Datenblatt für MA4Myyyy Series

MACOMW 350 www macum com Imgs wwwmacnm com/suggnn
MNS Microwave Chip Capacitors
Rev. V6
MA4Mxxxx Series
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
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Features
Excellent Repeatability
( Wafer-to-Wafer and Lot-to-Lot)
Small Size
Low Loss, High Q
Available with Round or Square Bond Pads
Description and Applications
The 4M series of MNS (metal-nitride-silicon) chip capacitors
is designed specifically for high reliability and repeatable
performance in microwave circuit applications. These ca-
pacitors are made using a low pressure chemical vapor
deposition (LPCVD) that results in dense, uniform nitride
layers. These devices exhibit higher capacitance per unit
area (resulting in smaller chip size) and improved rugged-
ness over similar MOS, MIS and ceramic capacitors.
Evaporated gold contacts are used to provide an easily
bondable metal pad on the capacitor chip. M/A-Com MNS
capacitors have shown no measurable capacitance change
when subjected to the rated standoff voltage at 150
Degrees C.
The MA4M series of chip capacitors is an excellent choice
for use in hybrid microwave circuits up through Ku-band,
where low loss, high reliability, small size and temperature
stability are prime concerns.
These chip capacitors are suited for applications requiring
DC blocks, coupling capacitors, bypass capacitors, capaci-
tive loads and tuning elements in oscillators, multipliers and
filters.
Case Style
Comparison of M/A-COM MNS Capacitors to Ceramic Chip Capacitors
Characteristics Compared MNS Ceramic
Operating Temperature Range -55 Deg C. to + 200 Deg. C. -55 Deg C. to + 200 Deg. C.
Temperature Coefficient 180 PPM 1000 PPM
Insertion Loss of a 20 pf Capacitor in a 50 Ohm
Line @ 15 GHz
.1 dB .2 dB
Chip Size
200 pF, 100V
20 pF, 100V
40 x 40 mils
22 x 22 mils
70 x 70 mils
50 x 50 mils
MACOMW TYPICAL CAFAC‘TANCE CHANGE FOR MNS and CERAMIC cAPAcrroR vs TEMPERATURE 1200 pF cAPAcwoR) an \ q \ .5 'umu rmmmu: c 1:5 .1 n \ u ; couuuuunn ( “Huron A ,a rm ([Rnxxt ( uutnm: Imgs wwwmacnm com/suggnn www macum com
MNS Microwave Chip Capacitors
Rev. V6
MA4Mxxxx Series
2
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
2
Model Number
Capacitance (pF)
Maximum
Standoff
Voltage Rating
( Volts )
Chip Style
Nominal Top
Contact Diameter
( mils )
MA4M2020 20 200 132 13
MA4M1050 50 100 132 11
MA4M1100 100 100 199 20
Specifications
Chip Capacitors with Round Bonding Pads
Chip Capacitors with Square Bonding Pads
Model Number
Capacitance (pF)
Maximum
Standoff
Voltage Rating
( Volts )
Chip Style
MA4M3010 10 200 350
MA4M3030 30 200 352
MA4M3050 50 200 354
MA4M3100 100 50 358
MA4M3150 150 50 359
Applied Voltage Specified standoff voltage
Operating Temperature -55 Deg.C to + 200 Deg. C
Storage Temperature -55 Deg.C to + 200 Deg. C
Maximum Ratings
Notes :
1. Capacitance is measured @ 1 MHz.
2. Temperature coefficient of capacitance is nominally
180 PPM/Degrees C.
4. Device failure may occur is standoff voltage rating is
exceeded.
5. Other capacitance and standoff voltage values are avail-
able on request.
