Datenblatt für KC-LINK, C0G Series

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1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Built Into Tomorrow
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications
DC Link, Snubber, Resonator Capacitor, 150°C
(Commercial & Automotive Grade)
Overview
KEMET's KC-LINK surface mount capacitors are designed
to meet the growing demand for fast switching wide
bandgap (WBG) semiconductors that operate at higher
voltages, temperatures, and frequencies. By utilizing
KEMET's robust and proprietary C0G/NPO base metal
electrode (BME) dielectric system, these capacitors are
well suited for power converters, inverters, snubbers, and
resonators, where high efficiency is a primary concern.
With extremely low effective series resistance (ESR) and
very low thermal resistance, KC-LINK capacitors can
operate at very high ripple currents with no change in
capacitance versus DC voltage, and negligible change
in capacitance versus temperature. With an operating
temperature of 150°C, these capacitors can be mounted
close to fast switching semiconductors in high power
density applications, which require minimal cooling.
KC-LINK C0G dielectric technology also exhibits high
mechanical robustness compared to other dielectric
technologies, allowing the capacitor to be mounted without
the use of lead frames. This provides extremely low
effective series inductance (ESL) increasing the operating
frequency range allowing for further miniaturization. For
added reliability, KC-LINK is now available with flexible
termination technology that provides superior flex
performance over standard termination systems, addressing
the primary failure mode of MLCC's flex cracks.
In addition to commercial grade, automotive grade
devices are available and meet the demanding Automotive
Electronics Council’s AEC–Q200 qualification requirements.
Benefits
• EIA 1812, 2220, and 3640 case size
• AEC–Q200 automotive qualified
• Flexible termination option available
• Very high ripple current capability
• Extremely low equivalent series resistance (ESR)
• Extremely low equivalent series inductance (ESL)
• Operating temperature range of −55°C to +150°C
• High frequency operation (> 10 MHz)
• No capacitance shift with voltage
• No piezoelectric noise
• High thermal stability
• RoHS compliant and Pb-free
Applications
• Wide bandgap (WBG), silicon carbide (SiC) and gallium
nitride (GaN) systems
• EV/HEV (drive systems, charging)
• Wireless charging
• Photovoltaic systems
• Power converters
• Inverters
• LLC resonant converters
• DC link
• Snubber
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KEll/IEI' «WEED-mm
2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Typical Performance
-10.00
-5.00
0.00
5.00
10.00
-55 -35 -15 5 25 45 65 85 105 125 145
Capacitance Change (%)
Temperature (°C)
Capacitance Change vs Temperature
-10.00
-5.00
0.00
5.00
10.00
0 100 200 300 400 500
Capacitance Change (%)
DC Voltage (V)
Capacitance Change vs DC Voltage
0
2
4
6
8
10
12
14
16
18
20
0 100 200 300 400 500 600 700 800 900 1,000
AC Current (Arms)
Frequency (kHz)
