smcmng
l. i.
_ am: 35353
LL W 2% [U (1043}'
r 7 a 53100 A
f 1 3,
DPDT smmng
ON ON
2 3 2 1
‘ i » _ 5 6 5 4
‘ .1
‘1 H ‘5“st
1‘, m (3 (ex,
0-0-0
0 0-0-0 A
m (5) mi
IHandling Precautions (FP, Fl', FL)
IPackaging Specifications —
FP
SPDT
DPDT
Switching
function
Part No.
FP1F−4M−Z
ON (ON)
Connecting terminals
2−3 2−1
Switching
function
Part No.
★
FP2F−4M−Z
ON (ON)
Connecting terminals
2−3
5−6
2−1
5−4
V/M
V/M
Terminal numbers are not shown on the switch.
Terminal numbers are not shown on the switch.
(Top view)
PC Hole Layouts
(Top view)
PC Hole Layouts
5-φ0.8~1.0
8-φ0.8~1.0
■Handling Precautions (FP, FT, FL)
1. Soldering Specifications
⑴Manual Soldering
Device:Soldering iron
380°C, Max.; 3 seconds, Max.
⑵Auto soldering
Device:Jet wave type or dip type
275°C, Max.; 6 seconds, Max.
・Pre-heating should be done at temperatures from
80 to 120°C and within 120 seconds.
⑶When soldering two or more terminals to the
common land, use solder resist to solder them
independently.
2. Flux Cleaning
⑴Solvents :Fluorine or Alcohol type
⑵Cleaning after soldering should be done after the PC
board is exposed to room temperature (30℃ or below)
for 1 to 2 hours.
⑶Do not use ultrasonic cleaning.
■Packaging Specifications
15
196
231
FUJISOKU
FUJISOKU
(ON): Momentary. ★:Made to order products.
The blue line shows the outline of the switch.
Plastic Pack 100 pcs./pack