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WEB {'9 TEXAS INSTRUMENTS

TMS320VC5509 Fixed-Point

Digital Signal Processor

Data Manual

Literature Number: SPRS163F

April 2001 − Revised January 2004

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.

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TI warrants performance of its hardware products to the specifications applicable at the time of sale in

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DSP dsp.ti.com Broadband www.ti.com/broadband

Interface interface.ti.com Digital Control www.ti.com/digitalcontrol

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Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork

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‘9 TEXAS INSTRUMENTS

Revision History

April 2001 − Revised January 2004 SPRS163F

REVISION HISTORY

This data sheet revision history highlights the technical changes made to the SPRS163E device-specific data

sheet to make it an SPRS163F revision.

Scope: Made various minor updates/revisions.

PAGE(S)

NO. ADDITIONS/CHANGES/DELETIONS

11 Section 1, TMS320VC5509 Features:

− removed “64-Bit Unique Device ID” from “On-Chip Peripherals” feature

17 Table 2−3, Signal Descriptions:

− changed “INITIALIZATION, INTERRUPT, AND RESET PINS” section to “INTERRUPT AND RESET PINS” section

− INT[4:0]: revised FUNCTION description

− X2/CLKIN: revised “In CLKGEN domain ...” paragraph

30 Figure 3−1, Block Diagram of the TMS320VC5509:

− GPIO block: changed “7/9” to “7/8”

− Interrupt Control block: changed “9” to “5”

37 Section 3.2, Peripherals:

− removed “64-bit Unique Device ID” from list

− changed “USB 2.0 full-speed slave interface supporting:” to “USB full-speed slave interface supporting:”

38 Table 3−4, Synchronization Control Function:

− 00101b: revised Serial Port 1 Mode description

− 00110b: revised Serial Port 1 Mode description

− 01001b: revised Serial Port 2 Mode description

− 01010b: revised Serial Port 2 Mode description

40 Figure 3−6, External Bus Selection Register:

− Bit 12, BKE: changed “R, 0” to “R/W, 0”

42 Table 3−6, TMS320VC5509 Parallel Port Signal Routing:

− A[15:14]: updated Non-Multiplex HPI (10) column

− A[20:16]: updated Data EMIF (00), Non-Multiplex HPI (10), and Multiplex HPI (11) columns

44 Figure 3−8, Parallel Port (EMIF) Signal Interface:

− changed the unit “MB” to “MBit”

44 Table 3−7, TMS320VC5509 Serial Port1 Signal Routing:

− removed “RESERVED (11)” column

44 Table 3−8, TMS320VC5509 Serial Port2 Signal Routing:

− removed “RESERVED (11)” column

52 Section 3.9, Peripheral Register Description:

− added paragraph about USB and MMC/SD register access

61 Table 3−31, MMC/SD1 Module Registers:

− added NOTE about MMC/SD module register read or write attempt

62 Table 3−32, MMC/SD2 Module Registers:

− added NOTE about MMC/SD module register read or write attempt

62 Table 3−33, USB Module Registers:

− added NOTE about USB module register read or write attempt

67 Updated Figure 3−18, IFR1 and IER1 Bit Locations

*9 TEXAS INSTRUMENTS

Revision History

4April 2001 − Revised January 2004SPRS163F

PAGE(S)

NO. ADDITIONS/CHANGES/DELETIONS

67 Updated Table 3−39, IFR1 and IER1 Register Bit Fields

67 Section 3.10.2, Interrupt Timing:

− replaced “(NMI and INT)” with “(INT[4:0])”

80 Figure 5−4, External Multiply-by-N Clock Timings:

− updated parameters C8 and C9

93 Table 5−16, Reset Timing Requirements:

− Parameter R4 [tw(RSL)]: updated MIN and MAX values

94 Table 5−19, Wake-Up From IDLE Switching Characteristics:

− updated footnote about 12-MHz crystal

114 Figure 5−37, MultiMedia Card (MMC) Timings:

− added Parameter MMC3

116 Table 5−45, Universal Serial Bus (USB) Characteristics:

− renumbered parameters

117 Figure 5−40, Full-Speed Loads:

− renumbered parameters

*9 TEXAS INSTRUMENTS

Contents

April 2001 − Revised January 2004 SPRS163F

Contents

Section Page

1 TMS320VC5509 Features 11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Introduction 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 Description 12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 Pin Assignments 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2.1 Terminal Assignments for the GHH Package 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2.2 Pin Assignments for the PGE Package 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.3 Signal Descriptions 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Functional Overview 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1 Memory 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.1 On-Chip Dual-Access RAM (DARAM) 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.2 On-Chip Single-Access RAM (SARAM) 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.3 On-Chip Read-Only Memory (ROM) 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.4 Secure ROM 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.5 Memory Map 33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1.6 Boot Configuration 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 Peripherals 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 Direct Memory Access (DMA) Controller 37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3.1 DMA Channel Control Register (DMA_CCR) 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.4 I2C Interface 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5 Configurable External Buses 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.1 External Bus Selection Register 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.2 Parallel Port 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.3 Parallel Port Signal Routing 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.5.4 Serial Ports 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6 General-Purpose Input/Output (GPIO) Ports 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6.1 Dedicated General-Purpose I/O 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6.2 Address Bus General-Purpose I/O 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.6.3 EHPI General-Purpose I/O 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.7 System Register 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.8 Memory-Mapped Registers 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.9 Peripheral Register Description 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10 Interrupts 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10.1 IFR and IER Registers 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10.2 Interrupt Timing 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10.3 Waking Up From IDLE Condition 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.10.4 Idling Clock Domain When External Parallel Bus Operating in EHPI Mode 68. . . . . .

4 Documentation Support 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.1 Device and Development Tool Support Nomenclature 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4.2 TMS320VC5509 Device Nomenclature 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

i" TEXAS INSTRUMENTS

Contents

6April 2001 − Revised January 2004SPRS163F

Section Page

5 Electrical Specifications 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.1 Absolute Maximum Ratings 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2 Recommended Operating Conditions 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.3 Electrical Characteristics Over Recommended Operating Case Temperature Range 74. . . . . . .

5.4 Package Thermal Resistance Characteristics 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.5 Timing Parameter Symbology 76. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6 Clock Options 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6.1 Internal System Oscillator With External Crystal 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6.2 Layout Considerations 78. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.6.3 Clock Generation in Bypass Mode (DPLL Disabled) 78. . . . . . . . . . . . . . . . . . . . . . . . . .

5.6.4 Clock Generation in Lock Mode (DPLL Synthesis Enabled) 79. . . . . . . . . . . . . . . . . . .

5.6.5 Real-Time Clock Oscillator With External Crystal 80. . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.7 Memory Interface Timings 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.7.1 Asynchronous Memory Timings 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.7.2 Synchronous DRAM (SDRAM) Timings 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.8 Reset Timings 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.8.1 Power-Up Reset (On-Chip Oscillator Active) 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.8.2 Power-Up Reset (On-Chip Oscillator Inactive) 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.8.3 Warm Reset 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.9 External Interrupt Timings 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.10 Wake-Up From IDLE 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.11 XF Timings 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.12 General-Purpose Input/Output (GPIOx) Timings 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.13 TIN/TOUT Timings (Timer0 Only) 97. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.14 Multichannel Buffered Serial Port (McBSP) Timings 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.14.1 McBSP Transmit and Receive Timings 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.14.2 McBSP General-Purpose I/O Timings 101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.14.3 McBSP as SPI Master or Slave Timings 102. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.15 Enhanced Host-Port Interface (EHPI) Timings 106. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.16 I2C Timings 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.17 MultiMedia Card (MMC) Timings 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.18 Secure Digital (SD) Card Timings 115. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.19 Universal Serial Bus (USB) Timings 116. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.20 ADC Timings 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6 Mechanical Data 119. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.1 Ball Grid Array Mechanical Data 119. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6.2 Low-Profile Quad Flatpack Mechanical Data 120. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

*9 TEXAS INSTRUMENTS

Figures

April 2001 − Revised January 2004 SPRS163F

List of Figures

Figure Page

2−1 179-Terminal GHH Ball Grid Array (Bottom View) 13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−2 144-Pin PGE Low-Profile Quad Flatpack (Top View) 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1 Block Diagram of the TMS320VC5509 30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2 Secure ROM 32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−3 TMS320VC5509 Memory Map (PGE Package) 34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−4 TMS320VC5509 Memory Map (GHH Package) 35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−5 DMA_CCR Bit Locations 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−6 External Bus Selection Register 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−7 Parallel Port Signal Routing 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−8 Parallel Port (EMIF) Signal Interface 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−9 I/O Direction Register (IODIR) Bit Layout 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−10 I/O Data Register (IODATA) Bit Layout 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−11 Address/GPIO Enable Register (AGPIOEN) Bit Layout 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−12 Address/GPIO Direction Register (AGPIODIR) Bit Layout 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−13 Address/GPIO Data Register (AGPIODATA) Bit Layout 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−14 EHPI GPIO Enable Register (EHPIGPIOEN) Bit Layout 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−15 EHPI GPIO Direction Register (EHPIGPIODIR) Bit Layout 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−16 EHPI GPIO Data Register (EHPIGPIODATA) Bit Layout 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−17 IFR0 and IER0 Bit Locations 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−18 IFR1 and IER1 Bit Locations 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

4−1 Device Nomenclature for the TMS320VC5509 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−1 3.3-V Test Load Circuit 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−2 Internal System Oscillator With External Crystal 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−3 Bypass Mode Clock Timings 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−4 External Multiply-by-N Clock Timings 80. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−5 Real-Time Clock Oscillator With External Crystal 80. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−6 Asynchronous Memory Read Timings 82. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−7 Asynchronous Memory Write Timings 83. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−8 Three SDRAM Read Commands 86. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−9 Three SDRAM WRT Commands 87. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−10 SDRAM ACTV Command 88. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−11 SDRAM DCAB Command 89. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−12 SDRAM REFR Command 90. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−13 SDRAM MRS Command 91. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−14 Power-Up Reset (On-Chip Oscillator Active) Timings 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−15 Power-Up Reset (On-Chip Oscillator Inactive) Timings 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−16 Reset Timings 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

i" TEXAS INSTRUMENTS

Figures

8April 2001 − Revised January 2004SPRS163F

Figure Page

5−17 External Interrupt Timings 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−18 Wake-Up From IDLE Timings 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−19 XF Timings 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−20 General-Purpose Input/Output (IOx) Signal Timings 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−21 TIN/TOUT Timings When Configured as Inputs 97. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−22 TIN/TOUT Timings When Configured as Outputs 97. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−23 McBSP Receive Timings 100. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−24 McBSP Transmit Timings 100. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−25 McBSP General-Purpose I/O Timings 101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−26 McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 102. . . . . . . . . . . . . . . . . . . . . . .

5−27 McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 103. . . . . . . . . . . . . . . . . . . . . . .

5−28 McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 104. . . . . . . . . . . . . . . . . . . . . . .

5−29 McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 105. . . . . . . . . . . . . . . . . . . . . . .

5−30 EHPI Nonmultiplexed Read/Write Timings 107. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−31 EHPI Multiplexed Memory (HPID) Access Read/Write Timings Without Autoincrement 108. . . . . . . . .

5−32 EHPI Multiplexed Memory (HPID) Access Read Timings With Autoincrement 109. . . . . . . . . . . . . . . . .

5−33 EHPI Multiplexed Memory (HPID) Access Write Timings With Autoincrement 110. . . . . . . . . . . . . . . . .

5−34 EHPI Multiplexed Register Access Read/Write Timings 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−35 I2C Receive Timings 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−36 I2C Transmit Timings 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−37 MultiMedia Card (MMC) Timings 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−38 Secure Digital (SD) Timings 115. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−39 USB Timings 116. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−40 Full-Speed Loads 117. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

6−1 TMS320VC5509 179-Ball MicroStar BGA Plastic Ball Grid Array Package 119. . . . . . . . . . . . . . . . . . .

6−2 TMS320VC5509 144-Pin Low-Profile Quad Flatpack 120. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

*9 TEXAS INSTRUMENTS

Tables

April 2001 − Revised January 2004 SPRS163F

List of Tables

Table Page

2−1 Pin Assignments for the GHH Package 14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−2 Pin Assignments for the PGE Package 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−3 Signal Descriptions 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1 DARAM Blocks 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2 SARAM Blocks 31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−3 Boot Configuration Summary 36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−4 Synchronization Control Function 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−5 External Bus Selection Register Bit Field Description 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−6 TMS320VC5509 Parallel Port Signal Routing 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−7 TMS320VC5509 Serial Port1 Signal Routing 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−8 TMS320VC5509 Serial Port2 Signal Routing 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−9 I/O Direction Register (IODIR) Bit Functions 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−10 I/O Data Register (IODATA) Bit Functions 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−11 Address/GPIO Enable Register (AGPIOEN) Bit Functions 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−12 Address/GPIO Direction Register (AGPIODIR) Bit Functions 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−13 Address/GPIO Data Register (AGPIODATA) Bit Functions 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−14 EHPI GPIO Enable Register (EHPIGPIOEN) Bit Functions 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−15 EHPI GPIO Direction Register (EHPIGPIODIR) Bit Functions 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−16 EHPI GPIO Data Register (EHPIGPIODATA) Bit Functions 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−17 CPU Memory-Mapped Registers 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−18 Idle Control, Status, and System Registers 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−19 External Memory Interface Registers 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−20 DMA Configuration Registers 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−21 Real-Time Clock Registers 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−22 Clock Generator 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−23 Timers 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−24 Multichannel Serial Port #0 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−25 Multichannel Serial Port #1 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−26 Multichannel Serial Port #2 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−27 GPIO 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−28 Device Revision ID 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−29 I2C Module Registers 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−30 Watchdog Timer Registers 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−31 MMC/SD1 Module Registers 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−32 MMC/SD2 Module Registers 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−33 USB Module Registers 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−34 Analog-to-Digital Controller (ADC) Registers 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−35 External Bus Selection Register 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−36 Secure ROM Register 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−37 Interrupt Table 65. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−38 IFR0 and IER0 Register Bit Fields 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−39 IFR1 and IER1 Register Bit Fields 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

i" TEXAS INSTRUMENTS

Tables

10 April 2001 − Revised January 2004SPRS163F

Table Page

5−1 Thermal Resistance Characteristics 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−2 Recommended Crystal Parameters 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−3 CLKIN Timing Requirements 78. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−4 CLKOUT Switching Characteristics 78. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−5 Multiply-By-N Clock Option Timing Requirements 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−6 Multiply-By-N Clock Option Switching Characteristics 79. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−7 Asynchronous Memory Cycle Timing Requirements 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−8 Asynchronous Memory Cycle Switching Characteristics 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−9 Synchronous DRAM Cycle Timing Requirements

[SDRAM Clock = 1X, (1/4)X, and (1/8)X of CPU Clock] 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−10 Synchronous DRAM Cycle Switching Characteristics

[SDRAM Clock = 1X, (1/4)X, and (1/8)X of CPU Clock] 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−11 Synchronous DRAM Cycle Timing Requirements [SDRAM Clock = (1/2)X of CPU Clock] 85. . . . . .

5−12 Synchronous DRAM Cycle Switching Characteristics [SDRAM Clock = (1/2)X of CPU Clock] 85. .

5−13 Power-Up Reset (On-Chip Oscillator Active) Timing Requirements 92. . . . . . . . . . . . . . . . . . . . . . . . .

5−14 Power-Up Reset (On-Chip Oscillator Inactive) Timing Requirements 92. . . . . . . . . . . . . . . . . . . . . . . .

5−15 Power-Up Reset (On-Chip Oscillator Inactive) Switching Characteristics 92. . . . . . . . . . . . . . . . . . . .

5−16 Reset Timing Requirements 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−17 Reset Switching Characteristics 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−18 External Interrupt Timing Requirements 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−19 Wake-Up From IDLE Switching Characteristics 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−20 XF Switching Characteristics 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−21 GPIO Pins Configured as Inputs Timing Requirements 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−22 GPIO Pins Configured as Outputs Switching Characteristics 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−23 TIN/TOUT Pins Configured as Inputs Timing Requirements 97. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−24 TIN/TOUT Pins Configured as Outputs Switching Characteristics 97. . . . . . . . . . . . . . . . . . . . . . . . . .

5−25 McBSP Transmit and Receive Timing Requirements 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−26 McBSP Transmit and Receive Switching Characteristics 99. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−27 McBSP General-Purpose I/O Timing Requirements 101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−28 McBSP General-Purpose I/O Switching Characteristics 101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−29 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) 102. . . . . . . . . .

5−30 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0) 102. . . . . .

5−31 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) 103. . . . . . . . . .

5−32 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0) 103. . . . . . .

5−33 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) 104. . . . . . . . . .

5−34 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1) 104. . . . . .

5−35 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) 105. . . . . . . . . .

5−36 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) 105. . . . . . .

5−37 EHPI Timing Requirements 106. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−38 EHPI Switching Characteristics 106. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−39 I2C Signals (SDA and SCL) Timing Requirements 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−40 I2C Signals (SDA and SCL) Switching Characteristics 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−41 MultiMedia Card (MMC) Timing Requirements 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−42 MultiMedia Card (MMC) Switching Characteristics 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−43 Secure Digital (SD) Card Timing Requirements 115. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−44 Secure Digital (SD) Card Switching Characteristics 115. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−45 Universal Serial Bus (USB) Characteristics 116. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5−46 ADC Characteristics 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

*4? TEXAS INSTRUMENTS

Features

April 2001 − Revised January 2004 SPRS163F

1 TMS320VC5509 Features

DHigh-Performance, Low-Power, Fixed-Point

TMS320C55x Digital Signal Processor

− 6.94-ns Instruction Cycle Time for

144-MHz Clock Rate at 1.6 V

− One/Two Instruction(s) Executed per

Cycle

− Dual Multipliers [Up to 288 Million

Multiply-Accumulates per Second

(MMACS)]

− Two Arithmetic/Logic Units (ALUs)

− Three Internal Data/Operand Read Buses

and Two Internal Data/Operand Write

Buses

D128K x 16-Bit On-Chip RAM, Composed of:

− 64K Bytes of Dual-Access RAM (DARAM)

8 Blocks of 4K × 16-Bit

− 192K Bytes of Single-Access RAM

(SARAM) 24 Blocks of 4K × 16-Bit

D64K Bytes of One-Wait-State On-Chip ROM

(32K × 16-Bit)

D8M × 16-Bit Maximum Addressable External

Memory Space (Synchronous DRAM)

D16-Bit External Parallel Bus Memory

Supporting Either:

− External Memory Interface (EMIF) With

GPIO Capabilities and Glueless Interface

to:

− Asynchronous Static RAM (SRAM)

− Asynchronous EPROM

− Synchronous DRAM (SDRAM)

− 16-Bit Parallel Enhanced Host-Port

Interface (EHPI) With GPIO Capabilities

DProgrammable Low-Power Control of Six

Device Functional Domains

DOn-Chip Scan-Based Emulation Logic

DOn-Chip Peripherals

− Two 20-Bit Timers

− Watchdog Timer

− Six-Channel Direct Memory Access

(DMA) Controller

− Three Serial Ports Supporting a

Combination of:

− Up to 3 Multichannel Buffered Serial

Ports (McBSPs)

− Up to 2 MultiMedia/Secure Digital Card

Interfaces

− Programmable Digital Phase-Locked

Loop (DPLL) Clock Generator

− Seven (LQFP) or Eight (BGA) General-

Purpose I/O (GPIO) Pins and a General-

Purpose Output Pin (XF)

− USB Full-Speed (12 Mbps) Slave Port

Supporting Bulk, Interrupt and

Isochronous Transfers

− Inter-Integrated Circuit (I2C) Multi-Master

and Slave Interface

− Real-Time Clock (RTC) With Crystal

Input, Separate Clock Domain, Separate

Power Supply

− 4-Channel (BGA) or 2-Channel (LQFP)

10-Bit Successive Approximation A/D

DIEEE Std 1149.1† (JTAG) Boundary Scan

Logic

DPackages:

− 144-Terminal Low-Profile Quad Flatpack

(LQFP) (PGE Suffix)

− 179-Terminal MicroStar BGA (Ball Grid

Array) (GHH Suffix)

D2.7-V – 3.6-V I/O Supply Voltage

D1.6-V Core Supply Voltage

All trademarks are the property of their respective owners.

TMS320C55x and MicroStar BGA are trademarks of Texas Instruments.

†IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.

*9 TEXAS INSTRUMENTS

Introduction

12 April 2001 − Revised January 2004SPRS163F

2 Introduction

This section describes the main features of the TMS320VC5509, lists the pin assignments, and describes the

function of each pin. This data manual also provides a detailed description section, electrical specifications,

parameter measurement information, and mechanical data about the available packaging.

NOTE: This data manual is designed to be used in conjunction with theTMS320C55x DSP Functional

Overview (literature number SPRU312), the TMS320C55x DSP CPU Reference Guide (literature

number SPRU371), and the TMS320C55x DSP Peripherals Overview Reference Guide (literature

number SPRU317).

2.1 Description

The TMS320VC5509 fixed-point digital signal processor (DSP) is based on the TMS320C55x DSP generation

CPU processor core. The C55x DSP architecture achieves high performance and low power through

increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal bus

structure that is composed of one program bus, three data read buses, two data write buses, and additional

buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to three data

reads and two data writes in a single cycle. In parallel, the DMA controller can perform up to two data transfers

per cycle independent of the CPU activity.

The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication

in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of

the ALUs is under instruction set control, providing the ability to optimize parallel activity and power

consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU.

The C55x DSP generation supports a variable byte width instruction set for improved code density. The

Instruction Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions

for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to AU and DU resources,

and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution

of conditional instructions.

The general-purpose input and output functions and the10-bit A/D provide sufficient pins for status, interrupts,

and bit I/O for LCDs, keyboards, and media interfaces. The parallel interface operates in two modes, either

as a slave to a microcontroller using the HPI port or as a parallel media interface using the asynchronous EMIF.

Serial media is supported through two MultiMedia Card/Secure Digital (MMC/SD) peripherals and three

McBSPs.

The 5509 peripheral set includes an external memory interface (EMIF) that provides glueless access to

asynchronous memories like EPROM and SRAM, as well as to high-speed, high-density memories such as

synchronous DRAM. Additional peripherals include Universal Serial Bus (USB), real-time clock, watchdog

timer, I2C multi-master and slave interface, and a unique device ID. Three full-duplex multichannel buffered

serial ports (McBSPs) provide glueless interface to a variety of industry-standard serial devices, and

multichannel communication with up to 128 separately enabled channels. The enhanced host-port interface

(HPI) is a 16-bit parallel interface used to provide host processor access to 32K bytes of internal memory on

the 5509. The HPI can be configured in either multiplexed or non-multiplexed mode to provide glueless

interface to a wide variety of host processors. The DMA controller provides data movement for six independent

channel contexts without CPU intervention, providing DMA throughput of up to two 16-bit words per cycle. Two

general-purpose timers, up to eight dedicated general-purpose I/O (GPIO) pins, and digital phase-locked loop

(DPLL) clock generation are also included.

The 5509 is supported by the industry’s award-winning eXpressDSP, Code Composer Studio Integrated

Development Environment (IDE), DSP/BIOS, Texas Instruments’ algorithm standard, and the industry’s

largest third-party network. The Code Composer Studio IDE features code generation tools including a

C Compiler and Visual Linker, simulator, RTDX, XDS510 emulation device drivers, and evaluation

modules. The 5509 is also supported by the C55x DSP Library which features more than 50 foundational

software kernels (FIR filters, IIR filters, FFTs, and various math functions) as well as chip and board support

libraries.

C55x, eXpressDSP, Code Composer Studio, DSP/BIOS, RTDX, and XDS510 are trademarks of Texas Instruments.

OO 00000000000 0 00000000000000 00000000000000 00000000000000 00000000000000 00000 00000 00000 00000 00000 00000 00000 00000 00000000000000 00000000000000 00000000000000 00000000000000 OOOOOOOOOOOOO INSTRUMENTS *9 TEXAS

Introduction

April 2001 − Revised January 2004 SPRS163F

The TMS320C55x DSP core was created with an open architecture that allows the addition of

application-specific hardware to boost performance on specific algorithms. The hardware extensions on the

5509 strike the perfect balance of fixed function performance with programmable flexibility, while achieving

low-power consumption, and cost that traditionally has been difficult to find in the video-processor market. The

extensions allow the 5509 to deliver exceptional video codec performance with more than half its bandwidth

available for performing additional functions such as color space conversion, user-interface operations,

security, TCP/IP, voice recognition, and text-to-speech conversion. As a result, a single 5509 DSP can power

most portable digital video applications with processing headroom to spare. For more information, see the

TMS320C55x Hardware Extensions for Image/Video Applications Programmer’s Reference (literature

number SPRU098). For more information on using the the DSP Image Processing Library, see the

TMS320C55x Image/Video Processing Library Programmer’s Reference (literature number SPRU037).

2.2 Pin Assignments

Figure 2−1 illustrates the ball locations for the 179-pin ball grid array (BGA) package and is used in conjunction

with Table 2−1 to locate signal names and ball grid numbers. DVDD is the power supply for the I/O pins while

CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and the core CPU.

2.2.1 Terminal Assignments for the GHH Package

1412 1310 118 9

5634

Figure 2−1. 179-Terminal GHH Ball Grid Array (Bottom View)

*9 TEXAS INSTRUMENTS

Introduction

14 April 2001 − Revised January 2004SPRS163F

Table 2−1. Pin Assignments for the GHH Package

BALL # SIGNAL

NAME BALL # SIGNAL

NAME

A2 VSS D5 GPIO5 H2 DVDD L13 D15

A3 GPIO4 D6 DR0 H3 A19 L14 CVDD

A4 DVDD D7 S10 H4 C4 M1 C10

A5 FSR0 D8 S11 H5 C5 M2 C13

A6 CVDD D9 DVDD H10 DVDD M3 VSS

A7 S12 D10 S25 H11 A’[0] M4 CVDD

A8 DVDD D11 VSS H12 RESET M5 VSS

A9 S20 D12 AIN2 H13 SDA M6 A5

A10 S21 D13 AIN1 H14 SCL M7 A1

A11 S23 D14 AIN0 J1 C6 M8 A15

A12 RTCINX1 E1 GPIO1 J2 DVDD M9 D3

A13 RDVDD E2 GPIO2 J3 C7 M10 D6

A14 RDVDD E3 DVDD J4 C8 M11 CVDD

B1 VSS E4 VSS J5 CVDD M12 DVDD

B2 CVDD E5 VSS J10 RVDD M13 VSS

B3 GPIO3 E6 DVDD J11 CVDD M14 D12

B4 TIN/TOUT0 E7 DX0 J12 TRST N1 VSS

B5 CLKR0 E8 S15 J13 TCK N2 VSS

B6 FSX0 E9 S13 J14 TMS N3 A13

B7 CVDD E10 NC K1 A18 N4 A10

B8 CVDD E11 AIN3 K2 C9 N5 A7

B9 VSS E12 ADVSS K3 C11 N6 DVDD

B10 S24 E13 VSS K4 VSS N7 RVDD

B11 VSS E14 XF K5 VSS N8 CVDD

B12 RTCINX2 F1 X1 K6 A3 N9 VSS

B13 RDVDD F2 X2/CLKIN K7 A2 N10 VSS

B14 AVSS F3 GPIO0 K8 D1 N11 D8

C1 PU F4 VSS K9 A14 N12 D11

C2 VSS F5 CLKOUT K10 DVDD N13 DVDD

C3 NC F10 ADVDD K11 EMU0 N14 VSS

C4 GPIO6 F11 VSS K12 EMU1/OFF P1 VSS

C5 VSS F12 INT4 K13 TDO P2 VSS

C6 CLKX0 F13 DVDD K14 TDI P3 A12

C7 VSS F14 INT3 L1 RVDD P4 A9

C8 S14 G1 CVDD L2 C14 P5 A17

C9 S22 G2 C1 L3 C12 P6 A4

C10 CVDD G3 A20 L4 A11 P7 A16

C11 VSS G4 C2 L5 A8 P8 DVDD

C12 RCVDD G5 C0 L6 A6 P9 D2

C13 AVSS G10 INT2 L7 A0 P10 D5

C14 AVDD G11 CVDD L8 D0 P11 D7

D1 GPIO7 G12 VSS L9 D4 P12 D10

D2 USBVDD G13 INT1 L10 D9 P13 DVDD

D3 DN G14 INT0 L11 D13 P14 DVDD

D4 DP H1 C3 L12 D14

‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

2.2.2 Pin Assignments for the PGE Package

The TMS320VC5509PGE 144-pin low-profile quad flatpack (LQFP) pin assignments are shown in Figure 2−2

and is used in conjunction with Table 2−2 to locate signal names and pin numbers. DVDD is the power supply

for the I/O pins while CVDD is the power supply for the core CPU. VSS is the ground for both the I/O pins and

the core CPU.

108

109

144

Figure 2−2. 144-Pin PGE Low-Profile Quad Flatpack (Top View)

*9 TEXAS INSTRUMENTS

Introduction

16 April 2001 − Revised January 2004SPRS163F

Table 2−2. Pin Assignments for the PGE Package

PIN NO. SIGNAL NAME PIN NO. SIGNAL NAME PIN NO. SIGNAL NAME PIN NO. SIGNAL NAME

1 VSS 37 VSS 73 VSS 109 RDVDD

2 PU 38 A13 74 D12 110 RCVDD

3 DP 39 A12 75 D13 111 RTCINX2

4 DN 40 A11 76 D14 112 RTCINX1

5 USBVDD 41 CVDD 77 D15 113 VSS

6 GPIO7 42 A10 78 CVDD 114 VSS

7 VSS 43 A9 79 EMU0 115 VSS

8 DVDD 44 A8 80 EMU1/OFF 116 S23

9 GPIO2 45 VSS 81 TDO 117 S25

10 GPIO1 46 A7 82 TDI 118 CVDD

11 VSS 47 A6 83 CVDD 119 S24

12 GPIO0 48 A5 84 TRST 120 S21

13 X2/CLKIN 49 DVDD 85 TCK 121 S22

14 X1 50 A4 86 TMS 122 VSS

15 CLKOUT 51 A3 87 RVDD 123 S20

16 C0 52 A2 88 DVDD 124 S13

17 C1 53 RVDD 89 SDA 125 S15

18 CVDD 54 A1 90 SCL 126 DVDD

19 C2 55 A0 91 RESET 127 S14

20 C3 56 DVDD 92 VSS 128 S11

21 C4 57 D0 93 INT0 129 S12

22 C5 58 D1 94 INT1 130 S10

23 C6 59 D2 95 CVDD 131 DX0

24 DVDD 60 VSS 96 INT2 132 CVDD

25 C7 61 D3 97 INT3 133 FSX0

26 C8 62 D4 98 DVDD 134 CLKX0

27 C9 63 D5 99 INT4 135 DR0

28 C11 64 VSS 100 VSS 136 FSR0

29 CVDD 65 D6 101 XF 137 CLKR0

30 RVDD 66 D7 102 VSS 138 VSS

31 C14 67 D8 103 ADVSS 139 DVDD

32 C12 68 CVDD 104 ADVDD 140 TIN/TOUT0

33 VSS 69 D9 105 AIN0 141 GPIO6

34 C10 70 D10 106 AIN1 142 GPIO4

35 C13 71 D11 107 AVDD 143 GPIO3

36 VSS 72 DVDD 108 AVSS 144 VSS

‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

2.3 Signal Descriptions

Table 2−3 lists each signal, function, and operating mode(s) grouped by function. See Section 2.2 for pin

locations based on package type.

Table 2−3. Signal Descriptions

TERMINAL

NAME MULTIPLEXED

SIGNAL NAME I/O/Z†FUNCTION BK‡RESET

CONDITION

PARALLEL BUS

A[13:0] I/O/Z

A subset of the parallel address bus A13−A0 of the C55x DSP core

bonded to external pins. These pins serve in one of three functions: HPI

address bus (HPI.HA[13:0]), EMIF address bus (EMIF.A[13:0]), or

general-purpose I/O (GPIO.A[13:0]). The initial state of these pins

depends on the GPIO0 pin. See Section 3.5.1 for more information.

The address bus has a bus holder feature that eliminates passive

component requirement and the power dissipation associated with them.

The bus holders keep the address bus at the previous logic level when the

bus goes into a high-impedance state.