Typical AC Current Performance
4.7 nF 1,700 V 7.5 nF 1,700 V 8.2 nF 1,700 V 22 nF 1,700 V
47 nF 1,200 V 56 nF 1,000 V 150 nF 650 V 220 nF 500 V
0
100
200
300
400
500
600
700
0 100 200 300 400 500 600 700 800 900 1,000
AC Voltage (Vrms)
Frequency (kHz)
Typical AC Voltage Performance
4.7 nF 1,700 V 7.5 nF 1,700 V 8.2 nF 1,700 V 22 nF 1,700 V
47 nF 1,200 V 56 nF 1,000 V 150 nF 650 V 220 nF 500 V
0
2
4
6
8
10
12
14
16
18
0100 200 300 400 500 600 700 800 900 1000
AC Current (Arms)
Frequency (kHz)
Typical AC Current Performance, EIA 2220 (CKC21)
4.7 nF 1,700 V
6.8 nF 1,700 V
7.5 nF 1,200 V
12 nF 1,200 V
15nF 1,000 V
33 nF 1,000 V
39 nF 650 V
100 nF 650 V
0
2
4
6
8
10
12
14
0100 200 300 400 500 600 700 800 900 1000
AC Current (Arms)
Frequency (kHz)
Typical AC Current Performance, EIA 1812 (CKC18)
4.7nF 1000V
7.5nF 1000V
15nF 1000V
18nF 650V
47nF 650V
0
2
4
6
8
10
12
14
16
18
20
0100 200 300 400 500 600 700 800 900 1000
Ripple Current (I
rms
)
Frequency (kHz)
Typical AC Current Performance, EIA 3640 (CKC33)
4.7nF 1700V
7.5nF 1700V
8.2nF 1700V
22nF 1700V
47nF 1200V
56nF 1000V
150nF 650V
220nF 500V
0
100
200
300
400
500
600
700
0100 200 300 400 500 600 700 800 900 1000
AC Voltage (V
rms
)
Frequency (kHz)
Typical AC Voltage Performance, EIA 2220 (CKC21)
4.7 nF 1,700 V
6.8 nF 1,700 V
7.5 nF 1,200 V
12 nF 1,200 V
15nF 1,000 V
33 nF 1,000 V
39 nF 650 V
100 nF 650 V
0
50
100
150
200
250
300
350
400
0100 200 300 400 500 600 700 800 900 1000
AC Voltage (V
rms
)
Frequency (kHz)
Typical AC Voltage Performance, EIA 1812 (CKC18)
4.7nF 1000V
7.5nF 1000V
15nF 1000V
18nF 650V
47nF 650V
*Ripple current measurements conditions.- Ripple current measurement were took under ambient temperature. Ripple current measurements
performed with a peak capacitor temperature of 150°C. Samples mounted to heat sink with no forced air cooling.
KEIVIEI' amen company ¢ REACH COMPLIANT
3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Ordering Information
CKC 33 C224 K C G A C TU
Series
Case Size
(L"x W ")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage (V) Dielectric
Subclass
Designation
Termination
Finish
Packaging
(Suffix/C-Spec)
CKC =
KC-LINK
18 = 1812
21 = 2220
33 = 3640
C = Standard
X = Flex1
Two single
digits and
number of
zeros.
Use 9 for
1.0 – 9.9 pF
e.g., 2.2 pF
= 229
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
C = 500 V
W = 650 V
D = 1,000 V
E = 1,200 V
J = 1,700 V
G = 2,000 V
G = C0G A = N/A C = 100% matte Sn See
"Packaging
C-Spec
Ordering
Options
Table"
1 Flexible termination is only available for EIA 1812 and 2220 case sizes.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions.
Lead-free
Packaging C-Spec Ordering Options Table
Packaging Type Packaging/Grade
Ordering Code (C-Spec)
Commercial Grade
Bulk Bag
1
/Unmarked
Not required (Blank)
7" Reel/Unmarked
TU
13" Reel (Embossed Plastic Tape)/Unmarked
7210
Automotive Grade2
7" Reel
AUTO
13" Reel (Embossed Plastic Tape)/Unmarked
AUTO7210
1 Default packaging is “Bulk Bag”. An ordering code C-Spec is not required for “Bulk Bag” packaging. "Bulk Bag" packaging option is not available for
case sizes larger than 2225 (5664 Metric).
