Datenblatt für Universal Eval Board User Guide von TDK InvenSense

InvenSense sensor for electrical character www invensense com For pro sa‘esQ nvensense com
Application Note
InvenSense Motion Sensor Universal
Evaluation Board (UEVB) User Guide
InvenSense reserves the right to change the
detail specifications as may be required to
permit improvements in the design of its
products.
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
www.invensense.com
Document Number: AN-IVS-0001EVB-00
Rev Number: 1.3
Rev Date: 02/24/2016
PURPOSE
This document describes the hardware and circuitry on the Universal Evaluation Board (UEVB). The UEVB is used to
evaluate most of InvenSense’s current motion sensing (gyroscopes, accelerometers, magnetometers) products. It
covers applying the UEVB to a larger system, and requires the understanding of key signals and circuit functions,
hardware jumper settings, and port connections.
USAGE
This UEVB provides up to nine axes of motion sensing comprised of:
• Digital-output of 3-axis gyroscope with user-programmable full-scale ranges
• Digital-output of 3-axis accelerometer with user-programmable full-scale ranges
• Digital-output of 3-axis magnetometer
• On-chip temperature sensor
• Data is measured using on-chip ADCs and is transmitted over I²C or SPI interfaces
The UEVB may be used by itself utilizing SPI or I²C serial communications interfaces. Alternatively, it may be
connected to the InvenSense ARM Controller Board for connectivity to a host computer via USB interface.
The UEVB was designed to support up to 9-axis MPUs (Motion Processing Units) with a built-in compass (MPU-
91xx and MPU-92xx). Connecting an external compass board to the UEVB may require the user to connect their
third-party compass to the UEVB via its auxiliary I2C bus. The UEVB is populated with an external compass, and can
access the main or auxiliary I2C bus lines provided by the sensor (AUX_DA and AUX_CL) via resistor options.
The UEVB is lead-free and RoHS compliant.
RELATED DOCUMENTS
Please refer to the product specification of the main motion sensor for electrical characteristics, pinout and
applications details. Sensor product specifications can be found at www.invensense.com. For product specifications
for unreleased parts, please contact the InvenSense sales department at sales@invensense.com.
InvenSense
UEVB
Document Number: AN-IVS-0001EVB-00 Page 2 of 19
Rev Number: 1.3
Rev Date: 02/24/2017
TABLE OF CONTENTS
PURPOSE ..................................................................................................................................................... 1
USAGE ...................................................................................................................................................... 1
RELATED DOCUMENTS .......................................................................................................................... 1
UEVB OVERVIEW ........................................................................................................................................ 3
TABLE 1A. PARTS FOR UEVB FOOTPRINTS ........................................................................................ 3
TABLE 1B. RESISTOR OPTIONS ............................................................................................................ 5
KEY FUNCTIONS AND PINOUTS ............................................................................................................ 7
I2C/SPI BUS CONNECTIONS ................................................................................................................... 7
SCHEMATIC ................................................................................................................................................. 8
BILL OF MATERIAL (BOM) .......................................................................................................................... 9
TABLE 2A. BILL OF MATERIAL FOR U1A (e.g. with MPU-92XX) ........................................................... 9
TABLE 2B. BILL OF MATERIAL FOR U1B (e.g. with ITG-35XX) ............................................................. 9
TABLE 2C. BILL OF MATERIAL FOR U1C (e.g. with ITG-1010) ........................................................... 10
TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-A (e.g. with MPU-60XX) ..................................... 10
TABLE 2E. BILL OF MATERIAL FOR U1D, OPTION-B (e.g. with MPU-91XX) ..................................... 11
POWER SUPPLY CONNECTIONS ............................................................................................................ 12
TABLE 3. POWER SELECTION JUMPERS (JP1, JP2) ......................................................................... 12
UEVB CONNECTOR SIGNALS DESCRIPTION ........................................................................................ 13
TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1) ............................................................. 13
CONNECTING THE FSYNC LINE .......................................................................................................... 14
SERIAL BUS LEVELS, SPEEDS, AND TERMINATIONS ...................................................................... 14
DATA GATHERING OPTIONS ................................................................................................................... 15
CONNECTION TO THE INVENSENSE ARM CONTROLLER BOARD ................................................. 15
USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD ........................................................ 15
SPECIAL INSTRUCTIONS ......................................................................................................................... 16
ELECTROSTATIC DISCHARGE SENSITIVITY ..................................................................................... 16
BOARD LAYOUT AND FOOTPRINT DISCUSSION .............................................................................. 16
REVISION HISTORY .............................................................................................................................. 18
U Th m s T UEVB PART PACKAGE TYPE PIN IDENTIFIER NUMBER SENSOR WPE FEATURES & DIMENSIONS COUNT 3- ast gyro, 2-axis accel (x, v) 9-axis1accel,gyro, AKM compass) compass (Most on ICM-205xx 9-axis1accel,gyro, AKM compass) compass (Most on IXZ-ZSXX QFN, 3 x 3 x 0.9 mm QFN, 3 x 3 x 0.75 mm QFN,3x3x0.75 mm 15
UEVB
Document Number: AN-IVS-0001EVB-00 Page 3 of 19
Rev Number: 1.3
Rev Date: 02/24/2017
UEVB OVERVIEW
The UEVB hosts most of InvenSense’s motion sensors and MPUs. To support a number of different products with
the UEVB, resistor options were implemented for easy and flexible circuit configurations. For example, Table 1a
shows the most popular parts that fit on the UEVB. Table 1b lists the resistor options for different configurations.