GPIO0 = 1:

HPI.HA[13:0] I

HPI address bus. HPI.HA[13:0] is selected when the Parallel Port Mode bit

field of the External Bus Selection Register is 10. This setting enables the

HPI in non-multiplexed mode.

HPI.HA[13:0] provides DSP internal memory access to host. In

non-multiplexed mode, these signals are driven by an external host as

address lines.

GPIO0 = 1:

Output,

EMIF.A[13:0]

GPIO0 = 0:

EMIF.A[13:0] O/Z

EMIF address bus. EMIF.A[13:0] is selected when the Parallel Port Mode

bit field of the External Bus Selection Register is 01. This setting enables

the full EMIF mode and the EMIF drives the parallel port address bus. The

internal A[14] address is exclusive-ORed with internal A[0] address and

the result is routed to the A[0] pin.

Input,

HPI.HA[13:0]

GPIO.A[13:0] I/O/Z

General-purpose I/O address bus. GPIO.A[13:0] is selected when the

Parallel Port Mode bit field of the External Bus Selection Register is 11.

This setting enables the HPI in multiplexed mode with the Parallel Port

GPIO register controlling the parallel port address bus. GPIO is also

selected when the Parallel Port Mode bit field is 00, enabling the Data

EMIF mode.

A′[0]

(BGA only) EMIF.A′[0] O/Z EMIF address bus A′[0]. This pin is not multiplexed with EMIF.A[14] and is

used as the least significant external address pin on the BGA package. Output

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

BK GPIO.A[15,14] HPLHnusm *9 TEXAS INSTRUMENTS

Introduction

18 April 2001 − Revised January 2004SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

PARALLEL BUS (CONTINUED)

A[15:14]

(BGA only) I/O/Z

A subset of the parallel address bus A15−A14 of the C55x DSP core

bonded to external pins. These pins serve in one of two functions: EMIF

address bus (EMIF.A[15:14]), or general-purpose I/O (GPIO.A[15:14]).

The initial state of these pins depends on the GPIO0 pin. See Section 3.5.1

for more information.

The address bus has a bus holder feature that eliminates passive

component requirement and the power dissipation associated with them.

The bus holders keep the address bus at the previous logic level when the

bus goes into a high-impedance state.

GPIO0 = 1:

Output,

EMIF.A[15:14]

EMIF.A[15:14] O/Z

EMIF address bus. EMIF.A[15:14] is selected when the Parallel Port Mode

bit field of the External Bus Selection Register is 01. This setting enables

the full EMIF mode and the EMIF drives the parallel port address bus.

GPIO0 = 0:

Input,

GPIO.A[15:14]

GPIO.A[15:14] I/O/Z

General-purpose I/O address bus. GPIO.A[15:14] is selected when the

Parallel Port Mode bit field of the External Bus Selection Register is 11.

This setting enables the HPI in multiplexed mode with the Parallel Port

GPIO register controlling the parallel port address bus. GPIO is also

selected when the Parallel Port Mode bit field is 00, enabling the Data

EMIF mode.

GPIO.A[15:14]

A[20:16]

(BGA only) EMIF.A[20:16] O/Z

EMIF address bus. At reset, these address pins are set as output.

NOTE: These pins only function as EMIF address pins and they are not

multiplexed for any other function.

Output

D[15:0] I/O/Z

A subset of the parallel bidirectional data bus D31−D0 of the C55xDSP

core. These pins serve in one of two functions: EMIF data bus

(EMIF.D[15:0]) or HPI data bus (HPI.HD[15:0]). The initial state of these

pins depends on the GPIO0 pin. See Section 3.5.1 for more information.

The data bus includes bus keepers to reduce the static power dissipation

caused by floating, unused pins. This eliminates the need for external bias

resistors on unused pins. When the data bus is not being driven by the

CPU, the bus keepers keep the pins at the logic level that was most

recently driven. (The data bus keepers are disabled at reset, and can be

enabled/disabled under software control.)

GPIO0 = 1:

Input,

EMIF.D[15:0]

GPIO0 = 0:

Input,

HPI.HD[15:0]

EMIF.D[15:0] I/O/Z EMIF data bus. EMIF.D[15:0] is selected when the Parallel Port Mode bit

field of the External Bus Selection Register is 00 or 01.

HPI.HD[15:0]

HPI.HD[15:0] I/O/Z HPI data bus. HPI.HD[15:0] is selected when the Parallel Port Mode bit

field of the External Bus Selection Register is 10 or 11.

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

EMIFKR‘E Input» EMlF‘A‘O‘E Output. Input, ‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

PARALLEL BUS (CONTINUED)

C0 I/O/Z

EMIF asynchronous memory read enable or general-purpose IO8. This

pin serves in one of two functions: EMIF asynchronous memory read

enable (EMIF.ARE) or general-purpose IO8 (GPIO8). The initial state of

this pin depends on the GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.ARE

EMIF.ARE O/Z

Active-low EMIF asynchronous memory read enable. EMIF.ARE is

selected when the Parallel Port Mode bit field of the External Bus Selection

EMIF.ARE

GPIO0 = 0:

Input,

GPIO8 I/O/Z General-purpose IO8. GPIO8 is selected when the Parallel Port Mode bit

field of the External Bus Selection Register is set to 10 or 11.

Input,

GPIO8

C1 O/Z

EMIF asynchronous memory output enable or HPI interrupt output. This

pin serves in one of two functions: EMIF asynchronous memory output

enable (EMIF.AOE) or HPI interrupt output (HPI.HINT). The initial state of

this pin depends on the GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.AOE

EMIF.AOE O/Z

Active-low asynchronous memory output enable. EMIF.AOE is selected

when the Parallel Port Mode bit field of the External Bus Selection Register

is 00 or 01.

EMIF.AOE

GPIO0 = 0:

Output,

HPI.HINT O/Z Active-low HPI interrupt output. HPI.HINT is selected when the Parallel

Port Mode bit field of the External Bus Selection Register is 10 or 11.

Output,

HPI.HINT

C2 I/O/Z

EMIF asynchronous memory write enable or HPI read/write. This pin

serves in one of two functions: EMIF asynchronous memory write enable

(EMIF.AWE) or HPI read/write (HPI.HR/W). The initial state of this pin

depends on the GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.AWE

EMIF.AWE O/Z

Active-low EMIF asynchronous memory write enable. EMIF.AWE is

selected when the Parallel Port Mode bit field of the External Bus Selection

EMIF.AWE

GPIO0 = 0:

Input,

HPI.HR/W I

HPI read/write. HPI.HR/W is selected when the Parallel Port Mode bit field

of the External Bus Selection Register is 10 or 11. HPI.HR/W controls the

direction of the HPI transfer.

Input,

HPI.HR/W

C3 I/O/Z

EMIF data ready input or HPI ready output. This pin serves in one of two

functions: EMIF data ready input (EMIF.ARDY) or HPI ready output

(HPI.HRDY). The initial state of this pin depends on the GPIO0 pin. See

Section 3.5.1 for more information. GPIO0 = 1:

Input,

EMIF.ARDY I

EMIF data ready input. Used to insert wait states for slow memories.

EMIF.ARDY is selected when the Parallel Port Mode bit field of the

External Bus Selection Register is 00 or 01.

NOTE: With the buskeeper being active after reset, a strong 2.2K pullup is

necessary on this signal.

Input,

EMIF.ARDY

GPIO0 = 0:

Output,

HPI.HRDY

HPI.HRDY O/Z HPI ready output. HPI.HRDY is selected when the Parallel Port Mode bit

field of the External Bus Selection Register is 10 or 11.

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

EMIFCEU Input. EMIFCET Input» OuIDu‘. GPIOO : U, ompul, GPIOO : 0. HPI.HCNTL1 *9 TEXAS INSTRUMENTS

Introduction

20 April 2001 − Revised January 2004SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

PARALLEL BUS (CONTINUED)

C4 I/O/Z

EMIF chip select for memory space CE0 or general-purpose IO9. This pin

serves in one of two functions: EMIF chip select for memory space CE0

(EMIF.CE0) or general-purpose IO9 (GPIO9). The initial state of this pin

depends on the GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.CE0

EMIF.CE0 O/Z

Active-low EMIF chip select for memory space CE0. EMIF.CE0 is selected

when the Parallel Port Mode bit field of the External Bus Selection Register

is set to 00 or 01.

EMIF.CE0

GPIO0 = 0:

Input,

GPIO9 I/O/Z General-purpose IO9. GPIO9 is selected when the Parallel Port Mode bit

field of the External Bus Selection Register is set to 10 or 11.

Input,

GPIO9

C5 I/O/Z

EMIF chip select for memory space CE1 or general-purpose IO10. This pin

serves in one of two functions: EMIF chip-select for memory space CE1

(EMIF.CE1) or general-purpose IO10 (GPIO10). The initial state of this pin

depends on the GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.CE1

EMIF.CE1 O/Z

Active-low EMIF chip select for memory space CE1. EMIF.CE1 is selected

when the Parallel Port Mode bit field of the External Bus Selection Register

is set to 00 or 01.

EMIF.CE1

GPIO0 = 0:

Input,

GPIO10 I/O/Z General-purpose IO10. GPIO10 is selected when the Parallel Port Mode

bit field of the External Bus Selection Register is set to 10 or 11.

Input,

GPIO10

C6 I/O/Z

EMIF chip select for memory space CE2 or HPI control input 0. This pin

serves in one of two functions: EMIF chip-select for memory space CE2

(EMIF.CE2) or HPI control input 0 (HPI.HCNTL0). The initial state of this

pin depends on the GPIO0 pin. See Section 3.5.1 for more information. GPIO0 = 1:

Output,

EMIF.CE2 O/Z

Active-low EMIF chip select for memory space CE2. EMIF.CE2 is selected

when the Parallel Port Mode bit field of the External Bus Selection Register

is set to 00 or 01.

Output,

EMIF.CE2

GPIO0 = 0:

HPI.HCNTL0 I

HPI control input 0. This pin, in conjunction with HPI.HCNTL1, selects a

host access to one of the three HPI registers. HPI.HCNTL0 is selected

when the Parallel Port Mode bit field of the External Bus Selection Register

is set to 10 or 11.

GPIO0 = 0:

Input,

HPI.HCNTL0

C7 I/O/Z

EMIF chip select for memory space CE3, general-purpose IO11, or HPI

control input 1. This pin serves in one of three functions: EMIF chip-select

for memory space CE3 (EMIF.CE3), general-purpose IO11 (GPIO11), or

HPI control input 1 (HPI.HCNTL1). The initial state of this pin depends on

the GPIO0 pin. See Section 3.5.1 for more information. GPIO0 = 1:

Output,

EMIF.CE3 O/Z

Active-low EMIF chip select for memory space CE3. EMIF.CE3 is selected

when the Parallel Port Mode bit field is of the External Bus Selection

Output,

EMIF.CE3

GPIO0 = 0:

GPIO11 I/O/Z General-purpose IO11. GPIO11 is selected when the Parallel Port Mode

bit field is set to 10.

GPIO0 = 0:

Input,

HPI.HCNTL1

HPI.HCNTL1 I

HPI control input 1. This pin, in conjunction with HPI.HCNTL0, selects a

host access to one of the three HPI registers. The HPI.HCNTL1 mode is

selected when the Parallel Port Mode bit field is set to 11.

HPI.HCNTL1

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

EMJFHEE EMJFHET ‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

PARALLEL BUS (CONTINUED)

C8 I/O/Z

EMIF byte enable 0 control or HPI byte identification. This pin serves in one

of two functions: EMIF byte enable 0 control (EMIF.BE0) or HPI byte

identification (HPI.HBE0). The initial state of this pin depends on the

GPIO0 pin. See Section 3.5.1 for more information.

EMIF.BE0 O/Z

Active-low EMIF byte enable 0 control. EMIF.BE0 is selected when the

Parallel Port Mode bit field of the External Bus Selection Register is set to

00 or 01.

GPIO0 = 1:

Output,

EMIF.BE0

HPI.HBE0 I

HPI byte identification. This pin, in conjunction with HPI.HBE1, identifies

the first or second byte of the transfer. HPI.HBE0 is selected when the

Parallel Port Mode bit field is set to 10 or 11.

NOTE: As of Revision 3.1 of the silicon, the byte-enable function on the

HPI will no longer be supported. HPI.HBE0 and HPI.HBE1 must

be pulled down by external resistors or driven low by the host

processor.

EMIF.BE0

GPIO0 = 0:

Input,

HPI.HBE0

C9 I/O/Z

EMIF byte enable 1 control or HPI byte identification. This pin serves in one

of two functions: EMIF byte enable 1 control (EMIF.BE1) or HPI byte

identification (HPI.HBE1). The initial state of this pin depends on the

GPIO0 pin. See Section 3.5.1 for more information.

EMIF.BE1 O/Z

Active-low EMIF byte enable 1 control. EMIF.BE1 is selected when the

Parallel Port Mode bit field of the External Bus Selection Register is set to

00 or 01.

GPIO0 = 1:

Output,

EMIF.BE1

HPI.HBE1 I

HPI byte identification. This pin, in conjunction with HPI.HBE0, identifies

the first or second byte of the transfer. HPI.HBE1 is selected when the

Parallel Port Mode bit field is set to 10 or 11.

NOTE: As of Revision 3.1 of the silicon, the byte-enable function on the

HPI will no longer be supported. HPI.HBE0 and HPI.HBE1 must

be pulled down by external resistors or driven low by the host

processor.

EMIF.BE1

GPIO0 = 0:

Input,

HPI.HBE1

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

Output, GPIOO : 0. EMlFSDWE GPIOO : U, *9 TEXAS INSTRUMENTS

Introduction

22 April 2001 − Revised January 2004SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

PARALLEL BUS (CONTINUED)

C10 I/O/Z

EMIF SDRAM row strobe, HPI address strobe, or general-purpose IO12.

This pin serves in one of three functions: EMIF SDRAM row strobe

(EMIF.SDRAS), HPI address strobe (HPI.HAS), or general-purpose IO12

(GPIO12). The initial state of this pin depends on the GPIO0 pin. See

Section 3.5.1 for more information. GPIO0 = 1:

Output,

EMIF.SDRAS O/Z

Active-low EMIF SDRAM row strobe. EMIF.SDRAS is selected when the

Parallel Port Mode bit field of the External Bus Selection Register is set to

00 or 01. BK

Output,

EMIF.SDRAS

GPIO0 = 0:

HPI.HAS I

Active-low HPI address strobe. This signal latches the address in the HPIA

Parallel Port Mode bit field is set to 11.

GPIO0 = 0:

Input,

HPI.HAS

GPIO12 I/O/Z General-purpose IO12. GPIO12 is selected when the Parallel Port Mode

bit field is set to 10.

C11 I/O/Z

EMIF SDRAM column strobe or HPI chip select input. This pin serves in

one of two functions: EMIF SDRAM column strobe (EMIF.SDCAS) or HPI

chip select input (HPI.HCS). The initial state of this pin depends on the

GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.SDCAS

EMIF.SDCAS O/Z

Active-low EMIF SDRAM column strobe. EMIF.SDCAS is selected when

the Parallel Port Mode bit field of the External Bus Selection Register is set

to 00 or 01.

EMIF.SDCAS

GPIO0 = 0:

Input,

HPI.HCS I

HPI Chip Select Input. HPI.HCS is the select input for the HPI and must be

driven low during accesses. HPI.HCS is selected when the Parallel Port

Mode bit field is set to 10 or 11.

Input,

HPI.HCS

C12 I/O/Z

EMIF SDRAM write enable or HPI Data Strobe 1 input. This pin serves in

one of two functions: EMIF SDRAM write enable (EMIF.SDWE) or HPI

data strobe 1 (HPI.HDS1). The initial state of this pin depends on the

GPIO0 pin. See Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.SDWE

EMIF.SDWE O/Z EMIF SDRAM write enable. EMIF. SDWE is selected when the Parallel

Port Mode bit field of the External Bus Selection Register is set to 00 or 01.

EMIF.SDWE

GPIO0 = 0:

HPI.HDS1 I

HPI Data Strobe 1 Input. HPI.HDS1 is driven by the host read or write

strobes to control the transfer. HPI.HDS1 is selected when the Parallel

Port Mode bit field is set to 10 or 11.

GPIO0 = 0:

Input,

HPI.HDS1

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

EMIF‘CLKMEM Input» ‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

PARALLEL BUS (CONTINUED)

C13 I/O/Z

SDRAM A10 address line or general-purpose IO13. This pin serves in one

of two functions: SDRAM A10 address line (EMIF.SDA10) or

general-purpose IO13 (GPIO13). The initial state of this pin depends on

the GPIO0 pin. See Section 3.5.1 for more information. GPIO0 = 1:

Output,

EMIF.SDA10 O/Z

SDRAM A10 address line. Address line/autoprecharge disable for

SDRAM memory. Serves as a row address bit (logically equivalent to A12)

during ACTV commands and also disables the autoprecharging function

of SDRAM during read or write operations. EMIF.SDA10 is selected when

the Parallel Port Mode bit field of the External Bus Selection Register is set

to 00 or 01.

Output,

EMIF.SDA10

GPIO0 = 0:

Input,

GPIO13

GPIO13 I/O/Z General-purpose IO13. GPIO13 is selected when the Parallel Port Mode

bit field is set to 10 or 11.

C14 I/O/Z

Memory interface clock for SDRAM, HPI Data Strobe 2 input, or

general-purpose IO14. This pin serves in one of two functions: memory

interface clock for SDRAM (EMIF.CLKMEM) or HPI data strobe 2

(HPI.HDS2). The initial state of this pin depends on the GPIO0 pin. See

Section 3.5.1 for more information.

GPIO0 = 1:

Output,

EMIF.CLKMEM

EMIF.CLKMEM O/Z

Memory interface clock for SDRAM. EMIF.CLKMEM is selected when the

Parallel Port Mode bit field of the External Bus Selection Register is set to

00 or 01.

EMIF.CLKMEM

GPIO0 = 0:

Input,

HPI.HDS2 I

HPI Data Strobe 2 Input. HPI.HDS2 is driven by the host read or write

strobes to control the transfer. HPI.HDS2 is selected when the Parallel

Port Mode bit field is set to 10 or 11.

Input,

HPI.HDS2

INTERRUPT AND RESET PINS

INT[4:0] I Active-low external user interrupt inputs. INT[4:0] are maskable and are

prioritized by the interrupt enable register (IER) and the interrupt mode bit. H Input

RESET I

Active-low reset. RESET causes the digital signal processor (DSP) to

terminate execution and forces the program counter to FF8000h. When

RESET is brought to a high level, execution begins at location FF8000h of

program memory. RESET affects various registers and status bits. Use an

external pullup resistor on this pin.

H Input

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

*9 TEXAS INSTRUMENTS

Introduction

24 April 2001 − Revised January 2004SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

BIT I/O SIGNALS

GPIO[7:6,4:0] (LQFP)

GPIO[7:0] (BGA) I/O/Z

7-bit (LQFP package) or 8-bit (BGA package) Input/Output lines that can

be individually configured as inputs or outputs, and also individually set or

reset when configured as outputs. At reset, these pins are configured as

inputs. After reset, the on-chip bootloader sample GPIO[3:0] to determine

the boot mode selected.

(GPIO5

only)

Input

XF O/Z

External flag. XF is set high by the BSET XF instruction, set low by BCLR

XF instruction or by loading ST1. XF is used for signaling other processors

in multiprocessor configurations or used as a general-purpose output pin.

XF goes into the high-impedance state when OFF is low, and is set high

following reset.

Output

OSCILLATOR/CLOCK SIGNALS

CLKOUT O/Z DSP clock output signal. CLKOUT cycles at the machine-cycle rate of the

CPU. CLKOUT goes into high-impedance state when OFF is low. Output

X2/CLKIN I/O

System clock/oscillator input. If the internal oscillator is not being used,

X2/CLKIN functions as the clock input.

NOTE: The USB module requires a 48 MHz clock. Since this input clock

is used by both the CPU PLL and the USB module PLL, it must

be a factor of 48 MHz in order for the programmable PLL to

produce the required 48 MHz USB module clock.

In CLKGEN domain idle (oscillator idle) mode, this pin becomes

output and is driven low to stop external crystals (if used) from

oscillating or an external clock source from driving the DSP’s

internal logic.

Oscillator

Input

X1 O

Output pin from the internal system oscillator for the crystal. If the internal

oscillator is not used, X1 should be left unconnected. X1 does not go into

the high-impedance state when OFF is low.

Oscillator

Output

TIMER SIGNALS

TIN/TOUT0 I/O/Z

Timer0 Input/Output. When output, TIN/TOUT0 signals a pulse or a

change of state when the on-chip timer counts down past zero. When

input, TIN/TOUT0 provides the clock source for the internal timer module.

At reset, this pin is configured as an input.

NOTE: Only the Timer0 signal is brought out. The Timer1 signal is

terminated internally and is not available for external use.

Input

REAL-TIME CLOCK

RTCINX1 I Real-Time Clock Oscillator input Input

RTCINX2 O Real-Time Clock Oscillator output Output

I2C

SDA I/O/Z I2C (bidirectional) data. At reset, this pin is in high-impedance mode. Hi-Z

SCL I/O/Z I2C (bidirectional) clock. At reset, this pin is in high-impedance mode. Hi-Z

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

MULTICHANNEL BUFFERED SERIAL PORTS SIGNALS

CLKR0 I/O/Z McBSP0 receive clock. CLKR0 serves as the serial shift clock for the serial

port receiver. At reset, this pin is in high-impedance mode. H Hi-Z

DR0 I McBSP0 receive data Input

FSR0 I/O/Z McBSP0 receive frame synchronization. The FSR0 pulse initiates the data

receive process over DR0. At reset, this pin is in high-impedance mode. Hi-Z

CLKX0 I/O/Z McBSP0 transmit clock. CLKX0 serves as the serial shift clock for the

serial port transmitter. The CLKX0 pin is configured as input after reset. H Input

DX0 O/Z McBSP0 transmit data. DX0 is placed in the high-impedance state when

not transmitting, when RESET is asserted, or when OFF is low. Hi-Z

FSX0 I/O/Z McBSP0 transmit frame synchronization. The FSX0 pulse initiates the

data transmit process over DX0. Configured as an input following reset. Input

S10 I/O/Z McBSP1 receive clock or MultiMedia Card/Secure Digital1

command/response. At reset, this pin is configured as McBSP1.CLKR.

McBSP1.CLKR I/Z

McBSP1 receive clock. McBSP1.CLKR serves as the serial shift clock for

the serial port receiver. McBSP1.CLKR is selected when the External Bus

Selection Register has 00 in the Serial Port1 Mode bit field or following

reset.

H Input

MMC1.CMD

SD1.CMD I/O/Z MMC1 or SD1 command/response is selected when the External Bus

Selection Register has 10 in the Serial Port1 Mode bit field.

S11 I/O/Z McBSP1 data receive or Secure Digital1 data1. At reset, this pin is

configured as McBSP1.DR.

McBSP1.DR I/Z

McBSP1 serial data receive. McBSP1.DR is selected when the External

Bus Selection Register has 00 in the Serial Port1 Mode bit field or following

reset.

Input

SD1.DAT1 I/O/Z SD1 data1 is selected when the External Bus Selection Register has 10 in

the Serial Port1 Mode bit field.

S12 I/O/Z McBSP1 receive frame synchronization or Secure Digital1 data2. At reset,

this pin is configured as McBSP1.FSR.

McBSP1.FSR I/Z McBSP1 receive frame synchronization. The McBSP1.FSR pulse initiates

the data receive process over McBSP1.DR. Input

SD1.DAT2 I/O/Z SD1 data2 is selected when the External Bus Selection Register has 10 in

the Serial Port1 Mode bit field.

S13 O/Z McBSP1 serial data transmit or MultiMedia Card/Secure Digital1 serial

clock. At reset, this pin is configured as McBSP1.DX.

McBSP1.DX O/Z

McBSP1 serial data transmit. McBSP1.DX is placed in the

high-impedance state when not transmitting, when RESET is asserted, or

when OFF is low. McBSP1.DX is selected when the External Bus

Selection Register has 00 in the Serial Port1 Mode bit field or following

reset.

BK Hi-Z

MMC1.CLK

SD1.CLK OMMC1 or SD1 serial clock is selected when the External Bus Selection

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

*9 TEXAS INSTRUMENTS

Introduction

26 April 2001 − Revised January 2004SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

MULTICHANNEL BUFFERED SERIAL PORTS SIGNALS (CONTINUED)

S14 I/O/Z McBSP1 transmit clock or MultiMedia Card/Secure Digital1 data0. At

reset, this pin is configured as McBSP1.CLKX.

McBSP1.CLKX I/O/Z

McBSP1 transmit clock. McBSP1.CLKX serves as the serial shift clock for

the serial port transmitter. The McBSP1.CLKX pin is configured as input

after reset. McBSP1.CLKX is selected when the External Bus Selection

H Input

MMC1.DAT

SD1.DAT0 I/O/Z MMC1 or SD1 data0 is selected when the External Bus Selection Register

has 10 in the Serial Port1 Mode Bit field.

S15 I/O/Z McBSP1 transmit frame synchronization or Secure Digital1 data3. At

reset, this pin is configured as McBSP1.FSX.

McBSP1.FSX I/O/Z

McBSP1 transmit frame synchronization. The McBSP1.FSX pulse

initiates the data transmit process over McBSP1.DX. Configured as an

input following reset. McBSP1.FSX is selected when the External Bus

Selection Register has 00 in the Serial Port1 Mode bit field or following

reset.

Input

SD1.DAT3 I/O/Z SD1 data3 is selected when the External Bus Selection Register has 10 in

the Serial Port1 Mode bit field.

S20 I/O/Z McBSP2 receive clock or MultiMedia Card/Secure Digital2

command/response. At reset, this pin is configured as McBSP2.CLKR.

McBSP2.CLKR I

McBSP2 receive clock. McBSP2.CLKR serves as the serial shift clock for

the serial port receiver. McBSP2.CLKR is selected when the External Bus

Selection Register has 00 in the Serial Port2 Mode bit field or following

reset.

H Input

MMC2.CMD

SD2.CMD I/O/Z MMC2 or SD2 command/response is selected when the External Bus

Selection Register has 10 in the Serial Port2 Mode bit field.

S21 I/O/Z McBSP2 data receive or Secure Digital2 data1. At reset, this pin is

configured as McBSP2.DR.

McBSP2.DR I

McBSP2 serial data receive. McBSP2.DR is selected when the External

Bus Selection Register has 00 in the Serial Port2 Mode bit field or following

reset.

Input

SD2.DAT1 I/O/Z SD2 data1 is selected when the External Bus Selection Register has 10 in

the Serial Port2 Mode bit field.

S22 I/O/Z McBSP2 receive frame synchronization or Secure Digital2 data2. At reset,

this pin is configured as McBSP2.FSR.

McBSP2.FSR I McBSP2 receive frame synchronization. The McBSP2.FSR pulse initiates

the data receive process over McBSP2.DR. Input

SD2.DAT2 I/O/Z SD2 data2 is selected when the External Bus Selection Register has 10 in

the Serial Port2 Mode bit field.

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

MULTICHANNEL BUFFERED SERIAL PORTS SIGNALS (CONTINUED)

S23 O/Z McBSP2 data transmit or MultiMedia Card/Secure Digital2 serial clock. At

reset, this pin is configured as McBSP2.DX.

McBSP2.DX O/Z

McBSP2 serial data transmit. McBSP2.DX is placed in the

high-impedance state when not transmitting, when RESET is asserted, or

when OFF is low. McBSP2.DX is selected when the External Bus

Selection Register has 00 in the Serial Port2 Mode bit field or following

reset.

BK Hi-Z

MMC2.CLK

SD2.CLK OMMC2 or SD2 serial clock is selected when the External Bus Selection

S24 I/O/Z McBSP2 transmit clock or MultiMedia Card/Secure Digital2 data0. At

reset, this pin is configured as McBSP2.CLKX.

McBSP2.CLKX I/O/Z

McBSP2 transmit clock. McBSP2.CLKX serves as the serial shift clock for

the serial port transmitter. The McBSP2.CLKX pin is configured as input

after reset. McBSP2.CLKX is selected when the External Bus Selection

H Input

MMC2.DAT

SD2.DAT0 I/O/Z MMC2 or SD2 data0 pin is selected when the External Bus Selection

S25 I/O/Z McBSP2 transmit frame synchronization or Secure Digital2 data3. At

reset, this pin is configured as McBSP2.FSX.

McBSP2.FSX I/O/Z

McBSP2 frame synchronization. The McBSP2.FSX pulse initiates the

data transmit process over McBSP2.DX. McBSP2.FSX is configured as

an input following reset. McBSP1.FSX is selected when the External Bus

Selection Register has 00 in the Serial Port2 Mode bit field or following

reset.

Input

SD2.DAT3 I/O/Z SD2 data3 is selected when the External Bus Selection Register has 10 in

the Serial Port2 Mode bit field.

USB

DP I/O/Z Differential (positive) receive/transmit. At reset, this pin is configured as

input. Input

DN I/O/Z Differential (negative) receive/transmit. At reset, this pin is configured as

input. Input

PU O/Z

Pullup output. This pin is used to pull up the detection resistor required by

the USB specification. The pin is internally connected to USBVDD via a

software controllable switch (CONN bit of the USBCTL register).

Output

A/D

AIN0 I Analog Input Channel 0 Input

AIN1 I Analog Input Channel 1 Input

AIN2 (BGA only) IAnalog Input Channel 2. (BGA package only) Input

AIN3 (BGA only) IAnalog Input Channel 3. (BGA package only) Input

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

*9 TEXAS INSTRUMENTS

Introduction

28 April 2001 − Revised January 2004SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

TEST/EMULATION PINS

TCK I

IEEE standard 1149.1 test clock. TCK is normally a free-running clock

signal with a 50% duty cycle. The changes on test access port (TAP) of

input signals TMS and TDI are clocked into the TAP controller, instruction

at the TAP output signal (TDO) occur on the falling edge of TCK.

HInput

TDI I

IEEE standard 1149.1 test data input. Pin with internal pullup device. TDI is

clocked into the selected register (instruction or data) on a rising edge of

TCK.

PU Input

TDO O/Z

IEEE standard 1149.1 test data output. The contents of the selected

TCK. TDO is in the high-impedance state except when the scanning of

data is in progress.

Hi-Z

TMS I

IEEE standard 1149.1 test mode select. Pin with internal pullup device.

This serial control input is clocked into the TAP controller on the rising edge

of TCK.

PU Input

TRST I

IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE

standard 1149.1 scan system control of the operations of the device. If

TRST is not connected or driven low, the device operates in its functional

mode, and the IEEE standard 1149.1 signals are ignored. This pin has an

internal pulldown.

PD Input

EMU0 I/O/Z

Emulator 0 pin. When TRST is driven low, EMU0 must be high for

activation of the OFF condition. When TRST is driven high, EMU0 is used

as an interrupt to or from the emulator system and is defined as I/O by way

of the IEEE standard 1149.1 scan system.

PU Input

EMU1/OFF I/O/Z

Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF

is used as an interrupt to or from the emulator system and is defined as I/O

by way of IEEE standard 1149.1 scan system. When TRST is driven low,

EMU1/OFF is configured as OFF. The EMU1/OFF signal, when

active-low, puts all output drivers into the high-impedance state. Note that

OFF is used exclusively for testing and emulation purposes (not for

multiprocessing applications). Therefore, for the OFF condition, the

following apply: TRST = low, EMU0 = high, EMU1/OFF = low

PU Input

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

‘9 TEXAS INSTRUMENTS

Introduction

April 2001 − Revised January 2004 SPRS163F

Table 2−3. Signal Descriptions (Continued)

TERMINAL

NAME RESET

CONDITION

BK‡

FUNCTIONI/O/Z†

MULTIPLEXED

SIGNAL NAME

SUPPLY PINS

CVDD SDigital Power, + VDD. Dedicated power supply for the core CPU.

RVDD SDigital Power, + VDD. Dedicated power supply for on-chip memory.

DVDD SDigital Power, + VDD. Dedicated power supply for the I/O pins.

USBVDD SDigital Power, + VDD. Dedicated power supply for the I/O of the USB

module (DP, DN , and PU)

RDVDD SDigital Power, + VDD. Dedicated power supply for the I/O pins of the RTC

module.

RCVDD SDigital Power, + VDD. Dedicated power supply for the RTC module

AVDD SAnalog Power, + VDD. Dedicated power supply for the 10-bit A/D.

