and set RA<2:0> as
;outputs
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12.2.4 PORTA FUNCTIONS AND OUTPUT
PRIORITIES
Each PORTA pin is multiplexed with other functions. The
pins, their combined functions and their output priorities
are shown in Table 12-1.
When multiple outputs are enabled, the actual pin
control goes to the peripheral with the highest priority.
Analog input functions, such as ADC, comparator and
CapSense inputs, are not shown in the priority lists.
These inputs are active when the I/O pin is set for
Analog mode using the ANSELx registers. Digital
output functions may control the pin when it is in Analog
mode as shown in the priority list.
TABLE 12-1: PORTA OUTPUT PRIORITY
Pin Name Function Priority(1)
RA0 ICSPDAT
ICDDAT
DACOUT
MDOUT
TX/CK
SDO
P1B
RA1 ICSPCLK
ICDCLK
SCL
RX/DT
SCK
RA2 SRQ
C1OUT
SDA
CCP1/P1A
RA3 No output priorities. Input only pin.
RA4 OSC2
CLKOUT
T1OSO
CLKR
TX/CK
SDO
P1B
RA5 OSC1
T1OSI
SRNQ
RX/DT
CCP1/P1A
Note 1: Priority listed from highest to lowest.
IAW
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12.3 Register Definitions: PORTA
REGISTER 12-2: PORTA: PORTA REGISTER
U-0 U-0 R/W-x/x R/W-x/x R-x/x R/W-x/x R/W-x/x R/W-x/x
—— RA5 RA4 RA3 RA2 RA1 RA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0
bit 5-0 RA<5:0>: PORTA I/O Value bits(1)
1 = Port pin is > VIH
0 = Port pin is < VIL
Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return
of actual I/O pin values.
REGISTER 12-3: TRISA: PORTA TRI-STATE REGISTER
U-0 U-0 R/W-1/1 R/W-1/1 R-1/1 R/W-1/1 R/W-1/1 R/W-1/1
—— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0
bit 5-4 TRISA<5:4>: PORTA Tri-State Control bits
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
bit 3 TRISA3: RA3 Port Tri-State Control bit
This bit is always ‘1’ as RA3 is an input only
bit 2-0 TRISA<2:0>: PORTA Tri-State Control bits
1 = PORTA pin configured as an input (tri-stated)
0 = PORTA pin configured as an output
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REGISTER 12-4: LATA: PORTA DATA LATCH REGISTER
U-0 U-0 R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u
——LATA5LATA4— LATA2 LATA1 LATA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-4 LATA<5:4>: RA<5:4> Output Latch Value bits(1)
bit 3 Unimplemented: Read as ‘0’
bit 2-0 LATA<2:0>: RA<2:0> Output Latch Value bits(1)
Note 1: Writes to PORTA are actually written to corresponding LATA register. Reads from PORTA register is return
of actual I/O pin values.
REGISTER 12-5: ANSELA: PORTA ANALOG SELECT REGISTER
U-0 U-0 U-0 R/W-1/1 U-0 R/W-1/1 R/W-1/1 R/W-1/1
— — — ANSA4 — ANSA2 ANSA1 ANSA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-5 Unimplemented: Read as ‘0’
bit 4 ANSA4: Analog Select between Analog or Digital Function on pins RA4, respectively
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
0 = Digital I/O. Pin is assigned to port or digital special function.
bit 3 Unimplemented: Read as ‘0’
bit 2-0 ANSA<2:0>: Analog Select between Analog or Digital Function on pins RA<2:0>, respectively
1 = Analog input. Pin is assigned as analog input(1). Digital input buffer disabled.
0 = Digital I/O. Pin is assigned to port or digital special function.
Note 1: When setting a pin to an analog input, the corresponding TRIS bit must be set to Input mode in order to
allow external control of the voltage on the pin.
WPUEN
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TABLE 12-2: SUMMARY OF REGISTERS ASSOCIATED WITH PORTA
TABLE 12-3: SUMMARY OF CONFIGURATION WORD WITH PORTA
REGISTER 12-6: WPUA: WEAK PULL-UP PORTA REGISTER
U-0 U-0 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
—— WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 WPUA<5:0>: Weak Pull-up Register bits(1, 2)
1 = Pull-up enabled
0 = Pull-up disabled
Note 1: Global WPUEN bit of the OPTION register must be cleared for individual pull-ups to be enabled.
2: The weak pull-up device is automatically disabled if the pin is in configured as an output.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ———ANSA4 — ANSA2 ANSA1 ANSA0 103
APFCON RXDTSEL SDOSEL SSSEL --- T1GSEL TXCKSEL P1BSEL CCP1SEL 99
LATA ——LATA5LATA4—LATA2LATA1LATA0
103
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 145
PORTA —— RA5 RA4 RA3 RA2 RA1 RA0 102
TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
WPUA —— WPUA5 WPUA4 WPUA3 WPUA2 WPUA1 WPUA0 104
Legend: x = unknown, u = unchanged, – = unimplemented locations read as ‘0’. Shaded cells are not used by PORTA.
Name Bits Bit -/7 Bit -/6 Bit 13/5 Bit 12/4 Bit 11/3 Bit 10/2 Bit 9/1 Bit 8/0 Register
on Page
CONFIG1 13:8 — — FCMEN IESO CLKOUTEN BOREN<1:0> CPD 33
7:0 CP MCLRE PWRTE WDTE<1:0> FOSC<2:0>
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by PORTA.
2011-2015 Microchip Technology Inc. DS40001441F-page 105
PIC12(L)F1840
13.0 INTERRUPT-ON-CHANGE
The PORTA pins can be configured to operate as
Interrupt-On-Change (IOC) pins. An interrupt can be
generated by detecting a signal that has either a rising
edge or a falling edge. Any individual PORTA pin, or
combination of PORTA pins, can be configured to
generate an interrupt. The interrupt-on-change module
has the following features:
• Interrupt-on-Change enable (Master Switch)
• Individual pin configuration
• Rising and falling edge detection
• Individual pin interrupt flags
Figure 13-1 is a block diagram of the IOC module.
13.1 Enabling the Module
To allow individual PORTA pins to generate an interrupt,
the IOCIE bit of the INTCON register must be set. If the
IOCIE bit is disabled, the edge detection on the pin will
still occur, but an interrupt will not be generated.
13.2 Individual Pin Configuration
For each PORTA pin, a rising edge detector and a falling
edge detector are present. To enable a pin to detect a
rising edge, the associated IOCAPx bit of the IOCAP
register is set. To enable a pin to detect a falling edge,
the associated IOCANx bit of the IOCAN register is set.
A pin can be configured to detect rising and falling
edges simultaneously by setting both the IOCAPx bit
and the IOCANx bit of the IOCAP and IOCAN registers,
respectively.
13.3 Interrupt Flags
The IOCAFx bits located in the IOCAF register are
status flags that correspond to the Interrupt-on-change
pins of PORTA. If an expected edge is detected on an
appropriately enabled pin, then the status flag for that pin
will be set, and an interrupt will be generated if the IOCIE
bit is set. The IOCIF bit of the INTCON register reflects
the status of all IOCAFx bits.
13.4 Clearing Interrupt Flags
The individual status flags, (IOCAFx bits), can be
cleared by resetting them to zero. If another edge is
detected during this clearing operation, the associated
status flag will be set at the end of the sequence,
regardless of the value actually being written.
In order to ensure that no detected edge is lost while
clearing flags, only AND operations masking out known
changed bits should be performed. The following
sequence is an example of what should be performed.
EXAMPLE 13-1: CLEARING INTERRUPT
FLAGS
(PORTA EXAMPLE)
13.5 Operation in Sleep
The interrupt-on-change interrupt sequence will wake
the device from Sleep mode, if the IOCIE bit is set.
If an edge is detected while in Sleep mode, the IOCAF
register will be updated prior to the first instruction
executed out of Sleep.
MOVLW 0xff
XORWF IOCAF, W
ANDWF IOCAF, F
PIC12(L)F1840
DS40001441F-page 106 2011-2015 Microchip Technology Inc.
FIGURE 13-1: INTERRUPT-ON-CHANGE BLOCK DIAGRAM
D
CK
R
Q
D
CK
R
Q
RAx
IOCANx
IOCAPx
Q2
D
CK
SQ
Q4Q1
Data Bus =
0 or 1
write IOCAFx
IOCIE
To Data Bus
IOCAFx
Edge
Detect
IOC Interrupt
to CPU core
From all other
IOCAFx individual
Pin Detectors
Q1
Q2
Q3
Q4
Q4Q1
Q1
Q2
Q3
Q4
Q1
Q2
Q3
Q4
Q4
Q4Q1 Q4Q1 Q4Q1
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PIC12(L)F1840
13.6 Register Definitions: Interrupt-on-Change Control
REGISTER 13-1: IOCAP: INTERRUPT-ON-CHANGE PORTA POSITIVE EDGE REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOCAP<5:0>: Interrupt-on-Change PORTA Positive Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a positive going edge. Associated Status bit and interrupt
flag will be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 13-2: IOCAN: INTERRUPT-ON-CHANGE PORTA NEGATIVE EDGE REGISTER
U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
—— IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOCAN<5:0>: Interrupt-on-Change PORTA Negative Edge Enable bits
1 = Interrupt-on-Change enabled on the pin for a negative going edge. Associated Status bit and interrupt
flag will be set upon detecting an edge.
0 = Interrupt-on-Change disabled for the associated pin.
REGISTER 13-3: IOCAF: INTERRUPT-ON-CHANGE PORTA FLAG REGISTER
U-0 U-0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0 R/W/HS-0/0
—— IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HS - Bit is set in hardware
bit 7-6 Unimplemented: Read as ‘0’
bit 5-0 IOCAF<5:0>: Interrupt-on-Change PORTA Flag bits
1 = An enabled change was detected on the associated pin.
Set when IOCAPx = 1 and a rising edge was detected on RAx, or when IOCANx = 1 and a falling edge
was detected on RAx.
0 = No change was detected, or the user cleared the detected change.
PIC12(L)F1840
DS40001441F-page 108 2011-2015 Microchip Technology Inc.
TABLE 13-1: SUMMARY OF REGISTERS ASSOCIATED WITH INTERRUPT-ON-CHANGE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ———ANSA4— ANSA2 ANSA1 ANSA0 103
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
IOCAF — — IOCAF5 IOCAF4 IOCAF3 IOCAF2 IOCAF1 IOCAF0 107
IOCAN — — IOCAN5 IOCAN4 IOCAN3 IOCAN2 IOCAN1 IOCAN0 107
IOCAP — — IOCAP5 IOCAP4 IOCAP3 IOCAP2 IOCAP1 IOCAP0 107
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by interrupt-on-change.
2011-2015 Microchip Technology Inc. DS40001441F-page 109
PIC12(L)F1840
14.0 FIXED VOLTAGE REFERENCE
(FVR)
The Fixed Voltage Reference, or FVR, is a stable
voltage reference, independent of VDD, with 1.024V,
2.048V or 4.096V selectable output levels. The output
of the FVR can be configured to supply a reference
voltage to the following:
• ADC input channel
• ADC positive reference
• Comparator positive input
• Digital-to-Analog Converter (DAC)
• Capacitive Sensing (CPS) module
The FVR can be enabled by setting the FVREN bit of
the FVRCON register.
14.1 Independent Gain Amplifiers
The output of the FVR supplied to the ADC,
Comparators, DAC and CPS module is routed through
two independent programmable gain amplifiers. Each
amplifier can be programmed for a gain of 1x, 2x or 4x,
to produce the three possible voltage levels.
The ADFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the ADC module. Refer-
ence Section 16.0 “Analog-to-Digital Converter
(ADC) Module” for additional information.
The CDAFVR<1:0> bits of the FVRCON register are
used to enable and configure the gain amplifier settings
for the reference supplied to the Comparators, DAC,
and CPS module. Reference Section 17.0 “Digital-to-
Analog Converter (DAC) Module”, Section 19.0
“Comparator Module” and Section 17.0 “Digital-to-
Analog Converter (DAC) Module” for additional
information.
14.2 FVR Stabilization Period
When the Fixed Voltage Reference module is enabled, it
requires time for the reference and amplifier circuits to
stabilize. Once the circuits stabilize and are ready for use,
the FVRRDY bit of the FVRCON register will be set. See
Section 30.0 “Electrical Specifications” for the
minimum delay requirement.
FIGURE 14-1: VOLTAGE REFERENCE BLOCK DIAGRAM
ADFVR<1:0>
CDAFVR<1:0>
X1
X2
X4
X1
X2
X4
2
2
FVR_buffer1
(To ADC Module)
FVR_buffer2
(To Comparators, DAC, CPS)
+
_
FVREN FVRRDY
Any peripheral requiring the
Fixed Reference
(See Figure 14-1)
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DS40001441F-page 110 2011-2015 Microchip Technology Inc.
TABLE 14-1: PERIPHERALS REQUIRING THE FIXED VOLTAGE REFERENCE (FVR)
Peripheral Conditions Description
HFINTOSC FOSC<2:0> = 100 and
IRCF<3:0> = 000x
INTOSC is active and device is not in Sleep.
BOR
BOREN<1:0> = 11 BOR always enabled.
BOREN<1:0> = 10 and BORFS = 1BOR disabled in Sleep mode, BOR Fast Start enabled.
BOREN<1:0> = 01 and BORFS = 1BOR under software control, BOR Fast Start enabled.
LDO All PIC12F1840 devices, when
VREGPM = 1 and not in Sleep
The device runs off of the low-power regulator when in Sleep
mode.
VRRDY‘“
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PIC12(L)F1840
14.3 Register Definitions: FVR Control
TABLE 14-2: SUMMARY OF REGISTERS ASSOCIATED WITH FIXED VOLTAGE REFERENCE
REGISTER 14-1: FVRCON: FIXED VOLTAGE REFERENCE CONTROL REGISTER
R/W-0/0 R-q/q R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
FVREN FVRRDY(1) TSEN TSRNG CDAFVR<1:0> ADFVR<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared q = Value depends on condition
bit 7 FVREN: Fixed Voltage Reference Enable bit
1 = Fixed Voltage Reference is enabled
0 = Fixed Voltage Reference is disabled
bit 6 FVRRDY: Fixed Voltage Reference Ready Flag bit(1)
1 = Fixed Voltage Reference output is ready for use
0 = Fixed Voltage Reference output is not ready or not enabled
bit 5 TSEN: Temperature Indicator Enable bit(3)
1 = Temperature Indicator is enabled
0 = Temperature Indicator is disabled
bit 4 TSRNG: Temperature Indicator Range Selection bit
1 =V
OUT = VDD - 4VT (High Range)
0 =V
OUT = VDD - 2VT (Low Range)
bit 3-2 CDAFVR<1:0>: Comparator and DAC Fixed Voltage Reference Selection bits
11 = Comparator, DAC and CPS module Fixed Voltage Reference Peripheral output is 4x (4.096V)(2)
10 = Comparator, DAC and CPS module Fixed Voltage Reference Peripheral output is 2x (2.048V)(2)
01 = Comparator, DAC and CPS module Fixed Voltage Reference Peripheral output is 1x (1.024V)
00 = Comparator, DAC and CPS module Fixed Voltage Reference Peripheral output is off
bit 1-0 ADFVR<1:0>: ADC Fixed Voltage Reference Selection bits
11 = ADC Fixed Voltage Reference Peripheral output is 4x (4.096V)(2)
10 = ADC Fixed Voltage Reference Peripheral output is 2x (2.048V)(2)
01 = ADC Fixed Voltage Reference Peripheral output is 1x (1.024V)
00 = ADC Fixed Voltage Reference Peripheral output is off
Note 1: FVRRDY is always ‘1’ on PIC12F1840 only.
2: Fixed Voltage Reference output cannot exceed VDD.
3: See Section 15.0 “Temperature Indicator Module” for additional information.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 111
Legend: Shaded cells are unused by the Fixed Voltage Reference module.
PIC12(L)F1840
DS40001441F-page 112 2011-2015 Microchip Technology Inc.
15.0 TEMPERATURE INDICATOR
MODULE
This family of devices is equipped with a temperature
circuit designed to measure the operating temperature
of the silicon die. The circuit’s range of operating
temperature falls between -40°C and +85°C. The
output is a voltage that is proportional to the device
temperature. The output of the temperature indicator is
internally connected to the device ADC.
The circuit may be used as a temperature threshold
detector or a more accurate temperature indicator,
depending on the level of calibration performed. A one-
point calibration allows the circuit to indicate a
temperature closely surrounding that point. A two-point
calibration allows the circuit to sense the entire range
of temperature more accurately. Reference Application
Note AN1333, “Use and Calibration of the Internal
Temperature Indicator” (DS01333) for more details
regarding the calibration process.
15.1 Circuit Operation
Figure 15-1 shows a simplified block diagram of the
temperature circuit. The proportional voltage output is
achieved by measuring the forward voltage drop across
multiple silicon junctions.
Equation 15-1 describes the output characteristics of
the temperature indicator.
EQUATION 15-1: VOUT RANGES
The temperature sense circuit is integrated with the
Fixed Voltage Reference (FVR) module. See
Section 14.0 “Fixed Voltage Reference (FVR)” for
more information.
The circuit is enabled by setting the TSEN bit of the
FVRCON register. When disabled, the circuit draws no
current.
The circuit operates in either high or low range. The high
range, selected by setting the TSRNG bit of the
FVRCON register, provides a wider output voltage. This
provides more resolution over the temperature range,
but may be less consistent from part to part. This range
requires a higher bias voltage to operate and thus, a
higher VDD is needed.
The low range is selected by clearing the TSRNG bit of
the FVRCON register. The low range generates a lower
voltage drop and thus, a lower bias voltage is needed to
operate the circuit. The low range is provided for low
voltage operation.
FIGURE 15-1: TEMPERATURE CIRCUIT
DIAGRAM
15.2 Minimum Operating VDD
When the temperature circuit is operated in low range,
the device may be operated at any operating voltage
that is within specifications.
When the temperature circuit is operated in high range,
the device operating voltage, VDD, must be high
enough to ensure that the temperature circuit is
correctly biased.
Table 15-1 shows the recommended minimum VDD vs.
range setting.
TABLE 15-1: RECOMMENDED VDD VS.
RANGE
High Range: VOUT = VDD - 4VT
Low Range: VOUT = VDD - 2VT
Min. VDD, TSRNG = 1Min. VDD, TSRNG = 0
3.6V 1.8V
TSEN
TSRNG
VDD
VOUT To AD C
2011-2015 Microchip Technology Inc. DS40001441F-page 113
PIC12(L)F1840
15.3 Temperature Output
The output of the circuit is measured using the internal
Analog-to-Digital Converter. A channel is reserved for
the temperature circuit output. Refer to Section 16.0
“Analog-to-Digital Converter (ADC) Module” for
detailed information.
15.3.1 ADC ACQUISITION TIME
To ensure accurate temperature measurements, the
user must wait at least 200 usec after the ADC input
multiplexer is connected to the temperature indicator
output before the conversion is performed. In addition,
the user must wait 200 usec between sequential
conversions of the temperature indicator output.
TABLE 15-2: SUMMARY OF REGISTERS ASSOCIATED WITH THE TEMPERATURE INDICATOR
Note: Every time the ADC MUX is changed to
the temperature indicator output selection
(CHS bit in the ADCCON0 register), wait
500 sec for the sampling capacitor to fully
charge before sampling the temperature
indicator output.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 111
Legend: Shaded cells are unused by the temperature indicator module.
/DONE 0 fl 4K 1 ——
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DS40001441F-page 114 2011-2015 Microchip Technology Inc.
16.0 ANALOG-TO-DIGITAL
CONVERTER (ADC) MODULE
The Analog-to-Digital Converter (ADC) allows
conversion of an analog input signal to a 10-bit binary
representation of that signal. This device uses analog
inputs, which are multiplexed into a single sample and
hold circuit. The output of the sample and hold is
connected to the input of the converter. The converter
generates a 10-bit binary result via successive
approximation and stores the conversion result into the
ADC result registers (ADRESH:ADRESL register pair).
Figure 16-1 shows the block diagram of the ADC.
The ADC voltage reference is software selectable to be
either internally generated or externally supplied.
The ADC can generate an interrupt upon completion of
a conversion. This interrupt can be used to wake-up the
device from Sleep.
FIGURE 16-1: ADC BLOCK DIAGRAM
Note 1: When ADON = 0, all multiplexer inputs are disconnected.
DAC_output
VDD
VREF ADPREF = 10
ADPREF = 00
ADPREF = 11
FVR Buffer1
ADON(1)
GO/DONE
VSS
ADC
00000
00001
00010
00011
11110
CHS<4:0>
AN0
AN1
AN2
AN3
11111
ADRESH ADRESL
10
16
ADFM 0 = Left Justify
1 = Right Justify
Temp Indicator 11101
Ref+ Ref-
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PIC12(L)F1840
16.1 ADC Configuration
When configuring and using the ADC the following
functions must be considered:
• Port configuration
• Channel selection
• ADC voltage reference selection
• ADC conversion clock source
• Interrupt control
• Result formatting
16.1.1 PORT CONFIGURATION
The ADC can be used to convert both analog and
digital signals. When converting analog signals, the I/O
pin should be configured for analog by setting the
associated TRIS and ANSEL bits. Refer to
Section 12.0 “I/O Ports” for more information.
16.1.2 CHANNEL SELECTION
There are seven channel selections available:
• AN<3:0> pins
• Temperature Indicator
• DAC_output
• FVR Buffer1 Output
Refer to Section 17.0 “Digital-to-Analog Converter
(DAC) Module”, Section 14.0 “Fixed Voltage Refer-
ence (FVR)” and Section 15.0 “Temperature Indica-
tor Module” for more information on these channel
selections.
The CHS bits of the ADCON0 register determine which
channel is connected to the sample and hold circuit.
When changing channels, a delay is required before
starting the next conversion. Refer to Section 16.2
“ADC Operation” for more information.
16.1.3 ADC VOLTAGE REFERENCE
The ADPREF bits of the ADCON1 register provides
control of the positive voltage reference. The positive
voltage reference can be:
•V
REF+ pin
•V
DD
See Section 14.0 “Fixed Voltage Reference (FVR)”
for more details on the Fixed Voltage Reference.
16.1.4 CONVERSION CLOCK
The source of the conversion clock is software
selectable via the ADCS bits of the ADCON1 register.
There are seven possible clock options:
•F
OSC/2
•F
OSC/4
•F
OSC/8
•F
OSC/16
•F
OSC/32
•F
OSC/64
•F
RC (dedicated internal FRC oscillator)
The time to complete one bit conversion is defined as
TAD. One full 10-bit conversion requires 11.5 TAD
periods as shown in Figure 16-2.
For correct conversion, the appropriate TAD
specification must be met. Refer to the ADC conversion
requirements in Section 30.0 “Electrical
Specifications” for more information. Table 16-1 gives
examples of appropriate ADC clock selections.
Note: Analog voltages on any pin that is defined
as a digital input may cause the input
buffer to conduct excess current.
Note: Unless using the FRC, any changes in the
system clock frequency will change the
ADC clock frequency, which may
adversely affect the ADC result.
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DS40001441F-page 116 2011-2015 Microchip Technology Inc.
TABLE 16-1: ADC CLOCK PERIOD (TAD) VS. DEVICE OPERATING FREQUENCIES
FIGURE 16-2: ANALOG-TO-DIGITAL CONVERSION TAD CYCLES
ADC Clock Period (TAD) Device Frequency (FOSC)
ADC
Clock Source ADCS<2:0> 32 MHz 20 MHz 16 MHz 8 MHz 4 MHz 1 MHz
Fosc/2 000 62.5ns(2) 100 ns(2) 125 ns(2) 250 ns(2) 500 ns(2) 2.0 s
Fosc/4 100 125 ns(2) 200 ns(2) 250 ns(2) 500 ns(2) 1.0 s4.0 s
Fosc/8 001 0.5 s(2) 400 ns(2) 0.5 s(2) 1.0 s2.0 s8.0 s(3)
Fosc/16 101 800 ns 800 ns 1.0 s2.0 s4.0 s16.0 s(3)
Fosc/32 010 1.0 s1.6 s2.0 s4.0 s8.0 s(3) 32.0 s(3)
Fosc/64 110 2.0 s3.2 s4.0 s8.0 s(3) 16.0 s(3) 64.0 s(3)
FRC x11 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4) 1.0-6.0 s(1,4)
Legend: Shaded cells are outside of recommended range.
Note 1: The FRC source has a typical TAD time of 1.6 s for VDD.
2: These values violate the minimum required TAD time.
3: For faster conversion times, the selection of another clock source is recommended.
4: The ADC clock period (TAD) and total ADC conversion time can be minimized when the ADC clock is derived from the
system clock FOSC. However, the FRC oscillator source must be used when conversions are to be performed with the
device in Sleep mode.
TAD1 TAD2TAD3TAD4 TAD5TAD6 TAD7TAD8TAD11
Set GO bit
Holding capacitor is disconnected from analog input (typically 100 ns)
TAD9 TAD10
TCY - TAD
ADRESH:ADRESL is loaded, GO bit is cleared,
ADIF bit is set, holding capacitor is connected to analog input.
Conversion starts
b0
b9 b6 b5 b4 b3 b2 b1
b8 b7
On the following cycle:
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16.1.5 INTERRUPTS
The ADC module allows for the ability to generate an
interrupt upon completion of an Analog-to-Digital
conversion. The ADC Interrupt Flag is the ADIF bit in
the PIR1 register. The ADC Interrupt Enable is the
ADIE bit in the PIE1 register. The ADIF bit must be
cleared in software.
This interrupt can be generated while the device is
operating or while in Sleep. If the device is in Sleep, the
interrupt will wake-up the device. Upon waking from
Sleep, the next instruction following the SLEEP instruc-
tion is always executed. If the user is attempting to
wake-up from Sleep and resume in-line code execu-
tion, the GIE and PEIE bits of the INTCON register
must be disabled. If the GIE and PEIE bits of the
INTCON register are enabled, execution will switch to
the Interrupt Service Routine.
16.1.6 RESULT FORMATTING
The 10-bit ADC conversion result can be supplied in
two formats, left justified or right justified. The ADFM bit
of the ADCON1 register controls the output format.
Figure 16-3 shows the two output formats.
FIGURE 16-3: 10-BIT ADC CONVERSION RESULT FORMAT
Note 1: The ADIF bit is set at the completion of
every conversion, regardless of whether
or not the ADC interrupt is enabled.
2: The ADC operates during Sleep only
when the FRC oscillator is selected.
ADRESH ADRESL
(ADFM = 0)MSB LSB
bit 7 bit 0 bit 7 bit 0
10-bit ADC Result Unimplemented: Read as ‘0’
(ADFM = 1)MSB LSB
bit 7 bit 0 bit 7 bit 0
Unimplemented: Read as ‘0’ 10-bit ADC Result
DONE GODONE DONE DONE DONE
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DS40001441F-page 118 2011-2015 Microchip Technology Inc.
16.2 ADC Operation
16.2.1 STARTING A CONVERSION
To enable the ADC module, the ADON bit of the
ADCON0 register must be set to a ‘1’. Setting the GO/
DONE bit of the ADCON0 register to a ‘1’ will start the
Analog-to-Digital conversion.
16.2.2 COMPLETION OF A CONVERSION
When the conversion is complete, the ADC module will:
• Clear the GO/DONE bit
• Set the ADIF Interrupt Flag bit
• Update the ADRESH and ADRESL registers with
new conversion result
16.2.3 TERMINATING A CONVERSION
If a conversion must be terminated before completion,
the GO/DONE bit can be cleared in software. The
ADRESH and ADRESL registers will be updated with
the partially complete Analog-to-Digital conversion
sample. Incomplete bits will match the last bit
converted.
16.2.4 ADC OPERATION DURING SLEEP
The ADC module can operate during Sleep. This
requires the ADC clock source to be set to the FRC
option. When the FRC oscillator source is selected, the
ADC waits one additional instruction before starting the
conversion. This allows the SLEEP instruction to be
executed, which can reduce system noise during the
conversion. If the ADC interrupt is enabled, the device
will wake-up from Sleep when the conversion
completes. If the ADC interrupt is disabled, the ADC
module is turned off after the conversion completes,
although the ADON bit remains set.
When the ADC clock source is something other than
FRC, a SLEEP instruction causes the present
conversion to be aborted and the ADC module is
turned off, although the ADON bit remains set.
16.2.5 SPECIAL EVENT TRIGGER
The Special Event Trigger of the CCPx/ECCPX module
allows periodic ADC measurements without software
intervention. When this trigger occurs, the GO/DONE
bit is set by hardware and the Timer1 counter resets to
zero.
Using the Special Event Trigger does not assure proper
ADC timing. It is the user’s responsibility to ensure that
the ADC timing requirements are met.
Refer to Section 24.0 “Capture/Compare/PWM
Modules” for more information.
Note: The GO/DONE bit should not be set in the
same instruction that turns on the ADC.
Refer to Section 16.2.6 “ADC Conver-
sion Procedure”.
Note: A device Reset forces all registers to their
Reset state. Thus, the ADC module is
turned off and any pending conversion is
terminated.
TABLE 16-2: SPECIAL EVENT TRIGGER
Device ECCP1
PIC12(L)F1840 ECCP1
DONE DONE
2011-2015 Microchip Technology Inc. DS40001441F-page 119
PIC12(L)F1840
16.2.6 ADC CONVERSION PROCEDURE
This is an example procedure for using the ADC to
perform an Analog-to-Digital conversion:
1. Configure Port:
• Disable pin output driver (Refer to the TRIS
register)
• Configure pin as analog (Refer to the ANSEL
register)
2. Configure the ADC module:
• Select ADC conversion clock
• Configure voltage reference
• Select ADC input channel
• Turn on ADC module
3. Configure ADC interrupt (optional):
• Clear ADC interrupt flag
• Enable ADC interrupt
• Enable peripheral interrupt
• Enable global interrupt(1)
4. Wait the required acquisition time(2).
5. Start conversion by setting the GO/DONE bit.
6. Wait for ADC conversion to complete by one of
the following:
• Polling the GO/DONE bit
• Waiting for the ADC interrupt (interrupts
enabled)
7. Read ADC Result.
8. Clear the ADC interrupt flag (required if interrupt
is enabled).
EXAMPLE 16-1: ADC CONVERSION
Note 1: The global interrupt can be disabled if the
user is attempting to wake-up from Sleep
and resume in-line code execution.
2: Refer to Section 16.4 “ADC Acquisi-
tion Requirements”.
;This code block configures the ADC
;for polling, Vdd and Vss references, Frc
;clock and AN0 input.
;
;Conversion start & polling for completion
; are included.
;
BANKSEL ADCON1 ;
MOVLW B’11110000’ ;Right justify, Frc
;clock
MOVWF ADCON1 ;Vdd and Vss Vref
BANKSEL TRISA ;
BSF TRISA,0 ;Set RA0 to input
BANKSEL ANSEL ;
BSF ANSEL,0 ;Set RA0 to analog
BANKSEL ADCON0 ;
MOVLW B’00000001’ ;Select channel AN0
MOVWF ADCON0 ;Turn ADC On
CALL SampleTime ;Acquisiton delay
BSF ADCON0,ADGO ;Start conversion
BTFSC ADCON0,ADGO ;Is conversion done?
GOTO $-1 ;No, test again
BANKSEL ADRESH ;
MOVF ADRESH,W ;Read upper 2 bits
MOVWF RESULTHI ;store in GPR space
BANKSEL ADRESL ;
MOVF ADRESL,W ;Read lower 8 bits
MOVWF RESULTLO ;Store in GPR space
GO/DONE
PIC12(L)F1840
DS40001441F-page 120 2011-2015 Microchip Technology Inc.
16.3 Register Definitions: ADC Control
REGISTER 16-1: ADCON0: ADC CONTROL REGISTER 0
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— CHS<4:0> GO/DONE ADON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-2 CHS<4:0>: Analog Channel Select bits
11111 = FVR (Fixed Voltage Reference) Buffer 1 Output(2)
11110 = DAC_output(1)
11101 = Temperature Indicator(3).
11100 = Reserved. No channel connected.
•
•
•
00100 = Reserved. No channel connected.
00011 =AN3
00010 =AN2
00001 =AN1
00000 =AN0
bit 1 GO/DONE: ADC Conversion Status bit
1 = ADC conversion cycle in progress. Setting this bit starts an ADC conversion cycle.
This bit is automatically cleared by hardware when the ADC conversion has completed.
0 = ADC conversion completed/not in progress
bit 0 ADON: ADC Enable bit
1 = ADC is enabled
0 = ADC is disabled and consumes no operating current
Note 1: See Section 17.0 “Digital-to-Analog Converter (DAC) Module” for more information.
2: See Section 14.0 “Fixed Voltage Reference (FVR)” for more information.
3: See Section 15.0 “Temperature Indicator Module” for more information.
2011-2015 Microchip Technology Inc. DS40001441F-page 121
PIC12(L)F1840
REGISTER 16-2: ADCON1: ADC CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0
ADFM ADCS<2:0> —— ADPREF<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ADFM: ADC Result Format Select bit
1 = Right justified. Six Most Significant bits of ADRESH are set to ‘0’ when the conversion result is
loaded.
0 = Left justified. Six Least Significant bits of ADRESL are set to ‘0’ when the conversion result is
loaded.
bit 6-4 ADCS<2:0>: ADC Conversion Clock Select bits
111 =F
RC (clock supplied from a dedicated RC oscillator)
110 =F
OSC/64
101 =F
OSC/16
100 =F
OSC/4
011 =F
RC (clock supplied from a dedicated RC oscillator)
010 =F
OSC/32
001 =F
OSC/8
000 =F
OSC/2
bit 3-2 Unimplemented: Read as ‘0’
bit 1-0 ADPREF<1:0>: ADC Positive Voltage Reference Configuration bits
11 =V
REF is connected to internal Fixed Voltage Reference (FVR) module(1)
10 =VREF is connected to external VREF pin(1)
01 = Reserved
00 =V
REF is connected to VDD
Note 1: When selecting the FVR or the VREF+ pin as the source of the positive reference, be aware that a
minimum voltage specification exists. See Section 30.0 “Electrical Specifications” for details.
PIC12(L)F1840
DS40001441F-page 122 2011-2015 Microchip Technology Inc.
REGISTER 16-3: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 0
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADRES<9:2>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ADRES<9:2>: ADC Result Register bits
Upper eight bits of 10-bit conversion result
REGISTER 16-4: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 0
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADRES<1:0> — — — — — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 ADRES<1:0>: ADC Result Register bits
Lower two bits of 10-bit conversion result
bit 5-0 Reserved: Do not use.
2011-2015 Microchip Technology Inc. DS40001441F-page 123
PIC12(L)F1840
REGISTER 16-5: ADRESH: ADC RESULT REGISTER HIGH (ADRESH) ADFM = 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
— — — — — — ADRES<9:8>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Reserved: Do not use.
bit 1-0 ADRES<9:8>: ADC Result Register bits
Upper two bits of 10-bit conversion result
REGISTER 16-6: ADRESL: ADC RESULT REGISTER LOW (ADRESL) ADFM = 1
R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u R/W-x/u
ADRES<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-0 ADRES<7:0>: ADC Result Register bits
Lower eight bits of 10-bit conversion result
PIC12(L)F1840
DS40001441F-page 124 2011-2015 Microchip Technology Inc.
16.4 ADC Acquisition Requirements
For the ADC to meet its specified accuracy, the charge
holding capacitor (CHOLD) must be allowed to fully
charge to the input channel voltage level. The Analog
Input model is shown in Figure 16-4. The source
impedance (RS) and the internal sampling switch (RSS)
impedance directly affect the time required to charge
the capacitor CHOLD. The sampling switch (RSS)
impedance varies over the device voltage (VDD), refer
to Figure 16-4. The maximum recommended
impedance for analog sources is 10 k. As the
source impedance is decreased, the acquisition time
may be decreased. After the analog input channel is
selected (or changed), an ADC acquisition must be
done before the conversion can be started. To calculate
the minimum acquisition time, Equation 16-1 may be
used. This equation assumes that 1/2 LSb error is used
(1,024 steps for the ADC). The 1/2 LSb error is the
maximum error allowed for the ADC to meet its
specified resolution.
EQUATION 16-1: ACQUISITION TIME EXAMPLE
TACQ Amplifier Settling Time Hold Capacitor Charging Time Temperature Coefficient++=
TAMP TCTCOFF++=
2µs TCTemperature - 25°C0.05µs/°C++=
TCCHOLD RIC RSS RS++ ln(1/511)–=
12.5pF 1k
7k
10k
++– ln(0.001957)=
1.72µs
VAPPLIED 1e
Tc–
RC
---------
–



VAPPLIED 11
2n1+
1–
--------------------------–


=
VAPPLIED 11
2n1+
1–
--------------------------–


VCHOLD=
VAPPLIED 1e
TC–
RC
----------
–



VCHOLD=
;[1] VCHOLD charged to within 1/2 lsb
;[2] VCHOLD charge response to VAPPLIED
;combining [1] and [2]
The value for TC can be approximated with the following equations:
Solving for TC:
Therefore:
Temperature 50°C and external impedance of 10k
5.0V VDD=
Assumptions:
Note: Where n = number of bits of the ADC.
TACQ 2µs 1.72µs 50°C- 25°C0.05µs/°C++=
4.97µs=
Note 1: The reference voltage (VREF) has no effect on the equation, since it cancels itself out.
2: The charge holding capacitor (CHOLD) is not discharged after each conversion.
3: The maximum recommended impedance for analog sources is 10 k. This is required to meet the pin
leakage specification.
2011-2015 Microchip Technology Inc. DS40001441F-page 125
PIC12(L)F1840
FIGURE 16-4: ANALOG INPUT MODEL
FIGURE 16-5: ADC TRANSFER FUNCTION
CPIN
VA
Rs
Analog
5 pF
VDD
VT 0.6V
VT 0.6V I LEAKAGE(1)
RIC 1k
Sampling
Switch
SS Rss
CHOLD = 12.5 pF
VSS/VREF-
6V
Sampling Switch
5V
4V
3V
2V
567891011
(k)
VDD
Legend:
CPIN
VT
I LEAKAGE
RIC
SS
CHOLD
= Input Capacitance
= Threshold Voltage
= Leakage current at the pin due to
= Interconnect Resistance
= Sampling Switch
= Sample/Hold Capacitance
various junctions
RSS
Note 1: Refer to Section 30.0 “Electrical Specifications”.
RSS = Resistance of Sampling Switch
Input
pin
3FFh
3FEh
ADC Output Code
3FDh
3FCh
03h
02h
01h
00h
Full-Scale
3FBh
0.5 LSB
VREF-Zero-Scale
Transition VREF+
Transition
1.5 LSB
Full-Scale Range
Analog Input Voltage
PIC12(L)F1840
DS40001441F-page 126 2011-2015 Microchip Technology Inc.
TABLE 16-3: SUMMARY OF REGISTERS ASSOCIATED WITH ADC
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ADCON0 — CHS<4:0> GO/DONE ADON 120
ADCON1 ADFM ADCS<2:0> —— ADPREF<1:0> 121
ADRESH ADC Result Register High 122, 123
ADRESL ADC Result Register Low 122, 123
ANSELA ———ANSA4— ANSA2 ANSA1 ANSA0 103
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — — 130
DACCON1 ——— DACR<4:0> 130
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 111
INTCON GIE PEIE TMR0IE INTE IOCE TMR0IF INTF IOCF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = unimplemented read as ‘0’. Shaded cells are not used for ADC module.
IFDACEN : I IFDACEN : {I & DACLI’S : I & DACR 4:0 : IIIII IFDACEN : {I & DACLI’S : II & DACR 4:0 : 01mm;
2011-2015 Microchip Technology Inc. DS40001441F-page 127
PIC12(L)F1840
17.0 DIGITAL-TO-ANALOG
CONVERTER (DAC) MODULE
The Digital-to-Analog Converter supplies a variable
voltage reference, ratiometric with the input source,
with 32 selectable output levels.
The input of the DAC can be connected to:
•External V
REF pins
•V
DD supply voltage
• FVR Buffer2
The output of the DAC can be configured to supply a
reference voltage to the following:
• Comparator positive input
• ADC input channel
•DACOUT pin
• Capacitive Sensing (CPS) module
The Digital-to-Analog Converter (DAC) can be enabled
by setting the DACEN bit of the DACCON0 register.
17.1 Output Voltage Selection
The DAC has 32 voltage level ranges. The 32 levels
are set with the DACR<4:0> bits of the DACCON1
register.
The DAC output voltage is determined by the following
equations:
EQUATION 17-1: DAC OUTPUT VOLTAGE
17.2 Ratiometric Output Level
The DAC output value is derived using a resistor ladder
with each end of the ladder tied to a positive and
negative voltage reference input source. If the voltage
of either input source fluctuates, a similar fluctuation will
result in the DAC output value.
The value of the individual resistors within the ladder
can be found in Section 30.0 “Electrical
Specifications”.
17.3 DAC Voltage Reference Output
The DAC can be output to the DACOUT pin by setting
the DACOE bit of the DACCON0 register to ‘1’.
Selecting the DAC reference voltage for output on the
DACOUT pin automatically overrides the digital output
buffer and digital input threshold detector functions of
that pin. Reading the DACOUT pin when it has been
configured for DAC reference voltage output will
always return a ‘0’.
Due to the limited current drive capability, a buffer must
be used on the DAC voltage reference output for
external connections to DACOUT. Figure 17-2 shows
an example buffering technique.
IF DACEN = 1
IF DACEN = 0 & DACLPS = 1 & DACR[4:0] = 11111
VOUT VSOURCE +=
IF DACEN = 0 & DACLPS = 0 & DACR[4:0] = 00000
VOUT VSOURCE –=
VSOURCE+ = VDD, VREF, or FVR BUFFER 2
VSOURCE- = VSS
VOUT VSOURCE+VSOURCE-–
DACR 4:0
25
-----------------------------


VSOURCE-+=
riiiiiiiiiiiiw 77777777777777
PIC12(L)F1840
DS40001441F-page 128 2011-2015 Microchip Technology Inc.
FIGURE 17-1: DIGITAL-TO-ANALOG CONVERTER BLOCK DIAGRAM
FIGURE 17-2: VOLTAGE REFERENCE OUTPUT BUFFER EXAMPLE
32-to-1 MUX
DACR<4:0>
R
R
R
R
R
R
R
32 DAC_output
DACOUT
5
(To Comparator, CPS and
ADC Modules)
DACOE
VDD
VREF
DACPSS<1:0> 2
DACEN
Steps
Digital-to-Analog Converter (DAC)
FVR BUFFER2
R
VSOURCE-
VSOURCE+
VSS
DACLPS
DACOUT Buffered DAC Output
+
–
DAC
Module
Voltage
Reference
Output
Impedance
R
PIC® MCU
+7? 4: Wj
2011-2015 Microchip Technology Inc. DS40001441F-page 129
PIC12(L)F1840
17.4 Low-Power Voltage State
In order for the DAC module to consume the least
amount of power, one of the two voltage reference input
sources to the resistor ladder must be disconnected.
Either the positive voltage source, (VSOURCE+), or the
negative voltage source, (VSOURCE-) can be disabled.
The negative voltage source is disabled by setting the
DACLPS bit in the DACCON0 register. Clearing the
DACLPS bit in the DACCON0 register disables the
positive voltage source.
17.4.1 OUTPUT CLAMPED TO POSITIVE
VOLTAGE SOURCE
The DAC output voltage can be set to VSOURCE+ with
the least amount of power consumption by performing
the following:
• Clearing the DACEN bit in the DACCON0 register.
• Setting the DACLPS bit in the DACCON0 register.
• Configuring the DACPSS bits to the proper
positive source.
• Configuring the DACR<4:0> bits to ‘11111’ in the
DACCON1 register.
This is also the method used to output the voltage level
from the FVR to an output pin. See Section 17.5
“Operation During Sleep” for more information.
Reference Figure 17-3 for output clamping examples.
17.4.2 OUTPUT CLAMPED TO NEGATIVE
VOLTAGE SOURCE
The DAC output voltage can be set to VSOURCE- with
the least amount of power consumption by performing
the following:
• Clearing the DACEN bit in the DACCON0 register.
• Clearing the DACLPS bit in the DACCON0 register.
• Configuring the DACR<4:0> bits to ‘00000’ in the
DACCON1 register.
This allows the comparator to detect a zero-crossing
while not consuming additional current through the DAC
module.
Reference Figure 17-3 for output clamping examples.
FIGURE 17-3: OUTPUT VOLTAGE CLAMPING EXAMPLES
17.5 Operation During Sleep
When the device wakes up from Sleep through an
interrupt or a Watchdog Timer time-out, the contents of
the DACCON0 register are not affected. To minimize
current consumption in Sleep mode, the voltage
reference should be disabled.
17.6 Effects of a Reset
A device Reset affects the following:
• DAC is disabled.
• DAC output voltage is removed from the
DACOUT pin.
• The DACR<4:0> range select bits are cleared.
R
R
R
DAC Voltage Ladder
(see Figure 17-1)
VSOURCE+
DACEN = 0
DACLPS = 1
DACR<4:0> = 11111
VSOURCE-
R
R
R
DAC Voltage Ladder
(see Figure 17-1)
VSOURCE+
DACEN = 0
DACLPS = 0
DACR<4:0> = 00000
VSOURCE-
Output Clamped to Positive Voltage Source Output Clamped to Negative Voltage Source
PIC12(L)F1840
DS40001441F-page 130 2011-2015 Microchip Technology Inc.
17.7 Register Definitions: DAC Control
TABLE 17-1: SUMMARY OF REGISTERS ASSOCIATED WITH THE DAC MODULE
REGISTER 17-1: DACCON0: VOLTAGE REFERENCE CONTROL REGISTER 0
R/W-0/0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0 U-0 U-0
DACEN DACLPS DACOE — DACPSS<1:0> — —
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 DACEN: DAC Enable bit
1 = DAC is enabled
0 = DAC is disabled
bit 6 DACLPS: DAC Low-Power Voltage State Select bit
1 = DAC Positive reference source selected
0 = DAC Negative reference source selected
bit 5 DACOE: DAC Voltage Output Enable bit
1 = DAC voltage level is also an output on the DACOUT pin
0 = DAC voltage level is disconnected from the DACOUT pin
bit 4 Unimplemented: Read as ‘0’
bit 3-2 DACPSS<1:0>: DAC Positive Source Select bits
11 = Reserved, do not use
10 = FVR Buffer2 output
01 =VREF pin
00 =VDD
bit 1-0 Unimplemented: Read as ‘0’
REGISTER 17-2: DACCON1: VOLTAGE REFERENCE CONTROL REGISTER 1
U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— — — DACR<4:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-5 Unimplemented: Read as ‘0’
bit 4-0 DACR<4:0>: DAC Voltage Output Select bits
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on page
FVRCON FVREN FVRRDY TSEN TSRNG CDAFVR<1:0> ADFVR<1:0> 111
DACCON0 DACEN DACLPS DACOE — DACPSS<1:0> — — 130
DACCON1 — — — DACR<4:0> 130
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the DAC module.
0‘ 0‘
2011-2015 Microchip Technology Inc. DS40001441F-page 131
PIC12(L)F1840
18.0 SR LATCH
The module consists of a single SR latch with multiple
Set and Reset inputs as well as separate latch outputs.
The SR latch module includes the following features:
• Programmable input selection
• SR latch output is available externally
• Separate Q and Q outputs
• Firmware Set and Reset
The SR latch can be used in a variety of analog
applications, including oscillator circuits, one-shot
circuit, hysteretic controllers, and analog timing
applications.
18.1 Latch Operation
The latch is a Set-Reset Latch that does not depend on
a clock source. Each of the Set and Reset inputs are
active-high. The latch can be set or reset by:
• Software control (SRPS and SRPR bits)
• Comparator C1 output (sync_C1OUT)
•SRI pin
• Programmable clock (SRCLK)
The SRPS and the SRPR bits of the SRCON0 register
may be used to set or reset the SR latch, respectively.
The latch is Reset-dominant. Therefore, if both Set and
Reset inputs are high, the latch will go to the Reset
state. Both the SRPS and SRPR bits are self resetting
which means that a single write to either of the bits is all
that is necessary to complete a latch Set or Reset oper-
ation.
The output from Comparator C1 can be used as the Set
or Reset inputs of the SR latch. The output of the
comparator can be synchronized to the Timer1 clock
source. See Section 19.0 “Comparator Module” and
Section 21.0 “Timer1 Module with Gate Control” for
more information.
An external source on the SRI pin can be used as the
Set or Reset inputs of the SR latch.
An internal clock source is available that can periodically
set or reset the SR latch. The SRCLK<2:0> bits in the
SRCON0 register are used to select the clock source
period. The SRSCKE and SRRCKE bits of the SRCON1
register enable the clock source to set or reset the SR
latch, respectively.
18.2 Latch Output
The SRQEN and SRNQEN bits of the SRCON0
register control the Q and Q latch outputs. Both of the
SR latch outputs may be directly output to an I/O pin at
the same time.
The applicable TRIS bit of the corresponding port must
be cleared to enable the port pin output driver.
18.3 Effects of a Reset
Upon any device Reset, the SR latch output is not
initialized to a known state. The user’s firmware is
responsible for initializing the latch output before
enabling the output pins.
PIC12(L)F1840
DS40001441F-page 132 2011-2015 Microchip Technology Inc.
FIGURE 18-1: SR LATCH SIMPLIFIED BLOCK DIAGRAM
TABLE 18-1: SRCLK FREQUENCY TABLE
SRPS
S
R
Q
Q
Note 1: If R = 1 and S = 1 simultaneously, Q = 0, Q =1
2: Pulse generator causes a 1 Q-state pulse width.
3: Name denotes the connection point at the comparator output.
Pulse
Gen(2)
SR
Latch(1)
SRQEN
SRSPE
SRSCKE
SRCLK
SRSC1E
sync_C1OUT(3)
SRPR Pulse
Gen(2)
SRRPE
SRRCKE
SRCLK
SRRC1E
sync_C1OUT(3)
SRLEN
SRNQEN
SRLEN
SRQ
SRNQ
SRI
SRI
SRCLK Divider FOSC = 32 MHz FOSC = 20 MHz FOSC = 16 MHz FOSC = 4 MHz FOSC = 1 MHz
111 512 62.5 kHz 39.0 kHz 31.3 kHz 7.81 kHz 1.95 kHz
110 256 125 kHz 78.1 kHz 62.5 kHz 15.6 kHz 3.90 kHz
101 128 250 kHz 156 kHz 125 kHz 31.25 kHz 7.81 kHz
100 64 500 kHz 313 kHz 250 kHz 62.5 kHz 15.6 kHz
011 32 1 MHz 625 kHz 500 kHz 125 kHz 31.3 kHz
010 16 2 MHz 1.25 MHz 1 MHz 250 kHz 62.5 kHz
001 8 4 MHz 2.5 MHz 2 MHz 500 kHz 125 kHz
000 4 8 MHz 5 MHz 4 MHz 1 MHz 250 kHz
IV SRLEN = 7 IV SRLEN =7 IVSRLEN =7 6 IV SRLEN :7 D‘ 0‘
2011-2015 Microchip Technology Inc. DS40001441F-page 133
PIC12(L)F1840
18.4 Register Definitions: SR Latch Control
REGISTER 18-1: SRCON0: SR LATCH CONTROL 0 REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/S-0/0 R/S-0/0
SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared S = Bit is set only
bit 7 SRLEN: SR Latch Enable bit
1 = SR Latch is enabled
0 = SR Latch is disabled
bit 6-4 SRCLK<2:0>: SR Latch Clock Divider bits
111 = Generates a 1 FOSC wide pulse every 512th FOSC cycle clock
110 = Generates a 1 FOSC wide pulse every 256th FOSC cycle clock
101 = Generates a 1 FOSC wide pulse every 128th FOSC cycle clock
100 = Generates a 1 FOSC wide pulse every 64th FOSC cycle clock
011 = Generates a 1 FOSC wide pulse every 32nd FOSC cycle clock
010 = Generates a 1 FOSC wide pulse every 16th FOSC cycle clock
001 = Generates a 1 FOSC wide pulse every 8th FOSC cycle clock
000 = Generates a 1 FOSC wide pulse every 4th FOSC cycle clock
bit 3 SRQEN: SR Latch Q Output Enable bit
If SRLEN = 1:
1 = Q is present on the SRQ pin
0 = External Q output is disabled
If SRLEN = 0:
SR Latch is disabled
bit 2 SRNQEN: SR Latch Q Output Enable bit
If SRLEN = 1:
1 =Q
is present on the SRnQ pin
0 = External Q output is disabled
If SRLEN = 0:
SR Latch is disabled
bit 1 SRPS: Pulse Set Input of the SR Latch bit(1)
1 = Pulse set input for 1 Q-clock period
0 = No effect on set input.
bit 0 SRPR: Pulse Reset Input of the SR Latch bit(1)
1 = Pulse reset input for 1 Q-clock period
0 = No effect on Reset input.
Note 1: Set only, always reads back ‘0’.
PIC12(L)F1840
DS40001441F-page 134 2011-2015 Microchip Technology Inc.
TABLE 18-2: SUMMARY OF REGISTERS ASSOCIATED WITH SR LATCH MODULE
REGISTER 18-2: SRCON1: SR LATCH CONTROL 1 REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
SRSPE SRSCKE Reserved SRSC1E SRRPE SRRCKE Reserved SRRC1E
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SRSPE: SR Latch Peripheral Set Enable bit
1 = SR latch is set when the SRI pin is high
0 = SRI pin has no effect on the set input of the SR latch
bit 6 SRSCKE: SR Latch Set Clock Enable bit
1 = Set input of SR latch is pulsed with SRCLK
0 = SRCLK has no effect on the set input of the SR latch
bit 5 Reserved: Read as ‘0’. Maintain this bit clear.
bit 4 SRSC1E: SR Latch C1 Set Enable bit
1 = SR latch is set when the C1 Comparator output is high
0 = C1 Comparator output has no effect on the set input of the SR latch
bit 3 SRRPE: SR Latch Peripheral Reset Enable bit
1 = SR latch is reset when the SRI pin is high
0 = SRI pin has no effect on the reset input of the SR latch
bit 2 SRRCKE: SR Latch Reset Clock Enable bit
1 = Reset input of SR latch is pulsed with SRCLK
0 = SRCLK has no effect on the reset input of the SR latch
bit 1 Reserved: Read as ‘0’. Maintain this bit clear.
bit 0 SRRC1E: SR Latch C1 Reset Enable bit
1 = SR latch is reset when the C1 Comparator output is high
0 = C1 Comparator output has no effect on the reset input of the SR latch
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
SRCON0 SRLEN SRCLK<2:0> SRQEN SRNQEN SRPS SRPR 133
SRCON1 SRSPE SRSCKE Reserved SRSC1E SRRPE SRRCKE Reserved SRRC1E 134
TRISA ——TRISA5TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the SR Latch module.
2011-2015 Microchip Technology Inc. DS40001441F-page 135
PIC12(L)F1840
19.0 COMPARATOR MODULE
Comparators are used to interface analog circuits to a
digital circuit by comparing two analog voltages and
providing a digital indication of their relative magnitudes.
Comparators are very useful mixed signal building
blocks because they provide analog functionality
independent of program execution. The analog
comparator module includes the following features:
• Independent comparator control
• Programmable input selection
• Comparator output is available internally/externally
• Programmable output polarity
• Interrupt-on-change
• Wake-up from Sleep
• Programmable Speed/Power optimization
•PWM shutdown
• Programmable and Fixed Voltage Reference
19.1 Comparator Overview
A single comparator is shown in Figure 19-1 along with
the relationship between the analog input levels and
the digital output. When the analog voltage at VIN+ is
less than the analog voltage at VIN-, the output of the
comparator is a digital low level. When the analog
voltage at VIN+ is greater than the analog voltage at
VIN-, the output of the comparator is a digital high level.
The comparators available for this device are located in
Table 19-1.
FIGURE 19-1: SINGLE COMPARATOR
TABLE 19-1: COMPARATOR AVAILABILITY
PER DEVICE
Device C1
PIC12(L)F1840 ●
–
+
VIN+
VIN-Output
Output
VIN+
VIN-
Note: The black areas of the output of the
comparator represents the uncertainty
due to input offsets and response time.
PIC12(L)F1840
DS40001441F-page 136 2011-2015 Microchip Technology Inc.
FIGURE 19-2: COMPARATOR 1 MODULE SIMPLIFIED BLOCK DIAGRAM
Note 1: When C1ON = 0, the Comparator will produce a ‘0’ at the output.
2: When C1ON = 0, all multiplexer inputs are disconnected.
3: Output of comparator can be frozen during debugging.
MUX
C1(3)
0
1
C1ON(1)
C1NCH
2
0
1
C1PCH<1:0>
C1IN1-
C1IN+
MUX
-
+
C1VN
C1VP
C1OUT
To ECCP PWM Logic
Q1
D
EN
Q
C1POL
MC1OUT
Set C1IF
0
1
C1SYNC C1OE
C1OUT
DQ
sync_C1OUT
DAC_output
FVR Buffer2
C1IN0-
2
C1SP
C1HYS
det
Interrupt
det
Interrupt
C1INTN
C1INTP
To D at a Bu s
2
3
TRIS bit
C1ON
(2)
(2)
(from Timer1)
T1CLK To Timer1 or SR Latch
VSS
2011-2015 Microchip Technology Inc. DS40001441F-page 137
PIC12(L)F1840
19.2 Comparator Control
The comparator has two control registers: CM1CON0
and CM1CON1.
The CM1CON0 register (see Register 19-1) contains
Control and Status bits for the following:
• Enable
•Output selection
• Output polarity
• Speed/Power selection
• Hysteresis enable
• Output synchronization
The CM1CON1 register (see Register 19-2) contains
Control bits for the following:
• Interrupt enable
• Interrupt edge polarity
• Positive input channel selection
• Negative input channel selection
19.2.1 COMPARATOR ENABLE
Setting the C1ON bit of the CM1CON0 register enables
the comparator for operation. Clearing the C1ON bit
disables the comparator resulting in minimum current
consumption.
19.2.2 COMPARATOR OUTPUT
SELECTION
The output of the comparator can be monitored by
reading either the C1OUT bit of the CM1CON0 register
or the MC1OUT bit of the CMOUT register. In order to
make the output available for an external connection,
the following conditions must be true:
• C1OE bit of the CM1CON0 register must be set
• Corresponding TRIS bit must be cleared
• C1ON bit of the CM1CON0 register must be set
19.2.3 COMPARATOR OUTPUT POLARITY
Inverting the output of the comparator is functionally
equivalent to swapping the comparator inputs. The
polarity of the comparator output can be inverted by
setting the C1POL bit of the CM1CON0 register.
Clearing the C1POL bit results in a non-inverted output.
Table 19-2 shows the output state versus input
conditions, including polarity control.