TABLE 1A. PARTS FOR UEVB FOOTPRINTS
UEVB
IDENTIFIER
PART
NUMBER
SENSOR TYPE
FEATURES
PACKAGE TYPE
& DIMENSIONS
PIN
COUNT
U1A
ITG-3400 3-axis gyro QFN, 3 x 3 x 0.9 mm 24
MPU-5400
3- axis gyro,
2-axis accel (X, Y)
QFN, 3 x 3 x 0.9 mm 24
MPU-65xx 6-axis (accel, gyro) QFN, 3 x 3 x 0.9 mm 24
MPU-68xx 6-axis (accel, gyro) QFN, 3 x 3x 0.9 mm 24
MPU-92xx
9-axis (accel, gyro,
compass)
AKM
compass
QFN, 3 x 3 x 1 mm 24
ICM-103xx 3-axis accel QFN, 3 x 3 x 0.9 mm 24
(Most of)
ICM-206xx
6-axis (accel, gyro) QFN, 3 X 3 X 0.75 mm 24
ICM-209xx*
9-axis (accel, gyro,
compass)
AKM
compass
LGA, 3 x 3 x 1 mm 24
IDG-20xx 2-axis gyro (X, Y) OIS QFN, 3 x 3 x 0.75 mm 16
U1B
IXZ-20xx
2-axis gyro (X, Z)
OIS
QFN, 3 x 3 x 0.75 mm
16
IDG-25xx 2-axis gyro (X, Y) QFN, 3 x 3 x 0.9 mm 16
(Most of)
IXZ-25xx
2-axis gyro (X, Z) QFN, 3 x 3 x 0.9 mm 16
ITG-35xx 3-axis gyro QFN, 3 x 3 x 0.9 mm 16
ITG-352x 3-axis gyro OIS
QFN, 3 x 3 x 0.9 mm
QFN, 3 x 3 x 0.75 mm
16
ITG-3701 3-axis gyro OIS
QFN, 3 x 3 x 0.75 mm
16
ITG-358x 3-axis gyro Custom QFN, 3 x 3 x 0.9 mm 16
ITG-1010 3-axis gyro QFN, 3 x 3 x 0.9 mm 16
U1C
ISZ-2510 1-axis gyro (Z) QFN, 3 x 3 x 0.9 mm 16
IXZ-2510 2-axis gyro (X, Z) QFN, 3 x 3 x 0.9 mm 16
ICM-20608 6-axis (accel, gyro) QFN, 3 x 3 x 0.75 mm 16
ICG-20660
6-axis (accel, gyro)
QFN, 3 x 3 x 0.75 mm
16
IAM-20680 6-axis (accel,gyro) LGA, 3 X 3 X 0.75mm 16
IAM-20380 3-axis (accel) LGA, 3 X 3 X 0.75mm 16
IMU-30xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24
U1D
MPU-30xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24
MPU-33xx 3-axis gyro QFN, 4 x 4 x 0.9 mm 24
MPU-60xx 6-axis (accel, gyro) QFN, 4x 4 x 0.9 mm 24
MPU-615x 6-axis (accel, gyro) QFN, 4 x 4 x 0.9mm 24
InvenSense 9»axis Iaccel, gym, compass)
UEVB
Document Number: AN-IVS-0001EVB-00 Page 4 of 19
Rev Number: 1.3
Rev Date: 02/24/2017
MPU-91xx
9-axis (accel, gyro,
compass)
LGA, 4 x 4 x 1 mm 24
* Future Product. Contact InvenSense Sales for availability.