ADVDD SAnalog Digital Power, + VDD. Dedicated power supply for the digital portion

of the 10-bit A/D.

VSS SDigital Ground. Dedicated ground for the I/O and core pins.

AVSS SAnalog Ground. Dedicated ground for the 10-bit A/D.

ADVSS SAnalog Digital Ground. Dedicated ground for the digital portion of the10-bit

A/D.

MISCELLANEOUS

NC No connection

†I = Input, O = Output, S = Supply, Hi-Z = High-impedance

‡BK = bus keeper (the bus keeper maintains the previous voltage level during reset or while the output pin is not driven), PU = pullup,

PD = pulldown, H = hysteresis input buffer

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Functional Overview

30 April 2001 − Revised January 2004SPRS163F

3 Functional Overview

The following functional overview is based on the block diagram in Figure 3−1.

†

7/8

USB PLL

†Number of pins determined by package type.

Figure 3−1. Block Diagram of the TMS320VC5509

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.1 Memory

The 5509 supports a unified memory map (program and data accesses are made to the same physical space).

The total on-chip memory is 320K bytes (128K 16-bit words of RAM and 32K 16-bit words of ROM).

3.1.1 On-Chip Dual-Access RAM (DARAM)

The DARAM is located in the byte address range 000000h−00FFFFh and is composed of eight blocks of

8K bytes each (see Table 3−1). Each DARAM block can perform two accesses per cycle (two reads, two

writes, or a read and a write). DARAM can be accessed by the internal program, data, or DMA buses. The

HPI can only access the first four (32K bytes) DARAM blocks.

Table 3−1. DARAM Blocks

BYTE ADDRESS RANGE MEMORY BLOCK

000000h − 001FFFh DARAM 0 (HPI accessible)†

002000h − 003FFFh DARAM 1 (HPI accessible)

004000h − 005FFFh DARAM 2 (HPI accessible)

006000h − 007FFFh DARAM 3 (HPI accessible)

008000h − 009FFFh DARAM 4

00A000h − 00BFFFh DARAM 5

00C000h − 00DFFFh DARAM 6

00E000h − 00FFFFh DARAM 7

†First 192 bytes are reserved for Memory-Mapped Registers (MMRs).

3.1.2 On-Chip Single-Access RAM (SARAM)

The SARAM is located at the byte address range 010000h−03FFFFh and is composed of 24 blocks of 8K bytes

each (see Table 3−2). Each SARAM block can perform one access per cycle (one read or one write). SARAM

can be accessed by the internal program, data, or DMA buses.

Table 3−2. SARAM Blocks

BYTE ADDRESS RANGE MEMORY BLOCK BYTE ADDRESS RANGE MEMORY BLOCK

010000h − 011FFFh SARAM 0 028000h − 029FFFh SARAM 12

012000h − 013FFFh SARAM 1 02A000h − 02BFFFh SARAM 13

014000h − 015FFFh SARAM 2 02C000h − 02DFFFh SARAM 14

016000h − 017FFFh SARAM 3 02E000h − 02FFFFh SARAM 15

018000h − 019FFFh SARAM 4 030000h − 031FFFh SARAM 16

01A000h − 01BFFFh SARAM 5 032000h − 033FFFh SARAM 17

01C000h − 01DFFFh SARAM 6 034000h − 035FFFh SARAM 18

01E000h − 01FFFFh SARAM 7 036000h − 037FFFh SARAM 19

020000h − 021FFFh SARAM 8 038000h − 039FFFh SARAM 20

022000h − 023FFFh SARAM 9 03A000h − 03BFFFh SARAM 21

024000h − 025FFFh SARAM 10 03C000h − 03DFFFh SARAM 22

026000h − 027FFFh SARAM 11 03E000h − 03FFFFh SARAM 23

FFFFFFh A No access OM:1 a. MPNM *9 TEXAS INSTRUMENTS

Functional Overview

32 April 2001 − Revised January 2004SPRS163F

3.1.3 On-Chip Read-Only Memory (ROM)

The one-wait-state ROM is located at the byte address range FF0000h−FFFFFFh. The ROM is composed

of one block of 32K bytes and two 16K-byte blocks, for a total of 64K bytes of ROM. The ROM address space

can be mapped by software to the external memory or to the internal ROM. The 16K ROM blocks at FFC000

to FFFFFF can be configured as secure ROM. (See Section 3.1.4.)

NOTE: Customers can arrange to have the 5509 ROM programmed with contents unique to

any particular application. Contact your local Texas Instruments representative for more

information on custom ROM programming.

The standard 5509 device includes a bootloader program resident in the ROM. When the MPNMC bit field

of the ST3 status register is set through software, the on-chip ROM is disabled and not present in the memory

map, and byte address range FF0000h−FFFFFFh is directed to external memory space. A hardware reset

always clears the MPNMC bit, so it is not possible to disable the ROM at reset. However, the software reset

instruction does not affect the MPNMC bit. All three ROM blocks can be accessed by the program, data, or

DMA buses. The first 16-bit word access to ROM requires three cycles. Subsequent accesses require two

cycles per 16-bit word.

3.1.4 Secure ROM

Included in this 64K-byte ROM is a 16K-byte secure ROM (SROM) that is mapped into the memory space at

reset. This 16K-byte SROM is mapped out of the memory space by writing a “1” to the SROM disable bit field

of the Secure ROM Register (0x7C00) as shown in Figure 3−2. When the SROM disable bit is set, its setting

cannot be changed and the CPU or peripherals cannot access the on-chip SROM memory space. This ROM

block is not programmed on standard 5509 devices, but can be used to implement a custom, secure bootload

feature. Contact your local Texas Instruments representative for more information on custom ROM

programming.

(16K Bytes)

FF0000h

FF8000h

FFC000h SROM

(If SROM= 0 & MPNMC=0)

FFFFFFh

FF0000h

FF8000h

FFC000h

FFFFFFh

FF0000h

FF8000h

FFC000h

FFFFFFh

ROM

(If MPNMC=0)

ROM

(If MPNMC=0)

External − CE3

(If MPNMC=1)

External − CE3

(If MPNMC=1)

External − CE3

(If MPNMC=1)

ROM

(If MPNMC=0)

ROM

(If MPNMC=0)

15 10

SROM=0 SROM=1

SROM

Secure ROM Register

No access

(If SROM=1 & MPNMC=0)

Byte

Address Byte

Address

Byte

Address

(32K Bytes) (32K Bytes)

(16K Bytes) (16K Bytes)

(16K Bytes)

(32K Bytes)

(16K Bytes)

Figure 3−2. Secure ROM

*4? TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.1.5 Memory Map

The 5509 provides 16M bytes of total memory space composed of on-cip RAM, on-chip ROM, and external

memory space supporting a variety of memory types. The on-chip, dual-access RAM allows two accesses

to a given block during the same cycle. The 5509 supports 8 blocks of 8K bytes of dual-access RAM. The

on-chip, single-access RAM allows one access to a given block per clock cycle. The 5509 supports

24 blocks of 8K byte of single-access RAM.

The remainder of the memory map is external space that is divided into four spaces. Each space has a chip

enable decode signal (called CE) that indicates an access to the selected space. The External Memory

Interface (EMIF) supports access to asynchronous memories such as SRAM and Flash, and synchronous

DRAM.

*9 TEXAS INSTRUMENTS

Functional Overview

34 April 2001 − Revised January 2004SPRS163F

3.1.5.1 PGE Package Memory Map

The PGE package features 14 address bits representing 16K-byte linear address for asynchronous memories

per CE space. Due to address row/column multiplexing, address reach for SDRAM devices is 4M bytes for

each CE space. The largest SDRAM device that can be used with the 5509 in a PGE package is 128M-bit

SDRAM.

000000

DARAM / HPI Access (32K − 192) Bytes

008000

DARAM‡32K Bytes

010000

SARAM§192K Bytes

External¶ − CE0

040000

400000

800000

C00000

FF0000

FF8000

32K Bytes

FFC000

(if SROM=0 &

MPNMC=0) 16K Bytes

16K Bytes

FFFFF

External¶ − CE1

External¶ − CE2

External¶ − CE3

Block Size

Byte Address

(Hex)†

SROM||

(if MPNMC=0)

ROM||

(if MPNMC=0)

ROM||

(if MPNMC=1)

External¶ − CE3

(if MPNMC=1)

External¶ − CE3

(if MPNMC=1)

External¶ − CE3

16K Bytes − Asynchronous

4M Bytes − SDRAM (MPNMC = 1)

4M Bytes − 64K Bytes if internal ROM selected (MPNMC = 0)

16K Bytes − Asynchronous

4M Bytes − SDRAM

16K Bytes − Asynchronous

4M Bytes − SDRAM

16K Bytes − Asynchronous

4M Bytes − 256K Bytes SDRAM#

Memory Blocks

†Address shown represents the first byte address in each block.

‡Dual-access RAM (DARAM): two accesses per cycle per block, 8 blocks of 8K bytes.

§Single-access RAM (SARAM): one access per cycle per block, 24 blocks of 8K bytes.

¶External memory spaces are selected by the chip-enable signal shown (CE[0:3]). Supported memory types include: asynchronous static

RAM (SRAM) and synchronous DRAM (SDRAM).

#The minus 256K bytes consists of 32K-byte DARAM/HPI access, 32K-byte DARAM, and 192K-byte SARAM.

|| Read-only memory (ROM): one access every two cycles, two blocks of 32K bytes.

0000C0 MMR (Reserved)

Figure 3−3. TMS320VC5509 Memory Map (PGE Package)

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.1.5.2 GHH Package Memory Map

The GHH package features 21 address bits representing 2M-byte linear address for asynchronous memories

per CE space. Due to address row/column multiplexing, address reach for SDRAM devices is 4M bytes for

each CE space. The largest SDRAM device that can be used with the 5509 in a GHH package is 128M-bit

SDRAM.

000000

DARAM / HPI Access (32K − 192) Bytes

008000

DARAM‡32K Bytes

010000

SARAM§192K Bytes

External¶ − CE0

040000

400000

800000

C00000

FF0000

FF8000

32K Bytes

FFC000

(if SROM=0 &

MPNMC=0) 16K Bytes

16K Bytes

FFFFF

External¶ − CE1

External¶ − CE2

External¶ − CE3

Block Size

Byte Address

(Hex)†

SROM||

(if MPNMC=0)

ROM||

(if MPNMC=0)

ROM||

(if MPNMC=1)

External¶ − CE3

(if MPNMC=1)

External¶ − CE3

(if MPNMC=1)

External¶ − CE3

2M Bytes − Asynchronous

4M Bytes − SDRAM (MPNMC = 1)

4M Bytes − 64K Bytes if internal ROM selected (MPNMC = 0)

2M Bytes − Asynchronous

4M Bytes − SDRAM

2M Bytes − Asynchronous

4M Bytes − SDRAM

2M Bytes − Asynchronous

4M Bytes − 256K Bytes SDRAM#

Memory Blocks

†Address shown represents the first byte address in each block.

‡Dual-access RAM (DARAM): two accesses per cycle per block, 8 blocks of 8K bytes.

§Single-access RAM (SARAM): one access per cycle per block, 24 blocks of 8K bytes.

¶External memory spaces are selected by the chip-enable signal shown (CE[0:3]). Supported memory types include: asynchronous static

RAM (SRAM) and synchronous DRAM (SDRAM).

#The minus 256K bytes consists of 32K-byte DARAM/HPI access, 32K-byte DARAM, and 192K-byte SARAM.

|| Read-only memory (ROM): one access every two cycles, two blocks of 32K bytes.

0000C0 MMR (Reserved)

Figure 3−4. TMS320VC5509 Memory Map (GHH Package)

*9 TEXAS INSTRUMENTS

Functional Overview

36 April 2001 − Revised January 2004SPRS163F

3.1.6 Boot Configuration

The on-chip bootloader provides a method to transfer application code and tables from an external source to

the on-chip RAM memory at power up. These options include:

•Enhanced host-port interface (HPI) in multiplexed or nonmultiplexed mode

•External 16-bit-wide asynchronous memory boot (via the EMIF)

•Serial port boot (from McBSP0) with 8-bit or 16-bit element length

•Serial EPROM boot (from McBSP0) supporting EPROMs with 16-bit or 24-bit address

•USB boot

•Direct execution from external 16-bit-wide asynchronous memory

External pins select the boot configuration. The values of GPIO[3:0] are sampled, following reset, upon

execution of the on-chip bootloader code. It is not possible to disable the bootloader at reset because the 5509

always starts execution from the on-chip ROM following a hardware reset. A summary of boot configurations

is shown in Table 3−3. For more information on using the bootloader, see the Using the

TMS320C5509/C5509A Bootloader application report (literature number SPRA375).

Table 3−3. Boot Configuration Summary

GPIO0 GPIO3 GPIO2 GPIO1 BOOT MODE PROCESS

0 0 0 0 Reserved

0 0 0 1 Serial (SPI) EPROM Boot (24-bit address) via McBSP0

0 0 1 0 USB

0 0 1 1 Reserved

0 1 0 0 Reserved

0 1 0 1 HPI – multiplexed mode

0 1 1 0 HPI – nonmultiplexed mode

0 1 1 1 Reserved

1 0 0 0 Execute from 16-bit-wide asynchronous memory (on CE1 space)

1 0 0 1 Serial (SPI) EPROM Boot (16-bit address) via McBSP0

1 0 1 0 Reserved

1 0 1 1 16-bit asynchronous memory (on CE1 space)

1 1 0 0 Reserved

1 1 0 1 Reserved

1 1 1 0 Standard serial boot via McBSP0 (16-bit data)

1 1 1 1 Standard serial boot via McBSP0 (8-bit data)

*4? TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.2 Peripherals

The 5509 supports the following peripherals:

•A Configurable Parallel External Interface supporting either:

− 16-bit external memory interface (EMIF) for asynchronous memory and/or SDRAM

− 16-bit enhanced host-port interface (HPI)

•A six-channel direct memory access (DMA) controller

•A programmable digital phase-locked loop (DPLL) clock generator

•Two 20-bit timers

•Watchdog Timer

•Three serial ports supporting a combination of:

− up to three multichannel buffered serial ports (McBSPs)

− up to two MultiMedia/Secure Digital Card Interfaces

•Seven (LQFP) or Eight (BGA) configurable general-purpose I/O pins

•USB full-speed slave interface supporting:

− Bulk

− Interrupt

− Isochronous

•I2C multi-master and slave interface (I2C compatible except, no fail-safe I/O buffers)

•Real-time clock with crystal input, separate clock domain and supply pins

•4-channel (BGA) or 2-channel (LQFP)10-bit Successive Approximation A/D

For detailed information on the C55x DSP peripherals, see the following documents:

•TMS320C55x DSP Functional Overview (literature number SPRU312)

•TMS320C55x DSP Peripherals Overview Reference Guide (literature number SPRU317)

3.3 Direct Memory Access (DMA) Controller

The 5509 DMA provides the following features:

•Four standard ports, one for each of the following data resources: DARAM, SARAM, Peripherals and

External Memory

•Six channels, which allow the DMA controller to track the context of six independent DMA channels

•Programmable low/high priority for each DMA channel

•One interrupt for each DMA channel

•Event synchronization. DMA transfers in each channel can be dependent on the occurrence of selected

events.

•Programmable address modification for source and destination addresses

•Dedicated Idle Domain allows the DMA controller to be placed in a low-power (idle) state under software

control.

•Dedicated DMA channel used by the HPI to access internal memory (DARAM)

The 5509 DMA controller allows transfers to be synchronized to selected events. The 5509 supports

21 separate sync events and each channel can be tied to separate sync events independent of the other

channels. Sync events are selected by programming the SYNC field in the channel-specific DMA Channel

Control Register (DMA_CCR).

*9 TEXAS INSTRUMENTS

Functional Overview

38 April 2001 − Revised January 2004SPRS163F

3.3.1 DMA Channel Control Register (DMA_CCR)

The channel control register (DMA_CCR) bit layouts are shown in Figure 3−5.

15 14 13 12 11 10 9 8

DST AMODE SRC AMODE END PROG Reserved REPEAT AUTO INIT

R/W, 00 R/W, 00 R/W, 0 R, 0 R/W, 0 R/W, 0

7654 0

EN PRIO FS SYNC

R/W, 0 R/W, 0 R/W, 0 R/W, 00000

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−5. DMA_CCR Bit Locations

The SYNC[4:0] bits specify the event that can initiate the DMA transfer for the corresponding DMA channel.

The five bits allow several configurations as listed in Table 3−4. The bits are set to zero upon reset. For those

synchronization modes with more than one peripheral listed, the Serial Port Mode bit field of the External Bus

Selection Register dictates which peripheral event is actually connected to the DMA input.

Table 3−4. Synchronization Control Function

SYNC FIELD IN

DMA_CCR SYNCHRONIZATION MODE

00000b No event synchronized

00001b McBSP 0 Receive Event (REVT0)

00010b McBSP 0 Transmit Event (XEVT0)

00011b Reserved. These bits should always be written with 0.

00100b Reserved. These bits should always be written with 0.

00101b

McBSP1/MMC−SD1 Receive Event

Serial Port 1 Mode:

00 = McBSP1 Receive Event (REVT1)

01 = MMC/SD1 Receive Event (RMMCEVT1)

10 = Reserved

11 = Reserved

00110b

McBSP1/MMC−SD1 Transmit Event

Serial Port 1 Mode:

00 = McBSP1 Transmit Event (XEVT1)

01 = MMC/SD1 Transmit Event (XMMCEVT1)

10 = Reserved

11 = reserved

00111b Reserved. These bits should always be written with 0.

01000b Reserved. These bits should always be written with 0.

01001b

McBSP2/MMC−SD2 Receive Event

Serial Port 2 Mode:

00 = McBSP2 Receive Event (REVT2)

01 = MMC/SD2 Receive Event (RMMCEVT2)

10 = Reserved

11 = Reserved

†The I2C receive event (REVTI2C) and external interrupt 4 (INT4) share a synchronization input to the DMA. When the SYNC field of the

DMA_CCR is set to 10011b, the logical OR of these two sources is used for DMA synchronization.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−4. Synchronization Control Function (Continued)

SYNC FIELD IN

DMA_CCR SYNCHRONIZATION MODE

01010b

McBSP2/MMC−SD2 Transmit Event

Serial Port 2 Mode:

00 = McBSP2 Transmit Event (XEVT2)

01 = MMC/SD2 Transmit Event (XMMCEVT2)

10 = Reserved

11 = Reserved

01011b Reserved. These bits should always be written with 0.

01100b Reserved. These bits should always be written with 0.

01101b Timer 0 Interrupt Event

01110b Timer 1 Interrupt Event

01111b External Interrupt 0

10000b External Interrupt 1

10001b External Interrupt 2

10010b External Interrupt 3

10011b External Interrupt 4 / I2C Receive Event (REVTI2C)†

10100b I2C Transmit Event (XEVTI2C)

Other values Reserved (Do not use these values)

†The I2C receive event (REVTI2C) and external interrupt 4 (INT4) share a synchronization input to the DMA. When the SYNC field of the

DMA_CCR is set to 10011b, the logical OR of these two sources is used for DMA synchronization.

3.4 I2C Interface

The TMS320VC5509 includes an I2C serial port. The I2C port supports:

•Compatible with Philips I2C Specification Revision 2.1 (January 2000)

•Operates at 100 Kbps or 400 Kbps

•7-bit addressing mode

•Master (transmit/receive) and slave (transmit/receive) modes of operation

•Events: DMA, interrupt, or polling

The I2C module clock must be in the range from 7 MHz to 12 MHz. This is necessary for proper operation of

the I2C module. With the I2C module clock in this range, the noise filters on the SDA and SCL pins suppress

noise that has a duration of 50 ns or shorter. The I2C module clock is derived from the DSP clock divided by

a programmable prescaler.

NOTE: I/O buffers are not fail-safe. The SDA and SCL pins could potentially draw current if the

device is powered down and SDA and SCL are driven by other devices connected to the I2C bus.

*9 TEXAS INSTRUMENTS

Functional Overview

40 April 2001 − Revised January 2004SPRS163F

3.5 Configurable External Buses

The 5509 offers several combinations of configurations for its external parallel port and two serial ports. This

allows the system designer to choose the appropriate media interface for its application without the need of

a large-pin-count package. The External Bus Selection Register controls the routing of the parallel and serial

port signals.

3.5.1 External Bus Selection Register

The External Bus Selection Register determines the mapping of the 14 (LQFP) or 21 (BGA) address signals,

16 data signals, and 15 control signals of the external parallel port. It also determines the mapping of the

McBSP or MMC/SD ports to Serial Port1 and Serial Port2. The External Bus Selection Register is

memory-mapped at port address 0x6C00. Once the bit fields of this register are changed, the routing of the

signals takes place on the next CPU clock cycle.

The reset value of the parallel port mode bit field is determined by the state of the GPIO0 pin at reset. If GPIO0

is high at reset, the full EMIF mode is enabled and the parallel port mode bit field is set to 01. If GPIO0 is low

at reset, the HPI multiplexed mode is enabled and the parallel port mode bit field is set to 11.

15 14 13 12 11 10 9 8

CLKOUT

Disable OSC Disable HIDL BKE EMIF X2 HOLD HOLDA Reserved

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 1 R, 0

76543210

Reserved Serial Port2 Mode Serial Port1 Mode Parallel Port Mode

R/W, 00 R/W, 00 R/W, 00 R/W, 01 if GPIO0 = 1

11 if GPIO0 = 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−6. External Bus Selection Register

Table 3−5. External Bus Selection Register Bit Field Description

BITS DESCRIPTION

15 CLKOUT disable.

CLKOUT disable = 0: CLKOUT enabled

CLKOUT disable = 1: CLKOUT disabled

14 Oscillator disable. Works with IDLE instruction to put the clock generation domain into IDLE mode.

OSC disable = 0: Oscillator enabled

OSC disable = 1: Oscillator disabled

Host mode idle bit. (Applicable only if the parallel bus is configured as EHPI.)

When the parallel bus is set to EHPI mode, the clock domain is not allowed to go to idle, so a host processor can

access the DSP internal memory. The HIDL bit works around this restriction and allows the DSP to idle the clock

domain and the EHPI. When the clock domain is in idle, a host processor will not be able to access the DSP

memory.

HIDL = 0: Host access to DSP enabled. Idling EHPI and clock domain is not allowed.

HIDL = 1: Idles the HPI and the clock domain upon execution of the IDLE instruction when the parallel

port mode is set to 10 or 11 selecting HPI mode. In addition, bit 4 of the Idle Control Register

must be set to 1 prior to the execution of the IDLE instruction.

†Function available when the port or pins configured as input.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−5. External Bus Selection Register Bit Field Description (Continued)

BITS DESCRIPTION

(PG3.0 or later)

Bus keep enable.†

BKE = 0: Bus keeper, pullups/pulldowns, and the USB I/O cells are enabled.

BKE = 1: Bus keeper, pullups/pulldowns, and the USB I/O cells are disabled.

EMIFX2 mode. EMIF SDRAM divide-by-two mode at 144 MHz. Use this feature when SDRAM CLKMEM =

1/2 CPU clock.

EMIFX2 = 0: For any other EMIF mode

EMIFX2 = 1: Only used for EMIF SDRAM divide-by-two mode at 144 MHz CPU operation.

(PG 3.0 or later)

EMIF hold

HOLD = 0: DSP drives the external memory bus

HOLD = 1: Request the external memory bus to be placed in high-impedance so that another device can

drive the memory bus

(PG 3.0 or later)

EMIF hold acknowledge.

HOLDA = 0: DSP indicates that a hold request on the external memory bus has occured, the EMIF

completed any pending external bus activity, and placed the external memory bus signals in

high-impedance state (address bus, data bus, CE[3:0], AOE, AWE, ARE, SDRAS, SDCAS,

SDWE, SDA10, CLKMEM). Once this bit is cleared, an external device can drive the bus.

HOLDA = 1: No hold acknowledge

8−6 Reserved. These bits should always be written with 0.

5−4

Serial port2 mode. McBSP2 or MMC/SD2 Mode. Determines the mode of Serial Port2.

Serial Port2 Mode = 00: McBSP2 mode. The McBSP2 signals are routed to the six pins of Seral Port2.

Serial Port2 Mode = 01: MMC/SD2 mode. The MMC/SD2 signals are routed to the six pins of Seral Port2.

Serial Port2 Mode = 10: Reserved

Serial Port2 Mode = 11: Reserved.

3−2

Serial port1 mode. McBSP1 or MMC/SD1 Mode. Determines the mode of Serial Port1.

Serial Port1 Mode = 00: McBSP1 mode. The McBSP1 signals are routed to the six pins of Seral Port1.

Serial Port1 Mode = 01: MMC/SD1 mode. The MMC/SD1 signals are routed to the six pins of Seral Port1.

Serial Port1 Mode = 10: Reserved

Serial Port1 Mode = 11: Reserved.

1−0

Parallel port mode. EMIF/HPI/GPIO Mode. Determines the mode of the parallel port.

Parallel Port Mode = 00: Data EMIF mode. The 16 EMIF data signals and 13 EMIF control signals are

routed to the corresponding external parallel bus data and control signals, but the

14 (LQFP) or 16 (BGA) address bus signals are used as general-purpose I/O.

Parallel Port Mode = 01: Full EMIF mode. The 14 (LQFP) or 21 (BGA) address signals, 16 data signals, and

15 control signals are routed to the corresponding external parallel bus address,

data, and control signals.

Parallel Port Mode = 10: Non-multiplexed HPI mode. The HPI is enabled an its 14 address signals,

16 data signals, and 7 control signals are routed to the corresponding address,

data, control signals of the external parallel bus. Moreover, 8 control signals of the

external parallel bus are used as general-purpose I/O.

Parallel Port Mode = 11: Multiplexed HPI mode. The HPI is enabled and its 16 data signals and

10 control signals are routed to the external parallel bus. In addition, 3 control

signals of the external parallel bus are used as general-purpose I/O. The

14 (LQFP) or 16 (BGA) external parallel port address bus signals are used as

general-purpose I/O.

†Function available when the port or pins configured as input.

*9 TEXAS INSTRUMENTS

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42 April 2001 − Revised January 2004SPRS163F

3.5.2 Parallel Port

The parallel port of the 5509 consists of 14 (LQFP) or 21 (BGA) address signals, 16 data signals, and 15 control

signals. Its 14 bits for address allow it to access 16K (LQFP) or 2M bytes of external memory when using the

asynchronous SRAM interface. On the other hand, the SDRAM interface can access the whole external

memory space of 16M bytes. The parallel bus supports four different modes:

•Full EMIF mode: the EMIF with its 14 (LQFP) or 21 address signals, 16 data signals, and 15 control

signals routed to the corresponding external parallel bus address, data, and control signals.

•Data EMIF mode: the EMIF with its 16 data signals, and 15 control signals routed to the corresponding

external parallel bus data and control signals, but the 14 (LQFP) or 16 (BGA) address bus signals are used

as general-purpose I/O signals.

•Non-multiplexed HPI mode: the HPI is enabled with its 14 address signals, 16 data signals, and

8 control signals routed to the corresponding address, data, and control signals of the external parallel

bus. Moreover, 7 control signals of the external parallel bus are used as general-purpose I/O.

•Multiplexed HPI mode: the HPI is enabled with its 16 data signals and 10 control signals routed to the

external parallel bus. In addition, 5 control signals of the external parallel bus are used as general-purpose

I/O. The external parallel port’s 14 (LQFP) or 16 (BGA) address signals are used as general-purpose I/O.

Table 3−6. TMS320VC5509 Parallel Port Signal Routing

Pin Signal Data EMIF (00)†Full EMIF (01)†Non-Multiplex HPI (10)†Multiplex HPI (11)†

Address Bus

A’[0] N/A EMIF.A[0] (BGA) N/A N/A

A[0]

GPIO.A[0] (LQFP) EMIF.A[0] (LQFP) HPI.HA[0] (LQFP) GPIO.A[0] (LQFP)

A[0]

GPIO.A[0] (BGA) HPI.HA[0] (BGA) GPIO.A[0] (BGA)

A[13:1]

GPIO.A[13:1] (LQFP) EMIF.A[13:1] (LQFP) HPI.HA[13:1] (LQFP) GPIO.A[13:1] (LQFP)

A[13:1]

GPIO.A[13:1] (BGA) EMIF.A[13:1] (BGA) HPI.HA[13:1] (BGA) GPIO.A[13:1] (BGA)

A[15:14] GPIO.A[15:14] (BGA) EMIF.A[15:14] (BGA) N/A GPIO.A[15:14] (BGA)

A[20:16]‡N/A EMIF.A[20:16] (BGA) N/A N/A

Data Bus

D[15:0] EMIF.D[15:0] EMIF.D[15:0] HPI.HD[15:0] HPI.HD[15:0]

Control Bus

C0 EMIF.ARE EMIF.ARE GPIO8 GPIO8

C1 EMIF.AOE EMIF.AOE HPI.HINT HPI.HINT

C2 EMIF.AWE EMIF.AWE HPI.HR/W HPI.HR/W

C3 EMIF.ARDY EMIF.ARDY HPI.HRDY HPI.HRDY

C4 EMIF.CE0 EMIF.CE0 GPIO9 GPIO9

C5 EMIF.CE1 EMIF.CE1 GPIO10 GPIO10

C6 EMIF.CE2 EMIF.CE2 HPI.HCNTL0 HPI.HCNTL0

C7 EMIF.CE3 EMIF.CE3 GPIO11 HPI.HCNTL1

C8 EMIF.BE0 EMIF.BE0 HPI.HBE0 HPI.HBE0

C9 EMIF.BE1 EMIF.BE1 HPI.HBE1 HPI.HBE1

C10 EMIF.SDRAS EMIF.SDRAS GPIO12 HPI.HAS

C11 EMIF.SDCAS EMIF.SDCAS HPI.HCS HPI.HCS

C12 EMIF.SDWE EMIF.SDWE HPI.HDS1 HPI.HDS1

C13 EMIF.SDA10 EMIF.SDA10 GPIO13 GPIO13

C14 EMIF.CLKMEM EMIF.CLKMEM HPI.HDS2 HPI.HDS2

†Represents Parallel Port Mode bits of the External Bus Selection Register.

‡A[20:16] of the BGA package always functions as EMIF address pins and they cannot be reconfigured for any other function.

ﬂ \/\/\/\ *4? TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.5.3 Parallel Port Signal Routing

The 5509 allows access to 16-bit-wide (read and write) asynchronous memory and 16-bit-wide SDRAM. For

16-bit-wide memories, EMIF.A[0] is kept low and is not used. To provide as many address pins as possible,

the 5509 routes the parallel port signals as shown in Figure 3−7.

Figure 3−7 shows the addition of the A′[0] signal in the BGA package. This pin is used for asynchronous

memory interface only, while the A[0] pin is used with HPI or GPIO. Figure 3−8 summarizes the use of the

parallel port signals for memory interfacing.

EMIF.A[0]

GPIO.A[0]

HPI.HA[0]

EMIF.A[13:1]

HPI.HA[13:1]

GPIO.A[13:1]

EMIF.A[14]

GPIO.A[14]

EMIF.A[15]

GPIO.A[15]

EMIF.A[20:16]

A’[0] (BGA only)

A[0]

A[13:1]

A[14] (BGA only)

A[15] (BGA only)

A[20:16] (BGA only)

Figure 3−7. Parallel Port Signal Routing

*9 TEXAS INSTRUMENTS

Functional Overview

44 April 2001 − Revised January 2004SPRS163F

16-Bit-Wide Asynchronous Memory

BGA

5509

A[20:14]

D[15:0]

A[13:1]

BE[1:0]

16-Bit

Asynchronous

Memory

D[15:0]

A[19:13]

A[12:0]

5509

LQFP

BGA

CLKMEM

SDCAS

SDRAS

CEx

SDRAM

128 MBit

64 MBit or

CAS

CLK

RAS

A[13]

A[14] or A[0]†

SDWE

BA[0]

BA[1]

DQM[H:L]

A[12]

SDA10

A[10:1]

D[15:0]

A[11]

A[9:0]

D[15:0]

A[10]

16-Bit-Wide SDRAM

BE[1:0]

†A[14] if BGA; A[0] if LQFP

CEx

LQFP

5509

A[13:1]

D[15:0]

A[0]

BE[1:0]

16-Bit

Asynchronous

Memory

D[15:0]

A[12:0]

A[13]

BE[1:0]

CEx

Figure 3−8. Parallel Port (EMIF) Signal Interface

3.5.4 Serial Ports

The 5509 Serial Port1 and Serial Port2 each consists of six signals that support two different modes:

•McBSP mode: all six signals of the McBSP are routed to the six external signals of the serial port.

