Datenblatt für TMS320VC5501 von Texas Instruments

{5‘ TEXAS INSTRUMENTS
TMS320VC5501 Fixed-Point
Digital Signal Processor
Data Manual
Literature Number: SPRS206K
December 2002 − Revised November 2008
        
         
   !    
!   
*9 TEXAS INSTRUMENTS
Revision History
3
December 2002 − Revised November 2008 SPRS206K
REVISION HISTORY
This data sheet revision history highlights the technical changes made to the SPRS206J device-specific data
sheet to make it an SPRS206K revision.
Scope: See table below.
PAGE(S)
NO. ADDITIONS/CHANGES/DELETIONS
21 Table 2−4, Signal Descriptions:
HD[7:0]: removed “M” from “Other” column
HC0: removed “M” from “Other” column
HC1: removed “M” from “Other” column
HCNTL0: removed “M” from “Other” column
HCNTL1: removed “M” from “Other” column
− HCS: removed “M” from “Other” column
− HR/W: removed “M” from “Other” column
88 Table 3−29, Peripheral IDLE Control Register Bit Field Description:
Updated footnote
161 Figure 5−22, Reset Timings:
Added footnote about the state of the DSP pins during power up
*9 TEXAS INSTRUMENTS
Revision History
4December 2002 − Revised November 2008SPRS206K
*9 TEXAS INSTRUMENTS
Contents
5
December 2002 − Revised November 2008 SPRS206K
Contents
Section Page
1 TMS320VC5501 Features 15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Introduction 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Description 16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Pin Assignments 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.1 Ball Grid Array (GZZ and ZZZ) 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2.2 Low-Profile Quad Flatpack (PGF) 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Signal Descriptions 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3 Functional Overview 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Memory 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.1 On-Chip ROM 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.2 On-Chip Dual-Access RAM (DARAM) 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.3 Instruction Cache 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.4 Memory Map 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1.5 Boot Configuration 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Peripherals 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3 Configurable External Ports and Signals 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.1 Parallel Port Mux 43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.2 Host Port Mux 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.3 External Bus Selection Register (XBSR) 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.3.4 Configuration Examples 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4 Timers 50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.1 Timer Interrupts 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.2 Timer Pins 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.4.3 Timer Signal Selection Register (TSSR) 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 Universal Asynchronous Receiver/Transmitter (UART) 54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 Inter-Integrated Circuit (I2C) Module 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.7 Host-Port Interface (HPI) 57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8 Direct Memory Access (DMA) Controller 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8.1 DMA Channel 0 Control Register (DMA_CCR0) 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9 System Clock Generator 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.1 Input Clock Source 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.2 Clock Groups 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.3 EMIF Input Clock Selection 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.4 Changing the Clock Group Frequencies 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.5 PLL Control Registers 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9.6 Reset Sequence 76. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10 Idle Control 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.1 Clock Domains 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.2 IDLE Procedures 77. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.3 Module Behavior at Entering IDLE State 80. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.4 Wake-Up Procedures 81. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.5 Auto-Wakeup/Idle Function for McBSP and DMA 84. . . . . . . . . . . . . . . . . . . . . . . . . . . .
i" TEXAS INSTRUMENTS
Contents
6December 2002 − Revised November 2008SPRS206K
Section Page
3.10.6 Clock State of Multiplexed Modules 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.10.7 IDLE Control and Status Registers 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.11 General-Purpose I/O (GPIO) 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.11.1 General-Purpose I/O Port 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.11.2 Parallel Port General-Purpose I/O (PGPIO) 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.12 External Bus Control Register 104. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.12.1 External Bus Control Register (XBCR) 105. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13 Internal Ports and System Registers 106. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13.1 XPORT Interface 106. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13.2 DPORT Interface 109. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13.3 IPORT Interface 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13.4 System Configuration Register (CONFIG) 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13.5 Time-Out Control Register (TOCR) 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.14 CPU Memory-Mapped Registers 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.15 Peripheral Registers 116. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.16 Interrupts 129. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.16.1 IFR and IER Registers 130. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.16.2 Interrupt Timing 131. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.16.3 Interrupt Acknowledge 131. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.17 Notice Concerning TCK 132. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4 Support 135. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability 135. . . . . . . . . . . . . . . . .
4.1.1 Initialization Requirements for Boundary Scan Test 135. . . . . . . . . . . . . . . . . . . . . . . . . .
4.1.2 Boundary Scan Description Language (BSDL) Model 135. . . . . . . . . . . . . . . . . . . . . . . .
4.2 Documentation Support 135. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Device and Development-Support Tool Nomenclature 136. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5 Electrical Specifications 137. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 Absolute Maximum Ratings 137. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 Electrical Specifications 137. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Recommended Operating Conditions 137. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Electrical Characteristics Over Recommended Operating Case Temperature Range 138. . . . . . .
5.5 Timing Parameter Symbology 139. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6 Clock Options 140. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.1 Internal System Oscillator With External Crystal 140. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.2 Layout Considerations 141. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6.3 Clock Generation in Bypass Mode (APLL Synthesis Disabled) 142. . . . . . . . . . . . . . . . .
5.6.4 Clock Generation in Lock Mode (APLL Synthesis Enabled) 143. . . . . . . . . . . . . . . . . . .
5.6.5 EMIF Clock Options 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7 Memory Timings 147. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7.1 Asynchronous Memory Timings 147. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7.2 Programmable Synchronous Interface Timings 150. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7.3 Synchronous DRAM Timings 154. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.8 HOLD/HOLDA Timings 159. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.9 Reset Timings 160. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.10 External Interrupt and Interrupt Acknowledge (IACK) Timings 162. . . . . . . . . . . . . . . . . . . . . . . . . . .
*9 TEXAS INSTRUMENTS
Contents
7
December 2002 − Revised November 2008 SPRS206K
Section Page
5.11 XF Timings 163. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.12 General-Purpose Input/Output (GPIOx) Timings 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.13 Parallel General-Purpose Input/Output (PGPIOx) Timings 165. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14 TIM0/TIM1/WDTOUT Timings 166. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14.1 TIM0/TIM1/WDTOUT Timer Pin Timings 166. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.14.2 TIM0/TIM1/WDTOUT General-Purpose I/O Timings 167. . . . . . . . . . . . . . . . . . . . . . . . .
5.14.3 TIM0/TIM1/WDTOUT Interrupt Timings 168. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.15 Multichannel Buffered Serial Port (McBSP) Timings 169. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.15.1 McBSP Transmit and Receive Timings 169. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.15.2 McBSP General-Purpose I/O Timings 172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.15.3 McBSP as SPI Master or Slave Timings 173. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16 Host-Port Interface Timings 179. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.1 HPI Read and Write Timings 179. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.2 HPI General-Purpose I/O Timings 185. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.16.3 HPI.HAS Interrupt Timings 186. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.17 Inter-Integrated Circuit (I2C) Timings 187. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.18 Universal Asynchronous Receiver/Transmitter (UART) Timings 189. . . . . . . . . . . . . . . . . . . . . . . . .
6 Mechanical Data 190. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1 Package Thermal Resistance Characteristics 190. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2 Packaging Information 192. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
i" TEXAS INSTRUMENTS
Figures
8December 2002 − Revised November 2008SPRS206K
List of Figures
Figure Page
2−1 201-Terminal GZZ and ZZZ Ball Grid Array (Bottom View) 17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2−2 176-Pin PGF Low-Profile Quad Flatpack (Top View) 19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−1 TMS320VC5501 Functional Block Diagram 38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−2 TMS320VC5501 Memory Map 41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−3 External Bus Selection Register Layout (0x6C00) 46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−4 Configuration Example A (GPIO6 = 1 at Reset) 48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−5 Configuration Example B (GPIO6 = 0 at Reset) 49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−6 Timer Interrupts 51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−7 Timer Pins 52. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−8 Timer Signal Selection Register Layout (0x8000) 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−9 UART Functional Block Diagram 55. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−10 I2C Module Block Diagram 56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−11 DMA Channel 0 Control Register Layout (0x0C01) 58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−12 System Clock Generator 60. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−13 Internal System Oscillator With External Crystal 61. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−14 Clock Generator Registers 64. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−15 PLL Control/Status Register Layout (0x1C80) 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−16 PLL Multiplier Control Register Layout (0x1C88) 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−17 PLL Divider 0 Register Layout (0x1C8A) 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−18 PLL Divider 1 Register Layout (0x1C8C) 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−19 PLL Divider 2 Register Layout (0x1C8E) 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−20 PLL Divider 3 Register Layout (0x1C90) 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−21 Oscillator Divider1 Register Layout (0x1C92) 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−22 Oscillator Wakeup Control Register Layout (0x1C98) 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−23 CLKOUT3 Select Register Layout (0x1C82) 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−24 CLKOUT Selection Register Layout (0x8400) 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−25 Clock Mode Control Register Layout (0x8C00) 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−26 IDLE Configuration Register Layout (0x0001) 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−27 IDLE Status Register Layout (0x0002) 87. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−28 Peripheral IDLE Control Register Layout (0x9400) 88. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−29 Peripheral IDLE Status Register Layout (0x9401) 90. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−30 Master IDLE Control Register Layout (0x9402) 91. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−31 Master IDLE Status Register Layout (0x9403) 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−32 GPIO Direction Register Layout (0x3400) 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−33 GPIO Data Register Layout (0x3401) 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−34 Parallel GPIO Enable Register 0 Layout (0x4400) 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−35 Parallel GPIO Direction Register 0 Layout (0x4401) 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−36 Parallel GPIO Data Register 0 Layout (0x4402) 97. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
*9 TEXAS INSTRUMENTS
Figures
9
December 2002 − Revised November 2008 SPRS206K
Figure Page
3−37 Parallel GPIO Enable Register 1 Layout (0x4403) 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−38 Parallel GPIO Direction Register 1 Layout (0x4404) 99. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−39 Parallel GPIO Data Register 1 Layout (0x4405) 100. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−40 Parallel GPIO Enable Register 2 Layout (0x4406) 101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−41 Parallel GPIO Direction Register 2 Layout (0x4407) 102. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−42 Parallel GPIO Data Register 2 Layout (0x4408) 103. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−43 External Bus Control Register Layout (0x8800) 105. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−44 XPORT Configuration Register Layout (0x0100) 107. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−45 XPORT Bus Error Register Layout (0x0102) 108. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−46 DPORT Configuration Register Layout (0x0200) 109. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−47 DPORT Bus Error Register Layout (0x0202) 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−48 IPORT Bus Error Register Layout (0x0302) 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−49 System Configuration Register Layout (0x07FD) 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−50 Time-Out Control Register Layout (0x9000) 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−51 IFR0, IER0, DBIFR0, and DBIER0 Registers Layout 130. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−52 IFR1, IER1, DBIFR1, and DBIER1 Registers Layout 131. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−53 Bad TCK Transition 133. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−54 Good TCK Transition 133. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−55 Sample Noise Filtering Circuitry 134. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−1 3.3-V Test Load Circuit 139. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−2 Internal System Oscillator With External Crystal 140. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−3 Bypass Mode Clock Timings 142. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−4 External Multiply-by-N Clock Timings 144. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−5 ECLKIN Timings for EMIF 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−6 ECLKOUT1 Timings for EMIF Module 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−7 ECLKOUT2 Timings for EMIF Module 146. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−8 Asynchronous Memory Read Timings 148. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−9 Asynchronous Memory Write Timings 149. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−10 Programmable Synchronous Interface Read Timings (With Read Latency = 2) 151. . . . . . . . . . . . . . . .
5−11 Programmable Synchronous Interface Write Timings (With Write Latency = 0) 152. . . . . . . . . . . . . . . .
5−12 Programmable Synchronous Interface Write Timings (With Write Latency = 1) 153. . . . . . . . . . . . . . . .
5−13 SDRAM Read Command (CAS Latency 3) 154. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−14 SDRAM Write Command 155. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−15 SDRAM ACTV Command 155. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−16 SDRAM DCAB Command 156. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−17 SDRAM DEAC Command 156. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−18 SDRAM REFR Command 157. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−19 SDRAM MRS Command 157. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−20 SDRAM Self-Refresh Timings 158. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−21 EMIF.HOLD/HOLDA Timings 159. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−22 Reset Timings 161. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
i" TEXAS INSTRUMENTS
Figures
10 December 2002 − Revised November 2008SPRS206K
Figure Page
5−23 External Interrupt Timings 162. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−24 External Interrupt Acknowledge Timings 162. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−25 XF Timings 163. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−26 General-Purpose Input/Output (GPIOx) Signal Timings 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−27 Parallel General-Purpose Input/Output (PGPIOx) Signal Timings 165. . . . . . . . . . . . . . . . . . . . . . . . . . .
5−28 TIM0/TIM1/WDTOUT Timings When Configured as Timer Input Pins 166. . . . . . . . . . . . . . . . . . . . . . . .
5−29 TIM0/TIM1/WDTOUT Timings When Configured as Timer Output Pins 166. . . . . . . . . . . . . . . . . . . . . .
5−30 TIM0/TIM1/WDTOUT General-Purpose I/O Timings 167. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−31 TIM0/TIM1/WDTOUT Interrupt Timings 168. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−32 McBSP Receive Timings 171. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−33 McBSP Transmit Timings 171. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−34 McBSP General-Purpose I/O Timings 172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−35 McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0 174. . . . . . . . . . . . . . . . . . . . . . .
5−36 McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0 175. . . . . . . . . . . . . . . . . . . . . . .
5−37 McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1 177. . . . . . . . . . . . . . . . . . . . . . .
5−38 McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1 178. . . . . . . . . . . . . . . . . . . . . . .
5−39 Multiplexed Read Timings Using HPI.HAS 181. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−40 Multiplexed Read Timings With HPI.HAS Held High 182. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−41 Multiplexed Write Timings Using HPI.HAS 183. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−42 Multiplexed Write Timings With HPI.HAS Held High 184. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−43 HINT Timings 184. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−44 HPI General-Purpose I/O Timings 185. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−45 HPI.HAS Interrupt Timings 186. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−46 I2C Receive Timings 187. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−47 I2C Transmit Timings 188. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−48 UART Timings 189. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
*9 TEXAS INSTRUMENTS
Tables
11
December 2002 − Revised November 2008 SPRS206K
List of Tables
Table Page
2−1 201-Terminal GZZ and ZZZ Ball Grid Array Thermal Ball Locations 17. . . . . . . . . . . . . . . . . . . . . . . . .
2−2 201-Terminal GZZ and ZZZ Ball Grid Array Ball Assignments 18. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2−3 176-Pin PGF Low-Profile Quad Flatpack Pin Assignments 20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2−4 Signal Descriptions 21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−1 On-Chip ROM Layout 39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−2 DARAM Blocks 40. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−3 Boot Configuration Selection Via the BOOTM[2:0] Pins 42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−4 TMS320VC5501 Routing of Parallel Port Mux Signals 44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−5 TMS320VC5501 Routing of Host Port Mux Signals 45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−6 External Bus Selection Register Bit Field Description 47. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−7 Timer Signal Selection Register Bit Field Description 53. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−8 Synchronization Control Function 59. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−9 Recommended Crystal Parameters 62. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−10 Internal Clocks Frequency Ranges 63. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−11 PLL Control Registers 66. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−12 PLL Control/Status Register Bit Field Description 67. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−13 PLL Multiplier Control Register Bit Field Description 68. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−14 PLL Divider 0 Register Bit Field Description 69. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−15 PLL Divider 1 Register Bit Field Description 70. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−16 PLL Divider 2 Register Bit Field Description 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−17 PLL Divider 3 Register Bit Field Description 71. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−18 Oscillator Divider1 Register Bit Field Description 72. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−19 Oscillator Wakeup Control Register Bit Field Description 73. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−20 CLKOUT3 Select Register Bit Field Description 74. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−21 CLKOUT Selection Register Bit Field Description 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−22 Clock Mode Control Register Bit Field Description 75. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−23 Number of Reference Clock Cycles Needed Until Program Flow Begins 76. . . . . . . . . . . . . . . . . . . . .
3−24 Peripheral Behavior at Entering IDLE State 80. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−25 Wake-Up Procedures 83. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−26 Clock Domain Memory-Mapped Registers 84. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−27 IDLE Configuration Register Bit Field Description 85. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−28 IDLE Status Register Bit Field Description 87. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−29 Peripheral IDLE Control Register Bit Field Description 88. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−30 Peripheral IDLE Status Register Bit Field Description 90. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−31 Master IDLE Control Register Bit Field Description 91. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−32 Master IDLE Status Register Bit Field Description 92. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−33 GPIO Direction Register Bit Field Description 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−34 GPIO Data Register Bit Field Description 93. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−35 TMS320VC5501 PGPIO Cross-Reference 94. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−36 Parallel GPIO Enable Register 0 Bit Field Description 95. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−37 Parallel GPIO Direction Register 0 Bit Field Description 96. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−38 Parallel GPIO Data Register 0 Bit Field Description 97. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−39 Parallel GPIO Enable Register 1 Bit Field Description 98. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−40 Parallel GPIO Direction Register 1 Bit Field Description 99. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−41 Parallel GPIO Data Register 1 Bit Field Description 100. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
i" TEXAS INSTRUMENTS
Tables
12 December 2002 − Revised November 2008SPRS206K
Table Page
3−42 Parallel GPIO Enable Register 2 Bit Field Description 101. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−43 Parallel GPIO Direction Register 2 Bit Field Description 102. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−44 Parallel GPIO Data Register 2 Bit Field Description 103. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−45 Pins With Pullups, Pulldowns, and Bus Holders 104. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−46 External Bus Control Register Bit Field Description 105. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−47 I/O Addresses Under Scope of XPORT 106. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−48 XPORT Configuration Register Bit Field Description 107. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−49 XPORT Bus Error Register Bit Field Description 108. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−50 DPORT Configuration Register Bit Field Description 109. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−51 DPORT Bus Error Register Bit Field Description 110. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−52 IPORT Bus Error Register Bit Field Description 111. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−53 System Configuration Register Bit Field Description 112. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−54 Time-Out Control Register Bit Field Description 113. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−55 CPU Memory-Mapped Registers 114. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−56 Peripheral Bus Controller Configuration Registers 116. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−57 External Memory Interface Registers 117. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−58 DMA Configuration Registers 118. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−59 Instruction Cache Registers 121. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−60 Trace FIFO 121. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−61 Timer Signal Selection Register 121. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−62 Timers 121. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−63 Multichannel Serial Port #0 123. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−64 Multichannel Serial Port #1 124. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−65 HPI 125. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−66 GPIO 125. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−67 Device Revision ID 126. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−68 I2C 126. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−69 UART 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−70 External Bus Selection 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−71 Clock Mode Register 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−72 CLKOUT Selector Register 127. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−73 Clock Controller Registers 128. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−74 IDLE Control Registers 128. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3−75 Interrupt Table 129. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−1 Recommended Crystal Parameters 140. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−2 CLKIN in Bypass Mode Timing Requirements 142. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−3 CLKOUT in Bypass Mode Switching Characteristics 142. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−4 CLKIN in Lock Mode Timing Requirements 143. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−5 CLKOUT in Lock Mode Switching Characteristics 143. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−6 EMIF Timing Requirements for ECLKIN 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−7 EMIF Switching Characteristics for ECLKOUT1 145. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−8 EMIF Switching Characteristics for ECLKOUT2 146. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−9 Asynchronous Memory Cycle Timing Requirements for ECLKIN 147. . . . . . . . . . . . . . . . . . . . . . . . . . .
5−10 Asynchronous Memory Cycle Switching Characteristics for ECLKOUT1 147. . . . . . . . . . . . . . . . . . . . .
5−11 Programmable Synchronous Interface Timing Requirements 150. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−12 Programmable Synchronous Interface Switching Characteristics 150. . . . . . . . . . . . . . . . . . . . . . . . . . .
*9 TEXAS INSTRUMENTS
Tables
13
December 2002 − Revised November 2008 SPRS206K
Table Page
5−13 Synchronous DRAM Cycle Timing Requirements 154. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−14 Synchronous DRAM Cycle Switching Characteristics 154. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−15 EMIF.HOLD/HOLDA Timing Requirements 159. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−16 EMIF.HOLD/HOLDA Switching Characteristics 159. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−17 Reset Timing Requirements 160. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−18 Reset Switching Characteristics 160. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−19 External Interrupt and Interrupt Acknowledge Timing Requirements 162. . . . . . . . . . . . . . . . . . . . . . . .
5−20 External Interrupt and Interrupt Acknowledge Switching Characteristics 162. . . . . . . . . . . . . . . . . . . . .
5−21 XF Switching Characteristics 163. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−22 GPIO Pins Configured as Inputs Timing Requirements 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−23 GPIO Pins Configured as Outputs Switching Characteristics 164. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−24 PGPIO Pins Configured as Inputs Timing Requirements 165. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−25 PGPIO Pins Configured as Outputs Switching Characteristics 165. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−26 TIM0/TIM1/WDTOUT Pins Configured as Timer Input Pins Timing Requirements 166. . . . . . . . . . . . .
5−27 TIM0/TIM1/WDTOUT Pins Configured as Timer Output Pins Switching Characteristics 166. . . . . . . .
5−28 TIM0/TIM1/WDTOUT General-Purpose I/O Timing Requirements 167. . . . . . . . . . . . . . . . . . . . . . . . . .
5−29 TIM0/TIM1/WDTOUT General-Purpose I/O Switching Characteristics 167. . . . . . . . . . . . . . . . . . . . . . .
5−30 TIM0/TIM1/WDTOUT Interrupt Timing Requirements 168. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−31 McBSP Transmit and Receive Timing Requirements 169. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−32 McBSP Transmit and Receive Switching Characteristics 170. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−33 McBSP General-Purpose I/O Timing Requirements 172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−34 McBSP General-Purpose I/O Switching Characteristics 172. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−35 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0) 173. . . . . . . . . .
5−36 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0) 173. . . . . .
5−37 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0) 175. . . . . . . . . .
5−38 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0) 175. . . . . . .
5−39 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1) 176. . . . . . . . . .
5−40 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1) 176. . . . . .
5−41 McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1) 178. . . . . . . . . .
5−42 McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1) 178. . . . . . .
5−43 HPI Read and Write Timing Requirements 179. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−44 HPI Read and Write Switching Characteristics 180. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−45 HPI General-Purpose I/O Timing Requirements 185. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−46 HPI General-Purpose I/O Switching Characteristics 185. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−47 HPI.HAS Interrupt Timing Requirements 186. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−48 I2C Signals (SDA and SCL) Timing Requirements 187. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−49 I2C Signals (SDA and SCL) Switching Characteristics 188. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−50 UART Timing Requirements 189. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5−51 UART Switching Characteristics 189. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6−1 Thermal Resistance Characteristics (Ambient) 190. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6−2 Thermal Resistance Characteristics (Case) 191. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
i" TEXAS INSTRUMENTS
Tables
14 December 2002 − Revised November 2008SPRS206K
*9 TEXAS INSTRUMENTS
Features
15
December 2002 − Revised November 2008 SPRS206K
1 TMS320VC5501 Features
DHigh-Performance, Low-Power, Fixed-Point
TMS320C55x Digital Signal
Processor (DSP)
− 3.33-ns Instruction Cycle Time for
300-MHz Clock Rate
− 16K-Byte Instruction Cache (I-Cache)
− One/Two Instructions Executed per Cycle
− Dual Multipliers [Up to 600 Million
Multiply-Accumulates Per Second
(MMACS)]
− Two Arithmetic/Logic Units (ALUs)
− One Program Bus, Three Internal
Data/Operand Read Buses, and Two
Internal Data/Operand Write Buses
DInstruction Cache (16K Bytes)
D16K x 16-Bit On-Chip RAM That is
Composed of Four Blocks of 4K × 16-Bit
Dual-Access RAM (DARAM) (32K Bytes)
D16K × 16-Bit One-Wait-State On-Chip ROM
(32K Bytes)
D8M × 16-Bit Maximum Addressable External
Memory Space
D32-Bit External Parallel Bus Memory
Supporting External Memory Interface
(EMIF) With General-Purpose Input/Output
(GPIO) Capabilities and Glueless Interface
to:
Asynchronous Static RAM (SRAM)
Asynchronous EPROM
Synchronous DRAM (SDRAM)
Synchronous Burst RAM (SBRAM)
DEmulation/Debug Trace Capability Saves
Last 16 Program Counter (PC)
Discontinuities and Last 32 PC Values
DProgrammable Low-Power Control of Six
Device Functional Domains
DOn-Chip Peripherals
− Six-Channel Direct Memory Access
(DMA) Controller
− Two Multichannel Buffered Serial Ports
(McBSPs)
− Programmable Analog Phase-Locked
Loop (APLL) Clock Generator
− General-Purpose I/O (GPIO) Pins and a
Dedicated Output Pin (XF)
− 8-Bit Parallel Host-Port Interface (HPI)
− Four Timers
− Two 64-Bit General-Purpose Timers
− 64-Bit Programmable Watchdog Timer
− 64-Bit DSP/BIOS Counter
− Inter-Integrated Circuit (I2C) Interface
− Universal Asynchronous Receiver/
Transmitter (UART)
DOn-Chip Scan-Based Emulation Logic
DIEEE Std 1149.1 (JTAG) Boundary Scan
Logic
DPackages:
− 176-Terminal LQFP (Low-Profile Quad
Flatpack) (PGF Suffix)
− 201-Terminal MicroStar BGA (Ball Grid
Array) (GZZ and ZZZ Suffixes)
D3.3-V I/O Supply Voltage
D1.26-V Core Supply Voltage
TMS320C55x, DSP/BIOS, and MicroStar BGA are trademarks of Texas Instruments.
All trademarks are the property of their respective owners.
IEEE Standard 1149.1-1990 Standard-Test-Access Port and Boundary Scan Architecture.
9 (literature number SPRU371) *9 TEXAS INSTRUMENTS
Introduction
16 December 2002 − Revised November 2008SPRS206K
2 Introduction
This section describes the main features of the TMS320VC5501 and gives a brief description of the device.
NOTE: This document is designed to be used in conjunction with the TMS320C55x DSP CPU Reference
Guide (literature number SPRU371).
2.1 Description
The TMS320VC5501 (5501) fixed-point digital signal processor (DSP) is based on the TMS320C55x DSP
generation CPU processor core. The C55x DSP architecture achieves high performance and low power
through increased parallelism and total focus on reduction in power dissipation. The CPU supports an internal
bus structure that is composed of one program bus, three data read buses, two data write buses, and
additional buses dedicated to peripheral and DMA activity. These buses provide the ability to perform up to
three data reads and two data writes in a single cycle. In parallel, the DMA controller can perform data transfers
independent of the CPU activity.
The C55x CPU provides two multiply-accumulate (MAC) units, each capable of 17-bit x 17-bit multiplication
in a single cycle. A central 40-bit arithmetic/logic unit (ALU) is supported by an additional 16-bit ALU. Use of
the ALUs is under instruction set control, providing the ability to optimize parallel activity and power
consumption. These resources are managed in the Address Unit (AU) and Data Unit (DU) of the C55x CPU.
The C55x DSP generation supports a variable byte width instruction set for improved code density. The
Instruction Unit (IU) performs 32-bit program fetches from internal or external memory and queues instructions
for the Program Unit (PU). The Program Unit decodes the instructions, directs tasks to AU and DU resources,
and manages the fully protected pipeline. Predictive branching capability avoids pipeline flushes on execution
of conditional instructions.
The 5501 peripheral set includes an external memory interface (EMIF) that provides glueless access to
asynchronous memories like EPROM and SRAM, as well as to high-speed, high-density memories such as
synchronous DRAM and synchronous burst RAM. Additional peripherals include UART, watchdog timer, and
an I-Cache. Two full-duplex multichannel buffered serial ports (McBSPs) provide glueless interface to a variety
of industry-standard serial devices, and multichannel communication with up to 128 separately enabled
channels. The host-port interface (HPI) is an 8-bit parallel interface used to provide host processor access
to 16K words of internal memory on the 5501. The HPI operates in multiplexed mode to provide glueless
interface to a wide variety of host processors. The DMA controller provides data movement for six independent
channel contexts without CPU intervention. Two general-purpose timers, eight dedicated general-purpose I/O
(GPIO) pins, and analog phase-locked loop (APLL) clock generation are also included.
The 5501 is supported by the industry’s award-winning eXpressDSP, Code Composer Studio Integrated
Development Environment (IDE), DSP/BIOS, Texas Instruments’ algorithm standard, and the industry’s
largest third-party network. The Code Composer Studio IDE features code generation tools that include a
C Compiler, Visual Linker, simulator, RTDX, XDS510 emulation device drivers, and evaluation modules.
The 5501 is also supported by the C55x DSP Library, which features more than 50 foundational software
kernels (FIR filters, IIR filters, FFTs, and various math functions) as well as chip and board support libraries.
C55x, eXpressDSP, Code Composer Studio, RTDX, and XDS510 are trademarks of Texas Instruments.
a (literature number SPRZOZOD OOOOOOOOOOOOOOO O 0000000000000 0 OO 00000000000 00 000 00000 000 000 000 000 COO 0000 00000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 0000 00000 0000 000 000 000 000 000 00000 000 ()0 00000000000 00 O 0000000000000 0 000000000000000 *9 TEXAS INSTRUMENTS
Introduction
17
December 2002 − Revised November 2008 SPRS206K
2.2 Pin Assignments
2.2.1 Ball Grid Array (GZZ and ZZZ)
The TMS320VC5501 is offered in two 201-terminal ball grid array (BGA) packages, both of which include
25 thermal balls to improve thermal dissipation. Except for their Eco-Status (refer to Section 6.2, Packaging
Information), both packages are essentially the same. Figure 2−1 illustrates the ball locations for both BGA
packages. Table 2−1 lists the locations of the thermal balls and Table 2−2 lists the signal names and terminal
numbers.
NOTE:
Some TMX samples were shipped in the GGW package. For more information on the GGW
package, see the TMS320VC5502 and TMS320VC5501 Digital Signal Processors Silicon
Errata (literature number SPRZ020D or later).
6
H
A
124
35
D
B
C
G
E
F
R
K
L
J
P
M
N
U
T
16
11
108
79 141213 15 17
Figure 2−1. 201-Terminal GZZ and ZZZ Ball Grid Array (Bottom View)
Table 2−1. 201-Terminal GZZ and ZZZ Ball Grid Array Thermal Ball Locations
BALL NO. BALL NO. BALL NO. BALL NO. BALL NO.
G7 G8 G9 G10 G11
H7 H8 H9 H10 H11
J7 J8 J9 J10 J11
K7 K8 K9 K10 K11
L7 L8 L9 L10 L11
For best device thermal performance:
An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.
The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability Temperature Cycle
performance.
The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be connected
to the ground plane for heat dissipation.
A solid internal plane is preferred for spreading the heat.
Refer to the MicroStar BGAE Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount, and
reliability considerations.
{'5 TEXAS INSTRUMENTS
Introduction
18 December 2002 − Revised November 2008SPRS206K
Table 2−2. 201-Terminal GZZ and ZZZ Ball Grid Array Ball Assignments†‡
BALL NO. SIGNAL NAME BALL NO. SIGNAL NAME BALL NO. SIGNAL NAME BALL NO. SIGNAL NAME
B1 GPIO6 U2 HCNTL1 T17 A19 A16 D16
C2 GPIO4 T3 HCNTL0 R16 A18 B15 D15
C1 GPIO2 U3 VSS R17 VSS A15 D14
D3 GPIO1 R4 HR/W P15 A17 C14 D13
D2 GPIO0 T4 HDS2 P16 A16 B14 D12
D1 TIM1 U4 CVDD P17 DVDD A14 D11
E3 TIM0 R5 HDS1 N15 A15 C13 D10
E2 INT0 T5 HRDY N16 A14 B13 D9
E1 CVDD U5 DVDD N17 VSS A13 DVDD
F3 INT1 R6 CLKOUT M15 A13 C12 D8
F2 INT2 T6 XF M16 A12 B12 D7
F1 DVDD U6 VSS M17 CVDD A12 VSS
G4 INT3 P7 C15 L14 A11 D11 D6
G3 NMI/WDTOUT R7 C14 L15 A10 C11 D5
G2 IACK T7 HINT L16 A9 B11 D4
G1 VSS U7 PVDD L17 A8 A11 CVDD
H1 CLKR0 U8 NC K17 DVDD A10 D3
H4 DR0 P8 X1 K14 A7 D10 D2
H3 FSR0 R8 X2/CLKIN K15 A6 C10 D1
H2 CLKX0 T8 EMIFCLKS K16 A5 B10 D0
J1 CVDD U9 VSS J17 VSS A9 VSS
J4 DX0 P9 C13 J14 A4 D9 EMU1/OFF
J3 FSX0 R9 C12 J15 A3 C9 EMU0
J2 CLKR1 T9 C11 J16 A2 B9 TDO
K1 DR1 U10 C10 H17 CVDD A8 VSS
K2 FSR1 T10 C9 H16 D31 B8 TDI
K4 DX1 P10 C8 H14 D30 D8 TRST
K3 CLKX1 R10 C7 H15 D29 C8 TCK
L1 VSS U11 VSS G17 VSS A7 TMS
L2 FSX1 T11 ECLKIN G16 D28 B7 RESET
L3 TEST§R11 ECLKOUT2 G15 D27 C7 HPIENA
L4 NC P11 ECLKOUT1 G14 D26 D7 HD7
M1 CVDD U12 CVDD F17 CVDD A6 CVDD
M2 RX T12 C6 F16 D25 B6 HD6
M3 GPIO5 R12 C5 F15 D24 C6 HD5
N1 DVDD U13 DVDD E17 DVDD A5 DVDD
N2 TX T13 C4 E16 D23 B5 HD4
N3 GPIO3 R13 C3 E15 D22 C5 HD3
P1 VSS U14 VSS D17 D21 A4 CVDD
P2 SCL T14 C2 D16 D20 B4 HD2
P3 SDA R14 C1 D15 D19 C4 HD1
R1 HC1 U15 C0 C17 VSS A3 VSS
R2 HC0 T15 A21 C16 D18 B3 HD0
T1 HCS U16 A20 B17 D17 A2 GPIO7
CVDD is core VDD, DVDD is I/O VDD, and PVDD is PLL VDD.
NC indicates “no connect”.
§The TEST pin is reserved for internal testing. It should be left unconnected.
The GPIO7 pin must be low at the rising edge of the reset signal for the device to operate properly.
{9 TEXAS INSTRUMENTS
Introduction
19
December 2002 − Revised November 2008 SPRS206K
2.2.2 Low-Profile Quad Flatpack (PGF)
The TMS320VC5501 is offered in a 176-pin low-profile quad flatpack (LQFP). Figure 2−2 illustrates the pin
locations for the 176-pin LQFP. Table 2−3 lists the signal names and pin numbers.
NOTE:
TMS320VC5501PGF has completed Temp Cycle reliability qualification testing with no
failures through 1500 cycles of −55°C to 125°C following an EIA/JEDEC Moisture Sensitivity
Level 4 pre-condition at 220+5/−0°C peak reflow. Exceeding this peak reflow temperature
condition or storage and handling requirements may result in either immediate device failure
post-reflow, due to package/die material delamination (“popcorning”), or degraded Temp cycle
life performance.
Please note that Texas Instruments (TI) also provides MSL, peak reflow and floor life
information on a bar-code label affixed to dry-pack shipping bags. Shelf life, temperature and
humidity storage conditions and re-bake instructions are prominently displayed on a nearby
screen-printed label.
89
88
45
44
132
133
176
1
Figure 2−2. 176-Pin PGF Low-Profile Quad Flatpack (Top View)
{'5 TEXAS INSTRUMENTS
Introduction
20 December 2002 − Revised November 2008SPRS206K
Table 2−3. 176-Pin PGF Low-Profile Quad Flatpack Pin Assignments†‡
PIN NO. SIGNAL NAME PIN NO. SIGNAL NAME PIN NO. SIGNAL NAME PIN NO. SIGNAL NAME
1 GPIO6 45 HCNTL1 89 A19 133 D16
2 GPIO4 46 HCNTL0 90 A18 134 D15
3 GPIO2 47 VSS 91 VSS 135 D14
4 GPIO1 48 HR/W 92 A17 136 D13
5 GPIO0 49 HDS2 93 A16 137 D12
6 TIM1 50 CVDD 94 DVDD 138 D11
7 TIM0 51 HDS1 95 A15 139 D10
8 INT0 52 HRDY 96 A14 140 D9
9 CVDD 53 DVDD 97 VSS 141 DVDD
10 INT1 54 CLKOUT 98 A13 142 D8
11 INT2 55 XF 99 A12 143 D7
12 DVDD 56 VSS 100 CVDD 144 VSS
13 INT3 57 C15 101 A11 145 D6
14 NMI/WDTOUT 58 C14 102 A10 146 D5
15 IACK 59 HINT 103 A9 147 D4
16 VSS 60 PVDD 104 A8 148 CVDD
17 CLKR0 61 NC 105 DVDD 149 D3
18 DR0 62 X1 106 A7 150 D2
19 FSR0 63 X2/CLKIN 107 A6 151 D1
20 CLKX0 64 EMIFCLKS 108 A5 152 D0
21 CVDD 65 VSS 109 VSS 153 VSS
22 DX0 66 C13 110 A4 154 EMU1/OFF
23 FSX0 67 C12 111 A3 155 EMU0
24 CLKR1 68 C11 112 A2 156 TDO
25 DR1 69 C10 113 CVDD 157 VSS
26 FSR1 70 C9 114 D31 158 TDI
27 DX1 71 C8 115 D30 159 TRST
28 CLKX1 72 C7 116 D29 160 TCK
29 VSS 73 VSS 117 VSS 161 TMS
30 FSX1 74 ECLKIN 118 D28 162 RESET
31 TEST§75 ECLKOUT2 119 D27 163 HPIENA
32 NC 76 ECLKOUT1 120 D26 164 HD7
33 CVDD 77 CVDD 121 CVDD 165 CVDD
34 RX 78 C6 122 D25 166 HD6
35 GPIO5 79 C5 123 D24 167 HD5
36 DVDD 80 DVDD 124 DVDD 168 DVDD
37 TX 81 C4 125 D23 169 HD4
38 GPIO3 82 C3 126 D22 170 HD3
39 VSS 83 VSS 127 D21 171 CVDD
40 SCL 84 C2 128 D20 172 HD2
41 SDA 85 C1 129 D19 173 HD1
42 HC1 86 C0 130 VSS 174 VSS
43 HC0 87 A21 131 D18 175 HD0
44 HCS 88 A20 132 D17 176 GPIO7
CVDD is core VDD, DVDD is I/O VDD, and PVDD is PLL VDD.
NC indicates “no connect”.
§The TEST pin is reserved for internal testing. It should be left unconnected.
The GPIO7 pin must be low at the rising edge of the reset signal for the device to operate properly.
reset, T h dumg res {9 TEXAS INSTRUMENTS
Introduction
21
December 2002 − Revised November 2008 SPRS206K
2.3 Signal Descriptions
Table 2−4 lists each signal, function, and operating mode(s) grouped by function. See Section 2.2, Pin
Assignments, for exact pin locations based on package type.
Table 2−4. Signal Descriptions
Pin
Name Multiplexed
Signal Name Pin
TypeOtherFunction
Parallel Port − Address Bus
A[21:18] I/O/Z
C, D, E
,
F, G, H
,
M
The A[21:18] pins of the Parallel Port serve one of two functions: parallel general-purpose
input/output (PGPIO) signals PGPIO[3:0] or external memory interface (EMIF) address
bus signals EMIF.A[21:18]. The function of the A[21:18] pins is determined by the state of
the GPIO6 pin during reset. The A[21:18] pins are set to PGPIO[3:0] if GPIO6 is low during
reset. The A[21:18] pins are set to EMIF.A[21:18] if GPIO6 is high during reset. The
function of the A[21:18] pins will be set once the device is taken out of reset (RESET pin
transitions from a low to high state).
The A[21:18] bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias resistors
on unused pins. When the bus goes into a high-impedance state, the bus holders keep the
address bus at the logic level that was most recently driven. The bus holders are enabled
at reset and can be enabled/disabled through the External Bus Control Register (XBCR).
PGPIO[3:0] I/O/Z Parallel general-purpose I/O. PGPIO[3:0] is selected if GPIO6 is low during reset. The
PGPIO[3:0] signals are configured as inputs after reset.
EMIF.A[21:18] O/Z EMIF address bus. EMIF.A[21:18] is selected if GPIO6 is high during reset. The
EMIF.A[21:18] signals are in a high-impedance state during reset and are configured as
outputs after reset with an output value of 0.
A[17:2] I/O/Z
C, D, E
,
F, M
The A[17:2] pins of the Parallel Port serve one of two functions: external memory interface
(EMIF) address bus signals EMIF.A[17:2] or reserved pins. The function of the A[17:2]
pins is determined by the state of the GPIO6 pin during reset. The A[17:2] pins are
reserved if GPIO6 is low during reset. The A[17:2] pins are set to EMIF.A[17:2] if GPIO6 is
high during reset. The function of the A[17:2] pins will be set once the device is taken out of
reset (RESET pin transitions from a low to high state).
The A[17:2] bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias resistors
on unused pins. When the bus goes into a high-impedance state, the bus holders keep the
address bus at the logic level that was most recently driven. The bus holders are enabled
at reset and can be enabled/disabled through the External Bus Control Register (XBCR).
Reserved I Reserved pins. These pins are reserved when GPIO6 is low during reset.
EMIF.A[17:2] O/Z EMIF address bus. EMIF.A[17:2] is selected when GPIO6 is high during reset. The
EMIF.A[17:2] signals are in a high-impedance state during reset and are configured as
outputs after reset with an output value of 0.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
reset. T reset Th {'5 TEXAS INSTRUMENTS
Introduction
22 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Data Bus
D[31:16] I/O/Z
C, D, E
,
F, G, H
,
M
The D[31:16] pins of the Parallel Port serve one of two functions: parallel general-purpose
input/output (PGPIO) signals PGPIO[19:4] or external memory interface (EMIF) data bus
signals EMIF.D[31:16]. The function of the D[31:16] pins is determined by the state of the
GPIO6 pin during reset. The D[31:16] pins are set to PGPIO[19:4] if GPIO6 is low during
reset. The D[31:16] pins are set to EMIF.D[31:16] if GPIO6 is high during reset. The
function of the D[31:16] pins will be set once the device is taken out of reset (RESET pin
transitions from a low to high state).
The D[31:16] bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias resistors
on unused pins. When the bus goes into a high-impedance state, the bus holders keep the
data bus at the logic level that was most recently driven. The bus holders are enabled at
reset and can be enabled/disabled through the External Bus Control Register (XBCR).
PGPIO[19:4] I/O/Z Parallel general-purpose I/O. PGPIO[19:4] is selected when GPIO6 is low during reset.
The PGPIO[19:4] signals are configured as inputs after reset.
EMIF.D[31:16] I/O/Z EMIF data bus. EMIF.D[31:16] is selected when GPIO6 is high during reset. The
EMIF.D[31:16] signals are set as inputs after reset.
D[15:0] I/O/Z
C, D, E
,
F, M
The D[15:0] pins of the Parallel Port serve one of two functions: external memory interface
(EMIF) data bus signals EMIF.D[15:0] or reserved pins. The function of the D[15:0] pins is
determined by the state of the GPIO6 pin during reset. The D[15:0] pins are reserved if
GPIO6 is low during reset. The D[15:0] pins are set to EMIF.D[15:0] if GPIO6 is high during
reset. The function of the D[15:0] pins will be set once the device is taken out of reset
(RESET pin transitions from a low to high state).
The D[15:0] bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias resistors
on unused pins. When the bus goes into a high-impedance state, the bus holders keep the
data bus at the logic level that was most recently driven. The bus holders are enabled at
reset and can be enabled/disabled through the External Bus Control Register (XBCR).
Reserved I/O/Z Reserved pins. These pins are reserved when GPIO6 is low during reset.
EMIF.D[15:0] I/O/Z EMIF data bus. EMIF.D[15:0] is selected when GPIO6 is high during reset. The
EMIF.D[15:0] signals are configured as inputs after reset.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
outgut PGP‘O swgnal P e ewes pin dunng reset, The cu gm ‘5 set in E w GPIOE e mgh dunn F, G. H. F conlrol pin. EM‘F ARE/SADS/SDCA EM‘FARE/SA E swgnal serves {our dwfleren Dus me nous me SDRA outgut PGP‘O swg GPIOG pm dumg reset. The 01 gm .5 AS w ems .s mgh dumng C, De Ev F control pin. EMIF.AOE EM‘FAO em m 5 me chronous *9 TEXAS INSTRUMENTS
Introduction
23
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Control Pins
C0 I/O/Z
The C0 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO20 or external memory interface control signal
EMIF.ARE/SADS/SDCAS/SRE. The function of the C0 pin is determined by the state of
the GPIO6 pin during reset. The C0 pin is set to PGPIO20 if GPIO6 is low during reset. The
C0 pin is set to EMIF.ARE/SADS/SDCAS/SRE if GPIO6 is high during reset. The function
of the C0 pin will be set once the device is taken out of reset (RESET pin transitions from a
low to high state).
PGPIO20 I/O/Z C, D, E
,
F, G, H,
Parallel general-purpose I/O. PGPIO20 is selected when GPIO6 is low during reset.
The PGPIO20 signal is configured as an input after reset.
EMIF.ARE/SADS/
SDCAS/SRE O/Z
F, G, H,
MEMIF control pin. EMIF.ARE/SADS/SDCAS/SRE is selected when GPIO6 is high during
reset. The EMIF.ARE/SADS/SDCAS/SRE signal is in a high-impedance state during
reset and is set to output after reset with an output value of 1.
The EMIF.ARE/SADS/SDCAS/SRE signal serves four different functions when used by
the EMIF: asynchronous memory read-enable (EMIF.ARE), synchronous memory
address strobe (EMIF.SADS), SDRAM column-address strobe (EMIF.SDCAS), and
synchronous read-enable (EMIF.SRE) (selected by RENEN in the CE Secondary Control
Register 1).
C1 I/O/Z
C, D, E,
The C1 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO21 or external memory interface control signal
EMIF.AOE/SOE/SDRAS. The function of the C1 pin is determined by the state of the
GPIO6 pin during reset. The C1 pin is set to PGPIO21 if GPIO6 is low during reset. The C1
pin is set to EMIF.AOE/SOE/SDRAS if GPIO6 is high during reset. The function of the C1
pin will be set once the device is taken out of reset (RESET pin transitions from a low to
high state).
PGPIO21 I/O/Z
C, D, E,
F, G, H
,
M
Parallel general-purpose I/O. PGPIO21 is selected when GPIO6 is low during reset.
The PGPIO21 signal is configured as an input after reset.
EMIF.AOE/SOE/
SDRAS O/Z
M
EMIF control pin. EMIF.AOE/SOE/SDRAS is selected when GPIO6 is high during reset.
The EMIF.AOE/SOE/SDRAS signal is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
The EMIF.AOE/SOE/SDRAS signal serves three different functions when used by the
EMIF: asynchronous memory output-enable (EMIF.AOE), synchronous memory
output-enable (EMIF.SOE), and SDRAM row-address strobe (EMIF.SDRAS).
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
outgut PGP‘O sw GPIOG pm dumg reset he 02 gm .5 we w GPIOE \s mgh dunng C, D‘ Ev M F control Ein. EMIF AWE em fu us 77" WE syn GPIOG \s mgh dunngr J *9 TEXAS INSTRUMENTS
Introduction
24 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Control Pins (Continued)
C2 I/O/Z
C, D, E,
The C2 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO22 or external memory interface control signal
EMIF.AWE/SWE/SDWE. The function of the C2 pin is determined by the state of the
GPIO6 pin during reset. The C2 pin is set to PGPIO22 if GPIO6 is low during reset. The C2
pin is set to EMIF.AWE/SWE/SDWE if GPIO6 is high during reset. The function of the C2
pin will be set once the device is taken out of reset (RESET pin transitions from a low to
high state).
PGPIO22 I/O/Z
C, D, E,
F, G, H
,
M
Parallel general-purpose I/O. PGPIO22 is selected when GPIO6 is low during reset.
The PGPIO22 signal is configured as an input after reset.
EMIF.AWE/
SWE/SDWE O/Z
M
EMIF control pin. EMIF.AWE/SWE/SDWE is selected when GPIO6 is high during reset.
The EMIF.AWE/SWE/SDWE signal is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
The EMIF.AWE/SWE/SDWE signal serves three different functions when used by the
EMIF: asynchronous memory write-enable (EMIF.AWE), synchronous memory
write-enable (EMIF.SWE), and SDRAM write-enable (EMIF.SDWE).
C3 I/O/Z
The C3 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO23 or external memory interface control signal
EMIF.ARDY. The function of the C3 pin is determined by the state of the GPIO6 pin during
reset. The C3 pin is set to PGPIO23 if GPIO6 is low during reset. The C3 pin is set to
EMIF.ARDY if GPIO6 is high during reset. The function of the C3 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO23 I/O/Z F, G, H
,
J
Parallel general-purpose I/O. PGPIO23 is selected when GPIO6 is low during reset.
The PGPIO23 signal is configured as an input after reset.
EMIF.ARDY I
J
EMIF data ready pin. EMIF.ARDY is selected when GPIO6 is high during reset.
The EMIF.ARDY signal indicates that an external device is ready for a bus transaction to
be completed. If the device is not ready (EMIF.ARDY is low), the processor extends the
memory access by one cycle and checks EMIF.ARDY again. An internal pullup is
included to disable this feature if not used. The internal pullup can be disabled through the
External Bus Control Register (XBCR).
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
outgu . The dunng re F‘G H, EMIF chip—selecl lnr memo outgu . The dunng re EMIF chip—selecl lnr memo outgu . The dunng re EMIF chip—selecl lnr memo *9 TEXAS INSTRUMENTS
Introduction
25
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Control Pins (Continued)
C4 I/O/Z
C, D, E
,
F, G, H,
The C4 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO24 or external memory interface control signal
EMIF.CE0. The function of the C4 pin is determined by the state of the GPIO6 pin during
reset. The C4 pin is set to PGPIO24 if GPIO6 is low during reset. The C4 pin is set to
EMIF.CE0 if GPIO6 is high during reset. The function of the C4 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO24 I/O/Z
F, G, H,
MParallel general-purpose I/O. PGPIO24 is selected when GPIO6 is low during reset.
The PGPIO24 signal is configured as an input after reset.
