9. Precautions
9-1. Soldering
(1) Manual soldering
1) Solder of 96.5Sn 3Ag 0.5Cu is recommended.
2) Before soldering every time, make baking to units. By manual soldering, it is the
possibility of crack due to the moisture absorption in the resin portion.
Use a soldering iron of 25W or smaller. Adjust the temperature of the soldering
iron below 350°C.
4) Force or stress must not be applied to the resin portion while soldering.
5) Finish soldering within 3 seconds.
6) Handle the devices only after temperature is cooled down.
Note) Manual Hot Gas Soldering is not recommended.
(2) Reflow soldering
1) Following soldering paste is recommended
Melting temperature: 216 ~ 220°C.
Composition: 96.5Sn 3Ag 0.5Cu
2) The temperature profile at the top surface of the parts is recommended as shown below.
3) It is requested that products should be handled after their temperature has dropped
down to the normal room temperature
9-2. Washing
(1) When washing after soldering is needed, following conditions are requested.
a) Washing solvent: Pure Water
b) Temperature, time: 50°C or less × 30 seconds max. or 30°C or less × 3 minutes max.
c) Ultrasonic washing: 300W or less
9-3. Other directions
(1) It is requested to avoid any stress added to the resin portion while it is heated.
(2) It is requested to avoid any friction by sharp metal nail etc. to the resin portion.
Jan.7.'15 Jan.7.'15
9/10SPECIFICATIONS OF CITILIGHT
Approved Checked Drawn Symbol CITILIGHT
CITIZEN ELECTRONICS CO.,LTD.
CL-773F-CW18C4-SDW
773E-901-01
M.Asahina
Jan.7.'15
Name
Drawing No
J.Kinoshita A.Kanemaru
Description Appro.
Issue of the first edition
Mark
Jan.7.'15
Date
-
140sec
160
~
180
°C
4
°C
/sec. Max
Tem p eratu re
Time
4
°C
/sec. Max 260
°C
Max
220
°C
60
~
70sec