•MMC/SD mode: all six signals of the MultiMedia Card/Secure Digital port are routed to the six external

signals of the serial port.

Table 3−7. TMS320VC5509 Serial Port1 Signal Routing

PIN SIGNAL MCBSP1 (00)†MMC/SD1 (10)†

S10 McBSP1.CLKR MMC1.CMD

S11 McBSP1.DR MMC1.DAT1

S12 McBSP1.FSR MMC1.DAT2

S13 McBSP1.DX MMC1.CLK

S14 McBSP1.CLKX MMC1.DAT0

S15 McBSP1.FSX MMC1.DAT3

†Represents Serial Port1 Mode bits of the External Bus Selection Register.

Table 3−8. TMS320VC5509 Serial Port2 Signal Routing

PIN SIGNAL MCBSP2 (00)‡MMC/SD2 (10)‡

S20 McBSP2.CLKR MMC2.CMD

S21 McBSP2.DR MMC2.DAT1

S22 McBSP2.FSR MMC2.DAT2

S23 McBSP2.DX MMC2.CLK

S24 McBSP2.CLKX MMC2.DAT0

S25 McBSP2.FSX MMC2.DAT3

‡Represents Serial Port2 Mode bits of the External Bus Selection Register.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.6 General-Purpose Input/Output (GPIO) Ports

3.6.1 Dedicated General-Purpose I/O

The 5509 provides eight dedicated general-purpose input/output pins, GPIO0−GPIO7. Each pin can be

indepedently configured as an input or an output using the I/O Direction Register (IODIR). The I/O Data

of pins configured as outputs. See Table 3−27 for address information. The description of the IODIR is shown

in Figure 3−9 and Table 3−9. The description of IODATA is shown in Figure 3−10 and Table 3−10.

To configure a GPIO pin as an input, clear the direction bit that corresponds to the pin in IODIR to 0. To read

the logic state of the input pin, read the corresponding bit in IODATA.

To configure a GPIO pin as an output, set the direction bit that corresponds to the pin in IODIR to 1. To control

the logic state of the output pin, write to the corresponding bit in IODATA.

15 876543210

Reserved IO7DIR IO6DIR IO5DIR

(BGA) IO4DIR IO3DIR IO2DIR IO1DIR IO0DIR

R−00000000 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−9. I/O Direction Register (IODIR) Bit Layout

Table 3−9. I/O Direction Register (IODIR) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−8 Reserved 0 These bits are reserved and are unaffected by writes.

7−0 IOxDIR†0IOx Direction Control Bit. Controls whether IOx operates as an input or an output.

IOxDIR = 0 IOx is configured as an input.

IOxDIR = 1 IOx is configured as an output.

†The GPIO5 pin is available on the BGA package only.

*9 TEXAS INSTRUMENTS

Functional Overview

46 April 2001 − Revised January 2004SPRS163F

15 876543210

Reserved IO7D IO6D IO5D

(BGA) IO4D IO3D IO2D IO1D IO0D

R−00000000 R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin R/W−pin

LEGEND: R = Read, W = Write, pin = value present on the pin (IO7−IO0 default to inputs after reset)

Figure 3−10. I/O Data Register (IODATA) Bit Layout

Table 3−10. I/O Data Register (IODATA) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−8 Reserved 0 These bits are reserved and are unaffected by writes.

7−0 IOxD pin†‡

IOx Data Bit.

If IOx is configured as an input (IOxDIR = 0 in IODIR):

IOxD = 0 The signal on the IOx pin is low.

IOxD = 1 The signal on the IOx pin is high.

If IOx is configured as an output (IOxDIR = 1 in IODIR):

IOxD = 0 Drive the signal on the IOx pin low.

IOxD = 1 Drive the signal on the IOx pin high.

†The GPIO5 pin is available on the BGA package only.

‡pin = value present on the pin (IO7−IO0 default to inputs after reset)

3.6.2 Address Bus General-Purpose I/O

The 16 address signals, EMIF.A[15−0], can also be individually enabled as GPIO when the Parallel Port Mode

bit field of the External Bus Selection Register is set for Data EMIF (00) or Multiplexed EHPI mode (11). These

pins are controlled by three registers: the enable register, AGPIOEN, determines if the pins serve as GPIO

or address (Figure 3−11); the direction register, AGPIODIR, determines if the GPIO enabled pin is an input

or output (Figure 3−12); and the data register, AGPIODATA, determines the logic states of the pins in

general-purpose I/O mode (Figure 3−13).

15 14 13 12 11 10 9 8

AIOEN15

(BGA) AIOEN14

(BGA) AIOEN13 AIOEN12 AIOEN11 AIOEN10 AIOEN9 AIOEN8

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

76543210

AIOEN7 AIOEN6 AIOEN5 AIOEN4 AIOEN3 AIOEN2 AIOEN1 AIOEN0

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−11. Address/GPIO Enable Register (AGPIOEN) Bit Layout

Table 3−11. Address/GPIO Enable Register (AGPIOEN) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−0 AIOENx 0

Enable or disable GPIO function of Address Bus of EMIF. AIOEN15 and AIOEN14 are only available in

BGA package.

AIOENx = 0 GPIO function of Ax line is disabled; i.e., Ax has address function.

AIOENx = 1 GPIO function of Ax line is enabled; i.e., Ax has GPIO function.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

15 14 13 12 11 10 9 8

AIODIR15

(BGA) AIODIR14

(BGA) AIODIR13 AIODIR12 AIODIR11 AIODIR10 AIODIR9 AIODIR8

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

76543210

AIODIR7 AIODIR6 AIODIR5 AIODIR4 AIODIR3 AIODIR2 AIODIR1 AIODIR0

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−12. Address/GPIO Direction Register (AGPIODIR) Bit Layout

Table 3−12. Address/GPIO Direction Register (AGPIODIR) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−0 AIODIRx 0

Data direction bits that configure the Address Bus configured as I/O pins as either input or output pins.

AIODIR15 and AIODIR14 are only available in BGA package.

AIODIRx = 0 Configure corresponding pin as an input.

AIODIRx = 1 Configure corresponding pin as an output.

15 14 13 12 11 10 9 8

AIOD15 (BGA) AIOD14 (BGA) AIOD13 AIOD12 AIOD11 AIOD10 AIOD9 AIOD8

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

76543210

AIOD7 AIOD6 AIOD5 AIOD4 AIOD3 AIOD2 AIOD1 AIOD0

R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−13. Address/GPIO Data Register (AGPIODATA) Bit Layout

Table 3−13. Address/GPIO Data Register (AGPIODATA) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−0 AIODx 0

Data bits that are used to control the level of the Address Bus configured as I/O output pins, and to monitor

the level of the Address Bus configured as I/O input pins. AIOD15 and AIOD14 are only available in BGA

package.

If AIODIRn = 0, then:

AIODx = 0 Corresponding I/O pin is read as a low.

AIODx = 1 Corresponding I/O pin is read as a high.

If AIODIRn = 1, then:

AIODx = 0 Set corresponding I/O pin to low.

AIODx = 1 Set corresponding I/O pin to high.

*9 TEXAS INSTRUMENTS

Functional Overview

48 April 2001 − Revised January 2004SPRS163F

3.6.3 EHPI General-Purpose I/O

Six control lines of the External Parallel Bus can also be set as general-purpose I/O when the Parallel Port

Mode bit field of the External Bus Selection Register is set to Nonmultiplexed EHPI (10) or Multiplexed EHPI

mode (11). These pins are controlled by three registers: the enable register, EHPIGPIOEN, determines if the

pins serve as GPIO or address (Figure 3−14); the direction register, EHPIGPIODIR, determines if the GPIO

enabled pin is an input or output (Figure 3−15); and the data register, EHPIGPIODATA, determines the logic

states of the pins in GPIO mode (Figure 3−16).

15 6543210

Reserved GPIOEN13 GPIOEN12 GPIOEN11 GPIOEN10 GPIOEN9 GPIOEN8

R, 0000 0000 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−14. EHPI GPIO Enable Register (EHPIGPIOEN) Bit Layout

Table 3−14. EHPI GPIO Enable Register (EHPIGPIOEN) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−6 Reserved 0 Reserved

5−0 GPIOEN13−

GPIOEN8 0

Enable or disable GPIO function of EHPI Control Bus.

GPIOENx = 0 GPIO function of GPIOx line is disabled

GPIOENx = 1 GPIO function of GPIOx line is enabled

15 6543210

Reserved GPIODIR13 GPIODIR12 GPIODIR11 GPIODIR10 GPIODIR9 GPIODIR8

R, 0000 0000 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−15. EHPI GPIO Direction Register (EHPIGPIODIR) Bit Layout

Table 3−15. EHPI GPIO Direction Register (EHPIGPIODIR) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−6 Reserved 0 Reserved

5−0 GPIODIR13−

GPIODIR8 0

Data direction bits that configure the EHPI Control Bus configured as I/O pins as either input or output

pins.

GPIODIRx = 0 Configure corresponding pin as an input.

GPIODIRx = 1 Configure corresponding pin as an output.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

15 6543210

Reserved GPIOD13 GPIOD12 GPIOD11 GPIOD10 GPIOD9 GPIOD8

R, 0000 0000 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−16. EHPI GPIO Data Register (EHPIGPIODATA) Bit Layout

Table 3−16. EHPI GPIO Data Register (EHPIGPIODATA) Bit Functions

BIT

NO. BIT

NAME RESET

VALUE FUNCTION

15−6 Reserved 0 Reserved

5−0 GPIOD13−

GPIOD8 0

Data bits that are used to control the level of the EHPI Control Bus configured as I/O output pins, and to

monitor the level of the EHPI Control Bus configured as I/O input pins.

If GPIODIRn = 0, then:

GPIODx = 0 Corresponding I/O pin is read as a low.

GPIODx = 1 Corresponding I/O pin is read as a high.

If GPIODIRn = 1, then:

GPIODx = 0 Set corresponding I/O pin to low.

GPIODx = 1 Set corresponding I/O pin to high.

3.7 System Register

The system register (SYSR) provides control over certain device-specific functions. The register is located

at port address 07FDh. This feature is not supported on the 5509 device.

*9 TEXAS INSTRUMENTS

Functional Overview

50 April 2001 − Revised January 2004SPRS163F

3.8 Memory-Mapped Registers

The 5509 has 78 memory-mapped CPU registers that are mapped in data memory space address 0h to 4Fh.

Table 3−17 provides a list of the CPU memory-mapped registers (MMRs) available. The corresponding

TMS320C54x (C54x) CPU registers are also indicated where applicable.

Table 3−17. CPU Memory-Mapped Registers

C55x

(HEX) DESCRIPTION BIT FIELD

IER0 IMR 00 Interrupt Enable Register 0 [15−0]

IFR0 IFR 01 Interrupt Flag Register 0 [15−0]

ST0_55 − 02 Status Register 0 for C55x [15−0]

ST1_55 − 03 Status Register 1 for C55x [15−0]

ST3_55 − 04 Status Register 3 for C55x [15−0]

− − 05 Reserved [15−0]

ST0 ST0 06 Status Register ST0 [15−0]

ST1 ST1 07 Status Register ST1 [15−0]

AC0L AL 08 Accumulator 0 [15−0]

AC0H AH 09 [31−16]

AC0G AG 0A [39−32]

AC1L BL OB Accumulator 1 [15−0]

AC1H BH 0C [31−16]

AC1G BG 0D [39−32]

T3 TREG 0E Temporary Register [15−0]

TRN0 TRN 0F Transition Register [15−0]

AR0 AR0 10 Auxiliary Register 0 [15−0]

AR1 AR1 11 Auxiliary Register 1 [15−0]

AR2 AR2 12 Auxiliary Register 2 [15−0]

AR3 AR3 13 Auxiliary Register 3 [15−0]

AR4 AR4 14 Auxiliary Register 4 [15−0]

AR5 AR5 15 Auxiliary Register 5 [15−0]

AR6 AR6 16 Auxiliary Register 6 [15−0]

AR7 AR7 17 Auxiliary Register 7 [15−0]

SP SP 18 Stack Pointer Register [15−0]

BK03 BK 19 Circular Buffer Size Register [15−0]

BRC0 BRC 1A Block Repeat Counter [15−0]

RSA0L RSA 1B Block Repeat Start Address [15−0]

REA0L REA 1C Block Repeat End Address [15−0]

PMST PMST 1D Processor Mode Status Register [15−0]

XPC XPC 1E Program Counter Extension Register [7−0]

− − 1F Reserved [15−0]

T0 − 20 Temporary Data Register 0 [15−0]

T1 − 21 Temporary Data Register 1 [15−0]

T2 − 22 Temporary Data Register 2 [15−0]

T3 − 23 Temporary Data Register 3 [15−0]

AC2L − 24 Accumulator 2 [15−0]

AC2H − 25 [31−16]

AC2G − 26 [39−32]

TMS320C54x and C54x are trademarks of Texas Instruments.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−17. CPU Memory-Mapped Registers (Continued)

C55x

WORD ADDRESS

(HEX)

C54x

CDP − 27 Coefficient Data Pointer [15−0]

AC3L − 28 Accumulator 3 [15−0]

AC3H − 29 [31−16]

AC3G − 2A [39−32]

DPH − 2B Extended Data Page Pointer [6−0]

MDP05 − 2C Reserved [6−0]

MDP67 − 2D Reserved [6−0]

DP − 2E Memory Data Page Start Address [15−0]

PDP − 2F Peripheral Data Page Start Address [8−0]

BK47 − 30 Circular Buffer Size Register for AR[4−7] [15−0]

BKC − 31 Circular Buffer Size Register for CDP [15−0]

BSA01 − 32 Circular Buffer Start Address Register for AR[0−1] [15−0]

BSA23 − 33 Circular Buffer Start Address Register for AR[2−3] [15−0]

BSA45 − 34 Circular Buffer Start Address Register for AR[4−5] [15−0]

BSA67 − 35 Circular Buffer Start Address Register for AR[6−7] [15−0]

BSAC − 36 Circular Buffer Coefficient Start Address Register [15−0]

BIOS − 37 Data Page Pointer Storage Location for 128-word Data Table [15−0]

TRN1 − 38 Transition Register 1 [15−0]

BRC1 − 39 Block Repeat Counter 1 [15−0]

BRS1 − 3A Block Repeat Save 1 [15−0]

CSR − 3B Computed Single Repeat [15−0]

RSA0H − 3C Repeat Start Address 0 [23−16]

RSA0L − 3D [15−0]

REA0H − 3E Repeat End Address 0 [23−16]

REA0L − 3F [15−0]

RSA1H − 40 Repeat Start Address 1 [23−16]

RSA1L − 41 [15−0]

REA1H − 42 Repeat End Address 1 [23−16]

REA1L − 43 [15−0]

RPTC − 44 Repeat Counter [15−0]

IER1 − 45 Interrupt Enable Register 1 [15−0]

IFR1 − 46 Interrupt Flag Register 1 [15−0]

DBIER0 − 47 Debug IER0 [15−0]

DBIER1 − 48 Debug IER1 [15−0]

IVPD − 49 Interrupt Vector Pointer DSP [15−0]

IVPH − 4A Interrupt Vector Pointer HOST [15−0]

ST2_55 − 4B Status Register 2 for C55x [15−0]

SSP − 4C System Stack Pointer [15−0]

SP − 4D User Stack Pointer [15−0]

SPH − 4E Extended Data Page Pointer for the SP and the SSP [6−0]

CDPH − 4F Main Data Page Pointer for the CDP [6−0]

*9 TEXAS INSTRUMENTS

Functional Overview

52 April 2001 − Revised January 2004SPRS163F

3.9 Peripheral Register Description

Each 5509 device has a set of memory-mapped registers associated with peripherals as listed in Table 3−18

through Table 3−36. Some registers use less than 16 bits. When reading these registers, unused bits are

always read as 0.

NOTE: The CPU access latency to the peripheral memory-mapped registers is 6 CPU cycles.

Following peripheral register update(s), the CPU must wait at least 6 CPU cycles before

attempting to use that peripheral. When more than one peripheral register is updated in a

sequence, the CPU only needs to wait following the final register write. For example, if the

EMIF is being reconfigured, the CPU must wait until the very last EMIF register update takes

effect before trying to access the external memory. The users should consult the respective

peripheral user’s guide to determine if a peripheral requires additional time to initialize itself

to the new configuration after the register updates take effect.

Before reading or writing to the USB register, the USB module has to be brought out of reset by setting bit 2

of the USB Idle Control and Status Register. Likewise, the MMC/SD must be selected by programming the

External Bus Selection Register before reading or writing the MMC/SD module registers.

Table 3−18. Idle Control, Status, and System Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x0001 ICR[7:0] Idle Control Register xxxx xxxx 0000 0000

0x0002 ISTR[7:0] Idle Status Register xxxx xxxx 0000 0000

0x07FD SYSR[15:0] System Register‡0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

‡System Register features are not supported on the 5509 device.

Table 3−19. External Memory Interface Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x0800 EGCR[15:0] EMIF Global Control Register xxxx xxxx 0010 xx00

0x0801 EMI_RST EMIF Global Reset Register xxxx xxxx xxxx xxxx

0x0802 EMI_BE[13:0] EMIF Bus Error Status Register xx00 0000 0000 0000

0x0803 CE0_1[14:0] EMIF CE0 Space Control Register 1 x010 1111 1111 1111

0x0804 CE0_2[15:0] EMIF CE0 Space Control Register 2 0100 1111 1111 1111

0x0805 CE0_3[7:0] EMIF CE0 Space Control Register 3 xxxx xxxx 0000 0000

0x0806 CE1_1[14:0] EMIF CE1 Space Control Register 1 x010 1111 1111 1111

0x0807 CE1_2[15:0] EMIF CE1 Space Control Register 2 0100 1111 1111 1111

0x0808 CE1_3[7:0] EMIF CE1 Space Control Register 3 xxxx xxxx 0000 0000

0x0809 CE2_1[14:0] EMIF CE2 Space Control Register 1 x010 1111 1111 1111

0x080A CE2_2[15:0] EMIF CE2 Space Control Register 2 0101 1111 1111 1111

0x080B CE2_3[7:0] EMIF CE2 Space Control Register 3 xxxx xxxx 0000 0000

0x080C CE3_1[14:0] EMIF CE3 Space Control Register 1 x010 1111 1111 1111

0x080D CE3_2[15:0] EMIF CE3 Space Control Register 2 0101 1111 1111 1111

0x080E CE3_3[7:0] EMIF CE3 Space Control Register 3 xxxx xxxx 0000 0000

0x080F SDC1[15:0] EMIF SDRAM Control Register 1 1111 1001 0100 1000

0x0810 SDPER[11:0] EMIF SDRAM Period Register xxxx 0000 1000 0000

0x0811 SDCNT[11:0] EMIF SDRAM Counter Register xxxx 0000 1000 0000

0x0812 INIT EMIF SDRAM Init Register xxxx xxxx xxxx xxxx

0x0813 SDC2[9:0] EMIF SDRAM Control Register 2 xxxx xx11 1111 1111

†Hardware reset; x denotes a “don’t care.”

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−20. DMA Configuration Registers

PORT ADDRESS

(WORD) REGISTER NAME DESCRIPTION RESET VALUE†

GLOBAL REGISTER

0x0E00 DMA_GCR[2:0] DMA Global Control Register xxxx xxxx xxxx x000

0x0E03 DMA_GTCR DMA Timeout Control Register

CHANNEL #0 REGISTERS

0x0C00 DMA_CSDP0 DMA Channel 0 Source Destination

Parameters Register 0000 0000 0000 0000

0x0C01 DMA_CCR0[15:0] DMA Channel 0 Control Register 0000 0000 0000 0000

0x0C02 DMA_CICR0[5:0] DMA Channel 0 Interrupt Control Register xxxx xxxx xx00 0011

0x0C03 DMA_CSR0[6:0] DMA Channel 0 Status Register xxxx xxxx xx00 0000

0x0C04 DMA_CSSA_L0 DMA Channel 0 Source Start Address Register

(lower bits) Undefined

0x0C05 DMA_CSSA_U0 DMA Channel 0 Source Start Address Register

(upper bits) Undefined

0x0C06 DMA_CDSA_L0 DMA Channel 0 Destination Start Address Register

(lower bits) Undefined

0x0C07 DMA_CDSA_U0 DMA Channel 0 Destination Start Address Register

(upper bits) Undefined

0x0C08 DMA_CEN0 DMA Channel 0 Element Number Register Undefined

0x0C09 DMA_CFN0 DMA Channel 0 Frame Number Register Undefined

0x0C0A DMA_CFI0 DMA Channel 0 Frame Index Register Undefined

0x0C0B DMA_CEI0 DMA Channel 0 Element Index Register Undefined

CHANNEL #1 REGISTERS

0x0C20 DMA_CSDP1 DMA Channel 1 Source Destination

Parameters Register 0000 0000 0000 0000

0x0C21 DMA_CCR1[15:0] DMA Channel 1 Control Register 0000 0000 0000 0000

0x0C22 DMA_CICR1[5:0] DMA Channel 1 Interrupt Control Register xxxx xxxx xx00 0011

0x0C23 DMA_CSR1[6:0] DMA Channel 1 Status Register xxxx xxxx xx00 0000

0x0C24 DMA_CSSA_L1 DMA Channel 1 Source Start Address Register

(lower bits) Undefined

0x0C25 DMA_CSSA_U1 DMA Channel 1 Source Start Address Register

(upper bits) Undefined

0x0C26 DMA_CDSA_L1 DMA Channel 1 Destination Start Address Register

(lower bits) Undefined

0x0C27 DMA_CDSA_U1 DMA Channel 1 Destination Start Address Register

(upper bits) Undefined

0x0C28 DMA_CEN1 DMA Channel 1 Element Number Register Undefined

0x0C29 DMA_CFN1 DMA Channel 1 Frame Number Register Undefined

0x0C2A DMA_CFI1 DMA Channel 1 Frame Index Register Undefined

0x0C2B DMA_CEI1 DMA Channel 1 Element Index Register Undefined

CHANNEL #2 REGISTERS

0x0C40 DMA_CSDP2 DMA Channel 2 Source Destination

Parameters Register 0000 0000 0000 0000

0x0C41 DMA_CCR2[15:0] DMA Channel 2 Control Register 0000 0000 0000 0000

0x0C42 DMA_CICR2[5:0] DMA Channel 2 Interrupt Control Register xxxx xxxx xx00 0011

†Hardware reset; x denotes a “don’t care.”

*9 TEXAS INSTRUMENTS

Functional Overview

54 April 2001 − Revised January 2004SPRS163F

Table 3−20. DMA Configuration Registers (Continued)

PORT ADDRESS

(WORD) RESET VALUE†

DESCRIPTIONREGISTER NAME

CHANNEL #2 REGISTERS (CONTINUED)

0x0C43 DMA_CSR2[6:0] DMA Channel 2 Status Register xxxx xxxx xx00 0000

0x0C44 DMA_CSSA_L2 DMA Channel 2 Source Start Address Register

(lower bits) Undefined

0x0C45 DMA_CSSA_U2 DMA Channel 2 Source Start Address Register

(upper bits) Undefined

0x0C46 DMA_CDSA_L2 DMA Channel 2 Destination Start Address Register

(lower bits) Undefined

0x0C47 DMA_CDSA_U2 DMA Channel 2 Destination Start Address Register

(upper bits) Undefined

0x0C48 DMA_CEN2 DMA Channel 2 Element Number Register Undefined

0x0C49 DMA_CFN2 DMA Channel 2 Frame Number Register Undefined

0x0C4A DMA_CFI2 DMA Channel 2 Frame Index Register Undefined

0x0C4B DMA_CEI2 DMA Channel 2 Element Index Register Undefined

CHANNEL #3 REGISTERS

0x0C60 DMA_CSDP3 DMA Channel 3 Source Destination

Parameters Register 0000 0000 0000 0000

0x0C61 DMA_CCR3[15:0] DMA Channel 3 Control Register 0000 0000 0000 0000

0x0C62 DMA_CICR3[5:0] DMA Channel 3 Interrupt Control Register xxxx xxxx xx00 0011

0x0C63 DMA_CSR3[6:0] DMA Channel 3 Status Register xxxx xxxx xx00 0000

0x0C64 DMA_CSSA_L3 DMA Channel 3 Source Start Address Register

(lower bits) Undefined

0x0C65 DMA_CSSA_U3 DMA Channel 3 Source Start Address Register

(upper bits) Undefined

0x0C66 DMA_CDSA_L3 DMA Channel 3 Destination Start Address Register

(lower bits) Undefined

0x0C67 DMA_CDSA_U3 DMA Channel 3 Destination Start Address Register

(upper bits) Undefined

0x0C68 DMA_CEN3 DMA Channel 3 Element Number Register Undefined

0x0C69 DMA_CFN3 DMA Channel 3 Frame Number Register Undefined

0x0C6A DMA_CFI3 DMA Channel 3 Frame Index Register Undefined

0x0C6B DMA_CEI3 DMA Channel 3 Element Index Register Undefined

CHANNEL #4 REGISTERS

0x0C80 DMA_CSDP4 DMA Channel 4 Source Destination

Parameters Register 0000 0000 0000 0000

0x0C81 DMA_CCR4[15:0] DMA Channel 4 Control Register 0000 0000 0000 0000

0x0C82 DMA_CICR4[5:0] DMA Channel 4 Interrupt Control Register xxxx xxxx xx00 0011

0x0C83 DMA_CSR4[6:0] DMA Channel 4 Status Register xxxx xxxx xx00 0000

0x0C84 DMA_CSSA_L4 DMA Channel 4 Source Start Address Register

(lower bits) Undefined

0x0C85 DMA_CSSA_U4 DMA Channel 4 Source Start Address Register

(upper bits) Undefined

0x0C86 DMA_CDSA_L4 DMA Channel 4 Destination Start Address Register

(lower bits) Undefined

†Hardware reset; x denotes a “don’t care.”

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−20. DMA Configuration Registers (Continued)

PORT ADDRESS

(WORD) RESET VALUE†

DESCRIPTIONREGISTER NAME

CHANNEL #4 REGISTERS (CONTINUED)

0x0C87 DMA_CDSA_U4 DMA Channel 4 Destination Start Address Register

(upper bits) Undefined

0x0C88 DMA_CEN4 DMA Channel 4 Element Number Register Undefined

0x0C89 DMA_CFN4 DMA Channel 4 Frame Number Register Undefined

0x0C8A DMA_CFI4 DMA Channel 4 Frame Index Register Undefined

0x0C8B DMA_CEI4 DMA Channel 4 Element Index Register Undefined

CHANNEL #5 REGISTERS

0x0CA0 DMA_CSDP5 DMA Channel 5 Source Destination

Parameters Register 0000 0000 0000 0000

0x0CA1 DMA_CCR5[15:0] DMA Channel 5 Control Register 0000 0000 0000 0000

0x0CA2 DMA_CICR5[5:0] DMA Channel 5 Interrupt Control Register xxxx xxxx xx00 0011

0x0CA3 DMA_CSR5[6:0] DMA Channel 5 Status Register xxxx xxxx xx00 0000

0x0CA4 DMA_CSSA_L5 DMA Channel 5 Source Start Address Register

(lower bits) Undefined

0x0CA5 DMA_CSSA_U5 DMA Channel 5 Source Start Address Register

(upper bits) Undefined

0x0CA6 DMA_CDSA_L5 DMA Channel 5 Destination Start Address Register

(lower bits) Undefined

0x0CA7 DMA_CDSA_U5 DMA Channel 5 Destination Start Address Register

(upper bits) Undefined

0x0CA8 DMA_CEN5 DMA Channel 5 Element Number Register Undefined

0x0CA9 DMA_CFN5 DMA Channel 5 Frame Number Register Undefined

0x0CAA DMA_CFI5 DMA Channel 5 Frame Index Register Undefined

0x0CAB DMA_CEI5 DMA Channel 5 Element Index Register Undefined

†Hardware reset; x denotes a “don’t care.”

mum" Imam ‘ m m Man on {ma emmm, *9 TEXAS INSTRUMENTS

Functional Overview

56 April 2001 − Revised January 2004SPRS163F

Table 3−21. Real-Time Clock Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x1800 RTCSEC Seconds Register 0000 0000 0000 0000

0x1801 RTCSECA Seconds Alarm Register 0000 0000 0000 0000

0x1802 RTCMIN Minutes Register 0000 0000 0000 0000

0x1803 RTCMINA Minutes Alarm Register 0000 0000 0000 0000

0x1804 RTCHOUR Hours Register 0000 0000 0000 0000

0x1805 RTCHOURA Hours Alarm Register 0000 0000 0000 0000

0x1806 RTCDAYW Day of the Week Register 0000 0000 0000 0000

0x1807 RTCDAYM Day of the Month (date) Register 0000 0000 0000 0000

0x1808 RTCMONTH Month Register 0000 0000 0000 0000

0x1809 RTCYEAR Year Register 0000 0000 0000 0000

0x180A RTCPINTR Periodic Interrupt Selection Register 0000 0000 0000 0000

0x180B RTCINTEN Interrupt Enable Register 0000 0000 1000 0000

0x180C RTCINTFL Interrupt Flag Register 0000 0000 0000 0000

0x180D−0x1BFF Reserved

†Hardware reset; x denotes a “don’t care.”

Table 3−22. Clock Generator

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x1C00 CLKMD[14:0] Clock Mode Register 0010 0000 0000 0010 DIV1 mode

0x1E00

USBPLL[14:0]

USB PLL Clock Generator

If non-USB boot mode:

0010 0000 0000 0110 DIV2 mode

0x1E00

USBPLL[14:0]

USB PLL Clock Generator

If USB boot mode:

0010 0010 0001 0011 PLL MULT4 mode

†Hardware reset; x denotes a “don’t care.”

Table 3−23. Timers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x1000 TIM0[15:0] Timer Count Register, Timer #0 1111 1111 1111 1111

0x1001 PRD0[15:0] Period Register, Timer #0 1111 1111 1111 1111

0x1002 TCR0[15:0] Timer Control Register, Timer #0 0000 0000 0001 0000

0x1003 PRSC0[15:0] Timer Prescaler Register, Timer #0 xxxx 0000 xxxx 0000

0x2400 TIM1[15:0] Timer Count Register, Timer #1 1111 1111 1111 1111

0x2401 PRD1[15:0] Period Register, Timer #1 1111 1111 1111 1111

0x2402 TCR1[15:0] Timer Control Register, Timer #1 0000 0000 0001 0000

0x2403 PRSC1[15:0] Timer Prescaler Register, Timer #1 xxxx 0000 xxxx 0000

†Hardware reset; x denotes a “don’t care.”