2 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
KEIVIEI' u vao company Standard Termination 4.50 (0 177) 3.20 (0.125) 0.50 (0.024) 20.30 (0.012) 20.30 (0.012) 20.35 (0.014) 5.70 (0 224) 5 00 (0.197) 0.50 (0.024) 20.40 (0.015) 20.40 (0.015) 20.35 (0.014) 9 30 (0.355) 10 20 (0.402) 1.27 (0.050) 20.50 (0.024) 20.40 (0.015) 20.40 (0.015) Flex Termination 4.50 (0.170) 3.20 (0.125) 0 70 (0.020) 20.40 (0.015) 20.30 (0.012) 20.35 (0.014) 5.90 (0 232) 5 00 (0.197) 0 70 (0.020) 20 75 (0.030) 20.40 (0.015) 20.35 (0.014)
4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Dimensions – Millimeters (Inches)
L
B
W
S
T
Standard Termination
KC-LINK
CODE
EIA
SIZE
CODE
METRIC
SIZE
CODE
L
LENGTH
W
WIDTH
T
THICKNESS
B
BANDWIDTH
S
SEPARATION
Minimum
Mounting
Technique
18 1812 4532
4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
See Table 2 for
Thickness
0.60 (0.024)
±0.35 (0.014)
N/A Solder Reflow
Only
21 2220 5650
5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
33 3640 9210
9.30 (0.366)
±0.60 (0.024)
10.20 (0.402)
±0.40 (0.016)
1.27 (0.050)
±0.40 (0.016)
Flex Termination
KC-LINK
CODE
EIA
SIZE
CODE
METRIC
SIZE
CODE
L
LENGTH
W
WIDTH
T
THICKNESS
B
BANDWIDTH
S
SEPARATION
Minimum
Mounting
Technique
18 1812 4532
4.50 (0.178)
±0.40 (0.016)
3.20 (0.126)
±0.30 (0.012)
See Table 2 for
Thickness
0.70 (0.028)
±0.35 (0.014)
N/A Solder Reflow
Only
21 2220 5650
5.90 (0.232)
±0.75 (0.030)
5.00 (0.197)
±0.40 (0.016)
0.70 (0.028)
±0.35 (0.014)
KEIl/IEI' u new company Rated Voltage Product Availability and Chip Thickness Codes GD 1812 1.251015 1.000 4,000 JL 2220 20010.20 500 2,000 SH 1812 1.403015 1.000 4,000 JN 2220 2.503020 500 2,000 GK 1812 1.60 t 0.20 1,000 4,000 MA 3640 1.40 t 0.15 250 1,000 GM 1812 2.003020 500 2,000 MB 3640 2003020 250 1,000 60 1812 2.50 i 0.20 500 2,000 MC 3640 2.50 1 0.20 250 1,000 JE 2220 1.40 i 0.15 1,000 4,000 JK 2220 1.60 t 0.20 1,000 4,000
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Table 1 – Capacitance Range/Selection Waterfall Standard Termination
Capacitance Capacitance
Code
Case Size/Series CKC18C CKC21C CKC33C
1812 2220 3640
Voltage Code C W D C W D E J C W D E J G
Rated Voltage
(VDC)
500
650
1000
500
650
1000
1200
1700
500
650
1000
1200
1700
2000
Capacitance Tolerance
Product Availability and Chip Thickness Codes
See Packaging Specs for Chip Thickness Dimensions
4,700 pF 472 F G J K M GD GD GD JK JK JK JK JK MA MA MA MA MA MA
5,100 pF 512 F G J K M GD GD GD JL JL JL JL JL MA MA MA MA MA MA
5,600 pF 562 F G J K M GD GD GD JL JL JL JL JL MA MA MA MA MA MA
6,200 pF 622 F G J K M GH GH GH JN JN JN JN JN MA MA MA MA MA MA
6,800 pF 682 F G J K M GH GH GH JN JN JN JN JN MA MA MA MA MA MA
7,500 pF 752 F G J K M GK GK GK JK JK JK JK MB MB MB MB MB MB
8,200 pF 822 F G J K M GK GK GK JL JL JL JL MB MB MB MB MB MB
9,100 pF 912 F G J K M GM GM GM JL JL JL JL MB MB MB MB MB MB
10,000 pF 103 F G J K M GM GM GM JL JL JL JL MB MB MB MB MB MB
12,000 pF 123 F G J K M GO GO GO JN JN JN JN MB MB MB MB MB MB
15,000 pF 153 F G J K M GO GO GO JE JE JE MC MC MC MC MC MC
18,000 pF 183 F G J K M GH GH JE JE JE MC MC MC MC MC
22,000 pF 223 F G J K M GH GH JK JK JK MC MC MC MC MC
27,000 pF 273 F G J K M GK GK JL JL JL MB MB MB MB
33,000 pF 333 F G J K M GM GM JN JN JN MB MB MB MB
39,000 pF 393 F G J K M GO GO JE JE MC MC MC MC
47,000 pF 473 F G J K M GO GO JE JE MC MC MC MC
56,000 pF 563 F G J K M JK JK MC MC MC
68,000 pF 683 F G J K M JL JL MC MC
82,000 pF 823 F G J K M JL JL MB MB
0.1 µF 104 F G J K M JN JN MB MB
0.12 µF 124 F G J K M MB MB
0.15 µF 154 F G J K M MC MC
0.18 µF 184 F G J K M MC
0.22 µF 224 F G J K M MC
Capacitance Capacitance
Code
Rated Voltage (VDC)
500
650
1000
500
650
1000
1200
1700
500
650
1000
1200
1700
2000
Voltage Code
C
W
D
C
W
D
E
J
C
W
D
E
J
G
Case Size/Series 1812 2220 3640
CKC18C CKC22C CKC33C
Note: Flexible termination available only for EIA 1812 and 2220.
