Datenblatt für MSP-EXP430FR4133 User guide von Texas Instruments

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MSP430FR4133 LaunchPad™ Development Kit (MSP
‑
EXP430FR4133)
User's Guide
SLAU595B–October 2014–Revised January 2017
MSP430FR4133 LaunchPad™ Development Kit
(MSP
‑‑
EXP430FR4133)
The MSP-EXP430FR4133 LaunchPad™ Development Kit is an easy-to-use evaluation module (EVM) for
the MSP430FR4133 microcontroller (see Figure 1). It contains everything needed to start developing on
the MSP430™ ultra-low-power (ULP) FRAM-based microcontroller (MCU) platform, including on-board
emulation for programming, debugging, and energy measurements. The board features on-board buttons
and LEDs for quick integration of a simple user interface and a liquid crystal display (LCD) that showcases
the integrated driver with flexible software-configurable pins.
Figure 1. MSP-EXP430FR4133
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Contents
1 Getting Started ............................................................................................................... 3
2 Hardware...................................................................................................................... 5
3 Software Examples ........................................................................................................ 17
4 Additional Resources ...................................................................................................... 22
5 FAQ .......................................................................................................................... 24
6 Schematics.................................................................................................................. 25
List of Figures
1 MSP-EXP430FR4133 ....................................................................................................... 1
2 MSP-EXP430FR4133 Overview........................................................................................... 5
3 Block Diagram................................................................................................................ 6
4 MSP430FR4133 Pinout..................................................................................................... 7
5 eZ-FET Emulator ............................................................................................................ 8
6 eZ-FET Isolation Jumper Block Diagram ............................................................................... 10
7 Application Backchannel UART in Device Manager................................................................... 10
8 LCD Segment Layout...................................................................................................... 11
9 MSP-EXP430FR4133 Power Block Diagram........................................................................... 14
10 LaunchPad to BoosterPack Connector Pinout ......................................................................... 16
11 Programming the LaunchPad With Program Batch Files............................................................. 18
12 Directing the Project>Import Function to the Demo Project .......................................................... 19
13 When CCS Has Found the Project ...................................................................................... 20
14 MSP-EXP430FR4133 Software Examples in TI Resource Explorer ................................................ 23
15 Schematics (1 of 6) ........................................................................................................ 25
16 Schematics (2 of 6) ........................................................................................................ 26
17 Schematics (3 of 6) ........................................................................................................ 27
18 Schematics (4 of 6) ........................................................................................................ 28
19 Schematics (5 of 6) ........................................................................................................ 29
20 Schematics (6 of 6) ........................................................................................................ 30
List of Tables
1 EnergyTrace Technology................................................................................................... 8
2 Isolation Block Connections................................................................................................ 9
3 LCD FH-1138P Segment Mapping ...................................................................................... 12
4 LCD to MSP430 Connections ............................................................................................ 13
5 Hardware Change Log .................................................................................................... 17
6 Software Examples ........................................................................................................ 17
7 IDE Minimum Requirements for MSP-EXP430FR4133............................................................... 18
8 List of Source Files and Folders ......................................................................................... 21
9 How MSP430 Device Documentation is Organized ................................................................... 22
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Trademarks
LaunchPad, MSP430, BoosterPack, Code Composer Studio, EnergyTrace, E2E are trademarks of Texas
Instruments.
IAR Embedded Workbench is a registered trademark of IAR Systems.
1 Getting Started
1.1 Introduction
The MSP-EXP430FR4133 LaunchPad™ Development Kit is an easy-to-use Evaluation Module (EVM) for
the MSP430FR4133 microcontroller (see Figure 1). It contains everything needed to start developing on
the MSP430™ ultra-low-power (ULP) FRAM-based microcontroller (MCU) platform, including on-board
emulation for programming, debugging, and energy measurements. The board features on-board buttons
and LEDs for quick integration of a simple user interface and a liquid crystal display (LCD) that showcases
the integrated driver with flexible software-configurable pins. The MSP430FR4133 device features
embedded FRAM (ferroelectric random access memory), a nonvolatile memory known for its ultra-low
power, high endurance, and high-speed write access.
Rapid prototyping is simplified by the 20-pin BoosterPack™ Plug-in Module headers, which support a wide
range of available BoosterPacks. You can quickly add features like wireless connectivity, graphical
displays, environmental sensing, and much more. Design your own BoosterPack or choose among many
already available from TI and third-party developers.
Free software development tools are also available, including TI's Eclipse-based Code Composer
Studio™ (CCSTUDIO) and IAR Embedded Workbench®IAR-KICKSTART. Both of these integrated
development environments (IDEs) support EnergyTrace™ technology when paired with the
MSP430FR4133 LaunchPad. More information about the LaunchPad, the supported BoosterPacks, and
available resources can be found at TI's LaunchPad portal.
1.2 Key Features
• MSP430 ultra-low-power FRAM technology based MSP430FR4133 16-bit MCU
• 20-pin LaunchPad standard that leverages the BoosterPack ecosystem
• eZ-FET, an open-source onboard debugger that features EnergyTrace technology
• On-board segmented LCD
• Two buttons and two LEDs for user interaction
• Backchannel UART through USB to PC
1.3 What's Included
1.3.1 Kit Contents
• 1 x MSP-EXP430FR4133 LaunchPad Development Kit
• 1 x micro-USB cable
• 1 x Quick Start Guide
1.3.2 Software Examples
• Out-of-Box Software
1.4 First Steps: Out-of-Box Experience
An easy way to get familiar with the EVM is by using its preprogrammed out-of-box code. It demonstrates
some key features from a user level.
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1.4.1 Connecting to the Computer
Connect the LaunchPad using the included USB cable to a computer. A green power LED should
illuminate. For proper operation, drivers are needed. It is recommended to get drivers by installing an IDE
such as TI's CCS or IAR EW430. Drivers are also available at www.ti.com/MSPdrivers.
1.4.2 Running the Out-of-Box Demo
When connected to the computer, the LaunchPad powers up and displays a greeting message on the
LCD. Press and hold the S1 and S2 buttons simultaneously to select a new mode. A more detailed
explanation of each mode can be found in Section 3.4.
1.4.2.1 Stopwatch Mode
This mode provides a simple stopwatch application. It supports split time, where the display freezes while
the stopwatch continues running in the background.
Timer Stopped:
S1: Start time
S2: Reset time
Timer Running:
S1: Stop time
S2: Split time (lap time)
1.4.2.2 Temperature Mode
This mode provides a simple thermometer application. Using the on-chip temperature sensor, the
temperature is displayed on the LCD.
S1: Pause current temperature
S2: Toggle temperature between °F and °C
1.5 Next Steps: Looking Into the Provided Code
After the EVM features have been explored, the fun can begin. It's time to open an integrated
development environment and start editing the code examples. Refer to Section 3.3 for more information
on IDEs and where to download them.
The out-of-box source code and more code examples are provided for download at
http://www.ti.com/tool/msp-exp430fr4133. Code is licensed under BSD, and TI encourages reuse and
modifications to fit specific needs.
Section 3 describes all of the functions in detail and describes the project structure to help familiarize you
with the code.
With the onboard eZ-FET emulator debugging and downloading new code is simple. A USB connection
between the EVM and a PC through the provided USB cable is all that is needed.
l TEXAS INSTRUMENTS Lam LED? 93’
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eZ-FET on-board emulator
Enables debugging/programming as
well as communication back to the
PC. The eZ-FET can also provide
power to the target MCU.
