THERM-A-GAP™ PAD 80LO Thermally Conductive Gap Filler Pads
Publish Date: 2025-07-02
Parker Chomerics THERM-A-GAP™ PAD 80LO thermally conductive gap filler pads provide a low hardness (35 Shore 00) solution with thermal conductivity of 8.3 W/mK.
THERM-A-GAP GEL 35VT Thermally Conductive Gel
Publish Date: 2024-06-26
Parker Chomerics' THERM-A-GAP GEL 35VT is a one-component silicone, dispensable thermal interface gel material with 3.5 W/m-K typical thermal conductivity.
THERM-A-GAP GEL 50TBL Thermally Conductive Gel
Publish Date: 2024-06-24
Parker Chomerics' THERM-A-GAP GEL 50TBL is a reworkable, high-performance thermal interface material with a typical bulk thermal conductivity of 5.0 W/m-K.
THERM-A-GAP™ GEL 50VT Thermally Conductive Gel
Publish Date: 2024-06-20
Parker Chomerics THERM-A-GAP GEL 50VT is a reworkable, high-performance, dispensable thermal interface gel material with 5.2 W/m-K typical thermal conductivity.
SOFT-SHIELD® 3500 EMI Shielding Gaskets
Publish Date: 2024-05-20
Parker Chomerics’ SOFT-SHIELD® 3500 EMI shielding gaskets feature low closure force for optimum performance in indoor applications.
THERM-A-GAP GEL 60HF
Publish Date: 2024-02-26
Parker Chomerics’ THERM-A-GAP GEL 60HF is a “high flow” gel that is ideal for high volume dispensing applications.
THERM-A-GAP PAD 80 Thermally-Conductive Gap Filler Pads
Publish Date: 2024-02-13
Parker Chomerics' THERM-A-GAP PAD 80 is a 8.3 W/m-K high-performance, thermally-conductive gap filler pad.
THERM-A-GAP GEL 75 Thermally Conductive Gel
Publish Date: 2024-02-06
Parker Chomerics' THERM-A-GAP GEL 75 is designed as a one-component fully cured system with automated dispensing.
THERM-A-GAP™ PAD 70TP Thermally Conductive Gap Filler Pads
Publish Date: 2024-01-31
Parker Chomerics’ THERM‐A‐GAP™ PAD 70TP is a high-performing, thermally conductive gap filler pad, demonstrating a thermal conductivity of 7.0 W/m‐K.
METALASTIC Series EMI Gaskets
Publish Date: 2024-01-19
Parker Chomerics' METALASTIC series EMI gaskets can withstand high compression forces.
CHO-MASK® II EMI Foil Tape
Publish Date: 2019-11-12
Parker Chomerics' CHO-MASK II is an EMI foil tape layered with polyester paint masking, providing a conductive non-corroding surface on electronic enclosures.
THERM-A-GAP™ GEL45 Thermally Conductive Gel
Publish Date: 2019-11-11
Parker Chomerics' THERM-A-GAP™ GEL45 dispensable thermal gel with 4.5 W/m-K thermal conductivity is a one-component fully cured system.
PREMIER™ A240-FRHF Conductive Plastic
Publish Date: 2019-08-23
Parker Chomerics' PREMIER™ A240-FRHF PC/ABS thermoplastic polymer alloys and conductive fillers are engineered for stable performance in diverse applications.
PREMIER™ PBT-225 Hydrolysis-Resistant Conductive Plastic
Publish Date: 2019-08-22
Parker Chomerics' PBT-225 hydrolysis-resistant conductive plastic is a high reliability, single-pellet material ideal for demanding electronics applications.
CHO-SEAL® 1298 Elastomer EMI Gasket
Publish Date: 2018-12-14
Parker Chomerics’ CHO-SEAL 1298 elastomer EMI gasket is available in sheet form and extruded into various profiles for design and manufacturing flexibility.
CHO-SEAL® 6502 Elastomer EMI Gasket
Publish Date: 2018-12-14
Parker Chomerics CHO-SEAL 6502 EMI shielding gasket comes in sheet form and is extruded into various profiles allowing for design and manufacturing flexibility.
THERMFLOW® T777 Phase Change Material
Publish Date: 2018-12-14
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
CHO-TOUCH™ Displays
Publish Date: 2018-12-14
Parker Chomerics' CHO-TOUCH displays are optically bonded touchscreens and LCD units designed to save assembly time and supply chain logistics.
THERM-A-GAP™ 976 Thermally Conductive Gap Filler Pads
Publish Date: 2018-11-29
Parker Chomerics' THERM-A-GAP™ 976 features fiberglass reinforced for improved tear strength and improved rework capabilities.
THERM-A-GAP™ 974 Thermally Conductive Gap Filler Pads
Publish Date: 2018-11-29
Parker Chomerics' THERM-A-GAP™ 974 is supplied with pressure sensitive adhesive for ease of use.

