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Datenblatt für SN54/74ACT00 von Texas Instruments
H
10
\Ammb
|_n_n_n_n_n_n_|
I—II—Il—Il—H—I
oIY:A-
740°C to BS‘C
755°Cto125¢c
OUTPUT
‘4‘ TEXAS
INSTRUMENTS
SCAS523D − AUGUST 1995 − REVISED OCTOBER 2003
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D4.5-V to 5.5-V VCC Operation
DInputs Accept Voltages to 5.5 V
DMax tpd of 8 ns at 5 V
DInputs Are TTL-Voltage Compatible
SN54ACT00 ...FK PACKAGE
(TOP VIEW)
3 2 1 20 19
910111213
4
5
6
7
8
18
17
16
15
14
4A
NC
4Y
NC
3B
1Y
NC
2A
NC
2B
1B
1A
NC
3Y
3A
V
4B
2Y
GND
NC
CC
NC − No internal connection
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1A
1B
1Y
2A
2B
2Y
GND
VCC
4B
4A
4Y
3B
3A
3Y
SN54ACT00 ...J OR W PACKAGE
SN74ACT00 . . . D, DB, N, NS, OR PW PACKAGE
(TOP VIEW)
description/ordering information
The ‘ACT00 devices contain four independent 2-input NAND gates. Each gate performs the Boolean function
of Y = A S B or Y = A + B in positive logic.
ORDERING INFORMATION
TAPACKAGE†ORDERABLE
PART NUMBER TOP-SIDE
MARKING
PDIP − N Tube SN74ACT00N SN74ACT00N
SOIC − D
Tube SN74ACT00D
ACT00
SOIC − D Tape and reel SN74ACT00DR ACT00
−40°C to 85°CSOP − NS Tape and reel SN74ACT00NSR ACT00
−40 C to 85 C
SSOP − DB Tape and reel SN74ACT00DBR AD00
TSSOP − PW
Tube SN74ACT00PW
AD00
TSSOP − PW Tape and reel SN74ACT00PWR AD00
CDIP − J Tube SNJ54ACT00J SNJ54ACT00J
−55°C to 125°CCFP − W Tube SNJ54ACT00W SNJ54ACT00W
−55 C to 125 C
LCCC − FK Tube SNJ54ACT00FK SNJ54ACT00FK
†Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
FUNCTION TABLE
(each gate)
INPUTS
OUTPUT
A B
OUTPUT
Y
H H L
LXH
X L H
Copyright 2003, Texas Instruments Incorporated
! "#$ ! %#&'" ($)
(#"! " !%$""! %$ *$ $! $+! !#$!
!(( ,-) (#" %"$!!. ($! $"$!!'- "'#($
$!. '' %$$!)
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
%(#"! "%' /0121 '' %$$! $ $!$(
#'$!! *$,!$ $() '' *$ %(#"! %(#"
%"$!!. ($! $"$!!'- "'#($ $!. '' %$$!)
‘9 TEXAS
INSTRUMENTS
2 POST OFFICE EOX 655303 5 DAL
SCAS523D − AUGUST 1995 − REVISED OCTOBER 2003
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic diagram, each gate (positive logic)
Y
B
A
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC −0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) −0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±200 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance, θJA (see Note 2): D package 86°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DB package 96°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
N package 80°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NS package 76°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
PW package 113°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg −65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 3)
SN54ACT00 SN74ACT00
UNIT
MIN MAX MIN MAX
UNIT
VCC Supply voltage 4.5 5.5 4.5 5.5 V
VIH High-level input voltage 2 2 V
VIL Low-level input voltage 0.8 0.8 V
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
IOH High-level output current −24 −24 mA
IOL Low-level output current 24 24 mA
∆t/∆vInput transition rise or fall rate 8 8 ns/V
TAOperating free-air temperature −55 125 −40 85 °C
NOTE 3: All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
unnnurrzn new Pnklnl'nnuc mm
‘PLH
‘PHL
V TEXAS
INSTRUMENTS
SCAS523D − AUGUST 1995 − REVISED OCTOBER 2003
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C SN54ACT00 SN74ACT00
UNIT
PARAMETER
TEST CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
IOH = −50 A
4.5 V 4.4 4.49 4.4 4.4
IOH = −50 µA5.5 V 5.4 5.49 5.4 5.4
VOH
IOH = −24 mA
4.5 V 3.86 3.7 3.76
V
VOH IOH = −24 mA 5.5 V 4.86 4.7 4.76 V
IOH = −50 mA†5.5 V 3.85
IOH = −75 mA†5.5 V 3.85
IOL = 50 A
4.5 V 0.001 0.1 0.1 0.1
IOL = 50 µA5.5 V 0.001 0.1 0.1 0.1
VOL
IOL = 24 mA
4.5 V 0.36 0.5 0.44
V
VOL IOL = 24 mA 5.5 V 0.36 0.5 0.44 V
IOL = 50 mA†5.5 V 1.65
IOL = 75 mA†5.5 V 1.65
IIVI = VCC or GND 5.5 V ±0.1 ±1±1µA
ICC VI = VCC or GND, IO = 0 5.5 V 2 40 20 µA
∆ICC‡One input at 3.4 V,
Other inputs at GND or VCC 5.5 V 0.6 1.6 1.5 mA
CiVI = VCC or GND 5 V 2.6 pF
†Not more than one output should be tested at a time, and the duration of the test should not exceed 2 ms.