19.2.4 COMPARATOR SPEED/POWER
SELECTION
The trade-off between speed or power can be
optimized during program execution with the C1SP
control bit. The default state for this bit is ‘1’ which
selects the normal speed mode. Device power
consumption can be optimized at the cost of slower
comparator propagation delay by clearing the C1SP bit
to ‘0’.
Note 1: The C1OE bit of the CM1CON0 register
overrides the PORT data latch. Setting
the C1ON bit of the CM1CON0 register
has no impact on the port override.
2: The internal output of the comparator is
latched with each instruction cycle.
Unless otherwise specified, external
outputs are not latched.
TABLE 19-2: COMPARATOR OUTPUT
STATE VS. INPUT
CONDITIONS
Input Condition C1POL C1OUT
C1VN > C1VP00
C1VN < C1VP01
C1VN > C1VP11
C1VN < C1VP10
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DS40001441F-page 138 2011-2015 Microchip Technology Inc.
19.3 Comparator Hysteresis
A selectable amount of separation voltage can be
added to the input pins of each comparator to provide a
hysteresis function to the overall operation. Hysteresis
is enabled by setting the C1HYS bit of the CM1CON0
register.
See Section 30.0 “Electrical Specifications” for
more information.
19.4 Timer1 Gate Operation
The output resulting from a comparator operation can
be used as a source for gate control of Timer1. See
Section 21.6 “Timer1 Gate” for more information.
This feature is useful for timing the duration or interval
of an analog event.
It is recommended that the comparator output be
synchronized to Timer1. This ensures that Timer1 does
not increment while a change in the comparator is
occurring.
19.4.1 COMPARATOR OUTPUT
SYNCHRONIZATION
The output from comparator C1 can be synchronized
with Timer1 by setting the C1SYNC bit of the
CM1CON0 register.
Once enabled, the comparator output is latched on the
falling edge of the Timer1 source clock. If a prescaler is
used with Timer1, the comparator output is latched after
the prescaling function. To prevent a race condition, the
comparator output is latched on the falling edge of the
Timer1 clock source and Timer1 increments on the
rising edge of its clock source. See the Comparator
Block Diagram (Figure 19-2) and the Timer1 Block
Diagram (Figure 21-1) for more information.
19.5 Comparator Interrupt
An interrupt can be generated upon a change in the
output value of the comparator for each comparator, a
rising edge detector and a Falling edge detector are
present.
When either edge detector is triggered and its
associated enable bit is set (C1INTP and/or C1INTN
bits of the CM1CON1 register), the Corresponding
Interrupt Flag bit (C1IF bit of the PIR2 register) will be
set.
To enable the interrupt, you must set the following bits:
• C1ON, C1POL and C1SP bits of the CM1CON0
register
• C1IE bit of the PIE2 register
• C1INTP bit of the CM1CON1 register (for a rising
edge detection)
• C1INTN bit of the CM1CON1 register (for a falling
edge detection)
• PEIE and GIE bits of the INTCON register
The associated interrupt flag bit, C1IF bit of the PIR2
register, must be cleared in software. If another edge is
detected while this flag is being cleared, the flag will still
be set at the end of the sequence.
19.6 Comparator Positive Input
Selection
Configuring the C1PCH<1:0> bits of the CM1CON1
register directs an internal voltage reference or an
analog pin to the non-inverting input of the comparator:
• C1IN+ analog pin
• DAC_output
• FVR Buffer2
•V
SS (Ground)
See Section 14.0 “Fixed Voltage Reference (FVR)”
for more information on the Fixed Voltage Reference
module.
See Section 17.0 “Digital-to-Analog Converter
(DAC) Module” for more information on the DAC input
signal.
Any time the comparator is disabled (C1ON = 0), all
comparator inputs are disabled.
Note: Although a comparator is disabled, an
interrupt can be generated by changing
the output polarity with the C1POL bit of
the CM1CON0 register, or by switching
the comparator on or off with the C1ON bit
of the CM1CON0 register.
H e H
2011-2015 Microchip Technology Inc. DS40001441F-page 139
PIC12(L)F1840
19.7 Comparator Negative Input
Selection
The C1NCH bit of the CM1CON1 register directs one
of two analog pins to the comparator inverting input.
19.8 Comparator Response Time
The comparator output is indeterminate for a period of
time after the change of an input source or the selection
of a new reference voltage. This period is referred to as
the response time. The response time of the comparator
differs from the settling time of the voltage reference.
Therefore, both of these times must be considered when
determining the total response time to a comparator
input change. See the Comparator and Voltage
Reference Specifications in Section 30.0 “Electrical
Specifications” for more details.
19.9 Interaction with ECCP Logic
The C1 comparator can be used as a general purpose
comparator. The output can be brought out to the
C1OUT pin. When the ECCP auto-shutdown is active
it can use the comparator signal. If auto-restart is also
enabled, the comparator can be configured as a
closed loop analog feedback to the ECCP, thereby,
creating an analog controlled PWM.
19.10 Analog Input Connection
Considerations
A simplified circuit for an analog input is shown in
Figure 19-3. Since the analog input pins share their
connection with a digital input, they have reverse
biased ESD protection diodes to VDD and VSS. The
analog input, therefore, must be between VSS and VDD.
If the input voltage deviates from this range by more
than 0.6V in either direction, one of the diodes is
forward biased and a latch-up may occur.
A maximum source impedance of 10 k is recommended
for the analog sources. Also, any external component
connected to an analog input pin, such as a capacitor or
a Zener diode, should have very little leakage current to
minimize inaccuracies introduced.
Note: To use C1IN+ and C1INx- pins as analog
input, the appropriate bits must be set in
the ANSEL register and the correspond-
ing TRIS bits must also be set to disable
the output drivers.
Note: When the comparator module is first
initialized the output state is unknown.
Upon initialization, the user should verify
the output state of the comparator prior to
relying on the result, primarily when using
the result in connection with other
peripheral features, such as the ECCP
Auto-Shutdown mode.
Note 1: When reading a PORT register, all pins
configured as analog inputs will read as a
‘0’. Pins configured as digital inputs will
convert as an analog input, according to
the input specification.
2: Analog levels on any pin defined as a
digital input, may cause the input buffer to
consume more current than is specified.
PIC12(L)F1840
DS40001441F-page 140 2011-2015 Microchip Technology Inc.
FIGURE 19-3: ANALOG INPUT MODEL
VA
Rs < 10K
CPIN
5 pF
VDD
VT 0.6V
VT 0.6V
RIC
ILEAKAGE(1)
Vss
Legend: CPIN = Input Capacitance
ILEAKAGE = Leakage Current at the pin due to various junctions
RIC = Interconnect Resistance
RS= Source Impedance
VA= Analog Voltage
VT= Threshold Voltage
To Comparator
Note 1: See Section 30.0 “Electrical Specifications”.
Analog
Input
pin
IfCWPOL :71 invened golamy . IfCWPOL :L nonrmvened golari‘y
2011-2015 Microchip Technology Inc. DS40001441F-page 141
PIC12(L)F1840
19.11 Register Definitions: Comparator Control
REGISTER 19-1: CM1CON0: COMPARATOR C1 CONTROL REGISTER 0
R/W-0/0 R-0/0 R/W-0/0 R/W-0/0 U-0 R/W-1/1 R/W-0/0 R/W-0/0
C1ON C1OUT C1OE C1POL —C1SP C1HYS C1SYNC
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 C1ON: Comparator Enable bit
1 = Comparator is enabled
0 = Comparator is disabled and consumes no active power
bit 6 C1OUT: Comparator Output bit
If C1POL = 1 (inverted polarity):
1 = C1VP < C1VN
0 = C1VP > C1VN
If C1POL = 0 (non-inverted polarity):
1 = C1VP > C1VN
0 = C1VP < C1VN
bit 5 C1OE: Comparator Output Enable bit
1 = C1OUT is present on the C1OUT pin. Requires that the associated TRIS bit be cleared to actually
drive the pin. Not affected by C1ON.
0 = C1OUT is internal only
bit 4 C1POL: Comparator Output Polarity Select bit
1 = Comparator output is inverted
0 = Comparator output is not inverted
bit 3 Unimplemented: Read as ‘0’
bit 2 C1SP: Comparator Speed/Power Select bit
1 = Comparator operates in normal power, higher speed mode
0 = Comparator operates in low-power, low-speed mode
bit 1 C1HYS: Comparator Hysteresis Enable bit
1 = Comparator hysteresis enabled
0 = Comparator hysteresis disabled
bit 0 C1SYNC: Comparator Output Synchronous Mode bit
1 = Comparator output to Timer1 and I/O pin is synchronous to changes on Timer1 clock source.
Output updated on the falling edge of Timer1 clock source.
0 = Comparator output to Timer1 and I/O pin is asynchronous.
PIC12(L)F1840
DS40001441F-page 142 2011-2015 Microchip Technology Inc.
TABLE 19-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARATOR MODULE
REGISTER 19-2: CM1CON1: COMPARATOR C1 CONTROL REGISTER 1
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 U-0 U-0 U-0 R/W-0/0
C1INTP C1INTN C1PCH<1:0> — — — C1NCH
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 C1INTP: Comparator Interrupt on Positive Going Edge Enable bits
1 = The C1IF interrupt flag will be set upon a positive going edge of the C1OUT bit
0 = No interrupt flag will be set on a positive going edge of the C1OUT bit
bit 6 C1INTN: Comparator Interrupt on Negative Going Edge Enable bits
1 = The C1IF interrupt flag will be set upon a negative going edge of the C1OUT bit
0 = No interrupt flag will be set on a negative going edge of the C1OUT bit
bit 5-4 C1PCH<1:0>: Comparator Positive Input Channel Select bits
10 = C1VP connects to FVR Voltage Reference
01 = C1VP connects to DAC Voltage Reference
00 = C1VP connects to C1IN+ pin
bit 3-1 Unimplemented: Read as ‘0’
bit 0 C1NCH: Comparator Negative Input Channel Select bit
1 = C1VN connects to C1IN1- pin
0 = C1VN connects to C1IN0- pin
REGISTER 19-3: CMOUT: COMPARATOR OUTPUT REGISTER
U-0 U-0 U-0 U-0 U-0 U-0 U-0 R-0/0
— — — — — — — MC1OUT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-1 Unimplemented: Read as ‘0’
bit 0 MC1OUT: Mirror Copy of C1OUT bit
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA — — —ANSA4— ANSA2 ANSA1 ANSA0 103
CM1CON0 C1ON C1OUT C1OE C1POL — C1SP C1HYS C1SYNC 141
CM1CON1 C1INTP C1INTN C1PCH<1:0> — — — C1NCH 142
CMOUT — — — — — — —MC1OUT142
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE2 OSFIE —C1IE EEIE BCL1IE —— — 74
PIR2 OSFIF —C1IFEEIF BCL1IF ———76
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = unimplemented, read as ‘0’. Shaded cells are unused by the comparator module.
g?
2011-2015 Microchip Technology Inc. DS40001441F-page 143
PIC12(L)F1840
20.0 TIMER0 MODULE
The Timer0 module is an 8-bit timer/counter with the
following features:
• 8-bit timer/counter register (TMR0)
• 8-bit prescaler (independent of Watchdog Timer)
• Programmable internal or external clock source
• Programmable external clock edge selection
• Interrupt on overflow
• TMR0 can be used to gate Timer1
Figure 20-1 is a block diagram of the Timer0 module.
20.1 Timer0 Operation
The Timer0 module can be used as either an 8-bit timer
or an 8-bit counter.
20.1.1 8-BIT TIMER MODE
The Timer0 module will increment every instruction
cycle, if used without a prescaler. 8-bit Timer mode is
selected by clearing the TMR0CS bit of the
OPTION_REG register.
When TMR0 is written, the increment is inhibited for
two instruction cycles immediately following the write.
20.1.2 8-BIT COUNTER MODE
In 8-Bit Counter mode, the Timer0 module will increment
on every rising or falling edge of the T0CKI pin or the
Capacitive Sensing Oscillator (CPSCLK) signal.
8-Bit Counter mode using the T0CKI pin is selected by
setting the TMR0CS bit in the OPTION_REG register to
‘1’ and resetting the T0XCS bit in the CPSCON0 register
to ‘0’.
8-Bit Counter mode using the Capacitive Sensing
Oscillator (CPSCLK) signal is selected by setting the
TMR0CS bit in the OPTION_REG register to ‘1’ and
setting the T0XCS bit in the CPSCON0 register to ‘1’.
The rising or falling transition of the incrementing edge
for either input source is determined by the TMR0SE bit
in the OPTION_REG register.
FIGURE 20-1: BLOCK DIAGRAM OF THE TIMER0
Note: The value written to the TMR0 register
can be adjusted, in order to account for
the two instruction cycle delay when
TMR0 is written.
T0CKI
TMR0SE
TMR0
PS<2:0>
Data Bus
Set Flag bit TMR0IF
on Overflow
TMR0CS
0
1
0
18
8
8-bit
Prescaler
FOSC/4
PSA
Sync
2 TCY
Overflow to Timer1
1
0
From CPSCLK
T0XCS
PIC12(L)F1840
DS40001441F-page 144 2011-2015 Microchip Technology Inc.
20.1.3 SOFTWARE PROGRAMMABLE
PRESCALER
A software programmable prescaler is available for
exclusive use with Timer0. The prescaler is enabled by
clearing the PSA bit of the OPTION_REG register.
There are eight prescaler options for the Timer0
module ranging from 1:2 to 1:256. The prescale values
are selectable via the PS<2:0> bits of the
OPTION_REG register. In order to have a 1:1 prescaler
value for the Timer0 module, the prescaler must be
disabled by setting the PSA bit of the OPTION_REG
register.
The prescaler is not readable or writable. All instructions
writing to the TMR0 register will clear the prescaler.
20.1.4 TIMER0 INTERRUPT
Timer0 will generate an interrupt when the TMR0
register overflows from FFh to 00h. The TMR0IF
interrupt flag bit of the INTCON register is set every
time the TMR0 register overflows, regardless of
whether or not the Timer0 interrupt is enabled. The
TMR0IF bit can only be cleared in software. The Timer0
interrupt enable is the TMR0IE bit of the INTCON
register.
20.1.5 8-BIT COUNTER MODE
SYNCHRONIZATION
When in 8-Bit Counter mode, the incrementing edge on
the T0CKI pin must be synchronized to the instruction
clock. Synchronization can be accomplished by
sampling the prescaler output on the Q2 and Q4 cycles
of the instruction clock. The high and low periods of the
external clocking source must meet the timing
requirements as shown in Section 30.0 “Electrical
Specifications”.
20.1.6 OPERATION DURING SLEEP
Timer0 cannot operate while the processor is in Sleep
mode. The contents of the TMR0 register will remain
unchanged while the processor is in Sleep mode.
Note: The Watchdog Timer (WDT) uses its own
independent prescaler.
Note: The Timer0 interrupt cannot wake the
processor from Sleep since the timer is
frozen during Sleep.
WPUEN MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 145
PIC12(L)F1840
20.2 Register Definitions: Option Register
TABLE 20-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER0
REGISTER 20-1: OPTION_REG: OPTION REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 WPUEN: Weak Pull-Up Enable bit
1 = All weak pull-ups are disabled (except MCLR, if it is enabled)
0 = Weak pull-ups are enabled by individual WPUA latch values
bit 6 INTEDG: Interrupt Edge Select bit
1 = Interrupt on rising edge of INT pin
0 = Interrupt on falling edge of INT pin
bit 5 TMR0CS: Timer0 Clock Source Select bit
1 = Transition on T0CKI pin
0 = Internal instruction cycle clock (FOSC/4)
bit 4 TMR0SE: Timer0 Source Edge Select bit
1 = Increment on high-to-low transition on T0CKI pin
0 = Increment on low-to-high transition on T0CKI pin
bit 3 PSA: Prescaler Assignment bit
1 = Prescaler is not assigned to the Timer0 module
0 = Prescaler is assigned to the Timer0 module
bit 2-0 PS<2:0>: Prescaler Rate Select bits
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CPSCON0 CPSON CPSRM — — CPSRNG<1:0> CPSOUT T0XCS 282
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 145
TMR0 Timer0 Module Register 143*
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by the Timer0 module.
* Page provides register information.
000
001
010
011
100
101
110
111
1 : 2
1 : 4
1 : 8
1 : 16
1 : 32
1 : 64
1 : 128
1 : 256
Bit Value Timer0 Rate
3 *W dock mpm T15 c
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21.0 TIMER1 MODULE WITH GATE
CONTROL
The Timer1 module is a 16-bit timer/counter with the
following features:
• 16-bit timer/counter register pair (TMR1H:TMR1L)
• Programmable internal or external clock source
• 2-bit prescaler
• Dedicated 32 kHz oscillator circuit
• Optionally synchronized comparator out
• Multiple Timer1 gate (count enable) sources
• Interrupt on overflow
• Wake-up on overflow (external clock,
Asynchronous mode only)
• Time base for the Capture/Compare function
• Special Event Trigger (with ECCP)
• Selectable Gate Source Polarity
• Gate Toggle mode
• Gate Single-pulse mode
• Gate Value Status
• Gate Event Interrupt
Figure 21-1 is a block diagram of the Timer1 module.
FIGURE 21-1: TIMER1 BLOCK DIAGRAM
TMR1H TMR1L
T1SYNC
T1CKPS<1:0>
Prescaler
1, 2, 4, 8
0
1
Synchronized
clock input
2
Set flag bit
TMR1IF on
Overflow TMR1(2)
TMR1ON
Note 1: ST Buffer is high speed type when using T1CKI.
2: Timer1 register increments on rising edge.
3: Synchronize does not operate while in Sleep.
T1G
T1OSC
FOSC/4
Internal
Clock
T1OSO
T1OSI
T1OSCEN
1
0
T1CKI
TMR1CS<1:0>
(1)
Synchronize(3)
det
Sleep input
TMR1GE
0
1
00
01
10
T1GPOL
D
Q
CK
Q
0
1
T1GVAL
T1GTM
Single Pulse
Acq. Control
T1GSPM
T1GGO/DONE
T1GSS<1:0>
EN
OUT
10
11
00
01
FOSC
Internal
Clock
Cap. Sensing
R
D
EN
Q
Q1
RD
T1GCON
Data Bus
det
Interrupt
TMR1GIF
Set
T1CLK
FOSC/2
Internal
Clock
D
EN
Q
t1g_in
TMR1ON
Oscillator
From Timer0
Overflow
Comparator 1
To Comparator Module
To Clock Switching Modules
11
Reserved
sync_C1OUT
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21.1 Timer1 Operation
The Timer1 module is a 16-bit incrementing counter
which is accessed through the TMR1H:TMR1L register
pair. Writes to TMR1H or TMR1L directly update the
counter.
When used with an internal clock source, the module is
a timer and increments on every instruction cycle.
When used with an external clock source, the module
can be used as either a timer or counter and
increments on every selected edge of the external
source.
Timer1 is enabled by configuring the TMR1ON and
TMR1GE bits in the T1CON and T1GCON registers,
respectively. Table 21-1 displays the Timer1 enable
selections.
21.2 Clock Source Selection
The TMR1CS<1:0> and T1OSCEN bits of the T1CON
register are used to select the clock source for Timer1.
Table 21-2 displays the clock source selections.
21.2.1 INTERNAL CLOCK SOURCE
When the internal clock source is selected, the
TMR1H:TMR1L register pair will increment on multiples
of FOSC as determined by the Timer1 prescaler.
When the FOSC internal clock source is selected, the
Timer1 register value will increment by four counts every
instruction clock cycle. Due to this condition, a 2 LSB
error in resolution will occur when reading the Timer1
value. To utilize the full resolution of Timer1, an
asynchronous input signal must be used to gate the
Timer1 clock input.
The following asynchronous sources may be used:
• Asynchronous event on the T1G pin to Timer1
gate
• C1 comparator input to Timer1 gate
21.2.2 EXTERNAL CLOCK SOURCE
When the external clock source is selected, the Timer1
module may work as a timer or a counter.
When enabled to count, Timer1 is incremented on the
rising edge of the external clock input T1CKI or the
capacitive sensing oscillator signal. Either of these
external clock sources can be synchronized to the
microcontroller system clock or they can run
asynchronously.
When used as a timer with a clock oscillator, an
external 32.768 kHz crystal can be used in conjunction
with the dedicated internal oscillator circuit.
TABLE 21-1: TIMER1 ENABLE
SELECTIONS
TMR1ON TMR1GE Timer1
Operation
00Off
01Off
10Always On
11Count Enabled
Note: In Counter mode, a falling edge must be
registered by the counter prior to the first
incrementing rising edge after any one or
more of the following conditions:
• Timer1 enabled after POR
• Write to TMR1H or TMR1L
• Timer1 is disabled
• Timer1 is disabled (TMR1ON = 0)
when T1CKI is high then Timer1 is
enabled (TMR1ON=1) when T1CKI is
low.
TABLE 21-2: CLOCK SOURCE SELECTIONS
TMR1CS1 TMR1CS0 T1OSCEN Clock Source
01xSystem Clock (FOSC)
00xInstruction Clock (FOSC/4)
11xCapacitive Sensing Oscillator
100External Clocking on T1CKI Pin
101Osc.Circuit On T1OSI/T1OSO Pins
T1 SYNC
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21.3 Timer1 Prescaler
Timer1 has four prescaler options allowing 1, 2, 4 or 8
divisions of the clock input. The T1CKPS bits of the
T1CON register control the prescale counter. The
prescale counter is not directly readable or writable;
however, the prescaler counter is cleared upon a write to
TMR1H or TMR1L.
21.4 Timer1 Oscillator
A dedicated low-power 32.768 kHz oscillator circuit is
built-in between pins T1OSI (input) and T1OSO
(amplifier output). This internal circuit is to be used in
conjunction with an external 32.768 kHz crystal.
The oscillator circuit is enabled by setting the
T1OSCEN bit of the T1CON register. The oscillator will
continue to run during Sleep.
21.5 Timer1 Operation in
Asynchronous Counter Mode
If the control bit T1SYNC of the T1CON register is set,
the external clock input is not synchronized. The timer
increments asynchronously to the internal phase
clocks. If the external clock source is selected then the
timer will continue to run during Sleep and can
generate an interrupt on overflow, which will wake-up
the processor. However, special precautions in
software are needed to read/write the timer (see
Section 21.5.1 “Reading and Writing Timer1 in
Asynchronous Counter Mode”).
21.5.1 READING AND WRITING TIMER1 IN
ASYNCHRONOUS COUNTER
MODE
Reading TMR1H or TMR1L while the timer is running
from an external asynchronous clock will ensure a valid
read (taken care of in hardware). However, the user
should keep in mind that reading the 16-bit timer in two
8-bit values itself, poses certain problems, since the
timer may overflow between the reads.
For writes, it is recommended that the user simply stop
the timer and write the desired values. A write
contention may occur by writing to the timer registers,
while the register is incrementing. This may produce an
unpredictable value in the TMR1H:TMR1L register pair.
21.6 Timer1 Gate
Timer1 can be configured to count freely or the count
can be enabled and disabled using Timer1 gate
circuitry. This is also referred to as Timer1 Gate Enable.
Timer1 gate can also be driven by multiple selectable
sources.
21.6.1 TIMER1 GATE ENABLE
The Timer1 Gate Enable mode is enabled by setting
the TMR1GE bit of the T1GCON register. The polarity
of the Timer1 Gate Enable mode is configured using
the T1GPOL bit of the T1GCON register.
When Timer1 Gate Enable mode is enabled, Timer1
will increment on the rising edge of the Timer1 clock
source. When Timer1 Gate Enable mode is disabled,
no incrementing will occur and Timer1 will hold the
current count. See Figure 21-3 for timing details.
21.6.2 TIMER1 GATE SOURCE
SELECTION
Timer1 gate source selections are shown in Table 21-4.
Source selection is controlled by the T1GSS bits of the
T1GCON register. The polarity for each available
source is also selectable. Polarity selection is
controlled by the T1GPOL bit of the T1GCON register.
TABLE 21-4: TIMER1 GATE SOURCES
Note: The oscillator requires a start-up and
stabilization time before use. Thus,
T1OSCEN should be set and a suitable
delay observed prior to using Timer1. A
suitable delay similar to the OST delay
can be implemented in software by
clearing the TMR1IF bit then presetting
the TMR1H:TMR1L register pair to
FC00h. The TMR1IF flag will be set when
1024 clock cycles have elapsed, thereby
indicating that the oscillator is running and
reasonably stable.
Note: When switching from synchronous to
asynchronous operation, it is possible to
skip an increment. When switching from
asynchronous to synchronous operation,
it is possible to produce an additional
increment.
TABLE 21-3: TIMER1 GATE ENABLE
SELECTIONS
T1CLK T1GPOL T1G Timer1 Operation
00Counts
01Holds Count
10Holds Count
11Counts
T1GSS Timer1 Gate Source
00 Timer1 Gate Pin
01 Overflow of Timer0
(TMR0 increments from FFh to 00h)
10 Comparator 1 Output sync_C1OUT
(optionally Timer1 synchronized output)
11 Reserved
TWGGO/DONE TWGGO/DONE TWGGO/DONE TWGSPM bi‘ in me T1GCON regisler, Ihe T1 GGO/DONE
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21.6.2.1 T1G Pin Gate Operation
The T1G pin is one source for Timer1 gate control. It
can be used to supply an external source to the Timer1
gate circuitry.
21.6.2.2 Timer0 Overflow Gate Operation
When Timer0 increments from FFh to 00h, a
low-to-high pulse will automatically be generated and
internally supplied to the Timer1 gate circuitry.
21.6.2.3 Comparator C1 Gate Operation
The output resulting from a Comparator 1 operation can
be selected as a source for Timer1 gate control. The
Comparator 1 output (sync_C1OUT) can be
synchronized to the Timer1 clock or left asynchronous.
For more information see Section 19.4.1 “Comparator
Output Synchronization”.
21.6.3 TIMER1 GATE TOGGLE MODE
When Timer1 Gate Toggle mode is enabled, it is
possible to measure the full-cycle length of a Timer1
gate signal, as opposed to the duration of a single level
pulse.
The Timer1 gate source is routed through a flip-flop that
changes state on every incrementing edge of the
signal. See Figure 21-4 for timing details.
Timer1 Gate Toggle mode is enabled by setting the
T1GTM bit of the T1GCON register. When the T1GTM
bit is cleared, the flip-flop is cleared and held clear. This
is necessary in order to control which edge is
measured.
21.6.4 TIMER1 GATE SINGLE-PULSE
MODE
When Timer1 Gate Single-Pulse mode is enabled, it is
possible to capture a single-pulse gate event. Timer1
Gate Single-Pulse mode is first enabled by setting the
T1GSPM bit in the T1GCON register. Next, the
T1GGO/DONE bit in the T1GCON register must be set.
The Timer1 will be fully enabled on the next incrementing
edge. On the next trailing edge of the pulse, the
T1GGO/DONE bit will automatically be cleared. No other
gate events will be allowed to increment Timer1 until the
T1GGO/DONE bit is once again set in software. See
Figure 21-5 for timing details.
If the Single-Pulse Gate mode is disabled by clearing the
T1GSPM bit in the T1GCON register, the T1GGO/DONE
bit should also be cleared.
Enabling the Toggle mode and the Single-Pulse mode
simultaneously will permit both sections to work
together. This allows the cycle times on the Timer1 gate
source to be measured. See Figure 21-6 for timing
details.
21.6.5 TIMER1 GATE VALUE STATUS
When Timer1 Gate Value Status is utilized, it is possible
to read the most current level of the gate control value.
The value is stored in the T1GVAL bit in the T1GCON
register. The T1GVAL bit is valid even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
21.6.6 TIMER1 GATE EVENT INTERRUPT
When Timer1 Gate Event Interrupt is enabled, it is
possible to generate an interrupt upon the completion
of a gate event. When the falling edge of T1GVAL
occurs, the TMR1GIF flag bit in the PIR1 register will be
set. If the TMR1GIE bit in the PIE1 register is set, then
an interrupt will be recognized.
The TMR1GIF flag bit operates even when the Timer1
gate is not enabled (TMR1GE bit is cleared).
Note: Enabling Toggle mode at the same time
as changing the gate polarity may result in
indeterminate operation.
T1SVNC T1 SVNC
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21.7 Timer1 Interrupt
The Timer1 register pair (TMR1H:TMR1L) increments
to FFFFh and rolls over to 0000h. When Timer1 rolls
over, the Timer1 interrupt flag bit of the PIR1 register is
set. To enable the interrupt on rollover, you must set
these bits:
• TMR1ON bit of the T1CON register
• TMR1IE bit of the PIE1 register
• PEIE bit of the INTCON register
• GIE bit of the INTCON register
The interrupt is cleared by clearing the TMR1IF bit in
the Interrupt Service Routine.
21.8 Timer1 Operation During Sleep
Timer1 can only operate during Sleep when setup in
Asynchronous Counter mode. In this mode, an external
crystal or clock source can be used to increment the
counter. To set up the timer to wake the device:
• TMR1ON bit of the T1CON register must be set
• TMR1IE bit of the PIE1 register must be set
• PEIE bit of the INTCON register must be set
• T1SYNC bit of the T1CON register must be set
• TMR1CS bits of the T1CON register must be
configured
• T1OSCEN bit of the T1CON register must be
configured
The device will wake-up on an overflow and execute
the next instructions. If the GIE bit of the INTCON
register is set, the device will call the Interrupt Service
Routine.
Timer1 oscillator will continue to operate in Sleep
regardless of the T1SYNC bit setting.
21.9 ECCP/CCP Capture/Compare Time
Base
The CCP module uses the TMR1H:TMR1L register
pair as the time base when operating in Capture or
Compare mode.
In Capture mode, the value in the TMR1H:TMR1L
register pair is copied into the CCPR1H:CCPR1L
register pair on a configured event.
In Compare mode, an event is triggered when the value
CCPR1H:CCPR1L register pair matches the value in
the TMR1H:TMR1L register pair. This event can be a
Special Event Trigger.
For more information, see Section 24.0
“Capture/Compare/PWM Modules”.
21.10 ECCP/CCP Special Event Trigger
When the CCP is configured to trigger a special event,
the trigger will clear the TMR1H:TMR1L register pair.
This special event does not cause a Timer1 interrupt.
The CCP module may still be configured to generate a
CCP interrupt.
In this mode of operation, the CCPR1H:CCPR1L
register pair becomes the period register for Timer1.
Timer1 should be synchronized and FOSC/4 should be
selected as the clock source in order to utilize the
Special Event Trigger. Asynchronous operation of
Timer1 can cause a Special Event Trigger to be
missed.
In the event that a write to TMR1H or TMR1L coincides
with a Special Event Trigger from the CCP, the write will
take precedence.
For more information, see Section 16.2.5 “Special
Event Trigger”.
FIGURE 21-2: TIMER1 INCREMENTING EDGE
Note: The TMR1H:TMR1L register pair and the
TMR1IF bit should be cleared before
enabling interrupts.
T1CKI = 1
when TMR1
Enabled
T1CKI = 0
when TMR1
Enabled
Note 1: Arrows indicate counter increments.
2: In Counter mode, a falling edge must be registered by the counter prior to the first incrementing rising edge of the clock.
g 4 Jflmjflfliflflfm fl W 1 3 -M M M Mm
2011-2015 Microchip Technology Inc. DS40001441F-page 151
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FIGURE 21-3: TIMER1 GATE ENABLE MODE
FIGURE 21-4: TIMER1 GATE TOGGLE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2 N + 3 N + 4
TMR1GE
T1GPOL
T1GTM
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2 N + 3 N + 4 N + 5 N + 6 N + 7 N + 8
PM W m JHHLHi—HM—HHHLI 1 w
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FIGURE 21-5: TIMER1 GATE SINGLE-PULSE MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 N N + 1 N + 2
T1GSPM
T1GGO/
DONE
Set by software
Cleared by hardware on
falling edge of T1GVAL
Set by hardware on
falling edge of T1GVAL
Cleared by software
Cleared by
software
TMR1GIF
Counting enabled on
rising edge of T1G
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FIGURE 21-6: TIMER1 GATE SINGLE-PULSE AND TOGGLE COMBINED MODE
TMR1GE
T1GPOL
t1g_in
T1CKI
T1GVAL
Timer1 NN + 1
N + 2
T1GSPM
T1GGO/
DONE
Set by software
Cleared by hardware on
falling edge of T1GVAL
Set by hardware on
falling edge of T1GVAL
Cleared by software
Cleared by
software
TMR1GIF
T1GTM
Counting enabled on
rising edge of T1G
N + 4
N + 3
T1 SYNC If T1OSCEN :7 If T1OSCEN :7
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21.11 Register Definitions: Timer1 Control
REGISTER 21-1: T1CON: TIMER1 CONTROL REGISTER
R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W-0/u U-0 R/W-0/u
TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 TMR1CS<1:0>: Timer1 Clock Source Select bits
11 = Timer1 clock source is Capacitive Sensing Oscillator (CAPOSC)
10 = Timer1 clock source is pin or oscillator:
If T1OSCEN = 0:
External clock from T1CKI pin (on the rising edge)
If T1OSCEN = 1:
Crystal oscillator on T1OSI/T1OSO pins
01 = Timer1 clock source is system clock (FOSC)
00 = Timer1 clock source is instruction clock (FOSC/4)
bit 5-4 T1CKPS<1:0>: Timer1 Input Clock Prescale Select bits
11 = 1:8 Prescale value
10 = 1:4 Prescale value
01 = 1:2 Prescale value
00 = 1:1 Prescale value
bit 3 T1OSCEN: LP Oscillator Enable Control bit
1 = Dedicated Timer1 oscillator circuit enabled
0 = Dedicated Timer1 oscillator circuit disabled
bit 2 T1SYNC: Timer1 Synchronization Control bit
1 = Do not synchronize asynchronous clock input
0 = Synchronize asynchronous clock input with system clock (FOSC)
bit 1 Unimplemented: Read as ‘0’
bit 0 TMR1ON: Timer1 On bit
1 = Enables Timer1
0 = Stops Timer1 and clears Timer1 gate flip-flop
DONE IfTMRWON :7 IfTMRWON :7
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REGISTER 21-2: T1GCON: TIMER1 GATE CONTROL REGISTER
R/W-0/u R/W-0/u R/W-0/u R/W-0/u R/W/HC-0/u R-x/x R/W-0/u R/W-0/u
TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Bit is cleared by hardware
bit 7 TMR1GE: Timer1 Gate Enable bit
If TMR1ON = 0:
This bit is ignored
If TMR1ON = 1:
1 = Timer1 counting is controlled by the Timer1 gate function
0 = Timer1 counts regardless of Timer1 gate function
bit 6 T1GPOL: Timer1 Gate Polarity bit
1 = Timer1 gate is active-high (Timer1 counts when gate is high)
0 = Timer1 gate is active-low (Timer1 counts when gate is low)
bit 5 T1GTM: Timer1 Gate Toggle Mode bit
1 = Timer1 Gate Toggle mode is enabled
0 = Timer1 Gate Toggle mode is disabled and toggle flip-flop is cleared
Timer1 gate flip-flop toggles on every rising edge.
bit 4 T1GSPM: Timer1 Gate Single-Pulse Mode bit
1 = Timer1 Gate Single-Pulse mode is enabled and is controlling Timer1 gate
0 = Timer1 Gate Single-Pulse mode is disabled
bit 3 T1GGO/DONE: Timer1 Gate Single-Pulse Acquisition Status bit
1 = Timer1 gate single-pulse acquisition is ready, waiting for an edge
0 = Timer1 gate single-pulse acquisition has completed or has not been started
bit 2 T1GVAL: Timer1 Gate Current State bit
Indicates the current state of the Timer1 gate that could be provided to TMR1H:TMR1L.
Unaffected by Timer1 Gate Enable (TMR1GE).
bit 1-0 T1GSS<1:0>: Timer1 Gate Source Select bits
11 = Reserved
10 = Comparator 1 optionally synchronized output (sync_C1OUT)
01 = Timer0 overflow output
00 = Timer1 Gate pin
T1 SYNC
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TABLE 21-5: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER1
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA — — — ANSA4 — ANSA2 ANSA1 ANSA0 103
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 150*
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 150*
TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON
154
T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/
DONE
T1GVAL T1GSS<1:0> 155
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used by the Timer1 module.
* Page provides register information.
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22.0 TIMER2 MODULE
The Timer2 module incorporates the following features:
• 8-bit Timer and Period registers (TMR2 and PR2,
respectively)
• Readable and writable (both registers)
• Software programmable prescaler (1:1, 1:4, 1:16,
and 1:64)
• Software programmable postscaler (1:1 to 1:16)
• Interrupt on TMR2 match with PR2, respectively
• Optional use as the shift clock for the MSSP1
modules
See Figure 22-1 for a block diagram of Timer2.
FIGURE 22-1: TIMER2 BLOCK DIAGRAM
Comparator
TMRx Output
Sets Flag bit TMRxIF
TMRx Reset
Postscaler
Prescaler
PRx
2
FOSC/4
1:1 to 1:16
1:1, 1:4, 1:16, 1:64
EQ
4
TxOUTPS<3:0>
TxCKPS<1:0>
MCLR
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22.1 Timer2 Operation
The clock input to the Timer2 modules is the system
instruction clock (FOSC/4).
TMR2 increments from 00h on each clock edge.
A 4-bit counter/prescaler on the clock input allows direct
input, divide-by-4 and divide-by-16 prescale options.
These options are selected by the prescaler control bits,
T2CKPS<1:0> of the T2CON register. The value of
TMR2 is compared to that of the Period register, PR2, on
each clock cycle. When the two values match, the
comparator generates a match signal as the timer
output. This signal also resets the value of TMR2 to 00h
on the next cycle and drives the output
counter/postscaler (see Section 22.2 “Timer2
Interrupt”).
The TMR2 and PR2 registers are both directly readable
and writable. The TMR2 register is cleared on any
device Reset, whereas the PR2 register initializes to
FFh. Both the prescaler and postscaler counters are
cleared on the following events:
• a write to the TMR2 register
• a write to the T2CON register
• Power-on Reset (POR)
• Brown-out Reset (BOR)
•MCLR
Reset
• Watchdog Timer (WDT) Reset
• Stack Overflow Reset
• Stack Underflow Reset
•RESET Instruction
22.2 Timer2 Interrupt
Timer2 can also generate an optional device interrupt.
The Timer2 output signal (TMR2-to-PR2 match)
provides the input for the 4-bit counter/postscaler. This
counter generates the TMR2 match interrupt flag which
is latched in TMR2IF of the PIR1 register. The interrupt
is enabled by setting the TMR2 Match Interrupt Enable
bit, TMR2IE of the PIE1 register.
A range of 16 postscale options (from 1:1 through 1:16
inclusive) can be selected with the postscaler control
bits, T2OUTPS<3:0>, of the T2CON register.
22.3 Timer2 Output
The unscaled output of TMR2 is available primarily to
the CCP1 module, where it is used as a time base for
operations in PWM mode.
Timer2 can be optionally used as the shift clock source
for the MSSP1 module operating in SPI mode.
Additional information is provided in Section 25.1
“Master SSP (MSSP1) Module Overview”
22.4 Timer2 Operation During Sleep
Timer2 cannot be operated while the processor is in
Sleep mode. The contents of the TMR2 and PR2
registers will remain unchanged while the processor is
in Sleep mode.
Note: TMR2 is not cleared when T2CON is
written.
2011-2015 Microchip Technology Inc. DS40001441F-page 159
PIC12(L)F1840
22.5 Register Definitions: Timer2 Control
REGISTER 22-1: T2CON: TIMER2 CONTROL REGISTER
U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
— T2OUTPS<3:0> TMR2ON T2CKPS<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 Unimplemented: Read as ‘0’
bit 6-3 T2OUTPS<3:0>: Timer Output Postscaler Select bits
1111 = 1:16 Postscaler
1110 = 1:15 Postscaler
1101 = 1:14 Postscaler
1100 = 1:13 Postscaler
1011 = 1:12 Postscaler
1010 = 1:11 Postscaler
1001 = 1:10 Postscaler
1000 = 1:9 Postscaler
0111 = 1:8 Postscaler
0110 = 1:7 Postscaler
0101 = 1:6 Postscaler
0100 = 1:5 Postscaler
0011 = 1:4 Postscaler
0010 = 1:3 Postscaler
0001 = 1:2 Postscaler
0000 = 1:1 Postscaler
bit 2 TMR2ON: Timer2 On bit
1 = Timer2 is on
0 = Timer2 is off
bit 1-0 T2CKPS<1:0>: Timer2 Clock Prescale Select bits
11 = Prescaler is 64
10 = Prescaler is 16
01 =Prescaler is 4
00 =Prescaler is 1
PIC12(L)F1840
DS40001441F-page 160 2011-2015 Microchip Technology Inc.
TABLE 22-1: SUMMARY OF REGISTERS ASSOCIATED WITH TIMER2
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PR2 Timer2 Module Period Register 157*
T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 159
TMR2 Holding Register for the 8-bit TMR2 Register 157*
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Timer2 module.
* Page provides register information.
2011-2015 Microchip Technology Inc. DS40001441F-page 161
PIC12(L)F1840
23.0 DATA SIGNAL MODULATOR
The Data Signal Modulator (DSM) is a peripheral which
allows the user to mix a data stream, also known as a
modulator signal, with a carrier signal to produce a
modulated output.
Both the carrier and the modulator signals are supplied
to the DSM module either internally, from the output of
a peripheral, or externally through an input pin.
The modulated output signal is generated by
performing a logical “AND” operation of both the carrier
and modulator signals and then provided to the MDOUT
pin.
The carrier signal is comprised of two distinct and
separate signals. A carrier high (CARH) signal and a
carrier low (CARL) signal. During the time in which the
modulator (MOD) signal is in a logic high state, the
DSM mixes the carrier high signal with the modulator
signal. When the modulator signal is in a logic low
state, the DSM mixes the carrier low signal with the
modulator signal.
Using this method, the DSM can generate the following
types of Key Modulation schemes:
• Frequency-Shift Keying (FSK)
• Phase-Shift Keying (PSK)
• On-Off Keying (OOK)
Additionally, the following features are provided within
the DSM module:
• Carrier Synchronization
• Carrier Source Polarity Select
• Carrier Source Pin Disable
• Programmable Modulator Data
• Modulator Source Pin Disable
• Modulated Output Polarity Select
• Slew Rate Control
Figure 23-1 shows a Simplified Block Diagram of the
Data Signal Modulator peripheral.
\WW FHHHHHW‘ r HW‘ ‘
PIC12(L)F1840
DS40001441F-page 162 2011-2015 Microchip Technology Inc.
FIGURE 23-1: SIMPLIFIED BLOCK DIAGRAM OF THE DATA SIGNAL MODULATOR
D
Q
MDBIT
MDMIN
CCP1
Reserved
Reserved
Reserved
Comparator C1
Reserved
Reserved
0000
0001
0010
0011
0100
0101
0110
0111
1000
0011
1001
1010
No Channel
Selected
VSS
MDCIN1
MDCIN2
CLKR
CCP1
Reserved
0000
0001
0010
0011
0100
0101
1111
*
*
No Channel
Selected
VSS
MDCIN1
MDCIN2
CLKR
CCP1
Reserved
0000
0001
0010
0011
0100
0101
1111
No Channel
Selected
MDCH<3:0>
MDMS<3:0>
MDCL<3:0>
1111
*
*
MSSP1 SDO1
Reserved
EUSART
SYNC
MDCHPOL
MDCLPOL
D
Q1
0
SYNC
1
0
MDCHSYNC
MDCLSYNC
MDOUT
MDOPOL
CARH
CARL
EN
MDEN
Data Signal
Modulator
MOD
MDOE
*
*
*
*
2011-2015 Microchip Technology Inc. DS40001441F-page 163
PIC12(L)F1840
23.1 DSM Operation
The DSM module can be enabled by setting the MDEN
bit in the MDCON register. Clearing the MDEN bit in the
MDCON register, disables the DSM module by auto-
matically switching the carrier high and carrier low sig-
nals to the VSS signal source. The modulator signal
source is also switched to the MDBIT in the MDCON
register. This not only assures that the DSM module is
inactive, but that it is also consuming the least amount
of current.
The values used to select the carrier high, carrier low,
and modulator sources held by the Modulation Source,
Modulation High Carrier, and Modulation Low Carrier
control registers are not affected when the MDEN bit is
cleared and the DSM module is disabled. The values
inside these registers remain unchanged while the
DSM is inactive. The sources for the carrier high, car-
rier low and modulator signals will once again be
selected when the MDEN bit is set and the DSM
module is again enabled and active.
The modulated output signal can be disabled without
shutting down the DSM module. The DSM module will
remain active and continue to mix signals, but the out-
put value will not be sent to the MDOUT pin. During the
time that the output is disabled, the MDOUT pin will
remain low. The modulated output can be disabled by
clearing the MDOE bit in the MDCON register.
23.2 Modulator Signal Sources
The modulator signal can be supplied from the
following sources:
• CCP1 Signal
• MSSP1 SDO1 Signal (SPI mode only)
• Comparator C1 Signal
• EUSART TX Signal
• External Signal on MDMIN pin
• MDBIT bit in the MDCON register
The modulator signal is selected by configuring the
MDMS <3:0> bits in the MDSRC register.
23.3 Carrier Signal Sources
The carrier high signal and carrier low signal can be
supplied from the following sources:
• CCP1 Signal
• Reference Clock Module Signal
• External Signal on MDCIN1 pin
• External Signal on MDCIN2 pin
•V
SS
The carrier high signal is selected by configuring the
MDCH <3:0> bits in the MDCARH register. The carrier
low signal is selected by configuring the MDCL <3:0>
bits in the MDCARL register.
23.4 Carrier Synchronization
During the time when the DSM switches between
carrier high and carrier low signal sources, the carrier
data in the modulated output signal can become
truncated. To prevent this, the carrier signal can be
synchronized to the modulator signal. When
synchronization is enabled, the carrier pulse that is
being mixed at the time of the transition is allowed to
transition low before the DSM switches over to the next
carrier source.
Synchronization is enabled separately for the carrier
high and carrier low signal sources. Synchronization for
the carrier high signal can be enabled by setting the
MDCHSYNC bit in the MDCARH register.
Synchronization for the carrier low signal can be
enabled by setting the MDCLSYNC bit in the MDCARL
register.
Figure 23-1 through Figure 23-5 show timing diagrams
of using various synchronization methods.
PIC12(L)F1840
DS40001441F-page 164 2011-2015 Microchip Technology Inc.
FIGURE 23-2: ON OFF KEYING (OOK) SYNCHRONIZATION
EXAMPLE 23-1: NO SYNCHRONIZATION (MDSHSYNC = 0, MDCLSYNC = 0)
FIGURE 23-3: CARRIER HIGH SYNCHRONIZATION (MDSHSYNC = 1, MDCLSYNC = 0)
Carrier Low (CARL)
MDCHSYNC = 1
MDCLSYNC = 0
MDCHSYNC = 1
MDCLSYNC = 1
MDCHSYNC = 0
MDCLSYNC = 0
MDCHSYNC = 0
MDCLSYNC = 1
Carrier High (CARH)
Modulator (MOD)
MDCHSYNC = 0
MDCLSYNC = 0
Modulator (MOD)
Carrier High (CARH)
Carrier Low (CARL)
Active Carrier CARH CARL CARL
CARH
State
MDCHSYNC = 1
MDCLSYNC = 0
Modulator (MOD)
Carrier High (CARH)
Carrier Low (CARL)
Active Carrier
CARH CARL CARL
CARH
State
both both
2011-2015 Microchip Technology Inc. DS40001441F-page 165
PIC12(L)F1840
FIGURE 23-4: CARRIER LOW SYNCHRONIZATION (MDSHSYNC = 0, MDCLSYNC = 1)
FIGURE 23-5: FULL SYNCHRONIZATION (MDSHSYNC = 1, MDCLSYNC = 1)
MDCHSYNC = 0
MDCLSYNC = 1
Modulator (MOD)
Carrier High (CARH)
Carrier Low (CARL)
Active Carrier CARH CARL CARL
CARH
State
MDCHSYNC = 1
MDCLSYNC = 1
Modulator (MOD)
Carrier High (CARH)
Carrier Low (CARL)
Active Carrier CARH CARL CARL
CARH
State
Falling edges
used to sync
PIC12(L)F1840
DS40001441F-page 166 2011-2015 Microchip Technology Inc.
23.5 Carrier Source Polarity Select
The signal provided from any selected input source for
the carrier high and carrier low signals can be inverted.
Inverting the signal for the carrier high source is
enabled by setting the MDCHPOL bit of the MDCARH
register. Inverting the signal for the carrier low source is
enabled by setting the MDCLPOL bit of the MDCARL
register.
23.6 Carrier Source Pin Disable
Some peripherals assert control over their
corresponding output pin when they are enabled. For
example, when the CCP1 module is enabled, the
output of CCP1 is connected to the CCP1 pin.
This default connection to a pin can be disabled by
setting the MDCHODIS bit in the MDCARH register for
the carrier high source and the MDCLODIS bit in the
MDCARL register for the carrier low source.
23.7 Programmable Modulator Data
The MDBIT of the MDCON register can be selected as
the source for the modulator signal. This gives the user
the ability to program the value used for modulation.
23.8 Modulator Source Pin Disable
The modulator source default connection to a pin can
be disabled by setting the MDMSODIS bit in the
MDSRC register.
23.9 Modulated Output Polarity
The modulated output signal provided on the MDOUT
pin can also be inverted. Inverting the modulated
output signal is enabled by setting the MDOPOL bit of
the MDCON register.
23.10 Slew Rate Control
The slew rate limitation on the output port pin can be
disabled. The slew rate limitation can be removed by
clearing the MDSLR bit in the MDCON register.
23.11 Operation in Sleep Mode
The DSM module is not affected by Sleep mode. The
DSM can still operate during Sleep, if the Carrier and
Modulator input sources are also still operable during
Sleep.
23.12 Effects of a Reset
Upon any device Reset, the DSM module is disabled.
The user’s firmware is responsible for initializing the
module before enabling the output. The registers are
reset to their default values.
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PIC12(L)F1840
23.13 Register Definitions: Modulation Control
REGISTER 23-1: MDCON: MODULATION CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-1/1 R/W-0/0 R-0/0 U-0 U-0 R/W-0/0
MDEN MDOE MDSLR MDOPOL MDOUT ——MDBIT
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 MDEN: Modulator Module Enable bit
1 = Modulator module is enabled and mixing input signals
0 = Modulator module is disabled and has no output
bit 6 MDOE: Modulator Module Pin Output Enable bit
1 = Modulator pin output enabled
0 = Modulator pin output disabled
bit 5 MDSLR: MDOUT Pin Slew Rate Limiting bit
1 = MDOUT pin slew rate limiting enabled
0 = MDOUT pin slew rate limiting disabled
bit 4 MDOPOL: Modulator Output Polarity Select bit
1 = Modulator output signal is inverted
0 = Modulator output signal is not inverted
bit 3 MDOUT: Modulator Output bit
Displays the current output value of the Modulator module.(1)
bit 2-1 Unimplemented: Read as ‘0’
bit 0 MDBIT: Allows software to manually set modulation source input to module(2)
1 = Modulator uses High Carrier source
0 = Modulator uses Low Carrier source
Note 1: The modulated output frequency can be greater and asynchronous from the clock that updates this
register bit, the bit value may not be valid for higher speed modulator or carrier signals.
2: MDBIT must be selected as the modulation source in the MDSRC register for this operation.
PIC12(L)F1840
DS40001441F-page 168 2011-2015 Microchip Technology Inc.
REGISTER 23-2: MDSRC: MODULATION SOURCE CONTROL REGISTER
R/W-x/u U-0 U-0 U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u
MDMSODIS — — —MDMS<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 MDMSODIS: Modulation Source Output Disable bit
1 = Output signal driving the peripheral output pin (selected by MDMS<3:0>) is disabled
0 = Output signal driving the peripheral output pin (selected by MDMS<3:0>) is enabled
bit 6-4 Unimplemented: Read as ‘0’
bit 3-0 MDMS<3:0> Modulation Source Selection bits
1111 = Reserved. No channel connected.
1110 = Reserved. No channel connected.
1101 = Reserved. No channel connected.
1100 = Reserved. No channel connected.
1011 = Reserved. No channel connected.
1010 = EUSART TX output.
1001 = Reserved. No channel connected.
1000 = MSSP1 SDO output
0111 = Reserved. No channel connected.
0110 = Comparator 1 output
0101 = Reserved. No channel connected.
0100 = Reserved. No channel connected.
0011 = Reserved. No channel connected.
0010 = CCP1 output (PWM Output mode only)
0001 = MDMIN port pin
0000 = MDBIT bit of MDCON register is modulation source
2011-2015 Microchip Technology Inc. DS40001441F-page 169
PIC12(L)F1840
REGISTER 23-3: MDCARH: MODULATION HIGH CARRIER CONTROL REGISTER
R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u
MDCHODIS MDCHPOL MDCHSYNC — MDCH<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 MDCHODIS: Modulator High Carrier Output Disable bit
1 = Output signal driving the peripheral output pin (selected by MDCH<3:0>) is disabled
0 = Output signal driving the peripheral output pin (selected by MDCH<3:0>) is enabled
bit 6 MDCHPOL: Modulator High Carrier Polarity Select bit
1 = Selected high carrier signal is inverted
0 = Selected high carrier signal is not inverted
bit 5 MDCHSYNC: Modulator High Carrier Synchronization Enable bit
1 = Modulator waits for a falling edge on the high time carrier signal before allowing a switch to the
low time carrier
0 = Modulator Output is not synchronized to the high time carrier signal(1)
bit 4 Unimplemented: Read as ‘0’
bit 3-0 MDCH<3:0> Modulator Data High Carrier Selection bits (1)
1111 = Reserved. No channel connected.
•
•
•
0101 = Reserved. No channel connected.
0100 = CCP1 output (PWM Output mode only)
0011 = Reference Clock module signal (CLKR)
0010 = MDCIN2 port pin
0001 = MDCIN1 port pin
0000 =V
SS
Note 1: Narrowed carrier pulse widths or spurs may occur in the signal stream if the carrier is not synchronized.
M ARH MD HF L MD H YN MDCH<3.0>
PIC12(L)F1840
DS40001441F-page 170 2011-2015 Microchip Technology Inc.
TABLE 23-1: SUMMARY OF REGISTERS ASSOCIATED WITH DATA SIGNAL MODULATOR MODE
REGISTER 23-4: MDCARL: MODULATION LOW CARRIER CONTROL REGISTER
R/W-x/u R/W-x/u R/W-x/u U-0 R/W-x/u R/W-x/u R/W-x/u R/W-x/u
MDCLODIS MDCLPOL MDCLSYNC — MDCL<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 MDCLODIS: Modulator Low Carrier Output Disable bit
1 = Output signal driving the peripheral output pin (selected by MDCL<3:0> of the MDCARL register)
is disabled
0 = Output signal driving the peripheral output pin (selected by MDCL<3:0> of the MDCARL register)
is enabled
bit 6 MDCLPOL: Modulator Low Carrier Polarity Select bit
1 = Selected low carrier signal is inverted
0 = Selected low carrier signal is not inverted
bit 5 MDCLSYNC: Modulator Low Carrier Synchronization Enable bit
1 = Modulator waits for a falling edge on the low time carrier signal before allowing a switch to the high
time carrier
0 = Modulator Output is not synchronized to the low time carrier signal(1)
bit 4 Unimplemented: Read as ‘0’
bit 3-0 MDCL<3:0> Modulator Data High Carrier Selection bits (1)
1111 = Reserved. No channel connected.
•
•
•
0101 = Reserved. No channel connected.
0100 = CCP1 output (PWM Output mode only)
0011 = Reference Clock module signal
0010 = Reserved. No channel connected.
0001 = MDCIN1 port pin
0000 =V
SS
Note 1: Narrowed carrier pulse widths or spurs may occur in the signal stream if the carrier is not synchronized.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
MDCARH MDCHODIS MDCHPOL MDCHSYNC —
MDCH<3:0>
169
MDCARL MDCLODIS MDCLPOL MDCLSYNC —
MDCL<3:0>
170
MDCON MDEN MDOE MDSLR MDOPOL MDOUT — —
MDBIT
167
MDSRC MDMSODIS — — —
MDMS<3:0>
168
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used in the Data Signal Modulator mode.
2011-2015 Microchip Technology Inc. DS40001441F-page 171
PIC12(L)F1840
24.0 CAPTURE/COMPARE/PWM
MODULES
The Capture/Compare/PWM module is a peripheral
which allows the user to time and control different
events, and to generate Pulse-Width Modulation
(PWM) signals. In Capture mode, the peripheral allows
the timing of the duration of an event. The Compare
mode allows the user to trigger an external event when
a predetermined amount of time has expired. The
PWM mode can generate Pulse-Width Modulated
signals of varying frequency and duty cycle.
This device contains one Enhanced Capture/Compare/
PWM module (ECCP1).
The Half-Bridge ECCP module has two available I/O
pins. See Table 24-1.
TABLE 24-1: PWM RESOURCES
Device Name ECCP1
PIC12(L)F1840 Enhanced PWM Half-Bridge
condihon.
PIC12(L)F1840
DS40001441F-page 172 2011-2015 Microchip Technology Inc.
24.1 Capture Mode
Capture mode makes use of the 16-bit Timer1
resource. When an event occurs on the CCP1 pin, the
16-bit CCPR1H:CCPR1L register pair captures and
stores the 16-bit value of the TMR1H:TMR1L register
pair, respectively. An event is defined as one of the
following and is configured by the CCP1M<3:0> bits of
the CCP1CON register:
• Every falling edge
• Every rising edge
• Every 4th rising edge
• Every 16th rising edge
When a capture is made, the Interrupt Request Flag bit
CCP1IF of the PIR1 register is set. The interrupt flag
must be cleared in software. If another capture occurs
before the value in the CCPR1H, CCPR1L register pair
is read, the old captured value is overwritten by the new
captured value.
Figure 24-1 shows a simplified diagram of the Capture
operation.
24.1.1 CCP1 PIN CONFIGURATION
In Capture mode, the CCP1 pin should be configured
as an input by setting the associated TRIS control bit.
Also, the CCP1 pin function can be moved to
alternative pins using the APFCON register. Refer to
Section 12.1 “Alternate Pin Function” for more
details.
FIGURE 24-1: CAPTURE MODE
OPERATION BLOCK
DIAGRAM
24.1.2 TIMER1 MODE RESOURCE
Timer1 must be running in Timer mode or Synchronized
Counter mode for the CCP1 module to use the capture
feature. In Asynchronous Counter mode, the capture
operation may not work.
See Section 21.0 “Timer1 Module with Gate Control”
for more information on configuring Timer1.
24.1.3 SOFTWARE INTERRUPT MODE
When the Capture mode is changed, a false capture
interrupt may be generated. The user should keep the
CCP1IE interrupt enable bit of the PIE1 register clear to
avoid false interrupts. Additionally, the user should
clear the CCP1IF interrupt flag bit of the PIR1 register
following any change in Operating mode.