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Plastic Quantity Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
GD
1812
1.25 ± 0.15
1,000
4,000
JL
2220
2.00 ± 0.20
500
2,000
GH
1812
1.40 ± 0.15
1,000
4,000
JN
2220
2.50 ± 0.20
500
2,000
GK
1812
1.60 ± 0.20
1,000
4,000
MA
3640
1.40 ± 0.15
250
1,000
GM
1812
2.00 ± 0.20
500
2,000
MB
3640
2.00 ± 0.20
250
1,000
GO
1812
2.50 ± 0.20
500
2,000
MC
3640
2.50 ± 0.20
250
1,000
JE
2220
1.40 ± 0.15
1,000
4,000
JK
2220
1.60 ± 0.20
1,000
4,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel
Plastic Quantity Plastic Quantity
Package quantity based on finished chip thickness specifications.
KEIVIEI' u vao company Visual and KEMET Mechanical \ntema\ 1 kHz :50 Hz and 1 0 20.2 V ‘ If capacitance Ilance measurements (including loleranc mdexed m a referee fime of 1,000 hours Dissipafion KEMET Dwssmauon {actor (DF) maxwmum limit at 25”C = Factor (DF) \ntema\ 01% Wimin Specificamn
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Table 3 – Performance & Reliability: Test Methods and Conditions
Test Reference Test Condition Limits
Visual and
Mechanical
KEMET
Internal
No defects that may affect performance (10X) Dimensions according KEMET Spec Sheet
Capacitance
(Cap)
KEMET
Internal
1 kHz ±50 Hz and 1.0 ±0.2 V
rms
if capacitance
Capacitance measurements (including tolerance) are
indexed to a referee time of 1,000 hours
Within Tolerance
Dissipation
Factor (DF)
KEMET
Internal
1 kHz ±50 Hz and 1.0 ±0.2 Vrms
Dissipation factor (DF) maximum limit at 25°C =
0.1%
Insulation
Resistance
(IR)
KEMET
Internal 500 VDC applied for 120±5 seconds at 25°C
Within Specification
To obtain IR limit, divide MΩ-µF value by the
capacitance and compare to GΩ limit. Select the
lower of the two limits.
1,000 MΩ-µF or 100 GΩ
Temperature
Coefficient of
Capacitance
(TCC)
KEMET
Internal
Frequency: 1 kHz ±50 Hz
Capacitance change with reference to +25°C
and 0 VDC applied.
* See part number specification sheet for voltage
Step Temperature (°C)
1+25°C
2−55°C
3+25°C (Reference)
4+150°C
±30 PPM / °C
Dielectric
Withstanding
Voltage
(DWV)
KEMET
Internal
Rated
DC Voltage
DWV Voltage
(% of Rated)
500 V 150%
650 V 130%
≥ 1,000 V 120%
(5 ±1 seconds and charge/discharge not exceeding 50 mA)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Withstand test voltage without insulation
breakdown or damage.
Aging Rate
(Maximum %
Capacitance
Loss/Decade
Hour)
KEMET
Internal Maximum % capacitance loss/decade hour 0% Loss/Decade Hour
Terminal
Strength
Kemet
Internal
Shear stress test per specific case size,
Time: 60±1 seconds
Case Size Force
3640 18N
No evidence of mechanical damage
KEIVIEI' u new company
7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Table 3 – Performance & Reliability: Test Methods and Conditions cont.
Test Reference Test Condition Limits
Board Flex AEC-Q200-005
Standard Termination system 3.0 mm
Test time: 60±5 seconds
Ramp time: 1 mm/seconds
No evidence of mechanical damage
Solderability J-STD-002
Magnification 50X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Visual Inspection.
95% coverage on termination.
