Datenblatt für COTS Series, X7R Dielectric von KEMET

E‘ectromc Components KEII/IEI' CHARGED? ——: ‘7 Rated (VDC) A = Testing per PRF755681 PD B: Testing pe PRF755681 P per ElArAéB C = Testing per PRF755681 PD perElA4169,H MILVS'TDVZOZ ConditinnA
1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
One world. One KEMET
Overview
KEMET’s COTS program is an extension of KEMET knowledge
of high reliability test regimes and requirements. KEMET
regularly supplies “up-screened” products by working with
customer drawings and imposing specified design and test
requirements. The COTS program offers the same high quality
and high reliability components as up-screened products,
but at a lower cost to the customer. This is accomplished by
eliminating the need for customer-specific drawings to achieve
the reliability level required for customer applications. A series
of tests and inspections have been selected to provide the
accelerated conditioning and 100% screening necessary to
eliminate infant mortal failures from the population.
KEMET’s X7R dielectric features a 125°C maximum operating
temperature and is considered “temperature stable.” The
Electronics Components, Assemblies & Materials Association
(EIA) characterizes X7R dielectric as a Class II material.
Components of this classification are fixed, ceramic dielectric
capacitors suited for bypass and decoupling applications or
for frequency discriminating circuits where Q and stability of
capacitance characteristics are not critical. X7R exhibits a
predictable change in capacitance with respect to time and
voltage and boasts a minimal change in capacitance with
reference to ambient temperature. Capacitance change is
limited to ±15% from −55°C to +125°C.
All COTS testing includes voltage conditioning and post-electrical
testing as per MIL–PRF–55681. For enhanced reliability, KEMET
also provides the following test level options and conformance
certifications:
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability
Applications, X7R Dielectric, 6.3 – 250 VDC
Ordering Information
C1210 T104 K 5 R A C TU
Ceramic
Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
Dielectric Test Level Termination
Finish1
Packaging/
Grade (C-Spec)
0402
0603
0805
1206
1210
1812
2220
T = COTS Two
significant
digits and
number of
zeros
J = ±5%
K = ±10%
M = ±20%
9 = 6.3
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
R = X7R A = Testing per MIL-
PRF-55681 PDA 8%
B= Testing per MIL-
PRF-55681 PDA 8%, DPA
per EIA-469
C = Testing per MIL-
PRF-55681 PDA 8%, DPA
per EIA-469, Humidity per
MIL-STD-202, Method 103,
Condition A
C = 100%
Matte Sn
L = SnPb (5%
Pb minimum)
See
"Packaging
C-Spec
Ordering
Options Table"
1 Additional termination finish options may be available. Contact KEMET for details.
Test Level A Test Level B Test Level C
Voltage Conditioning
DWV
IR@25°C
CAP
DF
Voltage Conditioning
DWV
IR@25°C
CAP
DF
Voltage Conditioning
DWV
IR@25°C
CAP
DF
PDA 8% PDA 8% PDA 8%
C of C DPA DPA
C of C 85/85
C of C
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Ermmm Compancnls KEIl/IEI' EHARGED! 7411 (HA 0603 and smaller case sizes) 7210 (EIA 0305 and larger case sizes) 7040 (EIA 0603) 7215 (EIA 0805 and larger case sizes)
2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)
Bulk Bag/Unmarked
Not required (Blank)
7" Reel/Unmarked
TU
13" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7" Reel/Marked
TM
13" Reel/Marked
7040 (EIA 0603)
7215 (EIA 0805 and larger case sizes)
7" Reel/Unmarked/2mm pitch
2
7081
13" Reel/Unmarked/2mm pitch
2
7082
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain
capacitors that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Benefits
• −55°C to +125°C operating temperature range
• Lead (Pb)-free, RoHS and REACH compliant
• Voltage conditioning and post-electrical testing per
MIL–PRF–55681
• Destructive Physical Analysis (DPA) per EIA–469
• Biased humidity testing (85/85) per MIL–STD–202
• Certificate of Compliance
• Temperature stable dielectric
• EIA 0402, 0603, 0805, 1206, 1210, 1812, and
2220 case sizes
• DC voltage ratings of 6.3 V, 10 V, 16 V, 25 V, 50 V, 100 V,
200 V, and 250 V
• Capacitance offerings ranging from 10 pF to 22 μF
• Available capacitance tolerances of ±5%, ±10%, and ±20%
• Non-polar device, minimizing installation concerns
• 100% pure matte tin-plated termination finish allowing for
excellent solderability
• SnPb termination finish option available upon request
(5% Pb minimum)
Applications
Typical applications include military, space quality and high reliability electronics.
