In summary, Cornell Dubilier’s ULP (Ultra-Low-Profile) Capacitors offer the advantages of electrolytic technology in a low-profile package. Its potential applications include products requiring high bulk capacitance for voltage ride-through or holdup. It is not intended as an alternative technology for applications using hybrid tantalums or high-ripple current types. With a thin, sealed package design, a single ULP can eliminate the need for many solid tantalum chip capacitors. When compared with other options for high capacitance applications, they can offer a significant size, cost and weight advantage and improve reliability because one component is needed in place of many.