No leaching
Temperature
Cycling
JESD22
Method JA-104
1,000 cycles (−55°C to +150°C)
2-3 cycles per hour
Soak Time 1 or 5 minutes
Measurement at 24 hours ±4 hours
after test conclusion.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Biased
Humidity
MIL-STD-202
Method 103
Load Humidity: 1,000 hours 85°C/85% RH and 200 VDC.
Add 100 K Ω resistor.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V.
Add 100 K Ω resistor.
Measurement at 24 hours ±4 hours
after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Moisture
Resistance
MIL-STD-202
Method 106
Number of cycles required 10, 24 hours per cycle.
Steps 7a and 7b not required
Measurement at 24 hours ±4 hours
after test conclusion.
Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Thermal
Shock
MIL-STD-202
Method 107
Number of cycles required 5, (−55°C to 125°C)
Dwell time 15 minutes.
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
High
Temperature
Life MIL-STD-202
Method 108
1,000 hours at 150°C with 1.0 X rated voltage applied. Within Post Environmental Limits
Cap: ±0.3% or ±0.25 pF shift
IR: 10% of Initial Limit
DF Limits Maximum: 0.5%
Storage Life 1,000 hours at 150°C, Unpowered
Vibration MIL-STD-202
Method 204
5 g's for 20 minutes, 12 cycles each of 3 orientations.
Test from 10 – 2,000 Hz
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Mechanical
Shock
MIL-STD-202
Method 213
1,500 g’s 0.5ms Half-sine, Velocity Change 15.4 ft/second
(Condition F)
Cap: Initial Limit
DF: Initial Limit
IR: Initial Limit
Resistance to
Solvents
MIL-STD-202
Method 215
Add Aqueous wash chemical OKEMCLEAN
(A 6% concentrated Oakite cleaner) or equivalent.
Do not use banned solvents
Visual Inspection 10X
Readable marking, no decoloration or stains.
No physical damage.
KEIVIEI' unison-“puny
8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Table 4 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
KC-
LINK
CODE
EIA
SIZE
CODE
METRIC
SIZE
CODE
Density Level A:
Maximum (Most) Land
Protrusion
Density Level B:
Median (Nominal) Land
Protrusion
Density Level C:
Minimum (Least) Land
Protrusion
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
18 1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
21 2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
33 3640 9210 4.45 1.70 10.70 11.60 11.70 4.35 1.50 10.60 10.70 11.10 4.25 1.30 10.50 10.00 10.80
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
KEIl/IEI' u new company
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Automotive C-Spec Information
KEMET automotive grade products meet or exceed the requirements outlined by the Automotive Electronics Council.
Details regarding test methods and conditions are referenced in document AEC–Q200, Stress Test Qualifi cation for Passive
Components. These products are supported by a Product Change Notifi cation (PCN) and Production Part Approval Process
warrant (PPAP).
Automotive products offered through our distribution channel have been assigned an inclusive ordering code C-Spec, “AUTO.”
This C-Spec was developed in order to better serve small and medium-sized companies that prefer an automotive grade
component without the requirement to submit a customer Source Controlled Drawing (SCD) or specifi cation for review by a
KEMET engineering specialist. This C-Spec is therefore not intended for use by KEMET OEM automotive customers and are
not granted the same “privileges” as other automotive C-Specs. Customer PCN approval and PPAP request levels are limited
(see details below.)
Product Change Notifi cation (PCN)
The KEMET product change notifi cation system is used to communicate primarily the following types of changes:
• Product/process changes that affect product form, fi t, function, and/or reliability
• Changes in manufacturing site
• Product obsolescence
KEMET Automotive
C-Spec
Customer Notifi cation Due To: Days Prior To
Implementation
Process/Product change Obsolescence*
KEMET assigned1Yes (with approval and sign off) Yes 180 days minimum
AUTO Yes (without approval) Yes 90 days minimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
The purpose of the Production Part Approval Process is:
• To ensure that supplier can meet the manufacturability and quality requirements for the purchased parts.
• To provide the evidence that all customer engineering design records and specifi cation requirements are properly
understood and fulfi lled by the manufacturing organization.
• To demonstrate that the established manufacturing process has the potential to produce the part.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMET assigned1●●●●●
AUTO ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specifi cation for review. For additional information contact KEMET.