ammm Compancnls KEIVIEI' EMARGED! 1.00 (0.040) 0.50 (0.020) 0.30 (0.012) Sokier Reflow 20.05 (0,002) :005 (0.002) 20.10 (0004) Only 1.00 (0.003) 0.80 (0.032) 0.35 (0.014) 20.15 (0.000) 20.15 (0.005) 10.15 (0.000) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 20.20 (0000) +020 (0000) :025 (0,010) 3.20 (0,120) 1.00 (0.053) 0.50 (0.02) 20.20 (0.000) :020 (0,005) :025 (0,010) 3.20 (0,120) 2.50 (0.090) 0.50 (0.02) +0.20 (0.000) :020 (0,005) :025 (0,010) 4.50 (0.177) 3.20 (0.120) 0.00 (0,024) 10.30 (0.012) 20.30 (0.012) :035 (0,014) 5.70 (0.224) 5.00 (0.197) 0.00 (0,024) 10.40 (0,010) 20.40 (0.010) :035 (0,014)
3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
Separation
Minimum
Mounting
Technique
0402 1005
1.00 (0.040)
±0.05 (0.002)
0.50 (0.020)
±0.05 (0.002)
See Table 2 for
Thickness
0.30 (0.012)
Solder Reflow
Only
0603 1608
1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
0.70 (0.028)
Solder Wave or
Solder Reflow
0805 2012
2.00 (0.079)
±0.20 (0.008)
1.25 (0.049)
+0.20 (0.008)
0.75 (0.030)
1206 3216
3.20 (0.126)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
N/A
121013225
3.20 (0.126)
+0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
Solder Reflow
Only
1812 4532
4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
2220 5650
5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
1 For capacitance values ≥ 4.7 µF add 0.02 (0.001) to the width tolerance dimension and 0.10 (0.004) to the length tolerance dimension.
Qualification/Certification
Commercial Grade products are subject to internal qualification. Details regarding test methods and conditions are refer-
enced in Table 4, Performance & Reliability.
Environmental Compliance
Lead (Pb)-free, RoHS, and REACH compliant without exemptions (excluding SnPb termination finish option).
ammmc compmm KEIVIEI' crummy: 250% M rated voltage (531 seconds and charge/discharge not exceedmg SOmA) 1,000 Megohm 500 Megohm Microfarads or 100 GD Microfarads or 10 an
4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°C to +125°C
Capacitance Change with Reference to
+25°C and 0 Vdc Applied (TCC) ±15%
1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
2Dielectric Withstanding Voltage (DWV)
250% of rated voltage
(5±1 seconds and charge/discharge not exceeding 50mA)
3Dissipation Factor (DF) Maximum Limit at 25°C 5%(6.3V & 10V), 3.5%(16V & 25V) and 2.5%(50V to 250V)
4Insulation Resistance (IR) Minimum Limit at 25°C See Insulation Resistance Limit Table
(Rated voltage applied for 120±5 seconds at 25°C)
1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF
120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF
4 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as
Automatic Level Control (ALC). The ALC feature should be switched to "ON".
