Datenblatt für 501912 Series Spec von Molex

molex 0.3mm Ev? FPCFfi 3?»?9
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TITLE:
0.3 FPC CONNECTOR E/O
GOLD PLATING (Hgt=1.8mm)
―LEAD FREE― 製品仕様書
E
変 更
REVISED
ECN No. J2016-0144
’15/08/17 YU.HASEGAWA
THIS DOCUMENT CONTAINS INFORMATION THAT IS PROPRIETARY TO
MOLEX LLC. AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
REV.
DESCRIPTION
DESIGN CONTROL
J
STATUS
WRITTEN
BY:
Y．MAEDA
CHECKED
BY:
M.TANAKA
APPROVED
BY:
N.UKITA
DATE: YR/MO/DAY
2006/07/17
DOCUMENT NUMBER
PS-501912-001
FILE NAME
PS501912001.docx
SHEET
1 OF 10
EN-037(2015-08 rev.2)
PRODUCT SPECIFICATION
【１．適用範囲 SCOPE】
本仕様書は、 殿 に納入する
0.3 mm ピッチ FPC用 コネクタ について規定する。
This specification covers the 0.3 mm PITCH FPC CONNECTOR series.
【２．製品名称及び型番 PRODUCT NAME AND PART NUMBER】
製 品 名 称
Product Name
製 品 型 番
Part Number
ハウジング アッセンブリ
Housing Assembly R/A (Bottom Contact Type)
無鉛
LEAD FREE
５０１９１２－＊＊１０
501912-**10 テーピング梱包品
Embossed Tape Package for 501912-**10
無鉛
LEAD FREE
５０１９１２－＊＊９０
* : 図面参照 Refer to the drawing.
【３．定格 RATINGS 】
項 目
Item
規 格
Standard
最大許容電圧
Rated Voltage(MAXIMUM)
50 V
[AC(実効値 rms) / DC]
最大許容電流
Rated Current (MAXIMUM)
0.2A
使用温度範囲*1
Ambient Temperature Range
(Operating and Non-operating)
-40℃ ～ +105℃ *2 *3
＊1：基板実装後の無通電状態は、使用温度範囲が適用されます。
Non-operating connectors after reflow must follow the operating temperature range condition.
＊2：通電による温度上昇分を含む。
This includes the terminal temperature rise generated by conducting electricity.
＊3：適合FPC(電線、ケーブル等)も本使用温度範囲を満足すること。
Applicable FPC (wires and cables) must also meet the specified temperature range.
molex 4 — 1 . ififlmfifié Electrical Performance w
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EN-037(2015-08 rev.2)
PRODUCT SPECIFICATION
【４．性 能 PERFORMANCE】
４－１．電気的性能 Electrical Performance
項目
Item
条件
Test Condition
規格
Requirement
4-1-1
接 触 抵 抗
Contact
Resistance
適合FPCを嵌合させ、開放電圧 20mV 以下、短絡
電流 10mAにて測定する。
(JIS C5402 5.4)
Mate applicable FPC and measure by dry circuit ,
20mV MAXIMUM, 10mA
(JIS C5402 5.4)
奇数極 ODD CIRCUIT
80 milliohm MAXIMUM
偶数極 EVEN CIRCUIT
40 milliohms MAXIMUM
4-1-2
絶 縁 抵 抗
Insulation
Resistance
適合FPCを嵌合させ、隣接するターミナル間及びタ
ーミナル、アース間に、DC 500Vを印加し測定する。
(JIS C5402 5.2/MIL-STD-202 試験法 302)
Mate applicable FPC and apply 500V DC between
adjacent terminal and ground.
(JIS C5402 5.2/MIL-STD-202 Method 302)
50 Megaohm MINIMUM
4-1-3
耐 電 圧
Dielectric
Strength
適合FPCを嵌合させ、隣接するターミナル間及びタ
ーミナル、アース間に、AC 250V（実効値）を1分
間印加する。
(JIS C5402 5.1/MIL-STD-202 試験法 301)
Mate applicable FPC, apply 250V AC for 1 minute
between adjacent terminal or ground.