● Part number specifi c PPAP available
○ Product family PPAP only
KEIVIEI' amen company
10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Soldering Process
Recommended Reflow Soldering Profile
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the
IPC/J‐STD‐020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow
passes at these conditions.
Profile Feature Termination Finish
100% matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
150°C
Temperature Maximum (T
Smax
)200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second maximum
Liquidous Temperature (TL)217°C
Time Above Liquidous (tL) 60 – 150 seconds
Peak Temperature (TP)260°C
Time Within 5°C of Maximum Peak
Temperature (tP)30 seconds maximum
Ramp-Down Rate (TP to TL)6°C/second maximum
Time 25°C to Peak Temperature 8 minutes maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature – reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40°C and maximum
storage humidity not exceed 70% relative humidity. In addition, temperature fluctuations should be minimized to avoid
condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized
solderability chip stock should be used promptly, preferably within 1.5 years upon receipt.
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Construction
Standard Termination
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Dielectric Material
(CaZrO3)
Dielectric Material
(CaZrO3)
Termination Finish
(100% matte Sn)
Termination Finish
(100% matte Sn)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
Flex Termination
Detailed Cross Section
Barrier Layer
(Ni)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte
Sn/SnPb–5% Pb min)
Termination Finish
(100% Matte
Sn/SnPb–5% Pb min)
Dielectric Material
(CaZrO3)
Dielectric Material
(CaZrO3)
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12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12, 16 and 24 mm tape on 7" and 13" reels in accordance
with EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2
for details on reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic (mm)
EIA Case Size Tape Size
(W)*
Embossed Plastic
7" Reel 13" Reel
Pitch (P
1
)*
1812, 2220 12 8 8
3640 24 16 16
*Refer to Figure 1 for W and P1 carrier tape reference locations.
*Refer to Tables 4 and 5 for tolerance specifi cations.
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13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape
Size D0
D1 Minimum
Note 1 E1P0P2
R Reference
Note 2
S1 Minimum
Note 3
T
Maximum
T1
Maximum
12 mm 1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.5
(0.059)
1.75±0.10
(0.069±0.004)
4.0±0.10
(0.157±0.004)
2.0±0.05
(0.079±0.002)
30
(1.181)
0.600
(0.024)
0.600
(0.024)
0.600
(0.024)
24 mm
1.5 +0.10/-0.0
(0.059 +0.004/-0.0)
1.5
(0.059)
1.75 ±0.10
(0.069 ±0.004)
4.0 ±0.10
(0.157 ±0.004)
2.0 ±0.10
(0.078 ± 0.00 3)
30
(1.181)
5
(0.196)
0.250
(0.009)
0.350
(0.013)
Variable Dimensions — Millimeters (Inches)
Tape
Size Pitch B1 Maximum
Note 4
E2
Minimum F P1
T2
Maximum
W
Maximum A0,B0 and K0
12 mm
Single (4 mm) and
Double (8 mm)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484) Note 5
24 mm 16 mm 22.25
(0.875)
11.5 ±0.10
(0.452 ±0.003)
16.0 ±0.10
(0.629 ±0.004)
3
(0.118)
24.3
(0.956)
24.3
(0.956)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment
location and hole location shall be applied independent of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6).
3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Document 481 paragraph 4.3 (b)).
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see
Figure 4)
(e) For KPS Series product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see Addendum in EIA Document 481 for standards relating to more precise taping requirements.
KEIVIEI'
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 Newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)
24 mm 0.1 to 1.6 Newton (10 to 160 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 2 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 3 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 4 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
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15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Figure 5 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 7 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
12 mm 178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
24 mm 1.2
(0.047) 13.0 ±0.2
(0.521 ±0.008) 21
(0.826)
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
12 mm 50
(1.969)
12.4+2.0/−0.0
(0.488+0.078/−0.0) 18.4
(0.724) Shall accommodate tape
width without interference
24 mm 25 +1.0/−0.0
(0.984 +0.039/−0.0) 27.4 ±1.0
(1.078 ±0.039)
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16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
Figure 6 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 7 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
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17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1039_KC-LINK_C0G • 3/12/2021
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
KC-LINK™ for Fast Switching Semiconductor Applications, DC Link, Snubber, Resonator Capacitor, 150°C (Commercial & Automotive)
KEMET Electronics Corporation Sales Offi ces
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.