Datenblatt für TMP302A,B,C,D von Texas Instruments

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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP302
SBOS488E –JUNE 2009–REVISED DECEMBER 2018
TMP302 Easy-to-Use, Low-Power, Low-Supply Temperature Switch in Micropackage
1
1 Features
1• Low Power: 15 μA (Maximum)
• SOT563 Package: 1.6-mm × 1.6-mm × 0.6 mm
• Trip-Point Accuracy: ±0.2°C (Typical) From +40°C
to +125°C
• Pin-Selectable Trip Points
• Open-Drain Output
• Pin-Selectable Hysteresis: 5°C and 10°C
• Low Supply Voltage Range: 1.4 V to 3.6 V
2 Applications
• Cell Phone Handsets
• Portable Media Players
• Consumer Electronics
• Servers
• Power-Supply Systems
• DC-DC Modules
• Thermal Monitoring
• Electronic Protection Systems
3 Description
The TMP302 device is a temperature switch in a
micropackage (SOT563). The TMP302 offers low
power (15-μA maximum) and ease-of-use through
pin-selectable trip points and hysteresis.
These devices require no additional components for
operation; they can function independent of
microprocessors or microcontrollers.
The TMP302 is available in several different versions.
For additional trip points, contact a TI representative.
Device Information(1)
PART NUMBER PACKAGE SELECTABLE TRIP
POINTS (ºC)(2)
TMP302A SOT (6) 50, 55, 60, 65
TMP302B SOT (6) 70, 75, 80, 85
TMP302C SOT (6) 90, 95, 100, 105
TMP302D SOT (6) 110, 115, 120, 125
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
(2) For other available trip points, contact a TI representative.
Trip Threshold Accuracy
l TEXAS INSTRUMENTS
1TRIPSET0 6 TRIPSET1
2GND 5 VS
3OUT 4 HYSTSET
2
TMP302
SBOS488E –JUNE 2009–REVISED DECEMBER 2018
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 2
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
6.5 Electrical Characteristics........................................... 5
6.6 Typical Characteristics.............................................. 5
7 Detailed Description.............................................. 7
7.1 Overview ................................................................... 7
7.2 Functional Block Diagram......................................... 7
7.3 Feature Description................................................... 8
7.4 Device Functional Modes.......................................... 8
8 Application and Implementation .......................... 9
8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
9 Power Supply Recommendations...................... 11
10 Layout................................................................... 11
10.1 Layout Guidelines ................................................. 11
10.2 Layout Example .................................................... 11
11 Device and Documentation Support ................. 12
11.1 Receiving Notification of Documentation Updates 12
11.2 Community Resources.......................................... 12
11.3 Trademarks........................................................... 12
11.4 Electrostatic Discharge Caution............................ 12
11.5 Glossary................................................................ 12
12 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision D (October 2018) to Revision E Page
• Changed the input pin supply voltage maximum value from: : VS+ 0.5 and ≤4 V to: : VS+ 0.3 and ≤4 V ......................... 4
Changes from Revision B (December 2014) to Revision C Page
• Changed device names by simplifying from TMP302A, TMP302B, TMP302C, and TMP302D to TMP302 ......................... 1
• Added plus-minus symbol to Machine Model value in ESD Ratings table............................................................................. 4
• Moved Specified Operating Temperature parameter from Electrical Characteristics table to Recommended
Operating Conditions table..................................................................................................................................................... 4
• Added Community Resources section ................................................................................................................................. 12
Changes from Revision A (September 2009) to Revision B Page
• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section ................................................................................................. 1
5 Pin Configuration and Functions
DRL Package
6-Pin SOT
Top View
l TEXAS INSTRUMENTS
3
TMP302
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Pin Functions
PIN TYPE DESCRIPTION
NO. NAME
1 TRIPSET0 Digital Input Used in combination with TRIPSET1 to select the temperature at which the device trips
2 GND Ground Ground
3 OUT Digital Output Open drain, active-low output
4 HYSTSET Digital Input Used to set amount of thermal hysteresis
5 VSPower
Supply Power supply
6 TRIPSET1 Digital Input Used in combination with TRIPSET0 to select the temperature at which the device trips
l TEXAS INSTRUMENTS
4
TMP302
SBOS488E –JUNE 2009–REVISED DECEMBER 2018
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage
Supply 4
VInput pin (TRIPSET0, TRIPSET1, HYSTSET) –0.5 VS+ 0.3
and ≤4
Output pin (OUT) –0.5 4
Current Output pin (OUT) 10 mA
Temperature
Operating –55 130
°CJunction 150
Storage –60 150
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
VCharged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000
Machine model (MM) ±500
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VSPower supply voltage 1.4 3.3 3.6 V
Rpullup Pullup resistor connected fromOUT to VS10 100 kΩ
TASpecified temperature –40 125 °C
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report (SPRA953).