EMIF.CE0 O/Z EMIF chip-select for memory space CE0. EMIF.CE0 is selected when GPIO6 is high
during reset. The EMIF.CE0 signal is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
C5 I/O/Z
C, D, E
,
F, G, H,
The C5 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO25 or external memory interface control signal
EMIF.CE1. The function of the C5 pin is determined by the state of the GPIO6 pin during
reset. The C5 pin is set to PGPIO25 if GPIO6 is low during reset. The C5 pin is set to
EMIF.CE1 if GPIO6 is high during reset. The function of the C5 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO25 I/O/Z
F, G, H,
MParallel general-purpose I/O. PGPIO25 is selected when GPIO6 is low during reset.
The PGPIO25 signal is configured as an input after reset.
EMIF.CE1 O/Z EMIF chip-select for memory space CE1. EMIF.CE1 is selected when GPIO6 is high
during reset. The EMIF.CE1 signal is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
C6 I/O/Z
C, D, E
,
F, G, H,
The C6 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO26 or external memory interface control signal
EMIF.CE2. The function of the C6 pin is determined by the state of the GPIO6 pin during
reset. The C6 pin is set to PGPIO26 if GPIO6 is low during reset. The C6 pin is set to
EMIF.CE2 if GPIO6 is high during reset. The function of the C6 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO26 I/O/Z
F, G, H,
MParallel general-purpose I/O. PGPIO26 is selected when GPIO6 is low during reset.
The PGPIO26 signal is configured as an input after reset.
EMIF.CE2 O/Z EMIF chip-select for memory space CE2. EMIF.CE2 is selected when GPIO6 is high
during reset. The EMIF.CE2 signal is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
outgu The durmg re e a L. EMIF chip-selem lnr memo Outgu The duhng re F me _ Outgu The duhng re e a L. F me _ *3" T EXAS INSTRUMENTS
Introduction
26 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Control Pins (Continued)
C7 I/O/Z
C, D, E
,
F, G, H,
The C7 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO27 or external memory interface control signal
EMIF.CE3. The function of the C7 pin is determined by the state of the GPIO6 pin during
reset. The C7 pin is set to PGPIO27 if GPIO6 is low during reset. The C7 pin is set to
EMIF.CE3 if GPIO6 is high during reset. The function of the C7 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO27 I/O/Z
F, G, H,
MParallel general-purpose I/O. PGPIO27 is selected when GPIO6 is low during reset.
The PGPIO27 signal is configured as an input after reset.
EMIF.CE3 O/Z EMIF chip-select for memory space CE3. EMIF.CE3 is selected when GPIO6 is high
during reset. The EMIF.CE3 signal is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
C8 I/O/Z
C, D, E
,
F, G, H,
The C8 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO28 or external memory interface control signal
EMIF.BE0. The function of the C8 pin is determined by the state of the GPIO6 pin during
reset. The C8 pin is set to PGPIO28 if GPIO6 is low during reset. The C8 pin is set to
EMIF.BE0 if GPIO6 is high during reset. The function of the C8 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO28 I/O/Z
F, G, H,
MParallel general-purpose I/O. PGPIO28 is selected when GPIO6 is low during reset.
The PGPIO28 signal is configured as an input after reset.
EMIF.BE0 O/Z EMIF byte-enable 0 control. EMIF.BE0 is selected when GPIO6 is high during reset. The
EMIF.BE0 signal is in a high-impedance state during reset and is set to output after reset
with an output value of 1.
C9 I/O/Z
C, D, E
,
F, G, H,
The C9 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO29 or external memory interface control signal
EMIF.BE1. The function of the C9 pin is determined by the state of the GPIO6 pin during
reset. The C9 pin is set to PGPIO29 if GPIO6 is low during reset. The C9 pin is set to
EMIF.BE1 if GPIO6 is high during reset. The function of the C9 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO29 I/O/Z
F, G, H,
MParallel general-purpose I/O. PGPIO29 is selected when GPIO6 is low during reset.
The PGPIO29 signal is configured as an input after reset.
EMIF.BE1 O/Z EMIF byte-enable 1 control. EMIF.BE1 is selected when GPIO6 is high during reset. The
EMIF.BE1 signal is in a high-impedance state during reset and is set to output after reset
with an output value of 1.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
outgu reset. E 2 w emoe \s mgh dunng res outgu reset. E 3 w emoe \s mgh dunng res set to EM‘FSDCKE IQ GP‘OG ‘5 high during re *9 TEXAS INSTRUMENTS
Introduction
27
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Control Pins (Continued)
C10 I/O/Z
C, D, E
,
F, G, H,
The C10 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO30 or external memory interface control signal
EMIF.BE2. The function of the C10 pin is determined by the state of the GPIO6 pin during
reset. The C10 pin is set to PGPIO30 if GPIO6 is low during reset. The C10 pin is set to
EMIF.BE2 if GPIO6 is high during reset. The function of the C10 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO30 I/O/Z F, G, H
,
MParallel general-purpose I/O. PGPIO30 is selected when GPIO6 is low during reset.
The PGPIO30 signal is configured as an input after reset.
EMIF.BE2 O/Z
EMIF byte-enable 2 control. EMIF.BE2 is selected when GPIO6 is high during reset. The
EMIF.BE2 signal is in a high-impedance state during reset and is set to output after reset
with an output value of 1.
C11 I/O/Z
C, D, E
,
F, G, H,
The C11 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO31 or external memory interface control signal
EMIF.BE3. The function of the C11 pin is determined by the state of the GPIO6 pin during
reset. The C11 pin is set to PGPIO31 if GPIO6 is low during reset. The C11 pin is set to
EMIF.BE3 if GPIO6 is high during reset. The function of the C11 pin will be set once the
device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO31 I/O/Z F, G, H
,
MParallel general-purpose I/O. PGPIO31 is selected when GPIO6 is low during reset.
The PGPIO31 signal is configured as an input after reset.
EMIF.BE3 O/Z
EMIF byte-enable 3 control. EMIF.BE3 is selected when GPIO6 is high during reset. The
EMIF.BE3 signal is in a high-impedance state during reset and is set to output after reset
with an output value of 1.
C12 I/O/Z
C, D, E
,
F, G, H,
The C12 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO32 or external memory interface control signal
EMIF.SDCKE. The function of the C12 pin is determined by the state of the GPIO6 pin
during reset. The C12 pin is set to PGPIO32 if GPIO6 is low during reset. The C12 pin is
set to EMIF.SDCKE if GPIO6 is high during reset. The function of the C12 pin will be set
once the device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO32 I/O/Z F, G, H
,
MParallel general-purpose I/O. PGPIO32 is selected when GPIO6 is low during reset.
The PGPIO32 signal is configured as an input after reset.
EMIF.SDCKE O/Z
EMIF SDRAM clock-enable. EMIF.SDCKE is selected when GPIO6 is high during reset.
The EMIF.SDCKE signal is in a high-impedance state during reset and is set to output
after reset with an output value of 1.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
outgut euhhg reset. The c urmg res c. D, E. -enabl Outgut euhhg reset. The o rt smog .s hrgh durmg res F, G, H. outgut P euhhg reset. The (:1 set to EMIF,HOLDA rt GPIOG Is mgh dunng re G,H,M d acknnw *9 TEXAS INSTRUMENTS
Introduction
28 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Parallel Port − Control Pins (Continued)
C13 I/O/Z
C, D, E
,
The C13 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO33 or external memory interface control signal
EMIF.SOE3. The function of the C13 pin is determined by the state of the GPIO6 pin
during reset. The C13 pin is set to PGPIO33 if GPIO6 is low during reset. The C13 pin is
set to EMIF.SOE3 if GPIO6 is high during reset. The function of the C13 pin will be set
once the device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO33 I/O/Z
C, D, E,
F, G, H
,
MParallel general-purpose I/O. PGPIO33 is selected when GPIO6 is low during reset.
The PGPIO33 signal is configured as an input after reset.
EMIF.SOE3 O/Z
EMIF synchronous memory output-enable for CE3. EMIF.SOE3 is selected when
GPIO6 is high during reset. The EMIF.SOE3 signal is in a high-impedance state during
reset and is set to output after reset with an output value of 1.
The EMIF.SOE3 signal is intended for glueless FIFO interface.
C14 I/O/Z
F, G, H,
The C14 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO34 or external memory interface control signal
EMIF.HOLD. The function of the C14 pin is determined by the state of the GPIO6 pin
during reset. The C14 pin is set to PGPIO34 if GPIO6 is low during reset. The C14 pin is
set to EMIF.HOLD if GPIO6 is high during reset. The function of the C14 pin will be set
once the device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO34 I/O/Z
F, G, H,
J, M Parallel general-purpose I/O. PGPIO34 is selected when GPIO6 is low during reset.
The PGPIO34 signal is configured as an input after reset.
EMIF.HOLD I EMIF hold request. EMIF.HOLD is selected when GPIO6 is high during reset.
EMIF.HOLD is asserted by an external host to request control of the address, data, and
control signals.
C15 I/O/Z
The C15 pin of the Parallel Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO35 or external memory interface control signal
EMIF.HOLDA. The function of the C15 pin is determined by the state of the GPIO6 pin
during reset. The C15 pin is set to PGPIO35 if GPIO6 is low during reset. The C15 pin is
set to EMIF.HOLDA if GPIO6 is high during reset. The function of the C15 pin will be set
once the device is taken out of reset (RESET pin transitions from a low to high state).
PGPIO35 I/O/Z C, D, F
,
G, H, M
Parallel general-purpose I/O. PGPIO35 is selected when GPIO6 is low during reset.
The PGPIO35 signal is configured as an input after reset.
EMIF.HOLDA O/Z
G, H, M
EMIF hold acknowledge. EMIF.HOLDA is selected when GPIO6 is high during reset.
The EMIF.HOLDA signal is in a high-impedance state during reset and is set to output
after reset with an output value of ‘1’.
EMIF.HOLDA is asserted by the DSP to indicate that the DSP is in the HOLD state and
that the EMIF address, data, and control signals are in a high-impedance state, allowing
the external memory interface to be accessed by other devices.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
{9 TEXAS INSTRUMENTS
Introduction
29
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
EMIF − Clock Pins
ECLKIN I C, L External EMIF input clock. ECLKIN is selected as the input clock to the EMIF when
EMIFCLKS is high.
ECLKOUT1 O/Z E, F, M
EMIF output clock. ECLKOUT1 outputs the EMIF input clock by default but can be held
low or set to a high-impedance state through the EMIF Global Control Register 1
(EGCR1).
The ECLKOUT1 pin is always in a high-impedance state during reset. The behavior of
ECLKOUT1 immediately after reset depends on the state of GPIO6 during reset and
EMIFCLKS:
GPIO6 EMIFCLKS ECLKOUT1 Behavior
0 0 Pin is in a high-impedance state.
0 1 Pin toggles at ECLKIN frequency.
1 0 Pin toggles at SYSCLK3 frequency.
1 1 Pin toggles at ECLKIN frequency.
ECLKOUT2 O/Z E, F
EMIF output clock. ECLKOUT2 can be enabled to output the EMIF input clock divided by
a factor 1, 2, or 4 through the EMIF Global Control Register 2 (EGCR2). ECLKOUT2 can
also be held low or set to a high-impedance state through the EGCR2 register.
The ECLKOUT2 pin toggles with a clock frequency equal to the EMIF input clock divided
by 4 during reset. The behavior of ECLKOUT2 immediately after reset depends on the
state of GPIO6 during reset and EMIFCLKS:
GPIO6 EMIFCLKS ECLKOUT2 Behavior
0 0 Pin is held low.
0 1 Pin toggles at one-fourth of the ECLKIN frequency.
1 0 Pin toggles at one-fourth of the SYSCLK3 frequency.
1 1 Pin toggles at one-fourth of the ECLKIN frequency.
EMIFCLKS I C, L EMIF input clock source select. The clock source for the EMIF is determined by the
state of the EMIFCLKS pin. The EMIF uses an internal clock (SYSCLK3) if EMIFCLKS is
low. ECLKIN is used as the clock source if EMIFCLKS is high.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
ng reset akgur n a: the H00 pm ‘5 delermmed by me state aHhe emoe pm dumg reset mgh dunngr Host add wmh mu‘txp‘exed addre *9 TEXAS INSTRUMENTS
Introduction
30 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Host Port − Data Bus
HD[7:0] I/O/Z
C, D, F
,
G, H
The HD[7:0] pins of the Host Port serve one of two functions: parallel general-purpose
input/output (PGPIO) signals PGPIO[43:36] or host-port interface (HPI) data bus signals
HPI.HD[7:0]. The function of the HD[7:0] pins is determined by the state of the GPIO6 pin
during reset. The HD[7:0] pins are set to PGPIO[43:36] if GPIO6 is low during reset. The
HD[7:0] pins are set to HPI.HD[7:0] if GPIO6 is high during reset. The function of the
HD[7:0] pins will be set once the device is taken out of reset (RESET pin transitions from a
low to high state).
The HD[7:0] bus includes bus holders to reduce the static power dissipation caused by
floating, unused pins. The bus holders also eliminate the need for external bias resistors
on unused pins. When the bus goes into a high-impedance state, the bus holders keep the
address bus at the logic level that was most recently driven. The bus holders are enabled
at reset and can be enabled/disabled through the External Bus Control Register (XBCR).
PGPIO[43:36] I/O/Z Parallel general-purpose I/O. PGPIO[43:36] is selected when GPIO6 is low during
reset. The PGPIO[43:36] signals are configured as inputs after reset.
HPI.HD[7:0] I/O/Z
Host data bus. HPI.HD[7:0] is selected when GPIO6 is high during reset. The
HPI.HD[7:0] signals are configured as inputs after reset.
The HPI will operate in multiplexed mode when GPIO6 is high during reset. In multiplexed
mode, an 8-bit data bus (HPI.HD[7:0]) carries both address and data. Each host cycle on
the bus consists of two consecutive 8-bit transfers.
Host Port − Control Pins
HC0 I/O/Z
C, F, G,
The HC0 pin of the Host Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO44 or host-port interface (HPI) signal HPI.HAS. The
function of the HC0 pin is determined by the state of the GPIO6 pin during reset. The HC0
pin is set to PGPIO44 if GPIO6 is low during reset. The HC0 pin is set to HPI.HAS if GPIO6
is high during reset. The function of the HC0 pin will be set once the device is taken out of
reset (RESET pin transitions from a low to high state).
PGPIO44 I/O/Z C, F, G
,
H, J Parallel general-purpose I/O. PGPIO44 is selected when GPIO6 is low during reset.
The PGPIO44 signal is configured as an input after reset.
HPI.HAS I
Host address strobe. HPI.HAS is selected when GPIO6 is high during reset. The
HPI.HAS signal is configured as an input after reset.
Hosts with multiplexed address and data pins may require HPI.HAS to latch the address in
the HPIA register. HPI.HAS is only available when the HPI is operating in multiplexed
mode.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
F,G H, mgh durmgr F, G. H. determine which HP‘ reglsmr Is bemg accessed by the host (HPIC. HPlD Wllh C, G, the HFL The HDS! and HDSZ pins are configured as mpuls afier reset. *9 TEXAS INSTRUMENTS
Introduction
31
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Host Port − Control Pins (Continued)
HC1 I/O/Z
F, G, H,
The HC1 pin of the Host Port serves one of two functions: parallel general-purpose
input/output (PGPIO) signal PGPIO45 or host-port interface (HPI) signal HPI.HBIL. The
function of the HC1 pin is determined by the state of the GPIO6 pin during reset. The HC1
pin is set to PGPIO45 if GPIO6 is low during reset. The HC1 pin is set to HPI.HBIL if GPIO6
is high during reset. The function of the HC1 pin will be set once the device is taken out of
reset (RESET pin transitions from a low to high state).
PGPIO45 I/O/Z
F, G, H,
KParallel general-purpose I/O. PGPIO45 is selected when GPIO6 is low during reset.
The PGPIO45 signal is configured as an input after reset.
HPI.HBIL I
Host byte identification. HPI.HBIL is selected when GPIO6 is high during reset. The
HPI.HBIL signal is configured as an input after reset.
In multiplexed mode, the host must use HPI.HBIL to identify the first and second bytes of
the host cycle.
HPI Pins
HCNTL0
I/O/Z
F, G, H,
HPI access control pins. The four binary states of the HCNTL0 and HCNTL1 pin
s
determine which HPI register is being accessed by the host (HPIC, HPID with
HCNTL1 I/O/Z
F, G, H,
J
determine which HPI register is being accessed by the host (HPIC, HPID with
autoincrementing, HPIA, or HPID). The HCNTL0 and HCNTL1 pins are configured a
s
inputs after reset.
HCS I/O/Z C, F, G,
H, J
HPI chip-select. HCS must be low for the HPI to be selected by the host. The HCS pin is
configured as an input after reset.
A host must not initiate transfer requests until the HPI has been brought out of reset,
see Section 3.7, Host-Port Interface (HPI), for more details.
HR/W I/O/Z F, G, H,
J
Host read- or write-select. HR/W indicates whether the current access is to be a read or
write operation. The HR/W pin is configured as an input after reset.
HDS1
I
C, G,
Host data strobe pins. The HDS1 and HDS2 pins are used for strobing data in and out o
f
the HPI. The HDS1 and HDS2 pins are configured as inputs after reset.
HDS2
I
C, G,
H, J
the HPI. The HDS1 and HDS2 pins are configured as inputs after reset.
A host must not initiate transfer requests until the HPI has been brought out of reset,
see Section 3.7, Host-Port Interface (HPI), for more details.
HRDY O/Z F, J, M
Host ready (from DSP to host). The HRDY pin informs the host when the HPI is ready for
the next transfer. The HRDY pin is in a high-impedance state during reset and is set to
output after reset with an output value of 1.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
{'5 TEXAS INSTRUMENTS
Introduction
32 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
HPI Pins (Continued)
HINT O/Z F, G, H,
J, M
Host interrupt (from DSP to host). The HINT pin is used by the DSP to interrupt the host.
The HINT signal is in a high-impedance state during reset and is set to output after reset
with an output value of 1.
HPIENA I C, L
HPI enable. The HPIENA pin must be dreiven high to enable the HPI for operation. If the
HPIENA pin is low, the HPI will be completely disabled and all HPI output pins will be in a
high-impedance state.
If the HPI is not needed, the HPIENA pin can be pulled low.
Interrupt and Reset Pins
INT[3:0] I C, L
Maskable external interrupts. INT0−INT3 are maskable interrupts.They are enabled
through the Interrupt Enable Registers (IER0 and IER1). All maskable interrupts are
globally enabled/disabled through the Interrupt Mode bit (INTM in ST1_55). INT0−INT3
can be polled and reset via the Interrupt Flag Registers (IFR0 and IFR1). All interrupts are
prioritized as shown in Table 3−75, Interrupt Table.
NMI/WDTOUT I/O/Z C, F, J,
M
Non-maskable external interrupt or Watchdog Timer output. The function of this pin is
controlled by the Timer Signal Selection Register (TSSR). By default, the NMI/WDTOUT
pin has the function of the NMI signal.
NMI is an external interrupt that cannot be masked by the Interrupt Enable Registers
(IER0 and IER1). When NMI is activated, the interrupt is always performed.
WDTOUT serves as an input and output pin for the Watchdog Timer.
IACK O/Z F, M
Interrupt acknowledge. IACK indicates the receipt of an interrupt and that the program
counter is fetching the interrupt vector location designated on the address bus. The IACK
pin is set to a value of ‘1’ during reset.
RESET I C, L
Device reset. RESET causes the digital signal processor (DSP) to terminate current
program execution. When RESET is brought to a high level, program execution begins by
fetching the reset interrupt service vector at the reset vector address FFFF00h
(IVPD:FFFFh). RESET affects various registers and status bits.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
5501 w be configured m EMIFJHPI mode when me GPIOG pm ‘5 mgh dunng reset. The *9 TEXAS INSTRUMENTS
Introduction
33
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
General-Purpose I/O Pins
GPIO7
GPIO6
GPIO5
GPIO4
GPIO3
GPIO2/BOOTM2
GPIO1/BOOTM1
GPIO0/BOOTM0
I/O/Z F, G, H,
M
General-purpose configurable inputs/outputs. GPIO[7:0] can be individually
configured as inputs or outputs via the GPIO Direction Register (IODIR). Data can be read
from inputs or written to outputs via the GPIO Data Register (IODATA). The GPIO pins are
configured as inputs after reset.
NOTE: the GPIO7 pin must be low during the rising edge of the reset signal for the device
to operate properly.
Boot mode selection signals. GPIO[2:0]/BOOTM[2:0] are sampled following reset to
configure the boot mode for the DSP. After the boot is completed, these pins can be used
as general-purpose inputs/outputs.
The GPIO4 pin is also used as an output for handshaking purposes on some of the boot
modes. Although this pin is not involved in boot mode selection, users should be aware
that this pin will become active as an output during the boot-load process and should
design accordingly. After the boot-load process is complete, the loaded application may
change the function of the GPIO4 pin.
Input clock source selection. The CLKMD0 bit of the Clock Mode Control Register
(CLKMD) determines which clock, either OSCOUT or X2/CLKIN, is used as an input clock
source to the DSP. If GPIO4 is low at reset, the CLKMD0 bit of the Clock Mode Control
Register (CLKMD) will be set to ‘0’ and the internal oscillator and the external crystal will
generate an input clock (OSCOUT) for the DSP. If GPIO4 is high, the CLKMD0 bit will be
set to ‘1’ and the input clock will be taken directly from the X2/CLKIN pin.
An external crystal must be attached to the X1 and X2/CLKIN pins when the internal
oscillator is used to generate a clock to the DSP. Otherwise, when the oscillator is not
used to generate the input clock for the DSP, an externally generated 3.3-V clock must be
applied to the X2/CLKIN pin and the X1 pin must be left unconnected.
Function selection for multiplexed pins. The GPIO6 pin is used to select the function of
the multiplexed signals in the Parallel Port and the Host Port. The 5501 will be configured
in PGPIO mode (EMIF and HPI are disabled) when the GPIO6 pin is low during reset. The
5501 will be configured in EMIF/HPI mode when the GPIO6 pin is high during reset. The
function of the multiplexed signals will be set once the device is taken out of reset (RESET
pin transitions from a low to high state).
XF O/Z F
External output (latched software-programmable signal). XF is set high by the BSET XF
instruction, set low by BCLR XF instruction, or by loading ST1. XF is used for signaling
other processors in multiprocessor configurations or used as a general-purpose output
pin. The XF pin is set to a value of ‘1’ during reset.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
{'5 TEXAS INSTRUMENTS
Introduction
34 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Oscillator/Clock Pins
CLKOUT O/Z F
Clock output. CLKOUT can be set to reflect the clock of the Fast Peripherals Clock
Group, Slow Peripherals Clock Group, and the External Memory Interface Clock Group.
The CLKOUT pin is set to the internal clock SYSCLK1 during and after reset. SYSCLK1 is
set equal to a divided-by-four CLKIN or OSCOUT (depending on the state of the GPIO4
pin) during and after reset. SYSCLK1 is used to clock the Fast Peripheral Clock Group.
X2/CLKIN I Clock/oscillator input. If the internal oscillator is not being used, X2/CLKIN functions as
the clock input.
X1 O Output pin from the internal oscillator for the crystal. If the internal oscillator is not
used, X1 should be left unconnected.
Multichannel Buffered Serial Port Pins
CLKR0 I/O/Z C, F, G,
H, M Receive clock input of McBSP0. The CLKR0 pin is configured as input after reset.
DR0 I L, G Serial data receive input of McBSP0
FSR0 I/O/Z F, G, H,
M
Frame synchronization pulse for receive input of McBSP0. The FSR0 pin is
configured as input after reset.
CLKX0 I/O/Z C, F, G,
H, M Transmit clock of McBSP0. The CLKX0 pin is configured as input after reset.
DX0 O/Z F, H, M Serial data transmit output of McBSP0. The DX0 pin is in a high-impedance state
during and after reset.
FSX0 I/O/Z F, G, H,
M
Frame synchronization pulse for transmit output of McBSP0. The FSX0 pin is
configured as input after reset.
CLKR1 I/O/Z C, G,
H, M Receive clock input of McBSP1. The CLKR1 pin is configured as input after reset.
DR1 I L, G Serial data receive input of McBSP1
FSR1 I/O/Z F, G, H,
M
Frame synchronization pulse for receive input of McBSP1. The FSR1 pin is
configured as input after reset.
DX1 O/Z F, H, M Serial data transmit output of McBSP1. The DX1 pin is in a high-impedance state
during and after reset.
CLKX1 I/O/Z C, F, G,
H, M Transmit clock of McBSP1. The CLKX1 pin is configured as input after reset.
FSX1 I/O/Z F, G, H,
M
Frame synchronization pulse for transmit output of McBSP1. The FSX1 pin is
configured as input after reset.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
Digital Power, + Vnu Digital Power, + Vnu Digital Power, + Vnu {9 TEXAS INSTRUMENTS
Introduction
35
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
UART Pins
TX O UART transmit data output. The UART.TX signal outputs a value of 1 during and after
reset.
RX I UART receive data input
I2C Pins
SCL I/O/Z C, F, M I2C clock bidirectional port. (Open collector I/O)
SDA I/O/Z C, F, M I2C data bidirectional port. (Open collector I/O)
Timer Pins
TIM0 I/O/Z F, G, H,
M
Input/Output pin for Timer 0. The TIM0 pin can be configured as an output or an input
via the Timer Signal Selection Register (TSSR).When configured as an output, the TIM0
pin can signal a pulse or a change of state when the Timer 0 count matches its period.
When configured as an input, the TIM0 pin can be used to provide the clock source for
Timer 0 (external clock source mode) or it can be used to start/stop the timer from
counting (clock gating mode). This pin can also be used as general-purpose I/O. The
TIM0 pin is configured as an input after reset.
TIM1 I/O/Z F, G, H,
M
Input/Output pin for Timer 1. The TIM1 pin can be configured as an output or an input
via the Timer Signal Selection Register (TSSR).When configured as an output, the TIM1
pin can signal a pulse or a change of state when the Timer 1 count matches its period.
When configured as an input, the TIM1 pin can be used to provide the clock source for
Timer 1 (external clock source mode) or it can be used to start/stop the timer from
counting (clock gating mode). This pin can also be used as general-purpose I/O. The
TIM1 pin is configured as an input after reset.
Supply Pins
VSS SDigital Ground. Dedicated ground for the device.
CVDD SDigital Power, + VDD. Dedicated power supply for the core CPU.
PVDD SDigital Power, + VDD. Dedicated power supply for the PLL module.
NC No Connect
DVDD SDigital Power, + VDD. Dedicated power supply for the I/O pins.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
{'5 TEXAS INSTRUMENTS
Introduction
36 December 2002 − Revised November 2008SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Test Pins
TCK I C, J
IEEE standard 1149.1 test clock. TCK is normally a free-running clock signal with a 50%
duty cycle. The changes on test access port (TAP) of input signals TMS and TDI are
clocked into the TAP controller, instruction register, or selected test data register on the
rising edge of TCK. Changes at the TAP output signal (TDO) occur on the falling edge of
TCK. Refer to Section 3.17, Notice Concerning TCK, for important information regarding
this pin.
TDI I J IEEE standard 1149.1 test data input. Pin with internal pullup device. TDI is clocked into
the selected register (instruction or data) on a rising edge of TCK.
TDO O/Z
IEEE standard 1149.1 test data output. The contents of the selected register (instruction
or data) are shifted out of TDO on the falling edge of TCK. TDO is in the high-impedance
state except when the scanning of data is in progress.
TMS I J IEEE standard 1149.1 test mode select. Pin with internal pullup device. This serial
control input is clocked into the TAP controller on the rising edge of TCK.
TRST I C, L, K
IEEE standard 1149.1 test reset. TRST, when high, gives the IEEE standard 1149.1
scan system control of the operations of the device. If TRST is not connected or driven
low, the device operates in its functional mode, and the IEEE standard 1149.1 signals are
ignored. Pin has an internal pulldown device.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
{9 TEXAS INSTRUMENTS
Introduction
37
December 2002 − Revised November 2008 SPRS206K
Table 2−4. Signal Descriptions (Continued)
Pin
Name FunctionOther
Pin
Type
Multiplexed
Signal Name
Test Pins (Continued)
EMU0 I/O/Z J
Emulator 0 pin. When TRST is driven low, EMU0 must be high for activation of the OFF
condition. When TRST is driven high, EMU0 is used as an interrupt to or from the emulator
system and is defined as I/O by way of the IEEE standard 1149.1 scan system.
The EMU0 and EMU1/OFF pins must be pulled up when an emulator is not connected.
Internal pullups have been included for this purpose. If the user chooses to disable these
pins through the XBCR, external pullup resistors must be added to these two pins.
EMU1/OFF I/O/Z J
Emulator 1 pin/disable all outputs. When TRST is driven high, EMU1/OFF is used as
an interrupt to or from the emulator system and is defined as I/O by way of IEEE standard
1149.1 scan system. When TRST is driven low, EMU1/OFF is configured as OFF. The
EMU1/OFF signal, when active (low), puts all output drivers into the high-impedance
state. Note that OFF is used exclusively for testing and emulation purposes (not for
multiprocessing applications). Therefore, for the OFF condition, the following apply:
TRST = low,
EMU0 = high,
EMU1/OFF = low
The EMU0 and EMU1/OFF pins must be pulled up when an emulator is not connected.
Internal pullups have been included for this purpose. If the user chooses to disable these
pins through the XBCR, external pullup resistors must be added to these two pins.
I = Input, O = Output, S = Supply, Z = High impedance
Other Pin Characteristics:
A Internal pullup [always enabled]
B Internal pulldown [always enabled]
C Hysteresis input
D Pin has bus holder, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
E Pin is high impedance in HOLD mode (due to HOLD pin). The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2)
determine the state of the ECLKOUTx signals during HOLD mode. If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode.
If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode.
F Pin is high impedance in OFF mode (TRST = 0, EMU0 = 1, and EMU1/OFF = 0).
G Pin can be configured as a general-purpose input.
H PIn can be configured as a general-purpose output.
J Pin has an internal pullup, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
K Pin has an internal pulldown, it can be enabled/disabled through the External Bus Control Register (XBCR) [enabled by default].
L Fail-safe pin
M Pin is in high-impedance during reset (RESET pin is low)
The following function SPRSZUEK {'1’ TEXAS INSTRUMENTS
Functional Overview
38 December 2002 − Revised November 2008SPRS206K
3 Functional Overview
The following functional overview is based on the block diagram in Figure 3−1.
General-Purpose
I/O
GPIO[7:0]
CLKX
X1
TCK
TMS
TDI
TDO
TRST
EMU0
EMU1/OFF
C55x CPU
XPORT
Peripheral
Controller
WDTimer
Interrupt
Control
NMI
Muxing
Logic
NMI/WDTOUT
INT3
RESET INT3
RESET
INT[2:0]INT[2:0] SCL SDA
FSX
CLKR
DX
FSR
DR
EMIF
DARAM0
DARAM1
PERI
HDS2
HRDY
HPIENA
HCNTL1
HR/W
HCNTL0
HINT
Host-Port
Interface (HPI)
Parallel
General-
Purpose I/O HC1
HD[7:0]
HC0
ECLKOUT2
External
Memory
Interface
(EMIF)
ECLKIN
ECLKOUT1
EMIFCLKS
A[21:2]
D[31:0]
C[15:0]
PGPIO[45:36]
PGPIO[35:0]
HD[7:0]
HAS
HBIL
C[15:0]
D[31:0]
A[21:2]
Parallel
Port MUX
Host Port
MUX
TIM
X2/CLKIN
Data Read Address Bus B [BAB] (24)
Data Read Bus B [BB] (16)
Program Data Bus [PB] (32)
Data Read Address Bus C [CAB] (24)
Data Read Bus C [CB] (16)
Data Read Address Bus D [DAB] (24)
Data Read Bus D [DB] (16)
Data Write Address Bus E [EAB] (24)
Data Write Bus E [EB] (16)
Data Write Address Bus F [FAB] (24)
Data Write Bus F [FB] (16)
Data
Computation
Unit (DU)
Address Data Flow
Unit (AU)
Instruction Buffer
Unit (IU) Program Flow
Unit (PU)
Emulation Control
DPORT
IPORT
Internal Memory
Interface
MPORT
DMA
Controller Timer 3
(DSP/BIOS Timer)
UART
RX
ROMDARAM Instruction
Cache
Timer
I2C
Clock Generator
Power
Management
McBSP
HCS
HDS1
CLKOUT
Program Address Bus [PAB] (24)
TX
Figure 3−1. TMS320VC5501 Functional Block Diagram
{9 TEXAS INSTRUMENTS
Functional Overview
39
December 2002 − Revised November 2008 SPRS206K
3.1 Memory
The 5501 supports a unified memory map (program and data accesses are made to the same physical space).
The total on-chip memory is 32K words (16K 16-bit words of RAM and 16K 16-bit words of ROM).
3.1.1 On-Chip ROM
TMS320VC5501 incorporates 16K x16-bit of on-chip, one-wait-state maskable ROM that can be mapped into
program memory space. The on-chip ROM is located at the byte address range FF8000h−FFFFFFh when
MPNMC = 0 at reset. When MPNMC = 1 at reset, the on-chip ROM is disabled and not present in the memory
map, and byte address range FF8000h−FFFFFFh is directed to external memory space. MPNMC is a bit
located in the ST3 status register, and its status is determined by the logic level on the BOOTM[2:0] pins when
sampled at reset. If BOOTM[2:0] are set to 00h at reset, the MPNMC bit is set to 1 and the on-chip ROM is
disabled; otherwise, the MPNMC bit is cleared to 0 and the on-chip ROM is enabled. These pins are not
sampled again until the next hardware reset. The software reset instruction does not affect the MPNMC bit.
Software can be used to set or clear the MPNMC bit.
The ROM can be accessed by the program bus (P) and the two read data buses (C and D). The on-chip ROM
is a two-cycle-per-word memory access, except for the first word access, which requires four cycles.
The standard on-chip ROM contains a bootloader which provides a variety of methods to load application code
automatically after power up or a hardware reset. For more information, see Section 3.1.5, Boot Configuration.
A vector table associated with the bootloader is also contained in the ROM. A boot mode branch table is
included in the ROM which contains hard-coded jumps to the beginning of each boot mode code section in
the bootloader.
A sine look-up table is provided containing 256 values (crossing 360 degrees) expressed in Q15 format.
The standard on-chip ROM layout is shown in Table 3−1.
Table 3−1. On-Chip ROM Layout
STARTING BYTE ADDRESS CONTENTS
FF_8000h Bootloader Program
FF_ECAEh Bootloader Revision Number
FF_ECB0h Boot Mode Branch Table
FF_ED00h Sine Table
FF_EF00h Reserved
FF_FF00h Interrupt Vector Table
ruction each Reference Guide (literature number SPRUGSO) *9 TEXAS INSTRUMENTS
Functional Overview
40 December 2002 − Revised November 2008SPRS206K
3.1.2 On-Chip Dual-Access RAM (DARAM)
TMS320VC5501 features 16K x 16-bit (32K bytes) of on-chip dual-access RAM. This memory enhances
system performance, since the C55x CPU can access a DARAM block twice per machine cycle. The DARAM
is composed of 4 blocks of 4K x 16-bit each (see Table 3−2). Each block in the DARAM can support two reads
in one cycle, a read and a write in one cycle, or two writes in one cycle. The dual-access RAM is located in
the (byte) address range 000000h−007FFFh, it can be accessed by the program, data and DMA buses. The
HPI has NO access to the DARAM block when device is in reset.
Table 3−2. DARAM Blocks
BYTE ADDRESS RANGE MEMORY BLOCK
000000h − 001FFFh DARAM 0
002000h − 003FFFh DARAM 1
004000h − 005FFFh DARAM 2
006000h − 007FFFh DARAM 3
First 192 bytes are reserved for Memory-Mapped Registers (MMRs).
3.1.3 Instruction Cache
On the TMS320VC5501, instructions may reside in internal memory or external memory. When instructions
reside in external memory, the I-Cache can improve the overall system performance by buffering the most
recent instructions accessed by the CPU.
The 5501 includes a 16K-byte instruction cache, which consists of a single 2-way cache block. The 2-way
cache uses 2-way associative mapping and holds up to 16K bytes: 512 sets, two lines per set, four 32-bit
words per line. In the 2-way cache, each line is identified by a unique tag. The 2-way cache is updated based
on a least-recently-used algorithm.
Control bits in the CPU status register ST3_55 provide the ability to enable, freeze, and flush the cache.
For more information on the instruction cache, see the TMS320VC5501/5502 DSP Instruction Cache
Reference Guide (literature number SPRU630).
SPRUGZU {9 TEXAS INSTRUMENTS
Functional Overview
41
December 2002 − Revised November 2008 SPRS206K
3.1.4 Memory Map
000000h DARAM0
(8K Bytes)
004000h
008000h
(4M minus 64K Bytes†§)
010000h
DARAM1
(8K Bytes)
DARAM2
(8K Bytes)
DARAM3
(8K Bytes)
External CE0 Space
(4M Bytes§)
External CE1 Space
(4M Bytes§)
External CE2 Space
(4M Bytes Minus 32K Bytes‡§)
External CE3 Space
ROM
(32K Bytes)
FF8000h
C00000h
800000h
400000h
000000h
004000h
008000h
010000h
(4M Bytes§)
External CE1 Space
(4M Bytes§)
External CE2 Space
(4M Bytes§)
External CE3 Space
C00000h
800000h
400000h
MPNMC = 0 MPNMC = 1
(4M minus 64K Bytes†§)
External CE0 Space
Reserved
002000h
006000h
DARAM0
(8K Bytes)
DARAM1
(8K Bytes)
DARAM2
(8K Bytes)
DARAM3
(8K Bytes)
Reserved
002000h
006000h
The lower 64K bytes in CE0 Space include 32K bytes of DARAM space and 32K bytes of reserved space.
The 32K bytes are for on-chip ROM block.
§The CE space size shown in the figure represents the maximum addressable memory space for a 32-bit EMIF configuration. The maximum
addressable memory space per CE is reduced when 16- or 8-bit EMIF configurations are used for asynchronous and SBSRAM memory types.
For more detailed information, refer to TMS320VC5501/5502 DSP External Memory Inteface (EMIF) Reference Guide (literature number
SPRU621).
Byte Address Byte Address
Figure 3−2. TMS320VC5501 Memory Map
{'5 TEXAS INSTRUMENTS
Functional Overview
42 December 2002 − Revised November 2008SPRS206K
3.1.5 Boot Configuration
The on-chip bootloader provides a way to transfer application code and tables from an external source to the
on-chip RAM at power up. The 5501 provides several options to download the code to accommodate varying
system requirements. These options include:
Host-port interface (HPI) boot in multiplexed mode
External memory boot (via EMIF) from 16-bit asynchronous memory
Serial port boot (from McBSP0) with 16-bit element length
SPI EPROM boot (from McBSP0) supporting EPROMs with 24-bit addresses
I2C EPROM boot (from I2C) supporting EPROMs larger than 512K bits
UART boot
Direct execution (no boot) from 16-bit or 32-bit external asynchronous memory
The external pins BOOTM2, BOOTM1, and BOOTM0 select the boot configuration. The values of
BOOTM[2:0] are latched with the rising edge of the RESET input. BOOTM2 is shared with GPIO2, BOOTM1
is shared with GPIO1, and BOOTM0 is shared with GPIO0.
The boot configurations available are summarized in Table 3−3.
Table 3−3. Boot Configuration Selection Via the BOOTM[2:0] Pins
BOOTM[2:0] BOOT PROCESS
000 Direct execution from 16-bit external asynchronous memory
001 SPI EPROM boot
010 Serial port boot (from McBSP0)
011 External memory boot (via EMIF) from 16-bit asynchronous memory
100 Direct execution from 32-bit external asynchronous memory
101 HPI boot
110 I2C EPROM boot
111 UART boot
3.2 Peripherals
The 5501 includes the following on-chip peripherals:
An external memory interface (EMIF) supporting a 32-bit interface to asynchronous memory, SDRAM,
and SBSRAM
An 8-bit host-port interface (HPI)
A six-channel direct memory access (DMA) controller
Two multichannel buffered serial ports (McBSPs)
A programmable analog phase-locked loop (APLL) clock generator
General-purpose I/O (GPIO) pins and a dedicated output pin (XF)
The 5501 can be configured as follows:
EMIF/HPI mode: 32-bit external memory interface with 8-bit host-port interface
PGPIO mode: PGPIO support with no external memory interface and no host-port interface
TMS320V05501/5502 DSP Instruction Cache Relerence Guide (literature number SPRUSSO) (literature number SPRU618) (literature number SPRU146) (literature number SPRU620) (literature number SPRU613) Reference Guide (literature number SPRU592) (literature number SPRU621) (literature number SPRU597) *9 TEXAS INSTRUMENTS
Functional Overview
43
December 2002 − Revised November 2008 SPRS206K
Four timers
Two 64-bit general-purpose timers
A programmable watchdog timer
A DSP/BIOS timer
An Inter-integrated Circuit (I2C) multi-master and slave interface
A Universal Asynchronous Receiver/Transmitter (UART)
For detailed information on the C55x DSP peripherals, see the following documents:
TMS320VC5501/5502 DSP Instruction Cache Reference Guide (literature number SPRU630)
TMS320VC5501/5502 DSP Timers Reference Guide (literature number SPRU618)
TMS320VC5501/5502/5503/5507/5509 DSP Inter-Integrated Circuit (I2C) Module Reference Guide
(literature number SPRU146)
TMS320VC5501/5502 DSP Host Port Interface (HPI) Reference Guide (literature number SPRU620)
TMS320VC5501/5502 DSP Direct Memory Access (DMA) Controller Reference Guide
(literature number SPRU613)
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP)
Reference Guide (literature number SPRU592)
TMS320VC5501/5502 DSP External Memory Interface (EMIF) Reference Guide
(literature number SPRU621)
TMS320VC5501/5502 DSP Universal Asynchronous Receiver/Transmitter (UART) Reference Guide
(literature number SPRU597)
3.3 Configurable External Ports and Signals
A number of pins on the 5501 have two functions, a feature that allows system designers to choose an
appropriate media interface for his/her application without the need for a large pin-count package. Two muxes
are included in the 5501 to control the configuration of these dual-function pins: the Parallel Port Mux and the
Host Port Mux. The state of these muxes is set at reset based on the state of the GPIO6 pin. The External
Bus Selection Register (XBSR) reflects the configuration of these muxes after the 5501 comes out of reset.
3.3.1 Parallel Port Mux
The Parallel Port Mux of the 5501 controls the function of 20 address signals (pins A[21:2]), 32 data signals
(pins D[31:0]), and 16 control signals (pins C0 through C15). The Parallel Port Mux supports two different
modes:
Full EMIF mode: The EMIF is enabled and its 20 address, 32 data, and 16 control signals are routed to
their corresponding pins on the Parallel Port Mux.
Parallel general-purpose I/O mode: The EMIF and HPI are disabled and 16 control, 4 address, and
16 data pins of the Parallel Port Mux are set to parallel general-purpose I/O (PGPIO).
The mode of the Parallel Port Mux is determined by the state of the GPIO6 pin at reset. If GPIO6 is low, the
EMIF and the HPI will be disabled: pins A[17:2] and pins D[15:0] will become reserved pins. All other pins in
the Parallel Port Mux are set to parallel general-purpose I/O. The Parallel/Host Port Mux Mode bit field in the
External Bus Selection Register (XBSR) will also be set to 0 to reflect the PGPIO mode of the Parallel Port
Mux.
If GPIO6 is high at reset, the HPI will be enabled in multiplexed mode and the EMIF will be fully enabled: pins
A[21:2] are set to EMIF.A[21:2], pins D[31:0] are set to EMIF.D[31:0], and pins C[15:0] are set to their
corresponding EMIF operation. The Parallel/Host Port Mux Mode bit field in the XBSR will be set to 1 to reflect
the full EMIF mode of the Parallel Port Mux. Note that in multiplexed mode, the HPI will use the HD[7:0] pins
to strobe in address and data information (see Section 3.7, Host-Port Interface (HPI), for more information on
the operation of the HPI in multiplexed mode).
{'5 TEXAS INSTRUMENTS
Functional Overview
44 December 2002 − Revised November 2008SPRS206K
Table 3−4 lists the individual routing of the EMIF and PGPIO signals to the external parallel address, data, and
control buses.
Table 3−4. TMS320VC5501 Routing of Parallel Port Mux Signals
PIN PARALLEL/HOST PORT MUX MODE = 0
(PGPIO) PARALLEL/HOST PORT MUX MODE = 1
(FULL EMIF)
Address Bus
A[17:2] Reserved EMIF.A[17:2]
A[21:18] PGPIO[3:0] EMIF.A[21:18]
Data Bus
D[31:16] PGPIO[19:4] EMIF.D[31:16]
D[15:0] Reserved EMIF.D[15:0]
Control Bus
C0 PGPIO20 EMIF.ARE/SADS/SDCAS/SRE
C1 PGPIO21 EMIF.AOE/SOE/SDRAS
C2 PGPIO22 EMIF.AWE/SWE/SDWE
C3 PGPIO23 EMIF.ARDY
C4 PGPIO24 EMIF.CE0
C5 PGPIO25 EMIF.CE1
C6 PGPIO26 EMIF.CE2
C7 PGPIO27 EMIF.CE3
C8 PGPIO28 EMIF.BE0
C9 PGPIO29 EMIF.BE1
C10 PGPIO30 EMIF.BE2
C11 PGPIO31 EMIF.BE3
C12 PGPIO32 EMIF.SDCKE
C13 PGPIO33 EMIF.SOE3
C14 PGPIO34 EMIF.HOLD
C15 PGPIO35 EMIF.HOLDA
{9 TEXAS INSTRUMENTS
Functional Overview
45
December 2002 − Revised November 2008 SPRS206K
3.3.2 Host Port Mux
The 5501 Host Port Mux controls the function of 8 data signals (pins HD[7:0]) and 2 control signals (pins HC0
and HC1). The Host Port Mux supports two different modes:
8-bit multiplexed mode: The HPI’s 8 data and 2 control signals are routed to their corresponding pins
on the Host Port Mux.
Parallel general-purpose I/O mode: All pins on the Host Port Mux are routed to PGPIO. The HPI and
EMIF are disabled.
The mode of the Host Port Mux is determined by the state of the GPIO6 pin at reset. If GPIO6 is low, the pins
of the Host Port Mux will be set to PGPIO. In this mode, the EMIF and the HPI will be disabled. The
Parallel/Host Port Mux Mode bit of the External Bus Control Register will be set to 0 to reflect the PGPIO mode
of the Host Port Mux.
If GPIO6 is high, the HPI will be enabled in 8-bit (multiplexed) mode: pins HD[7:0] are set to HPI.HD[7:0], and
HC0 and HC1 are set to HPI.HAS and HPI.HBIL, respectively. The Parallel/Host Port Mux Mode bit field in
the XBSR will be set to 1 to reflect the HPI multiplexed mode of the Host Port Mux. See Section 3.7, Host-Port
Interface (HPI), for more information on the operation of the HPI in multiplexed mode.
Table 3−5 lists the individual routing of the HPI and PGPIO signals to the Host Port Mux pins.
Table 3−5. TMS320VC5501 Routing of Host Port Mux Signals
PIN PARALLEL/HOST PORT MUX MODE = 0
(PGPIO) PARALLEL/HOST PORT MUX MODE = 1
(8-BIT HPI MULTIPLEXED)
Data Bus
HD[7:0] PGPIO[43:36] HPI.HD[7:0]
Control Bus
HC0 PGPIO44 HPI.HAS
HC1 PGPIO45 HPI.HBIL
{'5 TEXAS INSTRUMENTS
Functional Overview
46 December 2002 − Revised November 2008SPRS206K
3.3.3 External Bus Selection Register (XBSR)
The External Bus Selection Register controls the mode of the Parallel Port Mux and Host Port Mux. The
Parallel Port Mux can be configured to support the 32-bit EMIF or to support parallel general-purpose I/O. The
Host Port Mux can be configured to support the HPI in 8-bit (multiplexed) mode or parallel general-purpose
I/O (PGPIO).
The XBSR configures the Parallel Port Mux and the Host Port Mux at reset based on the state of the GPIO6
pin at reset. When GPIO6 is high at reset, the Parallel Port Mux will be configured to support the 32-bit EMIF
and the Host Port Mux will be configured to support the HPI in 8-bit (multiplexed) mode. When GPIO6 is low
at reset, both the Parallel Port Mux and the Host Port Mux will be configured to support parallel
general-purpose I/O; the EMIF and HPI will be disabled in this mode. The Paralle/Host Port Mux Mode bit of
the XBSR will reflect the mode selected for the Parallel and Host Port Muxes.
The clock to the EMIF module is disabled automatically when this module is not selected through the External
Bus Selection Register. Note that any accesses to disabled modules will result in a bus error if the PERITOEN
bit of the Time-Out Control Register is set to 1.
15 8
Reserved
R, 00000000
7 43210
Reserved Reserved
(see NOTE) Reserved
(see NOTE) Reserved Parallel /Host
Port Mux
Mode
R, 0000 R/W, 0 R/W, 0 R, 0 R/W, GPIO6
LEGEND: R = Read, W = Write, n = value at reset
NOTE: This reserved bit must be kept as zero during any writes to XBSR.
Figure 3−3. External Bus Selection Register Layout (0x6C00)
Modifying the XBSR to change the mode of the Parallel Port Mux and Host Port Mux after the 5501 has been brought out of reset is not
supported.
{9 TEXAS INSTRUMENTS
Functional Overview
47
December 2002 − Revised November 2008 SPRS206K
Table 3−6. External Bus Selection Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−4 R 000000000000 Reserved
Reserved 3 R/W 0 Reserved. This reserved bit must be kept as zero during any writes
to XBSR.
Reserved 2 R/W 0 Reserved. This reserved bit must be kept as zero during any writes
to XBSR.
Reserved 1 R 0 Reserved
Parallel/Host Port
Mux Mode 0 R/W GPIO6 Parllel/Host Port Mux Mode bit. Determines the mode of the Parallel
Port Mux and the Host Port Mux.
Parallel/Host Port Mux Mode = 0:
The Parallel Port Mux is configured to support PGPIO. In this
mode, the HPI and EMIF cannot be used.
The Host Port Mux is configured to support PGPIO. In this mode,
the Host Port Mux pins will be routed to PGPIO.
Parallel/Host Port Mux Mode = 1:
The Parallel Port Mux is configured to support the 32-bit EMIF. In
this mode, the EMIF is enabled and its 20 address, 32 data, and
16 control signals are routed to their corresponding pins on the
Parallel Port Mux.
