Slide 1 Slide 2 Slide 3 Slide 4 Slide 5 Slide 6 Slide 7 Slide 8 Slide 9 Slide 10 Slide 11 Slide 12 Slide 13 Slide 14 Product List
Okami-Slide7

In addition to the features that have already been discussed, there are also some features unique to the OKL Series. For instance, the LGA Interconnect to the board provides lower thermal impedance than pin blocks. With a small form factor of 12.2mm x 12.2mm, this package size improves power density 61% over the OKY-T/3-D12. Operating with 600kHz switching also allows faster transient response, two times more than 300kHz POLs, and offers a potential reduction of output capacitance. Finally, the 3A and 6A models share the same pad layout, thus providing flexibility when selecting models.

PTM Published on: 2011-06-01