InvenSense
UEVB
Document Number: AN-IVS-0001EVB-00 Page 5 of 19
Rev Number: 1.3
Rev Date: 02/24/2017
TABLE 1B. RESISTOR OPTIONS
𝐂𝐂𝐂𝐂/V_LOGIC Pin Resistor
Option for All Footprints
Functions as
CS
R18 = 1kΩ (or Open)
R22 = 0 Ω
Functions as
V_LOGIC
R18 = 0 Ω
R22 = Open
U1A Resistor
Option
Reserved
R1, R3, R5, R7 = 0 Ω
R2, R4, R6, R8 = Open
MPU-92xx and other QFN24,
3 x 3 x 1 mm parts
R1, R3, R5, R7 = Open
R2, R4, R6, R8 = 0 Ω
U1D Resistor
Option
Pin 15 = High
R19 = 10 kΩ
R20 = Open
Pin 15 = Low
R19 = Open
R20 = 10 kΩ
U2 Resistor
Option
Connects U2 to primary I2C bus
R11, R13 = 0 Ω
R12, R14 = Open
Connects U2 to U1's auxiliary I2C
bus (if available)
R11, R13 = Open
R12, R14 = 0 Ω
MWMMW UUUU UUUU flflflfl flflflfl
UEVB
Document Number: AN-IVS-0001EVB-00 Page 6 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
There are four different footprints on the UEVB PCB (Figures 1A, 1B, 1C and 1D) to fit various motion sensors, but
only one may be populated at a time.
U1A
QFN/LGA24
3 x 3 mm
1
2
3
4
5
613
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
U1B
QFN/LGA16
3 x 3 mm
1
2
3
4
12
11
10
9
5
6
7
8
16
15
14
13
Figure 1A: U1A (QFN/LGA24_3x3 mm) Figure 1B: U1B (QFN/LGA16_3x3 mm)
U1C
QFN/LGA16
3 x 3 mm
1
2
3
4
5
13
12
11
10
9
6
7
8
16
15
14
U1D
QFN/LGA24
4 x 4 mm
1
2
3
4
5
613
18
17
16
15
14
7
8
9
10
11
12
24
23
22
21
20
19
Figure 1C: U1C (QFN/LGA16_3x3 mm) Figure 1D: U1D (QFN/LGA24_4x4 mm)
The UEVB is populated with components only on its top side (Figure 2) to achieve ease of measurement access. A 10
x 2 connector (CN1) is designed to interface with the InvenSense ARM Controller Board, which is a host
microcontroller board useful for programming the registers of the sensor on the UEVB and accessing sensor data via
a PC or laptop through the USB port.
A 3-pin power selection header (JP1) is provided to choose the voltage level for VDD. Similarly, a 3-pin VDDIO
selection header (JP2) allows the user to select the power source for the board’s/sensor’s digital I/O voltage.
InvenSense
UEVB
Document Number: AN-IVS-0001EVB-00 Page 7 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
KEY FUNCTIONS AND PINOUTS
The motion sensing UEVB is a fully assembled and tested evaluation board, allowing for simple and swift
evaluation of the device’s X-/Y-/Z-axis angular rate gyroscope, X-/Y-/Z-axis accelerometer, and X-/Y-/Z-axis
compass. The motion sensing device has a primary interface to talk to the application processor and a secondary
interface that allows a user to communicate with an external sensor, such as a pressure sensor or compass.
The motion sensing device utilizes InvenSense’s proprietary MEMS technology with driven vibrating masses to
produce a functionally complete, low-cost motion sensor. The motion processing unit incorporates X-/Y-/Z-axis
low-pass filters and an EEPROM for on-chip factory calibration of the sensor. Factory-trimmed scale factors
eliminate the need for external active components and end-user calibration. A built-in Proportional-To-Absolute-
Temperature (PTAT) sensor provides temperature compensation information. Refer to the product specification
document for each sensor to obtain more details on specific sensor features.