6.4 Thermal Information
THERMAL METRIC(1)
TMP302
UNITDRL (SOT)
6 PINS
RθJA Junction-to-ambient thermal resistance 210.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 105.0 °C/W
RθJB Junction-to-board thermal resistance 87.5 °C/W
ψJT Junction-to-top characterization parameter 6.1 °C/W
ψJB Junction-to-board characterization parameter 87.0 °C/W
l TEXAS INSTRUMENTS Temperature we» Temperature we»
2.0
1.5
1.0
0.5
0
-0.5
1.0
1.5
2.0
-
-
-
40 50 60 70 80 90 100 110 130
Temperature ( C)
°
Trip Accuracy ( C)
°
120
16
14
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10
8
6
4
2
0
-75 -50 -25 0 25 50 75 100 150
Temperature ( C)
°
Quiescent Current (µA)
125
V = 3.6 V
S
V = 3.3 V
S
V = 1.4 V
S
5
TMP302
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6.5 Electrical Characteristics
At TA= –40°C to +125°C, and VS= 1.4 to 3.6 V (unless otherwise noted). 100% of all units are production tested at TA=
25°C; overtemperature specifications are specified by design.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TEMPERATURE MEASUREMENT
Trip point accuracy ±0.2 ±2 °C
Trip point accuracy versus
supply ±0.2 ±0.5 °C/V
Trip point hysteresis HYSTSET = GND 5 °C
HYSTSET = VS10 °C
TEMPERATURE TRIP POINT SET
Temperature trip point set
TRIPSET1 = GND, TRIPSET0 =
GND Default °C
TRIPSET1 = GND, TRIPSET0 = VSDefault + 5 °C
TRIPSET1 = VS, TRIPSET0 = GND Default + 10 °C
TRIPSET1 = VS, TRIPSET0 = VSDefault + 15 °C
HYSTERESIS SET INPUT
VIH Input logic level high 0.7 × VSVSV
VIL Input logic level low –0.5 0.3 × VSV
IIInput current 0 < VI< 3.6 V 1 µA
DIGITAL OUTPUT
VOL Output logic level low VS> 2 V, IOL = 3 mA 0 0.4 V
VS< 2 V, IOL = 3 mA 0 0.2 × VSV
POWER SUPPLY
Operating Supply Range 1.4 3.6 V
IQQuiescent Current TA= –40°C to +125°C 8 15 µA
VS= 3.3 V, TA= 50°C 7 µA
6.6 Typical Characteristics
At TA= 25°C and VS= 3.3 V, unless otherwise noted.
30 typical units
Figure 1. Trip Accuracy Error vs Temperature Figure 2. Quiescent Current vs Temperature
l TEXAS INSTRUMENTS 120 Time 45) 100 Twme (s) Fopmalmn Accuracy (‘0) 400 Temperature 4°C» , ‘ Tune (3 usMw) Twme (In ms/dM
Voltage (2 V/div)
Time (10 ms/div)
OUT
VS
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Temperature ( C)
°
Output Logic Level Low (mV)
120
100
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60
40
20
0
Temperature ( C)
°
0510 15 20 25 30
Time (s)
100
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50
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20
10
0
Temperature ( C)
°
0 20 40 60 80 100 120 140 160 180 200
Time (s)
6
TMP302
SBOS488E –JUNE 2009–REVISED DECEMBER 2018
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Typical Characteristics (continued)
At TA= 25°C and VS= 3.3 V, unless otherwise noted.