(JIS C5402 5.1/MIL-STD-202 Method 301)
異状なきこと
No Breakdown
４－２. 機械的性能 Mechanical Performance
項目
Item
条件
Test Condition
規格
Requirement
4-2-1
FPC保持力
FPC retention
Force
アクチュエータ挿入状態にて、毎分 25±3 mm の
速さでFPCを引き抜く。
Insert the actuator,pull the FPC at a rate of 25±3
mm per minute.
第６項参照
Refer to paragraph 6
4-2-2
ターミナル保持力
Terminal
Retention Force
毎分 25±3mm の速さで各端子を引き抜く。
Apply axial pull out force at the rate of 25±
3mm/minute on the terminal assembled in the
housing.
0.5 N {0.05 kgf}
MINIMUM
molex 4 — 3. f 0) 1th Environmental Performance and Others
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PRODUCT SPECIFICATION
４－３．そ の 他 Environmental Performance and Others
項目
Item
条件
Test Condition
規格
Requirement
4-3-1
繰り返し動作
Repeated
Actuator
Insertion/
Withdrawal
無通電状態にて1分間に10回以下の速さで、挿
入、抜去を20回繰り返す。
Insert and withdraw actuator up to 20 cycles at
the a rate of less than 10 cycles/minute.
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN
CIRCUIT
60milliohms
MAXIMUM
4-3-2
温 度 上 昇
Temperature
Rise
適合FPCを嵌合させ、最大許容総電流を通電し、
コネクタの温度上昇分を測定する。
(UL 498)
Mate applicable FPC and measure the
temperature rise of contact when the maximum
AC rated current is passed.
(UL 498)
温度上昇
Temperatur
e Rise
30 °C
MAXIMUM
4-3-3
耐 振 動 性
Vibration
DC 1mA 通電状態にて、嵌合軸を含む互いに垂
直な3方向に掃引割合 10～55～10 Hz/分、全振
幅 1.5mm の振動を各 2時間 加える。
(MIL-STD-202試験法 201)
Amplitude : 1.5 mm P-P
Frequency : 10-55-10 Hz / minute.
Duration : 2 hours in each
X.Y.Z. axes.
(MIL-STD-202, Method 201)
外 観
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN
CIRCUIT
60milliohms
MAXIMUM
瞬 断
Discontinuity
1.0
microsecond
MAXIMUM
molex
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PRODUCT SPECIFICATION
項目
Item
条件
Test Condition
規格
Requirement
4-3-4
耐 衝 撃 性
Shock
適合FPCを嵌合させ、DC 1mA 通電状態にて、嵌合軸
を含む互いに垂直な 6方向 に、490 m/s2 (50G) の衝撃
を 各3回 加える。
(JIS C0041/MIL-STD-202 試験法 213)
Mate applicable FPC and subject to the following shock
conditions. 3 times of shocks shall be applied for each
6 directions along 3 mutually perpendicular axes,
passing DC 1 mA current during the test.
(Total of 18 shocks)
Peak value : 490 m/s2 (50 G)
(JIS C0041/MIL-STD-202 Method 213)
外 観
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
瞬 断
Discontinuity
1.0
microsecond
MAXIMUM
4-3-5
耐 熱 性
Heat
Resistance
適合FPCを嵌合させ、105±2℃ の雰囲気中に 96時間
放置後取り出し、1～2時間 室温に放置する。
( JIS C0021/MIL-STD-202 試験法 108 )
Mate applicable FPC and expose to 105 +/- 2℃
for 96 hours. Upon completion of the exposure period,
the test specimens shall be conditioned at ambient
room conditions for 1 to 2 hours, after which the
specified measurements shall be performed.
( JIS C0021/MIL-STD-202 Method 108 )
外 観
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
molex
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PRODUCT SPECIFICATION
項目
Item
条件
Test Condition
規格
Requirement
4-3-6
耐 寒 性
Cold
Resistance
適合FPCを嵌合させ、－40±2℃ の雰囲気中に96時間
放置後取り出し、1～2時間室温に放置する。
( JIS C0020 )
Mate applicable FPC and expose to -40 +/- 2℃ for 96
hours. Upon completion of the exposure period, the
test specimens shall be conditioned at ambient room
conditions for 1 to 2 hours, after which the specified
measurements shall be performed.
