Datenblatt für dsPIC33EPyyyGM3yy,6yy,7yy von Microchip Technology
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MCLR
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/U2RTS
WU1RTS
JUQCTS




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U1CTS
UWRTS
UZCTS
U2RTS
USCTS
USRTS
UACTS
UARTS
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MCLR


MCLR
MCLR
MCLR
MCLR
l
(2mm
1
(MIC)
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mm
15
23
23
rry/Borrow
rry/Borrow


register. The C and DC Slams [ms operate as Borrow
Digil Borrow


















































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onoiouuo



MCLR







SVSRST
SYSRST
MCLR
MCLR




















































E
UBRTS
UARTS
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USCTS
UACTS















V
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When TCS : 1.
When TCS : ,7.
When TCS : 1.
When TCS : ,7.

V
Y7
When T32 : .
When T32 : .
When TCS : 1.
When TCS : ,7.
When TCS : 1.
When TCS : ,7.

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When Se: ‘0‘ '.














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Master mode.
save mode.
S‘andard Buffer Mode
Enhanced Buffer Mode.
S‘andard Buffer Mode
Enhanced Buffer Mode.
Master mode.
save mode.
E
SSX

Q

V
LSb
V7
Wnle
Wme
A2:
A VVé A A
Wme
If STREN : 1.
If STREN : C.



For 107B“ Address.
For 7rBil Address (IZCxMSK<6 0=""> on‘y .
6>
UXCTS
UXRTS
0‘ op‘ion wxlh me UxCTS and UxRTS
UXRTS
UXCTS

UXRTS
UXRTS
UXRTS
RX‘ UXCTS
d UXRTS
UXRTS
UxCTS
UXCTS
UXCTS UXRTS

IfIREN:C.
IfIREN:1.














If MIDE : .
If MIDE : .






When IDE : C.
When IDE : 1.
When IDE : 1.
When IDE : C.









AV
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For 1078“ Opera‘ion
For 1278“ Opera‘ion
\f SSRCG : .
\f SSRCG : .
\n 1278i: Mode (AD12B : )‘ S‘MSAM is Unimplemenled and is Read as‘ ‘.
In 127B“ Mode (AD1ZB : A) CHPS<1.0> BiLs are Unimplememed and are Read as ‘NJI‘.
1.0>
When ADDMAEN : C.
When ADDMAEN : 1.














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CMP4
VI
VI

Cx‘N1+
r
CxlN1r X ‘
‘
Cx|N1+
When CPOL : .
When CPOL : .
When CPOL : nonrinverled go‘amy .
When CPOL : inverled go‘anly .
If CPOL : inverted golarily .
If CPOL : nonrinverted golarily .
If CPOL : inverted golarily .
If CPOL : nonrinverted golarily .
When CPOL : nonrinverled go‘amy .
When CPOL : inverled go‘anly .
If CPOL : inverted golarily .
If CPOL : nonrinverted golarily .
If CPOL : inverted golarily .
If CPOL : nonrinverted golarily .





When CVRR<1 0=""> : .
When CVRR<1 0=""> : .
When CVRR<1 0=""> : .
When CVRR<1 0=""> : .
1>1>1>1>
When CVRR<1 0=""> : .
When CVRR<1 0=""> : .
When CVRR<1 0=""> : .
When CVRR<1 0=""> : .
1>1>1>1>

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PMALL PMALH
PMCSZ
PMCS1/PMCS
PMBE
For Slave Modes and Masler Mode 2 (PMMODE<9.8> : , ‘ ).
PMWR
For Master Mode 1 PMMODE<9 8=""> : .
PMENB
For Slave Modes and Masler Mode 2 (PMMODE<9.8> : , ‘ ).
PMRD
For Master Mode 1 PMMODE<9 8=""> : .
PMWR
PMRD
9>9.8>9>9.8>
/PMWR

If PMCON<7.6> : or C1.
If PMCON<7.6> : or CE.
If PMCON<7.6> : .
If PMCON<7.6> : or Ex.
7.6>7.6>7.6>7.6>














MCLR














MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
MCLR
AVDD‘ AVss‘ MCLR
AVDD‘ AVss‘ MCLR
MCLR


Load Condmon 1 Load Condmon 2
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Load Condi‘ion 1 Load Condinon 2



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Load Condihon 1 Load Condinon 2