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−24. Multichannel Serial Port #0

PORT ADDRESS

(WORD) REGISTER NAME DESCRIPTION RESET VALUE†

0x2800 DRR2_0[15:0] Data Receive Register 2, McBSP #0 0000 0000 0000 0000

0x2801 DRR1_0[15:0] Data Receive Register 1, McBSP #0 0000 0000 0000 0000

0x2802 DXR2_0[15:0] Data Transmit Register 2, McBSP #0 0000 0000 0000 0000

0x2803 DXR1_0[15:0] Data Transmit Register 1, McBSP #0 0000 0000 0000 0000

0x2804 SPCR2_0[15:0] Serial Port Control Register 2, McBSP #0 0000 0000 0000 0000

0x2805 SPCR1_0[15:0] Serial Port Control Register 1, McBSP #0 0000 0000 0000 0000

0x2806 RCR2_0[15:0] Receive Control Register 2, McBSP #0 0000 0000 0000 0000

0x2807 RCR1_0[15:0] Receive Control Register 1, McBSP #0 0000 0000 0000 0000

0x2808 XCR2_0[15:0] Transmit Control Register 2, McBSP #0 0000 0000 0000 0000

0x2809 XCR1_0[15:0] Transmit Control Register 1, McBSP #0 0000 0000 0000 0000

0x280A SRGR2_0[15:0] Sample Rate Generator Register 2, McBSP #0 0020 0000 0000 0000

0x280B SRGR1_0[15:0] Sample Rate Generator Register 1, McBSP #0 0000 0000 0000 0001

0x280C MCR2_0[15:0] Multichannel Control Register 2, McBSP #0 0000 0000 0000 0000

0x280D MCR1_0[15:0] Multichannel Control Register 1, McBSP #0 0000 0000 0000 0000

0x280E RCERA_0[15:0] Receive Channel Enable Register Partition A, McBSP #0 0000 0000 0000 0000

0x280F RCERB_0[15:0] Receive Channel Enable Register Partition B, McBSP #0 0000 0000 0000 0000

0x2810 XCERA_0[15:0] Transmit Channel Enable Register Partition A, McBSP #0 0000 0000 0000 0000

0x2811 XCERB_0[15:0] Transmit Channel Enable Register Partition B, McBSP #0 0000 0000 0000 0000

0x2812 PCR0[15:0] Pin Control Register, McBSP #0 0000 0000 0000 0000

0x2813 RCERC_0[15:0] Receive Channel Enable Register Partition C, McBSP #0 0000 0000 0000 0000

0x2814 RCERD_0[15:0] Receive Channel Enable Register Partition D, McBSP #0 0000 0000 0000 0000

0x2815 XCERC_0[15:0] Transmit Channel Enable Register Partition C, McBSP #0 0000 0000 0000 0000

0x2816 XCERD_0[15:0] Transmit Channel Enable Register Partition D, McBSP #0 0000 0000 0000 0000

0x2817 RCERE_0[15:0] Receive Channel Enable Register Partition E, McBSP #0 0000 0000 0000 0000

0x2818 RCERF_0[15:0] Receive Channel Enable Register Partition F, McBSP #0 0000 0000 0000 0000

0x2819 XCERE_0[15:0] Transmit Channel Enable Register Partition E, McBSP #0 0000 0000 0000 0000

0x281A XCERF_0[15:0] Transmit Channel Enable Register Partition F, McBSP #0 0000 0000 0000 0000

0x281B RCERG_0[15:0] Receive Channel Enable Register Partition G, McBSP #0 0000 0000 0000 0000

0x281C RCERH_0[15:0] Receive Channel Enable Register Partition H, McBSP #0 0000 0000 0000 0000

0x281D XCERG_0[15:0] Transmit Channel Enable Register Partition G, McBSP #0 0000 0000 0000 0000

0x281E XCERH_0[15:0] Transmit Channel Enable Register Partition H, McBSP #0 0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

*9 TEXAS INSTRUMENTS

Functional Overview

58 April 2001 − Revised January 2004SPRS163F

Table 3−25. Multichannel Serial Port #1

PORT ADDRESS

(WORD) REGISTER NAME DESCRIPTION RESET VALUE†

0x2C00 DRR2_1[15:0] Data Receive Register 2, McBSP #1 0000 0000 0000 0000

0x2C01 DRR1_1[15:0] Data Receive Register 1, McBSP #1 0000 0000 0000 0000

0x2C02 DXR2_1[15:0] Data Transmit Register 2, McBSP #1 0000 0000 0000 0000

0x2C03 DXR1_1[15:0] Data Transmit Register 1, McBSP #1 0000 0000 0000 0000

0x2C04 SPCR2_1[15:0] Serial Port Control Register 2, McBSP #1 0000 0000 0000 0000

0x2C05 SPCR1_1[15:0] Serial Port Control Register 1, McBSP #1 0000 0000 0000 0000

0x2C06 RCR2_1[15:0] Receive Control Register 2, McBSP #1 0000 0000 0000 0000

0x2C07 RCR1_1[15:0] Receive Control Register 1, McBSP #1 0000 0000 0000 0000

0x2C08 XCR2_1[15:0] Transmit Control Register 2, McBSP #1 0000 0000 0000 0000

0x2C09 XCR1_1[15:0] Transmit Control Register 1, McBSP #1 0000 0000 0000 0000

0x2C0A SRGR2_1[15:0] Sample Rate Generator Register 2, McBSP #1 0020 0000 0000 0000

0x2C0B SRGR1_1[15:0] Sample Rate Generator Register 1, McBSP #1 0000 0000 0000 0001

0x2C0C MCR2_1[15:0] Multichannel Control Register 2, McBSP #1 0000 0000 0000 0000

0x2C0D MCR1_1[15:0] Multichannel Control Register 1, McBSP #1 0000 0000 0000 0000

0x2C0E RCERA_1[15:0] Receive Channel Enable Register Partition A, McBSP #1 0000 0000 0000 0000

0x2C0F RCERB_1[15:0] Receive Channel Enable Register Partition B, McBSP #1 0000 0000 0000 0000

0x2C10 XCERA_1[15:0] Transmit Channel Enable Register Partition A, McBSP #1 0000 0000 0000 0000

0x2C11 XCERB_1[15:0] Transmit Channel Enable Register Partition B, McBSP #1 0000 0000 0000 0000

0x2C12 PCR1[15:0] Pin Control Register, McBSP #1 0000 0000 0000 0000

0x2C13 RCERC_1[15:0] Receive Channel Enable Register Partition C, McBSP #1 0000 0000 0000 0000

0x2C14 RCERD_1[15:0] Receive Channel Enable Register Partition D, McBSP #1 0000 0000 0000 0000

0x2C15 XCERC_1[15:0] Transmit Channel Enable Register Partition C, McBSP #1 0000 0000 0000 0000

0x2C16 XCERD_1[15:0] Transmit Channel Enable Register Partition D, McBSP #1 0000 0000 0000 0000

0x2C17 RCERE_1[15:0] Receive Channel Enable Register Partition E, McBSP #1 0000 0000 0000 0000

0x2C18 RCERF_1[15:0] Receive Channel Enable Register Partition F, McBSP #1 0000 0000 0000 0000

0x2C19 XCERE_1[15:0] Transmit Channel Enable Register Partition E, McBSP #1 0000 0000 0000 0000

0x2C1A XCERF_1[15:0] Transmit Channel Enable Register Partition F, McBSP #1 0000 0000 0000 0000

0x2C1B RCERG_1[15:0] Receive Channel Enable Register Partition G, McBSP #1 0000 0000 0000 0000

0x2C1C RCERH_1[15:0] Receive Channel Enable Register Partition H, McBSP #1 0000 0000 0000 0000

0x2C1D XCERG_1[15:0] Transmit Channel Enable Register Partition G, McBSP #1 0000 0000 0000 0000

0x2C1E XCERH_1[15:0] Transmit Channel Enable Register Partition H, McBSP #1 0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−26. Multichannel Serial Port #2

PORT ADDRESS

(WORD) REGISTER NAME DESCRIPTION RESET VALUE†

0x3000 DRR2_2[15:0] Data Receive Register 2, McBSP #2 0000 0000 0000 0000

0x3001 DRR1_2[15:0] Data Receive Register 1, McBSP #2 0000 0000 0000 0000

0x3002 DXR2_2[15:0] Data Transmit Register 2, McBSP #2 0000 0000 0000 0000

0x3003 DXR1_2[15:0] Data Transmit Register 1, McBSP #2 0000 0000 0000 0000

0x3004 SPCR2_2[15:0] Serial Port Control Register 2, McBSP #2 0000 0000 0000 0000

0x3005 SPCR1_2[15:0] Serial Port Control Register 1, McBSP #2 0000 0000 0000 0000

0x3006 RCR2_2[15:0] Receive Control Register 2, McBSP #2 0000 0000 0000 0000

0x3007 RCR1_2[15:0] Receive Control Register 1, McBSP #2 0000 0000 0000 0000

0x3008 XCR2_2[15:0] Transmit Control Register 2, McBSP #2 0000 0000 0000 0000

0x3009 XCR1_2[15:0] Transmit Control Register 1, McBSP #2 0000 0000 0000 0000

0x300A SRGR2_2[15:0] Sample Rate Generator Register 2, McBSP #2 0020 0000 0000 0000

0x300B SRGR1_2[15:0] Sample Rate Generator Register 1, McBSP #2 0000 0000 0000 0001

0x300C MCR2_2[15:0] Multichannel Control Register 2, McBSP #2 0000 0000 0000 0000

0x300D MCR1_2[15:0] Multichannel Control Register 1, McBSP #2 0000 0000 0000 0000

0x300E RCERA_2[15:0] Receive Channel Enable Register Partition A, McBSP #2 0000 0000 0000 0000

0x300F RCERB_2[15:0] Receive Channel Enable Register Partition B, McBSP #2 0000 0000 0000 0000

0x3010 XCERA_2[15:0] Transmit Channel Enable Register Partition A, McBSP #2 0000 0000 0000 0000

0x3011 XCERB_2[15:0] Transmit Channel Enable Register Partition B, McBSP #2 0000 0000 0000 0000

0x3012 PCR2[15:0] Pin Control Register, McBSP #2 0000 0000 0000 0000

0x3013 RCERC_2[15:0] Receive Channel Enable Register Partition C, McBSP #2 0000 0000 0000 0000

0x3014 RCERD_2[15:0] Receive Channel Enable Register Partition D, McBSP #2 0000 0000 0000 0000

0x3015 XCERC_2[15:0] Transmit Channel Enable Register Partition C, McBSP #2 0000 0000 0000 0000

0x3016 XCERD_2[15:0] Transmit Channel Enable Register Partition D, McBSP #2 0000 0000 0000 0000

0x3017 RCERE_2[15:0] Receive Channel Enable Register Partition E, McBSP #2 0000 0000 0000 0000

0x3018 RCERF_2[15:0] Receive Channel Enable Register Partition F, McBSP #2 0000 0000 0000 0000

0x3019 XCERE_2[15:0] Transmit Channel Enable Register Partition E, McBSP #2 0000 0000 0000 0000

0x301A XCERF_2[15:0] Transmit Channel Enable Register Partition F, McBSP #2 0000 0000 0000 0000

0x301B RCERG_2[15:0] Receive Channel Enable Register Partition G, McBSP #2 0000 0000 0000 0000

0x301C RCERH_2[15:0] Receive Channel Enable Register Partition H, McBSP #2 0000 0000 0000 0000

0x301D XCERG_2[15:0] Transmit Channel Enable Register Partition G, McBSP #2 0000 0000 0000 0000

0x301E XCERH_2[15:0] Transmit Channel Enable Register Partition H, McBSP #2 0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

*9 TEXAS INSTRUMENTS

Functional Overview

60 April 2001 − Revised January 2004SPRS163F

Table 3−27. GPIO

WORD

ADDRESS REGISTER

NAME PIN DESCRIPTION RESET VALUE†

0x3400 IODIR[7:0] GPIO[7:0] General-purpose I/O Direction Register 0000 0000 0000 0000

0x3401 IODATA[7:0] GPIO[7:0] General-purpose I/O Data Register 0000 0000 xxxx xxxx

0x4400 AGPIOEN[15:0] A[15:0] Address/GPIO Enable Register 0000 0000 0000 0000

0x4401 AGPIODIR[15:0] A[15:0] Address/GPIO Direction Register 0000 0000 0000 0000

0x4402 AGPIODATA[15:0] A[15:0] Address/GPIO Data Register xxxx xxxx xxxx xxxx

0x4403 EHPIGPIOEN[5:0] GPIO[13:8] EHPI/GPIO Enable Register 0000 0000 0000 0000

0x4404 EHPIGPIODIR[5:0] GPIO[13:8] EHPI/GPIO Direction Register 0000 0000 0000 0000

0x4405 EHPIGPIODATA[5:0] GPIO[13:8] EHPI/GPIO Data Register 0000 0000 00xx xxxx

†Hardware reset; x denotes a “don’t care.”

Table 3−28. Device Revision ID

WORD ADDRESS REGISTER NAME DESCRIPTION VALUE

0x3800 − 0x3803 Die ID[63:0] Factory Die Identification Reserved‡

0x3804 Rev ID[15:0] Silicon Revision Identification 0010 0101 0000 0010§

‡Contains factory information not intended for users.

§For additional information, see TMS320VC5509 Digital Signal Processor Silicon Errata (literature number SPRZ006).

Table 3−29. I2C Module Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x3C00 I2COAR[9:0]¶I2C Own Address Register 0000 0000 0000 0000

0x3C01 I2CIMR I2C Interrupt Mask Register 0000 0000 0000 0000

0x3C02 I2CSTR I2C Status Register 0000 0001 0000 0000

0x3C03 I2CCLKL[15:0] I2C Clock Divider Low Register 0000 0000 0000 0000

0x3C04 I2CCLKH[15:0] I2C Clock Divider High Register 0000 0000 0000 0000

0x3C05 I2CCNT[15:0] I2C Data Count 0000 0000 0000 0000

0x3C06 I2CDRR[7:0] I2C Data Receive Register 0000 0000 0000 0000

0x3C07 I2CSAR[9:0] I2C Slave Address Register 0000 0011 1111 1111

0x3C08 I2CDXR[7:0] I2C Data Transmit Register 0000 0000 0000 0000

0x3C09 I2CMDR[14:0] I2C Mode Register 0000 0000 0000 0000

0x3C0A I2CIVR I2C Interrupt Vector Register 0000 0000 0000 0000

0x3C0B I2CGPIO I2C General-Purpose Register xxxx xxxx xxxx xxxx

0x3C0C I2CPSC I2C Prescaler Register 0000 0000 0000 0000

0x3C0D − Reserved

0x3C0E − Reserved

0x3C0F − Reserved

− I2CRSR I2C receive shift register (not accessible to the CPU)

− I2CXSR I2C transmit shift register (not accessible to the CPU)

†Hardware reset; x denotes a “don’t care.”

¶Specifies a unique 5509 I2C address. This register must be set by the programmer. When this device is used in conjunction with another master

I2C device, the register must be programmed to the I2C slave address (01011xx) allocated by Philips Semiconductor for the 5509. The 2 LSBs

are the programmable address bits.

NOTE: I2C protocol compatible, no fail-safe buffer.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

Table 3−30. Watchdog Timer Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x4000 WDTIM[15:0] WD Timer Counter Register 1111 1111 1111 1111

0x4001 WDPRD[15:0] WD Timer Period Register 1111 1111 1111 1111

0x4002 WDTCR[13:0] WD Timer Control Register 0000 0011 1100 1111

0x4003 WDTCR2[15:0] WD Timer Control Register 2 0001 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

Table 3−31. MMC/SD1 Module Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x4800 MMCFCLK[8:0] MMC Function Clock Control Register 0000 0000 0000 0111

0x4801 MMCCTL[10:0] MMC Control Register 0000 0000 0000 0000

0x4802 MMCCLK[8:0] MMC Clock Control Register 0000 0000 0000 1111

0x4803 MMCST0[12:0] MMC Status Register 0 0000 0001 0000 0000

0x4804 MMCST1[5:0] MMC Status Register 1 0000 0000 0000 0000

0x4805 MMCIE[12:0] MMC Interrupt Enable Register 0000 0000 0000 0000

0x4806 MMCTOR[7:0] MMC Response Time-Out Register 0000 0000 0000 0000

0x4807 MMCTOD[15:0] MMC Data Read Time-Out Register 0000 0000 0000 0000

0x4808 MMCBLEN[11:0] MMC Block Length Register 0000 0010 0000 0000

0x4809 MMCNBLK[15:0] MMC Number of Blocks Register 0000 0000 0000 0000

0x480A MMCNBLC[15:0] MMC Number of Blocks Counter Register 0000 0000 0000 0000

0x480B MMCDRR[15:0] MMC Data Receive Register 0000 0000 0000 0000

0x480C MMCDXR[15:0] MMC Data Transmit Register 0000 0000 0000 0000

0x480D MMCCMD[15:0] MMC Command Register 0000 0000 0000 0000

0x480E MMCARGL[15:0] MMC Argument Register − Low 0000 0000 0000 0000

0x480F MMCARGH[15:0] MMC Argument Register − High 0000 0000 0000 0000

0x4810 MMCRSP0[15:0] MMC Response Register 0 0000 0000 0000 0000

0x4811 MMCRSP1[15:0] MMC Response Register 1 0000 0000 0000 0000

0x4812 MMCRSP2[15:0] MMC Response Register 2 0000 0000 0000 0000

0x4813 MMCRSP3[15:0] MMC Response Register 3 0000 0000 0000 0000

0x4814 MMCRSP4[15:0] MMC Response Register 4 0000 0000 0000 0000

0x4815 MMCRSP5[15:0] MMC Response Register 5 0000 0000 0000 0000

0x4816 MMCRSP6[15:0] MMC Response Register 6 0000 0000 0000 0000

0x4817 MMCRSP7[15:0] MMC Response Register 7 0000 0000 0000 0000

0x4818 MMCDRSP[7:0] MMC Data Response Register 0000 0000 0000 0000

0x4819 Reserved

0x481A MMCCIDX[7:0] MMC Command Index Register 0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

NOTE: The MMC/SD module must be selected in the External Bus Selection Register before any MMC/SD module register read or write attempt.

*9 TEXAS INSTRUMENTS

Functional Overview

62 April 2001 − Revised January 2004SPRS163F

Table 3−32. MMC/SD2 Module Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x4C00 MMCFCLK[8:0] MMC Function Clock Control Register 0000 0000 0000 0111

0x4C01 MMCCTL[10:0] MMC Control Register 0000 0000 0000 0000

0x4C02 MMCCLK[8:0] MMC Clock Control Register 0000 0000 0000 1111

0x4C03 MMCST0[12:0] MMC Status Register 0 0000 0001 0000 0000

0x4C04 MMCST1[5:0] MMC Status Register 1 0000 0000 0000 0000

0x4C05 MMCIE[12:0] MMC Interrupt Enable Register 0000 0000 0000 0000

0x4C06 MMCTOR[7:0] MMC Response Time-Out Register 0000 0000 0000 0000

0x4C07 MMCTOD[15:0] MMC Data Read Time-Out Register 0000 0000 0000 0000

0x4C08 MMCBLEN[11:0] MMC Block Length Register 0000 0010 0000 0000

0x4C09 MMCNBLK[15:0] MMC Number of Blocks Register 0000 0000 0000 0000

0x4C0A MMCNBLC[15:0] MMC Number of Blocks Counter Register 0000 0000 0000 0000

0x4C0B MMCDRR[15:0] MMC Data Receive Register 0000 0000 0000 0000

0x4C0C MMCDXR[15:0] MMC Data Transmit Register 0000 0000 0000 0000

0x4C0D MMCCMD[15:0] MMC Command Register 0000 0000 0000 0000

0x4C0E MMCARGL[15:0] MMC Argument Register − Low 0000 0000 0000 0000

0x4C0F MMCARGH[15:0] MMC Argument Register − High 0000 0000 0000 0000

0x4C10 MMCRSP0[15:0] MMC Response Register 0 0000 0000 0000 0000

0x4C11 MMCRSP1[15:0] MMC Response Register 1 0000 0000 0000 0000

0x4C12 MMCRSP2[15:0] MMC Response Register 2 0000 0000 0000 0000

0x4C13 MMCRSP3[15:0] MMC Response Register 3 0000 0000 0000 0000

0x4C14 MMCRSP4[15:0] MMC Response Register 4 0000 0000 0000 0000

0x4C15 MMCRSP5[15:0] MMC Response Register 5 0000 0000 0000 0000

0x4C16 MMCRSP6[15:0] MMC Response Register 6 0000 0000 0000 0000

0x4C17 MMCRSP7[15:0] MMC Response Register 7 0000 0000 0000 0000

0x4C18 MMCDRSP[7:0] MMC Data Response Register 0000 0000 0000 0000

0x4C19 Reserved

0x4C1A MMCCIDX[7:0] MMC Command Index Register 0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

NOTE: The MMC/SD module must be selected in the External Bus Selection Register before any MMC/SD module register read or write attempt.

Table 3−33. USB Module Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

DMA CONTEXTS

0x5800 Reserved

0x5808 DMAC_O1 Output Endpoint 1 DMA Context Register Undefined

0x5810 DMAC_O2 Output Endpoint 2 DMA Context Register Undefined

0x5818 DMAC_O3 Output Endpoint 3 DMA Context Register Undefined

0x5820 DMAC_O4 Output Endpoint 4 DMA Context Register Undefined

0x5828 DMAC_O5 Output Endpoint 5 DMA Context Register Undefined

0x5830 DMAC_O6 Output Endpoint 6 DMA Context Register Undefined

0x5838 DMAC_O7 Output Endpoint 7 DMA Context Register Undefined

0x5840 Reserved

†Hardware reset; x denotes a “don’t care.”

NOTE: The USB module must be brought out of reset by setting bit 2 of the USB Idle Control and Status Register before any USB module register

read or write attempt.

‘9 TEXAS INSTRUMENTS

Functional Overview

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Table 3−33. USB Module Registers (Continued)

WORD ADDRESS RESET VALUE†

DESCRIPTIONREGISTER NAME

DMA CONTEXTS (CONTINUED)

0x5848 DMAC_I1 Input Endpoint 1 DMA Context Register Undefined

0x5850 DMAC_I2 Input Endpoint 2 DMA Context Register Undefined

0x5858 DMAC_I3 Input Endpoint 3 DMA Context Register Undefined

0x5860 DMAC_I4 Input Endpoint 4 DMA Context Register Undefined

0x5868 DMAC_I5 Input Endpoint 5 DMA Context Register Undefined

0x5870 DMAC_I6 Input Endpoint 6 DMA Context Register Undefined

0x5878 DMAC_I7 Input Endpoint 7 DMA Context Register Undefined

DATA BUFFER

0x5880 Data Buffers Contains X/Y data buffers for endpoints 1 – 7 Undefined

0x6680 OEB_0 Output Endpoint 0 Buffer Undefined

0x66C0 IEB_0 Input Endpoint 0 Buffer Undefined

0x6700 SUP_0 Setup Packet for Endpoint 0 Undefined

ENDPOINT DESCRIPTOR BLOCKS

0x6708 OEDB_1 Output Endpoint 1 Descriptor Register Block Undefined

0x6710 OEDB_2 Output Endpoint 2 Descriptor Register Block Undefined

0x6718 OEDB_3 Output Endpoint 3 Descriptor Register Block Undefined

0x6720 OEDB_4 Output Endpoint 4 Descriptor Register Block Undefined

0x6728 OEDB_5 Output Endpoint 5 Descriptor Register Block Undefined

0x6730 OEDB_6 Output Endpoint 6 Descriptor Register Block Undefined

0x6738 OEDB_7 Output Endpoint 7 Descriptor Register Block Undefined

0x6740 Reserved

0x6748 IEDB_1 Input Endpoint 1 Descriptor Register Block Undefined

0x6750 IEDB_2 Input Endpoint 2 Descriptor Register Block Undefined

0x6758 IEDB_3 Input Endpoint 3 Descriptor Register Block Undefined

0x6760 IEDB_4 Input Endpoint 4 Descriptor Register Block Undefined

0x6768 IEDB_5 Input Endpoint 5 Descriptor Register Block Undefined

0x6770 IEDB_6 Input Endpoint 6 Descriptor Register Block Undefined

0x6778 IEDB_7 Input Endpoint 7 Descriptor Register Block Undefined

CONTROL AND STATUS REGISTERS

0x6780 IEPCNF_0 Input Endpoint 0 Configuration xxxx xxxx 0000 0000

0x6781 IEPBCNT_0 Input Endpoint 0 Byte Count xxxx xxxx 1000 0000

0x6782 OEPCNF_0 Output Endpoint 0 Configuration xxxx xxxx 0000 0000

0x6783 OEPBCNT_0 Output Endpoint 0 Byte Count xxxx xxxx 0000 0000

0x6784 − 0x6790 Reserved

0x6791 GLOBCTL Global Control Register xxxx xxxx 0000 0000

0x6792 VECINT Vector Interrupt Register xxxx xxxx 0000 0000

0x6793 IEPINT Input Endpoint Interrupt Register xxxx xxxx 0000 0000

0x6794 OEPINT Output Endpoint Interrupt Register xxxx xxxx 0000 0000

0x6795 IDMARINT Input DMA Reload Interrupt Register xxxx xxxx 0000 0000

0x6796 ODMARINT Output DMA Reload Interrupt Register xxxx xxxx 0000 0000

†Hardware reset; x denotes a “don’t care.”

NOTE: The USB module must be brought out of reset by setting bit 2 of the USB Idle Control and Status Register before any USB module register

read or write attempt.

*9 TEXAS INSTRUMENTS

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64 April 2001 − Revised January 2004SPRS163F

Table 3−33. USB Module Registers (Continued)

WORD ADDRESS RESET VALUE†

DESCRIPTIONREGISTER NAME

CONTROL AND STATUS REGISTERS (CONTINUED)

0x6797 IDMAGINT Input DMA Go Interrupt Register xxxx xxxx 0000 0000

0x6798 ODMAGINT Output DMA Go Interrupt Register xxxx xxxx 0000 0000

0x6799 IDMAMSK Input DMA Interrupt Mask Register xxxx xxxx 0000 0000

0x679A ODMAMSK Output DMA Interrupt Mask Register xxxx xxxx 0000 0000

0x679B IEDBMSK Input EDB Interrupt Mask Register xxxx xxxx 0000 0000

0x679C OEDBMSK Output EDB Interrupt Mask Register xxxx xxxx 0000 0000

0x67A0 HOSTCTL Host DMA Control Register xxxx xxxx xxxx x000

0x67A1 HOSTEP Host DMA Endpoint Register xxxx xxxx x000 0000

0x67A2 HOST Host DMA Status xxxx xxxx xxxx x001

0x67F8 FNUML Frame Number Low Register xxxx xxxx 0000 0000

0x67F9 FNUMH Frame Number High xxxx xxxx xxxx x000

0x67FA PSOFTMR PreSOF Interrupt Timer Register xxxx xxxx 0000 0000

0x67FC USBCTL USB Control Register xxxx xxxx 0101 0000

0x67FD USBMSK USB Interrupt Mask Register xxxx xxxx 0000 0000

0x67FE USBSTA USB Status Register xxxx xxxx 0000 0000

0x67FF FUNADR Function Address Register xxxx xxxx x000 0000

0x7000 USBIDLECTL USB Idle Control and Status Register xxxx xxxx xxxx x000

†Hardware reset; x denotes a “don’t care.”

NOTE: The USB module must be brought out of reset by setting bit 2 of the USB Idle Control and Status Register before any USB module register

read or write attempt.

Table 3−34. Analog-to-Digital Controller (ADC) Registers

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x6800 ADCCTL[15:11] ADC Control Register 0111 0000 0000 0000

0x6801 ADCDATA[15:0] ADC Data Register 0111 0000 0000 0000

0x6802 ADCCLKDIV[15:0] ADC Function Clock Divider Register 0000 0000 0000 1111

0x6803 ADCCLKCTL[8:0] ADC Clock Control Register 0000 0000 0000 0111

†Hardware reset; x denotes a “don’t care.”

Table 3−35. External Bus Selection Register

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x6C00 EBSR[15:0] External Bus Selection Register 0000 0000 0000 0011‡

†Hardware reset; x denotes a “don’t care.”

‡The reset value is 0000 0000 0000 0001 if GPIO0 = 1; the value is 0000 0000 0000 0011 if GPIO0 = 0.

Table 3−36. Secure ROM Register

WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE†

0x7400 SROM[0] Secure ROM Register 0000 0000 0000 0000

†Hardware reset; x denotes a “don’t care.”

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

3.10 Interrupts

Vector-relative locations and priorities for all internal and external interrupts are shown in Table 3−37.

Table 3−37. Interrupt Table

NAME SOFTWARE

(TRAP)

EQUIVALENT

RELATIVE

LOCATION†

(HEX BYTES) PRIORITY FUNCTION

RESET SINT0 0 0 Reset (hardware and software)

NMI‡SINT1 8 1 Nonmaskable interrupt

BERR SINT24 C0 2 Bus Error interrupt

INT0 SINT2 10 3 External interrupt #0

INT1 SINT16 80 4 External interrupt #1

INT2 SINT3 18 5 External interrupt #2

TINT0 SINT4 20 6 Timer #0 interrupt

RINT0 SINT5 28 7 McBSP #0 receive interrupt

XINT0 SINT17 88 8 McBSP #0 transmit interrupt

RINT1 SINT6 30 9 McBSP #1 receive interrupt

XINT1/MMCSD1 SINT7 38 10 McBSP #1 transmit interrupt, MMC/SD #1 interrupt

USB SINT8 40 11 USB interrupt

DMAC0 SINT18 90 12 DMA Channel #0 interrupt

DMAC1 SINT9 48 13 DMA Channel #1 interrupt

DSPINT SINT10 50 14 Interrupt from host

INT3/WDTINT SINT11 58 15 External interrupt #3 or Watchdog timer interrupt

INT4/RTC§SINT19 98 16 External interrupt #4 or RTC interrupt

RINT2 SINT12 60 17 McBSP #2 receive interrupt

XINT2/MMCSD2 SINT13 68 18 McBSP #2 transmit interrupt , MMC/SD #2 interrupt

DMAC2 SINT20 A0 19 DMA Channel #2 interrupt

DMAC3 SINT21 A8 20 DMA Channel #3 interrupt

DMAC4 SINT14 70 21 DMA Channel #4 interrupt

DMAC5 SINT15 78 22 DMA Channel #5 interrupt

TINT1 SINT22 B0 23 Timer #1 interrupt

IIC SINT23 B8 24 I2C interrupt

DLOG SINT25 C8 25 Data Log interrupt

RTOS SINT26 D0 26 Real-time Operating System interrupt

− SINT27 D8 27 Software interrupt #27

− SINT28 E0 28 Software interrupt #28

− SINT29 E8 29 Software interrupt #29

− SINT30 F0 30 Software interrupt #30

− SINT31 F8 31 Software interrupt #31

†Absolute addresses of the interrupt vector locations are determined by the contents of the IVPD and IVPH registers. Interrupt vectors for

interrupts 0−15 and 24−31 are relative to IVPD. Interrupt vectors for interrupts 16−23 are relative to IVPH.

‡The NMI pin is internally tied high. However, NMI interrupt vector can be used for SINT1 and Watchdog Timer Interrupt.

§It is recommended that either the INT4 or RTC interrupt be used. If both INT4 and RTC interrupts are used, one interrupt event can potentially

hold off the other interrupt. For example, if INT4 is asserted first and held low, the RTC interrupt will not be recognized until the INT4 pin is back

to high-logic state again. The INT4 pin must be pulled high if only the RTC interrupt is used.

*9 TEXAS INSTRUMENTS

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66 April 2001 − Revised January 2004SPRS163F

3.10.1 IFR and IER Registers

The IFR0 (Interrupt Flag Register 0) and IER0 (Interrupt Enable Register 0) bit layouts are shown in

Figure 3−17.

NOTE: Some of the interrupts are shared between multiple interrupt sources. All sources for

a particular bit are internally combined using a logic OR function so that no additional user

configuration is required to select the interrupt source. In the case of the serial port, the shared

functions are mutually exclusive so that only one of the interrupt sources will be active at a time

in a given system. For example: It is not possible to use McBSP2 and MMC/SD2

simultaneously. However, in the case of INT3/WDTINT it is possible to have active interrupts

simultaneously from both the external INT3 source and the watchdog timer. When an interrupt

is detected in this bit, the watchdog timer status register should be polled to determine if the

watchdog timer is the interrupt source.

15 14 13 12 11 10 9 8

DMAC5 DMAC4 XINT2/

MMCSD2 RINT2 INT3/

WDTINT DSPINT DMAC1 USB

R/W R/W R/W R/W R/W R/W R/W R/W

76543210

XINT1/

MMCSD1 RINT1 RINT0 TINT0 INT2 INT0 Reserved

R/W R/W R/W R/W R/W R/W

LEGEND: R = Read, W = Write, n = value after reset

Figure 3−17. IFR0 and IER0 Bit Locations

Table 3−38. IFR0 and IER0 Register Bit Fields

BIT

FUNCTION

NUMBER NAME

FUNCTION

15 DMAC5 DMA channel 5 interrupt flag/mask bit

14 DMAC4 DMA channel 4 interrupt flag/mask bit

13 XINT2/MMCSD2 This bit is used as either the McBSP2 transmit interrupt flag/mask bit, the MMC/SD2 interrupt

flag/mask bit.

12 RINT2 McBSP2 receive interrupt flag/mask bit.

11 INT3/WDTINT This bit is used as either the external user interrupt 3 flag/mask bit, or the watchdog timer interrupt

flag/mask bit.