I2C/SPI BUS CONNECTIONS
The UEVB communicates with a system processor (e.g. InvenSense ARM controller board) through the custom
header using either the I²C or the SPI serial interface. The device always acts as a slave when communicating with
the system processor.
Figure 2. Top Side of the UEVB (e.g. MPU-65xx)
InvenSense CHEMA TIC . INV [In vexsal EVB van .1.“ mm mm E E um maqueuc sensor m m I-lguu 3 unvn 51mm“; am— fin. m: gm; OPEN 7 .m.,m,mym ans 9: 2%: m m N, i, 21ng 31;; ”'7 l” 'Ffl: mums; 7 7 mm. ) ,“mu-"acz. maxim
UEVB
Document Number: AN-IVS-0001EVB-00 Page 8 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
SCHEMATIC
Figure 3. UEVB Circuit Schematic
InvenSense ITEM QUANTITY REFERENCE PART PCB FOOTPRINT Header 10 x 2, M, 90D, 2.54 x 2.54 mm C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 3-Pin Header, 2.54 x 2.54 mm, Male ITEM QUANTITY REFERENCE PART PCB FOOTPRINT Header 10x2, M, 90D, 2.54 x 2.54 mm C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 3-Pin Header, 2.54 x 2.54 mm, Male QFN15_3X3 10,5 PitchhA BGA14_2X2 10,4 Pitch)
UEVB
Document Number: AN-IVS-0001EVB-00 Page 9 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
BILL OF MATERIAL (BOM)
The UEVB offers five different BOMs, which cover most of InvenSense’s sensor (Tables 2A, 2B, 2C, 2D, and 2E.)
There are two BOM versions for U1D, and one each one for U1A, U1B and U1C.
TABLE 2A. BILL OF MATERIAL FOR U1A (e.g. with MPU-92XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10 x 2, M,
90D, 2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12,
C13, C14, C18, C19, C20
0.1 µF C0402
3 1 C10 2200 pF C0402
4
2
C15, C17
2.2 µF
C0402
5
1
C16
0.033 µF
C0402
7 2 JP1, JP2
3-Pin Header, 2.54 x
2.54 mm, Male
SIP-3P
9 8 R9, R10, R15, R19, R21, R23, R24, R25 10 kΩ R0402
10 7 R1, R3, R5, R7, R11, R13, R22 0 Ω R0402
11 1 R18 1 kΩ R0402
13
1
U1A
MPU-92xx
QFN24_3x3 mm
17
1
U2
AK8963C
BGA14_2X2 mm
18
1
U4
XC6210B302MR-G
SOT25
TABLE 2B. BILL OF MATERIAL FOR U1B (e.g. with ITG-35XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10x2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11,
C12, C13, C14, C18, C19, C20
0.1 µF C0402
3 1 C10 2200 pF C0402
4 2 C15, C17 2.2 µF C0402
5 1 C16 0.033 µF C0402
7 2 JP1, JP2
3-Pin Header, 2.54 x
2.54 mm, Male
SIP-3P
9 8 R9, R10, R15, R19, R21, R23, R24, R25 10 kΩ R0402
10
3
R11, R13, R22
0 Ω
R0402
11
1
R18
1 kΩ
R0402
14 1 U1B ITG-35xx
QFN16_3X3
(0.5 Pitch)A
17 1 U2 AK8963C
BGA14_2X2
(0.4 Pitch)
18 1 U4 XC6210B302MR-G SOT25
InvenSense ITEM QUANTITV REFERENCE PART PCB FOOTPRINT Header 10x2, M, 900, 2.54 x 2.54 mm 3-Pin Header, 2.54 x 2.54 mm, Male QFN16_\T36_3X3 10.5PHCH)A EGA14_2X2 10.4PHCH) T ITEM QUANTITV REFERENCE PART pca FOOTPRINT Header 10x2, M, 90D, 2.54 x 2.54 mm C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 3-Pin Header, 2.54 x 2.54 mm, Male
UEVB
Document Number: AN-IVS-0001EVB-00 Page 10 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