Figure 3. Temperature Step Response in Perfluorinated
Fluid at 100°C vs Time Figure 4. Thermal Step Response in Air at 100°C vs Time
Figure 5. Trip Threshold Accuracy
VS= 1.4 V IOL = 2 mA
Figure 6. Output Logic-Level Low VOL vs Temperature
Figure 7. Power-Up and Power-Down Response
TMP302A, TA= 55°C TRIPSET1 = TRIPSET0 = GND
Figure 8. Power-Up, Trip, and Power-Down Response
l TEXAS INSTRUMENTS $ GROUND
TRIPSET0 Temperature
Threshold and
Hysteresis
Temperature
Sensor
Comparator Alert
Bias
TRIPSET1
GROUND
OUT
VS
HYSTSET
7
TMP302
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7 Detailed Description
7.1 Overview
The TMP302 temperature switch is optimal for ultra low-power applications that require accurate trip thresholds.
A temperature switch is a device that issues an alert response when a temperature threshold is reached or
exceeded. The trip thresholds are programmable to four different settings using the TRIPSET1 and TRIPSET0
pins. Table 1 lists the pin settings versus trip points.
Table 1. Trip Point versus TRIPSET1 and TRIPSET0
TRIPSET1 TRIPSET0 TMP302A TMP302B TMP302C TMP302D
GND GND 50°C 70°C 90°C 110°C
GND VS55°C 75°C 95°C 115°C
VSGND 60°C 80°C 100°C 120°C
VSVS65°C 85°C 105°C 125°C
7.2 Functional Block Diagram
‘5‘ TEXAS INSTRUMENTS Tm
OUT
50°C 60°C T(TRIP)
VS
8
TMP302
SBOS488E –JUNE 2009–REVISED DECEMBER 2018
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7.3 Feature Description
7.3.1 HYSTSET
If the temperature trip threshold is crossed, the open-drain, active low output (OUT) goes low and does not return
to the original high state (that is, VS) until the temperature returns to a value within a hysteresis window set by
the HYSTSET pin. The HYSTSET pin allows the user to choose between a 5°C and a 10°C hysteresis window.
Table 2 lists the hysteresis window that corresponds to the HYSTSET setting.
Table 2. HYSTSET Window
HYSTSET THRESHOLD HYSTERESIS
GND 5°C
VS10°C
For the specific case of the device, if the HYSTSET pin is set to 10°C (that is, connected to VS) and the device is
configured with a 60°C trip point (TRIPSET1 = VS, TRIPSET0 = GND), when this threshold is exceeded the
output does not return to the original high state until it reaches 50°C. This case is more clearly shown in Figure 9.
Figure 9. TMP302A: HYSTSET = VS, TRIPSET1 = VS, TRIPSET0 = GND
7.4 Device Functional Modes
The TMP302 family of devices has a single functional mode. Normal operation for the TMP302 family of devices
occurs when the power-supply voltage applied between the VSpin and GND is within the specified operating
range of 1.4 to 3.6 V. The temperature threshold is selected by connecting the TRIPSET0 and TRIPSET1 pins to
either the GND or VSpins (see Table 1). Hysteresis is selected by connecting the HYSTSET pin to either the
GND or VSpins (see Table 2). The output pin, OUT, remains high when the temperature is below the selected
temperature threshold. The OUT pin remains low when the temperature is at or above the selected temperature
threshold. The OUT pin returns from a low state back to the high state based upon the amount of selected
hysteresis (see the HYSTSET section).
l TEXAS INSTRUMENTS 4
TMP302
TRIPSET0 TRIPSET1
HYSTSET
GND VS
OUT 0.1 µF
OUTPUT
VS
1.4 V to 3.6 V
10 k
9
TMP302
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8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
8.1.1 Configuring the TMP302
The TMP302 family of devices is simple to configure. The only external components that the device requires are
a bypass capacitor and pullup resistor. Power-supply bypassing is strongly recommended. Use a 0.1-µF
capacitor placed as close as possible to the supply pin. To minimize the internal power dissipation of the
TMP302 family of devices, use a pullup resistor value greater than 10 kΩfrom the OUT pin to the VSpin. Refer
to Table 1 for trip-point temperature configuration. The TRIPSET pins can be toggled dynamically; however, the
voltage of these pins must not exceed VS. To ensure a proper logic high, the voltage must not drop below 0.7 V
× VS.
