Datenblatt für MCIMX7D2D von NXP USA Inc.

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Ordering Information

See Table 1 on page 3

MCIMX7D

NXP Semiconductors

Data Sheet: Technical Data

Document Number: IMX7DCEC

Rev. 6, 03/2019

Package Information

Plastic Package

BGA 12 x 12 mm, 0.4 mm pitch

BGA 19 x 19 mm, 0.75 mm pitch

NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of

its products.

1 i.MX 7Dual introduction

The i.MX 7Dual family of processors represents NXP’s

latest achievement in high-performance processing for

low-power requirements with a high degree of functional

integration. These processors are targeted towards the

growing market of connected and portable devices.

The i.MX 7Dual family of processors features advanced

implementation of the Arm® Cortex®-A7 core, which

operates at speeds of up to 1 GHz and 1.2 GHz,

depending on the part number. The i.MX 7Dual family

provides up to 32-bit

DDR3/DDR3L/LPDDR2/LPDDR3-1066 memory

interface and a number of other interfaces for connecting

peripherals, such as WLAN, Bluetooth, GPS, displays,

and camera sensors.

i.MX 7Dual Family of

Applications Processors

Datasheet

1 i.MX 7Dual introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2 Architectural overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

2.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

3 Modules list. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1 Special signal considerations . . . . . . . . . . . . . . . . 16

3.2 Recommended connections for unused analog

interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 20

4.1 Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . . 20

4.2 Integrated LDO voltage regulator parameters. . . . 40

4.3 PLL electrical characteristics. . . . . . . . . . . . . . . . . 42

4.4 On-chip oscillators. . . . . . . . . . . . . . . . . . . . . . . . . 42

4.5 I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . . 43

4.6 I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . . 47

4.7 Output buffer impedance parameters . . . . . . . . . . 51

4.8 System modules timing . . . . . . . . . . . . . . . . . . . . . 53

4.9 General-purpose media interface (GPMI) timing. . 73

4.10 External peripheral interface parameters . . . . . . . 81

4.11 12-Bit A/D converter (ADC) . . . . . . . . . . . . . . . . . 118

5 Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 119

5.1 Boot mode configuration pins . . . . . . . . . . . . . . . 119

5.2 Boot device interface allocation. . . . . . . . . . . . . . 120

6 Package information and contact assignments. . . . . . . 122

6.1 12 x 12 mm package information . . . . . . . . . . . . 122

6.2 19 x 19 mm package information . . . . . . . . . . . . 139

7 Release notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157

i.MX 7Dual introduction

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors2

The i.MX 7Dual family of processors is specifically useful for applications such as:

• Audio

• Connected devices

• Access control panels

• Human-machine interfaces (HMI)

• Portable medical and health care

• IP phones

• Smart appliances

• Point of Sale

•eReaders

• Wearables

• Home energy management systems

The features of the i.MX 7Dual family of processors include the following:

• Arm Cortex-A7 plus Arm Cortex-M4—Heterogeneous Multicore Processing architecture enables

the device to run an open operating system like Linux/Android on the Cortex-A7 core and an RTOS

like FreeRTOS™ on the Cortex-M4 core.

• Two Arm Cortex-A7 cores—The processor enhances the capabilities of portable, connected

applications by fulfilling the ever-increasing MIPS needs of operating systems and applications at

lowest power consumption levels per MHz.

• Multilevel memory system—The multilevel Cortex-A7 memory system is based on the L1

instruction and data caches, L2 cache, and internal and external memory. The processor supports

many types of external memory devices, including DDR3, DDR3L, LPDDR2 and LPDDR3, NOR

Flash, NAND Flash (MLC and SLC), QSPI Flash, and managed NAND, including eMMC rev.

• Power efficiency—Power management implemented throughout the IC enables features and

peripherals to consume minimum power in both active and various low-power modes.

• Multimedia—The multimedia performance is enhanced by a multilevel cache system, NEON™

MPE (Media Processor Engine) coprocessor, a programmable smart DMA (SDMA) controller.

• Up to two Gigabit Ethernet with AVB—10/100/1000 Mbps Ethernet controllers supporting IEEE

Std 1588 time synchronization.

• Electronic Paper Display Controller (EPDC)—The processor integrates an EPD controller that

supports E Ink® color and monochrome panels with up to 2048 x 1536 resolution at 106 Hz

refresh, 4096 x 4096 resolution at 20 Hz refresh, and 5-bit grayscale (32-levels per color channel).

• Human-machine interface (HMI)—i.MX 7Dual processor provides up to two separate display

interfaces (parallel display and two-lane MIPI-DSI), CMOS sensor interface (two-lane MIPI-CSI

and parallel).

• Interface flexibility—i.MX 7Dual processor supports connections to a variety of interfaces: two

high-speed USB on-the-go modules with PHY, High-Speed Inter-Chip USB, multiple expansion

card ports (high-speed MMC/SDIO host and other), two Gigabit Ethernet controllers with support

for Ethernet AVB, PCIe-II, two 12-bit ADCs with a total of 8 single-ended inputs, two CAN ports,

and a variety of other popular interfaces (such as UART, I

C, and I

S).

i.MX 7Dual introduction

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 3

• Advanced security—The processors deliver hardware-enabled security features that enable secure

e-commerce, digital rights management (DRM), information encryption, secure boot, and secure

software downloads. The security features are discussed in detail in the i.MX 7Dual security

reference manual.

• Integrated power management—The processors integrate linear regulators and internally generate

voltage levels for different power domains. This significantly simplifies system power

management structure.

For a comprehensive list of the i.MX 7Dual features, see Section 1.2, “Features.”

1.1 Ordering information

Table 1 provides examples of orderable sample part numbers covered by this data sheet.

Table 1. Orderable parts

Part Number Options Cortex-A7 CPU

Speed Grade Qualification Tier Temperature

)Package

MCIMX7D7DVK10SD EPDC, CAN

2 x Gigabit Ethernet

4 tamper pins

1 x ADC

1 GHz Consumer

0 to +95°C 12x12 mm

0.4 mm pitch

BGA

MCIMX7D7DVM10SD EPDC, CAN

2 x Gigabit Ethernet

10 tamper pins

2 x ADC

1 GHz Consumer

0 to +95°C 19x19 mm

0.75 mm pitch

BGA

MCIMX7D5EVK10SD No EPDC, CAN

2 x Gigabit Ethernet

4 tamper pins

1 x ADC

1 GHz Industrial

-20 to 105°C 12x12 mm

0.4 mm pitch

BGA

MCIMX7D5EVM10SD No EPDC, CAN

2 x Gigabit Ethernet

10 tamper pins

2 x ADC

1 GHz Industrial

-20 to 105°C 19x19 mm

0.75 mm pitch

BGA

MCIMX7D3DVK10SD No EPDC, No CAN

2 x Gigabit Ethernet

4 tamper pins

1 x ADC

1 GHz Consumer

0 to +95°C 12x12 mm

0.4 mm pitch

BGA

MCIMX7D3EVK10SD No EPDC, No CAN

2 x Gigabit Ethernet

4 tamper pins

1 x ADC

1 GHz Industrial

–20 to +105°C 12x12 mm

0.4 mm pitch

BGA

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i.MX 7Dual introduction

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors4

Figure 1 describes the part number nomenclature so that the users can identify the characteristics of the

specific part number.

Restricted electrical specifications for parts with CPU maximum frequency of 1.2 GHz:

• Temperature range 0 to 85 degrees C (see Table 1)

• VDD_ARM requirements (see Table 9)

Figure 1. Part number nomenclature—i.MX 7Dual family of processors

1.2 Features

The i.MX 7Dual family of processors is based on Arm Cortex-A7 MPCore™ Platform, which has the

following features:

• Two Arm Cortex-A7 Cores (with TrustZone® technology)

• The core configuration is symmetric, where each core includes:

MCIMX7D2DVK12SD No EPDC, No CAN

2 x Gigabit Ethernet

4 tamper pins

1x ADC

1.2 GHz Consumer 0 to 85°C 12x12 mm

0.4 mm pitch

BGA

MCIMX7D2DVM12SD No EPDC, No CAN

2x Gigabit Ethernet

10 tamper pins

2x ADC

1.2 GHz Consumer 0 to 85°C 19x19mm

0.75 mm pitch

BGA

Consumer qualification grade assumes 5-year lifetime with 50% duty cycle.

Industrial qualification grade assumes 10-year lifetime with 100% duty cycle.

Table 1. Orderable parts(continued)

i.MX 7Dual introduction

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 5

— 32 KByte L1 Instruction Cache

— 32 KByte L1 Data Cache

— Private Timer and Watchdog

— NEON MPE (media processing engine) coprocessor

The Arm Cortex-A7 Core complex shares:

• General interrupt controller (GIC) with 128 interrupt support

• Global timer

• Snoop control unit (SCU)

• 512 KB unified I/D L2 cache

• Two master AXI bus interfaces output of L2 cache

• Frequency of the core (including NEON and L1 cache), as per Table 9.

• NEON MPE coprocessor

— SIMD Media Processing Architecture

— NEON register file with 32x64-bit general-purpose registers

— NEON Integer execute pipeline (ALU, Shift, MAC)

— NEON dual, single-precision floating point execute pipeline (FADD, FMUL)

— NEON load/store and permute pipeline

The Arm Cortex-M4 platform:

• Cortex-M4 CPU core

• MPU (memory protection unit)

• FPU (floating-point unit)

• 16 KByte instruction cache

• 16 KByte data cache

• 64 KByte TCM (tightly-coupled memory)

The SoC-level memory system consists of the following additional components:

— Boot ROM, including HAB (96 KB)

— Internal multimedia / shared, fast access RAM (256 KB of total OCRAM)

— Secure/nonsecure RAM (32 KB)

• External memory interfaces: The i.MX 7Dual family of processors supports the latest,

high-volume, cost effective DRAM, NOR, and NAND Flash memory standards.

— Up to 32-bit LP-DDR2-1066, DDR3-1066, DDR3L-1066, and LPDDR3-1066

— 8-bit NAND-Flash, including support for Raw MLC/SLC, 2 KB, 4 KB, and 8 KB page size,

BA-NAND, PBA-NAND, LBA-NAND, OneNAND™ and others. BCH ECC up to 62 bits.

— 16/32-bit NOR Flash. All EIMv2 pins are muxed on other interfaces.

Each i.MX 7Dual processor enables the following interfaces to external devices (some of them are muxed

and not available simultaneously):

• Displays—Available interfaces.

i.MX 7Dual introduction

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors6

— One parallel 24-bit display port

— One EPD port

— One MIPI DSI port

• Camera sensors:

— One parallel Camera port (up to 24 bit and up to 133 MHz peak)

— One MIPI-CSI port

• Expansion cards:

— Three MMC/SD/SDIO card ports all supporting the following. Moreover, the third port can

support HS400.

– 1-bit or 4-bit transfer mode specifications for SD and SDIO cards, up to 208 MHz

– 1-bit, 4-bit, or 8-bit transfer mode specifications for MMC cards up to 200 MHz in both

SDR and DDR modes, including HS200 and HS400 DDR modes

•USB

— Two high-speed (HS) USB 2.0 OTG (Up to 480 Mbps), with integrated HS USB PHY

— One high-speed USB 2.0 (480 Mbps) host with integrated HSIC USB (high-speed inter-chip

USB) PHY

• Expansion PCI Express port (PCIe) v. 2.1 one lane

— PCI Express (Gen 2.0) dual mode complex, supporting root complex operations and endpoint

operations. Uses x1 PHY configuration.

• Miscellaneous IPs and interfaces:

— Three instances of SAI supporting up to three I

S and AC97 ports

— Seven UARTs, up to 4.0 Mbps:

– Providing RS232 interface

– Supporting 9-bit RS485 Multidrop mode

— Four eCSPI (Enhanced CSPI)

— Four I

C, supporting 400 kbps

— Two 1-gigabit Ethernet controllers (designed to be compatible with IEEE Std 1588),

10/100/1000 Mbps with AVB support

— Four pulse width modulators (PWM)

— System JTAG controller (SJC)

— GPIO with interrupt capabilities

— 8x8 key pad port (KPP)

— One quad SPI

— Four watchdog timers (WDOG)

— One (12 x 12 mm) or two (19 x 19 mm) 2-channel, 12-bit analog-to-digital converters

(ADC)—effective number of bits (ENOB) can vary (typically 9–10 bits) depending on the

system implementation and the condition of the power/ground noise condition

i.MX 7Dual introduction

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 7

The i.MX 7Dual family of processors integrates advanced power management unit and controllers:

• PMU (power-management unit), multiple LDO supplies, for on-chip resources

• Temperature sensor for monitoring the die temperature

• Software state retention and power gating for Arm and NEON

• Support for various levels of system power modes

• Flexible clock gating control scheme

The i.MX 7Dual family of processors uses dedicated hardware accelerators to meet the targeted

multimedia performance. The use of hardware accelerators is a key factor in obtaining high performance

at low power consumption numbers, while having the CPU core relatively free for performing other tasks.

The i.MX 7Dual family of processors incorporates the following hardware accelerators:

• PXP—PiXel processing pipeline for imagine resize, rotation, overlay and CSC. Off loading key

pixel processing operations are required to support the LCD and EPDC display applications.

• EPDC—Low-power, high-performance, direct-drive, active-matrix electrophoretic display

controller, specifically designed to drive E Ink EPD panels.

Security functions are implemented by the following hardware:

• Arm TrustZone technology including separation of interrupts and memory mapping

• SJC—System JTAG Controller. Protecting JTAG from debug port attacks by regulating or

blocking the access to the system debug features.

• CAAM—Cryptographic Acceleration and Assurance Module, containing cryptographic and hash

engines, 32 KB secure RAM, and true and pseudo random number generator.

• SNVS—Secure Non-Volatile Storage, including secure real time clock

• CSU—Central Security Unit. Responsible for setting comprehensive security policy of the device.

Configured during boot and by eFuses and determines the security-level operation mode as well as

the TrustZone policy.

• HAB—High Assurance Boot—HABv4 with the new embedded enhancements: SHA-256,

2048-bit RSA key, SRK revocation mechanism, warm boot, CSU, and TrustZone initialization.

NOTE

The actual feature set depends on the part numbers as described in Table 1.

Functions, such as display and camera interfaces, connectivity interfaces,

may not be enabled for specific part numbers.

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Architectural overview

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors8

2 Architectural overview

The following subsections provide an architectural overview of the i.MX 7Dual processor system.

2.1 Block diagram

Figure 2 shows the functional modules in the i.MX 7Dual processor system.

Figure 2. i.MX 7Dual System block diagram

Debug

DAP

TPIU

CTIs

SJC

Shared Peripherals

Internal Memory

OCRAM 320KB

ROM 96KB

External Memory

DDR Controller

EIM

SPBA

PLLs

CCM

GPC

SRC

XTAL OSC

RC OSC

Timers

System Counter

Camera Interface

CSI

EPD Controller

Image Processing

Security

CSU

OCOTP (eFuse)

Power Management

LDOs

AP Peripherals

KPP

Sensors Modem IC EPD Panel PCIe Bus

Camera

LCD Panel

Tamper

Detection

Keypad

WLAN

Touch Panel

Control

GPMI&BCH

QSPI

MPU FPU

NAND FLASH

Display Interface

LCDIF

MIPI DSI

Smart DMA

SDMA

RDC MU

SEMAPHORE

NEON FPU

Temp Monitor

IOMUX

ADC (2)

LPDDR2/LPDDR3 Battery Ctrl

Device

JTAG

(IEEE1149.6)

Crystal&

Clock Source

NOR Flash

(Parallel)

CAAM

(32KB RAM)

SNVS(SRTC)

NOR FLASH

(Quad SPI)

MIPI CSI(2 lane)

USB OTG

(dev/host)

CAN x2

Pixel Processing

Pipeline(PXP)

Multi-Core Unit

TCM 64KB

I$ 16KB D$ 16KB

Cortex-M4 Core

ARM Cortex M4

Platform

L2 Cache 512KB

SCU & Timer

I$ 32KB D$ 32KB

CPU0

CPU1

ARM Cortex A7

MPCore Platform

WDOG(4)

GPT(4)

Flex Timer(2)

eCSPI(3)

SAI(3)

UART(3)

GPIO(7)

UART(4)

PWM(4)

eCSPI(1)

I2C(4)

SIMv2(2)

FlexCAN(2)

PCIe v2.1

AVB ENET(2)

uSDHC(3)

Clock & Reset

10/100/1000M

Ethernet x2

AXI and AHB Switch Fabric

MMC/SD

eMMC/eSD

MMC/SD

SDXC

/DDR3/DDR3L

Smart Card x2

OCOTP

Host (1) / OTG (2)

USB 2.0

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 9

3 Modules list

The i.MX 7Dual family of processors contains a variety of digital and analog modules. Table 2 describes

these modules in alphabetical order.

Table 2. i.MX 7Dual modules list

Block Mnemonic Block Name Subsystem Brief Description

ADC1

ADC2

Analog to Digital

Converter

The ADC is a 12-bit general purpose analog to digital

converter (ADC2 is not available in the 12x12 package).

Arm Arm Platform Arm The Arm Core Platform includes two Cortex-A7

coresand 1x Cortex-M4. It also includes associated

sub-blocks, such as the Level 2 Cache Controller, SCU

(Snoop Control Unit), GIC (General Interrupt

Controller), private timers, watchdog, and CoreSight

debug modules.

BCH Binary-BCH ECC

Processor

System control

peripherals

The BCH module provides up to 62-bit ECC

encryption/decryption for NAND Flash controller

(GPMI)

CAAM Cryptographic

accelerator and

assurance module

Security CAAM is a cryptographic accelerator and assurance

module. CAAM implements several encryption and

hashing functions, a run-time integrity checker, entropy

source generator, and a Pseudo Random Number

Generator (PRNG). The pseudo random number

generator is certifiable by Cryptographic Algorithm

Validation Program (CAVP) of National Institute of

Standards and Technology (NIST).

CAAM also implements a Secure Memory mechanism.

In i.MX 7Dual processors, the security memory

provided is 32 KB.

CCM

GPC

SRC

Clock Control Module,

General Power

Controller, System Reset

Controller

Clocks, resets, and

power control

These modules are responsible for clock and reset

distribution in the system, and also for the system

power management.

CSI Parallel CSI Multimedia

peripherals

The CSI IP provides parallel CSI standard camera

interface port. The CSI parallel data ports are up to 24

bits. It is designed to support 24-bit RGB888/YUV444,

CCIR656 video interface, 8-bit YCbCr, YUV or RGB,

and 8-bit/10-bit/16-bit Bayer data input.

CSU Central Security Unit security The Central Security Unit (CSU) is responsible for

setting comprehensive security policy within the i.MX

7Dual platform.

DAP Debug Access Port System control

peripherals

The DAP provides real-time access for the debugger

without halting the core to access:

• System memory and peripheral registers

• All debug configuration registers

The DAP also provides debugger access to JTAG scan

chains.

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors10

eCSPI1

eCSPI2

eCSPI3

eCSPI4

Configurable SPI Connectivity

Peripherals

Full-duplex enhanced Synchronous Serial Interface,

with data rate up to 52 Mbit/s. It is configurable to

support Master/Slave modes, four chip selects to

support multiple peripherals.

EIM NOR-Flash /PSRAM

interface

Connectivity

Peripherals

The EIM NOR-FLASH / PSRAM provides:

• Support for 16-bit (in Muxed I/O mode only) PSRAM

memories (sync and async operating modes), at

slow frequency

• Support for 16-bit (in muxed and non-muxed I/O

modes) NOR-Flash memories, at slow frequency

• Multiple chip selects

ENET1

ENET2

Ethernet Controller Connectivity

peripherals

The Ethernet Media Access Controller (MAC) is

designed to support 10/100/1000 Mbps Ethernet/IEEE

802.3 networks. An external transceiver interface and

transceiver function are required to complete the

interface to the media. The module has dedicated

hardware to support the IEEE 1588 standard. See the

ENET chapter of the

i.MX 7Dual Application Processor

Reference Manual

(IMX7DRM) for details.

EPDC Electrophoretic

Display

Controller

Connectivity

peripherals

The EPDC is a feature-rich, low power, and

high-performance direct-drive, active matrix EPD

controller. It is specifically designed to drive E Ink EPD

panels, supporting a wide variety of TFT backplanes.

Various levels of flexibility and programmability have

been introduced, as well as hardware support for

different E Ink image enhancing algorithms, such as

Regal D waveform support.

FLEXCAN1

FLEXCAN2

Flexible Controller Area

Network

Connectivity

peripherals

The CAN protocol was primarily, but not only, designed

to be used as a vehicle serial data bus, meeting the

specific requirements of this field: real-time processing,

reliable operation in the Electromagnetic interference

(EMI) environment of a vehicle, cost-effectiveness and

required bandwidth. The FlexCAN module is a full

implementation of the CAN protocol specification,

Version 2.0 B, which supports both standard and

extended message frames.

FLEXTIMER1

FLEXTIMER2

Flexible Timer Module Timer Peripherals Provide input signal capture and PWM support

GPIO1

GPIO2

GPIO3

GPIO4

GPIO5

GPIO6

GPIO7

General Purpose I/O

Modules

System control

peripherals

Used for general purpose input/output to external ICs.

Each GPIO module supports up to 32 bits of I/O.

GPMI General Purpose Memory

Interface

Connectivity

peripherals

The GPMI module supports up to 8x NAND devices and

62-bit ECC encryption/decryption for NAND Flash

Controller (GPMI2). GPMI supports separate DMA

channels for each NAND device.

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 11

GPT General Purpose Timer Timer peripherals Each GPT is a 32-bit “free-running” or “set and forget”

mode timer with programmable prescaler and compare

and capture register. A timer counter value can be

captured using an external event and can be configured

to trigger a capture event on either the leading or trailing

edges of an input pulse. When the timer is configured to

operate in “set and forget” mode, it is capable of

providing precise interrupts at regular intervals with

minimal processor intervention. The counter has output

compare logic to provide the status and interrupt at

comparison. This timer can be configured to run either

on an external clock or on an internal clock.

I2C1

I2C2

I2C3

I2C4

C Interface Connectivity

peripherals

C provide serial interface for external devices. Data

rates of up to 320 kbps are supported.

IOMUXC IOMUX Control System control

peripherals

This module enables flexible IO multiplexing. Each IO

pad has default and several alternate functions. The

alternate functions are software configurable.

KPP Key Pad Port Connectivity

peripherals

KPP Supports 8x8 external key pad matrix. KPP

features are:

• Open drain design

• Glitch suppression circuit design

• Multiple keys detection

• Standby key press detection

LCDIF LCD interface Multimedia

peripherals

The LCDIF is a general purpose display controller used

to drive a wide range of display devices varying in size

and capability. The LCDIF is designed to support dumb

(synchronous 24-bit Parallel RGB interface).

MIPI-CSI

(two-lane)

MIPI Camera Interface Multimedia

peripherals

This module provides a two-lane MIPI camera interface

operating up to a maximum bit rate of 1.5 Gbps.

MIPI DSI

(two-lane)

MIPI Display Interface Connectivity

peripherals

This module provides a two-lane MIPI display interface

operating up to a maximum bit rate of 1.5 Gbps.

DDRC DDR Controller Connectivity

peripherals

The DDR Controller has the following features:

• Supports 16/32-bit DDR3/DDR3L, LPDDR3, and

LPDDR2-1066

• Supports up to 2 Gbyte DDR memory space

MQS Medium-quality sound

module

Multimedia

peripherals

MQS is used to generate 2-channel, medium-quality,

PWM-like audio, via two standard digital GPIO pins.

The electronic specification is the same as the GPIO

digital output.

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors12

OCOTP_CTRL OTP Controller Security The On-Chip OTP controller (OCOTP_CTRL) provides

an interface for reading, programming, and/or

overriding identification and control information stored

in on-chip fuse elements. The module supports

electrically-programmable poly fuses (eFUSEs). The

OCOTP_CTRL also provides a set of volatile

software-accessible signals that can be used for

software control of hardware elements, not requiring

non-volatility. The OCOTP_CTRL provides the primary

user-visible mechanism for interfacing with on-chip fuse

elements. Among the uses for the fuses are unique chip

identifiers, mask revision numbers, cryptographic keys,

JTAG secure mode, boot characteristics, and various

control signals, requiring permanent non-volatility.

OCRAM On-Chip Memory

controller

Data path The On-Chip Memory controller (OCRAM) module is

designed as an interface between system’s AXI bus

and internal (on-chip) SRAM memory module.

In i.MX 7Dual processors, the OCRAM is used for

controlling the 128 KB multimedia RAM through a 64-bit

AXI bus.

PCIe PCI Express 2.0 Connectivity

peripherals

The PCIe IP provides PCI Express Gen 2.0

functionality.

PMU Power Management Unit Data path Integrated power management unit. Used to provide

power to various SoC domains.

PWM1

PWM2

PWM3

PWM4

Pulse Width Modulation Connectivity

peripherals

The pulse-width modulator (PWM) has a 16-bit counter

and is optimized to generate sound from stored sample

audio images and it can also generate tones. It uses

16-bit resolution and a 4x16 data FIFO to generate

sound.

PXP PiXel Processing Pipeline Display peripherals A high-performance pixel processor capable of 1

pixel/clock performance for combined operations, such

as color-space conversion, alpha blending,

gamma-mapping, and rotation. The PXP is enhanced

with features specifically for gray scale applications. In

addition, the PXP supports traditional pixel/frame

processing paths for still-image and video processing

applications, allowing it to interface with the integrated

EPD.

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 13

QSPI Quad SPI Connectivity

peripherals

Quad SPI module act as an interface to external serial

flash devices. This module contains the following

features:

• Flexible sequence engine to support various flash

vendor devices

• Single pad/Dual pad/Quad pad mode of operation

• Single Data Rate/Double Data Rate mode of

operation

• Parallel Flash mode

• DMA support

• Memory mapped read access to connected flash

devices

• Multi-master access with priority and flexible and

configurable buffer for each master

SAI1

SAI2

SAI3

Synchronous Audio

Interface

Connectivity

peripherals

The SAI module provides a synchronous audio

interface (SAI) that supports full duplex serial interfaces

with frame synchronization, such as I

S, AC97, TDM,

and codec/DSP interfaces.

SDMA Smart Direct Memory

Access

System control

peripherals

The SDMA is a multichannel flexible DMA engine. It

helps in maximizing system performance by offloading

the various cores in dynamic data routing. It has the

following features:

• Powered by a 16-bit Instruction-Set micro-RISC

engine

• Multi-channel DMA supporting up to 32 time-division

multiplexed DMA channels

• 48 events with total flexibility to trigger any

combination of channels

• Memory accesses including linear, FIFO, and 2D

addressing

• Shared peripherals between Arm and SDMA

• Very fast Context-Switching with 2-level priority

based preemptive multi-tasking

• DMA units with auto-flush and prefetch capability

• Flexible address management for DMA transfers

(increment, decrement, and no address changes on

source and destination address)

• DMA ports can handle unidirectional and

bidirectional flows (Copy mode)

• Up to 8-word buffer for configurable burst transfers

for EMIv2.5

• Support of byte-swapping and CRC calculations

• Library of Scripts and API is available

SIMv2-1

SIMv2-2

Smart Card Connectivity

peripherals

Smart card interface designed to be compatible with

ISO7816.

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors14

SJC System JTAG Controller System control

peripherals

The SJC provides JTAG interface (designed to be

compatible with JTAG TAP standards) to internal logic.

The i.MX 7Dual family of processors uses JTAG port for

production, testing, and system debugging.

Additionally, the SJC provides BSR (Boundary Scan

with IEEE 1149.1 and IEEE1149.6 standards.

The JTAG port must be accessible during platform

initial laboratory bring-up, for manufacturing tests and

troubleshooting, as well as for software debugging by

authorized entities. The i.MX 7Dual SJC incorporates

three security modes for protecting against

unauthorized accesses. Modes are selected through

eFUSE configuration.

SNVS Secure Non-Volatile

Storage

Security Secure Non-Volatile Storage, including Secure Real

Time Clock, Security State Machine, Master Key

Control, and Violation/Tamper Detection and reporting.

TEMPSENSOR Temperature Sensor System control

peripherals

Temperature sensor

TZASC Trust-Zone Address

Space Controller

Security The TZASC (TZC-380 by Arm) provides security

address region control functions required for intended

application. It is used on the path to the DRAM

controller.

UART1

UART2

UART3

UART4

UART5

UART6

UART7

UART Interface Connectivity

peripherals

Each of the UARTv2 modules support the following

serial data transmit/receive protocols and

configurations:

• 7- or 8-bit data words, 1 or 2 stop bits, programmable

parity (even, odd or none)

• Programmable baud rates up to 4 Mbps. This is a

higher max baud rate relative to the 1.875 MHz,

which is stated by the TIA/EIA-232-F standard.

• 32-byte FIFO on Tx and 32 half-word FIFO on Rx

supporting auto-baud

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 15

uSDHC1

uSDHC2

uSDHC3

SD/MMC and SDXC

Enhanced Multi-Media

Card / Secure Digital Host

Controller

Connectivity

peripherals

i.MX 7Dual SoC characteristics:

All the MMC/SD/SDIO controller IPs are based on the

uSDHC IP. They are designed to be:

• Fully compatible with MMC command/response sets

and Physical Layer as defined in the Multimedia

Card System Specification,

v5.0/v4.4/v4.41/v4.4/v4.3/v4.2.

• Fully compatible with SD command/response sets

and Physical Layer as defined in the SD Memory

Card Specifications v 3.0 including high-capacity

SDXC cards up to 2 TB.

• Fully compatible with SDIO command/response sets

and interrupt/Read-Wait mode as defined in the

SDIO Card Specification, Part E1, v. 3.0

All the ports support:

• 1-bit or 4-bit transfer mode specifications for SD and

SDIO cards up to UHS-I SDR104 mode (104 MB/s

max)

• 1-bit, 4-bit, or 8-bit transfer mode specifications for

MMC cards up to 200 MHz in both SDR and DDR

modes, including HS200 and HS400.

However, the SoC level integration and I/O muxing logic

restrict the functionality to the following:

• uSDHC1 and uSDHC2 are primarily intended to

serve as external slots or interfaces to on-board

SDIO devices. These ports are equipped with “Card

detection” and “Write Protection” pads and do not

support hardware reset.

• uSDHC3 is primarily intended to serve interfaces to

embedded MMC memory or interfaces to on-board

SDIO devices. These ports do not have “Card

detection” and “Write Protection” pads and do

support hardware reset.

• All ports can work with 1.8 V and 3.3 V cards. There

are two completely independent I/O power domains

for uSDHC1 and uSDHC2 in 4-bit configuration (SD

interface). uSDHC3 is placed in his own independent

power domain.

USBOTG2 2x USB 2.0 High Speed

OTG and HSIC USB

Connectivity

peripherals

USBOTG2 contains:

• Two high-speed OTG modules with integrated HS

USB PHYs

• One high-speed Host module connected to HSIC

USB port.

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors16

3.1 Special signal considerations

Table 3 lists special signal considerations for the i.MX 7Dual family of processors. The signal names are

listed in alphabetical order.

WDOG1

WDOG3

WDOG4

Watchdog Timer peripherals The Watch dog timer supports two comparison points

during each counting period. Each of the comparison

points is configurable to evoke an interrupt to the Arm

core, and a second point evokes an external event on

the WDOG line.

WDOG2

(TrustZone)

Watchdog (TrustZone

technology)

Timer peripherals The TrustZone Watchdog (TZ WDOG) timer module

protects against TrustZone starvation by providing a

method of escaping Normal mode and forcing a switch

to the TZ mode. TZ starvation is a situation where the

normal OS prevents switching to the TZ mode. Such

situation is undesirable as it can compromise the

system’s security. Once the TZ WDOG module is

activated, it must be serviced by TZ software on a

periodic basis. If servicing does not take place, the

timer times out. Upon a time-out, the TZ WDOG asserts

a TZ mapped interrupt that forces switching to the TZ

mode. If it is still not served, the TZ WDOG asserts a

security violation signal to the CSU. The TZ WDOG

module cannot be programmed or deactivated by a

normal mode SW.

Table 2. i.MX 7Dual modules list(continued)

Block Mnemonic Block Name Subsystem Brief Description

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 17

The package contact assignments can be found in Section 6, “Package information and contact

assignments.” Signal descriptions are provided in the i.MX 7Dual Application Processor Reference

Manual (IMX7DRM).

Table 3. Special signal considerations

Signal Name Remarks

CCM_CLK1_P/

CCM_CLK1_N

CCM_CLK2

One general purpose differential high speed clock input/output and one single-ended clock input

are provided.

Either or both of them can be used:

• To feed an external reference clock to the PLLs and to the modules inside the SoC, for

example, as an alternate reference clock for PCIe, Video/Audio interfaces and so forth.

• To output the internal SoC clock to be used outside the SoC as either a reference clock or as

a functional clock for peripherals; for example, it can be used as an output of the PCIe master

clock (root complex use)

See the

i.MX 7Dual Application Processor Reference Manual

(IMX7DRM) for details on the

respective clock trees.

The CCM_CLK1_* inputs/outputs are an LVDS differential pair.

Alternatively, a single-ended signal may be used to drive CCM_CLK1_P input. In this case

corresponding CCM_CLK1_N input should be tied to the constant voltage level equal to 1/2 of the

input signal swing.

Termination should be provided in case of high frequency signals.

See the LVDS pad electrical specification for further details. CCM_CLK2 is a single-ended input

referenced to ground.

After initialization:

• The CCM_CLK1_* inputs/outputs can be disabled if not used. Any of the unused CCM_CLK1_*

pins may be left floating.

• The CCM_CLK2 input should be grounded if not used.

RTC_XTALI/RTC_XTALO If the user wishes to configure RTC_XTALI and RTC_XTALO as an RTC oscillator, a 32.768 kHz

crystal, (100 k ESR, 10 pF load) should be connected between RTC_XTALI and RTC_XTALO. It

is recommended to use the configurable load capacitors provided in the IP instead of adding them

externally. To hit the exact oscillation frequency, the configurable capacitors need to be reduced

to account for board and chip parasitics.

The integrated oscillation amplifier is self biasing, but relatively weak. Care must be taken to limit

parasitic leakage from RTC_XTALI and RTC_XTALO to either power or ground (>100 M). This will

debias the amplifier and cause a reduction of startup margin. Typically RTC_XTALI and

RTC_XTALO should bias to approximately 0.5 V.

If it is desired to feed an external low frequency clock into RTC_XTALI, the RTC_XTALO pin

should be left floating or driven with a complimentary signal. The logic level of this forcing clock

should not exceed VDD_SNVS_CAP level.

In the case when a high-accuracy realtime clock is not required, the system may use internal low

frequency oscillator. It is recommended to connect RTC_XTALI to ground and keep RTC_XTALO

floating. This will however result in increased power consumption, because the internal oscillator

uses higher power than the RTC oscillator. Thus for lowest power configuration it is recommended

to always install a crystal.

XTALI/XTALO A 24.0 MHz crystal should be connected between XTALI and XTALO.

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors18

DRAM_VREF When using DDR_VREF with DDR I/O, the nominal reference voltage must be half of the

NVCC_DRAM supply. The user must tie DDR_VREF to a precision external resistor divider. Use

a 1 kΩ0.5% resistor to GND and a 1 kΩ0.5% resistor to NVCC_DRAM. Shunt each resistor with

a closely-mounted 0.1 µF capacitor.

To reduce supply current, a pair of 1.5 kΩ0.1% resistors can be used. Using resistors with

recommended tolerances ensures the ± 2% DDR_VREF tolerance (per the DDR3 specification)

is maintained when four DDR3 ICs plus the i.MX 7Dual are drawing current on the resistor divider.

It is recommended to use regulated power supply for “big” memory configurations (more than

eight devices)

ZQPAD DRAM calibration resistor 240 Ω1% used as reference during DRAM output buffer driver

calibration should be connected between this pad and GND.

PCIE_VPH/PCIE_VPH_TX/

PCIE_VPH_RX

Short these pins to VDDA_PHY1P8 if using PCIe. User can tie these pins to ground if not using

PCIe.

PCIE_VP/PCIE_VP_TX/PC

IE_VP_RX

Short these pins to VDDD_1P0CAP if using PCIe. User can tie these pins to ground with a 10 KΩ

resistor if not using PCIe.

VDDA_MIPI_1P8 Short these pins to VDDA_PHY_1P8 if using MIPI. User can leave these pins floating or grounded

if not using MIPI.

VDD_MIPI_1P0 Short these pins to VDDD_1P0_CAP if using MIPI. User can leave these pins floating or grounded

if not using MIPI.

GPANAIO This signal is reserved for manufacturing use only. User must leave this connection floating.