The Host Port Mux is configured to support the HPI in 8-bit
(multiplexed) mode. In this mode, the HPI is enabled and its eight
data/address and two control signals are routed to their
corresponding pins on the Host Port Mux.
{'5 TEXAS INSTRUMENTS
Functional Overview
48 December 2002 − Revised November 2008SPRS206K
3.3.4 Configuration Examples
Figure 3−4 and Figure 3−5 illustrate example configurations for the 5501 based on the state of GPIO6 at reset.
Shading denotes a peripheral module not available for this configuration.
Clock
Generator
PGPIO
HPI
TIMER0
TIMER1
McBSP0
WD Timer
TIMER3
(DSP/BIOS
Timer)
GPIO
McBSP1
UART
I2C
EMIF
CLKOUT, X1
X2/CLKIN
TIM0
TIM1
XF
SCL, SDA
32 D[31:0]
ARDY, HOLD, ECLKIN, EMIFCLKS
A[21:2], ECLKOUT1, ECLKOUT2
,
ARE/SADS/SDCAS/SRE,
AOE/SOE/SDRAS,
AWE/SWE/SDWE, CE[3:0],
BE[3:0], SDCKE, SOE3, HOLDA
HD[7:0], HCNTL0, HCNTL1, HCS,
HR/W
HAS, HBIL, HDS1, HDS2, HPIENA
HINT, HRDY
CLKR0, FSR0, CLKX0, FSX0
DR0
DX0
CLKR1, FSR1, CLKX1, FSX1
DR1
DX1
Interrupt
Control
The NMI/WDTOUT pin has NMI function by default, but can be set to WDTOUT through the TSSR.
GPIO[7:0] 8
NMI/WDTOUT
INT[3:0], RESET
IACK
RX
TX
Figure 3−4. Configuration Example A
(GPIO6 = 1 at Reset)
{9 TEXAS INSTRUMENTS
Functional Overview
49
December 2002 − Revised November 2008 SPRS206K
Clock
Generator
PGPIO
HPI
TIMER0
TIMER1
McBSP0
WD Timer
TIMER3
(DSP/BIOS
Timer)
GPIO
McBSP1
UART
I2C
EMIF
CLKOUT, X1
X2/CLKIN
TIM0
TIM1
XF
GPIO[7:0]
SCL, SDA
46 PGPIO[45:0]
CLKR0, FSR0, CLKX0, FSX0
DR0
DX0
CLKR1, FSR1, CLKX1, FSX1
DR1
DX1
RX
TX
8
Shading denotes a peripheral module not available for this configuration.
The NMI/WDTOUT pin has NMI function by default, but can be set to WDTOUT through the TSSR.
Interrupt
Control
NMI/WDTOUT
INT[3:0], RESET
IACK
Figure 3−5. Configuration Example B
(GPIO6 = 0 at Reset)
tion on the (literature number SPRU618) *9 TEXAS INSTRUMENTS
Functional Overview
50 December 2002 − Revised November 2008SPRS206K
3.4 Timers
The 5501 has four 64-bit timers: Timer 0, Timer 1, Watchdog Timer (WDT), and Timer 3. The first two timers,
Timer 0 and Timer 1, are mainly used as general-purpose timers. The third timer, the Watchdog Timer, can
be used as either a general-purpose timer or a watchdog timer. The fourth timer is reserved as a DSP/BIOS
counter; users have no access to this timer.
Each timer has one input, one output, and one interrupt signal: TIN, TOUT, and TINT, respectively. Timer 0,
Timer 1, and the Watchdog Timer are each assigned a pin: TIM0 pin is assigned to Timer 0, TIM1 is assigned
to Timer 1, and NMI/WDTOUT is used by the Watchdog Timer. The input (TIN) or output (TOUT) signal of
Timer 0, Timer 1, and the Watchdog Timer can be connected to their respective pins via the Timer Signal
Selection Register (TSSR).
The DSP/BIOS timer input, output, and interrupt signals are not internally connected. No interrupts are needed
from this timer; therefore, the timer interrupt signal is not internally connected to the CPU interrupt logic.
The interrupt signal (TINT) of the Watchdog Timer can be internally connected to the NMI, RESET, and INT3
signals via the TSSR.
Note that the NMI/WDTOUT pin has a dual function: Watchdog Timer pin and NMI input pin. The function of
the NMI/WDTOUT pin can be selected through the TSSR.
For more information on the 5501 timers, see the TMS320VC5501/5502 DSP Timers Reference Guide
(literature number SPRU618).
*9 TEXAS INS UMENTS
Functional Overview
51
December 2002 − Revised November 2008 SPRS206K
3.4.1 Timer Interrupts
As stated earlier, each timer has one input, one output, and one interrupt signal: TIN, TOUT, and TINT,
respectively. The interrupt signals of Timer 0 and Timer 1 are directly connected to the interrupt logic of the
DSP (see Figure 3−6). The interrupts for Timer 0 and Timer 1 are maskable and can be enabled or disabled
through the TINT0 and TINT1 bits of the interrupt enable registers (IER0 and IER1); setting TINT0 of IER0
to ‘1’ enables the interrupt for Timer 0 and setting TINT1 of IER1 enables the interrupt for Timer 1.
10 Others
IWCON
RESET INT3 NMI TINT1 TINT0
TINT
101101
RESET INT3 NMI/WDTOUT
Timer0
TINT
Timer1
TINT
Watchdog
Timer
TMS320VC5501 DSP
Interrupt Logic
Figure 3−6. Timer Interrupts
The interrupt signal for the Watchdog Timer can be internally connected to the RESET, INT3, or NMI signals
by setting the IWCON bit of the Timer Signal Selection Register (TSSR) appropriately (see Figure 3−6). The
DSP will be reset once the Watchdog Timer generates an interrupt if the timer interrupt is connected to RESET
(IWCON = ‘01’). A non-maskable interrupt will be generated if the timer interrupt is connected to NMI (IWCON
= ‘10’). An external interrupt will be generated when the timer interrupt signal is connected to INT3 (IWCON
= ‘11’), but only if the INT3 bit of IER0 is set to ‘1’.
Refer to Section 3.16, Interrupts, for more information on using interrupts.
*9 TEXAS INSTRUMENTS
Functional Overview
52 December 2002 − Revised November 2008SPRS206K
3.4.2 Timer Pins
The 5501 has one pin for each timer: TIM0 for Timer 0, TIM1 for Timer 1, and NMI/WDTOUT for the Watchdog
Timer. Either the output (TOUT) or input (TIN) signal can be connected to the timer pin (see Figure 3−7). When
the timer pin is configured as an output, the TOUT signal is connected to the pin. The TIN signal is connected
to the pin when the pin is configured as an input. Each pin can be configured as input or output through the
Timer Signal Selection Register (TSSR) (bits TIM0_MODE, TIM1_MODE, and WDT_MODE).
TIM0_MODE TIM0
TIM1_MODE TIM1
Timer0
TIN
TOUT
TOUT
TIN
Timer1
WDT_MODE
NMI/WDTOUT
Watchdog
Timer
TSSR
Peripheral Bus
TMS320VC5501 DSP
TOUT
TIN
Figure 3−7. Timer Pins
When configured as input, the timer pin can be used to source an external clock to the timer. Also, when the
timer pin is configured as input and the timer is running off an internal clock, the timer pin can be used to start
or stop count of the timer (clock gating).
When the timer pin is configured as an output, the timer pin can signal a pulse (pulse mode) or a change of
state (clock mode) when the timer count matches its period.
The NMI/WDTOUT pin has two functions: Watchdog Timer pin or NMI pin. The NMI/WDTOUT_CFG bit of the
TSSR controls the function of this pin. It is possible to configure the NMI/WDTOUT pin as NMI
(NMI/WDTOUT_CFG = ‘1’) and also connect the Watchdog Timer TINT signal to the NMI signal
(IWCON = ‘10’). In this case, the external NMI signal will be overridden by the TINT signal of the Watchdog
Timer, i.e., applying a signal to the NMI/WDTOUT pin will not generate the non-maskable interrupt NMI.
For all three timers (Timer 0, Timer 1, and the Watchdog Timer), both the TIN and TOUT signals can be used
for general-purpose input/output. The timer pin must be configured for input to use the TIN signal as
general-purpose input/output. The timer pin can be configured as an input by setting the pin mode bit of the
Timer Signal Selection Register (TSSR) to ‘0’. The TOUT signal can be used as general-purpose input/output
if the timer pin is configured for output. The timer pin can be configured as an output by setting the pin mode
bit of the TSSR to ‘1’. The GPIO Enable Register (GPEN), GPIO Direction Register (GPIODIR), and the GPIO
Data Register (GPDAT) of each timer can be used to control the state of the timer pins when used as
general-purpose input/output.
{9 TEXAS INSTRUMENTS
Functional Overview
53
December 2002 − Revised November 2008 SPRS206K
3.4.3 Timer Signal Selection Register (TSSR)
The Timer Signal Selection Register (TSSR) controls several pin characteristics for Timer 0, Timer 1, and the
Watchdog Timer. The TSSR can be used to specify whether the pins of Timer 0, Timer 1, and the Watchdog
Timer are inputs or outputs. The TSSR also determines how the interrupt signal of the Watchdog Timer is
connected internally and sets the function for the NMI/WDTOUT pin of the 5501. By default, all timer pins
(TIM0, TIM1, and NMI/WDTOUT) are set as inputs, the interrupt signal of the Watchdog Timer is not internally
connected to anything, and the NMI/WDTOUT pin has the function of the NMI signal.
15 8
Reserved
R, 00000000
76543210
Reserved WDT_MODE TIM1_MODE TIM0_MODE IWCON NMI/WDTOUT
_CFG
R, 00 R/W, 0 R/W, 0 R/W, 0 R/W, 00 R/W, 1
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−8. Timer Signal Selection Register Layout (0x8000)
Table 3−7. Timer Signal Selection Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−6 R 0000000000 Reserved
WDT_MODE 5 R/W 0 WDT pin mode
WDT_MODE = 0: WDTOUT pin is used as the timer input
pin.
WDT_MODE = 1: WDTOUT pin is used as the timer output
pin.
TIM1_MODE 4 R/W 0 TIM1 pin mode
TIM1_MODE = 0: TIM1 pin is used as the timer input pin.
TIM1_MODE = 1: TIM1 pin is used as the timer output pin.
TIM0_MODE 3 R/W 0 TIM0 pin mode
TIM0_MODE = 0: TIM0 pin is used as the timer input pin.
TIM0_MODE = 1: TIM0 pin is used as the timer output pin.
If NMI/WDTOUT_CFG = 1 and IWCON = 10, only the WDTOUT signal will drive the NMI signal; the external source driving the NMI/WDTOUT
pin will be ignored.
{'5 TEXAS INSTRUMENTS
Functional Overview
54 December 2002 − Revised November 2008SPRS206K
Table 3−7. Timer Signal Selection Register Bit Field Description (Continued)
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IWCON 2:1 R/W 00 Internal WDT output signal connection
IWCON = 00: Internal watchdog timer interrupt (TINT)
signal has no internal connection.
IWCON = 01: Internal watchdog timer interrupt (TINT)
signal has an internal connection to
RESET pin.
IWCON = 10: Internal watchdog timer interrupt (TINT)
signal has an internal connection to NMI
pin.
IWCON = 11: Internal watchdog timer interrupt (TINT)
signal has an internal connection to INT3
pin.
NMI/WDTOUT_CFG 0 R/W 1 NMI/WDTOUT configuration
NMI/WDTOUT_CFG = 0: NMI/WDTOUT pin is used as the
WDTOUT pin.
NMI/WDTOUT_CFG = 1: NMI/WDTOUT pin is used as the
NMI input pin.
If NMI/WDTOUT_CFG = 1 and IWCON = 10, only the WDTOUT signal will drive the NMI signal; the external source driving the NMI/WDTOUT
pin will be ignored.
3.5 Universal Asynchronous Receiver/Transmitter (UART)
The UART peripheral is based on the industry-standard TL16C550B asynchronous communications element,
which in turn, is a functional upgrade of the TL16C450. Functionally similar to the TL16C450 on power up
(character or TL16C450 mode), the UART can be placed in an alternate FIFO (TL16C550) mode. This relieves
the CPU of excessive software overhead by buffering received and transmitted characters. The receiver and
transmitter FIFOs store up to 16 bytes, including three additional bits of error status per byte for the receiver
FIFO.
The UART performs serial-to-parallel conversions on data received from a peripheral device or modem and
parallel-to-serial conversion on data received from the CPU. The CPU can read the UART status at any time.
The UART includes control capability and a processor interrupt system that can be configured to minimize
software management of the communications link.
The UART includes a programmable baud rate generator capable of dividing the CPU clock by divisors from 1
to 65535 and producing a 16× reference clock for the internal transmitter and receiver logic.
47 J # V A D k 4— 44 4 a t p f7 4—. + V r 1 i——> + F {9 TEXAS INSTRUMENTS
Functional Overview
55
December 2002 − Revised November 2008 SPRS206K
8
Receiver
Buffer
Register
Divisor
Latch (LS)
Divisor
Latch (MS)
Baud
Generator
Receiver
FIFO
Line
Status
Register
Transmitter
Holding
Register
Modem
Control
Register
Line
Control
Register
Transmitter
FIFO
Interrupt
Enable
Register
Interrupt
Identification
Register
FIFO
Control
Register
Interrupt/
Event
Control
Logic
S
e
l
e
c
t
Data
Bus
Buffer
RX
TX
Peripheral
Bus
S
e
l
e
c
t
Receiver
Shift
Register
Receiver
Timing and
Control
Transmitter
Timing and
Control
Transmitter
Shift
Register
Control
Logic
16
8
8
8
8
8
Interrupt to CPU
16
8
pin
pin
8
88
8
Power and
Emulation
Control
Register
Event to DMA controller
Figure 3−9. UART Functional Block Diagram
(literature number SPRU146) |:| k + W |:| |:| : E |:| E‘ |_l _ |:| > m |:| 55 SPRSZUEK WTEXAS INSTRUMENTS
Functional Overview
56 December 2002 − Revised November 2008SPRS206K
3.6 Inter-Integrated Circuit (I2C) Module
The TMS320VC5501 also includes an I2C serial port for control purposes. Features of the I2C port include:
Compatibility with Philips’ I2C-Bus Specification, Version 2.1 (January 2000)
Fast mode up to 400 Kbps (no fail-safe I/O buffers)
Noise filters (on the SDA and SCL pins) to suppress noise of 50 ns or less (I2C module clock must be in
the range of 7 MHz to 12 MHz)
7-bit and 10-bit device addressing modes
Master (transmit/receive) and slave (transmit/receive) functionality
Events: DMA, interrupt, or polling
Slew-rate limited open-drain output buffers
The I2C module clock must be in the range of 7 MHz to 12 MHz. This is necessary for the proper operation
of the I2C module.
NOTE: For additional information, see the TMS320VC5501/5502/5503/5507/5509 DSP
Inter-Integrated Circuit (I2C) Module Reference Guide (literature number SPRU146).
Figure 3−10 is a block diagram of the I2C module.
Clock
Prescale
I2CPSC
SYSCLK2
From PLL
Clock Generator
I2CCLKH
Generator
Bit Clock
I2CCLKL
Noise
Filter
I2C Clock
SCL
I2CXSR
I2CDXR
Transmit
Transmit
Shift
Transmit
Buffer
I2CDRR
Shift
I2CRSR
Receive
Buffer
Receive
Receive
Filter
SDA
I2C Data Noise
I2COAR
I2CSAR Slave
Address
Control
Address
Own
I2CMDR
I2CCNT
Mode
Data
Count
Source
Interrupt
Status
I2CISRC
I2CSTR
Enable
Interrupt
I2CIER
Interrupt/DMA
I2C Module
NOTE A: Shading denotes control/status registers.
Figure 3−10. I2C Module Block Diagram
9 (literature number SPRU620) *9 TEXAS INSTRUMENTS
Functional Overview
57
December 2002 − Revised November 2008 SPRS206K
3.7 Host-Port Interface (HPI)
The 5501 HPI provides an 8-bit parallel interface (multiplexed mode) to a host with the following features:
Host access to on-chip DARAM (excluding CPU memory-mapped registers)
16-bit address register with autoincrement capability for faster transfers
Multiple address/data strobes provide a glueless interface to a variety of hosts
HRDY signal for handshaking with host
The 5501 HPI can access the entire DARAM space of the 5501 (excluding memory-mapped CPU registers);
however, it does not have access to external memory of the peripheral I/O space. Furthermore, the HPI cannot
access internal DARAM space when the device is in reset. Note that all accesses made through the HPI are
word-addressed.
NOTE: No host access should occur when the HPI is placed in IDLE. The host cannot wake
up the DSP through the DSP_INT bit of the HPIC register when the DSP is in IDLE mode.
The 5501 HPI only supports data transfers in multiplexed 8-bit mode. In multiplexed mode, the host can only
send 8 bits of data at a time through the HD[7:0] bus; therefore, some extra steps have to be taken to read/write
from the 5501’s internal memory [see the TMS320VC5501/5502 DSP Host Port Interface (HPI) Reference
Guide (literature number SPRU620) for more information on the 5501 HPI].
The 5501 HPI has its own register set, therefore the HINT bit of CPU register ST3_55 is not used for
DSP-to-host interrrupts. The HINT bit in the Host Port Control Register (HPIC) should be used for DSP-to-host
interrupts.
A host must not initiate any transfer requests from the HPI while the HPI is being brought out of reset. As
described in Section 3.9.6, Reset Sequence, the C55x CPU and the peripherals are not brought out of reset
immediately after the RESET pin transitions from low to high. Instead, an internal counter stretches the reset
signal to allow enough time for the internal oscillator to stabilize and also to allow the reset signal to propagate
through different parts of the device. The IACK pin will go low for two CPU clock cycles to indicate that this
internal reset signal has been deasserted. A host must follow one of these two requirements before initiating
transfer requests from the HPI:
1. Keep the HPIENA pin low until the internal reset signal has been deasserted.
2. Keep the HCS, HDS1, and HDS2 pins inactive until the internal reset signal has been deasserted.
Note that when the HPI bootmode is used, the GPIO4 pin can also be used to determine when the internal
reset signal has been deasserted as this pin is used by the HPI to signal to the host that it is ready to receive
access requests.
Comm/[er Relerence Guide (Iileratu re number SPRU613) *9 TEXAS INSTRUMENTS
Functional Overview
58 December 2002 − Revised November 2008SPRS206K
3.8 Direct Memory Access (DMA) Controller
The 5501 DMA provides the following features:
Four standard ports for the following data resources: two for DARAM, one for Peripherals, and one for
External Memory
Six channels, which allow the DMA controller to track the context of six independent DMA channels
Programmable low/high priority for each DMA channel
One interrupt for each DMA channel
Event synchronization. DMA transfers in each channel can be dependent on the occurrence of selected
events.
Programmable address modification for source and destination addresses
Idle mode that allows the DMA controller to be placed in a low-power (idle) state under software control
The 5501 has an Auto-wakeup/Idle function for McBSP to DMA to on-chip memory data transfers when the
DMA and the McBSP are both set to IDLE. In the case that the McBSP is set to external clock mode and the
McBSP and the DMA are set to idle, the McBSP and the DMA can wake up from IDLE state automatically if
the McBSP gets a new data transfer. The McBSP and the DMA enter the idle state automatically after data
transfer is complete. [The clock generator (PLL) should be active and the PLL core should not be in
power-down mode for the Auto-wakeup/Idle function to work.]
The 5501 DMA controller allows transfers to be synchronized to selected events. The 5501 supports
14 separate synchronization events and each channel can be tied to separate synchronization event
independent of the other channels. Synchronization events are selected by programming the SYNC field in
the channel-specific DMA Channel Control Register (DMA_CCR).
The 5501 DMA can access all the internal DARAM space as well as all external memory space. The 5501 DMA
also has access to the registers for the following peripheral modules: McBSP, UART, GPIO, PGPIO, and I2C.
3.8.1 DMA Channel 0 Control Register (DMA_CCR0)
The DMA Channel 0 Control Register (DMA_CCR0) bit layouts are shown in Figure 3−11. DMA_CCR1 to
DMA_CCR5 have similar bit layouts. See the TMS320VC5501/5502 DSP Direct Memory Access (DMA)
Controller Reference Guide (literature number SPRU613) for more information on the DMA Channel n Control
Register (n = 0, 1, 2, 3, 4, or 5).
15 14 13 12 11 10 9 8
DSTAMODE SRCAMODE ENDPROG WP REPEAT AUTOINIT
R/W, 00 R/W, 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0
7654 0
EN PRIO FS SYNC
R/W, 0 R/W, 0 R/W, 0 R/W, 00000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−11. DMA Channel 0 Control Register Layout (0x0C01)
{9 TEXAS INSTRUMENTS
Functional Overview
59
December 2002 − Revised November 2008 SPRS206K
The SYNC field (bits[4:0]) of the DMA_CCR register specifies the event that can initiate the DMA transfer for
the corresponding DMA channel. The five bits allow several configurations as listed in Table 3−8. The bits are
set to zero upon reset.
Table 3−8. Synchronization Control Function
SYNC FIELD IN
DMA_CCR SYNCHRONIZATION MODE
00000b No event synchronized
00001b McBSP 0 Receive Event (REVT0)
00010b McBSP 0 Transmit Event (XEVT0)
00011b Reserved (Do not use this value)
00100b Reserved (Do not use this value)
00101b McBSP1 Receive Event (REVT1)
00110b McBSP1 Transmit Event (XEVT1)
00111b Reserved (Do not use this value)
01000b Reserved (Do not use this value)
01001b Reserved (Do not use this value)
01010b Reserved (Do not use this value)
01011b UART Receive Event (UARTREVT)
01100b UART Transmit Event (UARTXEVT)
01101b Timer 0 Event
01110b Timer 1 Event
01111b External Interrupt 0
10000b External Interrupt 1
10001b External Interrupt 2
10010b External Interrupt 3
10011b I2C Receive Event
10100b I2C Transmit Event
Other values Reserved (Do not use these values)
{'1’ TEXAS INSTRUMENTS
Functional Overview
60 December 2002 − Revised November 2008SPRS206K
3.9 System Clock Generator
The TMS320VC5501 includes a flexible clock generator module consisting of a PLL and oscillator, with several dividers so that different
clocks may be generated for different parts of the system (i.e., 55x core, Fast Peripherals, Slow Peripherals, External Memory Interface).
Figure 3−12 provides an overview of the system clock generator included in the 5501.
1
0
OSC
X2/CLKIN
X1
/1,/2,...,/32 x2, x3,
...,x15
PLL 1
0
Divider D1
SYSCLK1
(Fast Peripherals)
SYSCLK2
(Slow Peripherals)
(EMIF Internal Clock)
SYSCLK3
CLKOSEL
(CLKOUTSR[2:1])
CLKOUTDIS
(CLKOUTSR[0])
CLKOUT
CLKMD
(CLKMD[0])
GPIO4 at Reset = 0 −> CLKMD[0] = 0
GPIO4 at Reset = 1 −> CLKMD[0] = 1
10
/1,/2,/4
EMIF ECLKOUT1
ECLKOUT2
ECLKIN
EMIFCLKS
PLLREF
GPIO4
at Reset
55x
Core
CK3SEL (CK3SEL[3:0])
OSCOUT
PLLEN
(PLLCSR[0])
Clock Generator
ENA
PWRDN
Divider D0
D0EN
(PLLDIV0[15])
OSCPWRDN
(PLLCSR[2])
ENA
PLLOUT
D1EN (PLLDIV1[15])
Divider D2
ENA
D2EN (PLLDIV2[15])
Divider D3
ENA
D3EN (PLLDIV3[15])
CLKOUT3
(DSP Core Clock)
/1,/2,/4
/1,/2,/4
/1,/2,/4
/1,/2,...,/32
ENA
Divider OD1
OD1EN
(OSCDIV1[15])
Figure 3−12. System Clock Generator
December 2002 7 Revised November 2003 M TEXAS INSTRUMENTS
Functional Overview
61
December 2002 − Revised November 2008 SPRS206K
3.9.1 Input Clock Source
The clock input to the 5501 can be sourced from either an externally generated 3.3-V clock input on the
X2/CLKIN pin, or from the on-chip oscillator if an external crystal circuit is attached to the device as shown
in Figure 3−13. The CLKMD0 bit of the Clock Mode Control Register (CLKMD) determines which clock, either
OSCOUT or X2/CLKIN, is used as an input clock source to the DSP. If GPIO4 is low at reset, the CLKMD0
bit of the Clock Mode Control Register (CLKMD) will be set to ‘0’ and the internal oscillator and the external
crystal will generate the input clock to the DSP. If GPIO4 is high, the CLKMD0 bit will be set to ‘1’ and the input
clock will be taken directly from the X2/CLKIN pin.
The input clock source to the DSP can be directly used to generate the clocks to other parts of the system
(Bypass Mode) or it can be multiplied by a value from 2 to 15 and divided by a value from 1 to 32 to achieve
a desired frequency (PLL Mode). The PLLEN bit of the PLL Control/Status Register (PLLCSR) is used to select
between the PLL and bypass modes of the clock generator.
The clock generated through either the PLL Mode or the Bypass Mode can be further divided down to generate
a clock source for other parts of the system, or Clock Groups. Clock groups allow for lower power and
performance optimization since the frequency of groups with no high-speed requirements can be set to
one-fourth or one-half the frequency of other groups. A description of the different clock groups included in
the 5501 and the procedure for changing the operating frequency for those clock groups are described later
in this section.
3.9.1.1 Internal System Oscillator With External Crystal
The 5501 includes an internal oscillator which can be used in conjunction with an external crystal to generate
the input clock to the DSP. The oscillator requires an external crystal connected across the X1 and X2/CLKIN
pins. If the internal oscillator is not used, an external clock source must be applied to the X2/CLKIN pin and
the X1 pin should be left unconnected. Since the internal oscillator can be used as a clock source to the PLL,
the crystal oscillation frequency can be multiplied to generate the input clock to the different clock groups of
the DSP.
The crystal should be in fundamental-mode operation, and parallel resonant, with a maximum effective series
resistance (ESR) as specified in Table 3−9. The connection of the required circuit is shown in Figure 3−13.
Under some conditions, all the components shown are not required. The capacitors, C1 and C2, should be
chosen such that the equation below is satisfied. CL in the equation is the load specified for the crystal that
is also specified in Table 3−9.
CL+C1C2
(C1)C2)
X2/CLKIN X1
C1C2
Crystal
RS
Figure 3−13. Internal System Oscillator With External Crystal
{'5 TEXAS INSTRUMENTS
Functional Overview
62 December 2002 − Revised November 2008SPRS206K
Table 3−9. Recommended Crystal Parameters
FREQUENCY RANGE (MHz) MAXIMUM ESR
SPECIFICATIONS ()CLOAD (pF) MAXIMUM
CSHUNT (pF) RS (k)
20−15 40 10 7 0
15−12 40 16 7 0
12−10 40 16 7 2.8
10−8 60 18 7 2.2
8−6 60 18 7 8.8
6−5 80 18 7 14
The recommended ESR is presented as a maximum, and theoretically, a crystal with a lower maximum ESR
might seem to meet these specifications. However, it is recommended that crystals with actual maximum ESR
specifications as shown in Table 3−9 be used since this will result in maximum crystal performance reliability.
The internal oscillator can be set to power-down mode through the use of the OSCPWRDN bit in the PLL
Control/Status Register (PLLCSR). If the internal oscillator and the external crystal are generating the input
clock for the DSP (CLKMD0 = 0), the internal oscillator will be set to power-down mode when the OSCPWRDN
bit is set to 1 and the clock generator is set to its idle mode (CLKIS bit of the IDLE Status Register (ISTR)
becomes 1). If the X2/CLKIN pin is supplying the input clock to the DSP (CLKMD0 = 1), the internal oscillator
will be set to power-down immediately after the OSCPWRDN bit is set to 1.
The 5501 has internal circuitry that will count down a predetermined number of clock cycles (41,032 reference
clock cycles) to allow the oscillator input to become stable after waking up from power-down state or after
reset. If a reset is asserted, program flow will start after all stabilization periods have expired; this includes the
oscillator stabilization period only if GPIO4 is low at reset. If the oscillator is coming out of power-down mode,
program flow will start immediately after the oscillator stabilization period has completed. See Section 3.9.6,
Reset Sequence, for more details on program flow after reset or after oscillator power-down. See
Section 3.10, Idle Control, for more information on the oscillator power-down mode.
3.9.1.2 Clock Generation With PLL Disabled (Bypass Mode, Default)
After reset, the PLL multiplier (M1) and its divider (D0) will be bypassed by default and the input clock to point C
in Figure 3−14 will be taken from, depending on the state of the GPIO4 pin after reset, either the internal
oscillator or the X2/CLKIN pin. The PLL can be taken out of bypass mode as described in Section 3.9.4.1,
C55x Subsystem Clock Group.
3.9.1.3 Clock Generation With PLL Enabled (PLL Mode)
When not in bypass mode, the frequency of the input clock can be divided down by a programmable
divider (D0) by any factor from 1 to 32. The output clock of the divider can be multiplied by any factor from 2
to 15 through a programmable multiplier (M1). The divider factor can be set through the PLLDIV0 bit of the
PLL Divider 0 Register. The multiplier factor can be set through the PLLM bits of the PLL Multiplier Control
Register.
There is a specific minimum and maximum reference clock (PLLREF) and output clock (PLLOUT) for the block
labeled “PLL” in Figure 3−12, as well as for the C55x Core clock (CLKOUT3), the Fast Peripherals clock
(SYSCLK1), the Slow Peripherals clock (SYSCLK2), and the EMIF internal clock (SYSCLK3). The clock
generator must not be configured to exceed any of these constraints (certain combinations of external clock
input, internal dividers, and PLL multiply ratios might not be supported). See Table 3−10 for the PLL clock input
and output frequency ranges.
{9 TEXAS INSTRUMENTS
Functional Overview
63
December 2002 − Revised November 2008 SPRS206K
3.9.1.4 Frequency Ranges for Internal Clocks
There are specific minimum and maximum reference clocks for all of the internal clocks. Table 3−10 lists the
minimum and maximum frequencies for the internal clocks of the TMS320VC5501.
Table 3−10. Internal Clocks Frequency Ranges
CLOCK SIGNAL MIN MAX UNIT
OSCOUT (CLKMD = 0) 5 20 MHz
PLLREF (PLLEN = 1) 12 100 MHz
PLLOUT (PLLEN = 1) 70 300 MHz
CLKOUT3 300 MHz
SYSCLK1 150 MHz
SYSCLK2 SYSCLK1 MHz
SYSCLK3 − SYSCLK1MHz
Also see the electrical specification (timing requirements and switching characteristics parameters) in Section 5.6, Clock
Options, of this data manual.
When an internal clock is used for the EMIF module, the frequency for SYSCLK3 must also be less than or equal to 100 MHz.
When an external clock is used, the maximum frequency of SYSCLK3 can be equal to or less than the frequency of
SYSCLK1; however, the frequency of the clock signal applied to the ECLKIN pin must be less than or equal to 100 MHz.
3.9.2 Clock Groups
The TMS320VC5501 has four clock groups: the C55x Subsystem Clock Group, the Fast Peripherals Clock
Group, the Slow Peripherals Clock Group, and the External Memory Interface Clock Group. Clock groups
allow for lower power and performance optimization since the frequency of groups with no high-speed
requirements can be set to 1/4 or 1/2 the frequency of other groups.
3.9.2.1 C55x Subsystem Clock Group
The C55x Subsystem Clock Group includes the C55x CPU core, internal memory (DARAM and ROM), the
ICACHE, and all CPU-related modules. The input clock to this clock group is taken from the CLKOUT3 signal
(as shown in Figure 3−12), the source of which can be controlled through the CLKOUT3 Select Register
(CK3SEL). The different options for the CLKOUT3 signal are intended for test purposes; it is recommended
that the CK3SEL bits of the CK3SEL register be kept at their default value of ‘1011b’ during normal operation.
When operating the clock generator in PLL Mode, the frequency of CLKOUT3 can be set by adjusting the
divider and multiplier values of D0 and M1 through the PLLDIV0 and PLLM registers, respectively.
3.9.2.2 Fast Peripherals Clock Group
The Fast Peripherals Clock Group includes the DMA, HPI, and the timers. The input clock to this clock group
is taken from the output of divider 1 (D1) (as shown in Figure 3−12). By default, the divider is set to divide its
input clock by four, but the divide value can be changed to divide-by-1 or divide-by-2 by modifying the PLLDIV1
bits of the PLL Divider1 Register (PLLDIV1) through software.
3.9.2.3 Slow Peripherals Clock Group
The Slow Peripherals Clock Group includes the McBSPs, I2C, and the UART. The input clock to this clock
group is taken from the output of divider 2 (D2). by default, the divider is set to divide its input clock by four,
but the divide value can be changed to divide-by-1 or divide-by-2 by modifying the PLLDIV2 bits of the PLL
Divider2 Register (PLLDIV2) through software. The clock frequency of the Slow Peripherals Clock Group must
be equal to or less than that of the Fast Peripherals Clock Group.
3.9.2.4 External Memory Interface Clock Group
The External Memory Interface Clock Group includes the External Memory Interface (EMIF) module and the
external data bridge modules. The input clock to this clock group is taken from the output of divider 3 (D3).
By default, the divider is set to divide its input clock by four, but the divide value can be changed to divide-by-1
or divide-by-2 by modifying the PLLDIV3 bits of the PLL Divider3 Register (PLLDIV3) through software. The
clock frequency of the External Memory Interface Clock Group must be equal to or less than that of the Fast
Peripherals Clock Group.
*9 TEXAS INSTRUMENTS
Functional Overview
64 December 2002 − Revised November 2008SPRS206K
3.9.3 EMIF Input Clock Selection
The EMIF may be clocked from an external asynchronous clock source through the ECLKIN pin if a specific
EMIF frequency is needed. The source for the EMIF clock can be specified through the EMIFCLKS pin. If
EMIFCLKS is low, then the EMIF will be clocked via the same internal clock that feeds the data bridge module
and performance will be optimal. If EMIFCLKS is high, then an external asynchronous clock, which can be
taken up to 100 MHz, will clock the EMIF. The data throughput performance may be degraded due to
synchronization issues when an external clock source is used for the EMIF.
3.9.4 Changing the Clock Group Frequencies
DSP software can be used to change the clock frequency of each clock group by setting adequate values in
the PLL control registers. Figure 3−14 shows which PLL control registers affect the different portions of the
clock generator. The following sections describe the procedures for changing the frequencies of each clock
group.
Point A Divider
D0
Point B PLL Core
Multiplier M1 Divider
D1
Divider
D2
Divider
D3
Divider
OD1
PLLM
PLLDIV0
PLLDIV2
PLLDIV1
CK3SEL
WKEN
OSCDIV1
PLLDIV3
PLLCSR
PLLEN
Point C
Oscillator Power-Down Control
SYSCLK1
SYSCLK2
SYSCLK3
CLKOUT3
OSCOUT
X2/CLKIN
CLKMD0
11
0
0
Figure 3−14. Clock Generator Registers
*9 TEXAS INSTRUMENTS
Functional Overview
65
December 2002 − Revised November 2008 SPRS206K
3.9.4.1 C55x Subsystem Clock Group
Changes to the PLL Control Register (PLLCSR), the PLL Divider0 Register (PLLDIV0), and the PLL Multiplier
Register (PLLM) affect the clock of this clock group. The following procedure must be followed to change or
to set the PLL to a specific value:
1. Switch to bypass mode by setting the PLLEN bit to 0.
2. Set the PLL to its reset state by setting the PLLRST bit to 1.
3. Change the PLL setting through the PLLM and PLLDIV0 bits.
4. Wait for 1 µs.
5. Release the PLL from its reset state by setting PLLRST to 0.
6. Wait for the PLL to relock by polling the LOCK bit or by setting up a LOCK interrupt.
7. Switch back to PLL mode by setting the PLLEN bit to 1.
The frequency of the C55x Subsystem Clock Group can be up to 300 MHz.
3.9.4.2 Fast Peripherals Clock Group
Changes to the clock of the C55x Subsystem Clock Group affect the clock of the Fast Peripherals Clock Group.
The PLLDIV1 value of the PLL Divider1 Register (PLLDIV1) should not be set in a manner that makes the
frequency for this clock group greater than 150 MHz. There must be no activity in the modules included in the
Fast Peripherals Clock Group when the value of PLLDIV1 is being changed. It is recommended that the fast
peripheral modules be put in IDLE mode before changing the PLLDIV1 value.
3.9.4.3 Slow Peripherals Clock Group
Changes to the clock of the C55x Subsystem Clock Group affect the clock of the Slow Peripherals Clock
Group. The PLLDIV2 value of the PLL Divider2 Register (PLLDIV2) should not be set in a manner that makes
the frequency for this clock group greater than 150 MHz or greater than the frequency of the Fast Peripherals
Clock Group. There must be no activity in the modules included in the Slow Peripherals Clock Group when
the value of PLLDIV2 is being changed. It is recommended that the slow peripheral modules be put in IDLE
mode before changing the PLLDIV2 value.
3.9.4.4 External Memory Interface Clock Group
Changes to the clock of the C55x Subsystem Clock Group affect the clock of the External Memory Interface
Clock Group. The PLLDIV3 value of the PLL Divider3 Register (PLLDIV3) should not be set in a manner that
makes the frequency for this clock group greater than 100 MHz or greater than the frequency of the Fast
Peripherals Clock Group, whichever is smaller. If an external clock is used, the clock on the ECLKIN pin can
be up to 100 MHz and the output of divider 3 can be set equal to or lower than the frequency of the Fast
Peripherals Clock Group. There must be no external memory accesses when the value of PLLDIV3 is being
changed, this means that the value of PLLDIV3 cannot be changed by a program that is being executed from
external memory. It is recommended that the EMIF be put in IDLE mode before changing the PLLDIV3 value.
{'5 TEXAS INSTRUMENTS
Functional Overview
66 December 2002 − Revised November 2008SPRS206K
3.9.5 PLL Control Registers
The 5501 PLL control registers are accessible via the I/O memory map.
Table 3−11. PLL Control Registers
ADDRESS
ADDRESS
1C80h PLLCSR
1C82h CK3SEL
1C88h PLLM
1C8Ah PLLDIV0
1C8Ch PLLDIV1
1C8Eh PLLDIV2
1C90h PLLDIV3
1C92h OSCDIV1
1C98h WKEN
8400h CLKOUTSR
8C00h CLKMD
3.9.5.1 PLL Control / Status Register (PLLCSR)
15 8
Reserved
R, 00000000
76543210
Reserved STABLE LOCK Reserved PLLRST OSCPWRDN PLLPWRDN PLLEN
R, 0 R, 1 R, 0 R, 0 R/W, 1 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−15. PLL Control/Status Register Layout (0x1C80)
{9 TEXAS INSTRUMENTS
Functional Overview
67
December 2002 − Revised November 2008 SPRS206K
Table 3−12. PLL Control/Status Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15:7 R 000000000 Reserved. Reads return 0. Writes have no effect.
STABLE 6 R 1 Oscillator output stable. This bit indicates if the OSCOUT output has
stabilized.
STABLE = 0: Oscillator output is not yet stable.
Oscillator counter is not done counting
41,032 reference clock cycles.
STABLE = 1: Oscillator output is stable. This is true if
any one of the three cases is true:
a) Oscillator counter has finished counting.
b) Oscillator counter is disabled.
c) Test mode.
LOCK 5 R 0 Lock mode indicator. This bit indicates whether the clock generator
is in its lock mode.
LOCK = 0: The PLL is in the process of getting a phase
lock.
LOCK = 1: The clock generator is in the lock mode. The
PLL has a phase lock and the output clock of
the PLL has the frequency determined by the
PLLM register and PLLDIV0 register.
Reserved 4 R 0 Reserved. Reads return 0. Writes have no effect.
PLLRST 3 R/W 1 Asserts RESET to PLL
PLLRST = 0: PLL reset released
PLLRST = 1: PLL reset asserted
OSCPWRDN 2 R/W 0 Sets internal oscillator to power-down mode
OSCPWRDN = 0: Oscillator operational
OSCPWRDN = 1: Oscillator set to power-down mode based on
state of CLKMD0 bit of Clock Mode Control
Register (CLKMD).
When CLKMD0 = 0, the internal oscillator is set
to power-down mode when the clock generator
is set to its idle mode [CLKIS bit of the IDLE
Status Register (ISTR) becomes 1].
When CLKMD0 = 1, the internal oscillator is set
to power-down mode immediately after the
OSCPWRDN bit is set to 1.
PLLPWRDN 1 R/W 0 Selects PLL power down
PLLPWRDN = 0: PLL operational
PLLPWRDN = 1: PLL placed in power-down state
PLLEN 0 R/W 0 PLL mode enable. This bit controls the multiplexer before dividers
D1, D2, and D3.
PLLEN = 0: Bypass mode. Divider D1 and PLL are
bypassed. SYSCLK1 to 3 divided down
directly from input reference clock.
PLLEN = 1: PLL mode. Divider D1 and PLL are not
bypassed. SYSCLK1 to 3 divided down from
PLL output.
{'5 TEXAS INSTRUMENTS
Functional Overview
68 December 2002 − Revised November 2008SPRS206K
3.9.5.2 PLL Multiplier Control Register (PLLM)
15 8
Reserved
R, 00000000
754 0
Reserved PLLM
R, 000 R/W, 00000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−16. PLL Multiplier Control Register Layout (0x1C88)
Table 3−13. PLL Multiplier Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15:5 R 00000000000 Reserved. Reads return 0. Writes have no effect.
PLLM 4:0 R/W 00000 PLL multiplier-select
PLLM = 00000−00001: Reserved
PLLM = 00010: Times 2
PLLM = 00011: Times 3
PLLM = 00100: Times 4
PLLM = 00101: Times 5
PLLM = 00110: Times 6
PLLM = 00111: Times 7
PLLM = 01000: Times 8
PLLM = 01001: Times 9
PLLM = 01010: Times 10
PLLM = 01011: Times 11
PLLM = 01100: Times 12
PLLM = 01101: Times 13
PLLM = 01110: Times 14
PLLM = 01111: Times 15
PLLM = 10000−11111: Reserved
{9 TEXAS INSTRUMENTS
Functional Overview
69
December 2002 − Revised November 2008 SPRS206K
3.9.5.3 PLL Divider 0 Register (PLLDIV0) (Prescaler)
This register controls the value of the PLL prescaler (Divider D0).
15 14 8
D0EN Reserved
R/W, 1 R, 0000000
754 0
Reserved PLLDIV0
R, 000 R/W, 00000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−17. PLL Divider 0 Register Layout (0x1C8A)
Table 3−14. PLL Divider 0 Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
D0EN 15 R/W 1 Divider D0 enable
D0EN = 0: Divider 0 disabled
D0EN = 1: Divider 0 enabled
Reserved 14:5 R 0000000000 Reserved. Reads return 0. Writes have no effect.
PLLDIV0 4:0 R/W 00000 Divider D0 ratio
PLLDIV0 = 00000: Divide by 1
PLLDIV0 = 00001: Divide by 2
PLLDIV0 = 00010: Divide by 3
PLLDIV0 = 00011: Divide by 4
PLLDIV0 = 00100: Divide by 5
PLLDIV0 = 00101: Divide by 6
PLLDIV0 = 00110: Divide by 7
PLLDIV0 = 00111: Divide by 8
PLLDIV0 = 01000: Divide by 9
PLLDIV0 = 01001: Divide by 10
PLLDIV0 = 01010: Divide by 11
PLLDIV0 = 01011: Divide by 12
PLLDIV0 = 01100: Divide by 13
PLLDIV0 = 01101: Divide by 14
PLLDIV0 = 01110: Divide by 15
PLLDIV0 = 01111: Divide by 16
PLLDIV0 = 10000: Divide by 17
PLLDIV0 = 10001: Divide by 18
PLLDIV0 = 10010: Divide by 19
PLLDIV0 = 10011: Divide by 20
PLLDIV0 = 10100: Divide by 21
PLLDIV0 = 10101: Divide by 22
PLLDIV0 = 10110: Divide by 23
PLLDIV0 = 10111: Divide by 24
PLLDIV0 = 11000: Divide by 25
PLLDIV0 = 11001: Divide by 26
PLLDIV0 = 11010: Divide by 27
PLLDIV0 = 11011: Divide by 28
PLLDIV0 = 11100: Divide by 29
PLLDIV0 = 11101: Divide by 30
PLLDIV0 = 11110: Divide by 31
PLLDIV0 = 11111: Divide by 32
{'5 TEXAS INSTRUMENTS
Functional Overview
70 December 2002 − Revised November 2008SPRS206K
3.9.5.4 PLL Divider1 Register (PLLDIV1) for SYSCLK1
This register controls the value of the divider D1 for SYSCLK1. It is in both the BYPASS and PLL paths.
15 14 8
D1EN Reserved
R/W, 1 R, 0000000
754 0
Reserved PLLDIV1
R, 000 R/W, 00011
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−18. PLL Divider 1 Register Layout (0x1C8C)
Table 3−15. PLL Divider 1 Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
D1EN 15 R/W 1 Divider D1 enable
D1EN = 0: Divider 1 disabled
D1EN = 1: Divider 1 enabled
Reserved 14:5 R 0000000000 Reserved. Reads return 0. Writes have no effect.
PLLDIV1 4:0 R/W 00011 Divider D1 ratio (SYSCLK1 divider)
PLLDIV1 = 00000: Divide by 1
PLLDIV1 = 00001: Divide by 2
PLLDIV1 = 00010: Reserved
PLLDIV1 = 00011: Divide by 4
PLLDIV1 = 00100−11111: Reserved
3.9.5.5 PLL Divider2 Register (PLLDIV2) for SYSCLK2
This register controls the value of the divider D2 for SYSCLK2. It is in both the BYPASS and PLL paths.
15 14 8
D2EN Reserved
R/W, 1 R, 0000000
754 0
Reserved PLLDIV2
R, 000 R/W, 00011
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−19. PLL Divider 2 Register Layout (0x1C8E)
{9 TEXAS INSTRUMENTS
Functional Overview
71
December 2002 − Revised November 2008 SPRS206K
Table 3−16. PLL Divider 2 Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
D2EN 15 R/W 1 Divider D2 enable
D2EN = 0: Divider 2 disabled
D2EN = 1: Divider 2 enabled
Reserved 14:5 R 0000000000 Reserved. Reads return 0. Writes have no effect.
PLLDIV2 4:0 R/W 00011 Divider D2 ratio (SYSCLK2 divider)
PLLDIV2 = 00000: Divide by 1
PLLDIV2 = 00001: Divide by 2
PLLDIV2 = 00010: Reserved
PLLDIV2 = 00011: Divide by 4
PLLDIV2 = 00100−11111: Reserved
3.9.5.6 PLL Divider3 Register (PLLDIV3) for SYSCLK3
This register controls the value of the divider D3 for SYSCLK3. It is in both the BYPASS and PLL paths.
15 14 8
D3EN Reserved
R/W, 1 R, 0000000
754 0
Reserved PLLDIV3
R, 000 R/W, 00011
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−20. PLL Divider 3 Register Layout (0x1C90)
Table 3−17. PLL Divider 3 Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
D3EN 15 R/W 1 Divider D3 enable
D3EN = 0: Divider 3 disabled
D3EN = 1: Divider 3 enabled
Reserved 14:5 R 0000000000 Reserved. Reads return 0. Writes have no effect.
PLLDIV3 4:0 R/W 00011 Divider D3 ratio (SYSCLK3 divider)
PLLDIV3 = 00000: Divide by 1
PLLDIV3 = 00001: Divide by 2
PLLDIV3 = 00010: Reserved
PLLDIV3 = 00011: Divide by 4
PLLDIV3 = 00100−11111: Reserved
{'5 TEXAS INSTRUMENTS
Functional Overview
72 December 2002 − Revised November 2008SPRS206K
3.9.5.7 Oscillator Divider1 Register (OSCDIV1) for CLKOUT3
This register controls the value of the divider OD1 for CLKOUT3. It does not go through the PLL path.
15 14 8
OD1EN Reserved
R/W, 0 R, 0000000
754 0
Reserved OSCDIV1
R, 000 R/W, 00000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−21. Oscillator Divider1 Register Layout (0x1C92)
Table 3−18. Oscillator Divider1 Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
OD1EN 15 R/W 0 Oscillator divider OD1 enable
OD1EN = 0: Oscillator divider 1 disabled
OD1EN = 1: Oscillator divider 1 enabled
Reserved 14:5 R 0000000000 Reserved. Reads return 0. Writes have no effect.
OSCDIV1 4:0 R/W 00000 Divider OD1 ratio (CLKOUT3 divider)
OSCDIV1 = 00000: Divide by 1
OSCDIV1 = 00001: Divide by 2
OSCDIV1 = 00010: Divide by 3
OSCDIV1 = 00011: Divide by 4
OSCDIV1 = 00100: Divide by 5
OSCDIV1 = 00101: Divide by 6
OSCDIV1 = 00110: Divide by 7
OSCDIV1 = 00111: Divide by 8
OSCDIV1 = 01000: Divide by 9
OSCDIV1 = 01001: Divide by 10
OSCDIV1 = 01010: Divide by 11
OSCDIV1 = 01011: Divide by 12
OSCDIV1 = 01100: Divide by 13
OSCDIV1 = 01101: Divide by 14
OSCDIV1 = 01110: Divide by 15
OSCDIV1 = 01111: Divide by 16
OSCDIV1 = 10000: Divide by 17
OSCDIV1 = 10001: Divide by 18
OSCDIV1 = 10010: Divide by 19
OSCDIV1 = 10011: Divide by 20
OSCDIV1 = 10100: Divide by 21
OSCDIV1 = 10101: Divide by 22
OSCDIV1 = 10110: Divide by 23
OSCDIV1 = 10111: Divide by 24
OSCDIV1 = 11000: Divide by 25
OSCDIV1 = 11001: Divide by 26
OSCDIV1 = 11010: Divide by 27
OSCDIV1 = 11011: Divide by 28
OSCDIV1 = 11100: Divide by 29
OSCDIV1 = 11101: Divide by 30
OSCDIV1 = 11110: Divide by 31
OSCDIV1 = 11111: Divide by 32
{9 TEXAS INSTRUMENTS
Functional Overview
73
December 2002 − Revised November 2008 SPRS206K
3.9.5.8 Oscillator Wakeup Control Register (WKEN)
This register controls whether different events in the system are enabled to wake up the device after entering
OSCPWRDN.