TABLE 2C. BILL OF MATERIAL FOR U1C (e.g. with ITG-1010)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10x2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16 C1,C2,C3,C4,C5,C6,C7,C8,C9,C11,
C12,C13,C14,C18,C19,C20 0.1 µF C0402
3 1 C10 2200 pF C0402
4 2 C15,C17 2.2 µF C0402
5 1 C16 0.033 µF C0402
7 2 JP1,JP2
3-Pin Header, 2.54 x
2.54 mm, Male
SIP-3P
9 8 R9,R10,R15,R19,R21,R23,R24,R25 10 kΩ R0402
10 3 R11,R13,R22 0 Ω R0402
11 1 R18 1 kΩ R0402
15 1 U1C ITG-1010
QFN16_IT36_3X3
(0.5PITCH)A
17 1 U2 AK8963C
BGA14_2X2
(0.4PITCH)
18 1 U4 YB1210ST25R300 SOT235
TABLE 2D. BILL OF MATERIAL FOR U1D, OPTION-A (e.g. with MPU-60XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10x2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11,
C12, C13, C14, C18, C19, C20
0.1 µF C0402
3
1
C10
2200 pF
C0402
4
2
C15, C17
2.2 µF
C0402
5 1 C16 0.033 µF C0402
7 2 JP1, JP2
3-Pin Header, 2.54 x
2.54 mm, Male
SIP-3P
9 8 R9, R10, R15, R19, R21, R23, R24, R25 10 kΩ R0402
10
3
R11, R13, R22
0 Ω
R0402
11 1 R18 1 kΩ R0402
16 1 U1D MPU-60xx QFN24_4X4(0.5 Pitch)
17 1 U2 AK8963C BGA14_2X2(0.4Pitch)
18
1
U4
XC6210B302MR-G
SOT25
InvenSense T ITEM QUANTITV REFERENCE PART pca FOOTPRINT Header 10x2, M, 90D, 2.54 x 2.54 mm C1, C2, C3, C4, C5, C6, C7, C8, C9, C11, C12, C13, C14, C18, C19, C20 3-Pin Header, 2.54 x 2.54 mm, Male
UEVB
Document Number: AN-IVS-0001EVB-00 Page 11 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
TABLE 2E. BILL OF MATERIAL FOR U1D, OPTION-B (e.g. with MPU-91XX)
ITEM
QUANTITY
REFERENCE
PART
PCB FOOTPRINT
1 1 CN1
Header 10x2, M, 90D,
2.54 x 2.54 mm
HDB2X14NRA
2 16
C1, C2, C3, C4, C5, C6, C7, C8, C9, C11,
C12, C13, C14, C18, C19, C20
0.1 µF C0402
3
1
C10
2200 pF
C0402
4 2 C15, C17 2.2 µF C0402
5 1 C16 0.033 µF C0402
7 2 JP1, JP2
3-Pin Header, 2.54 x
2.54 mm, Male
SIP-3P
9 6 R9, R10, R15, R21, R24, R25 10 kΩ R0402
10
5
R11, R13, R20, R22, R23
0 Ω
R0402
11
1
R18
1 kΩ
R0402
16 1 U1D MPU-91xx QFN24_4X4(0.5 Pitch)
17 1 U2 AK8963C BGA14_2X2(0.4 Pitch)
18 1 U4 XC6210B302MR-G SOT25
InvenSense 1P1 PIN NUMBER SIGNAL DESCRIPTION 1»2 shunted VDD : 3v (from LDO, VIN > 3.1V, net name avo) 2»3 shunted VDD : VIN Irrarn an external soureeI JPZ PIN NUMBER SIGNAL DESCRIPTION 1»2 shunted VDDIO : VDD 2»3 shunted VDDIO : 1st (from an external source, net name 1vs)
UEVB
Document Number: AN-IVS-0001EVB-00 Page 12 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
POWER SUPPLY CONNECTIONS
JP1 and JP2 are 3-pin headers, which allow the user to select between an on-board LDO (Low-Voltage Dropout
Regulator, U4) and an external DC supply (VIN) to power the motion sensor. For details, please refer to Table 3.
TABLE 3. POWER SELECTION JUMPERS (JP1, JP2)
JP1 PIN NUMBER
SIGNAL DESCRIPTION
1-2 Shunted
VDD = 3V (from LDO, VIN > 3.1V, net name 3V0)
2-3 Shunted
VDD = VIN (from an external source)
JP2 PIN NUMBER
SIGNAL DESCRIPTION
1-2 Shunted
VDDIO = VDD
2-3 Shunted
VDDIO = 1.8V (from an external source, net name 1V8)
The on-board low-noise 3V LDO offers an output that is called 3V0 (Figure 3). Using this will ensure that the sensor
performance will meet data sheet specifications.