JTAG_

nnnn

The JTAG interface is summarized in Table 4. Use of external resistors is unnecessary. However,

if external resistors are used, the user must ensure that the on-chip pull-up/down configuration is

followed. For example, do not use an external pull down on an input that has on-chip pull-up.

JTAG_TDO is configured with a keeper circuit such that the floating condition is eliminated if an

external pull resistor is not present. An external pull resistor on JTAG_TDO is detrimental and

should be avoided.

JTAG_MOD is referenced as SJC_MOD in the

i.MX 7Dual Application Processor Reference

Manual

(IMX7DRM). Both names refer to the same signal. JTAG_MOD must be externally

connected to GND for normal operation. Termination to GND through an external pull-down

resistor (such as 1 kΩ) is allowed. JTAG_MOD set to high configures the JTAG interface to a

mode compatible with the IEEE 1149.1 standard. JTAG_MOD set to low configures the JTAG

interface for common SW debug adding all the system TAPs to the chain.

NC Do not connect. These signals are reserved and should be floated by the user.

POR_B This cold reset negative logic input resets all modules and logic in the IC.

May be used in addition to internally generated power on reset signal (logical AND, both internal

and external signals are considered active low).

ONOFF In Normal mode, may be connected to ON/OFF button (De-bouncing provided at this input).

Internally this pad is pulled up. Short connection to GND in OFF mode causes internal power

management state machine to change state to ON. In ON mode short connection to GND

generates interrupt (intended to SW controllable power down). Long above ~5s connection to

GND causes “forced” OFF.

TEST_MODE TEST_MODE is for factory use. This signal is internally connected to an on-chip pull-down device.

The user must tie this signal to GND.

Table 3. Special signal considerations(continued)

Signal Name Remarks

Modules list

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 19

3.2 Recommended connections for unused analog interfaces

Table 5 shows the recommended connections for unused analog interfaces.

PCIE_REXT The impedance calibration process requires connection of reference resistor 4.7 KΩ1% precision

resistor on PCIE_REXT pad to ground.

USB_OTG1_REXT/USB_O

TG2_REXT

The bias generation and impedance calibration process for the USB OTG PHYs requires

connection of 200 Ω (1% precision) reference resistors on each of the USB_OTG1_REXT and

USB_OTG2_REXT pads to ground.

USB_OTG1_CHD_B An external pullup resistor with value in range from 10 kΩ to 100 kΩ should be connected

between open-drain output USB_OTG1_CHD_B and supply VDD_USB_OTG1_3P3_IN for 3.3 V

signaling. Optionally, a similarly valued pullup resistor could be connected instead between

USB_OTG1_CHD_B and an unrelated supply up to 1.8 V, but in that case the output is only valid

when both that supply and VDD_USB_OTG1_3P3_IN are powered.

TEMPSENSOR_REXT External 100 KΩ (1% precision) resistor connection pin

Table 4. JTAG controller interface summary

JTAG I/O Type On-chip Termination

JTAG_TCK Input 47 kΩ

pull-up

JTAG_TMS Input 47 kΩ

pull-up

JTAG_TDI Input 47 kΩ

pull-up

JTAG_TDO 3-state output 100 kΩ pull-up

JTAG_TRSTB Input 47 kΩ

pull-up

JTAG_MOD Input 100 kΩ

pull-up

Table 5. Recommended connections for unused analog interfaces

Module Package Net Name Recommendation

if Unused

ADC VDDA_ADC2_1P8, VDDA_ADC2_1P8, VDDA_ADC1_1P8,

VDDA_ADC1_1P8

1.8 V

ADC2_IN3, ADC2_IN2, ADC2_IN1, ADC2_IN0, ADC1_IN0,

ADC1_IN1, ADC1_IN2, ADC1_IN3

Tie to ground

LDO VDD_1P2_CAP Floating if USB_HSIC is not used

MIPI VDD_MIPI_1P0, VDDA_MIPI_1P8 Floating or tie to ground

MIPI_DSI_D0_N, MIPI_DSI_D0_P, MIPI_VREG_0P4V,

MIPI_DSI_CLK_N, MIPI_DSI_CLK_P, MIPI_DSI_D1_N,

MIPI_DSI_D1_P, MIPI_CSI_D0_N, MIPI_CSI_D0_P,

MIPI_CSI_CLK_N, MIPI_CSI_CLK_P, MIPI_CSI_D1_N,

MIPI_CSI_D1_P

No connect

Table 3. Special signal considerations(continued)

Signal Name Remarks

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors20

4 Electrical characteristics

This section provides the device and module-level electrical characteristics for the i.MX 7Dual family of

processors.

4.1 Chip-level conditions

This section provides the device-level electrical characteristics for the IC. See Table 6 for a quick reference

to the individual tables and sections.

PCIe PCIE_REFCLKIN_N, PCIE_REFCLKIN_P,

PCIE_REFCLKOUT_N, PCIE_REFCLKOUT_P,

PCIE_RX_N, PCIE_RX_P, PCIE_TX_N, PCIE_TX_P

Floating

PCIE_VP,PCIE_VP_RX,PCIE_VP_TX,

PCIE_VPH,PCIE_VPH_RX,PCIE_VPH_TX, PCIE_REXT

Tie to ground

SNVS SNVS_TAMPER00, SNVS_TAMPER01, SNVS_TAMPER02,

SNVS_TAMPER03, SNVS_TAMPER04, SNVS_TAMPER05,

SNVS_TAMPER06, SNVS_TAMPER07, SNVS_TAMPER08,

SNVS_TAMPER09

Float—configure with software

Temperature sensor TEMPSENSOR_REXT Tie to ground or pulldown with 100 KΩ

resistor

TEMPSENSOR_RESERVE Floating

VDD_TEMPSENSOR_1P8 1.8 V

USB HSIC VDD_USB_H_1P2 Tie to ground

USB_H_DATA, USB_H_STROBE Floating

USB OTG1 VDD_USB_OTG1_3P3_IN, VDD_USB_OTG1_1P0_CAP Tie to ground

USB_OTG1_VBUS, USB_OTG1_DP, USB_OTG1_DN,

USB_OTG1_ID, USB_OTG1_REXT, USB_OTG1_CHD_B

Floating

USB OTG2 VDD_USB_OTG2_3P3_IN, VDD_USB_OTG2_1P0_CAP Tie to ground

USB_OTG2_VBUS, USB_OTG2_DP, USB_OTG2_DN,

USB_OTG2_ID, USB_OTG2_REXT

Floating

Table 6. i.MX 7Dual Chip-level conditions

For these characteristics, … Topic appears …

Absolute maximum ratings on page 21

FPBGA case “X” and case “Y” package thermal resistance on page 22

Operating ranges on page 23

External clock sources on page 25

Table 5. Recommended connections for unused analog interfaces(continued)

Module Package Net Name Recommendation

if Unused

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 21

4.1.1 Absolute maximum ratings

CAUTION

Stresses beyond those listed under Table 7 may affect reliability or cause

permanent damage to the device. These are stress ratings only. Functional

operation of the device at these or any other conditions beyond those

indicated in the operating ranges or parameters tables is not implied.

Maximum supply currents on page 26

Power modes on page 29

USB PHY Suspend current consumption on page 32

Table 7. Absolute maximum ratings

Parameter Description Symbol Min Max Unit

Core supply voltages VDD_ARM

VDD_SOC

–0.5 1.5 V

GPIO supply voltage NVCC_ENET1

NVCC_EPDC1

NVCC_EPDC2

NVCC_I2C

NVCC_LCD

NVCC_SAI

NVCC_SD1

NVCC_SD2

NVArmCC_SD3

NVCC_SPI

NVCC_UART

–0.3 3.6 V

DDR I/O supply voltage NVCC_DRAM –0.3 1.975 V

Clock I/O supply voltage NVCC_DRAM_CKE –0.3 1.98 V

VDD_SNVS_IN supply voltage VDD_SNVS_IN –0.3 3.6 V

USB OTG PHY supply voltage VDD_USB_OTG1_3P3_IN

VDD_USB_OTG2_3P3_IN

–0.3 3.6 V

USB_VBUS input detected USB_OTG1_VBUS

USB_OTG2_VBUS

–0.3 5.25 V

Input voltage on USB_OTG*_DP, USB_OTG*_DN

pins

USB_OTG1_DP/USB_OTG1_DN

USB_OTG2_DP/USB_OTG2_DN

–0.3 3.63 V

USB_OTG1_CHD_B open-drain pullup voltage

when external pullup resistor is connected to

VDD_USB_OTG1_3P3_IN supply only

USB_OTG1_CHD_B — 3.6 V

Table 6. i.MX 7Dual Chip-level conditions(continued)

For these characteristics, … Topic appears …

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors22

4.1.2 Thermal resistance

4.1.2.1 FPBGA case “X” and case “Y” package thermal resistance

Table 8 displays the thermal resistance data.

Per JEDEC JESD51-2, the intent of thermal resistance measurements is solely for a thermal performance

comparison of one package to another in a standardized environment. This methodology is not meant to

and does not predict the performance of a package in an application-specific environment.

USB_OTG1_CHD_B open-drain pullup voltage

when external pullup resistor is connected to any

supply other than VDD_USB_OTG1_3P3_IN

USB_OTG2_CHD_B — 1.975 V

Input/output voltage range V

out

–0.3 OVDD

+0.3 V

ESD damage immunity: V

esd

• Human Body Model (HBM)

• Charge Device Model (CDM)

—

2000

500

Storage temperature range T

STORAGE

–40 150

OVDD is the I/O supply voltage.

Table 8. Thermal Resistance Data

Rating Test conditions Symbol 12x12

pkg value

19x19

pkg value Unit

Junction to Ambient

Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Single-layer board (1s); natural convection

Four-layer board (2s2p); natural convection

Per JEDEC JESD51-2 with the single layer board horizontal. Thermal test board meets JEDEC specification for the specified

package.

θJA

55.4

32.6

44.4

30.2

C/W

Junction to Ambient

Single-layer board (1s); airflow 200 ft/min

2,3

Four-layer board (2s2p); airflow 200 ft/min

2,3

Per JEDEC JESD51-6 with the board horizontal.

θJA

41.8

28.0

34.3

25.8

C/W

Junction to Board

1,4

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on

the top surface of the board near the package.

—R

θJB

16.0 17.4

C/W

Junction to Case

1,5

—R

θJC

10.5 10.4

C/W

Junction to Package Top

1,6

Natural Convection Ψ

0.2 0.2

C/W

Junction to Package Bottom Natural Convection R

θB_CSB

15.3 17.3

C/W

Table 7. Absolute maximum ratings(continued)

Parameter Description Symbol Min Max Unit

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 23

4.1.3 Operating ranges

Table 9 provides the operating ranges of the i.MX 7Dual family of processors. For details on the chip's

power structure, see the “Power Management Unit (PMU)” chapter of the i.MX 7Dual Application

Processor Reference Manual (IMX7DRM).

Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method

1012.1).

Thermal characterization parameter indicating the temperature difference between package top and the junction temperature

per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.

Table 9. Operating ranges

Parameter

Description Symbol Min Typ Max

Unit Comment

Run Mode VDD_ARM 0.95 1.0 1.25 V Operation at 800 MHz and

below

1.045 1.1 1.25 V Operation between 800 MHz

and 1 GHz

1.2 1.225 1.25 V Operation between 1.0 GHz

and 1.2 GHz. See Tabl e 1 for

maximum frequencies.

VDD_SOC 0.95 1.0 1.25 V —

Standby/

Deep Sleep

mode

VDD_ARM 0 1.0 1.25 V See Table 14, “Power modes,”

on page 29.

VDD_SOC 0.95 1.0 1.155 V

Power

Supply

Analog

Domain and

LDOs

VDDA_1P8 1.71 1.8 1.89 V Power for analog LDO and

internal analog blocks. Must

match the range of voltages

that the rechargeable backup

battery supports.

Backup

battery

supply range

VDD_SNVS_IN 2.4 3.0 3.6 V —

LDO for

Low-Power

State

Retention

mode

VDD_LPSR 1.71 1.8 1.89 V Power rail for Low Power State

Retention mode

Supply for 24

MHz crystal

VDD_XTAL_1P8 1.650 1.8 1.950 V —

Temperature

sensor

VDD_TEMPSENSOR 1.710 1.8 1.890 V —

USB supply

voltages

VDD_USB_OTG1_3

P3_IN

3.0 3.3 3.6 V This rail is for USB

VDD_USB_OTG2_3

P3_IN

3.0 3.3 3.6 V This rail is for USB

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors24

DDR I/O

supply

voltage

NVCC_DRAM,

NVCC_DRAM_CKE

1.14 1.2 1.3 V LPDDR2, LPDDR3

1.425 1.5 1.575 V DDR3

1.283 1.35 1.45 V DDR3L

DRAM_VREF 0.49 ×

NVCC_DRAM)

0.5 ×

NVCC_DRAM

0.51 ×

NVCC_DRAM

V Set to one-half NVCC_DRAM

GPIO supply

voltages

NVCC_ENET1

NVCC_EPDC1

NVCC_EPDC2

NVCC_I2C

NVCC_LCD

NVCC_SAI

NVCC_SD1

NVCC_SD2

NVCC_SD3

NVCC_SPI

NVCC_UART

1.65,

3.0

1.8,

3.3

1.95,

3.6

V—

NVCC_GPIO1 1.65

3.0

1.8,

3.3

1.95,

3.6

V Power for GPIO1_DATA00 ~

GPIO1_DATA07

NVCC_GPIO2 1.65

3.0

1.8,

3.3

1.95,

3.6

V Power for GPIO1_DATA08 ~

GPIO1_DATA15 and JTAG

port

Voltage rails

supplied from

internal LDO

PCIE_VPH

PCIE_VPH_RX

PCIE_VPH_TX

VDDA_MIPI_1P8

1.71 1.8 1.89 V Supplied from

VDDA_PHY_1P8

PCIE_VP

PCIE_VP_RX

PCIE_VP_TX

VDD_MIPI_1P0

0.95 1.0 1.050 V Supplied from

VDDD_CAP_1P0

VDD_USB_H_1P2 1.150 1.2 1.250 V Supplied from VDD_1P2_CAP

Temperature

sensor

accuracy

delta

— ±3 — °C Typical accuracy over the

range –40°C to 125°C

A/D converter VDDA_ADC1_1P8 1.71 1.8 1.89 V —

VDDA_ADC2_1P8 1.71 1.8 1.89 V —

Fuse power FUSE_FSOURCE 1.710 1.8 1.890 V Power supply for internal use

Junction

temperature,

industrial

-20 — 105

C See Ta ble 1 for complete list of

junction temperature

capabilities.

Applying the maximum voltage results in maximum power consumption and heat generation. A voltage set point = (Vmin + the

supply tolerance) is recommended. This results in an optimized power/speed ratio. Operating a voltage of 1.2V and above will

reduce the overall lifetime of the part. For details, see

i.MX 7Dual/Solo Product Lifetime Usage

(AN5334).

Table 9. Operating ranges(continued)

Parameter

Description Symbol Min Typ Max

Unit Comment

Electrical characteristics

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NXP Semiconductors 25

Table 10 shows on-chip LDO regulators that can supply on-chip loads.

4.1.4 External clock sources

Each i.MX 7Dual processor has two external input system clocks: a low frequency (RTC_XTALI) and a

high frequency (XTALI).

The RTC_XTALI is used for low-frequency functions. It supplies the clock for wake-up circuit,

power-down real time clock operation, and slow system and watch-dog counters. The clock input can be

connected to either external oscillator or a crystal using internal oscillator amplifier. Additionally, there is

an internal resistor-capacitor (RC) oscillator, which can be used instead of the RTC_XTALI if accuracy is

not important.

The system clock input XTALI is used to generate the main system clock. It supplies the PLLs and other

peripherals. The system clock input can be connected to either an external oscillator or a crystal using

internal oscillator amplifier.

Table 11 shows the interface frequency requirements.

Table 10. On-chip LDOs

and their on-chip loads

On-chip LDOs are designed to supply i.MX 7Dual loads and must not be used to supply external loads.

Voltage Source Load Comment

VDDD_1P0_CAP VDD_MIPI_1P0 Connect directly (short) via board level

PCIE_VP

PCIE_VP_RX

PCIE_VP_TX

VDD_1P2_CAP VDD_USB_H_1P2 Connect directly (short) via board level

VDDA_PHY_1P8 VDDA_MIPI_1P8 Connect directly (short) via board level

PCIE_VPH

PCIE_VPH_RX

PCIE_VPH_TX

Table 11. External input clock frequency

Parameter Description Symbol Min Typ Max Unit

RTC_XTALI Oscillator

1,2

External oscillator or a crystal with internal oscillator amplifier.

The required frequency stability of this clock source is application dependent. See

Hardware Development Guide for

i.MX7Dual and 7Solo Applications Processors.

ckil

—32.768

Recommended nominal frequency 32.768 kHz.

—kHz

XTALI Oscillator

2,4

External oscillator or a fundamental frequency crystal appropriately coupled to the internal oscillator amplifier.

xtal

24 MHz

Electrical characteristics

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NXP Semiconductors26

The typical values shown in Table 11 are required for use with NXP BSPs to ensure precise time keeping

and USB operation. For RTC_XTALI operation, two clock sources are available. If there is not an

externally applied oscillator to RTC_XTALI, the internal oscillator takes over.

• On-chip 32 kHz RC oscillator—this clock source has the following characteristics:

— Approximately 25 µA more I

than crystal oscillator

— Approximately ±10% tolerance

— No external component required

— Starts up faster than 32 kHz crystal oscillator

— Three configurations for this input:

– External oscillator

– External crystal coupled to RTC_XTALI and RTC_XTALO

– Internal oscillator

External crystal oscillator with on-chip support circuit:

— At power up, RC oscillator is utilized. After crystal oscillator is stable, the clock circuit

switches over to the crystal oscillator automatically.

— Higher accuracy than RC oscillator

— If no external crystal is present, then the RC oscillator is utilized

The decision of choosing a clock source should be taken based on real-time clock use and precision

timeout.

4.1.5 Maximum supply currents

The Power Virus numbers shown in Table 12 represent a use case designed specifically to show the

maximum current consumption possible. All cores are running at the defined maximum frequency and are

limited to L1 cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a

very limited practical use case, if at all, and be limited to an extremely low duty cycle unless the intention

was to specifically show the worst case power consumption.

The MC3xPF3000xxxx, NXP’s power management IC targeted for the i.MX 7Dual family of processors,

supports the Power Virus mode operating at 1% duty cycle. Higher duty cycles are allowed, but a robust

thermal design is required for the increased system power dissipation.

Table 12 represents the maximum momentary current transients on power lines, and should be used for

power supply selection. Maximum currents are higher by far than the average power consumption of

typical use cases. For typical power consumption information, see the application note, i.MX 7DS Power

Consumption Measurement (AN5383).

Table 12. Maximum supply currents

Power Rail Source Conditions Max Current Unit

VDD_ARM From PMIC — 500 mA

VDD_SOC From PMIC — 1000 mA

Electrical characteristics

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NXP Semiconductors 27

VDDA_1P8_IN From PMIC — 150

VDD_SNVS_IN From PMIC or Coin cell — 1 mA

VDD_XTAL_1P8 From PMIC — 5 mA

VDD_LPSR_IN From PMIC — 5 mA

VDD_TEMPSENSOR_1P8 From PMIC — 1 mA

VDDA_ADC1_1P8 From PMIC — 5 mA

VDDA_ADC2_1P8 From PMIC — 5 mA

FUSE_FSOURCE From PMIC — 150 mA

VDD_MIPI_1P0 From i.MX 7 internal LDO — 80 mA

PCIE_VP From i.MX 7 internal LDO — 70 mA

PCIE_VP_RX From i.MX 7 internal LDO — 35 mA

PCIE_VP_TX From i.MX 7 internal LDO — 35 mA

PCIE_VPH From i.MX 7 internal LDO — 25 mA

PCIE_VPH_RX From i.MX 7 internal LDO — 15 mA

PCIE_VPH_TX From i.MX 7 internal LDO — 15 mA

NVCC_GPIO1 From PMIC N=12 Use max IO

equation

NVCC_GPIO2 From PMIC N=14 mA

NVCC_SD2 From PMIC N=9 mA

NVCC_SD3 From PMIC N=12 mA

NVCC_SD1 From PMIC N=9 mA

NVCC_ENET1 From PMIC N=16 mA

NVCC_EPDC1 From PMIC N=16 mA

NVCC_EPDC2 From PMIC N=17 mA

NVCC_SAI From PMIC N=11 mA

NVCC_LCD From PMIC N=29 mA

NVCC_SPI From PMIC N=8 mA

NVCC_ECSPI From PMIC N=8 mA

NVCC_I2C From PMIC N=8 mA

NVCC_UART From PMIC N=8 mA

VDD_USB_OTG1_3P3_IN From PMIC — 50 mA

VDD_USB_OTG2_3P3_IN From PMIC — 50 mA

VDD_USB_H_1P2 From i.MX 7 internal LDO — 20 mA

VDDA_MIPI_1P8 From i.MX 7 internal LDO — 5 mA

Table 12. Maximum supply currents(continued)

Power Rail Source Conditions Max Current Unit

Electrical characteristics

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NXP Semiconductors28

4.1.6 Power modes

The i.MX 7Dual has the following power modes:

• OFF mode: all power rails are off

• SNVS mode: only RTC and tamper detection logic is active

• LPSR mode: an extension of SNVS mode, with 16 GPIOs in low power state retention mode

• RUN Mode: all external power rails are on, CPU is active and running, other internal module can

be on/off based on application;

• Low Power mode (System Idle, Low Power Idle, and Deep Sleep): most external power rails are

still on, CPU is in WFI state or power gated, most of the internal modules are clock gated or power

gated

DRAM_VREF From PMIC — 1 mA

NVCC_DRAM_CKE From PMIC — 30 mA

NVCC_DRAM From PMIC — —

The actual maximum current drawn from VDDA_1P8_IN is as shown plus any additional current drawn from the

VDDD_1P0_CAP, VDD_1P2_CAP, VDDA_PHY_1P8 outputs, depending on actual application configuration (for example,

VDD_MIPI_1P0, VDD_USB_H_1P2 and PCIE_VP/VPH supplies).

General equation for estimated, maximal power consumption of an I/O power supply:

max

= N × C × V × (0.5 × F)

where:

N = Number of I/O pins supplied by the power line

C = Equivalent external capacitive load

V = IO voltage

(0.5 × F) = Data change rate, up to 0.5 of the clock rate (F)

In this equation, I

max

is in amps, C in farads, V in volts, and F in hertz.

The DRAM power consumption is dependent on several factors, such as external signal termination. DRAM power calculators

are typically available from the memory vendors. They take into account factors such as signal termination. See the application

note,

i.MX 7DS Power Consumption Measurement

(AN5383) for examples of DRAM power consumption during specific use

case scenarios.

Table 12. Maximum supply currents(continued)

Power Rail Source Conditions Max Current Unit

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors 29

The valid power mode transition is shown in this diagram.

Figure 3. i.MX 7Dual Power Modes

The power mode transition condition is defined in the following table.

The following table summarizes the external power supply state in all the power modes.

Table 13.

Power Mode Transition

Transition From To Condition

1 OFF RUN VDD_SVNS_IN supply present.

2 SNVS OFF VDD_SNVS_IN supply removal.

3 RUN SNVS ONOFF long press, or SW.

4 SNVS RUN ONOFF press, or RTC, or tamper event.

5 RUN LPSR SW.

6 LPSR RUN ONOFF press, or RTC, or tamper event, or GPIO event.

7 RUN Low Power SW (CPU execute WFI)

8 Low Power RUN RTC, tamper event, IRQ.

Table 14. Power modes

Power rail OFF SVNS LPSR RUN Low Power

VDD_ARM OFF OFF OFF ON ON/ OFF

VDD_SOC OFF OFF OFF ON ON

VDDA_1P8_IN OFF OFF OFF ON ON

VDD_SNVS_IN OFF ON ON ON ON

VDD_LPSR_IN OFF OFF ON ON ON

NVCC_GPIO1/2 OFF OFF ON ON ON

NVCC_DRAM OFF OFF OFF ON ON

OFF RUN

SNVS LPSR

Low

Power

Electrical characteristics

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NXP Semiconductors30

The NVCC_DRAM_CKE can be still ON during SNVS/LPSR mode to keep the CKE/RESET pad in

correct state to hold DRAM device in self-refresh mode.

The NVCC_XXX can be off in RUN mode / Low Power mode if all the pads in that IO bank is not used

in the application, the NVCC_XXX supply could be tied to GND.

The VDD_USB_OTG1_3P3_IN and VDD_USB_OTG2_3P3_IN are fully asynchronous to other power

rails, so it can be either ON/OFF in any of the power modes.

4.1.6.1 OFF Mode

In OFF mode, all the power rails are shut off.

4.1.6.2 SNVS Mode

SNVS mode is also called RTC mode, where only the power for the SNVS domain remain on. In this

mode, only the RTC and tamper detection logic is still active.

The power consumption in SNVS model with all the tamper detection logic enabled will be less than

5 uA @ 3.0 V on VDD_SNVS_IN for typical silicon at 25°C.

The external DRAM device can keep in self-refresh when the chip stays in SNVS mode with

NVCC_DRAM_CKE still powered. During the state transition between SNVS mode to/from ON mode,

the DRAM_CKE pad and DRAM_RESET pad has to always stay in correct state to keep DRAM in

self-refresh mode. No glitch / floating is allowed.

4.1.6.3 LPSR Mode

LPSR is considered as an extension of the SNVS mode. All the features supported in SNVS mode is also

supported in LPSR mode, including the capability of keeping DRAM device in self-refresh.

In LPSR mode, three additional power rails will remain on: VDD_LPSR_IN, NVCC_GPIO1, and

NVCC_GPIO2. These three power rails are used to supply the logic and IO pads in the LPSR domain. The

purpose of this mode is to retain the state of 16 GPIO pads, so the other components in the whole system

will have their control signal in correct state.

Among all the 16 GPIO pads, the NVCC_GPIO1 supply the power for 8 GPIO pads, and the

NVCC_GPIO2 supply the power for the other 8 GPIO pads. This allows the SoC to have some of its GPIO

working at 1.8 V while others working at 3.3 V in the LPSR mode.

NVCC_DRAM_CKE OFF OFF / ON OFF / ON ON ON

NVCC_XXX OFF OFF OFF ON / OFF ON / OFF

VDD_USB_OTG1_3P3_IN

VDD_USB_OTG2_3P3_IN

OFF / ON OFF / ON OFF / ON ON / OFF ON / OFF

Table 14. Power modes(continued)

Power rail OFF SVNS LPSR RUN Low Power

Electrical characteristics

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NXP Semiconductors 31

When LPSR mode is not needed for the application, the VDD_LPSR can be connected to VDDA_1P8 and

NVCC_GPIO1/2 can be connected to the same power supply as NVCC_XXX for other GPIO banks.

In LPSR mode, the supported wakeup source are RTC alarm, ONOFF event, security/tamper and also the

16 GPIO pads.

4.1.6.4 RUN Mode

In RUN mode, the CPU is active and running, and the analog / digital peripheral modules inside the

processor will be enabled. In this mode, all the external power rails to the processor have to be ON and the

SoC will be able to draw as many current as listed in the Table 5 Maximum Power Requirement.

In this mode, the PMIC should allow SoC to change the voltage of power rails through I2C/SPI interface.

Typically, when the CPU is doing DVFS, it switches the VDD_ARM voltage according to Table 9 when

the CPU’s frequency is switching between 1 GHz and 800 MHz (or below).

4.1.6.5 Low Power Mode

When the CPU is not running, the processor can enter low power mode. i.MX 7Dual processor supports a

very flexible set of power mode configurations in low power mode.

Typically there are 3 low power modes used, System IDLE, Low Power IDLE and SUSPEND:

• System IDLE—This is a mode that the CPU can automatically enter when there is no thread

running. All the peripherals can keep working and the CPU’s state is retained so the interrupt

response can be very short. The cores are able to individually enter the WAIT state.

• Low Power IDLE—This mode is for the case when the system needs to have lower power but still

keep some of the peripherals alive. Most of the peripherals, analog modules, and PHYs are shut

off; see Table 5-5, “Low Power Mode Definition,” in the i.MX 7Dual Application Processor

Reference Manual (IMX7DRM) for details. The interrupt response in this mode is expected to be

longer than the System IDLE, but its power is much lower.

• Suspend—This mode has the greatest power savings; all clocks, unused analog/PHYs, and

peripherals are off. The external DRAM stays in Self-Refresh mode. The exit time from this mode

is much longer.

In System IDLE and Low Power IDLE mode, the voltage on external power supplies remains the same as

in RUN mode, so the external PMIC is not aware of the state of the processor. If any low-power setting

needs to be applied to PMIC, it is done through the I2C/SPI interface before the processor enters a

low-power mode.

When the processor enters SUSPEND mode, it will assert the PMIC_STBY_REQ signal to PMIC. When

this signal is asserted, the processor allows the PMIC to shut off VDD_ARM externally. However, in some

application scenario, SW want to keep the data in L2 Cache to avoid performance impact on cache miss.

In this case, the VDD_ARM cannot be shut off. To support both scenarios, the PMIC should have an option

to shut off or keep VDD_ARM when it receives the PMIC_STBY_REQ. This should be configured

through I2C/SPI interface before the processor enters SUSPEND mode.

Except the VDD_ARM, the other power rails have to keep active in SUSPEND mode. Since the current

on each power rail is greatly reduced in this mode, PMIC can enter its own low power mode to get extra

Electrical characteristics

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NXP Semiconductors32

power saving. For example, the PMIC can change the DCDC rails to PFM mode to reduce the power

consumption.

The power consumption in low power modes is defined in Table 15.

All the power numbers defined in Table 15 are based on typical silicon at 25°C.

4.1.7 USB PHY Suspend current consumption

4.1.7.1 Low Power Suspend Mode

The VBUS Valid comparators and their associated bandgap circuits are enabled by default. Table 16

shows the USB interface current consumption in Suspend mode with default settings.

Table 15. Low Power Measurements

Power rail

System IDLE Low Power IDLE SUSPEND LPSR

Voltage Current Power Voltage Current Power Voltage Current Power Voltage Current Power

(V) (mA) (mW) (V) (mA) (mW) (V) (mA) (mW) (V) (mA) (mW)

VDD_ARM 1.0 2.7 2.70 1.0 0.428 0.43 1.0 0.3 0.30 0.0 — 0.00

VDD_SOC 1.0 19.38 19.38 1.0 1.423 1.42 1.0 0.6 0.60 0.0 — 0.00

VDDA_1P8_IN 1.8 3.46 6.23 1.8 0.206 0.37 1.8 0.4 0.72 0.0 — 0.00

VDD_SNVS_IN 3.0 0.006 0.018 3.0 0.005 0.015 3.0 0.006 0.018 3.0 0.003 0.009

VDD_LPSR_IN 1.8 0.04 0.07 1.8 0.041 0.07 1.8 0.039 0.0702 1.8 0.04 0.07

NVCC_GPIO1/2 1.8 0.072 0.13 1.8 0.073 0.13 1.8 0.072 0.13 1.8 0.072 0.13

Total — — 28.53 — — 2.45 — — 1.84 — — 0.21

Table 16. USB PHY current consumption with default settings

Low Power Suspend is enabled by setting USBx_PORTSC1 [PHCD]=1 [Clock Disable (PLPSCD)].

VDD_USB_OTG1_3P3_IN VDD_USB_OTG2_3P3_IN

Current 790 uA 790 uA

Electrical characteristics

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NXP Semiconductors 33

4.1.7.2 4.1.7.2 Power-Down modes

Table 17 shows the USB interface current consumption with only the OTG block powered down.

In Power-Down mode, everything is powered down, including the USB_VBUS valid comparators and

their associated bandgap circuity in typical condition. Table 18 shows the USB interface current

consumption in Power-Down mode.

4.1.8 PCIe phy 2.1 DC electrical characteristics

Note: V

should have no more than 40 mVpp AC power supply noise superimposed on the high power supply voltage for the

PHY core (1.8 V nominal DC value). At the same time, VDD should have no more than 20 mVpp AC power supply noise

superimposed on the low power supply voltage for the PHY core.

The power supply voltage variation for the PHY core should have less than +/-5% including the board-level power supply variation

and on-chip power supply variation due to the finite impedances in the package.

Table 17. USB PHY current consumption with

VBUS Valid Comparators disabled

VBUS Valid comparators can be disabled through software by setting USBNC_OTG*_PHY_CFG2[OTGDISABLE0] to 1. This

signal powers down only the VBUS Valid comparator, and does not control power to the Session Valid Comparator, ADP Probe

and Sense comparators, or the ID detection circuitry.

VDD_USB_OTG1_3P3_IN VDD_USB_OTG2_3P3_IN

Current 730 uA 730 uA

Table 18. USB PHY current consumption in Power-Down mode

The VBUS Valid Comparators and their associated bandgap circuits can be disabled through software by setting

USBNC_OTG*_PHY_CFG2[OTGDISABLE0] to 1 and USBNC_OTG*_PHY_CFG2[DRVVBUS0] to 0, respectively.