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial
Limit
16/25
5.0
< 16
7.5
Insulation Resistance Limit Table
EIA Case Size
1,000 Megohm
Microfarads or 100 GΩ
500 Megohm
Microfarads or 10 GΩ
0201
N/A
ALL
0402
< 0.012 µF
≥ 0.012 µF
0603
< 0.047 µF
≥ 0.047 µF
0805
< 0.15 µF
≥ 0.15 µF
1206
< 0.47 µF
≥ 0.47 µF
1210
< 0.39 µF
≥ 0.39 µF
1808
ALL
N/A
1812
< 2.2 µF
≥ 2.2 µF
1825
ALL
N/A
2220
< 10 µF
≥ 10 µF
2225
ALL
N/A
Eiccxmmc compmm KEIl/IEI' crummy: Capacitance Tolerance Producl Availability and Chip Thickness Codes See Table 2 INC Ip Thickness mansions case Sixe/ Series
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes)
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)
Capacitance Cap
Code
Case Size/
Series C0402T C0603T C0805T C1206T
Voltage Code 98435 9843512 9843512A9 843512A
Rated Voltage
(VDC)
6.3
10
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
10 – 91 pF* 100 – 910* J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
100 – 150 pF** 101 – 151** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN EB EB EB EB EB EB EB
180 – 820 pF** 181 – 821** J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB
1,000 pF 102 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
1,200 pF 122 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
1,500 pF 152 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
1,800 pF 182 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
2,200 pF 222 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
2,700 pF 272 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
3,300 pF 332 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
3,900 pF 392 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
4,700 pF 472 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
5,600 pF 562 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
6,800 pF 682 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
8,200 pF 822 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
10,000 pF 103 J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
12,000 pF 123 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DN DN DN EB EB EB EB EB EB EB EB
15,000 pF 153 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB
18,000 pF 183 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB
22,000 pF 223 J K M BB BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DN DN EB EB EB EB EB EB EB EB
27,000 pF 273 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE EB EB EB EB EB EB EB EB
33,000 pF 333 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE EB EB EB EB EB EB EB EB
39,000 pF 393 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DP DE EB EB EB EB EB EC EB EB
47,000 pF 473 J K M BB BB BB BB CF CF CF CF CF CF DN DN DN DN DN DE DG EB EB EB EB EB EC ED ED
56,000 pF 563 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE DG EB EB EB EB EB EB ED ED
68,000 pF 683 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE EB EB EB EB EB EB ED ED
82,000 pF 823 J K M BB BB BB CF CF CF CF CF DP DP DP DP DP DE EB EB EB EB EB EB ED ED
0.10 µF 104 J K M BB BB BB CF CF CF CF CF DN DN DN DN DN DE EB EB EB EB EB EB EM EM
0.12 µF 124 J K M CF CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG
0.15 µF 154 J K M CF CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC EG
0.18 µF 184 J K M CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC
0.22 µF 224 J K M CF CF CF CF DN DN DN DN DP DG EC EC EC EC EC EC
0.27 µF 274 J K M CF CF CF DP DP DP DP DP EB EB EB EB EC EM
0.33 µF 334 J K M CF CF CF DP DP DP DP DP EB EB EB EB EC EG
0.39 µF 394 J K M CF CF CF DG DG DG DG DE EB EB EB EB EC EG
0.47 µF 474 J K M CF CF CF DP DP DP DP DE EC EC EC EC EC EG
0.56 µF 564 J K M DP DP DP DG DH ED ED ED ED EC
0.68 µF 684 J K M DP DP DP DG DH EE EE EE EE ED
0.82 µF 824 J K M DP DP DP DG EF EF EF EF ED
1.0 µF 105 J K M DP DP DP DG EF EF EF EG ED
1.2 µF 125 J K M DE DE DE ED ED ED EG EH