10 DSPINT HPI host-to-DSP interrupt flag/mask.

9 DMAC1 DMA channel 1 interrupt flag/mask bit

8 USB USB interrupt flag/mask bit.

7 XINT1/MMCSD1 This bit is used as either the McBSP1 transmit interrupt flag/mask bit, the MMC/SD1 interrupt

flag/mask bit.

6 RINT1 McBSP1 receive interrupt flag/mask bit.

5 RINT0 McBSP0 receive interrupt flag bit

4 TINT0 Timer 0 interrupt flag bit

3 INT2 External interrupt 2 flag bit

2 INT0 External interrupt 0 flag bit

1−0 − Reserved for future expansion. These bits should always be written with 0.

‘9 TEXAS INSTRUMENTS

Functional Overview

April 2001 − Revised January 2004 SPRS163F

The IFR1 (Interrupt Flag Register 1) and IER1 (Interrupt Enable Register 1) bit layouts are shown in

Figure 3−18.

NOTE: It is possible to have active interrupts simultaneously from both the external interrupt 4

(INT4) and the real-time clock (RTC). When an interrupt is detected in this bit, the real-time

clock status register should be polled to determine if the real-time clock is the source of the

interrupt.

15 11 10 9 8

Reserved RTOS DLOG BERR

R/W−00000†R/W−0 R/W−0 R/W−0

76543210

I2C TINT1 DMAC3 DMAC2 INT4/RTC DMAC0 XINT0 INT1

R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0 R/W−0

LEGEND: R = Read, W = Write, n = value after reset

†Always write zeros.

Figure 3−18. IFR1 and IER1 Bit Locations

Table 3−39. IFR1 and IER1 Register Bit Fields

BIT

FUNCTION

NUMBER NAME

FUNCTION

15−11 − Reserved for future expansion. These bits should always be written with 0.

10 RTOS Real-time operating system interrupt flag/mask bit

9 DLOG Data log interrupt flag/mask bit

8 BERR Bus error interrupt flag/mask bit

7 I2C I2C interrupt flag/mask bit

6 TINT1 Timer 1 interrupt flag/mask bit

5 DMAC3 DMA channel 3 interrupt flag/mask bit

4 DMAC2 DMA channel 2 interrupt flag/mask bit

3INT4/RTC This bit can be used as either the external user interrupt 4 flag/mask bit, or the real-time clock

interrupt flag/mask bit.

2 DMAC0 DMA channel 0 interrupt flag/mask bit

1 XINT0 McBSP transmit 0 interrupt flag/mask bit

0 INT1 External user interrupt 1 flag/mask bit

3.10.2 Interrupt Timing

The external interrupts (INT[4:0]) are synchronized to the CPU by way of a two-flip-flop synchronizer. The

interrupt inputs are sampled on falling edges of the CPU clock. A sequence of 1-1-0-0-0 on consecutive cycles

on the interrupt pin is required for an interrupt to be detected. Therefore, the minimum low pulse duration on

the external interrupts on the 5509 is three CPU clock periods.

*9 TEXAS INSTRUMENTS

Functional Overview

68 April 2001 − Revised January 2004SPRS163F

3.10.3 Waking Up From IDLE Condition

One of the following four events can wake up the CPU from IDLE:

•Hardware Reset

•External Interrupt

•RTC Interrupt

•USB Event (Reset or Resume)

3.10.3.1 Waking Up From IDLE With Oscillator Disabled

With an external interrupt, a RTC interrupt, or an USB resume/reset, the clock generation circuit wakes up the

oscillator and enables the USB PLL to determine the oscillator stable time. In the case of the interrupt being

disabled by clearing the associated bit in the Interrupt Enable Register (IERx), the CPU is not “woken up”. If

the interrupt due to the wake-up event is enabled, the interrupt is sent to the CPU only after the oscillator is

stabilized and the USB PLL is locked. If the external interrupt serves as the wake-up event, the interrupt line

must stay low for a minimum of 3 CPU cycles after the oscillator is stabilized to wake up the CPU. Otherwise,

only the clock domain will wake up and another external interrupt will be needed to wake up the CPU.

Once out of IDLE, any system not using the USB should put the USB module in idle mode to reduce power

consumption.

For more details on the TMS320VC5509 oscillator-disable process, see the Disabling the Internal Oscillator

With External Crystal on the TMS320VC5509 DSP application report (literature number SPRA078).

3.10.4 Idling Clock Domain When External Parallel Bus Operating in EHPI Mode

The clock domain cannot be idled when the External Parallel Bus is operating in EHPI mode to ensure host

access to the DSP memory. To work around this restriction, use the HIDL bit of the External Bus Selection

XW DSP Functional Overview(|iterature number SPRU312) TMS320055X DSP CPU Reference Guide (literature number SPRU371) TMS320055X DSP Mnemanic Instruction Set Reference Guide (literature number SPRU374) TMS320055X DSP Algebraic Instruction Se! Relerence Guide (literature number SPRU375) 's Guide (literature number SPRU376) TMS320055X DSP Peripherals Overview Reference Guide (literature number SPRU317) 's Guide (literature number SPRU281) 's Guide (literature number SPRU280) '5 Reference (literature number SPRU422) *4? TEXAS INSTRUMENTS

Documentation Support

April 2001 − Revised January 2004 SPRS163F

4 Documentation Support

Extensive documentation supports all TMS320 DSP family of devices from product announcement through

applications development. The following types of documentation are available to support the design and use

of the TMS320C5000 platform of DSPs:

•TMS320C55x DSP Functional Overview (literature number SPRU312)

•Device-specific data sheets

•Complete user’s guides

•Development support tools

•Hardware and software application reports

TMS320C55x reference documentation includes, but is not limited to, the following:

•TMS320C55x DSP CPU Reference Guide (literature number SPRU371)

•TMS320C55x DSP Mnemonic Instruction Set Reference Guide (literature number SPRU374)

•TMS320C55x DSP Algebraic Instruction Set Reference Guide (literature number SPRU375)

•TMS320C55x DSP Programmer’s Guide (literature number SPRU376)

•TMS320C55x DSP Peripherals Overview Reference Guide (literature number SPRU317)

•TMS320C55x Optimizing C/C++ Compiler User’s Guide (literature number SPRU281)

•TMS320C55x Assembly Language Tools User’s Guide (literature number SPRU280)

•TMS320C55x DSP Library Programmer’s Reference (literature number SPRU422)

The reference guides describe in detail the TMS320C55x DSP products currently available and the

hardware and software applications, including algorithms, for fixed-point TMS320 DSP family of devices.

A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal

processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is

published quarterly and distributed to update TMS320 DSP customers on product information.

Information regarding TI DSP products is also available on the Worldwide Web at http://www.ti.com uniform

resource locator (URL).

TMS320 and TMS320C5000 are trademarks of Texas Instruments.

*9 TEXAS INSTRUMENTS

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70 April 2001 − Revised January 2004SPRS163F

4.1 Device and Development Tool Support Nomenclature

To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all

TMS320 DSP devices and support tools. Each TMS320 DSP commercial family member has one of three

prefixes: TMX, TMP, or TMS. Texas Instruments recommends two of three possible prefix designators for

support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from

engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).

Device development evolutionary flow:

TMX Experimental device that is not necessarily representative of the final device’s electrical specifications

TMP Final silicon die that conforms to the device’s electrical specifications but has not completed quality

and reliability verification

TMS Fully qualified production device

Support tool development evolutionary flow:

TMDX Development-support product that has not yet completed Texas Instruments internal qualification

testing.

TMDS Fully qualified development-support product

TMX and TMP devices and TMDX development-support tools are shipped with appropriate disclaimers

describing their limitations and intended uses. Experimental devices (TMX) may not be representative of a

final product and Texas Instruments reserves the right to change or discontinue these products without notice.

TMS devices and TMDS development-support tools have been characterized fully, and the quality and

reliability of the device have been demonstrated fully. TI’s standard warranty applies.

Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard

production devices. Texas Instruments recommends that these devices not be used in any production system

because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.

TMS320 is a trademark of Texas Instruments.

HE ‘9 TEXAS INSTRUMENTS

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April 2001 − Revised January 2004 SPRS163F

4.2 TMS320VC5509 Device Nomenclature

PREFIX

TMS 320 VC 5509 GHH

TMX = Experimental device

TMP = Prototype device

TMS = Qualified device

SMJ = MIL-STD-883C

SM = High Rel (non-883C)

DEVICE FAMILY

320 = TMS320 family

TECHNOLOGY

PACKAGE TYPE‡

GHH = 179-pin plastic BGA

PGE = 144-pin plastic LQFP

VC = Dual-Supply CMOS

DEVICE

55x DSP: 5509

†No silicon revision marked on the package indicates earlier (TMX or TMP) silicon. See the TMS320VC5509 Digital Signal Processor Silicon

Errata (literature number SPRZ006) to identify TMX or TMP silicon revision.

‡BGA = Ball Grid Array

LQFP = Low-Profile Quad Flatpack

(31)

DEVICE SILICON REVISION†

31= Revision 3.1

Figure 4−1. Device Nomenclature for the TMS320VC5509

*9 TEXAS INSTRUMENTS

Electrical Specifications

72 April 2001 − Revised January 2004SPRS163F

5 Electrical Specifications

This section provides the absolute maximum ratings and the recommended operating conditions for the

TMS320VC5509 DSP.

All electrical and switching characteristics in this data manual are valid over the recommended operating

conditions unless otherwise specified.

5.1 Absolute Maximum Ratings

The list of absolute maximum ratings are specified over operating case temperature. Stresses beyond those

listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any other conditions beyond those indicated

under Section 5.2 is not implied. Exposure to absolute-maximum-rated conditions for extended periods may

affect device reliability. All voltage values are with respect to VSS. Figure 5−1 provides the test load circuit

values for a 3.3-V I/O.

Supply voltage I/O range, DVDD − 0.3 V to 4.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Supply voltage core range, CVDD − 0.3 V to 2.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI − 0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range, VO − 0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating case temperature range, TC − 40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range Tstg − 55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

5.2 Recommended Operating Conditions

MIN NOM MAX UNIT

Core and Internal Memory

CVDD Device supply voltage, core 144 MHz 1.52 1.6 1.68 V

RVDD Device supply voltage, on-chip memory, 144 MHz 1.52 1.6 1.68 V

Peripherals

RCVDD RTC module supply voltage, core 1.52 1.6 1.68 V

RDVDD RTC module supply voltage, I/O (RTCINX1 and RTCINX2) 1.52 1.6 1.68 V

USBVDD USB module supply voltage, I/O (DP, DN, and PU) 3 3.3 3.6 V

DVDD Device supply voltage, I/O (except DP, DN, PU, SDA, SCL)†2.7 3.3 3.6 V

ADVDD A/D module digital supply voltage 2.7 3.3 3.6 V

AVDD A/D module analog supply voltage 2.7 3.3 3.6 V

Grounds

VSS Supply voltage, GND, I/O, and core 0 V

ADVSS Supply voltage, GND, A/D module, digital 0 V

AVSS Supply voltage, GND, A/D module, analog 0 V

†The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down.

Due to the fact that different voltage devices can be connected to the I2C bus, the level of logic 0 (low) and logic 1 (high) are not fixed and

depends on the associated VDD.

‡USB I/O pins DP and DN can tolerate a short circuit at D+ and D− to 0 V or 5 V, as long as the recommended series resistors (see Figure 5−40)

are connected between the D+ and DP (package), and the D− and DN (package). Do not apply a short circuit to the USB I/O pins DP and DN

in absence of the series resistors.

NOTE: USB PLL is powered from the core supply and is susceptible to core power supply ripple. The maximum allowable supply ripple is 1%

for 1 Hz to 5 kHz; 1.5% for 5 kHz to 10 MHz; 3% for 10 MHz to 100 MHz, and less than 5% for 100 MHz or greater.

ngmeve‘ Input vonage, no LowJevel mpul vmtage, L’O Loleevel ompm currem *4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

5.2 Recommended Operating Conditions (Continued)

UNITMAXNOMMIN

X2/CLKIN 2.2 DVDD + 0.3

DN and DP‡2.0

VIH High-level input voltage, I/O SDA & SCL: VDD related input levels†0.7*DVDD DVDD(max) +0.5 V

VIH

High-level input voltage, I/O

All other inputs

(including hysteresis inputs) 2.2 DVDD + 0.3

X2/CLKIN −0.3 0.7

DN and DP‡0.8

VIL Low-level input voltage, I/O SDA & SCL: VDD related input levels†−0.5 0.3 * DVDD V

VIL

Low-level input voltage, I/O

All other inputs

(including hysteresis inputs) −0.3 0.8

IOH

High-level output current

DN and DP‡ (VOH = 2.45 V) −17.0

High-level output current

All other outputs −4

DN and DP‡ (VOL = 0.36 V) 17.0

Low-level output current SDA and SCL†3mA

IOL

Low-level output current

All other outputs 4

TCOperating case temperature −40 85 _C

†The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down.

Due to the fact that different voltage devices can be connected to the I2C bus, the level of logic 0 (low) and logic 1 (high) are not fixed and

depends on the associated VDD.

‡USB I/O pins DP and DN can tolerate a short circuit at D+ and D− to 0 V or 5 V, as long as the recommended series resistors (see Figure 5−40)

are connected between the D+ and DP (package), and the D− and DN (package). Do not apply a short circuit to the USB I/O pins DP and DN

in absence of the series resistors.

NOTE: USB PLL is powered from the core supply and is susceptible to core power supply ripple. The maximum allowable supply ripple is 1%

for 1 Hz to 5 kHz; 1.5% for 5 kHz to 10 MHz; 3% for 10 MHz to 100 MHz, and less than 5% for 100 MHz or greater.

Loleevel output vouage mpux currem lor outputs m *9 TEXAS INSTRUMENTS

Electrical Specifications

74 April 2001 − Revised January 2004SPRS163F

5.3 Electrical Characteristics Over Recommended Operating Case Temperature

Range (Unless Otherwise Noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOH

High-level output voltage

DN, DP, and PU†DVDD = 3.3 ± 0.3 V,

IOH = −300 µA2.8 3.6

High-level output voltage

All other outputs DVDD = 3.3 ± 0.3 V,

IOH = MAX 2.4

SDA & SCL‡At 3 mA sink current 0 0.4

Low-level output voltage DN and DP†IOL = 3.0 mA 0.3 V

VOL

Low-level output voltage

All other outputs IOL = MAX 0.4

IIZ

Input current for outputs in

Output-only or I/O pins with bus

keepers (enabled) DVDD = MAX,

VO = VSS to DVDD −500 500

µA

Input current for outputs in

high-impedance All other output-only or I/O pins DVDD = MAX

VO = VSS to DVDD −5 5

Input pins with internal pulldown

(enabled) DVDD = MAX,

VI = VSS to DVDD 30 300

Input current

Input pins with internal pullup

(enabled) DVDD = MAX,

VI = VSS to DVDD −300 −30

µA

Input current

X2/CLKIN DVDD = MAX,

VI = VSS to DVDD −50 50

All other input-only pins DVDD = MAX,

VI = VSS to DVDD −5 5

IDDC CVDD Supply current, CPU + internal memory access§CVDD = 1.6V

CPU clock = 144 MHz

TC = 25_C

0.90 mA/

MHz

IDDP DVDD supply current, pins active¶DVDD = 3.3 V

CPU clock = 144 MHz

TC = 25_C

5.5 mA

IDDC CVDD supply current, standby#Oscillator disabled.

All domains in low-power state

CVDD = 1.6V

TC = 25_C250 µA

IDDP DVDD supply current, standby Oscillator disabled.

All domains in low-power state.

DVDD = 3.3 V

No I/O activity

TC = 25_C

10 µA

CiInput capacitance 3 pF

CoOutput capacitance 3 pF

†USB I/O pins DP and DN can tolerate a short circuit at D+ and D− to 0 V or 5 V, as long as the recommended series resistors (see Figure 5−40)

are connected between the D+ and DP (package), and the D− and DN (package). Do not apply a short circuit to the USB I/O pins DP and DN

in absence of the series resistors.

‡The I2C pins SDA and SCL do not feature fail-safe I/O buffers. These pins could potentially draw current when the device is powered down.

§CPU executing 75% Dual MAC + 25% ADD with moderate data bus activity (table of sine values). CPU and CLKGEN (DPLL) domain are active.

All other domains are idled.

¶One word of a table of a 16-bit sine value is written to the EMIF every 250 ns (64 Mbps). Each EMIF output pin is connected to a 10-pF load.

#In CLKGEN domain idle mode, X2/CLKIN becomes output and is driven low to stop external crystals (if used) from oscillating. Standby current

will be higher if an external clock source tries to drive the X2/CLKIN pin during this time.

NOTE: USB PLL is powered from the core supply and is susceptible to core power supply ripple. The maximum allowable supply ripple is 1%

for 1 Hz to 5 kHz; 1.5% for 5 kHz to 10 MHz; 3% for 10 MHz to 100 MHz, and less than 5% for 100 MHz or greater.

Am 2001 7 Rewsed January 2004 *4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

Transmission Line

4.0 pF 1.85 pF

Z0 = 50 Ω

(see note)

Tester Pin Electronics Data Manual Timing Reference Point

Output

Under

Test

NOTE: The data manual provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects

must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect.

The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from

the data manual timings.

42 Ω3.5 nH

Device Pin

(see note)

Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.

Figure 5−1. 3.3-V Test Load Circuit

5.4 Package Thermal Resistance Characteristics

Table 5−1 provides the estimated thermal resistance characteristics for the TMS320VC5509 DSP package

types.

Table 5−1. Thermal Resistance Characteristics

PARAMETER GHH

PACKAGE PGE

PACKAGE UNIT

RΘJA 54.1 66.7 °C/W

RΘJC 10.0 9.4 °C/W

*9 TEXAS INSTRUMENTS

Electrical Specifications

76 April 2001 − Revised January 2004SPRS163F

5.5 Timing Parameter Symbology

Timing parameter symbols used in the timing requirements and switching characteristics tables are created

in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related

terminology have been abbreviated as follows:

Lowercase subscripts and their meanings: Letters and symbols and their meanings:

a access time H High

c cycle time (period) L Low

d delay time V Valid

dis disable time Z High-impedance

en enable time

f fall time

h hold time

r rise time

su setup time

t transition time

v valid time

w pulse duration (width)

X Unknown, changing, or don’t care level

Am 2001 7 Rewsed January 2004 *9 TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

5.6 Clock Options

The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of two or four

or multiplied by one of several values to generate the internal machine cycle.

5.6.1 Internal System Oscillator With External Crystal

The internal oscillator is always enabled following a device reset. The oscillator requires an external crystal

or ceramic resonator connected across the X1 and X2/CLKIN pins. If the internal oscillator is not used, an

external clock source must be applied to the X2/CLKIN pin and the X1 pin should be left unconnected. Since

the internal oscillator can be used as a clock source to the PLLs, the crystal oscillation frequency can be

multiplied to generate the CPU clock and USB clock, if desired.

The crystal should be in fundamental-mode operation, and parallel resonant, with a maximum effective series

resistance (ESR) specified in Table 5−2. The connection of the required circuit is shown in Figure 5−2. Under

some conditions, all the components shown are not required. The capacitors, C1 and C2, should be chosen

such that the equation below is satisfied. CL in the equation is the load specified for the crystal that is also

specified in Table 5−2.

CL+C1C2

(C1)C2)

X2/CLKIN X1

C1 C2

Crystal

Figure 5−2. Internal System Oscillator With External Crystal

Table 5−2. Recommended Crystal Parameters

FREQUENCY RANGE (MHz) MAX ESR (Ω) CLOAD (pF) MAX CSHUNT (pF) RS (kΩ)

20−15 40 10 5 0

15−12 40 16 5 0

12−10 40 16 5 1.8

10−8 60 18 5 1.8

8−6 60 18 5 4.7

6−5 80 18 5 8.2

Although the recommended ESR presented in Table 5−2 as a maximum, theoretically, a crystal with a lower

maximum ESR might seem to meet the requirement. It is recommended that crystals which meet the

maximum ESR specification in Table 5−2 are used.

*9 TEXAS INSTRUMENTS

Electrical Specifications

78 April 2001 − Revised January 2004SPRS163F

5.6.2 Layout Considerations

Since parasitic capacitance, inductance and resistance can be significant in any circuit, good PC board layout

practices should always be observed when planning trace routing to the discrete components used in the

oscillator circuit. Specifically, the crystal and the associated discrete components should be located as close

to the DSP as physically possible. Also, X1 and X2/CLKIN traces should be separated as soon as possible

after routing away from the DSP to minimize parasitic capacitance between them, and a ground trace should

be run between these two signal lines. This also helps to minimize stray capacitance between these two

signals.

5.6.3 Clock Generation in Bypass Mode (DPLL Disabled)

The frequency of the reference clock provided at the X2/CLKIN pin can be divided by a factor of one, two, or

four to generate the internal CPU clock cycle. The divide factor (D) is set in the BYPASS_DIV field of the clock

mode register. The contents of this field only affect clock generation while the device is in bypass mode. In

this mode, the digital phase-locked loop (DPLL) clock synthesis is disabled.

Table 5−3 and Table 5−4 assume testing over recommended operating conditions and H = 0.5tc(CO) (see

Figure 5−3).

Table 5−3. CLKIN Timing Requirements

NO. MIN MAX UNIT

C1 tc(CI) Cycle time, X2/CLKIN 20 400†ns

C2 tf(CI) Fall time, X2/CLKIN 4 ns

C3 tr(CI) Rise time, X2/CLKIN 4 ns

C10 tw(CIL) Pulse duration, CLKIN low 6 ns

C11 tw(CIH) Pulse duration, CLKIN high 6 ns

†This device utilizes a fully static design and therefore can operate with tc(CI) approaching ∞. If an external crystal is used, the X2/CLKIN cycle

time is limited by the crystal frequency range listed in Table 5−2.

Table 5−4. CLKOUT Switching Characteristics

NO. PARAMETER MIN TYP MAX UNIT

C4 tc(CO) Cycle time, CLKOUT 20‡D*tc(CI)§1600†ns

C5 td(CIH-CO) Delay time, X2/CLKIN high to CLKOUT high/low 10 20 30 ns

C6 tf(CO) Fall time, CLKOUT 1 ns

C7 tr(CO) Rise time, CLKOUT 1 ns

C8 tw(COL) Pulse duration, CLKOUT low H−2 H+2 ns

C9 tw(COH) Pulse duration, CLKOUT high H−2 H+2 ns

†This device utilizes a fully static design and therefore can operate with tc(CO) approaching ∞. If an external crystal is used, the X2/CLKIN cycle

time is limited by the crystal frequency range listed in Table 5−2.

‡It is recommended that the DPLL synthesised clocking option be used to obtain maximum operating frequency.

§D = 1/(PLL Bypass Divider)

\K. at INSTRUMENTS *9 TEXAS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

C6 C8

X2/CLKIN

CLKOUT

C10 C11

NOTE A: The relationship of X2/CLKIN to CLKOUT depends on the PLL bypass divide factor chosen for the CLKMD register. The waveform

relationship shown in Figure 5−3 is intended to illustrate the timing parameters based on CLKOUT = 1/2(CLKIN) configuration.

Figure 5−3. Bypass Mode Clock Timings

5.6.4 Clock Generation in Lock Mode (DPLL Synthesis Enabled)

The frequency of the reference clock provided at the X2/CLKIN pin can be multiplied by a synthesis factor of

N to generate the internal CPU clock cycle. The synthesis factor is determined by:

N=M

where: M = the multiply factor set in the PLL_MULT field of the clock mode register

DL = the divide factor set in the PLL_DIV field of the clock mode register

Valid values for M are (multiply by) 2 to 31. Valid values for DL are (divide by) 1, 2, 3, and 4.

For detailed information on clock generation configuration, see the TMS320C55x DSP Peripherals Overview

Reference Guide (literature number SPRU317).

Table 5−5 and Table 5−6 assume testing over recommended operating conditions and H = 0.5tc(CO) (see

Figure 5−4).

Table 5−5. Multiply-By-N Clock Option Timing Requirements

NO. MIN MAX UNIT

C1 tc(CI) Cycle time, X2/CLKIN DPLL synthesis enabled 20†400 ns

C2 tf(CI) Fall time, X2/CLKIN 4 ns

C3 tr(CI) Rise time, X2/CLKIN 4 ns

C10 tw(CIL) Pulse duration, CLKIN low 6 ns

C11 tw(CIH) Pulse duration, CLKIN high 6 ns

†The clock frequency synthesis factor and minimum X2/CLKIN cycle time should be chosen such that the resulting CLKOUT cycle time is within

the specified range (tc(CO)). If an external crystal is used, the X2/CLKIN cycle time is limited by the crystal frequency range listed in Table 5−2.

Table 5−6. Multiply-By-N Clock Option Switching Characteristics

NO. PARAMETER MIN TYP MAX UNIT

C4 tc(CO) Cycle time, CLKOUT 6.94 tc(CI)*N‡1600 ns

C12 td(CI–CO) Delay time, X2/CLKIN high/low to CLKOUT high/low 10 20 30 ns

C6 tf(CO) Fall time, CLKOUT 1 ns

C7 tr(CO) Rise time, CLKOUT 1 ns

C8 tw(COL) Pulse duration, CLKOUT low H−2 H+2 ns

C9 tw(COH) Pulse duration, CLKOUT high H−2 H+2 ns

‡N = Clock frequency synthesis factor

w.....vmm, 2&wa 50 SPRS 163F *9 TEXAS INSTRUMENTS

Electrical Specifications

80 April 2001 − Revised January 2004SPRS163F

C1 C3 C2

C12

X2/CLKIN

CLKOUT Bypass Mode

C10 C11

NOTE A: The relationship of X2/CLKIN to CLKOUT depends on the PLL multiply and divide factor chosen for the CLKMD register. The waveform

relationship shown in Figure 5−3 is intended to illustrate the timing parameters based on CLKOUT = 1xCLKIN configuration.

Figure 5−4. External Multiply-by-N Clock Timings

5.6.5 Real-Time Clock Oscillator With External Crystal

The real-time clock module includes an oscillator circuit. The oscillator requires an external 32.768-kHz crystal

connected across the RTCINX1 and RTCINX2 pins. The connection of the required circuit, consisting of the

crystal and two load capacitors, is shown in Figure 5−5. The load capacitors, C1 and C2, should be chosen

such that the equation below is satisfied. CL in the equation is the load specified for the crystal.

CL+C1C2

(C1)C2)

RTCINX1 RTCINX2

C1 C2

32.768 kHz

Crystal

Figure 5−5. Real-Time Clock Oscillator With External Crystal

NOTE: The RTC can be idled by not supplying its 32-kHz oscillator signal. In order to keep

RTC power dissipation to a minimum when the RTC module is not used, it is recommended

that the RTC module be powered up, the RTC input pin (RTCINX1) be pulled low, and the RTC

output pin (RTCINX2) be left floating.

‘9 TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

5.7 Memory Interface Timings

5.7.1 Asynchronous Memory Timings

Table 5−7 and Table 5−8 assume testing over recommended operating conditions (see Figure 5−6 and

Figure 5−7).

Table 5−7. Asynchronous Memory Cycle Timing Requirements

NO. MIN MAX UNIT

M1 tsu(DV-COH) Setup time, read data valid before CLKOUT high†10 ns

M2 th(COH-DV) Hold time, read data valid after CLKOUT high 0 ns

M3 tsu(ARDY-COH) Setup time, ARDY valid before CLKOUT high†10 ns

M4 th(COH-ARDY) Hold time, ARDY valid after CLKOUT high 0 ns

†To ensure data setup time, simply program the strobe width wide enough. ARDY is internally synchronized. If ARDY does meet setup or hold

time, it may be recognized in the current cycle or the next cycle. Thus, ARDY can be an asynchronous input.

Table 5−8. Asynchronous Memory Cycle Switching Characteristics

NO. PARAMETER MIN MAX UNIT

M5 td(COH-CEV) Delay time, CLKOUT high to CEx valid 0 8 ns

M6 td(COH-CEIV) Delay time, CLKOUT high to CEx invalid 0 8 ns

M7 td(COH-BEV) Delay time, CLKOUT high to BEx valid 8 ns

M8 td(COH-BEIV) Delay time, CLKOUT high to BEx invalid 0 ns

M9 td(COH-AV) Delay time, CLKOUT high to address valid 8 ns

M10 td(COH-AIV) Delay time, CLKOUT high to address invalid 0 ns

M11 td(COH-AOEV) Delay time, CLKOUT high to AOE valid 0 6 ns

M12 td(COH-AOEIV) Delay time, CLKOUT high to AOE invalid 0 6 ns

M13 td(COH-AREV) Delay time, CLKOUT high to ARE valid 0 6 ns

M14 td(COH-AREIV) Delay time, CLKOUT high to ARE invalid 0 6 ns

M15 td(COH-DV) Delay time, CLKOUT high to data valid 6 ns

M16 td(COH-DIV) Delay time, CLKOUT high to data invalid 0 ns

M17 td(COH-AWEV) Delay time, CLKOUT high to AWE valid 0 6 ns

M18 td(COH-AWEIV) Delay time, CLKOUT high to AWE invalid 0 6 ns

INSTRUMENTS *9 TEXAS

Electrical Specifications

82 April 2001 − Revised January 2004SPRS163F

Setup = 2 Strobe = 5 Not Ready = 2

Hold

= 1

Extended

Hold = 2

CLKOUT†

CEx‡

BEx

A[20:0]§

D[15:0]

AOE

ARE

AWE

ARDY

M9 M10

M1 M2

M12

M14

M11

M13

†CLKOUT is equal to CPU clock

‡CEx becomes active depending on the memory address space being accessed

§A[13:0] for LQFP

Figure 5−6. Asynchronous Memory Read Timings

0'0'0'0'0' 0303 30303 ,0 0 3 '0'0'0'0 0'0' 03030303030303 70' 0303 0'0'0'0'0'0'0'0'0'0 ’0303030303030303030‘ 0 30. 'A'0'0'0'0'0'0'0'0'0'0 ’03030303030303030303 0'0'0'0'0'0'0'0'0'0‘0 ‘030303030303030303030 0,. 30 '0'0'0'0'0 30303 3030 0 0'0'0 0303 0 '0'0'0' 3030303 INSTRUMENTS *9 TEXAS Am 2001 7 Revrsed Jan

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

Setup = 2 Strobe = 5 Not Ready = 2 Hold = 1

Extended

Hold = 2

M17

LKOUT†

CEx‡

BEx

A[20:0]§

D[15:0]

AOE

ARE

AWE

ARDY

M9 M10

M18

M3M4

M15 M16

†CLKOUT is equal to CPU clock

‡CEx becomes active depending on the memory address space being accessed

§A[13:0] for LQFP

Figure 5−7. Asynchronous Memory Write Timings

PARAMETER *9 TEXAS INSTRUMENTS

Electrical Specifications

84 April 2001 − Revised January 2004SPRS163F

5.7.2 Synchronous DRAM (SDRAM) Timings

Table 5−9, Table 5−10, Table 5−11, and Table 5−12 assume testing over recommended operating conditions

(see Figure 5−8 through Figure 5−13).

Table 5−9. Synchronous DRAM Cycle Timing Requirements

[SDRAM Clock = 1X, (1/4)X, and (1/8)X of CPU Clock]†

NO. MIN MAX UNIT

M19 tsu(DV-CLKMEMH) Setup time, read data valid before CLKMEM high 9 ns

M20 th(CLKMEMH-DV) Hold time, read data valid after CLKMEM high 0 ns

M21 tc(CLKMEM) Cycle time, CLKMEM 13.88‡ns

†The EMIFX2 bit of the External Bus Selection Register (EBSR) is cleared. See Section 3.5.1, External Bus Selection Register, for more details.

‡Maximum SDRAM operating frequency supported is 72 MHz.

Table 5−10. Synchronous DRAM Cycle Switching Characteristics

[SDRAM Clock = 1X, (1/4)X, and (1/8)X of CPU Clock]†

NO.

PARAMETER

CPU CLOCK (1/4)X

CPU CLOCK (1/8)X

CPU CLOCK

UNIT

NO.