VDD_USB_OTG1_3P3_IN VDD_USB_OTG2_3P3_IN

Current 200 uA 200 uA

Table 19. PCIe recommended operating conditions

Parameter Description Min Max Unit

Low Power Supply Voltage for PHY Core 1 V 0.95 1.05 V

High Power Supply Voltage for PHY Core 1.8 V 1.71 1.89

Commercial Temperature Range 0 70 °C

Simulation Junction Temperature Range -40 125 °C

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet, Rev. 6, 02/2019

NXP Semiconductors34

Table 20. PCIe DC electrical characteristics

Parameter Description Min Typ Max Unit

Power Supply Voltage

(VDD of 1.0 V nominal

gate oxide /1.8 V for thick gate oxide)

1.0 - 5% 1.0 1.0 + 5% V

1.8 - 5% 1.8 1.8 + 5% V

PD Power Consumption Normal — 130 — mW

Partial Mode — 108 — mW

Slumber Mode — 7 — mW

Full Powerdown — 0.2 — mW

Table 21. PCIe PHY high-speed characteristics

High Speed I/O Characteristics

Description Symbol Speed Min. Typ. Max. Unit

Unit Interval UI 1.5 Gbps — 666.67 — ps

2.5 Gbps — 400 —

3.0 Gbps — 333.33 —

5.0 Gbps — 200 —

6.0 Gbps — 166.67 —

TX Serial output rise time (20% to 80%) T

TXRISE

1.5 Gbps 50 — 273 ps

2.5 Gbps 50 — —

3.0 Gbps 50 — 136

5.0 Gbps 30 — —

6.0 Gbps 33 — 80

TX Serial output fall time (80% to 20%) T

TXFALL

1.5 Gbps 50 — 273 ps

2.5 Gbps 50 — —

3.0 Gbps 50 — 136

5.0 Gbps 30 — —

6.0 Gbps 33 — 80

TX Serial data output voltage (Differential, pk–pk) ΔV

1.5 Gbps 400 — 600 mVp–p

2.5 Gbps 400 — 1200

3.0 Gbps 400 — 700

5.0 Gbps 400 — 1200

6.0 Gbps 240 — 900

Electrical characteristics

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NXP Semiconductors 35

PCIe Tx deterministic jitter < 1.5 MHz TRJ 2.5 Gbps/

5.0 Gbps

— — 3 ps ps, rms

PCIe Tx deterministic jitter > 1.5 MHz TDJ 5.0 Gbps/

2.5 Gbps

— — 30 ps/

60 ps

ps, pk–pk

RX Serial data input voltage (Differential pk–pk) ΔV

1.5 Gbps 325 — 600 mVp–p

2.5 Gbps 120 — 1200

3.0 Gbps 275 — 750

5.0 Gbps 120 — 1200

6.0 Gbps 240 — 1000

Table 22. PCIe PHY reference clock timing requirements

Description Symbol Min. Typ. Max. Unit

Frequency Tolerance F

TOL

-100 — 100 ppm

Duty Cycle D

40 — 60 %

Rise and Fall Time T

— — 1.5 ns

Peak to peak Jitter Jitter — — 40 ps,pk–pk

RMS Jitter — — 2.5 ps,rms

Period Jitter — — 25 ps

External Clock source output impedence Z

40 — 60 Ω

Differential input high voltage V

150 — — mV

Differential input low voltage V

—— -150mV

Absolute maximum input voltage V

MAX

—— 1.15V

Absolute minimum input voltage V

MIN

-0.3 — — V

Absolute crossing point voltage V

CROSS

250 — 550 mV

Table 21. PCIe PHY high-speed characteristics(continued)

High Speed I/O Characteristics

Description Symbol Speed Min. Typ. Max. Unit

Electrical characteristics

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NXP Semiconductors36

Table 23. PCIe PHY reference clock Transmit requirements

Description Symbol Interface Speed Min Typ Max Unit

Frequency of TBC F

TBC

20-bit 1.5 Gbps — 75 — MHz

3.0 Gbps — 150 —

6.0 Gbps — 300 —

40-bit 1.5 Gbps — 37.5 —

3.0 Gbps — 75 —

6.0 Gbps — 150 —

8-bit 2.5 Gbps — 250 —

16-bit 5.0 Gbps — —

Duty cycle of TBC DCTBC — — 40 — 60 %

TXD[0:30] setup time to the rising edge of TBC T

SETUP.TX

20-bit 1.5 Gbps 2.0 — — ns

3.0 Gbps

6.0 Gbps 1.0 — —

40-bit 1.5 Gbps 2.0 — —

3.0 Gbps

6.0 Gbps

8-bit 2.5 Gbps 1.0 — —

16-bit 5.0 Gbps

TXD[0:30] hold time to the rising edge of TBC T

HOLD.TX

20-bit 1.5 Gbps 2.0 — — ns

3.0 Gbps

6.0 Gbps 1.0 — —

40-bit 1.5 Gbps 2.0 — —

3.0 Gbps

6.0 Gbps

8-bit 2.5 Gbps 1.0 — —

16-bit 5.0 Gbps

Latency from the rising edge of TBC to the leading edge

of the corresponding first transmitted serial output bit

TXP/TXN

LAT.TX

— 1.5 Gbps — 70 — bits

2.5 Gbps — 100 —

3.0 Gbps — 95 —

5.0 Gbps — 200 —

6.0 Gbps — 120 —

Electrical characteristics

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NXP Semiconductors 37

The system design must comply with power-up sequence, power-down sequence, and steady state

guidelines as described in this section to guarantee the reliable operation of the device. Any deviation

from these sequences may result in the following situations:

• Excessive current during power-up phase

• Prevention of the device from booting

Table 24. PCIe PHY reference clock Receive requirements

Description Symbol Interface Speed Min Typ Max Unit

Frequency of RBC F

RBC

20-bit 1.5 Gbps — 75 — MHz

3.0 Gbps — 150 —

6.0 Gbps — 300 —

40-bit 1.5 Gbps — 37.5 —

3.0 Gbps — 75 —

6.0 Gbps — 150 —

Duty cycle of TBC DC

RBC

——40—60%

RXD[0:30] delay time from the falling edge of RBC T

DLY,RX

— — — — 1.33 ns

Latency from the leading edge of the corresponding first

received serial input bit, RXP/RXN, to the rising edge of RBC

LAT.RX

20-bit 1.5 Gbps — 100 — bits

2.5 Gbps — 230 —

3.0 Gbps — 100 —

5.0 Gbps — 260 —

6.0 Gbps — 100 —

Table 25. PCIe PHY output clock characteristics

Description Symbol Interface Speed Min Typ Max Unit

Frequency of PC_CLK F

PC_CLK

HIGH_SPEED=1 MHz

PCIe — — 250 —

Duty Cycle of PC_CLK D

CPC_CLK

— — 40 — 60 %

Frequency of TX_CLK F

TX_CLK

20-bit 1.5 Gbps — 75 — MHz

3.0 Gbps — 150 —

6.0 Gbps — 300 —

40-bit 1.5 Gbps — 37.5 —

3.0 Gbps — 75 —

6.0 Gbps — 150 —

Duty cycle of TX_CLK D

CTX_CLK

——40—60%

Electrical characteristics

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NXP Semiconductors38

• Irreversible damage to the processor (worst-case scenario)

4.1.9 Power-up sequence

The i.MX7 processor has the following power-up sequence requirements:

• VDD_SNVS_IN to be turned on before any other power supply. If a coin cell is used to power

VDD_SNVS_IN, then ensure that it is connected before any other supply is switched on.

• VDD_SOC to be turned on before NVCC_DRAM and NVCC_DRAM_CKE.

• VDD_ARM, VDD_SOC, VDDA_1P8_IN, VDD_LPSR_IN and all I/O power (NVCC_*) should

be turned on after VDD_SVNS_IN is active. But there is no sequence requirement among these

power rails other than the sequence requirement between VDD_SOC and

NVCC_DRAM/NVCC_DRAM_CKE.

• There are no special timing requirements for VDD_USB_OTG1_3P3_IN and

VDD_USB_OTG2_3P3_IN.

The POR_B input (if used) must be immediately asserted at power-up and remain asserted until the last

power rail reaches its working voltage. In the absence of an external reset feeding the POR_B input, the

internal POR module takes control.

The power-up sequence is shown in Figure 4 with the following timing parameters:

T1 Time from SVNS power stable to other power rails start to ramp, minimal delay is 2ms,

no max delay requirement.

T2 Time from first power rails (except SNVS) ramp up to all the power rails get stable,

minimal delay is 0ms, no max delay requirement.

T3 Time from all power rails get stable to power-on reset, minimal delay is 0ms, no max

delay requirement.

T6 Time from VDD_SOC get stable to NVCC_DRAM/NVCC_DRAM_CKE start to

ramp, minimal delay is 0ms, no max delay requirement.

VDDjNVsJN /I I I I I I I I I I I I VDD_LPSR_IN ' ' I I I I chc_GPIoI I I 5 7| I I I NVCC_GP|02 VDD_ARM VDD_SOC VDDA_I Pa_m I I I chc_><>

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NXP Semiconductors 39

Figure 4. i.MX 7Dual power-up sequence

4.1.10 Power-down sequence

The i.MX7 processors have the following power-down sequence requirements:

• VDD_SNVS _IN to be turned off last after any other power supply.

• NVCC_DRAM/NVCC_DRAM_CKE to be turned off before VDD_SOC.

• There are no special timing requirements forVDD_USB_OTG1_3P3_IN

andVDD_USB_OTG2_3P3_IN.

The power-down sequence is shown in Figure 5 with the following timing parameters:

T4 Time from first power rails (except SNVS) to ramp down to all the power rails (except

SNVS) get to ground, minimal delay is 0ms, no max delay requirement.

T5 Time from all the power rails power down (except SNVS) to SVNS power down,

minimal delay is 0ms, no max delay requirement.

T7 Time from NVCC_DRAM/NVCC_DRAM_CKE power down to VDD_SOC power

down, minimal delay is 0ms, no max delay requirement.

I I I I I I I I I I VDD_SNVS_IN I I I I I I I I I I VDDiLPSRJN I m | I | NVCC_GPI01 | z E I | | chciGFIOZ I ' ' I I VDD_ARM l< ‘2="" i="" i="" i="" vdd_soc="" i="" ‘="" i="" '="" '="" i="" i="" vddajpsjn="" r="" e="" i="" i="" i="" chc_="">

Electrical characteristics

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NXP Semiconductors40

Figure 5. i.MX 7Dual power-down sequence

4.1.11 Power supplies usage

I/O pins should not be externally driven while the I/O power supply for the pin (NVCC_xxx) is OFF. This

can cause internal latch-up and malfunctions due to reverse current flows. For information about I/O power

supply of each pin, see “Power Rail” columns in pin list tables of Section 6, “Package information and

contact assignments.”

4.2 Integrated LDO voltage regulator parameters

Various internal supplies can be powered from internal LDO voltage regulators. All the supply pins named

*_CAP must be connected to external capacitors. The onboard LDOs are intended for internal use only

and should not be used to power any external circuitry. See the i.MX 7Dual Application Processor

Reference Manual (IMX7DRM) for details on the power tree scheme.

NOTE

The *_CAP signals must not be powered externally. The *_CAP pins are for

the bypass capacitor connection only.

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4.2.1 Internal regulators

4.2.1.1 LDO_1P2

The LDO_1P2 regulator implements a programmable linear-regulator function from VDDA_1P8_IN (see

Table 9 for minimum and maximum input requirements). The typical output of the LDO, VDD_1P2_CAP,

is 1.2 V. It is intended for use with the USB HSIC PHY, which uses this voltage level for its output driver.

For additional information, see the “Power Management Unit (PMU)” chapter of the i.MX 7Dual

Application Processor Reference Manual (IMX7DRM).

4.2.1.2 LDO_1P0D

The LDO_1P0D regulator implements a programmable linear-regulator function from VDDA_1P8_IN

(see Table 9 for minimum and maximum input requirements). The typical output of the LDO,

VDD_1P0D_CAP, is 1.0 V. It is intended for use with the internal physical interfaces, including MIPI and

PCIe PHY. For additional information, see the i.MX 7Dual Application Processor Reference Manual

(IMX7DRM).

4.2.1.3 LDO_1P0A

The LDO_1P0A regulator implements a programmable linear-regulator function from VDDA_1P8_IN

(see Table 9 for minimum and maximum input requirements). The typical output of the LDO,

VDD_1P0A_CAP, is 1.0 V. It is intended for use with the internal analog modules, including the XTAL,

ADC, PLL, and Temperature Sensor. For additional information, see the i.MX 7Dual Application

Processor Reference Manual (IMX7DRM).

4.2.1.4 LDO_USB1_1PO/LDO_USB2_1P0

The LDO_USB1_1P0/LDO_USB2_1P0 regulators implement a fixed linear-regulator function from

VDD_USB_OTG1_3P3_IN and VDD_USB_OTG2_3P3_IN power inputs respectively (see Table 9 for

minimum and maximum input requirements). The typical output voltage is 1.0 V. It is intended for use

with the internal USB physical interfaces (USB PHY1 and USB PHY2). For additional information, see

the i.MX 7Dual Application Processor Reference Manual (IMX7DRM).

Table 26. LDO parameters

Parameter Min Max Units

PVCC_GPIO_AT3P3_1P8 1.6 1.98 V

VDD_1P2 1.1 1.32 V

LPSR_1P0 0.95 1.155 V

VDDA_PHY_1P8 1.6 1.98 V

USB_OTG1_1P0 0.95 1.155 V

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4.2.1.5 LDO_SVNS_1P8

1.8 V LDO from coin cell to generate 1.8 V power for SNVS and 32 K RTC. The LDO_SNVS_1P8

regulator implements a fixed linear-regulator function from VDD_SNVS_IN (see Table 9 for minimum

and maximum input requirements). The typical output is 1.7 V. It is intended for use with the internal

SNVS circuitry and 32 K RTC. For additional information, see the i.MX 7Dual Application Processor

Reference Manual (IMX7DRM).

4.3 PLL electrical characteristics

4.4 On-chip oscillators

4.4.1 OSC24M

Power for the oscillator is supplied from a clean source of VDDA_1P8. This block implements an

amplifier that when combined with a suitable quartz crystal and external load capacitors implements an

oscillator. The oscillator is powered from VDDA_1P8.

Table 27. PLL Electrical Parameters

PLL type Parameter Value

AUDIO_PLL Clock output range 650 MHz–1.3 GHz

Reference clock 24 MHz

Lock time <11250 reference cycles

VIDEO_PLL Clock output range 650 MHz–1.3 GHz

Reference clock 24 MHz

Lock time <383 reference cycles

SYS_PLL Clock output range 480 MHz

Reference clock 24 MHz

Lock time <383 reference cycles

ENET_PLL Clock output range 650 MHz–1.3 GHz, set to 1.0 GHz

Reference clock 24 MHz

Lock time <11250 reference cycles

ARM_PLL Clock output range 800 MHz–1.2 GHz

Reference clock 24 MHz

Lock time <2250 reference cycles

DRAM_PLL Clock output range 800 MHz–1066 MHz

Reference clock 24 MHz

Lock time >2250 reference cycles

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The system crystal oscillator consists of a Pierce-type structure running off the digital supply. A straight

forward biased-inverter implementation is used.

4.4.2 OSC32K

This block implements an internal amplifier, trimable load capacitors and a resistor that when combined

with a suitable quartz crystal implements a low power oscillator.

In addition, if the clock monitor determines that the OSC32K is not present then the source of the 32 kHz

clock will automatically switch to the internal relaxation oscillator of lesser frequency accuracy.

CAUTION

The internal RTC oscillator does not provide an accurate frequency and is

affected by process, voltage and temperature variations. NXP strongly

recommends using an external crystal as the RTC_XTALI reference. If the

internal oscillator is used instead, careful consideration must be given to the

timing implications on all of the SoC modules dependent on this clock.

The OSC32k runs from VDD_SNVS_1p8_CAP, which is regulated from

VDD_SNVS. The target battery is an ~3 V coin cell for VDD_SNVS and

the regulated output is ~1.75V.

4.5 I/O DC parameters

This section includes the DC parameters of the following I/O types:

Table 28. OSC32K Main Characteristics

Min Typ Max Comments

Fosc — 32.768 KHz — This frequency is nominal and determined by the crystal selected. 32.0 K

would work as well.

Current consumption — 350 nA — The typical value shown is only for the oscillator, driven by an external

crystal. If the interrelaxation oscillator is used instead of an external crystal

then approximately 250 nA should be added to this value.

Bias resistor — 200 MΩThis is the integrated bias resistor that sets the amplifier into a high gain

state. Any leakage through the ESD network, external board leakage, or

even a scope probe that is significant relative to this value will debias the

amp. The debiasing will result in low gain and will impact the circuit's ability

to start up and maintain oscillations.

Target Crystal Properties

Cload — 10 pF — Usually, crystals can be purchased tuned for different Cload. This Cload

value is typically 1/2 of the capacitances realized on the PCB on either side

of the quartz. A higher Cload will decrease oscillation margin but increases

current oscillating through the crystal. The Cload is programmable in 2 pF

steps.

ESR — 50 KΩ— Equivalent series resistance of the crystal. Choosing a crystal with a higher

value will decrease oscillating margin.

Electrical characteristics

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• General Purpose I/O (GPIO)

• Double Data Rate I/O (DDR) for LPDDR3 and DDR3 modes

• Differential I/O (CCM_CLK1)

4.5.1 General purpose I/O (GPIO) DC parameters

Table 29 shows DC parameters for GPIO pads. The parameters in Table 29 are guaranteed per the

operating ranges in Table 9, unless otherwise noted.

4.5.2 DDR I/O DC electrical characteristics

The DDR I/O pads support DDR3/DDR3L, LPDDR2, and LPDDR3 operational modes. The DDR

Memory Controller (DDRMC) is designed to be compatible with JEDEC-compliant SDRAMs. The

DDRC supports the following memory types:

• DDR3 SDRAM compliant to JESD79-3E DDR3 JEDEC standard release July, 2010

• LPDDR2 SDRAM compliant to JESD209-2B LPDDR2 JEDEC standard release June, 2009

• LPDDR3 SDRAM compliant to JESD209-3B LPDDR3 JEDEC standard release August, 2013

Table 29. GPIO DC Parameters

Parameter Symbol Test Conditions Min Max Units

High-level output voltage V

= –1.8mA, –3.6mA, –7.2mA, –10.8mA 0.8 × OVDD OVDD V

Low-level output voltage V

=1.8mA, 3.6mA, 7.2mA, 10.8mA 0 0.2 × OVDD V

High-level input voltage V

—0.7 × OVDD OVDD + 0.3 V

Low-level input voltage V

—–0.30.3 × OVDD V

Input hysteresis V

HYS

—0.15—V

Pull-up resistor (5_kΩ PU) — V

= 1.8 ± 0.15 V 5.94 5.98 KΩ

Pull-up resistor (5_kΩ PU) — V

= 3.3 ± 0.3 V 4.8 5.3 KΩ

Pull-up resistor (47_kΩ PU) — V

= 1.8 ± 0.15 V 46.1 50.6 KΩ

Pull-up resistor (47_kΩ PU) — V

=3.3±0.3V 45.8 49.8 KΩ

Pull-up resistor (100_kΩ PU) — V

= 1.8 ± 0.15 V 97.5 105.9 KΩ

Pull-up resistor (100_kΩ PU) — V

= 3.3 ± 0.3 V 101 105 KΩ

Pull-down resistor (100_kΩ PU) — V

= 1.8 ± 0.15 V 101 108.6 KΩ

Pull-down resistor (100_kΩ PD) — V

= 3.3 ± 0.3 V 101 108 KΩ

Input current (no PU/PD) I

—–55μΑ

Sink/source current in Push-Pull

mode

— Driving currents (@100MHz,

/H = 0.5×OV

, SS, 125°C)

= 2.7 V

–32.9 32.9 mA

Electrical characteristics

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DDRMC operation with the standards stated above is contingent upon the board DDR design adherence

to the DDR design and layout requirements stated in the hardware development guide for the i.MX 7

application processor.

4.5.2.1 LPDDR3 mode I/O DC parameters

Table 30. DC input logic level

Characteristics Symbol Min Max Unit

DC input logic high

It is the relationship of the V

DDQ

of the driving device and the V

REF

of the receiving device that determines noise margins.

However, in the case of V

(DC) max (that is, input overdrive), it is the V

DDQ

of the receiving device that is referenced.

IH(DC)

REF

+100 — mV

DC input logic low

IL(DC)

—V

REF

–100

Table 31. Output DC current drive

Characteristics Symbol Min Max Unit

Output minimum source DC current

When DDS=[111] and without ZQ calibration.

(DC) –4 — mA

Output minimum sink DC current

(DC) 4 — mA

DC output high voltage(I

= –0.1mA)

1,2

The values of V

and V

are valid only for 1.2 V range.

0.9 × V

DDQ

—V

DC output low voltage(I

= 0.1mA)

1,2

—0.1 × V

DDQ

Table 32. Input DC current

Characteristics Symbol Min Max Unit

High level input current

1,2

The values of V

and V

are valid only for 1.2 V range.

Driver Hi-Z and input power-down (PD=High)

–25 25 μA

Low level input current

1,2

–25 25 μA

Table 33. LPDDR3 I/O DC electrical parameters

Parameters Symbol Test

Conditions Min Max Unit

High-level output voltage VOH Ioh= -0.1mA 0.9 ×OVDD — V

Low-level output voltage VOL Iol= 0.1mA — 0.1 ×OVDD V

Input Reference Voltage Vref — 0.49 ×OVDD 0.51 ×OVDD V

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4.5.3 Differential I/O port (CCM_CLK1P/N)

The clock I/O interface is designed to be compatible with TIA/EIA 644-A standard. See TIA/EIA

STANDARD 644-A, Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface

Circuits (2001), for details.

Table 34 shows the clock I/O DC parameters.

DC High-Level input voltage Vih_DC — VRef + 0.100 OVDD V

DC Low-Level input voltage Vil_DC — OVSS VRef – 0.100 V

Differential Input Logic High Vih_diff — 0.26 See note

—

Differential Input Logic Low Vil_diff — See note

-0.26 —

Pull-up/Pull-down Impedance Mismatch Mmpupd — –15 15 %

240 ?unit calibration resolution Rres — — 10 ?

Keeper Circuit Resistance Rkeep — 110 175 k?

Input current (no pull-up/down) Iin VI = 0, VI = OVDD -2.5 2.5 μA

The single-ended signals need to be within the respective limits (Vih(dc) max, Vil(dc) min) for single-ended signals as well as

the limitations for overshoot and undershoot.

Table 34. Differential clock I/O DC electrical characteristics

Symbol Parameter Test conditions Min Typ Max Unit Notes

Vod Output Differential Voltage Rload=100 Ω between padp

and padn

250 350 450 mV Vpadp–Vpadn

Voh High-level output voltage 1.025 1.175 1.325 V

Vol Low-level output voltage 0.675 0.825 0.975

Vocm Output common mode voltage 0.9 1 1.1 Core supply is used

Vid Input Differential Voltage 100 600 mV Vpadp–Vpadn

Vicm Input common mode voltage 50m 1.57 V Vicm(max)=ovdd(m

in)–Vid(min)/2

Icc-ovdd Tri-state I/O supply current ipp_ibe=ipp_obe=0 irefin

disabled (0uA)

0.46 uA

Table 33. LPDDR3 I/O DC electrical parameters(continued)

Parameters Symbol Test

Conditions Min Max Unit

«+1

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4.6 I/O AC parameters

This section includes the AC parameters of the following I/O types:

• General Purpose I/O (GPIO)

• Double Data Rate I/O (DDR) for LPDDR2, LPDDR3 and DDR3/DDR3L modes

• Differential I/O (CCM_CLK1)

The GPIO and DDR I/O load circuit and output transition time waveforms are shown in Figure 6 and

Figure 7.

Figure 6. Load circuit for output

Figure 7. Output transition time waveform

4.6.1 General purpose I/O AC parameters

This section presents the I/O AC parameters for GPIO in different modes. Note that the fast or slow I/O

behavior is determined by the appropriate control bits in the IOMUXC control registers.

Icc-ovdd-lp Tri-state I/O supply current in

low-power mode

ipp_pwr_stable_b_1p8 =1

(means 1.8 V)

vddi is OFF

irefin disabled (0 uA)

0.35 1 uA

Icc-vddi Tri-state core supply current ipp_ibe=ipp_obe=0

irefin disabled (0 uA)

0.8

Icc Power supply current (ovdd) Rload=100 Ω between padp

and padn

4.7 mA This is not including

current through

external

Rload=100 Ω

VOH_max = Vos_max + Vod_max/2 = 1.1+0.225 = 1.325 V. VOH_min = Vos_min + Vod_min/2 = 0.9+0.125 = 1.025 V.

VOL_max = Vos_max - Vod_min/2 = 1.1-0.125 = 0.975 V. VOL_min = Vos_min - Vod_max/2 = 0.9 - 0.225 = 0.675 V

Table 34. Differential clock I/O DC electrical characteristics(continued)

Symbol Parameter Test conditions Min Typ Max Unit Notes

Test Point

From Output

Under Test CL

CL includes package, probe and fixture capacitance

OVDD

20%

80% 80%

20%

tr tf

Output (at pad)

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Table 35. Maximum input cell delay time

Cell name

Max Delay PAD → Y (ns)

VDD=1.65 V

T=125°C

Process=Slow

VDD=2.3 V

T=125°C

Process=Slow

VDD=3.0 V

T=125°C

Process=Slow

PBIDIRPUD_E33_33_NT_DR 0.9 1.5 1.4

Table 36. Output cell delay time for fixed load

Parameter

Simulated Cell Delay A PAD (ns)

VDD = 1.65 V, T = 125°C VDD = 2.3 V, T = 125°C VDD = 3.0 V, T = 125°C

DS0 DS1 SR Driver Type CL=

5 pF

CL=

10 pF

CL=

40 pF

CL=

5 pF

CL=

10 pF

CL=

40 pF

CL=

5 pF

CL=

10 pF

CL=

40 pF

0011× Slow Slew 4.9 6.0 12.5 4.8 6.1 11.9 5.4 6.7 14.6

0001× Fast Slew 3.8 4.7 11.2 3.8 5.1 12.8 4.2 5.3 13.5

0112× Slow Slew 4.1 4.8 8.2 4.2 4.9 8.8 4.5 5.3 9.1

0102× Fast Slew 2.8 3.3 6.4 2.9 3.4 7.2 3.1 3.7 7.2

1014× Slow Slew 3.6 4.1 6.0 3.7 4.1 6.4 3.9 4.4 6.6

1004× Fast Slew 2.2 2.5 4.1 2.3 2.6 4.6 2.4 2.8 4.8

1116× Slow Slew 3.6 4.0 5.5 3.6 4.0 5.9 3.8 4.3 6.2

1106× Fast Slew 2.0 2.3 3.4 2.1 2.3 3.8 2.2 2.5 3.9

Table 37. Maximum frequency of operation for input

Maximum frequency (MHz)

VDD = 1.8 V, CL = 50 fF VDD=2.5 V, CL =5 0 fF VDD = 3.3 V, CL = 50 fF

550 400 430

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4.6.2 Clock I/O AC parameters—CCM_CLK1_N/CCM_CLK1_P

The differential output transition time waveform is shown in Figure 8.

Table 38. Maximum frequency of operation for output

Maximum frequency value is obtained with lumped capacitor load. If you consider transmission line or SSN noise

effect, it could be worse than suggested value.

Parameter

Maximum frequency (MHz)

VDD = 1.8 V VDD = 2.5 V VDD = 3.3 V

DS0 DS1 SR Driver Type CL=

5 pF

CL=

10 pF

CL=

40 pF

CL=

5 pF

CL=

10 pF

CL=

40 pF

CL=

5 pF

CL=

10 pF

CL=

40 pF

0011× Slow Slew 1007025906020956020

0001× Fast Slew 110 75 25 100 65 20 100 65 20

0112× Slow Slew 120 100 50 120 100 40 115 95 40

0102× Fast Slew 185 145 50 180 130 40 170 130 40

1014× Slow Slew 140 125 85 135 120 70 130 115 70

1004× Fast Slew 235 200 100 225 195 80 215 185 80

1116× Slow Slew 140 125 90 135 120 85 130 115 80

1106× Fast Slew 250 225 140 240 215 120 235 205 120

ov (amerential)

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Figure 8. Differential LVDS driver transition time waveform

Table 39 shows the AC parameters for clock I/O.

Table 39. I/O AC Parameters of LVDS Pad

Symbol Parameter Test conditions Min Typ Max Unit Notes

Tphld Output Differential propagation delay high to low Rload=100 Ω between padp and

padn,

Cload = 2pF

— — 0.61 ns

At WCS, 125C, 1.62 V ovdd, 0.9 V vddi. Measurement levels are 50-50%. Output differential signal measured.

Tplhd Output Differential propagation delay low to high — — 0.61

Ttlh Output Transition time low to high — — 0.17

WCS, 125C, 1.62 V ovdd, 0.9 V vddi. Measurement levels are 20-80%. Output differential signal measured

Tthl Output Transition time high to low — — 0.17

Tphlr Input Differential propagation delay high to low Rload=100 Ω between padp and

padn, Cload on ipp_ind=0.1 pF

— — 0.33 ns

At WCS, 125C, 1.62 V ovdd, 0.9 V vddi. Measurement levels are 50-50%.

Tplhr Input Differential propagation delay low to high — — 0.33

Ttx Transmitter startup time (ipp-obe low to high) — — — 40 ns

TX startup time is defined as the time taken by transmitter for settling after its ipp_obe has been asserted. It is to stabilize the

current reference. Functionality is guaranteed only after the startup time

F Operating frequency — — 500 1000 MHz —

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4.7 Output buffer impedance parameters

This section defines the I/O impedance parameters of the i.MX 7Dual family of processors for the

following I/O types:

• Double Data Rate I/O (DDR) for LPDDR2, LPDDR3, and DDR3/DDR3L modes

• Differential I/O (CCM_CLK1)

• USB battery charger detection open-drain output (USB_OTG1_CHD_B)

NOTE

DDR I/O output driver impedance is measured with “long” transmission

line of impedance Ztl attached to I/O pad and incident wave launched into

transmission line. Rpu/Rpd and Ztl form a voltage divider that defines

specific voltage of incident wave relative to OVDD. Output driver

impedance is calculated from this voltage divider (see Figure 9).

Electrical characteristics

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Figure 9. Impedance matching load for measurement

4.7.1 DDR I/O output buffer impedance

The LPDDR2 interface is designed to be fully compatible with JESD209-2B LPDDR2 JEDEC standard

release June, 2009. The LPDDR3 interface mode is designed to be compatible with JESD209-3B JEDEC

standard released August, 2013. The DDR3 interface is designed to be fully compatible with JESD79-3F

DDR3 JEDEC standard release July, 2012.

ipp_do

Cload = 1p

Ztl Ω, L = 20 inches

predriver

PMOS (Rpu)

NMOS (Rpd)

pad

OVDD

OVSS

t,(ns)

U,(V)

OVDD

t,(ns)

VDD Vin (do)

Vout ( pad )

U,(V)

Vref

Rpu = Vovdd - Vref1

Vref1 × Ztl

Rpd = × Ztl

Vref2

Vovdd - Vref2

Vref1 Vref2

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Table 40 shows DDR I/O output buffer impedance of i.MX 7Dual family of processors.

Note:

1. Output driver impedance is controlled across PVTs using ZQ calibration procedure.

2. Calibration is done against 240 Ω external reference resistor.

3. Output driver impedance deviation (calibration accuracy) is ±5% (max/min impedance) across PVTs.

4.7.2 Differential I/O output buffer impedance

The Differential CCM interface is designed to be compatible with TIA/EIA 644-A standard. See, TIA/EIA

STANDARD 644-A, Electrical Characteristics of Low Voltage Differential Signaling (LVDS) Interface

Circuits (2001) for details.

4.7.3 USB battery charger detection driver impedance

The USB_OTG1_CHD_B open-drain output pin can be used to signal the results of USB Battery Charger

detection routines for the USB_OTG1 PHY instance to power management and monitoring devices. Use

of this pin requires an external pullup resistor, for more information see Table 3, and Table 7.

Table 41 shows the USB_OTG1_CHD_B pulldown driver impedance for the USB_OTG1_CHD_B pin.

4.8 System modules timing

This section contains the timing and electrical parameters for the modules in each i.MX 7Dual processor.

Table 40. DDR I/O output buffer impedance

Parameter Symbol Test Conditions DSE

(Drive Strength)

Typical

Unit

NVCC_DRAM=1.5 V

(DDR3)

DDR_SEL=11

NVCC_DRAM=1.2 V

(LPDDR2)

DDR_SEL=10

Output Driver

Impedance Rdrv

000

001

010

011

100

101

110

111

Hi-Z

240

120

Hi-Z

240

120

Table 41. USB_OTG1_CHD_B pulldown driver impedance (VDD_USB_OTG1_3P3_IN 3.3 V)

Parameter Symbol Typical Unit

Open-drain output driver pulldown impedance Rdrv_pd 1000 Ω

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4.8.1 Reset timings parameters

Figure 10 shows the reset timing and Table 42 lists the timing parameters.

Figure 10. Reset timing diagram

4.8.2 WDOG Reset timing parameters

Figure 11 shows the WDOG reset timing and Table 43 lists the timing parameters.

Figure 11. WDOG

_B timing diagram

NOTE

RTC_XTALI is approximately 32 kHz. RTC_XTALI cycle is one period or

approximately 30 μs.

NOTE

WDOGx_B output signals (for each one of the Watchdog modules) do not

have dedicated pins, but are muxed out through the IOMUX. See the

IOMUXC chapter of the i.MX 7Dual Application Processor Reference

Manual (IMX7DRM) for detailed information.

4.8.3 External interface module (EIM)

The following subsections provide information on the EIM.

Table 42. Reset timing parameters

ID Parameter Min Max Unit

CC1 Duration of POR_B to be qualified as valid.

Note: POR_B rise/fall times must be 5 ns or less.

1—

RTC_XTALI cycle

Table 43. WDOG

_B timing parameters

ID Parameter Min Max Unit

CC3 Duration of WDOG1_B Assertion 1 —

RTC_XTALI cycle

POR_B

CC1

(Input)

WDOG

CC3

(Output)

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4.8.3.1 EIM interface pads allocation

EIM supports 16-bit and 8-bit devices operating in address/data separate or multiplexed modes. Table 44

provides EIM interface pads allocation in different modes.

Table 44. EIM internal module multiplexing

For more information on configuration ports mentioned in this table, see the

i.MX 7Dual Application Processor Reference

Manual

(IMX7DRM).

Setup

Non Multiplexed Address/Data Mode Multiplexed Address/

Data Mode

8 Bit 16 Bit 16 Bit

MUM = 0,

DSZ = 100

MUM = 0,

DSZ = 101

MUM = 0,

DSZ = 001

MUM = 1,

DSZ = 001

EIM_ADDR

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_AD

[15:00]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_ADDR

[25:16]

EIM_DATA

[07:00],

EIM_EB0_B

EIM_DATA

[07:00]

—EIM_DATA

[07:00]

EIM_AD

[07:00]

EIM_DATA

[15:08],

EIM_EB1_B

—EIM_DATA

[15:08]

EIM_DATA

[15:08]

EIM_AD

[15:08]

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4.8.3.2 General EIM Timing—Synchronous mode

Figure 12, Figure 13, and Table 45 specify the timings related to the EIM module. All EIM output control

signals may be asserted and deasserted by an internal clock synchronized to the EIM_BCLK rising edge

according to corresponding assertion/negation control fields.

Figure 12. EIM outputs timing diagram

Figure 13. EIM inputs timing diagram

WE4

EIM_ADDRxx

EIM_CSx_B

EIM_WE_B

EIM_OE_B

EIM_BCLK

EIM_EBx_B

EIM_LBA_B

Output Data

...

WE5

WE6 WE7

WE8 WE9

WE10 WE11

WE12 WE13

WE14 WE15

WE16 WE17

WE3

WE2

WE1

Input Data

EIM_WAIT_B

EIM_BCLK

WE19

WE18

WE21

WE20

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4.8.3.3 Examples of EIM synchronous accesses

Table 45. EIM bus timing parameters

ID Parameter

BCD = 0 BCD = 1 BCD = 2 BCD = 3

Min Max Min Max Min Max Min Max

WE1 EIM_BCLK Cycle

time

t — 2 x t — 3 x t — 4 x t —

WE2 EIM_BCLK Low

Level Width

0.4 x t — 0.8 x t — 1.2 x t — 1.6 x t —

WE3 EIM_BCLK High

Level Width

0.4 x t — 0.8 x t — 1.2 x t — 1.6 x t —

WE4 Clock rise to

address valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 -t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE5 Clock rise to

address invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE6 Clock rise to

EIM_CSx_B valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE7 Clock rise to

EIM_CSx_B invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE8 Clock rise to

EIM_WE_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE9 Clock rise to

EIM_WE_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE10 Clock rise to

EIM_OE_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE11 Clock rise to

EIM_OE_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE12 Clock rise to

EIM_EBx_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE13 Clock rise to

EIM_EBx_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE14 Clock rise to

EIM_LBA_B Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE15 Clock rise to

EIM_LBA_B Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE16 Clock rise to Output

Data Valid

-0.5 x t -

1.25

-0.5 x t + 1.75 -t - 1.25 - t + 1.75 -1.5 x t -

1.25

-1.5 x t

+1.75

-2 x t -

1.25

-2 x t + 1.75

WE17 Clock rise to Output

Data Invalid

0.5 x t - 1.25 0.5 x t + 1.75 t - 1.25 t + 1.75 1.5 x t -

1.25

1.5 x t +1.75 2 x t - 1.25 2 x t + 1.75

WE18 Input Data setup

time to Clock rise

2 — 4—————

WE19 Input Data hold time

from Clock rise

2 — 2—————

WE20 EIM_WAIT_B setup

time to Clock rise

2 — 4—————

WE21 EIM_WAIT_B hold

time from Clock rise

2 — 2—————

t # 1‘ f Hﬁ f T # f

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Figure 14 to Figure 17 provide few examples of basic EIM accesses to external memory devices with the

timing parameters mentioned previously for specific control parameters settings.

Figure 14. Synchronous memory read access, WSC=1

t is the maximum EIM logic (axi_clk) cycle time. The maximum allowed axi_clk frequency depends on the fixed/non-fixed

latency configuration, whereas the maximum allowed EIM_BCLK frequency is:

—Fixed latency for both read and write is 132 MHz.

—Variable latency for read only is 132 MHz.

—Variable latency for write only is 52 MHz.

In variable latency configuration for write, if BCD = 0 & WBCDD = 1 or BCD = 1, axi_clk must be 104 MHz. Write BCD = 1 and

104 MHz axi_clk, will result in a EIM_BCLK of 52 MHz. When the clock branch to EIM is decreased to 104 MHz, other buses

are impacted which are clocked from this source. See the CCM chapter of the

i.MX 7Dual Application Processor Reference

Manual

(IMX7DRM) for a detailed clock tree description.

EIM_BCLK parameters are being measured from the 50% point, that is, high is defined as 50% of signal value and low is

defined as 50% as signal value.

For signal measurements, “High” is defined as 80% of signal value and “Low” is defined as 20% of signal value.

Last Valid Address Address v1

D(v1)

EIM_BCLK

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE4 WE5

WE6 WE7

WE10 WE11

WE13

WE12

WE14

WE15

WE18

WE19

g {FF : LL 6 , fa , , a i u a a t a A J #3 k k e k k W Hm ,7 i : ,7\%47 # , W F a k g P k k ‘ \JL 4 a 4 a T\

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Figure 15. Synchronous memory, write access, WSC=1, WBEA=0 and WADVN=0

Figure 16. Muxed Address/Data (A/D) mode, synchronous write access, WSC=6, ADVA=0, ADVN=1, and

ADH=1

NOTE

In 32-bit Muxed Address/Data (A/D) mode the 16 MSBs are driven on the

data bus.

