Datenblatt für SN74AUC2G07 von Texas Instruments

I TEXAS INSTRUMENTS HRH Hljlj
1
FEATURES
3
2
4
61
1A 1Y
2Y
GND
2A
3
2
4
61
1A 1Y
2Y
GND
2A
1A
2A
1Y
2Y
GND
Seemechanicaldrawingsfordimensions.
1
4
2
3
6
VCC
VCC
5VCC
5
5
DBVPACKAGE
(TOP VIEW)
DCKPACKAGE
(TOP VIEW)
YZP PACKAGE
(BOTTOMVIEW)
DESCRIPTION/ORDERING INFORMATION
SN74AUC2G07
www.ti.com
............................................................................................................................................................... SCES443D – MAY 2003 – REVISED JUNE 2008
DUAL BUFFER/DRIVER WITH OPEN-DRAIN OUTPUTS
2
•Available in the Texas Instruments NanoFree™ •Low Power Consumption, 10 µA at 1.8 VPackage
•± 8-mA Output Drive at 1.8 V•Optimized for 1.8-V Operation and Is 3.6-V I/O
•Latch-Up Performance Exceeds 100 mA PerTolerant to Support Mixed-Mode Signal
JESD 78, Class IIOperation
•ESD Protection Exceeds JESD 22•I
off
Supports Partial-Power-Down Mode
– 2000-V Human-Body Model (A114-A)Operation
– 200-V Machine Model (A115-A)•Sub-1-V Operable
– 1000-V Charged-Device Model (C101)•Max t
pd
of 2.5 ns at 1.8 V
This dual buffer/driver is operational at 0.8-V to 2.7-V V
CC
, but is designed specifically for 1.65-V to 1.95-V V
CCoperation.
The output of the SN74AUC2G07 is open drain and can be connected to other open-drain outputs to implementactive-low wired-OR or active-high wired-AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as thepackage.
This device is fully specified for partial-power-down applications using I
off
. The I
off
circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
(2)
NanoFree™ – WCSP (DSBGA)
Reel of 3000 SN74AUC2G07YZPR _ _ _UV_0.23-mm Large Bump – YZP (Pb-free)
Reel of 3000 SN74AUC2G07DBVR– 40C to 85C
SOT (SOT-23) – DBV U07_Reel of 250 SN74AUC2G07DBVT
SOT (SC-70) – DCK Reel of 3000 SN74AUC2G07DCKR UV_
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
(2) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one followingcharacter to designate the assembly/test site.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2003 – 2008, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
l TEXAS INSTRUMENTS
1A 1Y
1 6
2A 2Y
3 4
ABSOLUTE MAXIMUM RATINGS
(1)
SN74AUC2G07
SCES443D – MAY 2003 – REVISED JUNE 2008 ...............................................................................................................................................................
www.ti.com
FUNCTION TABLE(EACH BUFFER/DRIVER)
INPUT OUTPUTA Y
H H
L L
LOGIC DIAGRAM (POSITIVE LOGIC)
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range – 0.5 3.6 V
V
I
Input voltage range
(2)
– 0.5 3.6 V
V
O
Voltage range applied to any output in the high-impedance or power-off state
(2)
– 0.5 3.6 V
V
O
Output voltage range
(2)
– 0.5 V
CC
+ 0.5 V
I
IK
Input clamp current V
I
< 0 – 50 mA
I
OK
Output clamp current V
O
< 0 – 50 mA
I
O
Continuous output current ± 20 mA
Continuous current through V
CC
or GND ± 100 mA
DBV package 165
θ
JA
Package thermal impedance
(3)
DCK package 259 C/W
YZP package 123
T
stg
Storage temperature range – 65 150 C
(1) Stresses beyond those listed under " absolute maximum ratings " may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under " recommended operatingconditions " is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.(3) The package thermal impedance is calculated in accordance with JESD 51-7.
2Submit Documentation Feedback Copyright © 2003 – 2008, Texas Instruments Incorporated
Product Folder Link(s): SN74AUC2G07
l TEXAS INSTRUMENTS
RECOMMENDED OPERATING CONDITIONS
(1)
ELECTRICAL CHARACTERISTICS
SN74AUC2G07
www.ti.com
............................................................................................................................................................... SCES443D – MAY 2003 – REVISED JUNE 2008
MIN MAX UNIT
V
CC
Supply voltage 0.8 2.7 V
V
CC
= 0.8 V V
CC
V
IH
High-level input voltage V
CC
= 1.1 V to 1.95 V 0.65 נV
CC
V
V
CC
= 2.3 V to 2.7 V 1.7
V
CC
= 0.8 V 0
V
IL
Low-level input voltage V
CC
= 1.1 V to 1.95 V 0.35 נV
CC
V
V
CC
= 2.3 V to 2.7 V 0.7
V
I
Input voltage 0 3.6 V
V
O
Output voltage 0 3.6 V
V
CC
= 0.8 V 0.7
V
CC
= 1.1 V 3
I
OL
Low-level output current V
CC
= 1.4 V 5 mA
V
CC
= 1.65 V 8
V
CC
= 2.3 V 9
Δt/ Δv Input transition rise or fall rate 20 ns/V
T
A
Operating free-air temperature – 40 85 C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS V
CC
MIN TYP
(1)
MAX UNIT
I
OL
= 100 µA 0.8 V to 2.7 V 0.2
I
OL
= 0.7 mA 0.8 V 0.25
I
OL
= 3 mA 1.1 V 0.3V
OL
VI
OL
= 5 mA 1.4 V 0.4
I
OL
= 8 mA 1.65 V 0.45
I
OL
= 9 mA 2.3 V 0.6
I
I
A inputs V
I
= V
CC
or GND 0 to 2.7 V ± 5 µA
I
off
V
I
or V
O
= 2.7 V 0 ± 10 µA
I
CC
V
I
= V
CC
or GND, I
O
= 0 0.8 V to 2.7 V 10 µA
C
i
V
I
= V
CC
or GND 2.5 V 2.5 pF
(1) All typical values are at T
A
= 25C.