15 8
Reserved
R, 00000000
7 543210
Reserved WKEN4 WKEN3 WKEN2 WKEN1 WKEN0
R, 000 R/W, 1 R/W, 1 R/W, 1 R/W, 1 R/W, 1
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−22. Oscillator Wakeup Control Register Layout (0x1C98)
Table 3−19. Oscillator Wakeup Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15:5 R 00000000000 Reserved. Reads return 0. Writes have no effect.
WKEN4 4 R/W 1 Input INT3 can wake up the oscillator when the OSCPWRDN bit in
PLLCSR is asserted to logic 1.
WKEN4 = 0: Wake-up enabled. A low-to-high transition on INT3
wakes up the oscillator and clears the OSCPWRDN bit.
WKEN4 = 1: Wake-up disabled. A low-to-high transition on INT3 does
not wake up the oscillator.
WKEN3 3 R/W 1 Input INT2 can wake up the oscillator when the OSCPWRDN bit in
PLLCSR is asserted to logic 1.
WKEN3 = 0: Wake-up enabled. A low-to-high transition on INT2
wakes up the oscillator and clears the OSCPWRDN bit.
WKEN3 = 1: Wake-up disabled. A low-to-high transition on INT2 does
not wake up the oscillator.
WKEN2 2 R/W 1 Input INT1 can wake up the oscillator when the OSCPWRDN bit in
PLLCSR is asserted to logic 1.
WKEN2 = 0: Wake-up enabled. A low-to-high transition on INT1
wakes up the oscillator and clears the OSCPWRDN bit.
WKEN2 = 1: Wake-up disabled. A low-to-high transition on INT1 does
not wake up the oscillator.
WKEN1 1 R/W 1 Input INT0 can wake up the oscillator when the OSCPWRDN bit in
PLLCSR is asserted to logic 1.
WKEN1 = 0: Wake-up enabled. A low-to-high transition on INT0
wakes up the oscillator and clears the OSCPWRDN bit.
WKEN1 = 1: Wake-up disabled. A low-to-high transition on INT0
does not wake up the oscillator.
WKEN0 0 R/W 1 Input NMI can wake up the oscillator when the OSCPWRDN bit in
PLLCSR is asserted to logic 1.
WKEN0 = 0: Wake-up enabled. A low-to-high transition on NMI
wakes up the oscillator and clears the OSCPWRDN bit.
WKEN0 = 1: Wake-up disabled. A low-to-high transition on NMI
does not wake up the oscillator.
{'5 TEXAS INSTRUMENTS
Functional Overview
74 December 2002 − Revised November 2008SPRS206K
3.9.5.9 CLKOUT3 Select Register (CK3SEL)
This register controls which clock is output onto the CLKOUT3 so that it may be used to test and debug
the PLL (in addition to its normal function of being a direct input clock divider). Modes other than
CK3SEL = 1011 are intended for debug use only and should not be used during normal operation.
15 8
Reserved
R, 00000000
7430
Reserved CK3SEL
R, 0000 R/W, 1011
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−23. CLKOUT3 Select Register Layout (0x1C82)
Table 3−20. CLKOUT3 Select Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15:4 R 000000000000 Reserved. Reads return 0. Writes have no effect.
CK3SEL 3:0 R/W 1011 Output on CLK3SEL pin
CK3SEL = 1001 CLKOUT3 becomes point A in Figure 3−14
CK3SEL = 1010 CLKOUT3 becomes point B in Figure 3−14
CK3SEL = 0000−0111 CLKOUT3 becomes oscillator divider output
in Figure 3−14
CK3SEL = 1011 CLKOUT3 becomes point C in Figure 3−14
CK3SEL = Other Not supported
The different options for the CLKOUT3 signal are intended for test purposes; it is recommended that the CK3SEL bits of the CK3SEL register
be kept at their default value of ‘1011b’ during normal operation.
3.9.5.10 CLKOUT Selection Register (CLKOUTSR)
As described in Section 3.9.2, Clock Groups, the 5501 has different clock groups, each of which can be driven
by a clock that is different from the CPU clock. The CLKOUT Selection Register determines which clock signal
is reflected on the CLKOUT pin.
15 8
Reserved
R, 00000000
73210
Reserved CLKOSEL CLKOUTDIS
R, 00000 R/W, 01 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−24. CLKOUT Selection Register Layout (0x8400)
{9 TEXAS INSTRUMENTS
Functional Overview
75
December 2002 − Revised November 2008 SPRS206K
Table 3−21. CLKOUT Selection Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−3 R 0000000000000 Reserved
CLKOSEL 2:1 R/W 01 CLKOUT source-select
CLKOSEL = 00: Reserved
CLKOSEL = 01: CLKOUT source is SYSCLK1
CLKOSEL = 10: CLKOUT source is SYSCLK2
CLKOSEL = 11: CLKOUT source is SYSCLK3
CLKOUTDIS 0 R/W 0 Disable CLKOUT
CLKOUTDIS = 0: CLKOUT enabled
CLKOUTDIS = 1: CLKOUT disabled (driving 0)
3.9.5.11 Clock Mode Control Register (CLKMD)
15 8
Reserved
R, 00000000
710
Reserved CLKMD0
R, 0000000 R/W, GPIO4
state at reset
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−25. Clock Mode Control Register Layout (0x8C00)
Table 3−22. Clock Mode Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−1 R 000000000000000 Reserved
CLKMD0 0 R/W GPIO4 state at reset Clock output source-select
CLKMD0 = 0: OSCOUT is selected as clock input source
CLKMD0 = 1: X2/CLKIN is selected as clock input source
{'5 TEXAS INSTRUMENTS
Functional Overview
76 December 2002 − Revised November 2008SPRS206K
3.9.6 Reset Sequence
When RESET is low, the clock generator is in bypass mode with the input clock set to CLKIN or X2/CLKIN,
dependent upon the state of GPIO4. After the RESET pin transitions from low to high, the following events
will occur in the order listed below.
GPIO6 is sampled on the rising edge of the reset signal. The state of GPIO6 determines the function of
the multiplexed pins of the 5501. (See Section 3.3, Configurable External Ports and Signals, for more
information on pin multiplexing.) The state of GPIO6 during the rising edge of reset determines the value
of the Parallel/Host Port Mux Mode bit of the External Bus Control Register (XBSR).
GPIO4 is sampled on the rising edge of the reset signal to set the state of the CLKMD0 bit of the Clock
Mode Control Register (CLKMD), which in turns, determines the clock source for the DSP. The CLKMD0
bit selects either the internal oscillator output (OSCOUT) or the X2/CLKIN pin as the input clock source
for the DSP. If GPIO4 is low at reset, the CLKMD0 bit will be set to 0 and the internal oscillator and the
external crystal generate the input clock for the DSP. If GPIO4 is high, the CLKMD0 bit will be set to 1 and
the input clock will be taken directly from the X2/CLKIN pin.
After the reset signal transitions from low to high, the DSP will not be taken out of reset immediately.
Instead, an internal counter will count 41032 clock cycles to allow the internal oscillator to stabilize (only
if GPIO4 was low). The internal counter will also add 70 reference clock cycles to allow the reset signal
to propagate through different parts of the device.
After all internal delay cycles have expired, the IACK pin will go low for two CPU clock cycles to indicate
this internal reset signal has been deasserted. The BOOTM[2:0] pins will be sampled and their values will
be stored in the Boot Mode Register (BOOTM_MODE). The value in the BOOTM_MODE register will be
used by the bootloader to determine the boot mode of the DSP.
Program flow will commence after all internal delay cycles have expired.
The 5501 has internal circuitry that will count down 70 reference clock cycles to allow reset signals to
propagate correctly to all parts of the device after reset (RESET pin goes high). Furthermore, the 5501 also
has internal circuitry that will count down 41,032 reference clock cycles to allow the oscillator input to become
stable after waking up from power-down state or reset. If a reset is asserted, program flow will start after all
stabilization periods have expired; this includes the oscillator stabilization period only if GPIO4 is low at reset.
If the oscillator is coming out of power-down mode, program flow will start immediately after the oscillator
stabilization period has completed. Table 3−23 summarizes the number of reference clock cycles needed
before program flow begins.
Table 3−23. Number of Reference Clock Cycles Needed Until Program Flow Begins
CONDITION REFERENCE CLOCK
CYCLES
After Reset
Oscillator Not Used (GPIO4 = 1) 70
After Reset Oscillator Used (GPIO4 = 0) 41,102
After Oscillator Power-Down 41,032
All output (O/Z) and input/output (I/O/Z) pins (except for CLKOUT, ECLKOUT2, and XF) will go into
high-impedance mode during reset and will come out of high-impedance mode when the stabilization periods
have expired. All output (O/Z) and input/output (I/O/Z) pins will retain their value when the device enters a
power-down mode such as IDLE3 mode.
*9 TEXAS INSTRUMENTS
Functional Overview
77
December 2002 − Revised November 2008 SPRS206K
3.10 Idle Control
The Idle function is implemented for low power consumption. The Idle function achieves low power
consumption by gating the clock to unused parts of the chip, and/or setting the clock generator (PLL) and the
internal oscillator to a power-down mode.
3.10.1 Clock Domains
The 5501 provides six clock domains to power-off the main clock to the portions of the device that are not being
used. The six domains are:
CPU Domain
Master Port Domain (includes DMA and HPI modules)
ICACHE
Peripherals Domain
Clock Generator Domain
EMIF Domain
3.10.2 IDLE Procedures
Before entering idle mode (executing the IDLE instruction), the user has first to determine which part of the
system needs to be disabled and then program the Idle Control Register (ICR) accordingly. When the IDLE
instruction is executed, the ICR will be copied into the Idle Status Register (ISTR). The different bits of the ISTR
register will be propagated to disable the chosen domains. Special care has to be taken in programming the
ICR as some IDLE domain combinations are not valid (for example: CPU on and clock generator off).
3.10.2.1 CPU Domain Idle Procedure
The 5501 CPU can be idled by executing the following procedure.
1. Write ‘1’ to the CPUI bit (bit 0 of ICR).
2. Execute the IDLE instruction.
3. CPU will go to idle state
3.10.2.2 Master Port Domain (DMA/HPI) Idle Procedure
The clock to the DMA module and/or the HPI module will be stopped when the DMA and/or the HPI bit in the
MICR is set to 1 and the MPIS bit in the ISTR becomes 1. The DMA will go into idle immediately if there is no
data transfer taking place. If there is a data transfer taking place, then it will finish the current transfer and then
go into idle. The HPI will go into idle regardless of whether or not there is a data transfer taking place. Software
must confirm that the HPI has no activity before setting it to idle.
The 5501 DMA module and the HPI module can be disabled by executing the following procedure.
1. Write ‘1’ to the DMA bit and/or the HPI bit in MICR.
2. Write ‘1’ to the MPI bit in ICR.
3. Execute the IDLE instruction.
4. DMA and/or HPI go/goes to idle.
*9 TEXAS INSTRUMENTS
Functional Overview
78 December 2002 − Revised November 2008SPRS206K
3.10.2.3 Peripheral Modules Idle Procedure
The clock to the modules included in the Peripherals Domain will be stopped when their corresponding bit in
the PICR is set to 1 and the PERIS bit in the ISTR becomes 1. Each module in this domain will go into idle
immediately if it has no activity. If the module being set to idle has activity, it will wait until the activity completes
before going into idle.
Each peripheral module can be idled by executing the following procedure.
1. Write ‘1’ to the corresponding bit in PICR for each peripheral to be idled.
2. Write ‘1’ to the PERI bit in ICR.
3. Execute the IDLE instruction.
4. Every peripheral with its corresponding PICR bit set will go to idle.
3.10.2.4 EMIF Module Idle Procedure
The 5501 EMIF can be idled in one of two ways: through the ICR and through the PICR. The EMIF will go into
idle immediately if there is no data transfer taking place within the DMA. If there is a data transfer taking place,
then the EMIF will wait until the DMA finishes the current transfer and goes into idle before going into idle itself.
Please note that while the EMIF is in idle, the SDRAM refresh function of the EMIF will not be available.
The 5501 EMIF can be idled through the ICR only when the following modules are set to idle: CPU, I-Port,
ICACHE, DMA, and HPI. To place the EMIF in idle using the ICR, execute the following procedure:
1. Write ‘1’ to the DMA and HPI bits in MICR.
2. Write ‘1’ to the CPUI, MPI, ICACHEI, EMIFI, and IPORTI bits in ICR.
3. Execute the IDLE instruction.
4. EMIF and all modules listed in Step 2 will go to idle.
The 5501 EMIF can also be idled through the PICR. To place the EMIF in idle using the PICR, execute the
following procedure:
1. Write a ‘1’ to the EMIF bit in PICR.
2. Write a ‘1’ to the PERI bit in ICR.
3. Execute IDLE instruction.
4. EMIF will go to IDLE.
3.10.2.5 IDLE2 Mode
In IDLE2 mode, all modules except the CLOCK module are set to idle state. To place the 5501 in IDLE2 mode,
perform the following steps.
1. Write a ‘1’ to all peripheral module bits in the PICR.
2. Write a ‘1’ to the HPI and DMA bits in MICR.
3. Write a ‘1’ to all domain bits in the ICR except the CLOCK domain bit (CLKI).
4. Execute the IDLE instruction.
5. All internal clocks will be disabled, the CLOCK module will remain active.
*9 TEXAS INSTRUMENTS
Functional Overview
79
December 2002 − Revised November 2008 SPRS206K
3.10.2.6 IDLE3 Mode
In IDLE3 mode, all modules (including the CLOCK module) are set to idle state. To place the 5501 in IDLE3
mode, perform the following steps:
1. Clear (i.e., set to ‘0’) the PLLEN bit in PLLCSR to place the PLL in bypass mode.
2. Set the PLLPWRDN and PLLRST bits in PLLCSR to ‘1’.
3. Write a ‘1’ to all peripheral module bits in PICR (write 0x3FFF to PICR).
4. Write a ‘1’ to the HPI and DMA bits in MICR (write 0x0003 to MICR).
5. Write a ‘1’ to all domain bits and bit 9 in the ICR (write 0x03FF to ICR).
6. Execute the IDLE instruction.
7. PLL core is set to power-down mode and all internal clocks are disabled.
3.10.2.7 IDLE3 Mode With Internal Oscillator Disabled
In this state, all modules (including the CLOCK module) are set to the idle state and the internal oscillator is
set to the power-down mode. This is the lowest power-consuming state that 5501 can be placed under.
1. Clear (i.e., set to ‘0’) the PLLEN bit in PLLCSR to place the PLL in bypass mode.
2. Set the PLLPWRDN, PLLRST, and OSCPWRDN bits in PLLCSR to ‘1’.
3. Set the WKEN register to specify which event will wake up internal oscillator [e.g., set bit 1 to have
interrupt 0 (INT0) wake up the oscillator].
4. Write a ‘1’ to all peripheral module bits in PICR (write 0x3FFF to PICR).
5. Write a ‘1’ to the HPI and DMA bits in MICR (write 0x0003 to MICR).
6. Write a ‘1’ to all domain bits and bit 9 in the ICR (write 0x03FF to ICR).
7. Execute the IDLE instruction.
8. Internal oscillator is set to power-down mode, PLL core is set to power-down mode, and all internal clocks
are disabled.
Note that the internal oscillator can be awakened through an NMI or external interrupt as long as that event
is specified in the Oscillator Wakeup Control Register and, in the case of an external interrupt, the interrupt
is enabled in the CPU’s Interrupt Enable Register.
Maskable external interrupts must be enabled through IER prior to setting the 5501 to IDLE.
Clock Generator {'5 TEXAS INSTRUMENTS
Functional Overview
80 December 2002 − Revised November 2008SPRS206K
3.10.3 Module Behavior at Entering IDLE State
All transactions must be completed before entering the IDLE state. Table 3−24 lists the behavior of each
module before entering the IDLE state.
Table 3−24. Peripheral Behavior at Entering IDLE State
CLOCK DOMAIN MODULES MODULE BEHAVIOR AT ENTERING IDLE STATE
(ASSUMING THE IDLE CONTROL IS SET)
CPU Enter IDLE after CPU stops pipeline.
CPU
Interrupt Controller Enter IDLE after CPU stops.
CPU IDLE Controller Enter IDLE after CPU stops.
PLL Controller Enter IDLE after CPU stops.
Master Port DMA
Enter IDLE state after current DMA transfer to internal memory, EMIF, or
peripheral, or enter IDLE state immediately if no transfer exists.
DMA has function of Auto-wakeup/Idle with McBSP data transfer during
IDLE.
HPI Enter IDLE state immediately. Software has to take care of HPI activity.
ICACHE ICACHE Enter IDLE state after current data transfer from EMIF or program fetch from
CPU finishes, or enter IDLE state immediately if no transfer and no access
exist.
External Bus Selection Register Enter IDLE after CPU stops.
Timer Signal Selection Register Enter IDLE after CPU stops.
CLKOUT Selection Register Enter IDLE after CPU stops.
External Bus Control Register Enter IDLE after CPU stops.
Clock Mode Control Register Enter IDLE after CPU stops.
Timer0/1 and WDT Enter IDLE state immediately
DSP/BIOS Timer Enter IDLE state immediately
Peripheral McBSP0/1
External Clock and Frame:
Enter IDLE state after current McBSP activity is finished or enter IDLE state
immediately if no activity exists. McBSP has function of Auto-wakeup/Idle
with DMA transfer during IDLE.
Internal Clock and Frame:
Enter IDLE state immediately if both transmitter and receiver are in reset
(XRST = 0 and RRST = 0). IDLE state not entered otherwise.
GPIO Enter IDLE state immediately.
I2C Enter IDLE state after current I2C activity is finished or enter IDLE state
immediately if no activity exists.
UART Enter IDLE state after current UART activity is finished or enter IDLE state
immediately if no activity exists.
Parallel GPIO Enter IDLE state immediately.
PLL divider Enter IDLE state immediately.
Clock Generator PLL core Power-down state if set by software before IDLE
Clock Generator
Oscillator Power-down state if set by software before IDLE
EMIF EMIF Enter IDLE mode after current DMA transfer or enter IDLE mode
immediately if no activity exists.
*9 TEXAS INSTRUMENTS
Functional Overview
81
December 2002 − Revised November 2008 SPRS206K
3.10.4 Wake-Up Procedures
It is the user’s responsibility to ensure that there exists a valid wake-up procedure before entering idle mode.
Keep in mind that a hardware reset will restore all modules to their active state. All wake-up procedures are
described in the next sections.
3.10.4.1 CPU Domain Wake-up Procedure
The CPU domain can be taken out of idle though an enabled external interrupt or an NMI signal. External
interrupts can be enabled through the use of the IER0 and IER1 registers. Other modules, such as the EMIF
module, will be taken out of idle automatically when the CPU wakes up. Please see the wake-up procedures
for other modules for more information.
3.10.4.2 Master Port Domain (DMA/HPI) Wake-up Procedure
The 5501 DMA module and the HPI module can be taken out of idle simultaneously by executing the following
procedure.
1. Write ‘0’ to the MPI bit in ICR.
2. Execute the IDLE instruction.
3. DMA and HPI wake up.
It is also possible to wake up the DMA and HPI modules individually through the use of the Master Idle Control
Register. To wake up only the DMA or the HPI module, perform the following steps:
1. Write ‘0’ to the DMA bit or the HPI bit in MICR.
2. Selected module wakes up.
3.10.4.3 Peripheral Modules Wake-up Procedure
All 5501 peripherals can be taken out of idle simultaneously by executing the following procedure.
1. Write ‘0’ to the PERI bit in ICR.
2. Execute the IDLE instruction.
3. All idled peripherals wake up.
It is also possible to wake up individual peripherals through the use of the Peripheral Idle Control Register by
executing the following procedure.
1. Write ‘0’ to the idle control bit of peripheral(s) in PICR.
2. Idled peripherals with ‘0’ in PICR wake up.
*9 TEXAS INSTRUMENTS
Functional Overview
82 December 2002 − Revised November 2008SPRS206K
3.10.4.4 EMIF Module Wake-up Procedure
If both the CPU and the EMIF are in idle, then the EMIF will come out of idle when the CPU is taken out of
idle. The CPU can be taken out of idle through the use of an NMI or an enabled external interrupt. External
interrupts can be enabled through the IER0 and IER1 registers.
If the CPU is not in idle, then the EMIF can be taken out of idle through either of the following two procedures:
1. Write ‘0’ to the PERI bit in ICR.
2. Execute the IDLE instruction.
3. All idled peripherals, including the EMIF, wake up.
Or:
1. Write ‘0’ to the EMIF bit in PICR.
2. The EMIF module will wake up.
3.10.4.5 IDLE2 Mode Wake-up Procedure
The 5501 can be taken completely out of IDLE2 mode by executing the following procedure.
1. CPU wakes up from idle through NMI or enabled external interrupt.
2. Write ‘0’ to all bits in the ICR.
3. Execute the IDLE instruction.
4. All internal clocks are enabled and all modules come out of idle.
3.10.4.6 IDLE3 Mode Wake-up Procedure
The 5501 can be taken completely out of IDLE3 mode by executing the following procedure.
1. CPU wakes up from idle through NMI or enabled external interrupt.
2. Write ‘0’ to all bits in the ICR.
3. Execute the IDLE instruction.
4. All internal clocks are enabled and all modules come out of idle.
5. Write ‘0’ to the PLLPWRDN and PLLRST bits in PLLCSR.
6. Wait for the PLL to relock by polling the LOCK bit or by setting up a LOCK interrupt.
7. Set the PLLEN bit in PLLCSR to ‘1’.
8. All internal clocks will now come from the PLL core.
NOTE: Step 3 can be modified to only wake up certain modules, see previous sections for
more information on the wake-up procedures for the 5501 modules.
{9 TEXAS INSTRUMENTS
Functional Overview
83
December 2002 − Revised November 2008 SPRS206K
3.10.4.7 IDLE3 Mode With Internal Oscillator Disabled Wake-up Procedure
The internal oscillator of the 5501 will be woken up along with the CLOCK module through an NMI or an
enabled external interrupt. The source (INT0, INT1, INT2, INT3, or NMI) for the wake-up signal can be selected
through the use of the WKEN register. The maskable external interrupts must be enabled through IER0 and
IER1 prior to setting the 5501 to Idle 3 mode.
The 5501 has internal circuitry that will count down a predetermined number of clock cycles (41,032 reference
clock cycles) to allow the oscillator input to become stable after waking up from power-down state or reset.
When waking up from idle mode, program flow will start after the stabilization period of the oscillator has
expired (41032 reference clock cycles).
To take the 5501 (including the internal oscillator) out of the idle 3 state, execute the following procedure:
1. External interrupt or NMI occurs (as specified in the WKEN register) and program flow begins after
41,032 reference clock cycles.
2. CPU wakes up.
3. Write ‘0’ to all bits in the ICR.
4. Execute the IDLE instruction.
5. All internal clocks are enabled and all modules come out of idle.
6. Write ‘0’ to the PLLPWRDN, PLLRST, and OSCPWRDN bits in PLLCSR.
7. Wait for the PLL to relock by polling the LOCK bit or by setting up a LOCK interrupt.
8. Set the PLLEN bit in PLLCSR to ‘1’.
9. All internal clocks will now come from the PLL core.
NOTE: Step 2 can be modified to only wake up certain modules, see previous sections for
more information on the wake-up procedures for the 5501 modules.
3.10.4.8 Summary of Wake-up Procedures
Table 3−25 summarizes the wake-up procedures.
Table 3−25. Wake-Up Procedures
ISTR
VALUE CLOCK DOMAIN
STATUS EXIT FROM IDLE ICR
AFTER
WAKE-UP
ISTR
AFTER
WAKE-UP
xxx0xxx0 CPU − ON
Clock Generator − ON
Other − ON/OFF
1. DSP software modifies ICR
and executes “IDLE”
instruction
2. Reset
1. Modified value
2. All “0”
1. Updated to ICR modified
value after “IDLE”
instruction
2. All “0”
xxx0xxx1 CPU − OFF
Clock Generator − ON
Other − ON/OFF
1. Unmasked interrupt from
external or on-chip module
2. Reset
1. Not modified
2. All “0”
1. CPUIS, CLKIS, and
EMIFIS/XPORTIS/IPORTIS
are set to “0”
2. All “0”
xxx11111 CPU − OFF
Clock Generator − OFF
Other − OFF
1. Unmasked interrupt from
external
2. Reset
1. Not modified
2. All “0”
1. CPUIS, CLKIS, and
EMIFIS/XPORTIS/IPORTIS
are set to “0”
2. All “0”
{'5 TEXAS INSTRUMENTS
Functional Overview
84 December 2002 − Revised November 2008SPRS206K
3.10.5 Auto-Wakeup/Idle Function for McBSP and DMA
The 5501 has an Auto-wakeup/Idle function for McBSP to DMA to on-chip memory data transfers when the
DMA and the McBSP are both set to IDLE. In the case that the McBSP is set to external clock mode and the
McBSP and the DMA are set to idle, the McBSP and the DMA can wake up from IDLE state automatically if
the McBSP gets a new data transfer. The McBSP and the DMA enter the idle state automatically after data
transfer is complete. [The clock generator (PLL) should be active and the PLL core should not be in
power-down mode for the Auto-wakeup/Idle function to work.]
3.10.6 Clock State of Multiplexed Modules
The clock to the EMIF module is disabled automatically when this module is not selected through the External
Bus Selection Register (XBSR). Note that any accesses to disabled modules will result in a bus error.
3.10.7 IDLE Control and Status Registers
The clock domains are controlled by the IDLE Configuration Register (ICR) that allows the user to place
different parts of the device in Idle mode. The IDLE Status Register (ISTR) reflects the portion of the device
that remains active. The peripheral domain is controlled by the Peripheral IDLE Control Register (PICR). The
Peripheral IDLE Status Register (PISTR) reflects the portion of the peripherals that are in the IDLE state. The
Master IDLE Control Register (MICR) is used to place the HPI and DMA in Idle mode. The IDLE state of the
HPI and DMA is reflected by the Master IDLE Status Register (MISR). The PLL Control/Status Register
(PLLCSR) is used to power down the PLL core when the IDLE instruction is executed.
The settings in the ICR, PICR, and MICR take effect after the IDLE instruction is executed. For example, writing
xxx000001b into the ICR does not indicate that the CPU domain is in IDLE mode; rather, it indicates that after
the IDLE instruction, the CPU domain will be in IDLE mode. Procedures for placing portions of the device in
Idle mode and taking them out of Idle mode are described in Section 3.10.2 (IDLE Procedures) and
Section 3.10.4 (Wake-Up Procedures), respectively.
Table 3−26. Clock Domain Memory-Mapped Registers
ADDRESS REGISTER NAME
0x0001 IDLE Configuration Register (ICR)
0x0002 IDLE Status Register (ISTR)
0x9400 Peripheral IDLE Control Register (PICR)
0x9401 Peripheral IDLE Status Register (PISTR)
0x9402 Master IDLE Control Register (MICR)
0x9403 Master IDLE Status Register (MISR)
{9 TEXAS INSTRUMENTS
Functional Overview
85
December 2002 − Revised November 2008 SPRS206K
3.10.7.1 IDLE Configuration Register (ICR)
15 10 9 8
Reserved CLKEIIPORTI
R, 000000 R/W, 0 R/W, 0
76543210
MPORTI XPORTI EMIFI CLKI PERI ICACHEI MPI CPUI
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
This bit must be set to ‘1’ when placing the clock generator in idle; otherwise, a bus error interrupt will be generated.
Figure 3−26. IDLE Configuration Register Layout (0x0001)
Table 3−27. IDLE Configuration Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−10 R 000000 Reserved
CLKEI 9 R/W 0 Extended device clock generator idle control bit. The CLKEI bit must be set
to 1 along with the CLKI bit in order to properly place the device clock
generator in idle.
CLKI CLKEI
0 0 Device clock generator module remains active after
execution of an IDLE instruction.
1 1 Device clock generator is disabled after execution of
an IDLE instruction.
Any other combination of CLKI and CLKEI is not valid. Setting CLKI to 1 and
executing the IDLE instruction will generate a bus error interrupt if CLKEI is not
set to 1.
Disabling the clock generator provides the lowest level of power reduction by
stopping the system clock. Whenever the clock generator is idled, the CLKEI,
CPUI, MPI, ICACHEI, EMIFI, XPORTI, MPORTI, and IPORTI bits must be set
to 1 in order to ensure a proper power-down mode. A bus error interrupt will be
generated if the idle instruction is executed when CLKI = 1 and any of these
bits are not set to 1.
IPORTI 8 R/W 0 IPORT idle control bit. The IPORT is used for all ICACHE transactions.
IPORTI = 0: IPORT remains active after execution of an IDLE instruction
IPORTI = 1: IPORT is disabled after execution of an IDLE instruction
MPORTI 7 R/W 0 MPORT idle control bit. The MPORT is used for all DMA and HPI transactions.
MPORTI = 0: MPORT remains active after execution of an IDLE instruction
MPORTI = 1: MPORT is disabled after execution of an IDLE instruction
XPORTI 6 R/W 0 XPORT idle control bit. The XPORT is used for all I/O memory transactions.
XPORTI = 0: XPORT remains active after execution of an IDLE instruction
XPORTI = 1: XPORT is disabled after execution of an IDLE instruction
EMIFI 5 R/W 0 External Memory Interface (EMIF) idle control bit
EMIFI = 0: EMIF module remains active after execution of an
IDLE instruction
EMIFI = 1: EMIF module is disabled after execution of an IDLE
instruction
{'5 TEXAS INSTRUMENTS
Functional Overview
86 December 2002 − Revised November 2008SPRS206K
Table 3−27. IDLE Configuration Register Bit Field Description (Continued)
BIT NAME DESCRIPTIONRESET VALUEACCESSBIT NO.
CLKI 4 R/W 0 Device clock generator idle control bit. The CLKEI bit must be set to 1 along
with the CLKI bit in order to properly place the device clock generator in idle.
CLKI CLKEI
0 0 Device clock generator module remains active after
execution of an IDLE instruction.
1 1 Device clock generator is disabled after execution of
an IDLE instruction.
Any other combination of CLKI and CLKEI is not valid. Setting CLKI to 1 and
executing the IDLE instruction will generate a bus error interrupt if CLKEI is not
set to 1.
Disabling the clock generator provides the lowest level of power reduction by
stopping the system clock. Whenever the clock generator is idled, the CLKEI,
CPUI, MPI, ICACHEI, EMIFI, XPORTI, MPORTI, and IPORTI bits must be set
to 1 in order to ensure a proper power-down mode. A bus error interrupt will be
generated if the idle instruction is executed when CLKI = 1 and any of these
bits are not set to 1.
PERI 3 R/W 0 Peripheral Idle control bit
PERI = 0: All peripheral modules become/remain active after
execution of an IDLE instruction
PERI = 1: All peripheral modules with 1 in PICR are disabled after
execution of an IDLE instruction
ICACHEI 2 R/W 0 ICACHE idle control bit
ICACHEI = 0: ICACHE module remains active after execution of an
IDLE instruction
ICACHEI = 1: ICACHE module is disabled after execution of an IDLE
instruction
MPI 1 R/W 0 Master peripheral (DMA and HPI) idle control bit
MPI = 0: DMA and HPI modules remain active after execution of
an IDLE instruction
MPI = 1: DMA and HPI modules are disabled after execution of
an IDLE instruction
CPUI 0 R/W 0 CPU idle control bit
CPUI = 0: CPU module remains active after execution of an IDLE
instruction
CPUI = 1: CPU module is disabled after execution of an IDLE instruction
{9 TEXAS INSTRUMENTS
Functional Overview
87
December 2002 − Revised November 2008 SPRS206K
3.10.7.2 IDLE Status Register (ISTR)
15 9 8
Reserved IPORTIS
R, 0000000 R, 0
76543210
MPORTIS XPORTIS EMIFIS CLKIS PERIS ICACHEIS MPIS CPUIS
R, 0 R, 0 R, 0 R, 0 R, 0 R, 0 R, 0 R, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−27. IDLE Status Register Layout (0x0002)
Table 3−28. IDLE Status Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−9 R 0000000 Reserved
IPORTIS 8 R 0 IPORT idle status bit. The IPORT is used for all ICACHE transactions.
IPORTIS = 0: IPORT is active
IPORTIS = 1: IPORT is disabled
MPORTIS 7 R 0 MPORT idle status bit. The MPORT is used for all DMA and HPI
transactions.
MPORTIS = 0: MPORT is active
MPORTIS = 1: MPORT is disabled
XPORTIS 6 R 0 XPORT idle status bit. The XPORT is used for all I/O memory transactions.
XPORTIS = 0: XPORT is active
XPORTIS = 1: XPORT is disabled
EMIFIS 5 R 0 External Memory Interface (EMIF) idle status bit
EMIFIS = 0: EMIF module is active
EMIFIS = 1: EMIF module is disabled
CLKIS 4 R 0 Device clock generator idle status bit
CLKIS = 0: Device clock generator module is active
CLKIS = 1: Device clock generator is disabled
PERIS 3 R 0 Peripheral idle status bit
PERIS = 0: All peripheral modules are active
PERIS = 1: All peripheral modules are disabled
ICACHEIS 2 R 0 ICACHE idle status bit
ICACHEIS = 0: ICACHE module is active
ICACHEIS = 1: ICACHE module is disabled
MPIS 1 R 0 DMA and HPI idle status bit
MPIS = 0: DMA and HPI modules are active
MPIS = 1: DMA and HPI modules are disabled
CPUIS 0 R 0 CPU idle status bit
CPUIS = 0: CPU module is active
CPUIS = 1: CPU module is disabled
{'5 TEXAS INSTRUMENTS
Functional Overview
88 December 2002 − Revised November 2008SPRS206K
3.10.7.3 Peripheral IDLE Control Register (PICR)
15 14 13 12 11 10 9 8
Reserved MISC EMIF BIOST WDT PIO URT
R, 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
7654 3 2 1 0
I2C ID IO Reserved SP1 SP0 TIM1 TIM0
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−28. Peripheral IDLE Control Register Layout (0x9400)
Table 3−29. Peripheral IDLE Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−14 R 00 Reserved
MISC 13R/W 0 MISC bit
MISC = 0: Miscellaneous modules remain active when
ISTR.PERIS = 1 and IDLE instruction is executed.
MISC = 1: MIscellaneous module is disabled when
ISTR.PERIS = 1 and IDLE instruction is executed.
Miscellaneous modules include the XBSR, TIMEOUT Error Register,
XBCR, Timer Signal Selection Register, CLKOUT Select Register,
and Clock Mode Control Register.
EMIF 12R/W 0 EMIF bit
EMIF = 0: EMIF module remains active when ISTR.PERIS = 1
and IDLE instruction is executed.
EMIF = 1: EMIF module is disabled when ISTR.PERIS = 1 and
IDLE instruction is executed.
BIOST 11R/W 0 BIOS timer bit
BIOST = 0: DSP/BIOS timer remains active when ISTR.PERIS = 1
and the IDLE instruction is executed.
BIOST = 1: DSP/BIOS timer is disabled when ISTR.PERIS = 1 and
the IDLE instruction is executed.
WDT 10R/W 0 Watchdog timer bit
WDT = 0: WDT remains active when ISTR.PERIS = 1
and the IDLE instruction is executed.
WDT = 1: WDT is disabled when ISTR.PERIS = 1 and
the IDLE instruction is executed.
PIO 9R/W 0 Parallel GPIO bit
PIO = 0: Parallel GPIO remains active when ISTR.PERIS = 1
(ISTR.[3]) and the IDLE instruction is executed.
PIO = 1: Parallel GPIO is disabled when ISTR.PERIS = 1 and
the IDLE instruction is executed.
If the peripheral is already in IDLE, setting PERI (bit 3 of ICR) to 0 and executing the IDLE instruction will wake up all peripherals, and PICR bit
settings will be ignored. If PERIS (bit 3 of ISTR) = 1, executing the IDLE instruction will wake up the peripheral if its PICR bit is 0.
{9 TEXAS INSTRUMENTS
Functional Overview
89
December 2002 − Revised November 2008 SPRS206K
Table 3−29. Peripheral IDLE Control Register Bit Field Description (Continued)
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
URT 8R/W 0 UART bit
URT = 0: UART remains active when ISTR.PERIS = 1 and
the IDLE instruction is executed.
URT = 1: UART is disabled when ISTR.PERIS = 1 and the IDLE
instruction is executed.
I2C 7R/W 0 I2C bit
I2C = 0: I2C remains active when ISTR.PERIS = 1 and
the IDLE instruction is executed.
I2C = 1: I2C is disabled when ISTR.PERIS = 1 and the IDLE
instruction is executed.
ID 6R/W 0 ID bit
ID = 0: ID remains active when ISTR.PERIS = 1 and the
IDLE instruction is executed.
ID = 1: ID is disabled when ISTR.PERIS = 1 and the IDLE
instruction is executed.
IO 5R/W 0 IO bit
IO = 0: GPIO remains active when ISTR.PERIS = 1 and
the IDLE instruction is executed.
IO = 1: GPIO is disabled when ISTR.PERIS = 1 and the IDLE
instruction is executed.
Reserved 4 R/W 0 Reserved
SP1 3R/W 0 McBSP1 bit
SP1 = 0: McBSP1 remains active when ISTR.PERIS = 1
and the IDLE instruction is executed.
SP1 = 1: McBSP1 is disabled when ISTR.PERIS = 1 and the
IDLE instruction is executed.
SP0 2R/W 0 McBSP0 bit
SP0 = 0: McBSP0 remains active when ISTR.PERIS = 1
and the IDLE instruction is executed.
SP0 = 1: McBSP0 is disabled when ISTR.PERIS = 1 and the
IDLE instruction is executed.
TIM1 1R/W 0 TIMER1 bit
TIM1 = 0: TIMER1 remains active when ISTR.PERIS = 1
and the IDLE instruction is executed.
TIM1 = 1: TIMER1 is disabled when ISTR.PERIS = 1 and the
IDLE instruction is executed.
TIM0 0R/W 0 TIMER0 bit
TIM0 = 0: TIMER0 remains active when ISTR.PERIS = 1
and the IDLE instruction is executed.
TIM0 = 1: TIMER0 is disabled when ISTR.PERIS = 1 and the
IDLE instruction is executed.
If the peripheral is already in IDLE, setting PERI (bit 3 of ICR) to 0 and executing the IDLE instruction will wake up all peripherals, and PICR bit
settings will be ignored. If PERIS (bit 3 of ISTR) = 1, executing the IDLE instruction will wake up the peripheral if its PICR bit is 0.
{'5 TEXAS INSTRUMENTS
Functional Overview
90 December 2002 − Revised November 2008SPRS206K
3.10.7.4 Peripheral IDLE Status Register (PISTR)
15 14 13 12 11 10 9 8
Reserved MISC EMIF BIOST WDT PIO URT
R, 00 R, 0 R, 0 R, 0 R, 0 R, 0 R, 0
7 6 5 4 3 2 1 0
I2C ID IO Reserved SP1 SP0 TIM1 TIM0
R, 0 R, 0 R, 0 R, 0 R, 0 R, 0 R, 0 R, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−29. Peripheral IDLE Status Register Layout (0x9401)
Table 3−30. Peripheral IDLE Status Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−14 R 00 Reserved
MISC 13 R 0 MISC bit
MISC = 0: Miscellaneous modules are active
MISC = 1: Miscellaneous modules are disabled
Miscellaneous modules include the XBSR, TIMEOUT Error Register,
XBCR, Timer Signal Selection Register, CLKOUT Select Register,
and Clock Mode Control Register.
EMIF 12 R 0 EMIF bit
EMIF = 0: EMIF module is active
EMIF = 1: EMIF module is disabled
BIOST 11 R 0 BIOS timer bit
BIOST = 0: DSP/BIOS timer is active
BIOST = 1: DSP/BIOS timer is disabled
WDT 10 R 0 Watchdog timer bit
WDT = 0: WDT is active
WDT = 1: WDT is disabled
PIO 9 R 0 Parallel GPIO bit
PIO = 0: Parallel GPIO is active
PIO = 1: Parallel GPIO is disabled
URT 8 R 0 UART bit
URT = 0: UART is active
URT = 1: UART is disabled
I2C 7 R 0 I2C bit
I2C = 0: I2C is active
I2C = 1: I2C is disabled
ID 6 R 0 ID bit
ID = 0: ID is active
ID = 1: ID is disabled
IO 5 R 0 IO bit
IO = 0: GPIO is active
IO = 1: GPIO is disabled
{9 TEXAS INSTRUMENTS
Functional Overview
91
December 2002 − Revised November 2008 SPRS206K
Table 3−30. Peripheral IDLE Status Register Bit Field Description (Continued)
BIT NAME DESCRIPTIONRESET VALUEACCESSBIT NO.
Reserved 4 R 0 Reserved
SP1 3 R 0 McBSP1 bit
SP1 = 0: McBSP1 is active
SP1 = 1: McBSP1 is disabled
SP0 2 R 0 McBSP0 bit
SP0 = 0: McBSP0 is active
SP0 = 1: McBSP0 is disabled
TIM1 1 R 0 TIMER1 bit
TIM1 = 0: TIMER1 is active
TIM1 = 1: TIMER1 is disabled
TIM0 0 R 0 TIMER0 bit
TIM0 = 0: TIMER0 is active
TIM0 = 1: TIMER0 is disabled
3.10.7.5 Master IDLE Control Register (MICR)
15 8
Reserved
R, 00000000
7210
Reserved HPI DMA
R, 000000 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−30. Master IDLE Control Register Layout (0x9402)
Table 3−31. Master IDLE Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−2 R 00000000000000 Reserved
HPI 1 R/W 0 HPI bit
HPI = 0: HPI remains active when ISTR.MPIS becomes 1
HPI = 1: HPI is disabled when ISTR.MPIS becomes 1
DMA 0 R/W 0 DMA bit
DMA = 0: DMA remains active when ISTR.MPIS becomes 1
DMA = 1: DMA is disabled when ISTR.MPIS becomes 1
{'5 TEXAS INSTRUMENTS
Functional Overview
92 December 2002 − Revised November 2008SPRS206K
3.10.7.6 Master IDLE Status Register (MISR)
15 8
Reserved
R, 00000000
7210
Reserved HPI DMA
R, 000000 R, 0 R, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−31. Master IDLE Status Register Layout (0x9403)
Table 3−32. Master IDLE Status Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−2 R 00000000000000 Reserved
HPI 1 R 0 HPI bit
HPI = 0: HPI is active
HPI = 1: HPI is in IDLE status
DMA 0 R 0 DMA bit
DMA = 0: DMA is active
DMA = 1: DMA is in IDLE status
3.11 General-Purpose I/O (GPIO)
The 5501 includes an 8-bit I/O port solely for general-purpose input and output. Several dual-purpose
(multiplexed) pins complement the dedicated GPIO pins. The following sections describe the 8-bit GPIO port
as well as the dual GPIO functions of the Parallel Port Mux and Host Port Mux pins.
3.11.1 General-Purpose I/O Port
The general-purpose I/O port consists of eight individually bit-selectable I/O pins GPIO0 (LSB) through GPIO7
(MSB). The I/O port is controlled using two registers—IODIR and IODATA—that can be accessed by the CPU
or by the DMA, via the peripheral bus controller. The General-Purpose I/O Direction Register (IODIR) is
mapped at address 0x3400, and the General-Purpose I/O Data Register (IODATA) is mapped at address
0x3401.
Figure 3−32 and Figure 3−33 show the bit layout of IODIR and IODATA, respectively. Table 3−33 and
Table 3−34 describe the bit fields of these registers.
{9 TEXAS INSTRUMENTS
Functional Overview
93
December 2002 − Revised November 2008 SPRS206K
3.11.1.1 General-Purpose I/O Direction Register (IODIR)
15 8
Reserved
R, 00000000
76543210
IO7DIR IO6DIR IO5DIR IO4DIR IO3DIR IO2DIR IO1DIR IO0DIR
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−32. GPIO Direction Register Layout (0x3400)
Table 3−33. GPIO Direction Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−8 R 00000000 Reserved
IOxDIR 7−0 R/W 00000000 Data direction bits that configure the GPIO pins as inputs or outputs.
IOxDIR = 0: Configure corresponding GPIO pin as an input
IOxDIR = 1: Configure corresponding GPIO pin as an output
x = value from 0 to 7
3.11.1.2 General-Purpose I/O Data Register (IODATA)
15 8
Reserved
R, 00000000
76543210
IO7D IO6D IO5D IO4D IO3D IO2D IO1D IO0D
R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
LEGEND: R = Read, W = Write, n = value at reset, pin = the reset value depends on the signal level on the corresponding I/O pin.
Figure 3−33. GPIO Data Register Layout (0x3401)
Table 3−34. GPIO Data Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−8 R 00000000 Reserved
IOxD 7−0 R/W Depends on the signal level on
the corresponding I/O pin Data bits that are used to control the level of the I/O
pins configured as outputs and to monitor the level of
the I/O pins configured as inputs.
If IOxDIR = 0, then:
IOxD = 0: Corresponding GPIO pin is read as a low
IOxD = 1: Corresponding GPIO pin is read as a
high
If IOxDIR = 1, then:
IOxD = 0: Set corresponding GPIO pin to low
IOxD = 1: Set corresponding GPIO pin to high
x = value from 0 to 7
{'5 TEXAS INSTRUMENTS
Functional Overview
94 December 2002 − Revised November 2008SPRS206K
3.11.2 Parallel Port General-Purpose I/O (PGPIO)
Four address pins (A[21:18]), 16 data pins (D[31:16]), 16 control signals (C[15:0]), 8 host data pins (HD[7:0]),
and 2 HPI control pins (HC0, HC1) can be individually enabled as PGPIO when the Parallel/Host Port Mux
Mode bit field of the External Bus Selection Register (XBSR) is cleared for PGPIO mode (see Table 3−35).
These pins are controlled by three sets of registers: the PGPIO enable registers, the PGPIO direction
registers, and the PGPIO data registers.
The PGPIO enable registers PGPIOEN0−PGPIOEN2 (see Figure 3−34, Figure 3−37, and Figure 3−40)
determine if the output function of the PGPIO pins is enabled or disabled.
The PGPIO direction registers PGPIODIR0−PGPIODIR2 (see Figure 3−35, Figure 3−38, and
Figure 3−41) determine if corresponding bits in the PGPIO data registers specify an output value or an
input value.
The PGPIO data registers PGPIODAT0−PGPIODAT2 (see Figure 3−36, Figure 3−39, and Figure 3−42)
store the value read or written externally.
To use a PGPIO pin as an output, its corresponding bit must be set to 1 in both the enable and direction
registers. The state of the pin is then controlled through its bit in the data register. Conversely, to use a PGPIO
pin as an input, its corresponding bit must be cleared to 0 in both the enable and the direction registers. The
state of the pin can then be read from its bit in the data register.
NOTE: The enable registers PGPIOENn cannot override the External Bus Selection Register
(XBSR) setting.
Table 3−35. TMS320VC5501 PGPIO Cross-Reference
PIN PARALLEL/HOST PORT MUX MODE = 0
(PGPIO) PARALLEL/HOST PORT MUX MODE = 1
(FULL EMIF)
EMIF Address Bus
A[21:18] PGPIO[3:0] EMIF.A[21:18]
EMIF Data Bus
D[31:16] PGPIO[19:4] EMIF.D[31:16]
EMIF Control Bus
C0 PGPIO20 EMIF.ARE/SADS/SDCAS/SRE
C1 PGPIO21 EMIF.AOE/SOE/SDRAS
C2 PGPIO22 EMIF.AWE/SWE/SDWE
C3 PGPIO23 EMIF.ARDY
C4 PGPIO24 EMIF.CE0
C5 PGPIO25 EMIF.CE1
C6 PGPIO26 EMIF.CE2
C7 PGPIO27 EMIF.CE3
C8 PGPIO28 EMIF.BE0
C9 PGPIO29 EMIF.BE1
C10 PGPIO30 EMIF.BE2
C11 PGPIO31 EMIF.BE3
C12 PGPIO32 EMIF.SDCKE
C13 PGPIO33 EMIF.SOE3
C14 PGPIO34 EMIF.HOLD
C15 PGPIO35 EMIF.HOLDA
{9 TEXAS INSTRUMENTS
Functional Overview
95
December 2002 − Revised November 2008 SPRS206K
Table 3−35. TMS320VC5501 PGPIO Cross-Reference (Continued)
PIN PARALLEL/HOST PORT MUX MODE = 1
(FULL EMIF)
PARALLEL/HOST PORT MUX MODE = 0
(PGPIO)
HPI Data Bus
HD[7:0] PGPIO[43:36] HPI.HD[7:0]
HPI Control Bus
HC0 PGPIO44 HPI.HAS
HC1 PGPIO45 HPI.HBIL
3.11.2.1 Parallel GPIO Enable Register 0 (PGPIOEN0)
15 14 13 12 11 10 9 8
IO15EN IO14EN IO13EN IO12EN IO11EN IO10EN IO9EN IO8EN
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
IO7EN IO6EN IO5EN IO4EN IO3EN IO2EN IO1EN IO0EN
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−34. Parallel GPIO Enable Register 0 Layout (0x4400)
Table 3−36. Parallel GPIO Enable Register 0 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IOxEN 15−0 R/W 0000000000000000 Enable or disable output function of the corresponding I/O pins.
See Table 3−35, TMS320VC5501 PGPIO Cross-Reference to deter-
mine which device pins correspond to the PGPIO pins.
IOxEN = 0: Output function of the PGPIOx pin is disabled—i.e., the
pin cannot drive an output signal; it can only be used as
an input. When IOxEN = 0, IOxDIR must also be
cleared to 0.
IOxEN = 1: Output function of the PGPIOx pin is enabled—i.e., the
pin is used to drive an output signal. When IOxEN = 0,
IOxDIR must also be set to 1; otherwise, the output
value is undefined.
x = value from 0 to 15
{'5 TEXAS INSTRUMENTS
Functional Overview
96 December 2002 − Revised November 2008SPRS206K
3.11.2.2 Parallel GPIO Direction Register 0 (PGPIODIR0)
15 14 13 12 11 10 9 8
IO15DIR IO14DIR IO13DIR IO12DIR IO11DIR IO10DIR IO9DIR IO8DIR
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
IO7DIR IO6DIR IO5DIR IO4DIR IO3DIR IO2DIR IO1DIR IO0DIR
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−35. Parallel GPIO Direction Register 0 Layout (0x4401)
Table 3−37. Parallel GPIO Direction Register 0 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IOxDIR 15−0 R/W 0000000000000000 Data direction bits specify if corresponding bits in the data
registers specify an output value or an input value. See
Table 3−35, TMS320VC5501 PGPIO Cross-Reference to deter-
mine which device pins correspond to the PGPIO pins.