( JIS C0020 )
外 観
Appearance
異状なきこと
No Damage
接 触 抵 抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
4-3-7
耐 湿 性
Humidity
適合FPCを嵌合させ、60±2℃ 、相対湿度90～95%の
雰囲気中に 96時間 放置後取り出し、1～2時間室温に
放置する。
( JIS C0022/MIL-STD-202 試験法 103 )
Mate applicable FPC and expose to 60 +/- 2℃,relative
humidity 90 to 95% for 96 hours. Upon completion of
the exposure period, the test specimens shall be
conditioned at ambient room conditions for 1 to 2
hours, after which the specified measurements shall
be performed.
( JIS C0022/MIL-STD-202 Method 103 )
外 観
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
耐電圧
Dielectric
Strength
4-1-3項 満足の
こと
Must meet
4-1-3
絶縁抵抗
Insulation
Resistance
20 megaohm
MINIMUM
molex
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EN-037(2015-08 rev.2)
PRODUCT SPECIFICATION
項目
Item
条件
Test Condition
規格
Requirement
4-3-8
温度サイクル
Temperature
Cycling
適合FPCを嵌合させ、-55±3℃に30分、+105±2℃に
30分、これを1サイクルとし、5サイクル繰り返す。但
し、温度移行時間は、3分以内とする。試験後1～2時
間室温に放置する。(JIS C0025)
5 cycle
a) -55±3℃ 30 minutes
b) +105±2℃ 30 minutes
(Transit time shall be within 3 minutes)
(MIL-STD-202 Method 107)
外 観
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
4-3-9
塩 水 噴 霧
Salt Spray
適合FPCを嵌合させ、35±2℃ にて、重量比 5±1%
の塩水を48±4時間噴霧し、試験後常温で水洗いした
後、室温で乾燥させる。
( JIS C0023/MIL-STD-202 試験法 101 )
Mate applicable FPC and expose to the following salt
mist conditions. Upon completion of the exposure
period, salt deposits shall be removed by a gentle
wash or dip in running water, after which the specified
measurements shall be performed.
NaCl solution
Concentration : 5±1%
Spray time : 48±4 hours
Ambient temperature : 35±2℃
( JIS C0023/MIL-STD-202 Method 101 )
外 観
Appearance
異状なきこと
No Damage
接触抵抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
4-3-10
亜硫酸ガス
SO2 Gas
適合FPCを嵌合させ、40±2℃にて, 50±5 ppm の亜
硫酸ガス中に24時間放置する。
Mate applicable FPC and expose them to the following
SO2 gas atmosphere.
Temperature 40±2 ℃
Gas Density 50±5 ppm
Duration 24 hours
外 観
Appearance
異状なきこと
No Damage
接 触 抵 抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
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GOLD PLATING (Hgt=1.8mm)
―LEAD FREE― 製品仕様書
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EN-037(2015-08 rev.2)
PRODUCT SPECIFICATION
項目
Item
条件
Test Condition
規格
Requirement
4-3-11
耐アンモニア性
NH3 Gas
適合FPCを嵌合させ、水素イオン濃度28％の
アンモニア水を入れた容器中に40分間放置
する。（1Lに対して25mLの割合）
40 minutes exposure to NH３ gas
evaporating from 28% Ammonia solution
外 観
Appearance
異状なきこと
No Damage
接 触 抵 抗
Contact
Resistance
奇数極
ODD CIRCUIT
100milliohms
MAXIMUM
偶数極
EVEN CIRCUIT
60milliohms
MAXIMUM
4-3-12
半田付け性
Solderability
端子先端より0.2mm、金具先端より0.2mmの位
置まで245±3℃の半田に2～3秒漬す。
Dip solder tails and fitting nail into the molten
solder(held at 245±3℃)up to 0.2mm from the
bottom of the housing for 2～3 seconds.
濡れ性
Solder
Wetting
浸水面積の75%
以上
75% of
immersed area
must
show no
voids, pin
holes.
4-3-13
半田耐熱性
Resistance to
Soldering Heat
（リフロー時）第７項参照
(When reflowing) See paragraph 7.