‡This is the increase in supply current for each input that is at one of the specified TTL voltage levels, rather than 0 V or VCC.
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
PARAMETER
FROM
TO
TA = 25°C SN54ACT00 SN74ACT00
UNIT
PARAMETER
FROM
(INPUT)
TO
(OUTPUT) MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
A or B
Y
1.5 5.5 9 1 9.5 1 9.5
ns
tPHL
A or B
Y
1.5 4 7 1 8 1 8
ns
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cpd Power dissipation capacitance CL = 50 pF, f = 1 MHz 40 pF
\ 1 ‘ L,,
51 00 ‘ {5 1‘
\
$4 H
cL = so pF \ \
(see Note A) I 1}—
L0
‘9 TEXAS
INSTRUMENTS
SCAS523D − AUGUST 1995 − REVISED OCTOBER 2003
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1 2 × VCC
500 Ω
500 Ω Open
tPLH/tPHL Open
TEST S1
50% VCC
tPLH
tPHL
tPHL
tPLH
VOH
VOH
VOL
VOL
1.5 V 1.5 V
3 V
0 V
50% VCC
50% VCC
Input
Out-of-Phase
Output
In-Phase
Output 50% VCC
VOLTAGE WAVEFORMS
NOTES: A. CL includes probe and jig capacitance.
B. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr ≤2.5 ns, tf ≤ 2.5 ns
.
C. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
{I} TEXAS
INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2022
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8769901M2A ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-
8769901M2A
SNJ54
ACT00FK
Samples
5962-8769901MCA ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8769901MC
A
SNJ54ACT00J
Samples
5962-8769901MDA ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8769901MD
A
SNJ54ACT00W
Samples
SN74ACT00D ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT00 Samples
SN74ACT00DBR ACTIVE SSOP DB 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD00 Samples
SN74ACT00DG4 ACTIVE SOIC D 14 50 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT00 Samples
SN74ACT00DR ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT00 Samples
SN74ACT00DRE4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT00 Samples
SN74ACT00DRG4 ACTIVE SOIC D 14 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT00 Samples
SN74ACT00N ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74ACT00N Samples
SN74ACT00NE4 ACTIVE PDIP N 14 25 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74ACT00N Samples
SN74ACT00NSR ACTIVE SO NS 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ACT00 Samples
SN74ACT00PW ACTIVE TSSOP PW 14 90 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD00 Samples
SN74ACT00PWR ACTIVE TSSOP PW 14 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AD00 Samples
SNJ54ACT00FK ACTIVE LCCC FK 20 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-
8769901M2A
SNJ54
ACT00FK
Samples
SNJ54ACT00J ACTIVE CDIP J 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8769901MC
ASamples
Addendum-Page 1
I TEXAS
INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2022
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SNJ54ACT00J
SNJ54ACT00W ACTIVE CFP W 14 1 Non-RoHS
& Green SNPB N / A for Pkg Type -55 to 125 5962-8769901MD
A
SNJ54ACT00W
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ACT00, SN74ACT00 :
Addendum-Page 2
TEXAS
INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Jun-2022
•Catalog : SN74ACT00
•Automotive : SN74ACT00-Q1, SN74ACT00-Q1
•Military : SN54ACT00
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Military - QML certified for Military and Defense Applications
Addendum-Page 3
I TEXAS
INSTRUMENTS
5:.
V.’