IOxDIR = 0: Corresponding bit in the data register specifies
the value read on the PGPIOx pin (input). When
IOxDIR = 0, IOxEN must also be cleared to 0.
IOxDIR = 1: Corresponding bit in the data register specifies
the value driven on the PGPIOx pin (output).
When IOxDIR = 1, IOxEN must also be set to 1.
x = value from 0 to 15
{9 TEXAS INSTRUMENTS
Functional Overview
97
December 2002 − Revised November 2008 SPRS206K
3.11.2.3 Parallel GPIO Data Register 0 (PGPIODAT0)
15 14 13 12 11 10 9 8
IO15DAT IO14DAT IO13DAT IO12DAT IO11DAT IO10DAT IO9DAT IO8DAT
R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
76543210
IO7DAT IO6DAT IO5DAT IO4DAT IO3DAT IO2DAT IO1DAT IO0DAT
R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
LEGEND: R = Read, W = Write, n = value at reset, pin = the reset value depends on the signal level on the corresponding I/O pin.
Figure 3−36. Parallel GPIO Data Register 0 Layout (0x4402)
Table 3−38. Parallel GPIO Data Register 0 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IOxDAT 15−0 R/W Depends on the signal level on
the corresponding I/O pin Data bits that are used to either control the level of the
corresponding I/O pins configured as output pins or to
monitor the level of the corresponding I/O pins configured
as input pins. The function of the data register bits is
determined by the setting of the direction register bits. See
Table 3−35, TMS320VC5501 PGPIO Cross-Reference to
determine which device pins correspond to the PGPIO
pins.
If IOxEN = 0 and IOxDIR = 0, then IOxDAT is used to read
the value of the PGPIOx pin:
IOxDAT = 0: PGPIOx pin is read as a low
IOxDAT = 1: PGPIOx pin is read as a high
If IOxEN = 1 and IOxDIR = 1, then IOxDAT is used to set
the value of the PGPIOx pin:
IOxDAT = 0: Set PGPIOx pin to low
IOxDAT = 1: Set PGPIOx pin to high
Note that other combinations of IOxEN and IOxDIR are
not supported—i.e., IOxEN and IOxDIR must always be
set to the same value.
x = value from 0 to 15
{'5 TEXAS INSTRUMENTS
Functional Overview
98 December 2002 − Revised November 2008SPRS206K
3.11.2.4 Parallel GPIO Enable Register 1 (PGPIOEN1)
15 14 13 12 11 10 9 8
IO31EN IO30EN IO29EN IO28EN IO27EN IO26EN IO25EN IO24EN
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
IO23EN IO22EN IO21EN IO20EN IO19EN IO18EN IO17EN IO16EN
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−37. Parallel GPIO Enable Register 1 Layout (0x4403)
Table 3−39. Parallel GPIO Enable Register 1 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IOxEN 15−0 R/W 0000000000000000 Enable or disable output function of the corresponding I/O pins.
See Table 3−35, TMS320VC5501 PGPIO Cross-Reference to deter-
mine which device pins correspond to the PGPIO pins.
IOxEN = 0: Output function of the PGPIOx pin is disabled—i.e.,
the pin cannot drive an output signal; it can only be
used as an input. When IOxEN = 0, IOxDIR must
also be cleared to 0.
IOxEN = 1: Output function of the PGPIOx pin is enabled—i.e.,
the pin is used to drive an output signal. When
IOxEN = 0, IOxDIR must also be set to 1;
otherwise, the output value is undefined.
x = value from 16 to 31
{9 TEXAS INSTRUMENTS
Functional Overview
99
December 2002 − Revised November 2008 SPRS206K
3.11.2.5 Parallel GPIO Direction Register 1 (PGPIODIR1)
15 14 13 12 11 10 9 8
IO31DIR IO30DIR IO29DIR IO28DIR IO27DIR IO26DIR IO25DIR IO24DIR
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
IO23DIR IO22DIR IO21DIR IO20DIR IO19DIR IO18DIR IO17DIR IO16DIR
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−38. Parallel GPIO Direction Register 1 Layout (0x4404)
Table 3−40. Parallel GPIO Direction Register 1 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IOxDIR 15−0 R/W 0000000000000000 Data direction bits specify if corresponding bits in the data
registers specify an output value or an input value. See
Table 3−35, TMS320VC5501 PGPIO Cross-Reference to deter-
mine which device pins correspond to the PGPIO pins.
IOxDIR = 0: Corresponding bit in the data register specifies
the value read on the PGPIOx pin (input). When
IOxDIR = 0, IOxEN must also be cleared to 0.
IOxDIR = 1: Corresponding bit in the data register specifies
the value driven on the PGPIOx pin (output).
When IOxDIR = 1, IOxEN must also be set to 1.
x = value from 16 to 31
{'5 TEXAS INSTRUMENTS
Functional Overview
100 December 2002 − Revised November 2008SPRS206K
3.11.2.6 Parallel GPIO Data Register 1 (PGPIODAT1)
15 14 13 12 11 10 9 8
IO31DAT IO30DAT IO29DAT IO28DAT IO27DAT IO26DAT IO25DAT IO24DAT
R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
76543210
IO23DAT IO22DAT IO21DAT IO20DAT IO19DAT IO18DAT IO17DAT IO16DAT
R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
LEGEND: R = Read, W = Write, n = value at reset, pin = the reset value depends on the signal level on the corresponding I/O pin.
Figure 3−39. Parallel GPIO Data Register 1 Layout (0x4405)
Table 3−41. Parallel GPIO Data Register 1 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
IOxDAT 15−0 R/W Depends on the signal level on
the corresponding I/O pin Data bits that are used to either control the level of the
corresponding I/O pins configured as output pins or to
monitor the level of the corresponding I/O pins configured as
input pins. The function of the data register bits is
determined by the setting of the direction register bits. See
Table 3−35, TMS320VC5501 PGPIO Cross-Reference to
determine which device pins correspond to the PGPIO pins.
If IOxEN = 0 and IOxDIR = 0, then IOxDAT is used to read
the value of the PGPIOx pin:
IOxDAT = 0: PGPIOx pin is read as a low
IOxDAT = 1: PGPIOx pin is read as a high
If IOxEN = 1 and IOxDIR = 1, then IOxDAT is used to set
the value of the PGPIOx pin:
IOxDAT = 0: Set PGPIOx pin to low
IOxDAT = 1: Set PGPIOx pin to high
Note that other combinations of IOxEN and IOxDIR are not
supported—i.e., IOxEN and IOxDIR must always be set to
the same value.
x = value from 16 to 31
{9 TEXAS INSTRUMENTS
Functional Overview
101
December 2002 − Revised November 2008 SPRS206K
3.11.2.7 Parallel GPIO Enable Register 2 (PGPIOEN2)
15 14 13 12 11 10 9 8
Reserved IO45EN IO44EN IO43EN IO42EN IO41EN IO40EN
R/W, 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
IO39EN IO38EN IO37EN IO36EN IO35EN IO34EN IO33EN IO32EN
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−40. Parallel GPIO Enable Register 2 Layout (0x4406)
Table 3−42. Parallel GPIO Enable Register 2 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−14 R/W 00 Reserved
IOxEN 13−0 R/W 00000000000000 Enable or disable output function of the corresponding I/O pins.
See Table 3−35, TMS320VC5501 PGPIO Cross-Reference to deter-
mine which device pins correspond to the PGPIO pins.
IOxEN = 0: Output function of the PGPIOx pin is disabled—i.e.,
the pin cannot drive an output signal; it can only be
used as an input. When IOxEN = 0, IOxDIR must
also be cleared to 0.
IOxEN = 1: Output function of the PGPIOx pin is enabled—i.e.,
the pin is used to drive an output signal. When
IOxEN = 0, IOxDIR must also be set to 1;
otherwise, the output value is undefined.
x = value from 32 to 45
{'5 TEXAS INSTRUMENTS
Functional Overview
102 December 2002 − Revised November 2008SPRS206K
3.11.2.8 Parallel GPIO Direction Register 2 (PGPIODIR2)
15 14 13 12 11 10 9 8
Reserved IO45DIR IO44DIR IO43DIR IO42DIR IO41DIR IO40DIR
R/W, 00 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
IO39DIR IO38DIR IO37DIR IO36DIR IO35DIR IO34DIR IO33DIR IO32DIR
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−41. Parallel GPIO Direction Register 2 Layout (0x4407)
Table 3−43. Parallel GPIO Direction Register 2 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−14 R/W 00 Reserved
IOxDIR 13−0 R/W 00000000000000 Data direction bits specify if corresponding bits in the data registers
specify an output value or an input value. See Table 3−35,
TMS320VC5501 PGPIO Cross-Reference to determine which de-
vice pins correspond to the PGPIO pins.
IOxDIR = 0: Corresponding bit in the data register specifies
the value read on the PGPIOx pin (input). When
IOxDIR = 0, IOxEN must also be cleared to 0.
IOxDIR = 1: Corresponding bit in the data register specifies
the value driven on the PGPIOx pin (output).
When IOxDIR = 1, IOxEN must also be set to 1.
x = value from 32 to 45
{9 TEXAS INSTRUMENTS
Functional Overview
103
December 2002 − Revised November 2008 SPRS206K
3.11.2.9 Parallel GPIO Data Register 2 (PGPIODAT2)
15 14 13 12 11 10 9 8
Reserved IO45DAT IO44DAT IO43DAT IO42DAT IO41DAT IO40DAT
R/W, 00 R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
76543210
IO39DAT IO38DAT IO37DAT IO36DAT IO35DAT IO34DAT IO33DAT IO32DAT
R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin R/W, pin
LEGEND: R = Read, W = Write, n = value at reset, pin = the reset value depends on the signal level on the corresponding I/O pin.
Figure 3−42. Parallel GPIO Data Register 2 Layout (0x4408)
Table 3−44. Parallel GPIO Data Register 2 Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−14 R/W 00 Reserved
IOxDAT 13−0 R/W Depends on the signal level on
the corresponding I/O pin Data bits that are used to either control the level of the
corresponding I/O pins configured as output pins or to
monitor the level of the corresponding I/O pins configured
as input pins. The function of the data register bits is
determined by the setting of the direction register bits. See
Table 3−35, TMS320VC5501 PGPIO Cross-Reference to
determine which device pins correspond to the PGPIO
pins.
If IOxEN = 0 and IOxDIR = 0, then IOxDAT is used to read
the value of the PGPIOx pin:
IOxDAT = 0: PGPIOx pin is read as a low
IOxDAT = 1: PGPIOx pin is read as a high
If IOxEN = 1 and IOxDIR = 1, then IOxDAT is used to set
the value of the PGPIOx pin:
IOxDAT = 0: Set PGPIOx pin to low
IOxDAT = 1: Set PGPIOx pin to high
Note that other combinations of IOxEN and IOxDIR are
not supported—i.e., IOxEN and IOxDIR must always be
set to the same value.
x = value from 32 to 45
{'5 TEXAS INSTRUMENTS
Functional Overview
104 December 2002 − Revised November 2008SPRS206K
3.12 External Bus Control Register
The External Bus Control Register is used to disable/enable the bus pullups, pulldowns, and bus holders of
the 5501 pins. Table 3−45 lists which 5501 pins have pullups, pulldowns, and bus holders, and which bit on
the XBCR enables/disables that feature. Please note that for pins with dual functionality (e.g., HC0, HC1, C0,
etc.), the bus holder, pullup, and pulldown feature of each pin can be enabled or disabled regardless of the
function of the pin at the time.
Table 3−45. Pins With Pullups, Pulldowns, and Bus Holders
XBCR CONTROL BIT PIN FEATURE
TCK Pullup
TEST
TDI Pullup
TEST TMS Pullup
TRST Pulldown
EMU
EMU1/OFF Pullup
EMU EMU0 Pullup
WDT NMI/WDTOUT Pullup
HC0 Pullup
HC1 Pulldown
HCNTL0 Pullup
HCNTL1 Pullup
HC
HCS Pullup
HC HR/W Pullup
HDS1 Pullup
HDS2 Pullup
HRDY Pullup
HINT Pullup
HD HD[7:0] Bus Holder
C0 Bus Holder
C1 Bus Holder
C2 Bus Holder
C3 Pullup
C4 Bus Holder
C5 Bus Holder
C6 Bus Holder
PC
C7 Bus Holder
PC C8 Bus Holder
C9 Bus Holder
C10 Bus Holder
C11 Bus Holder
C12 Bus Holder
C13 Bus Holder
C14 Pullup
C15 Bus Holder
PD D[31:0] Bus Holder
PA A[21:2] Bus Holder
mm on m/ {9 TEXAS INSTRUMENTS
Functional Overview
105
December 2002 − Revised November 2008 SPRS206K
3.12.1 External Bus Control Register (XBCR)
15 8
Reserved
R, 00000000
76543210
EMU TEST WDT HC HD PC PD PA
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−43. External Bus Control Register Layout (0x8800)
Table 3−46. External Bus Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−8 R 00000000 Reserved
EMU 7 R/W 0 EMU bit
EMU = 0: Pullups on EMU1 and EMU0 pins are enabled.
EMU = 1: Pullups on EMU1 and EMU0 pins are disabled.
TEST 6 R/W 0 TEST bit
TEST = 0: Pullups/pulldowns on test pins are enabled
(does not include EMU1 and EMU0 pins)
TEST = 1: Pullups/pulldowns on test pins are disabled
(does not include EMU1 and EMU0 pins)
WDT 5 R/W 0 WDT bit
WDT = 0: Pullup on NMI/WDTOUT pin is enabled
WDT = 1: Pullup on NMI/WDTOUT pin is disabled
HC 4 R/W 0 HPI control signal bit
HC = 0: Pullups/pulldowns on HPI control pins (HC0 and HC1)
are enabled
HC = 1: Pullups/pulldowns on HPI control pins (HC0 and HC1)
are disabled
HD 3 R/W 0 HPI data bus bit
HD = 0: Bus holders on HPI data bus (pins HD[7:0]) are enabled
HD = 1: Bus holders on HPI data bus (pins HD[7:0]) are disabled
PC 2 R/W 0 EMIF control signals
PC = 0: Bus holders and pullups on EMIF control pins are enabled
PC = 1: Bus holders and pullups on EMIF control pins are disabled
PD 1 R/W 0 EMIF data bus signals
PD = 0: Bus holders on EMIF data bus (pins D[31:0]) are enabled
PD = 1: Bus holders on EMIF data bus (pins D[31:0]) are disabled
PA 0 R/W 0 EMIF address bus signals
PA = 0: Bus holders on EMIF address bus (pins A[21:2]) are
enabled
PA = 1: Bus holders on EMIF address bus (pins A[21:2]) are
disabled
*9 TEXAS INSTRUMENTS
Functional Overview
106 December 2002 − Revised November 2008SPRS206K
3.13 Internal Ports and System Registers
The 5501 includes three internal ports that interface the CPU core with the peripheral modules. Although these
ports cannot be directly controlled by user code, the registers associated with each port can be used to monitor
a number of error conditions that could be generated through illegal operation of the 5501. The port registers
are described in the following sections.
The 5501 also includes two registers that can be used to monitor and control several aspects of the interface
between the CPU and the system-level peripherals, these registers are also described in the following
sections.
3.13.1 XPORT Interface
The XPORT interfaces the CPU core to all peripheral modules. The XPORT will generate bus errors for invalid
accesses to any registers that fall under the ranges shown in Table 3−47. The INTERREN bit of the XPORT
Configuration Register (XCR) controls the bus error feature of the XPORT. The INTERR bit of the XPORT Bus
Error Register (XERR) is set to “1” when an error occurs during an access to a register listed in Table 3−47.
The EBUS and DBUS bits can be used to distinguish whether the error occurred during a write or read access.
Table 3−47. I/O Addresses Under Scope of XPORT
I/O ADDRESS RANGE
0x0000−0x03FF
0x1400−0x17FF
0x2000−0x23FF
The PERITO bit of the XERR is used to indicate that a CPU, DMA, or HPI access to a disabled/idled peripheral
module has generated a time-out error. The time-out error feature is enabled through the PERITOEN bit of
the Time-Out Control Register (TOCR). A time-out error is generated when 512 clock cycles pass without a
response from the peripheral register.
The XPORT can be placed into idle by setting the XPORTI bit of the Idle Control Register (ICR) and executing
the IDLE instruction. When the XPORT is in idle, it will stop accepting new peripheral module requests and
it will also not check for internal I/O bus errors. If there is a request from the CPU core or a peripheral module,
the XPORT will not respond and hang. The ICR register will generate a bus error if the XPORT is idled without
the CPU or Master Port domains being in idle mode.
{9 TEXAS INSTRUMENTS
Functional Overview
107
December 2002 − Revised November 2008 SPRS206K
3.13.1.1 XPORT Configuration Register (XCR)
The XPORT Configuration Register bit layout is shown in Figure 3−44 and the bits are described in
Table 3−48.
15 14 8
INTERREN Reserved
R/W, 1 R, 0000000
7 0
Reserved
R, 00000000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−44. XPORT Configuration Register Layout (0x0100)
Table 3−48. XPORT Configuration Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
INTERREN 15 R/W 1 INTERREN bit
INTERREN = 0: The XPORT will not generate a bus error for
invalid accesses to registers listed in Table 3−47.
Note that any invalid accesses to these registers
will hang the pipeline.
INTERREN = 1: The XPORT will generate a bus error for invalid
accesses to registers listed in Table 3−47. Note
that when a bus error occurs, any data returned
by the read instruction will not be valid.
Reserved 14−0 R 000000000000000 Reserved
This feature will not work if the XPORT is placed in idle through the ICR. However, a bus error will be generated if the XPORT is placed in idle
without the CPU being in idle.
{'5 TEXAS INSTRUMENTS
Functional Overview
108 December 2002 − Revised November 2008SPRS206K
3.13.1.2 XPORT Bus Error Register (XERR)
The XPORT Bus Error Register bit layout is shown in Figure 3−45 and the bits are described in Table 3−49.
15 14 13 12 11 8
INTERR Reserved PERITO Reserved
R, 0 R, 00 R, 0 R, 0000
754320
Reserved EBUS DBUS Reserved
R, 000 R, 0 R, 0 R, 000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−45. XPORT Bus Error Register Layout (0x0102)
Table 3−49. XPORT Bus Error Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
INTERR 15 R 0 INTERR bit
INTERR = 0: No error
INTERR = 1: An error occurred during an access to one of the
registers listed in Table 3−47.
Reserved 14−13 R 00 Reserved
PERITO 12 R 0 PERITO bit
PERITO = 0: No error
PERITO = 1: A time-out error occurred during an access to a
peripheral register.
Reserved 11−5 R 0000000 Reserved
EBUS 4 R 0 EBUS error bit
EBUS = 0: No error
EBUS = 1: An error occurred during an EBUS access (write) to
one of the registers listed in Table 3−47.
DBUS 3 R 0 DBUS error bit
DBUS = 0: No error
DBUS = 1: An error occurred during a DBUS access (read) to
one of the registers listed in Table 3−47.
Reserved 2−0 R 000 Reserved
See the TMS320C55x DSP CPU Reference Guide (literature number SPRU371) for more information on the D-bus and E-bus.
{9 TEXAS INSTRUMENTS
Functional Overview
109
December 2002 − Revised November 2008 SPRS206K
3.13.2 DPORT Interface
The DPORT interfaces the CPU to the EMIF module. The DPORT is capable of enabling write posting on the
EMIF module. Write posting prevents stalls to the CPU during external memory writes. Two write posting
registers, which are freely associated with E and F bus writes, exist within the DPORT and are used to store
the write address and data so that writes can be zero wait state for the CPU. External memory writes will not
generate stalls to the CPU unless the two write posting registers are filled. Write posting is enabled by setting
the WPE bit of the DCR to 1.
The EMIFTO bit of the DERR is used to indicate that a CPU, DMA, HPI, or IPORT access to external memory
has generated a time-out error. The time-out error feature is enabled through the EMIFTOEN bit of the
Time-Out Control Register (TOCR). This function is not recommended during normal operation of the 5501.
The DPORT can be placed into idle through the EMIFI bit of the Idle Control Register (ICR) and executing the
IDLE instruction. When the DPORT is in idle, it will stop accepting new EMIF requests. If there is a request
from the CPU or the EMIF, the DPORT will not respond and hang. The ICR register will generate a bus error
if the DPORT is idled without the CPU or Master Port domains being in idle.
3.13.2.1 DPORT Configuration Register (DCR)
The DPORT Configuration Register bit layout is shown in Figure 3−46 and the bits are described in
Table 3−50.
15 8
Reserved
R, 00000000
76 0
WPE Reserved
R/W, 0 R, 0000000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−46. DPORT Configuration Register Layout (0x0200)
Table 3−50. DPORT Configuration Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−8 R 00000000 Reserved
WPE 7 R/W 0 Write Posting Enable bit
WPE = 0: Write posting disabled
WPE = 1: Write posting enabled
Reserved 6−0 R 0000000 Reserved
Write posting should not be enabled or disabled while the EMIF is conducting a transaction with external memory.
{'5 TEXAS INSTRUMENTS
Functional Overview
110 December 2002 − Revised November 2008SPRS206K
3.13.2.2 DPORT Bus Error Register (DERR)
The DPORT Bus Error Register bit layout is shown in Figure 3−47 and the bits are described in Table 3−51.
15 13 12 11 8
Reserved EMIFTO Reserved
R, 000 R, 0 R, 0000
7 0
Reserved
R, 00000000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−47. DPORT Bus Error Register Layout (0x0202)
Table 3−51. DPORT Bus Error Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−13 R 000 Reserved
EMIFTO 12 R 0 EMIFTO bit
EMIFTO = 0: No error
EMIFTO = 1: Error 1 error
Reserved 11−0 R 000000000000 Reserved
{9 TEXAS INSTRUMENTS
Functional Overview
111
December 2002 − Revised November 2008 SPRS206K
3.13.3 IPORT Interface
The IPORT interfaces the I-Cache to the EMIF module. The ICACHETO bit of the IPORT Bus Error Register
(IERR) can be used to determine if a time-out error has occurred during an ICACHE access to external
memory. The time-out feature is enabled through the EMIFTOEN bit of the Time-Out Control Register (TOCR).
The IPORT can be placed into idle through the IPORTI bit of the Idle Control Register (ICR) and executing
the IDLE instruction. The IPORT will go into idle when there are no new requests from the ICACHE. When
the IPORT is in idle, it will stop accepting new requests from the CPU, it is important that the program flow not
use external memory in this case. If there are requests from the CPU, the IPORT will not respond and hang.
The ICR register will generate a bus error if the IPORT is idled without the CPU domain being in idle.
3.13.3.1 IPORT Bus Error Register (IERR)
The IPORT Bus Error Register bit layout is shown in Figure 3−48 and the bits are described in Table 3−52.
15 13 12 11 8
Reserved ICACHETO Reserved
R, 000 R, 0 R, 0000
7 0
Reserved
R, 00000000
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−48. IPORT Bus Error Register Layout (0x0302)
Table 3−52. IPORT Bus Error Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−13 R 000 Reserved
ICACHETO 12 R 0 ICACHETO bit
ICACHETO = 0: No error
ICACHETO = 1: A time-out error occurred during an ICACHE
access to external memory.
Reserved 11−0 R 000000000000 Reserved
{'5 TEXAS INSTRUMENTS
Functional Overview
112 December 2002 − Revised November 2008SPRS206K
3.13.4 System Configuration Register (CONFIG)
The System Configuration Register can be used to determine the operational state of the ICACHE. If the
ICACHE is not functioning, the CACHEPRES bit of the CONFIG register will be cleared. If the ICACHE is
functioning normally, this bit will be set.
The System Configuration Register bit layout is shown in Figure 3−49 and the bits are described in Table 3−53.
15 8
Reserved
R, 10000010
76543 0
Reserved CACHEPRES Reserved Reserved
R, 00 R, 0 RW, 0R, 0000
LEGEND: R = Read, W = Write, n = value at reset
This Reserved bit must be kept as zero during any writes to CONFIG.
Figure 3−49. System Configuration Register Layout (0x07FD)
Table 3−53. System Configuration Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−6 R 1000001000 Reserved
CACHEPRES 5 R 0 ICACHE present
CACHEPRES = 0: ICACHE is not functioning
CACHEPRES = 1: ICACHE is enabled and working
Reserved 4 R/W 0Reserved
Reserved 3−0 R 0000 Reserved
This Reserved bit must be kept as zero during any writes to CONFIG.
{DMA} Control/er Helerence Guide (literature number SPRU613) {9 TEXAS INSTRUMENTS
Functional Overview
113
December 2002 − Revised November 2008 SPRS206K
3.13.5 Time-Out Control Register (TOCR)
The Time-Out Control Register can be used to select whether or not a time-out error is generated when an
access to a disabled/idled peripheral module occurs. If the CPU or DMA access a disabled/idle peripheral
module and 512 CPU clock cycles pass without an acknowledgement from the peripheral module, then a
time-out error will be sent to the corresponding module if bit 1 in the Time-Out Control Register is set. A
time-out error will generate a CPU bus error that can be serviced through software by using the bus error
interrupt (BERR) (see Section 3.16, Interrupts, for more information on interrupts). If the DMA gets a time-out
error, it will set the TIMEOUT bit in the DMA Status Register (DMACSR) and generate a time-out error that
can be serviced through software by the CPU [see the TMS320VC5501/5502 DSP Direct Memory Access
(DMA) Controller Reference Guide (literature number SPRU613) for more information on using this feature
of the DMA].
The Time-Out Control Register can also be used to select whether or not a time-out error is generated when
a memory access through the EMIF module stalls for more than 512 CPU clock cycles. It is recommended
that this feature not be used for it can cause unexpected results.
15 8
Reserved
R, 00000000
7210
Reserved EMIFTOEN PERITOEN
R, 000000 R/W, 0 R/W, 1
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−50. Time-Out Control Register Layout (0x9000)
Table 3−54. Time-Out Control Register Bit Field Description
BIT NAME BIT NO. ACCESS RESET VALUE DESCRIPTION
Reserved 15−2 R 00000000000000 Reserved
EMIFTOEN 1 R/W 0 EMIF time-out control bit
EMIFTOEN = 0: A time-out error is not generated when an EMIF
access stalls for more than 512 CPU clock
cycles.
EMIFTOEN = 1: A time-out error is generated when an EMIF
access stalls for more than 512 CPU clock
cycles.
PERITOEN 0 R/W 1 Peripheral module time-out control bit
PERITOEN = 0: A time-out error is not generated when a CPU
access to a disabled/idle peripheral module
stalls for more than 512 CPU clock cycles.
PERITOEN = 1: A time-out error is generated when a CPU
access to a disabled/idle peripheral module
stalls for more than 512 CPU clock cycles.
Accumulator O Accumulator 1 {'5 TEXAS INSTRUMENTS
Functional Overview
114 December 2002 − Revised November 2008SPRS206K
3.14 CPU Memory-Mapped Registers
The 5501 has 78 memory-mapped CPU registers that are mapped in data memory space address 0h to 4Fh.
Table 3−55 provides a list of the CPU memory-mapped registers (MMRs) available. The corresponding
TMS320C54x (C54x) CPU registers are also indicated where applicable.
Table 3−55. CPU Memory-Mapped Registers
C54X
REGISTER C55X
REGISTER
WORD ADDRESS
(HEX) C55X REGISTER DESCRIPTION BIT FIELD
IER IER0 00 Interrupt Enable Register 0 [15−0]
IFR IFR0 01 Interrupt Flag Register 0 [15−0]
ST0_55 02 Status Register 0 [15−0]
ST1_55 03 Status Register 1 [15−0]
ST3_55 04 Status Register 3 [15−0]
05 Reserved [15−0]
ST0 ST0 06 Status Register 0 (protected address for C54x code) [15−0]
ST1 ST1 07 Status Register 1 (protected address for C54x code) [15−0]
AL AC0L 08 [15−0]
AH AC0H 09 Accumulator 0 [31−16]
AG AC0G 0A
Accumulator 0
[39−32]
BL AC1L 0B [15−0]
BH AC1H 0C Accumulator 1 [31−16]
BG AC1G 0D
Accumulator 1
[39−32]
TREG T3 0E Temporary Register 3 [15−0]
TRN TRN0 0F Transition Register 0 [15−0]
AR0 AR0 10 Auxiliary Register 0 [15−0]
AR1 AR1 11 Auxiliary Register 1 [15−0]
AR2 AR2 12 Auxiliary Register 2 [15−0]
AR3 AR3 13 Auxiliary Register 3 [15−0]
AR4 AR4 14 Auxiliary Register 4 [15−0]
AR5 AR5 15 Auxiliary Register 5 [15−0]
AR6 AR6 16 Auxiliary Register 6 [15−0]
AR7 AR7 17 Auxiliary Register 7 [15−0]
SP SP 18 Data Stack Pointer [15−0]
BK BK03 19 Circular Buffer Size Register for AR[0−3] [15−0]
BRC BRC0 1A Block Repeat Counter 0 [15−0]
RSA RSA0L 1B Low Part of Block Repeat Start Address Register 0 [15−0]
REA REA0L 1C Low Part of Block Repeat End Address Register 0 [15−0]
PMST PMST 1D Status Register 3 (protected address for C54x code) [15−0]
XPC XPC 1E Program Counter Extension Register for C54x code [7−0]
1F Reserved [15−0]
T0 20 Temporary Register 0 [15−0]
T1 21 Temporary Register 1 [15−0]
T2 22 Temporary Register 2 [15−0]
T3 23 Temporary Register 3 [15−0]
AC2L 24 Accumulator 2 [15−0]
− AC2H 25 [31−16]
− AC2G 26 [39−32]
TMS320C54x and C54x are trademarks of Texas Instruments.
{9 TEXAS INSTRUMENTS
Functional Overview
115
December 2002 − Revised November 2008 SPRS206K
Table 3−55. CPU Memory-Mapped Registers (Continued)
C54X
REGISTER BIT FIELDC55X REGISTER DESCRIPTION
WORD ADDRESS
(HEX)
C55X
REGISTER
CDP 27 Coefficient Data Pointer [15−0]
AC3L 28 Accumulator 3 [15−0]
− AC3H 29 [31−16]
− AC3G 2A [39−32]
DPH 2B High Part of the Extended Data Page Register
(XDP = DPH:DP) [6−0]
2C Reserved [6−0]
2D Reserved [6−0]
DP 2E Data Page Register [15−0]
PDP 2F Peripheral Data Page Register [8−0]
BK47 30 Circular Buffer Size Register for AR[4−7] [15−0]
BKC 31 Circular Buffer Size Register for CDP [15−0]
BSA01 32 Circular Buffer Start Address Register for AR[0−1] [15−0]
BSA23 33 Circular Buffer Start Address Register for AR[2−3] [15−0]
BSA45 34 Circular Buffer Start Address Register for AR[4−5] [15−0]
BSA67 35 Circular Buffer Start Address Register for AR[6−7] [15−0]
BSAC 36 Circular Buffer Start Address Register for CDP [15−0]
BIOS 37 Data Page Pointer Storage Location for 128-word Data Table [15−0]
TRN1 38 Transition Register 1 [15−0]
BRC1 39 Block Repeat Counter 1 [15−0]
BRS1 3A BRC1 Save Register [15−0]
CSR 3B Computed Single Repeat Register [15−0]
RSA0H 3C Block Repeat Start Address Register 0 [23−16]
− RSA0L 3D [15−0]
REA0H 3E Block Repeat End Address Register 0 [23−16]
− REA0L 3F [15−0]
RSA1H 40 Block Repeat Start Address Register 1 [23−16]
− RSA1L 41 [15−0]
REA1H 42 Block Repeat End Address Register 1 [23−16]
− REA1L 43 [15−0]
RPTC 44 Single Repeat Counter [15−0]
IER1 45 Interrupt Enable Register 1 [15−0]
IFR1 46 Interrupt Flag Register 1 [15−0]
DBIER0 47 Debug Interrupt Enable Register 0 [15−0]
DBIER1 48 Debug Interrupt Enable Register 0 [15−0]
IVPD 49 Interrupt Vector Pointer [15−0]
IVPH 4A Interrupt Vector Pointer [15−0]
ST2_55 4B Status Register 2 [15−0]
SSP 4C System Stack Pointer [15−0]
SP 4D Data Stack Pointer [15−0]
SPH 4E High Part of the Extended Stack Pointers
(XSP = SPH:SP, XSSP = SPH:SSP) [6−0]
CDPH 4F High Part of the Extended Coefficient Data Pointer
(XCDP = CDPH:CDP) [6−0]
Table 3774. Peripheral registers are accessed using the port qualifier. For more inlormation on the use of the '5 Guide (literature number SPRUZSO) *9 TEXAS INSTRUMENTS
Functional Overview
116 December 2002 − Revised November 2008SPRS206K
3.15 Peripheral Registers
Each 5501 device has a set of peripheral memory-mapped registers as listed in Table 3−56 through
Table 3−74. Peripheral registers are accessed using the port qualifier. For more information on the use of the
port qualifier, see the TMS320C55x Assembly Language Tools Users Guide (literature number SPRU280).
Some registers use less than 16 bits. When reading these registers, unused bits are always read as 0.
The user guides for each peripheral contain detailed information on the operation and the functions of each
of the peripheral registers (see Section 4.2, Documentation Support, for a list of documents supporting each
peripheral).
Table 3−56. Peripheral Bus Controller Configuration Registers
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x0000 Reserved
0x0001 ICR Idle Configuration Register 0000 0000 0000 0000
0x0002 ISTR Idle Status Register 0000 0000 0000 0000
0x0003 to 0x000D Reserved
0x000E Reserved
0x000F BOOT_MOD Boot Mode Register (read only) Value of GPIO[2:0] at reset
0x0010 Reserved
0x0011 Reserved
0x0100 XCR XPORT Configuration Register 1000 0000 0000 0000
0x0102 XERR XPORT Bus Error Register 0000 0000 0000 0000
0x0200 DCR DPORT Configuration Register 0000 0000 0000 0000
0x0202 DERR DPORT Bus Error Register 0000 0000 0000 0000
0x0302 IERR IPORT Bus Error Register 0000 0000 0000 0000
0x07FD CONFIG System Configuration Register 1000 0010 0000 0000
0x9000 TOCR Time-Out Control Register 0000 0000 0000 0001
x denotes a “don’t care.”
{9 TEXAS INSTRUMENTS
Functional Overview
117
December 2002 − Revised November 2008 SPRS206K
Table 3−57. External Memory Interface Registers
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x0800 EGCR1 EMIF Global Control Register 1 0010 0111 0111 1100
0x0801 EGCR2 EMIF Global Control Register 2 0000 0000 0000 1001
0x0802 CE1_1 EMIF CE1 Space Control Register 1 1111 1111 0001 1111
0x0803 CE1_2 EMIF CE1 Space Control Register 2 1111 1111 1111 1111
0x0804 CE0_1 EMIF CE0 Space Control Register 1 1111 1111 0000 0011
0x0805 CE0_2 EMIF CE0 Space Control Register 2 1111 1111 1111 1111
0x0806 Reserved
0x0807 Reserved
0x0808 CE2_1 EMIF CE2 Space Control Register 1 1111 1111 1111 0011
0x0809 CE2_2 EMIF CE2 Space Control Register 2 1111 1111 1111 1111
0x080A CE3_1 EMIF CE3 Space Control Register 1 1111 1111 1111 0011
0x080B CE3_2 EMIF CE3 Space Control Register 2 1111 1111 1111 1111
0x080C SDC1 EMIF SDRAM Control Register 1 1111 0000 0000 0000
0x080D SDC2 EMIF SDRAM Control Register 2 0000 0011 0100 1000
0x080E SDRC1 EMIF SDRAM Refresh Control Register 1 1100 0101 1101 1100
0x080F SDRC2 EMIF SDRAM Refresh Control Register 2 0000 0000 0101 1101
0x0810 SDX1 EMIF SDRAM Extension Register 1 0101 1111 1101 1111
0x0811 SDX2 EMIF SDRAM Extension Register 2 0000 0000 0001 0111
0x0812 to 0x0821 Reserved
0x0822 CE1_SC1 EMIF CE1 Secondary Control Register 1 0000 0000 0000 0010
0x0823 CE1_SC2 EMIF CE1 Secondary Control Register 2 0000 0000 0000 0000
0x0824 CE0_SC1 EMIF CE0 Secondary Control Register 1 0000 0000 0000 0010
0x0825 CE0_SC2 EMIF CE0 Secondary Control Register 2 0000 0000 0000 0000
0x0826 Reserved
0x0827 Reserved
0x0828 CE2_SC1 EMIF CE2 Secondary Control Register 1 0000 0000 0000 0010
0x0829 CE2_SC2 EMIF CE2 Secondary Control Register 2 0000 0000 0000 0000
0x082A CE3_SC1 EMIF CE3 Secondary Control Register 1 0000 0000 0000 0010
0x082B CE3_SC2 EMIF CE3 Secondary Control Register 2 0000 0000 0000 0000
0x082C to 0x0839 Reserved
0x0840 CESCR1 EMIF CE Size Control Register 1 0000 0000 0000 0000
0x0841 CESCR2 EMIF CE Size Control Register 2 0000 0000 0000 0000
x denotes a “don’t care.”
{'5 TEXAS INSTRUMENTS
Functional Overview
118 December 2002 − Revised November 2008SPRS206K
Table 3−58. DMA Configuration Registers
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
GLOBAL REGISTER
0x0E00 DMA_GCR(2:0) DMA Global Control Register 000
0x0E01 DMA_GTCR(3:0) DMA Global Timeout Control Register 0000
CHANNEL #0 REGISTERS
0x0C00 DMA_CSDP0 DMA Channel 0 Source Destination Parameters
Register 0000 0000 0000 0000
0x0C01 DMA_CCR0(15:0) DMA Channel 0 Control Register 0000 0000 0000 0000
0x0C02 DMA_CICR0(5:0) DMA Channel 0 Interrupt Control register 0000 0001 1000 0011
0x0C03 DMA_CSR0(6:0) DMA Channel 0 Status register 00 0000
0x0C04 DMA_CSSA_L0 DMA Channel 0 Source Start Address, lower bits,
register Undefined
0x0C05 DMA_CSSA_U0 DMA Channel 0 Source Start Address, upper bits,
register Undefined
0x0C06 DMA_CDSA_L0 DMA Channel 0 Source Destination Address, lower
bits, register Undefined
0x0C07 DMA_CDSA_U0 DMA Channel 0 Source Destination Address, upper
bits, register Undefined
0x0C08 DMA_CEN0 DMA Channel 0 Element Number register Undefined
0x0C09 DMA_CFN0 DMA Channel 0 Frame Number register Undefined
0x0C0A DMA_CSFI0 DMA Channel 0 Source Frame Index register Undefined
0x0C0B DMA_CSEI0 DMA Channel 0 Source Element Index register Undefined
0x0C0C DMA_CSAC0 DMA Channel 0 Source Address Counter register Undefined
0x0C0D DMA_CDAC0 DMA Channel 0 Destination Address Counter register Undefined
0x0C0E DMA_CDEI0 DMA Channel 0 Destination Element Index register Undefined
0x0C0F DMA_CDFI0 DMA Channel 0 Destination Frame Index register Undefined
CHANNEL #1 REGISTERS
0x0C20 DMA_CSDP1 DMA Channel 1 Source Destination Parameters
Register 0000 0000 0000 0000
0x0C21 DMA_CCR1(15:0) DMA Channel 1 Control Register 0000 0000 0000 0000
0x0C22 DMA_CICR1(5:0) DMA Channel 1 Interrupt Control register 0000 0001 1000 0011
0x0C23 DMA_CSR1(6:0) DMA Channel 1 Status register 00 0000
0x0C24 DMA_CSSA_L1 DMA Channel 1 Source Start Address, lower bits,
register Undefined
0x0C25 DMA_CSSA_U1 DMA Channel 1 Source Start Address, upper bits,
register Undefined
0x0C26 DMA_CDSA_L1 DMA Channel 1 Source Destination Address, lower
bits, register Undefined
0x0C27 DMA_CDSA_U1 DMA Channel 1 Source Destination Address, upper
bits, register Undefined
0x0C28 DMA_CEN1 DMA Channel 1 Element Number register Undefined
0x0C29 DMA_CFN1 DMA Channel 1 Frame Number register Undefined
0x0C2A DMA_CSFI1 DMA Channel 1 Source Frame Index register Undefined
0x0C2B DMA_CSEI1 DMA Channel 1 Source Element Index register Undefined
0x0C2C DMA_CSAC1 DMA Channel 1 Source Address Counter register Undefined
0x0C2D DMA_CDAC1 DMA Channel 1 Destination Address Counter register Undefined
0x0C2E DMA_CDEI1 DMA Channel 1 Destination Element Index register Undefined
0x0C2F DMA_CDFI1 DMA Channel 1 Destination Frame Index register Undefined
{9 TEXAS INSTRUMENTS
Functional Overview
119
December 2002 − Revised November 2008 SPRS206K
Table 3−58. DMA Configuration Registers (Continued)
WORD ADDRESS RESET VALUEDESCRIPTIONREGISTER NAME
CHANNEL #2 REGISTERS
0x0C40 DMA_CSDP2 DMA Channel 2 Source Destination Parameters
Register 0000 0000 0000 0000
0x0C41 DMA_CCR2(15:0) DMA Channel 2 Control Register 0000 0000 0000 0000
0x0C42 DMA_CICR2(5:0) DMA Channel 2 Interrupt Control register 0000 0001 1000 0011
0x0C43 DMA_CSR2(6:0) DMA Channel 2 Status register 00 0000
0x0C44 DMA_CSSA_L2 DMA Channel 2 Source Start Address, lower bits,
register Undefined
0x0C45 DMA_CSSA_U2 DMA Channel 2 Source Start Address, upper bits,
register Undefined
0x0C46 DMA_CDSA_L2 DMA Channel 2 Source Destination Address, lower
bits, register Undefined
0x0C47 DMA_CDSA_U2 DMA Channel 2 Source Destination Address, upper
bits, register Undefined
0x0C48 DMA_CEN2 DMA Channel 2 Element Number register Undefined
0x0C49 DMA_CFN2 DMA Channel 2 Frame Number register Undefined
0x0C4A DMA_CSFI2 DMA Channel 2 Source Frame Index register Undefined
0x0C4B DMA_CSEI2 DMA Channel 2 Source Element Index register Undefined
0x0C4C DMA_CSAC2 DMA Channel 2 Source Address Counter register Undefined
0x0C4D DMA_CDAC2 DMA Channel 2 Destination Address Counter register Undefined
0x0C4E DMA_CDEI2 DMA Channel 2 Destination Element Index register Undefined
0x0C4F DMA_CDFI2 DMA Channel 2 Destination Frame Index register Undefined
CHANNEL #3 REGISTERS
0x0C60 DMA_CSDP3 DMA Channel 3 Source Destination Parameters
Register 0000 0000 0000 0000
0x0C61 DMA_CCR3(15:0) DMA Channel 3 Control Register 0000 0000 0000 0000
0x0C62 DMA_CICR3(5:0) DMA Channel 3 Interrupt Control register 0000 0001 1000 0011
0x0C63 DMA_CSR3(6:0) DMA Channel 3 Status register 00 0000
0x0C64 DMA_CSSA_L3 DMA Channel 3 Source Start Address, lower bits,
register Undefined
0x0C65 DMA_CSSA_U3 DMA Channel 3 Source Start Address, upper bits,
register Undefined
0x0C66 DMA_CDSA_L3 DMA Channel 3 Source Destination Address, lower
bits, register Undefined
0x0C67 DMA_CDSA_U3 DMA Channel 3 Source Destination Address, upper
bits, register Undefined
0x0C68 DMA_CEN3 DMA Channel 3 Element Number register Undefined
0x0C69 DMA_CFN3 DMA Channel 3 Frame Number register Undefined
0x0C6A DMA_CSFI3 DMA Channel 3 Source Frame Index register Undefined
0x0C6B DMA_CSEI3 DMA Channel 3 Source Element Index register Undefined
0x0C6C DMA_CSAC3 DMA Channel 3 Source Address Counter register Undefined
0x0C6D DMA_CDAC3 DMA Channel 3 Destination Address Counter register Undefined
0x0C6E DMA_CDEI3 DMA Channel 3 Destination Element Index register Undefined
0x0C6F DMA_CDFI3 DMA Channel 3 Destination Frame Index register Undefined
{'5 TEXAS INSTRUMENTS
Functional Overview
120 December 2002 − Revised November 2008SPRS206K
Table 3−58. DMA Configuration Registers (Continued)
WORD ADDRESS RESET VALUEDESCRIPTIONREGISTER NAME
CHANNEL #4 REGISTERS
0x0C80 DMA_CSDP4 DMA Channel 4 Source Destination Parameters
Register 0000 0000 0000 0000
0x0C81 DMA_CCR4(15:0) DMA Channel 4 Control Register 0000 0000 0000 0000
0x0C82 DMA_CICR4(5:0) DMA Channel 4 Interrupt Control register 0000 0001 1000 0011
0x0C83 DMA_CSR4(6:0) DMA Channel 4 Status register 00 0000
0x0C84 DMA_CSSA_L4 DMA Channel 4 Source Start Address, lower bits,
register Undefined
0x0C85 DMA_CSSA_U4 DMA Channel 4 Source Start Address, upper bits,
register Undefined
0x0C86 DMA_CDSA_L4 DMA Channel 4 Source Destination Address, lower
bits, register Undefined
0x0C87 DMA_CDSA_U4 DMA Channel 4 Source Destination Address, upper
bits, register Undefined
0x0C88 DMA_CEN4 DMA Channel 4 Element Number register Undefined
0x0C89 DMA_CFN4 DMA Channel 4 Frame Number register Undefined
0x0C8A DMA_CSFI4 DMA Channel 4 Source Frame Index register Undefined
0x0C8B DMA_CSEI4 DMA Channel 4 Source Element Index register Undefined
0x0C8C DMA_CSAC4 DMA Channel 4 Source Address Counter register Undefined
0x0C8D DMA_CDAC4 DMA Channel 4 destination Address Counter register Undefined
0x0C8E DMA_CDEI4 DMA Channel 4 Destination Element Index register Undefined
0x0C8F DMA_CDFI4 DMA Channel 4 Destination Frame Index register Undefined
CHANNEL #5 REGISTERS
0x0CA0 DMA_CSDP5 DMA Channel 5 Source Destination Parameters
Register 0000 0000 0000 0000
0x0CA1 DMA_CCR5(15:0) DMA Channel 5 Control Register 0000 0000 0000 0000
0x0CA2 DMA_CICR5(5:0) DMA Channel 5 Interrupt Control register 0000 0001 1000 0011
0x0CA3 DMA_CSR5(6:0) DMA Channel 5 Status register 00 0000
0x0CA4 DMA_CSSA_L5 DMA Channel 5 Source Start Address, lower bits,
register Undefined
0x0CA5 DMA_CSSA_U5 DMA Channel 5 Source Start Address, upper bits,
register Undefined
0x0CA6 DMA_CDSA_L5 DMA Channel 5 Source Destination Address, lower
bits, register Undefined
0x0CA7 DMA_CDSA_U5 DMA Channel 5 Source Destination Address, upper
bits, register Undefined
0x0CA8 DMA_CEN5 DMA Channel 5 Element Number register Undefined
0x0CA9 DMA_CFN5 DMA Channel 5 Frame Number register Undefined
0x0CAA DMA_CSFI5 DMA Channel 5 Source Frame Index register Undefined
0x0CAB DMA_CSEI5 DMA Channel 5 Source Element Index register Undefined
0x0CAC DMA_CSAC5 DMA Channel 5 Source Address Counter register Undefined
0x0CAD DMA_CDAC5 DMA Channel 5 Destination Address Counter register Undefined
0x0CAE DMA_CDEI5 DMA Channel 5 Destination Element Index register Undefined
0x0CAF DMA_CDFI5 DMA Channel 5 Destination Frame Index register Undefined
{9 TEXAS INSTRUMENTS
Functional Overview
121
December 2002 − Revised November 2008 SPRS206K
Table 3−59. Instruction Cache Registers
WORD ADDRESS REGISTER NAME DESCRIPTION
0x1400 ICGC ICache Global Control Register
0x1401 ICFLARL ICache Flush Line Address Register Low Part
0x1402 ICFLARH ICache Flush Line Address Register High Part
0x1409 ICWMC ICache Way Miss-Counter Register
Table 3−60. Trace FIFO
WORD ADDRESS REGISTER NAME DESCRIPTION
0x2000 − 0x203F TRC00 − TRC63 Trace Register Discontinuity Section
0x2040 − 0x204F TRC64 − TRC79 Trace Register Last PC Section
0x2050 TRC_LPCOFFSET1 Trace LPC Offset Register 1
0x2051 TRC_LPCOFFSET2 Trace LPC Offset Register 2
0x2052 TRC_PTR Trace Pointer Register
0x2053 TRC_CNTL Trace Control Register
0x2054 TRC_ID Trace ID Register
The Trace FIFO registers are used by the emulator only and do not require any intervention from the user.