PARAMETER

MIN MAX MIN MAX MIN MAX

UNIT

M22 td(CLKMEMH-CEL) Delay time, CLKMEM high to CEx low 0 6 21 26 35 40 ns

M23 td(CLKMEMH-CEH) Delay time, CLKMEM high to CEx high 0 6 21 26 35 40 ns

M24 td(CLKMEMH-BEV) Delay time, CLKMEM high to BEx valid 0 6 21 26 35 40 ns

M25 td(CLKMEMH-BEIV) Delay time, CLKMEM high to BEx invalid 0 6 21 26 35 40 ns

M26 td(CLKMEMH-AV) Delay time, CLKMEM high to address

valid 1 6 21 26 35 40 ns

M27 td(CLKMEMH-AIV) Delay time, CLKMEM high to address

invalid 1 6 21 26 35 40 ns

M28 td(CLKMEMH-SDCASL) Delay time, CLKMEM high to SDCAS low 0 6 21 26 35 40 ns

M29 td(CLKMEMH-SDCASH) Delay time, CLKMEM high to SDCAS

high 0 6 21 26 35 40 ns

M30 td(CLKMEMH-DV) Delay time, CLKMEM high to data valid 0 6 21 26 35 40 ns

M31 td(CLKMEMH-DIV) Delay time, CLKMEM high to data invalid 0 6 21 26 35 40 ns

M32 td(CLKMEMH-SDWEL) Delay time, CLKMEM high to SDWE low 0 6 21 26 35 40 ns

M33 td(CLKMEMH-SDWEH) Delay time, CLKMEM high to SDWE high 0 6 21 26 35 40 ns

M34 td(CLKMEMH-SDA10V) Delay time, CLKMEM high to SDA10

valid 0 6 21 26 35 40 ns

M35 td(CLKMEMH-SDA10IV) Delay time, CLKMEM high to SDA10

invalid 0 6 21 26 35 40 ns

M36 td(CLKMEMH-SDRASL) Delay time, CLKMEM high to SDRAS low 0 6 21 26 35 40 ns

M37 td(CLKMEMH-SDRASH) Delay time, CLKMEM high to SDRAS

high 0 6 21 26 35 40 ns

†The EMIFX2 bit of the External Bus Selection Register (EBSR) is cleared. See Section 3.5.1, External Bus Selection Register, for more details.

‘9 TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

Table 5−11. Synchronous DRAM Cycle Timing Requirements [SDRAM Clock = (1/2)X of CPU Clock]†

NO. MIN MAX UNIT

M19 tsu(DV-CLKMEMH) Setup time, read data valid before CLKMEM high 7 ns

M20 th(CLKMEMH-DV) Hold time, read data valid after CLKMEM high 0 ns

M21 tc(CLKMEM) Cycle time, CLKMEM 13.88‡ns

†The EMIFX2 bit of the External Bus Selection Register (EBSR) is set. See Section 3.5.1, External Bus Selection Register, for more details.

‡Maximum SDRAM operating frequency supported is 72 MHz.

Table 5−12. Synchronous DRAM Cycle Switching Characteristics [SDRAM Clock = (1/2)X of CPU Clock]†

NO. PARAMETER MIN MAX UNIT

M22 td(CLKMEMH-CEL) Delay time, CLKMEM high to CEx low 2 10 ns

M23 td(CLKMEMH-CEH) Delay time, CLKMEM high to CEx high 2 10 ns

M24 td(CLKMEMH-BEV) Delay time, CLKMEM high to BEx valid 2 10 ns

M25 td(CLKMEMH-BEIV) Delay time, CLKMEM high to BEx invalid 2 10 ns

M26 td(CLKMEMH-AV) Delay time, CLKMEM high to address valid 2 10 ns

M27 td(CLKMEMH-AIV) Delay time, CLKMEM high to address invalid 2 10 ns

M28 td(CLKMEMH-SDCASL) Delay time, CLKMEM high to SDCAS low 2 10 ns

M29 td(CLKMEMH-SDCASH) Delay time, CLKMEM high to SDCAS high 2 10 ns

M30 td(CLKMEMH-DV) Delay time, CLKMEM high to data valid 2 10 ns

M31 td(CLKMEMH-DIV) Delay time, CLKMEM high to data invalid 2 10 ns

M32 td(CLKMEMH-SDWEL) Delay time, CLKMEM high to SDWE low 2 10 ns

M33 td(CLKMEMH-SDWEH) Delay time, CLKMEM high to SDWE high 2 10 ns

M34 td(CLKMEMH-SDA10V) Delay time, CLKMEM high to SDA10 valid 2 10 ns

M35 td(CLKMEMH-SDA10IV) Delay time, CLKMEM high to SDA10 invalid 2 10 ns

M36 td(CLKMEMH-SDRASL) Delay time, CLKMEM high to SDRAS low 2 10 ns

M37 td(CLKMEMH-SDRASH) Delay time, CLKMEM high to SDRAS high 2 10 ns

†The EMIFX2 bit of the External Bus Selection Register (EBSR) is set. See Section 3.5.1, External Bus Selection Register, for more details.

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Electrical Specifications

86 April 2001 − Revised January 2004SPRS163F

M22

M24

M26

M27 M23

M34

M28

M35

M29

M19 M20

D1 D2 D3

CLKMEM

CEx†

BEx‡

EMIF.A[13:0]

D[15:0]

SDA10

SDRAS

SDCAS

SDWE

READ READ READ

CA1 CA2 CA3

M21

†The chip enable that becomes active depends on the address being accessed.

‡All BE[1:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals remain

active until the next access that is not an SDRAM read occurs.

Figure 5−8. Three SDRAM Read Commands

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Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

WRITE WRITE WRITE

M22

M24

M26

M30

M34

M28

M32

M25

M27

M31

M23

M35

M29

M33

BE1 BE2 BE3

CA1 CA2 CA3

D1 D2 D3

CLKMEM

CEx†

BEx‡

EMIF.A[13:0]

D[15:0]

SDA10

SDRAS

SDCAS

SDWE

†The chip enable that becomes active depends on the address being accessed.

‡All BE[1:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals remain

active until the next access that is not an SDRAM read occurs.

Figure 5−9. Three SDRAM WRT Commands

i ’\/\L\{\/ /\ \ ‘ ‘r—w * x x x \ \ \ \ H '0'O'OV9'9V9VVOVVOVV‘VVQ‘O‘O‘O‘O‘O‘O‘OVVO‘ tot.tototototo$to$2o2o2otototototot€ot¢ét¢ot¢ototototi \ \ \ \ H '9'.'0'0'0'.'0'.'0'9VOWVO‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O‘O 2.2.3.3.2.2.gtéozototototototoxmammtw 1+ w i—‘K_)’— *9 TEXAS INSTRUMENTS

Electrical Specifications

88 April 2001 − Revised January 2004SPRS163F

M23

M37

M22

M26

M34

M36

CLKMEM

CEx†

BEx‡

EMIF.A[13:0]

D[15:0]

SDA10

SDRAS

SDCAS

SDWE

ACTV

Bank Activate/Row Address

†The chip enable that becomes active depends on the address being accessed.

‡All BE[1:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals remain

active until the next access that is not an SDRAM read occurs.

Figure 5−10. SDRAM ACTV Command

l /\/\L\]‘(\/\/ \ ‘ ‘H Kz3'3’3’3’3’3‘3‘3‘3'3‘I‘3:3z3:3:3‘3‘2‘3‘3‘3‘3‘3‘3‘3‘3‘3'3‘3‘3‘3'3’3'33333‘3‘3‘3"3‘3‘3‘I'I‘3‘3‘3‘W‘3‘3‘3‘1‘3’3‘3’3'3‘3‘3‘3‘2‘3‘3‘3 OAQAQAQAOAOAOAOAQAOAOA A A A AOAOAOAOAOAOAQAQAOAOAQAOAOAOAOAOAOAOA A A0A0AOAO’OAOAOAOAOA.A9AOAOAOAOAOAOA0AOAOAOAQAOAOAOAOAOAOAOAOAOAOA A x \ «wow \ 'O'O'O'O'OVO‘O‘O'0'9'O'O'O'O'O'O'O'O'O'O'OVV 2o2ofo2o292o2ofo2oto2ofofo292Mo2o2ofofofofofofofofofofofo‘ ‘ ’ofofo2mfofo2ofofofofofofofofofofofofofof \ H H % HM *4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

M23

M37

M22

M36

CLKMEM

CEx†

BEx‡

EMIF.A[13:0]

D[15:0]

SDA10

SDRAS

SDCAS

SDWE

M34 M35

M32 M33

DCAB

†The chip enable that becomes active depends on the address being accessed.

‡All BE[1:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals remain

active until the next access that is not an SDRAM read occurs.

Figure 5−11. SDRAM DCAB Command

/ \zf\/\ \/\ / INSTRUMENTS *9 TEXAS

Electrical Specifications

90 April 2001 − Revised January 2004SPRS163F

M23

M37

M22

M36

CLKMEM

CEx†

BEx‡

EMIF.A[13:0]

D[15:0]

SDA10

SDRAS

SDCAS

SDWE

M28 M29

REFR

†The chip enable that becomes active depends on the address being accessed.

‡All BE[1:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals

remain active until the next access that is not an SDRAM read occurs.

Figure 5−12. SDRAM REFR Command

’\/\/E H \ l \z‘f\/\/ r w \ 3‘3‘3‘3‘3‘3‘3‘3’3’3’3’3’3’3’3’3'3’3‘3‘3‘3‘3‘3‘3’3‘3‘3’3???‘ .O.O.O.O.O.O.OAOAAOAOAOAOA03.9.9.0...03333533 “—w ovo'o'o'o'o'0'0'0'0'o'o'o'o'o'wo'o'o'o'o' o - ‘2o292o3o202o2ofofofofofotofofofofofofofofofof i—LJ— *4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

M23

M37

M22

M36

CLKMEM

CEx†

BEx‡

EMIF.A[13:0]

D[15:0]

SDA10

SDRAS

SDCAS

SDWE

M32 M33

MRS

MRS Value 0x30§

M26 M27

M28 M29

†The chip enable that becomes active depends on the address being accessed.

‡All BE[1:0] signals are driven low (active) during reads. Byte manipulation of the read data is performed inside the EMIF. These signals remain

active until the next access that is not an SDRAM read occurs.

§Write burst length = 1

Read latency = 3

Burst type = 0 (serial)

Burst length = 1

Figure 5−13. SDRAM MRS Command

*9 TEXAS INSTRUMENTS

Electrical Specifications

92 April 2001 − Revised January 2004SPRS163F

5.8 Reset Timings

5.8.1 Power-Up Reset (On-Chip Oscillator Active)

Table 5−13 assumes testing over recommended operating conditions (see Figure 5−14).

Table 5−13. Power-Up Reset (On-Chip Oscillator Active) Timing Requirements

NO. MIN MAX UNIT

R1 th(SUPSTBL-RSTL) Hold time, RESET low after oscillator stable†3P‡ns

†Oscillator stable time depends on the crystal characteristic (i.e., frequency, ESR, etc.) which varies from one crystal manufacturer to another.

Based on the crystal characteristics, the oscillator stable time can be in the range of a few to 10s of ms. A reset circuit with 100 ms or more delay

time will ensure the oscillator stabilized before the RESET goes high.

‡P = 1/(input clock frequency) in ns. For example, when input clock is 12 MHz, P = 83.33 ns.

CLKOUT

CVDD

DVDD

RESET

Figure 5−14. Power-Up Reset (On-Chip Oscillator Active) Timings

5.8.2 Power-Up Reset (On-Chip Oscillator Inactive)

Table 5−14 and Table 5−15 assume testing over recommended operating conditions (see Figure 5−15).

Table 5−14. Power-Up Reset (On-Chip Oscillator Inactive) Timing Requirements

NO. MIN MAX UNIT

R2 th(CLKOUTV-RSTL) Hold time, CLKOUT valid to RESET low 3P‡ns

‡P = 1/(input clock frequency) in ns. For example, when input clock is 12 MHz, P = 83.33 ns.

Table 5−15. Power-Up Reset (On-Chip Oscillator Inactive) Switching Characteristics

NO. PARAMETER MIN MAX UNIT

R3 td(CLKINV-CLKOUTV) Delay time, CLKIN valid to CLKOUT valid 30 ns

CVDD

DVDD

CLKOUT

X2/CLKIN

RESET

Figure 5−15. Power-Up Reset (On-Chip Oscillator Inactive) Timings

\ L—T | 1 1 )—‘( | )k ‘ ‘ | I *4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

5.8.3 Warm Reset

Table 5−16 and Table 5−17 assume testing over recommended operating conditions (see Figure 5−16).

Table 5−16. Reset Timing Requirements

NO. MIN MAX UNIT

R4 tw(RSL) Pulse width, reset low 3P†ns

†P = 1/CPU clock frequency in ns. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−17. Reset Switching Characteristics†

NO. PARAMETER MIN MAX UNIT

R5 td(RSTH-BKV) Delay time, reset high to BK group valid‡38P + 6 ns

R6 td(RSTH-HIGHV) Delay time, reset high to High group valid§38P + 6 ns

R7 td(RSTL-ZIV) Delay time, reset low to Z group invalid¶20 ns

R8 td(RSTH-ZV) Delay time, reset high to Z group valid¶38P + 6 ns

†P = 1/CPU clock frequency in ns. For example, when running parts at 144 MHz, use P = 6.94 ns.

‡BK group: Pins with bus keepers, holds previous state during reset. Following low-to-high transition of RESET, these pins go to their post-reset

logic state.

BK group pins: A’[0], A[15:0], D[15:0], C[14:2], C0, GPIO5, S13, and S23

§High group: Following low-to-high transition of RESET, these pins go to logic-high state.

High group pins: C1[HPI.HINT], XF

¶Z group: Bidirectional pins which become input or output pins. Following low-to-high transition of RESET, these pins go to high-impedance state.

Z group pins: C1[EMIF.AOE], GPIO[7:6, 4:0], TIN/TOUT0, SDA, SCL, CLKR0, FSRX0, CLKX0, DX0, FSX0, S[25:24, 22:20, 15:14, 12:10],

A[20:16]

RESET

BK Group†

igh Group‡

Z Group§

†BK group pins: A’[0], A[15:0], D[15:0], C[14:2], C0, GPIO5, S13, and S23

‡High group pins: C1[HPI.HINT], XF

§Z group pins: C1[EMIF.AOE], GPIO[7:6, 4:0], TIN/TOUT0, SDA, SCL, CLKR0, FSRX0, CLKX0, DX0, FSX0, S[25:24, 22:20, 15:14, 12:10]

A[20:16]

Figure 5−16. Reset Timings

'9'9'9'9'9'O'O'OV'O'OVOV9'9'9'Q'OV'OV'OVVVVOV'OV ’§292o29202¢202920292¢2o2¢2o2¢o29202920292¢292¢292€o2¢o2¢2 r— —w x w \ vo'owo'owo'ow 'o'o'o'o'o'o'wo'o'ow \ sfofofotofofofofofofofofofo. ofofofofofofofofofofofofofm \ Hiﬂ : ﬁﬂ% gy— *9 TEXAS INSTRUMENTS

Electrical Specifications

94 April 2001 − Revised January 2004SPRS163F

5.9 External Interrupt Timings

Table 5−18 assumes testing over recommended operating conditions (see Figure 5−17).

Table 5−18. External Interrupt Timing Requirements†

NO. MIN MAX UNIT

I1 tw(INTL)A Pulse width, interrupt low, CPU active 3P ns

I2 tw(INTH)A Pulse width, interrupt high, CPU active 2P ns

†P = 1/CPU clock frequency in ns. For example, when running parts at 144 MHz, use P = 6.94 ns.

INTn

Figure 5−17. External Interrupt Timings

5.10 Wake-Up From IDLE

Table 5−19 assumes testing over recommended operating conditions (see Figure 5−18).

Table 5−19. Wake-Up From IDLE Switching Characteristics†

NO. PARAMETER MIN TYP MAX UNIT

ID1 td(WKPEVTL-CLKGEN) Delay time, wake-up event low to clock generation enable

(CPU and clock domain idle) 1.25‡ms

ID2 th(CLKGEN-WKPEVTL) Hold time, clock generation enable to wake-up event low

(CPU and clock domain in idle) 3P§ns

ID3 tw(WKPEVTL) Pulse width, wake-up event low (for CPU idle only) 3P ns

†P = 1/CPU clock frequency in ns. For example, when running parts at 144 MHz, use P = 6.94 ns.

‡Based on 12-MHz crystal used with on-chip oscillator at 25°C. This number will vary based on the actual crystal characteristics operating condition

and the PC board layout and the parasitics.

§Following the clock generation domain idle, the INTx becomes level-sensitive and stays that way until the low-to-high transition of INTx following

the CPU wake-up. Holding the INTx low longer than minimum requirement will send more than one interrupt to the CPU. The number of interrupts

sent to the CPU depends on the INTx-low time following the CPU wake-up from IDLE.

ID1

ID2

ID3

RESET,

INTx

Figure 5−18. Wake-Up From IDLE Timings

/\4’\/\/ *4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

5.11 XF Timings

Table 5−20 assumes testing over recommended operating conditions (see Figure 5−19).

Table 5−20. XF Switching Characteristics

NO. PARAMETER MIN MAX UNIT

td(XF)

Delay time, CLKOUT high to XF high 0 3

d(XF) Delay time, CLKOUT high to XF low 0 3

CLKOUT†

†CLKOUT reflects the CPU clock.

Figure 5−19. XF Timings

G1 Menace“, Setup «ma {Ox mpm vahd belore CLKOUT mgn momma) momma) *9 TEXAS INSTRUMENTS

Electrical Specifications

96 April 2001 − Revised January 2004SPRS163F

5.12 General-Purpose Input/Output (GPIOx) Timings

Table 5−21 and Table 5−22 assume testing over recommended operating conditions (see Figure 5−20).

Table 5−21. GPIO Pins Configured as Inputs Timing Requirements

NO. MIN MAX UNIT

GPIO 6

G1 t

su(GPIO-COH)

Setup time, IOx input valid before CLKOUT high AGPIO†8ns

tsu(GPIO-COH)

Setup time, IOx input valid before CLKOUT high

EHPIGPIO‡8

GPIO 0

G2 th(COH-GPIO) Hold time, IOx input valid after CLKOUT high AGPIO†0 ns

h(COH-GPIO)

EHPIGPIO‡0

†AGPIO pins: A[15:0]

‡EHPIGPIO pins: C13, C10, C7, C5, C4, and C0

Table 5−22. GPIO Pins Configured as Outputs Switching Characteristics

NO. PARAMETER MIN MAX UNIT

GPIO 0 5

G3 td(COH-GPIO) Delay time, CLKOUT high to IOx output change AGPIO†1 9 ns

d(COH-GPIO)

EHPIGPIO‡1 9

†AGPIO pins: A[15:0]

‡EHPIGPIO pins: C13, C10, C7, C5, C4, and C0

CLKOUT†

IOx

Input Mode

IOx

Output Mode

†CLKOUT reflects the CPU clock.

Figure 5−20. General-Purpose Input/Output (IOx) Signal Timings

*4? TEXAS INSTRUMENTS

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

5.13 TIN/TOUT Timings (Timer0 Only)

Table 5−23 and Table 5−24 assumes testing over recommended operating conditions (see Figure 5−21 and

Figure 5−22).

Table 5−23. TIN/TOUT Pins Configured as Inputs Timing Requirements†‡

NO. MIN MAX UNIT

T4 tw(TIN/TOUTL) Pulse width, TIN/TOUT low 2P + 1 ns

T5 tw(TIN/TOUTH) Pulse width, TIN/TOUT high 2P + 1 ns

†P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

‡Only the Timer0 signal is externally available. The Timer1 signal is internally terminated and is not available for external use.

Table 5−24. TIN/TOUT Pins Configured as Outputs Switching Characteristics†‡§

NO. PARAMETER MIN MAX UNIT

T1 td(COH-TIN/TOUTH) Delay time, CLKOUT high to TIN/TOUT high 0 3 ns

T2 td(COH-TIN/TOUTL) Delay time, CLKOUT high to TIN/TOUT low 0 3 ns

T3 tw(TIN/TOUT) Pulse duration, TIN/TOUT (output) P − 1 ns

†P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

‡Only the Timer0 signal is externally available. The Timer1 signal is internally terminated and is not available for external use.

§For proper operation of the TIN/TOUT pin configured as an output, the timer period must be configured for at least 4 cycles.

TIN/TOUT

as Input

T5 T4

Figure 5−21. TIN/TOUT Timings When Configured as Inputs

TIN/TOUT

as Output

CLKOUT

Figure 5−22. TIN/TOUT Timings When Configured as Outputs

*9 TEXAS INSTRUMENTS

Electrical Specifications

98 April 2001 − Revised January 2004SPRS163F

5.14 Multichannel Buffered Serial Port (McBSP) Timings

5.14.1 McBSP Transmit and Receive Timings

Table 5−25 and Table 5−26 assume testing over recommended operating conditions (see Figure 5−23 and

Figure 5−24).

Table 5−25. McBSP Transmit and Receive Timing Requirements†

NO. MIN MAX UNIT

MC1 tc(CKRX) Cycle time, CLKR/X CLKR/X ext 2P‡ns

MC2 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext P–1‡ns

MC3 tr(CKRX) Rise time, CLKR/X CLKR/X ext 6 ns

MC4 tf(CKRX) Fall time, CLKR/X CLKR/X ext 6 ns

MC5

tsu(FRH-CKRL)

Setup time, external FSR high before CLKR low

CLKR int 12

MC5

su(FRH-CKRL)

Setup time, external FSR high before CLKR low

CLKR ext 2

MC6

th(CKRL-FRH)

Hold time, external FSR high after CLKR low

CLKR int 3

MC6

h(CKRL-FRH)

Hold time, external FSR high after CLKR low

CLKR ext 2

MC7

tsu(DRV-CKRL)

Setup time, DR valid before CLKR low

CLKR int 10

MC7

su(DRV-CKRL)

Setup time, DR valid before CLKR low

CLKR ext 2

MC8

th(CKRL-DRV)

Hold time, DR valid after CLKR low

CLKR int 3

MC8

h(CKRL-DRV)

Hold time, DR valid after CLKR low

CLKR ext 3

MC9

tsu(FXH-CKXL)

Setup time, external FSX high before CLKX low

CLKX int 12

MC9

su(FXH-CKXL)

Setup time, external FSX high before CLKX low

CLKX ext 2

MC10

th(CKXL-FXH)

Hold time, external FSX high after CLKX low

CLKX int 4

MC10

h(CKXL-FXH)

Hold time, external FSX high after CLKX low

CLKX ext 2

†Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are

also inverted.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Disame «me. ox hlgmmpedance lrom CLKX high Delay ume. CLKX high to DX vahd. Mm: ‘ . _ DXENA=O "‘ when \n Da|a Delay 1 or 2 DXENA =1 mgn‘l DXENA = O MC17 ! ~ n5 ”M. . M. M‘ < ..="" n="" dxena="1" dxena="O" mc1b="" ~="" -="" ‘="" .="" ‘="" -="" n5="" when="" in="" da|a="" delay="" 0="" (xdatdly="00D)" dxena="1" dxena="O" m519="" 1="" w.="" a="" .="" ‘="" .="" ‘="" .="" "5="" when="" in="" da|a="" delay="" 0="" (xdatdly="00D)" dxena="" ,="" 4:9="" texas="" instruments="">

Electrical Specifications

April 2001 − Revised January 2004 SPRS163F

Table 5−26. McBSP Transmit and Receive Switching Characteristics†‡

NO. PARAMETER MIN MAX UNIT

MC1 tc(CKRX) Cycle time, CLKR/X CLKR/X int 2P ns

MC11 tw(CKRXH) Pulse duration, CLKR/X high CLKR/X int D−1§D+1§ns

MC12 tw(CKRXL) Pulse duration, CLKR/X low CLKR/X int C−1§C+1§ns

MC13

td(CKRH-FRV)

Delay time, CLKR high to internal FSR valid

CLKR int −4 1

MC13

d(CKRH-FRV)

Delay time, CLKR high to internal FSR valid

CLKR ext 4 13

MC14

td(CKXH-FXV)

Delay time, CLKX high to internal FSX valid

CLKX int −4 1

MC14

d(CKXH-FXV)

Delay time, CLKX high to internal FSX valid

CLKX ext 4 14

MC15

tdis(CKXH-DXHZ)

Disable time, DX high-impedance from CLKX high

CLKX int 0 2

MC15

dis(CKXH-DXHZ)

Disable time, DX high-impedance from CLKX high

following last data bit CLKX ext 311

Delay time, CLKX high to DX valid.

CLKX int 6

Delay time, CLKX high to DX valid.

This applies to all bits except the first bit transmitted. CLKX ext 16

MC16

td(CKXH-DXV)

Delay time, CLKX high to DX valid¶

DXENA = 0

CLKX int 6

MC16

d(CKXH-DXV)

Only applies to first bit transmitted

DXENA = 0

CLKX ext 16

Only applies to first bit transmitted

when in Data Delay 1 or 2

DXENA = 1

CLKX int 2P + 6

when in Data Delay 1 or 2

(XDATDLY=01b or 10b) modes

DXENA = 1

CLKX ext 2P + 16

Enable time, DX driven from CLKX

high

DXENA = 0

CLKX int 2

MC17

ten(CKXH-DX)

high¶

DXENA = 0

CLKX ext 4

MC17

en(CKXH-DX) Only applies to first bit transmitted

when in Data Delay 1 or 2

DXENA = 1

CLKX int 2P − 2

when in Data Delay 1 or 2

(XDATDLY=01b or 10b) modes

DXENA = 1

CLKX ext 2P

Delay time, FSX high to DX valid¶

DXENA = 0

FSX int 6

MC18

td(FXH-DXV)

Only applies to first bit transmitted

DXENA = 0

FSX ext 16

MC18

d(FXH-DXV) Only applies to first bit transmitted

when in Data Delay 0 (XDATDLY=00b)

DXENA = 1

FSX int 2P + 6

when in Data Delay 0 (XDATDLY=00b)

mode.

DXENA = 1

FSX ext 2P + 16

Enable time, DX driven from FSX high¶

DXENA = 0

FSX int 0

MC19

ten(FXH-DX)

Only applies to first bit transmitted

DXENA = 0

FSX ext 3

MC19

en(FXH-DX) Only applies to first bit transmitted

when in Data Delay 0 (XDATDLY=00b)

DXENA = 1

FSX int 2P − 2

when in Data Delay 0 (XDATDLY=00b)

mode

DXENA = 1

FSX ext 2P − 2

†Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are

also inverted.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

§T=CLKRX period = (1 + CLKGDV) * P

C=CLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even

D=CLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even

¶See the TMS320C55x DSP Peripherals Overview Reference Guide (literature number SPRU317) for a description of the DX enable (DXENA)

and data delay features of the McBSP.

r V1 X P/ \ rX r 14“ w} 4‘ 4 \ k X k *4 1 1“ J *‘ “ ‘ f mm mm *1 11 ‘ \ , 3 INSTRUMENTS *9 TEXAS mu SPRS163F

Electrical Specifications

100 April 2001 − Revised January 2004SPRS163F

MC2, MC12

MC2, MC11

MC1

MC3

MC4

MC13 MC13

MC5 MC6

MC7 MC8

Bit (n−1) (n−2) (n−3) (n−4)

Bit (n−1) (n−2) (n−3)

Bit (n−1) (n−2)

MC7 MC8

CLKR

FSR (Int)

FSR (Ext)

(RDATDLY=00b)

(RDATDLY=01b)

(RDATDLY=10b)

Figure 5−23. McBSP Receive Timings

MC2, MC12

MC2, MC11

MC1

MC3 MC4

MC14 MC14

MC9 MC10

MC19 MC18 MC16

MC16

MC17

MC15

MC17

Bit 0 Bit (n−1) (n−2) (n−3) (n−4)

Bit 0

Bit (n−1) (n−2) (n−3)

Bit (n−1) (n−2)

CLKX

FSX (Int)

FSX (Ext)

(XDATDLY=00b)

(XDATDLY=01b)

(XDATDLY=10b)

Figure 5−24. McBSP Transmit Timings

i 4? *4? TEXAS INSTRUMENTS

Electrical Specifications

101

April 2001 − Revised January 2004 SPRS163F

5.14.2 McBSP General-Purpose I/O Timings

Table 5−27 and Table 5−28 assume testing over recommended operating conditions (see Figure 5−25).

Table 5−27. McBSP General-Purpose I/O Timing Requirements

NO. MIN MAX UNIT

MC20 tsu(MGPIO-COH) Setup time, MGPIOx input mode before CLKOUT high†2P+7‡ns

MC21 th(COH-MGPIO) Hold time, MGPIOx input mode after CLKOUT high†0 ns

†MGPIOx refers to CLKRx, FSRx, DRx, CLKXx, or FSXx when configured as a general-purpose input.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−28. McBSP General-Purpose I/O Switching Characteristics

NO. PARAMETER MIN MAX UNIT

MC22 td(COH-MGPIO) Delay time, CLKOUT high to MGPIOx output mode§0 5 ns

§MGPIOx refers to CLKRx, FSRx, CLKXx, FSXx, or DXx when configured as a general-purpose output.

CLKOUT†

MGPIO‡

Input Mode

MGPIO§

Output Mode

MC20

MC21

MC22

†CLKOUT reflects the CPU clock.

‡MGPIOx refers to CLKRx, FSRx, DRx, CLKXx, or FSXx when configured as a general-purpose input.

§MGPIOx refers to CLKRx, FSRx, CLKXx, FSXx, or DXx when configured as a general-purpose output.

Figure 5−25. McBSP General-Purpose I/O Timings

102 sPFasmsF *9 TEXAS INSTRUMENTS

Electrical Specifications

102 April 2001 − Revised January 2004SPRS163F

5.14.3 McBSP as SPI Master or Slave Timings

Table 5−29 to Table 5−36 assume testing over recommended operating conditions (see Figure 5−26 through

Figure 5−29).

Table 5−29. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)†‡

NO.

MASTER SLAVE

UNIT

NO.

MIN MAX MIN MAX

UNIT

MC23 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 12 2 − 8P ns

MC24 th(CKXL-DRV) Hold time, DR valid after CLKX low 02 + 8P ns

MC25 tsu(FXL-CKXH) Setup time, FSX low before CLKX high 10 ns

MC26 tc(CKX) Cycle time, CLKX 2P 16P ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−30. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)†‡

NO.

PARAMETER

MASTER§SLAVE

UNIT

NO.

PARAMETER

MIN MAX MIN MAX

UNIT

MC27 td(CKXL-FXL) Delay time, CLKX low to FSX low¶T − 3 T + 4 ns

MC28 td(FXL-CKXH) Delay time, FSX low to CLKX high#C − 4 C + 3 ns

MC29 td(CKXH-DXV) Delay time, CLKX high to DX valid −2 8 5P + 3 5P + 12 ns

MC30 tdis(CKXL-DXHZ) Disable time, DX high-impedance following last data bit

from CLKX low C − 1 C + 1 ns

MC31 tdis(FXH-DXHZ) Disable time, DX high-impedance following last data bit

from FSX high 4P+ 2 4P + 10 ns

MC32 td(FXL-DXV) Delay time, FSX low to DX valid 3P + 5 3P + 14 ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

§T = CLKX period = (1 + CLKGDV) * 2P

C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2P when CLKGDV is even

¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX

and FSR is inverted before being used internally.

CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP

CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP

#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock

(CLKX).

LSB MC25

MC27

MC28

MC26

MC31

MC30

MC29

MC23 MC24

MSB

CLKX

FSX

Bit (n−1) (n−2) (n−3) (n−4)Bit 0

Bit 0 Bit (n−1) (n−2) (n−3) (n−4)

MC32

Figure 5−26. McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0

*ﬁ Hﬂﬂﬂ INSTRUMENTS *9 TEXAS

Electrical Specifications

103

April 2001 − Revised January 2004 SPRS163F

Table 5−31. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)†‡

NO.

MASTER SLAVE

UNIT

NO.

MIN MAX MIN MAX

UNIT

MC33 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 12 2 − 8P ns

MC34 th(CKXH-DRV) Hold time, DR valid after CLKX high 02 + 8P ns

MC25 tsu(FXL-CKXH) Setup time, FSX low before CLKX high 10 ns

MC26 tc(CKX) Cycle time, CLKX 2P 16P ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−32. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)†‡

NO.

PARAMETER

MASTER§SLAVE

UNIT

NO.