Selecting VIN to power the chip/board is generally done while designing and evaluating an embedded platform,
where the host processor and related electronics need full control over the motion processing chipset’s power
supply.
If a user intends to use the on-board 3V power source, an external VIN must be provided within the range of
3.1~6.0V to ensure the LDO works properly.
If the user provides a VIN power level of ≥3.6V, JP1 and JP2 must be shunted across pins 1-2, since the motion
sensors’ VDD and VDDIO operational ranges are ≤3.6V.
InvenSense TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CNl) CNl PIN NUMBER CNl SIGNAL NAME SIGNAL DESCRIPTION 1 AUX_DA AUX_DA. Auxiliary l1c serial data signal. 2, 4, 9, 12, 14, 15, 19, 25, 25, 27, 23 1va Power. Receive power from InvenSense ARM controller board or E Power, Receive power from lnvEnSense ARM controller board or an external source. ADO/MISC. Lowest (LSB) address bit in PC mode or SPI MISO signal in SPI mode,
UEVB
Document Number: AN-IVS-0001EVB-00 Page 13 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
UEVB CONNECTOR SIGNALS DESCRIPTION
TABLE 4. USER INTERFACE CONNECTOR SIGNALS (CN1)
CN1 PIN
NUMBER
CN1 SIGNAL NAME
SIGNAL DESCRIPTION
1
AUX_DA
AUX_DA. Auxiliary I2C serial data signal.
2, 4, 9, 12,
14, 16, 19,
25, 26, 27,
28
N.C. N.C. Do not connect to these pins.
3 AUX_CL AUX_CL. Auxiliary I2C serial clock signal.
5 1V8 1V8 Power. Receive power from InvenSense ARM controller board or
an external source.
6 DRDY DRDY. Data ready and FIFO interrupt signals.
7 INT INT. Interrupt output signal to controller.
8
CS
Test Signal. Not used in I2C mode; used as chip-select pin in SPI mode.
10 DRDY-CMP Compass (U2) DRDY. Compass data ready signal.
11 TP0 Test Signal
13 VPP Test Signal
15, 17 GND GND. Ground connection.
18 REGOUT REGOUT. Sensor’s on-chip regulator output.
20 SCL_SCLK SCL/SCLK. I2C or SPI primary serial clock signal.
21 FSYNC FSYNC. Frame synchronization input for camera applications.
22 SDA_SDI SDA/MOSI. I²C primary data or SPI MOSI signal.
23 VIN
Power. Receive power from InvenSense ARM controller board or an
external source.
24 AD0_SDO
AD0/MISO. Lowest (LSB) address bit in I2C mode or SPI MISO signal in
SPI mode.
InvenSense
UEVB
Document Number: AN-IVS-0001EVB-00 Page 14 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
CONNECTING THE FSYNC LINE
The FSYNC line is intended for use in a camera’s image-stabilization system. It is an input from the camera platform
to the UEVB, and is intended to synchronize the motion-sensor serial-bus transfer with the master timing set by
the camera system.
SERIAL BUS LEVELS, SPEEDS, AND TERMINATIONS
The UEVB supports I²C communications up to 400 kHz, or SPI communications up to 1MHz clock rates for writing.
In SPI mode, it can be operated at up to 20 MHz for reading. The I²C bus open-drain pull-up resistors (10 kΩ) are
connected to VDDIO.
InvenSense E Figure 4. UEVB connected to the lnvenSense ARM Controller Board
UEVB
Document Number: AN-IVS-0001EVB-00 Page 15 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
DATA GATHERING OPTIONS
The motion sensor’s digital sensor data is available on the UEVB’s header CN1. Alternatively, for connectivity with
a host PC, an InvenSense ARM controller board may be used.
CONNECTION TO THE INVENSENSE ARM CONTROLLER BOARD
For communications via USB with a host computer, the UEVB can be connected to the InvenSense ARM controller
board. InvenSense provides a software tool to support the collection of sensor data through the UEVB/ARM
controller board combo connected to a PC/laptop via a USB port. Please refer to the InvenSense Data Logger (IDL)
Application Notes document for additional instructions on how to use the software to obtain sensor data. This
information can be provided by your local field team on an as-needed basis.