24.1.4 CCP1 PRESCALER
There are four prescaler settings specified by the
CCP1M<3:0> bits of the CCP1CON register.
Whenever the CCP1 module is turned off, or the CCP1
module is not in Capture mode, the prescaler counter
is cleared. Any Reset will clear the prescaler counter.
Switching from one capture prescaler to another does not
clear the prescaler and may generate a false interrupt. To
avoid this unexpected operation, turn the module off by
clearing the CCP1CON register before changing the
prescaler. Example 24-1 demonstrates the code to
perform this function.
EXAMPLE 24-1: CHANGING BETWEEN
CAPTURE PRESCALERS
Note: If the CCP1 pin is configured as an output,
a write to the port can cause a capture
condition.
CCPR1H CCPR1L
TMR1H TMR1L
Set Flag bit CCP1IF
(PIR1 register)
Capture
Enable
CCP1M<3:0>
Prescaler
1, 4, 16
and
Edge Detect
pin
CCP1
System Clock (FOSC)
Note: Clocking Timer1 from the system clock
(FOSC) should not be used in Capture
mode. In order for Capture mode to
recognize the trigger event on the CCP1
pin, Timer1 must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
BANKSEL CCP1CON ;Set Bank bits to point
;to CCP1CON
CLRF CCP1CON ;Turn CCP1 module off
MOVLW NEW_CAPT_PS ;Load the W reg with
;the new prescaler
;move value and CCP1 ON
MOVWF CCP1CON ;Load CCP1CON with this
;value
TWSYNC
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PIC12(L)F1840
24.1.5 CAPTURE DURING SLEEP
Capture mode depends upon the Timer1 module for
proper operation. There are two options for driving the
Timer1 module in Capture mode. It can be driven by the
instruction clock (FOSC/4), or by an external clock source.
When Timer1 is clocked by FOSC/4, Timer1 will not
increment during Sleep. When the device wakes from
Sleep, Timer1 will continue from its previous state.
Capture mode will operate during Sleep when Timer1
is clocked by an external clock source.
24.1.6 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
reset, see Section 12.1 “Alternate Pin Function” for
more information.
TABLE 24-2: SUMMARY OF REGISTERS ASSOCIATED WITH CAPTURE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON RXDTSEL SDOSEL SSSEL —T1GSEL TXCKSEL P1BSEL CCP1SEL 99
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) 172
CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) 172
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIE2 OSFIE —C1IE EEIE BCL1IE — — — 74
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PIR2 OSFIF —C1IF EEIF BCL1IF — — —76
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON154
T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 155
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 150*
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 150*
TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Capture mode.
* Page provides register information.
dala lamh prec‘ude :he Rese: from occurring.
PIC12(L)F1840
DS40001441F-page 174 2011-2015 Microchip Technology Inc.
24.2 Compare Mode
Compare mode makes use of the 16-bit Timer1
resource. The 16-bit value of the CCPR1H:CCPR1L
register pair is constantly compared against the 16-bit
value of the TMR1H:TMR1L register pair. When a
match occurs, one of the following events can occur:
• Toggle the CCP1 output
• Set the CCP1 output
• Clear the CCP1 output
• Generate a Special Event Trigger
• Generate a Software Interrupt
The action on the pin is based on the value of the
CCP1M<3:0> control bits of the CCP1CON register. At
the same time, the interrupt flag CCP1IF bit is set.
All Compare modes can generate an interrupt.
Figure 24-2 shows a simplified diagram of the
Compare operation.
FIGURE 24-2: COMPARE MODE
OPERATION BLOCK
DIAGRAM
24.2.1 CCP1 PIN CONFIGURATION
The user must configure the CCP1 pin as an output by
clearing the associated TRIS bit.
Also, the CCP1 pin function can be moved to
alternative pins using the APFCON register. Refer to
Section 12.1 “Alternate Pin Function” for more
details.
24.2.2 TIMER1 MODE RESOURCE
In Compare mode, Timer1 must be running in either
Timer mode or Synchronized Counter mode. The
compare operation may not work in Asynchronous
Counter mode.
See Section 21.0 “Timer1 Module with Gate Control”
for more information on configuring Timer1.
24.2.3 SOFTWARE INTERRUPT MODE
When Generate Software Interrupt mode is chosen
(CCP1M<3:0> = 1010), the CCP1 module does not
assert control of the CCP1 pin (see the CCP1CON
register).
24.2.4 SPECIAL EVENT TRIGGER
When Special Event Trigger mode is chosen
(CCP1M<3:0> = 1011), the CCP1 module does the
following:
• Resets Timer1
• Starts an ADC conversion if ADC is enabled
The CCP1 module does not assert control of the CCP1
pin in this mode.
The Special Event Trigger output of the CCP1 occurs
immediately upon a match between the TMR1H,
TMR1L register pair and the CCPR1H, CCPR1L
register pair. The TMR1H, TMR1L register pair is not
reset until the next rising edge of the Timer1 clock. The
Special Event Trigger output starts an ADC conversion
(if the ADC module is enabled). This allows the
CCPR1H, CCPR1L register pair to effectively provide a
16-bit programmable period register for Timer1.
24.2.5 COMPARE DURING SLEEP
The Compare mode is dependent upon the system
clock (FOSC) for proper operation. Since FOSC is shut
down during Sleep mode, the Compare mode will not
function properly during Sleep.
Note: Clearing the CCP1CON register will force
the CCP1 compare output latch to the
default low level. This is not the PORT I/O
data latch.
CCPR1H CCPR1L
TMR1H TMR1L
Comparator
QS
R
Output
Logic
Special Event Trigger
Set CCP1IF Interrupt Flag
(PIR1)
Match
TRIS
CCP1M<3:0>
Mode Select
Output Enable
Pin
CCP1
4
Note: Clocking Timer1 from the system clock
(FOSC) should not be used in Capture
mode. In order for Capture mode to
recognize the trigger event on the CCP1
pin, TImer1 must be clocked from the
instruction clock (FOSC/4) or from an
external clock source.
Note 1: The Special Event Trigger from the CCP1
module does not set interrupt flag bit
TMR1IF of the PIR1 register.
2: Removing the match condition by
changing the contents of the CCPR1H
and CCPR1L register pair, between the
clock edge that generates the Special
Event Trigger and the clock edge that
generates the Timer1 Reset, will
preclude the Reset from occurring.
TWSYNC
2011-2015 Microchip Technology Inc. DS40001441F-page 175
PIC12(L)F1840
24.2.6 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
reset, see Section 12.1 “Alternate Pin Function” for
more information.
TABLE 24-3: SUMMARY OF REGISTERS ASSOCIATED WITH COMPARE
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON RXDTSEL SDOSEL SSSEL —T1GSEL TXCKSEL P1BSEL CCP1SEL 99
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
CCPR1L Capture/Compare/PWM Register 1 Low Byte (LSB) 172
CCPR1H Capture/Compare/PWM Register 1 High Byte (MSB) 172
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIE2 OSFIE —C1IE EEIE BCL1IE — — — 74
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PIR2 OSFIF —C1IF EEIF BCL1IF — — — 76
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON154
T1GCON TMR1GE T1GPOL T1GTM T1GSPM T1GGO/DONE T1GVAL T1GSS<1:0> 155
TMR1L Holding Register for the Least Significant Byte of the 16-bit TMR1 Register 150*
TMR1H Holding Register for the Most Significant Byte of the 16-bit TMR1 Register 150*
TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by Compare mode.
* Page provides register information.
W
PIC12(L)F1840
DS40001441F-page 176 2011-2015 Microchip Technology Inc.
24.3 PWM Overview
Pulse-Width Modulation (PWM) is a scheme that
provides power to a load by switching quickly between
fully on and fully off states. The PWM signal resembles
a square wave where the high portion of the signal is
considered the on state and the low portion of the signal
is considered the off state. The high portion, also known
as the pulse width, can vary in time and is defined in
steps. A larger number of steps applied, which
lengthens the pulse width, also supplies more power to
the load. Lowering the number of steps applied, which
shortens the pulse width, supplies less power. The
PWM period is defined as the duration of one complete
cycle or the total amount of on and off time combined.
PWM resolution defines the maximum number of steps
that can be present in a single PWM period. A higher
resolution allows for more precise control of the pulse
width time and in turn the power that is applied to the
load.
The term duty cycle describes the proportion of the on
time to the off time and is expressed in percentages,
where 0% is fully off and 100% is fully on. A lower duty
cycle corresponds to less power applied and a higher
duty cycle corresponds to more power applied.
Figure 24-3 shows a typical waveform of the PWM
signal.
24.3.1 STANDARD PWM OPERATION
The standard PWM mode generates a Pulse-Width
Modulation (PWM) signal on the CCP1 pin with up to 10
bits of resolution. The period, duty cycle, and resolution
are controlled by the following registers:
• PR2 registers
• T2CON registers
• CCPR1L registers
• CCP1CON registers
Figure 24-4 shows a simplified block diagram of PWM
operation.
FIGURE 24-3: CCP1 PWM OUTPUT
SIGNAL
FIGURE 24-4: SIMPLIFIED PWM BLOCK
DIAGRAM
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCP1 pin.
2: Clearing the CCP1CON register will
relinquish control of the CCP1 pin.
Period
Pulse Width
TMR2 = 0
TMR2 = CCPR1H:CCP1CON<5:4>
TMR2 = PR2
CCPR1L
CCPR1H(2) (Slave)
Comparator
TMR2
PR2
(1)
RQ
S
Duty Cycle Registers CCP1CON<5:4>
Clear Timer,
toggle CCP1 pin and
latch duty cycle
Note 1: The 8-bit timer TMR2 register is concatenated
with the 2-bit internal system clock (FOSC), or
2 bits of the prescaler, to create the 10-bit time
base.
2: In PWM mode, CCPR1H is a read-only register.
TRIS
CCP1
Comparator
determma‘ion loe PWM frequency.
2011-2015 Microchip Technology Inc. DS40001441F-page 177
PIC12(L)F1840
24.3.2 SETUP FOR PWM OPERATION
The following steps should be taken when configuring
the CCP1 module for standard PWM operation:
1. Disable the CCP1 pin output driver by setting
the associated TRIS bit.
2. Load the PR2 register with the PWM period
value.
3. Configure the CCP1 module for the PWM mode
by loading the CCP1CON register with the
appropriate values.
4. Load the CCPR1L register and the DC1B1 bits
of the CCP1CON register, with the PWM duty
cycle value.
5. Configure and start Timer2:
• Clear the TMR2IF interrupt flag bit of the
PIR1 register. See Note below.
• Configure the T2CKPS bits of the T2CON
register with the Timer prescale value.
• Enable the Timer by setting the TMR2ON
bit of the T2CON register.
6. Enable PWM output pin:
• Wait until the Timer overflows and the
TMR2IF bit of the PIR1 register is set. See
Note below.
• Enable the CCP1 pin output driver by
clearing the associated TRIS bit.
24.3.3 PWM PERIOD
The PWM period is specified by the PR2 register of
Timer2. The PWM period can be calculated using the
formula of Equation 24-1.
EQUATION 24-1: PWM PERIOD
When TMR2 is equal to PR2, the following three events
occur on the next increment cycle:
•TMR2 is cleared
• The CCP1 pin is set. (Exception: If the PWM duty
cycle = 0%, the pin will not be set.)
• The PWM duty cycle is latched from CCPR1L into
CCPR1H.
24.3.4 PWM DUTY CYCLE
The PWM duty cycle is specified by writing a 10-bit
value to multiple registers: CCPR1L register and
DC1B<1:0> bits of the CCP1CON register. The
CCPR1L contains the eight MSbs and the DC1B<1:0>
bits of the CCP1CON register contain the two LSbs.
CCPR1L and DC1B<1:0> bits of the CCP1CON
register can be written to at any time. The duty cycle
value is not latched into CCPR1H until after the period
completes (i.e., a match between PR2 and TMR2
registers occurs). While using the PWM, the CCPR1H
register is read-only.
Equation 24-2 is used to calculate the PWM pulse
width.
Equation 24-3 is used to calculate the PWM duty cycle
ratio.
EQUATION 24-2: PULSE WIDTH
EQUATION 24-3: DUTY CYCLE RATIO
The CCPR1H register and a 2-bit internal latch are
used to double buffer the PWM duty cycle. This double
buffering is essential for glitchless PWM operation.
The 8-bit timer TMR2 register is concatenated with
either the 2-bit internal system clock (FOSC), or 2 bits of
the prescaler, to create the 10-bit time base. The system
clock is used if the Timer2 prescaler is set to 1:1.
When the 10-bit time base matches the CCPR1H and
2-bit latch, then the CCP1 pin is cleared (see
Figure 24-4).
Note: In order to send a complete duty cycle and
period on the first PWM output, the above
steps must be included in the setup
sequence. If it is not critical to start with a
complete PWM signal on the first output,
then step 6 may be ignored.
PWM Period PR21+4TOSC =
(TMR2 Prescale Value)
Note 1: TOSC = 1/FOSC
Note: The Timer postscaler (see Section 22.1
“Timer2 Operation”) is not used in the
determination of the PWM frequency.
Pulse Width CCPR1L:CCP1CON<5:4>
=
TOSC
(TMR2 Prescale Value)
Duty Cycle Ratio CCPR1L:CCP1CON<5:4>
4PR21+
-----------------------------------------------------------------------=
remain unchanged.
PIC12(L)F1840
DS40001441F-page 178 2011-2015 Microchip Technology Inc.
24.3.5 PWM RESOLUTION
The resolution determines the number of available duty
cycles for a given period. For example, a 10-bit resolution
will result in 1024 discrete duty cycles, whereas an 8-bit
resolution will result in 256 discrete duty cycles.
The maximum PWM resolution is ten bits when PR2 is
255. The resolution is a function of the PR2 register
value as shown by Equation 24-4.
EQUATION 24-4: PWM RESOLUTION
TABLE 24-4: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 32 MHz)
TABLE 24-5: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 20 MHz)
TABLE 24-6: EXAMPLE PWM FREQUENCIES AND RESOLUTIONS (FOSC = 8 MHz)
Note: If the pulse width value is greater than the
period the assigned PWM pin(s) will
remain unchanged.
Resolution 4PR21+log
2log
------------------------------------------ bits=
PWM Frequency 1.95 kHz 7.81 kHz 31.25 kHz 125 kHz 250 kHz 333.3 kHz
Timer Prescale 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.88 kHz 19.53 kHz 78.12 kHz 156.3 kHz 208.3 kHz
Timer Prescale 16 4 1 1 1 1
PR2 Value 0xFF 0xFF 0xFF 0x3F 0x1F 0x17
Maximum Resolution (bits) 10 10 10 8 7 6.6
PWM Frequency 1.22 kHz 4.90 kHz 19.61 kHz 76.92 kHz 153.85 kHz 200.0 kHz
Timer Prescale 16 4 1 1 1 1
PR2 Value 0x65 0x65 0x65 0x19 0x0C 0x09
Maximum Resolution (bits) 8 8 8 6 5 5
2011-2015 Microchip Technology Inc. DS40001441F-page 179
PIC12(L)F1840
24.3.6 OPERATION IN SLEEP MODE
In Sleep mode, the TMR2 register will not increment
and the state of the module will not change. If the CCP1
pin is driving a value, it will continue to drive that value.
When the device wakes up, TMR2 will continue from its
previous state.
24.3.7 CHANGES IN SYSTEM CLOCK
FREQUENCY
The PWM frequency is derived from the system clock
frequency. Any changes in the system clock frequency
will result in changes to the PWM frequency. See
Section 5.0 “Oscillator Module (with Fail-Safe
Clock Monitor)” for additional details.
24.3.8 EFFECTS OF RESET
Any Reset will force all ports to Input mode and the
CCP registers to their Reset states.
24.3.9 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
reset, see Section 12.1 “Alternate Pin Function” for
more information.
TABLE 24-7: SUMMARY OF REGISTERS ASSOCIATED WITH STANDARD PWM
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON RXDTSEL SDOSEL SSSEL —T1GSEL TXCKSEL P1BSEL CCP1SEL 99
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PR2 Timer2 Period Register 157*
T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 159
TMR2 Timer2 Module Register 157
TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM.
* Page provides register information.
(E?
PIC12(L)F1840
DS40001441F-page 180 2011-2015 Microchip Technology Inc.
24.4 PWM (Enhanced Mode)
The enhanced PWM mode generates a Pulse-Width
Modulation (PWM) signal on up to two different output
pins with up to ten bits of resolution. The period, duty
cycle, and resolution are controlled by the following
registers:
• PR2 registers
• T2CON registers
• CCPR1L registers
• CCP1CON registers
The ECCP modules have the following additional PWM
registers which control Auto-shutdown, Auto-restart,
Dead-band Delay and PWM Steering modes:
• CCP1AS registers
• PSTR1CON registers
• PWM1CON registers
The enhanced PWM module can generate the following
three PWM Output modes:
• Single PWM
• Half-Bridge PWM
• Single PWM with PWM Steering Mode
To select an Enhanced PWM Output mode, the P1M bits
of the CCP1CON register must be configured
appropriately.
The PWM outputs are multiplexed with I/O pins and are
designated P1A and P1B. The polarity of the PWM pins
is configurable and is selected by setting the bits
CCP1M<3:0> in the CCP1CON register appropriately.
Figure 24-5 shows an example of a simplified block
diagram of the Enhanced PWM module.
Table 24-8 shows the pin assignments for various
Enhanced PWM modes.
FIGURE 24-5: EXAMPLE SIMPLIFIED BLOCK DIAGRAM OF THE ENHANCED PWM MODE
Note 1: The corresponding TRIS bit must be
cleared to enable the PWM output on the
CCP1 pin.
2: Clearing the CCP1CON register will
relinquish control of the CCP1 pin.
3: Any pin not used in the enhanced PWM
mode is available for alternate pin
functions, if applicable.
4: To prevent the generation of an
incomplete waveform when the PWM is
first enabled, the ECCP module waits
until the start of a new PWM period
before generating a PWM signal.
CCPR1L
CCPR1H (Slave)
Comparator
TMR2
Comparator
PR2
(1)
RQ
S
Duty Cycle Registers DC1B<1:0>
Clear Timer,
toggle PWM pin and
latch duty cycle
Note 1: The 8-bit timer TMR1 register is concatenated with the 2-bit internal Q clock, or 2 bits of the prescaler to create the 10-bit time
base.
TRISx
CCP1/P1A
TRISx
P1B
Output
Controller
P1M<1:0>
2
CCP1M<3:0>
4
PWM1CON
CCP1/P1A
P1B
E
2011-2015 Microchip Technology Inc. DS40001441F-page 181
PIC12(L)F1840
TABLE 24-8: EXAMPLE PIN ASSIGNMENTS FOR VARIOUS PWM ENHANCED MODES
FIGURE 24-6: EXAMPLE PWM (ENHANCED MODE) OUTPUT RELATIONSHIPS (ACTIVE-HIGH
STATE)
FIGURE 24-7: EXAMPLE ENHANCED PWM OUTPUT RELATIONSHIPS (ACTIVE-LOW STATE)
ECCP Mode P1M<1:0> CCP1/P1A P1B
Single 00 Yes(1) Yes (1)
Half-Bridge 10 Yes Yes
Note 1: PWM Steering enables outputs in Single mode.
0
Period
00
10
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
Pulse
Width
(Single Output)
(Half-Bridge)
Delay Delay
Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMRx Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMRx Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
0
Period
00
10
Signal PR2+1
P1M<1:0>
P1A Modulated
P1A Modulated
P1B Modulated
Pulse
Width
(Single Output)
(Half-Bridge) Delay Delay
Relationships:
• Period = 4 * TOSC * (PR2 + 1) * (TMRx Prescale Value)
• Pulse Width = TOSC * (CCPR1L<7:0>:CCP1CON<5:4>) * (TMRx Prescale Value)
• Delay = 4 * TOSC * (PWM1CON<6:0>)
V V
PIC12(L)F1840
DS40001441F-page 182 2011-2015 Microchip Technology Inc.
24.4.1 HALF-BRIDGE MODE
In Half-Bridge mode, two pins are used as outputs to
drive push-pull loads. The PWM output signal is output
on the CCP1/P1A pin, while the complementary PWM
output signal is output on the P1B pin (see Figure 24-9).
This mode can be used for Half-Bridge applications, as
shown in Figure 24-9, or for Full-Bridge applications,
where four power switches are being modulated with
two PWM signals.
In Half-Bridge mode, the programmable dead-band delay
can be used to prevent shoot-through current in Half-
Bridge power devices. The value of the P1DC<6:0> bits
of the PWM1CON register sets the number of instruction
cycles before the output is driven active. If the value is
greater than the duty cycle, the corresponding output
remains inactive during the entire cycle. See
Section 24.4.4 “Programmable Dead-Band Delay
Mode” for more details of the dead-band delay
operations.
Since the P1A and P1B outputs are multiplexed with
the PORT data latches, the associated TRIS bits must
be cleared to configure P1A and P1B as outputs.
FIGURE 24-8: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 24-9: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
Load
+
-
+
-
FET
Driver
FET
Driver
V+
Load
FET
Driver
FET
Driver
P1A
P1B
Standard Half-Bridge Circuit (“Push-Pull”)
Half-Bridge Output Driving a Full-Bridge Circuit
¢ ‘ 1—! 77777777777 l—\ L: f
2011-2015 Microchip Technology Inc. DS40001441F-page 183
PIC12(L)F1840
24.4.2 ENHANCED PWM AUTO-
SHUTDOWN MODE
The PWM mode supports an Auto-Shutdown mode that
will disable the PWM outputs when an external
shutdown event occurs. Auto-Shutdown mode places
the PWM output pins into a predetermined state. This
mode is used to help prevent the PWM from damaging
the application.
The auto-shutdown sources are selected using the
CCP1AS<2:0> bits of the CCP1AS register. A shutdown
event may be generated by:
•A logic ‘0’ on the FLT0 pin
• Comparator C1
• Setting the CCP1ASE bit in firmware
A shutdown condition is indicated by the CCP1ASE
(Auto-Shutdown Event Status) bit of the CCP1AS
register. If the bit is a ‘0’, the PWM pins are operating
normally. If the bit is a ‘1’, the PWM outputs are in the
shutdown state.
When a shutdown event occurs, two things happen:
The CCP1ASE bit is set to ‘1’. The CCP1ASE will
remain set until cleared in firmware or an auto-restart
occurs (see Section 24.4.3 “Auto-Restart Mode”).
The enabled PWM pins are asynchronously placed in
their shutdown states. The PWM output pins are
grouped into pairs [P1A] and [P1B. The state of each pin
pair is determined by the PSS1AC and PSS1BD bits of
the CCP1AS register. Each pin pair may be placed into
one of three states:
• Drive logic ‘1’
• Drive logic ‘0’
• Tri-state (high-impedance)
FIGURE 24-10: PWM AUTO-SHUTDOWN WITH FIRMWARE RESTART (P1RSEN = 0)
Note 1: The auto-shutdown condition is a level-
based signal, not an edge-based signal.
As long as the level is present, the auto-
shutdown will persist.
2: Writing to the CCP1ASE bit is disabled
while an auto-shutdown condition
persists.
3: Once the auto-shutdown condition has
been removed and the PWM restarted
(either through firmware or auto-restart)
the PWM signal will always restart at the
beginning of the next PWM period.
4: Prior to an auto-shutdown event caused
by a comparator output or FLT0 pin
event, a software shutdown can be
triggered in firmware by setting the
CCP1ASE bit of the CCP1AS register to
‘1’. The Auto-Restart feature tracks the
active status of a shutdown caused by a
comparator output or FLT0 pin event only.
If it is enabled at this time, it will immedi-
ately clear this bit and restart the ECCP
module at the beginning of the next PWM
period.
Shutdown
PWM
CCP1ASE bit
Activity
Event
Shutdown
Event Occurs Shutdown
Event Clears
PWM
Resumes
PWM Period
Start of
PWM Period
CCP1ASE
Cleared by
Firmware
Timer
Overflow Timer
Overflow
Timer
Overflow Timer
Overflow
Missing Pulse
(Auto-Shutdown) Missing Pulse
(CCP1ASE not clear)
Timer
Overflow
L J 1—! """"""" L3 fi‘
PIC12(L)F1840
DS40001441F-page 184 2011-2015 Microchip Technology Inc.
24.4.3 AUTO-RESTART MODE
The Enhanced PWM can be configured to
automatically restart the PWM signal once the auto-
shutdown condition has been removed. Auto-restart is
enabled by setting the P1RSEN bit in the PWM1CON
register.
If auto-restart is enabled, the CCP1ASE bit will remain
set as long as the auto-shutdown condition is active.
When the auto-shutdown condition is removed, the
CCP1ASE bit will be cleared via hardware and normal
operation will resume.
FIGURE 24-11: PWM AUTO-SHUTDOWN WITH AUTO-RESTART (P1RSEN = 1)
Shutdown
PWM
CCP1ASE bit
Activity
Event
Shutdown
Event Occurs
Shutdown
Event Clears
PWM Period
Start of
PWM Period
CCP1ASE
Cleared by
Hardware
Timer
Overflow Timer
Overflow
Timer
Overflow Timer
Overflow
Missing Pulse
(Auto-Shutdown) Missing Pulse
(CCP1ASE not clear)
Timer
Overflow
PWM
Resumes
T‘FT WT
2011-2015 Microchip Technology Inc. DS40001441F-page 185
PIC12(L)F1840
24.4.4 PROGRAMMABLE DEAD-BAND
DELAY MODE
In half-bridge applications where all power switches are
modulated at the PWM frequency, the power switches
normally require more time to turn off than to turn on. If
both the upper and lower power switches are switched
at the same time (one turned on, and the other turned
off), both switches may be on for a short period of time
until one switch completely turns off. During this brief
interval, a very high current (shoot-through current) will
flow through both power switches, shorting the bridge
supply. To avoid this potentially destructive shoot-
through current from flowing during switching, turning
on either of the power switches is normally delayed to
allow the other switch to completely turn off.
In Half-Bridge mode, a digitally programmable dead-
band delay is available to avoid shoot-through current
from destroying the bridge power switches. The delay
occurs at the signal transition from the non-active state
to the active state. See Figure 24-12 for illustration.
The lower seven bits of the associated PWM1CON
register (Register 24-3) sets the delay period in terms
of microcontroller instruction cycles (TCY or 4 TOSC).
FIGURE 24-12: EXAMPLE OF HALF-
BRIDGE PWM OUTPUT
FIGURE 24-13: EXAMPLE OF HALF-BRIDGE APPLICATIONS
Period
Pulse Width
td
td
(1)
P1A(2)
P1B(2)
td = Dead-Band Delay
Period
(1) (1)
Note 1: At this time, the TMR2 register is equal to the
PR2 register.
2: Output signals are shown as active-high.
P1A
P1B
FET
Driver
FET
Driver
V+
V-
Load
+
V
-
+
V
-
Standard Half-Bridge Circuit (“Push-Pull”)
PIC12(L)F1840
DS40001441F-page 186 2011-2015 Microchip Technology Inc.
24.4.5 PWM STEERING MODE
In Single Output mode, PWM steering allows any of the
PWM pins to be the modulated signal. Additionally, the
same PWM signal can be simultaneously available on
multiple pins.
Once the Single Output mode is selected
(CCP1M<3:2> = 11 and P1M<1:0> = 00 of the
CCP1CON register), the user firmware can bring out
the same PWM signal to one or two output pins by
setting the appropriate STR1 bits of the PSTR1CON
register, as shown in Tab le 24- 8.
While the PWM Steering mode is active, the
CCP1M<1:0> bits of the CCP1CON register determine
the polarity of the output pins.
The PWM auto-shutdown operation also applies to
PWM Steering mode as described in Section 24.4.2
“Enhanced PWM Auto-Shutdown Mode”. An auto-
shutdown event will only affect pins that have PWM
outputs enabled.
FIGURE 24-14: SIMPLIFIED STEERING
BLOCK DIAGRAM
24.4.5.1 Steering Synchronization
The STR1SYNC bit of the PSTR1CON register gives
the user two selections of when the steering event will
happen. When the STR1SYNC bit is ‘0’, the steering
event will happen at the end of the instruction that
writes to the PSTR1CON register. In this case, the
output signal at the output pins may be an incomplete
PWM waveform. This operation is useful when the user
firmware needs to immediately remove a PWM signal
from the pin.
When the STR1SYNC bit is ‘1’, the effective steering
update will happen at the beginning of the next PWM
period. In this case, steering on/off the PWM output will
always produce a complete PWM waveform.
Figures 24-15 and 24-16 illustrate the timing diagrams
of the PWM steering depending on the STR1SYNC
setting.
24.4.6 START-UP CONSIDERATIONS
When any PWM mode is used, the application
hardware must use the proper external pull-up and/or
pull-down resistors on the PWM output pins.
The CCP1M<1:0> bits of the CCP1CON register allow
the user to choose whether the PWM output signals are
active-high or active-low for each of the PWM output
pins (P1A and P1B). The PWM output polarities must
be selected before the PWM pin output drivers are
enabled. Changing the polarity configuration while the
PWM pin output drivers are enable is not
recommended since it may result in damage to the
application circuits.
The P1A and P1B output latches may not be in the
proper states when the PWM module is initialized.
Enabling the PWM pin output drivers at the same time
as the Enhanced PWM modes may cause damage to
the application circuit. The Enhanced PWM modes
must be enabled in the proper Output mode and
complete a full PWM cycle before enabling the PWM
pin output drivers. The completion of a full PWM cycle
is indicated by the TMR2IF bit of the PIR1 register
being set as the second PWM period begins.
Note: The associated TRIS bits must be set to
output (‘0’) to enable the pin output driver
in order to see the PWM signal on the pin.
1
0TRIS
P1A pin
PORT Data
P1A Signal
STR1A
1
0TRIS
P1B pin
PORT Data
STR1B
Note 1: Port outputs are configured as shown when
the CCP1CON register bits P1M<1:0> = 00
and CCP1M<3:2> = 11.
2: Single PWM output requires setting at least
one of the STR1 bits.
CCP1M1
CCP1M0
Note: When the microcontroller is released from
Reset, all of the I/O pins are in the high-
impedance state. The external circuits
must keep the power switch devices in the
Off state until the microcontroller drives
the I/O pins with the proper signal levels or
activates the PWM output(s).
2011-2015 Microchip Technology Inc. DS40001441F-page 187
PIC12(L)F1840
FIGURE 24-15: EXAMPLE OF STEERING EVENT AT END OF INSTRUCTION (STR1SYNC = 0)
FIGURE 24-16: EXAMPLE OF STEERING EVENT AT BEGINNING OF INSTRUCTION
(STR1SYNC = 1)
PWM
P1n = PWM
STR1
P1<B:A> PORT Data
PWM Period
PORT Data
PWM
PORT Data
P1n = PWM
STR1
P1<B:A> PORT Data
PIC12(L)F1840
DS40001441F-page 188 2011-2015 Microchip Technology Inc.
24.4.7 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
reset, see Section 12.1 “Alternate Pin Function” for
more information.
TABLE 24-9: SUMMARY OF REGISTERS ASSOCIATED WITH ENHANCED PWM
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
APFCON RXDTSEL SDOSEL SSSEL —T1GSEL TXCKSEL P1BSEL CCP1SEL 99
CCP1CON P1M<1:0> DC1B<1:0> CCP1M<3:0> 189
CCP1AS CCP1ASE CCP1AS<2:0> PSS1AC<1:0> PSS1BD<1:0> 190
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PR2 Timer2 Period Register 157*
PSTR1CON — — — STR1SYNC Reserved Reserved STR1B STR1A 191
PWM1CON P1RSEN P1DC<6:0> 191
T2CON — T2OUTPS<3:0> TMR2ON T2CKPS<1:0> 159
TMR2 Timer2 Module Register 157
TRISA —— TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the PWM.
* Page provides register information.
Caglure mode. Compare made, PWM mode If CCP1M< 2)="" if=""><32> 7 Caglure mode. Compare made, PWM mode PWM mode
2011-2015 Microchip Technology Inc. DS40001441F-page 189
PIC12(L)F1840
24.5 Register Definitions: CCP Control
REGISTER 24-1: CCP1CON: CCP1 CONTROL REGISTER
R/W-00 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
P1M<1:0> DC1B<1:0> CCP1M<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Reset
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-6 P1M<1:0>: Enhanced PWM Output Configuration bits
Capture mode:
Unused
Compare mode:
Unused
PWM mode:
If CCP1M<3:2> = 00, 01, 10:
xx = P1A assigned as Capture/Compare input; P1B assigned as port pins(1)
If CCP1M<3:2> = 11:
11 = Reserved
10 = Half-Bridge output; P1A, P1B modulated with dead-band control
01 = Reserved
00 = Single output; P1A modulated; P1B assigned as port pins
bit 5-4 DC1B<1:0>: PWM Duty Cycle Least Significant bits
Capture mode:
Unused
Compare mode:
Unused
PWM mode:
These bits are the two LSbs of the PWM duty cycle. The eight MSbs are found in CCPR1L.
bit 3-0 CCP1M<3:0>: ECCP1 Mode Select bits
1011 = Compare mode: Special Event Trigger (CCP1 resets Timer, sets CCP1IF bit, and starts ADC conversion
if ADC module is enabled)
1010 = Compare mode: generate software interrupt only; ECCP1 pin reverts to I/O state
1001 = Compare mode: initialize ECCP1 pin high; clear output on compare match (set CCP1IF)
1000 = Compare mode: initialize ECCP1 pin low; set output on compare match (set CCP1IF)
0111 = Capture mode: every 16th rising edge
0110 = Capture mode: every 4th rising edge
0101 = Capture mode: every rising edge
0100 = Capture mode: every falling edge
0011 = Reserved
0010 = Compare mode: toggle output on match
0001 = Reserved
0000 = Capture/Compare/PWM off (resets ECCP1 module)
PWM mode:
1111 = PWM mode: P1A active-low; P1B active-low
1110 = PWM mode: P1A active-low; P1B active-high
1101 = PWM mode: P1A active-high; P1B active-low
1100 = PWM mode: P1A active-high; P1B active-high
PIC12(L)F1840
DS40001441F-page 190 2011-2015 Microchip Technology Inc.
REGISTER 24-2: CCP1AS: CCP1 AUTO-SHUTDOWN CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
CCP1ASE CCP1AS<2:0> PSS1AC<1:0> PSS1BD<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CCP1ASE: CCP1 Auto-Shutdown Event Status bit
1 = A shutdown event has occurred; CCP1 outputs are in shutdown state
0 = CCP1 outputs are operating
bit 6-4 CCP1AS<2:0>: CCP1 Auto-Shutdown Source Select bits
111 =V
IL on FLT0 pin or Comparator C1 low(1)
110 = Reserved
101 =V
IL on FLT0 pin or Comparator C1 low(1)
100 =VIL on FLT0 pin
011 = Either Comparator C1 output low(1)
010 = Reserved
001 = Comparator C1 output low(1)
000 = Auto-shutdown is disabled
bit 3-2 PSS1AC<1:0>: Pin P1A Shutdown State Control bits
1x = Pin P1A tri-state
01 = Drive pin P1A to ‘1’
00 = Drive pin P1A to ‘0’
bit 1-0 PSS1BD<1:0>: Pin P1B Shutdown State Control bits
1x = Pin P1B tri-state
01 = Drive pin P1B to ‘1’
00 = Drive pin P1B to ‘0’
Note 1: If C1SYNC is enabled, the shutdown will be delayed by Timer1.
2011-2015 Microchip Technology Inc. DS40001441F-page 191
PIC12(L)F1840
REGISTER 24-3: PWM1CON: ENHANCED PWM CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
P1RSEN P1DC<6:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 P1RSEN: PWM Restart Enable bit
1 = Upon auto-shutdown, the CCP1ASE bit clears automatically once the shutdown event goes
away; the PWM restarts automatically
0 = Upon auto-shutdown, CCP1ASE must be cleared in software to restart the PWM
bit 6-0 P1DC<6:0>: PWM Delay Count bits
P1DC1 = Number of FOSC/4 (4 * TOSC) cycles between the scheduled time when a PWM signal
should transition active and the actual time it transitions active
Note 1: Bit resets to ‘0’ with Two-Speed Start-up and LP, XT or HS selected as the Oscillator mode or Fail-Safe
mode is enabled.
REGISTER 24-4: PSTR1CON: PWM STEERING CONTROL REGISTER(1)
U-0 U-0 U-0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-1/1
— — —STR1SYNCReserved Reserved STR1B STR1A
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-5 Unimplemented: Read as ‘0’
bit 4 STR1SYNC: Steering Sync bit
1 = Output steering update occurs on next PWM period
0 = Output steering update occurs at the beginning of the instruction cycle boundary
bit 3-2 Reserved: Read as ‘0’. Maintain these bits clear.
bit 1 STR1B: Steering Enable bit B
1 = P1B pin has the PWM waveform with polarity control from CCP1M<1:0>
0 = P1B pin is assigned to port pin
bit 0 STR1A: Steering Enable bit A
1 = P1A pin has the PWM waveform with polarity control from CCP1M<1:0>
0 = P1A pin is assigned to port pin
Note 1: The PWM Steering mode is available only when the CCP1CON register bits CCP1M<3:2> = 11 and
P1M<1:0> = 00.
35‘ TMRZ Outgm 2
PIC12(L)F1840
DS40001441F-page 192 2011-2015 Microchip Technology Inc.
25.0 MASTER SYNCHRONOUS
SERIAL PORT MODULE
25.1 Master SSP (MSSP1) Module
Overview
The Master Synchronous Serial Port (MSSP1) module
is a serial interface useful for communicating with other
peripheral or microcontroller devices. These peripheral
devices may be serial EEPROMs, shift registers,
display drivers, A/D converters, etc. The MSSP1
module can operate in one of two modes:
• Serial Peripheral Interface (SPI)
• Inter-Integrated Circuit (I2C™)
The SPI interface supports the following modes and
features:
•Master mode
• Slave mode
• Clock Parity
• Slave Select Synchronization (Slave mode only)
• Daisy-chain connection of slave devices
Figure 25-1 is a block diagram of the SPI interface
module.
FIGURE 25-1: MSSP1 BLOCK DIAGRAM (SPI MODE)
( )
Read Write
Data Bus
SSP1SR Reg
SSP1M<3:0>
bit 0 Shift
Clock
SS Control
Enable
Edge
Select
Clock Select
TMR2 Output
TOSC
Prescaler
4, 16, 64
2
Edge
Select
2 (CKP, CKE)
4
TRIS bit
SDO
SSP1BUF Reg
SDI
SS
SCK
Baud rate
generator
(SSP1ADD)
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PIC12(L)F1840
The I2C interface supports the following modes and
features:
•Master mode
• Slave mode
• Byte NACKing (Slave mode)
• Limited Multi-master support
• 7-bit and 10-bit addressing
• Start and Stop interrupts
• Interrupt masking
• Clock stretching
• Bus collision detection
• General call address matching
•Address masking
• Address Hold and Data Hold modes
• Selectable SDA hold times
Figure 25-2 is a block diagram of the I2C interface
module in Master mode. Figure 25-3 is a diagram of the
I2C interface module in Slave mode.
FIGURE 25-2: MSSP1 BLOCK DIAGRAM (I2C™ MASTER MODE)
Read Write
SSP1SR
Start bit, Stop bit,
Start bit detect,
SSP1BUF
Internal
data bus
Set/Reset: S, P, SSP1STAT, WCOL, SSP1OV
Shift
Clock
MSb LSb
SDA
Acknowledge
Generate (SSP1CON2)
Stop bit detect
Write collision detect
Clock arbitration
State counter for
end of XMIT/RCV
SCL
SCL in
Bus Collision
SDA in
Receive Enable (RCEN)
Clock Cntl
Clock arbitrate/BCOL detect
(Hold off clock source)
[SSP1M 3:0]
Baud rate
Reset SEN, PEN (SSP1CON2)
generator
(SSP1ADD)
Address Match detect
Set SSP1IF, BCL1IF
V fig
PIC12(L)F1840
DS40001441F-page 194 2011-2015 Microchip Technology Inc.
FIGURE 25-3: MSSP1 BLOCK DIAGRAM (I2C™ SLAVE MODE)
Read Write
SSP1SR Reg
Match Detect
SSP1ADD Reg
Start and
Stop bit Detect
SSP1BUF Reg
Internal
Data Bus
Addr Match
Set, Reset
S, P bits
(SSP1STAT Reg)
SCL
SDA
Shift
Clock
MSb LSb
SSP1MSK Reg
2011-2015 Microchip Technology Inc. DS40001441F-page 195
PIC12(L)F1840
25.2 SPI Mode Overview
The Serial Peripheral Interface (SPI) bus is a
synchronous serial data communication bus that
operates in Full-Duplex mode. Devices communicate
in a master/slave environment where the master device
initiates the communication. A slave device is
controlled through a Chip Select known as Slave
Select.
The SPI bus specifies four signal connections:
• Serial Clock (SCK)
• Serial Data Out (SDO)
• Serial Data In (SDI)
• Slave Select (SS)
Figure 25-1 shows the block diagram of the MSSP1
module when operating in SPI mode.
The SPI bus operates with a single master device and
one or more slave devices. When multiple slave
devices are used, an independent Slave Select
connection is required from the master device to each
slave device.
Figure 25-4 shows a typical connection between a
master device and multiple slave devices.
The master selects only one slave at a time. Most slave
devices have tri-state outputs so their output signal
appears disconnected from the bus when they are not
selected.
Transmissions involve two shift registers, eight bits in
size, one in the master and one in the slave. With either
the master or the slave device, data is always shifted
out one bit at a time, with the Most Significant bit (MSb)
shifted out first. At the same time, a new Least
Significant bit (LSb) is shifted into the same register.
Figure 25-5 shows a typical connection between two
processors configured as master and slave devices.
Data is shifted out of both shift registers on the
programmed clock edge and latched on the opposite
edge of the clock.
The master device transmits information out on its SDO
output pin which is connected to, and received by, the
slave’s SDI input pin. The slave device transmits
information out on its SDO output pin, which is
connected to, and received by, the master’s SDI input
pin.
To begin communication, the master device first sends
out the clock signal. Both the master and the slave
devices should be configured for the same clock
polarity.
The master device starts a transmission by sending out
the MSb from its shift register. The slave device reads
this bit from that same line and saves it into the LSb
position of its shift register.
During each SPI clock cycle, a full-duplex data
transmission occurs. This means that while the master
device is sending out the MSb from its shift register (on
its SDO pin) and the slave device is reading this bit and
saving it as the LSb of its shift register, that the slave
device is also sending out the MSb from its shift register
(on its SDO pin) and the master device is reading this
bit and saving it as the LSb of its shift register.
After eight bits have been shifted out, the master and
slave have exchanged register values.
If there is more data to exchange, the shift registers are
loaded with new data and the process repeats itself.
Whether the data is meaningful or not (dummy data),
depends on the application software. This leads to
three scenarios for data transmission:
• Master sends useful data and slave sends dummy
data.
• Master sends useful data and slave sends useful
data.
• Master sends dummy data and slave sends useful
data.
Transmissions may involve any number of clock
cycles. When there is no more data to be transmitted,
the master stops sending the clock signal and it
deselects the slave.
Every slave device connected to the bus that has not
been selected through its slave select line must
disregard the clock and transmission signals and must
not transmit out any data of its own.
PIC12(L)F1840
DS40001441F-page 196 2011-2015 Microchip Technology Inc.
FIGURE 25-4: SPI MASTER AND MULTIPLE SLAVE CONNECTION
25.2.1 SPI MODE REGISTERS
The MSSP1 module has five registers for SPI mode
operation. These are:
• MSSP1 STATUS register (SSP1STAT)
• MSSP1 Control register 1 (SSP1CON1)
• MSSP1 Control register 3 (SSP1CON3)
• MSSP1 Data Buffer register (SSP1BUF)
• MSSP1 Address register (SSP1ADD)
• MSSP1 Shift register (SSP1SR)
(Not directly accessible)
SSP1CON1 and SSP1STAT are the control and
STATUS registers in SPI mode operation. The
SSP1CON1 register is readable and writable. The
lower 6 bits of the SSP1STAT are read-only. The upper
two bits of the SSP1STAT are read/write.
In one SPI master mode, SSP1ADD can be loaded
with a value used in the Baud Rate Generator. More
information on the Baud Rate Generator is available in
Section 25.7 “Baud Rate Generator”.
SSP1SR is the shift register used for shifting data in
and out. SSP1BUF provides indirect access to the
SSP1SR register. SSP1BUF is the buffer register to
which data bytes are written, and from which data
bytes are read.
In receive operations, SSP1SR and SSP1BUF
together create a buffered receiver. When SSP1SR
receives a complete byte, it is transferred to SSP1BUF
and the SSP1IF interrupt is set.
During transmission, the SSP1BUF is not buffered. A
write to SSP1BUF will write to both SSP1BUF and
SSP1SR.
SPI Master SCK
SDO
SDI
General I/O
General I/O
General I/O
SCK
SDI
SDO
SS
SPI Slave
#1
SCK
SDI
SDO
SS
SPI Slave
#2
SCK
SDI
SDO
SS
SPI Slave
#3
2011-2015 Microchip Technology Inc. DS40001441F-page 197
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25.2.2 SPI MODE OPERATION
When initializing the SPI, several options need to be
specified. This is done by programming the appropriate
control bits (SSP1CON1<5:0> and SSP1STAT<7:6>).
These control bits allow the following to be specified:
• Master mode (SCK1 is the clock output)
• Slave mode (SCK1 is the clock input)
• Clock Polarity (Idle state of SCK1)
• Data Input Sample Phase (middle or end of data
output time)
• Clock Edge (output data on rising/falling edge of
SCK1)
• Clock Rate (Master mode only)
• Slave Select mode (Slave mode only)
To enable the serial port, SSP1 Enable bit, SSP1EN of
the SSP1CON1 register must be set. To reset or
reconfigure SPI mode, clear the SSP1EN bit,
re-initialize the SSP1CONx registers and then set the
SSP1EN bit. This configures the SDI, SDO, SCK and
SS pins as serial port pins. For the pins to behave as
the serial port function, some must have their data
direction bits (in the TRIS register) appropriately
programmed as follows:
• SDI must have corresponding TRIS bit set
• SDO must have corresponding TRIS bit cleared
• SCK (Master mode) must have corresponding
TRIS bit cleared
• SCK (Slave mode) must have corresponding
TRIS bit set
•SS
must have corresponding TRIS bit set
Any serial port function that is not desired may be
overridden by programming the corresponding data
direction (TRIS) register to the opposite value.
The MSSP1 consists of a transmit/receive shift register
(SSP1SR) and a buffer register (SSP1BUF). The
SSP1SR shifts the data in and out of the device, MSb
first. The SSP1BUF holds the data that was written to
the SSP1SR until the received data is ready. Once the
8 bits of data have been received, that byte is moved to
the SSP1BUF register. Then, the Buffer Full Detect bit,
BF of the SSP1STAT register, and the interrupt flag bit,
SSP1IF, are set. This double-buffering of the received
data (SSP1BUF) allows the next byte to start reception
before reading the data that was just received. Any
write to the SSP1BUF register during
transmission/reception of data will be ignored and the
write collision detect bit, WCOL, of the SSP1CON1
register, will be set. User software must clear the
WCOL bit to allow the following write(s) to the
SSP1BUF register to complete successfully.
When the application software is expecting to receive
valid data, the SSP1BUF should be read before the
next byte of data to transfer is written to the SSP1BUF.
The Buffer Full bit, BF of the SSP1STAT register,
indicates when SSP1BUF has been loaded with the
received data (transmission is complete). When the
SSP1BUF is read, the BF bit is cleared. This data may
be irrelevant if the SPI is only a transmitter. Generally,
the MSSP1 interrupt is used to determine when the
transmission/reception has completed. If the interrupt
method is not going to be used, then software polling
can be done to ensure that a write collision does not
occur.
The SSP1SR is not directly readable or writable and
can only be accessed by addressing the SSP1BUF
register. Additionally, the SSP1STAT register indicates
the various Status conditions.
L777+lss ‘
PIC12(L)F1840
DS40001441F-page 198 2011-2015 Microchip Technology Inc.
FIGURE 25-5: SPI MASTER/SLAVE CONNECTION
Serial Input Buffer
(BUF)
Shift Register
(SSP1SR)
MSb LSb
SDO
SDI
Processor 1
SCK
SPI Master SSP1M<3:0> = 00xx
Serial Input Buffer
(SSP1BUF)
Shift Register
(SSP1SR)
LSb
MSb
SDI
SDO
Processor 2
SCK
SPI Slave SSP1M<3:0> = 010x
Serial Clock
SS
Slave Select
General I/O (optional)
= 1010
2011-2015 Microchip Technology Inc. DS40001441F-page 199
PIC12(L)F1840
25.2.3 SPI MASTER MODE
The master can initiate the data transfer at any time
because it controls the SCK line. The master
determines when the slave (Processor 2, Figure 25-5)
is to broadcast data by the software protocol.
In Master mode, the data is transmitted/received as
soon as the SSP1BUF register is written to. If the SPI
is only going to receive, the SDO output could be
disabled (programmed as an input). The SSP1SR
register will continue to shift in the signal present on the
SDI pin at the programmed clock rate. As each byte is
received, it will be loaded into the SSP1BUF register as
if a normal received byte (interrupts and Status bits
appropriately set).
The clock polarity is selected by appropriately
programming the CKP bit of the SSP1CON1 register
and the CKE bit of the SSP1STAT register. This then,
would give waveforms for SPI communication as
shown in Figure 25-6, Figure 25-8, Figure 25-9 and
Figure 25-10, where the MSB is transmitted first. In
Master mode, the SPI clock rate (bit rate) is user
programmable to be one of the following:
•F
OSC/4 (or TCY)
•F
OSC/16 (or 4 * TCY)
•F
OSC/64 (or 16 * TCY)
• Timer2 output/2
• Fosc/(4 * (SSP1ADD + 1))
Figure 25-6 shows the waveforms for Master mode.
When the CKE bit is set, the SDO data is valid before
there is a clock edge on SCK. The change of the input
sample is shown based on the state of the SMP bit. The
time when the SSP1BUF is loaded with the received
data is shown.
FIGURE 25-6: SPI MODE WAVEFORM (MASTER MODE)
SCK
(CKP = 0
SCK
(CKP = 1
SCK
(CKP = 0
SCK
(CKP = 1
4 Clock
Modes
Input
Sample
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
bit 7
SDI
SSP1IF
(SMP = 1)
(SMP = 0)
(SMP = 1)
CKE = 1)
CKE = 0)
CKE = 1)
CKE = 0)
(SMP = 0)
Write to
SSP1BUF
SSP1SR to
SSP1BUF
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
(CKE = 0)
(CKE = 1)
bit 0
When me SPI is in Save mode wim Q
PIC12(L)F1840
DS40001441F-page 200 2011-2015 Microchip Technology Inc.
25.2.4 SPI SLAVE MODE
In Slave mode, the data is transmitted and received as
external clock pulses appear on SCK. When the last
bit is latched, the SSP1IF interrupt flag bit is set.
Before enabling the module in SPI Slave mode, the clock
line must match the proper Idle state. The clock line can
be observed by reading the SCK pin. The Idle state is
determined by the CKP bit of the SSP1CON1 register.
While in Slave mode, the external clock is supplied by
the external clock source on the SCK pin. This external
clock must meet the minimum high and low times as
specified in the electrical specifications.
While in Sleep mode, the slave can transmit/receive
data. The shift register is clocked from the SCK pin
input and when a byte is received, the device will
generate an interrupt. If enabled, the device will
wake-up from Sleep.
25.2.4.1 Daisy-Chain Configuration
The SPI bus can sometimes be connected in a
daisy-chain configuration. The first slave output is con-
nected to the second slave input, the second slave
output is connected to the third slave input, and so on.
The final slave output is connected to the master input.
Each slave sends out, during a second group of clock
pulses, an exact copy of what was received during the
first group of clock pulses. The whole chain acts as
one large communication shift register. The
daisy-chain feature only requires a single Slave Select
line from the master device.
Figure 25-7 shows the block diagram of a typical
daisy-chain connection when operating in SPI mode.
In a daisy-chain configuration, only the most recent
byte on the bus is required by the slave. Setting the
BOEN bit of the SSP1CON3 register will enable writes
to the SSP1BUF register, even if the previous byte has
not been read. This allows the software to ignore data
that may not apply to it.
25.2.5 SLAVE SELECT
SYNCHRONIZATION
The Slave Select can also be used to synchronize
communication. The Slave Select line is held high until
the master device is ready to communicate. When the
Slave Select line is pulled low, the slave knows that a
new transmission is starting.
If the slave fails to receive the communication properly,
it will be reset at the end of the transmission, when the
Slave Select line returns to a high state. The slave is
then ready to receive a new transmission when the
Slave Select line is pulled low again. If the Slave Select
line is not used, there is a risk that the slave will
eventually become out of sync with the master. If the
slave misses a bit, it will always be one bit off in future
transmissions. Use of the Slave Select line allows the
slave and master to align themselves at the beginning
of each transmission.
The SS pin allows a Synchronous Slave mode. The
SPI must be in Slave mode with SS pin control enabled
(SSP1CON1<3:0> = 0100).
When the SS pin is low, transmission and reception are
enabled and the SDO pin is driven.
When the SS pin goes high, the SDO pin is no longer
driven, even if in the middle of a transmitted byte and
becomes a floating output. External pull-up/pull-down
resistors may be desirable depending on the
application.
When the SPI module resets, the bit counter is forced
to ‘0’. This can be done by either forcing the SS pin to
a high level or clearing the SSP1EN bit.
Note 1: When the SPI is in Slave mode with SS pin
control enabled (SSP1CON1<3:0> =
0100), the SPI module will reset if the SS
pin is set to VDD.
2: When the SPI is used in Slave mode with
CKE set; the user must enable SS pin
control.
3: While operated in SPI Slave mode the
SMP bit of the SSP1STAT register must
remain clear.
a} 45 ‘u (Y )2 (( J) P1SR m P1BUF
2011-2015 Microchip Technology Inc. DS40001441F-page 201
PIC12(L)F1840
FIGURE 25-7: SPI DAISY-CHAIN CONNECTION
FIGURE 25-8: SLAVE SELECT SYNCHRONOUS WAVEFORM
SPI Master SCK
SDO
SDI
General I/O
SCK
SDI
SDO
SS
SPI Slave
#1
SCK
SDI
SDO
SS
SPI Slave
#2
SCK
SDI
SDO
SS
SPI Slave
#3
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 7
SSP1IF
Interrupt
CKE = 0)
CKE = 0)
Write to
SSP1BUF
SSP1SR to
SSP1BUF
SS
Flag
bit 0
bit 7
bit 0
bit 6
SSP1BUF to
SSP1SR
Shift register SSP1SR
and bit count are reset
PIC12(L)F1840
DS40001441F-page 202 2011-2015 Microchip Technology Inc.
FIGURE 25-9: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 0)
FIGURE 25-10: SPI MODE WAVEFORM (SLAVE MODE WITH CKE = 1)
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSP1IF
Interrupt
CKE = 0)
CKE = 0)
Write to
SSP1BUF
SSP1SR to
SSP1BUF
SS
Flag
Optional
bit 0
detection active
Write Collision
Valid
SCK
(CKP = 1
SCK
(CKP = 0
Input
Sample
SDI
bit 7 bit 0
SDO bit 7 bit 6 bit 5 bit 4 bit 3 bit 2 bit 1 bit 0
SSP1IF
Interrupt
CKE = 1)
CKE = 1)
Write to
SSP1BUF
SSP1SR to
SSP1BUF
SS
Flag
Not Optional
Write Collision
detection active
Valid
2011-2015 Microchip Technology Inc. DS40001441F-page 203
PIC12(L)F1840
25.2.6 SPI OPERATION IN SLEEP MODE
In SPI Master mode, module clocks may be operating
at a different speed than when in Full-Power mode; in
the case of the Sleep mode, all clocks are halted.
Special care must be taken by the user when the
MSSP1 clock is much faster than the system clock.
In Slave mode, when MSSP1 interrupts are enabled,
after the master completes sending data, an MSSP1
interrupt will wake the controller from Sleep.
If an exit from Sleep mode is not desired, MSSP1
interrupts should be disabled.
In SPI Master mode, when the Sleep mode is selected,
all module clocks are halted and the
transmission/reception will remain in that state until the
device wakes. After the device returns to Run mode,
the module will resume transmitting and receiving data.
In SPI Slave mode, the SPI Transmit/Receive Shift
register operates asynchronously to the device. This
allows the device to be placed in Sleep mode and data
to be shifted into the SPI Transmit/Receive Shift
register. When all eight bits have been received, the
MSSP1 interrupt flag bit will be set and if enabled, will
wake the device.
TABLE 25-1: SUMMARY OF REGISTERS ASSOCIATED WITH SPI OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA — — —ANSA4 —ANSA2 ANSA1 ANSA0 103
APFCON RXDTSEL SDOSEL SSSEL —T1GSEL TXCKSEL P1BSEL CCP1SEL 99
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register 196*
SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 243
SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 245
SSP1STAT SMP CKE D/A P S R/W UA BF 242
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP1 in SPI mode.
* Page provides register information.
Note 1: PIC12(L)F1840 only.
ACK ACK ACK ACK AiCK
PIC12(L)F1840
DS40001441F-page 204 2011-2015 Microchip Technology Inc.
25.3 I2C MODE OVERVIEW
The Inter-Integrated Circuit Bus (I2C) is a multi-master
serial data communication bus. Devices communicate
in a master/slave environment where the master
devices initiate the communication. A Slave device is
controlled through addressing.
The I2C bus specifies two signal connections:
• Serial Clock (SCL)
• Serial Data (SDA)
Figure 25-11 shows the block diagram of the MSSP1
module when operating in I2C mode.
Both the SCL and SDA connections are bidirectional
open-drain lines, each requiring pull-up resistors for the
supply voltage. Pulling the line to ground is considered
a logical zero and letting the line float is considered a
logical one.
Figure 25-11 shows a typical connection between two
processors configured as master and slave devices.
The I2C bus can operate with one or more master
devices and one or more slave devices.
There are four potential modes of operation for a given
device:
• Master Transmit mode
(master is transmitting data to a slave)
• Master Receive mode
(master is receiving data from a slave)
•Slave Transmit mode
(slave is transmitting data to a master)
• Slave Receive mode
(slave is receiving data from the master)
To begin communication, a master device starts out in
Master Transmit mode. The master device sends out a
Start bit followed by the address byte of the slave it
intends to communicate with. This is followed by a
single Read/Write bit, which determines whether the
master intends to transmit to or receive data from the
slave device.
If the requested slave exists on the bus, it will respond
with an Acknowledge bit, otherwise known as an ACK.
The master then continues in either Transmit mode or
Receive mode and the slave continues in the
complement, either in Receive mode or Transmit
mode, respectively.