Last Valid Address Address V1

D(V1)

EIM_BCLK

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE4 WE5

WE6 WE7

WE8 WE9

WE12

WE13

WE14

WE15

WE16 WE17

EIM_BCLK

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Address V1 Write Data

WE4

WE16

WE6

WE7

WE9

WE8

WE10

WE11

WE14 WE15

WE17

WE5

Last Valid Address

EIM_ADDRxx/

EIM_ADxx

ﬂ ‘ m \ / mimm, , e :4

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Figure 17. 16-Bit Muxed A/D Mode, Synchronous Read Access, WSC=7, RADVN=1, ADH=1, OEA=0

4.8.3.4 General EIM timing—Asynchronous mode

Figure 18 through Figure 22, and Table 46 help you determine timing parameters relative to the chip

select (CS) state for asynchronous and DTACK EIM accesses with corresponding EIM bit fields and the

timing parameters mentioned above.

Asynchronous read & write access length in cycles may vary from what is shown in Figure 18 through

Figure 21 as RWSC, OEN and CSN is configured differently. See the i.MX 7Dual Application Processor

Reference Manual (IMX7DRM) for the EIM programming model.

Figure 18. Asynchronous memory read access (RWSC = 5)

Last

EIM_BCLK

EIM_ADDRxx/

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Address V1 Data

Valid Address

EIM_ADxx

WE5

WE6

WE7

WE14 WE15

WE10

WE11

WE12 WE13

WE18

WE19

WE4

Last Valid Address Address V1

D(V1)

EIM_ADDRxx/

EIM_DATAxx[7:0]

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE39

WE35

WE37

WE32

WE36

WE38

WE43

WE40

WE31

WE44

INT_CLK

start of

access

end of

access

MAXDI

MAXCSO

MAXCO

EIM_ADxx

/ mvmm x/ a k We a — ,1 W V 1» k 32, 33+i+ 4. 39+i+ o1 45+¥e 461 g. 4147*

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Figure 19. Asynchronous A/D muxed read access (RWSC = 5)

Figure 20. Asynchronous memory write access

Addr. V1 D(V1)

EIM_ADDRxx/

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE39

WE35A

WE37

WE36

WE38

WE40A

WE31

WE44

INT_CLK

start of

access

end of

access

MAXDI

MAXCSO

MAXCO

WE32A

EIM_ADxx

Last Valid Address Address V1

D(V1)

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE31

WE39

WE33

WE45

WE32

WE40

WE34

WE46

WE42

WE41

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Figure 21. Asynchronous A/D muxed write access

Figure 22. DTACK mode read access (DAP=0)

EIM_WE_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

WE33

WE45

WE34

WE46

WE42

Addr. V1 D(V1)

EIM_ADDRxx/

WE31

WE42

WE41

WE32A

EIM_DATAxx

EIM_LBA_B

WE39 WE40A

Last Valid Address Address V1

D(V1)

EIM_ADDRxx

EIM_DATAxx[7:0]

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE39

WE35

WE37

WE32

WE36

WE38

WE43

WE40

WE31

WE44

EIM_DTACK_B

WE47

WE48

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Figure 23. DTACK Mode write access (DAP=0)

Table 46. EIM asynchronous timing parameters table relative chip to select

Ref No. Parameter

Determination by

Synchronous measured

parameters

Min Max Unit

WE31 EIM_CSx_B valid to Address

Valid

WE4 – WE6 – CSA

— 3 – CSA ns

WE32 Address Invalid to EIM_CSx_B

invalid

WE7 – WE5 – CSN

—3 – CSNns

WE32A(m

uxed A/D

EIM_CSx_B valid to Address

Invalid

+ WE4 – WE7 + (ADVN

ADVA

+ 1 – CSA)

–3 + (ADVN +

ADVA + 1 – CSA)

—ns

WE33 EIM_CSx_B Valid to

EIM_WE_B Valid

WE8 – WE6 + (WEA – WCSA) — 3 + (WEA – WCSA) ns

WE34 EIM_WE_B Invalid to

EIM_CSx_B Invalid

WE7 – WE9 + (WEN – WCSN) — 3 + (WEN – WCSN) ns

WE35 EIM_CSx_B Valid to

EIM_OE_B Valid

WE10 – WE6 + (OEA – RCSA) — 3 + (OEA – RCSA) ns

WE35A

(muxed

A/D)

EIM_CSx_B Valid to

EIM_OE_B Valid

WE10 – WE6 + (OEA +

RADVN + RADVA + ADH + 1 –

RCSA)

–3 + (OEA +

RADVN+RADVA+

ADH+1–RCSA)

3 + (OEA +

RADVN+RADVA+AD

H+1–RCSA)

WE36 EIM_OE_B Invalid to

EIM_CSx_B Invalid

WE7 – WE11 + (OEN – RCSN) — 3 – (OEN – RCSN) ns

WE37 EIM_CSx_B Valid to

EIM_EBx_B Valid (Read

access)

WE12 – WE6 + (RBEA –

RCSA)

— 3 + (RBEA – RCSA) ns

Last Valid Address Address V1

D(V1)

EIM_ADDRxx

EIM_DATAxx

EIM_WE_B

EIM_LBA_B

EIM_OE_B

EIM_EBx_B

EIM_CSx_B

Next Address

WE31

WE39

WE33

WE45

WE32

WE40

WE34

WE46

WE42

WE41

EIM_DTACK_B

WE48

WE47

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WE38 EIM_EBx_B Invalid to

EIM_CSx_B Invalid (Read

access)

WE7 – WE13 + (RBEN –

RCSN)

— 3 – (RBEN– RCSN) ns

WE39 EIM_CSx_B Valid to

EIM_LBA_B Valid

WE14 – WE6 + (ADVA – CSA) — 3 + (ADVA – CSA) ns

WE40 EIM_LBA_B Invalid to

EIM_CSx_B Invalid (ADVL is

asserted)

WE7 – WE15 – CSN — 3 – CSN ns

WE40A

(muxed

A/D)

EIM_CSx_B Valid to

EIM_LBA_B Invalid

WE14 – WE6 + (ADVN + ADVA

+ 1 – CSA)

–3 + (ADVN +

ADVA + 1 – CSA)

3 + (ADVN + ADVA +

1 – CSA)

WE41 EIM_CSx_B Valid to Output

Data Valid

WE16 – WE6 – WCSA — 3 – WCSA ns

WE41A

(muxed

A/D)

EIM_CSx_B Valid to Output

Data Valid

WE16 – WE6 + (WADVN +

WADVA + ADH + 1 – WCSA)

— 3 + (WADVN +

WADVA + ADH + 1 –

WCSA)

WE42 Output Data Invalid to

EIM_CSx_B Invalid

WE17 – WE7 – CSN — 3 – CSN ns

MAXCO Output maximum delay from

internal driving

EIM_ADDRxx/control FFs to

chip outputs

10 — — ns

MAXCSO Output maximum delay from

CSx internal driving FFs to CSx

out

10 — — ns

MAXDI EIM_DATAxx maximum delay

from chip input data to its

internal FF

5——ns

WE43 Input Data Valid to EIM_CSx_B

Invalid

MAXCO – MAXCSO + MAXDI MAXCO –

MAXCSO +

MAXDI

—ns

WE44 EIM_CSx_B Invalid to Input

Data invalid

00—ns

WE45 EIM_CSx_B Valid to

EIM_EBx_B Valid (Write

access)

WE12 – WE6 + (WBEA –

WCSA)

— 3 + (WBEA – WCSA) ns

WE46 EIM_EBx_B Invalid to

EIM_CSx_B Invalid (Write

access)

WE7 – WE13 + (WBEN –

WCSN)

— –3 + (WBEN –

WCSN)

Table 46. EIM asynchronous timing parameters table relative chip to select(continued)

Ref No. Parameter

Determination by

Synchronous measured

parameters

Min Max Unit

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MAXDTI MAXIMUM delay from

EIM_DTACK_B to its internal

FF + 2 cycles for

synchronization

10 — — ns

WE47 EIM_DTACK_B Active to

EIM_CSx_B Invalid

MAXCO – MAXCSO +

MAXDTI

MAXCO –

MAXCSO +

MAXDTI

—ns

WE48 EIM_CSx_B Invalid to

EIM_DTACK_B Invalid

00—ns

For more information on configuration parameters mentioned in this table, see the

i.MX 7Dual Application Processor Reference

Manual

(IMX7DRM).

In this table, CSA means WCSA when write operation or RCSA when read operation.

In this table, CSN means WCSN when write operation or RCSN when read operation.

t is axi_clk cycle time.

In this table, ADVN means WADVN when write operation or RADVN when read operation.

In this table, ADVA means WADVA when write operation or RADVA when read operation.

Table 46. EIM asynchronous timing parameters table relative chip to select(continued)

Ref No. Parameter

Determination by

Synchronous measured

parameters

Min Max Unit

| p | | | |¢ ROW/EA COUBA 1

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4.8.4 DDR SDRAM-specific parameters (DDR3, DDR3L, LPDDR3, and

LPDDR2)

4.8.4.1 DDR3/DDR3L parameters

Figure 24 shows the DDR3 basic timing diagram with the timing parameters provided in Table 47.

Figure 24. DDR3 Command and Address Timing Diagram

Table 47. DDR3 timing parameters

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

DDR1 DRAM_SDCLKx_P clock high-level width t

0.47 0.53 t

DDR2 DRAM_SDCLKx_P clock low-level width t

0.47 0.53 t

DDR4 DRAM_CSx_B, DRAM_RAS_B, DRAM_CAS_B, DRAM_SDCKE, DRAM_SDWE_B,

DRAM_SDODTx setup time

425 — ps

DDR5 DRAM_CSx_B, DRAM_RAS_B, DRAM_CAS_B, DRAM_SDCKE, DRAM_SDWE_B,

DRAM_SDODTx hold time

375 — ps

DDR6 Address output setup time t

425 — ps

DDR7 Address output hold time t

375 — ps

DRAM_SDWE_B

DRAM_ADDRxx ROW/BA COL/BA

DDR1

DDR2

DDR4

DDR5

DDR6 DDR7

DRAM_SDCLKx_P

DRAM_

ODTx /

DDR4

DRAM_SDCKEx

DRAM_SDCLKx_N

DRAM_CSx_B

DRAM_RAS_B

DRAM_CAS_B

DDR4

‘ 1> >

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All measurements are in reference to Vref level.

Measurements were done using balanced load and 25

resistor from outputs to VDD_REF.

Figure 25 shows the DDR3 write timing diagram. The timing parameters for this diagram appear in

Table 48.

Figure 25. DDR3 write cycle

To receive the reported setup and hold values, write calibration should be performed in order to locate the

DRAM_SDQSx_P

the middle of DRAM_DATAxx window.

All measurements are in reference to Vref level.

Measurements were taken using balanced load and 25

resistor from outputs to DDR_VREF.

Table 48. DDR3 write cycle

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

DDR17 DRAM_DATAxx and DRAM_DQMx setup time to

DRAM_SDQSx_P

(differential strobe)

225 — ps

DDR18 DRAM_DATAxx and DRAM_DQMx hold time to

DRAM_SDQSx_P

(differential strobe)

250 — ps

DDR21

DRAM_SDQSx_P

latching rising transitions to associated clock edges t

DQSS

-0.25 +0.25 tCK

DDR22

DRAM_SDQSx_P

high level width t

DQSH

0.45 0.55 tCK

DDR23

DRAM_SDQSx_P

low level width t

DQSL

0.45 0.55 tCK

DRAM_SDCLKx_P

DRAM_SDCLKx_N

DRAM_SDQSx_P

DRAM_DATAxx

DRAM_DQMx

Data Data Data Data Data Data Data Data

DM DM DM DM DM DM DM DM

DDR17

DDR18 DDR18

DDR21 DDR23

DDR22

(output)

Mmm/ \I / \ } m} DRAMstB " ”’4 “ Hun.» LPS" ‘— <—lp5 dram="" sdckex="" 4.="" -=""> LP3 LPG + LP: DFIAM_CAS_B , LP“, » LP4¢

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i.MX 7Dual Family of Applications Processors Datasheet,

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NXP Semiconductors68

Figure 26 shows the DDR3 read timing diagram. The timing parameters for this diagram appear in

Table 49.

Figure 26. DDR3 read cycle

To receive the reported setup and hold values, read calibration should be performed in order to locate the DRAM_SDQSx_P

in the middle of DRAM_DATAxx window.

All measurements are in reference to Vref level.

Measurements were done using balanced load and 25

resistor from outputs to VDD_REF.

4.8.4.2 LPDDR3 parameters

Figure 27 shows the LPDDR3 basic timing diagram. The timing parameters for this diagram appear in

Table 50.

Figure 27. LPDDR3 command and address timing diagram

Table 49. DDR3 read cycle

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

DDR26 Minimum required DRAM_DATAxx valid window width — 510 — ps

DRAM_SDCLKx_P

DRAM_SDCLKx_N

DRAM_SDQSx_P

DRAM_DATAxx

DATA

DATADATA

DATA

DATADATA

DDR26

(input)

DRAMjDCLKLPJ \ / DRAM_SDCLKx_N—\ I LP2I> 4 DRAMjDCLKLP (oulM) LPI7> DRAM_DAT (MM) DHAM_DQMx (mum) LP17

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NXP Semiconductors 69

Figure 28 shows the LPDDR3 write timing diagram. The timing parameters for this diagram appear in

Table 51.

Figure 28. LPDDR3 write cycle

Table 50. LPDDR3 timing parameters

1,2

All measurements are in reference to V

ref

level.

Measurements were done using balanced load and 25

resistor from outputs to DDR_VREF.

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

LP1 SDRAM clock high-level width t

0.45 0.55 t

LP2 SDRAM clock low-level width t

0.45 0.55 t

LP3 DRAM_CSx_B t

390 — ps

LP4 DRAM_CSx_E t

390 — ps

LP3 DRAM_CAS_B setup time t

275 — ps

LP4 DRAM_CAS_B hold time t

275 — ps

DRAM_SDCLKx_P / \ DRAM_SDCLKx_N \ I DRAM_SDQSX_P (inpul) DRlMiDATAxx (inpul; mi w+ DlTi

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NXP Semiconductors70

Figure 29 shows the LPDDR3 read timing diagram. The timing parameters for this diagram appear in

Table 52.

Figure 29. LPDDR3 read cycle

Table 51. LPDDR3 write cycle

1,2,3

To receive the reported setup and hold values, write calibration should be performed in order to locate the DRAM_SDQS in

the middle of DRAM_DATAxx window.

All measurements are in reference to V

ref

level.

Measurements were done using balanced load and 25

resistor from outputs to DDR_VREF.

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

LP17 DRAM_DATAxx and DRAM_DQMx setup time to DRAM_SDQSx_P

(differential strobe)

275 — ps

LP18 DRAM_DATAxx and DRAM_DQMx hold time to DRAM_SDQSx_P

(differential strobe)

275 — ps

LP21 DRAM_SDQSx_P latching rising transitions to associated clock edges t

DQSS

-0.25 +0.25 t

LP22 DRAM_SDQSx_P high level width t

DQSH

0.4 — t

LP23 DRAM_SDQSx_P low level width t

DQSL

0.4 — t

Table 52. LPDDR3 read cycle

1,2,3

To receive the reported setup and hold values, read calibration should be performed in order to locate the DRAM_SDQSx_P

in the middle of DRAM_DATA_xx window.

All measurements are in reference to V

ref

level.

Measurements were done using balanced load and 25

resistor from outputs to DDR_VREF.

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

LP26 Minimum required DRAM_DATAxx valid window width for LPDDR3 — 460 — ps

/\/})Lj \ \ /

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NXP Semiconductors 71

4.8.4.3 LPDDR2 parameters

Figure 30 shows the LPDDR2 basic timing diagram. The timing parameters for this diagram appear in

Table 53.

Figure 30. LPDDR2 command and address timing diagram

Table 53. LPDDR2 timing parameters

1,2

All measurements are in reference to Vref level.

Measurements were done using balanced load and 25

resistor from outputs to DDR_VREF

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

LP1 SDRAM clock high-level width t

0.45 0.55 t

LP2 SDRAM clock low-level width t

0.45 0.55 t

LP3 DRAM_CSx_B, DRAM_SDCKEx setup time t

370 — ps

LP4 DRAM_CSx_B, DRAM_SDCKEx hold time t

370 — ps

LP3 DRAM_CAS_B setup time t

770 — ps

LP4 DRAM_CAS_B hold time t

770 — ps

DRAM_SDCLKx_P

DRAM_CSx_B

DRAM_SDCKEx

DRAM_CAS_B

LP4

LP3

LP4

LP3

LP2

LP3

LP1

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Figure 31 shows the LPDDR2 write timing diagram. The timing parameters for this diagram appear in

Table 54.

Figure 31. LPDDR2 write cycle

To receive the reported setup and hold values, write calibration should be performed in order to locate the DRAM_SDQS in

the middle of DRAM_DATAxx window.

All measurements are in reference to Vref level.

Measurements were done using balanced load and 25

resistor from outputs to DDR_VREF.

Table 54. LPDDR2 write cycle

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

LP17 DRAM_DATAxx and DRAM_DQMx setup time to DRAM_SDQSx_P

(differential strobe)

360 — ps

LP18 DRAM_DATAxx and DRAM_DQMx hold time to DRAM_SDQSx_P

(differential strobe)

360 — ps

LP21 DRAM_SDQSx_P latching rising transitions to associated clock edges t

DQSS

-0.25 +0.25 tCK

LP22 DRAM_SDQSx_P high level width t

DQSH

0.4 — tCK

LP23 DRAM_SDQSx_P low level width t

DQSL

0.4 — tCK

DRAM_SDCLKx_P

DRAM_SDCLKx_N

DRAM_SDCLKx_P

DRAM_DATAxx

DRAM_DQMx

Data Data Data Data Data Data Data Data

DM DM DM DM DM DM DM DM

LP17

LP18

LP18 LP18

LP21

LP23

LP22

(output)

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NXP Semiconductors 73

Figure 32 shows the LPDDR2 read timing diagram. The timing parameters for this diagram appear in

Table 55.

Figure 32. LPDDR2 read cycle

To receive the reported setup and hold values, read calibration should be performed in order to locate the DRAM_SDQSx_P

in the middle of DRAM_DATA_xx window.

All measurements are in reference to Vref level.

Measurements were done using balanced load and 25

resistor from outputs to DDR_VREF.

4.9 General-purpose media interface (GPMI) timing

The i.MX 7Dual GPMI controller is a flexible interface NAND Flash controller with 8-bit data width, up

to 200 MB/s I/O speed and individual chip select.

It supports Asynchronous Timing mode, Source Synchronous Timing mode and Toggle Timing mode

separately, as described in the following subsections.

4.9.1 Asynchronous mode AC timing (ONFI 1.0 compatible)

Asynchronous mode AC timings are provided as multiplications of the clock cycle and fixed delay. The

maximum I/O speed of GPMI in asynchronous mode is about 50 MB/s. Figure 33 through Figure 36

depicts the relative timing between GPMI signals at the module level for different operations under

asynchronous mode. Table 56 describes the timing parameters (NF1–NF17) that are shown in the figures.

Table 55. LPDDR2 read cycle

ID Parameter Symbol

CK = 533 MHz

Unit

Min Max

LP26 Minimum required DRAM_DATAxx valid window width for LPDDR2 — 230 — ps

DRAM_SDCLKx_P

DRAM_SDCLKx_N

DRAM_SDQSx_P

DRAM_DATAxx

DATA

DATADATA

DATA

DATADATA

LP26

(input)

,__.:._ 4, 3—:

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Figure 33. Command Latch cycle timing diagram

Figure 34. Address Latch cycle timing diagram

Figure 35. Write Data Latch cycle timing diagram

Figure 36. Read Data Latch cycle timing diagram (Non-EDO Mode)

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Figure 37. Read Data Latch cycle timing diagram (EDO mode)

Table 56. Asynchronous mode timing parameters

GPMI’s Asynchronous mode output timing can be controlled by the module’s internal registers

HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.

This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min. Max.

NF1 NAND_CLE setup time tCLS (AS + DS)

T - 0.12 [see notes

2,3

]

AS minimum value can be 0, while DS/DH minimum value is 1.

T = GPMI clock period -0.075ns (half of maximum p-p jitter).

NF2 NAND_CLE hold time tCLH DH

T - 0.72 [see note

]ns

NF3 NAND_CE0_B setup time tCS (AS + DS + 1)

T [see notes

3,2

]ns

NF4 NAND_CE0_B hold time tCH (DH+1)

T - 1 [see note

]ns

NF5 NAND_WE_B pulse width tWP DS

T [see note

]ns

NF6 NAND_ALE setup time tALS (AS + DS)

T - 0.49 [see notes

3,2

]ns

NF7 NAND_ALE hold time tALH (DH

T - 0.42 [see note

]ns

NF8 Data setup time tDS DS

T - 0.26 [see note

]ns

NF9 Data hold time tDH DH

T - 1.37 [see note

]ns

NF10 Write cycle time tWC (DS + DH)

T [see note

]ns

NF11 NAND_WE_B hold time tWH DH

T [see note

]ns

NF12 Ready to NAND_RE_B low tRR

NF12 is guaranteed by the design.

(AS + 2)

T [see

3,2

]—ns

NF13 NAND_RE_B pulse width tRP DS

T [see note

]ns

NF14 READ cycle time tRC (DS + DH)

T [see note

]ns

NF15 NAND_RE_B high hold time tREH DH

T [see note

]ns

NF16 Data setup on read tDSR — (DS

T -0.67)/18.38 [see

notes

5,6

]

Non-EDO mode.

EDO mode, GPMI clock

≈

100 MHz

(AS=DS=DH=1, GPMI_CTL1 [RDN_DELAY] = 8, GPMI_CTL1 [HALF_PERIOD] = 0).

NF17 Data hold on read tDHR 0.82/11.83 [see notes

5,6

]—ns

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In EDO mode (Figure 36), NF16/NF17 are different from the definition in non-EDO mode (Figure 35).

They are called tREA/tRHOH (RE# access time/RE# HIGH to output hold). The typical value for them

are 16 ns (max for tREA)/15 ns (min for tRHOH) at 50 MB/s EDO mode. In EDO mode, GPMI will

sample NAND_DATAxx at rising edge of delayed NAND_RE_B provided by an internal DPLL. The

delay value can be controlled by GPMI_CTRL1.RDN_DELAY (see the GPMI chapter of the i.MX 7Dual

Application Processor Reference Manual [IMX7DRM]). The typical value of this control register is 0x8

at 50 MT/s EDO mode. But if the board delay is big enough and cannot be ignored, the delay value should

be made larger to compensate the board delay.

4.9.2 Source Synchronous mode AC timing (ONFI 2.x compatible)

Figure 38 to Figure 40 show the write and read timing of Source Synchronous mode.

Figure 38. Source Synchronous mode command and address timing diagram

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NXP Semiconductors 77

Figure 39. Source Synchronous mode data write timing diagram

Figure 40. Source Synchronous mode data read timing diagram

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Figure 41. NAND_DQS/NAND_DQ Read Valid window

For DDR Source Synchronous mode, Figure 41 shows the timing diagram of

NAND_DQS/NAND_DATAxx read valid window. The typical value of tDQSQ is 0.85 ns (max) and 1 ns

(max) for tQHS at 200 MB/s. GPMI will sample NAND_DATA[7:0] at both rising and falling edge of an

delayed NAND_DQS signal, which can be provided by an internal DPLL. The delay value can be

controlled by GPMI register GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI

chapter of the i.MX 7Dual Application Processor Reference Manual [IMX7DRM]). Generally, the typical

delay value of this register is equal to 0x7 which means 1/4 clock cycle delay expected. But if the board

delay is big enough and cannot be ignored, the delay value should be made larger to compensate the board

delay.

Table 57. Source Synchronous mode timing parameters

GPMI’s Source Synchronous mode output timing can be controlled by the module’s internal registers

GPMI_TIMING2_CE_DELAY, GPMI_TIMING_PREAMBLE_DELAY, GPMI_TIMING2_POST_DELAY. This AC timing

depends on these registers settings. In the table, CE_DELAY/PRE_DELAY/POST_DELAY represents each of these settings.

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min. Max.

NF18 NAND_CE0_B access time tCE CE_DELAY

T - 0.79 [see note

]

T = tCK(GPMI clock period) –0.075 ns (half of maximum p-p jitter).

NF19 NAND_CE0_B hold time tCH 0.5

tCK - 0.63 [see note

]ns

NF20 Command/address NAND_DATAxx setup time tCAS 0.5

tCK - 0.05 ns

NF21 Command/address NAND_DATAxx hold time tCAH 0.5

tCK - 1.23 ns

NF22 clock period tCK — ns

NF23 preamble delay tPRE PRE_DELAY

T - 0.29 [see note

]ns

NF24 postamble delay tPOST POST_DELAY

T - 0.78 [see note

]ns

NF25 NAND_CLE and NAND_ALE setup time tCALS 0.5

tCK - 0.86 ns

NF26 NAND_CLE and NAND_ALE hold time tCALH 0.5

tCK - 0.37 ns

NF27 NAND_CLK to first NAND_DQS latching transition tDQSS T - 0.41 [see note

]ns

NF28 Data write setup 0.25

tCK - 0.35

NF29 Data write hold 0.25

tCK - 0.85

NF30 NAND_DQS/NAND_DQ read setup skew — 2.06

NF31 NAND_DQS/NAND_DQ read hold skew — 1.95

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4.9.3 ONFI NV-DDR2 mode (ONFI 3.2 compatible)

4.9.3.1 Command and address timing

ONFI 3.2 mode command and address timing is the same as ONFI 1.0 compatible Async mode AC timing.

See Section 4.9.1, “Asynchronous mode AC timing (ONFI 1.0 compatible),” for details.

4.9.3.2 Read and write timing

ONFI 3.2 mode read and write timing is the same as Toggle mode AC timing. See Section 4.9.4, “Toggle

mode AC Timing,” for details.

4.9.4 Toggle mode AC Timing

4.9.4.1 Command and address timing

NOTE

Toggle mode command and address timing is the same as ONFI 1.0

compatible Asynchronous mode AC timing. See Section 4.9.1,

“Asynchronous mode AC timing (ONFI 1.0 compatible),” for details.

4.9.4.2 Read and write timing

Figure 42. Toggle mode data write timing

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Figure 43. Toggle mode data read timing

Table 58. Toggle mode timing parameters

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min. Max.

NF1 NAND_CLE setup time tCLS (AS + DS)

T - 0.12 [see note

]

NF2 NAND_CLE hold time tCLH DH

T - 0.72 [see note

]

NF3 NAND_CE0_B setup time tCS (AS + DS)

T - 0.58 [see notes

]

NF4 NAND_CE0_B hold time tCH DH

T - 1 [see note

]

NF5 NAND_WE_B pulse width tWP DS

T [see note

]

NF6 NAND_ALE setup time tALS (AS + DS)

T - 0.49 [see notes

]

NF7 NAND_ALE hold time tALH DH

T - 0.42 [see note

]

NF8 Command/address NAND_DATAxx setup time tCAS DS

T - 0.26 [see note

]

NF9 Command/address NAND_DATAxx hold time tCAH DH

T - 1.37 [see note

]

NF18 NAND_CEx_B access time tCE CE_DELAY

T [see notes

4,2

]—ns

NF22 clock period tCK — — ns

NF23 preamble delay tPRE PRE_DELAY

T [see notes

5,2

]— ns

NF24 postamble delay tPOST POST_DELAY

T +0.43 [see

note

]

—ns

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For DDR Toggle mode, Figure 41 shows the timing diagram of NAND_DQS/NAND_DATAxx read valid

window. The typical value of tDQSQ is 1.4 ns (max) and 1.4 ns (max) for tQHS at 133 MB/s. GPMI will

sample NAND_DATA[7:0] at both rising and falling edge of an delayed NAND_DQS signal, which is

provided by an internal DPLL. The delay value of this register can be controlled by GPMI register

GPMI_READ_DDR_DLL_CTRL.SLV_DLY_TARGET (see the GPMI chapter of the i.MX 7Dual

Application Processor Reference Manual [IMX7DRM]). Generally, the typical delay value is equal to 0x7

which means 1/4 clock cycle delay expected. But if the board delay is big enough and cannot be ignored,

the delay value should be made larger to compensate the board delay.

4.10 External peripheral interface parameters

The following subsections provide information on external peripheral interfaces.

4.10.1 ECSPI timing parameters

This section describes the timing parameters of the ECSPI blocks. The ECSPI have separate timing

parameters for master and slave modes.

NF28 Data write setup tDS

0.25

tCK - 0.32 — ns

NF29 Data write hold tDH

0.25

tCK - 0.79 — ns

NF30 NAND_DQS/NAND_DQ read setup skew tDQSQ

—3.18

NF31 NAND_DQS/NAND_DQ read hold skew tQHS

—3.27

The GPMI toggle mode output timing can be controlled by the module’s internal registers

HW_GPMI_TIMING0_ADDRESS_SETUP, HW_GPMI_TIMING0_DATA_SETUP, and HW_GPMI_TIMING0_DATA_HOLD.

This AC timing depends on these registers settings. In the table, AS/DS/DH represents each of these settings.

AS minimum value can be 0, while DS/DH minimum value is 1.

T = tCK (GPMI clock period) -0.075 ns (half of maximum p-p jitter).

CE_DELAY represents HW_GPMI_TIMING2[CE_DELAY]. NF18 is guaranteed by the design. Read/Write operation is started

with enough time of ALE/CLE assertion to low level.

PRE_DELAY+1)

≥

(AS+DS)

Shown in Figure 42.

Shown in Figure 43.

Table 58. Toggle mode timing parameters

(continued)

ID Parameter Symbol

Timing

T = GPMI Clock Cycle Unit

Min. Max.

‘1,“ a w f1m‘ if 1m 4%

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4.10.1.1 ECSPI Master mode timing

Figure 44 depicts the timing of ECSPI in master mode. Table 59 lists the ECSPI master mode timing

characteristics.

Figure 44. ECSPI Master mode timing diagram

Table 59. ECSPI Master mode timing parameters

ID Parameter Symbol Min Max Unit

CS1 ECSPIx_SCLK Cycle Time–Read

ECSPIx_SCLK Cycle Time–Write

clk

—ns

CS2 ECSPIx_SCLK High or Low Time–Read

ECSPIx_SCLK High or Low Time–Write

21.5

—ns

CS3 ECSPIx_SCLK Rise or Fall

See specific I/O AC parameters Section 4.6, “I/O AC parameters.”

RISE/FALL

——ns

CS4 ECSPIx_SS_B pulse width t

CSLH

Half ECSPIx_SCLK period — ns

CS5 ECSPIx_SS_B Lead Time (CS setup time) t

SCS

Half ECSPIx_SCLK period - 4 — ns

CS6 ECSPIx_SS_B Lag Time (CS hold time) t

HCS

Half ECSPIx_SCLK period - 2 — ns

CS7 ECSPIx_MOSI Propagation Delay (C

LOAD

=20pF) t

PDmosi

-1 1 ns

CS8 ECSPIx_MISO Setup Time t

Smiso

18 — ns

CS9 ECSPIx_MISO Hold Time t

Hmiso

0—ns

CS10 RDY to ECSPIx_SS_B Time

SPI_RDY is sampled internally by ipg_clk and is asynchronous to all other CSPI signals.

SDRY

5—ns

CS7

CS2

CS4

CS6 CS5

CS8 CS9

ECSPIx_SCLK

ECSPIx_SS_B

ECSPIx_MOSI

ECSPIx_MISO

ECSPIx_RDY_B

CS10

CS3

CS1

Electrical characteristics

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NXP Semiconductors 83

4.10.1.2 ECSPI Slave mode timing

Figure 45 depicts the timing of ECSPI in Slave mode. Table 60 lists the ECSPI Slave mode timing

characteristics.

Figure 45. ECSPI Slave mode timing diagram

Table 60. ECSPI Slave mode timing parameters

ID Parameter Symbol Min Max Unit

CS1 ECSPIx_SCLK Cycle Time–Read

ECSPI_SCLK Cycle Time–Write

clk

—ns

CS2 ECSPIx_SCLK High or Low Time–Read

ECSPIx_SCLK High or Low Time–Write

21.5

—ns

CS4 ECSPIx_SS_B pulse width t

CSLH

Half ECSPIx_SCLK period — ns

CS5 ECSPIx_SS_B Lead Time (CS setup time) t

SCS

5—ns

CS6 ECSPIx_SS_B Lag Time (CS hold time) t

HCS

5—ns

CS7 ECSPIx_MOSI Setup Time t

Smosi

4—ns

CS8 ECSPIx_MOSI Hold Time t

Hmosi

4—ns

CS9 ECSPIx_MISO Propagation Delay (C

LOAD

=20pF) t

PDmiso

419ns

CS1

CS7 CS8

CS2

CS4

CS6 CS5

CS9

ECSPIx_SCLK

ECSPIx_SS_B

ECSPIx_MISO

ECSPIx_MOSI

W ij % Hf ’m

Electrical characteristics

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NXP Semiconductors84

4.10.2

Ultra-high-speed SD/SDIO/MMC host interface (uSDHC)

timing

This section describes the electrical information of the uSDHC, which includes SD/eMMC4.3 (single data

rate) timing, eMMC4.4/4.41 (dual data rate) timing and SDR104/50(SD3.0) timing.

4.10.2.1 SD/eMMC4.3 (single data rate) AC timing

Figure 46 depicts the timing of SD/eMMC4.3, and Table 61 lists the SD/eMMC4.3 timing characteristics.

Figure 46. SD/eMMC4.3 Timing

Table 61. SD/eMMC4.3 interface timing specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency (Low Speed) f

PP1

0400kHz

Clock Frequency (SD/SDIO Full Speed/High Speed) f

PP2

0 25/50 MHz

Clock Frequency (MMC Full Speed/High Speed) f

PP3

0 20/52 MHz

Clock Frequency (Identification Mode) f

100 400 kHz

SD2 Clock Low Time t

7—ns

SD3 Clock High Time t

7—ns

SD4 Clock Rise Time t

TLH

—3ns

SD5 Clock Fall Time t

THL

—3ns

uSDHC Output/Card Inputs SD_CMD, SDx_DATAx (Reference to CLK)

SD6 uSDHC Output Delay t

-6.6 3.6 ns

SD1

SD3

SD5

SD4

SD7

SDx_CLK

SD2

SD8

SD6

Output from uSDHC to card

Input from card to uSDHC

SDx_DATA[7:0]

Electrical characteristics

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NXP Semiconductors 85

4.10.2.2 eMMC4.4/4.41 (dual data rate) AC timing

Figure 47 depicts the timing of eMMC4.4/4.41. Table 62 lists the eMMC4.4/4.41 timing characteristics.

Be aware that only DATA is sampled on both edges of the clock (not applicable to CMD).

Figure 47. eMMC4.4/4.41 timing

uSDHC Input/Card Outputs SD_CMD, SDx_DATAx (Reference to CLK)

SD7 uSDHC Input Setup Time t

ISU

2.5 — ns

SD8 uSDHC Input Hold Time

1.5 — ns

In Low-Speed mode, card clock must be lower than 400 kHz, voltage ranges from 2.7 to 3.6 V.

In Normal (Full) -Speed mode for SD/SDIO card, clock frequency can be any value between 0

–

25 MHz. In High-speed mode,

clock frequency can be any value between 0

–

50 MHz.

In Normal (Full) -Speed mode for MMC card, clock frequency can be any value between 0

–

20 MHz. In High-speed mode,

clock frequency can be any value between 0

–

52 MHz.

To satisfy hold timing, the delay difference between clock input and cmd/data input must not exceed 2 ns.

Table 62. eMMC4.4/4.41 interface timing specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency (eMMC4.4/4.41 DDR) f

052MHz

SD1 Clock Frequency (SD3.0 DDR) f

050MHz

uSDHC Output / Card Inputs SD_CMD, SDx_DATAx (Reference to CLK)

SD2 uSDHC Output Delay t

2.7 6.9 ns

uSDHC Input / Card Outputs SD_CMD, SDx_DATAx (Reference to CLK)

Table 61. SD/eMMC4.3 interface timing specification(continued)

ID Parameter Symbols Min Max Unit

SD1

SD2

SD3

Output from eSDHCv3 to card

Input from card to eSDHCv3

SDx_DATA[7:0]

SDx_CLK

SD4

SD2

......

SDx_DATA[7:0]

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Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet,

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NXP Semiconductors86

4.10.2.3 HS400 AC timing—eMMC5.0 only

Figure 48 depicts the timing of HS400. Table 63 lists the HS400 timing characteristics. Be aware that only

data is sampled on both edges of the clock (not applicable to CMD).

The CMD input/output timing for

HS400 mode is the same as CMD input/output timing for SDR104 mode. Check SD5, SD6 and SD7

parameters in Table 65 SDR50/SDR104 Interface Timing Specification for CMD input/output timing for

HS400 mode.