8.2 Typical Application
Figure 10 shows the typical circuit configuration for the TMP302 family of devices. The TMP302 family of devices
is configured for the default temperature threshold by connecting the TRIPSET0 and TRIPSET1 pins directly to
ground. Connecting the HYSTSET pin to ground configures the device for 5°C of hysteresis. Place a 10-kΩ
pullup resistor between the OUT and VSpins. Place a 0.1-µF bypass capacitor between the VSpin and ground,
close to the TMP302 device.
Figure 10. TMP302 Typical Application Schematic
Figure 11 shows the most generic implementation of the TMP302 family of devices. Switches are shown
connecting the TMPSET0, TMPSET1 and HYSTSET pins to either VSor ground. The use of switches is not
strictly required; the switches are shown only to illustrate the various pin connection combinations. In practice,
connecting the TMPSET0, TMPSET1 and HYSTSET pins to ground or directly to the VSpin is sufficient and
minimizes space and cost. If additional flexibility is desired, connections from the TMPSET0, TMPSET1 and
HYSTSET pins can be made through 0-Ωresistors which can be either populated or not populated depending
upon the desired connection.
J 4 HM
TMP302
TRIPSET0 TRIPSET1
HYSTSET
GND VS
OUT
0.1 µF
OUTPUT VS
1.4 V to 3.6 V
10 k
10
TMP302
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Typical Application (continued)
Figure 11. TMP302 Generic Application Schematic
8.2.1 Design Requirements
Designing with the TMP302 family of devices is simple. The TMP302 family of devices is a temperature switch
commonly used to signal a microprocessor in the event of an over temperature condition. The temperature at
which the TMP302 family of devices issues an active low alert is determined by the configuration of the
TRIPSET0 and TRIPSET1 pins. These two pins are digital inputs and must be tied either high or low, according
to Table 1. The TMP302 family of devices issues an active low alert when the temperature threshold is
exceeded. The device has built-in hysteresis to avoid the device from signaling the microprocessor as soon as
the temperature drops below the temperature threshold. The amount of hysteresis is determined by the
HYSTSET pin. This pin is a digital input and must be tied either high or low, according to Table 2.
See Figure 10 and Figure 11 for typical circuit configurations.
8.2.2 Detailed Design Procedure
Determine the threshold temperature and hysteresis required for the application. Connect the TMPSET0,
TMPSET1, and HYSTSET pins according to the design requirements. Refer to Table 1 and Table 2. Use a 10-kΩ
pullup resistor from the OUT pin to the VSpin. To minimize power, a larger-value pullup resistor can be used but
must not exceed 100 kΩ. Place a 0.1-µF bypass capacitor close to the TMP302 device to reduce noise coupled
from the power supply.
8.2.3 Application Curves
Figure 12 and Figure 13 show the TMP302A power-on response with the ambient temperature less than 50°C
and greater than 50°C respectively. The TMP302A was configured with trip point set to 50°C. The TMP302B,
TMP302C, and TMP302D devices behave similarly with regards to power on response with TAbelow or above
the trip point. Note that the OUT signal typically requires 35 ms following power on to become valid.
l TEXAS INSTRUMENTS
TRIPSET0 TRIPSET1
GND
OUT
VS
HYSTSET
Heat Source
0.1 µF
VIA to Power Ground Plane
Ground Plane for
Thermal
Coupling to Heat
Source
Supply Voltage
Output
10 k
Time (5 µs/div)
Voltage (2 V/div)
OUT
VS
Time (10 ms/div)
Voltage (2 V/div)
OUT
VS
11
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Typical Application (continued)
Figure 12. TMP302A Power-On Response,
TALess than 50°C Figure 13. TMP302A Power-On Response,
TAGreater than 50°C
9 Power Supply Recommendations
The TMP302 family of devices is designed to operate from a single power supply within the range 1.4 V and 3.6
V. No specific power supply sequencing with respect to any of the input or output pins is required. The TMP302
family of devices is fully functional within 35 ms of the voltage at the VSpin reaching or exceeding 1.4 V.