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ACT00DBR SSOP DB 14 2000 330.0 16.4 8.35 6.6 2.4 12.0 16.0 Q1
SN74ACT00DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
SN74ACT00NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
SN74ACT00PWR TSSOP PW 14 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ACT00DBR SSOP DB 14 2000 356.0 356.0 35.0
SN74ACT00DR SOIC D 14 2500 356.0 356.0 35.0
SN74ACT00NSR SO NS 14 2000 356.0 356.0 35.0
SN74ACT00PWR TSSOP PW 14 2000 356.0 356.0 35.0
Pack Materials-Page 2
I TEXAS
INSTRUMENTS
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TUBE
L - Tube length
T - Tube
height
W - Tube
width
B - Alignment groove width
*All dimensions are nominal
Device Package Name Package Type Pins SPQ L (mm) W (mm) T (µm) B (mm)
5962-8769901M2A FK LCCC 20 1 506.98 12.06 2030 NA
5962-8769901MDA W CFP 14 1 506.98 26.16 6220 NA
SN74ACT00D D SOIC 14 50 506.6 8 3940 4.32
SN74ACT00DG4 D SOIC 14 50 506.6 8 3940 4.32
SN74ACT00N N PDIP 14 25 506 13.97 11230 4.32
SN74ACT00N N PDIP 14 25 506 13.97 11230 4.32
SN74ACT00NE4 N PDIP 14 25 506 13.97 11230 4.32
SN74ACT00NE4 N PDIP 14 25 506 13.97 11230 4.32
SN74ACT00PW PW TSSOP 14 90 530 10.2 3600 3.5
SNJ54ACT00FK FK LCCC 20 1 506.98 12.06 2030 NA
SNJ54ACT00W W CFP 14 1 506.98 26.16 6220 NA
Pack Materials-Page 3
MECHANICAL DATA
AME; CHEF“ ELAR‘REE
?< (a="" cm;="" w”)="" ,eamess="" c="" ’7="" flflflflflfl\="" f="" e="" e="" e="" e="" ,="" kwwwg="" qfijrm“="" a="" i:="" i7="" i4="" i:="" i:="" e7="" eiflfiiflfizj="" vvwwttflfl="" 1="" notes="" ah="" ineur="" dimensions="" are="" in="" inches="" (minmeiers).="" this="" cruwg="" i5="" subjeci="" i0="" chcnge="" without="" noiice="" this="" package="" car="" he="" hermeticuiiy="" secied="" mm="" a="" metai="" ic="" i'ciis="" wiihi="" jedec="" n87004="" 50m)="" {mm="" instruments="" w.="" (i.="" cam="">
MECHANICAL DATA
NS (R-PDSO-G") PLASTIC SMALL—OUTLINE PACKAGE
14-PINS SHOWN
HHFHHFH
j j t t H H j,
A
jfi/—\ %
lgLLLLLiLLL/fiif
A MAX 1060 1060 1290 1530
A MW 990 9,90 1230 14‘70
4040062/0 03/03
VOTES: A. AH Hneur dimenswons are m mHHmetevs
a, Tm: druwmg 5 subject to change wmom name.
0 Body dwmenswons do not mamas mom flash 0v pmtmswom not to exceed 0,15
INSTRUMEN'IS
www.li.m
MECHANICAL DATA
W (R—GDFP—F14) CERAM‘C DUAL FLATPACK
Ease and Seating Wane
0.250 (6.60)
00‘5 (W) 0235 (5.97)
f 0. 026 (0 as)
‘ ‘ 0.005 0.20
_ 00 2.03) 0.004 (0.10)
0,045 1.14
47 0,280 (7.11) MAX 4»
0.019 0.48
1 H i 0.015 50.35;
:3 I: T
I: :1
:I I: 0.050 (1.27)
(:3 ::I
0.390 (9 91)
7' I: :1
0.335 (0.51) :l I:
1:3 ::1
1:3 ::1 “-005 (0-13) “‘N
4 Manes
1:3 I: i
7 E f
0.560 (9.11) 0.360 (0.14)
0.250 (0.35) 0,250 (6.35)
404013072/r 01/11
NOTES: A. AH Hnear dimensions are in inches (m1111meters).
B. This dram’ng 1: 5mm \0 change mm nofice.
c, This package can be hermeticany sea1ed mm 0 ceramic lid usmg glass iriL
0, \ndex paint '15 pmw'ded an cap for terminm idenmcutiun omy.