Figure 48. HS400 timing

SD3 uSDHC Input Setup Time t

ISU

2.4 — ns

SD4 uSDHC Input Hold Time t

1.3 — ns

Table 63. HS400 interface timing specifications

ID Parameter Symbols Min Max Unit

Card Input clock

SD1 Clock Frequency fPP 0 200 Mhz

SD2 Clock Low Time t

0.46

CLK

0.54

CLK

SD3 Clock High Time t

0.46

CLK

0.54

CLK

uSDHC Output/Card inputs DAT (Reference to SCK)

SD4 Output Skew from Data of

Edge of SCK

OSkew1

0.45 — ns

SD5 Output Skew from Edge of

SCK to Data

OSkew2

0.45 — ns

Table 62. eMMC4.4/4.41 interface timing specification(continued)

ID Parameter Symbols Min Max Unit

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet,

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NXP Semiconductors 87

4.10.2.4 HS200 Mode Timing

Figure 49 depicts the timing of HS200 mode, and Table 64 lists the HS200 timing characteristics.

Figure 49. HS200 Mode Timing

uSDHC input/Card Outputs DAT (Reference to Strobe)

SD6 uSDHC input skew t

—

0.45 ns

SD7 uSDHC hold skew t

RQH

—

0.45 ns

Table 64. HS200 Interface Timing Specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency Period t

CLK

5.0 — ns

SD2 Clock Low Time t

0.3*t

CLK

0.7*t

CLK

SD2 Clock High Time t

0.3*t

CLK

0.7*t

CLK

uSDHC Output/Card Inputs SD_CMD, SDx_DATAx in HS200 (Reference to CLK)

SD5 uSDHC Output Delay t

–1.6 1 ns

uSDHC Input/Card Outputs SD_CMD, SDx_DATAx in HS200 (Reference to CLK)

HS200 is for 8 bits while SDR104 is for 4 bits.

SD8 Card Output Data Window t

ODW

0.5*t

CLK

—ns

Table 63. HS400 interface timing specifications(continued)

ID Parameter Symbols Min Max Unit

6&.

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6'

6'

6'

6'6'

6' 6'

6'

Electrical characteristics

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NXP Semiconductors88

4.10.2.5 SDR50/SDR104 AC timing

Figure 50 depicts the timing of SDR50/SDR104, and Table 65 lists the SDR50/SDR104 timing

characteristics.

Figure 50. SDR50/SDR104 timing

Table 65. SDR50/SDR104 interface timing specification

ID Parameter Symbols Min Max Unit

Card Input Clock

SD1 Clock Frequency Period t

CLK

5—ns

SD2 Clock Low Time t

0.46

CLK

0.54

CLK

SD3 Clock High Time t

0.46

CLK

0.54

CLK

uSDHC Output/Card Inputs SD_CMD, SDx_DATAx in SDR50 (Reference to CLK)

SD4 uSDHC Output Delay t

–3 1 ns

uSDHC Output/Card Inputs SD_CMD, SDx_DATAx in SDR104 (Reference to CLK)

SD5 uSDHC Output Delay t

–1.6 1 ns

uSDHC Input/Card Outputs SD_CMD, SDx_DATAx in SDR50 (Reference to CLK)

SD6 uSDHC Input Setup Time t

ISU

2.4 — ns

SD7 uSDHC Input Hold Time t

1.4 — ns

uSDHC Input/Card Outputs SD_CMD, SDx_DATAx in SDR104 (Reference to CLK)

Data window in SDR100 mode is variable.

SD8 Card Output Data Window t

ODW

0.5*t

CLK

—ns

SCK

8-bit output from uSDHC to eMMC

8-bit input from eMMC to uSDHC

SD8

SD7

SD6

SD4/SD5

SD2 SD3

SD1

F6134

Electrical characteristics

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NXP Semiconductors 89

4.10.2.6 Bus operation condition for 3.3 V and 1.8 V signaling

Signaling level of SD/eMMC4.3 and eMMC4.4/4.41 modes is 3.3 V. Signaling level of SDR104/SDR50

mode is 1.8 V. The DC parameters for the NVCC_SD1, NVCC_SD2 and NVCC_SD3 supplies are

identical to those shown in Table 29, "GPIO DC Parameters," on page 44.

4.10.3 Ethernet controller (ENET) AC electrical specifications

The following timing specs are defined at the chip I/O pin and must be translated appropriately to arrive

at timing specs/constraints for the physical interface.

4.10.3.1 ENET MII mode timing

This subsection describes MII receive, transmit, asynchronous inputs, and serial management signal

timings.

4.10.3.1.1 MII receive signal timing (ENET_RX_DATA3,2,1,0, ENET_RX_EN,

ENET_RX_ER, and ENET_RX_CLK)

The receiver functions correctly up to an ENET_RX_CLK maximum frequency of 25 MHz + 1%. There

is no minimum frequency requirement. Additionally, the processor clock frequency must exceed twice the

ENET_RX_CLK frequency.

Figure 51 shows MII receive signal timings. Table 66 describes the timing parameters (M1–M4) shown in

the figure.

Figure 51. MII receive signal timing diagram

ENET_RX_CLK (input)

ENET_RX_DATA3,2,1,0

M1 M2

ENET_RX_ER

ENET_RX_EN

(inputs)

Electrical characteristics

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NXP Semiconductors90

ENET_RX_EN, ENET_RX_CLK, and ENET0_RXD0 have the same timing in 10 Mbps 7-wire interface mode.

4.10.3.1.2 MII transmit signal timing (ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER, and ENET_TX_CLK)

The transmitter functions correctly up to an ENET_TX_CLK maximum frequency of 25 MHz + 1%.

There is no minimum frequency requirement. Additionally, the processor clock frequency must exceed

twice the ENET_TX_CLK frequency.

Figure 52 shows MII transmit signal timings. Table 67 describes the timing parameters (M5–M8) shown

in the figure.

Figure 52. MII transmit signal timing diagram

ENET_TX_EN, ENET_TX_CLK, and ENET0_TXD0 have the same timing in 10-Mbps 7-wire interface mode.

Table 66. MII receive signal timing

ID Characteristic

Min. Max. Unit

M1 ENET_RX_DATA3,2,1,0, ENET_RX_EN, ENET_RX_ER to

ENET_RX_CLK setup

5— ns

M2 ENET_RX_CLK to ENET_RX_DATA3,2,1,0, ENET_RX_EN,

ENET_RX_ER hold

5— ns

M3 ENET_RX_CLK pulse width high 35% 65% ENET_RX_CLK period

M4 ENET_RX_CLK pulse width low 35% 65% ENET_RX_CLK period

Table 67. MII transmit signal timing

ID Characteristic

Min. Max. Unit

M5 ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER invalid

5— ns

M6 ENET_TX_CLK to ENET_TX_DATA3,2,1,0, ENET_TX_EN,

ENET_TX_ER valid

—20 ns

M7 ENET_TX_CLK pulse width high 35% 65% ENET_TX_CLK period

M8 ENET_TX_CLK pulse width low 35% 65% ENET_TX_CLK period

ENET_TX_CLK (input)

ENET_TX_DATA3,2,1,0

ENET_TX_ER

ENET_TX_EN

(outputs)

Electrical characteristics

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NXP Semiconductors 91

4.10.3.1.3 MII asynchronous inputs signal timing (ENET_CRS and ENET_COL)

Figure 53 shows MII asynchronous input timings. Table 68 describes the timing parameter (M9) shown in

the figure.

Figure 53. MII async inputs timing diagram

ENET_COL has the same timing in 10-Mbit 7-wire interface mode.

4.10.3.1.4 MII Serial management channel timing (ENET_MDIO and ENET_MDC)

The MDC frequency is designed to be equal to or less than 2.5 MHz to be compatible with the IEEE 802.3

MII specification. However the ENET can function correctly with a maximum MDC frequency of

15 MHz.

Figure 54 shows MII asynchronous input timings. Table 69 describes the timing parameters (M10–M15)

shown in the figure.

Figure 54. MII serial management channel timing diagram

Table 68. MII asynchronous inputs signal timing

ID Characteristic Min. Max. Unit

ENET_CRS to ENET_COL minimum pulse width 1.5 — ENET_TX_CLK period

ENET_CRS, ENET_COL

ENET_MDC (output)

ENET_MDIO (output)

M14

M15

M10

M11

M12 M13

ENET_MDIO (input)

Electrical characteristics

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NXP Semiconductors92

4.10.3.2 RMII mode timing

In RMII mode, ENET_CLK is used as the REF_CLK, which is a 50 MHz ± 50 ppm continuous reference

clock. ENET_RX_EN is used as the

ENET_RX_EN

in RMII. Other signals under RMII mode include

ENET_TX_EN,

ENET_TX_DATA[1:0]

ENET_RX_DATA[1:0]

and ENET_RX_ER.

Figure 55 shows RMII mode timings. Table 70 describes the timing parameters (M16–M21) shown in the

figure.

Figure 55. RMII mode signal timing diagram

Table 69. MII serial management channel timing

ID Characteristic Min. Max. Unit

M10 ENET_MDC falling edge to ENET_MDIO output invalid (min.

propagation delay)

0— ns

M11 ENET_MDC falling edge to ENET_MDIO output valid (max.

propagation delay)

—5 ns

M12 ENET_MDIO (input) to ENET_MDC rising edge setup 18 — ns

M13 ENET_MDIO (input) to ENET_MDC rising edge hold 0 — ns

M14 ENET_MDC pulse width high 40% 60% ENET_MDC period

M15 ENET_MDC pulse width low 40% 60% ENET_MDC period

ENET_CLK (input)

ENET_TX_EN

M16

M17

M18

M19

M20 M21

ENET_RX_DATA[1:0]

ENET_TX_DATA (output)

ENET_RX_ER

ENET_RX_EN (input)

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet,

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NXP Semiconductors 93

4.10.3.3 Signal switching specifications

The following timing specifications meet the requirements for RGMII interfaces for a range of transceiver

devices.

Table 70. RMII signal timing

ID Characteristic Min. Max. Unit

M16 ENET_CLK pulse width high 35% 65% ENET_CLK period

M17 ENET_CLK pulse width low 35% 65% ENET_CLK period

M18 ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA invalid 4 — ns

M19 ENET_CLK to ENET0_TXD[1:0], ENET_TX_DATA valid — 15 ns

M20 ENET_RX_DATAD[1:0], ENET_RX_EN(ENET_RX_EN), ENET_RX_ER to

ENET_CLK setup

4— ns

M21 ENET_CLK to ENET_RX_DATAD[1:0], ENET_RX_EN, ENET_RX_ER

hold

2— ns

Table 71. RGMII signal switching specifications

The timings assume the following configuration:

DDR_SEL = (11)b

DSE (drive-strength) = (111)b

Symbol Description Min. Max. Unit

cyc2

For 10 Mbps and 100 Mbps, T

cyc

will scale to 400 ns ±40 ns and 40 ns ±4 ns respectively.

Clock cycle duration 7.2 8.8 ns

skewT3

For all versions of RGMII prior to 2.0; This implies that PC board design will require clocks to be routed such that an additional

trace delay of greater than 1.5 ns and less than 2.0 ns will be added to the associated clock signal. For 10/100, the Max value

is unspecified.

Data to clock output skew at transmitter -500 500 ps

skewR3

Data to clock input skew at receiver 1 2.6 ns

Duty_G

Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domain as long

as minimum duty cycle is not violated and stretching occurs for no more than three Tcyc of the lowest speed transitioned

between.

Duty cycle for Gigabit 45 55 %

Duty_T

Duty cycle for 10/100T 40 60 %

Tr/Tf Rise/fall time (20–80%) — 0.75 ns

Electrical characteristics

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

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NXP Semiconductors94

Figure 56. RGMII transmit signal timing diagram original

Figure 57. RGMII receive signal timing diagram original

Figure 58. RGMII receive signal timing diagram with internal delay

4.10.4 Flexible controller area network (flexcan) ac electrical specifications

The Flexible Controller Area Network (FlexCAN) module is a communication controller implementing

the CAN protocol according to the CAN 2.0 B protocol specification. The processor has two CAN

modules available for systems design. Tx and Rx ports for both modules are multiplexed with other I/O

pins. See the IOMUXC chapter of the i.MX 7Dual Application Processor Reference Manual (IMX7DRM)

to see which pins expose Tx and Rx pins; these ports are named FLEXCAN_TX and FLEXCAN_RX,

respectively.

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NXP Semiconductors 95

4.10.5 I

C module timing parameters

This section describes the timing parameters of the I

C module. Figure 59 depicts the timing of I

module, and Table 72 lists the I

C module timing characteristics.

Figure 59. I

C bus timing

Table 72. I

C module timing parameters

ID Parameter

Standard Mode Fast Mode

Unit

Min Max Min Max

IC1 I2Cx_SCL cycle time 10 — 2.5 —

IC2 Hold time (repeated) START condition 4.0 — 0.6 —

IC3 Set-up time for STOP condition 4.0 — 0.6 —

IC4 Data hold time 0

A device must internally provide a hold time of at least 300 ns for I2Cx_SDA signal to bridge the undefined region of the falling

edge of I2Cx_SCL.

3.45

The maximum hold time has only to be met if the device does not stretch the LOW period (ID no IC5) of the I2Cx_SCL signal.

0.9

IC5 HIGH Period of I2Cx_SCL Clock 4.0 — 0.6 —

IC6 LOW Period of the I2Cx_SCL Clock 4.7 — 1.3 —

IC7 Set-up time for a repeated START condition 4.7 — 0.6 —

IC8 Data set-up time 250 — 100

A Fast-mode I

C-bus device can be used in a Standard-mode I

C-bus system, but the requirement of Set-up time (ID No IC7)

of 250 ns must be met. This automatically is the case if the device does not stretch the LOW period of the I2Cx_SCL signal.

If such a device does stretch the LOW period of the I2Cx_SCL signal, it must output the next data bit to the I2Cx_SDA line

max_rise_time (IC9) + data_setup_time (IC7) = 1000 + 250 = 1250 ns (according to the Standard-mode I

C-bus specification)

before the I2Cx_SCL line is released.

—ns

IC9 Bus free time between a STOP and START condition 4.7 — 1.3 —

IC10 Rise time of both I2Cx_SDA and I2Cx_SCL signals — 1000 20 + 0.1C

= total capacitance of one bus line in pF.

300 ns

IC11 Fall time of both I2Cx_SDA and I2Cx_SCL signals — 300 20 + 0.1C

300 ns

IC12 Capacitive load for each bus line (C

)—400—400pF

IC10 IC11 IC9

IC2 IC8 IC4 IC7 IC3

IC6

IC10

IC5

IC11 START STOP START

START

I2Cx_SDA

I2Cx_SCL

IC1

LCDn_DATA[23 00] . LCDn Conlrul SIgna‘s I

Electrical characteristics

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NXP Semiconductors96

4.10.6 LCD controller (LCDIF) timing parameters

Figure 60 shows the LCDIF timing and Table yy lists the timing parameters.

Figure 60. LCD timing

4.10.7 Parallel CMOS sensor interface (CSI) timing parameters

4.10.7.1 Gated clock mode timing

Figure 61 and Figure 62 shows the gated clock mode timings for CSI, and Table 74 describes the timing

parameters (P1–P7) shown in the figures. A frame starts with a rising/falling edge on CSI_VSYNC

Table 73. LCD timing parameters

ID Parameter Symbol Min Max Unit

L1 LCD pixel clock frequency tCLK(LCD) - 150 MHz

L2 LCD pixel clock high (falling edge capture) tCLKH(LCD) 3 - ns

L3 LCD pixel clock low (rising edge capture) tCLKL(LCD) 3 - ns

L4 LCD pixel clock high to data valid (falling edge capture) td(CLKH-DV) -1 1 ns

L5 LCD pixel clock low to data valid (rising edge capture) td(CLKL-DV) -1 1 ns

L6 LCD pixel clock high to control signals valid (falling edge capture) td(CLKH-CTRLV) -1 1 ns

L7 LCD pixel clock low to control signals valid (rising edge capture) td(CLKL-CTRLV) -1 1 ns

Electrical characteristics

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NXP Semiconductors 97

(VSYNC), then CSI_HSYNC (HSYNC) is asserted and holds for the entire line. The pixel clock,

CSI_PIXCLK (PIXCLK), is valid as long as HSYNC is asserted.

Figure 61. CSI Gated Clock Mode—Sensor Data at Falling Edge, Latch Data at Rising Edge

Figure 62. CSI Gated Clock Mode—Sensor Data at Rising Edge, Latch Data at Falling Edge

Table 74. CSI Gated Clock Mode Timing Parameters

ID Parameter Symbol Min. Max. Units

P1 CSI_VSYNC to CSI_HSYNC time tV2H 33.5 — ns

P2 CSI_HSYNC setup time tHsu 1 — ns

P3 CSI DATA setup time tDsu 1 — ns

CSI_PIXCLK

CSI_VSYNC

CSI_DATA[15:00]

P3 P4

CSI_HSYNC

P2 P6

CSI_PIXCLK

CSI_VSYNC

CSI_DATA[15:00]

P3 P4

CSI_HSYNC

P2 P5

K dim m ﬁg 1//

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4.10.7.2 Ungated clock mode timing

Figure 63 shows the ungated clock mode timings of CSI, and Table 75 describes the timing parameters

(P1–P6) that are shown in the figure. In ungated mode the CSI_VSYNC and CSI_PIXCLK signals are

used, and the CSI_HSYNC signal is ignored.

Figure 63. CSI Ungated Clock Mode—Sensor Data at Falling Edge, Latch Data at Rising Edge

The CSI enables the chip to connect directly to external CMOS image sensors, which are classified as

dumb or smart as follows:

• Dumb sensors only support traditional sensor timing (vertical sync (VSYNC) and horizontal sync

(HSYNC)) and output-only Bayer and statistics data.

• Smart sensors support CCIR656 video decoder formats and perform additional processing of the

image (for example, image compression, image pre-filtering, and various data output formats).

P4 CSI DATA hold time tDh 1 — ns

P5 CSI pixel clock high time tCLKh 3.75 — ns

P6 CSI pixel clock low time tCLKl 3.75 — ns

P7 CSI pixel clock frequency fCLK — 148.5 MHz

Table 75. CSI Ungated Clock Mode Timing Parameters

ID Parameter Symbol Min. Max. Units

P1 CSI_VSYNC to pixel clock time tVSYNC 33.5 — ns

P2 CSI DATA setup time tDsu 1 — ns

P3 CSI DATA hold time tDh 1 — ns

P4 CSI pixel clock high time tCLKh 3.75 — ns

P5 CSI pixel clock low time tCLKl 3.75 — ns

P6 CSI pixel clock frequency fCLK — 148.5 MHz

Table 74. CSI Gated Clock Mode Timing Parameters(continued)

ID Parameter Symbol Min. Max. Units

CSI_PIXCLK

CSI_VSYNC

CSI_DATA[15:00]

P2 P3

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The following subsections describe the CSI timing in gated and ungated clock modes.

4.10.8 MIPI PHY timing parameters

4.10.8.1

This section describes MIPI PHY electrical specifications.

Electrical and Timing

Information

Table 76. Electrical and Timing Information

Symbol Parameters Test Conditions Min Typ Max Unit

Input DC Specifications - Apply to DSI_CLK_P/DSI_CLK_N and DSI_DATA_P/DSI_DATA_N inputs

Input signal voltage range Transient voltage range is

limited from -300 mV to

1600 mV

-50 — 1350 mV

LEAK

Input leakage current VGNDSH(min) = VI =

VGNDSH(max) +

VOH(absmax)

Lane module in LP Receive

Mode

-10 — 10 mA

GNDSH

Ground Shift — -50 — 50 mV

OH(absmax)

Maximum transient output

voltage level

———1.45V

voh(absmax)

Maximum transient time

above VOH(absmax)

———20ns

HS Line Drivers DC Specifications

| HS Transmit Differential

output voltage magnitude

Ω<

= RL< = 125

140 200 270 mV

| Change in Differential output

voltage magnitude between

logic states

Ω<

= RL< = 125

——10mV

CMTX

Steady-state common-mode

output voltage.

Ω<

= RL< = 125

150 200 250 mV

CMTX

(1,0) Changes in steady-state

common-mode output voltage

between logic states

Ω<

= RL< = 125

—— 5mV

OHHS

HS output high voltage 80

Ω<

= RL< = 125

— — 360 mV

Single-ended output

impedance.

—405062.5

Single-ended output

impedance mismatch.

———10%

LP Line Drivers DC Specifications

Output low-level SE voltage — -50 50 mV

Output high-level SE voltage — 1.1 1.2 1.3 V

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OLP

Single-ended output

impedance.

—110——

OLP(01-10)

Single-ended output

impedance mismatch driving

opposite level

———20%

OLP(0-11)

Single-ended output

impedance mismatch driving

same level

———5%

HS Line Receiver DC Specifications

IDTH

Differential input high voltage

threshold

———70mV

IDTL

Differential input low voltage

threshold

—-70——mV

IHHS

Single ended input high

voltage

— — — 460 mV

ILHS

Single ended input low

voltage

—-40——mV

CMRXDC

Input common mode voltage — 70 — 330 mV

Differential input impedance — 80 — 125

LP Line Receiver DC Specifications

Input low voltage — — — 550 mV

Input high voltage — 920 — — mV

HYST

Input hysteresis — 25 — — mV

Contention Line Receiver DC Specifications

ILF

Input low fault threshold — 200 — 450 mV

Table 76. Electrical and Timing Information(continued)

Symbol Parameters Test Conditions Min Typ Max Unit

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4.10.8.2 MIPI PHY signaling levels

The signal levels are different for differential HS mode and single-ended LP mode. Figure 64 shows both

the HS and LP signal levels on the left and right sides, respectively. The HS signaling levels are below

the LP low-level input threshold such that LP receiver always detects low on HS signals.

Figure 64. MIPI PHY Signaling Levels

4.10.8.3 MIPI HS line driver characteristics

Figure 65. Ideal Single-ended and Resulting Differential HS Signals

HS Vout

Range

HS Vcm

Range

Max V

Min V

CMTX,MIN

OLHS

CMTX,MAX

OHHS

LP V

OH,MAX

OH,MIN

LP Threshold

Region

GNDSH,MA

GNDSH,MIN

GND

LP V

HS Differential Signaling LP Single-ended Signaling

OD(1)

OD(0)

= V

- V

CMTX

= (V

DP +

)/2

(Differential)

Ideal Single-Ended High Speed Signals

Ideal Differential High Speed Signals

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4.10.8.4

Possible

VCMTX and

VOD Distortions of the Single-ended HS Signals

Figure 66. Possible

VCMTX and

VOD Distortions of the Single-ended HS Signals

4.10.8.5 MIPI PHY switching characteristics

Table 77. Electrical and Timing Information

Symbol Parameters Test Conditions Min Typ Max Unit

HS Line Drivers AC Specifications

— Maximum serial data rate (forward

direction)

On DATAP/N outputs.

<= RL <= 125

80 — 1500 Mbps

DDRCLK

DDR CLK frequency On DATAP/N outputs. 40 — 750 MHz

DDRCLK

DDR CLK period 80

Ω<

= RL< = 125

1.33 — 25 ns

CDC

DDR CLK duty cycle t

CDC

CPH

DDRCLK

—50—%

CPH

DDR CLK high time — — 1 — UI

CPL

DDR CLK low time — — 1 — UI

— DDR CLK / DATA Jitter — — 75 — ps pk–pk

SKEW[PN]

Intra-Pair (Pulse) skew — — 0.075 — UI

SKEW[TX]

Data to Clock Skew — 0.350 — 0.650 UI

Differential output signal rise time 20% to 80%, RL = 50

150 — 0.3UI ps

Differential output signal fall time 20% to 80%, RL = 50

150 — 0.3UI ps

CMTX(HF)

Common level variation above 450 MHz 80

<= RL< = 125

——15mV

rms

CMTX(LF)

Common level variation between 50

MHz and 450 MHz.

<= RL< = 125

——25mV

OD(0)

OD (1)

(SE HS Signals)

Static V

CMTX

(SE HS Signals)

Dynamic V

CMTX

(SE HS Signals)

CM TX

CMTX

CM TX

OD(0)

5/5

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LP Line Drivers AC Specifications

rlp,

flp

Single ended output rise/fall time 15% to 85%, C

<70 pF — — 25 ns

reo

30% to 85%, C

<70 pF — — 35 ns

Signal slew rate 15% to 85%, C

<70 pF — — 120 mV/ns

Load capacitance — 0 — 70 pF

HS Line Receiver AC Specifications

SETUP[RX]

Data to Clock Receiver Setup time — 0.15 — — UI

HOLD[RX]

Clock to Data Receiver Hold time — 0.15 — — UI

CMRX(HF)

Common mode interference beyond

450 MHz

———200mVpp

CMRX(LF)

Common mode interference between

50 MHz and 450 MHz.

—-50—50mVpp

Common mode termination — — — 60 pF

LP Line Receiver AC Specifications

SPIKE

Input pulse rejection — — 300 Vps

MIN

Minimum pulse response — 50 — ns

INT

Pk-to-Pk interference voltage — — — 400 mV

INT

Interference frequency — 450 — — MHz

Model Parameters used for Driver Load switching performance evaluation

PAD

Equivalent Single ended I/O PAD

capacitance.

———1pF

Equivalent Single ended Package +

PCB capacitance.

———2pF

Equivalent wire bond series inductance — — — 1.5 nH

Equivalent wire bond series resistance — — — 0.15

Load resistance — 80 100 125

Table 77. Electrical and Timing Information(continued)

Symbol Parameters Test Conditions Min Typ Max Unit

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4.10.8.6 High-speed clock timing

Figure 67. DDR Clock Definition

4.10.8.7 Forward high-speed data transmission timing

The timing relationship of the DDR Clock differential signal to the Data differential signal is shown in

Figure 68:

Figure 68. Data to Clock Timing Definitions

4.10.8.8 Reverse high-speed data transmission timing

Figure 69. Reverse High-Speed Data Transmission Timing at Slave Side

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4.10.8.9 Low-power receiver timing

Input Glitch Rejection of Low-Power Receivers

4.10.9 PCIe PHY parameters

The PCIe interface is designed to be compatible with PCIe specification Gen2 x1 lane and supports the

PCI Express 1.1/2.0 standard.

4.10.9.1 PCIE_REXT reference resistor connection

The impedance calibration process requires connection of reference resistor 4.7 kΩ. 1% precision resistor

on PCIE_REXT pads to ground. It is used for termination impedance calibration.

4.10.10 Pulse width modulator (PWM) timing parameters

This section describes the electrical information of the PWM. The PWM can be programmed to select one

of three clock signals as its source frequency. The selected clock signal is passed through a prescaler before

being input to the counter. The output is available at the pulse-width modulator output (PWMO) external

pin.

Figure 70 depicts the timing of the PWM, and Table 78 lists the PWM timing parameters.

Figure 70. PWM Timing

Table 78. PWM output timing parameters

ID Parameter Min Max Unit

PWM Module Clock Frequency 0 ipg_clk MHz

2*TLPX 2*TLPX

TMIN-RX TMIN-RX

eSPIKE

Input

Output

VIH

VIL

07-N?/54

0 0

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4.10.11 QUAD SPI (QSPI) Timing Parameters

Measurement conditions are with 35 pF load on SCK and SIO pins and input slew rate of 1 V/ns.

4.10.11.1 SDR Mode

Figure 71. QuadSPI Input/Read Timing (SDR mode with internal sampling)

Figure 72. QuadSPI Input/Read Timing (SDR mode with loopback DQS sampling)

P1 PWM output pulse width high 15 ns

P2 PWM output pulse width low 15 ns

Table 79. QuadSPI Input Timing (SDR mode with internal sampling)

Symbol Parameter

Value

Unit

Min Max

Setup time for incoming data 8.67 — ns

Hold time requirement for incoming data 0 — ns

Table 78. PWM output timing parameters(continued)

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NOTE

• For internal sampling, the timing values assumes using sample point 0,

that is QuadSPIx_SMPR[SDRSMP] = 0.

• For loopback DQS sampling, the data strobe is output to the DQS pad

together with the serial clock. The data strobe is looped back from DQS

pad and used to sample input data.

Figure 73. QuadSPI Output/Write Timing (SDR mode)

NOTE

css

and T

csh

are configured by the QuadSPIx_FLSHCR register, the default

value of 3 are shown on the timing. Please refer to the i.MX 6SoloX

Reference Manual (IMX6ULLRM) for more details.

Table 80. QuadSPI Input/Read Timing (SDR mode with loopback DQS sampling)

Symbol Parameter

Value

Unit

Min Max

Setup time for incoming data 2 — ns

Hold time requirement for incoming data 1 — ns

Table 81. QuadSPI Output/Write Timing (SDR mode)

Symbol Parameter

Value

Unit

Min Max

DVO

Output data valid time — 2.5 ns

DHO

Output data hold time -0.5 — ns

SCK clock period 10 — ns

CSS

Chip select output setup time 3 — SCK cycle(s)

CSH

Chip select output hold time 3 — SCK cycle(s)

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4.10.11.2 DDR Mode

Figure 74. QuadSPI Input/Read Timing (DDR mode with internal sampling)

Figure 75. QuadSPI Input/Read Timing (DDR mode with loopback DQS sampling)

NOTE

• For internal sampling, the timing values assumes using sample point 0,

that is QuadSPIx_SMPR[SDRSMP] = 0.

Table 82. QuadSPI Input/Read Timing (DDR mode with internal sampling)

Symbol Parameter

Value

Unit

Min Max

Setup time for incoming data 8.67 — ns

Hold time requirement for incoming data 0 — ns

Table 83. QuadSPI Input/Read Timing (DDR mode with loopback DQS sampling)

Symbol Parameter

Value

Unit

Min Max

Setup time for incoming data 2 — ns

Hold time requirement for incoming data 1 — ns

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• For loopback DQS sampling, the data strobe is output to the DQS pad

together with the serial clock. The data strobe is looped back from DQS

pad and used to sample input data.

Figure 76. QuadSPI Output/Write Timing (DDR mode)

NOTE

css

and T

csh

are configured by the QuadSPIx_FLSHCR register, the default

value of 3 are shown on the timing. See the i.MX 7Dual Reference Manual

(IMX7DRM) for more details.

4.10.12

SAI/I

S switching specifications

This section provides the AC timings for the SAI in master (clocks driven) and slave (clocks input) modes.

All timings are given for noninverted serial clock polarity (SAI_TCR[TSCKP] = 0, SAI_RCR[RSCKP] =

0) and noninverted frame sync (SAI_TCR[TFSI] = 0, SAI_RCR[RFSI] = 0). If the polarity of the clock

and/or the frame sync have been inverted, all the timings remain valid by inverting the clock signal

(SAI_BCLK) and/or the frame sync (SAI_FS) shown in the figures below.

Table 84. QuadSPI Output/Write Timing (DDR mode)

Symbol Parameter

Value

Unit

Min Max

DVO

Output data valid time — (0.25 x T

SCLK

) + 2.5 ns

DHO

Output data hold time (0.25 x T

SCLK

) - 0.5 — ns

SCK clock period 20 — ns

CSS

Chip select output setup time 3 — SCK cycle(s)

CSH

Chip select output hold time 3 — SCK cycle(s)

Table 85. Master mode SAI timing

Num Characteristic Min Max Unit

S1 SAI_MCLK cycle time 20 — ns

S2 SAI_MCLK pulse width high/low 40% 60% MCLK period

S3 SAI_BCLK cycle time 40 — ns

S4 SAI_BCLK pulse width high/low 40% 60% BCLK period

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Figure 77. SAI timing — master modes

S5 SAI_BCLK to SAI_FS output valid — 15 ns

S6 SAI_BCLK to SAI_FS output invalid 0 — ns

S7 SAI_BCLK to SAI_TXD valid — 15 ns

S8 SAI_BCLK to SAI_TXD invalid 0 — ns

S9 SAI_RXD/SAI_FS input setup before SAI_BCLK 15 — ns

S10 SAI_RXD/SAI_FS input hold after SAI_BCLK 0 — ns

Table 86. Master mode SAI timing

Num Characteristic Min Max Unit

S11 SAI_BCLK cycle time (input) 40 — ns

S12 SAI_BCLK pulse width high/low (input) 40% 60% BCLK period

S13 SAI_FS input setup before SAI_BCLK 10 — ns

S14 SAI_FA input hold after SAI_BCLK 2 — ns

S15 SAI_BCLK to SAI_TXD/SAI_FS output valid — 20 ns

S16 SAI_BCLK to SAI_TXD/SAI_FS output invalid 0 — ns

S17 SAI_RXD setup before SAI_BCLK 10 — ns

S18 SAI_RXD hold after SAI_BCLK 2 — ns

Table 85. Master mode SAI timing(continued)

Num Characteristic Min Max Unit

lasJCLK (Input) Izsjs (output) Izsjs (mun) |2S_TXD I2S,RXD

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Figure 78. SAI timing — slave modes

4.10.13 SCAN JTAG controller (SJC) timing parameters

Figure 79 depicts the SJC test clock input timing. Figure 80 depicts the SJC boundary scan timing.

Figure 81 depicts the SJC test access port. Signal parameters are listed in Table 87.

Figure 79. Test clock input timing diagram

JTAG_TCK

(Input) VM VM

VIH VIL

SJ1

SJ2 SJ2

SJ3

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Figure 80. Boundary scan (JTAG) timing diagram

JTAG_TCK

(Input)

Data

Inputs

Data

Outputs

Data

Outputs

Data

Outputs

VIH

VIL

Input Data Valid

Output Data Valid

SJ4 SJ5

SJ6

SJ7

SJ6

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Figure 81. Test access port timing diagram

Figure 82. JTAG_TRST_B timing diagram

Table 87. JTAG timing

ID Parameter

1,2

All Frequencies

Unit

Min Max

SJ0 JTAG_TCK frequency of operation 1/(3•T

)

0.001 22 MHz

SJ1 JTAG_TCK cycle time in Crystal mode 45 — ns

SJ2 JTAG_TCK clock pulse width measured at

22.5 — ns

SJ3 JTAG_TCK rise and fall times — 3 ns

SJ4 Boundary scan input data set-up time 5 — ns

SJ5 Boundary scan input data hold time 24 — ns

SJ6 JTAG_TCK low to output data valid — 40 ns

SJ7 JTAG_TCK low to output high impedance — 40 ns

SJ8 JTAG_TMS, JTAG_TDI data set-up time 5 — ns

JTAG_TCK

(Input)

JTAG_TDI

(Input)

JTAG_TDO

(Output)

JTAG_TDO

(Output)

JTAG_TDO

(Output)

VIH

VIL

Input Data Valid

Output Data Valid

JTAG_TMS

SJ8 SJ9

SJ10

SJ11

SJ10

JTAG_TCK

(Input)

JTAG_TRST_B

(Input)

SJ13

SJ12

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4.10.14 UART I/O configuration and timing parameters

4.10.14.1 UART RS-232 I/O configuration in different modes

The i.MX 7Dual UART interfaces can serve both as DTE or DCE device. This can be configured by the

DCEDTE control bit (default 0—DCE mode). Table 88 shows the UART I/O configuration based on the

enabled mode.

4.10.14.2 UART RS-232 Serial mode timing

This section describes the electrical information of the UART module in the RS-232 mode.

SJ9 JTAG_TMS, JTAG_TDI data hold time 25 — ns

SJ10 JTAG_TCK low to JTAG_TDO data valid — 44 ns

SJ11 JTAG_TCK low to JTAG_TDO high impedance — 44 ns

SJ12 JTAG_TRST_B assert time 100 — ns

SJ13 JTAG_TRST_B set-up time to JTAG_TCK low 40 — ns

= target frequency of SJC

= mid-point voltage

Table 88. UART I/O configuration vs. mode

Port

DTE Mode DCE Mode

Direction Description Direction Description

UARTx_RTS_B Output UARTx_RTS_B from DTE to DCE Input UARTx_RTS_B from DTE to DCE

UARTx_CTS_B Input UARTx_CTS_B from DCE to DTE Output UARTx_CTS_B from DCE to DTE

UARTx_TX_ DATA Input Serial data from DCE to DTE Output Serial data from DCE to DTE

UARTx_RX

_DATA

Output Serial data from DTE to DCE Input Serial data from DTE to DCE

Table 87. JTAG timing(continued)

ID Parameter

1,2

All Frequencies

Unit

Min Max

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4.10.14.2.1 UART transmitter

Figure 83 depicts the transmit timing of UART in the RS-232 Serial mode, with 8 data bit/1 stop bit

format. Table 89 lists the UART RS-232 Serial mode transmit timing characteristics.

Figure 83. UART RS-232 Serial mode transmit timing diagram

4.10.14.2.2 UART receiver

Figure 84 depicts the RS-232 Serial mode receive timing with 8 data bit/1 stop bit format. Table 90 lists

Serial mode receive timing characteristics.