Introducing EnergyTrace Technology
TM
Real-time power consumption readings and
state updates from the MSP430FR4133
MCU, including CPU and peripheral state
are viewable through the EnergyTrace GUI
Jumpers to isolate emulator
from target MCU (J101)
- Back-channel UART to PC
(RTS, CTS, RXD, TXD)
- Spy-Bi -Wire debug (SBWTDIO/SBWTCK)
- Power (5V, 3V3, and GND)
20-pin BoosterPack
plug-in module connector
(J1 and J2) {
Button/Switch
S2
User LEDs
LED1, LED2
Button/Switch
S1
Segmented LCD Display
- 6 alphanumeric characters
- 6 symbols for various applications
- Ultra-low power display
MSP430FR4133 Microcontroller
MSP1
Reset
{
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2 Hardware
Figure 2 shows an overview of the MSP-EXP430FR4133 hardware.
Figure 2. MSP-EXP430FR4133 Overview
Target Device
MSP430FR4133
Crystal
32.768 kHz
Micro-B
USB
3.3-VLDO
ESD
Protection
Debug
MCU
LEDs
Red, Green
Crystal
4 MHz
UART/SBW to Target
User Interface
2 Buttons and 2 LEDs
20-pin LaunchPad
standard headers
Power to Target
Reset
button Segmented LCD
EnergyTrace
Hardware
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2.1 Block Diagram
Figure 3 shows the block diagram.
Figure 3. Block Diagram
2.2 Hardware Features
2.2.1 MSP430FR4133
The MSP430FR4133 is the next device in TI's new ULP FRAM technology platform. FRAM is a cutting
edge memory technology, combining the best features of flash and RAM into one nonvolatile memory.
Device features include:
• 1.8-V to 3.6-V operation
• Up to 16-MHz system clock and 8-MHz FRAM access
• 16KB of nonvolatile FRAM
• Industry's lowest-power LCD controller
• IR modulation logic
• Two timer blocks and up to three serial interfaces (SPI, UART, or I2C)
• Analog: 10-channel 10-bit differential ADC
• Digital: RTC, CRC
*9 TEXAS INSTRUMENTS E: E «:5 E 9% 3 m3; 3 93.3 6759012345675901
P4.7/R13
P4.6/R23
P4.5/R33
P4.4/LCDCAP1
P4.3/LCDCAP0
P4.2/XOUT
P4.1/XIN
DVSS
DVCC
RST/NMI/SBWTDIO
TEST/SBWTCK
P4.0/TA1.1
P8.3/TA1.2
P8.2/TA1CLK
P8.1/ACLK/A9
P8.0/SMCLK/A8
P1.7/TA0.1/TDO/A7
P1.6/TA0.2/TDI/TCLK/A6
P1.5/TA0CLK/TMS/A5
P1.4/MCLK/TCK/A4/VREF+
P1.3/UCA0STE/A3
P1.2/UCA0CLK/A2
P1.1/ /A1/UCA0RXD/UCA0SOMI Veref+
P1.0/ /A0/Veref–UCA0TXD/UCA0SIMO
P5.7/L39
P5.6/L38
P5.5/L37
P5.4/L36
P5.3/UCB0SOMI/UCB0SCL/L35
P5.2/UCB0SIMO/UCB0SDA/L34
P5.1/UCB0CLK/L33
P5.0/UCB0STE/L32
P2.7/L31
P2.6/L30
P2.5/L29
P2.4/L28
P2.3/L27
P2.2/L26
P2.1/L25
P2.0/L24
P6.7/L23
P6.6/L22
P6.5/L21
P6.4/L20
P6.3/L19
P6.2/L18
P6.1/L17
P6.0/L16
P3.7/L15
P3.6/L14
P3.5/L13
P3.4/L12
P3.3/L11
P3.2/L10
P3.1/L9
P3.0/L8
P7.7/L7
P7.6/L6
P7.5/L5
P7.4/L4
P7.3/L3
P7.2/L2
P7.1/L1
P7.0/L0
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Figure 4. MSP430FR4133 Pinout
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2.2.2 eZ-FET Onboard Emulator With EnergyTrace™ Technology
To keep development easy and cost effective, TI's LaunchPad Development Kits integrate an onboard
emulator, which eliminates the need for expensive programmers. The MSP-EXP430FR4133 has the eZ-
FET emulator (see Figure 5), which is a simple and low-cost debugger that supports all MSP430 device
derivatives.
Figure 5. eZ-FET Emulator
The MSP-EXP430FR4133 LaunchPad features EnergyTrace technology but does not have support for
EnergyTrace++™ technology. The EnergyTrace functionality varies across the MSP portfolio (see
Table 1).
Table 1. EnergyTrace Technology
Feature EnergyTrace™ Technology EnergyTrace++™ Technology
Current Monitoring ✓ ✓
CPU State ✓
Peripheral and System State ✓
Devices Supported All MSP430 MCUs MSP430FR59xx and
MSP430FR69xx MCUs
Development Tool Required MSP-FET or eZ-FET MSP-FET or eZ-FET
The eZ-FET also provides a "backchannel" UART-over-USB connection with the host, which can be very
useful during debugging and for easy communication with a PC. The provided UART supports hardware
flow control (RTS and CTS), although by default these signals are not connected to the target.
The dotted line through J101 shown in Figure 5 divides the eZ-FET emulator from the target area. The
signals that cross this line can be disconnected by jumpers on J101, the isolation jumper block. More
details on the isolation jumper block are in Section 2.2.3.
The eZ-FET hardware can be found in the schematics in Section 6 and in the accompanying MSP-
EXP430FR4133 Hardware Design Files. The software and more information about the debugger can be
found on the eZ-FET lite wiki.
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2.2.3 Emulator Connection: Isolation Jumper Block
The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from
the eZ-FET domain into the MSP430FR4133 target domain. This includes eZ-FET Spy-Bi-Wire signals,
application UART signals, and 3.3-V and 5-V power (see Table 2 and Figure 6).
Reasons to open these connections:
• To remove any and all influence from the eZ-FET emulator for high accuracy target power
measurements
• To control 3-V and 5-V power flow between the eZ-FET and target domains
• To expose the target MCU pins for other use than onboard debugging and application UART
communication
• To expose the programming and UART interface of the eZ-FET so that it can be used for devices other
than the onboard MCU.
Table 2. Isolation Block Connections
Jumper Description
GND Ground
5V 5-V VBUS from USB
3V3 3.3-V rail, derived from VBUS by an LDO in the eZ-FET domain
RTS >> Backchannel UART: Ready-To-Send, for hardware flow control. The target can use this to indicate whether it
is ready to receive data from the host PC. The arrows indicate the direction of the signal.
CTS << Backchannel UART: Clear-To-Send, for hardware flow control. The host PC (through the emulator) uses this
to indicate whether it is ready to receive data. The arrows indicate the direction of the signal.
RXD << Backchannel UART: The target FR4133 receives data through this signal. The arrows indicate the direction
of the signal.
TXD >> Backchannel UART: The target FR4133 sends data through this signal. The arrows indicate the direction of
the signal.
SBW RST Spy-Bi-Wire emulation: SBWTDIO data signal. This pin also functions as the RST signal (active low).
SBW TST Spy-Bi-Wire emulation: SBWTCK clock signal. This pin also functions as the TST signal.
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eZ-FET
Emulator
MCU
Isolation
Jumper Block
Spy-Bi-Wire (SBW)
Emulation
Application UART
3.3V Power
5V Power
Target MSP430
MCU
eZ-FETMSP430 Target
USB Connector
in out
LDO
BoosterPack Header
BoosterPack Header
USB
EnergyTrace
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Figure 6. eZ-FET Isolation Jumper Block Diagram
2.2.4 Application (or "Backchannel") UART
The backchannel UART allows communication with the USB host that is not part of the target application's
main functionality. This is useful during development and also provides a communication channel to the
PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC
that communicate with the LaunchPad.