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GM710-IIPTe3
1410017
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MICHOCHIF
d5P|C33EP512
GM710-IIPFe3
1410017
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:::::::::::
: LT
44-Lead Plastic Thin Quad Flatpack (PT) 10X10X1 mm Body, 2.00 mm Footprint [TQFF‘]
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RECOMMENDED LAND PATTERN
Unks MILUMETERS
Dimension Limks MIN \ NOM \ MAX
Comam Pm E 0.80 850
Can‘am Pad Spacmg c1 11 40
sumac: Pad Spacmg c2 11 40
some: Pad Widm (x44) X: 0.55
sumac: Pad Lenglh (x44) W 1.50
Distance Between Pads :3 o 25
Noles
1 Dwmenswomng and lolerancing perASME Y14.5M
55:: Basic Dwmenswon Theoretwca‘ly exact value shown without Io‘erances
Microchip Techno‘ogy Drawmg No 004720755
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]
No‘e: Forlhe most current package drawmgs, please see (he Microchip Packaging SpecIIIcalIon Iocaled at
hllp'llwww mIcrochIp (yum/packaging
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(DATUM A) 7 \1
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44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN]
Note: For the mosl current package arawmgs, ptease see me Mlcrochlp Packagmg Specmcatton tocated at
hllp://www.mtcrochtpLom/packagmg
Um|s NHLUMETERS
Dtmenston Limus MIN | NOM | MAX
Number of Pms N 44
Pttch e o 65 550
mean Heighl A u so 0 so 1 on
Standoff At a on 0 oz 0 05
Termmat Thickness A3 0 2o REF
Overau wmm E s no 350
Exposed Pad wmth E2 5 25 | 5 45 | 6 an
Overs” Length D s on ESC
Expused Pad Lenglh D2 5 25 s 45 s an
Termmat Wtdlh b o 2!) u 30 u 35
Termmat Lengm L u an 0 AD 0 so
TerminatrlorExpcsedrPad K a 20 , ,
NOIeS'
t. Pm1 vtsuat mdex feature may vary, but must be tocated witmn the hatched area
2. Package is saw smgutatea
3. Dtmensioning and toteranemg per ASME Y‘M 5M
Esc- Bastc Dtmenslon Theoretlcal‘y exact vatue shown wttnout toterances
REF' Relerence Dimenston. usuaHv wtmouttoteranee for mtormattan Dumoses omv
Mtcmcmp Technology Drawing 004-1030 Sheet 2 of 2
44-Lead Plastic Quad Flat,
No Lead Package (ML) - 8x8 mm Body [QFN]
Note: Forlhe most current package drawings, please see the Microchip Packagmg Specmcalwon \ocated at
nup-Nwww mwcrocmp Gum/packaging
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S‘LK SCREEN
RECOMMENDED LAND PATTERN
Umls M‘LL‘METERS
Dwmenswon Limus MIN | NOM | MAX
Contact Push E 0 65 BSC
Opuonal Center Pad W‘dth W2 6.60
Oplmnal Center Pad Lengm T2 5.50
Contact Pad Spacmg c1 8 00
Contact Pad Spacmg (:2 a on
Coniacl Pad Wwdth (X44) X1 0.35
Conlacl Pad Lengm (x44) w 0.85
Dislance Heme-en Pads G 0 25
Notes:
1 Dwmensioning and «merancing per ASME Y‘M 5M
BSC: Basic Dimenswn Theorencany exam vame shown wuhout lo‘erances
chmchlp Techno‘ogy Drawing No commas
64-Lead Plastic Quad Flat, No Lead Package (MR) — 9x9x0.9 mm Body [QFN]
With 7.15 x 7.15 Exposed Pad
sEAflNG PLANE
NOTE 1
(DATUM A)
(DATUM a)
H 64Xb
BOTTOM VIEW
o.1c®
o 05®
AIBI
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Microchip Tecnnmogy Drawmg commas Sheet 1 012
64-Lead Plastic Quad Flat, No Lead Package (MR) — 9x9xo.9 mm Body [QFN]
With 7.15 x 7.15 Exposed Pad
Unws MILLIMETERS
D1mens1on Ltmtts MW | NOM \ MAX
Number at Pms N 64
Pitch e 0 50 BSC
everan He1ghl A 0.00 o 90 1 00
Slande" A1 0 00 o 02 0 05
Canlact Thickness A3 0 20 REF
Overs“ Wldm E 9 00 ESE
Exposed Pad Width 52 7.05 | 7 15 1 7 50
Overan Length D 9 00 BSC
Exposed Pad Length D2 7 05 7 15 7 50
Contact Wmm b D13 0 25 O 30
Cantaet Length L 0.30 n 40 0 50
Contact—to—Expasea Pad K 0.20 - -
Notes:
1 P1n1 visua1 1ndex veature may vary. hu| must be heated wtthih the halched area
2 Package is saw sthgmated.
3 D1mens1onlng and tuterahcthg perASMEY14.5M.
BSC Basic Dimension. Theoreticany exact vame shown w1|houl to1erahces.
REF Reference Dlmenslan, usuaHy wllhoul taterahce, for tntormattoh purposes ahty
Mlcmchlp Technology Drawmg GOA-1490 Sheet 2 of 2
(SA-Lead Plastic Quad Flat, No Lead Package (MR) 7 9x9x0.9 mm Body [QFN]
With 0.40 mm Contact Length
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S‘LK SCREEN