10 Layout
10.1 Layout Guidelines
Place the power supply bypass capacitor as close as possible to the VSand GND pins. The recommended value
for this bypass capacitor is 0.1-µF. Additional bypass capacitance can be added to compensate for noisy or high-
impedance power supplies. Place a 10-kΩpullup resistor from the open drain OUT pin to the power supply pin
VS.
10.2 Layout Example
Figure 14. Layout Example
l TEXAS INSTRUMENTS
12
TMP302
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11 Device and Documentation Support
11.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
11.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
11.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Samples Samples Samples Samples Sample: Sample: Samples Samples
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TMP302ADRLR ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCP
TMP302ADRLT ACTIVE SOT-5X3 DRL 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCP
TMP302BDRLR ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCT
TMP302BDRLT ACTIVE SOT-5X3 DRL 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCT
TMP302CDRLR ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCR
TMP302CDRLT ACTIVE SOT-5X3 DRL 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCR
TMP302DDRLR ACTIVE SOT-5X3 DRL 6 4000 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCS
TMP302DDRLT ACTIVE SOT-5X3 DRL 6 250 RoHS & Green NIPDAU | NIPDAUAG Level-1-260C-UNLIM -40 to 125 OCS
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP302 :
•Automotive: TMP302-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
I TEXAS INSTRUMENTS 5:. V.’
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Jun-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP302ADRLR SOT-5X3 DRL 6 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302ADRLT SOT-5X3 DRL 6 250 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302BDRLR SOT-5X3 DRL 6 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302BDRLT SOT-5X3 DRL 6 250 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302CDRLR SOT-5X3 DRL 6 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302CDRLT SOT-5X3 DRL 6 250 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302DDRLR SOT-5X3 DRL 6 4000 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
TMP302DDRLT SOT-5X3 DRL 6 250 180.0 8.4 1.98 1.78 0.69 4.0 8.0 Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 6-Jun-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP302ADRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0
TMP302ADRLT SOT-5X3 DRL 6 250 202.0 201.0 28.0
TMP302BDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0
TMP302BDRLT SOT-5X3 DRL 6 250 202.0 201.0 28.0
TMP302CDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0
TMP302CDRLT SOT-5X3 DRL 6 250 202.0 201.0 28.0
TMP302DDRLR SOT-5X3 DRL 6 4000 202.0 201.0 28.0
TMP302DDRLT SOT-5X3 DRL 6 250 202.0 201.0 28.0
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
1.7
1.5
4X 0.5
2X 1
6X 0.3
0.1
0.6 MAX
6X 0.18
0.08
6X 0.4
0.2
0.05
0.00 TYP
6X 0.27
0.15
B1.3
1.1
A
1.7
1.5
NOTE 3
SOT - 0.6 mm max heightDRL0006A
PLASTIC SMALL OUTLINE
4223266/C 12/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-293 Variation UAAD
16
PIN 1
ID AREA
34
SEATING PLANE
0.05 C
SCALE 8.000
0.1 C A B
0.05
SYMM
SYMM
www.ti.com
EXAMPLE BOARD LAYOUT
0.05 MAX
AROUND 0.05 MIN
AROUND
6X (0.67)
6X (0.3)
(1.48)
4X (0.5)
(R0.05) TYP
4223266/C 12/2021
SOT - 0.6 mm max heightDRL0006A
PLASTIC SMALL OUTLINE
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria.
SYMM
LAND PATTERN EXAMPLE
SCALE:30X
SYMM
1
34
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDERMASK DETAILS
www.ti.com
EXAMPLE STENCIL DESIGN
(1.48)
4X (0.5)
6X (0.67)
6X (0.3)
(R0.05) TYP
SOT - 0.6 mm max heightDRL0006A
PLASTIC SMALL OUTLINE
4223266/C 12/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:30X
SYMM
SYMM
1
34
6
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