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): SN74AUC2G07
l TEXAS INSTRUMENTS
SWITCHING CHARACTERISTICS
SWITCHING CHARACTERISTICS
OPERATING CHARACTERISTICS
SN74AUC2G07
SCES443D – MAY 2003 – REVISED JUNE 2008 ...............................................................................................................................................................
www.ti.com
over recommended operating free-air temperature range, C
L
= 15 pF (unless otherwise noted) (see Figure 1 )
V
CC
= 1.2 V V
CC
= 1.5 V V
CC
= 1.8 V V
CC
= 2.5 VV
CC
= 0.8 VFROM TO
± 0.1 V ± 0.1 V ± 0.15 V ± 0.2 VPARAMETER UNIT(INPUT) (OUTPUT)
TYP MIN MAX MIN MAX MIN TYP MAX MIN MAX
t
PLH
4.3 1.2 3 1 2.2 1 1.8 2.5 0.9 1.6A Y nst
PHL
6.2 1 3.1 0.6 2.3 0.6 1 1.9 0.6 1.2
over recommended operating free-air temperature range, C
L
= 30 pF (unless otherwise noted) (see Figure 1 )
V
CC
= 1.8 V V
CC
= 2.5 VFROM TO
± 0.15 V ± 0.2 VPARAMETER UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX
t
PLH
1 2 2.5 0.6 1.2A Y nst
PHL
0.9 1.5 2.3 0.8 1.8
T
A
= 25C
V
CC
= 0.8 V V
CC
= 1.2 V V
CC
= 1.5 V V
CC
= 1.8 V V
CC
= 2.5 VTESTPARAMETER UNITCONDITIONS
TYP TYP TYP TYP TYP
Power dissipationC
pd
f = 10 MHz 2.5 2.5 2.5 2.5 3.5 pFcapacitance
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Product Folder Link(s): SN74AUC2G07
ii? TEXAS INSTRUMENTS
PARAMETER MEASUREMENT INFORMATION
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 ,
slewrate 1V/ns.
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
E. t andt arethesameast .
F. t andt arethesameast .
G. t andt arethesameast .
L
O
PLZ PHZ dis
PZL PZH en
PLH PHL pd
£ W
³
FromOutput
UnderTest
C
(seeNote A)
L
LOADCIRCUIT
S1
2×VCC
Open
GND
RL
RL
t /t
PLH PHL Open
TEST S1
2×VCC
t /t
PLZ PZL
GND
t /t
PHZ PZH
0V
tW
Input
0V
Input
Output
Output
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
VOLTAGEWAVEFORMS
PULSEDURATION
VCC/2
VCC/2 VCC/2
VCC/2
VOL
VOH
VCC
VCC
VOH
VOL
VCC/2
VCC/2
VCC/2
VCC/2
tPLH tPHL
tPLH
tPHL
th
tsu
DataInput
TimingInput
0V
0V
Output
Waveform1
S1at2×V
(seeNoteB)
CC
Output
Waveform2
S1atGND
(seeNoteB)
VOL
VOH
0V
»0V
Output
Control
VCC/2
VCC/2 VCC/2
VCC/2
VCC/2
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
VCC
VCC
VCC
VCC/2
VCC/2
VCC
tPZL tPLZ
tPHZ
tPZH
V – V
OH D
V +V
OL D
0.8V
1.2V 0.1V±
1.5V 0.1V±
1.8V 0.15V±
2.5V 0.2V±
1.8V 0.15V±
2.5V 0.2V±
VCC
2kW
2kW
2kW
2kW
2kW
1kW
500 W
RL
0.1V
0.1V
0.1V
0.15V
0.15V
0.15V
0.15V
VD
CL
15pF
15pF
15pF
15pF
15pF
30pF
30pF
SN74AUC2G07
www.ti.com
............................................................................................................................................................... SCES443D – MAY 2003 – REVISED JUNE 2008
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2003 – 2008, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): SN74AUC2G07
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
SN74AUC2G07DBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 85 (U075, U07F, U07R)
Samples
SN74AUC2G07DBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 U07R Samples
SN74AUC2G07DCKR ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (UV5, UVF, UVR) Samples
SN74AUC2G07DCKRG4 ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (UV5, UVF, UVR) Samples
SN74AUC2G07YZPR ACTIVE DSBGA YZP 6 3000 RoHS & Green SNAGCU Level-1-260C-UNLIM -40 to 85 UVN Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Addendum-Page 1
TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 14-Oct-2022
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«Pt» Reel Dlameter AD Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component tengtn K0 Dimension designed to accommodate the component thickness 7 w OveraH Wiotn ot the carrier tape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE OOODOODD ,,,,,,,,,,, ‘ User Direcllon 0' Feed Sprocket Hoies Pockel Quadrants