MACOMW Case 5M9 Chip INCH Es MILLIMETERS Style DIM. MIN. MAX. MIN. MAx. 132 A 0020 0024 051 Del _ B 0 003 0 003 0 03 0 203 199 A 0 027 0 03| 0 e9 0 79 < 4="" b="" 0="" 004="" 0="" 003="" 010="" 0="" 203="" 200="" a="" 0="" 037="" 0="" 041="" 0="" 94="" |="" 04="" _="" b="" 0="" 004="" 0="" 003="" 0="" i0="" 0="" 203="" 201="" a="" 0="" 047="" 0="" 05|="" i="" i9="" i30="" b="" 0="" 004="" 0="" 003="" 0="" i0="" 0="" 203="" _="" 203="" a="" —="" 0="" 060="" —="" i="" 52="" b="" b="" 0="" 004="" 0="" 003="" 0="" i0="" 0="" 203="" nu|2="" for="" 0="" dimension="" on="" above="" case="" smes.="" see="" speciiicaiions="" chip="" inches="" millimeters="" swle="" dim="" min.="" max.="" min.="" max.="" 350="" a="" 0018="" 0021="" 046="" 053="" b="" 7="" o="" 008="" 7="" 0="" 203="" c="" 7="" 0="" 009="" 7="" 0="" 23="" 351="" a="" 0018="" 0021="" 045="" 053="" b="" 7="" o="" 008="" 7="" 0="" 203="" c="" 7="" 0="" 012="" 7="" 0="" 30="" c="" .3="" 352="" a="" 0018="" 0021="" 046="" 053="" b="" 7="" o="" 008="" 7="" 0="" 203="" c="" 7="" 0="" 015="" 7="" 0="" 38="" 354="" a="" 0020="" 0023="" d="" 51="" 058="" b="" 7="" 0="" 008="" 7="" 0="" 203="" _="" c="" 7="" 0="" 018="" 7="" 0="" 46="" b="" 358="" a="" 0013="" 0021="" 046="" 053="" b="" 7="" 0="" 008="" 7="" 0="" 203="" c="" 7="" 0="" 013="" 7="" 0="" 33="" 359="" a="" 0015="" 0021="" 046="" 053="" b="" 7="" 0="" 008="" 7="" 0="" 203="" c="" 7="" 0="" 01="" ii="" 7="" 0="" 41="" www="" macum="" cum="">
MNS Microwave Chip Capacitors
Rev. V6
MA4Mxxxx Series
3
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
3
MACOMW Bonding and Handling Considerations for MNS Chip Capacitors HandHng Normal precauttons tltat are common to the handhng of hybnd semtconductors also apply" to MNS clnp capacttors. Removal of chtps from waffle packs and subsequent handlmg should be done u'tth a \"acutnn pencrl Penctls equtpped \vrth ettlter metal- hc or nonntetalltc ttps are acceptable Surface Preparation Each MNS clnp and substrate should be flee of ads and other surfiace contatmnatton Such contamntants may result nt poor solder wettmg Cleanstng can be done u‘tth acetone. alcohol, freon. TMS or other common rmcroelectromc solt‘ents Bur- tuslung of MNS capacttor clttps ts not necessarv or recent» mended Solder Soldenng temperatures up to 300°C are acceptable for a duratton not greater than 5 seconds for MNS clttp capacttors Any of the common ttnrleadrstlvert leadrtndtum or htgher temperature gold alloy solders are acceptable pronded that the 300°C temperature is not exceeded Pure tin or tmrantnnony solders are not recommended Cleamng of testdual flux 1s requtred and can be accompltshed wrth a fluorutated or chlotntated solvent Conductive Epoxy Au_\' of the couduetn'e epoxtes that are aratlable for semtcour ductor the attachment are acceptable for MNS chip capacttor attachment Follow the manufacturers recommendattons for nuxtng and apphcattou carefully Take care to seat the capacrtor on the substrate using a sofi tntplement Lead Bonding Ball, ultrasonic» TC or pulse bondtng of the one or rtbhott leads are all acceptable methods Temperature for the pulse bonder should not exceed 300°C Mamnum pressure apphed to the MNS capacttor chtps sltould not exceed 35 grams for any oftlte methods used, Proper procedure W111 result tn bond strength tltat exceeds MIL-STD-BssB Method 2011.2 for gold wne or gold ribbon. www macum wm hflgs:I/www.micam.mmlsug‘§fl
MNS Microwave Chip Capacitors
Rev. V6
MA4Mxxxx Series
4
4
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
4
Notes :
1. For additional bonding, handling and chip mounting
information, reference MACOM application note M541.
MACOM www macum com Img Ilwww macnm com/suggnn
MNS Microwave Chip Capacitors
Rev. V6
MA4Mxxxx Series
5
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
5
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products. These materials are provided by MACOM as a service to its customers and may be used for
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assumes no responsibility for errors or omissions in these materials. MACOM may make changes to
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