The pathway of the backchannel UART is shown in Figure 6. The backchannel UART is the UART on
eUSCI_A0. Because of USCI limitations, this UART channel is shared with the UART on the 20-pin
BoosterPack connector (eUSCI_A0). This UART channel is also shared with the red LED on P1.0. This is
a lot of sharing, but all 64 pins of the device are used and this was done out of necessity. The P1.0 pin
serves more functions than any other.
On the host side, a virtual COM port for the application backchannel UART is generated when the
LaunchPad enumerates on the host. You can use any PC application that interfaces with COM ports,
including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the
target application. You need to identify the COM port for the backchannel. On Windows PCs, Device
Manager can assist (see Figure 7).
Figure 7. Application Backchannel UART in Device Manager
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The backchannel UART is the "MSP Application UART1" port. In this case, Figure 7 shows COM13, but
this port can vary from one host PC to the next. After you identify the correct COM port, configure it in
your host application according to its documentation. You can then open the port and begin
communication to it from the host.
On the target MSP430FR4133 side, the backchannel is connected to the eUSCI_A0 module. The eZ-FET
has a configurable baud rate; therefore, it is important that the PC application configures the baud rate to
be the same as what is configured on the eUSCI_A0.
The eZ-FET also supports hardware flow control, if desired. Hardware flow control (CTS and RTS
handshaking) allows the target MSP430FR4133 and the emulator to tell each other to wait before sending
more data. At low baud rates and with simple target applications, flow control may not be necessary.
Applications with higher baud rates and more interrupts to service have a higher likelihood that the will not
be able to read the eUSCI_A0 RXBUF register in time, before the next byte arrives. If this happens, the
eUSCI_A0 UCA0STATW register reports an overrun error.
2.2.5 Special Features
2.2.5.1 Liquid Crystal Display (LCD)
The MSP430FR4133 LaunchPad features an on-board LCD (see Figure 8). This LCD is driven by the
internal LCD driver on the MSP430FR4133 device.
Figure 8. LCD Segment Layout
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There are many available LCD segments, including six full alpha-numeric numbers and letters in addition
to several symbols at the top for various modes or applications. Table 3 shows the mapping of these
segments.
Table 3. LCD FH-1138P Segment Mapping
Pin COM3 COM2 COM1 COM0
1 A1E A1F A1G A1M
2 A1A A1B A1C A1D
3 A1Q NEG A1N A1DP
4 A1H A1J A1K A1P
5 A2E A2F A2G A2M
6 A2A A2B A2C A2D
7 A2Q A2COL A2N A2DP
8 A2H A2J A2K A2P
9 A3R A3F A3G A3M
10 A3A A3B A3C A3D
11 A3Q ANT A3N A3DP
12 A3H A3J A3K A3P
13 A4R A4F A4G A4M
14 A4A A4B A4C A4D
15 A4Q A4COL A4N A4DP
16 A4H A4J A4K A4P
17 A5E A5F A5G A5M
18 A5A A5B A5C A5D
19 A5Q DEG A5N A5DP
20 A5H A5J A5K A5P
21 COM3 - - -
22 - COM2 - -
23 - - COM1 -
24 - - - COM0
25 - - - -
26 - - - -
27 - - - -
28 - - - -
29 - - - -
30 - - - -
31 - - - -
32 TMR HRT REC !
33 B6 B4 B2 BATT
34 B5 B3 B1 []
35 A6E A6F A6G A6M
36 A6A A6B A6C A6D
37 A6Q TX A6N RX
38 A6H A6J A6K A6P
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The MSP430FR4133 device has flexible LCD pins allowing any pin to be a SEG or a COM. This simplifies
layout for the user. The LCD connections are typically a tradeoff between easy layout and optimal memory
settings for cleaner user software, among other considerations. The flexibility of the MSP430FR4133
allowed an optimal memory setting for easy software, along with a simple layout on the PCB (see
Table 4).
Each LCDMEM register is eight bits, controlling up to eight segments. The FH-1138P is a 4-mux LCD, so
four COM pins are needed from the MSP430FR4133. With four COM pins, each segment pin controls four
bits or segments. This means that each LCDMEM register controls two segment pins, as shown in
Table 4. Note that LCDMEM14 to LCDMEM17 and LCDMEM20 and higher are not used due to layout
considerations.
Each alphanumeric character A1 to A6 is controlled by two adjacent LCDMEM registers for efficiency and
ease of use in software. This allows for a single 16-bit memory access to control the whole character, as
opposed to split memory regions requiring separate memory accesses.
Table 4. LCD to MSP430 Connections
LCDMEM
Port Pin
FR4133 Pin
LCD Pin
COM3
COM2
COM1
COM0
Port Pin
FR4133 Pin
LCD Pin
COM3
COM2
COM1
COM0
LCDM19 P5.7 L39 38 A6H A6J A6K A6P P5.6 L38 37 A6Q TX A6N RX
LCDM18 P5.5 L37 36 A6A A6B A6C A6D P5.4 L36 35 A6E A6F A6G A6M
LCDM17 P5.3 L35 P5.2 L34
LCDM16 P5.1 L33 P5.0 L32
LCDM15 P2.7 L31 P2.6 L30
LCDM14 P2.5 L29 P2.4 L28
LCDM13 P2.3 L27 P2.2 L26 34 B5 B3 B1 []
LCDM12 P2.1 L25 33 B6 B4 B2 BATT P2.0 L24 32 TMR HRT REC !
LCDM11 P6.7 L23 16 A4H A4J A4K A4P P6.6 L22 15 A4Q A4COL A4N A4DP
LCDM10 P6.5 L21 14 A4A A4B A4C A4D P6.4 L20 13 A4R A4F A4G A4M
LCDM9 P6.3 L19 12 A3H A3J A3K A3P P6.2 L18 11 A3Q ANT A3N A3DP
LCDM8 P6.1 L17 10 A3A A3B A3C A3D P6.0 L16 9 A3R A3F A3G A3M
LCDM7 P3.7 L15 8 A2H A2J A2K A2P P3.6 L14 7 A2Q A2COL A2N A2DP
LCDM6 P3.5 L13 6 A2A A2B A2C A2D P3.4 L12 5 A2E A2F A2G A2M
LCDM5 P3.3 L11 4 A1H A1J A1K A1P P3.2 L10 3 A1Q NEG A1N A1DP
LCDM4 P3.1 L9 2 A1A A1B A1C A1D P3.0 L8 1 A1E A1F A1G A1M
LCDM3 P7.7 L7 20 A5H A5J A5K A5P P7.6 L6 19 A5Q DEG A5N A5DP
LCDM2 P7.5 L5 18 A5A A5B A5C A5D P7.4 L4 17 A5E A5F A5G A5M
LCDM1 P7.3 L3 21 COM3 - - - P7.2 L2 22 - COM2 - -
LCDM0 P7.1 L1 23 - - COM1 - P7.0 L0 24 - - - COM0
I TEXAS INSTRUMENTS BoosterPack and External
Debug
Power
Domain
Target and
BoosterPack
Power
Domain
Legend
J101
3V3
eZ-FET
J1 J2
MSP430FR4133
target and
BoosterPack
VCC
GND
GND
J6
Target
MSP430FR4133
Device
LCD
USB (eZ-FET) Power
Configuration
Place
Jumper
BoosterPack and External
Power Configuration
J101
3V3
eZ-FET
J1 J2
MSP430FR4133
target and
BoosterPack
VCC
GND
GND
J6
Target
MSP430FR4133
Device
LCD
No
Jumper
Hardware
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2.3 Power
The board was designed to accommodate various powering methods, including through the on-board eZ-
FET and from external or BoosterPack power (see Figure 9).