A Start bit is indicated by a high-to-low transition of the
SDA line while the SCL line is held high. Address and
data bytes are sent out, Most Significant bit (MSb) first.
The Read/Write bit is sent out as a logical one when the
master intends to read data from the slave, and is sent
out as a logical zero when it intends to write data to the
slave.
FIGURE 25-11: I2C MASTER/
SLAVE CONNECTION
The Acknowledge bit (ACK) is an active-low signal,
which holds the SDA line low to indicate to the
transmitter that the slave device has received the
transmitted data and is ready to receive more.
The transition of a data bit is always performed while
the SCL line is held low. Transitions that occur while the
SCL line is held high are used to indicate Start and Stop
bits.
If the master intends to write to the slave, then it repeat-
edly sends out a byte of data, with the slave responding
after each byte with an ACK bit. In this example, the
master device is in Master Transmit mode and the
slave is in Slave Receive mode.
If the master intends to read from the slave, then it
repeatedly receives a byte of data from the slave, and
responds after each byte with an ACK bit. In this
example, the master device is in Master Receive mode
and the slave is Slave Transmit mode.
On the last byte of data communicated, the master
device may end the transmission by sending a Stop bit.
If the master device is in Receive mode, it sends the
Stop bit in place of the last ACK bit. A Stop bit is
indicated by a low-to-high transition of the SDA line
while the SCL line is held high.
In some cases, the master may want to maintain
control of the bus and re-initiate another transmission.
If so, the master device may send another Start bit in
place of the Stop bit or last ACK bit when it is in receive
mode.
The I2C bus specifies three message protocols;
• Single message where a master writes data to a
slave.
• Single message where a master reads data from
a slave.
• Combined message where a master initiates a
minimum of two writes, or two reads, or a
combination of writes and reads, to one or more
slaves.
Master
SCL
SDA
SCL
SDA
Slave
VDD
VDD
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When one device is transmitting a logical one, or letting
the line float, and a second device is transmitting a
logical zero, or holding the line low, the first device can
detect that the line is not a logical one. This detection,
when used on the SCL line, is called clock stretching.
Clock stretching gives slave devices a mechanism to
control the flow of data. When this detection is used on
the SDA line, it is called arbitration. Arbitration ensures
that there is only one master device communicating at
any single time.
25.3.1 CLOCK STRETCHING
When a slave device has not completed processing
data, it can delay the transfer of more data through the
process of clock stretching. An addressed slave device
may hold the SCL clock line low after receiving or send-
ing a bit, indicating that it is not yet ready to continue.
The master that is communicating with the slave will
attempt to raise the SCL line in order to transfer the
next bit, but will detect that the clock line has not yet
been released. Because the SCL connection is
open-drain, the slave has the ability to hold that line low
until it is ready to continue communicating.
Clock stretching allows receivers that cannot keep up
with a transmitter to control the flow of incoming data.
25.3.2 ARBITRATION
Each master device must monitor the bus for Start and
Stop bits. If the device detects that the bus is busy, it
cannot begin a new message until the bus returns to an
Idle state.
However, two master devices may try to initiate a
transmission on or about the same time. When this
occurs, the process of arbitration begins. Each
transmitter checks the level of the SDA data line and
compares it to the level that it expects to find. The first
transmitter to observe that the two levels do not match,
loses arbitration, and must stop transmitting on the
SDA line.
For example, if one transmitter holds the SDA line to a
logical one (lets it float) and a second transmitter holds
it to a logical zero (pulls it low), the result is that the
SDA line will be low. The first transmitter then observes
that the level of the line is different than expected and
concludes that another transmitter is communicating.
The first transmitter to notice this difference is the one
that loses arbitration and must stop driving the SDA
line. If this transmitter is also a master device, it also
must stop driving the SCL line. It then can monitor the
lines for a Stop condition before trying to reissue its
transmission. In the meantime, the other device that
has not noticed any difference between the expected
and actual levels on the SDA line continues with its
original transmission. It can do so without any compli-
cations, because so far, the transmission appears
exactly as expected with no other transmitter disturbing
the message.
Slave Transmit mode can also be arbitrated, when a
master addresses multiple slaves, but this is less
common.
If two master devices are sending a message to two
different slave devices at the address stage, the master
sending the lower slave address always wins arbitra-
tion. When two master devices send messages to the
same slave address, and addresses can sometimes
refer to multiple slaves, the arbitration process must
continue into the data stage.
Arbitration usually occurs very rarely, but it is a
necessary process for proper multi-master support.
Transmmer The dewce which shxfls da‘a om E‘ 3‘
PIC12(L)F1840
DS40001441F-page 206 2011-2015 Microchip Technology Inc.
25.4 I2C MODE OPERATION
All MSSP1 I2C communication is byte oriented and
shifted out MSb first. Six SFR registers and two
interrupt flags interface the module with the PIC®
microcontroller and user software. Two pins, SDA and
SCL, are exercised by the module to communicate
with other external I2C devices.
25.4.1 BYTE FORMAT
All communication in I2C is done in 9-bit segments. A
byte is sent from a master to a slave or vice-versa,
followed by an Acknowledge bit sent back. After the
8th falling edge of the SCL line, the device outputting
data on the SDA changes that pin to an input and
reads in an acknowledge value on the next clock
pulse.
The clock signal, SCL, is provided by the master. Data
is valid to change while the SCL signal is low, and
sampled on the rising edge of the clock. Changes on
the SDA line while the SCL line is high define special
conditions on the bus, explained below.
25.4.2 DEFINITION OF I2C TERMINOLOGY
There is language and terminology in the description
of I2C communication that have definitions specific to
I2C. That word usage is defined below and may be
used in the rest of this document without explana-
tion. This table was adapted from the Philips I2CTM
specification.
25.4.3 SDA AND SCL PINS
Selection of any I2C mode with the SSP1EN bit set,
forces the SCL and SDA pins to be open-drain. These
pins should be set by the user to inputs by setting the
appropriate TRIS bits.
25.4.4 SDA HOLD TIME
The hold time of the SDA pin is selected by the SDAHT
bit of the SSP1CON3 register. Hold time is the time
SDA is held valid after the falling edge of SCL. Setting
the SDAHT bit selects a longer 300 ns minimum hold
time and may help on buses with large capacitance.
TABLE 25-2: I2C BUS TERMS
Note: Data is tied to output zero when an I2C
mode is enabled.
TERM Description
Transmitter The device which shifts data out
onto the bus.
Receiver The device which shifts data in
from the bus.
Master The device that initiates a transfer,
generates clock signals and
terminates a transfer.
Slave The device addressed by the
master.
Multi-master A bus with more than one device
that can initiate data transfers.
Arbitration Procedure to ensure that only one
master at a time controls the bus.
Winning arbitration ensures that
the message is not corrupted.
Synchronization Procedure to synchronize the
clocks of two or more devices on
the bus.
Idle No master is controlling the bus,
and both SDA and SCL lines are
high.
Active Any time one or more master
devices are controlling the bus.
Addressed
Slave
Slave device that has received a
matching address and is actively
being clocked by a master.
Matching
Address
Address byte that is clocked into a
slave that matches the value
stored in SSP1ADD.
Write Request Slave receives a matching
address with R/W bit clear, and is
ready to clock in data.
Read Request Master sends an address byte with
the R/W bit set, indicating that it
wishes to clock data out of the
Slave. This data is the next and all
following bytes until a Restart or
Stop.
Clock Stretching When a device on the bus hold
SCL low to stall communication.
Bus Collision Any time the SDA line is sampled
low by the module while it is out-
putting and expected high state.
1“ \‘4 1‘ \\\4 \\\\\\\ \\L
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PIC12(L)F1840
25.4.5 START CONDITION
The I2C specification defines a Start condition as a
transition of SDA from a high to a low state while SCL
line is high. A Start condition is always generated by
the master and signifies the transition of the bus from
an Idle to an Active state. Figure 25-12 shows wave
forms for Start and Stop conditions.
A bus collision can occur on a Start condition if the
module samples the SDA line low before asserting it
low. This does not conform to the I2C Specification that
states no bus collision can occur on a Start.
25.4.6 STOP CONDITION
A Stop condition is a transition of the SDA line from
low-to-high state while the SCL line is high.
25.4.7 RESTART CONDITION
A Restart is valid any time that a Stop would be valid.
A master can issue a Restart if it wishes to hold the
bus after terminating the current transfer. A Restart
has the same effect on the slave that a Start would,
resetting all slave logic and preparing it to clock in an
address. The master may want to address the same or
another slave. Figure 25-13 shows the wave form for a
Restart condition.
In 10-bit Addressing Slave mode a Restart is required
for the master to clock data out of the addressed
slave. Once a slave has been fully addressed, match-
ing both high and low address bytes, the master can
issue a Restart and the high address byte with the
R/W bit set. The slave logic will then hold the clock
and prepare to clock out data.
After a full match with R/W clear in 10-bit mode, a prior
match flag is set and maintained. Until a Stop
condition, a high address with R/W clear, or high
address match fails.
25.4.8 START/STOP CONDITION INTERRUPT
MASKING
The SCIE and PCIE bits of the SSP1CON3 register
can enable the generation of an interrupt in Slave
modes that do not typically support this function. Slave
modes where interrupt on Start and Stop detect are
already enabled, these bits will have no effect.
FIGURE 25-12: I2C START AND STOP CONDITIONS
FIGURE 25-13: I2C RESTART CONDITION
Note: At least one SCL low time must appear
before a Stop is valid, therefore, if the SDA
line goes low then high again while the SCL
line stays high, only the Start condition is
detected.
SDA
SCL
P
Stop
Condition
S
Start
Condition
Change of
Data Allowed
Change of
Data Allowed
Restart
Condition
Sr
Change of
Data Allowed
Change of
Data Allowed
ACK ACK ACK ACK ACK 2‘
PIC12(L)F1840
DS40001441F-page 208 2011-2015 Microchip Technology Inc.
25.4.9 ACKNOWLEDGE SEQUENCE
The 9th SCL pulse for any transferred byte in I2C is
dedicated as an Acknowledge. It allows receiving
devices to respond back to the transmitter by pulling
the SDA line low. The transmitter must release control
of the line during this time to shift in the response. The
Acknowledge (ACK) is an active-low signal, pulling the
SDA line low indicated to the transmitter that the
device has received the transmitted data and is ready
to receive more.
The result of an ACK is placed in the ACKSTAT bit of
the SSP1CON2 register.
Slave software, when the AHEN and DHEN bits are
set, allow the user to set the ACK value sent back to
the transmitter. The ACKDT bit of the SSP1CON2
register is set/cleared to determine the response.
Slave hardware will generate an ACK response if the
AHEN and DHEN bits of the SSP1CON3 register are
clear.
There are certain conditions where an ACK will not be
sent by the slave. If the BF bit of the SSP1STAT regis-
ter or the SSP1OV bit of the SSP1CON1 register are
set when a byte is received.
When the module is addressed, after the 8th falling
edge of SCL on the bus, the ACKTIM bit of the
SSP1CON3 register is set. The ACKTIM bit indicates
the acknowledge time of the active bus. The ACKTIM
Status bit is only active when the AHEN bit or DHEN
bit is enabled.
25.5 I2C SLAVE MODE OPERATION
The MSSP1 Slave mode operates in one of four
modes selected in the SSP1M bits of SSP1CON1
register. The modes can be divided into 7-bit and
10-bit Addressing mode. 10-bit Addressing modes
operate the same as 7-bit with some additional
overhead for handling the larger addresses.
Modes with Start and Stop bit interrupts operate the
same as the other modes with SSP1IF additionally
getting set upon detection of a Start, Restart, or Stop
condition.
25.5.1 SLAVE MODE ADDRESSES
The SSP1ADD register (Register 25-6) contains the
Slave mode address. The first byte received after a
Start or Restart condition is compared against the
value stored in this register. If the byte matches, the
value is loaded into the SSP1BUF register and an
interrupt is generated. If the value does not match, the
module goes idle and no indication is given to the
software that anything happened.
The SSP Mask register (Register 25-5) affects the
address matching process. See Section 25.5.9
“SSP1 Mask Register” for more information.
25.5.1.1 I2C Slave 7-bit Addressing Mode
In 7-bit Addressing mode, the LSb of the received data
byte is ignored when determining if there is an address
match.
25.5.1.2 I2C Slave 10-bit Addressing Mode
In 10-bit Addressing mode, the first received byte is
compared to the binary value of ‘1 1 1 1 0 A9 A8
0’. A9 and A8 are the two MSb’s of the 10-bit address
and stored in bits 2 and 1 of the SSP1ADD register.
After the acknowledge of the high byte the UA bit is set
and SCL is held low until the user updates SSP1ADD
with the low address. The low address byte is clocked
in and all 8 bits are compared to the low address value
in SSP1ADD. Even if there is not an address match;
SSP1IF and UA are set, and SCL is held low until
SSP1ADD is updated to receive a high byte again.
When SSP1ADD is updated the UA bit is cleared. This
ensures the module is ready to receive the high
address byte on the next communication.
A high and low address match as a write request is
required at the start of all 10-bit addressing
communication. A transmission can be initiated by
issuing a Restart once the slave is addressed, and
clocking in the high address with the R/W bit set. The
slave hardware will then acknowledge the read
request and prepare to clock out data. This is only
valid for a slave after it has received a complete high
and low address byte match.
E‘ E‘ E‘ ACK ACK ACK ACK. E‘ W ACK ACK ACK
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25.5.2 SLAVE RECEPTION
When the R/W bit of a matching received address byte
is clear, the R/W bit of the SSP1STAT register is
cleared. The received address is loaded into the
SSP1BUF register and acknowledged.
When the overflow condition exists for a received
address, then not Acknowledge is given. An overflow
condition is defined as either bit BF of the SSP1STAT
register is set, or bit SSP1OV of the SSP1CON1
register is set. The BOEN bit of the SSP1CON3
register modifies this operation. For more information
see Register 25-4.
An MSSP1 interrupt is generated for each transferred
data byte. Flag bit, SSP1IF, must be cleared by soft-
ware.
When the SEN bit of the SSP1CON2 register is set,
SCL will be held low (clock stretch) following each
received byte. The clock must be released by setting
the CKP bit of the SSP1CON1 register, except
sometimes in 10-bit mode. See Section 25.2.3 “SPI
Master Mode” for more detail.
25.5.2.1 7-bit Addressing Reception
This section describes a standard sequence of events
for the MSSP1 module configured as an I2C Slave in
7-bit Addressing mode. All decisions made by hard-
ware or software and their effect on reception.
Figure 25-14 and Figure 25-15 is used as a visual
reference for this description.
This is a step by step process of what typically must
be done to accomplish I2C communication.
1. Start bit detected.
2. S bit of SSP1STAT is set; SSP1IF is set if
interrupt on Start detect is enabled.
3. Matching address with R/W bit clear is received.
4. The slave pulls SDA low sending an ACK to the
master, and sets SSP1IF bit.
5. Software clears the SSP1IF bit.
6. Software reads received address from
SSP1BUF clearing the BF flag.
7. If SEN = 1; Slave software sets CKP bit to
release the SCL line.
8. The master clocks out a data byte.
9. Slave drives SDA low sending an ACK to the
master, and sets SSP1IF bit.
10. Software clears SSP1IF.
11. Software reads the received byte from
SSP1BUF clearing BF.
12. Steps 8-12 are repeated for all received bytes
from the master.
13. Master sends Stop condition, setting P bit of
SSP1STAT, and the bus goes idle.
25.5.2.2 7-bit Reception with AHEN and DHEN
Slave device reception with AHEN and DHEN set
operate the same as without these options with extra
interrupts and clock stretching added after the 8th
falling edge of SCL. These additional interrupts allow
the slave software to decide whether it wants to ACK
the receive address or data byte, rather than the
hardware. This functionality adds support for PMBus™
that was not present on previous versions of this
module.
This list describes the steps that need to be taken by
slave software to use these options for I2C
communication. Figure 25-16 displays a module using
both address and data holding. Figure 25-17 includes
the operation with the SEN bit of the SSP1CON2
register set.
1. S bit of SSP1STAT is set; SSP1IF is set if
interrupt on Start detect is enabled.
2. Matching address with R/W bit clear is clocked
in. SSP1IF is set and CKP cleared after the 8th
falling edge of SCL.
3. Slave clears the SSP1IF.
4. Slave can look at the ACKTIM bit of the
SSP1CON3 register to determine if the SSP1IF
was after or before the ACK.
5. Slave reads the address value from SSP1BUF,
clearing the BF flag.
6. Slave sets ACK value clocked out to the master
by setting ACKDT.
7. Slave releases the clock by setting CKP.
8. SSP1IF is set after an ACK, not after a NACK.
9. If SEN = 1 the slave hardware will stretch the
clock after the ACK.
10. Slave clears SSP1IF.
11. SSP1IF set and CKP cleared after 8th falling
edge of SCL for a received data byte.
12. Slave looks at ACKTIM bit of SSP1CON3 to
determine the source of the interrupt.
13. Slave reads the received data from SSP1BUF
clearing BF.
14. Steps 7-14 are the same for each received data
byte.
15. Communication is ended by either the slave
sending an ACK =1, or the master sending a
Stop condition. If a Stop is sent and Interrupt on
Stop Detect is disabled, the slave will only know
by polling the P bit of the SSTSTAT register.
Note: SSP1IF is still set after the 9th falling edge
of SCL even if there is no clock stretching
and BF has been cleared. Only if NACK is
sent to Master is SSP1IF not set
PIC12(L)F1840
DS40001441F-page 210 2011-2015 Microchip Technology Inc.
FIGURE 25-14: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 0, DHEN = 0)
Receiving Address
ACK
Receiving Data
ACK
Receiving Data ACK =1
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
SSP1IF
BF
SSP1OV
12345678 12345678 12345678
999
ACK is not sent.
SSP1OV set because
SSP1BUF is still full.
Cleared by software
First byte
of data is
available
in SSP1BUF
SSP1BUF is read
SSP1IF set on 9th
falling edge of
SCL
Cleared by software
P
Bus Master sends
Stop condition
S
From Slave to Master
2011-2015 Microchip Technology Inc. DS40001441F-page 211
PIC12(L)F1840
FIGURE 25-15: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
SEN SEN
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0SDA
SCL 123456789 123456789 123456789 P
SSP1IF set on 9th
SCL is not held
CKP is written to ‘1’ in software,
CKP is written to ‘1’ in software,
ACK
low because
falling edge of SCL
releasing SCL
ACK is not sent.
Bus Master sends
CKP
SSP1OV
BF
SSP1IF
SSP1OV set because
SSP1BUF is still full.
Cleared by software
First byte
of data is
available
in SSP1BUF
ACK=1
Cleared by software
SSP1BUF is read
Clock is held low until CKP is set to ‘1’
releasing SCL
Stop condition
S
ACK
ACK
Receive Address Receive Data Receive Data
R/W=0
JL §§
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DS40001441F-page 212 2011-2015 Microchip Technology Inc.
FIGURE 25-16: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 1)
Receiving Address Receiving Data Received Data
P
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
BF
CKP
S
P
12 3 4 56 7 8 912345678 9
12345678
Master sends
Stop condition
S
Data is read from SSP1BUF
Cleared by software
SSP1IF is set on
9th falling edge of
SCL, after ACK
CKP set by software,
SCL is released
Slave software
9
ACKTIM cleared by
hardware in 9th
rising edge of SCL
sets ACKDT to
not ACK
When DHEN = 1:
CKP is cleared by
hardware on 8th falling
edge of SCL
Slave software
clears ACKDT to
ACK the received
byte
ACKTIM set by hardware
on 8th falling edge of SCL
When AHEN = 1:
CKP is cleared by hardware
and SCL is stretched
Address is
read from
SSBUF
ACKTIM set by hardware
on 8th falling edge of SCL
ACK
Master Releases SDA
to slave for ACK sequence
No interrupt
after not ACK
from Slave
ACK= 1
ACK
ACKDT
ACKTIM
SSP1IF
If AHEN = 1:
SSP1IF is set
JL
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PIC12(L)F1840
FIGURE 25-17: I2C SLAVE, 7-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 1, DHEN = 1)
Receiving Address Receive Data Receive Data
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
SSP1IF
BF
ACKDT
CKP
S
P
ACK
S12
345678 912
345678 9 1234567 8 9
ACK
ACK
Cleared by software
ACKTIM is cleared by hardware
SSP1BUF can be
Set by software,
read any time before
next byte is loaded
release SCL
on 9th rising edge of SCL
Received
address is loaded into
SSP1BUF
Slave software clears
ACKDT to ACK
R/W = 0Master releases
SDA to slave for ACK sequence
the received byte
When AHEN = 1;
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
ACKTIM is set by hardware
on 8th falling edge of SCL
When DHEN = 1;
on the 8th falling edge
of SCL of a received
data byte, CKP is cleared
Received data is
available on SSP1BUF
Slave sends
not ACK
CKP is not cleared
if not ACK
P
Master sends
Stop condition
No interrupt after
if not ACK
from Slave
ACKTIM
E‘ ACK ACK W ACK W 7 7 ACK. ACK ACK ACK ACK ACK ACK ACK
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25.5.3 SLAVE TRANSMISSION
When the R/W bit of the incoming address byte is set
and an address match occurs, the R/W bit of the
SSP1STAT register is set. The received address is
loaded into the SSP1BUF register, and an ACK pulse
is sent by the slave on the ninth bit.
Following the ACK, slave hardware clears the CKP bit
and the SCL pin is held low (see Section 25.5.6
“Clock Stretching” for more detail). By stretching the
clock, the master will be unable to assert another clock
pulse until the slave is done preparing the transmit
data.
The transmit data must be loaded into the SSP1BUF
register which also loads the SSP1SR register. Then
the SCL pin should be released by setting the CKP bit
of the SSP1CON1 register. The eight data bits are
shifted out on the falling edge of the SCL input. This
ensures that the SDA signal is valid during the SCL
high time.
The ACK pulse from the master-receiver is latched on
the rising edge of the ninth SCL input pulse. This ACK
value is copied to the ACKSTAT bit of the SSP1CON2
register. If ACKSTAT is set (not ACK), then the data
transfer is complete. In this case, when the not ACK is
latched by the slave, the slave goes idle and waits for
another occurrence of the Start bit. If the SDA line was
low (ACK), the next transmit data must be loaded into
the SSP1BUF register. Again, the SCL pin must be
released by setting bit CKP.
An MSSP1 interrupt is generated for each data transfer
byte. The SSP1IF bit must be cleared by software and
the SSP1STAT register is used to determine the status
of the byte. The SSP1IF bit is set on the falling edge of
the ninth clock pulse.
25.5.3.1 Slave Mode Bus Collision
A slave receives a Read request and begins shifting
data out on the SDA line. If a bus collision is detected
and the SBCDE bit of the SSP1CON3 register is set,
the BCL1IF bit of the PIRx register is set. Once a bus
collision is detected, the slave goes idle and waits to be
addressed again. User software can use the BCL1IF bit
to handle a slave bus collision.
25.5.3.2 7-bit Transmission
A master device can transmit a read request to a
slave, and then clock data out of the slave. The list
below outlines what software for a slave will need to
do to accomplish a standard transmission.
Figure 25-18 can be used as a reference to this list.
1. Master sends a Start condition on SDA and
SCL.
2. S bit of SSP1STAT is set; SSP1IF is set if
interrupt on Start detect is enabled.
3. Matching address with R/W bit set is received by
the Slave setting SSP1IF bit.
4. Slave hardware generates an ACK and sets
SSP1IF.
5. SSP1IF bit is cleared by user.
6. Software reads the received address from
SSP1BUF, clearing BF.
7. R/W is set so CKP was automatically cleared
after the ACK.
8. The slave software loads the transmit data into
SSP1BUF.
9. CKP bit is set releasing SCL, allowing the mas-
ter to clock the data out of the slave.
10. SSP1IF is set after the ACK response from the
master is loaded into the ACKSTAT register.
11. SSP1IF bit is cleared.
12. The slave software checks the ACKSTAT bit to
see if the master wants to clock out more data.
13. Steps 9-13 are repeated for each transmitted
byte.
14. If the master sends a not ACK; the clock is not
held, but SSP1IF is still set.
15. The master sends a Restart condition or a Stop.
16. The slave is no longer addressed.
Note 1: If the master ACKs the clock will be
stretched.
2: ACKSTAT is the only bit updated on the
rising edge of SCL (9th) rather than the
falling.
2011-2015 Microchip Technology Inc. DS40001441F-page 215
PIC12(L)F1840
FIGURE 25-18: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 0)
Receiving Address Automatic Transmitting Data Automatic Transmitting Data
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SDA
SCL
SSPIF
BF
CKP
ACKSTAT
R/W
D/A
S
P
Received address
When R/W is set
R/W is copied from the
Indicates an address
is read from SSPBUF
SCL is always
held low after 9th SCL
falling edge
matching address byte
has been received
Masters not ACK
is copied to
ACKSTAT
CKP is not
held for not
ACK
BF is automatically
cleared after 8th falling
edge of SCL
Data to transmit is
loaded into SSPBUF
Set by software
Cleared by software
ACK
ACK
ACK
R/W = 1
SP
Master sends
Stop condition
E‘ S 3: ACK [ACK ACK ACK ACK ACK
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DS40001441F-page 216 2011-2015 Microchip Technology Inc.
25.5.3.3 7-bit Transmission with Address
Hold Enabled
Setting the AHEN bit of the SSP1CON3 register
enables additional clock stretching and interrupt
generation after the 8th falling edge of a received
matching address. Once a matching address has
been clocked in, CKP is cleared and the SSP1IF
interrupt is set.
Figure 25-19 displays a standard waveform of a 7-bit
Address Slave Transmission with AHEN enabled.
1. Bus starts Idle.
2. Master sends Start condition; the S bit of
SSP1STAT is set; SSP1IF is set if interrupt on
Start detect is enabled.
3. Master sends matching address with R/W bit
set. After the 8th falling edge of the SCL line the
CKP bit is cleared and SSP1IF interrupt is
generated.
4. Slave software clears SSP1IF.
5. Slave software reads ACKTIM bit of SSP1CON3
register, and R/W and D/A of the SSP1STAT
register to determine the source of the interrupt.
6. Slave reads the address value from the
SSP1BUF register clearing the BF bit.
7. Slave software decides from this information if it
wishes to ACK or not ACK and sets the ACKDT
bit of the SSP1CON2 register accordingly.
8. Slave sets the CKP bit releasing SCL.
9. Master clocks in the ACK value from the slave.
10. Slave hardware automatically clears the CKP bit
and sets SSP1IF after the ACK if the R/W bit is
set.
11. Slave software clears SSP1IF.
12. Slave loads value to transmit to the master into
SSP1BUF setting the BF bit.
13. Slave sets the CKP bit, releasing the clock.
14. Master clocks out the data from the slave and
sends an ACK value on the 9th SCL pulse.
15. Slave hardware copies the ACK value into the
ACKSTAT bit of the SSP1CON2 register.
16. Steps 10-15 are repeated for each byte
transmitted to the master from the slave.
17. If the master sends a not ACK the slave
releases the bus, allowing the master to send a
Stop and end the communication.
Note: SSP1BUF cannot be loaded until after the
ACK.
Note: Master must send a not ACK on the last byte
to ensure that the slave releases the SCL
line to receive a Stop.
2011-2015 Microchip Technology Inc. DS40001441F-page 217
PIC12(L)F1840
FIGURE 25-19: I2C SLAVE, 7-BIT ADDRESS, TRANSMISSION (AHEN = 1)
Receiving Address Automatic Transmitting Data Automatic Transmitting Data
A7 A6 A5 A4 A3 A2 A1 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
SDA
SCL
SSP1IF
BF
ACKDT
ACKSTAT
CKP
R/W
D/A
Received address
is read from SSP1BUF
BF is automatically
cleared after 8th falling
edge of SCL
Data to transmit is
loaded into SSP1BUF
Cleared by software
Slave clears
ACKDT to ACK
address
Master’s ACK
response is copied
to SSP1STAT
CKP not cleared
after not ACK
Set by software,
releases SCL
ACKTIM is cleared
on 9th rising edge of SCL
ACKTIM is set on 8th falling
edge of SCL
When AHEN = 1;
CKP is cleared by hardware
after receiving matching
address.
When R/W = 1;
CKP is always
cleared after ACK
SP
Master sends
Stop condition
ACK
R/W = 1
Master releases SDA
to slave for ACK sequence
ACK
ACK
ACKTIM
E‘ ACK ACK ACK SACK
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DS40001441F-page 218 2011-2015 Microchip Technology Inc.
25.5.4 SLAVE MODE 10-BIT ADDRESS
RECEPTION
This section describes a standard sequence of events
for the MSSP1 module configured as an I2C slave in
10-bit Addressing mode.
Figure 25-20 is used as a visual reference for this
description.
This is a step by step process of what must be done by
slave software to accomplish I2C communication.
1. Bus starts Idle.
2. Master sends Start condition; S bit of
SSP1STAT is set; SSP1IF is set if interrupt on
Start detect is enabled.
3. Master sends matching high address with R/W
bit clear; UA bit of the SSP1STAT register is set.
4. Slave sends ACK and SSP1IF is set.
5. Software clears the SSP1IF bit.
6. Software reads received address from
SSP1BUF clearing the BF flag.
7. Slave loads low address into SSP1ADD,
releasing SCL.
8. Master sends matching low address byte to the
slave; UA bit is set.
9. Slave sends ACK and SSP1IF is set.
10. Slave clears SSP1IF.
11. Slave reads the received matching address
from SSP1BUF clearing BF.
12. Slave loads high address into SSP1ADD.
13. Master clocks a data byte to the slave and
clocks out the slaves ACK on the 9th SCL pulse;
SSP1IF is set.
14. If SEN bit of SSP1CON2 is set, CKP is cleared
by hardware and the clock is stretched.
15. Slave clears SSP1IF.
16. Slave reads the received byte from SSP1BUF
clearing BF.
17. If SEN is set the slave sets CKP to release the
SCL.
18. Steps 13-17 repeat for each received byte.
19. Master sends Stop to end the transmission.
25.5.5 10-BIT ADDRESSING WITH ADDRESS OR
DATA HOLD
Reception using 10-bit addressing with AHEN or
DHEN set is the same as with 7-bit modes. The only
difference is the need to update the SSP1ADD register
using the UA bit. All functionality, specifically when the
CKP bit is cleared and SCL line is held low are the
same. Figure 25-21 can be used as a reference of a
slave in 10-bit addressing with AHEN set.
Figure 25-22 shows a standard waveform for a slave
transmitter in 10-bit Addressing mode.
Note: Updates to the SSP1ADD register are not
allowed until after the ACK sequence.
Note: If the low address does not match, SSP1IF
and UA are still set so that the slave soft-
ware can set SSP1ADD back to the high
address. BF is not set because there is no
match. CKP is unaffected.
2011-2015 Microchip Technology Inc. DS40001441F-page 219
PIC12(L)F1840
FIGURE 25-20: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 1, AHEN = 0, DHEN = 0)
SSP1IF
Receive First Address Byte
ACK
Receive Second Address Byte
ACK
Receive Data
ACK
Receive Data
ACK
1 1 1 1 0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5 D4 D3 D2 D1 D0
SDA
SCL
UA
CKP
12345678912345678
912345678
9123456789P
Master sends
Stop condition
Cleared by software
Receive address is
Software updates SSP1ADD
Data is read
SCL is held low
Set by software,
while CKP =
0
from SSP1BUF
releasing SCL
When SEN =
1
;
CKP is cleared after
9th falling edge of received byte
read from SSP1BUF
and releases SCL
When UA =
1
;
If address matches
Set by hardware
on 9th falling edge
SSP1ADD it is loaded into
SSP1BUF
SCL is held low
S
BF
PIC12(L)F1840
DS40001441F-page 220 2011-2015 Microchip Technology Inc.
FIGURE 25-21: I2C SLAVE, 10-BIT ADDRESS, RECEPTION (SEN = 0, AHEN = 1, DHEN = 0)
Receive First Address Byte
UA
Receive Second Address Byte
UA
Receive Data
ACK
Receive Data
1 1 1 1 0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 D7 D6 D5SDA
SCL
SSP1IF
BF
ACKDT
UA
CKP
ACKTIM
12345678 9
S
ACK
ACK
12345678 91234567891
2
SSP1BUF
is read from
Received data
SSP1BUF can be
read anytime before
the next received byte
Cleared by software
falling edge of SCL
not allowed until 9th
Update to SSP1ADD is
Set CKP with software
releases SCL
SCL
clears UA and releases
Update of SSP1ADD,
Set by hardware
on 9th falling edge
Slave software clears
ACKDT to ACK
the received byte
If when AHEN = 1;
on the 8th falling edge
of SCL of an address
byte, CKP is cleared
ACKTIM is set by hardware
on 8th falling edge of SCL
Cleared by software
R/W = 0
mmmmmmm
2011-2015 Microchip Technology Inc. DS40001441F-page 221
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FIGURE 25-22: I2C SLAVE, 10-BIT ADDRESS, TRANSMISSION (SEN = 0, AHEN = 0, DHEN = 0)
Receiving Address
ACK
Receiving Second Address Byte
Sr
Receive First Address Byte
ACK
Transmitting Data Byte
1 1 1 1 0
A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
1 1 1 1 0
A9 A8 D7 D6 D5 D4 D3 D2 D1 D0SDA
SCL
SSP1IF
BF
UA
CKP
R/W
D/A
123456789 123456789 1234 56789 123456789
ACK = 1
P
Master sends
Stop condition
Master sends
not ACK
Master sends
Restart event
ACK
R/W = 0
S
Cleared by software
After SSP1ADD is
updated, UA is cleared
and SCL is released
High address is loaded
Received address is Data to transmit is
Set by software
Indicates an address
When R/W = 1;
R/W is copied from the
Set by hardware
UA indicates SSP1ADD
SSP1BUF loaded
with received address
must be updated
has been received
loaded into SSP1BUF
releases SCL
Masters not ACK
is copied
matching address byte
CKP is cleared on
9th falling edge of SCL
read from SSP1BUF
back into SSP1ADD
ACKSTAT
Set by hardware
ACK W ACK
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25.5.6 CLOCK STRETCHING
Clock stretching occurs when a device on the bus
holds the SCL line low effectively pausing
communication. The slave may stretch the clock to
allow more time to handle data or prepare a response
for the master device. A master device is not
concerned with stretching as anytime it is active on the
bus and not transferring data it is stretching. Any
stretching done by a slave is invisible to the master
software and handled by the hardware that generates
SCL.
The CKP bit of the SSP1CON1 register is used to con-
trol stretching in software. Any time the CKP bit is
cleared, the module will wait for the SCL line to go low
and then hold it. Setting CKP will release SCL and
allow more communication.
25.5.6.1 Normal Clock Stretching
Following an ACK if the R/W bit of SSP1STAT is set, a
read request, the slave hardware will clear CKP. This
allows the slave time to update SSP1BUF with data to
transfer to the master. If the SEN bit of SSP1CON2 is
set, the slave hardware will always stretch the clock
after the ACK sequence. Once the slave is ready; CKP
is set by software and communication resumes.
25.5.6.2 10-bit Addressing Mode
In 10-bit Addressing mode, when the UA bit is set, the
clock is always stretched. This is the only time the SCL
is stretched without CKP being cleared. SCL is
released immediately after a write to SSP1ADD.
25.5.6.3 Byte NACKing
When AHEN bit of SSP1CON3 is set; CKP is cleared
by hardware after the 8th falling edge of SCL for a
received matching address byte. When DHEN bit of
SSP1CON3 is set; CKP is cleared after the 8th falling
edge of SCL for received data.
Stretching after the 8th falling edge of SCL allows the
slave to look at the received address or data and
decide if it wants to ACK the received data.
Note 1: The BF bit has no effect on if the clock will
be stretched or not. This is different than
previous versions of the module that
would not stretch the clock, clear CKP, if
SSP1BUF was read before the 9th falling
edge of SCL.
2: Previous versions of the module did not
stretch the clock for a transmission if
SSP1BUF was loaded before the 9th fall-
ing edge of SCL. It is now always cleared
for read requests.
Note: Previous versions of the module did not
stretch the clock if the second address byte
did not match.
sspwcom‘ WR
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PIC12(L)F1840
25.5.7 CLOCK SYNCHRONIZATION AND
THE CKP BIT
Any time the CKP bit is cleared, the module will wait
for the SCL line to go low and then hold it. However,
clearing the CKP bit will not assert the SCL output low
until the SCL output is already sampled low. There-
fore, the CKP bit will not assert the SCL line until an
external I2C master device has already asserted the
SCL line. The SCL output will remain low until the CKP
bit is set and all other devices on the I2C bus have
released SCL. This ensures that a write to the CKP bit
will not violate the minimum high time requirement for
SCL (see Figure 25-23).
FIGURE 25-23: CLOCK SYNCHRONIZATION TIMING
SDA
SCL
DX ‚ – 1DX
WR
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
SSP1CON1
CKP
Master device
releases clock
Master device
asserts clock
ACK
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25.5.8 GENERAL CALL ADDRESS SUPPORT
The addressing procedure for the I2C bus is such that
the first byte after the Start condition usually
determines which device will be the slave addressed
by the master device. The exception is the general call
address which can address all devices. When this
address is used, all devices should, in theory, respond
with an acknowledge.
The general call address is a reserved address in the
I2C protocol, defined as address 0x00. When the
GCEN bit of the SSP1CON2 register is set, the slave
module will automatically ACK the reception of this
address regardless of the value stored in SSP1ADD.
After the slave clocks in an address of all zeros with
the R/W bit clear, an interrupt is generated and slave
software can read SSP1BUF and respond.
Figure 25-24 shows a General Call reception
sequence.
In 10-bit Address mode, the UA bit will not be set on
the reception of the general call address. The slave
will prepare to receive the second byte as data, just as
it would in 7-bit mode.
If the AHEN bit of the SSP1CON3 register is set, just
as with any other address reception, the slave
hardware will stretch the clock after the 8th falling
edge of SCL. The slave must then set its ACKDT
value and release the clock with communication
progressing as it would normally.
FIGURE 25-24: SLAVE MODE GENERAL CALL ADDRESS SEQUENCE
25.5.9 SSP1 MASK REGISTER
An SSP1 Mask (SSP1MSK) register (Register 25-5) is
available in I2C Slave mode as a mask for the value
held in the SSP1SR register during an address
comparison operation. A zero (‘0’) bit in the SSP1MSK
register has the effect of making the corresponding bit
of the received address a “don’t care.”
This register is reset to all ‘1’s upon any Reset
condition and, therefore, has no effect on standard
SSP1 operation until written with a mask value.
The SSP1 Mask register is active during:
• 7-bit Address mode: address compare of A<7:1>.
• 10-bit Address mode: address compare of A<7:0>
only. The SSP1 mask has no effect during the
reception of the first (high) byte of the address.
SDA
SCL
S
SSPIF
BF (SSPSTAT<0>)
Cleared by software
SSPBUF is read
R/W = 0
ACK
General Call Address
Address is compared to General Call Address
Receiving Data ACK
123456789123456789
D7 D6 D5 D4 D3 D2 D1 D0
after ACK, set interrupt
GCEN (SSP1CON2<7>)
’1’
S /m E‘ /W
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25.6 I2C MASTER MODE
Master mode is enabled by setting and clearing the
appropriate SSPM bits in the SSP1CON1 register and
by setting the SSPEN bit. In Master mode, the SDA and
SCK pins must be configured as inputs. The MSSP
peripheral hardware will override the output driver TRIS
controls when necessary to drive the pins low.
Master mode of operation is supported by interrupt
generation on the detection of the Start and Stop
conditions. The Stop (P) and Start (S) bits are cleared
from a Reset or when the MSSP1 module is disabled.
Control of the I2C bus may be taken when the P bit is
set, or the bus is Idle.
In Firmware Controlled Master mode, user code
conducts all I2C bus operations based on Start and
Stop bit condition detection. Start and Stop condition
detection is the only active circuitry in this mode. All
other communication is done by the user software
directly manipulating the SDA and SCL lines.
The following events will cause the SSP1 Interrupt Flag
bit, SSP1IF, to be set (SSP1 interrupt, if enabled):
• Start condition detected
• Stop condition detected
• Data transfer byte transmitted/received
• Acknowledge transmitted/received
• Repeated Start generated
25.6.1 I2C MASTER MODE OPERATION
The master device generates all of the serial clock
pulses and the Start and Stop conditions. A transfer is
ended with a Stop condition or with a Repeated Start
condition. Since the Repeated Start condition is also
the beginning of the next serial transfer, the I2C bus will
not be released.
In Master Transmitter mode, serial data is output
through SDA, while SCL outputs the serial clock. The
first byte transmitted contains the slave address of the
receiving device (7 bits) and the Read/Write (R/W) bit.
In this case, the R/W bit will be logic ‘0’. Serial data is
transmitted eight bits at a time. After each byte is
transmitted, an Acknowledge bit is received. Start and
Stop conditions are output to indicate the beginning
and the end of a serial transfer.
In Master Receive mode, the first byte transmitted con-
tains the slave address of the transmitting device
(7 bits) and the R/W bit. In this case, the R/W bit will be
logic ‘1’. Thus, the first byte transmitted is a 7-bit slave
address followed by a ‘1’ to indicate the receive bit.
Serial data is received via SDA, while SCL outputs the
serial clock. Serial data is received 8 bits at a time. After
each byte is received, an Acknowledge bit is transmit-
ted. Start and Stop conditions indicate the beginning
and end of transmission.
A Baud Rate Generator is used to set the clock
frequency output on SCL. See Section 25.7 “Baud
Rate Generator” for more detail.
Note 1: The MSSP1 module, when configured in
I2C Master mode, does not allow queuing
of events. For instance, the user is not
allowed to initiate a Start condition and
immediately write the SSP1BUF register
to initiate transmission before the Start
condition is complete. In this case, the
SSP1BUF will not be written to and the
WCOL bit will be set, indicating that a
write to the SSP1BUF did not occur
2: When in Master mode, Start/Stop detec-
tion is masked and an interrupt is gener-
ated when the SEN/PEN bit is cleared and
the generation is complete.
E X
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25.6.2 CLOCK ARBITRATION
Clock arbitration occurs when the master, during any
receive, transmit or Repeated Start/Stop condition,
releases the SCL pin (SCL allowed to float high). When
the SCL pin is allowed to float high, the Baud Rate
Generator (BRG) is suspended from counting until the
SCL pin is actually sampled high. When the SCL pin is
sampled high, the Baud Rate Generator is reloaded
with the contents of SSP1ADD<7:0> and begins
counting. This ensures that the SCL high time will
always be at least one BRG rollover count in the event
that the clock is held low by an external device
(Figure 25-25).
FIGURE 25-25: BAUD RATE GENERATOR TIMING WITH CLOCK ARBITRATION
25.6.3 WCOL STATUS FLAG
If the user writes the SSP1BUF when a Start, Restart,
Stop, Receive or Transmit sequence is in progress, the
WCOL is set and the contents of the buffer are
unchanged (the write does not occur). Any time the
WCOL bit is set it indicates that an action on SSP1BUF
was attempted while the module was not idle.
SDA
SCL
SCL deasserted but slave holds
DX ‚ – 1DX
BRG
SCL is sampled high, reload takes
place and BRG starts its count
03h 02h 01h 00h (hold off) 03h 02h
Reload
BRG
Value
SCL low (clock arbitration)
SCL allowed to transition high
BRG decrements on
Q2 and Q4 cycles
Note: Because queuing of events is not allowed,
writing to the lower 5 bits of SSP1CON2 is
disabled until the Start condition is
complete.
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25.6.4 I2C MASTER MODE START
CONDITION TIMING
To initiate a Start condition (Figure 25-26), the user
sets the Start Enable bit, SEN bit of the SSP1CON2
register. If the SDA and SCL pins are sampled high,
the Baud Rate Generator is reloaded with the contents
of SSP1ADD<7:0> and starts its count. If SCL and
SDA are both sampled high when the Baud Rate
Generator times out (TBRG), the SDA pin is driven low.
The action of the SDA being driven low while SCL is
high is the Start condition and causes the S bit of the
SSP1STAT1 register to be set. Following this, the
Baud Rate Generator is reloaded with the contents of
SSP1ADD<7:0> and resumes its count. When the
Baud Rate Generator times out (TBRG), the SEN bit of
the SSP1CON2 register will be automatically cleared
by hardware; the Baud Rate Generator is suspended,
leaving the SDA line held low and the Start condition is
complete.
FIGURE 25-26: FIRST START BIT TIMING
Note 1: If at the beginning of the Start condition,
the SDA and SCL pins are already sam-
pled low, or if during the Start condition,
the SCL line is sampled low before the
SDA line is driven low, a bus collision
occurs, the Bus Collision Interrupt Flag,
BCL1IF, is set, the Start condition is
aborted and the I2C module is reset into
its Idle state.
2: The Philips I2C Specification states that a
bus collision cannot occur on a Start.
SDA
SCL
S
TBRG
1st bit 2nd bit
TBRG
SDA = 1, At completion of Start bit,
SCL = 1
Write to SSP1BUF occurs here
TBRG
hardware clears SEN bit
TBRG
Write to SEN bit occurs here Set S bit (SSP1STAT<3>)
and sets SSP1IF bit
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25.6.5 I2C MASTER MODE REPEATED
START CONDITION TIMING
A Repeated Start condition (Figure 25-27) occurs when
the RSEN bit of the SSP1CON2 register is
programmed high and the master state machine is no
longer active. When the RSEN bit is set, the SCL pin is
asserted low. When the SCL pin is sampled low, the
Baud Rate Generator is loaded and begins counting.
The SDA pin is released (brought high) for one Baud
Rate Generator count (TBRG). When the Baud Rate
Generator times out, if SDA is sampled high, the SCL
pin will be deasserted (brought high). When SCL is
sampled high, the Baud Rate Generator is reloaded
and begins counting. SDA and SCL must be sampled
high for one TBRG. This action is then followed by
assertion of the SDA pin (SDA = 0) for one TBRG while
SCL is high. SCL is asserted low. Following this, the
RSEN bit of the SSP1CON2 register will be automati-
cally cleared and the Baud Rate Generator will not be
reloaded, leaving the SDA pin held low. As soon as a
Start condition is detected on the SDA and SCL pins,
the S bit of the SSP1STAT register will be set. The
SSP1IF bit will not be set until the Baud Rate Generator
has timed out.
FIGURE 25-27: REPEAT START CONDITION WAVEFORM
Note 1: If RSEN is programmed while any other
event is in progress, it will not take effect.
2: A bus collision during the Repeated Start
condition occurs if:
• SDA is sampled low when SCL
goes from low-to-high.
• SCL goes low before SDA is
asserted low. This may indicate
that another master is attempting to
transmit a data ‘1’.
SDA
SCL
Repeated Start
Write to SSP1CON2
Write to SSP1BUF occurs here
At completion of Start bit,
hardware clears RSEN bit
1st bit
S bit set by hardware
TBRG
TBRG
SDA = 1,SDA = 1,
SCL (no change) SCL = 1
occurs here
TBRG TBRG TBRG
and sets SSP1IF
Sr
ACK ACK E‘ e ACK ACK ACK
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25.6.6 I2C MASTER MODE TRANSMISSION
Transmission of a data byte, a 7-bit address or the
other half of a 10-bit address is accomplished by simply
writing a value to the SSP1BUF register. This action will
set the Buffer Full flag bit, BF, and allow the Baud Rate
Generator to begin counting and start the next trans-
mission. Each bit of address/data will be shifted out
onto the SDA pin after the falling edge of SCL is
asserted. SCL is held low for one Baud Rate Generator
rollover count (TBRG). Data should be valid before SCL
is released high. When the SCL pin is released high, it
is held that way for TBRG. The data on the SDA pin
must remain stable for that duration and some hold
time after the next falling edge of SCL. After the eighth
bit is shifted out (the falling edge of the eighth clock),
the BF flag is cleared and the master releases SDA.
This allows the slave device being addressed to
respond with an ACK bit during the ninth bit time if an
address match occurred, or if data was received prop-
erly. The status of ACK is written into the ACKSTAT bit
on the rising edge of the ninth clock. If the master
receives an Acknowledge, the Acknowledge Status bit,
ACKSTAT, is cleared. If not, the bit is set. After the ninth
clock, the SSP1IF bit is set and the master clock (Baud
Rate Generator) is suspended until the next data byte
is loaded into the SSP1BUF, leaving SCL low and SDA
unchanged (Figure 25-28).
After the write to the SSP1BUF, each bit of the address
will be shifted out on the falling edge of SCL until all
seven address bits and the R/W bit are completed. On
the falling edge of the eighth clock, the master will
release the SDA pin, allowing the slave to respond with
an Acknowledge. On the falling edge of the ninth clock,
the master will sample the SDA pin to see if the address
was recognized by a slave. The status of the ACK bit is
loaded into the ACKSTAT Status bit of the SSP1CON2
register. Following the falling edge of the ninth clock
transmission of the address, the SSP1IF is set, the BF
flag is cleared and the Baud Rate Generator is turned
off until another write to the SSP1BUF takes place,
holding SCL low and allowing SDA to float.
25.6.6.1 BF Status Flag
In Transmit mode, the BF bit of the SSP1STAT register
is set when the CPU writes to SSP1BUF and is cleared
when all eight bits are shifted out.
25.6.6.2 WCOL Status Flag
If the user writes the SSP1BUF when a transmit is
already in progress (i.e., SSP1SR is still shifting out a
data byte), the WCOL bit is set and the contents of the
buffer are unchanged (the write does not occur).
WCOL must be cleared by software before the next
transmission.
25.6.6.3 ACKSTAT Status Flag
In Transmit mode, the ACKSTAT bit of the SSP1CON2
register is cleared when the slave has sent an
Acknowledge (ACK =0) and is set when the slave
does not Acknowledge (ACK =1). A slave sends an
Acknowledge when it has recognized its address
(including a general call), or when the slave has
properly received its data.
25.6.6.4 Typical transmit sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSP1CON2 register.
2. SSP1IF is set by hardware on completion of the
Start.
3. SSP1IF is cleared by software.
4. The MSSP1 module will wait the required start
time before any other operation takes place.
5. The user loads the SSP1BUF with the slave
address to transmit.
6. Address is shifted out the SDA pin until all eight
bits are transmitted. Transmission begins as
soon as SSP1BUF is written to.
7. The MSSP1 module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSP1CON2 register.
8. The MSSP1 module generates an interrupt at
the end of the ninth clock cycle by setting the
SSP1IF bit.
9. The user loads the SSP1BUF with eight bits of
data.
10. Data is shifted out the SDA pin until all eight bits
are transmitted.
11. The MSSP1 module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSP1CON2 register.
12. Steps 8-11 are repeated for all transmitted data
bytes.
13. The user generates a Stop or Restart condition
by setting the PEN or RSEN bits of the
SSP1CON2 register. Interrupt is generated
once the Stop/Restart condition is complete.
if A g E f I wiDDDDDQ Dig j>>j>j>>mw
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FIGURE 25-28: I2C MASTER MODE WAVEFORM (TRANSMISSION, 7 OR 10-BIT ADDRESS)
SDA
SCL
SSP1IF
BF (SSP1STAT<0>)
SEN
A7 A6 A5 A4 A3 A2 A1 ACK = 0D7 D6 D5 D4 D3 D2 D1 D0
ACK
Transmitting Data or Second Half
R/W = 0Transmit Address to Slave
123456789 123456789 P
Cleared by software service routine
SSP1BUF is written by software
from SSP1 interrupt
After Start condition, SEN cleared by hardware
S
SSP1BUF written with 7-bit address and R/W
start transmit
SCL held low
while CPU
responds to SSP1IF
SEN = 0
of 10-bit Address
Write SSP1CON2<0> SEN = 1
Start condition begins From slave, clear ACKSTAT bit SSP1CON2<6>
ACKSTAT in
SSP1CON2 = 1
Cleared by software
SSP1BUF written
PEN
R/W
Cleared by software
E‘ ACK ACK ACK ACK
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25.6.7 I2C MASTER MODE RECEPTION
Master mode reception (Figure 25-29) is enabled by
programming the Receive Enable bit, RCEN bit of the
SSP1CON2 register.
The Baud Rate Generator begins counting and on each
rollover, the state of the SCL pin changes
(high-to-low/low-to-high) and data is shifted into the
SSP1SR. After the falling edge of the eighth clock, the
receive enable flag is automatically cleared, the con-
tents of the SSP1SR are loaded into the SSP1BUF, the
BF flag bit is set, the SSP1IF flag bit is set and the Baud
Rate Generator is suspended from counting, holding
SCL low. The MSSP1 is now in Idle state awaiting the
next command. When the buffer is read by the CPU,
the BF flag bit is automatically cleared. The user can
then send an Acknowledge bit at the end of reception
by setting the Acknowledge Sequence Enable, ACKEN
bit of the SSP1CON2 register.
25.6.7.1 BF Status Flag
In receive operation, the BF bit is set when an address
or data byte is loaded into SSP1BUF from SSP1SR. It
is cleared when the SSP1BUF register is read.
25.6.7.2 SSP1OV Status Flag
In receive operation, the SSP1OV bit is set when eight
bits are received into the SSP1SR and the BF flag bit is
already set from a previous reception.
25.6.7.3 WCOL Status Flag
If the user writes the SSP1BUF when a receive is
already in progress (i.e., SSP1SR is still shifting in a
data byte), the WCOL bit is set and the contents of the
buffer are unchanged (the write does not occur).
25.6.7.4 Typical Receive Sequence:
1. The user generates a Start condition by setting
the SEN bit of the SSP1CON2 register.
2. SSP1IF is set by hardware on completion of the
Start.
3. SSP1IF is cleared by software.
4. User writes SSP1BUF with the slave address to
transmit and the R/W bit set.
5. Address is shifted out the SDA pin until all eight
bits are transmitted. Transmission begins as
soon as SSP1BUF is written to.
6. The MSSP1 module shifts in the ACK bit from
the slave device and writes its value into the
ACKSTAT bit of the SSP1CON2 register.
7. The MSSP1 module generates an interrupt at
the end of the ninth clock cycle by setting the
SSP1IF bit.
8. User sets the RCEN bit of the SSP1CON2
register and the master clocks in a byte from the
slave.
9. After the 8th falling edge of SCL, SSP1IF and
BF are set.
10. Master clears SSP1IF and reads the received
byte from SSP1UF, clears BF.
11. Master sets ACK value sent to slave in ACKDT
bit of the SSP1CON2 register and initiates the
ACK by setting the ACKEN bit.
12. Masters ACK is clocked out to the slave and
SSP1IF is set.
13. User clears SSP1IF.
14. Steps 8-13 are repeated for each received byte
from the slave.
15. Master sends a not ACK or Stop to end
communication.
Note: The MSSP1 module must be in an Idle
state before the RCEN bit is set or the
RCEN bit will be disregarded.
w , «Em A ”a A A: : a, T
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FIGURE 25-29: I2C MASTER MODE WAVEFORM (RECEPTION, 7-BIT ADDRESS)
P
9
87
6
5
D0
D1
D2
D3D4
D5
D6D7
S
A7 A6 A5 A4 A3 A2 A1
SDA
SCL 12345678912345678 9 1234
Bus master
terminates
transfer
ACK
Receiving Data from Slave
Receiving Data from Slave
D0
D1
D2
D3D4
D5
D6D7
ACK
R/W
Transmit Address to Slave
SSP1IF
BF
ACK is not sent
Write to SSP1CON2<0>(SEN = 1),
Write to SSP1BUF occurs here, ACK from Slave
Master configured as a receiver
by programming SSP1CON2<3> (RCEN = 1)
PEN bit = 1
written here
Data shifted in on falling edge of CLK
Cleared by software
start XMIT
SEN = 0
SSP1OV
SDA = 0, SCL = 1
while CPU
(SSP1STAT<0>)
ACK
Cleared by software
Cleared by software
Set SSP1IF interrupt
at end of receive
Set P bit
(SSP1STAT<4>)
and SSP1IF
Cleared in
software
ACK from Master
Set SSP1IF at end
Set SSP1IF interrupt
at end of Acknowledge
sequence
Set SSP1IF interrupt
at end of Acknow-
ledge sequence
of receive
Set ACKEN, start Acknowledge sequence
SSP1OV is set because
SSP1BUF is still full
SDA = ACKDT = 1
RCEN cleared
automatically
RCEN = 1, start
next receive
Write to SSP1CON2<4>
to start Acknowledge sequence
SDA = ACKDT (SSP1CON2<5>) = 0
RCEN cleared
automatically
responds to SSP1IF
ACKEN
begin Start condition
Cleared by software
SDA = ACKDT = 0
Last bit is shifted into SSP1SR and
contents are unloaded into SSP1BUF
RCEN
Master configured as a receiver
by programming SSP1CON2<3> (RCEN = 1)
RCEN cleared
automatically
ACK from Master
SDA\ = ACKDT = 0 RCEN cleared
automatically
J “
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25.6.8 ACKNOWLEDGE SEQUENCE
TIMING
An Acknowledge sequence is enabled by setting the
Acknowledge Sequence Enable bit, ACKEN bit of the
SSP1CON2 register. When this bit is set, the SCL pin is
pulled low and the contents of the Acknowledge data bit
are presented on the SDA pin. If the user wishes to gen-
erate an Acknowledge, then the ACKDT bit should be
cleared. If not, the user should set the ACKDT bit before
starting an Acknowledge sequence. The Baud Rate
Generator then counts for one rollover period (TBRG)
and the SCL pin is deasserted (pulled high). When the
SCL pin is sampled high (clock arbitration), the Baud
Rate Generator counts for TBRG. The SCL pin is then
pulled low. Following this, the ACKEN bit is automatically
cleared, the Baud Rate Generator is turned off and the
MSSP1 module then goes into Idle mode
(Figure 25-30).
25.6.8.1 WCOL Status Flag
If the user writes the SSP1BUF when an Acknowledge
sequence is in progress, then WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
25.6.9 STOP CONDITION TIMING
A Stop bit is asserted on the SDA pin at the end of a
receive/transmit by setting the Stop Sequence Enable
bit, PEN bit of the SSP1CON2 register. At the end of a
receive/transmit, the SCL line is held low after the
falling edge of the ninth clock. When the PEN bit is set,
the master will assert the SDA line low. When the SDA
line is sampled low, the Baud Rate Generator is
reloaded and counts down to ‘0’. When the Baud Rate
Generator times out, the SCL pin will be brought high
and one TBRG (Baud Rate Generator rollover count)
later, the SDA pin will be deasserted. When the SDA
pin is sampled high while SCL is high, the P bit of the
SSP1STAT register is set. A TBRG later, the PEN bit is
cleared and the SSP1IF bit is set (Figure 25-31).
25.6.9.1 WCOL Status Flag
If the user writes the SSP1BUF when a Stop sequence
is in progress, then the WCOL bit is set and the
contents of the buffer are unchanged (the write does
not occur).
FIGURE 25-30: ACKNOWLEDGE SEQUENCE WAVEFORM
Note: TBRG = one Baud Rate Generator period.