PARAMETER

MIN MAX MIN MAX

UNIT

MC27 td(CKXL-FXL) Delay time, CLKX low to FSX low¶C − 4 C + 3 ns

MC28 td(FXL-CKXH) Delay time, FSX low to CLKX high#T − 3 T + 4 ns

MC35 td(CKXL-DXV) Delay time, CLKX low to DX valid −2 8 5P + 3 5P + 12 ns

MC30 tdis(CKXL-DXHZ) Disable time, DX high-impedance following last data bit from

CLKX low −1 1 5P + 3 5P + 10 ns

MC32 td(FXL-DXV) Delay time, FSX low to DX valid D − 2 D + 7 3P + 5 3P + 14 ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

§T = CLKX period = (1 + CLKGDV) * P

C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even

D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even

¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX

and FSR is inverted before being used internally.

CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP

CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP

#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock

(CLKX).

LSB MC25

MC28

MC26

MC35

MC33 MC34

MSB

CLKX

FSX

Bit (n−1) (n−2) (n−3) (n−4)Bit 0

Bit 0 Bit (n−1) (n−2) (n−3) (n−4)

MC27

MC30 MC32

Figure 5−27. McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0

104 SPRSI 63F *9 TEXAS INSTRUMENTS

Electrical Specifications

104 April 2001 − Revised January 2004SPRS163F

Table 5−33. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)†‡

NO.

MASTER SLAVE

UNIT

NO.

MIN MAX MIN MAX

UNIT

MC33 tsu(DRV-CKXH) Setup time, DR valid before CLKX high 12 2 − 8P ns

MC34 th(CKXH-DRV) Hold time, DR valid after CLKX high 02 + 8P ns

MC36 tsu(FXL-CKXL) Setup time, FSX low before CLKX low 10 ns

MC26 tc(CKX) Cycle time, CLKX 2P 16P ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−34. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)†‡

NO.

PARAMETER

MASTER§SLAVE

UNIT

NO.

PARAMETER

MIN MAX MIN MAX

UNIT

MC37 td(CKXH-FXL) Delay time, CLKX high to FSX low¶T − 3 T + 4 ns

MC38 td(FXL-CKXL) Delay time, FSX low to CLKX low#D − 4 D + 3 ns

MC35 td(CKXL-DXV) Delay time, CLKX low to DX valid −2 8 5P + 3 5P + 12 ns

MC39 tdis(CKXH-DXHZ) Disable time, DX high-impedance following last data bit from

CLKX high D − 1 D + 1 ns

MC31 tdis(FXH-DXHZ) Disable time, DX high-impedance following last data bit from

FSX high 4P + 2 4P +10 ns

MC32 td(FXL-DXV) Delay time, FSX low to DX valid 3P + 5 3P + 14 ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

§T = CLKX period = (1 + CLKGDV) * P

C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even

D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even

¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX

and FSR is inverted before being used internally.

CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP

CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP

#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock

(CLKX).

LSB MC36

MC37

MC38

MC26

MC31

MC39

MC35

MC33 MC34

MSB

CLKX

FSX

Bit (n−1) (n−2) (n−3) (n−4)Bit 0

Bit 0 Bit (n−1) (n−2) (n−3) (n−4)

MC32

Figure 5−28. McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1

\ “M 1 1” W * 1 1 ‘ x ‘ x H F1} 1 F*—+ *4? TEXAS INSTRUMENTS

Electrical Specifications

105

April 2001 − Revised January 2004 SPRS163F

Table 5−35. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)†‡

NO.

MASTER SLAVE

UNIT

NO.

MIN MAX MIN MAX

UNIT

MC23 tsu(DRV-CKXL) Setup time, DR valid before CLKX low 12 2 − 8P ns

MC24 th(CKXL-DRV) Hold time, DR valid after CLKX low 02 + 8P ns

MC36 tsu(FXL-CKXL) Setup time, FSX low before CLKX low 10 ns

MC26 tc(CKX) Cycle time, CLKX 2P 16P ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−36. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)†‡

NO.

PARAMETER

MASTER§SLAVE

UNIT

NO.

PARAMETER

MIN MAX MIN MAX

UNIT

MC37 td(CKXH-FXL) Delay time, CLKX high to FSX low¶D − 4 D + 3 ns

MC38 td(FXL-CKXL) Delay time, FSX low to CLKX low#T − 3 T + 4 ns

MC29 td(CKXH-DXV) Delay time, CLKX high to DX valid −2 8 5P + 3 5P + 12 ns

MC39 tdis(CKXH-DXHZ) Disable time, DX high-impedance following last data bit from

CLKX high −1 1 5P + 2 5P + 10 ns

MC32 td(FXL-DXV) Delay time, FSX low to DX valid C − 2 C + 7 3P + 5 3P + 14 ns

†For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.

‡P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

§T = CLKX period = (1 + CLKGDV) * P

C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even

D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even

¶FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX

and FSR is inverted before being used internally.

CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP

CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP

#FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock

(CLKX).

LSB MC26

MC29

MC23 MC24

MSB

CLKX

FSX

Bit (n−1) (n−2) (n−3) (n−4)Bit 0

Bit 0 Bit (n−1) (n−2) (n−3) (n−4)

MC37

MC39

MC36

MC38

MC32

Figure 5−29. McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1

*9 TEXAS INSTRUMENTS

Electrical Specifications

106 April 2001 − Revised January 2004SPRS163F

5.15 Enhanced Host-Port Interface (EHPI) Timings

Table 5−37 and Table 5−38 assume testing over recommended operating conditions (see Figure 5−30

through Figure 5−34).

Table 5−37. EHPI Timing Requirements

NO. MIN MAX UNIT

H1 tsu(HASL-HDSL) Setup time, HAS low before HDS low 5 ns

H2 th(HDSL-HASL) Hold time, HAS low after HDS low 3 ns

H3 tsu(HCNTLV-HDSL) Setup time, (HR/W, HBE[1:0], HPI.HA[13:0],

HCNTL[1:0]) valid before HDS low 2 ns

H4 th(HDSL-HCNTLIV) Hold time, (HR/W, HBE[1:0], HPI.HA[13:0], HCNTL[1:0]) invalid after HDS low 4 ns

H5 tw(HDSL) Pulse duration, HDS low 4P†ns

H6 tw(HDSH) Pulse duration, HDS high 4P†ns

H7 tsu(HDV-HDSH) Setup time, HPI data bus write data valid before HDS high 3 ns

H8 th(HDSH-HDIV) Hold time, HPI data bus write data invalid after HDS high 4 ns

H9 tsu(HCNTLV-HASL) Setup time, (HR/W, HBE[1:0], HCNTL[1:0]) valid before HAS low 2 ns

H10 th(HASL-HCNTLIV) Hold time, (HR/W, HBE[1:0], HCNTL[1:0]) invalid after HAS low 1 ns

†P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

Table 5−38. EHPI Switching Characteristics

NO. PARAMETER MIN MAX UNIT

H11 td(HDSL-HDD)M Delay time, HDS low to HPI data bus read data driven

(memory access) 5 14 ns

H12 td(HDSL-HDV1)M

Delay time, HDS low to HPI data bus read data valid

(memory access without autoincrement or first memory access during

autoincrement) 15P+14†‡ ns

H13 td(HDSL-HDV2)M Delay time, HDS low to HPI data bus read data valid

(memory access) 14 ns

H14 td(HDSL-HDD)R Delay time, HDS low to HPI data bus read data driven

(register access) 4 14 ns

H15 td(HDSL-HDV)R Delay time, HDS low to HPI data bus read data valid

(register access) 14 ns

H16 td(HDSH-HDIV) Delay time, HDS high to HPI data bus read data invalid 4 14 ns

H17 td(HDSL-HRDYL) Delay time, HDS low to HRDY low (during reads) P + 10 ns

H18 td(HDV-HRDYH) Delay time, HPI data bus valid to HRDY high (during reads) −12§ns

H19 td(HDSH-HRDYL) Delay time, HDS high to HRDY low (during writes) 14 ns

H20 td(HDSH-HRDYH) Delay time, HDS high to HRDY high (during writes) 15P+14†‡ ns

†P = 1/CPU clock frequency. For example, when running parts at 144 MHz, use P = 6.94 ns.

‡HPI latency is dependent on the number of DMA channels active, their priorities and their source/destination ports. The latency shown assumes

no competing CPU or DMA activity to the memory resources being accessed by the EHPI.

§Indicates there is no overlap between valid read data and HRDY low. Read data becomes valid after HRDY rising.

l‘pingixﬁﬂw *MW Hle‘l \ ‘ x ‘ ' \ 7 ‘WV.VOWO'6'9'VO'OV'OV'O'O‘O'OV‘OV‘OV '0'. O'6'9'O'9'O'9'O'6V'OV'OV'O'OVOVOV‘O'O‘O'O‘O'O‘ ' ’02¢foto?of¢2ofo’sfofofokfoﬁofofofofdoﬁofz Aim AofofoYo2o2¢3o2o?ofo29fofvfof¢fofo3ofof¢fofofofo§fofofof3 \ ‘ \ OVOVO'O'O'6'9'O'O'OV'OV'O'O‘O'OV‘OV‘OV '0'. 0' ' ’¢2~20292oﬁoﬁkwsfoféoféofoﬁofdoféofz 329‘ ’o202¢?o292029202otofofvfoﬁoféfoﬁoﬁofotofoﬁofé "A Vvvvvvvvvvvvvvvvvvvvvvvvvv "n 690 \ ”OOOOOQOOOOQOQOQOOQOQOQ N 90969 3039!? ‘02¢fo$2ofofofotoﬁiofofofoﬁofofofoﬁofofofz 339’ ’¢fo3o2o$3oto!ofé’oﬁofdofokfoﬁofotoﬁofo? 29%? x ‘ \ *—~ \ x ‘ '6". 0V'OV'OV'O'6'9'O'O'OV'OV'OVO'OVOVVV '0‘ O'OV'OV'OV'OVVOVVVO'OV'OVOVO'OV'OV6V 2.2.2: - 9.2.2.2.2.2.2.2.§2.2.2.2.2.2.2.2.2.2.2.2.2.2.2. .2: - a2.2.2.2.2.2.2.2.2.2.2.2.2¢.2.2.2.2¢.2.2.2.2.2.2.2.22 \ \ \ k 1 ‘ x x \ \ \ \ ‘ Q‘: \ w ‘ ‘ " ’p—* \ \ V_t_)‘_;_ ‘ \ \ x ‘ ‘ ‘ 4 # «—+ 4 r ‘ 4 r ‘ *4? TEXAS INSTRUMENTS

Electrical Specifications

107

April 2001 − Revised January 2004 SPRS163F

H5 H5

ValidValid

H11

H16

Read Data

H20

H19

Write Data

H18

H17

HCS

HDS

HR/W

HBE[1:0]

HPI.HA[13:0]

HPI.HD[15:0]

(Read)

HPI.HD[15:0]

(Write)

HRDY

Read Write

H12

ValidValidHCNTL[0]

NOTES: A. Any non-multiplexed access with HCNTL0 low will result in HPIC register access. For data read or write, HCNTL0 must stay

high during the EHPI access.

B. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur

concurrent with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied permanently active and HCS is used as a strobe,

the timing requirements shown for HDS apply to HCS. Operation with HCS as a strobe is not recommended.

Figure 5−30. EHPI Nonmultiplexed Read/Write Timings

1 1 44LH91 1 7L—‘1‘1 i 1 19% 1 1 w 1 1 1 1‘PH4 1 ‘ 1 ‘ ‘ 1 1 '0‘". O'O'O'QV'O'Q'OV O'O'Q'OVO'O'O'QVO'O'VO' 33.20?on .0?”of"‘02o’§%‘o‘o’¢’o’o’$¢‘o’¢’o’o’o" '9'O'6'O'O'0'0'0'O'9'0'O'O'0'O'O'O'O'O'O'O'Q'O'O'O'O'O'Q' ””202?!232.392?!fffofofffffﬁofo. o'o'o'o'o'o'o'o'o'0'0'0'0'0'0'0'0'0'0'0'9'0'0' ’o2o2o2o2o2otofo2§2ofofofofofofofofofofofofofof 1 9'9'OVOV'0V0'O'0'0'0'O'Q'0'O'Q'O'O'O'O'QV'O'QVVV' VOW. ’60fo2o2q2o2o2o2oto2§2o2o2ofofofofofofofofofofoﬁfofo. my '0'. O'O'O'O'0'0'0'0'O'Q'O'O'0'O'O'O'O'O'O'O'Q'O'O'O'O'O'Q' 'O'OVV O'O'O'0'0'0V0'0'O'O'Q'OVO'O'O'Q'O'O'O'OV' w ’”22.2222.302.2929to!ofoﬁfofofofofofofoﬁfdo. 1.2.2.2: - ’.2.2.2.2.2.t.2.2.2.2.2.2.2.2.2.2.2.2.2.2¢.2.2 1 1 k—+ H3 1 1 H HI4 1 1 1 1—1—1 H15 1 1 1 1 mi:- 1—1—1— 1 1 1—1 1 1 1 +—4 1 1 1 1 v—v 1 1 1 1 1 H 1 4 F 1 sPFasmsF *9 TEXAS INSTRUMENTS

Electrical Specifications

108 April 2001 − Revised January 2004SPRS163F

Valid (11) Valid (11)

Read Data

Write Data

Read Write

H5 H5

H14

H15

H9 H10

H20

H19

H18

H17

HCS

HAS

HDS

HR/W

HBE[1:0]

HCNTL[1:0]

HPI.HD[15:0]

(Read)

HPI.HD[15:0]

(Write)

HRDY

H2H2

H10

NOTE: The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent

with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied permanently active and HCS is used as a strobe, the timing

requirements shown for HDS apply to HCS. Operation with HCS as a strobe is not recommended.

Figure 5−31. EHPI Multiplexed Memory (HPID) Access Read/Write Timings Without Autoincrement

\ x \ ‘ w x w L—* ‘ ‘ x ‘ ‘ x ‘ V ’ x ‘ ‘ ‘ ‘ \' ' ‘ 1 ‘ ’ "33:23t:E3E3g?3E3E3i3§3§3§3§2§2§2§2§2§2§2§3§°V V’3"'3‘3‘3'3‘3‘3‘3‘3‘3‘3’3‘3’3‘3‘3‘3‘3‘3’3‘3‘3'3’3’3 0AO‘Q‘QAO‘Q‘Q‘Q‘Q‘Q‘Q‘Oﬁﬁtﬁtﬁﬁtﬁttmk ’3‘”3’3’3’;’3‘3’3'3’3'3’3‘3’3‘3‘3‘3’3’3’3‘o QRAORAOAQAO) 0A0 9A0 0A0 0A0 0A0 .O;O3O3O3O3.;.3.z.3.3.;.;.;.;‘;.;‘;‘;.;.;.;.W 0AOAOAOAOAOAO‘OA0AOAOAOAOAORAOAOAOAOAQAOAOA OO;O3o;b;o;o;o;o;¢;o;o;¢;o;o;¢o 0'o'o'o'o'o'o'o'o'o'o'wo‘wo‘wo‘o'v‘o’o‘v O0.026A0533333333333 ”””“NNN““““N” OAOAOQAOQAO‘OAOAOAAOAOAOAA *4? TEXAS INSTRUMENTS

Electrical Specifications

109

April 2001 − Revised January 2004 SPRS163F

Valid (01) Valid (01)

n n+1 n+2

d(n) d(n+1) d(n+2)

Read Data Read Data

H5 H6

H10

H11

H12

H16

H13

H17

H18

H20

H19 H20

H19

HCS

HAS

HDS

HR/W

HBE[1:0]

HCNTL[1:0]

HPI.HD[15:0]

(Read)

HPIA

Contents

HPID

Contents

HRDY

H11

NOTES: A. During autoincrement mode, although the EHPI internally increments the memory address, reads of the HPIA register by the

host will always indicate the base address.

B. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur

concurrent with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied permanently active and HCS is used as a strobe,

the timing requirements shown for HDS apply to HCS. Operation with HCS as a strobe is not recommended.

Figure 5−32. EHPI Multiplexed Memory (HPID) Access Read Timings With Autoincrement

O'Q'Q'QVQ'Q'Q'O'0”;O;§VVVVO;O;O;Q;O. ,V,V,V.V,V,v,V.v,V,Vy,Vvvcvvvvcvyw v sfofofofofofofofofofg A”hfohfofunmA ‘ ’ ”«“““«” .of..«92.52.292.29‘920‘o‘o‘u‘o‘u‘o‘usgm ”3'3';';';'3‘;~;~;~3~3‘. c'w'0V'.'u'9V'o'ﬂvo'vo'o'wo'ww ’ofofofofofofofo‘afoféAmmmsm ””””’””“"”“”” .OAOAO.9AO.OAO‘OAQ‘Q‘Q‘QAQAt‘tﬁﬁtﬁtﬁttA I?3’3‘3‘3’3‘3’3’3’5’3’3’3’3‘3’;‘3’3‘3‘3‘3‘3‘o 0V'9‘O‘O‘O‘O‘0‘0‘O‘O‘O‘O‘O‘O‘O‘O‘O‘OV‘O'“'9' oAoAoAoAo.om.0.9.0.0.vo.vo.~.~.~.~.¢ ””””“"““““”“” Q.O.OA0.0A0A0A0A0A0A0A0A0333333333330; HPI.HD[15:0] (Write) HRDV mm: n X n+1 X H Pl D Contents d‘") X “(n no spasms/r *9 TEXAS INSTRUMENTS

Electrical Specifications

110 April 2001 − Revised January 2004SPRS163F

Valid (01) Valid (01)

n n+1 n+2

d(n) d(n+1) d(n+2)

Write Data

H5 H6

H10

HCS

HAS

HDS

HR/W

HBE[1:0]

HCNTL[1:0]

HPI.HD[15:0]

(Write)

HPIA

Contents

HPID

Contents

HRDY

Write Data

H7 H8

H20

H19

H20

H19

NOTES: A. During autoincrement mode, although the EHPI internally increments the memory address, reads of the HPIA register by the

host will always indicate the base address.

B. The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur

concurrent with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied permanently active and HCS is used as a strobe,

the timing requirements shown for HDS apply to HCS. Operation with HCS as a strobe is not recommended.

Figure 5−33. EHPI Multiplexed Memory (HPID) Access Write Timings With Autoincrement

I T ﬁ [ \ w'o'w'we'w.'we'0'w'o'owo'woww wow o'we'0'w'«V'weVvowwwvw ’o203ofo2o3o2o3o29to?ofofofofofofz‘ofofofofofofofofofo. 32029392 s393ofo2o2o3o2ofofofofofofofofofofofofofofofof3 \ o O‘O‘O‘O‘OVVOV‘O‘O‘O‘W'O'QV‘O‘OVO'OV‘O‘O‘ wow '0.o.ofofo3o2o2o2of.3ofo2biofofofofofofofofofofofofofo. 32020? '0'. ‘ om'w'0'u'0'w'u'¢'wvwwwww wow o'we'0'w'ow'weVvowwwow 2030‘ - ’0203ofo2o3o2o3o203¢3ofofofofofofz‘ofoftfofofofofofofo. 32029? - ’03ofo2o2o3o2oto?ofofofofofofofofofoﬁofofofof O‘O‘O‘O‘O‘O‘V0'O‘O‘O‘OVVQVV‘OV‘OVOV ‘o2o2o2ofo2o2oto?ofofdoﬁfoﬁfofofoféoﬁfo}? I *4? TEXAS INSTRUMENTS

Electrical Specifications

111

April 2001 − Revised January 2004 SPRS163F

Valid (10 or 00) Valid (10 or 00)

Read Data

Write Data

H1 H1

Read Write

H5 H6 H5

H14

H16

H9 H10

HCS

HAS

HDS

HR/W

HBE[1:0]

HCNTL[1:0]

HPI.HD[15:0]

(Read)

HPI.HD[15:0]

(Write)

HRDY

H10

H15

NOTE: The falling edge of HCS must occur concurrent with or before the falling edge of HDS. The rising edge of HCS must occur concurrent

with or after the rising edge of HDS. If HDS1 and/or HDS2 are tied permanently active and HCS is used as a strobe, the timing

requirements shown for HDS apply to HCS. Operation with HCS as a strobe is not recommended.

Figure 5−34. EHPI Multiplexed Register Access Read/Write Timings

INSTRUMENTS *9 TEXAS

Electrical Specifications

112 April 2001 − Revised January 2004SPRS163F

5.16 I2C Timings

Table 5−39 and Table 5−40 assume testing over recommended operating conditions (see Figure 5−35 and

Figure 5−36).

Table 5−39. I2C Signals (SDA and SCL) Timing Requirements

NO.

STANDARD

MODE FAST

MODE

UNIT

NO.

MIN MAX MIN MAX

UNIT

IC1 tc(SCL) Cycle time, SCL 10 2.5 µs

IC2 tsu(SCLH-SDAL) Setup time, SCL high before SDA low for a repeated START

condition 4.7 0.6 µs

IC3 th(SCLL-SDAL) Hold time, SCL low after SDA low for a START and a repeated

START condition 4 0.6 µs

IC4 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs

IC5 tw(SCLH) Pulse duration, SCL high 4 0.6 µs

IC6 tsu(SDA-SCLH) Setup time, SDA valid before SCL high 250 100†ns

IC7 th(SDA-SCLL) Hold time, SDA valid after SCL low 0‡0‡0.9§µs

IC8 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 µs

IC9 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb¶300 ns

IC10 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb¶300 ns

IC11 tf(SDA) Fall time, SDA 300 20 + 0.1Cb¶300 ns

IC12 tf(SCL) Fall time, SCL 300 20 + 0.1Cb¶300 ns

IC13 tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition) 4.0 0.6 µs

IC14 tw(SP) Pulse duration, spike (must be suppressed) 0 50 ns

IC15 Cb¶Capacitive load for each bus line 400 400 pF

†A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA-SCLH) ≥ 250 ns must then be met.

This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period

of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA-SCLH) = 1000 + 250 = 1250 ns (according to the Standard-mode

I2C-Bus Specification) before the SCL line is released.

‡A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined

region of the falling edge of SCL.

§The maximum th(SDA-SCLL) has only to be met if the device does not stretch the LOW period [tw(SCLL)] of the SCL signal.

¶Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.

IC10

IC8 IC4

IC3

IC7

IC12

IC5

IC6 IC14

IC2

IC3

IC13

Stop Start Repeated

Start Stop

SDA

SCL

IC1

IC11 IC9

Figure 5−35. I2C Receive Timings

I2C Bus is a trademark of Koninklijke Philips Electronics N.V.

R E T E M A m P INSTRUMENTS ‘9 TEXAS

Electrical Specifications

113

April 2001 − Revised January 2004 SPRS163F

Table 5−40. I2C Signals (SDA and SCL) Switching Characteristics

NO.

PARAMETER

STANDARD

MODE FAST

MODE

UNIT

NO.

PARAMETER

MIN MAX MIN MAX

UNIT

IC16 tc(SCL) Cycle time, SCL 10 2.5 µs

IC17 td(SCLH-SDAL) Delay time, SCL high to SDA low for a repeated START

condition 4.7 0.6 µs

IC18 td(SDAL-SCLL) Delay time, SDA low to SCL low for a START and a repeated

START condition 4 0.6 µs

IC19 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs

IC20 tw(SCLH) Pulse duration, SCL high 4 0.6 µs

IC21 td(SDA-SCLH) Delay time, SDA valid to SCL high 250 100 ns

IC22 tv(SCLL-SDAV) Valid time, SDA valid after SCL low 0 0 0.9 µs

IC23 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 µs

IC24 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb†300 ns

IC25 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb†300 ns

IC26 tf(SDA) Fall time, SDA 300 20 + 0.1Cb†300 ns

IC27 tf(SCL) Fall time, SCL 300 20 + 0.1Cb†300 ns

IC28 td(SCLH-SDAH) Delay time, SCL high to SDA high for a STOP condition 4 0.6 µs

IC29 CpCapacitance for each I2C pin 10 10 pF

†Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.

IC25

IC23 IC19

IC18

IC22

IC27

IC20

IC21

IC17

IC18

IC28

Stop Start Repeated

Start Stop

SDA

SCL

IC16

IC26 IC24

Figure 5−36. I2C Transmit Timings

H¥4~ \ 1‘37 1 4 r H‘ W m 1 r T ”x 1 4‘ F ‘6'“ O'O'OVV'O'O'O'O'O'O'OV OV'O'O'O' 202029‘-’o2¢2¢2¢$$20¢2¢2¢2¢2§-‘¢2¢2¢2¢$2 4" H’ m *9 TEXAS INSTRUMENTS

Electrical Specifications

114 April 2001 − Revised January 2004SPRS163F

5.17 MultiMedia Card (MMC) Timings

Table 5−41 and Table 5−42 assume testing over recommended operating conditions (see Figure 5−37).

Table 5−41. MultiMedia Card (MMC) Timing Requirements

NO. MIN MAX UNIT

MMC7 tsu(DV-CLKH) Setup time, data valid before clock high 9 ns

MMC8 th(CLKH-DV) Hold time, data valid after clock high 0 ns

Table 5−42. MultiMedia Card (MMC) Switching Characteristics

NO. PARAMETER MIN MAX UNIT

MMC1 f(PP) Clock frequency data transfer mode (PP) (CL = 100 pF) 17.2†MHz

MMC2 f(OD) Clock frequency identification mode (OD) (CL = 250 pF) 400 kHz

MMC3 tw(CLKL) Clock low time (CL = 100 pF) 10 ns

MMC4 tw(CLKH) Clock high time (CL = 100 pF) 10 ns

MMC5 tr(CLK) Clock rise time 5 ns

MMC6 tf(CLK) Clock fall time 5 ns

MMC9 td(CLKL-DV) Delay time, MMC.CLK low to data valid −4 1 ns

†Maximum clock frequency specified in MMC Specification version 3.2 is 20 MHz. The 5509 can support clock frequency as high as 17.2 MHz.

MMC6

MMC5

MMC1

MMC4

MMC8 MMC7

MMC9

MMC.CLK

MMC.CMD

MMC.DATx

MMC.CMD

MMC.DATx

MMC3

Figure 5−37. MultiMedia Card (MMC) Timings

\ 4g 1 \ \ a? L4 1 \ % i 1 r 41 w \ \ '0'“ O'O'OV'O'O'O'O'OVVOV “VOW 2¢&O-'¢.2.2.2.2.2..2.2.2.y-s2.2¢.2¢ 4H“, \ \ m: V \ \ *4? TEXAS INSTRUMENTS

Electrical Specifications

115

April 2001 − Revised January 2004 SPRS163F

5.18 Secure Digital (SD) Card Timings

Table 5−43 and Table 5−44 assume testing over recommended operating conditions (see Figure 5−38).

Table 5−43. Secure Digital (SD) Card Timing Requirements

NO. MIN MAX UNIT

SD7 tsu(DV-CLKH) Setup time, data valid before clock high 9 ns

SD8 th(CLKH-DV) Hold time, data valid after clock high 0 ns

Table 5−44. Secure Digital (SD) Card Switching Characteristics

NO. PARAMETER MIN MAX UNIT

SD1 f(PP) Clock frequency data transfer mode (PP) (CL = 100 pF) 21†MHz

SD2 f(OD) Clock frequency identification mode (OD) (CL = 250 pF) 400 kHz

SD3 tw(CLKL) Clock low time (CL = 100 pF) 10 ns

SD4 tw(CLKH) Clock high time (CL = 100 pF) 10 ns

SD5 tr(CLK) Clock rise time 5 ns

SD6 tf(CLK) Clock fall time 5 ns

SD9 td(CLKL-DV) Delay time, SD.CLK low to data valid −4 1 ns

†Maximum clock frequency specified in the SD Specification is 25 MHz. The 5509 can support clock frequency as high as 21.0 MHz.

SD6

SD5

SD1

SD4

SD8 SD7

SD9

SD.CLK

SD.CMD

SD.DATx

SD.CMD

SD.DATx

SD3

Figure 5−38. Secure Digital (SD) Timings

PARAMETER *9 TEXAS INSTRUMENTS

Electrical Specifications

116 April 2001 − Revised January 2004SPRS163F

5.19 Universal Serial Bus (USB) Timings

Table 5−45 assumes testing over recommended operating conditions (see Figure 5−39 and Figure 5−40).

Table 5−45. Universal Serial Bus (USB) Characteristics

NO.

PARAMETER

FULL SPEED

12Mbps

UNIT

NO.

PARAMETER

MIN TYP MAX

UNIT

U1 trRise time of DP and DN signals†4 20 ns

U2 tfFall time of DP and DN signals†4 20 ns

tRFM Rise/Fall time matching‡90 111.11 %

VCRS Output signal cross-over voltage†1.3 2.0 V

tjr Differential propagation jitter§¶ −2 2 ns

fop Operating frequency (Full speed mode) 12 Mb/s

U3 Rs(DP) Series resistor 24 Ω

U4 Rs(DN) Series resistor 24 Ω

U5 Cedge(DP) Edge rate control capacitor 22 pF

U6 Cedge(DN) Edge rate control capacitor 22 pF

†CL = 50 pF

‡(tr/tf) x 100

§tpx(1) − tpx(0)

¶USB is powered from the core supply and is susceptible to core power supply ripple, refer to recommend operating conditions for allowable supply

ripple to meet USB specifications of peak-to-peak jitter tolerance ( 0.6% at 6 MHz bit clock and 2.4% at 12 MHz bit clock).

VOL

VCRS

VOH

tperiod + Jitter

90%

10%

D−

D+

Figure 5−39. USB Timings

|i| ﬂ *4? TEXAS INSTRUMENTS

Electrical Specifications

117

April 2001 − Revised January 2004 SPRS163F

5509

USBVDD

D+

D−

R(PU)

1.5 kW

NOTES: A. A full-speed buffer is measured with the load shown.

B. CL = 50 pF

Figure 5−40. Full-Speed Loads

*9 TEXAS INSTRUMENTS

Electrical Specifications

118 April 2001 − Revised January 2004SPRS163F

5.20 ADC Timings

Table 5−46 assumes testing over recommended operating conditions.

Table 5−46. ADC Characteristics

NO. PARAMETER MIN MAX UNIT

A1 tc(SCLC) Cycle time, ADC internal conversion clock 500 ns

A2 td(AQ) Delay time, ADC sample and hold acquisition time 40 µs

A3 td(CONV) Delay time, ADC conversion time 13 * tc(SCLC) ns

SDNL

Static differential non-linearity error 2 LSB

DNL Static integral non-linearity error 3 LSB

A5 Zset Zero-scale offset error 9 LSB

A6 Fset Full-scale offset error 9 LSB

A7 Analog input impedance 1 MΩ

m? OOOOOOO OOOOOOO OOOOOOO OOOOOOOOOOOOO OOOOOOO‘OOOOOOO 0000000 0000000 0000000 00000 00090 omer : ;_ ﬁ% i Jnggggoom i -- 000000000 000000000 000000000 0&0000000 000000000 00000 00000 00000 00000 00000 00000 00000 00000 *9ﬁmw INSTRUMENTS

Mechanical Data

119

April 2001 − Revised January 2004 SPRS163F

6 Mechanical Data

6.1 Ball Grid Array Mechanical Data

GHH (S-PBGA-N179) PLASTIC BALL GRID ARRAY

0,08 0,10

1,40 MAX0,85

0,55

0,45 0,45

0,35

0,95

11,90

12,10 SQ

4173504-3/C 12/01

Seating Plane

43 65

98 1110 1312 14

0,40

10,40 TYP

A1 Corner

Bottom View

0,80

0,40

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. MicroStar BGAt configuration.

Figure 6−1. TMS320VC5509 179-Ball MicroStar BGA Plastic Ball Grid Array Package

MicroStar BGA is a trademark of Texas Instruments.

11.50 TVP 44 2D 20 19,80 50 220 SO 7 Sealing Fla wzu sPFasmsF *9 TEXAS Ann! 200 INSTRUMENTS

Mechanical Data

120 April 2001 − Revised January 2004SPRS163F

6.2 Low-Profile Quad Flatpack Mechanical Data

PGE (S-PQFP-G144) PLASTIC QUAD FLATPACK

4040147/C 10/96

0,27

0,17

0,13 NOM

0,25

0,75

0,45

0,05 MIN

Seating Plane

Gage Plane

108

109

144

22,20

21,80

19,80

17,50 TYP

20,20

1,35

1,45

1,60 MAX

0,08

0°−7°

0,08

0,50

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Falls within JEDEC MO-136

Figure 6−2. TMS320VC5509 144-Pin Low-Profile Quad Flatpack

Datenblatt für TMS320VC5509 Data Manual von Texas Instruments

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