RECOMMENDED LAND PATTERN
Umts MILUMETERS
Dnnension Ltmtts MIN \ NOM \ MAX
Contacl Pttcn E 0.50 BSC
cottonat Center Fad Width W2 7.35
apnonat Center Pad Length 12 7.35
Contact Pad Spacmg c1 5.90
Contact Pad Spacmg C2 5.90
Contact Fad Width (x04) x1 0.30
Contact Pad Length (x54) w 0.35
Dislanoe Between Pads G 0.20
Notes'
1 Dimenstoning and toterancing per ASME v14 5M
BSC Easlc Dlmensmn Theoret‘ca‘ly exact value shown wtthout to‘erances
Mtcmcmp Tecnnclogy Drawmg No. COA-ZMQA
D
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TOP VIEW
7 A —
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SEATING , ,
PLANE
E 0.08
SIDE VIEW
chrocmp Technmogy Drawing 004-08
Number of Leade
Lead Pitch
Overau Height
Motded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overau width
Overau Length
Motded Package Width
Motded Package Length
Lead Thickness
Lead width
Motd Drafl Angie Top
No.95 Motd Drafl An ie Bottom
1. PM 1 Visual Index fealure may vary‘ butmusl b
2, Chamfers at comers are optionat, we may var
3. DimenSions D1 and E1 do nol inctude moid fla
protrustons shaH not exceed 0.25mm per Slde
4. DImenstonmg and toteiancing per ASME Y14.5
Bso, Bastc Dimension TheorellcaHy exac
REF Reference Dimension, usuauy witho
64-Lead Plastic Thin Quad Ftatpack (PT) 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
I:
l:l
:I
:I
:I
l:l
l:l
:I
|:| CZ
:I
l:l
:I
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|:I :I
t:t l:l
,l L x. ,l L E
RECOMMENDED LAND PATTERN
Untts MtLLtMETERs
Dtmenston LtthS MN | NOM \ MAX
Contact Pitch E 0 50 BSC
Contact Pad Spacing ct 11.40
Contact Pad Spacing 02 11.40
Contact Pad Wtdth (x54) X1 0 30
Conlact Pad Length (X64) Y1 1 50
D1stance Between Pads G 0.20
Notes-
1 Dtmensmnmg and tuterancmg per ASME Y14 SM
350: Eastc Dimension. Theoreltcalty exact vatue shown wtthout tolerances
Mmmcmp Tecnnmugy Drawtrtg No 004-20553
100-Lead Plastic Thtn Quad Flatpack (PT)-12X12x1 mm Body. 2.00 mm Footprint [TQFP]
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RECOMMENDED LAND PATTERN
< 1="" units="" milumeters="" dlmenslon="" ltmtts="" min="" \="" noni="" \="" max="" camact="" pm="" e="" o="" 40="" ese="" contact="" pad="" spacmg="" 01="" 13.40="" contact="" pad="" spacmg="" 02="" 13.40="" contact="" pad="" wtdm="" (x100)="" x1="" 0.20="" contact="" pad="" length="" (x100)="" v1="" 1="" so="" dlslance="" between="" pads="" g="" u="" 20="" notes="" 1="" dtmenstunlng="" and="" tolerancmg="" perasme="" v1a="" sm="" 550="" east:="" dtmenston="" thearettcauy="" exact="" value="" shown="" wtthmfl="" tolerances="" mtcrocmp="" technotogy="" drawing="" no="" commas="">
1007Lead Plastic Thin Quad Flaipack (PF) 7 14x14x1 mm Body 2.00 mm Footprim [TQFF‘]
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RECOMMENDED LAND PATTERN
Units M1LL|METERS
Dimension L1m1L§ MN | NOM 1 MAX
Comaci Pitch E 0 so 558
Contact Pad Spacing (:1 15.40
Comaci Pad Spacing c2 15.40
Contact Pad Widm (X1 {10) X1 0 30
Camact Pad Length (X1 00) Y1 1 50
Beam Between Pads 6 0.20
Notes
1. Dimensluning and la1erancing per ASME Y14.5M
830: Basic Dimension. Theorehcany exact vaiue shown without mierances.
Microchip Technology Drawing No 004-21105
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121-Lead Plastic Thin Profile Ball Grid Array (BG) -10x10x1.10 mm Body
[TFBGA--Formerly XBGA]
Note: For [he most current package drawings, please see the Microchip Packaging Specification located at
htlp I/www microchipcomlpackaging
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O O O O O O O O O O O
O O O O O O O O O O O
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RECOMMENDED LAND PATTERN
Unlls MiLLIMETERS
Dlmension Limits MiN | NOM | MAX
contact Piich Ei u 50 E50
Contact Pitcn E2 0 ac asc
contact Pad Spaclng c1 8 00
Contact Pad Spaclng c2 5 00
Contact Pad Diameter (X121) x a 32
Noies
I. Dimensioning and Ioierancmg per ASME YI4.5M
550: Basic Dimension Theoreticaliy exact Vaiue shown without loleranoes.
Microchip Technoiogy Drawing No (20472145 Rev D












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