Datenblatt für LM258A-EP von Texas Instruments

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FEATURES
1
2
3
4
8
7
6
5
1OUT
1IN–
1IN+
GND
VCC
2OUT
2IN–
2IN+
DPACKAGE
(TOP VIEW)
DESCRIPTION/ORDERING INFORMATION
LM258A-EPDUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
•Controlled Baseline •Low Input Bias and Offset Parameters:
– One Assembly/One Test Site, One – Input Offset Voltage . . . 2 mV TypFabrication Site
– Input Offset Current . . . 2 nA Typ•Extended Temperature Performance of –55 °C
– Input Bias Current . . . 15 nA Typto 125 °C
•Differential Input Voltage Range Equal to•Enhanced Diminishing Manufacturing
Maximum-Rated Supply Voltage . . . 32 VSources (DMS) Support
•Open-Loop Differential Voltage Amplification•Enhanced Product-Change Notification
. . . 100 V/mV Typ•Qualification Pedigree
(1)
•Internal Frequency Compensation•Wide Supply Range:
– Single Supply . . . 3 V to 30 V
– Dual Supplies . . . ±1.5 V to ±15 V•Low Supply-Current Drain, Independent ofSupply Voltage . . . 0.7 mA Typ•Common-Mode Input Voltage Range IncludesGround, Allowing Direct Sensing NearGround
(1) Component qualification in accordance with JEDEC andindustry standards to ensure reliable operation over anextended temperature range. This includes, but is not limitedto, Highly Accelerated Stress Test (HAST) or biased 85/85,temperature cycle, autoclave or unbiased HAST,electromigration, bond intermetallic life, and mold compoundlife. Such qualification testing should not be viewed asjustifying use of this component beyond specifiedperformance and environmental limits.
The LM258A consists of two independent, high-gain, frequency-compensated operational amplifiers designed tooperate from a single supply over a wide range of voltages. Operation from split supplies also is possible if thedifference between the two supplies is 3 V to 30 V, and V
CC
is at least 1.5 V more positive than the inputcommon-mode voltage. The low supply-current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifiercircuits that now can be implemented more easily in single-supply-voltage systems. For example, this device canbe operated directly from the standard 5-V supply used in digital systems and easily can provide the requiredinterface electronics without additional ±5-V supplies.
ORDERING INFORMATION
MAXV
IO
max ORDERABLET
A
TESTED PACKAGE
(1)
TOP-SIDE MARKINGAT 25 °C PART NUMBERV
CC
–55 °C to 125 °C 3mV 30V SOIC – D Reel of 2500 LM258AMDREP 258AM
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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IN+
IN-
OUT
+
-
VCC+
OUT
GND(orV )
CC-
ToOther Amplifier
IN–
IN+
Current
Regulator
» m6- A
Current
Regulator
Epi-FET
Diodes
Resistors
Transistors
Capacitors
COMPONENTCOUNT
1
2
7
51
2
Current
Regulator
» m100- A
» m6- A
Current
Regulator
» m50- A
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
SYMBOL (EACH AMPLIFIER)
SCHEMATIC (EACH AMPLIFIER)
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Absolute Maximum Ratings
(1)
LM258A-EPDUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
over operating free-air temperature range (unless otherwise noted)
VALUE UNIT
V
CC
Supply voltage
(2)
±16 or 32 V
V
ID
Differential input voltage
(3)
±32 V
V
I
Input voltage (either input) –0.3 to 32 V
Duration of output short circuit (one amplifier) to ground
Unlimitedat (or below) 25 °C free-air temperature (V
CC
≤15 V)
(4)
θ
JA
Package thermal impedance
(5) (6)
97 °C/W
T
A
Operating free-air temperature range –55 to 125 °C
T
J
Operating virtual junction temperature 150 °C
T
stg
Storage temperature range
(7)
–65 to 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operatingconditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) All voltage values, except differential voltages and V
CC
specified for measurement of I
OS
, are with respect to the network groundterminal.
(3) Differential voltages are at IN+ with respect to IN–.(4) Short circuits from outputs to V
CC
can cause excessive heating and eventual destruction.(5) Maximum power dissipation is a function of T
J
(max), θ
JA
, and T
A
. The maximum allowable power dissipation at any allowable ambienttemperature is P
D
= (T
J
(max) – T
A
)/ θ
JA
. Operating at the absolute maximum T
J
of 150 °C can affect reliability.(6) The package thermal impedance is calculated in accordance with JESD 51-7.(7) Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction ofoverall device life. See http://www.ti.com/ep_quality for additional information on enhanced plastic packaging.