Table 3−61. Timer Signal Selection Register
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x8000 TSSR Timer Signal Selection Register 0000 0000 0000 0000
Table 3−62. Timers
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x1000 GPTPID1_0 Peripheral ID register 1, Timer #0 0000 0111 0000 0001
0x1001 GPTPID2_0 Peripheral ID register 2, Timer #0 0000 0000 0000 0001
0x1002 GPTEMU_0 Emulation Management Register, Timer #0 0000 0000 0000 0000
0x1003 GPTCLK_0 Timer Clock Speed Register, Timer #0 0000 0000 0000 0000
0x1004 GPTGPINT_0 GPIO Interrupt Control Register, Timer #0 0000 0000 0000 0000
0x1005 GPTGPEN_0 GPIO Enable Register, Timer #0 0000 0000 0000 0000
0x1006 GPTGPDAT_0 GPIO Data Register, Timer #0 0000 0000 0000 0000
0x1007 GPTGPDIR_0 GPIO Direction Register, Timer #0 0000 0000 0000 0000
0x1008 GPTCNT1_0 Timer Counter 1 Register, Timer #0 0000 0000 0000 0000
0x1009 GPTCNT2_0 Timer Counter 2 Register, Timer #0 0000 0000 0000 0000
0x100A GPTCNT3_0 Timer Counter 3 Register, Timer #0 0000 0000 0000 0000
0x100B GPTCNT4_0 Timer Counter 4 Register, Timer #0 0000 0000 0000 0000
0x100C GPTPRD1_0 Period Register 1, Timer #0 0000 0000 0000 0000
0x100D GPTPRD2_0 Period Register 2, Timer #0 0000 0000 0000 0000
0x100E GPTPRD3_0 Period Register 3, Timer #0 0000 0000 0000 0000
0x100F GPTPRD4_0 Period Register 4, Timer #0 0000 0000 0000 0000
0x1010 GPTCTL1_0 Timer Control Register 1, Timer #0 0000 0000 0000 0000
0x1011 GPTCTL2_0 Timer Control Register 2, Timer #0 0000 0000 0000 0000
0x1012 GPTGCTL1_0 Global Timer Control Register 1, Timer #0 0000 0000 0000 0000
0x1013 Reserved
0x2400 GPTPID1_1 Peripheral ID register 1, Timer #1 0000 0111 0000 0001
0x2401 GPTPID2_1 Peripheral ID register 2, Timer #1 0000 0000 0000 0001
0x2402 GPTEMU_1 Emulation Management Register, Timer #1 0000 0000 0000 0000
0x2403 GPTCLK_1 Timer Clock Speed Register, Timer #1 0000 0000 0000 0000
0x2404 GPTGPINT_1 GPIO Interrupt Control Register, Timer #1 0000 0000 0000 0000
{'5 TEXAS INSTRUMENTS
Functional Overview
122 December 2002 − Revised November 2008SPRS206K
Table 3−62. Timers (Continued)
WORD ADDRESS RESET VALUEDESCRIPTIONREGISTER NAME
0x2405 GPTGPEN_1 GPIO Enable Register, Timer #1 0000 0000 0000 0000
0x2406 GPTGPDAT_1 GPIO Data Register, Timer #1 0000 0000 0000 0000
0x2407 GPTGPDIR_1 GPIO Direction Register, Timer #1 0000 0000 0000 0000
0x2408 GPTCNT1_1 Timer Counter 1 Register, Timer #1 0000 0000 0000 0000
0x2409 GPTCNT2_1 Timer Counter 2 Register, Timer #1 0000 0000 0000 0000
0x240A GPTCNT3_1 Timer Counter 3 Register, Timer #1 0000 0000 0000 0000
0x240B GPTCNT4_1 Timer Counter 4 Register, Timer #1 0000 0000 0000 0000
0x240C GPTPRD1_1 Period Register 1, Timer #1 0000 0000 0000 0000
0x240D GPTPRD2_1 Period Register 2, Timer #1 0000 0000 0000 0000
0x240E GPTPRD3_1 Period Register 3, Timer #1 0000 0000 0000 0000
0x240F GPTPRD4_1 Period Register 4, Timer #1 0000 0000 0000 0000
0x2410 GPTCTL1_1 Timer Control Register 1, Timer #1 0000 0000 0000 0000
0x2411 GPTCTL2_1 Timer Control Register 2, Timer #1 0000 0000 0000 0000
0x2412 GPTGCTL1_1 Global Timer Control Register 1, Timer #1 0000 0000 0000 0000
0x2413 Reserved
0x4000 WDTPID1 Peripheral ID register 1, Watchdog Timer 0000 0111 0000 0001
0x4001 WDTPID2 Peripheral ID register 2, Watchdog Timer 0000 0000 0000 0001
0x4002 WDTEMU Emulation Management Register, Watchdog Timer 0000 0000 0000 0000
0x4003 WDTCLK Timer Clock Speed Register, Watchdog Timer 0000 0000 0000 0000
0x4004 WDTGPINT GPIO Interrupt Control Register, Watchdog Timer 0000 0000 0000 0000
0x4005 WDTGPEN GPIO Enable Register, Watchdog Timer 0000 0000 0000 0000
0x4006 WDTGPDAT GPIO Data Register, Watchdog Timer 0000 0000 0000 0000
0x4007 WDTGPDIR GPIO Direction Register, Watchdog Timer 0000 0000 0000 0000
0x4008 WDTCNT1 Timer Counter 1 Register, Watchdog Timer 0000 0000 0000 0000
0x4009 WDTCNT2 Timer Counter 2 Register, Watchdog Timer 0000 0000 0000 0000
0x400A WDTCNT3 Timer Counter 3 Register, Watchdog Timer 0000 0000 0000 0000
0x400B WDTCNT4 Timer Counter 4 Register, Watchdog Timer 0000 0000 0000 0000
0x400C WDTPRD1 Period Register 1, Watchdog Timer 0000 0000 0000 0000
0x400D WDTPRD2 Period Register 2, Watchdog Timer 0000 0000 0000 0000
0x400E WDTPRD3 Period Register 3, Watchdog Timer 0000 0000 0000 0000
0x400F WDTPRD4 Period Register 4, Watchdog Timer 0000 0000 0000 0000
0x4010 WDTCTL1 Timer Control Register 1, Watchdog Timer 0000 0000 0000 0000
0x4011 WDTCTL2 Timer Control Register 2, Watchdog Timer 0000 0000 0000 0000
0x4012 WDTGCTL1 Global Timer Control Register 1, Watchdog Timer 0000 0000 0000 0000
0x4013 Reserved
0x4014 WDTWCTL1 WD Timer Control Register 1, Watchdog Timer 0000 0000 0000 0000
0x4015 WDTWCTL2 WD Timer Control Register 2, Watchdog Timer 0000 0000 0000 0000
{9 TEXAS INSTRUMENTS
Functional Overview
123
December 2002 − Revised November 2008 SPRS206K
Table 3−63. Multichannel Serial Port #0
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x2800 DRR1_0 Data Receive Register 1, McBSP #0 0000 0000 0000 0000
0x2801 DRR2_0 Data Receive Register 2, McBSP #0 0000 0000 0000 0000
0x2802 DXR1_0 Data Transmit Register 1, McBSP #0 0000 0000 0000 0000
0x2803 DXR2_0 Data Transmit Register 2, McBSP #0 0000 0000 0000 0000
0x2804 SPCR1_0 Serial Port Control Register 1, McBSP #0 0000 0000 0000 0000
0x2805 SPCR2_0 Serial Port Control Register 2, McBSP #0 0000 0000 0000 0000
0x2806 RCR1_0 Receive Control Register 1, McBSP #0 0000 0000 0000 0000
0x2807 RCR2_0 Receive Control Register 2, McBSP #0 0000 0000 0000 0000
0x2808 XCR1_0 Transmit Control Register 1, McBSP #0 0000 0000 0000 0000
0x2809 XCR2_0 Transmit Control Register 2, McBSP #0 0000 0000 0000 0000
0x280A SRGR1_0 Sample Rate Generator Register 1, McBSP #0 0000 0000 0000 0001
0x280B SRGR2_0 Sample Rate Generator Register 2, McBSP #0 0010 0000 0000 0000
0x280C MCR1_0 Multichannel Control Register 1, McBSP #0 0000 0000 0000 0000
0x280D MCR2_0 Multichannel Control Register 2, McBSP #0 0000 0000 0000 0000
0x280E RCERA_0 Receive Channel Enable Register Partition A, McBSP #0 0000 0000 0000 0000
0x280F RCERB_0 Receive Channel Enable Register Partition B, McBSP #0 0000 0000 0000 0000
0x2810 XCERA_0 Transmit Channel Enable Register Partition A, McBSP #0 0000 0000 0000 0000
0x2811 XCERB_0 Transmit Channel Enable Register Partition B, McBSP #0 0000 0000 0000 0000
0x2812 PCR0 Pin Control Register, McBSP #0 0000 0000 0000 0000
0x2813 Reserved
0x2814 RCERC_0 Receive Channel Enable Register Partition C, McBSP #0 0000 0000 0000 0000
0x2815 RCERD_0 Receive Channel Enable Register Partition D, McBSP #0 0000 0000 0000 0000
0x2816 XCERC_0 Transmit Channel Enable Register Partition C, McBSP #0 0000 0000 0000 0000
0x2817 XCERD_0 Transmit Channel Enable Register Partition D, McBSP #0 0000 0000 0000 0000
0x2818 RCERE_0 Receive Channel Enable Register Partition E, McBSP #0 0000 0000 0000 0000
0x2819 RCERF_0 Receive Channel Enable Register Partition F, McBSP #0 0000 0000 0000 0000
0x281A XCERE_0 Transmit Channel Enable Register Partition E, McBSP #0 0000 0000 0000 0000
0x281B XCERF_0 Transmit Channel Enable Register Partition F, McBSP #0 0000 0000 0000 0000
0x281C RCERG_0 Receive Channel Enable Register Partition G, McBSP #0 0000 0000 0000 0000
0x281D RCERH_0 Receive Channel Enable Register Partition H, McBSP #0 0000 0000 0000 0000
0x281E XCERG_0 Transmit Channel Enable Register Partition G, McBSP #0 0000 0000 0000 0000
0x281F XCERH_0 Transmit Channel Enable Register Partition H, McBSP #0 0000 0000 0000 0000
{'5 TEXAS INSTRUMENTS
Functional Overview
124 December 2002 − Revised November 2008SPRS206K
Table 3−64. Multichannel Serial Port #1
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x2C00 DRR1_1 Data Receive Register 1, McBSP #1 0000 0000 0000 0000
0x2C01 DRR2_1 Data Receive Register 2, McBSP #1 0000 0000 0000 0000
0x2C02 DXR1_1 Data Transmit Register 1, McBSP #1 0000 0000 0000 0000
0x2C03 DXR2_1 Data Transmit Register 2, McBSP #1 0000 0000 0000 0000
0x2C04 SPCR1_1 Serial Port Control Register 1, McBSP #1 0000 0000 0000 0000
0x2C05 SPCR2_1 Serial Port Control Register 2, McBSP #1 0000 0000 0000 0000
0x2C06 RCR1_1 Receive Control Register 1, McBSP #1 0000 0000 0000 0000
0x2C07 RCR2_1 Receive Control Register 2, McBSP #1 0000 0000 0000 0000
0x2C08 XCR1_1 Transmit Control Register 1, McBSP #1 0000 0000 0000 0000
0x2C09 XCR2_1 Transmit Control Register 2, McBSP #1 0000 0000 0000 0000
0x2C0A SRGR1_1 Sample Rate Generator Register 1, McBSP #1 0000 0000 0000 0001
0x2C0B SRGR2_1 Sample Rate Generator Register 2, McBSP #1 0010 0000 0000 0000
0x2C0C MCR1_1 Multichannel Control Register 1, McBSP #1 0000 0000 0000 0000
0x2C0D MCR2_1 Multichannel Control Register 2, McBSP #1 0000 0000 0000 0000
0x2C0E RCERA_1 Receive Channel Enable Register Partition A, McBSP #1 0000 0000 0000 0000
0x2C0F RCERB_1 Receive Channel Enable Register Partition B, McBSP #1 0000 0000 0000 0000
0x2C10 XCERA_1 Transmit Channel Enable Register Partition A, McBSP #1 0000 0000 0000 0000
0x2C11 XCERB_1 Transmit Channel Enable Register Partition B, McBSP #1 0000 0000 0000 0000
0x2C12 PCR1 Pin Control Register, McBSP #1 0000 0000 0000 0000
0x2C13 Reserved
0x2C14 RCERC_1 Receive Channel Enable Register Partition C, McBSP #1 0000 0000 0000 0000
0x2C15 RCERD_1 Receive Channel Enable Register Partition D, McBSP #1 0000 0000 0000 0000
0x2C16 XCERC_1 Transmit Channel Enable Register Partition C, McBSP #1 0000 0000 0000 0000
0x2C17 XCERD_1 Transmit Channel Enable Register Partition D, McBSP #1 0000 0000 0000 0000
0x2C18 RCERE_1 Receive Channel Enable Register Partition E, McBSP #1 0000 0000 0000 0000
0x2C19 RCERF_1 Receive Channel Enable Register Partition F, McBSP #1 0000 0000 0000 0000
0x2C1A XCERE_1 Transmit Channel Enable Register Partition E, McBSP #1 0000 0000 0000 0000
0x2C1B XCERF_1 Transmit Channel Enable Register Partition F, McBSP #1 0000 0000 0000 0000
0x2C1C RCERG_1 Receive Channel Enable Register Partition G, McBSP #1 0000 0000 0000 0000
0x2C1D RCERH_1 Receive Channel Enable Register Partition H, McBSP #1 0000 0000 0000 0000
0x2C1E XCERG_1 Transmit Channel Enable Register Partition G, McBSP #1 0000 0000 0000 0000
0x2C1F XCERH_1 Transmit Channel Enable Register Partition H, McBSP #1 0000 0000 0000 0000
{9 TEXAS INSTRUMENTS
Functional Overview
125
December 2002 − Revised November 2008 SPRS206K
Table 3−65. HPI
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0xA000 PID LSW PID [15:0]
0xA001 PID MSW PID [31:16]
0xA002 HPWREMU Power and Emulation Management Register 0000 0000 0000 0000
0xA003 Reserved
0xA004 HGPIOINT1 General-Purpose I/O Interrupt Control Register 1 0000 0000 0000 0000
0xA005 HGPIOINT2 General-Purpose I/O Interrupt Control Register 2 0000 0000 0000 0000
0xA006 HGPIOEN General-Purpose I/O Enable Register 0000 0000 0000 0000
0xA007 Reserved
0xA008 HGPIODIR1 General-Purpose I/O Direction Register 1 0000 0000 0000 0000
0xA009 Reserved
0xA00A HGPIODAT1 General-Purpose I/O Data Register 1 xxxx xxxx xxxx xxxx
0xA00B Reserved
0xA00C HGPIODIR2 General-Purpose I/O Direction Register 2 0000 0000 0000 0000
0xA00D Reserved
0xA00E HGPIODAT2 General-Purpose I/O Data Register 2 xxxx xxxx xxxx xxxx
0xA00F − 0xA017 Reserved
0xA018 HPIC Host Port Control Register 0000 0000 0000 1000
0xA019 Reserved
0xA01A HPIAW Host Port Write Address Register xxxx xxxx xxxx xxxx
0xA01B Reserved
0xA01C HPIAR Host Port Read Address Register xxxx xxxx xxxx xxxx
0xA01D − 0xA020 Reserved
x denotes a “don’t care.”
Table 3−66. GPIO
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x3400 IODIR General-purpose I/O Direction Register 0000 0000 0000 0000
0x3401 IODATA General-purpose I/O Data Register 0000 0000 xxxx xxxx
0x4400 PGPIOEN0 Parallel GPIO Enable Register 0 0000 0000 0000 0000
0x4401 PGPIODIR0 Parallel GPIO Direction Register 0 0000 0000 0000 0000
0x4402 PGPIODAT0 Parallel GPIO Data Register 0 0000 0000 0000 0000
0x4403 PGPIOEN1 Parallel GPIO Enable Register 1 0000 0000 0000 0000
0x4404 PGPIODIR1 Parallel GPIO Direction Register 1 0000 0000 0000 0000
0x4405 PGPIODAT1 Parallel GPIO Data Register 1 0000 0000 0000 0000
0x4406 PGPIOEN2 Parallel GPIO Enable Register 2 0000 0000 0000 0000
0x4407 PGPIODIR2 Parallel GPIO Direction Register 2 0000 0000 0000 0000
0x4408 PGPIODAT2 Parallel GPIO Data Register 2 0000 0000 0000 0000
x denotes a “don’t care.”
{'5 TEXAS INSTRUMENTS
Functional Overview
126 December 2002 − Revised November 2008SPRS206K
Table 3−67. Device Revision ID
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x3800 − 0x3803 Die ID Die ID
0x3804 Chip ID (LSW) Defines F# 3LS digits and PG rev 1001 0100 0110 xxxx
0x3805 Chip ID (MSW) Defines F# 3MS digits 0000 0111 0101 0001
0x3806 Sub ID Defines subsytem ID 0000 0000 0000 0000
x denotes a “don’t care.”
Denotes single core
Table 3−68. I2C
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x3C00 I2COAR§I2C Own Address Register 0000 0000 0000 0000
0x3C01 I2CIER I2C Interrupt Enable Register 0000 0000 0000 0000
0x3C02 I2CSTR I2C Status Register 0000 0100 0001 0000
0x3C03 I2CCLKL I2C Clock Low-Time Divider Register 0000 0000 0000 0000
0x3C04 I2CCLKH I2C Clock High-Time Divider Register 0000 0000 0000 0000
0x3C05 I2CCNT I2C Data Count 0000 0000 0000 0000
0x3C06 I2CDRR I2C Data Receive Register 0000 0000 0000 0000
0x3C07 I2CSAR I2C Slave Address Register 0000 0011 1111 1111
0x3C08 I2CDXR I2C Data Transmit Register 0000 0000 0000 0000
0x3C09 I2CMDR I2C Mode Register 0000 0000 0000 0000
0x3C0A I2CISRC I2C Interrupt Source Register 0000 0000 0000 0000
0x3C0B I2CGPIO I2C General-Purpose Register (Not supported) xxxx xxxx xxxx xxxx
0x3C0C I2CPSC I2C Prescaler Register 0000 0000 0000 0000
0x3C0D PID1 I2C Peripheral ID Register 1
0x3C0E PID2 I2C Peripheral ID Register 2
I2CXSR I2C Transmit Shift Register
I2CRSR I2C Receive Shift Register
x denotes a “don’t care.”
§Specifies a unique 5501 I2C address. This register is fully programmable in both 7-bit and 10-bit modes and must be set by the programmer. When
this device is used in conjunction with another I2C device, it must be programmed to the I2C slave address (01011A2A1A0) allocated by Philips
Semiconductor for the 5501 (allocation number: 1946). A2, A1, and A0 are programmable address bits.
{9 TEXAS INSTRUMENTS
Functional Overview
127
December 2002 − Revised November 2008 SPRS206K
Table 3−69. UART
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x9C00 URRBR/
URTHR/
URDLL
Receive Buffer Register
Transmit Holding Register
Divisor Latch LSB Register
xxxx xxxx
0x9C01 URIER/
URDLM§Interrupt Enable Register
Divisor Latch MSB Register 0000 0000
0x9C02 URIIR/
URFCRInterrupt Identification Register
FIFO Control Register 0000 0001
0000 0000
0x9C03 URLCR Line Control Register 0000 0000
0x9C04 URMCR Modem Control Register 0000 0000
0x9C05 URLSR Line Status Register 0110 0000
0x9C07 URSCR Scratch Register xxxx xxxx
0x9C08 URDLLDivisor Latch LSB Register
0x9C09 URDLM§Divisor Latch MSB Register
0x9C0A URPID1 Peripheral ID Register (LSW)
0x9C0B URPID2 Peripheral ID Register (MSW)
0x9C0C URPECR Power and Emulation Control Register 0000 0000 0000 0000
x denotes a “don’t care.”
The registers URRBR, URTHR, and URDLL share one address. URDLL also has a dedicated address. When using the dedicated address, the
DLAB bit can be kept cleared, so that URRBR and URTHR are always selected at the shared address.
If DLAB = 0 : Read Only: URRBR
Write Only: URTHR
If DLAB = 1: Read/Write: URDLL
§The registers URIER and URDLM share one address. URDLM also has a dedicated address. When using the dedicated address, the DLAB bit
can be kept cleared, so that URIER is always selected at the shared address.
If DLAB = 0: Read/WRite: URIER
If DLAB = 1: Read/Write: URDLM
The registers URIIR and URFCR share one address.
Read Only: URIIR
Write Only: URFCR
Table 3−70. External Bus Selection
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x6C00 XBSR External Bus Selection Register 0000 0000 0000 0000
0x8800 XBCR External Bus Control Register 0000 0000 0000 0000
Table 3−71. Clock Mode Register
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x8C00 CLKMD Clock Mode Control Register 0000 0000 0000 0000
Table 3−72. CLKOUT Selector Register
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x8400 CLKOUTSR CLKOUT Selection Register 0000 0000 0000 0010
{'5 TEXAS INSTRUMENTS
Functional Overview
128 December 2002 − Revised November 2008SPRS206K
Table 3−73. Clock Controller Registers
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x1C80 PLLCSR PLL Control Status Register 0000 0000 0000 0000
0x1C82 CK3SEL CLKOUT3 Select Register 0000 0000 0000 1011
0x1C88 PLLM PLL Multiplier Control Register 0000 0000 0000 0000
0x1C8A PLLDIV0 PLL Divider 0 Register 1000 0000 0000 0000
0x1C8C PLLDIV1 PLL Divider 1 Register 1000 0000 0000 0011
0x1C8E PLLDIV2 PLL Divider 2 Register 1000 0000 0000 0011
0x1C90 PLLDIV3 PLL Divider 3 Register 1000 0000 0000 0011
0x1C92 OSCDIV1 Oscillator Divider 1 Register 0000 0000 0000 0000
0x1C98 WKEN Oscillator Wakeup Control Register 0000 0000 0000 0000
Table 3−74. IDLE Control Registers
WORD ADDRESS REGISTER NAME DESCRIPTION RESET VALUE
0x9400 PICR Peripheral IDLE Control Register 0000 0000 0000 0000
0x9401 PISTR Peripheral IDLE Status Register 0000 0000 0000 0000
0x9402 MICR Master IDLE Control Register 0000 0000 0000 0000
0x9403 MISR Master IDLE Status Register 0000 0000 0000 0000
information on selling up and (literature number SPRU371) {9 TEXAS INSTRUMENTS
Functional Overview
129
December 2002 − Revised November 2008 SPRS206K
3.16 Interrupts
Vector-relative locations and priorities for all internal and external interrupts are shown in Table 3−75. For more
information on setting up and using interrupts, please refer to the TMS320C55x DSP CPU Reference Guide
(literature number SPRU371).
Table 3−75. Interrupt Table
NAME SOFTWARE
(TRAP)
EQUIVALENT
LOCATION
(HEX BYTES) PRIORITY FUNCTION
RESET SINT0 0 0 Reset (hardware and software)
NMI SINT1 8 1 Nonmaskable interrupt
INT0 SINT2 10 3 External interrupt #0
INT2 SINT3 18 5 External interrupt #2
TINT0 SINT4 20 6 Timer #0 interrupt
RINT0 SINT5 28 7 McBSP #0 receive interrupt
RINT1 SINT6 30 9 McBSP #1 receive interrupt
XINT1 SINT7 38 10 McBSP #1 transmit interrupt
LCKINT SINT8 40 11 PLL lock interrupt
DMAC1 SINT9 48 13 DMA Channel #1 interrupt
DSPINT SINT10 50 14 Interrupt from host
INT3/WDTINTSINT11 58 15 External interrupt #3 or Watchdog timer interrupt
UART SINT12 60 17 UART interrupt
SINT13 68 18 Software interrupt #13
DMAC4 SINT14 70 21 DMA Channel #4 interrupt
DMAC5 SINT15 78 22 DMA Channel #5 interrupt
INT1 SINT16 80 4 External interrupt #1
XINT0 SINT17 88 8 McBSP #0 transmit interrupt
DMAC0 SINT18 90 12 DMA Channel #0 interrupt
SINT19 98 16 Software interrupt #19
DMAC2 SINT20 A0 19 DMA Channel #2 interrupt
DMAC3 SINT21 A8 20 DMA Channel #3 interrupt
TINT1 SINT22 B0 23 Timer #1 interrupt
IIC SINT23 B8 24 I2C interrupt
BERR SINT24 C0 2 Bus Error interrupt
DLOG SINT25 C8 25 Data Log interrupt
RTOS SINT26 D0 26 Real-time Operating System interrupt
SINT27 D8 27 Software interrupt #27
SINT28 E0 28 Software interrupt #28
SINT29 E8 29 Software interrupt #29
SINT30 F0 30 Software interrupt #30
SINT31 F8 31 Software interrupt #31
WDTINT is generated only when the WDT interrupt pin is connected to INT3 through the TSSR.
(literature number SPRU371) *9 TEXAS INSTRUMENTS
Functional Overview
130 December 2002 − Revised November 2008SPRS206K
3.16.1 IFR and IER Registers
The Interrupt Enable Registers (IER0 and IER1) control which interrupts will be masked or enabled during
normal operation. The Interrupt Flag Registers (IFR0 and IFR1) contain flags that indicate interrupts that are
currently pending.
The Debug Interrupt Enable Registers (DBIER0 and DBIER1) are used only when the CPU is halted in the
real-time emulation mode. If the CPU is running in real-time mode, the standard interrupt processing (IER0/1)
is used and DBIER0/1 are ignored.
A maskable interrupt enabled in DBIER0/1 is defined as a time-critical interrupt. When the CPU is halted in
the real-time mode, the only interrupts that are serviced are time-critical interrupts that are also enabled in an
interrupt enable register (IER0 or IER1).
Write the DBIER0/1 to enable or disable time-critical interrupts. To enable an interrupt, set its corresponding
bit. To disable an interrupt, clear its corresponding bit. Initialize these registers before using the real-time
emulation mode.
A DSP hardware reset clears IFR0/1, IER0/1, and DBIER0/1 to 0. A software reset instruction clears IFR0/1
to 0 but does not affect IER0/1 and DBIER0/1.
The bit layouts of these registers for each interrupt are shown in Figure 3−51 and Figure 3−52. For more
information on the IER, IFR, and DBIER registers, refer to the TMS320C55x DSP CPU Reference Guide
(literature number SPRU371).
15 14 13 12 11 10 9 8
DMAC5 DMAC4 Reserved UART INT3/
WDTINTDSPINT DMAC1 Reserved
R/W, 0 R/W, 0 R/W, 0R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
76543210
XINT1 RINT1 RINT0 TINT0 INT2 INT0 Reserved
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R, 0
LEGEND: R = Read, W = Write, n = value at reset
This bit must be kept zero when writing to IER0.
WDTINT is generated only when the WDT interrupt pin is connected to INT3 through the TSSR.
Figure 3−51. IFR0, IER0, DBIFR0, and DBIER0 Registers Layout
TMS320VC5501/5502 DSP T/‘mers Reference Guide (literature number SPRU618) the TMS320V05501/5502 DSP Host Port Interface {HPU Helerence Guide (\iteramre number SPRU620) *9 TEXAS INSTRUMENTS
Functional Overview
131
December 2002 − Revised November 2008 SPRS206K
15 11 10 9 8
Reserved RTOS DLOG BERR
R, 0 R/W, 0 R/W, 0 R/W, 0
76543210
I2CTINT1 DMAC3 DMAC2 INT4 DMAC0 XINT0 INT1
R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0 R/W, 0
LEGEND: R = Read, W = Write, n = value at reset
Figure 3−52. IFR1, IER1, DBIFR1, and DBIER1 Registers Layout
3.16.2 Interrupt Timing
The external interrupts (NMI and INT) are synchronized to the CPU by way of a two-flip-flop synchronizer. The
interrupt inputs are sampled on falling edges of the CPU clock. A sequence on the interrupt pin of 1–0–0–0
on consecutive cycles is required for an interrupt to be detected. Therefore, the minimum low pulse duration
on the external interrupts on the 5501 is three CPU clock periods.
TIM0, TIM1, WDTOUT, and HPI.HAS can be configured to generate interrupts to the CPU. When they are used
for this function, these pins will generate the interrupt associated with that module, i.e., TIM0 will generate
TINT0, HPI.HAS will generate DSPINT, etc. Three SYSCLK1 clock cycles must be allowed to pass between
consecutive interrupts generated using the HPI.HAS signal; otherwise, the last interrupt will be ignored
(i.e., a sequence of 0−1−1−1−0 on consecutive cycles is required for consecutive interrupts). For more
information on configuring TIM0, TIM1, WDTOUT, and HPI.HAS as interrupt pins, please refer to the
TMS320VC5501/5502 DSP Timers Reference Guide (literature number SPRU618) for the timer pins and to
the TMS320VC5501/5502 DSP Host Port Interface (HPI) Reference Guide (literature number SPRU620) for
the HPI pin.
3.16.3 Interrupt Acknowledge
The IACK pin is used to indicate the receipt of an interrupt and that the program counter is fetching the interrupt
vector location designated on the address bus. As the CPU fetches the first word or the software vector, it
generates the IACK signal, which clears the appropriate interrupt flag bit. The IACK signal will go low for a total
of one CPU clock pulse and then go high again. For maskable interrupts, note that the CPU will not jump to
an interrupt service routine if the appropriate interrupt enable bit is not set; consequently, the IACK pin will not
go low when the interrupt is generated.
*9 TEXAS INSTRUMENTS
Functional Overview
132 December 2002 − Revised November 2008SPRS206K
3.17 Notice Concerning TCK
Under certain conditions, the emulation hardware may corrupt the emulation control state machine or may
cause it to lose synchronization with the emulator software. When emulation commands fail as a result of the
problem, Code Composer Studio Integrated Development Environment (IDE) may be unable to start or it
may report errors when interacting with the TMS320C55x DSP (for example, when halting the CPU,
reaching a breakpoint, etc.).
This phenomenon is observed when an erroneous clock edge is generated from the TCK signal inside the
C55x DSP. This can be caused by several factors, acting independently or cumulatively:
TCK transition times (as measured between 2.4 V and 0.8 V) in excess of 3 ns.
Operating the C55x DSP in a socket, which can aggravate noise or glitches on the TCK input.
Poor signal integrity on the TCK line from reflections or other layout issues.
A TCK edge that can cause this problem might look similar to the one shown in Figure 3−53. A TCK edge that
does not cause the problem looks similar to the one shown in Figure 3−54. The key difference between the
two figures is that Figure 3−54 has a clean and sharp transition whereas Figure 3−53 has a “knee” in the
transition zone. Problematic TCK signals may not have a knee that is as pronounced as the one in
Figure 3−53. Due to the TCK signal amplification inside the chip, any perturbation of the signal can create
erroneous clock edges.
As a result of the faster edge transition, there is increased ringing in Figure 3−54. As long as the ringing does
not cross logic input thresholds (0.8 V for falling edges, and 2.4 V for rising edges), this ringing is acceptable.
When examining a TCK signal for this issue, either in board simulation or on an actual board, it is very important
to probe the TCK line as close to the DSP input pin as possible. In simulation, it should not be difficult to probe
right at the DSP input. For most physical boards, this means using the via for the TCK pad on the back side
of the board. Similarly, ground for the probe should come from one of the nearby ground pad vias to minimize
EMI noise picked up by the probe.
Code Composer Studio, TMS320C55x, and C55x are trademarks of Texas Instruments.
December 2002 7 Revised November 2003 *9 TEXAS INSTRUMENTS
Functional Overview
133
December 2002 − Revised November 2008 SPRS206K
0
4
2
1
3
0 5 10
15
−1 20
Volts (V)
nanoseconds (ns)
2.5 V
0.6 V
Figure 3−53. Bad TCK Transition
Volts (V)
nanoseconds (ns)
0
2
1
3
0 5 10
15
−1 20
4
2.5 V
0.6 V
Figure 3−54. Good TCK Transition
As the problem may be caused by one or more of the above factors, one or more of the steps outlined below
may be necessary to fix it:
Avoid using a socket
Ensure the board design achieves rise times and fall times of less than 3 ns with clean monotonic edges
for the TCK signal.
For designs where TCK is supplied by the emulation pod, implement noise filtering circuitry on the target
board. A sample circuit is shown in Figure 3−55.
*9 TEXAS INSTRUMENTS
Functional Overview
134 December 2002 − Revised November 2008SPRS206K
0.1
mF
SN74LVC1G32
R32
33 W
SN74LVC1G32
0.1
mF
3.3 V 3.3 V
TCK
2
4
8
10
12
14
1
3
5
7
9
11
13
XDS TRST
XDS EMU1
TRST
EMU1/OFF
EMU0
3.3 V
TMS
TDI
TDO
XDS TMS
XDS TDI
XDS TDO
XDS TCK RTN
XDS TCK
XDS EMU0
Figure 3−55. Sample Noise Filtering Circuitry
MicroStar BGA ’” Packaging Reference Guide (literature number SSYZOi 5) (literature number SPRU371) (literature number SPRU374) TMS320C55X DSP Algebraic Instruction Set Reference Guide (literature number SPRU375) 's Guide (literature number SPRU376) 's Guide (literature number SPRU280) TMS320VC5501/5502 DSP Instruction Cache Relerence Guide (literature number SPRUSSO) (literature number SPRU618) (literature number SPRU146 (literature number SPRU620) (literature number SPRUBi 3) Reference Guide (literature number SPRU592) (literature number SPRU621) (literature number SPRU597) TMSS‘ZOl/C SPRZOZOD Application Repurt (literature number SPRA993) *9 TEXAS INSTRUMENTS
Support
135
December 2002 − Revised November 2008 SPRS206K
4 Support
4.1 Notices Concerning JTAG (IEEE 1149.1) Boundary Scan Test Capability
4.1.1 Initialization Requirements for Boundary Scan Test
The TMS320VC5501 uses the JTAG port for boundary scan tests, emulation capability and factory test
purposes. To use boundary scan test, the EMU0 and EMU1/OFF pins must be held HIGH through a rising edge
of the TRST signal prior to the first scan. This operation selects the appropriate TAP control for boundary scan.
If at any time during a boundary scan test a rising edge of TRST occurs when EMU0 or EMU1/OFF are not
high, a factory test mode may be selected preventing boundary scan test from being completed. For this
reason, it is recommended that EMU0 and EMU1/OFF be pulled or driven high at all times during boundary
scan test.
4.1.2 Boundary Scan Description Language (BSDL) Model
BSDL models are available on the web in the TMS320VC5501 product folder under the “simulation models”
section.
4.2 Documentation Support
Extensive documentation supports all TMS320 DSP family of devices from product announcement through
applications development. The following types of documentation are available to support the design and use
of the TMS320C5000 platform of DSPs:
Device-specific data sheets
Complete user’s guides
Development support tools
Hardware and software application reports
MicroStar BGAE Packaging Reference Guide (literature number SSYZ015)
TMS320C55x reference documentation that includes, but is not limited to, the following:
TMS320C55x DSP CPU Reference Guide (literature number SPRU371)
TMS320C55x DSP Mnemonic Instruction Set Reference Guide (literature number SPRU374)
TMS320C55x DSP Algebraic Instruction Set Reference Guide (literature number SPRU375)
TMS320C55x DSP Programmers Guide (literature number SPRU376)
TMS320C55x Assembly Language Tools Users Guide (literature number SPRU280)
TMS320VC5501/5502 DSP Instruction Cache Reference Guide (literature number SPRU630)
TMS320VC5501/5502 DSP Timers Reference Guide (literature number SPRU618)
TMS320VC5501/5502/5503/5507/5509 DSP Inter-Integrated Circuit (I2C) Module Reference Guide
(literature number SPRU146)
TMS320VC5501/5502 DSP Host Port Interface (HPI) Reference Guide (literature number SPRU620)
TMS320VC5501/5502 DSP Direct Memory Access (DMA) Controller Reference Guide
(literature number SPRU613)
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP)
Reference Guide (literature number SPRU592)
TMS320VC5501/5502 DSP External Memory Interface (EMIF) Reference Guide
(literature number SPRU621)
TMS320VC5501/5502 DSP Universal Asynchronous Receiver/Transmitter (UART) Reference Guide
(literature number SPRU597)
TMS320VC5502 and TMS320VC5501 Digital Signal Processors Silicon Errata (literature number
SPRZ020D or later)
TMS320VC5501/02 Power Consumption Summary Application Report (literature number SPRA993)
TMS320 and TMS320C5000 are trademarks of Texas Instruments.
*9 TEXAS INSTRUMENTS
Support
136 December 2002 − Revised November 2008SPRS206K
The reference guides describe in detail the TMS320C55x DSP products currently available and the
hardware and software applications, including algorithms, for fixed-point TMS320 DSP family of devices.
A series of DSP textbooks is published by Prentice-Hall and John Wiley & Sons to support digital signal
processing research and education. The TMS320 DSP newsletter, Details on Signal Processing, is published
quarterly and distributed to update TMS320 DSP customers on product information.
Information regarding TI DSP products is also available on the Worldwide Web at http://www.ti.com uniform
resource locator (URL).
4.3 Device and Development-Support Tool Nomenclature
To designate the stages in the product development cycle, TI assigns prefixes to the part numbers of all DSP
devices and support tools. Each DSP commercial family member has one of three prefixes: TMX, TMP, or TMS
(e.g., TMS320VC5501). Texas Instruments recommends two of three possible prefix designators for its
support tools: TMDX and TMDS. These prefixes represent evolutionary stages of product development from
engineering prototypes (TMX/TMDX) through fully qualified production devices/tools (TMS/TMDS).
Device development evolutionary flow:
TMX Experimental device that is not necessarily representative of the final device’s electrical specifications
TMP Final silicon die that conforms to the device’s electrical specifications but has not completed quality
and reliability verification
TMS Fully qualified production device
Support tool development evolutionary flow:
TMDX Development-support product that has not yet completed Texas Instruments internal qualification
testing.
TMDS Fully qualified development-support product
TMX and TMP devices and TMDX development-support tools are shipped against the following disclaimer:
“Developmental product is intended for internal evaluation purposes.”
TMS devices and TMDS development-support tools have been characterized fully, and the quality and
reliability of the device have been demonstrated fully. TI’s standard warranty applies.
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard
production devices. Texas Instruments recommends that these devices not be used in any production system
because their expected end-use failure rate still is undefined. Only qualified production devices are to be used.
*9 TEXAS INSTRUMENTS
Electrical Specifications
137
December 2002 − Revised November 2008 SPRS206K
5 Electrical Specifications
This section provides the absolute maximum ratings and the recommended operating conditions for the
TMS320VC5501 DSP.
All electrical and switching characteristics in this data manual are valid over the recommended operating
conditions unless otherwise specified.
5.1 Absolute Maximum Ratings
The list of absolute maximum ratings are specified over operating case temperature. Stresses beyond those
listed under Section 5.2, Electrical Specifications, may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated under Section 5.3, Recommended Operating Conditions, is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability. All supply voltage
values (core and I/O) are with respect to VSS. Figure 5−1 provides the test load circuit values for a 3.3-V
device. Measured timing information contained in this data manual is based on the test load setup and
conditions shown in Figure 5−1.
5.2 Electrical Specifications
This section provides the absolute maximum ratings for the TMS320VC5501 DSP.
Supply voltage I/O range, DVDD − 0.3 V to 4.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage core range, CVDD − 0.3 V to 2.0 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI − 0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, Vo − 0.3 V to 4.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating case temperature range, TC −40°C to 85°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range Tstg55_C to 150_C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.3 Recommended Operating Conditions
This section provides the recommended operating conditions for the TMS320VC5501 DSP.
MIN NOM MAX UNIT
DVDD Device supply voltage, I/O 3.0 3.3 3.6 V
CVDD Device supply voltage, core 1.20 1.26 1.32 V
PVDD Device supply voltage, PLL 3.0 3.3 3.6 V
VSS Supply voltage, GND 0 V
VIH
High-level input voltage, I/O
Hysteresis inputs
DVDD = 3.0 − 3.6 V 2.2 DVDD + 0.3
V
VIH High-level input voltage, I/O All other inputs
DVDD = 3.0 − 3.6 V 2 DVDD + 0.3
V
VIL
Low-level input voltage, I/O
Hysteresis inputs
DVDD = 3.0 − 3.6 V −0.3 0.8
V
VIL Low-level input voltage, I/O All other inputs
DVDD = 3.0 − 3.6 V −0.3 0.8
V
IOH High-level output current All outputs − 300 µA
IOL Low-level output current All outputs 1.5 mA
TCOperating case temperature −40 85 °C
lnpul currenl lor outputs m DD v‘ : Vss to DVDD spa/«993’. *9 TEXAS INSTRUMENTS
Electrical Specifications
138 December 2002 − Revised November 2008SPRS206K
5.4 Electrical Characteristics Over Recommended Operating Case Temperature
Range (Unless Otherwise Noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage DVDD = 3.3 ±0.3 V, IOH = MAX 2.4 V
VOL Low-level output voltage IOL = MAX 0.4 V
IIZ
Input current for outputs in
Output-only or
input/output pins
with bus holders
Bus holders enabled
DVDD = MAX, VO = VSS to DVDD − 300 300
A
IIZ
Input current for outputs in
high impedance All other
output-only or
input/output pins DVDD = MAX, VI = VSS to DVDD − 5 5
µA
Input pins with
internal pulldown DVDD = MAX, VI = VSS to DVDD − 5 300
X2/CLKIN DVDD = MAX, VI = VSS to DVDD − 50 50
IIInput current Input pins with
internal pullup Pullup enabled
DVDD = MAX, VI = VSS to DVDD − 300 5µA
All other
input-only pins DVDD = MAX, VI = VSS to DVDD − 5 5
IDDC CVDD supply currentCVDD = Nominal
CPU clock = 300 MHz
TC = 25°C239 mA
IDDD DVDD supply currentDVDD = Nominal
CPU clock = 300 MHz
TC = 25°C39 mA
IDDP PVDD supply currentPVDD = Nominal
20-MHz clock input,
APLL mode = x15 11 mA
CiInput capacitance 3 pF
CoOutput capacitance 3 pF
Current draw is highly application-dependent. The power numbers quoted here are for the sample application described in the
TMS320VC5501/02 Power Consumption Summary application report (literature number SPRA993). The spreadsheet provided with the
application report can be used to estimate the power consumption for a particular application. The spreadsheet also contains the current
consumption that can be expected when running the DSP in its idle configurations.
The sample application can be summarized as follows:
Case temperature: 25°C
APLL: 300 MHz
CPU: 85% utilization
Instruction cache enabled
CLKOUT off
EMIF: 75 MHz, 118% utilization, 100% writes, 32 bits, 100% switching
ECLKOUT1 and ECLKOUT2: Off
HPI: 5Mwords/second, 100% utilization, 100% writes, 100% switching
DMA:
Channel 0: 35% utilization, 32-bit elements, 100% switching (for internal memory to external memory transfers)
Channel 1: 1.56% utilization, 32-bit elements, 100% switching (for internal memory to McBSP0 transfers)
Channel 2: 1.56% utilization, 32-bit elements, 100% switching (for McBSP1 to internal memory transfers)
Channels 3 and 4: 0% utilization (reserved for UART transfers)
Channel 5: 60% utilization (for internal memory to internal memory transfers using Watchdog Timer event)
McBSP0: 25 MHz, 100% utilization, 100% switching
Timer0: 5 MHz, 100% utilization, 100% switching
Timer1: 10 MHz, 100% utilization, 100% switching
WD Timer: 30 MHz, 100% utilization, 100% switching
UART: 9600 baud, 100% utilization
All other peripherals use 0 MHz, 0% utilization
December 2002 7 Revised November 2003 *9 TEXAS INSTRUMENTS
Electrical Specifications
139
December 2002 − Revised November 2008 SPRS206K
Transmission Line
4.0 pF 1.85 pF
Z0 = 50
(see note)
Tester Pin Electronics Data Sheet Timing Reference Point
Output
Under
Test
NOTE: The data sheet provides timing at the device pin. For output timing analysis, the tester pin electronics and its transmission line effects
must be taken into account. A transmission line with a delay of 2 ns or longer can be used to produce the desired transmission line effect.
The transmission line is intended as a load only. It is not necessary to add or subtract the transmission line delay (2 ns or longer) from
the data sheet timings.
42 3.5 nH
Device Pin
(see note)
Input requirements in this data sheet are tested with an input slew rate of < 4 Volts per nanosecond (4 V/ns) at the device pin.
Figure 5−1. 3.3-V Test Load Circuit
5.5 Timing Parameter Symbology
Timing parameter symbols used in the timing requirements and switching characteristics tables are created
in accordance with JEDEC Standard 100. To shorten the symbols, some of the pin names and other related
terminology have been abbreviated as follows:
Lowercase subscripts and their meanings: Letters and symbols and their meanings:
a access time H High
c cycle time (period) L Low
d delay time V Valid
dis disable time Z High impedance
en enable time
f fall time
h hold time
r rise time
su setup time
t transition time
v valid time
w pulse duration (width)
X Unknown, changing, or don’t care level
14a SPRSZUEK *9 TEXAS INSTRUMENTS
Electrical Specifications
140 December 2002 − Revised November 2008SPRS206K
5.6 Clock Options
This section provides the timing requirements and switching characteristics for the various clock options
available on the 5501.
5.6.1 Internal System Oscillator With External Crystal
The 5501 includes an internal oscillator which can be used in conjunction with an external crystal to generate
the input clock to the DSP. The oscillator requires an external crystal connected across the X1 and X2/CLKIN
pins. If the internal oscillator is not used, an external clock source must be applied to the X2/CLKIN pin and
the X1 pin should be left unconnected. Since the internal oscillator can be used as a clock source to the PLL,
the crystal oscillation frequency can be multiplied to generate the input clock to the different clock groups of
the DSP.
GPIO4 is sampled on the rising edge of the reset signal to set the state of the CLKMD0 bit of the Clock Mode
Control Register (CLKMD), which in turns, determines the clock source for the DSP. The CLKMD0 bit selects
either the internal oscillator output (OSCOUT) or the X2/CLKIN pin as the input clock source for the DSP. If
GPIO4 is low at reset, the CLKMD0 bit will be set to ‘0’ and the internal oscillator and the external crystal
generate the input clock for the DSP. If GPIO4 is high, the CLKMD0 bit will be set to ‘1’ and the input clock
will be taken directly from the X2/CLKIN pin.
The crystal should be in fundamental-mode operation, and parallel resonant, with a maximum effective series
resistance (ESR) as specified in Table 5−1. The connection of the required circuit is shown in Figure 5−2.
Under some conditions, all the components shown are not required. The capacitors, C1 and C2, should be
chosen such that the equation below is satisfied. CL in the equation is the load specified for the crystal that
is also specified in Table 5−1.
CL+C1C2
(C1)C2)
X2/CLKIN X1
C1C2
Crystal
RS
Figure 5−2. Internal System Oscillator With External Crystal
Table 5−1. Recommended Crystal Parameters
FREQUENCY RANGE (MHz) MAXIMUM ESR
SPECIFICATIONS ()CLOAD (pF) MAXIMUM
CSHUNT (pF) RS (k)
20−15 40 10 7 0
15−12 40 16 7 0
12−10 40 16 7 2.8
10−8 60 18 7 2.2
8−6 60 18 7 8.8
6−5 80 18 7 14
*9 TEXAS INSTRUMENTS
Electrical Specifications
141
December 2002 − Revised November 2008 SPRS206K
The recommended ESR is presented as a maximum, and theoretically, a crystal with a lower maximum ESR
might seem to meet these specifications. However, it is recommended that crystals with actual maximum ESR
specifications as shown in Table 5−1 be used since this will result in maximum crystal performance reliability.
5.6.2 Layout Considerations
Since parasitic capacitance, inductance, and resistance can be significant in this and any circuit, good PC
board layout practices should always be observed when planning trace routing to the discrete components
used in this oscillator circuit. Specifically, the crystal and the associated discrete components should be
located as close to the DSP as physically possible. Also, X1 and X2/CLKIN traces should be separated as soon
as possible after routing away from the DSP to minimize parasitic capacitance between them, and a ground
trace should be run between these two signal lines. This also helps to minimize stray capacitance between
these two signals.
*9 TEXAS INSTRUMENTS
Electrical Specifications
142 December 2002 − Revised November 2008SPRS206K
5.6.3 Clock Generation in Bypass Mode (APLL Synthesis Disabled)
Table 5−2 and Table 5−3 assume testing over recommended operating conditions (see Figure 5−3).
Table 5−2. CLKIN in Bypass Mode Timing Requirements
NO. MIN MAX UNIT
C7 tc(CI) Cycle time, CLKINAPLL Synthesis Disabled 20 ns
C8 tf(CI) Fall time, CLKIN 10 ns
C9 tr(CI) Rise time, CLKIN 10 ns
C10 tw(CIL) Pulse duration, CLKIN low 0.4 * tc(CI) ns
C11 tw(CIH) Pulse duration, CLKIN high 0.4 * tc(CI) ns
If an external crystal is used, the X2/CLKIN cycle time is limited by the crystal frequency range listed in Table 5−1.
This device utilizes a fully static design and therefore can operate with tc(CI) approaching . The device is characterized at frequencies
approaching 0 Hz.
Table 5−3. CLKOUT in Bypass Mode Switching Characteristics
NO. PARAMETER MIN TYP MAX UNIT
C1 tc(CO) Cycle time, CLKOUT 20 K * tc(CI)§¶ ns
C3 tf(CO) Fall time, CLKOUT 3 ns
C4 tr(CO) Rise time, CLKOUT 3 ns
C5 tw(COL) Pulse duration, CLKOUT low K * tc(CI)/2 − 1 K * tc(CI)/2 + 1 ns
C6 tw(COH) Pulse duration, CLKOUT high K * tc(CI)/2 − 1 K * tc(CI)/2 + 1 ns
§K = divider ratio between CPU clock and system clock selected as CLKOUT. For example, when SYSCLK1 is selected as CLKOUT and SYSCLK1
is set to the CPU clock divided by four, use K = 4.
This device utilizes a fully static design and therefore can operate with tc(CI) approaching . The device is characterized at frequencies
approaching 0 Hz.
C4
C3
CLKOUT
CLKIN
C5
C8
C9
C1
C7
C6
C10 C11
NOTE: The relationship of CLKIN to CLKOUT depends on the system clock selected to drive CLKOUT. The waveform relationship shown in
Figure 5−3 is intended to illustrate the timing parameters only and may differ based on configuration.
Figure 5−3. Bypass Mode Clock Timings
M *9 TEXAS INSTRUMENTS
Electrical Specifications
143
December 2002 − Revised November 2008 SPRS206K
5.6.4 Clock Generation in Lock Mode (APLL Synthesis Enabled)
The frequency of the reference clock provided at the CLKIN pin can be multiplied by a synthesis factor of N
to generate the internal CPU clock cycle. The synthesis factor is determined by:
N+M
D0
where: M = the multiply factor set in the PLLM field of the PLL Multiplier Control Register (PLLM)
D0= the divide factor set in the PLLDIV0 field of the PLL Divider 0 Register (PLLDIV0)
Valid values for M are (multiply by) 2 to 15. Valid values for D0 are (divide by) 1 to 32.
For detailed information on clock generation configuration, see Section 3.9, System Clock Generator.
Table 5−4 and Table 5−5 assume testing over recommended operating conditions (see Figure 5−4).
Table 5−4. CLKIN in Lock Mode Timing Requirements
NO. MIN MAX UNIT
C7 tc(CI) Cycle time, CLKINAPLL synthesis enabled 1083.3 ns
C8 tf(CI) Fall time, CLKIN 10 ns
C9 tr(CI) Rise time, CLKIN 10 ns
If an external crystal is used, the X2/CLKIN cycle time is limited by the crystal frequency range listed in Table 5−1.