SDA
SCL
SSP1IF set at
Acknowledge sequence starts here,
write to SSP1CON2 ACKEN automatically cleared
Cleared in
TBRG TBRG
the end of receive
8
ACKEN = 1, ACKDT = 0
D0
9
SSP1IF
software SSP1IF set at the end
of Acknowledge sequence
Cleared in
software
ACK
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FIGURE 25-31: STOP CONDITION RECEIVE OR TRANSMIT MODE
25.6.10 SLEEP OPERATION
While in Sleep mode, the I2C slave module can receive
addresses or data and when an address match or
complete byte transfer occurs, wake the processor
from Sleep (if the MSSP1 interrupt is enabled).
25.6.11 EFFECTS OF A RESET
A Reset disables the MSSP1 module and terminates
the current transfer.
25.6.12 MULTI-MASTER MODE
In Multi-Master mode, the interrupt generation on the
detection of the Start and Stop conditions allows the
determination of when the bus is free. The Stop (P) and
Start (S) bits are cleared from a Reset or when the
MSSP1 module is disabled. Control of the I2C bus may
be taken when the P bit of the SSP1STAT register is
set, or the bus is Idle, with both the S and P bits clear.
When the bus is busy, enabling the SSP interrupt will
generate the interrupt when the Stop condition occurs.
In multi-master operation, the SDA line must be
monitored for arbitration to see if the signal level is the
expected output level. This check is performed by
hardware with the result placed in the BCL1IF bit.
The states where arbitration can be lost are:
• Address Transfer
• Data Transfer
• A Start Condition
• A Repeated Start Condition
• An Acknowledge Condition
25.6.13 MULTI -MASTER COMMUNICATION,
BUS COLLISION AND BUS
ARBITRATION
Multi-Master mode support is achieved by bus
arbitration. When the master outputs address/data bits
onto the SDA pin, arbitration takes place when the
master outputs a ‘1’ on SDA, by letting SDA float high
and another master asserts a ‘0’. When the SCL pin
floats high, data should be stable. If the expected data
on SDA is a ‘1’ and the data sampled on the SDA pin is
‘0’, then a bus collision has taken place. The master will
set the Bus Collision Interrupt Flag, BCL1IF, and reset
the I2C port to its Idle state (Figure 25-32).
If a transmit was in progress when the bus collision
occurred, the transmission is halted, the BF flag is
cleared, the SDA and SCL lines are deasserted and the
SSP1BUF can be written to. When the user services
the bus collision Interrupt Service Routine and if the I2C
bus is free, the user can resume communication by
asserting a Start condition.
If a Start, Repeated Start, Stop or Acknowledge
condition was in progress when the bus collision
occurred, the condition is aborted, the SDA and SCL
lines are deasserted and the respective control bits in
the SSP1CON2 register are cleared. When the user
services the bus collision Interrupt Service Routine and
if the I2C bus is free, the user can resume
communication by asserting a Start condition.
The master will continue to monitor the SDA and SCL
pins. If a Stop condition occurs, the SSP1IF bit will be set.
A write to the SSP1BUF will start the transmission of
data at the first data bit, regardless of where the
transmitter left off when the bus collision occurred.
In Multi-Master mode, the interrupt generation on the
detection of Start and Stop conditions allows the
determination of when the bus is free. Control of the I2C
bus can be taken when the P bit is set in the SSP1STAT
register, or the bus is Idle and the S and P bits are
cleared.
SCL
SDA
SDA asserted low before rising edge of clock
Write to SSP1CON2,
set PEN
Falling edge of
SCL = 1 for TBRG, followed by SDA = 1 for TBRG
9th clock
SCL brought high after TBRG
Note: TBRG = one Baud Rate Generator period.
TBRG TBRG
after SDA sampled high. P bit (SSP1STAT<4>) is set.
TBRG
to setup Stop condition
ACK
P
TBRG
PEN bit (SSP1CON2<2>) is cleared by
hardware and the SSP1IF bit is set
2011-2015 Microchip Technology Inc. DS40001441F-page 235
PIC12(L)F1840
FIGURE 25-32: BUS COLLISION TIMING FOR TRANSMIT AND ACKNOWLEDGE
SDA
SCL
BCL1IF
SDA released
SDA line pulled low
by another source
Sample SDA. While SCL is high,
data does not match what is driven
Bus collision has occurred.
Set bus collision
interrupt (BCL1IF)
by the master.
by master
Data changes
while SCL = 0
V
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DS40001441F-page 236 2011-2015 Microchip Technology Inc.
25.6.13.1 Bus Collision During a Start
Condition
During a Start condition, a bus collision occurs if:
a) SDA or SCL are sampled low at the beginning of
the Start condition (Figure 25-33).
b) SCL is sampled low before SDA is asserted low
(Figure 25-34).
During a Start condition, both the SDA and the SCL
pins are monitored.
If the SDA pin is already low, or the SCL pin is already
low, then all of the following occur:
• the Start condition is aborted,
• the BCL1IF flag is set and
• the MSSP1 module is reset to its Idle state
(Figure 25-33).
The Start condition begins with the SDA and SCL pins
deasserted. When the SDA pin is sampled high, the
Baud Rate Generator is loaded and counts down. If the
SCL pin is sampled low while SDA is high, a bus colli-
sion occurs because it is assumed that another master
is attempting to drive a data ‘1’ during the Start
condition.
If the SDA pin is sampled low during this count, the
BRG is reset and the SDA line is asserted early
(Figure 25-35). If, however, a ‘1’ is sampled on the SDA
pin, the SDA pin is asserted low at the end of the BRG
count. The Baud Rate Generator is then reloaded and
counts down to zero; if the SCL pin is sampled as ‘0’
during this time, a bus collision does not occur. At the
end of the BRG count, the SCL pin is asserted low.
FIGURE 25-33: BUS COLLISION DURING START CONDITION (SDA ONLY)
Note: The reason that bus collision is not a fac-
tor during a Start condition is that no two
bus masters can assert a Start condition
at the exact same time. Therefore, one
master will always assert SDA before the
other. This condition does not cause a bus
collision because the two masters must be
allowed to arbitrate the first address fol-
lowing the Start condition. If the address is
the same, arbitration must be allowed to
continue into the data portion, Repeated
Start or Stop conditions.
SDA
SCL
SEN
SDA sampled low before
SDA goes low before the SEN bit is set.
S bit and SSP1IF set because
SSP1 module reset into Idle state.
SEN cleared automatically because of bus collision.
S bit and SSP1IF set because
Set SEN, enable Start
condition if SDA = 1, SCL = 1
SDA = 0, SCL = 1.
BCL1IF
S
SSP1IF
SDA = 0, SCL = 1.
SSP1IF and BCL1IF are
cleared by software
SSP1IF and BCL1IF are
cleared by software
Set BCL1IF,
Start condition. Set BCL1IF.
2011-2015 Microchip Technology Inc. DS40001441F-page 237
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FIGURE 25-34: BUS COLLISION DURING START CONDITION (SCL = 0)
FIGURE 25-35: BRG RESET DUE TO SDA ARBITRATION DURING START CONDITION
SDA
SCL
SEN bus collision occurs. Set BCL1IF.
SCL = 0 before SDA = 0,
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
TBRG TBRG
SDA = 0, SCL = 1
BCL1IF
S
SSP1IF
Interrupt cleared
by software
bus collision occurs. Set BCL1IF.
SCL = 0 before BRG time-out,
’0’’0’
’0’’0’
SDA
SCL
SEN
Set S
Less than TBRG TBRG
SDA = 0, SCL = 1
BCL1IF
S
SSP1IF
S
Interrupts cleared
by software
set SSP1IF
SDA = 0, SCL = 1,
SCL pulled low after BRG
time-out
Set SSP1IF
’0’
SDA pulled low by other master.
Reset BRG and assert SDA.
Set SEN, enable Start
sequence if SDA = 1, SCL = 1
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DS40001441F-page 238 2011-2015 Microchip Technology Inc.
25.6.13.2 Bus Collision During a Repeated
Start Condition
During a Repeated Start condition, a bus collision
occurs if:
a) A low level is sampled on SDA when SCL goes
from low level to high level (Case 1).
b) SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’ (Case 2).
When the user releases SDA and the pin is allowed to
float high, the BRG is loaded with SSP1ADD and
counts down to zero. The SCL pin is then deasserted
and when sampled high, the SDA pin is sampled.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’, Figure 25-36).
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
masters can assert SDA at exactly the same time.
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition,
see Figure 25-37.
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
FIGURE 25-36: BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
FIGURE 25-37: BUS COLLISION DURING REPEATED START CONDITION (CASE 2)
SDA
SCL
RSEN
BCL1IF
S
SSP1IF
Sample SDA when SCL goes high.
If SDA = 0, set BCL1IF and release SDA and SCL.
Cleared by software
’0’
’0’
SDA
SCL
BCL1IF
RSEN
S
SSP1IF
Interrupt cleared
by software
SCL goes low before SDA,
set BCL1IF. Release SDA and SCL.
TBRG TBRG
’0’
2011-2015 Microchip Technology Inc. DS40001441F-page 239
PIC12(L)F1840
25.6.13.3 Bus Collision During a Stop
Condition
Bus collision occurs during a Stop condition if:
a) After the SDA pin has been deasserted and
allowed to float high, SDA is sampled low after
the BRG has timed out (Case 1).
b) After the SCL pin is deasserted, SCL is sampled
low before SDA goes high (Case 2).
The Stop condition begins with SDA asserted low.
When SDA is sampled low, the SCL pin is allowed to
float. When the pin is sampled high (clock arbitration),
the Baud Rate Generator is loaded with SSP1ADD and
counts down to 0. After the BRG times out, SDA is
sampled. If SDA is sampled low, a bus collision has
occurred. This is due to another master attempting to
drive a data ‘0’ (Figure 25-38). If the SCL pin is sampled
low before SDA is allowed to float high, a bus collision
occurs. This is another case of another master
attempting to drive a data ‘0’ (Figure 25-39).
FIGURE 25-38: BUS COLLISION DURING A STOP CONDITION (CASE 1)
FIGURE 25-39: BUS COLLISION DURING A STOP CONDITION (CASE 2)
SDA
SCL
BCL1IF
PEN
P
SSP1IF
TBRG TBRG TBRG
SDA asserted low
SDA sampled
low after TBRG,
set BCL1IF
’0’
’0’
SDA
SCL
BCL1IF
PEN
P
SSP1IF
TBRG TBRG TBRG
Assert SDA SCL goes low before SDA goes high,
set BCL1IF
’0’
’0’
PIC12(L)F1840
DS40001441F-page 240 2011-2015 Microchip Technology Inc.
TABLE 25-3: SUMMARY OF REGISTERS ASSOCIATED WITH I2C™ OPERATION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Reset
Values on
Page
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSP1IE CCP1IE TMR2IE TMR1IE 73
PIE2 OSFIE —C1IE EEIE BCL1IE —— — 74
PIR1 TMR1GIF ADIF RCIF TXIF SSP1IF CCP1IF TMR2IF TMR1IF 75
PIR2 OSFIF —C1IF EEIF BCL1IF — — —76
SSP1ADD ADD<7:0> 246
SSP1BUF Synchronous Serial Port Receive Buffer/Transmit Register 196*
SSP1CON1 WCOL SSPOV SSPEN CKP SSPM<3:0> 243
SSP1CON2 GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN 244
SSP1CON3 ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN 245
SSP1MSK MSK<7:0> 246
SSP1STAT SMP CKE D/A P S R/W UA BF 242
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used by the MSSP module in I2C™ mode.
* Page provides register information.
2011-2015 Microchip Technology Inc. DS40001441F-page 241
PIC12(L)F1840
25.7 BAUD RATE GENERATOR
The MSSP1 module has a Baud Rate Generator
available for clock generation in both I2C and SPI
Master modes. The Baud Rate Generator (BRG)
reload value is placed in the SSP1ADD register
(Register 25-6). When a write occurs to SSP1BUF, the
Baud Rate Generator will automatically begin counting
down.
Once the given operation is complete, the internal clock
will automatically stop counting and the clock pin will
remain in its last state.
An internal signal “Reload” in Figure 25-40 triggers the
value from SSP1ADD to be loaded into the BRG
counter. This occurs twice for each oscillation of the
module clock line. The logic dictating when the reload
signal is asserted depends on the mode the MSSP1 is
being operated in.
Table 25-4 demonstrates clock rates based on
instruction cycles and the BRG value loaded into
SSP1ADD.
EQUATION 25-1:
FIGURE 25-40: BAUD RATE GENERATOR BLOCK DIAGRAM
TABLE 25-4: MSSP1 CLOCK RATE W/BRG
FCLOCK FOSC
SSPxADD 1+4
-------------------------------------------------=
Note: Values of 0x00, 0x01 and 0x02 are not valid
for SSP1ADD when used as a Baud Rate
Generator for I2C. This is an implementation
limitation.
FOSC FCY BRG Value FCLOCK
(2 Rollovers of BRG)
32 MHz 8 MHz 13h 400 kHz
32 MHz 8 MHz 19h 308 kHz
32 MHz 8 MHz 4Fh 100 kHz
16 MHz 4 MHz 09h 400 kHz
16 MHz 4 MHz 0Ch 308 kHz
16 MHz 4 MHz 27h 100 kHz
4 MHz 1 MHz 09h 100 kHz
Note 1: Refer to the I/O port electrical and timing specifications in Table 30-4 and Figure 30-7 to ensure the
system is designed to support the I/O requirements.
SSP1M<3:0>
BRG Down Counter
SSP1CLK FOSC/2
SSP1ADD<7:0>
SSP1M<3:0>
SCL
Reload
Control
Reload
>I SPI Master mode SPI SIave mode In I20 MasIer or SIave made. In SPI Master or SIave mode. In IZCW mode arIIy _ Dam/Address ’ NVnIe ms nIInqus Ina Rm anon folIo m ACK In I20 SIave mode. In I20 MasIer mode. Recere SFI and I20 modes . TransmIl I20 mode only)
PIC12(L)F1840
DS40001441F-page 242 2011-2015 Microchip Technology Inc.
25.8 Register Definitions: MSSP Control
REGISTER 25-1: SSPSTAT: SSP STATUS REGISTER
R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0 R-0/0
SMP CKE D/A PSR/WUA BF
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SMP: SPI Data Input Sample bit
SPI Master mode:
1 = Input data sampled at end of data output time
0 = Input data sampled at middle of data output time
SPI Slave mode:
SMP must be cleared when SPI is used in Slave mode
In I2 C Master or Slave mode:
1 = Slew rate control disabled for standard speed mode (100 kHz and 1 MHz)
0 = Slew rate control enabled for high speed mode (400 kHz)
bit 6 CKE: SPI Clock Edge Select bit (SPI mode only)
In SPI Master or Slave mode:
1 = Transmit occurs on transition from active to Idle clock state
0 = Transmit occurs on transition from Idle to active clock state
In I2 C™ mode only:
1 = Enable input logic so that thresholds are compliant with SMBus specification
0 = Disable SMBus specific inputs
bit 5 D/A: Data/Address bit (I2C mode only)
1 = Indicates that the last byte received or transmitted was data
0 = Indicates that the last byte received or transmitted was address
bit 4 P: Stop bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Stop bit has been detected last (this bit is ‘0’ on Reset)
0 = Stop bit was not detected last
bit 3 S: Start bit
(I2C mode only. This bit is cleared when the MSSP module is disabled, SSPEN is cleared.)
1 = Indicates that a Start bit has been detected last (this bit is ‘0’ on Reset)
0 = Start bit was not detected last
bit 2 R/W: Read/Write bit information (I2C mode only)
This bit holds the R/W bit information following the last address match. This bit is only valid from the address match
to the next Start bit, Stop bit, or not ACK bit.
In I2 C Slave mode:
1 = Read
0 = Write
In I2 C Master mode:
1 = Transmit is in progress
0 = Transmit is not in progress
OR-ing this bit with SEN, RSEN, PEN, RCEN or ACKEN will indicate if the MSSP is in Idle mode.
bit 1 UA: Update Address bit (10-bit I2C mode only)
1 = Indicates that the user needs to update the address in the SSPADD register
0 = Address does not need to be updated
bit 0 BF: Buffer Full Status bit
Receive (SPI and I2 C modes):
1 = Receive complete, SSPBUF is full
0 = Receive not complete, SSPBUF is empty
Transmit (I2 C mode only):
1 = Data transmit in progress (does not include the ACK and Stop bits), SSPBUF is full
0 = Data transmit complete (does not include the ACK and Stop bits), SSPBUF is empty
Master mode SIave mode In SPI mode In I20 mode In boIh mode In SPI mode 7 EnabIes senaI port and configures say 500, SDI and 55 In I20 mode In SPI mode In I20 SIave mode : H In I20 Master made i led, E
2011-2015 Microchip Technology Inc. DS40001441F-page 243
PIC12(L)F1840
REGISTER 25-2: SSP1CON1: SSP1 CONTROL REGISTER 1
R/C/HS-0/0 R/C/HS-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
WCOL SSP1OV SSP1EN CKP SSP1M<3:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HS = Bit is set by hardware C = User cleared
bit 7 WCOL: Write Collision Detect bit
Master mode:
1 = A write to the SSP1BUF register was attempted while the I2C conditions were not valid for a transmission to be started
0 = No collision
Slave mode:
1 = The SSP1BUF register is written while it is still transmitting the previous word (must be cleared in software)
0 = No collision
bit 6 SSP1OV: Receive Overflow Indicator bit(1)
In SPI mode:
1 = A new byte is received while the SSP1BUF register is still holding the previous data. In case of overflow, the data in SSP1SR
is lost. Overflow can only occur in Slave mode. In Slave mode, the user must read the SSP1BUF, even if only transmitting
data, to avoid setting overflow. In Master mode, the overflow bit is not set since each new reception (and transmission) is
initiated by writing to the SSP1BUF register (must be cleared in software).
0 = No overflow
In I2 C mode:
1 = A byte is received while the SSP1BUF register is still holding the previous byte. SSP1OV is a “don’t care” in Transmit
mode (must be cleared in software).
0 = No overflow
bit 5 SSP1EN: Synchronous Serial Port Enable bit
In both modes, when enabled, these pins must be properly configured as input or output
In SPI mode:
1 = Enables serial port and configures SCK, SDO, SDI and SS as the source of the serial port pins(2)
0 = Disables serial port and configures these pins as I/O port pins
In I2 C mode:
1 = Enables the serial port and configures the SDA and SCL pins as the source of the serial port pins(3)
0 = Disables serial port and configures these pins as I/O port pins
bit 4 CKP: Clock Polarity Select bit
In SPI mode:
1 = Idle state for clock is a high level
0 = Idle state for clock is a low level
In I2 C Slave mode:
SCL release control
1 = Enable clock
0 = Holds clock low (clock stretch). (Used to ensure data setup time.)
In I2 C Master mode:
Unused in this mode
bit 3-0 SSPM<3:0>: Synchronous Serial Port Mode Select bits
1111 = I2C Slave mode, 10-bit address with Start and Stop bit interrupts enabled
1110 = I2C Slave mode, 7-bit address with Start and Stop bit interrupts enabled
1101 = Reserved
1100 = Reserved
1011 = I2C firmware controlled Master mode (slave idle)
1010 = SPI Master mode, clock = FOSC/(4 * (SSPADD+1))(5)
1001 = Reserved
1000 = I2C Master mode, clock = FOSC / (4 * (SSPADD+1))(4)
0111 = I2C Slave mode, 10-bit address
0110 = I2C Slave mode, 7-bit address
0101 = SPI Slave mode, clock = SCK pin, SS pin control disabled, SS can be used as I/O pin
0100 = SPI Slave mode, clock = SCK pin, SS pin control enabled
0011 = SPI Master mode, clock = TMR2 output/2
0010 = SPI Master mode, clock = FOSC/64
0001 = SPI Master mode, clock = FOSC/16
0000 = SPI Master mode, clock = FOSC/4
Note 1: In Master mode, the overflow bit is not set since each new reception (and transmission) is initiated by writing to the SSP1BUF
register.
2: When enabled, these pins must be properly configured as input or output.
3: When enabled, the SDA and SCL pins must be configured as inputs.
4: SSP1ADD values of 0, 1 or 2 are not supported for I2C mode.
5: SSP1ADD value of ‘0’ is not supported. Use SSP1M = 0000 instead.
In Receive mode. In Master Recewe mode. SCKMSSP Release Control. In Masler mode. In SIave mode.
PIC12(L)F1840
DS40001441F-page 244 2011-2015 Microchip Technology Inc.
REGISTER 25-3: SSP1CON2: SSP1 CONTROL REGISTER 2
R/W-0/0 R-0/0 R/W-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/S/HS-0/0 R/W/HS-0/0
GCEN ACKSTAT ACKDT ACKEN RCEN PEN RSEN SEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared HC = Cleared by hardware S = User set
bit 7 GCEN: General Call Enable bit (in I2C Slave mode only)
1 = Enable interrupt when a general call address (0x00 or 00h) is received in the SSP1SR
0 = General call address disabled
bit 6 ACKSTAT: Acknowledge Status bit (in I2C mode only)
1 = Acknowledge was not received
0 = Acknowledge was received
bit 5 ACKDT: Acknowledge Data bit (in I2C mode only)
In Receive mode:
Value transmitted when the user initiates an Acknowledge sequence at the end of a receive
1 = Not Acknowledge
0 = Acknowledge
bit 4 ACKEN: Acknowledge Sequence Enable bit (in I2C Master mode only)
In Master Receive mode:
1 = Initiate Acknowledge sequence on SDA and SCL pins, and transmit ACKDT data bit.
Automatically cleared by hardware.
0 = Acknowledge sequence idle
bit 3 RCEN: Receive Enable bit (in I2C Master mode only)
1 = Enables Receive mode for I2C
0 = Receive idle
bit 2 PEN: Stop Condition Enable bit (in I2C Master mode only)
SCKMSSP Release Control:
1 = Initiate Stop condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Stop condition Idle
bit 1 RSEN: Repeated Start Condition Enable bit (in I2C Master mode only)
1 = Initiate Repeated Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Repeated Start condition Idle
bit 0 SEN: Start Condition Enable/Stretch Enable bit
In Master mode:
1 = Initiate Start condition on SDA and SCL pins. Automatically cleared by hardware.
0 = Start condition Idle
In Slave mode:
1 = Clock stretching is enabled for both slave transmit and slave receive (stretch enabled)
0 = Clock stretching is disabled
Note 1: For bits ACKEN, RCEN, PEN, RSEN, SEN: If the I2C module is not in the Idle mode, this bit may not be
set (no spooling) and the SSP1BUF may not be written (or writes to the SSP1BUF are disabled).
In SP‘ S‘ave mode. @243 Maser mode and SPI Masmr mode. @243 Save mode. ACK
2011-2015 Microchip Technology Inc. DS40001441F-page 245
PIC12(L)F1840
REGISTER 25-4: SSP1CON3: SSP1 CONTROL REGISTER 3
R-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ACKTIM PCIE SCIE BOEN SDAHT SBCDE AHEN DHEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ACKTIM: Acknowledge Time Status bit (I2C mode only)(3)
1 = Indicates the I2C bus is in an Acknowledge sequence, set on 8TH falling edge of SCL clock
0 = Not an Acknowledge sequence, cleared on 9TH rising edge of SCL clock
bit 6 PCIE: Stop Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Stop condition
0 = Stop detection interrupts are disabled(2)
bit 5 SCIE: Start Condition Interrupt Enable bit (I2C mode only)
1 = Enable interrupt on detection of Start or Restart conditions
0 = Start detection interrupts are disabled(2)
bit 4 BOEN: Buffer Overwrite Enable bit
In SPI Slave mode:(1)
1 = SSP1BUF updates every time that a new data byte is shifted in ignoring the BF bit
0 = If new byte is received with BF bit of the SSP1STAT register already set, SSP1OV bit of the
SSP1CON1 register is set, and the buffer is not updated
In I2C Master mode and SPI Master mode:
This bit is ignored.
In I2C Slave mode:
1 = SSP1BUF is updated and ACK is generated for a received address/data byte, ignoring the
state of the SSP1OV bit only if the BF bit = 0.
0 = SSP1BUF is only updated when SSP1OV is clear
bit 3 SDAHT: SDA Hold Time Selection bit (I2C mode only)
1 = Minimum of 300 ns hold time on SDA after the falling edge of SCL
0 = Minimum of 100 ns hold time on SDA after the falling edge of SCL
bit 2 SBCDE: Slave Mode Bus Collision Detect Enable bit (I2C Slave mode only)
If on the rising edge of SCL, SDA is sampled low when the module is outputting a high state, the
BCL1IF bit of the PIR2 register is set, and bus goes idle
1 = Enable slave bus collision interrupts
0 = Slave bus collision interrupts are disabled
bit 1 AHEN: Address Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a matching received address byte; CKP bit of the
SSP1CON1 register will be cleared and the SCL will be held low.
0 = Address holding is disabled
bit 0 DHEN: Data Hold Enable bit (I2C Slave mode only)
1 = Following the 8th falling edge of SCL for a received data byte; slave hardware clears the CKP bit
of the SSP1CON1 register and SCL is held low.
0 = Data holding is disabled
Note 1: For daisy-chained SPI operation; allows the user to ignore all but the last received byte. SSP1OV is still set
when a new byte is received and BF = 1, but hardware continues to write the most recent byte to
SSP1BUF.
2: This bit has no effect in Slave modes that Start and Stop condition detection is explicitly listed as enabled.
3: The ACKTIM Status bit is only active when the AHEN bit or DHEN bit is set.
Master mode: 10-Bit Slave mode — Most Significant Address Byte: 10-Bil Slave mode — Least Significant Address Byte: 7-Bil Slave mode:
PIC12(L)F1840
DS40001441F-page 246 2011-2015 Microchip Technology Inc.
REGISTER 25-5: SSP1MSK: SSP1 MASK REGISTER
R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1 R/W-1/1
MSK<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-1 MSK<7:1>: Mask bits
1 = The received address bit n is compared to SSP1ADD<n> to detect I2C address match
0 = The received address bit n is not used to detect I2C address match
bit 0 MSK<0>: Mask bit for I2C Slave mode, 10-bit Address
I2C Slave mode, 10-bit address (SSP1M<3:0> = 0111 or 1111):
1 = The received address bit 0 is compared to SSP1ADD<0> to detect I2C address match
0 = The received address bit 0 is not used to detect I2C address match
I2C Slave mode, 7-bit address, the bit is ignored
REGISTER 25-6: SSP1ADD: MSSP1 ADDRESS AND BAUD RATE REGISTER (I2C MODE)
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0
ADD<7:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
Master mode:
bit 7-0 ADD<7:0>: Baud Rate Clock Divider bits
SCL pin clock period = ((ADD<7:0> + 1) *4)/FOSC
10-Bit Slave mode — Most Significant Address Byte:
bit 7-3 Not used: Unused for Most Significant Address byte. Bit state of this register is a “don’t care”. Bit
pattern sent by master is fixed by I2C specification and must be equal to ‘11110’. However, those bits
are compared by hardware and are not affected by the value in this register.
bit 2-1 ADD<2:1>: Two Most Significant bits of 10-bit address
bit 0 Not used: Unused in this mode. Bit state is a “don’t care.”
10-Bit Slave mode — Least Significant Address Byte:
bit 7-0 ADD<7:0>: Eight Least Significant bits of 10-bit address
7-Bit Slave mode:
bit 7-1 ADD<7:1>: 7-bit address
bit 0 Not used: Unused in this mode. Bit state is a “don’t care.”
T><9>
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26.0 ENHANCED UNIVERSAL
SYNCHRONOUS
ASYNCHRONOUS RECEIVER
TRANSMITTER (EUSART)
The Enhanced Universal Synchronous Asynchronous
Receiver Transmitter (EUSART) module is a serial I/O
communications peripheral. It contains all the clock
generators, shift registers and data buffers necessary
to perform an input or output serial data transfer
independent of device program execution. The
EUSART, also known as a Serial Communications
Interface (SCI), can be configured as a full-duplex
asynchronous system or half-duplex synchronous
system. Full-Duplex mode is useful for
communications with peripheral systems, such as CRT
terminals and personal computers. Half-Duplex
Synchronous mode is intended for communications
with peripheral devices, such as A/D or D/A integrated
circuits, serial EEPROMs or other microcontrollers.
These devices typically do not have internal clocks for
baud rate generation and require the external clock
signal provided by a master synchronous device.
The EUSART module includes the following capabilities:
• Full-duplex asynchronous transmit and receive
• Two-character input buffer
• One-character output buffer
• Programmable 8-bit or 9-bit character length
• Address detection in 9-bit mode
• Input buffer overrun error detection
• Received character framing error detection
• Half-duplex synchronous master
• Half-duplex synchronous slave
• Programmable clock polarity in synchronous
modes
• Sleep operation
The EUSART module implements the following
additional features, making it ideally suited for use in
Local Interconnect Network (LIN) bus systems:
• Automatic detection and calibration of the baud rate
• Wake-up on Break reception
• 13-bit Break character transmit
Block diagrams of the EUSART transmitter and
receiver are shown in Figure 26-1 and Figure 26-2.
FIGURE 26-1: EUSART TRANSMIT BLOCK DIAGRAM
TXIF
TXIE
Interrupt
TXEN
TX9D
MSb LSb
Data Bus
TXREG Register
Transmit Shift Register (TSR)
(8) 0
TX9
TRMT SPEN
TX/CK pin
Pin Buffer
and Control
8
SPBRGL
SPBRGH
BRG16
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
•••
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DS40001441F-page 248 2011-2015 Microchip Technology Inc.
FIGURE 26-2: EUSART RECEIVE BLOCK DIAGRAM
The operation of the EUSART module is controlled
through three registers:
• Transmit Status and Control (TXSTA)
• Receive Status and Control (RCSTA)
• Baud Rate Control (BAUDCON)
These registers are detailed in Register 26-1,
Register 26-2 and Register 26-3, respectively.
When the receiver or transmitter section is not enabled
then the corresponding RX or TX pin may be used for
general purpose input and output.
RX/DT pin
Pin Buffer
and Control
SPEN
Data
Recovery
CREN OERR
FERR
RSR Register
MSb LSb
RX9D RCREG Register FIFO
Interrupt
RCIF
RCIE
Data Bus
8
Stop START
(8) 7 1 0
RX9
• • •
SPBRGLSPBRGH
BRG16
RCIDL
FOSC ÷ n
n
+ 1 Multiplier x4 x16 x64
SYNC 1X00 0
BRGH X110 0
BRG16 X101 0
Baud Rate Generator
when Ihe TXEN enable
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PIC12(L)F1840
26.1 EUSART Asynchronous Mode
The EUSART transmits and receives data using the
standard non-return-to-zero (NRZ) format. NRZ is
implemented with two levels: a VOH mark state which
represents a ‘1’ data bit, and a VOL space state which
represents a ‘0’ data bit. NRZ refers to the fact that
consecutively transmitted data bits of the same value
stay at the output level of that bit without returning to a
neutral level between each bit transmission. An NRZ
transmission port idles in the Mark state. Each character
transmission consists of one Start bit followed by eight
or nine data bits and is always terminated by one or
more Stop bits. The Start bit is always a space and the
Stop bits are always marks. The most common data
format is eight bits. Each transmitted bit persists for a
period of 1/(Baud Rate). An on-chip dedicated
8-bit/16-bit Baud Rate Generator is used to derive
standard baud rate frequencies from the system
oscillator. See Tabl e 26-5 for examples of baud rate
configurations.
The EUSART transmits and receives the LSb first. The
EUSART’s transmitter and receiver are functionally
independent, but share the same data format and baud
rate. Parity is not supported by the hardware, but can
be implemented in software and stored as the ninth
data bit.
26.1.1 EUSART ASYNCHRONOUS
TRANSMITTER
The EUSART transmitter block diagram is shown in
Figure 26-1. The heart of the transmitter is the serial
Transmit Shift Register (TSR), which is not directly
accessible by software. The TSR obtains its data from
the transmit buffer, which is the TXREG register.
26.1.1.1 Enabling the Transmitter
The EUSART transmitter is enabled for asynchronous
operations by configuring the following three control
bits:
•TXEN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the TXEN bit of the TXSTA register enables the
transmitter circuitry of the EUSART. Clearing the SYNC
bit of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART and automatically
configures the TX/CK I/O pin as an output. If the TX/CK
pin is shared with an analog peripheral, the analog I/O
function must be disabled by clearing the corresponding
ANSEL bit.
26.1.1.2 Transmitting Data
A transmission is initiated by writing a character to the
TXREG register. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately
transferred to the TSR register. If the TSR still contains
all or part of a previous character, the new character
data is held in the TXREG until the Stop bit of the
previous character has been transmitted. The pending
character in the TXREG is then transferred to the TSR
in one TCY immediately following the Stop bit
transmission. The transmission of the Start bit, data bits
and Stop bit sequence commences immediately
following the transfer of the data to the TSR from the
TXREG.
26.1.1.3 Transmit Data Polarity
The polarity of the transmit data can be controlled with
the SCKP bit of the BAUDCON register. The default
state of this bit is ‘0’ which selects high true transmit idle
and data bits. Setting the SCKP bit to ‘1’ will invert the
transmit data resulting in low true idle and data bits. The
SCKP bit controls transmit data polarity in
Asynchronous mode only. In Synchronous mode, the
SCKP bit has a different function. See Section 26.5.1.2
“Clock Polarity”.
26.1.1.4 Transmit Interrupt Flag
The TXIF interrupt flag bit of the PIR1 register is set
whenever the EUSART transmitter is enabled and no
character is being held for transmission in the TXREG.
In other words, the TXIF bit is only clear when the TSR
is busy with a character and a new character has been
queued for transmission in the TXREG. The TXIF flag bit
is not cleared immediately upon writing TXREG. TXIF
becomes valid in the second instruction cycle following
the write execution. Polling TXIF immediately following
the TXREG write will return invalid results. The TXIF bit
is read-only, it cannot be set or cleared by software.
The TXIF interrupt can be enabled by setting the TXIE
interrupt enable bit of the PIE1 register. However, the
TXIF flag bit will be set whenever the TXREG is empty,
regardless of the state of TXIE enable bit.
To use interrupts when transmitting data, set the TXIE
bit only when there is more data to send. Clear the
TXIE interrupt enable bit upon writing the last character
of the transmission to the TXREG.
Note 1: The TXIF Transmitter Interrupt flag is set
when the TXEN enable bit is set.
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26.1.1.5 TSR Status
The TRMT bit of the TXSTA register indicates the
status of the TSR register. This is a read-only bit. The
TRMT bit is set when the TSR register is empty and is
cleared when a character is transferred to the TSR
register from the TXREG. The TRMT bit remains clear
until all bits have been shifted out of the TSR register.
No interrupt logic is tied to this bit, so the user has to
poll this bit to determine the TSR status.
26.1.1.6 Transmitting 9-Bit Characters
The EUSART supports 9-bit character transmissions.
When the TX9 bit of the TXSTA register is set, the
EUSART will shift nine bits out for each character
transmitted. The TX9D bit of the TXSTA register is the
ninth, and Most Significant, data bit. When transmitting
9-bit data, the TX9D data bit must be written before
writing the eight Least Significant bits into the TXREG.
All nine bits of data will be transferred to the TSR shift
register immediately after the TXREG is written.
A special 9-bit Address mode is available for use with
multiple receivers. See Section 26.1.2.7 “Address
Detection” for more information on the address mode.
26.1.1.7 Asynchronous Transmission Set-up:
1. Initialize the SPBRGH, SPBRGL register pair and
the BRGH and BRG16 bits to achieve the desired
baud rate (see Section 26.4 “EUSART Baud
Rate Generator (BRG)”).
2. Enable the asynchronous serial port by clearing
the SYNC bit and setting the SPEN bit.
3. If 9-bit transmission is desired, set the TX9
control bit. A set ninth data bit will indicate that
the eight Least Significant data bits are an
address when the receiver is set for address
detection.
4. Set SCKP bit if inverted transmit is desired.
5. Enable the transmission by setting the TXEN
control bit. This will cause the TXIF interrupt bit
to be set.
6. If interrupts are desired, set the TXIE interrupt
enable bit of the PIE1 register. An interrupt will
occur immediately provided that the GIE and
PEIE bits of the INTCON register are also set.
7. If 9-bit transmission is selected, the ninth bit
should be loaded into the TX9D data bit.
8. Load 8-bit data into the TXREG register. This
will start the transmission.
FIGURE 26-3: ASYNCHRONOUS TRANSMISSION
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
Word 1
Stop bit
Word 1
Transmit Shift Reg.
Start bit bit 0 bit 1 bit 7/8
Write to TXREG
Word 1
BRG Output
(Shift Clock)
TX/CK
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
TRMT bit
(Transmit Shift
Reg. Empty Flag)
1 TCY
pin
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FIGURE 26-4: ASYNCHRONOUS TRANSMISSION (BACK-TO-BACK)
TABLE 26-1: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 259
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 75
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
SPBRGL BRG<7:0> 260*
SPBRGH BRG<15:8> 260*
TXREG EUSART Transmit Data Register 249*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Asynchronous Transmission.
* Page provides register information.
Transmit Shift Reg.
Write to TXREG
BRG Output
(Shift Clock)
TX/CK
TRMT bit
(Transmit Shift
Reg. Empty Flag)
Word 1 Word 2
Word 1 Word 2
Start bit Stop bit Start bit
Transmit Shift Reg.
Word 1 Word 2
bit 0 bit 1 bit 7/8 bit 0
Note: This timing diagram shows two consecutive transmissions.
1 TCY
1 TCY
pin
TXIF bit
(Transmit Buffer
Reg. Empty Flag)
cleared for rhe receiver Io funcrion. rnformarion on overrun errors
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26.1.2 EUSART ASYNCHRONOUS
RECEIVER
The Asynchronous mode is typically used in RS-232
systems. The receiver block diagram is shown in
Figure 26-2. The data is received on the RX/DT pin and
drives the data recovery block. The data recovery block
is actually a high-speed shifter operating at 16 times
the baud rate, whereas the serial Receive Shift
Register (RSR) operates at the bit rate. When all eight
or nine bits of the character have been shifted in, they
are immediately transferred to a two character
First-In-First-Out (FIFO) memory. The FIFO buffering
allows reception of two complete characters and the
start of a third character before software must start
servicing the EUSART receiver. The FIFO and RSR
registers are not directly accessible by software.
Access to the received data is via the RCREG register.
26.1.2.1 Enabling the Receiver
The EUSART receiver is enabled for asynchronous
operation by configuring the following three control bits:
• CREN = 1
• SYNC = 0
• SPEN = 1
All other EUSART control bits are assumed to be in
their default state.
Setting the CREN bit of the RCSTA register enables the
receiver circuitry of the EUSART. Clearing the SYNC bit
of the TXSTA register configures the EUSART for
asynchronous operation. Setting the SPEN bit of the
RCSTA register enables the EUSART. The programmer
must set the corresponding TRIS bit to configure the
RX/DT I/O pin as an input.
26.1.2.2 Receiving Data
The receiver data recovery circuit initiates character
reception on the falling edge of the first bit. The first bit,
also known as the Start bit, is always a zero. The data
recovery circuit counts one-half bit time to the center of
the Start bit and verifies that the bit is still a zero. If it is
not a zero then the data recovery circuit aborts
character reception, without generating an error, and
resumes looking for the falling edge of the Start bit. If
the Start bit zero verification succeeds then the data
recovery circuit counts a full bit time to the center of the
next bit. The bit is then sampled by a majority detect
circuit and the resulting ‘0’ or ‘1’ is shifted into the RSR.
This repeats until all data bits have been sampled and
shifted into the RSR. One final bit time is measured and
the level sampled. This is the Stop bit, which is always
a ‘1’. If the data recovery circuit samples a ‘0’ in the
Stop bit position then a framing error is set for this
character, otherwise the framing error is cleared for this
character. See Section 26.1.2.4 “Receive Framing
Error” for more information on framing errors.
Immediately after all data bits and the Stop bit have
been received, the character in the RSR is transferred
to the EUSART receive FIFO and the RCIF interrupt
flag bit of the PIR1 register is set. The top character in
the FIFO is transferred out of the FIFO by reading the
RCREG register.
26.1.2.3 Receive Interrupts
The RCIF interrupt flag bit of the PIR1 register is set
whenever the EUSART receiver is enabled and there is
an unread character in the receive FIFO. The RCIF
interrupt flag bit is read-only, it cannot be set or cleared
by software.
RCIF interrupts are enabled by setting all of the
following bits:
• RCIE, Interrupt Enable bit of the PIE1 register
• PEIE, Peripheral Interrupt Enable bit of the
INTCON register
• GIE, Global Interrupt Enable bit of the INTCON
register
The RCIF interrupt flag bit will be set when there is an
unread character in the FIFO, regardless of the state of
interrupt enable bits.
Note 1: If the RX/DT function is on an analog pin,
the corresponding ANSEL bit must be
cleared for the receiver to function.
Note: If the receive FIFO is overrun, no additional
characters will be received until the overrun
condition is cleared. See Section 26.1.2.5
“Receive Overrun Error” for more
information on overrun errors.
ofme RCREG wiH notc‘earme FERR bi‘
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26.1.2.4 Receive Framing Error
Each character in the receive FIFO buffer has a
corresponding framing error Status bit. A framing error
indicates that a Stop bit was not seen at the expected
time. The framing error status is accessed via the
FERR bit of the RCSTA register. The FERR bit
represents the status of the top unread character in the
receive FIFO. Therefore, the FERR bit must be read
before reading the RCREG.
The FERR bit is read-only and only applies to the top
unread character in the receive FIFO. A framing error
(FERR = 1) does not preclude reception of additional
characters. It is not necessary to clear the FERR bit.
Reading the next character from the FIFO buffer will
advance the FIFO to the next character and the next
corresponding framing error.
The FERR bit can be forced clear by clearing the SPEN
bit of the RCSTA register which resets the EUSART.
Clearing the CREN bit of the RCSTA register does not
affect the FERR bit. A framing error by itself does not
generate an interrupt.
26.1.2.5 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before the FIFO is accessed. When
this happens the OERR bit of the RCSTA register is set.
The characters already in the FIFO buffer can be read
but no additional characters will be received until the
error is cleared. The error must be cleared by either
clearing the CREN bit of the RCSTA register or by
resetting the EUSART by clearing the SPEN bit of the
RCSTA register.
26.1.2.6 Receiving 9-bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift nine bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth and Most Significant data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the eight Least Significant bits
from the RCREG.
26.1.2.7 Address Detection
A special Address Detection mode is available for use
when multiple receivers share the same transmission
line, such as in RS-485 systems. Address detection is
enabled by setting the ADDEN bit of the RCSTA
register.
Address detection requires 9-bit character reception.
When address detection is enabled, only characters
with the ninth data bit set will be transferred to the
receive FIFO buffer, thereby setting the RCIF interrupt
bit. All other characters will be ignored.
Upon receiving an address character, user software
determines if the address matches its own. Upon
address match, user software must disable address
detection by clearing the ADDEN bit before the next
Stop bit occurs. When user software detects the end of
the message, determined by the message protocol
used, software places the receiver back into the
Address Detection mode by setting the ADDEN bit.
Note: If all receive characters in the receive
FIFO have framing errors, repeated reads
of the RCREG will not clear the FERR bit.
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26.1.2.8 Asynchronous Reception Set-up:
1. Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 26.4 “EUSART
Baud Rate Generator (BRG)”).
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit reception is desired, set the RX9 bit.
6. Enable reception by setting the CREN bit.
7. The RCIF interrupt flag bit will be set when a
character is transferred from the RSR to the
receive buffer. An interrupt will be generated if
the RCIE interrupt enable bit was also set.
8. Read the RCSTA register to get the error flags
and, if 9-bit data reception is enabled, the ninth
data bit.
9. Get the received eight Least Significant data bits
from the receive buffer by reading the RCREG
register.
10. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
26.1.2.9 9-bit Address Detection Mode Set-up
This mode would typically be used in RS-485 systems.
To set up an Asynchronous Reception with Address
Detect Enable:
1. Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 26.4 “EUSART
Baud Rate Generator (BRG)”).
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the serial port by setting the SPEN bit.
The SYNC bit must be clear for asynchronous
operation.
4. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. Enable 9-bit reception by setting the RX9 bit.
6. Enable address detection by setting the ADDEN
bit.
7. Enable reception by setting the CREN bit.
8. The RCIF interrupt flag bit will be set when a
character with the ninth bit set is transferred
from the RSR to the receive buffer. An interrupt
will be generated if the RCIE interrupt enable bit
was also set.
9. Read the RCSTA register to get the error flags.
The ninth data bit will always be set.
10. Get the received eight Least Significant data bits
from the receive buffer by reading the RCREG
register. Software determines if this is the
device’s address.
11. If an overrun occurred, clear the OERR flag by
clearing the CREN receiver enable bit.
12. If the device has been addressed, clear the
ADDEN bit to allow all received data into the
receive buffer and generate interrupts.
FIGURE 26-5: ASYNCHRONOUS RECEPTION
Start
bit bit 7/8
bit 1bit 0 bit 7/8 bit 0Stop
bit
Start
bit
Start
bit
bit 7/8 Stop
bit
RX/DT pin
Reg
Rcv Buffer Reg.
Rcv Shift
Read Rcv
Buffer Reg.
RCREG
RCIF
(Interrupt Flag)
OERR bit
CREN
Word 1
RCREG
Word 2
RCREG
Stop
bit
Note: This timing diagram shows three words appearing on the RX input. The RCREG (receive buffer) is read after the third word,
causing the OERR (overrun) bit to be set.
RCIDL
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TABLE 26-2: SUMMARY OF REGISTERS ASSOCIATED WITH ASYNCHRONOUS RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL —SCKP BRG16 —WUEABDEN 259
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 75
RCREG EUSART Receive Data Register 252*
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
SPBRGL BRG<7:0> 260*
SPBRGH BRG<15:8> 260*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Asynchronous Reception.
* Page provides register information.
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26.2 Clock Accuracy with
Asynchronous Operation
The factory calibrates the internal oscillator block
output (INTOSC). However, the INTOSC frequency
may drift as VDD or temperature changes, and this
directly affects the asynchronous baud rate. Two
methods may be used to adjust the baud rate clock, but
both require a reference clock source of some kind.
The first (preferred) method uses the OSCTUNE
register to adjust the INTOSC output. Adjusting the
value in the OSCTUNE register allows for fine resolution
changes to the system clock source. See Section 5.2.2
“Internal Clock Sources” for more information.
The other method adjusts the value in the Baud Rate
Generator. This can be done automatically with the
Auto-Baud Detect feature (see Section 26.4.1
“Auto-Baud Detect”). There may not be fine enough
resolution when adjusting the Baud Rate Generator to
compensate for a gradual change in the peripheral
clock frequency.
Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode,
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26.3 Register Definitions: EUSART Control
REGISTER 26-1: TXSTA: TRANSMIT STATUS AND CONTROL REGISTER
R/W-/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-1/1 R/W-0/0
CSRC TX9 TXEN(1) SYNC SENDB BRGH TRMT TX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CSRC: Clock Source Select bit
Asynchronous mode:
Don’t care
Synchronous mode:
1 = Master mode (clock generated internally from BRG)
0 = Slave mode (clock from external source)
bit 6 TX9: 9-bit Transmit Enable bit
1 = Selects 9-bit transmission
0 = Selects 8-bit transmission
bit 5 TXEN: Transmit Enable bit(1)
1 = Transmit enabled
0 = Transmit disabled
bit 4 SYNC: EUSART Mode Select bit
1 = Synchronous mode
0 = Asynchronous mode
bit 3 SENDB: Send Break Character bit
Asynchronous mode:
1 = Send Sync Break on next transmission (cleared by hardware upon completion)
0 = Sync Break transmission completed
Synchronous mode:
Don’t care
bit 2 BRGH: High Baud Rate Select bit
Asynchronous mode:
1 = High speed
0 = Low speed
Synchronous mode:
Unused in this mode
bit 1 TRMT: Transmit Shift Register Status bit
1 = TSR empty
0 = TSR full
bit 0 TX9D: Ninth bit of Transmit Data
Can be address/data bit or a parity bit.
Note 1: SREN/CREN overrides TXEN in Sync mode.
Asynchronous mode Synchronous mode , Masler Synchronous mode , S‘ave Asynchronous mode Synchronous mode Asynchronous mode 97m RXQ : 1 Asynchronous mode 87m RXQ : 0
PIC12(L)F1840
DS40001441F-page 258 2011-2015 Microchip Technology Inc.
REGISTER 26-2: RCSTA: RECEIVE STATUS AND CONTROL REGISTER
R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R/W-0/0 R-0/0 R-0/0 R-x/x
SPEN RX9 SREN CREN ADDEN FERR OERR RX9D
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 SPEN: Serial Port Enable bit
1 = Serial port enabled (configures RX/DT and TX/CK pins as serial port pins)
0 = Serial port disabled (held in Reset)
bit 6 RX9: 9-bit Receive Enable bit
1 = Selects 9-bit reception
0 = Selects 8-bit reception
bit 5 SREN: Single Receive Enable bit
Asynchronous mode:
Don’t care
Synchronous mode – Master:
1 = Enables single receive
0 = Disables single receive
This bit is cleared after reception is complete.
Synchronous mode – Slave
Don’t care
bit 4 CREN: Continuous Receive Enable bit
Asynchronous mode:
1 = Enables receiver
0 = Disables receiver
Synchronous mode:
1 = Enables continuous receive until enable bit CREN is cleared (CREN overrides SREN)
0 = Disables continuous receive
bit 3 ADDEN: Address Detect Enable bit
Asynchronous mode 9-bit (RX9 = 1):
1 = Enables address detection, enable interrupt and load the receive buffer when RSR<8> is set
0 = Disables address detection, all bytes are received and ninth bit can be used as parity bit
Asynchronous mode 8-bit (RX9 = 0):
Don’t care
bit 2 FERR: Framing Error bit
1 = Framing error (can be updated by reading RCREG register and receive next valid byte)
0 = No framing error
bit 1 OERR: Overrun Error bit
1 = Overrun error (can be cleared by clearing bit CREN)
0 = No overrun error
bit 0 RX9D: Ninth bit of Received Data
This can be address/data bit or a parity bit and must be calculated by user firmware.
Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode Asynchronous mode Synchronous mode
2011-2015 Microchip Technology Inc. DS40001441F-page 259
PIC12(L)F1840
REGISTER 26-3: BAUDCON: BAUD RATE CONTROL REGISTER
R-0/0 R-1/1 U-0 R/W-0/0 R/W-0/0 U-0 R/W-0/0 R/W-0/0
ABDOVF RCIDL — SCKP BRG16 — WUE ABDEN
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 ABDOVF: Auto-Baud Detect Overflow bit
Asynchronous mode:
1 = Auto-baud timer overflowed
0 = Auto-baud timer did not overflow
Synchronous mode:
Don’t care
bit 6 RCIDL: Receive Idle Flag bit
Asynchronous mode:
1 = Receiver is Idle
0 = Start bit has been received and the receiver is receiving
Synchronous mode:
Don’t care
bit 5 Unimplemented: Read as ‘0’
bit 4 SCKP: Synchronous Clock Polarity Select bit
Asynchronous mode:
1 = Transmit inverted data to the TX/CK pin
0 = Transmit non-inverted data to the TX/CK pin
Synchronous mode:
1 = Data is clocked on rising edge of the clock
0 = Data is clocked on falling edge of the clock
bit 3 BRG16: 16-bit Baud Rate Generator bit
1 = 16-bit Baud Rate Generator is used
0 = 8-bit Baud Rate Generator is used
bit 2 Unimplemented: Read as ‘0’
bit 1 WUE: Wake-up Enable bit
Asynchronous mode:
1 = Receiver is waiting for a falling edge. No character will be received, byte RCIF will be set. WUE
will automatically clear after RCIF is set.
0 = Receiver is operating normally
Synchronous mode:
Don’t care
bit 0 ABDEN: Auto-Baud Detect Enable bit
Asynchronous mode:
1 = Auto-Baud Detect mode is enabled (clears when auto-baud is complete)
0 = Auto-Baud Detect mode is disabled
Synchronous mode:
Don’t care
PIC12(L)F1840
DS40001441F-page 260 2011-2015 Microchip Technology Inc.
26.4 EUSART Baud Rate Generator
(BRG)
The Baud Rate Generator (BRG) is an 8-bit or 16-bit
timer that is dedicated to the support of both the
asynchronous and synchronous EUSART operation.
By default, the BRG operates in 8-bit mode. Setting the
BRG16 bit of the BAUDCON register selects 16-bit
mode.
The SPBRGH, SPBRGL register pair determines the
period of the free running baud rate timer. In
Asynchronous mode the multiplier of the baud rate
period is determined by both the BRGH bit of the TXSTA
register and the BRG16 bit of the BAUDCON register. In
Synchronous mode, the BRGH bit is ignored.
Table 26-3 contains the formulas for determining the
baud rate. Example 26-1 provides a sample calculation
for determining the baud rate and baud rate error.
Typical baud rates and error values for various
asynchronous modes have been computed for your
convenience and are shown in Table 26-3. It may be
advantageous to use the high baud rate (BRGH = 1),
or the 16-bit BRG (BRG16 = 1) to reduce the baud rate
error. The 16-bit BRG mode is used to achieve slow
baud rates for fast oscillator frequencies.
Writing a new value to the SPBRGH, SPBRGL register
pair causes the BRG timer to be reset (or cleared). This
ensures that the BRG does not wait for a timer overflow
before outputting the new baud rate.
If the system clock is changed during an active receive
operation, a receive error or data loss may result. To
avoid this problem, check the status of the RCIDL bit to
make sure that the receive operation is Idle before
changing the system clock.
EXAMPLE 26-1: CALCULATING BAUD
RATE ERROR
For a device with FOSC of 16 MHz, desired baud rate
of 9600, Asynchronous mode, 8-bit BRG:
Solving for SPBRGH:SPBRGL:
X
FOSC
Desired Baud Rate
---------------------------------------------
64
--------------------------------------------- 1–=
Desired Baud Rate FOSC
64 [SPBRGH:SPBRGL] 1+
------------------------------------------------------------------------=
16000000
9600
------------------------
64
------------------------1–=
25.04225==
Calculated Baud Rate 16000000
64 25 1+
---------------------------=
9615=
Error Calc. Baud Rate Desired Baud Rate –
Desired Baud Rate
--------------------------------------------------------------------------------------------=
9615 9600–
9600
---------------------------------- 0 . 1 6 %==
2011-2015 Microchip Technology Inc. DS40001441F-page 261
PIC12(L)F1840
TABLE 26-3: BAUD RATE FORMULAS
TABLE 26-4: SUMMARY OF REGISTERS ASSOCIATED WITH THE BAUD RATE GENERATOR
Configuration Bits
BRG/EUSART Mode Baud Rate Formula
SYNC BRG16 BRGH
000 8-bit/Asynchronous FOSC/[64 (n+1)]
001 8-bit/Asynchronous FOSC/[16 (n+1)]
010 16-bit/Asynchronous
011 16-bit/Asynchronous
FOSC/[4 (n+1)]10x 8-bit/Synchronous
11x 16-bit/Synchronous
Legend: x = Don’t care, n = value of SPBRGH, SPBRGL register pair.
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL —SCKP BRG16 —WUE ABDEN 259
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
SPBRGL BRG<7:0> 260*
SPBRGH BRG<15:8> 260*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented, read as ‘0’. Shaded cells are not used for the Baud Rate Generator.
* Page provides register information.
PIC12(L)F1840
DS40001441F-page 262 2011-2015 Microchip Technology Inc.
TABLE 26-5: BAUD RATES FOR ASYNCHRONOUS MODES
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300—— — —— — —— — —— —
1200 — — — 1221 1.73 255 1200 0.00 239 1200 0.00 143
2400 2404 0.16 207 2404 0.16 129 2400 0.00 119 2400 0.00 71
9600 9615 0.16 51 9470 -1.36 32 9600 0.00 29 9600 0.00 17
10417 10417 0.00 47 10417 0.00 29 10286 -1.26 27 10165 -2.42 16
19.2k 19.23k 0.16 25 19.53k 1.73 15 19.20k 0.00 14 19.20k 0.00 8
57.6k 55.55k -3.55 3 — — — 57.60k 0.00 7 57.60k 0.00 2
115.2k — — — — — — — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 0
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 — — — 300 0.16 207 300 0.00 191 300 0.16 51
1200 1202 0.16 103 1202 0.16 51 1200 0.00 47 1202 0.16 12
2400 2404 0.16 51 2404 0.16 25 2400 0.00 23 — — —
9600 9615 0.16 12 — — — 9600 0.00 5 — — —
10417 10417 0.00 11 10417 0.00 5 — — — — — —
19.2k — — — — — — 19.20k 0.00 2 — — —
57.6k — — — — — — 57.60k 0.00 0 — — —
115.2k — — — — — — — — — — — —
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 —— — —— — —— — —— —
1200 — — — — — — — — — — — —
2400 — — — — — — — — — —— —
9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71
10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65
19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35
57.6k 57.14k -0.79 34 56.82k -1.36 21 57.60k 0.00 19 57.60k 0.00 11
115.2k 117.64k 2.12 16 113.64k -1.36 10 115.2k 0.00 9 115.2k 0.00 5
2011-2015 Microchip Technology Inc. DS40001441F-page 263
PIC12(L)F1840
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 0
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 —— — — — — — — — 300 0.16 207
1200 — — — 1202 0.16 207 1200 0.00 191 1202 0.16 51
2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25
9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — —
10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5
19.2k 19231 0.16 25 19.23k 0.16 12 19.2k 0.00 11 — — —
57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — —
115.2k — — — — — — 115.2k 0.00 1 — — —
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 6666 300.0 -0.01 4166 300.0 0.00 3839 300.0 0.00 2303
1200 1200 -0.02 3332 1200 -0.03 1041 1200 0.00 959 1200 0.00 575
2400 2401 -0.04 832 2399 -0.03 520 2400 0.00 479 2400 0.00 287
9600 9615 0.16 207 9615 0.16 129 9600 0.00 119 9600 0.00 71
10417 10417 0.00 191 10417 0.00 119 10378 -0.37 110 10473 0.53 65
19.2k 19.23k 0.16 103 19.23k 0.16 64 19.20k 0.00 59 19.20k 0.00 35
57.6k 57.14k -0.79 34 56.818 -1.36 21 57.60k 0.00 19 57.60k 0.00 11
115.2k 117.6k 2.12 16 113.636 -1.36 10 115.2k 0.00 9 115.2k 0.00 5
BAUD
RATE
SYNC = 0, BRGH = 0, BRG16 = 1
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 299.9 -0.02 1666 300.1 0.04 832 300.0 0.00 767 300.5 0.16 207
1200 1199 -0.08 416 1202 0.16 207 1200 0.00 191 1202 0.16 51
2400 2404 0.16 207 2404 0.16 103 2400 0.00 95 2404 0.16 25
9600 9615 0.16 51 9615 0.16 25 9600 0.00 23 — — —
10417 10417 0.00 47 10417 0.00 23 10473 0.53 21 10417 0.00 5
19.2k 19.23k 0.16 25 19.23k 0.16 12 19.20k 0.00 11 — — —
57.6k 55556 -3.55 8 — — — 57.60k 0.00 3 — — —
115.2k — — — — — — 115.2k 0.00 1 — — —
TABLE 26-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
PIC12(L)F1840
DS40001441F-page 264 2011-2015 Microchip Technology Inc.