1.5 µF 155 J K M DG DG DG EF EF EF EG EH
1.8 µF 185 J K M DG DG DG ED ED ED EF EH
2.2 µF 225 J K M DG DG DG ED ED ED EF EH
2.7 µF 275 J K M EN EN EN EH
3.3 µF 335 J K M ED ED ED EH
3.9 µF 395 J K M EF EF EF EH
4.7 µF 475 J K M EF EF EF EH
5.6 µF 565 J K M EH EH EH
6.8 µF 685 J K M EH EH EH
Capacitance Cap
Code
Rated Voltage
(VDC)
6.3
10
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Voltage Code 98435 9843512 9843512A 9843512A
Case Size/
Series
C0402T C0603T C0805T C1206T
ammmc compmm KEIVIEI' crummy: Capacitance Product Availability and Chip thickness Codes Tolerance SeeTahleZIMCl Thickness Imensions Capaci‘ance Tolerance
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes)
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)
Capacitance Cap
Code
Case Size/
Series C1210T C1808T C1812T C1825T C2220T
Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Rated Voltage
(VDC)
6.3
10
16
25
50
100
200
250
50
100
200
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
10 - 91 pF* 100 - 910* J K M FB FB FB FB FB FB FB
100 - 270 pF** 101 - 391** J K M FB FB FB FB FB FB FB
330 pF 331 J K M FB FB FB FB FB FB FB LF LF LF
390 pF 391 J K M FB FB FB FB FB FB FB LF LF LF
470 - 820 pF** 471 - 821** J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,000 pF 102 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,200 pF 122 J K M FB FB FB FB FB FB FB LF LF LF GB GB GB GB
1,500 pF 152 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB
1,800 pF 182 J K M FB FB FB FB FB FB FE LF LF LF GB GB GB GB
2,200 pF 222 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB
2,700 pF 272 J K M FB FB FB FB FB FB FB FB LF LF LF GB GB GB GB
3,300 pF 332 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB
3,900 pF 392 J K M FB FB FB FB FB FB FB FB LF LF GB GB GB GB
4,700 pF 472 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GD
5,600 pF 562 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GH
6,800 pF 682 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE JE
8,200 pF 822 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE JE
10,000 pF 103 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE JE
12,000 pF 123 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE JE
15,000 pF 153 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE JE
18,000 pF 183 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB JE JE JE
22,000 pF 223 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JE JE JE
27,000 pF 273 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JE JE JE
Capacitance Cap
Code
Rated Voltage
(VDC)
6.3
10
16
25
50
100
200
250
50
100
200
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Case Size/
Series
C1210T C1808T C1812T C1825T C2220T
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1206 Case Sizes) cont'd
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)
Capacitance Cap
Code
Case Size/
Series C0402T C0603T C0805T C1206T
Voltage Code 98435 9843512 9843512A9 843512A
Rated Voltage
(VDC)
6.3
10
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
8.2 µF 825 J K M EH EH EH
10 µF 106 J K M EH EH EH
Capacitance Cap
Code
Rated Voltage
(VDC)
6.3
10
16
25
50
6.3
10
16
25
50
100
200
6.3
10
16
25
50
100
200
250
6.3
10
16
25
50
100
200
250
Voltage Code 98435 9843512 9843512A 9843512A
Case Size/
Series
C0402T C0603T C0805T C1206T
ammmc compmm KEIVIEI' crummy: Capacitance Tolerance
7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 1B – Capacitance Range/Selection Waterfall (1210 – 2220 Case Sizes) cont'd
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
**Capacitance range Includes E12 decade values only. (i.e., 10, 12, 15, 18, 22, 27, 33, 39, 47, 56, 68, and 82)
Capacitance Cap
Code
Case Size/
Series C1210T C1808T C1812T C1825T C2220T
Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Rated Voltage
(VDC)
6.3
10
16
25
50
100
200
250
50
100
200
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