Figure 84. UART RS-232 Serial mode receive timing diagram

4.10.15 USB HSIC timing

This section describes the electrical information of the USB HSIC port.

Table 89. RS-232 Serial mode transmit timing parameters

ID Parameter Symbol Min Max Unit

UA1 Transmit Bit Time t

Tbit

1/F

baud_rate1

- T

ref_clk2

baud_rate

: Baud rate frequency. The maximum baud rate the UART can support is (

ipg_perclk

frequency)/16.

ref_clk

: The period of UART reference clock

ref_clk

(

ipg_perclk

after RFDIV divider).

1/F

baud_rate

+ T

ref_clk

—

Table 90. RS-232 Serial mode receive timing parameters

ID Parameter Symbol Min Max Unit

UA2 Receive Bit Time

The UART receiver can tolerate 1/(16 x F

baud_rate

) tolerance in each bit. But accumulation tolerance in one frame must not

exceed 3/(16 x F

baud_rate

Rbit

1/F

baud_rate2

- 1/(16

x F

baud_rate

)

baud_rate

: Baud rate frequency. The maximum baud rate the UART can support is (

ipg_perclk

frequency)/16.

1/F

baud_rate

1/(16 x F

baud_rate

)

—

Start

Bit Bit 1 Bit 2Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

UARTx_TX_DATA

(output) Bit 3 STOP

BIT

Start

Bit

Possible

Parity

Bit

Par Bit

UA1

UA1 UA1

UA1

Bit 1 Bit 2Bit 0 Bit 4 Bit 5 Bit 6 Bit 7

UARTx_RX_DATA

(output)

Bit 3

Start

Bit STOP

BIT

Start

Bit

Possible

Parity

Bit

Par Bit

UA2 UA2

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NOTE

HSIC is DDR signal, following timing spec is for both rising and falling

edge.

4.10.15.1 Transmit timing

Figure 85. USB HSIC transmit waveform

4.10.15.2 Receive timing

Figure 86. USB HSIC receive waveform

Table 91. USB HSIC transmit parameters

Name Parameter Min Max Unit Comment

Tstrobe strobe period 4.165 4.169 ns

Todelay data output delay time 550 1350 ps Measured at 50% point

Tslew strobe/data rising/falling time 0.7 2 V/ns Averaged from 30% – 70% points

Table 92. USB HSIC receive parameters

The timings in the table are guaranteed when:

—AC I/O voltage is between 0.9x to 1x of the I/O supply

—DDR_SEL configuration bits of the I/O are set to (10)b

Name Parameter Min Max Unit Comment

Tstrobe strobe period 4.165 4.169 ns

Thold data hold time 300 ps Measured at 50% point

Tsetup data setup time 365 ps Measured at 50% point

Tslew strobe/data rising/falling time 0.7 2 V/ns Averaged from 30% – 70% points

USB_H_STROBE

USB_H_DATA

Todelay

Tstrobe

Todelay

USB_H_STROBE

USB_H_DATA

Thold

Tstrobe

Tsetup

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4.10.16 USB PHY parameters

This section describes the USB-OTG PHY parameters.

The USB PHY meets the electrical compliance requirements defined in the Universal Serial Bus Revision

2.0 OTG, USB Host with the amendments below (On-The-Go and Embedded Host Supplement to the USB

Revision 2.0 Specification is not applicable to Host port):

• USB ENGINEERING CHANGE NOTICE

— Title: 5V Short Circuit Withstand Requirement Change

— Applies to: Universal Serial Bus Specification, Revision 2.0

• Errata for USB Revision 2.0 April 27, 2000 as of 12/7/2000

• USB ENGINEERING CHANGE NOTICE

— Title: Pull-up/Pull-down resistors

— Applies to: Universal Serial Bus Specification, Revision 2.0

• USB ENGINEERING CHANGE NOTICE

— Title: Suspend Current Limit Changes

— Applies to: Universal Serial Bus Specification, Revision 2.0

• USB ENGINEERING CHANGE NOTICE

— Title: USB 2.0 Phase Locked SOFs

— Applies to: Universal Serial Bus Specification, Revision 2.0

• On-The-Go and Embedded Host Supplement to the USB Revision 2.0 Specification

— Revision 2.0, version 1.1a, July 27, 2010

• Battery Charging Specification (available from USB-IF)

— Revision 1.2, December 7, 2010

4.10.16.1 USB_OTG*_REXT reference resistor connection

The bias generation and impedance calibration process for the USB OTG PHYs requires connection of

reference resistors 200 Ω 1% precision on each of USB_OTG1_REXT and USB_OTG2_REXT pads to

ground.

4.10.16.2 USB_OTG_CHD_B USB battery charger detection external pullup

resistor connection

The usage and external resistor connection for the USB_OTG_CHD_B pin are described in Table 3,

Table 7, and Section 4.7.3, “USB battery charger detection driver impedance.”

Electrical characteristics

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4.11 12-Bit A/D converter (ADC)

Table 93. Recommended operating conditions for 12-bit ADC

Characteristics Symbol Min Typ Max Unit

Supply Voltage AVDD18 1.7 1.8 1.9 V

VDDA10 0.95 1 1.05 V

Operating Temp T

–25 — 105 C

Analog Input Channel — — — 16 Channel

Analog Input Range

DO=111111111111 @AIN=AVDD18 & DO=000000000000 @AIN=AVSS18 (Input full-scale voltage = AVDD18)

ADC

_IN

AGND — VREF V

Main Clock Frequency FCLK 300K — 6M Hz

Start of conversion clk frequency (FCLK/3) FSOC 50K — 1M Hz

External Input Resistance of ADC

IEXT

= Output resistance of the ADC driver = Output resistance of signal generator + Series parasitic resistance between

signal source and ADC input (for example, PCB and bonding wire resistance and ESD protection resistance)

IEXT

— 50 250

Table 94. DC Electrical characteristics

Specification Symbol Min Typ Max Unit Conditions

Resolution — — 12 12 Bits —

Differential

Non-Linearity

DNL — ± 2.0 ± 2.0 LSB PD=Low

FCLK=6MHz

FSOC=1MHz

FAIN=10kHz

Ramp wave

Integral

Non-Linearity

INL — ± 6.0 ± 6.0 LSB

Top Offset Voltage EOT — ±10 ± 100 LSB

Bottom Offset

Voltage

EOB — ±11 ± 100 LSB

Table 95. AC Electrical characteristics

Specification Symbol Min Typ Max Unit

Main Clock Duty Ratio — 45 45 55 %

Analog Input Frequency CH #15-0 FAIN DC 50k 100K Hz

Normal Operation Current Consumption

VDDA_ADCx_1P8

—0.531.90 mA

VDDA_1P0_CAP

—0.020.10 mA

Boot mode configuration

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5 Boot mode configuration

This section provides information on Boot mode configuration pins allocation and boot devices interfaces

allocation.

5.1 Boot mode configuration pins

Table 96 provides boot options, functionality, fuse values, and associated pins. Several input pins are also

sampled at reset and can be used to override fuse values, depending on the value of BT_FUSE_SEL fuse.

The boot option pins are in effect when BT_FUSE_SEL fuse is ‘0’ (cleared, which is the case for an

unblown fuse). For detailed Boot mode options configured by the Boot mode pins, see the “System Boot,

Fusemap, and eFuse” chapter in the i.MX 7Dual Application Processor Reference Manual (IMX7DRM).

Power Down Current

IPD

— 3.0 300

μΑ

Signal to Noise and Distortion Ratio SNDR 54 60 — dB

Normal operation current consumption includes only the current from the ADC core. It does not include static current from the

power pads.

Power-down current includes only the current from the ADC core. It does not include static current from the power pads.

IOP and IPD are measurable only on the ADC core's test chips. Because AVDD10 is shared with internal logic power, IOP

and IPD in the test plan only measure current consumption @ AVDD18, VREF.

Table 96. Fuses and associated pins used for boot

Pin Direction

at Reset

eFuse

name

State during reset

(POR_B

asserted)

State after reset

(POR_B

deasserted)

Details

BOOT_MODE0 Input N/A Hi-Z Hi-Z Boot mode selection

BOOT_MODE1 Input N/A Hi-Z Hi-Z Boot mode selection

Table 95. AC Electrical characteristics(continued)

Specification Symbol Min Typ Max Unit

Boot mode configuration

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5.2 Boot device interface allocation

Table 97 lists the interfaces that can be used by the boot process in accordance with the specific Boot

mode configuration. The table also describes the interface’s specific modes and IOMUXC allocation,

which are configured during boot when appropriate.

LCD1_DATA00 Input BT_CFG[0] 100K Pull Down Keeper Boot options, pin value overrides fuse

settings for BT_FUSE_SEL=’0’. Signal

configuration as fuse override input at

power up.

These are special I/O lines that control the

boot configuration during product

development. In production, the boot

configuration can be controlled by fuses.

LCD1_DATA01 Input BT_CFG[1] 100K Pull Down Keeper

LCD1_DATA02 Input BT_CFG[2] 100K Pull Down Keeper

LCD1_DATA03 Input BT_CFG[3] 100K Pull Down Keeper

LCD1_DATA04 Input BT_CFG[4] 100K Pull Down Keeper

LCD1_DATA05 Input BT_CFG[5] 100K Pull Down Keeper

LCD1_DATA06 Input BT_CFG[6] 100K Pull Down Keeper

LCD1_DATA07 Input BT_CFG[7] 100K Pull Down Keeper

LCD1_DATA08 Input BT_CFG[8] 100K Pull Down Keeper

LCD1_DATA09 Input BT_CFG[9] 100K Pull Down Keeper

LCD1_DATA10 Input BT_CFG[10] 100K Pull Down Keeper

LCD1_DATA11 Input BT_CFG[11] 100K Pull Down Keeper

LCD1_DATA12 Input BT_CFG[12] 100K Pull Down Keeper

LCD1_DATA13 Input BT_CFG[13] 100K Pull Down Keeper

LCD1_DATA14 Input BT_CFG[14] 100K Pull Down Keeper

LCD1_DATA15 Input BT_CFG[15] 100K Pull Down Keeper

LCD1_DATA16 Input BT_CFG[16] 100K Pull Down Keeper

LCD1_DATA17 Input BT_CFG[17] 100K Pull Down Keeper

LCD1_DATA18 Input BT_CFG[18] 100K Pull Down Keeper

LCD1_DATA19 Input BT_CFG[19] 100K Pull Down Keeper

Table 97. Interface allocation during boot

Interface IP Instance Allocated Pads During Boot Comment

QSPI QSPI EPDC_D0, EPDC_D1, EPDC_D2, EPDC_D3,

EPDC_D4, EPDC_D5, EPDC_D6, EPDC_D7,

EPDC_D8, EPDC_D9, EPDC_D10, EPDC_D11,

EPDC_D12, EPDC_D13, EPDC_D14, EPDC_D15

SPI ECSPI-1 ECSPI1_SCLK, ECSPI1_MOSI, ECSPI1_MISO,

ECSPI1_SS0, UART1_RXD, UART1_TXD,

UART2_RXD

The chip-select pin used depends

on the fuse "CS select (SPI only)"

Table 96. Fuses and associated pins used for boot(continued)

Pin Direction

at Reset

eFuse

name

State during reset

(POR_B

asserted)

State after reset

(POR_B

deasserted)

Details

Boot mode configuration

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SPI ECSPI-2 ECSPI2_SCLK, ECSPI2_MOSI, ECSPI2_MISO,

ECSPI2_SS0, ENET1_RX_CTL, ENET1_RXC,

ENET1_TD0

The chip-select pin used depends

on the fuse "CS select (SPI only)"

SPI ECSPI-3 SAI2_TXFS, SAI2_TXC, SAI2_RXD, SAI2_TXD,

SD1_DATA3, SD2_CD_B, SD2_WP

The chip-select pin used depends

on the fuse "CS select (SPI only)"

SPI ECSPI-4 SD1_CD_B, SD1_WP, SD1_RESET_B, SD1_CLK,

SD1_CMD, SD1_DATA0, SD1_DATA1

The chip-select pin used depends

on the fuse "CS select (SPI only)"

EIM EIM EPDC_SDCE2, EPDC_SDCE3, EPDC_GDCLK,

EPDC_GDOE, EPDC_GDRL, EPDC_GDSP,

EPDC_BDR0, LCD_DAT20, LCD_DAT21, LCD_DAT22,

LCD_DAT23, EPDC_D8, EPDC_D9, EPDC_D10,

EPDC_D12, EPDC_D14, EPDC_PWRSTAT

Used for NOR, OneNAND boot

Only CS0 is supported. Allocated

pads may differ depending on mux

mode. See the “System Boot,

Fusemap, and eFuse” chapter of

the

i.MX 7Dual Application

Processor Reference Manual

(IMX7DRM) for details.

NAND Flash GPMI SD3_CLK, SD3_CMD, SD3_DATA0, SD3_DATA1,

SD3_DATA2, SD3_DATA3, SD3_DATA4, SD3_DATA5,

SD3_DATA6, SD3_DATA7, SD3_STROBE,

SD3_RESET_B, SAI1_TXC, SAI1_TXFS, SAI1_TXD

8 bit

Only CS0 is supported

SD/MMC USDHC-1 SD1_CD_B, SD1_RESET_B, SD1_CLK, SD1_CMD,

SD1_DATA0, SD1_DATA1, SD1_DATA2, SD1_DATA3,

GPIO1_IO08, ECSPI2_SCLK, ECSPI2_MOSI,

ECSPI2_MISO, ECSPI2_SS0

1, 4, or 8 bit

SD/MMC USDHC-2 SD2_RESET_B, SD2_CLK, SD2_CMD, SD2_DATA0,

SD2_DATA1, SD2_DATA2, SD2_DATA3, GPIO1_IO12,

ECSPI1_SCLK, ECSPI1_MOSI, ECSPI1_MISO,

ECSPI1_SS0

1, 4, or 8 bit

SD/MMC USDHC-3 SD3_CLK, SD3_CMD, SD3_DAT0, SD3_DAT1,

SD3_DAT2, SD3_DAT3, SD3_DAT4, SD3_DAT5,

SD3_DAT6, SD3_DAT7, SD3_RESET_B

1, 4, or 8 bit

USB USB-OTG

PHY

—

Table 97. Interface allocation during boot(continued)

Interface IP Instance Allocated Pads During Boot Comment

m mum 7mm mum. m /, WM: FALL Lee A u: v A up "3531153? ““ *Hr: um] P’xPrrm v 1 m n- m , Ll , u,

Package information and contact assignments

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6 Package information and contact assignments

This section includes the contact assignment information and mechanical package drawing.

6.1 12 x 12 mm package information

6.1.1 Case 1997-01, 12 x 12, 0.4 mm pitch, ball matrix

The following figure shows the top, bottom, and side views of the 12×12 mm BGA package.

Figure 87. 12 x 12 mm BGA, Case x Package Top, Bottom, and Side Views

Package information and contact assignments

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6.1.2 12 x 12 mm supplies contact assignments and functional contact

assignments

Table 98 shows supplies contact assignments for the 12 x 12 mm package.

Table 98. i.MX 7Dual 12 x 12 mm supplies contact assignments

Rail Ball Comments

DRAM_VREF T20 DDR voltage reference input. Connect to a

voltage source that is 50% of NVCC_DRAM

DRAM_ZQPAD Y18 DDR output buffer driver calibration reference

voltage input. Connect DRAM_ZQPAD to an

external 240

1% resistor to Vss

FUSE_FSOURCE V09

GND A01,A28,B05,B23,B26,C03,C05,C07,C10,C1

3,C14,C15,C23,C24,C25,C26,D08,

D12,D17,D21,E03,E05,E24,E26,F08,F10,F12

,F14,F15,F17,F21,H04,H06,H23,H25,L13,L16

,M04,M06,M23,M25,N11,N18,T11,T18,U04,U

06,U23,U25,V13,V16,W03,W06,AA04,AA06,

AA23,AA25,AC08,AC10,AC12,AC14,AC15,A

C17,AC21,AD03,AD05,AD06,AD24,AD26,AE

06,AE07,AE08,AE09,AE17,AE21,AF03,AF05,

AF08,AF09,AF10,AF11,AF13,AF14,AF15,AF2

4,AF26,AG10,AH01,AH28

GPANAIO AF02 Test signal. Should be left unconnected.

MIPI_VREG_0P4V B19

NVCC_DRAM V27,V28,W21,W23,W26,Y20,AA19,AC19,AF

17,AF18,AF19,AG18,AH18

Supply input for the DDR I/O interface

NVCC_DRAM_CKE V20

NVCC_ENET1 J18 Supply input for the ENET interfaces

NVCC_EPDC1 P20 Supply for EPDC

NVCC_EPDC2 N20 Supply for EPDC

NVCC_GPIO1 Y09 Supply for GPIO1

NVCC_GPIO2 Y11 Supply for GPIO2

NVCC_I2C R09 Supply for I2C

NVCC_LCD L20 Supply for LCD

NVCC_SAI J13 Supply for SAI

NVCC_SD1 J11 Supply for SD card

NVCC_SD2 L09 Supply for SD card

NVCC_SD3 N09 Supply for SD card

NVCC_SPI P09 Supply for SPI

Package information and contact assignments

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NVCC_UART T09 Supply for UART

PCIE_VP AB13 Supply input for the PCIe PHY

PCIE_VPH Y15 Supply input for the PCIe PHY

PVCC_ENET_CAP G16 Secondary supply for ENET. Requires external

capacitor

PVCC_EPDC_LCD_CAP R20 Secondary supply for EPDC, LCD. Requires

external capacitor

PVCC_GPIO_CAP AB11 Secondary supply for GPIO. Requires external

capacitor

PVCC_I2C_SPI_UART_CAP W08 Secondary supply for I2C, SPI, UART.

Requires external capacitor

PVCC_SAI_SD_CAP J14 Secondary supply for SAI, SD. Requires

external capacitor

USB_OTG1_VBUS C09 VBUS input for USB_OTG1

USB_OTG2_VBUS C11 VBUS input for USB_OTG2

VDD_1P2_CAP AA10 Supply for HSIC

VDD_ARM A20,B20,C16,C17,C18,C19,C20,C21,C22,F1

9,H19,J20,K21,K23,K26,L27,L28

Supply voltage for Arm

VDD_LPSR_1P0_CAP AG06 Secondary supply for LPSR. Requires external

capacitor

VDD_LPSR_IN AG05 Supply to LPSR

VDD_MIPI_1P0 J16 Supply for MIPI

VDD_SNVS_1P8_CAP AG07 Secondary supply for SNVS. Requires external

capacitor

VDD_SNVS_IN Y13 Supply for SNVS

VDD_SOC H10,J09,K03,K06,K08,L01,L02,L11,L18,N13,

N16,P03,P06,P23,P26,R26,T13,T16,V11,V18

,R03,R06,R23

Supply for SOC

VDD_TEMPSENSOR_1P8 AH05 Supply for temp sensor

VDD_USB_H_1P2 C12,G13 Supply input for the USB HSIC interface

VDD_USB_OTG1_1P0_CAP E09 Secondary supply for OTG1. Requires external

capacitor

VDD_USB_OTG1_3P3_IN D09 Secondary supply for OTG1. Requires external

capacitor

VDD_USB_OTG2_1P0_CAP F09 Secondary supply for OTG2. Requires external

capacitor

VDD_USB_OTG2_3P3_IN D11 Secondary supply for OTG2. Requires external

capacitor

Table 98. i.MX 7Dual 12 x 12 mm supplies contact assignments(continued)

Rail Ball Comments

Package information and contact assignments

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Table 99 shows an alpha-sorted list of functional contact assignments for the 12 x 12 mm package.

VDD_XTAL_1P8 AH02

VDDA_1P0_CAP AH07 Secondary supply for 1.0V. Requires external

capacitor

VDDA_1P8_IN AF04,AG03,AG04 Supply for 1.8V

VDDA_ADC1_1P8 AH04 Supply for ADC

VDDA_MIPI_1P8 J15 Supply for MIPI

VDDA_PHY_1P8 Y14

VDDD_1P0_CAP AC13,AE12,AF12 Secondary supply for 1.0V. Requires external

capacitor

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

AB07 ADC1_IN0 ADC1_VDDA_1P8 ADC1_IN0

AC07 ADC1_IN1 ADC1_VDDA_1P8 ADC1_IN1

AD07 ADC1_IN2 ADC1_VDDA_1P8 ADC1_IN2

AD09 ADC1_IN3 ADC1_VDDA_1P8 ADC1_IN3

Y01 BOOT_MODE0 NVCC_GPIO1 GPIO ALT0 BOOT_MODE0 100K PD

Y02 BOOT_MODE1 NVCC_GPIO1 GPIO ALT0 BOOT_MODE1 100K PD

AE04 CCM_CLK1_N VDDA_1P8 CCM_CLK1_N

AE03 CCM_CLK1_P VDDA_1P8 CCM_CLK1_P

AE02 CCM_CLK2 VDDA_1P8 CCM_CLK2

AC24 DRAM_ADDR00 NVCC_DRAM DDR DRAM_ADDR00

AC25 DRAM_ADDR01 NVCC_DRAM DDR DRAM_ADDR01

AC26 DRAM_ADDR02 NVCC_DRAM DDR DRAM_ADDR02

AB25 DRAM_ADDR03 NVCC_DRAM DDR DRAM_ADDR03

AB24 DRAM_ADDR04 NVCC_DRAM DDR DRAM_ADDR04

AE23 DRAM_ADDR05 NVCC_DRAM DDR DRAM_ADDR05

AF23 DRAM_ADDR06 NVCC_DRAM DDR DRAM_ADDR06

AE22 DRAM_ADDR07 NVCC_DRAM DDR DRAM_ADDR07

AD22 DRAM_ADDR08 NVCC_DRAM DDR DRAM_ADDR08

AC22 DRAM_ADDR09 NVCC_DRAM DDR DRAM_ADDR09

Table 98. i.MX 7Dual 12 x 12 mm supplies contact assignments(continued)

Rail Ball Comments

Package information and contact assignments

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AD23 DRAM_ADDR10 NVCC_DRAM DDR DRAM_ADDR10

AG27 DRAM_ADDR11 NVCC_DRAM DDR DRAM_ADDR11

AE27 DRAM_ADDR12 NVCC_DRAM DDR DRAM_ADDR12

AG28 DRAM_ADDR13 NVCC_DRAM DDR DRAM_ADDR13

AE20 DRAM_ADDR14 NVCC_DRAM DDR DRAM_ADDR14

AG26 DRAM_ADDR15 NVCC_DRAM DDR DRAM_ADDR15

AG25 DRAM_CAS_B NVCC_DRAM DDR DRAM_CAS_B

AE26 DRAM_CS0_B NVCC_DRAM DDR DRAM_CS0_B

AC23 DRAM_CS1_B NVCC_DRAM DDR DRAM_CS1_B

AH22 DRAM_DATA00 NVCC_DRAM DDR DRAM_DATA00

AG19 DRAM_DATA01 NVCC_DRAM DDR DRAM_DATA01

AG20 DRAM_DATA02 NVCC_DRAM DDR DRAM_DATA02

AF22 DRAM_DATA03 NVCC_DRAM DDR DRAM_DATA03

AF20 DRAM_DATA04 NVCC_DRAM DDR DRAM_DATA04

AG22 DRAM_DATA05 NVCC_DRAM DDR DRAM_DATA05

AF21 DRAM_DATA06 NVCC_DRAM DDR DRAM_DATA06

AH20 DRAM_DATA07 NVCC_DRAM DDR DRAM_DATA07

AC18 DRAM_DATA08 NVCC_DRAM DDR DRAM_DATA08

AB18 DRAM_DATA09 NVCC_DRAM DDR DRAM_DATA09

AD16 DRAM_DATA10 NVCC_DRAM DDR DRAM_DATA10

AC16 DRAM_DATA11 NVCC_DRAM DDR DRAM_DATA11

AD18 DRAM_DATA12 NVCC_DRAM DDR DRAM_DATA12

AE18 DRAM_DATA13 NVCC_DRAM DDR DRAM_DATA13

AB16 DRAM_DATA14 NVCC_DRAM DDR DRAM_DATA14

AE16 DRAM_DATA15 NVCC_DRAM DDR DRAM_DATA15

W27 DRAM_DATA16 NVCC_DRAM DDR DRAM_DATA16

Y27 DRAM_DATA17 NVCC_DRAM DDR DRAM_DATA17

Y26 DRAM_DATA18 NVCC_DRAM DDR DRAM_DATA18

Y28 DRAM_DATA19 NVCC_DRAM DDR DRAM_DATA19

AA26 DRAM_DATA20 NVCC_DRAM DDR DRAM_DATA20

AB26 DRAM_DATA21 NVCC_DRAM DDR DRAM_DATA21

AB27 DRAM_DATA22 NVCC_DRAM DDR DRAM_DATA22

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

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AB28 DRAM_DATA23 NVCC_DRAM DDR DRAM_DATA23

V23 DRAM_DATA24 NVCC_DRAM DDR DRAM_DATA24

V22 DRAM_DATA25 NVCC_DRAM DDR DRAM_DATA25

T23 DRAM_DATA26 NVCC_DRAM DDR DRAM_DATA26

T22 DRAM_DATA27 NVCC_DRAM DDR DRAM_DATA27

V24 DRAM_DATA28 NVCC_DRAM DDR DRAM_DATA28

V25 DRAM_DATA29 NVCC_DRAM DDR DRAM_DATA29

T25 DRAM_DATA30 NVCC_DRAM DDR DRAM_DATA30

T24 DRAM_DATA31 NVCC_DRAM DDR DRAM_DATA31

AH24 DRAM_DQM0 NVCC_DRAM DDR DRAM_DQM0

AD20 DRAM_DQM1 NVCC_DRAM DDR DRAM_DQM1

AD28 DRAM_DQM2 NVCC_DRAM DDR DRAM_DQM2

Y25 DRAM_DQM3 NVCC_DRAM DDR DRAM_DQM3

AF16 DRAM_ODT0 NVCC_DRAM DDR DRAM_ODT0

AH25 DRAM_RAS_B NVCC_DRAM DDR DRAM_RAS_B

V26 DRAM_RESET NVCC_DRAM_CKE DDR DRAM_RESET

AE28 DRAM_SDBA0 NVCC_DRAM DDR DRAM_SDBA0

AB22 DRAM_SDBA1 NVCC_DRAM DDR DRAM_SDBA1

AF27 DRAM_SDBA2 NVCC_DRAM DDR DRAM_SDBA2

Y22 DRAM_SDCKE0 NVCC_DRAM_CKE DDR DRAM_SDCKE0

AB23 DRAM_SDCKE1 NVCC_DRAM_CKE DDR DRAM_SDCKE1

AF25 DRAM_SDCLK0_N NVCC_DRAM DDRCLK DRAM_SDCLK0_N

AE25 DRAM_SDCLK0_P NVCC_DRAM DDRCLK DRAM_SDCLK0_P

AG23 DRAM_SDQS0_N NVCC_DRAM DDRCLK DRAM_SDQS0_N

AG24 DRAM_SDQS0_P NVCC_DRAM DDRCLK DRAM_SDQS0_P

AC20 DRAM_SDQS1_N NVCC_DRAM DDRCLK DRAM_SDQS1_N

AB20 DRAM_SDQS1_P NVCC_DRAM DDRCLK DRAM_SDQS1_P

AD27 DRAM_SDQS2_N NVCC_DRAM DDRCLK DRAM_SDQS2_N

AC27 DRAM_SDQS2_P NVCC_DRAM DDRCLK DRAM_SDQS2_P

Y24 DRAM_SDQS3_N NVCC_DRAM DDRCLK DRAM_SDQS3_N

Y23 DRAM_SDQS3_P NVCC_DRAM DDRCLK DRAM_SDQS3_P

AH27 DRAM_SDWE_B NVCC_DRAM DDR DRAM_SDWE_B

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

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M03 ECSPI1_MISO NVCC_SPI GPIO ALT5 GPIO4_IO[18] 100K PD