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 32.000 MHz FOSC = 20.000 MHz FOSC = 18.432 MHz FOSC = 11.0592 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 26666 300.0 0.00 16665 300.0 0.00 15359 300.0 0.00 9215
1200 1200 0.00 6666 1200 -0.01 4166 1200 0.00 3839 1200 0.00 2303
2400 2400 0.01 3332 2400 0.02 2082 2400 0.00 1919 2400 0.00 1151
9600 9604 0.04 832 9597 -0.03 520 9600 0.00 479 9600 0.00 287
10417 10417 0.00 767 10417 0.00 479 10425 0.08 441 10433 0.16 264
19.2k 19.18k -0.08 416 19.23k 0.16 259 19.20k 0.00 239 19.20k 0.00 143
57.6k 57.55k -0.08 138 57.47k -0.22 86 57.60k 0.00 79 57.60k 0.00 47
115.2k 115.9k 0.64 68 116.3k 0.94 42 115.2k 0.00 39 115.2k 0.00 23
BAUD
RATE
SYNC = 0, BRGH = 1, BRG16 = 1 or SYNC = 1, BRG16 = 1
FOSC = 8.000 MHz FOSC = 4.000 MHz FOSC = 3.6864 MHz FOSC = 1.000 MHz
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
Actual
Rate
%
Error
SPBRG
value
(decimal)
300 300.0 0.00 6666 300.0 0.01 3332 300.0 0.00 3071 300.1 0.04 832
1200 1200 -0.02 1666 1200 0.04 832 1200 0.00 767 1202 0.16 207
2400 2401 0.04 832 2398 0.08 416 2400 0.00 383 2404 0.16 103
9600 9615 0.16 207 9615 0.16 103 9600 0.00 95 9615 0.16 25
10417 10417 0 191 10417 0.00 95 10473 0.53 87 10417 0.00 23
19.2k 19.23k 0.16 103 19.23k 0.16 51 19.20k 0.00 47 19.23k 0.16 12
57.6k 57.14k -0.79 34 58.82k 2.12 16 57.60k 0.00 15 — — —
115.2k 117.6k 2.12 16 111.1k -3.55 8 115.2k 0.00 7 — — —
TABLE 26-5: BAUD RATES FOR ASYNCHRONOUS MODES (CONTINUED)
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2011-2015 Microchip Technology Inc. DS40001441F-page 265
PIC12(L)F1840
26.4.1 AUTO-BAUD DETECT
The EUSART module supports automatic detection
and calibration of the baud rate.
In the Auto-Baud Detect (ABD) mode, the clock to the
BRG is reversed. Rather than the BRG clocking the
incoming RX signal, the RX signal is timing the BRG.
The Baud Rate Generator is used to time the period of
a received 55h (ASCII “U”) which is the Sync character
for the LIN bus. The unique feature of this character is
that it has five rising edges including the Stop bit edge.
Setting the ABDEN bit of the BAUDCON register starts
the auto-baud calibration sequence (Figure 26-6).
While the ABD sequence takes place, the EUSART
state machine is held in Idle. On the first rising edge of
the receive line, after the Start bit, the SPBRG begins
counting up using the BRG counter clock as shown in
Table 26-6. The fifth rising edge will occur on the RX pin
at the end of the eighth bit period. At that time, an
accumulated value totaling the proper BRG period is
left in the SPBRGH, SPBRGL register pair, the ABDEN
bit is automatically cleared and the RCIF interrupt flag
is set. The value in the RCREG needs to be read to
clear the RCIF interrupt. RCREG content should be
discarded. When calibrating for modes that do not use
the SPBRGH register the user can verify that the
SPBRGL register did not overflow by checking for 00h
in the SPBRGH register.
The BRG auto-baud clock is determined by the BRG16
and BRGH bits as shown in Table 2 6- 6. During ABD,
both the SPBRGH and SPBRGL registers are used as
a 16-bit counter, independent of the BRG16 bit setting.
While calibrating the baud rate period, the SPBRGH
and SPBRGL registers are clocked at 1/8th the BRG
base clock rate. The resulting byte measurement is the
average bit time when clocked at full speed.
TABLE 26-6: BRG COUNTER CLOCK RATES
FIGURE 26-6: AUTOMATIC BAUD RATE CALIBRATION
Note 1: If the WUE bit is set with the ABDEN bit,
auto-baud detection will occur on the byte
following the Break character (see
Section 26.4 “EUSART Baud Rate
Generator (BRG)”).
2: It is up to the user to determine that the
incoming character baud rate is within the
range of the selected BRG clock source.
Some combinations of oscillator frequency
and EUSART baud rates are not possible.
3: During the auto-baud process, the
auto-baud counter starts counting at 1.
Upon completion of the auto-baud
sequence, to achieve maximum accuracy,
subtract 1 from the SPBRGH:SPBRGL
register pair.
BRG16 BRGH BRG Base
Clock
BRG ABD
Clock
00FOSC/64 FOSC/512
01FOSC/16 FOSC/128
10FOSC/16 FOSC/128
11 FOSC/4 FOSC/32
Note: During the ABD sequence, SPBRGL and
SPBRGH registers are both used as a 16-bit
counter, independent of BRG16 setting.
BRG Value
RX pin
ABDEN bit
RCIF bit
bit 0 bit 1
(Interrupt)
Read
RCREG
BRG Clock
Start
Auto Cleared
Set by User
XXXXh 0000h
Edge #1
bit 2 bit 3
Edge #2
bit 4 bit 5
Edge #3
bit 6 bit 7
Edge #4
Stop bit
Edge #5
001Ch
Note 1: The ABD sequence requires the EUSART module to be configured in Asynchronous mode.
SPBRGL XXh 1Ch
SPBRGH XXh 00h
RCIDL
Break Character OsciHalor Starling Time WUE Bil
PIC12(L)F1840
DS40001441F-page 266 2011-2015 Microchip Technology Inc.
26.4.2 AUTO-BAUD OVERFLOW
During the course of automatic baud detection, the
ABDOVF bit of the BAUDCON register will be set if the
baud rate counter overflows before the fifth rising edge
is detected on the RX pin. The ABDOVF bit indicates
that the counter has exceeded the maximum count that
can fit in the 16 bits of the SPBRGH:SPBRGL register
pair. After the ABDOVF bit has been set, the counter
continues to count until the fifth rising edge is detected
on the RX pin. Upon detecting the fifth RX edge, the
hardware will set the RCIF interrupt flag and clear the
ABDEN bit of the BAUDCON register. The RCIF flag
can be subsequently cleared by reading the RCREG
register. The ABDOVF flag of the BAUDCON register
can be cleared by software directly.
To terminate the auto-baud process before the RCIF
flag is set, clear the ABDEN bit then clear the ABDOVF
bit of the BAUDCON register. The ABDOVF bit will
remain set if the ABDEN bit is not cleared first.
26.4.3 AUTO-WAKE-UP ON BREAK
During Sleep mode, all clocks to the EUSART are
suspended. Because of this, the Baud Rate Generator
is inactive and a proper character reception cannot be
performed. The Auto-Wake-up feature allows the
controller to wake-up due to activity on the RX/DT line.
This feature is available only in Asynchronous mode.
The Auto-Wake-up feature is enabled by setting the
WUE bit of the BAUDCON register. Once set, the normal
receive sequence on RX/DT is disabled, and the
EUSART remains in an Idle state, monitoring for a
wake-up event independent of the CPU mode. A
wake-up event consists of a high-to-low transition on the
RX/DT line. (This coincides with the start of a Sync Break
or a wake-up signal character for the LIN protocol.)
The EUSART module generates an RCIF interrupt
coincident with the wake-up event. The interrupt is
generated synchronously to the Q clocks in normal CPU
operating modes (Figure 26-7), and asynchronously if
the device is in Sleep mode (Figure 26-8). The interrupt
condition is cleared by reading the RCREG register.
The WUE bit is automatically cleared by the low-to-high
transition on the RX line at the end of the Break. This
signals to the user that the Break event is over. At this
point, the EUSART module is in Idle mode waiting to
receive the next character.
26.4.3.1 Special Considerations
Break Character
To avoid character errors or character fragments during
a wake-up event, the wake-up character must be all
zeros.
When the wake-up is enabled the function works
independent of the low time on the data stream. If the
WUE bit is set and a valid non-zero character is
received, the low time from the Start bit to the first rising
edge will be interpreted as the wake-up event. The
remaining bits in the character will be received as a
fragmented character and subsequent characters can
result in framing or overrun errors.
Therefore, the initial character in the transmission must
be all ‘0’s. This must be ten or more bit times, 13-bit
times recommended for LIN bus, or any number of bit
times for standard RS-232 devices.
Oscillator Start-up Time
Oscillator start-up time must be considered, especially
in applications using oscillators with longer start-up
intervals (i.e., LP, XT or HS/PLL mode). The Sync
Break (or wake-up signal) character must be of
sufficient length, and be followed by a sufficient
interval, to allow enough time for the selected oscillator
to start and provide proper initialization of the EUSART.
WUE Bit
The wake-up event causes a receive interrupt by
setting the RCIF bit. The WUE bit is cleared in
hardware by a rising edge on RX/DT. The interrupt
condition is then cleared in software by reading the
RCREG register and discarding its contents.
To ensure that no actual data is lost, check the RCIDL
bit to verify that a receive operation is not in process
before setting the WUE bit. If a receive operation is not
occurring, the WUE bit may then be set just prior to
entering the Sleep mode.
10“ \ MOW \JQA‘QW ‘34 10" \QJOA} ‘\ \ HEM \ \ 10“ \W 1“ \ \ 10“ \ \ 10“ \ \ 1
2011-2015 Microchip Technology Inc. DS40001441F-page 267
PIC12(L)F1840
FIGURE 26-7: AUTO-WAKE-UP BIT (WUE) TIMING DURING NORMAL OPERATION
FIGURE 26-8: AUTO-WAKE-UP BIT (WUE) TIMINGS DURING SLEEP
Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit set by user Auto Cleared
Cleared due to User Read of RCREG
Note 1: The EUSART remains in Idle while the WUE bit is set.
Q1Q2Q3 Q4 Q1Q2 Q3 Q4 Q1Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4
OSC1
WUE bit
RX/DT Line
RCIF
Bit Set by User Auto Cleared
Cleared due to User Read of RCREG
Sleep Command Executed
Note 1
Note 1: If the wake-up event requires long oscillator warm-up time, the automatic clearing of the WUE bit can occur while the stposc signal is
still active. This sequence should not depend on the presence of Q clocks.
2: The EUSART remains in Idle while the WUE bit is set.
Sleep Ends
J) J/
PIC12(L)F1840
DS40001441F-page 268 2011-2015 Microchip Technology Inc.
26.4.4 BREAK CHARACTER SEQUENCE
The EUSART module has the capability of sending the
special Break character sequences that are required by
the LIN bus standard. A Break character consists of a
Start bit, followed by 12 ‘0’ bits and a Stop bit.
To send a Break character, set the SENDB and TXEN
bits of the TXSTA register. The Break character
transmission is then initiated by a write to the TXREG.
The value of data written to TXREG will be ignored and
all ‘0’s will be transmitted.
The SENDB bit is automatically reset by hardware after
the corresponding Stop bit is sent. This allows the user
to preload the transmit FIFO with the next transmit byte
following the Break character (typically, the Sync
character in the LIN specification).
The TRMT bit of the TXSTA register indicates when the
transmit operation is active or idle, just as it does during
normal transmission. See Figure 26-9 for the timing of
the Break character sequence.
26.4.4.1 Break and Sync Transmit Sequence
The following sequence will start a message frame
header made up of a Break, followed by an auto-baud
Sync byte. This sequence is typical of a LIN bus
master.
1. Configure the EUSART for the desired mode.
2. Set the TXEN and SENDB bits to enable the
Break sequence.
3. Load the TXREG with a dummy character to
initiate transmission (the value is ignored).
4. Write ‘55h’ to TXREG to load the Sync character
into the transmit FIFO buffer.
5. After the Break has been sent, the SENDB bit is
reset by hardware and the Sync character is
then transmitted.
When the TXREG becomes empty, as indicated by the
TXIF, the next data byte can be written to TXREG.
26.4.5 RECEIVING A BREAK CHARACTER
The Enhanced EUSART module can receive a Break
character in two ways.
The first method to detect a Break character uses the
FERR bit of the RCSTA register and the Received data
as indicated by RCREG. The Baud Rate Generator is
assumed to have been initialized to the expected baud
rate.
A Break character has been received when;
• RCIF bit is set
• FERR bit is set
• RCREG = 00h
The second method uses the Auto-Wake-up feature
described in Section 26.4.3 “Auto-Wake-up on
Break”. By enabling this feature, the EUSART will
sample the next two transitions on RX/DT, cause an
RCIF interrupt, and receive the next data byte followed
by another interrupt.
Note that following a Break character, the user will
typically want to enable the Auto-Baud Detect feature.
For both methods, the user can set the ABDEN bit of
the BAUDCON register before placing the EUSART in
Sleep mode.
FIGURE 26-9: SEND BREAK CHARACTER SEQUENCE
Write to TXREG Dummy Write
BRG Output
(Shift Clock)
Start bit bit 0 bit 1 bit 11 Stop bit
Break
TXIF bit
(Transmit
Interrupt Flag)
TX (pin)
TRMT bit
(Transmit Shift
Empty Flag)
SENDB
(send Break
control bit)
SENDB Sampled Here Auto Cleared
memory‘ so i‘ is nmavai‘ab‘e to the user.
2011-2015 Microchip Technology Inc. DS40001441F-page 269
PIC12(L)F1840
26.5 EUSART Synchronous Mode
Synchronous serial communications are typically used
in systems with a single master and one or more
slaves. The master device contains the necessary cir-
cuitry for baud rate generation and supplies the clock
for all devices in the system. Slave devices can take
advantage of the master clock by eliminating the inter-
nal clock generation circuitry.
There are two signal lines in Synchronous mode: a
bidirectional data line and a clock line. Slaves use the
external clock supplied by the master to shift the serial
data into and out of their respective receive and
transmit shift registers. Since the data line is
bidirectional, synchronous operation is half-duplex
only. Half-duplex refers to the fact that master and
slave devices can receive and transmit data but not
both simultaneously. The EUSART can operate as
either a master or slave device.
Start and Stop bits are not used in synchronous
transmissions.
26.5.1 SYNCHRONOUS MASTER MODE
The following bits are used to configure the EUSART
for synchronous master operation:
• SYNC = 1
• CSRC = 1
• SREN = 0 (for transmit); SREN = 1 (for receive)
• CREN = 0 (for transmit); CREN = 1 (for receive)
• SPEN = 1
Setting the SYNC bit of the TXSTA register configures
the device for synchronous operation. Setting the CSRC
bit of the TXSTA register configures the device as a
master. Clearing the SREN and CREN bits of the RCSTA
register ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART.
26.5.1.1 Master Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device
configured as a master transmits the clock on the
TX/CK line. The TX/CK pin output driver is
automatically enabled when the EUSART is configured
for synchronous transmit or receive operation. Serial
data bits change on the leading edge to ensure they are
valid at the trailing edge of each clock. One clock cycle
is generated for each data bit. Only as many clock
cycles are generated as there are data bits.
26.5.1.2 Clock Polarity
A clock polarity option is provided for Microwire
compatibility. Clock polarity is selected with the SCKP
bit of the BAUDCON register. Setting the SCKP bit sets
the clock Idle state as high. When the SCKP bit is set,
the data changes on the falling edge of each clock.
Clearing the SCKP bit sets the Idle state as low. When
the SCKP bit is cleared, the data changes on the rising
edge of each clock.
26.5.1.3 Synchronous Master Transmission
Data is transferred out of the device on the RX/DT pin.
The RX/DT and TX/CK pin output drivers are
automatically enabled when the EUSART is configured
for synchronous master transmit operation.
A transmission is initiated by writing a character to the
TXREG register. If the TSR still contains all or part of a
previous character the new character data is held in the
TXREG until the last bit of the previous character has
been transmitted. If this is the first character, or the
previous character has been completely flushed from
the TSR, the data in the TXREG is immediately
transferred to the TSR. The transmission of the
character commences immediately following the
transfer of the data to the TSR from the TXREG.
Each data bit changes on the leading edge of the
master clock and remains valid until the subsequent
leading clock edge.
26.5.1.4 Synchronous Master Transmission
Set-up:
1. Initialize the SPBRGH, SPBRGL register pair
and the BRGH and BRG16 bits to achieve the
desired baud rate (see Section 26.4 “EUSART
Baud Rate Generator (BRG)”).
2. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
3. Disable Receive mode by clearing bits SREN
and CREN.
4. Enable Transmit mode by setting the TXEN bit.
5. If 9-bit transmission is desired, set the TX9 bit.
6. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
7. If 9-bit transmission is selected, the ninth bit
should be loaded in the TX9D bit.
8. Start transmission by loading data to the TXREG
register.
Note: The TSR register is not mapped in data
memory, so it is not available to the user.
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PIC12(L)F1840
DS40001441F-page 270 2011-2015 Microchip Technology Inc.
FIGURE 26-10: SYNCHRONOUS TRANSMISSION
FIGURE 26-11: SYNCHRONOUS TRANSMISSION (THROUGH TXEN)
TABLE 26-7: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER
TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 259
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 75
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
SPBRGL BRG<7:0> 260*
SPBRGH BRG<15:8> 260*
TXREG EUSART Transmit Data Register 249*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Synchronous Master Transmission.
* Page provides register information.
bit 0 bit 1 bit 7
Word 1
bit 2 bit 0 bit 1 bit 7
RX/DT
Write to
TXREG Reg
TXIF bit
(Interrupt Flag)
TXEN bit ‘1’ ‘1’
Word 2
TRMT bit
Write Word 1 Write Word 2
Note: Sync Master mode, SPBRGL = 0, continuous transmission of two 8-bit words.
pin
TX/CK pin
TX/CK pin
(SCKP = 0)
(SCKP = 1)
RX/DT pin
TX/CK pin
Write to
TXREG reg
TXIF bit
TRMT bit
bit 0 bit 1 bit 2 bit 6 bit 7
TXEN bit
cleared for :he receiver Io funcrion. cleared
2011-2015 Microchip Technology Inc. DS40001441F-page 271
PIC12(L)F1840
26.5.1.5 Synchronous Master Reception
Data is received at the RX/DT pin. The RX/DT pin
output driver is automatically disabled when the
EUSART is configured for synchronous master receive
operation.
In Synchronous mode, reception is enabled by setting
either the Single Receive Enable bit (SREN of the
RCSTA register) or the Continuous Receive Enable bit
(CREN of the RCSTA register).
When SREN is set and CREN is clear, only as many
clock cycles are generated as there are data bits in a
single character. The SREN bit is automatically cleared
at the completion of one character. When CREN is set,
clocks are continuously generated until CREN is
cleared. If CREN is cleared in the middle of a character
the CK clock stops immediately and the partial charac-
ter is discarded. If SREN and CREN are both set, then
SREN is cleared at the completion of the first character
and CREN takes precedence.
To initiate reception, set either SREN or CREN. Data is
sampled at the RX/DT pin on the trailing edge of the
TX/CK clock pin and is shifted into the Receive Shift
Register (RSR). When a complete character is
received into the RSR, the RCIF bit is set and the char-
acter is automatically transferred to the two character
receive FIFO. The Least Significant eight bits of the top
character in the receive FIFO are available in RCREG.
The RCIF bit remains set as long as there are unread
characters in the receive FIFO.
26.5.1.6 Slave Clock
Synchronous data transfers use a separate clock line,
which is synchronous with the data. A device configured
as a slave receives the clock on the TX/CK line. The
TX/CK pin output driver is automatically disabled when
the device is configured for synchronous slave transmit
or receive operation. Serial data bits change on the
leading edge to ensure they are valid at the trailing edge
of each clock. One data bit is transferred for each clock
cycle. Only as many clock cycles should be received as
there are data bits.
26.5.1.7 Receive Overrun Error
The receive FIFO buffer can hold two characters. An
overrun error will be generated if a third character, in its
entirety, is received before RCREG is read to access
the FIFO. When this happens the OERR bit of the
RCSTA register is set. Previous data in the FIFO will
not be overwritten. The two characters in the FIFO
buffer can be read, however, no additional characters
will be received until the error is cleared. The OERR bit
can only be cleared by clearing the overrun condition.
If the overrun error occurred when the SREN bit is set
and CREN is clear then the error is cleared by reading
RCREG. If the overrun occurred when the CREN bit is
set then the error condition is cleared by either clearing
the CREN bit of the RCSTA register or by clearing the
SPEN bit which resets the EUSART.
26.5.1.8 Receiving 9-bit Characters
The EUSART supports 9-bit character reception. When
the RX9 bit of the RCSTA register is set the EUSART
will shift 9-bits into the RSR for each character
received. The RX9D bit of the RCSTA register is the
ninth, and Most Significant, data bit of the top unread
character in the receive FIFO. When reading 9-bit data
from the receive FIFO buffer, the RX9D data bit must
be read before reading the eight Least Significant bits
from the RCREG.
26.5.1.9 Synchronous Master Reception
Set-up:
1. Initialize the SPBRGH, SPBRGL register pair for
the appropriate baud rate. Set or clear the
BRGH and BRG16 bits, as required, to achieve
the desired baud rate.
2. Clear the ANSEL bit for the RX pin (if applicable).
3. Enable the synchronous master serial port by
setting bits SYNC, SPEN and CSRC.
4. Ensure bits CREN and SREN are clear.
5. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
6. If 9-bit reception is desired, set bit RX9.
7. Start reception by setting the SREN bit or for
continuous reception, set the CREN bit.
8. Interrupt flag bit RCIF will be set when reception
of a character is complete. An interrupt will be
generated if the enable bit RCIE was set.
9. Read the RCSTA register to get the ninth bit (if
enabled) and determine if any error occurred
during reception.
10. Read the 8-bit received data by reading the
RCREG register.
11. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
Note: If the RX/DT function is on an analog pin,
the corresponding ANSEL bit must be
cleared for the receiver to function.
Note: If the device is configured as a slave and
the TX/CK function is on an analog pin, the
corresponding ANSEL bit must be
cleared.
PIC12(L)F1840
DS40001441F-page 272 2011-2015 Microchip Technology Inc.
FIGURE 26-12: SYNCHRONOUS RECEPTION (MASTER MODE, SREN)
TABLE 26-8: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS MASTER
RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL — SCKP BRG16 —WUE ABDEN 259
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 75
RCREG EUSART Receive Data Register 252*
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
SPBRGL BRG<7:0> 260*
SPBRGH BRG<15:8> 260*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Synchronous Master Reception.
* Page provides register information.
CREN bit
RX/DT
Write to
bit SREN
SREN bit
RCIF bit
(Interrupt)
Read
RCREG
‘0’
bit 0 bit 1 bit 2 bit 3 bit 4 bit 5 bit 6 bit 7
‘0’
Note: Timing diagram demonstrates Sync Master mode with bit SREN = 1 and bit BRGH = 0.
TX/CK pin
TX/CK pin
pin
(SCKP = 0)
(SCKP = 1)
2011-2015 Microchip Technology Inc. DS40001441F-page 273
PIC12(L)F1840
26.5.2 SYNCHRONOUS SLAVE MODE
The following bits are used to configure the EUSART
for synchronous slave operation:
• SYNC = 1
• CSRC = 0
• SREN = 0 (for transmit); SREN = 1 (for receive)
• CREN = 0 (for transmit); CREN = 1 (for receive)
• SPEN = 1
Setting the SYNC bit of the TXSTA register configures the
device for synchronous operation. Clearing the CSRC bit
of the TXSTA register configures the device as a slave.
Clearing the SREN and CREN bits of the RCSTA register
ensures that the device is in the Transmit mode,
otherwise the device will be configured to receive. Setting
the SPEN bit of the RCSTA register enables the
EUSART.
26.5.2.1 EUSART Synchronous Slave
Transmit
The operation of the Synchronous Master and Slave
modes are identical (see Section 26.5.1.3
“Synchronous Master Transmission”), except in the
case of the Sleep mode.
If two words are written to the TXREG and then the
SLEEP instruction is executed, the following will occur:
1. The first character will immediately transfer to
the TSR register and transmit.
2. The second word will remain in TXREG register.
3. The TXIF bit will not be set.
4. After the first character has been shifted out of
TSR, the TXREG register will transfer the second
character to the TSR and the TXIF bit will now be
set.
5. If the PEIE and TXIE bits are set, the interrupt
will wake the device from Sleep and execute the
next instruction. If the GIE bit is also set, the
program will call the Interrupt Service Routine.
26.5.2.2 Synchronous Slave Transmission
Set-up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Clear the ANSEL bit for the CK pin (if applicable).
3. Clear the CREN and SREN bits.
4. If interrupts are desired, set the TXIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
5. If 9-bit transmission is desired, set the TX9 bit.
6. Enable transmission by setting the TXEN bit.
7. If 9-bit transmission is selected, insert the Most
Significant bit into the TX9D bit.
8. Start transmission by writing the Least
Significant eight bits to the TXREG register.
TABLE 26-9: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE
TRANSMISSION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL —SCKPBRG16 —WUE ABDEN 259
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 75
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
TXREG EUSART Transmit Data Register 249*
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Synchronous Slave Transmission.
* Page provides register information.
PIC12(L)F1840
DS40001441F-page 274 2011-2015 Microchip Technology Inc.
26.5.2.3 EUSART Synchronous Slave
Reception
The operation of the Synchronous Master and Slave
modes is identical (Section 26.5.1.5 “Synchronous
Master Reception”), with the following exceptions:
• Sleep
• CREN bit is always set, therefore the receiver is
never idle
• SREN bit, which is a “don’t care” in Slave mode
A character may be received while in Sleep mode by
setting the CREN bit prior to entering Sleep. Once the
word is received, the RSR register will transfer the data
to the RCREG register. If the RCIE enable bit is set, the
interrupt generated will wake the device from Sleep
and execute the next instruction. If the GIE bit is also
set, the program will branch to the interrupt vector.
26.5.2.4 Synchronous Slave Reception
Set-up:
1. Set the SYNC and SPEN bits and clear the
CSRC bit.
2. Clear the ANSEL bit for both the CK and DT pins
(if applicable).
3. If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
4. If 9-bit reception is desired, set the RX9 bit.
5. Set the CREN bit to enable reception.
6. The RCIF bit will be set when reception is
complete. An interrupt will be generated if the
RCIE bit was set.
7. If 9-bit mode is enabled, retrieve the Most
Significant bit from the RX9D bit of the RCSTA
register.
8. Retrieve the eight Least Significant bits from the
receive FIFO by reading the RCREG register.
9. If an overrun error occurs, clear the error by
either clearing the CREN bit of the RCSTA
register or by clearing the SPEN bit which resets
the EUSART.
TABLE 26-10: SUMMARY OF REGISTERS ASSOCIATED WITH SYNCHRONOUS SLAVE
RECEPTION
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
BAUDCON ABDOVF RCIDL —SCKPBRG16 —WUE ABDEN 259
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
PIE1 TMR1GIE ADIE RCIE TXIE SSPIE CCP1IE TMR2IE TMR1IE 73
PIR1 TMR1GIF ADIF RCIF TXIF SSPIF CCP1IF TMR2IF TMR1IF 75
RCREG EUSART Receive Data Register 252*
RCSTA SPEN RX9 SREN CREN ADDEN FERR OERR RX9D 258
TXSTA CSRC TX9 TXEN SYNC SENDB BRGH TRMT TX9D 257
Legend: — = unimplemented location, read as ‘0’. Shaded cells are not used for Synchronous Slave Reception.
* Page provides register information.
2011-2015 Microchip Technology Inc. DS40001441F-page 275
PIC12(L)F1840
26.6 EUSART Operation During Sleep
The EUSART will remain active during Sleep only in the
Synchronous Slave mode. All other modes require the
system clock and therefore cannot generate the
necessary signals to run the Transmit or Receive Shift
registers during Sleep.
Synchronous Slave mode uses an externally generated
clock to run the Transmit and Receive Shift registers.
26.6.1 SYNCHRONOUS RECEIVE DURING
SLEEP
To receive during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for Synchronous Slave Reception (see
Section 26.5.2.4 “Synchronous Slave
Reception Set-up:”).
• If interrupts are desired, set the RCIE bit of the
PIE1 register and the GIE and PEIE bits of the
INTCON register.
• The RCIF interrupt flag must be cleared by read-
ing RCREG to unload any pending characters in
the receive buffer.
Upon entering Sleep mode, the device will be ready to
accept data and clocks on the RX/DT and TX/CK pins,
respectively. When the data word has been completely
clocked in by the external device, the RCIF interrupt
flag bit of the PIR1 register will be set. Thereby, waking
the processor from Sleep.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the Global Inter-
rupt Enable (GIE) bit of the INTCON register is also set,
then the Interrupt Service Routine at address 004h will
be called.
26.6.2 SYNCHRONOUS TRANSMIT
DURING SLEEP
To transmit during Sleep, all the following conditions
must be met before entering Sleep mode:
• RCSTA and TXSTA Control registers must be
configured for synchronous slave transmission
(see Section 26.5.2.2 “Synchronous Slave
Transmission Set-up:”).
• The TXIF interrupt flag must be cleared by writing
the output data to the TXREG, thereby filling the
TSR and transmit buffer.
• If interrupts are desired, set the TXIE bit of the
PIE1 register and the PEIE bit of the INTCON reg-
ister.
• Interrupt enable bits TXIE of the PIE1 register and
PEIE of the INTCON register must set.
Upon entering Sleep mode, the device will be ready to
accept clocks on TX/CK pin and transmit data on the
RX/DT pin. When the data word in the TSR has been
completely clocked out by the external device, the
pending byte in the TXREG will transfer to the TSR and
the TXIF flag will be set. Thereby, waking the processor
from Sleep. At this point, the TXREG is available to
accept another character for transmission, which will
clear the TXIF flag.
Upon waking from Sleep, the instruction following the
SLEEP instruction will be executed. If the Global
Interrupt Enable (GIE) bit is also set then the Interrupt
Service Routine at address 0004h will be called.
26.6.3 ALTERNATE PIN LOCATIONS
This module incorporates I/O pins that can be moved to
other locations with the use of the alternate pin function
register, APFCON. To determine which pins can be
moved and what their default locations are upon a
Reset, see Section 12.1 “Alternate Pin Function” for
more information.
4%
PIC12(L)F1840
DS40001441F-page 276 2011-2015 Microchip Technology Inc.
27.0 CAPACITIVE SENSING (CPS)
MODULE
The Capacitive Sensing (CPS) module allows for an
interaction with an end user without a mechanical
interface. In a typical application, the CPS module is
attached to a pad on a Printed Circuit Board (PCB),
which is electrically isolated from the end user. When the
end user places their finger over the PCB pad, a
capacitive load is added, causing a frequency shift in the
CPS module. The CPS module requires software and at
least one timer resource to determine the change in
frequency. Key features of this module include:
• Analog MUX for monitoring multiple inputs
• Capacitive sensing oscillator
• Multiple current ranges
• Multiple voltage reference modes
• Multiple timer resources
• Software control
• Operation during Sleep
FIGURE 27-1: CAPACITIVE SENSING BLOCK DIAGRAM
Note 1: If CPSON = 0, disabling capacitive sensing, no channel is selected.
TMR0CS
CPS0
CPS1
CPS2
CPS3
CPSCH<3:0>
Capacitive
Sensing
Oscillator
CPSOSC
CPSON
CPSRNG<1:0>
TMR0
0
1
Set
TMR0IF
Overflow
T0XCS
0
1
T0CKI
CPSOUT
CPSCLK
FOSC/4
Timer0 Module
CPSON(1)
T1CS<1:0>
T1OSC/
T1CKI
TMR1H:TMR1L
EN
T1GSEL<1:0>
Timer1 Gate
Control Logic
T1G
FOSC
FOSC/4
Timer1 Module
sync_C1OUT
0
1
Int.
Ref.
Ref+
Ref-
CPSRM
0
1FVR
Buffer2
DAC_output
2011-2015 Microchip Technology Inc. DS40001441F-page 277
PIC12(L)F1840
FIGURE 27-2: CAPACITIVE SENSING OSCILLATOR BLOCK DIAGRAM
Note 1: Module Enable and Current mode selections are not shown.
2: Comparators remain active in Noise Detection mode.
0
1
VDD
CPSCLK
Oscillator Module
CPSx SQ
R
+
-
+
-
(2)
(1)
(1) (2)
0
1
Internal
References
FVR Buffer2
DAC_output
CPSRM
Analog Pin
Ref- Ref+
PIC12(L)F1840
DS40001441F-page 278 2011-2015 Microchip Technology Inc.
27.1 Analog MUX
The CPS module can monitor up to four inputs. See
Register 27-2 for details. To determine if a frequency
change has occurred the user must:
• Select the appropriate CPS pin by setting the
appropriate CPSCH bits of the CPSCON1 register.
• Set the corresponding ANSEL bit.
• Set the corresponding TRIS bit.
• Run the software algorithm.
Selection of the CPSx pin while the module is enabled
will cause the capacitive sensing oscillator to be on the
CPSx pin. Failure to set the corresponding ANSEL and
TRIS bits can cause the capacitive sensing oscillator to
stop, leading to false frequency readings.
27.2 Capacitive Sensing Oscillator
The capacitive sensing oscillator consists of a constant
current source and a constant current sink, to produce
a triangle waveform. The CPSOUT bit of the
CPSCON0 register shows the status of the capacitive
sensing oscillator, whether it is a sinking or sourcing
current. The oscillator is designed to drive a capacitive
load (single PCB pad) and at the same time, be a clock
source to either Timer0 or Timer1. The oscillator has
several different current settings as defined by CPS-
RNG<1:0> of the CPSCON0 register. The different cur-
rent settings for the oscillator serve two purposes:
• Maximize the number of counts in a timer for a
fixed time base.
• Maximize the count differential in the timer during
a change in frequency.
27.3 Voltage References
The capacitive sensing oscillator uses voltage
references to provide two voltage thresholds for
oscillation. The upper voltage threshold is referred to
as Ref+ and the lower voltage threshold is referred to
as Ref-.
The user can elect to use Fixed Voltage References,
which are internal to the capacitive sensing oscillator,
or variable voltage references, which are supplied by
the Fixed Voltage Reference (FVR) module and the
Digital-to-Analog Converter (DAC) module.
When the Fixed Voltage References are used, the VSS
voltage determines the lower threshold level (Ref-) and
the VDD voltage determines the upper threshold level
(Ref+).
When the variable voltage references are used, the
DAC voltage determines the lower threshold level
(Ref-) and the FVR voltage determines the upper
threshold level (Ref+). An advantage of using these
reference sources is that oscillation frequency remains
constant with changes in VDD.
Different oscillation frequencies can be obtained
through the use of these variable voltage references.
The more the upper voltage reference level is lowered
and the more the lower voltage reference level is
raised, the higher the capacitive sensing oscillator
frequency becomes.
Selection between the voltage references is controlled
by the CPSRM bit of the CPSCON0 register. Setting
this bit selects the variable voltage references and
clearing this bit selects the Fixed Voltage References.
Please see Section 14.0 “Fixed Voltage Reference
(FVR)” and Section 17.0 “Digital-to-Analog Converter
(DAC) Module” for more information on configuring the
variable voltage levels.
2011-2015 Microchip Technology Inc. DS40001441F-page 279
PIC12(L)F1840
27.4 Current Ranges
The capacitive sensing oscillator can operate in one of
seven different power modes. The power modes are
separated into two ranges; the low range and the high
range.
When the oscillator’s low range is selected, the fixed
internal voltage references of the capacitive sensing
oscillator are being used. When the oscillator’s high
range is selected, the variable voltage references
supplied by the FVR and DAC modules are being used.
Selection between the voltage references is controlled
by the CPSRM bit of the CPSCON0 register. See
Section 27.3 “Voltage References” for more
information.
Within each range there are three distinct Power modes;
low, medium and high. Current consumption is dependent
upon the range and mode selected. Selecting Power
modes within each range is accomplished by configuring
the CPSRNG <1:0> bits in the CPSCON0 register. See
Table 27-1 for proper Power mode selection.
The remaining mode is a Noise Detection mode that
resides within the high range. The Noise Detection
mode is unique in that it disables the sinking and
sourcing of current on the analog pin but leaves the rest
of the oscillator circuitry active. This reduces the
oscillation frequency on the analog pin to zero and also
greatly reduces the current consumed by the oscillator
module.
When noise is introduced onto the pin, the oscillator is
driven at the frequency determined by the noise. This
produces a detectable signal at the comparator output,
indicating the presence of activity on the pin.
Figure 27-2 shows a more detailed drawing of the
current sources and comparators associated with the
oscillator.
TABLE 27-1: CURRENT RANGE MODE SELECTION
CPSRM Range CPSRNG<1:0> Current Range(1)
1Variable
00 Noise Detection
01 Low
10 Medium
11 High
0Fixed
00 Off
01 Low
10 Medium
11 High
Note 1: See Power-Down Currents (IPD) in Section 30.0 “Electrical Specifications” for more information.
PIC12(L)F1840
DS40001441F-page 280 2011-2015 Microchip Technology Inc.
27.5 Timer Resources
To measure the change in frequency of the capacitive
sensing oscillator, a fixed time base is required. For the
period of the fixed time base, the capacitive sensing
oscillator is used to clock either Timer0 or Timer1. The
frequency of the capacitive sensing oscillator is equal
to the number of counts in the timer divided by the
period of the fixed time base.
27.6 Fixed Time Base
To measure the frequency of the capacitive sensing
oscillator, a fixed time base is required. Any timer
resource or software loop can be used to establish the
fixed time base. It is up to the end user to determine the
method in which the fixed time base is generated.
27.6.1 TIMER0
To select Timer0 as the timer resource for the CPS
module:
• Set the T0XCS bit of the CPSCON0 register.
• Clear the TMR0CS bit of the OPTION_REG
register.
When Timer0 is chosen as the timer resource, the
capacitive sensing oscillator will be the clock source for
Timer0. Refer to Section 20.0 “Timer0 Module” for
additional information.
27.6.2 TIMER1
To select Timer1 as the timer resource for the CPS
module, set the TMR1CS<1:0> of the T1CON register
to ‘11’. When Timer1 is chosen as the timer resource,
the capacitive sensing oscillator will be the clock
source for Timer1. Because the Timer1 module has a
gate control, developing a time base for the frequency
measurement can be simplified by using the Timer0
overflow flag.
It is recommend that the Timer0 overflow flag, in
conjunction with the Toggle mode of the Timer1 Gate,
be used to develop the fixed time base required by the
software portion of the CPS module. Refer to
Section 21.6 “Timer1 Gate” for additional information.
TABLE 27-2: TIMER1 ENABLE FUNCTION
27.7 Software Control
The software portion of the CPS module is required to
determine the change in frequency of the capacitive
sensing oscillator. This is accomplished by the
following:
• Setting a fixed time base to acquire counts on
Timer0 or Timer1.
• Establishing the nominal frequency for the
capacitive sensing oscillator.
• Establishing the reduced frequency for the capac-
itive sensing oscillator due to an additional capac-
itive load.
• Set the frequency threshold.
27.7.1 NOMINAL FREQUENCY
(NO CAPACITIVE LOAD)
To determine the nominal frequency of the capacitive
sensing oscillator:
• Remove any extra capacitive load on the selected
CPSx pin.
• At the start of the fixed time base, clear the timer
resource.
• At the end of the fixed time base save the value in
the timer resource.
The value of the timer resource is the number of
oscillations of the capacitive sensing oscillator for the
given time base. The frequency of the capacitive
sensing oscillator is equal to the number of counts on
in the timer, divided by the period of the fixed time base.
27.7.2 REDUCED FREQUENCY
(ADDITIONAL CAPACITIVE LOAD)
The extra capacitive load will cause the frequency of the
capacitive sensing oscillator to decrease. To determine
the reduced frequency of the capacitive sensing
oscillator:
• Add a typical capacitive load on the selected
CPSx pin.
• Use the same fixed time base as the nominal
frequency measurement.
• At the start of the fixed time base, clear the timer
resource.
• At the end of the fixed time base, save the value
in the timer resource.
The value of the timer resource is the number of
oscillations of the capacitive sensing oscillator with an
additional capacitive load. The frequency of the capac-
itive sensing oscillator is equal to the number of counts
on in the timer, divided by the period of the fixed time
base. This frequency should be less than the value
obtained during the nominal frequency measurement.
Note: The fixed time base can not be generated
by the timer resource that the capacitive
sensing oscillator is clocking.
TMR1ON TMR1GE Timer1 Operation
00 Off
01 Off
10 On
11Count Enabled by input
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PIC12(L)F1840
27.7.3 FREQUENCY THRESHOLD
The frequency threshold should be placed midway
between the value of nominal frequency and the
reduced frequency of the capacitive sensing oscillator.
Refer to Application Note AN1103, “Software Handling
for Capacitive Sensing” (DS01103) for more detailed
information on the software required for CPS module.
27.8 Operation during Sleep
The capacitive sensing oscillator will continue to run as
long as the module is enabled, independent of the part
being in Sleep. In order for the software to determine if
a frequency change has occurred, the part must be
awake. However, the part does not have to be awake
when the timer resource is acquiring counts.
Note: For more information on general capacitive
sensing refer to Application Notes:
• AN1101, “Introduction to Capacitive
Sensing” (DS01101)
• AN1102, “Layout and Physical
Design Guidelines for Capacitive
Sensing” (DS01102)
Note: Timer0 does not operate when in Sleep,
and therefore, cannot be used for
capacitive sense measurements in Sleep.
If CPSRM : 1 variab‘e vo‘lage reference mode If CPSRM : o Frxed Vo‘tage Reference mode . If TMROCS : 1 If TMROCS : 0
PIC12(L)F1840
DS40001441F-page 282 2011-2015 Microchip Technology Inc.
27.9 Register Definitions: Capacitive Sensing Control
REGISTER 27-1: CPSCON0: CAPACITIVE SENSING CONTROL REGISTER 0
R/W-0/0 R/W-0/0 U-0 U-0 R/W-0/0 R/W-0/0 R-0/0 R/W-0/0
CPSON CPSRM —— CPSRNG<1:0> CPSOUT T0XCS
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7 CPSON: CPS Module Enable bit
1 = CPS module is enabled
0 = CPS module is disabled
bit 6 CPSRM: Capacitive Sensing Reference Mode bit
1 = Capacitive Sensing module is in Variable Voltage Reference mode.
0 = Capacitive Sensing module is in Fixed Voltage Reference mode.
bit 5-4 Unimplemented: Read as ‘0’
bit 3-2 CPSRNG<1:0>: Capacitive Sensing Current Range bit
If CPSRM = 1 (variable voltage reference mode):(2)
11 = Oscillator is in High Current Range.
10 = Oscillator is in Medium Current Range.
01 = Oscillator is in Low Current Range.
00 = Oscillator is on. Noise detection mode.
If CPSRM = 0 (Fixed Voltage Reference mode):(1)
11 = Oscillator is in High Current Range.
10 = Oscillator is in Medium Current Range.
01 = Oscillator is in Low Current Range.
00 = Oscillator is off.
bit 1 CPSOUT: Capacitive Sensing Oscillator Status bit
1 = Oscillator is sourcing current (Current flowing out of the pin)
0 = Oscillator is sinking current (Current flowing into the pin)
bit 0 T0XCS: Timer0 External Clock Source Select bit
If TMR0CS = 1:
The T0XCS bit controls which clock external to the core/Timer0 module supplies Timer0:
1 = Timer0 clock source is the capacitive sensing oscillator, CPSCLK
0 = Timer0 clock source is the T0CKI pin
If TMR0CS = 0:
Timer0 clock source is controlled by the core/Timer0 module and is FOSC/4
If CPSON :7 If CPSON =7
2011-2015 Microchip Technology Inc. DS40001441F-page 283
PIC12(L)F1840
TABLE 27-3: SUMMARY OF REGISTERS ASSOCIATED WITH CAPACITIVE SENSING
REGISTER 27-2: CPSCON1: CAPACITIVE SENSING CONTROL REGISTER 1
U-0 U-0 U-0 U-0 U-0 U-0 R/W-0/0 R/W-0/0
— — — — — — CPSCH<1:0>
bit 7 bit 0
Legend:
R = Readable bit W = Writable bit U = Unimplemented bit, read as ‘0’
u = Bit is unchanged x = Bit is unknown -n/n = Value at POR and BOR/Value at all other Resets
‘1’ = Bit is set ‘0’ = Bit is cleared
bit 7-2 Unimplemented: Read as ‘0’
bit 1-0 CPSCH<1:0>: Capacitive Sensing Channel Select bits
If CPSON = 0:
These bits are ignored. No channel is selected.
If CPSON = 1:
11 = channel 3, (CPS3)
10 = channel 2, (CPS2)
01 = channel 1, (CPS1)
00 = channel 0, (CPS0)
Name Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0 Register
on Page
ANSELA ———ANSA4— ANSA2 ANSA1 ANSA0 103
CPSCON0 CPSON CPSRM —— CPSRNG<1:0> CPSOUT T0XCS 282
CPSCON1 —————— CPSCH<1:0> 283
INTCON GIE PEIE TMR0IE INTE IOCIE TMR0IF INTF IOCIF 72
OPTION_REG WPUEN INTEDG TMR0CS TMR0SE PSA PS<2:0> 145
T1CON TMR1CS<1:0> T1CKPS<1:0> T1OSCEN T1SYNC —TMR1ON154
TRISA — — TRISA5 TRISA4 TRISA3 TRISA2 TRISA1 TRISA0 102
Legend: — = Unimplemented locations, read as ‘0’. Shaded cells are not used by the CPS module.
MCLR nMCLR
PIC12(L)F1840
DS40001441F-page 284 2011-2015 Microchip Technology Inc.
28.0 IN-CIRCUIT SERIAL
PROGRAMMING™ (ICSP™)
ICSP™ programming allows customers to manufacture
circuit boards with unprogrammed devices. Programming
can be done after the assembly process allowing the
device to be programmed with the most recent firmware
or a custom firmware. Five pins are needed for ICSP™
programming:
• ICSPCLK
• ICSPDAT
•MCLR
/VPP
•VDD
•VSS
In Program/Verify mode the program memory, user IDs
and the Configuration Words are programmed through
serial communications. The ICSPDAT pin is a
bidirectional I/O used for transferring the serial data and
the ICSPCLK pin is the clock input. For more information
on ICSP™ refer to the
“PIC16F/LF1847/PIC12F/LF1840 Memory
Programming Specification”, (DS41439).
28.1 High-Voltage Programming Entry
Mode
The device is placed into High-Voltage Programming
Entry mode by holding the ICSPCLK and ICSPDAT
pins low then raising the voltage on MCLR/VPP to VIHH.
Some programmers produce VPP greater than VIHH
(9.0V), an external circuit is required to limit the VPP
voltage. See Figure 28-1 for example circuit.
FIGURE 28-1: VPP LIMITER EXAMPLE CIRCUIT
VREF
VPP
VDD
VSS
ICSP_DATA
ICSP_CLOCK
NC
RJ11-6PIN
RJ11-6PIN
R1
270 Ohm
To M PL AB® ICD 2 To Targe t Bo ard
1
2
3
4
5
61
2
3
4
5
6
R2 R3
10k 1% 24k 1%
U1
LM431BCMX
A
2
3
6
7
8
A
A
A
K
NC
NC
1
4
5
MCLR MCLR MCLR lMCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 285
PIC12(L)F1840
28.2 Low-Voltage Programming Entry
Mode
The Low-Voltage Programming Entry mode allows the
PIC® Flash MCUs to be programmed using VDD only,
without high voltage. When the LVP bit of Configuration
Words is set to ‘1’, the low-voltage ICSP programming
entry is enabled. To disable the Low-Voltage ICSP
mode, the LVP bit must be programmed to ‘0’.
Entry into the Low-Voltage Programming Entry mode
requires the following steps:
1. MCLR is brought to VIL.
2. A 32-bit key sequence is presented on
ICSPDAT, while clocking ICSPCLK.
Once the key sequence is complete, MCLR must be
held at VIL for as long as Program/Verify mode is to be
maintained.
If low-voltage programming is enabled (LVP = 1), the
MCLR Reset function is automatically enabled and
cannot be disabled. See Section 7.4 “MCLR” for more
information.
The LVP bit can only be reprogrammed to ‘0’ by using
the High-Voltage Programming mode.
28.3 Common Programming Interfaces
Connection to a target device is typically done through
an ICSP™ header. A commonly found connector on
development tools is the RJ-11 in the 6P6C (6-pin, 6
connector) configuration. See Figure 28-2.
FIGURE 28-2: ICD RJ-11 STYLE
CONNECTOR INTERFACE
Note: The MPLAB ICD 2 produces a VPP
voltage greater than the maximum VPP
specification of the PIC12(L)F1840.
1
2
3
4
5
6
Target
Bottom Side
PC Board
VPP/MCLR VSS
ICSPCLK
VDD
ICSPDAT
NC
Pin Description*
1 = VPP/MCLR
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
PIC12(L)F1840
DS40001441F-page 286 2011-2015 Microchip Technology Inc.
Another connector often found in use with the PICkit™
programmers is a standard 6-pin header with 0.1 inch
spacing. Refer to Figure 28-3.
FIGURE 28-3: PICkit™ PROGRAMMER STYLE CONNECTOR INTERFACE
1
2
3
4
5
6
* The 6-pin header (0.100" spacing) accepts 0.025" square pins.
Pin Description*
1 = VPP/MCLR
2 = VDD Target
3 = VSS (ground)
4 = ICSPDAT
5 = ICSPCLK
6 = No Connect
Pin 1 Indicator
2011-2015 Microchip Technology Inc. DS40001441F-page 287
PIC12(L)F1840
For additional interface recommendations, refer to your
specific device programmer manual prior to PCB
design.
It is recommended that isolation devices be used to
separate the programming pins from other circuitry.
The type of isolation is highly dependent on the specific
application and may include devices such as resistors,
diodes, or even jumpers. See Figure 28-4 for more
information.
FIGURE 28-4: TYPICAL CONNECTION FOR ICSP™ PROGRAMMING
VDD
VPP
VSS
External
Device to be
Data
Clock
VDD
MCLR/VPP
VSS
ICSPDAT
ICSPCLK
**
*
To Normal Connections
*Isolation devices (as required).
Programming
Signals Programmed
VDD
PIC12(L)F1840
DS40001441F-page 288 2011-2015 Microchip Technology Inc.
29.0 INSTRUCTION SET SUMMARY
Each instruction is a 14-bit word containing the
operation code (opcode) and all required operands.
The opcodes are broken into three broad categories.
• Byte Oriented
• Bit Oriented
• Literal and Control
The literal and control category contains the most
varied instruction word format.
Table 29-3 lists the instructions recognized by the
MPASMTM assembler.
All instructions are executed within a single instruction
cycle, with the following exceptions, which may take
two or three cycles:
• Subroutine takes two cycles (CALL, CALLW)
• Returns from interrupts or subroutines take two
cycles (RETURN, RETLW, RETFIE)
• Program branching takes two cycles (GOTO, BRA,
BRW, BTFSS, BTFSC, DECFSZ, INCSFZ)
• One additional instruction cycle will be used when
any instruction references an indirect file register
and the file select register is pointing to program
memory.
One instruction cycle consists of four oscillator cycles;
for an oscillator frequency of 4 MHz, this gives a
nominal instruction execution rate of 1 MHz.
All instruction examples use the format ‘0xhh’ to
represent a hexadecimal number, where ‘h’ signifies a
hexadecimal digit.
29.1 Read-Modify-Write Operations
Any instruction that specifies a file register as part of
the instruction performs a Read-Modify-Write (R-M-W)
operation. The register is read, the data is modified,
and the result is stored according to either the
instruction, or the destination designator ‘d’. A read
operation is performed on a register even if the
instruction writes to that register.
TABLE 29-1: OPCODE FIELD
DESCRIPTIONS
TABLE 29-2: ABBREVIATION
DESCRIPTIONS
Field Description
fRegister file address (0x00 to 0x7F)
WWorking register (accumulator)
bBit address within an 8-bit file register
kLiteral field, constant data or label
xDon’t care location (= 0 or 1).
The assembler will generate code with x = 0.
It is the recommended form of use for
compatibility with all Microchip software tools.
dDestination select; d = 0: store result in W,
d = 1: store result in file register f.
Default is d = 1.
nFSR or INDF number. (0-1)
mm Pre-post increment-decrement mode
selection
Field Description
PC Program Counter
TO Time-out bit
CCarry bit
DC Digit carry bit
ZZero bit
PD Power-down bit
2011-2015 Microchip Technology Inc. DS40001441F-page 289
PIC12(L)F1840
FIGURE 29-1: GENERAL FORMAT FOR
INSTRUCTIONS
Byte-oriented file register operations
13 8 7 6 0
d = 0 for destination W
OPCODE d f (FILE #)
d = 1 for destination f
f = 7-bit file register address
Bit-oriented file register operations
13 10 9 7 6 0
OPCODE b (BIT #) f (FILE #)
b = 3-bit bit address
f = 7-bit file register address
Literal and control operations
13 8 7 0
OPCODE k (literal)
k = 8-bit immediate value
13 11 10 0
OPCODE k (literal)
k = 11-bit immediate value
General
CALL and GOTO instructions only
MOVLP instruction only
13 5 4 0
OPCODE k (literal)
k = 5-bit immediate value
MOVLB instruction only
13 9 8 0
OPCODE k (literal)
k = 9-bit immediate value
BRA instruction only
FSR Offset instructions
13 7 6 5 0
OPCODE n k (literal)
n = appropriate FSR
FSR Increment instructions
13 7 6 0
OPCODE k (literal)
k = 7-bit immediate value
13 3 2 1 0
OPCODE n m (mode)
n = appropriate FSR
m = 2-bit mode value
k = 6-bit immediate value
13 0
OPCODE
OPCODE only
PIC12(L)F1840
DS40001441F-page 290 2011-2015 Microchip Technology Inc.
TABLE 29-3: PIC12(L)F1840 INSTRUCTION SET
Mnemonic,
Operands Description Cycles
14-Bit Opcode Status
Affected Notes
MSb LSb
BYTE-ORIENTED FILE REGISTER OPERATIONS
ADDWF
ADDWFC
ANDWF
ASRF
LSLF
LSRF
CLRF
CLRW
COMF
DECF
INCF
IORWF
MOVF
MOVWF
RLF
RRF
SUBWF
SUBWFB
SWAPF
XORWF
f, d
f, d
f, d
f, d
f, d
f, d
f
–
f, d
f, d
f, d
f, d
f, d
f
f, d
f, d
f, d
f, d
f, d
f, d
Add W and f
Add with Carry W and f
AND W with f
Arithmetic Right Shift
Logical Left Shift
Logical Right Shift
Clear f
Clear W
Complement f
Decrement f
Increment f
Inclusive OR W with f
Move f
Move W to f
Rotate Left f through Carry
Rotate Right f through Carry
Subtract W from f
Subtract with Borrow W from f
Swap nibbles in f
Exclusive OR W with f
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
00
11
00
11
11
11
00
00
00
00
00
00
00
00
00
00
00
11
00
00
0111
1101
0101
0111
0101
0110
0001
0001
1001
0011
1010
0100
1000
0000
1101
1100
0010
1011
1110
0110
dfff
dfff
dfff
dfff
dfff
dfff
lfff
0000
dfff
dfff
dfff
dfff
dfff
1fff
dfff
dfff
dfff
dfff
dfff
dfff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
00xx
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
ffff
C, DC, Z
C, DC, Z
Z
C, Z
C, Z
C, Z
Z
Z
Z
Z
Z
Z
Z
C
C
C, DC, Z
C, DC, Z
Z
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
BYTE ORIENTED SKIP OPERATIONS
DECFSZ
INCFSZ
f, d
f, d
Decrement f, Skip if 0
Increment f, Skip if 0
1(2)
1(2)
00
00
1011
1111
dfff
dfff
ffff
ffff
1, 2
1, 2
BIT-ORIENTED FILE REGISTER OPERATIONS
BCF
BSF
f, b
f, b
Bit Clear f
Bit Set f
1
1
01
01
00bb
01bb
bfff
bfff
ffff
ffff
2
2
BIT-ORIENTED SKIP OPERATIONS
BTFSC
BTFSS
f, b
f, b
Bit Test f, Skip if Clear
Bit Test f, Skip if Set
1 (2)
1 (2)
01
01
10bb
11bb
bfff
bfff
ffff
ffff
1, 2
1, 2
LITERAL OPERATIONS
ADDLW
ANDLW
IORLW
MOVLB
MOVLP
MOVLW
SUBLW
XORLW
k
k
k
k
k
k
k
k
Add literal and W
AND literal with W
Inclusive OR literal with W
Move literal to BSR
Move literal to PCLATH
Move literal to W
Subtract W from literal
Exclusive OR literal with W
1
1
1
1
1
1
1
1
11
11
11
00
11
11
11
11
1110
1001
1000
0000
0001
0000
1100
1010
kkkk
kkkk
kkkk
001k
1kkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
kkkk
C, DC, Z
Z
Z
C, DC, Z
Z
Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle
is executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require one
additional instruction cycle.
CONTROL OPERATIONS
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PIC12(L)F1840
TABLE 29-3: PIC12(L)F1840 INSTRUCTION SET (CONTINUED)
Mnemonic,
Operands Description Cycles
14-Bit Opcode Status
Affected Notes
MSb LSb
CONTROL OPERATIONS
BRA
BRW
CALL
CALLW
GOTO
RETFIE
RETLW
RETURN
k
–
k
–
k
k
k
–
Relative Branch
Relative Branch with W
Call Subroutine
Call Subroutine with W
Go to address
Return from interrupt
Return with literal in W
Return from Subroutine
2
2
2
2
2
2
2
2
11
00
10
00
10
00
11
00
001k
0000
0kkk
0000
1kkk
0000
0100
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
0000
kkkk
1011
kkkk
1010
kkkk
1001
kkkk
1000
INHERENT OPERATIONS
CLRWDT
NOP
OPTION
RESET
SLEEP
TRIS
–
–
–
–
–
f
Clear Watchdog Timer
No Operation
Load OPTION_REG register with W
Software device Reset
Go into Standby mode
Load TRIS register with W
1
1
1
1
1
1
00
00
00
00
00
00
0000
0000
0000
0000
0000
0000
0110
0000
0110
0000
0110
0110
0100
0000
0010
0001
0011
0fff
TO, PD
TO, PD
C-COMPILER OPTIMIZED
ADDFSR
MOVIW
MOVWI
n, k
n mm
k[n]
n mm
k[n]
Add Literal k to FSRn
Move Indirect FSRn to W with pre/post inc/dec
modifier, mm
Move INDFn to W, Indexed Indirect.