Figure 9. MSP-EXP430FR4133 Power Block Diagram
2.3.1 eZ-FET USB Power
The most common power-supply scenario is from USB through the eZ-FET debugger. This provides 5-V
power from the USB and also regulates this power rail to 3.3 V for eZ-FET operation and 3.3 V to the
target side of the LaunchPad. Power from the eZ-FET is controlled by jumper J101. For 3.3 V, make sure
that a jumper is connected across the J101 3V3 terminal.
2.3.2 BoosterPack and External Power Supply
Header J6 is present on the board to supply external power directly. It is important to comply with the
device voltage operation specifications when supplying external power. The MSP430FR4133 has an
operating range of 1.8 V to 3.6 V. More information can be found in the MSP430FR4133 data sheet
(SLAS865).
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2.4 Measure MSP430 Current Draw
To measure the current draw of the MSP430FR4133 using a multi-meter, use the 3V3 jumper on the
jumper isolation block. The current measured includes the target device and any current drawn through
the BoosterPack headers.
To measure ultra-low power, follow these steps:
1. Remove the 3V3 jumper in the isolation block, and attach an ammeter across this jumper.
2. Consider the effect that the backchannel UART and any circuitry attached to the MSP430FR4133 may
have on current draw. Consider disconnecting these at the isolation jumper block, or at least consider
their current sinking and sourcing capability in the final measurement.
3. Make sure there are no floating input/output (I/Os). These cause unnecessary extra current draw.
Every I/O should either be driven out or, if it is an input, should be pulled or driven to a high or low
level.
4. Begin target execution.
5. Measure the current. Keep in mind that if the current levels are fluctuating, it may be difficult to get a
stable measurement. It is easier to measure quiescent states.
Alternatively, EnergyTrace technology can be used to measure the same current, and see energy profiles
through integrated GUI in CCS and IAR. EnergyTrace allows you to compare various current profiles and
better optimize your energy performance!
2.5 Clocking
The MSP-EXP430FR4133 provides an external clock in addition to the internal clocks in the device.
• Y1: a 32-kHz crystal
The 32-kHz crystal allows for lower LPM3 sleep currents than do the other low-frequency clock sources.
Therefore, the presence of the crystal allows the full range of low-power modes to be used.
The internal clocks in the device default to the following configuration:
• MCLK: DCO, 2 MHz
• SMCLK: DCO, 2 MHz
• ACLK: REFO, 32.768 kHz
For more information about configuring internal clocks and using the external oscillators, see the
MSP430FR4xx and MSP430FR2xx Family User's Guide (SLAU445).
2.6 Using the eZ-FET Emulator With a Different Target
The eZ-FET emulator on the LaunchPad can interface to most MSP430 derivative devices, not just the on-
board MSP430FR4133 target device.
To do this, disconnect every jumper in the isolation jumper block. This is necessary, because the emulator
cannot connect to more than one target at a time over the Spy-Bi-Wire (SBW) connection.
Next, make sure the target board has proper connections for SBW. Note that to be compatible with SBW,
the capacitor on RST/SBWTDIO cannot be greater than 2.2 nF. The documentation for designing MSP430
JTAG interface circuitry is the MSP430 Hardware Tools User's Guide (SLAU278).
Finally, wire together these signals from the emulator side of the isolation jumper block to the target
hardware:
• 5 V (if 5 V is needed)
• 3.3 V
• GND
• SBWTDIO
• SBWTCK
• TXD (if the UART backchannel is used)
• RXD (if the UART backchannel is used)
• CTS (if hardware flow control is used)
• RTS (if hardware flow control is used)
This wiring can be done either with jumper wires or by designing the board with a connector that plugs
into the isolation jumper block.
l TEXAS INSTRUMENTS
The following pins are exposed at the BoosterPack connector.
+3.3V
P8.1
P2.7
P1.1
P8.0
P5.1
P2.5
P8.2
P8.3
P1.0
UART RX
TX
Analog In
Analog In
SPI CLK
I2C* SCL
SDA
A9
A1
UCA0RXD
UCA0SOMI
A0
UCA0TXD
UCA0SIMO
L31
SMCLK A8
L33
UCB0CLK
L29
TA1CLK
TA1.2
BoosterPack
Standard MSP-EXP430FR4133 Pin Map
+3.3V
GPIO (!)
GPIO (!)
(!)
(!)
(!)
(!)
AC LK
GND
P1.7
P1.6
RST
P5.2
P1.3
P1.4
P1.5
P5.3
A7
TA0.1 TDO
L34 UCB0SDA
L35 UCB0SCL
UCB0SOMI
A4
MCLK TCK
A5
TMS TA0CLK
A6
TA0.2 TDI TCLK
A3
UCB0STE
UCB0SIMO SPI MOSI
MISO
SPI CS Wireless
SPI CS Display
SPI CS Other
BoosterPack Standard
MSP-EXP430FR4133 Pin Map
GND
RST
PWM Out GPIO (!)
GPIO (!)
GPIO (!)
GPIO (!)
GPIO (!)
(!)
(!)
(!)
(!)
(!)
UCA0STE
P5.0 L32 GPIO**
Also shown are functions that map with the BoosterPack standard.
* Note that to comply with the I C channels of the BoosterPack standard, a software-emulated I C must be used.
** Some LaunchPads do not 100% comply with the standard, please check your LaunchPad to ensure compatability
(!) Denotes I/O pins that are interrupt-capable.
2 2
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2.7 BoosterPack Pinout
The LaunchPad adheres to the 20-pin LaunchPad pinout standard. A standard was created to aid
compatibility between LaunchPad and BoosterPack tools across the TI ecosystem.
The 20-pin standard is compatible with the 40-pin standard that is used by other LaunchPads like the
MSP‑EXP430F5529LP. This allows some subset of functionality of 40-pin BoosterPacks to be used with
20-pin LaunchPads.
While most BoosterPacks are compliant with the standard, some are not. The MSP-EXP430FR4133
LaunchPad is compatible with all 20-pin BoosterPacks that are compliant with the standard. If the reseller
or owner of the BoosterPack does not explicitly indicate compatibility with the MSP-EXP430FR4133
LaunchPad, compare the schematic of the candidate BoosterPack with the LaunchPad to ensure
compatibility. Keep in mind that sometimes conflicts can be resolved by changing the MSP430FR4133
device pin function configuration in software. More information about compatibility can also be found at
http://www.ti.com/launchpad.
Figure 10 shows the 20-pin pinout of the MSP430FR4133 LaunchPad.
Note that software's configuration of the pin functions plays a role in compatibility. The LaunchPad side of
the dashed line in Figure 10 shows all of the functions for which the MSP430FR4133 device's pins can be
configured. This can also be seen in the MSP430FR4133 data sheet. The BoosterPack side of the dashed
line shows the standard. The LaunchPad function whose color matches the BoosterPack function shows
the specific software-configurable function by which the MSP430FR4133 LaunchPad adheres to the
standard.
Figure 10. LaunchPad to BoosterPack Connector Pinout
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2.8 Design Files
2.8.1 Hardware
Schematics can be found in Section 6. All design files including schematics, layout, bill of materials
(BOM), Gerber files, and documentation are available in the MSP-EXP430FR4133 Hardware Design Files.
