W ® DMMT5551/DMMT5551S
mam. Green
*1 |* 7, 307—26
1—1 H H T Dim Min Max Typ
A 0.35 0 50 0.38
B 1.50 1 70 1.60
C 2.70 3 00 2.80
D 7 7 0.95
F 7 7 0.55
H 2.90 3 10 3.00
L J 0013 0 10 0.05
T K 1.00 1 30 1.10
L 0.35 0 55 0.40
M 0.10 0 20 0.15
It 0C 5“ 7
All Dimensions in mm
' u u Ll '
Characterislic Symbol Value Unil
Col‘ectorrfiase VoHage vcao 180 v
Col‘edorrEmmer thage V550 160 V
EmmerrBase Voltage VEEO 60 v
Conemor Current , Commuous {Note 2} lg 200 mA
Power stsxpanon mm 2, 3) Pg 300 mW
Therm Resmance. Juncmn m Amman: (Note 2) RM 417 ”CM
Operahng and Storage Temperature Range 1", T5“; 755 to +150 ac
DMMT5551/DMMT5551S
MATCHED NPN SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
DS30436 Rev. 8 - 2 1 of 4
www.diodes.com
DMMT5551/DMMT5551S
© Diodes Incorporated
• Epitaxial Planar Die Construction
• Complementary PNP Type Available (DMMT5401)
• Ideal for Low Power Amplification and Switching
• Intrinsically Matched NPN Pair (Note 1)
• 2% Matched Tolerance, hFE, VCE(SAT), VBE(SAT)
• Lead Free/RoHS Compliant (Note 4)
• "Green" Device (Note 5 and 6)
Mechanical Data
• Case: SOT-26
• Case Material: Molded Plastic, "Green" Molding
Compound, Note 7. UL Flammability Classification
Rating 94V-0
• Moisture Sensitivity: Level 1 per J-STD-020C
• Terminal Connections: See Diagram
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Copper leadframe).
• Marking Information: K4R & K4T, See Page 3
• Ordering & Date Code Information: See Page 3
• Weight: 0.006 grams (approximate)
SOT-26
Dim Min Max Typ
A 0.35 0.50 0.38
B 1.50 1.70 1.60
C 2.70 3.00 2.80
D ⎯ ⎯ 0.95
F ⎯ ⎯ 0.55
H 2.90 3.10 3.00
J 0.013 0.10 0.05
K 1.00 1.30 1.10
L 0.35 0.55 0.40
M 0.10 0.20 0.15
α 0° 8° ⎯
All Dimens ons in mm i
Maximum Ratings @TA = 25°C unless otherwise specified
Characteristic
A
Symbol Value Unit
Collector-Base Voltage VCBO 180 V
Collector-Emitter Voltage VCEO 160 V
Emitter-Base Voltage VEBO 6.0 V
Collector Current - Continuous (Note 2) IC 200 mA
Power Dissipation (Note 2, 3) Pd 300 mW
Thermal Resistance, Junction to Ambient (Note 2) RθJA 417 °C/W
Operating and Storage Temperature Range Tj, TSTG -55 to +150 °C
Notes: 1. Built with adjacent die from a single wafer.
2. Device mounted on FR5 PCB: 1.0 x 0.75 x 0.62 in.; pad layout as shown on suggested pad layout document AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
3. Maximum combined dissipation.
4. No purposefully added lead.
5. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
6. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
M
JL
DF
BC
H
K
C
2
E
2
E
1
B
2
B
1
C
1
C
2
E
1
C
1
B
2
E
2
B
1
DMMT5551S
(K4T Marking Code)
DMMT5551
(K4R Marking Code)