Datenblatt für AMM-2738-B-R
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\ Data Sheet AMM-2738-B-R \
Anechoi: Room
0_ n n a n n 0 rs n n 00
go. ,0:
O, 20‘
0. 1‘53
0 J
0' Speaker 30
o / we )0
o - E :g
G, \ )0
Bo. 3
0 Interface ,0
. A . 0
go- CII’CUIt JD;
0' :03
go. ,0
G U U U U U U u u u D
BOEEWQSflOflOfiOBgfl
DeH PC
BK2715 Amplifier
BK3109 lvlultI~Analyser
'— ———————— —| Vdd=2V
I CF 5?: (‘7) Power
' |
I ’—‘EA $ : : Oulput
I MEMS :: I C=1 JUF
I Sensor g Ground
'— ________ J
M EM 3 M IC
[dB/J V]
-20
-30* ff]
-40— J
-50-
-50 I I I
T [ I
20 50 100 200 500
[HZ]
1k
2k 5k 16k 2(le
u:
o
B
.2
3 20
7%
o 10
w
5 4
§ 0 I’ 4
n:
o
z
-10
10 100 FREQUENCY (H1) 1000 10000
Frequency Response Mask
Frequency (Hz) Upper Limit
20 1 - 1
50 1 - 1
100 1 ~ 1
900 1 -1
1000 0 0
1 1 00 1 - 1
2000 1 - 1
5000 1 - 1
1 0000 2 0
1 5000 6 4
20000 8 6
Free-field frequency response normalized to 1kHz sensitivity value.
THDON (96)
a
94 100 106 112 1 18 120
/
4o
/’
OUTPUTAMPLITUDEtdBV)
c‘»
o
45
90
100
110
INPUT AMPLITU DE ( dB SPL )
120
dBV
/
‘4 \.r/
-6
20000 4M0 5M0 WOO 70000 H!
Temperature'C
Soldering Peak Temperature
280 l.lax.260'C@SOSec
220 Above 217‘0 \
l.iax.QDSec \
\
Pre-Heat /
12$ / \ Cooling
150C ~180'C
I.Iax,1208ec
605 120: l l 905 805
Time
Important Notes to minimize device damage:
14 Do not boards wash or clean after the reflow process.
2. Do not apply over 0.3Mpa of air pressure into the port hole.
3‘ Do not expose to ultrasonic processing or cleaning.
4‘ Do not pull a vacuum over port hole ofthe microphone
1.21 0.55 L
_ 0.” '—0.12
l 6 1 L113.) 74.65
i 1 0.13]— 1 2
|
— - ————— —— — 01.45—
3| >< oo.95~_="" _="" e="" é="">-| >< ap“="" \_j_/="" r0.25="" 1'90="" low—o="" 7°”="" view="" sde="" view="" bamm="" view="" dd:="" cot="" yyww="" w:va'="" ww:="" wotk="" md:="" xxxx="" x)oo(:="" lotno.="" item="" dimension="" tolerance="" units="" (+/-)="" lengthfl.)="" 2.75="" 0.10="" mm="" width[w)="" 1.85="" 0.10="" mm="" height(h)="" 0.9="" 0.10="" mm="" acoustic="" port="" (ap)="" (210.25="" 0.05="" mm="" pin="" #="" pin="" name="" type="" description="" 1="" v“,="" power="" power="" supply="" 2="" output="" signal="" output="" signal="" 3="" gnd="" ground="" ground="" notes:="" all="" dimensions="" are="" in="" millimeter="" (mm).="" tolerance:0.15mm="" unless="" otherwise="" specified.="">
0.30 —°
0.30
J_
L1
-—0.30
Recommended Pickup Location
0.00
0.30 -| .65
_!
—-| 0.55 l—
i
|-—1.21
¢1.40
$0.90 _.
Recommended Solder Pad Layout
Tape Specification
A
2:0. 1
G)
cq
o
1-!
GB 5‘!
810.1 20510.1 320.1
A'_.
0. 310.05
1.120.05
A-A'
Notes:
All dimensions are in millimeter [mm].
Tolerance:0.15mm unless otherwise specified.
Reel Specification
A
D
g :1: 1°
Top Wew Side we" DETAILA
7” Reel
mmenslon (mm) ‘
Description Symbol
Mlnlmum Nominal Maxlmum
Reel Dlameter A - 1 80 -
Huh Diameter B 58 60 62
Hub Hole Dlamener . c 12.8 13 13.5 ]
Reel Wldth (Measured at Imb) . D - 16 16.4 \
Arbor Hole E 20.2 - - l
Arbor Hw in mm Dlameter F 12.3 ‘ 13.0 13.5 ‘
Arbor Slot Width G 1.5 - - ‘
Notes:
All dimensions are In milllmeher (nun).
Packing Quantity
7"le
Fm'numtso 1250un‘us mums ”“1
o o o o o o o o o o o o o o
E1 ESQ Q51 [51E
MEMS Microphone \ AP Hole Lemon
Padang Inlomnflnn
w/
“903119917“
Qty/ml Wolght/ml nun/um Qty/anon wagmmn 2:2“; Sham-
” "‘1 N“ NM NM a-xmen-m Mp
1250 0.25 4 5000 ~3.00 272 x 159 x 236 -10'C~§0 ‘C
Specifications Rev inns
Revision Description Date
Released from Engmeermg 10 31 2019
Added Ultrasomc Response 5/14/2020