2.8.2 Software
All design files including TI-TXT object-code firmware images, software example projects, and
documentation are available in the MSP-EXP430FR4133 Software Examples.
2.9 Hardware Change Log
Table 5. Hardware Change Log
PCB Revision Description
Rev 1.0 Initial release
Rev 1.1 Added CE marking to silkscreen for compliance. No functional or layout change.
3 Software Examples
The software examples included with the MSP430FR4133 LaunchPad can be found in the MSP-
EXP430FR4133 Software Examples.
Table 6. Software Examples
Demo Name BoosterPack
Required Description Details
OutOfBox_FR4133 None The out-of-box demo pre-programmed on the LaunchPad from
the factory. Demonstrates features of MSP430FR4133 device Section 3.4
3.1 Precompiled Binary
The /Binary/ folder inside the MSP-EXP430FR4133 Software Examples includes precompiled TI-TXT
binary files for each of the projects in Table 6 that are ready to be flashed onto the LaunchPad. A copy of
the MSP430Flasher tool is also shipped to interface with the eZ-FET Emulator.
To quickly program a demo onto the LaunchPad, simply navigate into the corresponding demo project's
directory and double click the "Program <Example>.bat" file.
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Software Examples
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Figure 11. Programming the LaunchPad With Program Batch Files
If desired, the "Program <Example>.bat" file can be modified to point to your own projects' binary file.
NOTE: After importing and compiling the software source code in an IDE such as CCS or IAR, the
TI-TXT binary files located in the /Binary/ folder are not updated automatically. Copy the
newly compiled binary from your IDE's /Workspace/Project/ directory and replace the
"<Example>.txt" in /Binary/ for the batch file to program your own binary file.
3.2 MSP430Ware Library
The examples are built upon MSP430 libraries shown below that are available from TI. All libraries are
available as part of MSP430Ware. Downloading CCS includes MSP430Ware along with TI Resource
Explorer.
• Driver library (MSP430DRIVERLIB): a foundational MSP430 software library that is useful for
interfacing with all MSP430 core functions and peripherals, especially clocks and power.
• Graphics library (MSP430-GRLIB): a library for interfacing MSP430 devices to dot-matrix LCD displays.
Contains primitives for simple drawing as well as images and more.
• Capacitive Touch Library (CAPSENSELIBRARY): a library for capacitive touch sensing applications.
This library supports the use of buttons, sliders, wheels and more. Highly configurable for each
application.
When you begin your own development, you will need more information about these libraries than can be
included in this user's guide. All of the information that you need is in MSP430Ware or the specific library
documentation linked above.
3.3 Development Environment Requirements
To use any of the software examples with the LaunchPad, you must have an IDE that supports the
MSP430FR4133 device (see Table 7). For more details on where to download the latest IDE, see
Section 4.3.
Table 7. IDE Minimum Requirements for MSP-EXP430FR4133
Code Composer Studio™ IDE IAR Embedded Workbench™ IDE
CCS v6.0 or later IAR EW430 v6.10 or later
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3.3.1 CCS
CCS v6.0 or later is required. When CCS has been launched, and a workspace directory chosen, use
Project>Import Existing CCS Eclipse Project. Direct it to the desired demo project directory that contains
main.c (see Figure 12). Selecting the \CCS subdirectory also works. The CCS-specific files are located
there.
Figure 12. Directing the Project>Import Function to the Demo Project
When you click OK, CCS should recognize the project and allow you to import it. The indication that CCS
has found the project is that it appears in "Discovered projects" and is checked (see Figure 13).
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Software Examples
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Figure 13. When CCS Has Found the Project
Sometimes CCS finds the project but does not show a checkmark; this might mean that your workspace
already has a project by that name. You can resolve this by renaming or deleting that project. (Even if you
do not see it in the CCS workspace, be sure to check the workspace directory on the file system.)
3.3.2 IAR
IAR 6.10 or higher is required. To open the demo in IAR, click File>Open>Workspace…, and browse to
the *.eww workspace file inside the \IAR subdirectory of the desired demo. All workspace information is
contained within this file.
The subdirectory also has an *.ewp project file. This file can be opened into an existing workspace by
clicking Project>Add-Existing-Project….
Although the software examples have all of the code required to run them, IAR users may download and
install MSP430Ware, which contains MSP430 libraries and the TI Resource Explorer. These are already
included in a CCS installation (unless the user selected otherwise).
3.4 Out-of-Box Software Example
This section describes the functionality and structure of the out-of-box software that is preloaded on the
EVM.
There are two modes in the out-of-box software, stopwatch mode and temperature sensor mode, which
can be controlled with S1 and S2 push buttons on the LaunchPad. This demo shows how to utilize the
LCD_E module (active in low power mode 3.5), combined with the RTC counter, ADC, and internal
temperature sensor, to implement simple stopwatch and thermometer.
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3.4.1 Source File Structure
The project is split into multiple files. This makes it easier to navigate and reuse parts of it for other
projects.
Table 8. List of Source Files and Folders
Name Description
main.c The out-of-box demo main function, initializations, shared ISRs, and so on
hal_LCD.c Hardware abstraction layer for LCD
StopWatchMode.c Main function file for stopwatch mode
TempSensorMode.c Main function file for live thermometer mode
Library: Driverlib Device driver library (MSP430DRIVERLIB)
3.4.2 Power Up and Idle
Upon powering up the out-of-box demo, the LCD displays a scrolling welcome message. The
MSP430FR4133 then enters a loop, in which the LCD cycles through all of its segments followed by a
scrolling instruction message to "Hold S1 and S2 to switch modes".
3.4.3 Stopwatch Mode
While in the power up and idle state or in the temperature sensor mode, the stopwatch mode can be
entered by holding down both S1 and S2 buttons shortly. The LCD displays scrolling text "STOPWATCH
MODE" to indicate successful entry into this mode.
The MSP430FR4133 initializes the stopwatch calendar to HH:MM:SS:CC = 00:00:00:00, then goes to
sleep in LPM3.5. Since the onboard LCD has 6 alphanumeric digits, the stopwatch format is initially
MM:SS:CC but becomes HH:MM:SS when the timer reaches the first hour.
Press the S1 button to start the stopwatch timer (counts up). While the timer is running, the
MSP430FR4133 sleeps and wakes between LPM3 (waiting for RTC interrupt) and active mode
(incrementing calendar and updating LCD). Press the S1 button again to stop the stopwatch timer and
return the MSP430FR4133 back to LPM3.5 to conserve power. When the stopwatch timer is stopped,
press the S2 button resets the timer back to 00:00:00.
While the stopwatch timer is running, press the S2 button to pause the LCD at the current time but
continue the timer running in the background, allowing for the "split timer" functionality. Press the S2
button to resume display of the running timer on the LCD.
3.4.4 Temperature Sensor Mode
While in the stopwatch mode, the temperature sensor mode can be entered by holding down both S1 and
S2 buttons shortly. The LCD displays scrolling text "TEMPSENSOR MODE" to indicate successful entry
into this mode.
Upon entering this mode, the MSP430FR4133 initializes the ADC input to its internal temperature sensor
and starts sampling/conversion at four times per second. Each time an ADC conversion completes, the
LCD shows the calculated temperature to the tenths decimal place.
The temperature unit can be toggled between Celsius and Fahrenheit by pressing the S2 button.
The temperature measurement can also be paused/resumed by pressing the S1 button. While the
temperature measurement is running, the MSP430FR4133 sleeps and wakes between LPM3 (waiting for
ADC sample/conversion to finish) and active mode (processing the results and updating LCD). When the
temperature measurement is paused, the MSP430FR4133 enters LPM3.5 with the LCD remaining on
displaying the last measured temperature.