33,000 pF 333 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JB JB JB
39,000 pF 393 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JB JB JB
47,000 pF 473 J K M FB FB FB FB FB FB FB FB LD LD GB GB GB GB GB HB HB HB HB JB JB JB
56,000 pF 563 J K M FB FB FB FB FB FB FC FC LD LD GB GB GB GB GB HB HB HB HB JB JB JB
68,000 pF 683 J K M FB FB FB FB FB FB FC FC LD GB GB GB GB GB HB HB HB HB JB JB JB
82,000 pF 823 J K M FB FB FB FB FB FC FF FF LD GB GB GB GB GB HB HB HB HB JB JB JC JC JC
0.10 µF 104 J K M FB FB FB FB FB FD FG FG LD GB GB GB GB GB HB HB HB HB JB JB JC JC JC
0.12 µF 124 J K M FB FB FB FB FB FD FH FH LD GB GB GB GB GB HB HB HB HB JB JB JC JC JC
0.15 µF 154 J K M FC FC FC FC FC FD FM FM LD GB GB GB GE GE HB HB HB HB JB JB JC JC JC
0.18 µF 184 J K M FC FC FC FC FC FD FK FK LD GB GB GB GG GG HB HB HB HB JB JB JC JC JC
0.22 µF 224 J K M FC FC FC FC FC FD FK FK GB GB GB GG GG HB HB HB HB JB JB JC JC JC
0.27 µF 274 J K M FC FC FC FC FC FD GB GB GG GG GG HB HB HB HB JC JC JC JC JC
0.33 µF 334 J K M FD FD FD FD FD FD GB GB GG GG GG HB HB HB HB JC JC JC JC JC
0.39 µF 394 J K M FD FD FD FD FD FD GB GB GG GG GG HD HD HD HD JC JC JC JC JC
0.47 µF 474 J K M FD FD FD FD FD FD GB GB GG GJ GJ HD HD HD HD JC JC JC JC JC
0.56 µF 564 J K M FD FD FD FD FD FF GC GC GG HD HD HD HD JC JD JD JD JD
0.68 µF 684 J K M FD FD FD FD FD FG GC GC GG HD HD HD HD JC JD JD JD JD
0.82 µF 824 J K M FF FF FF FF FF FL GE GE GG HF HF HF HF JC JF JF JF JF
1.0 µF 105 J K M FH FH FH FH FH FM GE GE GG HF HF HF HF JC JF JF JF JF
1.2 µF 125 J K M FH FH FH FH FG JC JC
1.5 µF 155 J K M FH FH FH FH FG JC JC
1.8 µF 185 J K M FH FH FH FH FG JD JD
2.2 µF 225 J K M FJ FJ FJ FJ FG GO GO JF JF
2.7 µF 275 J K M FE FE FE FG FH
3.3 µF 335 J K M FF FF FF FM FM
3.9 µF 395 J K M FG FG FG FG FK GK GK
4.7 µF 475 J K M FC FC FC FG FS GK GK JF JF
5.6 µF 565 J K M FF FF FF FH
6.8 µF 685 J K M FG FG FG FM
8.2 µF 825 J K M FH FH FH FK
10 µF 106 J K M FH FH FH FS GK JF JO
12 µF 126 J K M
15 µF 156 J K M JO
18 µF 186 J K M
22 µF 226 J K M FS FS JO
Capacitance Cap
Code
Rated Voltage
(VDC)
6.3
10
16
25
50
100
200
250
50
100
200
25
50
100
200
250
50
100
200
250
25
50
100
200
250
Voltage Code 9 8 4 3 5 1 2 A 5 1 2 3 5 1 2 A 5 1 2 A 3 5 1 2 A
Case Size/
Series C1210T C1808T C1812T C1825T C2220T
ammm Compancnls KEIVIEI' Emma): BB CF DN DP DE as DH EB EC EN ED EE EF EM EG EH F8 F0 F0 FE FF FG FL FH FM FJ FK FS LD LF as so GD GE GH 66 GK GJ 50 HB HD HF J3 J0 JD JE JF J0 0402 0603 0805 0805 0805 0805 0805 1206 1206 1206 1206 1206 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1210 1808 1808 1812 1812 1812 1812 1812 1812 1812 1812 1812 1825 1825 1825 2220 2220 2220 2220 2220 2220 05010.05 08010.07 0.781010 0.901010 1.001010 1.251015 1.25 1 0 20 0781010 0901010 0.951010 1.001010 1.101010 1.201015 1.251015 16010.15 1.60 1 0 20 0781010 0901010 0.951010 1.001010 1.101010 1.251015 1.401015 15510.15 17010.20 1.85 1 0 20 21010.20 2501030 0901010 1.001015 1001010 1101010 12510.15 1.301010 1.401015 1.551010 1.60 1 0 20 1.701015 2.501020 1.101015 13010.15 15010.15 10010.15 11010.15 1.301015 1.401015 1.501015 24010.15 10.000 4.000 4.000 4.000 4.000 0 ooooooooooooooooooooooooooooooooooooooo 50.000 15,000 15.000 15.000 10,000 aaacccccaanaacccccaaaaacccccaaaaacccccaa oat: 2.500 2.500 2.500 4.000 4.000 4.000 2.500 2.500 2.500 2.500 2.000 2.000 4.000 4.000 4.000 2.500 2.500 2.500 2.000 2.000 2.000 2.000 2.000 1.000 2.500 2.500 1.000 1.000 1.000 1.000 1.000 1.000 1.000 1.000 500 1.000 1.000 1.000 1.000 1.000 1.000 1.000 1.000 500 coo 10.000 10.000 10.000 10.000 10.000 10.000 10.000 10.000 10.000 10.000 8.000 8.000 10.000 10.000 10.000 10.000 10.000 10.000 8.000 8.000 8.000 8.000 8.000 4.000 10.000 10.000 4.000 4.000 4.000 4.000 4.000 4.000 4.000 4.000 2.000 4.000 4.000 4.000 4.000 4.000 4.000 4.000 4.000 2.000
8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see “Tape & Reel Packaging Information”.