E. Faus within M1L STD 1835 GDFPW’FH
i TEXAS
INSTRUMENTS
www.mmm
GENERIC PACKAGE VIEW
J 14 CDIP - 5.08 mm max heigm
CERAMIC DUAL IN LINE PACKAGE
[I
l
l
'I
I.“
Images above are jusl a represenlalion of the package family, aclual package may vary
Refel lo the produd dala sheel for package details.
4040053756
I TEXAS
INSTRI IMFNTS
www.ti.com
PACKAGE OUTLINE
C
14X .008-.014
[0.2-0.36]
TYP
-15
0
AT GAGE PLANE
-.314.308 -7.977.83[ ]
14X -.026.014 -0.660.36[ ]
14X -.065.045 -1.651.15[ ]
.2 MAX TYP
[5.08] .13 MIN TYP
[3.3]
TYP-.060.015 -1.520.38[ ]
4X .005 MIN
[0.13]
12X .100
[2.54]
.015 GAGE PLANE
[0.38]
A
-.785.754 -19.9419.15[ ]
B -.283.245 -7.196.22[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
78
14
1
PIN 1 ID
(OPTIONAL)
SCALE 0.900
SEATING PLANE
.010 [0.25] C A B
fi©©©©©©©
““w“‘¢‘w‘w““‘
,w@@@@@@
A
RLr
www.ti.com
EXAMPLE BOARD LAYOUT
ALL AROUND
[0.05] MAX.002
.002 MAX
[0.05]
ALL AROUND
SOLDER MASK
OPENING
METAL
(.063)
[1.6]
(R.002 ) TYP
[0.05]
14X ( .039)
[1]
( .063)
[1.6]
12X (.100 )
[2.54]
(.300 ) TYP
[7.62]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
4214771/A 05/2017
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
SEE DETAIL A SEE DETAIL B
SYMM
SYMM
1
78
14
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
DETAIL B
13X, SCALE: 15X
MECHANICAL DATA
D U1 4)} 0 (3'4) DLASHC SMALL 0U ¥N¥
4040047 5/M 06/1‘
NO'ES, A AH Hnec' dimensmrs c'e m 'mc'ves ['nflhmeter5>
B Th5 drawer ‘5 subje», ,0 change mm: Home,
A Body \cngth docs rm mac mod Hoar, p'omswons, (xv gmc bms Mom mm warmers, or gm buns sha‘
nm exceed 3005 (015) eam swce
@ Body mm does 101 meme 11mm fish.
E Rdererce JEDEC MS 012 mam AB,
nter‘ec: flash sfu‘ not exceed 0017 (043) each swde
{If TEXAS
INSTRUMENTS
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LAND PATTERN DATA
D (R7PDSOmGl4) PLASTlC SMALL OUTLINE
Example Board Layout Sterlazlogpeulyngs
(Mole c)
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Example
Non Soldermask Delined Pad Example
Pad Geometry
(See Note c)
F
Example
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7 0 07 f (See Note E)
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NOTES: A. All linear dimensions are in millimeters.
a, Tnis drawan is subject to cnonae wl'lhuul notice.
c. Publlcutl’on chs7351 is recommended tor alternate desl’gns.
D. Laser ctming apertures w‘lth trapezoidal walls and also roundlng comers wlll otter better paste release. Customers should
contact their board assembly site for stencil design recommendations, Reter tc ch—7525 lor otner stencil recommendations.
E. Customers snoola contact their ooard looricotion site lor solder musk tolerances between ond oroond signol oods.
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INSTRUMENTS
www.li.com
MECHANICAL DATA
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INSTRUMENTS
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LAND PATTERN DATA
PLASTHC SMALL OUTLINE
Example Board Layout
(Male 0)
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MECHANICAL DATA
N (R—PDlP-T“) PLASTIC DUAL—IN—LINE PACKAGE
16 P15 SHOWN
PWS "
A L .
[NM 15 a 20
16 9 0 775 U 777 0 SZU '1 USE
3 ,
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0 250 (6,50‘ A MN [1145‘ 0142‘ 0.350 new
3 O 240 (6.10), 15 92/ (1832/ (2 .59) (23,58)
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1 B
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1 1
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20 Pm vendor upho'v
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B 1m: drawmq 1s sume
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A The 70 p171 and 15m} shmflder Md” 15 a ve'vdnr 0311071, eher NIH Dr 111 wkflh
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INSTRUMENTS
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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