Figure 4 shows the connection of the UEVB to the InvenSense ARM controller board. Connections between the two
boards are made via header CN1 on the UEVB and connector JP6 on the InvenSense ARM Controller Board.
Figure 4. UEVB connected to the InvenSense ARM Controller Board
USE OF THE UEVB WITHOUT AN ARM CONTROLLER BOARD
I²C and SPI signals are made available on header CN1. Users may develop their own tools to communicate with the
UEVB as there is no bus mode selection setting required.
InvenSense UEVB
UEVB
Document Number: AN-IVS-0001EVB-00 Page 16 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
SPECIAL INSTRUCTIONS
ELECTROSTATIC DISCHARGE SENSITIVITY
The motion sensors can be permanently damaged by electrostatic discharge (ESD). ESD precautions for handling
and storage must be taken to avoid damage to the devices.
BOARD LAYOUT AND FOOTPRINT DISCUSSION
The UEVB is a 4-layer FR-4 PCB design with the dimensions: 38.1 x 38.1 x 1.6 mm (1500 x 1500 x 62 mil). See Figure
5 and Figure 6 for a detailed top and bottom view of the UEVB.
The MPU footprint on the UEVB supports both QFN and LGA packages. Footprints and sensor land patterns were
chosen large enough, so they offer ease of use, reliable contact with the sensor, hand-solder and debugging
capabilities for both packages.
Note that to avoid potential shorting/clearance issues at the corner pins for LGA packages, the land pattern shapes
for the individual pins in this design were chosen to be oblong rather than square. The dimensions for the pin pads
are 0.225 x 0.7 mm.
Solder mask (also called solder resist is a layer of protective coating for PCB’s copper traces, which helps to prevent
undesired solder bridges and shorts) dimensions will not be provided as they are dependent upon the manufacturing
process and the clearance capabilities of the chosen fabrication house. Contact your PCB vendor to determine the
minimum required clearance between pin pads (usually 4 mil to 6 mil or 0.102 mm to 0.152 mm) and traces allowing
them enough room to print an adequate solder mask.
InvenSense UE VB C/ InvenSense Universal EVB VDI‘uO SEL m, Rev-B. Aug 1. 2013 vnDIu vuo ADO 5m 5m «(cow vm Fsmc nun mo WP wo
UEVB
Document Number: AN-IVS-0001EVB-00 Page 17 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
Figure 5 & Figure 6.Top & Bottom View of the UEVB Board Layout
InvenSense UE VB REVISION HISTORY DATE REVISION DESCRIPTION 1/22/14 1.0 Initial Release 1/31/14 1.1 Updated parts Iist and BOM labIEs. Updated parts Iist, corrected text and up docum guide. 02/24/17 1.3 Update parts IIst
UEVB
Document Number: AN-IVS-0001EVB-00 Page 18 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
REVISION HISTORY
DATE
REVISION
DESCRIPTION
1/22/14
1.0
Initial Release
1/31/14
1.1
Updated parts list and BOM tables.
11/7/14 1.2
Updated parts list, corrected text
and updated references to existing
documentation listed in this user
guide.
02/24/17
1.3
Update parts list
InvenSense UEVB InvenSense ense Inc All nghts re
UEVB
Document Number: AN-IVS-0001EVB-00 Page 19 of 19
Rev Number: 1.2
Rev Date: 11/07/2014
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by InvenSense for its
use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications are subject to change without
notice. InvenSense reserves the right to make changes to this product, including its circuits and software, in order to improve its design and/or
performance, without prior notice. InvenSense makes no warranties, neither expressed nor implied, regarding the information and
specifications contained in this document. InvenSense assumes no responsibility for any claims or damages arising from information contained
in this document, or from the use of products and services detailed therein. This includes, but is not limited to, claims or damages based on the
infringement of patents, copyrights, mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by implication or
otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information previously supplied.
Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors should not be used or sold in
the development, storage, production or utilization of any conventional or mass-destructive weapons or for any other weapons or life
threatening applications, as well as in any other life critical applications such as medical equipment, transportation, aerospace and nuclear
instruments, undersea equipment, power plant equipment, disaster prevention and crime prevention equipment.
©2014 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion, MotionApps,
DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be trademarks of the
respective companies with which they are associated.
.
©2014 InvenSense, Inc. All rights reserved.