Move W to Indirect FSRn with pre/post inc/dec
modifier, mm
Move W to INDFn, Indexed Indirect.
1
1
1
1
1
11
00
11
00
11
0001
0000
1111
0000
1111
0nkk
0001
0nkk
0001
1nkk
kkkk
0nmm
kkkk
1nmm
kkkk
Z
Z
2, 3
2
2, 3
2
Note 1: If the Program Counter (PC) is modified, or a conditional test is true, the instruction requires two cycles. The second cycle
is executed as a NOP.
2: If this instruction addresses an INDF register and the MSb of the corresponding FSR is set, this instruction will require
one additional instruction cycle.
3: See Table in the MOVIW and MOVWI instruction descriptions.
PIC12(L)F1840
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29.2 Instruction Descriptions
ADDFSR Add Literal to FSRn
Syntax: [ label ] ADDFSR FSRn, k
Operands: -32 k 31
n [ 0, 1]
Operation: FSR(n) + k FSR(n)
Status Affected: None
Description: The signed 6-bit literal ‘k’ is added to
the contents of the FSRnH:FSRnL
register pair.
FSRn is limited to the range 0000h -
FFFFh. Moving beyond these bounds
will cause the FSR to wrap-around.
ADDLW Add literal and W
Syntax: [ label ] ADDLW k
Operands: 0 k 255
Operation: (W) + k (W)
Status Affected: C, DC, Z
Description: The contents of the W register are
added to the 8-bit literal ‘k’ and the
result is placed in the W register.
ADDWF Add W and f
Syntax: [ label ] ADDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) + (f) (destination)
Status Affected: C, DC, Z
Description: Add the contents of the W register
with register ‘f’. If ‘d’ is ‘0’, the result is
stored in the W register. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
ADDWFC ADD W and CARRY bit to f
Syntax: [ label ] ADDWFC f {,d}
Operands: 0 f 127
d [0,1]
Operation: (W) + (f) + (C) dest
Status Affected: C, DC, Z
Description: Add W, the Carry flag and data mem-
ory location ‘f’. If ‘d’ is ‘0’, the result is
placed in W. If ‘d’ is ‘1’, the result is
placed in data memory location ‘f’.
ANDLW AND literal with W
Syntax: [ label ] ANDLW k
Operands: 0 k 255
Operation: (W) .AND. (k) (W)
Status Affected: Z
Description: The contents of W register are
AND’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
ANDWF AND W with f
Syntax: [ label ] ANDWF f,d
Operands: 0 f 127
d 0,1
Operation: (W) .AND. (f) (destination)
Status Affected: Z
Description: AND the W register with register ‘f’. If
‘d’ is ‘0’, the result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
ASRF Arithmetic Right Shift
Syntax: [ label ] ASRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. The MSb remains unchanged. If
‘d’ is ‘0’, the result is placed in W. If ‘d’
is ‘1’, the result is stored back in reg-
ister ‘f’.
register f C
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BCF Bit Clear f
Syntax: [ label ] BCF f,b
Operands: 0 f 127
0 b 7
Operation: 0 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is cleared.
BRA Relative Branch
Syntax: [ label ] BRA label
[ label ] BRA $+k
Operands: -256 label - PC + 1 255
-256 k 255
Operation: (PC) + 1 + k PC
Status Affected: None
Description: Add the signed 9-bit literal ‘k’ to the
PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + k.
This instruction is a 2-cycle instruc-
tion. This branch has a limited range.
BRW Relative Branch with W
Syntax: [ label ] BRW
Operands: None
Operation: (PC) + (W) PC
Status Affected: None
Description: Add the contents of W (unsigned) to
the PC. Since the PC will have incre-
mented to fetch the next instruction,
the new address will be PC + 1 + (W).
This instruction is a 2-cycle instruc-
tion.
BSF Bit Set f
Syntax: [ label ] BSF f,b
Operands: 0 f 127
0 b 7
Operation: 1 (f<b>)
Status Affected: None
Description: Bit ‘b’ in register ‘f’ is set.
BTFSC Bit Test f, Skip if Clear
Syntax: [ label ] BTFSC f,b
Operands: 0 f 127
0 b 7
Operation: skip if (f<b>) = 0
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘1’, the next
instruction is executed.
If bit ‘b’, in register ‘f’, is ‘0’, the next
instruction is discarded, and a NOP is
executed instead, making this a
2-cycle instruction.
BTFSS Bit Test f, Skip if Set
Syntax: [ label ] BTFSS f,b
Operands: 0 f 127
0 b < 7
Operation: skip if (f<b>) = 1
Status Affected: None
Description: If bit ‘b’ in register ‘f’ is ‘0’, the next
instruction is executed.
If bit ‘b’ is ‘1’, then the next
instruction is discarded and a NOP is
executed instead, making this a
2-cycle instruction.
fi PD fifi
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CALL Call Subroutine
Syntax: [ label ] CALL k
Operands: 0 k 2047
Operation: (PC)+ 1 TOS,
k PC<10:0>,
(PCLATH<6:3>) PC<14:11>
Status Affected: None
Description: Call Subroutine. First, return address
(PC + 1) is pushed onto the stack.
The 11-bit immediate address is
loaded into PC bits <10:0>. The upper
bits of the PC are loaded from
PCLATH. CALL is a 2-cycle instruc-
tion.
CALLW Subroutine Call With W
Syntax: [ label ] CALLW
Operands: None
Operation: (PC) +1 TOS,
(W) PC<7:0>,
(PCLATH<6:0>) PC<14:8>
Status Affected: None
Description: Subroutine call with W. First, the
return address (PC + 1) is pushed
onto the return stack. Then, the con-
tents of W is loaded into PC<7:0>,
and the contents of PCLATH into
PC<14:8>. CALLW is a 2-cycle
instruction.
CLRF Clear f
Syntax: [ label ] CLRF f
Operands: 0 f 127
Operation: 00h (f)
1 Z
Status Affected: Z
Description: The contents of register ‘f’ are cleared
and the Z bit is set.
CLRW Clear W
Syntax: [ label ] CLRW
Operands: None
Operation: 00h (W)
1 Z
Status Affected: Z
Description: W register is cleared. Zero bit (Z) is
set.
CLRWDT Clear Watchdog Timer
Syntax: [ label ] CLRWDT
Operands: None
Operation: 00h WDT
0 WDT prescaler,
1 TO
1 PD
Status Affected: TO, PD
Description: CLRWDT instruction resets the Watch-
dog Timer. It also resets the prescaler
of the WDT. Status bits TO and PD
are set.
COMF Complement f
Syntax: [ label ] COMF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (destination)
Status Affected: Z
Description: The contents of register ‘f’ are com-
plemented. If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
DECF Decrement f
Syntax: [ label ] DECF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination)
Status Affected: Z
Description: Decrement register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W
register. If ‘d’ is ‘1’, the result is stored
back in register ‘f’.
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DECFSZ Decrement f, Skip if 0
Syntax: [ label ] DECFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - 1 (destination);
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are decre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, then a
NOP is executed instead, making it a
2-cycle instruction.
GOTO Unconditional Branch
Syntax: [ label ] GOTO k
Operands: 0 k 2047
Operation: k PC<10:0>
PCLATH<6:3> PC<14:11>
Status Affected: None
Description: GOTO is an unconditional branch. The
11-bit immediate value is loaded into
PC bits <10:0>. The upper bits of PC
are loaded from PCLATH<4:3>. GOTO
is a 2-cycle instruction.
INCF Increment f
Syntax: [ label ] INCF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination)
Status Affected: Z
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
INCFSZ Increment f, Skip if 0
Syntax: [ label ] INCFSZ f,d
Operands: 0 f 127
d [0,1]
Operation: (f) + 1 (destination),
skip if result = 0
Status Affected: None
Description: The contents of register ‘f’ are incre-
mented. If ‘d’ is ‘0’, the result is placed
in the W register. If ‘d’ is ‘1’, the result
is placed back in register ‘f’.
If the result is ‘1’, the next instruction is
executed. If the result is ‘0’, a NOP is
executed instead, making it a 2-cycle
instruction.
IORLW Inclusive OR literal with W
Syntax: [ label ] IORLW k
Operands: 0 k 255
Operation: (W) .OR. k (W)
Status Affected: Z
Description: The contents of the W register are
OR’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
IORWF Inclusive OR W with f
Syntax: [ label ] IORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .OR. (f) (destination)
Status Affected: Z
Description: Inclusive OR the W register with regis-
ter ‘f’. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
DD
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LSLF Logical Left Shift
Syntax: [ label ] LSLF f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f<7>) C
(f<6:0>) dest<7:1>
0 dest<0>
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the left through the Carry flag.
A ‘0’ is shifted into the LSb. If ‘d’ is ‘0’,
the result is placed in W. If ‘d’ is ‘1’, the
result is stored back in register ‘f’.
LSRF Logical Right Shift
Syntax: [ label ] LSRF f {,d}
Operands: 0 f 127
d [0,1]
Operation: 0 dest<7>
(f<7:1>) dest<6:0>,
(f<0>) C,
Status Affected: C, Z
Description: The contents of register ‘f’ are shifted
one bit to the right through the Carry
flag. A ‘0’ is shifted into the MSb. If ‘d’ is
‘0’, the result is placed in W. If ‘d’ is ‘1’,
the result is stored back in register ‘f’.
register f 0
C
register f C0
MOVF Move f
Syntax: [ label ] MOVF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) (dest)
Status Affected: Z
Description: The contents of register f is moved to
a destination dependent upon the
status of d. If d = 0, destination is W
register. If d = 1, the destination is file
register f itself. d = 1 is useful to test a
file register since status flag Z is
affected.
Words: 1
Cycles: 1
Example: MOVF FSR, 0
After Instruction
W = value in FSR register
Z=
1
Examg‘e. Examg‘e.
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PIC12(L)F1840
MOVIW Move INDFn to W
Syntax: [ label ] MOVIW ++FSRn
[ label ] MOVIW --FSRn
[ label ] MOVIW FSRn++
[ label ] MOVIW FSRn--
[ label ] MOVIW k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: INDFn W
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
• Unchanged
Status Affected: Z
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
MOVLB Move literal to BSR
Syntax: [ label ] MOVLB k
Operands: 0 k 15
Operation: k BSR
Status Affected: None
Description: The 5-bit literal ‘k’ is loaded into the
Bank Select Register (BSR).
MOVLP Move literal to PCLATH
Syntax: [ label ] MOVLP k
Operands: 0 k 127
Operation: k PCLATH
Status Affected: None
Description: The 7-bit literal ‘k’ is loaded into the
PCLATH register.
MOVLW Move literal to W
Syntax: [ label ] MOVLW k
Operands: 0 k 255
Operation: k (W)
Status Affected: None
Description: The 8-bit literal ‘k’ is loaded into W reg-
ister. The “don’t cares” will assemble as
‘0’s.
Words: 1
Cycles: 1
Example: MOVLW 0x5A
After Instruction
W = 0x5A
MOVWF Move W to f
Syntax: [ label ] MOVWF f
Operands: 0 f 127
Operation: (W) (f)
Status Affected: None
Description: Move data from W register to register
‘f’.
Words: 1
Cycles: 1
Example: MOVWF OPTION_REG
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
Examg‘e. Examg‘e.
PIC12(L)F1840
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MOVWI Move W to INDFn
Syntax: [ label ] MOVWI ++FSRn
[ label ] MOVWI --FSRn
[ label ] MOVWI FSRn++
[ label ] MOVWI FSRn--
[ label ] MOVWI k[FSRn]
Operands: n [0,1]
mm [00,01, 10, 11]
-32 k 31
Operation: W INDFn
Effective address is determined by
• FSR + 1 (preincrement)
• FSR - 1 (predecrement)
• FSR + k (relative offset)
After the Move, the FSR value will be
either:
• FSR + 1 (all increments)
• FSR - 1 (all decrements)
Unchanged
Status Affected: None
Mode Syntax mm
Preincrement ++FSRn 00
Predecrement --FSRn 01
Postincrement FSRn++ 10
Postdecrement FSRn-- 11
Description: This instruction is used to move data
between W and one of the indirect
registers (INDFn). Before/after this
move, the pointer (FSRn) is updated by
pre/post incrementing/decrementing it.
Note: The INDFn registers are not
physical registers. Any instruction that
accesses an INDFn register actually
accesses the register at the address
specified by the FSRn.
FSRn is limited to the range 0000h -
FFFFh. Incrementing/decrementing it
beyond these bounds will cause it to
wrap-around.
The increment/decrement operation on
FSRn WILL NOT affect any Status bits.
NOP No Operation
Syntax: [ label ] NOP
Operands: None
Operation: No operation
Status Affected: None
Description: No operation.
Words: 1
Cycles: 1
Example: NOP
OPTION Load OPTION_REG Register
with W
Syntax: [ label ] OPTION
Operands: None
Operation: (W) OPTION_REG
Status Affected: None
Description: Move data from W register to
OPTION_REG register.
Words: 1
Cycles: 1
Example: OPTION
Before Instruction
OPTION_REG = 0xFF
W = 0x4F
After Instruction
OPTION_REG = 0x4F
W = 0x4F
RESET Software Reset
Syntax: [ label ] RESET
Operands: None
Operation: Execute a device Reset. Resets the
RI flag of the PCON register.
Status Affected: None
Description: This instruction provides a way to
execute a hardware Reset by soft-
ware.
Examg‘e. Examg‘e. Examg‘e.
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PIC12(L)F1840
RETFIE Return from Interrupt
Syntax: [ label ] RETFIE
Operands: None
Operation: TOS PC,
1 GIE
Status Affected: None
Description: Return from Interrupt. Stack is POPed
and Top-of-Stack (TOS) is loaded in
the PC. Interrupts are enabled by
setting Global Interrupt Enable bit,
GIE (INTCON<7>). This is a 2-cycle
instruction.
Words: 1
Cycles: 2
Example: RETFIE
After Interrupt
PC = TOS
GIE = 1
RETLW Return with literal in W
Syntax: [ label ] RETLW k
Operands: 0 k 255
Operation: k (W);
TOS PC
Status Affected: None
Description: The W register is loaded with the eight
bit literal ‘k’. The program counter is
loaded from the top of the stack (the
return address). This is a 2-cycle
instruction.
Words: 1
Cycles: 2
Example:
TABLE
CALL TABLE;W contains table
;offset value
• ;W now has table value
•
•
ADDWF PC ;W = offset
RETLW k1 ;Begin table
RETLW k2 ;
•
•
•
RETLW kn ; End of table
Before Instruction
W = 0x07
After Instruction
W = value of k8
RETURN Return from Subroutine
Syntax: [ label ] RETURN
Operands: None
Operation: TOS PC
Status Affected: None
Description: Return from subroutine. The stack is
POPed and the top of the stack (TOS)
is loaded into the program counter.
This is a 2-cycle instruction.
RLF Rotate Left f through Carry
Syntax: [ label ] RLF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the left through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
Words: 1
Cycles: 1
Example: RLF REG1,0
Before Instruction
REG1 = 1110 0110
C=0
After Instruction
REG1 = 1110 0110
W = 1100 1100
C=1
Register fC
SUBWFB ltd) ,(g
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RRF Rotate Right f through Carry
Syntax: [ label ] RRF f,d
Operands: 0 f 127
d [0,1]
Operation: See description below
Status Affected: C
Description: The contents of register ‘f’ are rotated
one bit to the right through the Carry
flag. If ‘d’ is ‘0’, the result is placed in
the W register. If ‘d’ is ‘1’, the result is
placed back in register ‘f’.
SLEEP Enter Sleep mode
Syntax: [ label ]SLEEP
Operands: None
Operation: 00h WDT,
0 WDT prescaler,
1 TO,
0 PD
Status Affected: TO, PD
Description: The power-down Status bit, PD is
cleared. Time-out Status bit, TO is
set. Watchdog Timer and its pres-
caler are cleared.
The processor is put into Sleep mode
with the oscillator stopped.
Register fC
SUBLW Subtract W from literal
Syntax: [ label ]SUBLW k
Operands: 0 k 255
Operation: k - (W) W)
Status Affected: C, DC, Z
Description: The W register is subtracted (2’s com-
plement method) from the 8-bit literal
‘k’. The result is placed in the W regis-
ter.
SUBWF Subtract W from f
Syntax: [ label ] SUBWF f,d
Operands: 0 f 127
d [0,1]
Operation: (f) - (W) destination)
Status Affected: C, DC, Z
Description: Subtract (2’s complement method) W
register from register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’ is
‘1’, the result is stored back in register
‘f.
SUBWFB Subtract W from f with Borrow
Syntax: SUBWFB f {,d}
Operands: 0 f 127
d [0,1]
Operation: (f) – (W) – (B) dest
Status Affected: C, DC, Z
Description: Subtract W and the BORROW flag
(CARRY) from register ‘f’ (2’s comple-
ment method). If ‘d’ is ‘0’, the result is
stored in W. If ‘d’ is ‘1’, the result is
stored back in register ‘f’.
C = 0W k
C = 1W k
DC = 0W<3:0> k<3:0>
DC = 1W<3:0> k<3:0>
C = 0W f
C = 1W f
DC = 0W<3:0> f<3:0>
DC = 1W<3:0> f<3:0>
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SWAPF Swap Nibbles in f
Syntax: [ label ] SWAPF f,d
Operands: 0 f 127
d [0,1]
Operation: (f<3:0>) (destination<7:4>),
(f<7:4>) (destination<3:0>)
Status Affected: None
Description: The upper and lower nibbles of regis-
ter ‘f’ are exchanged. If ‘d’ is ‘0’, the
result is placed in the W register. If ‘d’
is ‘1’, the result is placed in register ‘f’.
TRIS Load TRIS Register with W
Syntax: [ label ] TRIS f
Operands: 5 f 7
Operation: (W) TRIS register ‘f’
Status Affected: None
Description: Move data from W register to TRIS
register.
When ‘f’ = 5, TRISA is loaded.
When ‘f’ = 6, TRISB is loaded.
When ‘f’ = 7, TRISC is loaded.
XORLW Exclusive OR literal with W
Syntax: [ label ]XORLW k
Operands: 0 k 255
Operation: (W) .XOR. k W)
Status Affected: Z
Description: The contents of the W register are
XOR’ed with the 8-bit literal ‘k’. The
result is placed in the W register.
XORWF Exclusive OR W with f
Syntax: [ label ] XORWF f,d
Operands: 0 f 127
d [0,1]
Operation: (W) .XOR. (f) destination)
Status Affected: Z
Description: Exclusive OR the contents of the W
register with register ‘f’. If ‘d’ is ‘0’, the
result is stored in the W register. If ‘d’
is ‘1’, the result is stored back in regis-
ter ‘f’.
MCLR
PIC12(L)F1840
DS40001441F-page 302 2011-2015 Microchip Technology Inc.
30.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias .......................................................................................................-40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on VDD with respect to VSS, PIC12F1840 ............................................................................. -0.3V to +6.5V
Voltage on VDD with respect to VSS, PIC12LF1840 ........................................................................... -0.3V to +4.0V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to VSS ............................................................................ -0.3V to (VDD + 0.3V)
Total power dissipation(1) ...............................................................................................................................800 mW
Maximum current out of VSS pin, -40°C TA +85°C for industrial............................................................... 170 mA
Maximum current out of VSS pin, -40°C TA +125°C for extended .............................................................. 70 mA
Maximum current into VDD pin, -40°C TA +85°C for industrial.................................................................. 170 mA
Maximum current into VDD pin, -40°C TA +125°C for extended ................................................................. 70 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA
Maximum output current sunk by any I/O pin....................................................................................................25 mA
Maximum output current sourced by any I/O pin...............................................................................................25 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
2011-2015 Microchip Technology Inc. DS40001441F-page 303
PIC12(L)F1840
FIGURE 30-1: PIC12F1840 VOLTAGE FREQUENCY GRAPH, -40°C
TA

+125°C
FIGURE 30-2: PIC12LF1840 VOLTAGE FREQUENCY GRAPH, -40°C
TA

+125°C
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies.
2.3
0
2.5
Frequency (MHz)
VDD (V)
43210 16
5.5
1.8
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies.
1.8
0
2.5
Frequency (MHz)
VDD (V)
432
10 16
3.6
PIC12(L)F1840
DS40001441F-page 304 2011-2015 Microchip Technology Inc.
FIGURE 30-3: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
125
25
2.0
0
60
85
VDD (V)
4.0 5.04.5
Temperature (°C)
2.5 3.0 3.5 5.51.8
-40
± 5%
± 2%
± 5%
± 3%
2011-2015 Microchip Technology Inc. DS40001441F-page 305
PIC12(L)F1840
30.1 DC Characteristics: Supply Voltage
PIC12LF1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC12F1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param.
No.
Sym. Characteristic Min. Typ† Max. Units Conditions
D001 VDD Supply Voltage (VDDMIN, VDDMAX)
1.8
2.5
—
—
3.6
3.6
V
V
FOSC 16 MHz:
FOSC 32 MHz
D001 2.3
2.5
—
—
5.5
5.5
V
V
FOSC 16 MHz:
FOSC 32 MHz
D002* VDR RAM Data Retention Voltage(1)
1.5 — — V Device in Sleep mode
D002* 1.7 — — V Device in Sleep mode
D002A* VPOR Power-on Reset Release Voltage —1.6— V
D002B* VPORR*Power-on Reset Rearm Voltage
—0.8— V
D002B* —1.5 — V
D003 VADFVR Fixed Voltage Reference Voltage for
ADC -8 — 6 %
1.024V, VDD 2.5V
2.048V, VDD 2.5V
4.096V, VDD 4.75V
D003A VCDAFVR Fixed Voltage Reference Voltage for
Comparator and DAC -11 — 7 %
1.024V, VDD 2.5V
2.048V, VDD 2.5V
4.096V, VDD 4.75V
D004* SVDD VDD Rise Rate to ensure internal
Power-on Reset signal
0.05 — — V/ms See Section 7.1 “Power-On Reset
(POR)” for details.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
PIC12(L)F1840
DS40001441F-page 306 2011-2015 Microchip Technology Inc.
FIGURE 30-4: POR AND POR REARM WITH SLOW RISING VDD
VDD
VPOR
VPORR
VSS
VSS
NPOR(1)
TPOR(3)
POR REARM
Note 1: When NPOR is low, the device is held in Reset.
2: TPOR 1 s typical.
3: TVLOW 2.7 s typical.
TVLOW(2)
MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 307
PIC12(L)F1840
30.2 DC Characteristics: Supply Current (IDD)
PIC12LF1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC12F1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No.
Device
Characteristics Min. Typ† Max. Units
Conditions
VDD Note
Supply Current (IDD)(1, 2)
D010 — 5.0 12 A1.8
FOSC = 32 kHz
LP Oscillator
-40°C TA +85°C
—7.4 25 A3.0
D010 —17 28 A2.3 FOSC = 32 kHz
LP Oscillator
-40°C TA +85°C
—19 38 A3.0
—22 45 A5.0
D010A — 5.0 21 A1.8FOSC = 32 kHz
LP Oscillator
-40°C TA +125°C
—7.4 25 A3.0
D010A —17 60 A2.3 FOSC = 32 kHz
LP Oscillator
-40°C TA +125°C
—19 70 A3.0
—22 80 A5.0
D011 — 60 95 A1.8FOSC = 1 MHz
XT Oscillator
—119
180 A3.0
D011 —110 200 A2.3 FOSC = 1 MHz
XT Oscillator
—150 300 A3.0
—183 360 A5.0
D012 — 165 240 A1.8FOSC = 4 MHz
XT Oscillator
— 309 430 A3.0
D012 —240 400 A2.3 FOSC = 4 MHz
XT Oscillator
—332 500 A3.0
—392 600 A5.0
D013 — 34 120 A1.8FOSC = 1 MHz
External Clock (ECM),
Medium-Power mode
—69
200 A3.0
D013 —70 150 A2.3 FOSC = 1 MHz
External Clock (ECM),
Medium-Power mode
—105 210 A3.0
—136 250 A5.0
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: 8 MHz internal oscillator with 4x PLL enabled.
4: 8 MHz crystal oscillator with 4x PLL enabled.
5: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
MCLR
PIC12(L)F1840
DS40001441F-page 308 2011-2015 Microchip Technology Inc.
Supply Current (IDD)(1, 2)
D014 — 118 210 A1.8FOSC = 4 MHz
External Clock (ECM),
Medium-Power mode
— 222 380 A3.0
D014 —172 250 A2.3 FOSC = 4 MHz
External Clock (ECM),
Medium-Power mode
—290 380 A3.0
—350 480 A5.0
D015 — 6.5 20 A1.8FOSC = 31 kHz
LFINTOSC
-40°C TA +85°C
—9.0 31 A3.0
D015 —18 45 A2.3 FOSC = 31 kHz
LFINTOSC
-40°C TA +85°C
—24 50 A3.0
—25 60 A5.0
D016 — 103 190 A1.8FOSC = 500 kHz
MFINTOSC
— 124 220 A3.0
D016 —132 200 A2.3 FOSC = 500 kHz
MFINTOSC
—165 250 A3.0
—210 300 A5.0
D017 — 0.5 0.9 mA 1.8 FOSC = 8 MHz
HFINTOSC
—0.81.3 mA 3.0
D017 —0.7 0.9 mA 2.3 FOSC = 8 MHz
HFINTOSC
—0.9 1.3 mA 3.0
—1.0 1.5 mA 5.0
D018 — 0.7 1.2 mA 1.8 FOSC = 16 MHz
HFINTOSC
—1.21.8 mA 3.0
D018 —0.9 1.5 mA 2.3 FOSC = 16 MHz
HFINTOSC
—1.2 2.0 mA 3.0
—1.3 2.1 mA 5.0
30.2 DC Characteristics: Supply Current (IDD) (Continued)
PIC12LF1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC12F1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No.
Device
Characteristics Min. Typ† Max. Units
Conditions
VDD Note
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: 8 MHz internal oscillator with 4x PLL enabled.
4: 8 MHz crystal oscillator with 4x PLL enabled.
5: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 309
PIC12(L)F1840
Supply Current (IDD)(1, 2)
D019 — 1.3 3.0 mA 3.0 FOSC = 32 MHz
HFINTOSC (Note 3)
—2.34.0 mA 3.6
D019 —2.2 3.8 mA 3.0 FOSC = 32 MHz
HFINTOSC (Note 3)
—2.4 4.1 mA 5.0
D020 — 1.3 2.5 mA 3.0 FOSC = 32 MHz
HS Oscillator (Note 4)
—1.73.0 mA 3.6
D020 —1.4 2.5 mA 3.0 FOSC = 32 MHz
HS Oscillator (Note 4)
—1.8 3.0 mA 5.0
D021 — 185 300 A1.8FOSC = 4 MHz
EXTRC (Note 5)
— 390 480 A3.0
D021 —290 400 A2.3 FOSC = 4 MHz
EXTRC (Note 5)
—415 550 A3.0
—495 600 A5.0
30.2 DC Characteristics: Supply Current (IDD) (Continued)
PIC12LF1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC12F1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No.
Device
Characteristics Min. Typ† Max. Units
Conditions
VDD Note
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The test conditions for all IDD measurements in active operation mode are: OSC1 = external square wave, from
rail-to-rail; all I/O pins tri-stated, pulled to VDD; MCLR = VDD; WDT disabled.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors, such as I/O pin loading
and switching rate, oscillator type, internal code execution pattern and temperature, also have an impact on the current
consumption.
3: 8 MHz internal oscillator with 4x PLL enabled.
4: 8 MHz crystal oscillator with 4x PLL enabled.
5: For RC oscillator configurations, current through REXT is not included. The current through the resistor can be extended
by the formula IR = VDD/2REXT (mA) with REXT in k
PIC12(L)F1840
DS40001441F-page 310 2011-2015 Microchip Technology Inc.
30.3 DC Characteristics: Power-Down Base Current (IPD)
PIC12LF1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC12F1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min. Typ† Max.
+85°C
Max.
+125°C Units
Conditions
VDD Note
Power-down Base Current (IPD)(2)
D022 — 0.02 1.0 8.0 A 1.8 WDT, BOR, FVR and T1OSC
disabled, all peripherals inactive
— 0.03 2.0 9.0 A3.0
D022 —0.2 1.3 10 A2.3 WDT, BOR, FVR and T1OSC
disabled, all peripherals inactive,
Low-power regulator active
VREGPM = 1
—0.3 2.0 12 A3.0
—0.5 6.0 15 A5.0
D023 — 0.5 6.0 14 A 1.8 WDT Current (Note 1)
—0.87.0 17 A3.0
D023 —0.5 615 A2.3 WDT Current
VREGPM = 1 (Note 1)
—0.8 720 A3.0
—0.9 822 A5.0
D023A — 8.5 23 25 A 1.8 FVR Current (Note 1)
— 8.5 24 27 A3.0
D023A —18 26 30 A2.3 FVR Current
VREGPM = 0 (Note 1)
—19 27 37 A3.0
—20 29 45 A5.0
D024 — 8.0 17 20 A 3.0 BOR Current (Note 1)
D024 —8.0 17 30 A3.0 BOR Current
VREGPM = 1 (Note 1)
—9.0 20 40 A5.0
D025 — 0.3 5 9 A 1.8 T1OSC Current (Note 1)
—0.5 9 12 A3.0
D025 —1.1 610 A2.3 T1OSC Current
VREGPM = 1 (Note 1)
—1.3 920 A3.0
—1.4 10 25 A5.0
D026 — 0.1 1.0 9 A 1.8 ADC Current (Note 1, 3)
No conversion in progress
—0.12.0 10 A3.0
D026 —0.2 3.0 10 A2.3 ADC Current
No conversion in progress
VREGPM = 1 (Note 1, 3)
—0.4 4.0 11 A3.0
—0.5 6.0 16 A5.0
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is
enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max.
values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
3: ADC clock source is FRC.
2011-2015 Microchip Technology Inc. DS40001441F-page 311
PIC12(L)F1840
Power-down Base Current (IPD)(2)
D026A* — 250 — — A 1.8 ADC Current (Note 1, 3)
Conversion in progress
—250 — — A3.0
D026A* —280 — — A2.3 ADC Current
Conversion in progress
VREGPM = 1 (Note 1, 3)
—280 — — A3.0
—280 — — A5.0
D027 — 3 12 15 A 1.8 Cap Sense, Low Power
CPSRM = 0, CPSRNG = 01
(Note 1)
— 4 15 18 A3.0
D027 —6.3 13 16 A2.3 Cap Sense, Low Power
CPSRM = 0, CPSRNG = 01
VREGPM = 1 (Note 1)
—8.5 18 20 A3.0
—12.8 23 25 A5.0
D027A — 6.0 15 20 A 1.8 Cap Sense, Medium Power
CPSRM = 0, CPSRNG = 10
(Note 1)
— 8.0 18 25 A3.0
D027A —9.5 20 25 A2.3 Cap Sense, Medium Power
CPSRM = 0, CPSRNG = 10
VREGPM = 1 (Note 1)
—13 28 30 A3.0
—17 32 35 A5.0
D027B — 15 35 40 A 1.8 Cap Sense, High Power
CPSRM = 0, CPSRNG = 11
(Note 1)
—39 60 75 A3.0
D027B —20 40 45 A2.3 Cap Sense, High Power
CPSRM = 0, CPSRNG = 11
VREGPM = 1 (Note 1)
—42 68 80 A3.0
—49 72 86 A5.0
D028 — 4.8 15 20 A 1.8 Comparator,
Low Power, CxSP = 0 (Note 1)
— 4.9 17 23 A3.0
D028 —4.9 16 21 A2.3 Comparator,
Low Power, CxSP = 0
VREGPM = 1 (Note 1)
—5.0 17 23 A3.0
—5.2 18 24 A5.0
D028A — 27 50 60 A 1.8 Comparator,
Normal Power, CxSP = 1
(Note 1)
—28 55 70 A3.0
D028A —27 52 62 A2.3 Comparator,
Normal Power, CxSP = 1
VREGPM = 1 (Note 1)
—28 55 65 A3.0
—29 57 75 A5.0
30.3 DC Characteristics: Power-Down Base Current (IPD) (Continued)
PIC12LF1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
PIC12F1840
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Device Characteristics Min. Typ† Max.
+85°C
Max.
+125°C Units
Conditions
VDD Note
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The peripheral current is the sum of the base IDD or IPD and the additional current consumed when this peripheral is
enabled. The peripheral current can be determined by subtracting the base IDD or IPD current from this limit. Max.
values should be used when calculating total current consumption.
2: The power-down current in Sleep mode does not depend on the oscillator type. Power-down current is measured with
the part in Sleep mode, with all I/O pins in high-impedance state and tied to VSS.
3: ADC clock source is FRC.
Inpuc Low Voltage MCLR
PIC12(L)F1840
DS40001441F-page 312 2011-2015 Microchip Technology Inc.
30.4 DC Characteristics: I/O Ports
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
VIL Input Low Voltage
I/O PORT:
D030 with TTL buffer — — 0.8 V 4.5V VDD 5.5V
D030A — — 0.15 VDD V1.8V VDD 4.5V
D031 with Schmitt Trigger buffer — — 0.2 VDD V2.0V VDD 5.5V
with I2C™ levels — — 0.3 VDD V
with SMBus levels — — 0.8 V 2.7V VDD 5.5V
D032 MCLR, OSC1 (RC mode) — — 0.2 VDD V(Note 1)
D033 OSC1 (HS mode) — — 0.3 VDD V
VIH Input High Voltage
I/O PORT:
D040 with TTL buffer 2.0 — — V 4.5V VDD 5.5V
D040A 0.25 VDD +
0.8
——V1.8V VDD 4.5V
D041 with Schmitt Trigger buffer 0.8 VDD ——V2.0V VDD 5.5V
with I2C™ levels 0.7 VDD ——V
with SMBus levels 2.1 — — V 2.7V VDD 5.5V
D042 MCLR 0.8 VDD ——V
D043A OSC1 (HS mode) 0.7 VDD ——V
D043B OSC1 (RC mode) 0.9 VDD ——VVDD > 2.0V (Note 1)
IIL Input Leakage Current(2)
D060 I/O Ports — ± 5 ± 125 nA VSS VPIN VDD,
Pin at high impedance, 85°C
—± 5 ± 1000 nA VSS VPIN VDD,
Pin at high impedance, 125°C
D061 MCLR(3) —± 50± 200nAVSS VPIN VDD,
Pin at high impedance, 85°C
IPUR Weak Pull-up Current
D070* 25
25
100
140
200
300
A
A
VDD = 3.3V, VPIN = VSS
VDD = 5.0V, VPIN = VSS
VOL Output Low Voltage(4)
D080 I/O Ports
——0.6V
IOL = 8 mA, VDD = 5V
IOL = 6 mA, VDD = 3.3V
IOL = 1.8 mA, VDD = 1.8V
VOH Output High Voltage(4)
D090 I/O Ports
VDD - 0.7 — — V
IOH = 3.5 mA, VDD = 5V
IOH = 3 mA, VDD = 3.3V
IOH = 1 mA, VDD = 1.8V
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: Including OSC2 in CLKOUT mode.
apaciuvs Loading scs on ucpuwins MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 313
PIC12(L)F1840
Capacitive Loading Specs on Output Pins
D101* COSC2 OSC2 pin — — 15 pF In XT, HS and LP modes when
external clock is used to drive
OSC1
D101A* CIO All I/O pins — — 50 pF
30.4 DC Characteristics: I/O Ports (Continued)
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: In RC oscillator configuration, the OSC1/CLKIN pin is a Schmitt Trigger input. It is not recommended to use an external
clock in RC mode.
2: Negative current is defined as current sourced by the pin.
3: The leakage current on the MCLR pin is strongly dependent on the applied voltage level. The specified levels represent
normal operating conditions. Higher leakage current may be measured at different input voltages.
4: Including OSC2 in CLKOUT mode.
nMCLR
PIC12(L)F1840
DS40001441F-page 314 2011-2015 Microchip Technology Inc.
30.5 Memory Programming Requirements
DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +85°C for industrial
-40°C TA +125°C for extended
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
Program Memory High-Voltage
Programming Specifications
D110 VIHH Voltage on MCLR/VPP pin 8.0 — 9.0 V (Note 2)
D111 IDDVPP Programming/Erase Current on VPP,
High Voltage Programming
——10mA
D112 VBE VDD for Bulk Erase 2.7 — VDDMAX V
D113 VPEW VDD for Write or Row Erase VDDMIN —VDDMAX V
D114 IPPPGM Programming/Erase Current on VPP,
Low Voltage Programming
—1.0—mA
D115 IDDPGM Programming/Erase Current on VDD,
High or Low Voltage
Programming
—5.0
—mA
Data EEPROM Memory
D116 EDByte Endurance 100K — — E/W -40C to +85C
D117 VDRW VDD for Read/Write VDDMIN —VDDMAX V
D118 TDEW Erase/Write Cycle Time — 4.0 5.0 ms
D119 TRETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
D120 TREF Number of Total Erase/Write Cycles
before Refresh
1M 10M — E/W -40°C to +85°C
Program Flash Memory
D121 EPCell Endurance 10K — — E/W -40C to +85C (Note 1)
D122 VPRW VDD for Read/Write VDDMIN —VDDMAX V
D123 TIW Self-timed Write Cycle Time — 2 2.5 ms
D124 TRETD Characteristic Retention — 40 — Year Provided no other
specifications are violated
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: Self-write and Block Erase.
2: Required only if single-supply programming is disabled.
8-pm PDIP package
2011-2015 Microchip Technology Inc. DS40001441F-page 315
PIC12(L)F1840
30.6 Thermal Considerations
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Typ. Units Conditions
TH01 JA Thermal Resistance Junction to Ambient 89.3 C/W 8-pin PDIP package
149.5 C/W 8-pin SOIC package
56.7 C/W 8-pin DFN package
39.4 C/W 8-pin UDFN 3X3mm package
TH02 JC Thermal Resistance Junction to Case 43.1 C/W 8-pin PDIP package
39.9 C/W 8-pin SOIC package
9.0 C/W 8-pin DFN package
40.3 C/W 8-pin UDFN 3X3mm package
TH03 TJMAX Maximum Junction Temperature 150 C
TH04 PD Power Dissipation — W PD = PINTERNAL + PI/O
TH05 PINTERNAL Internal Power Dissipation — W PINTERNAL = IDD x VDD(1)
TH06 PI/OI/O Power Dissipation — W PI/O = (IOL * VOL) + (IOH * (VDD - VOH))
TH07 PDER Derated Power — W PDER = PDMAX (TJ - TA)/JA(2)
Note 1: IDD is current to run the chip alone without driving any load on the output pins.
2: TA = Ambient Temperature, TJ = Junction Temperature.
MCLR Load Condifion
PIC12(L)F1840
DS40001441F-page 316 2011-2015 Microchip Technology Inc.
30.7 Timing Parameter Symbology
The timing parameter symbols have been created with
one of the following formats:
FIGURE 30-5: LOAD CONDITIONS
1. TppS2ppS
2. TppS
T
F Frequency T Time
Lowercase letters (pp) and their meanings:
pp
cc CCP1 osc OSC1
ck CLKOUT rd RD
cs CS rw RD or WR
di SDIx sc SCKx
do SDO ss SS
dt Data in t0 T0CKI
io I/O PORT t1 T1CKI
mc MCLR wr WR
Uppercase letters and their meanings:
S
FFall PPeriod
HHigh RRise
I Invalid (High-impedance) V Valid
L Low Z High-impedance
V
SS
C
L
Legend: CL = 50 pF for all pins, 15 pF for
OSC2 output
Load Condition
Pin
ym equencym enodm um mew
2011-2015 Microchip Technology Inc. DS40001441F-page 317
PIC12(L)F1840
30.8 AC Characteristics: PIC12(L)F1840-I/E
FIGURE 30-6: CLOCK TIMING
TABLE 30-1: CLOCK OSCILLATOR TIMING REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS01 FOSC External CLKIN Frequency(1) DC — 0.5 MHz External Clock (ECL)
DC — 4 MHz External Clock (ECM)
DC — 32 MHz External Clock (ECH)
Oscillator Frequency(1) — 32.768 — kHz LP Oscillator
0.1 — 4 MHz XT Oscillator
1 — 4 MHz HS Oscillator
1 — 20 MHz HS Oscillator, VDD > 2.7V
DC — 4 MHz RC Oscillator, VDD > 2.0V
OS02 TOSC External CLKIN Period(1) 27 — s LP Oscillator
250 — ns XT Oscillator
50 — ns HS Oscillator
50 — ns External Clock (EC)
Oscillator Period(1) — 30.5 — s LP Oscillator
250 — 10,000 ns XT Oscillator
50 — 1,000 ns HS Oscillator
250 — — ns RC Oscillator
OS03 TCY Instruction Cycle Time(1) 200 TCY DC ns TCY = 4/FOSC
OS04* TosH,
TosL
External CLKIN High,
External CLKIN Low
2——s LP oscillator
100 — — ns XT oscillator
20 — — ns HS oscillator
OS05* TosR,
TosF
External CLKIN Rise,
External CLKIN Fall
0 — — ns LP oscillator
0 — — ns XT oscillator
0 — — ns HS oscillator
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Instruction cycle period (TCY) equals four times the input oscillator time base period. All specified values are based on
characterization data for that particular oscillator type under standard operating conditions with the device executing code.
Exceeding these specified limits may result in an unstable oscillator operation and/or higher than expected current con-
sumption. All devices are tested to operate at “min” values with an external clock applied to OSC1 pin. When an external
clock input is used, the “max” cycle time limit is “DC” (no clock) for all devices.
OSC1/CLKIN
OSC2/CLKOUT
Q4 Q1 Q2 Q3 Q4 Q1
OS02
OS03
OS04 OS04
OSC2/CLKOUT
(LP,XT,HS Modes)
(CLKOUT Mode)
we 5 TAS +60°C‘ VDD ,-
PIC12(L)F1840
DS40001441F-page 318 2011-2015 Microchip Technology Inc.
TABLE 30-2: OSCILLATOR PARAMETERS
TABLE 30-3: PLL CLOCK TIMING SPECIFICATIONS (VDD = 2.7V TO 5.5V)
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Freq.
Tolerance Min. Typ† Max. Units Conditions
OS08 HFOSC Internal Calibrated HFINTOSC
Frequency (Note 1)
2% — 16.0 — MHz 0°C TA +60°C, VDD 2.5V
3% — 16.0 — MHz 60°C TA +85°C, VDD 2.5V
5% — 16.0 — MHz -40°C TA +125°C
OS08A MFOSC Internal Calibrated MFINTOSC
Frequency (Note 1)
2% — 500 — MHz 0°C TA +60°C, VDD 2.5V
3% — 500 — kHz 60°C TA +85°C, VDD 2.5V
5% — 500 — kHz -40°C TA +125°C
OS09 LFOSC Internal LFINTOSC Frequency — — 31 — kHz (Note 2)
OS10* TIOSC ST HFINTOSC
Wake-up from Sleep Start-up Time
MFINTOSC
Wake-up from Sleep Start-up Time
—
—
—
—
—
—
5
—
20
8
—
30
s
s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 F and 0.01 F values in parallel are recommended.
2: See Figure 31-64 and Figure 31-65, LFINTOSC Frequency Characteristics over VDD and Temperature.
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
F10 FOSC Oscillator Frequency Range 4 — 8 MHz
F11 FSYS On-Chip VCO System Frequency 16 — 32 MHz
F12 TRC PLL Start-up Time (Lock Time) — — 2 ms
F13* CLK CLKOUT Stability (Jitter) -0.25% — +0.25% %
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3V, 25C unless otherwise stated. These parameters are for design guidance
only and are not tested.
2011-2015 Microchip Technology Inc. DS40001441F-page 319
PIC12(L)F1840
FIGURE 30-7: CLKOUT AND I/O TIMING
TABLE 30-4: CLKOUT AND I/O TIMING PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
OS11 TosH2ckL FOSC to CLKOUT (Note 1) ——70nsVDD = 3.3-5.0V
OS12 TosH2ckH FOSC to CLKOUT (Note 1) ——72nsVDD = 3.3-5.0V
OS13 TckL2ioV CLKOUT to Port out valid (Note 1) ——20ns
OS14 TioV2ckH Port input valid before CLKOUT
(Note 1)
TOSC + 200 ns — — ns
OS15 TosH2ioV Fosc (Q1 cycle) to Port out valid — 50 70* ns VDD = 3.3-5.0V
OS16 TosH2ioI Fosc (Q2 cycle) to Port input invalid
(I/O in setup time)
50 — — ns VDD = 3.3-5.0V
OS17 TioV2osH Port input valid to Fosc(Q2 cycle)
(I/O in setup time)
20 — — ns
OS18* TioR Port output rise time —
—
40
15
72
32
ns VDD = 1.8V
VDD = 3.3-5.0V
OS19* TioF Port output fall time —
—
28
15
55
30
ns VDD = 1.8V
VDD = 3.3-5.0V
OS20* Tinp INT pin input high or low time 25 — — ns
OS21* Tioc Interrupt-on-change new input level
time
25 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25C unless otherwise stated.
Note 1: Measurements are taken in RC mode where CLKOUT output is 4 x TOSC.
FOSC
CLKOUT
I/O pin
(Input)
I/O pin
(Output)
Q4 Q1 Q2 Q3
OS11
OS19
OS13
OS15
OS18, OS19
OS20
OS21
OS17
OS16
OS14
OS12
OS18
Old Value New Value
Write Fetch Read ExecuteCycle
J) J) J J) J) J) Rese‘ Rese‘ FWRTE PWRTE
PIC12(L)F1840
DS40001441F-page 320 2011-2015 Microchip Technology Inc.
FIGURE 30-8: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER AND POWER-UP
TIMER TIMING
FIGURE 30-9: BROWN-OUT RESET TIMING AND CHARACTERISTICS
VDD
MCLR
Internal
POR
PWRT
Time-out
OSC
Start-Up Time
Internal Reset(1)
Watchdog Timer
33
32
30
31
34
I/O pins
34
Note 1: Asserted low.
Reset(1)
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33(1)
Note 1: 64 ms delay only if PWRTE bit in the Configuration Words is programmed to ‘0’.
2 ms delay if PWRTE = 0.
Reset
(due to BOR)
VBOR and VHYST
37
MCLR PWRTE MCLR
2011-2015 Microchip Technology Inc. DS40001441F-page 321
PIC12(L)F1840
TABLE 30-5: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
30 TMCLMCLR Pulse Width (low) 2 — — s
31 TWDTLP Low-Power Watchdog Timer
Time-out Period
10 16 27 ms VDD = 3.3V-5V,
1:16 Prescaler used
32 TOST Oscillator Start-up Timer Period
(Note 1)
— 1024 — Tosc
33* TPWRT Power-up Timer Period, PWRTE =040 65 140 ms
34* TIOZ I/O high-impedance from MCLR Low
or Watchdog Timer Reset
——2.0s
35 VBOR Brown-out Reset Voltage (Note 2) 2.55
2.35
1.80
2.70
2.45
1.90
2.85
2.58
2.00
V
V
V
BORV = 0, PIC12(L)F1840
BORV = 1, PIC12F1840
PIC12LF1840
37* VHYST Brown-out Reset Hysteresis 0 25 75 mV -40°C to +85°C
38* TBORDC Brown-out Reset DC Response
Time
1335sVDD VBOR
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: By design, the Oscillator Start-up Timer (OST) counts the first 1024 cycles, independent of frequency.
2: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device
as possible. 0.1 F and 0.01 F values in parallel are recommended.
‘ ‘ h w ‘ \ \ ‘ H H ‘ R a“? a“ 1 \ \ 40' T Kl High Pu‘se Wudm No Presca‘er or ch + 40 or ch + 40
PIC12(L)F1840
DS40001441F-page 322 2011-2015 Microchip Technology Inc.
FIGURE 30-10: TIMER0 AND TIMER1 EXTERNAL CLOCK TIMINGS
TABLE 30-6: TIMER0 AND TIMER1 EXTERNAL CLOCK REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
40* TT0H T0CKI High Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
41* TT0L T0CKI Low Pulse Width No Prescaler 0.5 TCY + 20 — — ns
With Prescaler 10 — — ns
42* TT0P T0CKI Period Greater of:
20 or TCY + 40
N
— — ns N = prescale value
45* TT1H T1CKI High
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
46* TT1L T1CKI Low
Time
Synchronous, No Prescaler 0.5 TCY + 20 — — ns
Synchronous, with Prescaler 15 — — ns
Asynchronous 30 — — ns
47* TT1P T1CKI Input
Period
Synchronous Greater of:
30 or TCY + 40
N
— — ns N = prescale value
Asynchronous 60 — — ns
48 FT1 Timer1 Oscillator Input Frequency Range
(oscillator enabled by setting bit T1OSCEN)
32.4 32.768 33.1 kHz
49* TCKEZTMR1 Delay from External Clock Edge to Timer
Increment
2 TOSC —7 TOSC — Timers in Sync
mode
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
T0CKI
T1CKI
40 41
42
45 46
47 49
TMR0 or
TMR1
3ch + 40
2011-2015 Microchip Technology Inc. DS40001441F-page 323
PIC12(L)F1840
FIGURE 30-11: CAPTURE/COMPARE/PWM TIMINGS (CCP)
TABLE 30-7: CAPTURE/COMPARE/PWM REQUIREMENTS (CCP)
TABLE 30-8: ANALOG-TO-DIGITAL CONVERTER (ADC) CHARACTERISTICS(1,2,3)
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
CC01* TccL CCP Input Low Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC02* TccH CCP Input High Time No Prescaler 0.5TCY + 20 — — ns
With Prescaler 20 — — ns
CC03* TccP CCP Input Period 3TCY + 40
N
— — ns N = prescale value
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA 25°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD01 NRResolution — — 10 bit
AD02 EIL Integral Error — ±1 ±1.7 LSb VREF = 3.0V
AD03 EDL Differential Error — ±1 ±1 LSb No missing codes
VREF = 3.0V
AD04 EOFF Offset Error — ±1 ±2.5 LSb VREF = 3.0V
AD05 EGN Gain Error — ±1 ±2.0 LSb VREF = 3.0V
AD06 VREF Reference Voltage (Note 4)1.8—VDD VVREF = (VREF+ minus VREF-)
AD07 VAIN Full-Scale Range VSS —VREF V
AD08 ZAIN Recommended Impedance of
Analog Voltage Source
—— 10kCan go higher if external 0.01 F capacitor is
present on input pin.
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The ADC conversion result never decreases with an increase in the input voltage and has no missing codes.
3: ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input.
4: ADC Reference Voltage (Ref+) is the selected reference input, VREF+ pin, VDD pin or the FVR Buffer1. When the FVR is
selected as the reference input, the FVR Buffer1 output selection must be 2.048V or 4.096V (ADFVR<1:0> = 1x).
Note: Refer to Figure 30-5 for load conditions.
(Capture mode)
CC01 CC02
CC03
CCP
DONE a , «WHuumn (1 » WE
PIC12(L)F1840
DS40001441F-page 324 2011-2015 Microchip Technology Inc.
TABLE 30-9: ADC CONVERSION REQUIREMENTS
FIGURE 30-12: ADC CONVERSION TIMING (NORMAL MODE)
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA 25°C
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
AD130* TAD ADC Clock Period 1.0 — 9.0 sFOSC-based
ADC Internal RC Oscillator
Period
1.0 2.0 6.0 s ADCS<2:0> = x11 (ADC FRC mode)
AD131 TCNV Conversion Time (not including
Acquisition Time) (Note 1)
—11—TAD Set GO/DONE bit to conversion
complete
AD132* TACQ Acquisition Time — 5.0 — s
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are not
tested.
Note 1: The ADRES register may be read on the following TCY cycle.
AD131
AD130
BSF ADCON0, GO
Q4
ADC CLK
ADC Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
765 3210
Note 1: If the ADC clock source is selected as RC, a time of TCY is added before the ADC clock starts. This allows the
SLEEP instruction to be executed.
1 TCY
4
AD134 (TOSC/2(1))
1 TCY
AD132
a Q? )J H )1 phng Sm
2011-2015 Microchip Technology Inc. DS40001441F-page 325
PIC12(L)F1840
FIGURE 30-13: ADC CONVERSION TIMING (SLEEP MODE)
AD132
AD131
AD130
BSF ADCON0, GO
Q4
ADC CLK
ADC Data
ADRES
ADIF
GO
Sample
OLD_DATA
Sampling Stopped
DONE
NEW_DATA
7 5 3210
Note 1: If the ADC clock source is selected as RC, a time of TCY is added before the ADC clock starts. This allows the
SLEEP instruction to be executed.
AD134
4
6
1 TCY
(TOSC/2 + TCY(1))
1 TCY
PIC12(L)F1840
DS40001441F-page 326 2011-2015 Microchip Technology Inc.
TABLE 30-10: COMPARATOR SPECIFICATIONS
TABLE 30-11: DIGITAL-TO-ANALOG CONVERTER (DAC) SPECIFICATIONS
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA 25°C
Param
No. Sym. Characteristics Min. Typ. Max. Units Comments
CM01 VIOFF Input Offset Voltage — ±7.5 ±60 mV CxSP = 1
VICM = VDD/2
CM02 VICM Input Common Mode Voltage 0 — VDD V
CM03 CMRR Common Mode Rejection Ratio — 50 — dB
CM04A
TRESP(1)
Response Time Rising Edge — 400 800 ns CxSP = 1
CM04B Response Time Falling Edge — 200 400 ns CxSP = 1
CM04C Response Time Rising Edge — 1200 — ns CxSP = 0
CM04D Response Time Falling Edge — 550 — ns CxSP = 0
CM05 TMC2OV Comparator Mode Change to
Output Valid*
——10s
CM06 CHYSTER Comparator Hysteresis — 45 — mV CxHYS = 1, CxSP = 1
(Note 2)
* These parameters are characterized but not tested.
Note 1: Response time measured with one comparator input at VDD/2, while the other input transitions from VSS to
VDD.
2: Comparator Hysteresis is available when the CxHYS bit of the CMxCON0 register is enabled.
Operating Conditions (unless otherwise stated)
VDD = 3.0V, TA 25°C
Param
No. Sym. Characteristics Min. Typ. Max. Units Comments
DAC01 CLSB Step Size — VDD/32 — V
DAC02 CACC Absolute Accuracy — — 1/2 LSb VDD = 3.0V, TA = +25°C
DAC03 CRUnit Resistor Value (R) — 5K —
DAC04* CST Settling Time (Note 1) ——10s
* Parameter(s) characterized but not tested.
Note 1: Settling time measured while DACR<4:0> transitions from ‘0000’ to ‘1111’.
2011-2015 Microchip Technology Inc. DS40001441F-page 327
PIC12(L)F1840
FIGURE 30-14: USART SYNCHRONOUS TRANSMISSION (MASTER/SLAVE) TIMING
TABLE 30-12: USART SYNCHRONOUS TRANSMISSION REQUIREMENTS
FIGURE 30-15: USART SYNCHRONOUS RECEIVE (MASTER/SLAVE) TIMING
TABLE 30-13: USART SYNCHRONOUS RECEIVE REQUIREMENTS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
US120 TCKH2DTV SYNC XMIT (Master and Slave)
Clock high to data-out valid
3.0-5.5V — 80 ns
1.8-5.5V — 100 ns
US121 TCKRF Clock out rise time and fall time
(Master mode)
3.0-5.5V — 45 ns
1.8-5.5V — 50 ns
US122 TDTRF Data-out rise time and fall time 3.0-5.5V — 45 ns
1.8-5.5V — 50 ns
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Symbol Characteristic Min. Max. Units Conditions
US125 TDTV2CKL SYNC RCV (Master and Slave)
Data-hold before CK (DT hold time) 10 — ns
US126 T
CKL2DTL Data-hold after CK (DT hold time) 15 — ns
Note: Refer to Figure 30-5 for load conditions.
US121 US121
US120 US122
CK
DT
Note: Refer to Figure 30-5 for load conditions.
US125
US126
CK
DT
PIC12(L)F1840
DS40001441F-page 328 2011-2015 Microchip Technology Inc.
FIGURE 30-16: SPI MASTER MODE TIMING (CKE = 0, SMP = 0)
FIGURE 30-17: SPI MASTER MODE TIMING (CKE = 1, SMP = 1)
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP70
SP71 SP72
SP73
SP74
SP75, SP76
SP78
SP79
SP80
SP79
SP78
MSb LSb
bit 6 - - - - - -1
MSb In LSb In
bit 6 - - - -1
Note: Refer to Figure 30-5 for load conditions.
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP81
SP71 SP72
SP74
SP75, SP76
SP78
SP80
MSb
SP79
SP73
MSb In
bit 6 - - - - - -1
LSb In
bit 6 - - - -1
LSb
Note: Refer to Figure 30-5 for load conditions.
2011-2015 Microchip Technology Inc. DS40001441F-page 329
PIC12(L)F1840
FIGURE 30-18: SPI SLAVE MODE TIMING (CKE = 0)
FIGURE 30-19: SPI SLAVE MODE TIMING (CKE = 1)
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP70
SP71 SP72
SP73
SP74
SP75, SP76 SP77
SP78
SP79
SP80
SP79
SP78
MSb LSb
bit 6 - - - - - -1
MSb In bit 6 - - - -1 LSb In
SP83
Note: Refer to Figure 30-5 for load conditions.
SSx
SCKx
(CKP = 0)
SCKx
(CKP = 1)
SDOx
SDIx
SP70
SP71 SP72
SP82
SP74
SP75, SP76
MSb bit 6 - - - - - -1 LSb
SP77
MSb In bit 6 - - - -1 LSb In
SP80
SP83
Note: Refer to Figure 30-5 for load conditions.
PIC12(L)F1840
DS40001441F-page 330 2011-2015 Microchip Technology Inc.
TABLE 30-14: SPI MODE REQUIREMENTS
Param
No. Symbol Characteristic Min. Typ† Max. Units Conditions
SP70* TSSL2SCH,
TSSL2SCL
SS to SCK or SCK input 2.25 TCY ——ns
SP71* TSCH SCK input high time (Slave mode) TCY + 20 — — ns
SP72* TSCL SCK input low time (Slave mode) TCY + 20 — — ns
SP73* TDIV2SCH,
TDIV2SCL
Setup time of SDI data input to SCK edge 100 — — ns
SP74* TSCH2DIL,
TSCL2DIL
Hold time of SDI data input to SCK edge 100 — — ns
SP75* TDOR SDO data output rise time 3.0-5.5V — 10 25 ns
1.8-5.5V — 25 50 ns
SP76* TDOF SDO data output fall time — 10 25 ns
SP77* TSSH2DOZSS to SDO output high-impedance 10 — 50 ns
SP78* TSCR SCK output rise time
(Master mode)
3.0-5.5V — 10 25 ns
1.8-5.5V — 25 50 ns
SP79* TSCF SCK output fall time (Master mode) — 10 25 ns
SP80* TSCH2DOV,
TSCL2DOV
SDO data output valid after
SCK edge
3.0-5.5V — — 50 ns
1.8-5.5V — — 145 ns
SP81* TDOV2SCH,
TDOV2SCL
SDO data output setup to SCK edge Tcy — — ns
SP82* TSSL2DOV SDO data output valid after SS edge — — 50 ns
SP83* TSCH2SSH,
TSCL2SSH
SSafter SCK edge 1.5TCY + 40 — — ns
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
2011-2015 Microchip Technology Inc. DS40001441F-page 331
PIC12(L)F1840
FIGURE 30-20: I2C™ BUS START/STOP BITS TIMING
Note: Refer to Figure 30-5 for load conditions.