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50 ± 0.05
10,000
50,000
0
0
CF
0603
0.80 ± 0.07
4,000
15,000
0
0
DN
0805
0.78 ± 0.10
4,000
15,000
0
0
DP
0805
0.90 ± 0.10
4,000
15,000
0
0
DE
0805
1.00 ± 0.10
0
0
2,500
10,000
DG
0805
1.25 ± 0.15
0
0
2,500
10,000
DH
0805
1.25 ± 0.20
0
0
2,500
10,000
EB
1206
0.78 ± 0.10
4,000
10,000
4,000
10,000
EC
1206
0.90 ± 0.10
0
0
4,000
10,000
EN
1206
0.95 ± 0.10
0
0
4,000
10,000
ED
1206
1.00 ± 0.10
0
0
2,500
10,000
EE
1206
1.10 ± 0.10
0
0
2,500
10,000
EF
1206
1.20 ± 0.15
0
0
2,500
10,000
EM
1206
1.25 ± 0.15
0
0
2,500
10,000
EG
1206
1.60 ± 0.15
0
0
2,000
8,000
EH
1206
1.60 ± 0.20
0
0
2,000
8,000
FB
1210
0.78 ± 0.10
0
0
4,000
10,000
FC
1210
0.90 ± 0.10
0
0
4,000
10,000
FD
1210
0.95 ± 0.10
0
0
4,000
10,000
FE
1210
1.00 ± 0.10
0
0
2,500
10,000
FF
1210
1.10 ± 0.10
0
0
2,500
10,000
FG
1210
1.25 ± 0.15
0
0
2,500
10,000
FL
1210
1.40 ± 0.15
0
0
2,000
8,000
FH
1210
1.55 ± 0.15
0
0
2,000
8,000
FM
1210
1.70 ± 0.20
0
0
2,000
8,000
FJ
1210
1.85 ± 0.20
0
0
2,000
8,000
FK
1210
2.10 ± 0.20
0
0
2,000
8,000
FS
1210
2.50 ± 0.30
0
0
1,000
4,000
LD
1808
0.90 ± 0.10
0
0
2,500
10,000
LF
1808
1.00 ± 0.15
0
0
2,500
10,000
GB
1812
1.00 ± 0.10
0
0
1,000
4,000
GC
1812
1.10 ± 0.10
0
0
1,000
4,000
GD
1812
1.25 ± 0.15
0
0
1,000
4,000
GE
1812
1.30 ± 0.10
0
0
1,000
4,000
GH
1812
1.40 ± 0.15
0
0
1,000
4,000
GG
1812
1.55 ± 0.10
0
0
1,000
4,000
GK
1812
1.60 ± 0.20
0
0
1,000
4,000
GJ
1812
1.70 ± 0.15
0
0
1,000
4,000
GO
1812
2.50 ± 0.20
0
0
500
2,000
HB
1825
1.10 ± 0.15
0
0
1,000
4,000
HD
1825
1.30 ± 0.15
0
0
1,000
4,000
HF
1825
1.50 ± 0.15
0
0
1,000
4,000
JB
2220
1.00 ± 0.15
0
0
1,000
4,000
JC
2220
1.10 ± 0.15
0
0
1,000
4,000
JD
2220
1.30 ± 0.15
0
0
1,000
4,000
JE
2220
1.40 ± 0.15
0
0
1,000
4,000
JF
2220
1.50 ± 0.15
0
0
1,000
4,000
JO
2220
2.40 ± 0.15
0
0
500
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity1Plastic Quantity
ammmc compmm KEIVIEI' crummy:
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 2B – Bulk Packaging Quantities
Packaging Type Loose Packaging
Bulk Bag (default)
Packaging C-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
1
50,000
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
20,000
1812
4532
1825
4564
2220
5650
2225
5664
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for Automotive Grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
E‘ucuomc Compcnonu KEIWEI' CHARGED!
10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
cccccccccccccccccccc Emma):
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Soldering Process
Recommended Soldering Technique:
• Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206
• All other EIA case sizes are limited to solder reflow only
Recommended Reflow Soldering Profile:
KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual),
convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal
stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-
STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at
these conditions.