The clock frequency synthesis factor and minimum CLKIN cycle time should be chosen such that the resulting CLKOUT cycle time is within the
specified range [tc(CO)].
Table 5−5. CLKOUT in Lock Mode Switching Characteristics
NO. PARAMETER MIN TYP MAX UNIT
C1 tc(CO) Cycle time, CLKOUT 6.66 K * tc(CI)/N§14.29 ns
C3 tf(CO) Fall time, CLKOUT 3 ns
C4 tr(CO) Rise time, CLKOUT 3 ns
C5 tw(COL) Pulse duration, CLKOUT low K * tc(CI)/2N − 1 K * tc(CI)/2N + 1 ns
C6 tw(COH) Pulse duration, CLKOUT high K * tc(CI)/2N − 1 K * tc(CI)/2N + 1 ns
§N = Clock frequency synthesis factor. K = divider ratio between CPU clock and system clock selected as CLKOUT. For example, when SYSCLK1
is selected as CLKOUT and SYSCLK1 is set to the CPU clock divided by four, use K = 4.
202.292.! 30292.? *9 TEXAS INSTRUMENTS
Electrical Specifications
144 December 2002 − Revised November 2008SPRS206K
C1
C7
C6 C3
C4
C8
CLKIN
CLKOUT
C5
C9
Bypass Mode
NOTE: The waveform relationship of CLKIN to CLKOUT depends on the multiply and divide factors chosen for the APLL synthesis and on the
system clock selected to drive CLKOUT. The waveform relationship shown in Figure 5−4 is intended to illustrate the timing parameters
only and may differ based on configuration.
Figure 5−4. External Multiply-by-N Clock Timings
tc EKO! tw EKO1H tw EKO‘L H EK01 td EKIHVEKOtH ‘P W x 1‘ T \ \ / \ / \ y I" \‘ fl \ / \ \ P 4 ‘ ‘ 44 k ECLKIN ’ \ f V‘ l \ I \ l \ l 1 J P H 55 aw V T L 4J‘7 1 fir if ECLKoun _/ \ I \ I i I Si Jr \ December 20027 Revised November 2003 M TEXAS INSTRUMENTS
Electrical Specifications
145
December 2002 − Revised November 2008 SPRS206K
5.6.5 EMIF Clock Options
Table 5−6 through Table 5−8 assume testing over recommended operating conditions (see Figure 5−5
through Figure 5−7).
Table 5−6. EMIF Timing Requirements for ECLKIN†‡
NO. MIN MAX UNIT
E7 tc(EKI) Cycle time, ECLKIN 10 16P ns
E8 tw(EKIH) Pulse duration, ECLKIN high 0.4 * tc(EKI) ns
E9 tw(EKIL) Pulse duration, ECLKIN low 0.4 * tc(EKI) ns
E10 tt(EKI) Transition time, ECLKIN 2 ns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.33 ns.
The reference points for the rise and fall transitions are measured at VIL MAX and VIH MIN.
Table 5−7. EMIF Switching Characteristics for ECLKOUT1§¶#
NO. PARAMETER MIN MAX UNIT
E1 tc(EKO1) Cycle time, ECLKOUT1 E − 1 E + 1 ns
E2 tw(EKO1H) Pulse duration, ECLKOUT1 high EH − 1 EH + 1 ns
E3 tw(EKO1L) Pulse duration, ECLKOUT1 low EL − 1 EL + 1 ns
E4 tt(EKO1) Transition time, ECLKOUT1 1 ns
E5 td(EKIH-EKO1H) Delay time, ECLKIN high to ECLKOUT1 high 3 13 ns
E6 td(EKIL-EKO1L) Delay time, ECLKIN low to ECLKOUT1 low 3 13 ns
§The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
E = the EMIF input clock (CPU clock, CPU/2 clock, or CPU/4 clock) period in ns for EMIF.
#EH is the high period of E (EMIF input clock period) in ns and EL is the low period of E (EMIF input clock period) in ns for EMIF.
ECLKIN
E7
E8
E9
E10
E10
Figure 5−5. ECLKIN Timings for EMIF
E5 E6 E1
E2 E3
ECLKINECLKIN
ECLKOUT1
E4 E4
Figure 5−6. ECLKOUT1 Timings for EMIF Module
‘c EKOZ ‘w EKOZH ‘w EKOZL N EKOZ ‘d EKIHVEKOZH » n W k w ‘ ’\/\7H\1H\/\/\/\/\/ \ \ hi 444 4% x x f x w W \ “W l; ECLKOUT2 J \ { 3* * 3k % fl 146 SPRSZUEK M TEXAS December 2002 7 Revised Novem INSTRUMENTS
Electrical Specifications
146 December 2002 − Revised November 2008SPRS206K
Table 5−8. EMIF Switching Characteristics for ECLKOUT2†‡
NO. PARAMETER MIN MAX UNIT
E11 tc(EKO2) Cycle time, ECLKOUT2 NE − 1 NE + 1 ns
E12 tw(EKO2H) Pulse duration, ECLKOUT2 high 0.5NE − 1 0.5NE + 1 ns
E13 tw(EKO2L) Pulse duration, ECLKOUT2 low 0.5NE − 1 0.5NE + 1 ns
E14 tt(EKO2) Transition time, ECLKOUT2 1 ns
E15 td(EKIH-EKO2H) Delay time, ECLKIN high to ECLKOUT2 high 3 13 ns
E16 td(EKIH-EKO2L) Delay time, ECLKIN high to ECLKOUT2 low 3 13 ns
The reference points for the rise and fall transitions are measured at VOL MAX and VOH MIN.
E = the EMIF input clock (CPU clock, CPU/2 clock, or CPU/4 clock) period in ns for EMIF.
N = the EMIF input clock divider; N = 1, 2, or 4.
E15 E16
ECLKIN
ECLKOUT2
E13
E12
E11
E14 E14
Figure 5−7. ECLKOUT2 Timings for EMIF Module
tsu EDVVAREH th AREHVEDV tsu ARDVVEKO1 H tosu SELVVAREL (on AREHVSEU td EKO|HVAREV tosu SELVVAWEL (on AWEHVSEUV *9 TEXAS INSTRUMENTS
Electrical Specifications
147
December 2002 − Revised November 2008 SPRS206K
5.7 Memory Timings
5.7.1 Asynchronous Memory Timings
Table 5−9 and Table 5−10 assume testing over recommended operating conditions (see Figure 5−8 and
Figure 5−9).
Table 5−9. Asynchronous Memory Cycle Timing Requirements for ECLKIN†‡
NO. MIN MAX UNIT
A3 tsu(EDV-AREH) Setup time, EMIF.Dx valid before EMIF.ARE high 6 ns
A4 th(AREH-EDV) Hold time, EMIF.Dx valid after EMIF.ARE high 1 ns
A6 tsu(ARDY-EKO1H) Setup time, EMIF.ARDY valid before ECLKOUT1 high 3.5 ns
A7 th(EKO1H-ARDY) Hold time, EMIF.ARDY valid after ECLKOUT1 high 1 ns
To ensure data setup time, simply program the strobe width wide enough. EMIF.ARDY is internally synchronized. The EMIF.ARDY signal is
recognized in the cycle for which the setup and hold time is met. To use EMIF.ARDY as an asynchronous input, the pulse width of the EMIF.ARDY
signal should be wide enough (e.g., pulse width = 2E) to ensure setup and hold time is met.
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
Table 5−10. Asynchronous Memory Cycle Switching Characteristics for ECLKOUT1‡§¶
NO. PARAMETER MIN MAX UNIT
A1 tosu(SELV-AREL) Output setup time, select signals valid to EMIF.ARE low RS * E − 1.5 ns
A2 toh(AREH-SELIV) Output hold time, EMIF.ARE high to select signals invalid RH * E − 1.5 ns
A5 td(EKO1H-AREV) Delay time, ECLKOUT1 high to EMIF.ARE valid 1.5 5 ns
A8 tosu(SELV-AWEL) Output setup time, select signals valid to EMIF.AWE low WS * E − 1.5 ns
A9 toh(AWEH-SELIV) Output hold time, EMIF.AWE high to select signals invalid WH * E − 1.5 ns
A10 td(EKO1H-AWEV) Delay time, ECLKOUT1 high to EMIF.AWE valid 1.5 5 ns
RS = Read setup, RST = Read strobe, RH = Read hold, WS = Write setup, WST = Write strobe, WH = Write hold. These parameters are
programmed via the EMIF CE space control registers.
§E = ECLKOUT1 period in ns for EMIF.
Select signals for EMIF include: EMIF.CEx, EMIF.BE[3:0], EMIF.A[21:2], and EMIF.AOE; and for EMIF writes, include EMIF.D[31:0].
\ 1 l ‘ l \ 1 1 ‘ 1 WWW \ 1 \ 1 1 I 1 A w ‘ x k at ——\k 174‘ 1 l 1 11 y— 1 w w 1 ‘ Hm \ \ He — l )5 T41 BE 3 w H W I Pimfl" \ 1 ‘ 1w 41 I )1( 11 1 A1ddress K 1 11 X | ‘ x 1 x W 1 1 “ ‘ y“ r ‘ I I , 1 H 1 ‘ 1 1‘ ‘ M4“ \ l eadD 1 wk ——— —\k 11 \ ‘ R w \1 j— A54>1r7 1 1 4119 1 _——_ LJ ‘ ‘ w ‘ K \ l 1 fl 1., 1 4 1 l EMIEARDV 1 1 ‘ 1 J I 1 14s SPRSZDEK *9 TEXAS INSTRUMENTS
Electrical Specifications
148 December 2002 − Revised November 2008SPRS206K
Setup = 2 Strobe = 3 Not Ready Hold = 2
BE
Address
Read Data A2A1
A2A1
A2A1
A2A1
A5
A4
A3
EMIF.ARDY
A7 A7
A6A6
A5
ECLKOUT1
EMIF.CEx
EMIF.A[21:2]
EMIF.D[31:0]
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/SDCAS/SRE
EMIF.BE[3:0]
EMIF.AWE/SWE/SDWE
EMIF.AOE/SOE/SDRAS, EMIF.ARE/SADS/SDCAS/SRE, and EMIF.AWE/SWE/SDWE operate as EMIF.AOE (identified under select signals),
EMIF.ARE, and EMIF.AWE, respectively, during asynchronous memory accesses.
Figure 5−8. Asynchronous Memory Read Timings
1 1 +7 As 1 1 1 1 1" 4‘11 _ EMIEfi \ 1 1 1 1 1 1 1 1 1 1* A8 1 1 1 1 1 1‘7 4'1 mammal l X 1 BE 1' 1 1 1 X 1 1 1 1 1 P A3 A 1 1 1 F 4 1 1 1 EMIEA[21:2] | X 1 1 “mess 1 1 1 1 X 1 A3 41 1 1 ' 1 1 F 4 1 1 1 EMIED[31:0] 1 1 1 1 write ”a" 1 1 1 1 __ 1 1 1 ‘ 1 1 1 1 1 1 1 1 1 1 _ _ 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 _ fipe ‘ 1* —— 1 1 1 1—W 1 1 L—% ”#4 1 1 1 1 1 4 1? A6 1 4 fl EMIF.AHDV 1 \ December 2002 7 Revised November 2003 U, TEXAS INSTRUMENTS
Electrical Specifications
149
December 2002 − Revised November 2008 SPRS206K
Setup = 2 Strobe = 3 Not Ready Hold = 2
BE
Address
Write Data
A10
A8
A8
A8
A8
A7
A6
ECLKOUT1
EMIF.CEx
EMIF.A[21:2]
EMIF.D[31:0]
EMIF.BE[3:0]
EMIF.ARDY
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/SDCAS/SRE
EMIF.AWE/SWE/SDWE
A7
A6
A10
A9
A9
A9
A9
EMIF.AOE/SOE/SDRAS, EMIF.ARE/SADS/SDCAS/SRE, and EMIF.AWE/SWE/SDWE operate as EMIF.AOE (identified under select signals),
EMIF.ARE, and EMIF.AWE, respectively, during asynchronous memory accesses.
Figure 5−9. Asynchronous Memory Write Timings
‘smEDVrEKOxW ‘d EKOXH'CEV ‘d EKOXH'EEV ‘d EKOXH'EEIV ‘d EKOXH'EAV ‘d EKOXH'EAIV ‘d EKOXH'ADSV ‘d EKOXH'OEV ‘d EKOXH'EDV ‘d EKOXH'EDIV ‘d EKOXH'WEV *9 TEXAS INSTRUMENTS
Electrical Specifications
150 December 2002 − Revised November 2008SPRS206K
5.7.2 Programmable Synchronous Interface Timings
Table 5−11 and Table 5−12 assume testing over recommended operating conditions (see Figure 5−10
through Figure 5−12).
Table 5−11. Programmable Synchronous Interface Timing Requirements
NO. MIN MAX UNIT
PS6 tsu(EDV-EKOxH) Setup time, read EMIF.Dx valid before ECLKOUTx high 2 ns
PS7 th(EKOxH-EDV) Hold time, read EMIF.Dx valid after ECLKOUTx high 1.5 ns
Table 5−12. Programmable Synchronous Interface Switching Characteristics
NO. PARAMETER MIN MAX UNIT
PS1 td(EKOxH-CEV) Delay time, ECLKOUTx high to EMIF.CEx valid 0.8 7 ns
PS2 td(EKOxH-BEV) Delay time, ECLKOUTx high to EMIF.BEx valid 7 ns
PS3 td(EKOxH-BEIV) Delay time, ECLKOUTx high to EMIF.BEx invalid 0.8 ns
PS4 td(EKOxH-EAV) Delay time, ECLKOUTx high to EMIF.Ax valid 7 ns
PS5 td(EKOxH-EAIV) Delay time, ECLKOUTx high to EMIF.Ax invalid 0.8 ns
PS8 td(EKOxH-ADSV) Delay time, ECLKOUTx high to EMIF.SADS/SRE valid 0.8 7 ns
PS9 td(EKOxH-OEV) Delay time, ECLKOUTx high to, EMIF.SOE valid 0.8 7 ns
PS10 td(EKOxH-EDV) Delay time, ECLKOUTx high to EMIF.Dx valid 7 ns
PS11 td(EKOxH-EDIV) Delay time, ECLKOUTx high to EMIF.Dx invalid 0.8 ns
PS12 td(EKOxH-WEV) Delay time, ECLKOUTx high to EMIF.SWE valid 0.8 7 ns
The following parameters are programmable via the EMIF CE Secondary Control Registers (CEx_SC1, CEx_SC2):
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
− EMIF.CEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, EMIF.CEx goes inactive after the final command has
been issued (CEEXT = 0). For synchronous FIFO interface with glue, EMIF.CEx is active when EMIF.SOE is active (CEEXT = 1).
Function of EMIF.SADS/SRE (RENEN): For standard SBSRAM or ZBT SRAM interface, EMIF.SADS/SRE acts as EMIF.SADS with deselect
cycles (RENEN = 0). For FIFO interface, EMIF.SADS/SRE acts as EMIF.SRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to ECLKOUT1 or ECLKOUT2
IEARE/SADS INSTRUMENTS *9 TEXAS
Electrical Specifications
151
December 2002 − Revised November 2008 SPRS206K
ECLKOUTx
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:2]
EMIF.D[31:0]
EMIF.ARE/SADS/
SDCAS/SRE§
EMIF.AOE/SOE/SDRAS§
EMIF.AWE/SWE/SDWE§
BE1 BE2 BE3 BE4
Q1 Q2 Q3 Q4
PS9
PS1
PS4 PS5
PS8
PS9
PS6 PS7
PS3
PS1
PS2
BE1 BE2 BE3 BE4
A1 A2 EA3 A4
PS8
READ latency = 2
A3
The read latency and the length of EMIF.CEx assertion are programmable via the SYNCRL and CEEXT fields, respectively, in the EMIF CE
Secondary Control Registers (CEx_SC1, CEx_SC2). In the figure, SYNCRL = 2 and CEEXT = 0.
The following parameters are programmable via the EMIF CE Secondary Control Registers (CEx_SC1, CEx_SC2):
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
− EMIF.CEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, EMIF.CEx goes inactive after the final command has
been issued (CEEXT = 0). For synchronous FIFO interface with glue, EMIF.CEx is active when EMIF.SOE is active (CEEXT = 1).
Function of EMIF.SADS/SRE (RENEN): For standard SBSRAM or ZBT SRAM interface, EMIF.SADS/SRE acts as EMIF.SADS with deselect
cycles (RENEN = 0). For FIFO interface, EMIF.SADS/SRE acts as EMIF.SRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to ECLKOUT1 or ECLKOUT2
§EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, and EMIF.AWE/SWE/SDWE operate as EMIF.SADS/SRE, EMIF.SOE, and
EMIF.SWE, respectively, during programmable synchronous interface accesses.
Figure 5−10. Programmable Synchronous Interface Read Timings (With Read Latency = 2)
ECLKOUTX EMIF.E[3 :0] EMIF.A[21:2] EMIF.D[31:0] EMIEARE/SADS/SDCAS/SRH EMIEAOE/SOE/SDRAS* \ ( / \ 4 \ _ L—k HF { EMIF.CExT ‘ ‘ \ ‘ x W H 1 | ‘ ‘ X X X ‘ | I ‘ fT x W 1 I r—‘r b F-XF x W 1 x ‘ #4 —q 1 ‘r ‘ \ \ w H 1 52 SPRSZDEK *9 TEXAS INSTRUMENTS
Electrical Specifications
152 December 2002 − Revised November 2008SPRS206K
ECLKOUTx
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:2]
EMIF.D[31:0]
EMIF.ARE/SADS/SDCAS/SRE
EMIF.AOE/SOE/SDRAS
EMIF.AWE/SWE/SDWE
BE1 BE2 BE3 BE4
Q1 Q2 Q3 Q4
PS12
PS11
PS3
PS1
PS12
PS10
PS4
PS2
PS1
PS8
PS5
PS8
A1 A2 A3 A4
PS10
The write latency and the length of EMIF.CEx assertion are programmable via the SYNCWL and CEEXT fields, respectively, in the EMIF CE
Secondary Control Registers (CEx_SC1, CEx_SC2). In this figure, SYNCWL = 0 and CEEXT = 0.
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, and EMIF.AWE/SWE/SDWE operate as EMIF.SADS/SRE, EMIF.SOE, and
EMIF.SWE, respectively, during programmable synchronous interface accesses.
Figure 5−11. Programmable Synchronous Interface Write Timings (With Write Latency = 0)
ECLKOUTX — \ EMIECEXT —‘—\_‘_'—V_/—‘— \ EMIEEmJ] I EMIF.A[21:2] | EMIEAOE/SOE/SDRAS9 EMIEAWE/SWEs—DWE§ M 4‘ \ \ \ ‘ \ ‘ 7—4 W W EMIF.D[31:DJ —y—(:X:t:X:X:::X:)O— ‘ L—L EMIF.A— DS/ \ ‘ \ SDCAS/SRE§ ‘ December 2002 7 Revised ND *9 TEXAS INSTRUMENTS
Electrical Specifications
153
December 2002 − Revised November 2008 SPRS206K
ECLKOUTx
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:2]
EMIF.D[31:0]
EMIF.ARE/SADS/
SDCAS/SRE§
EMIF.AOE/SOE/SDRAS§
EMIF.AWE/SWE/SDWE§
BE1 BE2 BE3 BE4
Q1 Q2 Q3
PS11
PS3
PS12
PS10
PS4
PS2
PS1
PS8
PS5
PS8
A1 A2 A3 A4
PS10
Write
Latency =
1
PS1
Q4
PS12
The write latency and the length of EMIF.CEx assertion are programmable via the SYNCWL and CEEXT fields, respectively, in the EMIF CE
Secondary Control Registers (CEx_SC1, CEx_SC2). In this figure, SYNCWL = 1 and CEEXT = 0.
The following parameters are programmable via the EMIF CE Secondary Control Registers (CEx_SC1, CEx_SC2):
Read latency (SYNCRL): 0-, 1-, 2-, or 3-cycle read latency
Write latency (SYNCWL): 0-, 1-, 2-, or 3-cycle write latency
− EMIF.CEx assertion length (CEEXT): For standard SBSRAM or ZBT SRAM interface, EMIF.CEx goes inactive after the final command has
been issued (CEEXT = 0). For synchronous FIFO interface with glue, EMIF.CEx is active when EMIF.SOE is active (CEEXT = 1).
Function of EMIF.SADS/SRE (RENEN): For standard SBSRAM or ZBT SRAM interface, EMIF.SADS/SRE acts as EMIF.SADS with deselect
cycles (RENEN = 0). For FIFO interface, EMIF.SADS/SRE acts as EMIF.SRE with NO deselect cycles (RENEN = 1).
Synchronization clock (SNCCLK): Synchronized to ECLKOUT1 or ECLKOUT2
§EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, and EMIF.AWE/SWE/SDWE operate as EMIF.SADS/SRE, EMIF.SOE, and
EMIF.SWE, respectively, during programmable synchronous interface accesses.
Figure 5−12. Programmable Synchronous Interface Write Timings (With Write Latency = 1)
‘suIEDVrEKOI H) ‘d EKOIHVCEV ‘d EKOIHVBEV ‘d EKOIHVBEIV ‘d EKOIHVEAV ‘d EKOIHVEAIV ‘d EKOIHVCASV ‘d EKOIHVEDV ‘d EKOIHVEDI ‘d EKOIHVWEV ‘d EKOIHVRASV /\? /‘ /‘\‘/ / {\ _ WW I I I I I ‘ I I I _ I W I 1 H I I‘ ‘x x ‘X ‘X X ‘ I WW I I I I X x ‘ ‘ I I I ‘ I I [ X ‘X ‘ ‘ | I IHF I ‘ I |‘\ \ I *9 TEXAS INSTRUMENTS
Electrical Specifications
154 December 2002 − Revised November 2008SPRS206K
5.7.3 Synchronous DRAM Timings
Table 5−13 and Table 5−14 assume testing over recommended operating conditions (see Figure 5−13
through Figure 5−20).
Table 5−13. Synchronous DRAM Cycle Timing Requirements
NO. MIN MAX UNIT
SD6 tsu(EDV-EKO1H) Setup time, read EMIF.Dx valid before ECLKOUT1 high 2 ns
SD7 th(EKO1H-EDV) Hold time, read EMIF.Dx valid after ECLKOUT1 high 2 ns
Table 5−14. Synchronous DRAM Cycle Switching Characteristics
NO. PARAMETER MIN MAX UNIT
SD1 td(EKO1H-CEV) Delay time, ECLKOUT1 high to EMIF.CEx valid/invalid 0.8 7 ns
SD2 td(EKO1H-BEV) Delay time, ECLKOUT1 high to EMIF.BEx valid 7 ns
SD3 td(EKO1H-BEIV) Delay time, ECLKOUT1 high to EMIF.BEx invalid 0.8 ns
SD4 td(EKO1H-EAV) Delay time, ECLKOUT1 high to EMIF.Ax valid 7 ns
SD5 td(EKO1H-EAIV) Delay time, ECLKOUT1 high to EMIF.Ax invalid 0.8 ns
SD8 td(EKO1H-CASV) Delay time, ECLKOUT1 high to EMIF.SDCAS valid 0.8 7 ns
SD9 td(EKO1H-EDV) Delay time, ECLKOUT1 high to EMIF.Dx valid 7 ns
SD10 td(EKO1H-EDIV) Delay time, ECLKOUT1 high to EMIF.Dx invalid 0.8 ns
SD11 td(EKO1H-WEV) Delay time, ECLKOUT1 high to EMIF.SDWE valid 0.8 7 ns
SD12 td(EKO1H-RASV) Delay time, ECLKOUT1 high to EMIF.SDRAS valid 0.8 7 ns
SD13 td(EKO1H-CKEV) Delay time, ECLKOUT1 high to EMIF.SDCKE valid 0.8 7 ns
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[11:2]
EMIF.D[31:0]
EMIF.A12
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/
SDCAS/SRE
EMIF.AWE/SWE/SDWE
EMIF.A[21:13]
BE1 BE2 BE3 BE4
Bank
Column
D1 D2 D3 D4
SD8
SD7
SD6
SD5
SD5
SD5
SD1
SD3
SD2
SD8
SD4
SD4
SD4
SD1
READ
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−13. SDRAM Read Command (CAS Latency 3)
IEARE/SADS INSTRUMENTS *9 TEXAS
Electrical Specifications
155
December 2002 − Revised November 2008 SPRS206K
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[11:2]
EMIF.D[31:0]
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/
SDCAS/SRE
EMIF.AWE/SWE/SDWE
EMIF.A12
EMIF.A[21:13]
BE1 BE2 BE3 BE4
Bank
Column
D1 D2 D3 D4
SD11
SD8
SD9
SD5
SD5
SD5
SD2
SD1
SD11
SD8
SD9
SD4
SD4
SD2
SD1
SD10
SD3
SD4
WRITE
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−14. SDRAM Write Command
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13]
EMIF.D[31:0]
EMIF.A12
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/
SDCAS/SRE
EMIF.AWE/SWE/SDWE
Bank Activate
Row Address
Row Address
SD12
SD5
SD5
SD5
SD1
EMIF.A[11:2]
ACTV
SD12
SD4
SD4
SD4
SD1
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−15. SDRAM ACTV Command
Electrical Specifications
156 December 2002 − Revised November 2008SPRS206K
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13, 11:2]
EMIF.D[31:0]
EMIF.A12
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/SDCAS/SRE
EMIF.AWE/SWE/SDWE
SD11
SD12
SD5
SD1
DCAB
SD11
SD12
SD4
SD1
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−16. SDRAM DCAB Command
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13]
EMIF.D[31:0]
EMIF.A12
EMIF.AOE/SOE/SDRAS
E
MIF.ARE/SADS/SDCAS/SRE
EMIF.AWE/SWE/SDWE
EMIF.A[11:2]
Bank
SD11
SD12
SD5
SD5
SD1
DEAC
SD11
SD12
SD4
SD4
SD1
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−17. SDRAM DEAC Command
‘: IEARE/SADS % % W % : IEARE/SADS INSTRUMENTS *9 TEXAS
Electrical Specifications
157
December 2002 − Revised November 2008 SPRS206K
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13, 11:2]
EMIF.D[31:0]
EMIF.A12
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/
SDCAS/SRE
EMIF.AWE/SWE/SDWE
SD8
SD12
SD1
REFR
SD8
SD12
SD1
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−18. SDRAM REFR Command
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:2]
EMIF.D[31:0]
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/
SDCAS/SRE
EMIF.AWE/SWE/SDWE
MRS value
SD11
SD8
SD12
SD5
SD1
MRS
SD11
SD8
SD12
SD4
SD1
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−19. SDRAM MRS Command
ECLKOUT1 % \ EMIRE \ ‘ / ‘ \ \ _ \ EMIF.BE[3:0] | \ K 1 w ‘ , \ EMIF.A[21:13, ":21 | EMIF.AI2 | ‘ 2 1 \ EMIF.D[31:0] [ EMIEAOE/SOE/SDRAS? EMIF R ESADS/ SDCAS/SRET \ \ \ \ \ \ EMIEAWE/SWE/SDWE? \ \ \ £44444!“ \ ‘ ‘ 1 ‘ w \ \ ‘ \ \ \ ‘ ‘ i \ ; 1 sun 4H 7% 1 SD % EMIF.SDCKE 3k \ 7K 155 SPRSZDEK *9 TEXAS INSTRUMENTS
Electrical Specifications
158 December 2002 − Revised November 2008SPRS206K
End Self-Refresh
Self Refresh
SD13
SD13
ECLKOUT1
EMIF.CEx
EMIF.BE[3:0]
EMIF.A[21:13, 11:2]
EMIF.A12
EMIF.D[31:0]
EMIF.AOE/SOE/SDRAS
EMIF.ARE/SADS/
SDCAS/SRE
EMIF.AWE/SWE/SDWE
EMIF.SDCKE
TRAS cycles
EMIF.ARE/SADS/SDCAS/SRE, EMIF.AWE/SWE/SDWE, and EMIF.AOE/SOE/SDRAS operate as EMIF.SDCAS, EMIF.SDWE, and
EMIF.SDRAS, respectively, during SDRAM accesses.
Figure 5−20. SDRAM Self-Refresh Timings
td HOLDLVEMH td EMHZVHOLDAL td HOLDHVEM td EMLZVHOLDAH td HOLDLVEKOH ‘ HH—w 1 r—w December 2002 7 Revised November 2003 M TEXAS INSTRUMENTS
Electrical Specifications
159
December 2002 − Revised November 2008 SPRS206K
5.8 HOLD/HOLDA Timings
Table 5−15 and Table 5−16 assume testing over recommended operating conditions (see Figure 5−21).
Table 5−15. EMIF.HOLD/HOLDA Timing Requirements
NO. MIN MAX UNIT
H3 toh(HOLDAL-HOLDL) Hold time, EMIF.HOLD low after EMIF.HOLDA low E ns
E = the EMIF input clock (ECLKIN, CPU/1 clock, CPU1/2 clock, or CPU1/4 clock) period in ns for EMIF.
Table 5−16. EMIF.HOLD/HOLDA Switching Characteristics†‡§
NO. PARAMETER MIN MAX UNIT
H1 td(HOLDL-EMHZ) Delay time, EMIF.HOLD low to EMIF Bus high impedance 4E ns
H2 td(EMHZ-HOLDAL) Delay time, EMIF Bus high impedance to EMIF.HOLDA low 0 2E ns
H4 td(HOLDH-EMLZ) Delay time, EMIF.HOLD high to EMIF Bus low impedance 2E 7E ns
H5 td(EMLZ-HOLDAH) Delay time, EMIF Bus low impedance to EMIF.HOLDA high 0 2E ns
H6 td(HOLDL-EKOHZ) Delay time, EMIF.HOLD low to ECLKOUTx high impedance 4E ns
H7 td(HOLDH-EKOLZ) Delay time, EMIF.HOLD high to ECLKOUTx low impedance 2E 7E ns
E = the EMIF input clock (ECLKIN, CPU/1 clock, CPU1/2 clock, or CPU1/4 clock) period in ns for EMIF.
EMIF Bus consists of: EMIF.CE[3:0], EMIF.BE[3:0], EMIF.D[31:0], EMIF.A[21:2], EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, and
EMIF.AWE/SWE/SDWE, EMIF.SDCKE, and EMIF.SOE3.
§The EKxHZ bits in the EMIF Global Control Registers (EGCR1, EGCR2) determine the state of the ECLKOUTx signals during EMIF.HOLDA.
If EKxHZ = 0, ECLKOUTx continues clocking during HOLD mode. If EKxHZ = 1, ECLKOUTx goes to high impedance during HOLD mode, as
shown in Figure 5−21.
All pending EMIF transactions are allowed to complete before EMIF.HOLDA is asserted. If no bus transactions are occurring, then the minimum
delay time can be achieved. Also, bus hold can be indefinitely delayed by setting NOHOLD = 1.
EMIF.HOLD
EMIF.HOLDA
EMIF Bus
DSP Owns Bus External Requestor
Owns Bus DSP Owns Bus
5501
H1
H3
H2 H5
H4
ECLKOUTx
ECLKOUTx
H6 H7
EMIF Bus consists of: EMIF.CE[3:0], EMIF.BE[3:0], EMIF.D[31:0], EMIF.A[21:2], EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, and
EMIF.AWE/SWE/SDWE, EMIF.SDCKE, and EMIF.SOE3.
Figure 5−21. EMIF.HOLD/HOLDA Timings
‘d RSLVEMIFH De‘ay time, m high m EMIF gmup vandt ‘d RSLrHIGH‘V — ~ De‘ay time, W high to high group vahd§ ‘d RSLVZH De‘ay time, RESET high to 2 group mam ‘d RSLVIOIM *9 TEXAS INSTRUMENTS
Electrical Specifications
160 December 2002 − Revised November 2008SPRS206K
5.9 Reset Timings
Table 5−17 and Table 5−18 assume testing over recommended operating conditions (see Figure 5−22).
Table 5−17. Reset Timing Requirements
NO. MIN MAX UNIT
R1 tw(RSL) Pulse width, RESET low 2P + 5 ns
P = the period of the clock on the X2/CLKIN pin in ns. For example, when using 20 MHz as the input clock, use P = 50 ns.
Table 5−18. Reset Switching Characteristics
NO. PARAMETER MIN MAX UNIT
R2 td(RSL-EMIFHZ) Delay time, RESET low to EMIF group high impedance12 ns
R3
td(RSH-EMIFV)
Delay time, RESET high to EMIF group valid
GPIO4 = 0 (CLKMOD = 0) 41115P + 21
ns
R3
td(RSH-EMIFV) Delay time, RESET high to EMIF group valid
GPIO4 = 1 (CLKMOD = 1) 148P + 22 ns
R4 td(RSL-HIGHIV) Delay time, RESET low to high group invalid§12 ns
R5
td(RSH-HIGHV)
Delay time, RESET high to high group valid§
GPIO4 = 0 (CLKMOD = 0) 41044P + 17
ns
R5
t
d(RSH-HIGHV)
Delay time, RESET high to high group valid§
GPIO4 = 1 (CLKMOD = 1) 77P + 18
ns
R6 td(RSL-ZHZ) Delay time, RESET low to Z group high impedance10 ns
R7
td(RSH-ZV)
Delay time, RESET high to Z group invalid
GPIO4 = 0 (CLKMOD = 0) 41044P + 18
ns
R7
t
d(RSH-ZV)
Delay time, RESET high to Z group invalid
GPIO4 = 1 (CLKMOD = 1) 77P + 19
ns
R8 td(RSL-IOIM) Delay time, RESET low to Input/Output group switch to input mode#13 ns
R9 td(RSL-TGLD) Delay time, RESET low to Toggle group switch to default toggle frequency|| 11 + 14P ns
P = the period of the clock on the X2/CLKIN pin in ns. For example, when using 20 MHz as the input clock, use P = 50 ns.
EMIF group: EMIF.A[21:2], EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, EMIF.AWE/SWE/SDWE, EMIF.ARDY, EMIF.CE0,
EMIF.CE1, EMIF.CE2, EMIF.CE3, EMIF.BE0, EMIF.BE1, EMIF.BE2, EMIF.BE3, EMIF.SDCKE, EMIF.SOE3, EMIF.HOLD, EMIF.HOLDA,
ECLKOUT1.
EMIF.ARDY and EMIF.HOLDA do not go to a high-impedance state during reset since they are input-only signals; they are included here simply
for completeness.
§High group: IACK, XF, SCL (assumes external pullup on pin), SDA (assumes external pullup on pin), UART.TX, TDO.
Z group: HRDY, HINT, DX1, DX0
#Input/Output group: PGPIO[45:0], HPI.HD[7:0], EMIF.D[31:0], HPI.HAS, HPI.HBIL, HCNTL1, HCNTL0, HCS, HR/W, HDS1, HDS2,
NMI/WDTOUT, GPIO[7:0], TIM0, TIM1, CLKR0, CLKX0, FSR0, FSX0, CLKR1, CLKX1, FSR1, FSX1, EMU0, EMU1/OFF. Signals in this group
switch to input mode with reset.
|| Toggle group: ECLKOUT2, CLKOUT. Pins in this group toggle with a default frequency during reset.
H H w \ H k fl \ O'6'"9'VO'OVO'O'O'O'O'O'O'OV'O'OV' ' §§§§§§§ \ %$292ototototéototéotofotofoflotofofo! \ H 4H \ \ v F7 \ W 1 9.2a:.2.2.2.2.2.2.2¢.2.2¢.2.2¢.2.2.2.2 ~—-r F’ % 9'W0'Wo'9'.'o'o'o'o'o'o'wo'w ' W m2m¢¢¢¢¢¢222¢¢¢2¢2 \ """0' WV".v"nnnnnnv.".n."."."nuwnnnnvuw fofofofofo’ ‘of.2o30392o20292oto!o2o20392~20!o2«to!o2020292o20392.20292oto!o2o20292oto!ofofofofofofofofofofofofofofotofofotof \ r w "n", ‘y.vv..v..v..v.n..v.n...."."."."....".."wwwwv fotofofofofg’o’ ‘292o20292o20292o20292o20392«to!o2020292«to!o2o20292.20292o20292o20292ofofofofofofofotofofotofofofofofofofofotof *9 TEXAS INSTRUMENTS
Electrical Specifications
161
December 2002 − Revised November 2008 SPRS206K
R1
R4
R6
R3
R5
R7
RESET
EMIF Group†‡
High Group†§
Z Group†¶
R8
Input/Output Group†#
R9
Toggle Group||
The state of the DSP pins during power up is undefined until RESET is asserted. It is recommended that the RESET pin be kept low during
power up.
EMIF group: EMIF.A[21:2], EMIF.ARE/SADS/SDCAS/SRE, EMIF.AOE/SOE/SDRAS, EMIF.AWE/SWE/SDWE, EMIF.ARDY, EMIF.CE0
,
EMIF.CE1, EMIF.CE2, EMIF.CE3, EMIF.BE0, EMIF.BE1, EMIF.BE2, EMIF.BE3, EMIF.SDCKE, EMIF.SOE3, EMIF.HOLD, EMIF.HOLDA
,
ECLKOUT1.
EMIF.ARDY and EMIF.HOLDA do not go to a high-impedance state during reset since they are input-only signals; they are included here simpl
y
for completeness.
§High group: IACK, XF, SCL (assumes external pullup on pin), SDA (assumes external pullup on pin), UART.TX, TDO.
Z group: HRDY, HINT, DX1, DX0
#Input/Output group: PGPIO[45:0], HPI.HD[7:0], EMIF.D[31:0], HPI.HAS, HPI.HBIL, HCNTL1, HCNTL0, HCS, HR/W, HDS1, HDS2
,
NMI/WDTOUT, GPIO[7:0], TIM0, TIM1, CLKR0, CLKX0, FSR0, FSX0, CLKR1, CLKX1, FSR1, FSX1, EMU0, EMU1/OFF. Signals in this group
switch to input mode with reset.
|| Toggle group: ECLKOUT2, CLKOUT. Pins in this group toggle with a default frequency during reset.
R2
Figure 5−22. Reset Timings
w at x x — '0vow.wovwwo‘wwwo'w W“vowWWo‘wwwwwwwo‘wo' tototoxofotofofm‘ofofofotofiofotofiofo‘ .o3of.2of.2.2otot.to!ofofa‘ofo’akoxofiofofofofotototofiof \ x H 7» *9 TEXAS INSTRUMENTS
Electrical Specifications
162 December 2002 − Revised November 2008SPRS206K
5.10 External Interrupt and Interrupt Acknowledge (IACK) Timings
Table 5−19 and Table 5−20 assume testing over recommended operating conditions (see Figure 5−23 and
Figure 5−24).
Table 5−19. External Interrupt and Interrupt Acknowledge Timing Requirements
NO. MIN MAX UNIT
I1 tw(INTL)A Pulse width, interrupt low, CPU active 3Pns
I2 tw(INTH)A Pulse width, interrupt high, CPU active 1Pns
P = 1/CPU clock frequency in ns. For example, when running parts at 300 MHz, use P = 3.33 ns.
Table 5−20. External Interrupt and Interrupt Acknowledge Switching Characteristics
NO. PARAMETER MIN MAX UNIT
I3 td(COH-IACKV) Delay time, CLKOUT high to IACK valid0 8 ns
In this case, CLKOUT refers to the CPU clock. Since CLKOUT cannot be programmed to reflect the CPU clock, there might be an extra delay
of a certain number of CPU clocks based on the ratio between the system clock shown on CLKOUT and the CPU clock. For example, if SYSCLK2
is shown on CLKOUT and SYSCLK2 is programmed to be half the CPU clock, there might be an extra delay of one CPU clock period between
the transition of CLKOUT and the specified timing. If system clock is programmed to be one-fourth of the CPU clock, there might be an extra delay
of 1, 2, or 3 CPU clocks between the transition of CLKOUT and the specified timing. The extra delay must be taken into account when considering
the MAX value for the timing under question. Note that if the CPU clock and the system clock shown on CLKOUT are operating at the same
frequency, there will be no extra delay in the specified timing.
I2
I1
INTx, NMI
Figure 5−23. External Interrupt Timings
I3 I3
CLKOUT
IACK
NOTE: The figure shows the case in which CLKOUT is programmed to show a system clock that is operating at the same frequency as
the CPU clock.
Figure 5−24. External Interrupt Acknowledge Timings
4/ \ / \ *9 TEXAS INSTRUMENTS
Electrical Specifications
163
December 2002 − Revised November 2008 SPRS206K
5.11 XF Timings
Table 5−21 assumes testing over recommended operating conditions (see Figure 5−25).
Table 5−21. XF Switching Characteristics
NO. PARAMETER MIN MAX UNIT
X1
td(XF)
Delay time, CLKOUT high to XF high0 5
ns
X1
td(XF) Delay time, CLKOUT high to XF low0 6 ns
In this case, CLKOUT refers to the CPU clock. Since CLKOUT cannot be programmed to reflect the CPU clock, there might be an extra delay
of a certain number of CPU clocks based on the ratio between the system clock shown on CLKOUT and the CPU clock. For example, if SYSCLK2
is shown on CLKOUT and SYSCLK2 is programmed to be half the CPU clock, there might be an extra delay of one CPU clock period between
the transition of CLKOUT and the specified timing. If system clock is programmed to be one-fourth of the CPU clock, there might be an extra delay
of 1, 2, or 3 CPU clocks between the transition of CLKOUT and the specified timing. The extra delay must be taken into account when considering
the MAX value for the timing under question. Note that if the CPU clock and the system clock shown on CLKOUT are operating at the same
frequency, there will be no extra delay in the specified timing.
X1
CLKOUT
XF
NOTE: The figure shows the case in which CLKOUT is programmed to show a system clock that is operating at the same frequency as
the CPU clock.
Figure 5−25. XF Timings
1su¢eplacom ‘thOHrGP‘CD ‘dlCOHrGP‘CD *9 TEXAS INSTRUMENTS
Electrical Specifications
164 December 2002 − Revised November 2008SPRS206K
5.12 General-Purpose Input/Output (GPIOx) Timings
Table 5−22 and Table 5−23 assume testing over recommended operating conditions (see Figure 5−26).
Table 5−22. GPIO Pins Configured as Inputs Timing Requirements
NO. MIN MAX UNIT
G2 tsu(GPIO–COH) Setup time, GPIOx input valid before CLKOUT high5 ns
G3 th(COH–GPIO) Hold time, GPIOx input valid after CLKOUT high0 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
Table 5−23. GPIO Pins Configured as Outputs Switching Characteristics
NO. PARAMETER MIN MAX UNIT
G1 td(COH–GPIO) Delay time, CLKOUT high to GPIOx output change0 8 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
G1
G2
G3
CLKOUT
GPIOx
Input Mode
GPIOx
Output Mode
Figure 5−26. General-Purpose Input/Output (GPIOx) Signal Timings
tsuwepxmcom *9 TEXAS INSTRUMENTS
Electrical Specifications
165
December 2002 − Revised November 2008 SPRS206K
5.13 Parallel General-Purpose Input/Output (PGPIOx) Timings
Table 5−24 and Table 5−25 assume testing over recommended operating conditions (see Figure 5−27).
Table 5−24. PGPIO Pins Configured as Inputs Timing Requirements
NO. MIN MAX UNIT
PG2 tsu(PGPIO–COH) Setup time, PGPIOx input valid before CLKOUT high6 ns
PG3 th(COH–PGPIO) Hold time, PGPIOx input valid after CLKOUT high0 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
Table 5−25. PGPIO Pins Configured as Outputs Switching Characteristics
NO. PARAMETER MIN MAX UNIT
PG1 td(COH–PGPIO) Delay time, CLKOUT high to PGPIOx output change0 10 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
PG1
PG2
PG3
CLKOUT
PGPIOx
Input Mode
PGPIOx
Output Mode
Figure 5−27. Parallel General-Purpose Input/Output (PGPIOx) Signal Timings
‘meu ‘d COHrTIMH ‘d COHrTIML ‘w T‘M *9 TEXAS INSTRUMENTS
Electrical Specifications
166 December 2002 − Revised November 2008SPRS206K
5.14 TIM0/TIM1/WDTOUT Timings
5.14.1 TIM0/TIM1/WDTOUT Timer Pin Timings
Table 5−26 and Table 5−27 assume testing over recommended operating conditions (see Figure 5−28 and
Figure 5−29).
Table 5−26. TIM0/TIM1/WDTOUT Pins Configured as Timer Input Pins Timing Requirements
NO. MIN MAX UNIT
T4 tw(TIML) Pulse width, TIM0/TIM1/WDTOUT low 4P ns
T5 tw(TIMH) Pulse width, TIM0/TIM1/WDTOUT high 4P ns
P = (Divider1 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the fast peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
Table 5−27. TIM0/TIM1/WDTOUT Pins Configured as Timer Output Pins Switching Characteristics
NO. PARAMETER MIN MAX UNIT
T1 td(COH–TIMH) Delay time, CLKOUT high to TIM0/TIM1/WDTOUT high0 6 ns
T2 td(COH–TIML) Delay time, CLKOUT high to TIM0/TIM1/WDTOUT low0 7 ns
T3 tw(TIM) Pulse duration, TIM0/TIM1/WDTOUT Pns
P = (Divider1 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the fast peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
TIM0/TIM1/WDTOUT
as Input
T5 T4
Figure 5−28. TIM0/TIM1/WDTOUT Timings When Configured as Timer Input Pins
T1
T2
T3
CLKOUT
TIM0/TIM1/WDTOUT
as Output
Figure 5−29. TIM0/TIM1/WDTOUT Timings When Configured as Timer Output Pins
tsu T‘MDGP‘CLCOH th COHiTIMOGPIO tsu T‘MKSP‘OiCOH th COH7T|M1GPIO tsu WDTGP‘CLCOH td COHiTIMOGPIO td COH7T|M1GPIO T X“; >< if="" a="" x44;="" x4=""><~i 1t="" 44="" x4="" *9="" texas="" instruments="">
Electrical Specifications
167
December 2002 − Revised November 2008 SPRS206K
5.14.2 TIM0/TIM1/WDTOUT General-Purpose I/O Timings
Table 5−28 and Table 5−29 assume testing over recommended operating conditions (see Figure 5−30).
Table 5−28. TIM0/TIM1/WDTOUT General-Purpose I/O Timing Requirements
NO. MIN MAX UNIT
T9 tsu(TIM0GPIO−COH) Setup time, TIM0-GPIO input mode before CLKOUT high 5 ns
T10 th(COH−TIM0GPIO) Hold time, TIM0-GPIO input mode after CLKOUT high 0 ns
T11 tsu(TIM1GPIO−COH) Setup time, TIM1-GPIO input mode before CLKOUT high 5 ns
T12 th(COH−TIM1GPIO) Hold time, TIM1-GPIO input mode after CLKOUT high 0 ns
T13 tsu(WDTGPIO−COH) Setup time, WDTOUT-GPIO input mode before CLKOUT high 5 ns
T14 th(COH−WDTGPIO) Hold time, WDTOUT-GPIO input mode after CLKOUT high 0 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
Table 5−29. TIM0/TIM1/WDTOUT General-Purpose I/O Switching Characteristics
NO. PARAMETER MIN MAX UNIT
T6 td(COH−TIM0GPIO) Delay time, CLKOUT high to TIM0-GPIO output mode 10 ns
T7 td(COH−TIM1GPIO) Delay time, CLKOUT high to TIM1-GPIO output mode 10 ns
T8 td(COH−WDTGPIO) Delay time, CLKOUT high to WDTOUT-GPIO output mode 10 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
CLKOUT
TIM0 GPIO
Input Mode
TIM0 GPIO
Output Mode
T9
T10
T6
TIM1 GPIO
Input Mode
TIM1 GPIO
Output Mode
T12
T7
WDTOUT GPIO
Input Mode
WDTOUT GPIO
Output Mode
T14
T8
T11
T13
Figure 5−30. TIM0/TIM1/WDTOUT General-Purpose I/O Timings
(GPINTL Reler to the TM8320V05501/5502 DSP Timers Reference Guide {Nerature number SPRU618) /_\_2f_\_/_\_/_\_/_ 4 i {w {iii j *9 TEXAS INSTRUMENTS
Electrical Specifications
168 December 2002 − Revised November 2008SPRS206K
5.14.3 TIM0/TIM1/WDTOUT Interrupt Timings
Table 5−30 assumes testing over recommended operating conditions (see Figure 5−31).
Table 5−30. TIM0/TIM1/WDTOUT Interrupt Timing Requirements†‡
NO. MIN MAX UNIT
T15 tsu(TIM0L−COH) Setup time, TIM0 low§ before CLKOUT rising edge 5 ns
T16 th(COH−TIM0L) Hold time, TIM0 low§ after CLKOUT rising edge 0 ns
T17 tw(TIM0L) Pulse width, TIM0 low§P ns
T18 tsu(TIM1L−COH) Setup time, TIM1 low§ before CLKOUT rising edge 5 ns
T19 th(COH−TIM1L) Hold time, TIM1 low§ after CLKOUT rising edge 0 ns
T20 tw(TIM1L) Pulse width, TIM1 low§P ns
T21 tsu(WDTL−COH) Setup time, WDTOUT low§ before CLKOUT rising edge 5 ns
T22 th(COH−WDTL) Hold time, WDTOUT low§ after CLKOUT rising edge 0 ns
T23 tw(WDTL) Pulse width, WDTOUT low§P ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
P = (Divider1 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the fast peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§An interrupt can be triggered by setting the timer pins high or low, depending on the setting of the TIN1INV bit in the GPIO Interrupt Control Register
(GPINT). Refer to the TMS320VC5501/5502 DSP Timers Reference Guide (literature number SPRU618) for more information on the interrupt
capability of the timer pins.
CLKOUT
TIM0
T15
T16
T17
TIM1
T18
T19
T20
WDTOUT
T21
T22
T23
Figure 5−31. TIM0/TIM1/WDTOUT Interrupt Timings
*9 TEXAS INSTRUMENTS
Electrical Specifications
169
December 2002 − Revised November 2008 SPRS206K
5.15 Multichannel Buffered Serial Port (McBSP) Timings
5.15.1 McBSP Transmit and Receive Timings
Table 5−31 and Table 5−32 assume testing over recommended operating conditions (see Figure 5−32 and
Figure 5−33).