L03 ECSPI1_MOSI NVCC_SPI GPIO ALT5 GPIO4_IO[17] 100K PD

K02 ECSPI1_SCLK NVCC_SPI GPIO ALT5 GPIO4_IO[16] 100K PD

N03 ECSPI1_SS0 NVCC_SPI GPIO ALT5 GPIO4_IO[19] 100K PD

P02 ECSPI2_MISO NVCC_SPI GPIO ALT5 GPIO4_IO[22] 100K PD

N02 ECSPI2_MOSI NVCC_SPI GPIO ALT5 GPIO4_IO[21] 100K PD

N01 ECSPI2_SCLK NVCC_SPI GPIO ALT5 GPIO4_IO[20] 100K PD

R02 ECSPI2_SS0 NVCC_SPI GPIO ALT5 GPIO4_IO[23] 100K PD

G18 ENET1_COL NVCC_ENET1 GPIO ALT5 GPIO7_IO[15] 100K PD

F18 ENET1_CRS NVCC_ENET1 GPIO ALT5 GPIO7_IO[14] 100K PD

F07 ENET1_RD0 NVCC_ENET1 GPIO ALT5 GPIO7_IO[0] 100K PD

E07 ENET1_RD1 NVCC_ENET1 GPIO ALT5 GPIO7_IO[1] 100K PD

D07 ENET1_RD2 NVCC_ENET1 GPIO ALT5 GPIO_IO[2] 100K PD

D16 ENET1_RD3 NVCC_ENET1 GPIO ALT5 GPIO7_IO[3] 100K PD

C06 ENET1_RX_CLK NVCC_ENET1 GPIO ALT5 GPIO7_IO[13] 100K PD

E11 ENET1_RX_CTL NVCC_ENET1 GPIO ALT5 GPIO7_IO[4] 100K PD

F11 ENET1_RXC NVCC_ENET1 GPIO ALT5 GPIO7_IO[5] 100K PD

E13 ENET1_TD0 NVCC_ENET1 GPIO ALT5 GPIO7_IO[6] 100K PD

D13 ENET1_TD1 NVCC_ENET1 GPIO ALT5 GPIO_IO[7] 100K PD

E16 ENET1_TD2 NVCC_ENET1 GPIO ALT5 GPIO7_IO[8] 100K PD

F16 ENET1_TD3 NVCC_ENET1 GPIO ALT5 GPIO7_IO[9] 100K PD

F13 ENET1_TX_CLK NVCC_ENET1 GPIO ALT5 GPIO7_IO[12] 100K PD

G11 ENET1_TX_CTL NVCC_ENET1 GPIO ALT5 GPIO7_IO[10] 100K PD

G09 ENET1_TXC NVCC_ENET1 GPIO ALT5 GPIO7_IO[11] 100K PD

L23 EPDC_BDR0 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[28] 100K PD

L22 EPDC_BDR1 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[29] 100K PD

T27 EPDC_D00 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[0] 100K PD

U26 EPDC_D01 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[1] 100K PD

T26 EPDC_D02 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[2] 100K PD

R27 EPDC_D03 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[3] 100K PD

N23 EPDC_D04 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[4] 100K PD

T28 EPDC_D05 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[5] 100K PD

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 129

P27 EPDC_D06 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[6] 100K PD

N28 EPDC_D07 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[7] 100K PD

N27 EPDC_D08 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[8] 100K PD

N26 EPDC_D09 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[9] 100K PD

N25 EPDC_D10 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[10] 100K PD

N24 EPDC_D11 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[11] 100K PD

M26 EPDC_D12 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[12] 100K PD

L26 EPDC_D13 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[13] 100K PD

L25 EPDC_D14 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[14] 100K PD

N22 EPDC_D15 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[15] 100K PD

J23 EPDC_GDCLK NVCC_EPDC2 GPIO ALT5 GPIO2_IO[24] 100K PD

J22 EPDC_GDOE NVCC_EPDC2 GPIO ALT5 GPIO2_IO[25] 100K PD

L24 EPDC_GDRL NVCC_EPDC2 GPIO ALT5 GPIO2_IO[26] 100K PD

K27 EPDC_GDSP NVCC_EPDC2 GPIO ALT5 GPIO2_IO[27] 100K PD

J27 EPDC_PWRCOM NVCC_EPDC2 GPIO ALT5 GPIO2_IO[30] 100K PD

J26 EPDC_PWRSTAT NVCC_EPDC2 GPIO ALT5 GPIO2_IO[31] 100K PD

J25 EPDC_SDCE0 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[20] 100K PD

J24 EPDC_SDCE1 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[21] 100K PD

G22 EPDC_SDCE2 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[22] 100K PD

G23 EPDC_SDCE3 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[23] 100K PD

G24 EPDC_SDCLK NVCC_EPDC2 GPIO ALT5 GPIO2_IO[16] 100K PD

J28 EPDC_SDLE NVCC_EPDC2 GPIO ALT5 GPIO2_IO[17] 100K PD

G25 EPDC_SDOE NVCC_EPDC2 GPIO ALT5 GPIO2_IO[18] 100K PD

F26 EPDC_SDSHR NVCC_EPDC2 GPIO ALT5 GPIO2_IO[19] 100K PD

AF02 GPANAIO VDDA_1P8 GPIO GPANAIO

V04 GPIO1_IO00 NVCC_GPIO1 GPIO ALT0 GPIO1_IO00 100K PU

V05 GPIO1_IO01 NVCC_GPIO1 GPIO ALT0 GPIO1_IO01 100K PD

Y07 GPIO1_IO02 NVCC_GPIO1 GPIO ALT0 GPIO1_IO02 100K PD

Y06 GPIO1_IO03 NVCC_GPIO1 GPIO ALT0 GPIO1_IO03 100K PD

Y05 GPIO1_IO04 NVCC_GPIO1 GPIO ALT0 GPIO1_IO04 100K PD

Y04 GPIO1_IO05 NVCC_GPIO1 GPIO ALT0 GPIO1_IO05 100K PD

V06 GPIO1_IO06 NVCC_GPIO1 GPIO ALT0 GPIO1_IO06 100K PD

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors130

V07 GPIO1_IO07 NVCC_GPIO1 GPIO ALT0 GPIO1_IO07 100K PD

AB03 GPIO1_IO08 NVCC_GPIO2 GPIO ALT0 GPIO1_IO08 100K PD

AB04 GPIO1_IO09 NVCC_GPIO2 GPIO ALT0 GPIO1_IO09 100K PD

AB05 GPIO1_IO10 NVCC_GPIO2 GPIO ALT0 GPIO1_IO10 100K PD

AB06 GPIO1_IO11 NVCC_GPIO2 GPIO ALT0 GPIO1_IO11 100K PD

AC06 GPIO1_IO12 NVCC_GPIO2 GPIO ALT0 GPIO1_IO12 100K PD

AC05 GPIO1_IO13 NVCC_GPIO2 GPIO ALT0 GPIO1_IO13 100K PD

AC04 GPIO1_IO14 NVCC_GPIO2 GPIO ALT0 GPIO1_IO14 100K PD

AC03 GPIO1_IO15 NVCC_GPIO2 GPIO ALT0 GPIO1_IO15 100K PD

N04 I2C1_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[8] 100K PD

N05 I2C1_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[9] 100K PD

N06 I2C2_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[10] 100K PD

N07 I2C2_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[11] 100K PD

T06 I2C3_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[12] 100K PD

T07 I2C3_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[13] 100K PD

T05 I2C4_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[14] 100K PD

T04 I2C4_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[15] 100K PD

AB01 JTAG_MOD NVCC_GPIO2 GPIO ALT0 JTAG_MOD 100K PU

AD01 JTAG_TCK NVCC_GPIO2 GPIO ALT0 JTAG_TCK 47K PU

AC02 JTAG_TDI NVCC_GPIO2 GPIO ALT0 JTAG_TDI 47K PU

AE01 JTAG_TDO NVCC_GPIO2 GPIO ALT0 JTAG_TDO 100K PU

AD02 JTAG_TMS NVCC_GPIO2 GPIO ALT0 JTAG_TMS 47K PU

AB02 JTAG_TRST_B NVCC_GPIO2 GPIO ALT0 JTAG_TRST_B 47K PU

D20 LCD_CLK NVCC_LCD GPIO ALT5 GPIO3_IO[0] 100K PD

F22 LCD_DATA00 NVCC_LCD GPIO ALT5 GPIO3_IO[5] 100K PD

F23 LCD_DATA01 NVCC_LCD GPIO ALT5 GPIO3_IO[6] 100K PD

E23 LCD_DATA02 NVCC_LCD GPIO ALT5 GPIO3_IO[7] 100K PD

E22 LCD_DATA03 NVCC_LCD GPIO ALT5 GPIO3_IO[8] 100K PD

D22 LCD_DATA04 NVCC_LCD GPIO ALT5 GPIO3_IO[9] 100K PD

D23 LCD_DATA05 NVCC_LCD GPIO ALT5 GPIO3_IO[10] 100K PD

E18 LCD_DATA06 NVCC_LCD GPIO ALT5 GPIO3_IO[11] 100K PD

D18 LCD_DATA07 NVCC_LCD GPIO ALT5 GPIO3_IO[12] 100K PD

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 131

F20 LCD_DATA08 NVCC_LCD GPIO ALT5 GPIO3_IO[13] 100K PD

G20 LCD_DATA09 NVCC_LCD GPIO ALT5 GPIO3_IO[14] 100K PD

A27 LCD_DATA10 NVCC_LCD GPIO ALT5 GPIO3_IO[15] 100K PD

E27 LCD_DATA11 NVCC_LCD GPIO ALT5 GPIO3_IO[16] 100K PD

F27 LCD_DATA12 NVCC_LCD GPIO ALT5 GPIO3_IO[17] 100K PD

E28 LCD_DATA13 NVCC_LCD GPIO ALT5 GPIO3_IO[18] 100K PD

G27 LCD_DATA14 NVCC_LCD GPIO ALT5 GPIO3_IO[19] 100K PD

B28 LCD_DATA15 NVCC_LCD GPIO ALT5 GPIO3_IO[20] 100K PD

C27 LCD_DATA16 NVCC_LCD GPIO ALT5 GPIO3_IO[21] 100K PD

D26 LCD_DATA17 NVCC_LCD GPIO ALT5 GPIO3_IO[22] 100K PD

D27 LCD_DATA18 NVCC_LCD GPIO ALT5 GPIO3_IO[23] 100K PD

D28 LCD_DATA19 NVCC_LCD GPIO ALT5 GPIO3_IO[24] 100K PD

G26 LCD_DATA20 NVCC_LCD GPIO ALT5 GPIO3_IO[25] 100K PD

H26 LCD_DATA21 NVCC_LCD GPIO ALT5 GPIO3_IO[26] 100K PD

B27 LCD_DATA22 NVCC_LCD GPIO ALT5 GPIO3_IO[27] 100K PD

D25 LCD_DATA23 NVCC_LCD GPIO ALT5 GPIO3_IO[28] 100K PD

G28 LCD_ENABLE NVCC_LCD GPIO ALT5 GPIO3_IO[1] 100K PD

F25 LCD_HSYNC NVCC_LCD GPIO ALT5 GPIO3_IO[2] 100K PD

E20 LCD_RESET NVCC_LCD GPIO ALT5 GPIO3_IO[4] 100K PD

F24 LCD_VSYNC NVCC_LCD GPIO ALT5 GPIO3_IO[3] 100K PD

B16 MIPI_CSI_CLK_N MIPI_VDDA_1P8 MIPI_CSI_CLK_N

A16 MIPI_CSI_CLK_P MIPI_VDDA_1P8 MIPI_CSI_CLK_P

B18 MIPI_CSI_D0_N MIPI_VDDA_1P8 MIPI_CSI_D0_N

A18 MIPI_CSI_D0_P MIPI_VDDA_1P8 MIPI_CSI_D0_P

B15 MIPI_CSI_D1_N MIPI_VDDA_1P8 MIPI_CSI_D1_N

B14 MIPI_CSI_D1_P MIPI_VDDA_1P8 MIPI_CSI_D1_P

B24 MIPI_DSI_CLK_N MIPI_VDDA_1P8 MIPI_DSI_CLK_N

A24 MIPI_DSI_CLK_P MIPI_VDDA_1P8 MIPI_DSI_CLK_P

B25 MIPI_DSI_D0_N MIPI_VDDA_1P8 MIPI_DSI_D0_N

A25 MIPI_DSI_D0_P MIPI_VDDA_1P8 MIPI_DSI_D0_P

A22 MIPI_DSI_D1_N MIPI_VDDA_1P8 MIPI_DSI_D1_N

B22 MIPI_DSI_D1_P MIPI_VDDA_1P8 MIPI_DSI_D1_P

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors132

AD13 ONOFF VDD_SNVS_IN ONOFF

AG13 PCIE_REFCLKIN_N PCIE_VPH PCIE_REFCLKIN_N

AH13 PCIE_REFCLKIN_P PCIE_VPH PCIE_REFCLKIN_P

AG11 PCIE_REFCLKOUT_N PCIE_VPH PCIE_REFCLKOUT_N

AH11 PCIE_REFCLKOUT_P PCIE_VPH PCIE_REFCLKOUT_P

Y16 PCIE_REXT PCIE_VPH PCIE_REXT

AG16 PCIE_RX_N PCIE_VPH_RX PCIE_RX_N

AH16 PCIE_RX_P PCIE_VPH_RX PCIE_RX_P

AG14 PCIE_TX_N PCIE_VPH_TX PCIE_TX_N

AG15 PCIE_TX_P PCIE_VPH_TX PCIE_TX_P

AD11 CCM_PMIC_STBY_REQ VDD_SNVS_IN GPIO CCM_PMIC_STBY_REQ

Y03 POR_B NVCC_GPIO1 GPIO ALT0 POR_B 100K PU

AG09 RTC_XTALI VDD_SNVS_1P8_CAP RTC_XTALI

AH09 RTC_XTALO VDD_SNVS_1P8_CAP RTC_XTALO

D03 SAI1_MCLK NVCC_SAI GPIO ALT5 GPIO6_IO[18] 100K PD

G04 SAI1_RXC NVCC_SAI GPIO ALT5 GPIO6_IO[17] 100K PD

F03 SAI1_RXD NVCC_SAI GPIO ALT5 GPIO6_IO[12] 100K PD

C04 SAI1_RXFS NVCC_SAI GPIO ALT5 GPIO6_IO[16] 100K PD

F04 SAI1_TXC NVCC_SAI GPIO ALT5 GPIO6_IO[13] 100K PD

G05 SAI1_TXD NVCC_SAI GPIO ALT5 GPIO6_IO[15] 100K PD

F05 SAI1_TXFS NVCC_SAI GPIO ALT5 GPIO6_IO[14] 100K PD

E06 SAI2_RXD NVCC_SAI GPIO ALT5 GPIO6_IO[21] 100K PD

D04 SAI2_TXC NVCC_SAI GPIO ALT5 GPIO6_IO[20] 100K PD

D06 SAI2_TXD NVCC_SAI GPIO ALT5 GPIO6_IO[22] 100K PD

F06 SAI2_TXFS NVCC_SAI GPIO ALT5 GPIO6_IO[19] 100K PD

A05 SD1_CD_B NVCC_SD1 GPIO ALT5 GPIO5_IO[0] 100K PD

B03 SD1_CLK NVCC_SD1 GPIO ALT5 GPIO5_IO[3] 100K PD

A02 SD1_CMD NVCC_SD1 GPIO ALT5 GPIO5_IO[4] 100K PD

B04 SD1_DATA0 NVCC_SD1 GPIO ALT5 GPIO5_IO[5] 100K PD

A04 SD1_DATA1 NVCC_SD1 GPIO ALT5 GPIO5_IO[6] 100K PD

B02 SD1_DATA2 NVCC_SD1 GPIO ALT5 GPIO5_IO[7] 100K PD

B01 SD1_DATA3 NVCC_SD1 GPIO ALT5 GPIO5_IO[8] 100K PD

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 133

C02 SD1_RESET_B NVCC_SD1 GPIO ALT5 GPIO5_IO[2] 100K PD

D02 SD1_WP NVCC_SD1 GPIO ALT5 GPIO5_IO[1] 100K PD

E01 SD2_CD_B NVCC_SD2 GPIO ALT5 GPIO5_IO[9] 100K PD

G01 SD2_CLK NVCC_SD2 GPIO ALT5 GPIO5_IO[12] 100K PD

G02 SD2_CMD NVCC_SD2 GPIO ALT5 GPIO5_IO[13] 100K PD

F02 SD2_DATA0 NVCC_SD2 GPIO ALT5 GPIO5_IO[14] 100K PD

E02 SD2_DATA1 NVCC_SD2 GPIO ALT5 GPIO5_IO[15] 100K PD

H03 SD2_DATA2 NVCC_SD2 GPIO ALT5 GPIO5_IO[16] 100K PD

G03 SD2_DATA3 NVCC_SD2 GPIO ALT5 GPIO5_IO[17] 100K PD

J03 SD2_RESET_B NVCC_SD2 GPIO ALT5 GPIO5_IO[11] 100K PD

D01 SD2_WP NVCC_SD2 GPIO ALT5 GPIO5_IO[10] 100K PD

J06 SD3_CLK NVCC_SD3 GPIO ALT5 GPIO6_IO[0] 100K PD

L04 SD3_CMD NVCC_SD3 GPIO ALT5 GPIO6_IO[1] 100K PD

G06 SD3_DATA0 NVCC_SD3 GPIO ALT5 GPIO6_IO[2] 100K PD

G07 SD3_DATA1 NVCC_SD3 GPIO ALT5 GPIO6_IO[3] 100K PD

L07 SD3_DATA2 NVCC_SD3 GPIO ALT5 GPIO6_IO[4] 100K PD

L06 SD3_DATA3 NVCC_SD3 GPIO ALT5 GPIO6_IO[5] 100K PD

L05 SD3_DATA4 NVCC_SD3 GPIO ALT5 GPIO6_IO[6] 100K PD

J07 SD3_DATA5 NVCC_SD3 GPIO ALT5 GPIO6_IO[7] 100K PD

J05 SD3_DATA6 NVCC_SD3 GPIO ALT5 GPIO6_IO[8] 100K PD

J04 SD3_DATA7 NVCC_SD3 GPIO ALT5 GPIO6_IO[9] 100K PD

J02 SD3_RESET_B NVCC_SD3 GPIO ALT5 GPIO6_IO[11] 100K PD

J01 SD3_STROBE NVCC_SD3 GPIO ALT5 GPIO6_IO[10] 100K PD

AE13 SNVS_PMIC_ON_REQ VDD_SNVS_IN SNVS_PMIC_ON_REQ

AE11 SNVS_TAMPER0 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER0

AC11 SNVS_TAMPER1 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER1

AC09 SNVS_TAMPER2 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER2

AB09 SNVS_TAMPER9 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER9

AF06 TEMPSENSOR_RESERVE VDD_TEMPSENSOR_1P8

AF07 TEMPSENSOR_REXT VDD_TEMPSENSOR_1P8 TEMPSENSOR_REXT

AA03 TEST_MODE NVCC_GPIO1 GPIO ALT0 TEST_MODE 100K PD

T01 UART1_RXD NVCC_UART GPIO ALT5 GPIO4_IO[0] 100K PD

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors134

V01 UART1_TXD NVCC_UART GPIO ALT5 GPIO4_IO[1] 100K PD

T02 UART2_RXD NVCC_UART GPIO ALT5 GPIO4_IO[2] 100K PD

T03 UART2_TXD NVCC_UART GPIO ALT5 GPIO4_IO[3] 100K PD

V03 UART3_CTS NVCC_UART GPIO ALT5 GPIO4_IO[7] 100K PD

W02 UART3_RTS NVCC_UART GPIO ALT5 GPIO4_IO[6] 100K PD

V02 UART3_RXD NVCC_UART GPIO ALT5 GPIO4_IO[4] 100K PD

U03 UART3_TXD NVCC_UART GPIO ALT5 GPIO4_IO[5] 100K PD

A13 USB_H_DATA USB_H_VDD_1P2 USB_H_DATA

B13 USB_H_STROBE USB_H_VDD_1P2 USB_H_STROBE

B06 USB_OTG1_CHD_B USB_OTG1_VDDA_3P3 USB_OTG1_CHD_B

B07 USB_OTG1_DN USB_OTG1_VDDA_3P3 USB_OTG1_DN

A07 USB_OTG1_DP USB_OTG1_VDDA_3P3 USB_OTG1_DP

B09 USB_OTG1_ID USB_OTG1_VDDA_3P3 USB_OTG1_ID

C08 USB_OTG1_REXT USB_OTG1_VDDA_3P3 USB_OTG1_REXT

B11 USB_OTG2_DN USB_OTG2_VDDA_3P3 USB_OTG2_DN

A11 USB_OTG2_DP USB_OTG2_VDDA_3P3 USB_OTG2_DP

B10 USB_OTG2_ID USB_OTG2_VDDA_3P3 USB_OTG2_ID

A09 USB_OTG2_REXT USB_OTG2_VDDA_3P3 USB_OTG2_REXT

AG02 XTALI VDDA_1P8 XTALI

AG01 XTALO VDDA_1P8 XTALO

The state immediately after RESET and before ROM firmware or software has executed.

Table 99. i.MX 7Dual 12 x 12 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 135

6.1.3 i.MX 7Dual 12 x 12 mm 0.4 mm Pitch Ball Map

The following table shows the i.MX 7Dual 12 x 12 mm 0.4 mm pitch ball map.

Table 100. i.MX 7Dual 12 x 12 mm 0.4 mm pitch ball map

12345678910111213141516171819202122232425262728

VSS

SD1_CMD

SD1_DATA1

SD1_CD_B

USB_OTG1_DP

USB_OTG2_REXT

USB_OTG2_DP

USB_H_DATA

MIPI_CSI_CLK_P

MIPI_CSI_D0_P

VDD_ARM

MIPI_DSI_D1_N

MIPI_DSI_CLK_P

MIPI_DSI_D0_P

LCD1_DATA10

VSS

SD1_DATA3

SD1_DATA2

SD1_CLK

SD1_DATA0

VSS

USB_OTG1_CHD_B

USB_OTG1_DN

USB_OTG1_ID

USB_OTG2_ID

USB_OTG2_DN

USB_H_STROBE

MIPI_CSI_D1_P

MIPI_CSI_D1_N

MIPI_CSI_CLK_N

MIPI_CSI_D0_N

MIPI_VREG_0P4V

VDD_ARM

MIPI_DSI_D1_P

VSS

MIPI_DSI_CLK_N

MIPI_DSI_D0_N

VSS

LCD1_DATA22

LCD1_DATA15

SD1_RESET_B

VSS

SAI1_RXFS

VSS

ENET1_RX_CLK

VSS

USB_OTG1_REXT

USB_OTG1_VBUS

VSS

USB_OTG2_VBUS

VDD_USB_H_1P2

VSS

VDD_ARM

VSS

LCD1_DATA16

SD2_WP

SD1_WP

SAI1_MCLK

SAI2_TXC

SAI2_TXD

ENET1_RDATA2

VSS

VDD_USB_OTG1_3P3_IN

VDD_USB_OTG2_3P3_IN

VSS

ENET1_TDATA1

ENET1_RDATA3

VSS

LCD1_DATA07

LCD1_CLK

VSS

LCD1_DATA04

LCD1_DATA05

LCD1_DATA23

LCD1_DATA17

LCD1_DATA18

LCD1_DATA19

SD2_CD_B

SD2_DATA1

VSS

SAI2_RXD

ENET1_RDATA1

VDD_USB_OTG1_1P0_CAP

ENET1_RX_CTL

ENET1_TDATA0

ENET1_TDATA2

LCD1_DATA06

LCD1_RESET

LCD1_DATA03

LCD1_DATA02

VSS

LCD1_DATA11

LCD1_DATA13

SD2_DATA0

SAI1_RXD

SAI1_TXC

SAI1_TXFS

SAI2_TXFS

ENET1_RDATA0

VSS

VDD_USB_OTG2_1P0_CAP

VSS

ENET1_RXC

VSS

ENET1_TX_CLK

VSS

ENET1_TDATA3

VSS

ENET1_CRS

VDD_ARM

LCD1_DATA08

VSS

LCD1_DATA00

LCD1_DATA01

LCD1_VSYNC

LCD1_HSYNC

EPDC1_SDSHR

LCD1_DATA12

SD2_CLK

SD2_CMD

SD2_DATA3

SAI1_RXC

SAI1_TXD

SD3_DATA0

SD3_DATA1

ENET1_TXC

ENET1_TX_CTL

VDD_USB_H_1P2

PVCC_ENET_CAP

ENET1_COL

LCD1_DATA09

EPDC1_SDCE2

EPDC1_SDCE3

EPDC1_SDCLK

EPDC1_SDOE

LCD1_DATA20

LCD1_DATA14

LCD1_ENABLE

12345678910111213141516171819202122232425262728

04 07 AP

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors136

SD2_DATA2

VSS

VDD_SOC

VDD_ARM

VSS

LCD1_DATA21

SD3_STROBE

SD3_RESET_B

SD2_RESET_B

SD3_DATA7

SD3_DATA6

SD3_CLK

SD3_DATA5

VDD_SOC

NVCC_SD1

NVCC_SAI

PVCC_SAI_SD_CAP

VDDA_MIPI_1P8

VDD_MIPI_1P0

NVCC_ENET1

VDD_ARM

EPDC1_GDOE

EPDC1_GDCLK

EPDC1_SDCE1

EPDC1_SDCE0

EPDC1_PWRSTAT

EPDC1_PWRCOM

EPDC1_SDLE

ECSPI1_SCLK

VDD_SOC

VDD_ARM

EPDC1_GDSP

VDD_SOC

ECSPI1_MOSI

SD3_CMD

SD3_DATA4

SD3_DATA3

SD3_DATA2

NVCC_SD2

VDD_SOC

VSS

VDD_SOC

NVCC_LCD

EPDC1_BDR1

EPDC1_BDR0

EPDC1_GDRL

EPDC1_DATA14

EPDC1_DATA13

VDD_ARM

ECSPI1_MISO

VSS

EPDC1_DATA12

ECSPI2_SCLK

ECSPI2_MOSI

ECSPI1_SS0

I2C1_SCL

I2C1_SDA

I2C2_SCL

I2C2_SDA

NVCC_SD3

VSS

VDD_SOC

VSS

NVCC_EPDC2

EPDC1_DATA15

EPDC1_DATA04

EPDC1_DATA11

EPDC1_DATA10

EPDC1_DATA09

EPDC1_DATA08

EPDC1_DATA07

ECSPI2_MISO

VDD_SOC

NVCC_SPI

NVCC_EPDC1

VDD_SOC

EPDC1_DATA06

ECSPI2_SS0

VDD_SOC

NVCC_I2C

PVCC_EPDC_LCD_CAP

VDD_SOC

EPDC1_DATA03

UART1_RXD

UART2_RXD

UART2_TXD

I2C4_SDA

I2C4_SCL

I2C3_SCL

I2C3_SDA

NVCC_UART

VSS

VDD_SOC

VSS

DRAM_VREF

DRAM_DATA27

DRAM_DATA26

DRAM_DATA31

DRAM_DATA30

EPDC1_DATA02

EPDC1_DATA00

EPDC1_DATA05

UART3_TXD

VSS

EPDC1_DATA01

Table 100. i.MX 7Dual 12 x 12 mm 0.4 mm pitch ball map(continued)

12345678910111213141516171819202122232425262728

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 137

UART1_TXD

UART3_RXD

UART3_CTS

GPIO1_IO00

GPIO1_IO01

GPIO1_IO06

GPIO1_IO07

FUSE_FSOURCE

VDD_SOC

VSS

VDD_SOC

NVCC_DRAM_CKE

DRAM_DATA25

DRAM_DATA24

DRAM_DATA28

DRAM_DATA29

DRAM_RESET

NVCC_DRAM

UART3_RTS

VSS

PVCC_I2C_SPI_UART_CAP

NVCC_DRAM

DRAM_DATA16

BOOT_MODE0

BOOT_MODE1

POR_B

GPIO1_IO05

GPIO1_IO04

GPIO1_IO03

GPIO1_IO02

NVCC_GPIO1

NVCC_GPIO2

VDD_SNVS_IN

VDDA_PHY_1P8

PCIE_VPH

PCIE_REXT

DRAM_ZQPAD

NVCC_DRAM

DRAM_SDCKE0

DRAM_SDQS3_P

DRAM_SDQS3_N

DRAM_DQM3

DRAM_DATA18

DRAM_DATA17

DRAM_DATA19

TEST_MODE

VSS

VDD_1P2_CAP

NVCC_DRAM

VSS

DRAM_DATA20

JTAG_MOD

JTAG_TRST_B

GPIO1_IO08

GPIO1_IO09

GPIO1_IO10

GPIO1_IO11

ADC1_IN0

SNVS_TAMPER09

PVCC_GPIO_CAP

PCIE_VP

DRAM_DATA14

DRAM_DATA09

DRAM_SDQS1_P

DRAM_SDBA1

DRAM_SDCKE1

DRAM_ADDR04

DRAM_ADDR03

DRAM_DATA21

DRAM_DATA22

DRAM_DATA23

JTAG_TDI

GPIO1_IO15

GPIO1_IO14

GPIO1_IO13

GPIO1_IO12

ADC1_IN1

VSS

SNVS_TAMPER02

VSS

SNVS_TAMPER01

VSS

VDDD_1P0_CAP

VSS

DRAM_DATA11

VSS

DRAM_DATA08

NVCC_DRAM

DRAM_SDQS1_N

VSS

DRAM_ADDR09

DRAM_CS1_B

DRAM_ADDR00

DRAM_ADDR01

DRAM_ADDR02

DRAM_SDQS2_P

JTAG_TCK

JTAG_TMS

VSS

ADC1_IN2

ADC1_IN3

PMIC_STBY_REQ

ONOFF

DRAM_DATA10

DRAM_DATA12

DRAM_DQM1

DRAM_ADDR08

DRAM_ADDR10

VSS

DRAM_SDQS2_N

DRAM_DQM2

JTAG_TDO

CCM_CLK2

CCM_CLK1_P

CCM_CLK1_N

VSS

SNVS_TAMPER00

VDDD_1P0_CAP

SNVS_PMIC_ON_REQ

DRAM_DATA15

VSS

DRAM_DATA13

DRAM_ADDR14

VSS

DRAM_ADDR07

DRAM_ADDR05

DRAM_SDCLK0_P

DRAM_CS0_B

DRAM_ADDR12

DRAM_SDBA0

Table 100. i.MX 7Dual 12 x 12 mm 0.4 mm pitch ball map(continued)

12345678910111213141516171819202122232425262728

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors138

GPANAIO

VSS

VDDA_1P8_IN

VSS

TEMPSENSOR_RESERVE

TEMPSENSOR_REXT

VSS

VDDD_1P0_CAP

VSS

DRAM_ODT0

NVCC_DRAM

DRAM_DATA04

DRAM_DATA06

DRAM_DATA03

DRAM_ADDR06

VSS

DRAM_SDCLK0_N

VSS

DRAM_SDBA2

XTALO

XTALI

VDDA_1P8_IN

VDD_LPSR_IN

VDD_LPSR_1P0_CAP

VDD_SNVS_1P8_CAP

RTC_XTALI

VSS

PCIE_REFCLKOUT_N

PCIE_REFCLKIN_N

PCIE_TX_N

PCIE_TX_P

PCIE_RX_N

NVCC_DRAM

DRAM_DATA01

DRAM_DATA02

DRAM_DATA05

DRAM_SDQS0_N

DRAM_SDQS0_P

DRAM_CAS_B

DRAM_ADDR15

DRAM_ADDR11

DRAM_ADDR13

VSS

VDD_XTAL_1P8

VDDA_ADC1_1P8

VDD_TEMPSENSOR_1P8

VDDA_1P0_CAP

RTC_XTALO

PCIE_REFCLKOUT_P

PCIE_REFCLKIN_P

PCIE_RX_P

NVCC_DRAM

DRAM_DATA07

DRAM_DATA00

DRAM_DQM0

DRAM_RAS_B

DRAM_SDWE_B

VSS

Table 100. i.MX 7Dual 12 x 12 mm 0.4 mm pitch ball map(continued)

12345678910111213141516171819202122232425262728

m m} x w: DE mac 3 mm ; 4 Jf \ V w ‘ ‘ \[ulLr ' 5 1 E F 1 1 ,* , ,,,,,,,, + ,,,,,,,, u ,,%, \ i i E i x ; 1 _ .7 m 1E \mm IE 7 _B "M rrEEIVLIEHV / “ A7 ,, m \I: ‘EI [in VB I: \[l‘li \JI: :v‘ n ‘ n K K n ”m

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 139

6.2 19 x 19 mm package information

6.2.1 Case “Y”, 19 x 19 mm, 0.75 mm pitch, ball matrix

Figure 88 shows the top, bottom, and side views of the 19×19 mm BGA package.

Figure 88. 19 x 19 mm BGA, Case x Package Top, Bottom, and Side Views

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors140

6.2.2 19 x 19 mm supplies contact assignments and functional contact

assignments

Table 101 shows supplies contact assignments for the 19 x 19 mm package.

Table 101. i.MX 7Dual 19 x 19 mm supplies contact assignments

Rail Pins Comments

ADC2_VDDA_1P8 AB03

DRAM_VREF AC13

DRAM_ZQPAD AB13 DDR output buffer driver calibration reference

voltage input. Connect DRAM_ZQPAD to an

external 240

1% resistor to Vss

FUSE_FSOURCE0 V08

GND A01,A03,A06,A09,A13,A17,A21,A25,B03,B06

,B09,B13,B17,B21,C09,C13,C15,C16,C18,C1

9,D01,D02,D04,D07,D10,D22,F07,F08,F11,F

13,G07,G04,G09,G11,G13,G15,G17,G19,G2

2,H01,H02,J07,J19,K04,K10,K12,K14,K16,K2

2,L07,L11,L13,L15,L19,M10,M12,M14,M16,M

24,M25,N04,N07,N11,N13,N15,N19,P10,P12,

P14,P16,R07,R11,R13,R15,R19,R20,R21,R2

3,T04,T10,T12,T14,T16,T20,U07,U11,U19,U2

0,U23,V20,W01,W02,W04,W07,W09,W11,W1

3,W15,W17,W19,W20,W23,Y06,Y13,Y14,Y15

,Y16,Y17,Y18,Y19,AA01,AA02,AA06,AA08,A

A15,AA23,AB04,AB05,AB07,AB09,AB12,AC0

6,AC09,AC12,AC15,AC17,AC19,AC21,AC23,

AD02,AD07,AD09,AD12,AE01,AE05,AE07,A

E09,AE12,AE24,AE25, AD05

Ground

GPANIO V04 Test signal. Should be left unconnected.

MIPI_VREG_0P4V H18

NVCC_DRAM T21,U21,V21,W21,Y21,AA16,AA17,AA18,AA

19,AA20,AA21

NVCC_DRAM_CKE Y20

NVCC_ENET1 H16 Supply for ENET interface

NVCC_EPDC1 M18 Supply for EPDC interface

NVCC_EPDC2 L17 Supply for EPDC interface

NVCC_GPIO1 P08 Supply for GPIO1 interface

NVCC_GPIO2 T08 Supply for GPIO2 interface

NVCC_I2C M08 Supply for I2C interface

NVCC_LCD K18 Supply for LCD interface

NVCC_SAI F12 Supply for SAI interface

NVCC_SD1 E07 Supply for SD card interface

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 141

NVCC_SD2 H08 Supply for SD card interface

NVCC_SD3 K08 Supply for SD card interface

NVCC_SPI L09 Supply for SPI interface

NVCC_UART N09 Supply for UART interface

PCIE_VP AA10 Supply for PCIe' interface

PCIE_VP_RX AA12 Supply for PCIe PHY

PCIE_VP_TX AA11 Supply for PCIe PHY

PCIE_VPH Y10

PCIE_VPH_RX Y12

PCIE_VPH_TX Y11

PVCC_ENET_CAP H14 Secondary supply for ENET (internal regulator

output). Requires external capacitors

PVCC_EPDC_LCD_CAP N17 Secondary supply for EPDC_LCD (internal

regulator output). Requires external capacitors

PVCC_GPIO_CAP V10 Secondary supply for GPIO (internal regulator

output). Requires external capacitors

PVCC_I2C_SPI_UART_CAP R09 Secondary supply for I2C_SPI_UART (internal

regulator output). Requires external capacitors

PVCC_SAI_SD_CAP J09 Secondary supply for SAI_SD (internal

regulator output). Requires external capacitors

USB_OTG1_VBUS C08

USB_OTG1_VDDA_3P3_IN F10

USB_OTG2_VBUS C10

USB_OTG2_VDDA_3P3_IN F09

VDD_1P2_CAP U09 Supply for HSIC

VDD_ARM C17,C20,D17,D20,F22,F23,J22,J23 Supply for Arm

VDD_LPSR_1P0_CAP AC05 Secondary supply for LPSR (internal regulator

output). Requires external capacitors

VDD_LPSR_IN W06 Supply for LPSR

VDD_SNVS_1P8_CAP AE08 Secondary supply for SNVS (internal regulator

output). Requires external capacitors

VDD_SNVS_IN AD08 Primary supply for the SNVS regulator

VDD_SOC C14,D14,F03,F04,F18,F19,J03,J04,M03,M04,

P18,R03,R04,R17,T18,U13,U15,U17,V12,V1

4,V16,V18

Supply for SOC

VDD_TEMPSENSOR_1P8 AC04 Supply for VDDe PHY

Table 101. i.MX 7Dual 19 x 19 mm supplies contact assignments(continued)

Rail Pins Comments

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors142

Table 102 shows an alpha-sorted list of functional contact assignments for the 19 x 19 mm package.

VDD_USB_H_1P2 H12 Supply input for the USB HSIC Interface

VDD_USB_OTG1_1P0_CAP H10 Secondary supply for USB OTG (internal

regulator output). Requires external capacitors

VDD_USB_OTG2_1P0_CAP J11 Secondary supply for USB OTG (internal

regulator output). Requires external capacitors

VDD_XTAL_1P8 V05

VDDA_1P0_CAP V03 Secondary supply for 1P0 (internal regulator

output). Requires external capacitors

VDDA_1P8_IN V06,W05

VDDA_ADC1_1P8 AC03 Supply for ADC

VDDA_PHY_1P8 Y09

VDDD_1P0_CAP AA09 Secondary supply for 1P0 (internal regulator

output). Requires external capacitors

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

AD01 ADC1_IN0 ADC1_VDDA_1P8 ADC1_IN0

AD03 ADC1_IN1 ADC1_VDDA_1P8 ADC1_IN1

AE02 ADC1_IN2 ADC1_VDDA_1P8 ADC1_IN2

AE03 ADC1_IN3 ADC1_VDDA_1P8 ADC1_IN3

AC01 ADC2_IN0 ADC2_VDDA_1P8 ADC2_IN0

AC02 ADC2_IN1 ADC2_VDDA_1P8 ADC2_IN1

AB01 ADC2_IN2 ADC2_VDDA_1P8 ADC2_IN2

AB02 ADC2_IN3 ADC2_VDDA_1P8 ADC2_IN3

P04 BOOT_MODE0 NVCC_GPIO1 GPIO ALT0 BOOT_MODE0 100K PD

P05 BOOT_MODE1 NVCC_GPIO1 GPIO ALT0 BOOT_MODE1 100K PD

Y01 CCM_CLK1_N VDDA_1P8 CCM_CLK1_N

Y02 CCM_CLK1_P VDDA_1P8 CCM_CLK1_P

W03 CCM_CLK2 VDDA_1P8 CCM_CLK2

AC07 CCM_PMIC_STBY_REQ VDD_SNVS_IN CCM_PMIC_STBY_REQ

AB19 DRAM_ADDR00 NVCC_DRAM DDR DRAM_ADDR00

AB16 DRAM_ADDR01 NVCC_DRAM DDR DRAM_ADDR01

Table 101. i.MX 7Dual 19 x 19 mm supplies contact assignments(continued)