Profile Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)3°C/second
maximum
3°C/second
maximum
Liquidous Temperature (TL)183°C 217°C
Time Above Liquidous (tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)235°C 260°C
Time Within 5°C of Maximum
Peak Temperature (t
P
)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp-up Rate = 3°C/second
Maximum Ramp-down Rate = 6°C/second
tP
tL
ts
25°C to Peak
Einctmnic Componcnls KEIl/IEI' EHARGED! Appendix 2, Note: Standard termination system 7 2.0 mm (minimum) for all except 3 mm for CBS. Fiexible termination system 7 3.0 mm (minimum). Load Humidity: 1,000 hours 85"Cl85% RH and rated voitage. Add 100 K ohm resistor. Measurement at 24 hours +/74 hours after test conclusion. Low Volt Humidity: 1.000 hours SEC/85% RH and 1.5 V, Add 100 K ohm resistor. Measurement at 24 hours +/74 hours after test conclusion. M|L7STD7202 Method 106 t = 24 hours/cycle. Steps 7a and 7b not required. Measurement at 24 hours +/74 hours after test conclusion. M|L7STD7202 Method 107 755"C/+125’C. Note: Number of cycles required 7 300, maximum tiansierunie 7 20 seconds, dweli time 715 minutes. Air 7 Air. M|L7STD7202 Method 103 /E|A7198 M|L7STD7202 Method 103 5 g‘s tor 20 min.. 12 cycles each oi 3 orientations. Note: Use 0" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of o mounted Within 2" from any secure point, Test from 10 7 2,000 Hz M|L7STD7202 Method 213 M|L7STD7202 Method 215
12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
Terminal Strength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnification 50 X. Conditions:
a) Method B, 4 hours at 155°C, dry heat at 235°C
b) Method B at 215°C category 3
c) Method D, category 3 at 260°C
Temperature Cycling JESD22 Method JA–104 1,000 Cycles (−55°C to +125°C). Measurement at 24 hours +/−4 hours after test conclusion.
Biased Humidity MIL–STD–202 Method
103
Load Humidity: 1,000 hours 85°C/85% RH and rated voltage. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Low Volt Humidity: 1,000 hours 85°C/85% RH and 1.5 V. Add 100 K ohm resistor.
Measurement at 24 hours +/−4 hours after test conclusion.
Moisture Resistance
MIL–STD–202 Method
106
t = 24 hours/cycle. Steps 7a and 7b not required.
Measurement at 24 hours +/−4 hours after test conclusion.
Thermal Shock
MIL–STD–202 Method
107
−55°C/+125°C. Note: Number of cycles required – 300, maximum transfer time – 20
seconds, dwell time – 15 minutes. Air – Air.
High Temperature Life
MIL–STD–202 Method
108
/EIA–198
1,000 hours at 125°C (85°C for X5R, Z5U and Y5V) with 2 X rated voltage applied.
Storage Life
MIL–STD–202 Method
108
150°C, 0 VDC for 1,000 hours.
Vibration MIL–STD–202 Method
204
5 g's for 20 min., 12 cycles each of 3 orientations. Note: Use 8" X 5" PCB 0.031" thick 7
secure points on one long side and 2 secure points at corners of opposite sides. Parts
mounted within 2" from any secure point. Test from 10 – 2,000 Hz
Mechanical Shock
MIL–STD–202 Method
213
Figure 1 of Method 213, Condition F.
Resistance to Solvents
MIL–STD–202 Method
215
Add aqueous wash chemical, OKEM Clean or equivalent.
Storage & Handling
Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in
other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres,
and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp
and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum
storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on
the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock
should be used promptly, preferably within 1.5 years of receipt.
.................... CHARGED!
13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Construction
Dielectric
Material (BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min) End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
ammmc Con-Don KEIVIEI' cums: .
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Capacitor Marking (Optional):
These surface mount multilayer ceramic capacitors are
normally supplied unmarked. If required, they can be
marked as an extra cost option. Marking is available
on most KEMET devices, but must be requested using
the correct ordering code identifi er(s). If this option is
requested, two sides of the ceramic body will be laser
marked with a “K” to identify KEMET, followed by two
characters (per EIA–198 - see table below) to identify the
capacitance value. EIA 0603 case size devices are limited
to the “K” character only.
Laser marking option is not available on:
• C0G, ultra stable X8R and Y5V dielectric devices.
• EIA 0402 case size devices.
• EIA 0603 case size devices with fl exible termination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
Marking appears in legible contrast. Illustrated below
is an example of an MLCC with laser marking of “KA8”,
which designates a KEMET device with rated capacitance
of 100 µF. Orientation of marking is vendor optional.