Table 5−31. McBSP Transmit and Receive Timing Requirements†‡
NO. MIN MAX UNIT
M11 tc(CKRX) Cycle time, CLKR/X CLKR/X ext 2P ns
M12 tw(CKRX) Pulse duration, CLKR/X high or CLKR/X low CLKR/X ext P – 2 ns
M13 tr(CKRX) Rise time, CLKR/X CLKR/X ext 5 ns
M14 tf(CKRX) Fall time, CLKR/X CLKR/X ext 5 ns
M15
tsu(FRH–CKRL)
Setup time, external FSR high before CLKR low
CLKR int 5
ns
M15
tsu(FRH–CKRL) Setup time, external FSR high before CLKR low CLKR ext 1ns
M16
th(CKRL–FRH)
Hold time, external FSR high after CLKR low
CLKR int 1
ns
M16
th(CKRL–FRH) Hold time, external FSR high after CLKR low CLKR ext 6ns
M17
tsu(DRV–CKRL)
Setup time, DR valid before CLKR low
CLKR int 3
ns
M17
tsu(DRV–CKRL) Setup time, DR valid before CLKR low CLKR ext 1ns
M18
th(CKRL–DRV)
Hold time, DR valid after CLKR low
CLKR int 1
ns
M18
th(CKRL–DRV) Hold time, DR valid after CLKR low CLKR ext 6ns
M19
tsu(FXH–CKXL)
Setup time, external FSX high before CLKX low
CLKX int 5
ns
M19
tsu(FXH–CKXL) Setup time, external FSX high before CLKX low CLKX ext 1ns
M20
th(CKXL–FXH)
Hold time, external FSX high after CLKX low
CLKX int 1
ns
M20
th(CKXL–FXH) Hold time, external FSX high after CLKX low CLKX ext 6ns
Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are
also inverted.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
‘ciCKRX) ‘w(CKRXH) ‘w(CKRXLi Disabie time. CLKX high In DX high impedance Deiay time. CLKX high to DX vaiid. Deiay iime, CLKX hlgh 10 DX vaiidii when in Data Deiay 1 or 2 Wm. Enable time. CLKX high 10 DX driven when in Data Deiay 1 or 2 Wm. Deiay time, FSX high to DX vaiid when in Data Delay 0 (XDATDLY=DDD) mm“. Enable iime, st high 10 DX dnveni when in Data Delay 0 (XDATDLY=DDD) mm“. SPRUEBZi *9 TEXAS INSTRUMENTS
Electrical Specifications
170 December 2002 − Revised November 2008SPRS206K
Table 5−32. McBSP Transmit and Receive Switching Characteristics†‡
NO. PARAMETER MIN MAX UNIT
M1 tc(CKRX) Cycle time, CLKR/X CLKR/X int 2P ns
M2 tw(CKRXH) Pulse duration, CLKR/X high CLKR/X int D−1§D+1§ns
M3 tw(CKRXL) Pulse duration, CLKR/X low CLKR/X int C−1§C+1§ns
M4
td(CKRH–FRV)
Delay time, CLKR high to internal FSR valid
CLKR int −2 6
ns
M4
td(CKRH–FRV) Delay time, CLKR high to internal FSR valid CLKR ext 4 16 ns
M5
td(CKXH–FXV)
Delay time, CLKX high to internal FSX valid
CLKX int 0 6
ns
M5
td(CKXH–FXV) Delay time, CLKX high to internal FSX valid CLKX ext 4 16 ns
M6
tdis(CKXH–DXHZ)
Disable time, CLKX high to DX high impedance
CLKX int −5 5
ns
M6
tdis(CKXH–DXHZ
)
Disable time, CLKX high to DX high impedance
following last data bit CLKX ext 111 ns
Delay time, CLKX high to DX valid.
CLKX int 6
Delay time, CLKX high to DX valid.
This applies to all bits except the first bit transmitted. CLKX ext 16
M7
t
Delay time, CLKX high to DX valid
DXENA = 0
CLKX int 6
ns
M7 td(CKXH–DXV)
Delay time, CLKX high to DX valid
Only applies to first bit transmitted
DXENA = 0 CLKX ext 16 ns
Only applies to first bit transmitted
when in Data Delay 1 or 2
DXENA = 1
CLKX int 2P+2
when in Data Delay 1 or 2
(XDATDLY=01b or 10b) modes DXENA = 1 CLKX ext 2P+8
Enable time, CLKX high to DX driven
DXENA = 0
CLKX int 0
M8
ten(CKXH–DX)
Enable time, CLKX high to DX driven
Only applies to first bit transmitted
DXENA = 0 CLKX ext 6
ns
M8
ten(CKXH–DX) Only applies to first bit transmitted
when in Data Delay 1 or 2
DXENA = 1
CLKX int 2P ns
when in Data Delay 1 or 2
(XDATDLY=01b or 10b) modes DXENA = 1 CLKX ext 2P+6
Delay time, FSX high to DX valid
DXENA = 0
FSX int 2
M9
td(FXH–DXV)
Delay time, FSX high to DX valid
Only applies to first bit transmitted
DXENA = 0 FSX ext 7
ns
M9
td(FXH–DXV) Only applies to first bit transmitted
when in Data Delay 0 (XDATDLY=00b)
DXENA = 1
FSX int 2P+2 ns
when in Data Delay 0 (XDATDLY=00b)
mode. DXENA = 1 FSX ext 2P+7
Enable time, FSX high to DX driven
DXENA = 0
FSX int 0
M10
ten(FXH–DX)
Enable time, FSX high to DX driven
Only applies to first bit transmitted
DXENA = 0 FSX ext 6
ns
M10
ten(FXH–DX) Only applies to first bit transmitted
when in Data Delay 0 (XDATDLY=00b)
DXENA = 1
FSX int 2P ns
when in Data Delay 0 (XDATDLY=00b)
mode DXENA = 1 FSX ext P+6
Polarity bits CLKRP = CLKXP = FSRP = FSXP = 0. If the polarity of any of the signals is inverted, then the timing references of that signal are
also inverted.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§T=CLKRX period = (1 + CLKGDV) * P
C=CLKRX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
D=CLKRX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
See the TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number
SPRU592) for a description of the DX enable (DXENA) and data delay features of the McBSP.
INSTRUMENTS *9 TEXAS
Electrical Specifications
171
December 2002 − Revised November 2008 SPRS206K
M3, M12
M2, M12
M1, M11
M13
M14M4 M4
M15 M16
M17 M18
Bit (n−1) (n−2) (n−3) (n−4)
Bit (n−1) (n−2) (n−3)
Bit (n−1) (n−2)
M17 M18
M17 M18
CLKR
FSR (Int)
FSR (Ext)
DR
(RDATDLY=00b)
DR
(RDATDLY=01b)
DR
(RDATDLY=10b)
Figure 5−32. McBSP Receive Timings
M3, M12
M2, M12
M1, M11
M13 M14
M5 M5
M19 M20
M10 M9 M7
M7
M7
M8
M6
M8
Bit 0 Bit (n−1) (n−2) (n−3) (n−4)
Bit 1
Bit 2
Bit (n−1) (n−2) (n−3)
Bit (n−1) (n−2)
CLKX
FSX (Int)
FSX (Ext)
DX
(XDATDLY=00b)
DX
(XDATDLY=01b)
DX
(XDATDLY=10b)
Bit 0
Bit 0Bit 1
NOTE A: This figure does not include first or last frames. For first frame, no data will be present before frame synchronization.
For last frame, no data will be present after frame synchronization.
Figure 5−33. McBSP Transmit Timings
Emmemacom ‘thOHrMGPIm ‘dlCOHrMGPIm H H H—T i x x *9 TEXAS INSTRUMENTS
Electrical Specifications
172 December 2002 − Revised November 2008SPRS206K
5.15.2 McBSP General-Purpose I/O Timings
Table 5−33 and Table 5−34 assume testing over recommended operating conditions (see Figure 5−34).
Table 5−33. McBSP General-Purpose I/O Timing Requirements
NO. MIN MAX UNIT
M22 tsu(MGPIO–COH) Setup time, MGPIOx input mode before CLKOUT high†‡ 4 ns
M23 th(COH–MGPIO) Hold time, MGPIOx input mode after CLKOUT high†‡ 0 ns
MGPIOx refers to CLKRx, FSRx, DRx, CLKXx, or FSXx when configured as a general-purpose input.
In this case, CLKOUT reflects SYSCLK2. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK2 as CLKOUT.
Table 5−34. McBSP General-Purpose I/O Switching Characteristics
NO. PARAMETER MIN MAX UNIT
M21 td(COH–MGPIO) Delay time, CLKOUT high to MGPIOx output mode‡§ 0 6 ns
In this case, CLKOUT reflects SYSCLK2. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK2 as CLKOUT.
§MGPIOx refers to CLKRx, FSRx, CLKXx, FSXx, or DXx when configured as a general-purpose output.
CLKOUT
MGPIO
Input Mode
MGPIO
Output Mode
M22
M23
M21
MGPIOx refers to CLKRx, FSRx, DRx, CLKXx, or FSXx when configured as a general-purpose input.
MGPIOx refers to CLKRx, FSRx, CLKXx, FSXx, or DXx when configured as a general-purpose output.
Figure 5−34. McBSP General-Purpose I/O Timings
tsu DRVrCKXL th CKXLrDRV tsu FXLrCKXH tt: CKX td CKXLrFXL td FXLrCKXH td CKXHrDXV td FXLrDXV USP Mulllchannel Bu/Iered Sena! Par! (MCBSP) Reference Guide (\Iteralure number SPRUSQZ} USP Mulllchannel Bu/Iered Sena! Par! (MCBSP) Reference Guide (\Iteralure number SPRUSQZ} *9 TEXAS INSTRUMENTS
Electrical Specifications
173
December 2002 − Revised November 2008 SPRS206K
5.15.3 McBSP as SPI Master or Slave Timings
Table 5−35 to Table 5−42 assume testing over recommended operating conditions (see Figure 5−35 through
Figure 5−38).
Table 5−35. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 0)†‡§
NO.
MASTER SLAVE
UNIT
NO.
MIN MAX MIN MAX
UNIT
M30 tsu(DRV–CKXL) Setup time, DR valid before CLKX low 13 0 − 5P ns
M31 th(CKXL–DRV) Hold time, DR valid after CLKX low 19 + 6P ns
M32 tsu(FXL–CKXH) Setup time, FSX low before CLKX high 10 ns
M33 tc(CKX) Cycle time, CLKX 2P 16P ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
Table 5−36. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 0)†‡§¶
NO.
PARAMETER
MASTER SLAVE
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
M24 td(CKXL–FXL) Delay time, CLKX low to FSX low#T − 2 T + 6 ns
M25 td(FXL–CKXH) Delay time, FSX low to CLKX high|| C − 6 C + 4 ns
M26 td(CKXH–DXV) Delay time, CLKX high to DX valid −4 6 4P 6P ns
M27 tdis(CKXL–DXHZ) Disable time, DX high impedance following last data bit from
CLKX low C − 2 C +10 ns
M28 tdis(FXH–DXHZ) Disable time, DX high impedance following last data bit from
FSX high 2P+ 4 4P + 10 ns
M29 td(FXL–DXV) Delay time, FSX low to DX valid 2P + 4 4P + 10 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
T = BCLKX period = (1 + CLKGDV) * 2P
C = BCLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * 2P when CLKGDV is even
#FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
|| FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
INSTRUMENTS *9 TEXAS
Electrical Specifications
174 December 2002 − Revised November 2008SPRS206K
LSB M32
M24
M25
M33
M28
M27 M29
M26
M30 M31
MSB
CLKX
FSX
DX
DR
Bit (n−1) (n−2) (n−3) (n−4)Bit 0
Bit 0 Bit (n−1) (n−2) (n−3) (n−4)
Figure 5−35. McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 0
tsu DRVrCKXH th CKXHrDRV tsu FXLrCKXH tt: CKX USP Mulllchannel Bu/Iered Sena! Par! (MCBSP) Reference Guide (\Iteralure number SPRUSQZ}. td CKXLrFXL td FXLrCKXH td CKXLrDXV td FXLrDXV USP Mulllchannel Bu/Iered Sena! Par! (MCBSP) Reference Guide (\Iteralure number SPRUSQZ} 44L AJ 4’47 *9 TEXAS INSTRUMENTS
Electrical Specifications
175
December 2002 − Revised November 2008 SPRS206K
Table 5−37. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 0)†‡§
NO.
MASTER SLAVE
UNIT
NO.
MIN MAX MIN MAX
UNIT
M39 tsu(DRV–CKXH) Setup time, DR valid before CLKX high 13 0 − 5P ns
M40 th(CKXH–DRV) Hold time, DR valid after CLKX high 19 + 6P ns
M41 tsu(FXL–CKXH) Setup time, FSX low before CLKX high 10 ns
M42 tc(CKX) Cycle time, CLKX 2P 16P ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
Table 5−38. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 0)†‡§¶
NO.
PARAMETER
MASTER SLAVE
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
M34 td(CKXL–FXL) Delay time, CLKX low to FSX low#C − 2 C + 6 ns
M35 td(FXL–CKXH) Delay time, FSX low to CLKX high|| T − 6 T + 4 ns
M36 td(CKXL–DXV) Delay time, CLKX low to DX valid −4 6 4P 6P ns
M37 tdis(CKXL–DXHZ) Disable time, DX high impedance following last
data bit from CLKX low −2 10 3P + 4 4P + 18 ns
M38 td(FXL–DXV) Delay time, FSX low to DX valid D − 2 D +10 2P − 4 4P + 10 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
T = CLKX period = (1 + CLKGDV) * P
C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
#FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
|| FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
LSB M41
M35
M42
M38
M36
M39 M40
MSB
CLKX
FSX
DX
DR
Bit (n−1) (n−2) (n−3) (n−4)Bit 0
Bit 0 Bit (n−1) (n−2) (n−3) (n−4)
M34
M37
Figure 5−36. McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 0
‘su DRVrC KXH ‘h CKXHrDRV ‘su FXLrCKXL ‘c CKX ‘d CKXHrFXL ‘d FXLrCKXL ‘d CKXLrDXV ‘d FXLrDXV tea m the USP Mulllchanne/ Bu/Iered Sena! Par! (MCBSP) Re/erence Guide (hteralure number SPRUSQZ} USP Mulllchanne/ Bu/Iered Sena! Par! (MCBSP) Re/erence Guide (hteralure number SPRUSQZ} *9 TEXAS INSTRUMENTS
Electrical Specifications
176 December 2002 − Revised November 2008SPRS206K
Table 5−39. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 10b, CLKXP = 1)†‡§
NO.
MASTER SLAVE
UNIT
NO.
MIN MAX MIN MAX
UNIT
M49 tsu(DRV–CKXH) Setup time, DR valid before CLKX high 13 0 − 5P ns
M50 th(CKXH–DRV) Hold time, DR valid after CLKX high 19 + 6P ns
M51 tsu(FXL–CKXL) Setup time, FSX low before CLKX low 10 ns
M52 tc(CKX) Cycle time, CLKX 2P 16P ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
Table 5−40. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 10b, CLKXP = 1)†‡§¶
NO.
PARAMETER
MASTER SLAVE
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
M43 td(CKXH–FXL) Delay time, CLKX high to FSX low#T − 2 T + 6 ns
M44 td(FXL–CKXL) Delay time, FSX low to CLKX low|| D − 6 D + 4 ns
M45 td(CKXL–DXV) Delay time, CLKX low to DX valid −4 6 4P 6P ns
M46 tdis(CKXH–DXHZ) Disable time, DX high impedance following last data bit
from CLKX high D − 2 D +10 ns
M47 tdis(FXH–DXHZ) Disable time, DX high impedance following last data bit
from FSX high 2P + 4 4P + 10 ns
M48 td(FXL–DXV) Delay time, FSX low to DX valid 2P − 4 4P + 10 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
T = CLKX period = (1 + CLKGDV) * P
D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
#FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
|| FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
Electrical Specifications
177
December 2002 − Revised November 2008 SPRS206K
LSB M51
M43
M44
M52
M47
M46 M48
M45
M49 M50
MSB
CLKX
FSX
DX
DR
Bit (n−1) (n−2) (n−3) (n−4)Bit 0
Bit 0 Bit (n−1) (n−2) (n−3) (n−4)
Figure 5−37. McBSP Timings as SPI Master or Slave: CLKSTP = 10b, CLKXP = 1
‘su DRVrCKXL ‘h CKXLrDRV ‘su FXLrCKXL ‘c CKX USP Mulllchanne/ Bu/Iered Sena! Par! (MCBSP) Re/erence Guide (hteralure number SPRUSQZ} ‘d CKXHrFXL ‘d FXLrCKXL ‘d CKXHrDXV ‘d FXLrDXV USP Mulllchanne/ Bu/Iered Sena! Par! (MCBSP) Re/erence Guide (hteralure number SPRUSQZ} ”‘ #41 —\_,{ }$_,(\_/\_/\_/\ Jr «1—4\ \ *9 TEXAS INSTRUMENTS
Electrical Specifications
178 December 2002 − Revised November 2008SPRS206K
Table 5−41. McBSP as SPI Master or Slave Timing Requirements (CLKSTP = 11b, CLKXP = 1)†‡§
NO.
MASTER SLAVE
UNIT
NO.
MIN MAX MIN MAX
UNIT
M58 tsu(DRV–CKXL) Setup time, DR valid before CLKX low 13 0 − 5P ns
M59 th(CKXL–DRV) Hold time, DR valid after CLKX low 19 + 6P ns
M60 tsu(FXL–CKXL) Setup time, FSX low before CLKX low 10 ns
M61 tc(CKX) Cycle time, CLKX 2P 16P ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
Table 5−42. McBSP as SPI Master or Slave Switching Characteristics (CLKSTP = 11b, CLKXP = 1)†‡§¶
NO.
PARAMETER
MASTER SLAVE
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
M53 td(CKXH–FXL) Delay time, CLKX high to FSX low#D − 2 D + 6 ns
M54 td(FXL–CKXL) Delay time, FSX low to CLKX low|| T − 6 T + 4 ns
M55 td(CKXH–DXV) Delay time, CLKX high to DX valid −4 6 4P 6P ns
M56 tdis(CKXH–DXHZ) Disable time, DX high impedance following last data bit
from CLKX high −2 10 3P + 4 4P + 18 ns
M57 td(FXL–DXV) Delay time, FSX low to DX valid C − 2 C +10 2P − 4 4P + 10 ns
For all SPI slave modes, CLKG is programmed as 1/2 of the CPU clock by setting CLKSM = CLKGDV = 1.
P = (Divider2 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the slow peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
§McBSP register values required to configure the McBSP as an SPI master and as an SPI slave are listed in the
TMS320VC5501/5502/5503/5507/5509/5510 DSP Multichannel Buffered Serial Port (McBSP) Reference Guide (literature number SPRU592).
T = CLKX period = (1 + CLKGDV) * P
C = CLKX low pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2) * P when CLKGDV is even
D = CLKX high pulse width = T/2 when CLKGDV is odd or zero and = (CLKGDV/2 + 1) * P when CLKGDV is even
#FSRP = FSXP = 1. As a SPI master, FSX is inverted to provide active-low slave-enable output. As a slave, the active-low signal input on FSX
and FSR is inverted before being used internally.
CLKXM = FSXM = 1, CLKRM = FSRM = 0 for master McBSP
CLKXM = CLKRM = FSXM = FSRM = 0 for slave McBSP
|| FSX should be low before the rising edge of clock to enable slave devices and then begin a SPI transfer at the rising edge of the master clock
(CLKX).
LSB M61
M55
M58 M59
MSB
CLKX
FSX
DX
DR
Bit (n−1) (n−2) (n−3) (n−4)Bit 0
Bit 0 Bit (n−1) (n−2) (n−3) (n−4)
M53
M56
M60
M54
M57
Figure 5−38. McBSP Timings as SPI Master or Slave: CLKSTP = 11b, CLKXP = 1
tsu HASLiDSL th DSLiHASL tsu HADiHASL th HASLiHAD tw DSL tw DSH tsu HADiDSL th DSLiHAD tsu HDiDSH *9 TEXAS INSTRUMENTS
Electrical Specifications
179
December 2002 − Revised November 2008 SPRS206K
5.16 Host-Port Interface Timings
5.16.1 HPI Read and Write Timings
Table 5−43 and Table 5−44 assume testing over recommended operating conditions (see Figure 5−39
through Figure 5−43).
Table 5−43. HPI Read and Write Timing Requirements†‡§
NO. MIN MAX UNIT
H9 tsu(HASL−DSL) Setup time, HPI.HAS low before DS falling edge 5 ns
H10 th(DSL−HASL) Hold time, HPI.HAS low after DS falling edge 2 ns
H11 tsu(HAD−HASL) Setup time, HAD valid before HPI.HAS falling edge 5 ns
H12 th(HASL−HAD) Hold time, HAD valid after HPI.HAS falling edge 5 ns
H13 tw(DSL) Pulse duration, DS low 15 ns
H14 tw(DSH) Pulse duration, DS high 2P ns
H15 tsu(HAD−DSL) Setup time, HAD valid before DS falling edge 5 ns
H16 th(DSL−HAD) Hold time, HAD valid after DS falling edge 5 ns
H17 tsu(HD−DSH) Setup time, HD valid before DS rising edge 5 ns
H18 th(DSH−HD) Hold time, HD valid after DS rising edge 0 ns
H37 tsu(HCSL-DSL) Setup time, HCS low before DS falling edge 0 ns
H38 th(HRDYH-DSL) Hold time, DS low after HRDY rising edge 0 ns
P = (Divider1 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the fast peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
DS refers to logical OR of HCS, HDS1, and HDS2. HD refers to HPI Data Bus. HDS refers to HDS1 or HDS2. HAD refers to HCNTL0, HCNTL1,
HPI.HBIL, and HR/W.
§A host must not initiate transfer requests until the HPI has been brought out of reset, see Section 3.7, Host-Port Interface (HPI), for more details.
De‘ay (me, as low In HD 'd(DSL7HDV) ‘dls DSHiHDV ‘en DSLiHDD ‘d DSLiHRDVL ‘d DSHiHRDYL De‘ay nme. Ds law an HRDV high ‘d HDV7HRDYH De‘ay nme. DS mgh to HRDY De‘ay (me ‘d(DSLrHRDYHp no‘emp‘yqf Case 2 HPID read no auto-Incremenl‘ Casea HPID read wwth antermcrement endlead Case 1 HPID read no aulmncremen!‘ Case 2' HPID read wwth antermcrement andnread Case 2 HPID wme no autoancremem‘] *9 TEXAS INSTRUMENTS
Electrical Specifications
180 December 2002 − Revised November 2008SPRS206K
Table 5−44. HPI Read and Write Switching Characteristics†‡§
NO. PARAMETER MIN MAX UNIT
Case 1. HPIC or HPIA read 5 15
Case 2. HPID read with
K = 1|| 9 * 2H + 20
Case 2. HPID read with
no auto-increment
K = 2|| 10 * 2H + 20
no auto-increment
K = 4|| 11 * 2H + 20
H1
td(DSL−HDV)
Delay time, DS low to HD
valid
Case 3. HPID read with
K = 1|| 9 * 2H + 20
ns
H1
td(DSL−HDV)
Delay time, DS low to HD
valid
Case 3. HPID read with
auto-increment and read
FIFO initially empty
K = 2|| 10 * 2H + 20
ns
auto-increment and read
FIFO initially emptyK = 4|| 11 * 2H + 20
Case 4. HPID read with auto-increment
and data previously prefetched into the
read FIFO 5 15
H2 tdis(DSH−HDV) Disable time, HD high-impedance from DS high 1 4 ns
H3 ten(DSL−HDD) Enable time, HD driven from DS low 3 15 ns
H4 td(DSL−HRDYL) Delay time, DS low to HRDY low 12 ns
H5 td(DSH−HRDYL) Delay time, DS high to HRDY low 12 ns
Case 1. HPID read with
K = 1|| 10 * 2H + 20
Case 1. HPID read with
no auto-increment
K = 2|| 11 * 2H + 20 ns
H6
td(DSL−HRDYH)
Delay time, DS low to HRDY
no auto-increment
K = 4|| 12 * 2H + 20
ns
H6
td(DSL−HRDYH)
Delay time, DS low to HRDY
high
Case 2. HPID read with
K = 1|| 10 * 2H + 20
high
Case 2. HPID read with
auto-increment and read
FIFO initially empty
K = 2|| 11 * 2H + 20 ns
auto-increment and read
FIFO initially emptyK = 4|| 12 * 2H + 20
ns
H7 td(HDV−HRDYH) Delay time, HD valid to HRDY high 0 ns
H8 td(COH−HINT) Delay time, CLKOUT high to HINT change#8 ns
Case 1. HPIA writeK = 1, 2, 4|| 5 * 2H + 20
H34
td(DSH-HRDYH)
Delay time, DS high to HRDY
Case 2. HPID write with
K = 1|| 5 * 2H + 20
ns
H34
t
d(DSH-HRDYH)
Delay time, DS high to HRDY
high Case 2. HPID write with
no auto-increment
K = 2|| 5 * 2H + 20
ns
no auto-increment
K = 4|| 6 * 2H + 20
Delay time, DS low to HRDY high for HPIA write and FIFO
K = 1|| 40 * 2H + 20
H35 td(DSL-HRDYH) Delay time, DS low to HRDY high for HPIA write and FIFO
not empty
K = 2|| 40 * 2H + 20 ns
H35
td(DSL-HRDYH)
not empty
K = 4|| 24 * 2H + 20
ns
H36 td(HASL-HRDYL) Delay time, HPI.HAS low to HRDY low 12 ns
DS refers to logical OR of HCS, HDS1, and HDS2. HD refers to HPI Data Bus. HDS refers to HDS1 or HDS2. HAD refers to HCNTL0, HCNTL1,
HPI.HBIL, and HR/W.
H is half the SYSCLK1 clock cycle.
§A host must not initiate transfer requests until the HPI has been brought out of reset, see Section 3.7, Host-Port Interface (HPI), for more details.
Assumes no other DMA or CPU memory activity.
#In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
|| K = divider ratio between CPU clock and SYSCLK1. For example, when SYSCLK1 is set to the CPU clock divided by four, use K = 4.
1 L—pL H12 \ ”L1 «1% ”‘2 \ HCNTL[1:D] | "11‘ t1 )‘( 1 1 )‘( 1 )‘( 1 | mm 1 ‘mm : HR/W | 1 / L; 1 1 I L; H12 1 I \ HPI.HBIL| ""1 fl ,‘1 1 "'1' fl ‘\ 1 | x x ‘ x x H Hm 1 harm” M37533“ pi H37 fl‘i "‘3 4" H14 4 \ us \ +2 \ I \ \ \ \ 1 $17“ 14f H2 Trim H H ‘ H7 H44» H33 \ HSSH ‘47 H6 4g \ HRDV K—} a me state m we FIFO, transmans on HRDY m Re/erence Guide weramre number spnuszu) December 2002 7 Revised November 2003 M TEXAS INSTRUMENTS
Electrical Specifications
181
December 2002 − Revised November 2008 SPRS206K
HCS
HPI.HAS
HR/W
HPI.HBIL
DS
HPI.HD[7:0]
HRDY
H2
H3
H1
H37 H9
H10
H14
H2
H38
H12
H11
H12
H11
H12
H11
H13
H7
H6
H1
H3
H13
H37 H9 H10
H36
HCNTL[1:0]
H12
H11
H12
H11 H12
NOTE: Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-incrementing)
and the state of the FIFO, transitions on HRDY may or may not occur [see the TMS320VC5501/5502 DSP Host Port Interface (HPI)
Reference Guide (literature number SPRU620)].
H11
Figure 5−39. Multiplexed Read Timings Using HPI.HAS
m 1—} /—\ \ \ mm HCNTL[1:D] | X * X X _ ‘ \ ‘ \ \ ‘ Hm” I \ "I \ \ f ‘K HPI.HBIL l \ / ,‘l } x x ‘ x \ ‘ hfli H13 4.1 \ ‘ 11+ H \ \ H H16 1 H3 \ Hair H1 I5 W 7 H37 44—q #7 H14 :‘f 4“ as W \ \ \ \ Ha 4,1 \ H3 45—»! ,4: H1 J,—>1 k—D‘F H2 ’47 H114 :4—» WW] ‘ {3:3 cxj \ \ 1 h—L Haa H4 H yd—+ HLI “—r "5 4% HRDV \ / d the state ol the FIFO, Iransmons on HRDV m Reference Gurde (hteralure number SPRUGZO) 182 SPRSZDEK M TEXAS December 2002 7 R INSTRUMENTS
Electrical Specifications
182 December 2002 − Revised November 2008SPRS206K
HCS
HPI.HAS
HCNTL[1:0]
HR/W
HPI.HBIL
DS
HPI.HD[7:0]
HRDY
H16
H15
H37
H13
H14
H16
H15
H37 H13
H3
H1 H2
H3 H1 H2
H38
H7
H4
H6
NOTE: Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-incrementing)
and the state of the FIFO, transitions on HRDY may or may not occur [see the TMS320VC5501/5502 DSP Host Port Interface (HPI)
Reference Guide (literature number SPRU620)].
Figure 5−40. Multiplexed Read Timings With HPI.HAS Held High
W F\ /—\ 1 1 1 1 HPI.HAS ‘ ‘ ‘ ‘ ‘ ‘ 1 10k 1 1 W 1 HII 4‘01 1 1 101 1 1 HCNTL[I:0] | x x x x 1 1 1 1 1 1 1 1+1 1 1 10% 1 H11 14H 1 1 1 1w 1 1 "WW I \ 1 / 1 l 1 1 1 1 1 1 1 W 1 1 W 1 H11 14* 1 1 14% 1 1 HPI.HB|L I ‘ \ 1 / ‘ ‘ 1 \ ‘ 1 1 h—pL 1 H—Ni 1 Lfl 1 1 F 4—54“ m7 4%7 H13 ”5 1 L1 1 1 1 1 1 M 10% 1 1 HI7 {xi—‘1 H174‘ W1 HPI.HD[7:0] 1 1 #—\ 1 ‘ ‘ 4 1 H3544—v1 1k 1 1 1 fl 1" 1 W" 41 MESH Haajd—H 1 1 "5M 1 HRDV \_/ \_/ \_/ Re/erence Gulde1l11eramre number spnuezu) December 2002, Revised November 2003 *9 TEXAS s INSTRUMENTS
Electrical Specifications
183
December 2002 − Revised November 2008 SPRS206K
HCS
HPI.HAS
HCNTL[1:0]
HR/W
HPI.HBIL
DS
HPI.HD[7:0]
HRDY
H5 H34
H17 H18
H13
H10
H12
H9
H37
H12
H12
H11
H11
H11
H17 H18
H14
H11
H11
H11
H37
H10
H9
H13
H12
H12
H12
H5
H34
H38
H35
H36
NOTE: Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-incrementing)
and the state of the FIFO, transitions on HRDY may or may not occur [see the TMS320VC5501/5502 DSP Host Port Interface (HPI)
Reference Guide (literature number SPRU620)].
Figure 5−41. Multiplexed Write Timings Using HPI.HAS
\ HPI.HA5 1 HCNTL[1:0]I ‘ X )‘Y ‘ )‘( )‘Y | \ ‘ > f ‘ w 1/ . HPI.HB|L| ‘ “\ i" ‘ f ‘N | x \ WW \ x W x \ ‘ngfi‘ \ H‘LH \ WH” HWHI H37A4—q ‘ ngq ‘ as —\_2F7 \_x \ \ ‘ Mfima w \ ”17+“ \ HUM \ HPI.HD[7:0] ‘ ‘ , f ‘, 1 #15714: 4H 4 \ H33 ‘ HAH p—p‘LHs ‘ H, 4% k ‘ \ x w "544 \ HRDV \_/ \_/ \_/ Re/erence Guide (merature number spauezm] \ \ “—F} —:C 154 SPRSZDEK ”TEXAS DecemberzflflzrRewsedNovemberZDDB INSTRUMENTS
Electrical Specifications
184 December 2002 − Revised November 2008SPRS206K
HCS
HPI.HAS
HCNTL[1:0]
HR/W
HPI.HBIL
DS
HPI.HD[7:0]
HRDY
H34
H5
H17
H18
H17 H18
H34
H5
H4 H38
H37
H13
H16
H15 H14 H13
H16
H15
H37
H35
NOTE: Depending on the type of write or read operation (HPID without auto-incrementing, HPIA, HPIC, or HPID with auto-incrementing)
and the state of the FIFO, transitions on HRDY may or may not occur [see the TMS320VC5501/5502 DSP Host Port Interface (HPI)
Reference Guide (literature number SPRU620)].
Figure 5−42. Multiplexed Write Timings With HPI.HAS Held High
H8
CLKOUT
HINT
Figure 5−43. HINT Timings
INSTRUMENTS *9 TEXAS
Electrical Specifications
185
December 2002 − Revised November 2008 SPRS206K
5.16.2 HPI General-Purpose I/O Timings
Table 5−45 and Table 5−46 assume testing over recommended operating conditions (see Figure 5−44).
Table 5−45. HPI General-Purpose I/O Timing Requirements
NO. MIN MAX UNIT
H27 tsu(HDGPIO−COH) Setup time, HDGPIO input mode before CLKOUT high5 ns
H28 th(COH−HDGPIO) Hold time, HDGPIO input mode after CLKOUT high0 ns
H29 tsu(HCGPIO−COH) Setup time, HCGPIO input mode before CLKOUT high§5 ns
H30 th(COH−HCGPIO) Hold time, HCGPIO input mode after CLKOUT high§0 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
HDGPIO refers to HPI.HD[7:0] configured as general-purpose input.
§HCGPIO refers to HPI.HAS, HPI.HBIL, HCNTL0, HCNTL1, HCS, HR/W, HDS1, HDS2, HRDY, and HINT configured as general-purpose input.
Table 5−46. HPI General-Purpose I/O Switching Characteristics
NO. PARAMETER MIN MAX UNIT
H21 td(COH−HDGPIO) Delay time, CLKOUT high to HDGPIO output mode10 ns
H22 td(COH−HCGPIO) Delay time, CLKOUT high to HCGPIO output mode#10 ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
HDGPIO refers to HPI.HD[7:0] configured as general-purpose output.
#HCGPIO refers to HPI.HAS, HPI.HBIL, HCNTL0, HCNTL1, HCS, HR/W, HDS1, HDS2, HRDY, and HINT configured as general-purpose output.
CLKOUT
HDGPIO
Input Mode
HDGPIO
Output Mode
H27
H28
H21
HCGPIO
Input Mode
HCGPIO
Output Mode
H29
H30
H22
Figure 5−44. HPI General-Purpose I/O Timings
number spnueza) *9 TEXAS INSTRUMENTS
Electrical Specifications
186 December 2002 − Revised November 2008SPRS206K
5.16.3 HPI.HAS Interrupt Timings
Table 5−47 assumes testing over recommended operating conditions (see Figure 5−45).
Table 5−47. HPI.HAS Interrupt Timing Requirements
NO. MIN MAX UNIT
H31 tsu(HASL−COH) Setup time, HPI.HAS low before CLKOUT rising edge 5 ns
H32 th(COH−HASL) Hold time, HPI.HAS low after CLKOUT rising edge 0 ns
H33 tw(HASL) Pulse width, HPI.HAS lowP§ns
In this case, CLKOUT reflects SYSCLK1. The CLKOUT Selection Register (CLKOUTSR) can be programmed to select SYSCLK1 as CLKOUT.
An interrupt can be triggered by setting the HPI.HAS signal high or low, depending on the setting of the HAS bit in the General-Purpose I/O
Interrupt Control Register 2 (HPGPIOINT2). Refer to the TMS320VC5501/5502 DSP Host Port Interface (HPI) Reference Guide (literature
number SPRU620) for more information on the interrupt capability of the HPI.HAS signal.
§P = (Divider1 Ratio)/(CPU Clock Frequency) in ns. For example, when running parts at 300 MHz with the fast peripheral domain at 1/2 the CPU
clock frequency, use P = 2/300 MHz = 6.66 ns.
CLKOUT
HPI.HAS
H31
H32
H33
Figure 5−45. HPI.HAS Interrupt Timings
su SDAVSCLH h SDAVSCLL H A D s H L C S u s INSTRUMENTS *9 TEXAS
Electrical Specifications
187
December 2002 − Revised November 2008 SPRS206K
5.17 Inter-Integrated Circuit (I2C) Timings
Table 5−48 and Table 5−49 assume testing over recommended operating conditions (see Figure 5−46 and
Figure 5−47).
Table 5−48. I2C Signals (SDA and SCL) Timing Requirements
NO.
STANDARD
MODE FAST
MODE
UNIT
NO.
MIN MAX MIN MAX
UNIT
IC1 tc(SCL) Cycle time, SCL 10 2.5 µs
IC2 tsu(SCLH-SDAL) Setup time, SCL high before SDA low for a repeated START
condition 4.7 0.6 µs
IC3 th(SCLL-SDAL) Hold time, SCL low after SDA low for a START and a repeated
START condition 4 0.6 µs
IC4 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs
IC5 tw(SCLH) Pulse duration, SCL high 4 0.6 µs
IC6 tsu(SDA-SCLH) Setup time, SDA valid before SCL high 250 100ns
IC7 th(SDA-SCLL) Hold time, SDA valid after SCL low For I2C bus devices 000.9§µs
IC8 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 µs
IC9 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb300 ns
IC10 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb300 ns
IC11 tf(SDA) Fall time, SDA 300 20 + 0.1Cb300 ns
IC12 tf(SCL) Fall time, SCL 300 20 + 0.1Cb300 ns
IC13 tsu(SCLH-SDAH) Setup time, SCL high before SDA high (for STOP condition) 4.0 0.6 µs
IC14 tw(SP) Pulse duration, spike (must be suppressed) 0 50 ns
IC15 CbCapacitive load for each bus line 400 400 pF
A Fast-mode I2C-bus device can be used in a Standard-mode I2C-bus system, but the requirement tsu(SDA−SCLH) 250 ns must then be met.
This will automatically be the case if the device does not stretch the LOW period of the SCL signal. If such a device does stretch the LOW period
of the SCL signal, it must output the next data bit to the SDA line tr max + tsu(SDA−SCLH) = 1000 + 250 = 1250 ns (according to the Standard-mode
I2C-Bus Specification) before the SCL line is released.
A device must internally provide a hold time of at least 300 ns for the SDA signal (referred to the VIHmin of the SCL signal) to bridge the undefined
region of the falling edge of SCL.
§The maximum th(SDA−SCLL) has only to be met if the 5501 I2C operates in master-receiver mode and the slave device does not stretch the LOW
period [tw(SCLL)] of the SCL signal.
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
IC10
IC8 IC4
IC3 IC7 IC12
IC5
IC6 IC14
IC2
IC3
IC13
Stop Start Repeated
Start Stop
SDA
SCL
IC1
IC11 IC9
Figure 5−46. I2C Receive Timings
I2C Bus is a trademark of Koninklijke Philips Electronics N.V.
R E T E M A m P ‘d S DAVSCLH ‘v SCLLVSDA ‘d SCLHVSDAH INSTRUMENTS *9 TEXAS
Electrical Specifications
188 December 2002 − Revised November 2008SPRS206K
Table 5−49. I2C Signals (SDA and SCL) Switching Characteristics
NO.
PARAMETER
STANDARD
MODE FAST
MODE
UNIT
NO.
PARAMETER
MIN MAX MIN MAX
UNIT
IC16 tc(SCL) Cycle time, SCL 10 2.5 µs
IC17 td(SCLH-SDAL) Delay time, SCL high to SDA low for a repeated START
condition 4.7 0.6 µs
IC18 td(SDAL-SCLL) Delay time, SDA low to SCL low for a START and a repeated
START condition 4 0.6 µs
IC19 tw(SCLL) Pulse duration, SCL low 4.7 1.3 µs
IC20 tw(SCLH) Pulse duration, SCL high 4 0.6 µs
IC21 td(SDA-SCLH) Delay time, SDA valid to SCL high 250 100 ns
IC22 tv(SCLL-SDAV) Valid time, SDA valid after SCL low For I2C bus devices 0 0 µs
IC23 tw(SDAH) Pulse duration, SDA high between STOP and START conditions 4.7 1.3 µs
IC24 tr(SDA) Rise time, SDA 1000 20 + 0.1Cb300 ns
IC25 tr(SCL) Rise time, SCL 1000 20 + 0.1Cb300 ns
IC26 tf(SDA) Fall time, SDA 300 20 + 0.1Cb300 ns
IC27 tf(SCL) Fall time, SCL 300 20 + 0.1Cb300 ns
IC28 td(SCLH-SDAH) Delay time, SCL high to SDA high for a STOP condition 4 0.6 µs
IC29 CpCapacitance for each I2C pin 10 10 pF
Cb = total capacitance of one bus line in pF. If mixed with HS-mode devices, faster fall-times are allowed.
IC25
IC23 IC19
IC18 IC22 IC27
IC20
IC21
IC17
IC18
IC28
Stop Start Repeated
Start Stop
SDA
SCL
IC16
IC26 IC24
Figure 5−47. I2C Transmit Timings
tw(UDB)R *9 TEXAS INSTRUMENTS
Electrical Specifications
189
December 2002 − Revised November 2008 SPRS206K
5.18 Universal Asynchronous Receiver/Transmitter (UART) Timings
Table 5−50 to Table 5−51 assume testing over recommended operating conditions (see Figure 5−48).
Table 5−50. UART Timing Requirements
NO. MIN MAX UNIT
U4 tw(UDB)R Pulse width, receive data bit 0.96U1.05Uns
U5 tw(USB)R Pulse width, receive start bit 0.96U1.05Uns
U = UART baud time = 1/programmed baud rate
Table 5−51. UART Switching Characteristics
NO. PARAMETER MIN MAX UNIT
U1 fbaud Maximum programmable baud rate 5 MHz
U2 tw(UDB)X Pulse width, transmit data bit U − 2U + 2ns
U3 tw(USB)X Pulse width, transmit start bit U − 2U + 2ns
U = UART baud time = 1/programmed baud rate
U3
U2
Start
Bit
Data Bits
UART.TX
UART.RX
U5
Data Bits
Bit
Start
U4
Figure 5−48. UART Timings
Some TMX samp‘es were shipped in the GGW package. Far more information on the GGW package, see the 2 and TMS320V05501 D/‘g/‘tal ngna/ Processors Sflicon Errata (\iteralure number SPRZOZOD a (literature number SPRZOZOD (wnh lherma‘ has): *9 TEXAS INSTRUMENTS
Mechanical Data
190 December 2002 − Revised November 2008SPRS206K
6 Mechanical Data
Some TMX samples were shipped in the GGW package. For more information on the GGW package, see the
TMS320VC5502 and TMS320VC5501 Digital Signal Processors Silicon Errata (literature number SPRZ020D
or later).
TMS320VC5501PGF has completed Temp Cycle reliability qualification testing with no failures through
1500 cycles of −55°C to 125°C following an EIA/JEDEC Moisture Sensitivity Level 4 pre-condition at
220+5/−0°C peak reflow. Exceeding this peak reflow temperature condition or storage and handling
requirements may result in either immediate device failure post-reflow, due to package/die material
delamination (“popcorning”), or degraded Temp cycle life performance.
Please note that Texas Instruments (TI) also provides MSL, peak reflow and floor life information on a bar-code
label affixed to dry-pack shipping bags. Shelf life, temperature and humidity storage conditions and re-bake
instructions are prominently displayed on a nearby screen-printed label.
6.1 Package Thermal Resistance Characteristics
Table 6−1 and Table 6−2 provide the thermal resistance characteristics for the recommended package types
used on the TMS320VC5501 DSP.
NOTE:
Some TMX samples were shipped in the GGW package. For more information on the GGW
package, see the TMS320VC5502 and TMS320VC5501 Digital Signal Processors Silicon
Errata (literature number SPRZ020D or later).
Table 6−1. Thermal Resistance Characteristics (Ambient)
PACKAGE RθJA (°C/W) BOARD TYPEAIRFLOW (LFM)
94 High-K 0
93 High-K 150
91 High-K 250
(Without thermal vias)
87 High-K 500
(Without thermal vias)
117 Low-K 0
GZZ, ZZZ
114 Low-K 150
GZZ, ZZZ
109 Low-K 250
101 Low-K 500
39 High-K 0
(With thermal vias)
37 High-K 150
(With thermal vias)
36 High-K 250
34 High-K 500
Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface Mount Package Thermal
Measurements.
Adding thermal vias will significantly improve the thermal performance of the device. To use the thermal balls on the GZZ and ZZZ packages:
An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.
The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability Temperature Cycle
performance.
The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be connected
to the ground plane for heat dissipation.
A solid internal plane is preferred for spreading the heat.
Refer to the MicroStar BGAE Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount, and
reliability considerations.
GJC {9 TEXAS INSTRUMENTS
Mechanical Data
191
December 2002 − Revised November 2008 SPRS206K
Table 6−1. Thermal Resistance Characteristics (Ambient) (Continued)
PACKAGE AIRFLOW (LFM)BOARD TYPE
RθJA (°C/W)
60 High-K 0
52 High-K 150
49 High-K 250
PGF
45 High-K 500
PGF
104 Low-K 0
81 Low-K 150
73 Low-K 250
64 Low-K 500
Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface Mount Package Thermal
Measurements.
Adding thermal vias will significantly improve the thermal performance of the device. To use the thermal balls on the GZZ and ZZZ packages:
An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.
The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability Temperature Cycle
performance.
The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be connected
to the ground plane for heat dissipation.
A solid internal plane is preferred for spreading the heat.
Refer to the MicroStar BGAE Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount, and
reliability considerations.
Table 6−2. Thermal Resistance Characteristics (Case)
PACKAGE RθJC (°C/W) BOARD TYPE
GZZ, ZZZ 22 2s JEDEC Test Card
PGF 13.2 2s JEDEC Test Card
Board types are as defined by JEDEC. Reference JEDEC Standard JESD51−9, Test Boards for Area Array Surface
Mount Package Thermal Measurements.
*9 TEXAS INSTRUMENTS
Mechanical Data
192 December 2002 − Revised November 2008SPRS206K
6.2 Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
TEXAS INSTRUMENTS Samples Samples Samples Samples Samples Samples
PACKAGE OPTION ADDENDUM
www.ti.com 31-Mar-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
C55EQUAL ACTIVE LQFP PGF 176 40 RoHS & Green NIPDAU Level-4-260C-72 HR -40 to 85 320VC5501PGF
TMS
300
TMS320VC5501GBE300 ACTIVE NFBGA GBE 201 126 Non-RoHS
& Green SNPB Level-3-220C-168 HR -40 to 85 TMS
320VC5501GBE
A
300
TMS320VC5501PGF300 ACTIVE LQFP PGF 176 40 RoHS & Green NIPDAU Level-4-260C-72 HR -40 to 85 320VC5501PGF
TMS
300
TMS320VC5501ZAV300 ACTIVE NFBGA ZAV 201 126 RoHS & Green SNAGCU Level-3-260C-168 HR -40 to 85 TMS
320VC5501ZAV
A
300
TNETV2501INPGF ACTIVE LQFP PGF 176 40 RoHS & Green NIPDAU Level-4-260C-72 HR -40 to 85 320VC5501PGF
TMS
300
VC5501LMPGF300 ACTIVE LQFP PGF 176 40 RoHS & Green NIPDAU Level-4-260C-72 HR -40 to 85 320VC5501PGF
TMS
300
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 31-Mar-2021
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
l TEXAS INSTRUMENTS L - Outer tray length without tabs J: K0 - Outer tray height +++++++++++++++ +++++++++++++++ +++++++++++++++ (mg, +++++++++++++++ rm. +++++++++++++++ i+++++trgr+++++++ | P1 - Tray unit pocket pitch CW - Measurement tor tray edge (Y direction) to comer pocket center — CL - Measurement for tray edge (X direction) to corner pocket center
TRAY
Chamfer on Tray corner indicates Pin 1 orientation of packed units.
*All dimensions are nominal
Device Package
Name Package
Type Pins SPQ Unit array
matrix Max
temperature
(°C)
L (mm) W
(mm) K0
(µm) P1
(mm) CL
(mm) CW
(mm)
C55EQUAL PGF LQFP 176 40 4x10 150 315 135.9 7620 20.7 30.4 20.7
TMS320VC5501GBE300 GBE NFBGA 201 126 7 X 18 150 315 135.9 7620 17.2 11.3 16.35
TMS320VC5501PGF300 PGF LQFP 176 40 4x10 150 315 135.9 7620 20.7 30.4 20.7
TMS320VC5501ZAV300 ZAV NFBGA 201 126 7 X 18 150 315 135.9 7620 17.2 11.3 16.35
TNETV2501INPGF PGF LQFP 176 40 4x10 150 315 135.9 7620 20.7 30.4 20.7
VC5501LMPGF300 PGF LQFP 176 40 4x10 150 315 135.9 7620 20.7 30.4 20.7
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2022
Pack Materials-Page 1
MECHANICAL DATA GZZ (S—PBGA—N201) PLASTIC BALL GRID ARRAY 15,10 ’47 T9050 fl 12,50 TYF‘ )>mr):m‘nmILXr’§zth: A1 Come! 579111315 246310121416 0'95 Bonom V1ew 0.55 1.40 MAX 3_ , f%T 3 mm We JL333m— mm 157: 0,35 4205370/A 05/03 NOTES' A. A11 fineor d1mens1uns are m m1111me1ers This dvawinq is subject 10 Change mum ncfice. c Mmsmy EBA" cunfiqmumu cu MmroSmr BSA 15 a Vadcmurk of Tcxcs 1ns1run‘cms {P TEXAS INSTRUMENTS
MECHANICAL DATA zzz (S—PBGA—N201) PLASTIC BALL GRID ARRAY 0 A1 Comer :Lxgzzrmac Dmficmfim 12,500: 050 'e \ 000000000000000 0 0000000000000 0 00 00000000000 00 000 OCIOOO 000 000 000 000 000 0000 00000 0000 0000 00000 0000 fieee~geeeee~geeeai Bokom Vwcw L40 VAX 1 Sm'mg P‘anc 4ZZGSOG/A 10/04 NO'ES' A AH Hnec' dimensmrs c'e m m'mmmrs 0 change wnrau: nvhce, B Tm drowmq \s sums c ms package is \eudwee ‘4; TEXAS INSTRUMENTS www.li.com
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATA SHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, regulatory or other requirements.
These resources are subject to change without notice. TI grants you permission to use these resources only for development of an
application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license
is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you
will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these
resources.
TI’s products are provided subject to TI’s Terms of Sale or other applicable terms available either on ti.com or provided in conjunction with
such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for
TI products.
TI objects to and rejects any additional or different terms you may have proposed. IMPORTANT NOTICE
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022, Texas Instruments Incorporated