Rail Pins Comments

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 143

AC18 DRAM_ADDR02 NVCC_DRAM DDR DRAM_ADDR02

AC20 DRAM_ADDR03 NVCC_DRAM DDR DRAM_ADDR03

AB21 DRAM_ADDR04 NVCC_DRAM DDR DRAM_ADDR04

Y23 DRAM_ADDR05 NVCC_DRAM DDR DRAM_ADDR05

V22 DRAM_ADDR06 NVCC_DRAM DDR DRAM_ADDR06

Y22 DRAM_ADDR07 NVCC_DRAM DDR DRAM_ADDR07

W22 DRAM_ADDR08 NVCC_DRAM DDR DRAM_ADDR08

V23 DRAM_ADDR09 NVCC_DRAM DDR DRAM_ADDR09

T23 DRAM_ADDR10 NVCC_DRAM DDR DRAM_ADDR10

U22 DRAM_ADDR11 NVCC_DRAM DDR DRAM_ADDR11

T22 DRAM_ADDR12 NVCC_DRAM DDR DRAM_ADDR12

P23 DRAM_ADDR13 NVCC_DRAM DDR DRAM_ADDR13

AB18 DRAM_ADDR14 NVCC_DRAM DDR DRAM_ADDR14

AB20 DRAM_ADDR15 NVCC_DRAM DDR DRAM_ADDR15

AC14 DRAM_CAS_B NVCC_DRAM DDR DRAM_CAS_B

AB23 DRAM_CS0_B NVCC_DRAM DDR DRAM_CS0_B

AA22 DRAM_CS1_B NVCC_DRAM DDR DRAM_CS1_B

AD22 DRAM_DATA00 NVCC_DRAM DDR DRAM_DATA00

AD23 DRAM_DATA01 NVCC_DRAM DDR DRAM_DATA01

AE20 DRAM_DATA02 NVCC_DRAM DDR DRAM_DATA02

AE23 DRAM_DATA03 NVCC_DRAM DDR DRAM_DATA03

AE22 DRAM_DATA04 NVCC_DRAM DDR DRAM_DATA04

AD19 DRAM_DATA05 NVCC_DRAM DDR DRAM_DATA05

AD18 DRAM_DATA06 NVCC_DRAM DDR DRAM_DATA06

AE19 DRAM_DATA07 NVCC_DRAM DDR DRAM_DATA07

AE14 DRAM_DATA08 NVCC_DRAM DDR DRAM_DATA08

AE18 DRAM_DATA09 NVCC_DRAM DDR DRAM_DATA09

AE17 DRAM_DATA10 NVCC_DRAM DDR DRAM_DATA10

AD16 DRAM_DATA11 NVCC_DRAM DDR DRAM_DATA11

AE16 DRAM_DATA12 NVCC_DRAM DDR DRAM_DATA12

AD14 DRAM_DATA13 NVCC_DRAM DDR DRAM_DATA13

AD13 DRAM_DATA14 NVCC_DRAM DDR DRAM_DATA14

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors144

AE13 DRAM_DATA15 NVCC_DRAM DDR DRAM_DATA15

AA25 DRAM_DATA16 NVCC_DRAM DDR DRAM_DATA16

W24 DRAM_DATA17 NVCC_DRAM DDR DRAM_DATA17

V25 DRAM_DATA18 NVCC_DRAM DDR DRAM_DATA18

W25 DRAM_DATA19 NVCC_DRAM DDR DRAM_DATA19

AC25 DRAM_DATA20 NVCC_DRAM DDR DRAM_DATA20

AB25 DRAM_DATA21 NVCC_DRAM DDR DRAM_DATA21

AB24 DRAM_DATA22 NVCC_DRAM DDR DRAM_DATA22

AC24 DRAM_DATA23 NVCC_DRAM DDR DRAM_DATA23

R25 DRAM_DATA24 NVCC_DRAM DDR DRAM_DATA24

N24 DRAM_DATA25 NVCC_DRAM DDR DRAM_DATA25

P25 DRAM_DATA26 NVCC_DRAM DDR DRAM_DATA26

N25 DRAM_DATA27 NVCC_DRAM DDR DRAM_DATA27

U25 DRAM_DATA28 NVCC_DRAM DDR DRAM_DATA28

R24 DRAM_DATA29 NVCC_DRAM DDR DRAM_DATA29

U24 DRAM_DATA30 NVCC_DRAM DDR DRAM_DATA30

V24 DRAM_DATA31 NVCC_DRAM DDR DRAM_DATA31

AD20 DRAM_DQM0 NVCC_DRAM DDR DRAM_DQM0

AD17 DRAM_DQM1 NVCC_DRAM DDR DRAM_DQM1

AA24 DRAM_DQM2 NVCC_DRAM DDR DRAM_DQM2

P24 DRAM_DQM3 NVCC_DRAM DDR DRAM_DQM3

AC16 DRAM_ODT0 NVCC_DRAM DDR DRAM_ODT0

AA14 DRAM_ODT1 NVCC_DRAM DDR DRAM_ODT1

AB15 DRAM_RAS_B NVCC_DRAM DDR DRAM_RAS_B

AC22 DRAM_RESET NVCC_DRAM_CKE DDR DRAM_RESET

R22 DRAM_SDBA0 NVCC_DRAM DDR DRAM_SDBA0

P22 DRAM_SDBA1 NVCC_DRAM DDR DRAM_SDBA1

N23 DRAM_SDBA2 NVCC_DRAM DDR DRAM_SDBA2

AB17 DRAM_SDCKE0 NVCC_DRAM_CKE DDR DRAM_SDCKE0

AB22 DRAM_SDCKE1 NVCC_DRAM_CKE DDR DRAM_SDCKE1

AD25 DRAM_SDCLK0_N NVCC_DRAM DDRCLK DRAM_SDCLK0_N

AD24 DRAM_SDCLK0_P NVCC_DRAM DDRCLK DRAM_SDCLK0_P

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 145

AD21 DRAM_SDQS0_N NVCC_DRAM DDRCLK DRAM_SDQS0_N

AE21 DRAM_SDQS0_P NVCC_DRAM DDRCLK DRAM_SDQS0_P

AE15 DRAM_SDQS1_N NVCC_DRAM DDRCLK DRAM_SDQS1_N

AD15 DRAM_SDQS1_P NVCC_DRAM DDRCLK DRAM_SDQS1_P

Y25 DRAM_SDQS2_N NVCC_DRAM DDRCLK DRAM_SDQS2_N

Y24 DRAM_SDQS2_P NVCC_DRAM DDRCLK DRAM_SDQS2_P

T25 DRAM_SDQS3_N NVCC_DRAM DDRCLK DRAM_SDQS3_N

T24 DRAM_SDQS3_P NVCC_DRAM DDRCLK DRAM_SDQS3_P

AB14 DRAM_SDWE_B NVCC_DRAM DDR DRAM_SDWE_B

H04 ECSPI1_MISO NVCC_SPI GPIO ALT5 GPIO4_IO[18] 100K PD

G05 ECSPI1_MOSI NVCC_SPI GPIO ALT5 GPIO4_IO[17] 100K PD

H03 ECSPI1_SCLK NVCC_SPI GPIO ALT5 GPIO4_IO[16] 100K PD

H05 ECSPI1_SS0 NVCC_SPI GPIO ALT5 GPIO4_IO[19] 100K PD

H06 ECSPI2_MISO NVCC_SPI GPIO ALT5 GPIO4_IO[22] 100K PD

G06 ECSPI2_MOSI NVCC_SPI GPIO ALT5 GPIO4_IO[21] 100K PD

J05 ECSPI2_SCLK NVCC_SPI GPIO ALT5 GPIO4_IO[20] 100K PD

J06 ECSPI2_SS0 NVCC_SPI GPIO ALT5 GPIO4_IO[23] 100K PD

D19 ENET1_COL NVCC_ENET1 GPIO ALT5 GPIO7_IO[15] 100K PD

E19 ENET1_CRS NVCC_ENET1 GPIO ALT5 GPIO7_IO[14] 100K PD

E14 ENET1_RD0 NVCC_ENET1 GPIO ALT5 GPIO7_IO[0] 100K PD

F14 ENET1_RD1 NVCC_ENET1 GPIO ALT5 GPIO7_IO[1] 100K PD

D13 ENET1_RD2 NVCC_ENET1 GPIO ALT5 GPIO_IO[2] 100K PD

E13 ENET1_RD3 NVCC_ENET1 GPIO ALT5 GPIO7_IO[3] 100K PD

D15 ENET1_RX_CLK NVCC_ENET1 GPIO ALT5 GPIO7_IO[13] 100K PD

E15 ENET1_RX_CTL NVCC_ENET1 GPIO ALT5 GPIO7_IO[4] 100K PD

F15 ENET1_RXC NVCC_ENET1 GPIO ALT5 GPIO7_IO[5] 100K PD

F17 ENET1_TD0 NVCC_ENET1 GPIO ALT5 GPIO7_IO[6] 100K PD

E17 ENET1_TD1 NVCC_ENET1 GPIO ALT5 GPIO_IO[7] 100K PD

E18 ENET1_TD2 NVCC_ENET1 GPIO ALT5 GPIO7_IO[8] 100K PD

D18 ENET1_TD3 NVCC_ENET1 GPIO ALT5 GPIO7_IO[9] 100K PD

D16 ENET1_TX_CLK NVCC_ENET1 GPIO ALT5 GPIO7_IO[12] 100K PD

E16 ENET1_TX_CTL NVCC_ENET1 GPIO ALT5 GPIO7_IO[10] 100K PD

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors146

F16 ENET1_TXC NVCC_ENET1 GPIO ALT5 GPIO7_IO[11] 100K PD

K24 EPDC_BDR0 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[28] 100K PD

K23 EPDC_BDR1 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[29] 100K PD

P20 EPDC_D00 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[0] 100K PD

P21 EPDC_D01 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[1] 100K PD

N20 EPDC_D02 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[2] 100K PD

N21 EPDC_D03 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[3] 100K PD

N22 EPDC_D04 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[4] 100K PD

M20 EPDC_D05 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[5] 100K PD

M21 EPDC_D06 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[6] 100K PD

M22 EPDC_D07 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[7] 100K PD

M23 EPDC_D08 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[8] 100K PD

L25 EPDC_D09 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[9] 100K PD

L24 EPDC_D10 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[10] 100K PD

L23 EPDC_D11 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[11] 100K PD

L22 EPDC_D12 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[12] 100K PD

L21 EPDC_D13 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[13] 100K PD

L20 EPDC_D14 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[14] 100K PD

K25 EPDC_D15 NVCC_EPDC1 GPIO ALT5 GPIO2_IO[15] 100K PD

J25 EPDC_GDCLK NVCC_EPDC2 GPIO ALT5 GPIO2_IO[24] 100K PD

J24 EPDC_GDOE NVCC_EPDC2 GPIO ALT5 GPIO2_IO[25] 100K PD

K21 EPDC_GDRL NVCC_EPDC2 GPIO ALT5 GPIO2_IO[26] 100K PD

H25 EPDC_GDSP NVCC_EPDC2 GPIO ALT5 GPIO2_IO[27] 100K PD

H24 EPDC_PWRCOM NVCC_EPDC2 GPIO ALT5 GPIO2_IO[30] 100K PD

K20 EPDC_PWRSTAT NVCC_EPDC2 GPIO ALT5 GPIO2_IO[31] 100K PD

G25 EPDC_SDCE0 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[20] 100K PD

G24 EPDC_SDCE1 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[21] 100K PD

H23 EPDC_SDCE2 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[22] 100K PD

H22 EPDC_SDCE3 NVCC_EPDC2 GPIO ALT5 GPIO2_IO[23] 100K PD

J21 EPDC_SDCLK NVCC_EPDC2 GPIO ALT5 GPIO2_IO[16] 100K PD

J20 EPDC_SDLE NVCC_EPDC2 GPIO ALT5 GPIO2_IO[17] 100K PD

H21 EPDC_SDOE NVCC_EPDC2 GPIO ALT5 GPIO2_IO[18] 100K PD

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 147

H20 EPDC_SDSHR NVCC_EPDC2 GPIO ALT5 GPIO2_IO[19] 100K PD

N01 GPIO1_IO00 NVCC_GPIO1 GPIO ALT0 GPIO1_IO00 100K PU

N02 GPIO1_IO01 NVCC_GPIO1 GPIO ALT0 GPIO1_IO01 100K PD

N03 GPIO1_IO02 NVCC_GPIO1 GPIO ALT0 GPIO1_IO02 100K PD

N05 GPIO1_IO03 NVCC_GPIO1 GPIO ALT0 GPIO1_IO03 100K PD

N06 GPIO1_IO04 NVCC_GPIO1 GPIO ALT0 GPIO1_IO04 100K PD

P01 GPIO1_IO05 NVCC_GPIO1 GPIO ALT0 GPIO1_IO05 100K PD

P02 GPIO1_IO06 NVCC_GPIO1 GPIO ALT0 GPIO1_IO06 100K PD

P03 GPIO1_IO07 NVCC_GPIO1 GPIO ALT0 GPIO1_IO07 100K PD

R01 GPIO1_IO08 NVCC_GPIO2 GPIO ALT0 GPIO1_IO08 100K PD

R02 GPIO1_IO09 NVCC_GPIO2 GPIO ALT0 GPIO1_IO09 100K PD

R05 GPIO1_IO10 NVCC_GPIO2 GPIO ALT0 GPIO1_IO10 100K PD

T01 GPIO1_IO11 NVCC_GPIO2 GPIO ALT0 GPIO1_IO11 100K PD

T02 GPIO1_IO12 NVCC_GPIO2 GPIO ALT0 GPIO1_IO12 100K PD

T03 GPIO1_IO13 NVCC_GPIO2 GPIO ALT0 GPIO1_IO13 100K PD

T05 GPIO1_IO14 NVCC_GPIO2 GPIO ALT0 GPIO1_IO14 100K PD

T06 GPIO1_IO15 NVCC_GPIO2 GPIO ALT0 GPIO1_IO15 100K PD

J02 I2C1_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[8] 100K PD

K01 I2C1_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[9] 100K PD

K02 I2C2_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[10] 100K PD

K03 I2C2_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[11] 100K PD

K05 I2C3_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[12] 100K PD

K06 I2C3_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[13] 100K PD

L01 I2C4_SCL NVCC_I2C GPIO ALT5 GPIO4_IO[14] 100K PD

L02 I2C4_SDA NVCC_I2C GPIO ALT5 GPIO4_IO[15] 100K PD

U01 JTAG_MOD NVCC_GPIO2 GPIO ALT0 JTAG_MOD 100K PU

U05 JTAG_TCK NVCC_GPIO2 GPIO ALT0 JTAG_TCK 47K PU

U03 JTAG_TDI NVCC_GPIO2 GPIO ALT0 JTAG_TDI 47K PU

U06 JTAG_TDO NVCC_GPIO2 GPIO ALT0 JTAG_TDO 100K PU

U04 JTAG_TMS NVCC_GPIO2 GPIO ALT0 JTAG_TMS 47K PU

U02 JTAG_TRST_B NVCC_GPIO2 GPIO ALT0 JTAG_TRST_B 47K PU

E20 LCD_CLK NVCC_LCD GPIO ALT5 GPIO3_IO[0] 100K PD

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors148

D21 LCD_DATA00 NVCC_LCD GPIO ALT5 GPIO3_IO[5] 100K PD

A22 LCD_DATA01 NVCC_LCD GPIO ALT5 GPIO3_IO[6] 100K PD

B22 LCD_DATA02 NVCC_LCD GPIO ALT5 GPIO3_IO[7] 100K PD

A23 LCD_DATA03 NVCC_LCD GPIO ALT5 GPIO3_IO[8] 100K PD

C22 LCD_DATA04 NVCC_LCD GPIO ALT5 GPIO3_IO[9] 100K PD

B23 LCD_DATA05 NVCC_LCD GPIO ALT5 GPIO3_IO[10] 100K PD

A24 LCD_DATA06 NVCC_LCD GPIO ALT5 GPIO3_IO[11] 100K PD

F20 LCD_DATA07 NVCC_LCD GPIO ALT5 GPIO3_IO[12] 100K PD

E21 LCD_DATA08 NVCC_LCD GPIO ALT5 GPIO3_IO[13] 100K PD

C23 LCD_DATA09 NVCC_LCD GPIO ALT5 GPIO3_IO[14] 100K PD

B24 LCD_DATA10 NVCC_LCD GPIO ALT5 GPIO3_IO[15] 100K PD

G20 LCD_DATA11 NVCC_LCD GPIO ALT5 GPIO3_IO[16] 100K PD

F21 LCD_DATA12 NVCC_LCD GPIO ALT5 GPIO3_IO[17] 100K PD

E22 LCD_DATA13 NVCC_LCD GPIO ALT5 GPIO3_IO[18] 100K PD

D23 LCD_DATA14 NVCC_LCD GPIO ALT5 GPIO3_IO[19] 100K PD

C24 LCD_DATA15 NVCC_LCD GPIO ALT5 GPIO3_IO[20] 100K PD

B25 LCD_DATA16 NVCC_LCD GPIO ALT5 GPIO3_IO[21] 100K PD

G21 LCD_DATA17 NVCC_LCD GPIO ALT5 GPIO3_IO[22] 100K PD

E23 LCD_DATA18 NVCC_LCD GPIO ALT5 GPIO3_IO[23] 100K PD

D24 LCD_DATA19 NVCC_LCD GPIO ALT5 GPIO3_IO[24] 100K PD

C25 LCD_DATA20 NVCC_LCD GPIO ALT5 GPIO3_IO[25] 100K PD

E24 LCD_DATA21 NVCC_LCD GPIO ALT5 GPIO3_IO[26] 100K PD

D25 LCD_DATA22 NVCC_LCD GPIO ALT5 GPIO3_IO[27] 100K PD

G23 LCD_DATA23 NVCC_LCD GPIO ALT5 GPIO3_IO[28] 100K PD

F25 LCD_ENABLE NVCC_LCD GPIO ALT5 GPIO3_IO[1] 100K PD

E25 LCD_HSYNC NVCC_LCD GPIO ALT5 GPIO3_IO[2] 100K PD

C21 LCD_RESET NVCC_LCD GPIO ALT5 GPIO3_IO[4] 100K PD

F24 LCD_VSYNC NVCC_LCD GPIO ALT5 GPIO3_IO[3] 100K PD

A15 MIPI_CSI_CLK_N MIPI_VDDA_1P8 MIPI_CSI_CLK_N

B15 MIPI_CSI_CLK_P MIPI_VDDA_1P8 MIPI_CSI_CLK_P

A16 MIPI_CSI_D0_N MIPI_VDDA_1P8 MIPI_CSI_D0_N

B16 MIPI_CSI_D0_P MIPI_VDDA_1P8 MIPI_CSI_D0_P

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 149

A14 MIPI_CSI_D1_N MIPI_VDDA_1P8 MIPI_CSI_D1_N

B14 MIPI_CSI_D1_P MIPI_VDDA_1P8 MIPI_CSI_D1_P

A19 MIPI_DSI_CLK_N MIPI_VDDA_1P8 MIPI_DSI_CLK_N

B19 MIPI_DSI_CLK_P MIPI_VDDA_1P8 MIPI_DSI_CLK_P

A20 MIPI_DSI_D0_N MIPI_VDDA_1P8 MIPI_DSI_D0_N

B20 MIPI_DSI_D0_P MIPI_VDDA_1P8 MIPI_DSI_D0_P

A18 MIPI_DSI_D1_N MIPI_VDDA_1P8 MIPI_DSI_D1_N

B18 MIPI_DSI_D1_P MIPI_VDDA_1P8 MIPI_DSI_D1_P

J13 MIPI_VDDA_1P8 MIPI_VDDA_1P8 MIPI_VDDA_1P8

J15 MIPI_VDDD_1P0 MIPI_VDDD_1P0 MIPI_VDDD_1P0

J17 MIPI_VDDD_1P0 MIPI_VDDD_1P0 MIPI_VDDD_1P0

AC08 ONOFF VDD_SNVS_IN ONOFF

AE10 PCIE_REFCLKIN_N PCIE_VPH PCIE_REFCLKIN_N

AD10 PCIE_REFCLKIN_P PCIE_VPH PCIE_REFCLKIN_P

AC10 PCIE_REFCLKOUT_N PCIE_VPH PCIE_REFCLKOUT_N

AB10 PCIE_REFCLKOUT_P PCIE_VPH PCIE_REFCLKOUT_P

AA13 PCIE_REXT PCIE_VPH PCIE_REXT

AE11 PCIE_RX_N PCIE_VPH_RX PCIE_RX_N

AD11 PCIE_RX_P PCIE_VPH_RX PCIE_RX_P

AC11 PCIE_TX_N PCIE_VPH_TX PCIE_TX_N

AB11 PCIE_TX_P PCIE_VPH_TX PCIE_TX_P

AA10 PCIE_VP PCIE_VP PCIE_VP

AA12 PCIE_VP_RX PCIE_VP_RX PCIE_VP_RX

AA11 PCIE_VP_TX PCIE_VP_TX PCIE_VP_TX

Y10 PCIE_VPH PCIE_VPH PCIE_VPH

Y12 PCIE_VPH_RX PCIE_VPH_RX PCIE_VPH_RX

Y11 PCIE_VPH_TX PCIE_VPH_TX PCIE_VPH_TX

R06 POR_B NVCC_GPIO1 GPIO ALT0 POR_B 100K PU

AE06 RTC_XTALI VDD_SNVS_1P8_CAP RTC_XTALI

AD06 RTC_XTALO VDD_SNVS_1P8_CAP RTC_XTALO

E10 SAI1_MCLK NVCC_SAI GPIO ALT5 GPIO6_IO[18] 100K PD

D12 SAI1_RXC NVCC_SAI GPIO ALT5 GPIO6_IO[17] 100K PD

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors150

E12 SAI1_RXD NVCC_SAI GPIO ALT5 GPIO6_IO[12] 100K PD

C12 SAI1_RXFS NVCC_SAI GPIO ALT5 GPIO6_IO[16] 100K PD

C11 SAI1_TXC NVCC_SAI GPIO ALT5 GPIO6_IO[13] 100K PD

E11 SAI1_TXD NVCC_SAI GPIO ALT5 GPIO6_IO[15] 100K PD

D11 SAI1_TXFS NVCC_SAI GPIO ALT5 GPIO6_IO[14] 100K PD

E09 SAI2_RXD NVCC_SAI GPIO ALT5 GPIO6_IO[21] 100K PD

D08 SAI2_TXC NVCC_SAI GPIO ALT5 GPIO6_IO[20] 100K PD

E08 SAI2_TXD NVCC_SAI GPIO ALT5 GPIO6_IO[22] 100K PD

D09 SAI2_TXFS NVCC_SAI GPIO ALT5 GPIO6_IO[19] 100K PD

C06 SD1_CD_B NVCC_SD1 GPIO ALT5 GPIO5_IO[0] 100K PD

B05 SD1_CLK NVCC_SD1 GPIO ALT5 GPIO5_IO[3] 100K PD

C05 SD1_CMD NVCC_SD1 GPIO ALT5 GPIO5_IO[4] 100K PD

A05 SD1_DATA0 NVCC_SD1 GPIO ALT5 GPIO5_IO[5] 100K PD

D06 SD1_DATA1 NVCC_SD1 GPIO ALT5 GPIO5_IO[6] 100K PD

A04 SD1_DATA2 NVCC_SD1 GPIO ALT5 GPIO5_IO[7] 100K PD

D05 SD1_DATA3 NVCC_SD1 GPIO ALT5 GPIO5_IO[8] 100K PD

B04 SD1_RESET_B NVCC_SD1 GPIO ALT5 GPIO5_IO[2] 100K PD

C04 SD1_WP NVCC_SD1 GPIO ALT5 GPIO5_IO[1] 100K PD

D03 SD2_CD_B NVCC_SD2 GPIO ALT5 GPIO5_IO[9] 100K PD

E03 SD2_CLK NVCC_SD2 GPIO ALT5 GPIO5_IO[12] 100K PD

F06 SD2_CMD NVCC_SD2 GPIO ALT5 GPIO5_IO[13] 100K PD

E04 SD2_DATA0 NVCC_SD2 GPIO ALT5 GPIO5_IO[14] 100K PD

E05 SD2_DATA1 NVCC_SD2 GPIO ALT5 GPIO5_IO[15] 100K PD

F05 SD2_DATA2 NVCC_SD2 GPIO ALT5 GPIO5_IO[16] 100K PD

E06 SD2_DATA3 NVCC_SD2 GPIO ALT5 GPIO5_IO[17] 100K PD

G03 SD2_RESET_B NVCC_SD2 GPIO ALT5 GPIO5_IO[11] 100K PD

C03 SD2_WP NVCC_SD2 GPIO ALT5 GPIO5_IO[10] 100K PD

C01 SD3_CLK NVCC_SD3 GPIO ALT5 GPIO6_IO[0] 100K PD

E01 SD3_CMD NVCC_SD3 GPIO ALT5 GPIO6_IO[1] 100K PD

B02 SD3_DATA0 NVCC_SD3 GPIO ALT5 GPIO6_IO[2] 100K PD

A02 SD3_DATA1 NVCC_SD3 GPIO ALT5 GPIO6_IO[3] 100K PD

G02 SD3_DATA2 NVCC_SD3 GPIO ALT5 GPIO6_IO[4] 100K PD

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 151

F01 SD3_DATA3 NVCC_SD3 GPIO ALT5 GPIO6_IO[5] 100K PD

F02 SD3_DATA4 NVCC_SD3 GPIO ALT5 GPIO6_IO[6] 100K PD

E02 SD3_DATA5 NVCC_SD3 GPIO ALT5 GPIO6_IO[7] 100K PD

C02 SD3_DATA6 NVCC_SD3 GPIO ALT5 GPIO6_IO[8] 100K PD

B01 SD3_DATA7 NVCC_SD3 GPIO ALT5 GPIO6_IO[9] 100K PD

G01 SD3_RESET_B NVCC_SD3 GPIO ALT5 GPIO6_IO[11] 100K PD

J01 SD3_STROBE NVCC_SD3 GPIO ALT5 GPIO6_IO[10] 100K PD

AB08 SNVS_PMIC_ON_REQ VDD_SNVS_IN SNVS_PMIC_ON_REQ

AA07 SNVS_TAMPER0 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER0

Y08 SNVS_TAMPER1 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER1

AB06 SNVS_TAMPER2 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER2

Y07 SNVS_TAMPER3 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER3

AA05 SNVS_TAMPER4 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER4

Y05 SNVS_TAMPER5 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER5

AA04 SNVS_TAMPER6 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER6

Y04 SNVS_TAMPER7 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER7

AA03 SNVS_TAMPER8 VDDD_SNVS_1P8_CAP Analog SNVS_TAMPER8

Y03 SNVS_TAMPER9 VDD_SNVS_1P8_CAP Analog SNVS_TAMPER9

AE04 TEMPSENSOR_REXT VDD_TEMPSENSOR_1P8 TEMPSENSOR_REXT

AD04 TEMPSENSOR_RESERVE VDD_TEMPSENSOR_1P8 TEMPSENSOR_RESERVE

P06 TEST_MODE NVCC_GPIO1 GPIO ALT0 TEST_MODE 100K PD

L03 UART1_RXD NVCC_UART GPIO ALT5 GPIO4_IO[0] 100K PD

L04 UART1_TXD NVCC_UART GPIO ALT5 GPIO4_IO[1] 100K PD

L05 UART2_RXD NVCC_UART GPIO ALT5 GPIO4_IO[2] 100K PD

L06 UART2_TXD NVCC_UART GPIO ALT5 GPIO4_IO[3] 100K PD

M06 UART3_CTS NVCC_UART GPIO ALT5 GPIO4_IO[7] 100K PD

M05 UART3_RTS NVCC_UART GPIO ALT5 GPIO4_IO[6] 100K PD

M01 UART3_RXD NVCC_UART GPIO ALT5 GPIO4_IO[4] 100K PD

M02 UART3_TXD NVCC_UART GPIO ALT5 GPIO4_IO[5] 100K PD

A12 USB_H_DATA USB_H_VDD_1P2 USB_H_DATA

B12 USB_H_STROBE USB_H_VDD_1P2 USB_H_STROBE

C07 USB_OTG1_CHD_B USB_OTG1_VDDA_3P3 USB_OTG1_CHD_B

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors152

6.2.3 Case “Y”, i.MX 7Dual 19 ×19 mm 0.75 mm pitch ball map

The following table shows the i.MX 7Dual 19 ×19 mm, 0.75 mm pitch ball map.

A08 USB_OTG1_DN USB_OTG1_VDDA_3P3 USB_OTG1_DN

B08 USB_OTG1_DP USB_OTG1_VDDA_3P3 USB_OTG1_DP

B07 USB_OTG1_ID USB_OTG1_VDDA_3P3 USB_OTG1_ID

A07 USB_OTG1_REXT USB_OTG1_VDDA_3P3 USB_OTG1_REXT

A10 USB_OTG2_DN USB_OTG2_VDDA_3P3 USB_OTG2_DN

B10 USB_OTG2_DP USB_OTG2_VDDA_3P3 USB_OTG2_DP

B11 USB_OTG2_ID USB_OTG2_VDDA_3P3 USB_OTG2_ID

A11 USB_OTG2_REXT USB_OTG2_VDDA_3P3 USB_OTG2_REXT

V01 XTALI VDDA_1P8 XTALI

V02 XTALO VDDA_1P8 XTALO

The state immediately after RESET and before ROM firmware or software has executed.

Table 103. i.MX 7Dual 19 ×19 mm 0.75 mm pitch ball map

12345678910111213141516171819202122232425

VSS

SD3_DATA1

VSS

SD1_DATA2

SD1_DATA0

VSS

USB_OTG1_REXT

USB_OTG1_DN

VSS

USB_OTG2_DN

USB_OTG2_REXT

USB_H_DATA

VSS

MIPI_CSI_D1_N

MIPI_CSI_CLK_N

MIPI_CSI_D0_N

VSS

MIPI_DSI_D1_N

MIPI_DSI_CLK_N

MIPI_DSI_D0_N

VSS

LCD1_DATA01

LCD1_DATA03

LCD1_DATA06

VSS

SD3_DATA7

SD3_DATA0

VSS

SD1_RESET_B

SD1_CLK

VSS

USB_OTG1_ID

USB_OTG1_DP

VSS

USB_OTG2_DP

USB_OTG2_ID

USB_H_STROBE

VSS

MIPI_CSI_D1_P

MIPI_CSI_CLK_P

MIPI_CSI_D0_P

VSS

MIPI_DSI_D1_P

MIPI_DSI_CLK_P

MIPI_DSI_D0_P

VSS

LCD1_DATA02

LCD1_DATA05

LCD1_DATA10

LCD1_DATA16

SD3_CLK

SD3_DATA6

SD2_WP

SD1_WP

SD1_CMD

SD1_CD_B

USB_OTG1_CHD_B

USB_OTG1_VBUS

VSS

USB_OTG2_VBUS

SAI1_TXC

SAI1_RXFS

VSS

VDD_SOC

VSS

VDD_ARM

VSS

VDD_ARM

LCD1_RESET

LCD1_DATA04

LCD1_DATA09

LCD1_DATA15

LCD1_DATA20

12345678910111213141516171819202122232425

Table 102. i.MX 7Dual 19 x 19 mm functional contact assignments(continued)

Ball Ball Name Power Group Ball

type

Default

Mode

Default

Function

PD/PU

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 153

VSS

SD2_CD_B

VSS

SD1_DATA3

SD1_DATA1

VSS

SAI2_TXC

SAI2_TXFS

VSS

SAI1_TXFS

SAI1_RXC

ENET1_RDATA2

VDD_SOC

ENET1_RX_CLK

ENET1_TX_CLK

VDD_ARM

ENET1_TDATA3

ENET1_COL

VDD_ARM

LCD1_DATA00

VSS

LCD1_DATA14

LCD1_DATA19

LCD1_DATA22

SD3_CMD

SD3_DATA5

SD2_CLK

SD2_DATA0

SD2_DATA1

SD2_DATA3

NVCC_SD1

SAI2_TXD

SAI2_RXD

SAI1_MCLK

SAI1_TXD

SAI1_RXD

ENET1_RDATA3

ENET1_RD0

ENET1_RX_CTL

ENET1_TX_CTL

ENET1_TDATA1

ENET1_TDATA2

ENET1_CRS

LCD1_CLK

LCD1_DATA08

LCD1_DATA13

LCD1_DATA18

LCD1_DATA21

LCD1_HSYNC

SD3_DATA3

SD3_DATA4

VDD_SOC

SD2_DATA2

SD2_CMD

VSS

VDD_USB_OTG2_3P3_IN

VDD_USB_OTG1_3P3_IN

VSS

NVCC_SAI

VSS

ENET1_RDATA1

ENET1_RXC

ENET1_TXC

ENET1_TD0

VDD_SOC

LCD1_DATA07

LCD1_DATA12

VDD_ARM

LCD1_VSYNC

LCD1_ENABLE

SD3_RESET_B

SD3_DATA2

SD2_RESET_B

VSS

ECSPI1_MOSI

ECSPI2_MOSI

VSS

LCD1_DATA11

LCD1_DATA17

VSS

LCD1_DATA23

EPDC1_SDCE1

EPDC1_SDCE0

VSS

ECSPI1_SCLK

ECSPI1_MISO

ECSPI1_SS0

ECSPI2_MISO

NVCC_SD2

VDD_USB_OTG1_1P0_CAP

VDD_USB_H_1P2

PVCC_ENET_CAP

NVCC_ENET1

MIPI_VREG_0P4V

EPDC1_SDSHR

EPDC1_SDOE

EPDC1_SDCE3

EPDC1_SDCE2

EPDC1_PWRCOM

EPDC1_GDSP

SD3_STROBE

I2C1_SCL

VDD_SOC

ECSPI2_SCLK

ECSPI2_SS0

VSS

PVCC_SAI_SD_CAP

VDD_USB_OTG2_1P0_CAP

VDDA_MIPI_1P8

VDD_MIPI_1P0

VSS

EPDC1_SDLE

EPDC1_SDCLK

VDD_ARM

EPDC1_GDOE

EPDC1_GDCLK

I2C1_SDA

I2C2_SCL

I2C2_SDA

VSS

I2C3_SCL

I2C3_SDA

NVCC_SD3

VSS

NVCC_LCD

EPDC1_PWRSTAT

EPDC1_GDRL

VSS

EPDC1_BDR1

EPDC1_BDR0

EPDC1_DATA15

Table 103. i.MX 7Dual 19 ×19 mm 0.75 mm pitch ball map (continued)

12345678910111213141516171819202122232425

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors154

I2C4_SCL

I2C4_SDA

UART1_RXD

UART1_TXD

UART2_RXD

UART2_TXD

VSS

NVCC_SPI

VSS

NVCC_EPDC2

VSS

EPDC1_DATA14

EPDC1_DATA13

EPDC1_DATA12

EPDC1_DATA11

EPDC1_DATA10

EPDC1_DATA09

UART3_RXD

UART3_TXD

VDD_SOC

UART3_RTS

UART3_CTS

NVCC_I2C

VSS

NVCC_EPDC1

EPDC1_DATA05

EPDC1_DATA06

EPDC1_DATA07

EPDC1_DATA08

VSS

GPIO1_IO00

GPIO1_IO01

GPIO1_IO02

VSS

GPIO1_IO03

GPIO1_IO04

VSS

NVCC_UART

VSS

PVCC_EPDC_LCD_CAP

VSS

EPDC1_DATA02

EPDC1_DATA03

EPDC1_DATA04

DRAM_SDBA2

DRAM_DATA25

DRAM_DATA27

GPIO1_IO05

GPIO1_IO06

GPIO1_IO07

BOOT_MODE0

BOOT_MODE1

TEST_MODE

NVCC_GPIO1

VSS

VDD_SOC

EPDC_D00

EPDC1_DATA01

DRAM_SDBA1

DRAM_ADDR13

DRAM_DQM3

DRAM_DATA26

GPIO1_IO08

GPIO1_IO09

VDD_SOC

GPIO1_IO10

POR_B

VSS

PVCC_I2C_SPI_UART_CAP

VSS

VDD_SOC

VSS

DRAM_SDBA0

VSS

DRAM_DATA29

DRAM_DATA24

GPIO1_IO11

GPIO1_IO12

GPIO1_IO13

VSS

GPIO1_IO14

GPIO1_IO15

NVCC_GPIO2

VSS

VDD_SOC

VSS

NVCC_DRAM

DRAM_ADDR12

DRAM_ADDR10

DRAM_SDQS3_P

DRAM_SDQS3_N

JTAG_MOD

JTAG_TRST_B

JTAG_TDI

JTAG_TMS

JTAG_TCK

JTAG_TDO

VSS

VDD_1P2_CAP

VSS

VDD_SOC

VSS

NVCC_DRAM

DRAM_ADDR11

VSS

DRAM_DATA30

DRAM_DATA28

Table 103. i.MX 7Dual 19 ×19 mm 0.75 mm pitch ball map (continued)

12345678910111213141516171819202122232425

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 155

XTALI

XTALO

VDDA_1P0_CAP

GPANAIO

VDD_XTAL_1P8

VDDA_1P8_IN

FUSE_FSOURCE

PVCC_GPIO_CAP

VDD_SOC

VSS

NVCC_DRAM

DRAM_ADDR06

DRAM_ADDR09

DRAM_DATA31

DRAM_DATA18

VSS

CCM_CLK2

VSS

VDDA_1P8_IN

VDD_LPSR_IN

VSS

NVCC_DRAM

DRAM_ADDR08

VSS

DRAM_DATA17

DRAM_DATA19

CCM_CLK1_N

CCM_CLK1_P

SNVS_TAMPER09

SNVS_TAMPER07

SNVS_TAMPER05

VSS

SNVS_TAMPER03

SNVS_TAMPER01

VDDA_PHY_1P8

PCIE_VPH

PCIE_VPH_TX

PCIE_VPH_RX

VSS

NVCC_DRAM_CKE

NVCC_DRAM

DRAM_ADDR07

DRAM_ADDR05

DRAM_SDQS2_P

DRAM_SDQS2_N

VSS

SNVS_TAMPER08

SNVS_TAMPER06

SNVS_TAMPER04

VSS

SNVS_TAMPER00

VSS

VDDD_1P0_CAP

PCIE_VP

PCIE_VP_TX

PCIE_VP_RX

PCIE_REXT

DRAM_ODT1

VSS

NVCC_DRAM

DRAM_CS1_B

VSS

DRAM_DQM2

DRAM_DATA16

ADC2_IN2

ADC2_IN3

VDDA_ADC2_1P8

VSS

SNVS_TAMPER02

VSS

SNVS_PMIC_ON_REQ

VSS

PCIE_REFCLKOUT_P

PCIE_TX_P

VSS

DRAM_ZQPAD

DRAM_SDWE_B

DRAM_RAS_B

DRAM_ADDR01

DRAM_SDCKE0

DRAM_ADDR14

DRAM_ADDR00

DRAM_ADDR15

DRAM_ADDR04

DRAM_SDCKE1

DRAM_CS0_B

DRAM_DATA22

DRAM_DATA21

ADC2_IN0

ADC2_IN1

VDDA_ADC1_1P8

VDD_TEMPSENSOR_1P8

VDD_LPSR_1P0_CAP

VSS

PMIC_STBY_REQ

ONOFF

VSS

PCIE_REFCLKOUT_N

PCIE_TX_N

VSS

DRAM_VREF

DRAM_CAS_B

VSS

DRAM_ODT0

VSS

DRAM_ADDR02

VSS

DRAM_ADDR03

VSS

DRAM_RESET

VSS

DRAM_DATA23

DRAM_DATA20

ADC1_IN0

VSS

ADC1_IN1

TEMPSENSOR_RESERVE

VSS

RTC_XTALO

VSS

VDD_SNVS_IN

VSS

PCIE_REFCLKIN_P

PCIE_RX_P

VSS

DRAM_DATA14

DRAM_DATA13

DRAM_SDQS1_P

DRAM_DATA11

DRAM_DQM1

DRAM_DATA06

DRAM_DATA05

DRAM_DQM0

DRAM_SDQS0_N

DRAM_DATA00

DRAM_DATA01

DRAM_SDCLK0_P

DRAM_SDCLK0_N

Table 103. i.MX 7Dual 19 ×19 mm 0.75 mm pitch ball map (continued)

12345678910111213141516171819202122232425

Package information and contact assignments

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors156

VSS

ADC1_IN2

ADC1_IN3

TEMPSENSOR_REXT

VSS

RTC_XTALI

VSS

VDD_SNVS_1P8_CAP

VSS

PCIE_REFCLKIN_N

PCIE_RX_N

VSS

DRAM_DATA15

DRAM_DATA08

DRAM_SDQS1_N

DRAM_DATA12

DRAM_DATA10

DRAM_DATA09

DRAM_DATA07

DRAM_DATA02

DRAM_SDQS0_P

DRAM_DATA04

DRAM_DATA03

VSS

Table 103. i.MX 7Dual 19 ×19 mm 0.75 mm pitch ball map (continued)

12345678910111213141516171819202122232425

Revision history

i.MX 7Dual Family of Applications Processors Datasheet,

Rev. 6

02/2019

NXP Semiconductors 157

7 Release notes

Table 104 provides release notes for this data sheet.

Table 104. Release notes

Rev.

Number Date Substantive Change(s)

Rev. 6 2/2019 • On p. 1 and in Table 1, “Orderable parts,” added information related to new part number,

MCIMX7D5EVK10SD

•In Table 12, “Maximum supply currents,” updated maximum value for DRAM_VREF

•In Table 22, “PCIe PHY reference clock timing requirements”:

• In ‘Absolute maximum input voltage’ row, updated ‘Min.’ value

• In ‘Absolute minimum input voltage’ row, updated ‘Min.’ and ‘Max.’ values

• In ‘Absolute crossing point voltage’ row, updated ‘Max’. value

arm

Document Number: IMX7DCEC

Rev. 6

03/2019

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