KEMET
ID
2-Digit
Capacitance
Code
EIA Case Size Metric Size Code Capacitance
0603
1608
≤ 170 pF
0805
2012
≤ 150 pF
1206
3216
≤ 910 pF
1210
3225
≤ 2,000 pF
1808
4520
≤ 3,900 pF
1812
4532
≤ 6,700 pF
1825
4564
≤ 0.018 µF
2220
5650
≤ 0.027 µF
2225
5664
≤ 0.033 µF
ammmc Compononl: KEIWEI' cums): -acitance F Fur Varinus AI halNumeralldentifiers
15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifi ers
Alpha
Character
Numeral
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
0.10
1.0
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000
C
0.12
1.2
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
1.3
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
1.5
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
F
0.16
1.6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
160,000,000
G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H
0.20
2.0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2.2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N
0.33
3.3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3.6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3.9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4.3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5.6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6.2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6.8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000
Y
0.82
8.2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2.5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3.5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e
0.45
4.5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.50
5.0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.60
6.0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.70
7.0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y
0.90
9.0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
ammm Compancnls KEIVIEI' Emma): Bmm.12mm 180mm (700») mmmm camenape KPS1812 and 2220
16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Tape & Reel Packaging Information
KEMET offers multilayer ceramic chip capacitors packaged in 8, 12 and 16 mm tape on 7" and 13" reels in accordance with
EIA Standard 481. This packaging system is compatible with all tape-fed automatic pick and place systems. See Table 2 for
details on reeling quantities for commercial chips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch (P
1
)* Pitch (P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 – 1210 84444
1805 – 1808 12 4 4
≥ 1812 12 8 8
KPS 1210 12 8 8
KPS 1812
and 2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotive grade 7" reel unmarked
C-3191
Automotive grade 13" reel unmarked
C-7081
Commercial grade 7" reel unmarked
C-7082
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Double the parts on each reel results in fewer reel
changes and increased effi ciency.
• Fewer reels result in lower packaging, shipping and
storage costs, reducing waste.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ , mum: nulhmaeling DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nole4 Minimum Maximum Maximum
17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5 +0.10/−0.0
(0.059 +0.004/−0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm)
and double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls KEIVI mam): T - V 1 f ¢¢§9 W \ +7: Tiifi‘eri / #4 j/ l ‘X J x — RRefevence NmeZ 0.10 (0.904) maXImum (afiiflig (0237) 4.0 10.10 3.3 (0.157 :a 004) (0.327)
18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0) 1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246) 3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
19© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be
165° to 180° from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of
300 ±10 mm/minute.
3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 0.4 mes/+0.0 (0331 +0 059400) 12.4 +2 0/00 (0.40:; +0 070/0 0) 15.4 +2.0/+0.0 (0.646 +0 070/0 0) 14.4 (0 567) 10.4 (0.724) 22.4 (0 882)
20© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059) 13.0 +0.5/−0.2
(0.521 +0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4 +1.5/−0.0
(0.331 +0.059/−0.0)
14.4
(0.567)
Shall accommodate tape
width without interference
12 mm
12.4 +2.0/−0.0
(0.488 +0.078/−0.0)
18.4
(0.724)
16 mm
16.4 +2.0/−0.0
(0.646 +0.078/−0.0)
22.4
(0.882)
EHARGED! 1 fi%¢ee¢o¢¢ o¢ as» ¢¢‘eo¢»$—e¢¢ / u )) rH/mm‘ yllm‘ #e4 keH/ +4 #:4 #é+\#++ \ \LLJ LLW (Lu ‘9900099fl/60fi999wv99 \‘ 90999990 Waif¢‘W¢oe6Too‘6o1 lg: Qiiiggfi1u9M133333§L @y’émawmammm gag“? HHHHH H‘HHHHH
21© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm KEIVIEI' cumin:
22© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1027_X7R_COTS_SMD • 6/12/2019
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Commercial Off-The-Shelf (COTS) for Higher Reliability Applications, X7R Dielectric, 6.3 – 250 VDC
KEMET Electronics Corporation Sales Offi ces
For a complete list of our global sales offi ces, please visit www.kemet.com/sales.
Disclaimer
All product specifi cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for
checking and verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed. All Information given
herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.
Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such
applications, but are not intended to constitute – and KEMET specifi cally disclaims – any warranty concerning suitability for a specifi c customer application or use.
The Information is intended for use only by customers who have the requisite experience and capability to determine the correct products for their application. Any
technical advice inferred from this Information or otherwise provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes
no obligation or liability for the advice given or results obtained.
Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component
failures may still occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards
(such as installation of protective circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury
or property damage.
Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other
measures may not be required.
KEMET is a registered trademark of KEMET Electronics Corporation.