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74AUC2G07DBVR SOT-23 DBV 6 3000 178.0 9.2 3.3 3.23 1.55 4.0 8.0 Q3
SN74AUC2G07DBVR SOT-23 DBV 6 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74AUC2G07DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74AUC2G07DBVT SOT-23 DBV 6 250 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
SN74AUC2G07DCKR SC70 DCK 6 3000 180.0 8.4 2.41 2.41 1.2 4.0 8.0 Q3
SN74AUC2G07DCKR SC70 DCK 6 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74AUC2G07YZPR DSBGA YZP 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2020
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74AUC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74AUC2G07DBVR SOT-23 DBV 6 3000 202.0 201.0 28.0
SN74AUC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74AUC2G07DBVT SOT-23 DBV 6 250 202.0 201.0 28.0
SN74AUC2G07DCKR SC70 DCK 6 3000 202.0 201.0 28.0
SN74AUC2G07DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74AUC2G07YZPR DSBGA YZP 6 3000 220.0 220.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2020
Pack Materials-Page 2
MECHANICAL DATA DCK (R-PDSO-GS) PLASTIC SMALL-OUTLINE PACKAGE E 18’) 6 4 7 H Fl H ‘fi «40 1233 \ ’i’ To enugemane Seanng Mane Pm 1/ ' ‘ ' ‘ ‘ maexArea Wm H m} j; / ‘ u / Um "4L 1—]; f Scamg Mane \\ \ / 31 409555574/8 U‘ /200/ , m m hmeters AH \mec' mmens‘mrs Tm drawmq \s sumsc: 0 change wmu: nome Body mmensmns do nut mc‘ude mom flcsh m aroms'm Mom Has» and pruvuswon W m exceed 015 :2r m FuHs an JFDFC M07763 vunuhcn AB NO'FS Umm> INSrRUMEm-s www.1i.com
LAND PATTERN DATA 7PJSOiC6> PLASTC SMALL OU’LME NOTES' maop> Exc'm‘e Boc'd Luyum stem Openings Based or a stencfl hickncss uf 127mm (005mm) * 1* :E /23\\der Musk Cpen‘wg “ 2m Geometry M \meur dimensmns are m m'flhrvete's Th's drawqu is sweat (a chc'vge mm: 'vuhce Custume's shoud p‘uce a new 01 We cvcmt buurd (abr'cahun c'awmg rm :0 uHer the ce'fle' smder musk defined and, ”Jbficuhon \PC77351 is reco'n'nended (Dr uHernme designs Laser cumrg opc'mvcs mm "apczmda wuHs and mo rouncmq corners wm am bcncr aosxc recuscv mstomcrs show can thew Guard assemwy sue for gene design recommencnmons Exomme sxercu deswgw basec on a 50% vo‘umemc bad My paste M‘cr m M4523 var other new rccowmcwdatnrs. ' hams Q‘ INSTRUMENTS www.li.com
3: fig,
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
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EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/C 06/2021
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
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EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
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PACKAGE OUTLINE
C
0.5 MAX
0.19
0.15
1
TYP
0.5 TYP
6X 0.25
0.21
0.5
TYP
B E A
D
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. NanoFreeTM package configuration.
NanoFree Is a trademark of Texas Instruments.
BALL A1
CORNER
SEATING PLANE
BALL TYP 0.05 C
B
A
12
0.015 C A B
SYMM
SYMM
C
SCALE 9.000
D: Max =
E: Max =
1.418 mm, Min =
0.918 mm, Min =
1.357 mm
0.857 mm
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EXAMPLE BOARD LAYOUT
6X ( )0.225 (0.5) TYP
(0.5) TYP
()
METAL
0.225 0.05 MAX
SOLDER MASK
OPENING
METAL
UNDER
MASK
()
SOLDER MASK
OPENING
0.225
0.05 MIN
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.
For more information, see Texas Instruments literature number SBVA017 (www.ti.com/lit/sbva017).
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:40X
12
A
B
C
NON-SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
NOT TO SCALE
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(0.5)
TYP
(0.5) TYP
6X ( 0.25) (R ) TYP0.05
METAL
TYP
4219524/A 06/2014
DSBGA - 0.5 mm max heightYZP0006
DIE SIZE BALL GRID ARRAY
NOTES: (continued)
5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.
SYMM
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
SCALE:40X
12
A
B
C
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