外 観
Appearance
端子ガタ
割れ等
異状無きこと
No Damage
（手半田時）
端子先端より0.2mm、金具先端より0.2mmの位
置まで370～400℃の半田に3±1秒加熱後。
Dip solder tails and fitting nail into the molten
solder(held at 350±5℃)up to 0.2mm from the
bottom of the housing for 3±1seconds.
【５．外観形状、寸法及び材質 PRODUCT SHAPE, DIMENSIONS AND MATERIALS】
図面参照 Refer to the drawing.
molex
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EN-037(2015-08 rev.2)
PRODUCT SPECIFICATION
【６．FPC保持力 FPC RETENTION FORCE】
＊FPCの仕様により保持力が影響を受ける為、規格を満たさない事があります。
There may be the case which the connector performance does not meet the above specification,
because the different FPC manufacturers have their own unique specification.
極数
No. of
CKT
単位
UNIT
保持力 (最小値)
Retention Force (MIN.)
極数
No. of
CKT
単位
UNIT
保持力 (最小値)
Retention Force (MIN.)
初 回
1st
10回目
10th
20回目
20th
初 回
1st
10回目
10th
20回目
20th
15
N
{kgf}
3.3
{0.34}
1.8
{0.19}
1.8
{0.19}
35
N
{kgf}
5.5
{0.56}
4.7
{0.48}
4.3
{0.44}
21
N
{kgf}
3.9
{0.40}
2.6
{0.27}
2.6
{0.27}
37
N
{kgf}
5.7
{0.58}
5.0
{0.51}
4.5
{0.46}
23
N
{kgf}
4.2
{0.43}
3.0
{0.31}
2.8
{0.29}
39
N
{kgf}
6.0
{0.61}
5.3
{0.54}
4.8
{0.49}
25
N
{kgf}
4.4
{0.45}
3.3
{0.34}
3.0
{0.31}
45
N
{kgf}
6.6
{0.68}
6.2
{0.63}
5.5
{0.56}
27
N
{kgf}
4.6
{0.47}
3.6
{0.37}
3.2
{0.33}
47
N
{kgf}
6.8
{0.69}
6.4
{0.65}
5.7
{0.58}
33
N
{kgf}
5.3
{0.54}
4.4
{0.45}
4.0
{0.41}
51
N
{kgf}
7.2
{0.73}
6.8
{0.69}
6.1
{0.62}
molex fl / 90 : 305ec. TEMPERATURE CONDITION GRAPH
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EN-037(2015-08 rev.2)
PRODUCT SPECIFICATION
【７．赤外線リフロー条件 INFRARED REFLOW CONDITION 】
温度条件グラフ
TEMPERATURE CONDITION GRAPH
(基板表面温度）
(TEMPERATURE ON BOARD PATTERN SIDE)
リフロー可能回数：2回
Reflow possibility : 2 times
注記(NOTE)；
1. 本リフロー条件に関しては、リフロー装置及び基板などにより
条件が異なりますので、事前にリフロー評価の確認をお願い致します。
Please check the reflow soldering condition by your own devices beforehand.
Because the condition changes by the soldering devices, p.c.boards, and so on.
2. クリーム半田の厚さは、リフロー後で 0.12mm 以上を維持して下さい。
Thickness of the cream solder shall be maintained 0.12mm MIN. after reflow process.
250℃(ピーク温度) 10秒
250℃(PEAK TEMP)10sec
30±10秒(230℃以上)
30±10sec. (230℃MIN.)
90±30秒
90±30sec.
予熱：150～200℃
Pre-heat：150～200℃
molex
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PRODUCT SPECIFICATION
REV.
REV. RECORD
DATE
ECN NO.
WRITTEN BY :
CHECKED BY :
A
RELEASED
‘06/07/17
J2006-3517
Y.MAEDA
N.UKITA
B
REVISED
‘07/09/11
J2008-0709
R.TSURUOKA
T.HARUYAMA
C
REVISED
’07/10/17
J2008-1377
Y.MAEDA
N.UKITA
D
REVISED
’08/03/03
J2008-3156
H.TAGAMI
K.TAKAHASHI
E
REVISED
‘15/08/18
J2016-0144
YU.HASEGAWA
K.TAKAHASHI