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4 Additional Resources
4.1 LaunchPad Websites
More information about the MSP430FR4133 LaunchPad, supported BoosterPacks, and available
resources can be found at:
•Tool Folder: resources specific to this particular LaunchPad
•TI's LaunchPad portal: information about all LaunchPads from TI for all MCUs
4.2 Information on the MSP430FR4133
At some point, you will probably want more information about the MSP430FR4133 device. For every
MSP430 device, the documentation is organized as shown in Table 9.
Table 9. How MSP430 Device Documentation is Organized
Document For MSP430FR4133 Description
Device family user's guide MSP430FR4xx and MSP430FR2xx
Family User's Guide (SLAU445)Architectural information about the device, including all modules
and peripherals such as clocks, timers, ADC, and so on.
Device-specific data sheet MSP430FR413x Mixed-Signal
Microcontrollers data sheet
(SLAS865)
Device-specific information and all parametric information for this
device
4.3 Download CCS or IAR
Although the files can be viewed with any text editor, more can be done with the projects if they're opened
with a development environment like Code Composer Studio (CCS) or IAR Embedded Workbench.
CCS and IAR are available in full, free code-size, or time limited versions. The full out-of-box demo can be
built with the free versions of CCS and IAR (IAR KickStart), because it is under the code size limit. For full
functionality, download the full version of either CCS or IAR.
Go to the MSP430 software tools page to download them and for instructions on installation.
4.4 MSP430Ware and TI Resource Explorer
MSP430Ware is a complete collection of libraries and tools. It includes all of the MSP430 libraries used in
the software examples. By default, MSP430Ware is included in a CCS installation. IAR users must
download it separately.
MSP430Ware is built into the TI Resource Explorer, for easily browsing tools. For example, all of the
software examples are shown in Figure 14.
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Figure 14. MSP-EXP430FR4133 Software Examples in TI Resource Explorer
Inside TI Resource Explorer, these examples and many more can be found, and easily imported into CCS
with one click.
4.5 MSP430FR4133 Code Examples
This is a set of very simple code examples (SLAC625) that demonstrate how to use the entire set of
MSP430 peripherals: ADC12, Timer_A, eUSCI, and so on. These do not use driver library, rather they
access the MSP430 registers directly.
Every MSP430 derivative has a set of these code examples. When writing code that uses a peripheral,
they can often serve as a starting point.
Code examples can be accessed directly through MSP430Ware and the TI Resource Explorer without
downloading the code examples mentioned above. TI Resource Explorer allows a one-click import of the
device example code.
4.6 MSP430 Application Notes
There are many application notes at www.ti.com/msp430, with practical design examples and topics.
4.7 Community Resources
4.7.1 TI E2E™ Community
Search the forums at e2e.ti.com. If you cannot find your answer, post your question to the community.
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4.7.2 Community at Large
Many online communities focus on the LaunchPad – for example, http://www.43oh.com. You can find
additional tools, resources, and support from these communities.
5 FAQ
Q: I can't get the backchannel UART to connect. What's wrong?
A: Check the following:
• Do the baud rate in the host's terminal application and the USCI settings match?
• Are the appropriate jumpers in place, on the isolation jumper block?
• Probe on RXD and send data from the host. If you don't see data, it might be a problem on the host
side.
• Probe on TXD while sending data from the MSP430. If you don't see data, it might be a configuration
problem with the eUSCI module.
• Consider the use of the hardware flow control lines (especially for higher baud rates).
Q: So the onboard emulator is really open source? And I can build my own onboard emulator?
A: Yes! We encourage you to do so. The design files are on ti.com.
Q: The MSP430 G2 LaunchPad had a socket, allowing me change the target device. Why doesn't
this LaunchPad use one?
A: This LaunchPad provides more functionality, and this means using a device with more pins. Sockets for
devices with this many pins are too expensive for the LaunchPad's target price.
Q: With the female headers on the bottom, the board doesn't sit flat on the table, and I can't
unsolder them. Why did TI do this?
A: For several reasons. A major feedback item on previous LaunchPads was the desire for female
headers instead of male ones. But simply using female instead is problematic, because compatibility with
existing BoosterPacks would be lost, and some people prefer male headers. So, adding female headers
without removing male ones satisfies both preferences. It also allows more flexibility in stacking
BoosterPacks and other LaunchPads.
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6 Schematics
The following figures show the schematics for the MSP-EXP430FR4133.
Figure 15. Schematics (1 of 6)
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Host MCU and LCD module
MSP430FR4133
100n
GND
100n100n
1u
12p
12p
GND +3V3
10u 100n
GNDGND
GND
32.768kHz
P4.7/R13
1
P4.6/R23
2
P4.5/R33
3
P4.4/LCDCAP1
4
P4.3/LCDCAP0
5
P4.2/XOUT
6
P4.1/XIN
7
DVSS
8
DVCC
9
RST/NMI/SBWTDIO
10
TEST/SBWTCK
11
P4.0/TA1.1
12
P8.3/TA1.2
13
P8.2/TA1CLK
14
P8.1/ACLK/A9
15
P8.0/SMCLK/A8
16
P1.7/TA0.1/TDO/A7
17
P1.6/TA0.2/TDI/TCLK/A6
18
P1.5/TA0CLK/TMS/A5
19
P1.4/MCLK/TCK/A4
20
P1.3/UCA0STE/A3
21
P1.2/UCA0CLK/A2
22
P1.1/UCA0RXD/UCA0SOMI/A1/VEREF+
23
P1.0/UCA0TXD/UCA0SIMO/A0/VEREF-
24
P5.7/L39
25
P5.6/L38
26
P5.5/L37
27
P5.4/L36
28
P5.3/UCB0SOMI/UCB0SCL/L35
29
P5.2/UCB0SIMO/UCB0SDA/L34
30
P5.1/UCB0CLK/L33
31
P5.0/UCB0STE/L32
32
P2.7/L31 33
P2.6/L30 34
P2.5/L29 35
P2.4/L28 36
P2.3/L27 37
P2.2/L26 38
P2.1/L25 39
P2.0/L24 40
P6.7/L23 41
P6.6/L22 42
P6.5/L21 43
P6.4/L20 44
P6.3/L19 45
P6.2/L18 46
P6.1/L17 47
P6.0/L16 48
P3.7/L15 49
P3.6/L14 50
P3.5/L13 51
P3.4/L12 52
P3.3/L11 53
P3.2/L10 54
P3.1/L9 55
P3.0/L8 56
P7.7/L7 57
P7.6/L6 58
P7.5/L5 59
P7.4/L4 60
P7.3/L3 61
P7.2/L2 62
P7.1/L1 63
P7.0/L0 64
MSP1
MSP430FR4x
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
LCD1
C3C2C1
C4
C5
C6
C7 C8
Y1
L[0..39]
L0
L0
L1
L1
L2
L2
L4
L4
L5
L5
L6
L6
L7
L7
L8
L8
L9
L9
L10
L10
L11
L11
L12
L12
L13
L13
L14
L14
L15
L15
L39
L39
L38
L38
L37
L37
L36
L36
L16
L16
L17
L17
L18
L18
L19
L19
L21
L21
L22
L22
L23
L23
L24
L24
L25
L25
L26
L26
L3
L3
RST/SBWTDIO
TEST/SBWTCK
P4.0
P8.3
P8.2
P8.1
P8.0
P1.7
P1.6
P1.5
P1.4
P1.3
P1.2
P5.3
P5.1
P5.0
P2.5
P2.6
P2.7
P5.2
L20
L20