SP91
SP92
SP93
SCLx
SDAx
Start
Condition
Stop
Condition
SP90
TABLE 30-15: I2C™ BUS START/STOP BITS REQUIREMENTS
Param.
No. Symbol Characteristic Min. Typ. Max. Units Conditions
SP90* TSU:STA Start condition 100 kHz mode 4700 — — ns Only relevant for
repeated Start condition
Setup time 400 kHz mode 600 — —
SP91* THD:STA Start condition 100 kHz mode 4000 — — ns After this period, the first
clock pulse is generated
Hold time 400 kHz mode 600 — —
SP92* TSU:STO Stop condition 100 kHz mode 4700 — — ns
Setup time 400 kHz mode 600 — —
SP93* THD:STO Stop condition 100 kHz mode 4000 — — ns
Hold time 400 kHz mode 600 — —
* These parameters are characterized but not tested.
SFWm ‘
PIC12(L)F1840
DS40001441F-page 332 2011-2015 Microchip Technology Inc.
FIGURE 30-21: I2C™ BUS DATA TIMING
I
Note: Refer to Figure 30-5 for load conditions.
SP90
SP91 SP92
SP100
SP101
SP103
SP106 SP107
SP109 SP109
SP110
SP102
SCLx
SDAx
In
SDAx
Out
TABLE 30-16: I2C™ BUS DATA REQUIREMENTS
Param.
No. Symbol Characteristic Min. Max. Units Conditions
SP100* THIGH Clock high time 100 kHz mode 4.0 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 0.6 — s Device must operate at a
minimum of 10 MHz
SSP module 1.5TCY ——
SP101* TLOW Clock low time 100 kHz mode 4.7 — s Device must operate at a
minimum of 1.5 MHz
400 kHz mode 1.3 — s Device must operate at a
minimum of 10 MHz
SSP module 1.5TCY ——
SP102* TRSDA and SCL rise
time
100 kHz mode — 1000 ns
400 kHz mode 20 + 0.1CB300 ns CB is specified to be from
10-400 pF
SP103* TFSDA and SCL fall
time
100 kHz mode — 250 ns
400 kHz mode 20 + 0.1CB250 ns CB is specified to be from
10-400 pF
SP106* THD:DAT Data input hold time 100 kHz mode 0 — ns
400 kHz mode 0 0.9 s
SP107* TSU:DAT Data input setup
time
100 kHz mode 250 — ns (Note 2)
400 kHz mode 100 — ns
SP109* TAA Output valid from
clock
100 kHz mode — 3500 ns (Note 1)
400 kHz mode — — ns
SP110* TBUF Bus free time 100 kHz mode 4.7 — s Time the bus must be free
before a new transmission
can start
400 kHz mode 1.3 — s
SP111 CBBus capacitive loading — 400 pF
* These parameters are characterized but not tested.
Note 1: As a transmitter, the device must provide this internal minimum delay time to bridge the undefined region (min.
300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
2: A Fast mode (400 kHz) I2C™ bus device can be used in a Standard mode (100 kHz) I2C bus system, but the
requirement TSU:DAT 250 ns must then be met. This will automatically be the case if the device does not
stretch the low period of the SCL signal. If such a device does stretch the low period of the SCL signal, it must
output the next data bit to the SDA line TR max. + TSU:DAT = 1000 + 250 = 1250 ns (according to the Standard
mode I2C bus specification), before the SCL line is released.
2011-2015 Microchip Technology Inc. DS40001441F-page 333
PIC12(L)F1840
TABLE 30-17: CAP SENSE OSCILLATOR SPECIFICATIONS
FIGURE 30-22: CAP SENSE OSCILLATOR
Param.
No. Symbol Characteristic Min. Typ† Max. Units Conditions
CS01 ISRC Current Source High — -8 —A
Medium — -1.5 — A
Low — -0.3 — A
CS02 ISNK Current Sink High — 7.5 — A
Medium — 1.5 — A
Low — 0.25 — A
CS03 VCTH Cap Threshold — 0.8 — V
CS04 VCTL Cap Threshold — 0.4 — V
CS05 VCHYST Cap Hysteresis
(VCTH - VCTL)
High — 525 — mV
Medium — 375 — mV
Low — 300 — mV
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
ISRC
VCTH
VCTL
ISNK
EnabledEnabled
not allowed
PIC12(L)F1840
DS40001441F-page 334 2011-2015 Microchip Technology Inc.
30.9 High Temperature Operation
This section outlines the specifications for the following
devices operating in the high temperature range
between -40°C and 150°C.(2)
• PIC12F1840(4)
When the value of any parameter is identical for both
the 125°C Extended and the 150°C High Temp.
temperature ranges, then that value will be found in the
standard specification tables shown earlier in this
chapter, under the fields listed for the 125°C Extended
temperature range. If the value of any parameter is
unique to the 150°C High Temp. temperature range,
then it will be listed here, in this section of the data
sheet.
If a Silicon Errata exists for the product and it lists a
modification to the 125°C Extended temperature range
value, one that is also shared at the 150°C High Temp.
temperature range, then that modified value will apply
to both temperature ranges.
TABLE 30-18: ABSOLUTE MAXIMUM RATINGS
Note 1: Writes are not allowed for Flash
program memory above 125°C.
2: AEC-Q100 reliability testing for devices
intended to operate at 150°C is 1,000
hours. Any design in which the total oper-
ating time from 125°C to 150°C will be
greater than 1,000 hours is not warranted
without prior written approval from
Microchip Technology Inc.
3: The temperature range indicator in the
catalog part number and device marking
is “H” for -40°C to 150°C.
Example: PIC12F1840T-H/SN indicates
the device is shipped in a Tape and Reel
configuration, in the SOIC package, and
is rated for operation from -40°C to
150°C.
4: The low voltage version of this device,
PIC12LF1840, is not released for
operation above +125°C.
5: Errata Sheet DS80538 lists various mask
revisions. 150°C operation applies only
to revisions A5 and later.
6: The Capacitive Sensing module (CPS)
should not be used in high temperature
devices. Function and its parametrics are
not warranted.
7: Only SOIC (SN) and DFN (MF) packages
will be offered, not PDIP or UQFN.
Parameter Condition Value
Max. Current: VDD Source 15 mA
Max. Current: VSS Sink 15 mA
Max. Current: Pin Source 5 mA
Max. Current: Pin Sink 5 mA
Max. Storage Temperature — -65°C to 155°C
Max. Junction Temperature — +155°C
Ambient Temperature under Bias — -40°C to +150°C
Note: Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the
device. This is a stress rating only, and functional operation of the device at those or any other conditions
above those indicated in the operation listings of this specification is not implied. Exposure above maximum
rating conditions for extended periods may affect device reliability.
2011-2015 Microchip Technology Inc. DS40001441F-page 335
PIC12(L)F1840
FIGURE 30-23: PIC12F1840 VOLTAGE FREQUENCY GRAPH, -40°C
TA

+150°C
FIGURE 30-24: HFINTOSC FREQUENCY ACCURACY OVER DEVICE VDD AND TEMPERATURE
1.8
0
2.5
Frequency (MHz)
VDD (V)
Note 1: The shaded region indicates the permissible combinations of voltage and frequency.
2: Refer to Table 30-1 for each Oscillator mode’s supported frequencies.
43210 16
5.5
150
25
2.0
0
85
125
VDD (V)
4.0 5.04.5
Temperature (°C)
2.5 3.0 3.5 5.5
1.8
-40
± 10%
± 5%
No Operation
Foss :
PIC12(L)F1840
DS40001441F-page 336 2011-2015 Microchip Technology Inc.
TABLE 30-19: DC CHARACTERISTICS FOR PIC12F1840-H (High Temp.)
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristics Min. Typ. Max. Units Condition
D001 VDD Supply Voltage 2.5 — 5.5 V FOSC 32 MHz (Note 2)
D002* VDR RAM Data Retention Voltage(1) 2.1 — 5.5 V Device in Sleep mode
D003 VADFVR Fixed Voltage Reference
Voltage for ADC
-10 — 8 % 1.024V, VDD 2.5V
2.048V, VDD 2.5V
4.096V, VDD 4.75V
D003A VCDAFVR Fixed Voltage Reference
Voltage for ADC
-13 — 9 % 1.024V, VDD 2.5V
2.048V, VDD 2.5V
4.096V, VDD 4.75V
* These parameters are characterized but not tested.
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
2: PLL required for 32 MHz operation.
m m gem
2011-2015 Microchip Technology Inc. DS40001441F-page 337
PIC12(L)F1840
TABLE 30-20: MEMORY PROGRAMMING REQUIREMENTS FOR PIC12F1840-H (High Temp.)
TABLE 30-21: OSCILLATOR PARAMETERS FOR PIC12F1840-H (High Temp.)
TABLE 30-22: RESET, WATCHDOG TIMER, OSCILLATOR START-UP TIMER, POWER-UP TIMER
AND BROWN-OUT RESET PARAMETERS FOR PIC12F1840-H (High Temp.)
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristic Min. Typ. Max. Units Conditions
Data EEPROM Memory
D116 EDByte Endurance 50K — — E/W -40°C to +150°C
D118 TDEW Erase/Write Cycle Time — — 6.0 ms -40°C to +150°C
D119 TRETD Data Retention — 20 — Years 50K Programming cycles
Program Flash Memory
D121 EPCell Endurance — — — — Programming the Flash memory
above +125°C is not permitted
D124 TRETD Data Retention — 20 — Years
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristic Frequency
Tolerance Min. Typ. Max. Units Conditions
OS08 HFOSC Int. Calibrated HFINTOSC
Freq.(1)
±5% — 16.0 — MHz -40°C TA 125°C
VDD 2.5V
±10% — 16.0 — MHz -40°C TA 150°C
VDD 2.5V
OS08A MFOSC Int. Calibrated MFINTOSC
Freq.(1)
±5% — 500 — kHz -40°C TA 125°C
VDD 2.5V
±10% — 500 — kHz -40°C TA 150°C
VDD 2.5V
OS09 LFOSC Internal LFINTOSC Freq. ±35% — 31 — kHz -40°C TA 150°C
VDD 2.5V
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: To ensure these oscillator frequency tolerances, VDD and VSS must be capacitively decoupled as close to
the device as possible. 0.1 µF and 0.01 µF values in parallel are recommended.
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristic Min. Typ. Max. Units Conditions
31 TWDTLP Low-Power Watchdog Timer
Time-out Period (No Prescaler)
81630msVDD = 3.3V-5V
1:16 Prescaler used
35 VBOR Brown-out Reset Voltage(1) 2.50
—
2.70
—
2.90
—
V
—
BORV = 0
BORV = 1
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: To ensure these voltage tolerances, VDD and VSS must be capacitively decoupled as close to the device as
possible. 0.1 µF and 0.01 µF values in parallel are recommended.
PIC12(L)F1840
DS40001441F-page 338 2011-2015 Microchip Technology Inc.
TABLE 30-23: A/D CONVERTER (ADC) CHARACTERISTICS FOR PIC12F1840-H (High Temp.)
TABLE 30-24: COMPARATOR SPECIFICATIONS FOR PIC12F1840-H (High Temp.)
TABLE 30-25: CAP SENSE OSCILLATOR SPECIFICATIONS FOR PIC12F1840-H (High Temp.)
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristic Min. Typ. Max. Units Conditions
AD04 EOFF Offset Error — — 3.5 LSB No missing codes
VREF = 3.0V
† Data in “Typ” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Total Absolute Error includes integral, differential, offset and gain errors.
2: The A/D conversion result never decreases with an increase in the input voltage and has no missing codes.
3: ADC VREF is from external VREF, VDD pin or FVR, whichever is selected as reference input.
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristic Min. Typ. Max. Units Conditions
CM01 VIOFF Input Offset Voltage — — ±70 mV High-Power mode,
VICM = VDD/2
PIC12F1840 Standard Operating Conditions: (unless otherwise stated)
Operating Temperature: -40°C TA +150°C for High Temperature
Param
No. Sym. Characteristic Min. Typ. Max. Units Conditions
All All All ————This module is not intended for use in
high temperature devices.
2011-2015 Microchip Technology Inc. DS40001441F-page 339
PIC12(L)F1840
31.0 DC AND AC CHARACTERISTICS GRAPHS AND CHARTS
The graphs and tables provided in this section are for design guidance and are not tested.
In some graphs or tables, the data presented are outside specified operating range (i.e., outside specified VDD
range). This is for information only and devices are ensured to operate properly only within the specified range.
“Typical” represents the mean of the distribution at 25C. “MAXIMUM”, “Max.”, “MINIMUM” or “Min.”
represents (mean + 3) or (mean - 3) respectively, where is a standard deviation, over each
temperature range.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore, outside the warranted range.
PIC12(L)F1840
DS40001441F-page 340 2011-2015 Microchip Technology Inc.
FIGURE 31-1: IDD, LP OSCILLATOR, FOSC = 32 kHz, PIC12LF1840 ONLY
FIGURE 31-2: IDD, LP OSCILLATOR, FOSC = 32 kHz, PIC12F1840 ONLY
Typical
Max.
0
5
10
15
20
25
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
5
10
15
20
25
30
35
40
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
\\
2011-2015 Microchip Technology Inc. DS40001441F-page 341
PIC12(L)F1840
FIGURE 31-3: IDD TYPICAL, XT AND EXTRC OSCILLATOR, PIC12LF1840 ONLY
FIGURE 31-4: IDD MAXIMUM, XT AND EXTRC OSCILLATOR, PIC12LF1840 ONLY
4 MHz EXTRC
4 MHz XT
1 MHz XT
0
50
100
150
200
250
300
350
400
450
500
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Typical: 25°C
4 MHz EXTRC
4 MHz XT
1 MHz XT
0
100
200
300
400
500
600
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
//
PIC12(L)F1840
DS40001441F-page 342 2011-2015 Microchip Technology Inc.
FIGURE 31-5: IDD TYPICAL, XT AND EXTRC OSCILLATOR, PIC12F1840 ONLY
FIGURE 31-6: IDD MAXIMUM, XT AND EXTRC OSCILLATOR, PIC12F1840 ONLY
4 MHz EXTRC
4 MHz XT
1 MHz XT
0
100
200
300
400
500
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Typical: 25°C
4 MHz EXTRC
4 MHz XT
1 MHz XT
0
100
200
300
400
500
600
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 343
PIC12(L)F1840
FIGURE 31-7: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 32 kHz,
PIC12LF1840 ONLY
FIGURE 31-8: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 32 kHz,
PIC12F1840 ONLY
Typical
Max.
0
2
4
6
8
10
12
14
16
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
5
10
15
20
25
30
35
40
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
\\ \\ \\ \\
PIC12(L)F1840
DS40001441F-page 344 2011-2015 Microchip Technology Inc.
FIGURE 31-9: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 500 kHz,
PIC12LF1840 ONLY
FIGURE 31-10: IDD, EXTERNAL CLOCK (ECL), LOW-POWER MODE, FOSC = 500 kHz,
PIC12F1840 ONLY
Max.
Typical
0
10
20
30
40
50
60
70
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
10
20
30
40
50
60
70
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
2011-2015 Microchip Technology Inc. DS40001441F-page 345
PIC12(L)F1840
FIGURE 31-11: IDD TYPICAL, EXTERNAL CLOCK (ECM), MEDIUM-POWER MODE,
PIC12LF1840 ONLY
FIGURE 31-12: IDD MAXIMUM, EXTERNAL CLOCK (ECM), MEDIUM-POWER MODE,
PIC12LF1840 ONLY
4 MHz
1 MHz
0
50
100
150
200
250
300
350
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Typical: 25°C
4 MHz
1 MHz
0
50
100
150
200
250
300
350
400
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
PIC12(L)F1840
DS40001441F-page 346 2011-2015 Microchip Technology Inc.
FIGURE 31-13: IDD TYPICAL, EXTERNAL CLOCK (ECM), MEDIUM-POWER MODE, PIC12F1840
ONLY
FIGURE 31-14: IDD MAXIMUM, EXTERNAL CLOCK (ECM), MEDIUM-POWER MODE, PIC12F1840
ONLY
4 MHz
1 MHz
0
50
100
150
200
250
300
350
400
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Typical: 25°C
4 MHz
1 MHz
0
50
100
150
200
250
300
350
400
450
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 347
PIC12(L)F1840
FIGURE 31-15: IDD TYPICAL, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12LF1840 ONLY
FIGURE 31-16: IDD MAXIMUM, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12LF1840 ONLY
32 MHz
16 MHz
8 MHz
0.0
0.5
1.0
1.5
2.0
2.5
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Typical: 25°C
32 MHz
16 MHz
8 MHz
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Max: 85°C + 3ı
\\
PIC12(L)F1840
DS40001441F-page 348 2011-2015 Microchip Technology Inc.
FIGURE 31-17: IDD TYPICAL, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12F1840 ONLY
FIGURE 31-18: IDD MAXIMUM, EXTERNAL CLOCK (ECH), HIGH-POWER MODE,
PIC12F1840 ONLY
32 MHz
16 MHz
8 MHz
0.0
0.5
1.0
1.5
2.0
2.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Typical: 25°C
32 MHz
16 MHz
8 MHz
0.0
0.5
1.0
1.5
2.0
2.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 349
PIC12(L)F1840
FIGURE 31-19: IDD, LFINTOSC, FOSC = 31 kHz, PIC12LF1840 ONLY
FIGURE 31-20: IDD, LFINTOSC, FOSC = 31 kHz, PIC12F1840 ONLY
Typical
Max.
0
5
10
15
20
25
30
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
5
10
15
20
25
30
35
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
\ \
PIC12(L)F1840
DS40001441F-page 350 2011-2015 Microchip Technology Inc.
FIGURE 31-21: IDD, MFINTOSC, FOSC = 500 kHz, PIC12LF1840 ONLY
FIGURE 31-22: IDD, MFINTOSC, FOSC = 500 kHz, PIC12F1840 ONLY
Typical
Max.
0
20
40
60
80
100
120
140
160
180
200
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
Typical
Max.
0
50
100
150
200
250
300
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (μA)
VDD (V)
Max: 85°C + 3ı
Typical: 25°C
2011-2015 Microchip Technology Inc. DS40001441F-page 351
PIC12(L)F1840
FIGURE 31-23: IDD TYPICAL, HFINTOSC, PIC12LF1840 ONLY
FIGURE 31-24: IDD MAXIMUM, HFINTOSC, PIC12LF1840 ONLY
32 MHz (4x PLL)
16 MHz
8 MHz
4 MHz
0.0
0.5
1.0
1.5
2.0
2.5
3.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Typical: 25°C
32 MHz (4x PLL)
16 MHz
8 MHz
4 MHz
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Max: 85°C + 3ı
// C: :
PIC12(L)F1840
DS40001441F-page 352 2011-2015 Microchip Technology Inc.
FIGURE 31-25: IDD TYPICAL, HFINTOSC, PIC12F1840 ONLY
FIGURE 31-26: IDD MAXIMUM, HFINTOSC, PIC12F1840 ONLY
32 MHz (4x PLL)
16 MHz
8 MHz
4 MHz
0.0
0.5
1.0
1.5
2.0
2.5
3.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Typical: 25°C
32 MHz (4x PLL)
16 MHz
8 MHz
4 MHz
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 353
PIC12(L)F1840
FIGURE 31-27: IDD TYPICAL, HS OSCILLATOR, PIC12LF1840 ONLY
FIGURE 31-28: IDD MAXIMUM, HS OSCILLATOR, PIC12LF1840 ONLY
32 MHz
8 MHz
4 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Typical: 25°C
32 MHz
8 MHz
4 MHz
0.0
0.5
1.0
1.5
2.0
2.5
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IDD (mA)
VDD (V)
Max: 85°C + 3ı
:
PIC12(L)F1840
DS40001441F-page 354 2011-2015 Microchip Technology Inc.
FIGURE 31-29: IDD TYPICAL, HS OSCILLATOR, PIC12F1840 ONLY
FIGURE 31-30: IDD MAXIMUM, HS OSCILLATOR, PIC12F1840 ONLY
32 MHz
8 MHz
4 MHz
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Typical: 25°C
32 MHz
8 MHz
4 MHz
0.0
0.5
1.0
1.5
2.0
2.5
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IDD (mA)
VDD (V)
Max: 85°C + 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 355
PIC12(L)F1840
FIGURE 31-31: IPD BASE, SLEEP MODE, PIC12LF1840 ONLY
FIGURE 31-32: IPD BASE, LOW-POWER SLEEP MODE, VREGPM = 1, PIC12F1840 ONLY
450
M85
°
C3
Max.
250
300
350
400
450
D(nA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0
50
100
150
200
250
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (nA)
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
Max.
600
Max.
300
400
500
600
P
D(nA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0
100
200
300
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (nA)
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
PIC12(L)F1840
DS40001441F-page 356 2011-2015 Microchip Technology Inc.
FIGURE 31-33: IPD, WATCHDOG TIMER (WDT), PIC12LF1840 ONLY
FIGURE 31-34: IPD, WATCHDOG TIMER (WDT), PIC12F1840 ONLY
1.4
Typical
Max.
0.6
0.8
1.0
1.2
1.4
IPD (μA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0.0
0.2
0.4
0.6
08
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (μ
A
0.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
1.2
Typical
Max.
0.6
0.8
1.0
1.2
IPD (μA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0.0
0.2
0.4
0.6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (μ
A
0.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
2011-2015 Microchip Technology Inc. DS40001441F-page 357
PIC12(L)F1840
FIGURE 31-35: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC12LF1840 ONLY
FIGURE 31-36: IPD, FIXED VOLTAGE REFERENCE (FVR), PIC12F1840 ONLY
Max.
25
Typical
Max.
10
15
20
25
IPD (μA)
0
5
10
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (μ
A
Max: 85°C + 3ı
Typical: 25°C
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
30
Typical
Max.
15
20
25
30
IPD (μA)
0
5
10
15
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (
μ
Max: 85°C + 3ı
Typical: 25°C
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
MA)
PIC12(L)F1840
DS40001441F-page 358 2011-2015 Microchip Technology Inc.
FIGURE 31-37: IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC12LF1840 ONLY
FIGURE 31-38: IPD, BROWN-OUT RESET (BOR), BORV = 1, PIC12F1840 ONLY
12
Typical
Max.
6
8
10
12
D
(μA)
Max: 85°C + 3ı
Typical: 25°C
0
2
4
6
16
18
20
22
24
26
28
30
32
34
36
38
IPD (μA)
0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
Max
14
Ma 85
°
C+3
ı
Typical
Max.
6
8
10
12
14
IPD (μA)
Max: 85°C + 3ı
Typical: 25°C
0
2
4
6
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPD (μA
)
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
\\
2011-2015 Microchip Technology Inc. DS40001441F-page 359
PIC12(L)F1840
FIGURE 31-39: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC12LF1840 ONLY
FIGURE 31-40: IPD, TIMER1 OSCILLATOR, FOSC = 32 kHz, PIC12F1840 ONLY
6.0
T
yp
ical
Max.
3.0
4.0
5.0
6.0
IPD (μA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0.0
1.0
2.0
3.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
IPD (μ
A
0.0
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
VDD (V)
12
Typical
Max.
6
8
10
12
IPD (μA)
Max: 85°C + 3ı
Typical: 25°C
Typical
0
2
4
6
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
IPD (
μ
0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
VDD (V)
/ / / /
PIC12(L)F1840
DS40001441F-page 360 2011-2015 Microchip Technology Inc.
FIGURE 31-41: VOH vs. IOH OVER TEMPERATURE, VDD = 5.5V, PIC12F1840 ONLY
FIGURE 31-42: VOL vs. IOL OVER TEMPERATURE, VDD = 5.5V, PIC12F1840 ONLY
-40°C
Typical
125°C
0
1
2
3
4
5
6
-45 -40 -35 -30 -25 -20 -15 -10 -5 0
VOH (V)
IOH (mA)
Graph represents
3ıLimits
-40°C
Typical
125°C
0
1
2
3
4
5
0 102030405060708090100
VOL (V)
IOL (mA)
Graph represents
3ıLimits
2011-2015 Microchip Technology Inc. DS40001441F-page 361
PIC12(L)F1840
FIGURE 31-43: VOH vs. IOH OVER TEMPERATURE, VDD = 3.0V
FIGURE 31-44: VOL vs. IOL, OVER TEMPERATURE, VDD = 3.0V
-40°C
Typical
125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
-15-13-11-9-7-5-3-1
VOH (V)
IOH (mA)
Graph represents
3ıLimits
-40°C
Typical
125°C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 5 10 15 20 25 30 35 40
VOL (V)
IOL (mA)
Graph represents
3ıLimits
/ //
PIC12(L)F1840
DS40001441F-page 362 2011-2015 Microchip Technology Inc.
FIGURE 31-45: VOH vs. IOH OVER TEMPERATURE, VDD = 1.8V, PIC12LF1840 ONLY
FIGURE 31-46: VOL vs. IOL OVER TEMPERATURE, VDD = 1.8V, PIC12LF1840 ONLY
-40°C
Typical
125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-4.5 -4.0 -3.5 -3.0 -2.5 -2.0 -1.5 -1.0 -0.5 0.0
VOH (V)
IOH (mA)
Graph represents
3ıLimits
-40°C
Typical
125°C
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
012345678910
VOL (V)
IOL (mA)
Graph represents
3ıLimits
) //
2011-2015 Microchip Technology Inc. DS40001441F-page 363
PIC12(L)F1840
FIGURE 31-47: POR RELEASE VOLTAGE
FIGURE 31-48: POR REARM VOLTAGE, PIC12F1840 ONLY
Typical
Max.
Min.
1.50
1.52
1.54
1.56
1.58
1.60
1.62
1.64
1.66
1.68
1.70
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
Typical
Max.
Min.
1.34
1.36
1.38
1.40
1.42
1.44
1.46
1.48
1.50
1.52
1.54
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
PIC12(L)F1840
DS40001441F-page 364 2011-2015 Microchip Technology Inc.
FIGURE 31-49: BROWN-OUT RESET VOLTAGE, BORV = 1, PIC12LF1840 ONLY
FIGURE 31-50: BROWN-OUT RESET HYSTERESIS, BORV = 1, PIC12LF1840 ONLY
Typical
Max.
Min.
1.80
1.85
1.90
1.95
2.00
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
Typical
Max.
Min.
0
10
20
30
40
50
60
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 365
PIC12(L)F1840
FIGURE 31-51: BROWN-OUT RESET VOLTAGE, BORV = 1, PIC12F1840 ONLY
FIGURE 31-52: BROWN-OUT RESET HYSTERESIS, BORV = 1, PIC12F1840 ONLY
Typical
Max.
Min.
2.30
2.35
2.40
2.45
2.50
2.55
2.60
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
Typical
Max.
Min.
0
10
20
30
40
50
60
70
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
PIC12(L)F1840
DS40001441F-page 366 2011-2015 Microchip Technology Inc.
FIGURE 31-53: BROWN-OUT RESET VOLTAGE, BORV = 0
Typical
Max.
Min.
2.55
2.60
2.65
2.70
2.75
2.80
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
\\\ \\\
2011-2015 Microchip Technology Inc. DS40001441F-page 367
PIC12(L)F1840
FIGURE 31-54: LOW POWER BROWN-OUT RESET VOLTAGE, LPBOR = 0
FIGURE 31-55: LOW POWER BROWN-OUT RESET HYSTERESIS, LPBOR = 0
Typical
Max.
Min.
1.80
1.90
2.00
2.10
2.20
2.30
2.40
2.50
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (V)
Temperature (°C)
Max: Typical + 3ı
Min: Typical - 3ı
Typical
Max.
Min.
0
5
10
15
20
25
30
35
40
45
-60 -40 -20 0 20 40 60 80 100 120 140
Voltage (mV)
Temperature (°C)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
PIC12(L)F1840
DS40001441F-page 368 2011-2015 Microchip Technology Inc.
FIGURE 31-56: WDT TIME-OUT PERIOD
FIGURE 31-57: PWRT PERIOD
Typical
Max.
Min.
10
12
14
16
18
20
22
24
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ms)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
Typical
Max.
Min.
40
50
60
70
80
90
100
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ms)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
2011-2015 Microchip Technology Inc. DS40001441F-page 369
PIC12(L)F1840
FIGURE 31-58: FVR STABILIZATION PERIOD
Typical
Max.
0
5
10
15
20
25
30
35
40
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Time (us)
VDD (V)
Max: Typical + 3ı
Typical: statistical mean @ 25°C
Note:
The FVR Stabilization Period applies when:
1) coming out of RESET or exiting Sleep mode for PIC12/16LFxxxx devices.
2) when exiting sleep mode with VREGPM = 1for PIC12/16Fxxxx devices
In all other cases, the FVR is stable when released from RESET.
PIC12(L)F1840
DS40001441F-page 370 2011-2015 Microchip Technology Inc.
FIGURE 31-59: COMPARATOR HYSTERESIS, NORMAL-POWER MODE, CxSP = 1, CxHYS = 1
FIGURE 31-60: COMPARATOR HYSTERESIS, LOW-POWER MODE, CxSP = 0, CxHYS = 1
Min.
Typical
Max.
0
10
20
30
40
50
60
70
80
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Hysteresis (mV)
VDD (V)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
Min.
Typical
Max.
0
2
4
6
8
10
12
14
16
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Hysteresis (mV)
VDD (V)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
/ l//
2011-2015 Microchip Technology Inc. DS40001441F-page 371
PIC12(L)F1840
FIGURE 31-61: COMPARATOR RESPONSE TIME, NORMAL-POWER MODE, CxSP = 1
FIGURE 31-62: COMPARATOR RESPONSE TIME OVER TEMPERATURE,
NORMAL-POWER MODE, CxSP = 1
Max.
Typical
0
50
100
150
200
250
300
350
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ns)
VDD (V)
Max: Typical + 3ı
Typical: 25°C
-40°C
Typical
125°C
0
50
100
150
200
250
300
350
400
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Time (ns)
VDD (V)
Graph represents
3ıLimits
PIC12(L)F1840
DS40001441F-page 372 2011-2015 Microchip Technology Inc.
FIGURE 31-63: COMPARATOR INPUT OFFSET AT 25°C, NORMAL-POWER MODE, CxSP = 1,
PIC12F1840 ONLY
Max.
Typical
Min.
-50
-40
-30
-20
-10
0
10
20
30
40
50
0.0 1.0 2.0 3.0 4.0 5.0
Offset Voltage (mV)
Common Mode Voltage (V)
Max: Typical + 3ı
Typical: 25°C
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 373
PIC12(L)F1840
FIGURE 31-64: LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE, PIC12LF1840 ONLY
FIGURE 31-65: LFINTOSC FREQUENCY OVER VDD AND TEMPERATURE, PIC12F1840 ONLY
Typical
Max.
Min.
20
22
24
26
28
30
32
34
36
1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0 3.2 3.4 3.6 3.8
Frequency (kHz)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
Typical
Max.
Min.
20
22
24
26
28
30
32
34
36
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
Frequency (kHz)
VDD (V)
Max: Typical + 3ı(-40°C to +125°C)
Typical: statistical mean @ 25°C
Min: Typical - 3ı(-40°C to +125°C)
‘R
PIC12(L)F1840
DS40001441F-page 374 2011-2015 Microchip Technology Inc.
FIGURE 31-66: CAP SENSE CURRENT SINK/SOURCE CHARACTERISTICS,
FIXED VOLTAGE REFERENCE (CPSRM = 0),
HIGH CURRENT RANGE (CPSRNG = 11)
FIGURE 31-67: CAP SENSE CURRENT SINK/SOURCE CHARACTERISTICS,
FIXED VOLTAGE REFERENCE (CPSRM = 0),
MEDIUM CURRENT RANGE (CPSRNG = 10)
Sink Typical
Sink Max.
Sink Min.
Source Typical
Source Min.
Source Max.
-20
-15
-10
-5
0
5
10
15
20
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPIN (uA)
VDD (V)
Max: Typical + 3ı
Typical:
Min: Typical - 3ı
Sink Typical
Sink Max.
Sink Min.
Source Typical
Source Min.
Source Max.
-5
-4
-3
-2
-1
0
1
2
3
4
5
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPIN (uA)
VDD (V)
Max: Typical + 3ı
Typical:
Min: Typical - 3ı
2011-2015 Microchip Technology Inc. DS40001441F-page 375
PIC12(L)F1840
FIGURE 31-68: CAP SENSE CURRENT SINK/SOURCE CHARACTERISTICS,
FIXED VOLTAGE REFERENCE (CPSRM = 0),
LOW CURRENT RANGE (CPSRNG = 01)
Sink Typical
Sink Max.
Sink Min.
Source Typical
Source Min.
Source Max.
-1.2
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
0.6
0.8
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0
IPIN (uA)
VDD (V)
Max: Typical + 3ı
Typical:
Min: Typical - 3ı
PIC12(L)F1840
DS40001441F-page 376 2011-2015 Microchip Technology Inc.
32.0 DEVELOPMENT SUPPORT
The PIC® microcontrollers (MCU) and dsPIC® digital
signal controllers (DSC) are supported with a full range
of software and hardware development tools:
• Integrated Development Environment
- MPLAB® X IDE Software
• Compilers/Assemblers/Linkers
- MPLAB XC Compiler
-MPASM
TM Assembler
-MPLINK
TM Object Linker/
MPLIBTM Object Librarian
- MPLAB Assembler/Linker/Librarian for
Various Device Families
• Simulators
- MPLAB X SIM Software Simulator
•Emulators
- MPLAB REAL ICE™ In-Circuit Emulator
• In-Circuit Debuggers/Programmers
- MPLAB ICD 3
- PICkit™ 3
• Device Programmers
- MPLAB PM3 Device Programmer
• Low-Cost Demonstration/Development Boards,
Evaluation Kits and Starter Kits
• Third-party development tools
32.1 MPLAB X Integrated Development
Environment Software
The MPLAB X IDE is a single, unified graphical user
interface for Microchip and third-party software, and
hardware development tool that runs on Windows®,
Linux and Mac OS® X. Based on the NetBeans IDE,
MPLAB X IDE is an entirely new IDE with a host of free
software components and plug-ins for high-
performance application development and debugging.
Moving between tools and upgrading from software
simulators to hardware debugging and programming
tools is simple with the seamless user interface.
With complete project management, visual call graphs,
a configurable watch window and a feature-rich editor
that includes code completion and context menus,
MPLAB X IDE is flexible and friendly enough for new
users. With the ability to support multiple tools on
multiple projects with simultaneous debugging, MPLAB
X IDE is also suitable for the needs of experienced
users.
Feature-Rich Editor:
• Color syntax highlighting
• Smart code completion makes suggestions and
provides hints as you type
• Automatic code formatting based on user-defined
rules
• Live parsing
User-Friendly, Customizable Interface:
• Fully customizable interface: toolbars, toolbar
buttons, windows, window placement, etc.
• Call graph window
Project-Based Workspaces:
• Multiple projects
• Multiple tools
• Multiple configurations
• Simultaneous debugging sessions
File History and Bug Tracking:
• Local file history feature
• Built-in support for Bugzilla issue tracker
2011-2015 Microchip Technology Inc. DS40001441F-page 377
PIC12(L)F1840
32.2 MPLAB XC Compilers
The MPLAB XC Compilers are complete ANSI C
compilers for all of Microchip’s 8, 16, and 32-bit MCU
and DSC devices. These compilers provide powerful
integration capabilities, superior code optimization and
ease of use. MPLAB XC Compilers run on Windows,
Linux or MAC OS X.
For easy source level debugging, the compilers provide
debug information that is optimized to the MPLAB X
IDE.
The free MPLAB XC Compiler editions support all
devices and commands, with no time or memory
restrictions, and offer sufficient code optimization for
most applications.
MPLAB XC Compilers include an assembler, linker and
utilities. The assembler generates relocatable object
files that can then be archived or linked with other relo-
catable object files and archives to create an execut-
able file. MPLAB XC Compiler uses the assembler to
produce its object file. Notable features of the assem-
bler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command-line interface
• Rich directive set
• Flexible macro language
• MPLAB X IDE compatibility
32.3 MPASM Assembler
The MPASM Assembler is a full-featured, universal
macro assembler for PIC10/12/16/18 MCUs.
The MPASM Assembler generates relocatable object
files for the MPLINK Object Linker, Intel® standard HEX
files, MAP files to detail memory usage and symbol
reference, absolute LST files that contain source lines
and generated machine code, and COFF files for
debugging.
The MPASM Assembler features include:
• Integration into MPLAB X IDE projects
• User-defined macros to streamline
assembly code
• Conditional assembly for multipurpose
source files
• Directives that allow complete control over the
assembly process
32.4 MPLINK Object Linker/
MPLIB Object Librarian
The MPLINK Object Linker combines relocatable
objects created by the MPASM Assembler. It can link
relocatable objects from precompiled libraries, using
directives from a linker script.
The MPLIB Object Librarian manages the creation and
modification of library files of precompiled code. When
a routine from a library is called from a source file, only
the modules that contain that routine will be linked in
with the application. This allows large libraries to be
used efficiently in many different applications.
The object linker/library features include:
• Efficient linking of single libraries instead of many
smaller files
• Enhanced code maintainability by grouping
related modules together
• Flexible creation of libraries with easy module
listing, replacement, deletion and extraction
32.5 MPLAB Assembler, Linker and
Librarian for Various Device
Families
MPLAB Assembler produces relocatable machine
code from symbolic assembly language for PIC24,
PIC32 and dsPIC DSC devices. MPLAB XC Compiler
uses the assembler to produce its object file. The
assembler generates relocatable object files that can
then be archived or linked with other relocatable object
files and archives to create an executable file. Notable
features of the assembler include:
• Support for the entire device instruction set
• Support for fixed-point and floating-point data
• Command-line interface
• Rich directive set
• Flexible macro language
• MPLAB X IDE compatibility
PIC12(L)F1840
DS40001441F-page 378 2011-2015 Microchip Technology Inc.
32.6 MPLAB X SIM Software Simulator
The MPLAB X SIM Software Simulator allows code
development in a PC-hosted environment by simulat-
ing the PIC MCUs and dsPIC DSCs on an instruction
level. On any given instruction, the data areas can be
examined or modified and stimuli can be applied from
a comprehensive stimulus controller. Registers can be
logged to files for further run-time analysis. The trace
buffer and logic analyzer display extend the power of
the simulator to record and track program execution,
actions on I/O, most peripherals and internal registers.
The MPLAB X SIM Software Simulator fully supports
symbolic debugging using the MPLAB XC Compilers,
and the MPASM and MPLAB Assemblers. The soft-
ware simulator offers the flexibility to develop and
debug code outside of the hardware laboratory envi-
ronment, making it an excellent, economical software
development tool.
32.7 MPLAB REAL ICE In-Circuit
Emulator System
The MPLAB REAL ICE In-Circuit Emulator System is
Microchip’s next generation high-speed emulator for
Microchip Flash DSC and MCU devices. It debugs and
programs all 8, 16 and 32-bit MCU, and DSC devices
with the easy-to-use, powerful graphical user interface of
the MPLAB X IDE.
The emulator is connected to the design engineer’s
PC using a high-speed USB 2.0 interface and is
connected to the target with either a connector
compatible with in-circuit debugger systems (RJ-11)
or with the new high-speed, noise tolerant, Low-
Voltage Differential Signal (LVDS) interconnection
(CAT5).
The emulator is field upgradable through future firmware
downloads in MPLAB X IDE. MPLAB REAL ICE offers
significant advantages over competitive emulators
including full-speed emulation, run-time variable
watches, trace analysis, complex breakpoints, logic
probes, a ruggedized probe interface and long (up to
three meters) interconnection cables.
32.8 MPLAB ICD 3 In-Circuit Debugger
System
The MPLAB ICD 3 In-Circuit Debugger System is
Microchip’s most cost-effective, high-speed hardware
debugger/programmer for Microchip Flash DSC and
MCU devices. It debugs and programs PIC Flash
microcontrollers and dsPIC DSCs with the powerful,
yet easy-to-use graphical user interface of the MPLAB
IDE.
The MPLAB ICD 3 In-Circuit Debugger probe is
connected to the design engineer’s PC using a high-
speed USB 2.0 interface and is connected to the target
with a connector compatible with the MPLAB ICD 2 or
MPLAB REAL ICE systems (RJ-11). MPLAB ICD 3
supports all MPLAB ICD 2 headers.
32.9 PICkit 3 In-Circuit Debugger/
Programmer
The MPLAB PICkit 3 allows debugging and program-
ming of PIC and dsPIC Flash microcontrollers at a most
affordable price point using the powerful graphical user
interface of the MPLAB IDE. The MPLAB PICkit 3 is
connected to the design engineer’s PC using a full-
speed USB interface and can be connected to the tar-
get via a Microchip debug (RJ-11) connector (compati-
ble with MPLAB ICD 3 and MPLAB REAL ICE). The
connector uses two device I/O pins and the Reset line
to implement in-circuit debugging and In-Circuit Serial
Programming™ (ICSP™).
32.10 MPLAB PM3 Device Programmer
The MPLAB PM3 Device Programmer is a universal,
CE compliant device programmer with programmable
voltage verification at VDDMIN and VDDMAX for
maximum reliability. It features a large LCD display
(128 x 64) for menus and error messages, and a mod-
ular, detachable socket assembly to support various
package types. The ICSP cable assembly is included
as a standard item. In Stand-Alone mode, the MPLAB
PM3 Device Programmer can read, verify and program
PIC devices without a PC connection. It can also set
code protection in this mode. The MPLAB PM3
connects to the host PC via an RS-232 or USB cable.
The MPLAB PM3 has high-speed communications and
optimized algorithms for quick programming of large
memory devices, and incorporates an MMC card for file
storage and data applications.
2011-2015 Microchip Technology Inc. DS40001441F-page 379
PIC12(L)F1840
32.11 Demonstration/Development
Boards, Evaluation Kits, and
Starter Kits
A wide variety of demonstration, development and
evaluation boards for various PIC MCUs and dsPIC
DSCs allows quick application development on fully
functional systems. Most boards include prototyping
areas for adding custom circuitry and provide applica-
tion firmware and source code for examination and
modification.
The boards support a variety of features, including LEDs,
temperature sensors, switches, speakers, RS-232
interfaces, LCD displays, potentiometers and additional
EEPROM memory.
The demonstration and development boards can be
used in teaching environments, for prototyping custom
circuits and for learning about various microcontroller
applications.
In addition to the PICDEM™ and dsPICDEM™
demonstration/development board series of circuits,
Microchip has a line of evaluation kits and demonstra-
tion software for analog filter design, KEELOQ® security
ICs, CAN, IrDA®, PowerSmart battery management,
SEEVAL® evaluation system, Sigma-Delta ADC, flow
rate sensing, plus many more.
Also available are starter kits that contain everything
needed to experience the specified device. This usually
includes a single application and debug capability, all
on one board.
Check the Microchip web page (www.microchip.com)
for the complete list of demonstration, development
and evaluation kits.
32.12 Third-Party Development Tools
Microchip also offers a great collection of tools from
third-party vendors. These tools are carefully selected
to offer good value and unique functionality.
• Device Programmers and Gang Programmers
from companies, such as SoftLog and CCS
• Software Tools from companies, such as Gimpel
and Trace Systems
• Protocol Analyzers from companies, such as
Saleae and Total Phase
• Demonstration Boards from companies, such as
MikroElektronika, Digilent® and Olimex
• Embedded Ethernet Solutions from companies,
such as EZ Web Lynx, WIZnet and IPLogika®
Wfiflfl Wflflfl 0's 0’” meALJ mmmm HHHH HHHH XXXXXXXX XXXXYYWW O 6‘ 09 UUUU UUUU NNN
PIC12(L)F1840
DS40001441F-page 380 2011-2015 Microchip Technology Inc.
33.0 PACKAGING INFORMATION
33.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC® designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead PDIP (300 mil) Example
XXXXXXXX
XXXXXNNN
YYWW
12F1840
/P017
1212
8-Lead SOIC (3.90 mm) Example
NNN
017
12F1840
/SN1212
2011-2015 Microchip Technology Inc. DS40001441F-page 381
PIC12(L)F1840
33.2 Package Marking Information
8-Lead DFN (3x3x0.9 mm) Example
XXXX
NNN
YYWW
PIN 1 PIN 1
MFQ0
1212
017
8-Lead UDFN (3x3x0.5 mm)
TABLE 33-1: 8-LEAD 3X3 DFN (MF) TOP
MARKING
Part Number Marking
PIC12F1840T-E/MF MFQ0
PIC12F1840T-I/MF MFR0
PIC12LF1840T-E/MF MFS0
PIC12LF1840T-I/MF MFT0
TABLE 33-2: 8-LEAD 3X3 UDFN (RF) TOP
MARKING
Part Number Marking
PIC12F1840T-I/RF DAC0
PIC12F1840T-E/RF DAD0
PIC12LF1840T-I/RF DAJ0
PIC12LF1840T-E/RF DAK0
PIC12(L)F1840
DS40001441F-page 382 2011-2015 Microchip Technology Inc.
33.3 Package Details
The following sections give the technical details of the packages.
B
A
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Microchip Technology Drawing No. C04-018D Sheet 1 of 2
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
eB
E
A
A1
A2
L
8X b
8X b1
D
E1
c
C
PLANE
.010 C
12
N
NOTE 1
TOP VIEW
END VIEWSIDE VIEW
e
2011-2015 Microchip Technology Inc. DS40001441F-page 383
PIC12(L)F1840
Microchip Technology Drawing No. C04-018D Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
8-Lead Plastic Dual In-Line (P) - 300 mil Body [PDIP]
Units INCHES
Dimension Limits MIN NOM MAX
Number of Pins N 8
Pitch e.100 BSC
Top to Seating Plane A - - .210
Molded Package Thickness A2 .115 .130 .195
Base to Seating Plane A1 .015
Shoulder to Shoulder Width E .290 .310 .325
Molded Package Width E1 .240 .250 .280
Overall Length D .348 .365 .400
Tip to Seating Plane L .115 .130 .150
Lead Thickness c.008 .010 .015
Upper Lead Width b1 .040 .060 .070
Lower Lead Width b.014 .018 .022
Overall Row Spacing eB - - .430
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
3.
1.
protrusions shall not exceed .010" per side.
2.
4.
Notes:
§
--
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
Pin 1 visual index feature may vary, but must be located within the hatched area.
§ Significant Characteristic
Dimensioning and tolerancing per ASME Y14.5M
e
DATUM A DATUM A
e
b
e
2
b
e
2
ALTERNATE LEAD DESIGN
(VENDOR DEPENDENT)
s-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] NOTEl E . ‘ ‘+ 2x N/2 TlPS NX b * BE! TOP VIEW A‘— an —-- l SEATING PLANE M 7 SIDE VIEW A‘— + n VIEW A-A Mlcmchlp Technology Drawmg Na 004—0570 Sheel 1 of 2
PIC12(L)F1840
DS40001441F-page 384 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] UHlls MILLlMETERS Dimenslon Limits MIN l NOM l MAX Number 01 Prns N 5 Pitcn e 1.27 BSC Overall Heigm A . . 1.75 Molded Package Thickness A2 1.25 . . Stands" § Al 0.10 . 0.25 Overall Wldth E 5.00 BSC Molded Package Wrdth E1 3.90 850 Overall Length D 4.90 BSC Chamier (Optional) n 0.25 . 0.50 Fool Length L 0.40 . 1.27 Feetpnnt Ll 1.04 REF Fool Angle w 0° . 5° Lead Thickness c 0.17 — 0.25 Lead Wrdtn 5 0.31 — 0.51 Mold malt Angle Top at 5° — 15° Mold Bran Angle Bollom 73 5° — 15° Notes: 1. Plrl 1 vlsual lridex fealure may vary, bul musl be located wiinrn lhe hatched area 2. § 5rgnineant Characterlstic 3 Dlmenslans D and E1 do not lnclude mold flash or prulmsluns Mold flash or protrusions shall not exceed 0.15mm per side 4. Dlmensionlng and toleraneing per ASME v14 5M 55c: Basro Drmensron Theorellcally exact value shown wrlnout tolerances REF: Relerence Drmensron, usually wllhoul tolerance. for lnlormallon purposes only Mlcrachip Technology Drawing No c047057c street 2 012
2011-2015 Microchip Technology Inc. DS40001441F-page 385
PIC12(L)F1840
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
7% D / SILKSCREEN .-} U U [41 RECOMMENDED LAND PATTERN I L Umls MILLIMETERS Dimensmn Lxmxls MIN \ NONI | MAX ConKacl Pitch E 1 27 BSC Comad Pad Spacmg c 5.40 Contact Pad wmm (x5) x1 0 so Camacl Pad Length (xa) v1 1 55 Notes- 1 Dwmensmmng and |olerancing per ASME v14 5M BSC. Easwc Dlmenslon Theorehca‘ly exact vame Shawn wwthout lolerances. Microchip Techno‘ogy Drawmg No. (304720st
PIC12(L)F1840
DS40001441F-page 386 2011-2015 Microchip Technology Inc.
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8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN] TOP VIEW (DATU M A) (DATUM B) K 7 7, N I? 4. gXb 00703 c A\a| ‘1} 0.0503 c BOTTOM VIEW Microchip Technology Drawmg No. CMVDSZC Shee| 1 072
2011-2015 Microchip Technology Inc. DS40001441F-page 387
PIC12(L)F1840
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN] NOTE 2 Unlts MILLIMETERS Dlmenslorl lelts MN | NOM l MAX Number at Plns N a Pltch e 0 65 Bsc Overall Helghl A 0 so 0 90 1 00 S|andofl A1 0.00 0 02 0 05 Contact Thickness A3 0.20 REF Overall Length D 3 00 BSC Exposed Pad Wldtn E2 1 34 | . l 1 60 Overall Wldm E 3 00 ESC Expased Pad Length DZ 1.60 - 2 40 Contact wlatn o 0.25 0 30 0 35 Contact Lengtn L 0.20 0 30 0 55 ContactrlosExposed Fad K 0.20 . . Notes: 1. Pm 1 visual lndex leature may vary. but must oe located w1tnintl1e natoheo area 2 Package may nave one or more exposed lle bars at ends. 3 Package 1s saw singulateo 4. Dlmensmnlng ano tolerancing perASME Y14.5M 380 Basic Dlmenslon Theorellcally exacl value Shawn wilnout tolerances REF: Relerence Drmensron, usually wnnout tolerance. tor lnformatlon purposes only. Mlcrochlp Technology Drawlng No 004-0620 Sheel 2 of 2
PIC12(L)F1840
DS40001441F-page 388 2011-2015 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
8-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9mm Body [DFN] W2 C1 T2 \ SILK SCREEN RECOMMENDED LAND PATTERN Umts MILUMETERS Dtmenslcn Ltmtts MIN | NOM \ MAX (:0an Ptton E o 65 BSC Ophonal Center no wmtn w2 2 40 Ophonal Center Fad Lenglh 12 1 55 Contact Pao Spacmg 01 3 to Contact Fad Wldm (X8) x1 0 35 Contact Pad Length (X8) v1 0 65 Dustance Between Pads 6 0 30 Notes: 1 Dimensoning and toteranoing per ASME v14 SM 380 Basic Dimenston. Theoreuca‘ly exact value shown wttham to‘erances. Microchtp Technology Drawmg No. 004720628
2011-2015 Microchip Technology Inc. DS40001441F-page 389
PIC12(L)F1840
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note: For Ihe mosl currenl package drawmgs, please see me Microchip Pack hllpJ/www mIcrochIp.com/packaging —D—T—I I (DATUM A) — I (DATUM B) 7 \ NOTE1 7%77+ iiiii IEIWIFI ///flI c TOP VIEW W—I—l SEATING, W W W W Iii— ’ SIDE VIEW ECDJ f $ -III Ex; j\' \ + m...
PIC12(L)F1840
DS40001441F-page 390 2011-2015 Microchip Technology Inc.
B
A
0.10 C
0.10 C
0.10 C A B
(DATUM B)
(DATUM A)
C
SEATING
PLANE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
12
N
0.10 C A B
0.10 C A B
0.05 C
0.05 C
Microchip Technology Drawing C04-254A Sheet 1 of 2
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN]
2X
8X
D
E
A
(A3)
A1
NOTE 1
D2
E2
8X be
K
L
e
2
12
N
2011-2015 Microchip Technology Inc. DS40001441F-page 391
PIC12(L)F1840
Microchip Technology Drawing C04-254A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.65 BSC
0.065 REF
1.40
2.20
0.35
0.25
0.45
0.00
0.30
3.00 BSC
0.45
2.30
1.50
0.50
0.02
3.00 BSC
MILLIMETERS
MIN NOM
8
1.60
2.40
0.55
0.35
0.55
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN]
PIC12(L)F1840
DS40001441F-page 392 2011-2015 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
Optional Center Pad Width
Optional Center Pad Length
Contact Pitch
Y2
X2
2.40
1.60
MILLIMETERS
0.65 BSC
MIN
E
MAX
Contact Pad Length (X8)
Contact Pad Width (X8)
Y1
X1
0.85
0.35
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2254A
NOM
8-Lead Ultra Thin Plastic Dual Flat, No Lead Package (RF) - 3x3x0.50 mm Body [UDFN]
SILK SCREEN
CContact Pad Spacing 2.90
Contact Pad to Center Pad (X8) G2 0.30
C
X2
X1
E
Y2
G2
Y1
Contact Pad to Contact Pad (X6) G1 0.20
G1
2011-2015 Microchip Technology Inc. DS40001441F-page 393
PIC12(L)F1840
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (02/2011)
Original release of this data sheet.
Revision B (05/2011)
Updated ‘Special Microcontroller Features’ and
‘Low-Power Features’ sections; Updated Section 30.3,
‘DC Characteristics: PIC12(L)F1840-I/E
(Power-down)’; Updated the Packaging Information
section.
Revision C (12/2012)
Updated electrical specifications and added character-
ization data.
Revision D (11/2013)
Updated electrical specification section; Other minor
corrections.
Revision E (05/2014)
Updated with new 8-lead UDFN 3x3x0.5mm package.
Updated Product Identification System page and
added new specifications for new packages.
Updated Equation 16-1. Updated Figures 5-7, 16-4,
19-2, 21-1, 25-24, 27-1, 27-2, 30-9. Removed Figure
31-54. Updated Registers 12-6, 24-2. Updated
Sections 15.3, 16.1.2, 17.0, 19.6, 21.0, 24.4.2, 25.6,
27.0, 27.1, 30.5, 30.6, 33.2. Updated Tables 3-3, 7-5,
12-1, 25-4, 30-5, 30-8, 30-10, 30-11, 30-14, 30-17.
Revision F (4/2015)
Added Section 30.9: High Temperature Operation in
the Electrical Specifications section.
APPENDIX B: MIGRATING FROM
OTHER PIC®
DEVICES
This section provides comparisons when migrating
from other similar PIC® devices to the PIC12(L)F1840
family of devices.
B.1 PIC12F683 to PIC12(L)F1840
TABLE B-1: FEATURE COMPARISON
Feature PIC12F683 PIC12(L)F1840
Max. Operating
Speed
20 MHz 32 MHz
Max. Program
Memory (Words)
2K 4K
Max. SRAM (Bytes) 128 256
Max. EEPROM
(Bytes)
256 256
ADC Resolution 10-bit 10-bit
Timers (8/16-bit) 2/1 2/1
Brown-out Reset Y Y
Internal Pull-ups GP<5:4>,
GP<2:0>
RA<5:0>
Interrupt-on-change GP<5:0> RA<5:0>, Edge
Selectable
Comparator 1 1
EUSART N Y
Extended WDT N Y
Software Control
Option of WDT/BOR
YY
INTOSC
Frequencies
31 kHz -
8 MHz
31 kHz -
32 MHz
Clock Switching Y Y
Capacitive Sensing N Y
CCP/ECCP 1/0 0/1
Enhanced PIC16
CPU
NY
MSSPx/SSPx N Y
Reference Clock N Y
Data Signal
Modulator
NY
SR Latch N Y
Voltage Reference N Y
DAC N Y
PIC12(L)F1840
DS40001441F-page 394 2011-2015 Microchip Technology Inc.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at
www.microchip.com. This web site is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip web site at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the web site
at: http://www.microchip.com/support
PART No. v ”44 41x lxx T xxx T wwwmmrucmg bum/Eskagmg
2011-2015 Microchip Technology Inc. DS40001441F-page 395
PIC12(L)F1840
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: PIC12F1840, PIC12LF1840
Tape and Reel
Option:
Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range:
I= -40C to +85C(Industrial)
E= -40
C to +125C (Extended)
Package:(2) MF = Micro Lead Frame (DFN) 3x3x0.9mm
RF = Micro Lead Frame (UDFN) 3x3x0.5mm
P=Plastic DIP
SN = SOIC, 8-Lead
Pattern: QTP, SQTP, Code or Special Requirements
(blank otherwise)
Examples:
a) PIC12F1840T - I/MF 301
Tape and Reel,
Industrial temperature,
DFN package,
QTP pattern #301
b) PIC12F1840 - I/P
Industrial temperature
PDIP package
c) PIC12F1840 - E/SN
Extended temperature,
SOIC package
Note 1: Tape and Reel identifier only appears in
the catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package.
Check with your Microchip Sales Office
for package availability with the Tape and
Reel option.
2: Small form-factor packaging options may
be available. Please check
www.microchip.com/packaging for small-
form factor package availability, or contact
your local Sales Office.
[X](1)
Tape and Reel
Option
-
YSTEM
DS40001441F-page 396 2011-2015 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2011-2015, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-63277-249-7
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
6‘ MICRDCHIP AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE
2011-2015 Microchip Technology Inc. DS40001441F-page 397
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
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Tel: 678-957-9614
Fax: 678-957-1455
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Tel: 216-447-0464
Fax: 216-447-0643
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Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
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Tel: 248-848-4000
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Fax: 317-773-5453
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Tel: 949-462-9523
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New York, NY
Tel: 631-435-6000
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Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Tel: 852-2943-5100
Fax: 852-2401-3431
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Tel: 61-2-9868-6733
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Tel: 86-10-8569-7000
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Tel: 86-28-8665-5511
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Fax: 82-2-558-5932 or
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Worldwide Sales and Service
01/27/15