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Electrical Characteristics
aIIO
aIIO
LM258A-EP
DUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
at specified free-air temperature, V
CC
= 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS
(1)
T
A
(2)
MIN TYP
(3)
MAX UNIT
V
CC
= 5 V to 30 V, 25 °C 2 3V
IO
Input offset voltage V
IC
= V
ICR(min)
, mVFull range 4V
O
= 1.4 V
Average temperature
coefficient of Full range 7 15 µV/ °Cinput offset voltage
25 °C 2 15I
IO
Input offset current V
O
= 1.4 V nAFull range 30
Average temperature
coefficient of Full range 10 200 pA/ °Cinput offset current
25 °C –15 –80I
IB
Input bias current V
O
= 1.4 V nAFull range –100
25 °C 0 to V
CC
– 1.5Common-mode
V
ICR
V
CC
= 5 V to Max Vinput voltage range
Full range 0 to V
CC
– 2
R
L
≥2 k Ω25 °C V
CC
– 1.5High-levelV
OH
R
L
= 2 k ΩFull range 26 Voutput voltage
V
CC
= 30 V
R
L
≥10 k ΩFull range 27 28
Low-levelV
OL
R
L
≤10 k ΩFull range 5 20 mVoutput voltage
Large-signal V
CC
= 15 V, 25 °C 50 100A
VD
differential V
O
= 1 V to 11 V, V/mVFull range 25voltage amplification R
L
≥2 k Ω
Common-mode V
CC
= 5 V to MaxCMRR 25 °C 70 80 dBrejection ratio V
IC
= V
ICR(min)
Supply-voltage
k
SVR
rejection ratio V
CC
= 5 V to Max 25 °C 65 100 dB(∆V
DD
/∆V
IO
)
CrosstalkV
O1
/V
O2
f = 1 kHz to 20 kHz 25 °C 120 dBattenuation
V
CC
= 15 V, 25 °C –20 –30 –60V
ID
= 1 V, Source
Full range –10V
O
= 0
mAI
O
Output current V
CC
= 15 V, 25 °C 10 20V
ID
= –1 V, Sink
5Full rangeV
O
= 15 V
V
ID
= –1 V, V
O
= 200 mV 25 °C 12 30 µA
Short-circuit V
CC
at 5 V, GND at –5 V,I
OS
25 °C±40 ±60 mAoutput current V
O
= 0
V
O
= 2.5 V, No load Full range 0.7 1.2Supply currentI
CC
mA(two amplifiers)
V
CC
= Max, V
O
= V
CC
/2, No load Full range 1 2
(1) All characteristics are measured under open-loop conditions with zero common-mode input voltage, unless otherwise specified. MAXV
CC
for testing purposes is 30 V.(2) Full range is –55 °C to 125 °C.(3) All typical values are at T
A
= 25 °C.
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Operating Characteristics
+
VO
–
RL
CL
VI
VCC+
VCC-
LM258A-EPDUAL OPERATIONAL AMPLIFIERS
SLOS506 – OCTOBER 2006
V
CC
=±15 V, T
A
= 25 °C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate at unity gain R
L
= 1 M Ω, C
L
= 30 pF, V
I
=±10 V, See Figure 1 0.3 V/ µs
B
1
Unity-gain bandwidth R
L
= 1 M Ω, C
L
= 20 pF, See Figure 1 0.7 MHz
V
n
Equivalent input noise voltage R
S
= 100 Ω, V
I
= 0 V, f = 1 kHz, See Figure 2 40 nV/ √Hz
Figure 1. Unity-Gain Amplifier
Figure 2. Noise-Test Circuit
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM258AMDREP ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 258AM
LM258AMDREPG4 ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 258AM
V62/07605-01XE ACTIVE SOIC D 8 2500 RoHS & Green NIPDAU Level-1-260C-UNLIM -55 to 125 258AM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
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PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A-EP :
•Catalog: LM258A
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I+K0 '«PI» Reel Diame|er AD Dimension deSIgned Io accommodate me componem wIdIh E0 Dimension desIgned Io eeeemmodaIe me component Iengm K0 Dlmenslun desIgned to accommodate me componem Ihlckness 7 w Overall with loe earner cape i p1 Pitch between successwe cavIIy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O SprockeIHoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pocket Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM258AMDREP SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jul-2021
Pack Materials-Page 1
l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258AMDREP SOIC D 8 2500 340.5 336.1 25.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Jul-2021
Pack Materials-Page 2
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PACKAGE OUTLINE
C
.228-.244 TYP
[5.80-6.19]
.069 MAX
[1.75]
6X .050
[1.27]
8X .012-.020
[0.31-0.51]
2X
.150
[3.81]
.005-.010 TYP
[0.13-0.25]
0 - 8 .004-.010
[0.11-0.25]
.010
[0.25]
.016-.050
[0.41-1.27]
4X (0 -15 )
A
.189-.197
[4.81-5.00]
NOTE 3
B .150-.157
[3.81-3.98]
NOTE 4
4X (0 -15 )
(.041)
[1.04]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES:
1. Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches.
Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed .006 [0.15] per side.
4. This dimension does not include interlead flash.
5. Reference JEDEC registration MS-012, variation AA.
18
.010 [0.25] C A B
5
4
PIN 1 ID AREA
SEATING PLANE
.004 [0.1] C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 2.800
Yl“‘+
www.ti.com
EXAMPLE BOARD LAYOUT
.0028 MAX
[0.07]
ALL AROUND
.0028 MIN
[0.07]
ALL AROUND
(.213)
[5.4]
6X (.050 )
[1.27]
8X (.061 )
[1.55]
8X (.024)
[0.6]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
EXPOSED
METAL
OPENING
SOLDER MASK METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED
METAL
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:8X
SYMM
1
45
8
SEE
DETAILS
SYMM
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EXAMPLE STENCIL DESIGN
8X (.061 )
[1.55]
8X (.024)
[0.6]
6X (.050 )
[1.27] (.213)
[5.4]
(R.002 ) TYP
[0.05]
SOIC - 1.75 mm max heightD0008A
SMALL OUTLINE INTEGRATED CIRCUIT
4214825/C 02/2019
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL
SCALE:8X
SYMM
SYMM
1
45
8
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