P1.0/TXD
P1.1/RXD
P2.4/CTS
P2.3/RTS
Texas Instruments
Mike Stein
1.1
A
B
C
D
1 2 3 4 5 6
A
B
C
D
1 2 3 4 5 6
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Figure 16. Schematics (2 of 6)
t; TEXAS INSTRUMENTS m7 mum/m v1 wmw/sv} ts L win/m: an 7 12 m J3 u mm 1" mm fix m mu: MEL Wm n «r w L Wu) K» L swam L mm h it; 12: m it}; 11: wk CDHPHNY: TITLE: MSD’EXD4BZED4133 GDPPUUED: 3/6 Sheen CHECKED: DPHNN: 12/28/2816 4:51 pm Rev: capyngmmmr Yams Insuumena \ncnrpmahed
1
10 11
2021
22
GND
Green
Red
GND
47k
1n
GND
+3V3
470
470
+3V3
GND
+3V3
GND
100n
+3V3
GND
MOUNTHOLE_125MIL MOUNTHOLE_125MIL
MOUNTHOLE_125MIL MOUNTHOLE_125MIL
GND
Mounting Holes: 125 mil for 4-40/M2.5/M3 screws
BoosterPack Headers Pushbuttons S1, S2, S3
External Power and Battery Connector LEDs
Silkscreen
1 3
42
S2
1 3
42
S3
LED2
LED1
1
2
JP1
R1
C11
R4
R5
C10
1 3
42
S1
U$2 U$3
U$5 U$6
1
2
3
J6
RST/SBWTDIO
RST/SBWTDIO P2.6
P1.2
P4.0
P8.1
P1.1/RXD
P2.7
P8.0
P5.1
P2.5
P8.2
P8.3
P1.6
P1.7
P5.0
P5.2
P5.3
P1.3
P1.4
P1.5
P1.0/TXD
P1.0/TXD
5V
Texas Instruments
Mike Stein
1.1
A
B
C
D
1 2 3 4 5 6
A
B
C
D
1 2 3 4 5 6
+3V3
GND
GND
Copyright © 2017, Texas Instruments Incorporated
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Figure 17. Schematics (3 of 6)
TEXAS INSTRUMENTS CDHPHNY: TITLE: MSD’EXD4BZED4133 DPHNN: CHECKED: flPPPUUED: 12/2g/2ms 4:51 pm Rev: Sheen 4/6 Cupyngmmmv Yams Insummem \ncnrpmahed
Software-controlled DCDC converter
TARGET VCC SENSE
Energy measurement method protected under U.S. Patent
Application 13/329,073 and subsequent patent applications
MSP430G2452IRSA16R
4k7 4k7
2k2
3k3
6k8
820
0
GND
470
GND
2u2
220k
220k 32p
GND GND
220k
220k 32p
GND GND
220k
220k
32p
GND GND
100n4.7u
GNDGND
4.7u 100n
47k
GNDGND
GND
4.7u
GND
4.7u
GND
100n
GND
MSP430G2X[1/5]2
GND
BAS40-05
BC850CW-115
DMG1013UW
BAS40-05
TS5A21366RSER
GND
47k
GND
100n
GND
R116 R117
R126
R127
R128
R118
R119
R120
L101
R121
R122 C122
R112
R113 C115 R114
R115
C116
C118C117
C119 C120
R107
C109
C106 C124
1
2
3
4
5
6
7 10
11
12
13
14
15
16
8 9
TP
MSP102
D102
T102
T101
D101
NO1
1
IN1
3
NO2
5
IN2
7
COM1 8
COM2 4
V+ 2
GND
6
IC103
R108
C126
EZFET_DCDCTEST
EZFET_DCDCRSTEZFET_HOSTSDA
EZFET_HOSTSCL
EZFET_VCC
EZFET_VCC
EZFET_DCDCIO0
EZFET_DCDCIO1
EZFET_VCCOUT
EZFET_VCCOUT
EZFET_VCCOUT
EZFET_VCCOUT
EZFET_VCCOUT
EZFET_DCDCCAL0
EZFET_DCDCCAL1
EZFET_DCDCCAL2
EZFET_DCDCPULSE
EZFET_AVCC
EZFET_AVCCOUT
EZFET_VBUS
EZFET_VBUS
EZFET_VCCTARGET
EZFET_VCCEN1
EZFET_AVCCOUT2ADC
EZFET_VCCEN2
Texas Instruments
Mike Stein
1.1
+
+
A
B
C
D
1 2 3 4 5 6
A
B
C
D
1 2 3 4 5 6
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Figure 18. Schematics (4 of 6)
TEXAS INSTRUMENTS mm .3 gm , F a .L __ K E -_ E a ( 1 A «manamwawmmwm J- ” 1 1 7 I F W 1, gm 5 m w; 10:4 mm“ 1 E FET E TD! 5 ‘ 5 ‘ Emma 7 w WWW ‘ E FET U RTTXD 9 woflmLEL \ mum n Law 1 E m u was :3 ‘ :2 V 2 RT ‘ W‘O‘Oia ‘ W as ,7 ‘ m 5 ‘ any we ‘ 44 TH”? ‘ 43 ‘ 1 40mm, J ‘ ‘ [n W «0 ‘EFEY c L 7777777777777 A 7 FBBEB/l/ZJX 3; , :::::::::::::::::T 7 95.5mm vx'uzwm'uzmm A I 35 E m y a mcu 3" E FFT H Sr D mm CUMDHNY: i i TITLE: MSD’EXD43ZFQ4133 DPHNN: CHECKED: flpPPUUED: 12/28/2816 4:51 BM REV: Sheen 5/6 Copyngm®2017 Yams Insummem \ncnrpmahed
Host MCU for emulation
To MSP430FR4133
MSP430F5528IRGC
GND
GND
GND
470 470
GND GND
1n
47k
GND
470n
GND
220n
GND
220n
GND
GND
100n
GND
10u
GND
100n
GND
100n
GND
240k
150k 32p
GND GND
100n
GND
GND GND
+3V3
Red
Green
PIEZO_CSTCR4M00G15L99
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
16
1
2
3
4
5
6
7
8
9
11
12
13
14
15
10
TP
R101 R102
C112
R109
C101
C102 C107
C103
C104 C113
C121
R124
R125 C123
C114
J101
1 2
3 4
5 6
7 8
9 10
11 12
13 14
15 16
17 18
19 20
LED101
LED102
1
2
3
Q101
EZFET_LED0
EZFET_LED1
EZFET_VCORE
EZFET_AVBUS
EZFET_UARTTXD
EZFET_UARTRTS
EZFET_SBWTDIO
EZFET_SBWTCK
EZFET_VCCEN1
EZFET_VCCEN2
EZFET_DCDCIO0
EZFET_DCDCIO1
EZFET_RST
EZFET_TCK
EZFET_TMS
EZFET_TDI
EZFET_TDO
EZFET_TEST
EZFET_XT2OUT
EZFET_XT2IN
EZFET_V18
EZFET_VUSB
EZFET_VBUS
EZFET_VBUS
EZFET_VBUS
EZFET_PU.1/DM
EZFET_PUR
EZFET_PU.0/DP
EZFET_VREF
EZFET_VCC
EZFET_VCC
EZFET_VCC
EZFET_DCDCTEST
EZFET_DCDCRST
EZFET_HOSTSDA
EZFET_HOSTSCL
EZFET_DCDCPULSE
EZFET_AVCCOUT2ADC
EZFET_UARTRXD
EZFET_UARTCTS
EZFET_NC_TMSC
EZFET_VCCTARGET
5V
TEST/SBWTCK
RST/SBWTDIO
P1.0/TXD
P1.1/RXD
P2.3/RTS
P2.4/CTS
Texas Instruments
Mike Stein
1.1
+
A
B
C
D
1 2 3 4 5 6
A
B
C
D
1 2 3 4 5 6
Copyright © 2017, Texas Instruments Incorporated
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Figure 19. Schematics (5 of 6)
TEXAS INSTRUMENTS CDHPHNY: TITLE: MSD’EXD4BZED4133 DPHNN: CHECKED: GDPPUUED: 12/28/2816 4:51 pm Rev: Sheen 6/6 oupyngmmmv Yams lnslmmems \ncnrpumlzd
USB interface and power supply
DEBUG
TLV70033:3.3V
TLV70033DSE
1u
TPD4E004DRYR
27
27
10p 10p
GNDGND
1k4
1M
GND
GND GND
33k
GND
GND GND
GND
GND
100n
Change IC101 to adjust target voltage from 2.8V to 3.6V
C108
IO1
1
IO2
2
GND
3IO3 4
IO4 5
VCC 6
IC102
R103
R104
C110 C111 R105
R106
R123
1
TP102
1
TP107
1
TP103
1
TP104
1
TP105
1
TP106
1
TP109
1
TP108
1
TP101
1
2
3
4
5
SS1*6
IN
1
EN
6
OUT 3
GND
2
IC101
C105
GND
EZFET_VBUS
EZFET_DP
EZFET_DM
EZFET_DM
EZFET_SHIELD
EZFET_SHIELD
EZFET_PU.0/DP
EZFET_PU.1/DM
EZFET_PUR
EZFET_VCC
EZFET_RST
EZFET_TCK
EZFET_TMS
EZFET_TDI
EZFET_TDO
EZFET_TEST
EZFET_DCDCTEST
EZFET_DCDCRST
Texas Instruments
Mike Stein
1.1
A
B
C
D
1 2 3 4 5 6
A
B
C
D
1 2 3 4 5 6
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Schematics
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‑
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Figure 20. Schematics (6 of 6)
l TEXAS INSTRUMENTS
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Revision History
Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from July 21, 2015 to January 17, 2017 ........................................................................................................... Page
• Added Rev 1.1 to Table 5,Hardware Change Log.................................................................................. 17
• Updated all figures in Section 6,Schematics ........................................................................................ 25
WARNING
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
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2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
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3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
www.ti.com
4
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
5
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2019, Texas Instruments Incorporated
WARNING
STANDARD TERMS FOR EVALUATION MODULES
1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, and/or
documentation which may be provided together or separately (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance
with the terms set forth herein. User's acceptance of the EVM is expressly subject to the following terms.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms do not apply to Software. The warranty, if any, for Software is covered in the applicable Software License
Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for a nonconforming EVM if (a) the nonconformity was caused by
neglect, misuse or mistreatment by an entity other than TI, including improper installation or testing, or for any EVMs that have
been altered or modified in any way by an entity other than TI, (b) the nonconformity resulted from User's design, specifications
or instructions for such EVMs or improper system design, or (c) User has not paid on time. Testing and other quality control
techniques are used to the extent TI deems necessary. TI does not test all parameters of each EVM.
User's claims against TI under this Section 2 are void if User fails to notify TI of any apparent defects in the EVMs within ten (10)
business days after delivery, or of any hidden defects with ten (10) business days after the defect has been detected.
2.3 TI's sole liability shall be at its option to repair or replace EVMs that fail to conform to the warranty set forth above, or credit
User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the warranty
period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to repair or
replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall be
warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
WARNING
Evaluation Kits are intended solely for use by technically qualified,
professional electronics experts who are familiar with the dangers
and application risks associated with handling electrical mechanical
components, systems, and subsystems.
User shall operate the Evaluation Kit within TI’s recommended
guidelines and any applicable legal or environmental requirements
as well as reasonable and customary safeguards. Failure to set up
and/or operate the Evaluation Kit within TI’s recommended
guidelines may result in personal injury or death or property
damage. Proper set up entails following TI’s instructions for
electrical ratings of interface circuits such as input, output and
electrical loads.
NOTE:
EXPOSURE TO ELECTROSTATIC DISCHARGE (ESD) MAY CAUSE DEGREDATION OR FAILURE OF THE EVALUATION
KIT; TI RECOMMENDS STORAGE OF THE EVALUATION KIT IN A PROTECTIVE ESD BAG.
www.ti.com
2
3Regulatory Notices:
3.1 United States
3.1.1 Notice applicable to EVMs not FCC-Approved:
FCC NOTICE: This kit is designed to allow product developers to evaluate electronic components, circuitry, or software
associated with the kit to determine whether to incorporate such items in a finished product and software developers to write
software applications for use with the end product. This kit is not a finished product and when assembled may not be resold or
otherwise marketed unless all required FCC equipment authorizations are first obtained. Operation is subject to the condition
that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference.
Unless the assembled kit is designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must
operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•Reorient or relocate the receiving antenna.
•Increase the separation between the equipment and receiver.
•Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
•Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210 or RSS-247
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSSs. Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
www.ti.com
3
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required to follow the
instructions set forth by Radio Law of Japan, which includes, but is not limited to, the instructions below with respect to EVMs
(which for the avoidance of doubt are stated strictly for convenience and should be verified by User):
1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
2. 実験局の免許を取得後ご使用いただく。
3. 技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http:/
/www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
3.4 European Union
3.4.1 For EVMs subject to EU Directive 2014/30/EU (Electromagnetic Compatibility Directive):
This is a class A product intended for use in environments other than domestic environments that are connected to a
low-voltage power-supply network that supplies buildings used for domestic purposes. In a domestic environment this
product may cause radio interference in which case the user may be required to take adequate measures.
www.ti.com
4
4EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
6. Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY MATERIALS PROVIDED WITH THE EVM (INCLUDING, BUT NOT
LIMITED TO, REFERENCE DESIGNS AND THE DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL
FAULTS." TI DISCLAIMS ALL OTHER WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT
NOT LIMITED TO ANY EPIDEMIC FAILURE WARRANTY OR IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS
FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY THIRD PARTY PATENTS, COPYRIGHTS, TRADE
SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS SHALL BE
CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY OTHER INDUSTRIAL OR
INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD PARTY, TO USE THE
EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY INVENTION, DISCOVERY OR
IMPROVEMENT, REGARDLESS OF WHEN MADE, CONCEIVED OR ACQUIRED.
7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS. THIS OBLIGATION SHALL APPLY
WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY OTHER LEGAL
THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
www.ti.com
5
8. Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS OR THE USE OF THE EVMS , REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF
SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED TO, COST OF REMOVAL OR
REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES, RETESTING,
OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS, LOSS OF SAVINGS, LOSS OF
USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL BE BROUGHT AGAINST TI
MORE THAN TWELVE (12) MONTHS AFTER THE EVENT THAT GAVE RISE TO THE CAUSE OF ACTION HAS
OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY USE OF AN EVM PROVIDED
HEREUNDER, INCLUDING FROM ANY WARRANTY, INDEMITY OR OTHER OBLIGATION ARISING OUT OF OR IN
CONNECTION WITH THESE TERMS, , EXCEED THE TOTAL AMOUNT PAID TO TI BY USER FOR THE PARTICULAR
EVM(S) AT ISSUE DURING THE PRIOR TWELVE (12) MONTHS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE
CLAIMED. THE EXISTENCE OF MORE THAN ONE CLAIM SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
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