Amphenol Communications Solutions MezzSelect™

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Stack Height: Choose 1 parameter no preference <5 mm 5-10mm 10-15mm 15-20mm 20-25mm 25-30mm 30-35mm >35mm Contact Pitch: Choose 1 parameter no preference <e;0.5 mm 0.8 mm 1.0 mm 1.27 mm 2.0 mm 2.54 mm Number of Rows: Choose 1 parameter no preference 2 rows 9-12 rows >e;18 rows

Termination Style: Choose 1 parameter no preference TMT SMT PIP BGA Transmission Speed: Choose 1 parameter no preference <0.622Gb/s 0.622-2.5Gb/s 2.5-6.25Gb/s >6.25Gb/s Linear Density: Choose 1 parameter no preference >e;8 lines per cm >e;10 lines per cm >e;16 lines per cm >e;20 lines per cm >e;25 lines per cm >e;40 lines per cm >e;62 lines per cm >e;80 lines per cm

Number of Positions: Choose 1 parameter no preference <10 signal pins 10-30 signal pins 30-50 signal pins 50-70 signal pins 70-100 signal pins 100-200 signal pins >200 signal pins Current Rating: Choose 1 parameter no preference <e;1 amp per single contact 1.5 amp per single contact 2.0 amp per single contact 2.5 amp per single contact 3.0 amp per single contact 3.5 amp per single contact

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BergStak® Series

Versatile, high density parallel board–to–board connector system offers twelve PCB stack heights in nine sizes up to two hundred positions. Stack height flexibility supports evolving designs and emerging mechanical requirements with a common mating interface. Special housing and blade-on-beam terminal features provide easy PCB assembly, worry-free mating and long-term reliability.

Features & Benefits:

• 0.8mm double-row contact pitch conserves printed circuit board space
• Vast range of sizes and stack heights support diverse electronic packaging schemes
• Choice of gold-based and palladium-based platings provide protection in different environments and applications
• Tapered PCB locator pegs increase the ease and accuracy of hand assembly
• Blade-on-beam contacts allow peeling for safer, easier un-mating
• Tape and Reel packaging supports high speed automated assembly
• PCIe®Gen.2 high speed performance on some stack heights
• Fully inter-matable with similar competitive connectors
• Optimized "blade-on-beam" contact mating maximizes connection integrity
  • Early receptacle contact point increases mating wipe and allows early engagement/late disengagement
  • Precision-tapered contacts control mating stress while providing reliable, high normal force
  • Coined contact tips assure smooth, safe wiping action during connector mating
  • Connector polarization, generous lead-in angles and precise contact positioning ensure precise mating alignment and reliability

View all BargStak products

Dubox™ & Bergstik™ Series

The mezzanine system is a pin-in-socket board to board system on a 2.54mm pitch. It is part of Amphenol Communications Solutions fully modular system and includes board receptacles and headers.

Features & Benefits:

• Single and double row covering 2 positions up to 72
• Through hole or surface mount
• Minimum stack height 9.54mm. Use of double body header allows completely variable stack heights up to 26mm
• Part of Amphenol Communications Solutions Basics+ range which features easy product finders, fast samples, standard parts in stock at leading distributors and other benefits.

View all Dubox & Bergstik products

Conan® Series

The Conan 1.0mm mezzanine connector system provides a mechanically secure, high density electrical interface between parallel printed circuit boards.

Conan’s mechanical features and palladium/nickel/gold plated electrical contacts qualify it for high reliability use in portable and mobile electronic equipment.

Features & Benefits:

• “Snap” engagement contacts assure secure mating with an audible “click”
• Blade-on-beam contact design allows "peeling" disengagement and prevents contact stubbing
• Connector housings feature "lead-in" angles to assist in mating
• Surface mounted metal hold-downs reinforce connector retention to the printed circuit board
• Mating polarization prevents backward connections
• PCB polarization prevents errors during printed circuit board assembly
• Pick and place caps with tape and reel packaging support automated assembly processe
• Header height options support a range of PCB stack heights: 4.15mm to 7mm
• 9 part sizes: 9 to 69 contacts
• Lead-free RoHS compatible products satisfy environmental regulations

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GIG-Array® Series

The GIG-ARRAY® connector is designed to meet the needs of up to 10Gb/s applications requiring up to 296 signal pins per connector. Amphenol Communications Solutions long tradition as a BGA connector innovator assures expertise and reliability in the GIG-ARRAY® BGA design. The combination of multiple stack heights (15mm to 40mm) and multiple sizes (200 signals to 296 signals) utilizing a 100-Ohm differential matched impedance design allows for optimal design flexibility while yielding less than 1% cross-talk performance.

Amphenol Communications Solutions has produced BGA mezzanine connectors since 1996, shipping over 10 billion BGA contact interfaces demonstrating Amphenol Communications Solutions extensive experience as the premier BGA interconnect innovator and supplier. Amphenol Communications Solutions patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-ofthe- art manufacturing facility.

Features & Benefits:

• RoHS compliant (Lead-Free) options are available
• Optimized design for utilization in high-density, high-speed mezzanine applications
• Ball Grid Array (BGA) termination for process friendly attachment
• 1mm x 0.65mm BGA interface pitch optimizes routing and electrical performance
• Stack Heights available from 15mm to 40mm provide mezzanine design flexibility
• Connector sizes of 200 and 296 signals providing 62 signal contacts per linear cm (158 signal contacts per linear inch) allow for optimization of board space and signal requirements
• 100 Ohm differential pair matched impedance assures consistent high speed performance
• Up to 10 Gb/s differential pair performance
• Very low cross-talk (VLC) design of less than 1% allows for required signal integrity performance
• Dual beam signal contacts provide two points of contact increasing product reliability
• Polarized design assures proper mating of the connector

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MEG-Array® Series

The MEG-Array® connector is designed to meet the needs of 10Gb/s applications requiring up to 528 signal pins per connector. The combination of multiple stack heights (4mm to 14mm) and multiple sizes (81 signals to 528 signals) allows for optimal design flexibility while yielding less than 1% cross-talk performance when configured differentially.  has produced the MEG-Array® Connector System since 1996, shipping over 10 billion BGA contact interfaces illustrating Amphenol Communications Solutions extended tradition as the premier BGA interconnect innovator and supplier. Amphenol Communications Solutions patented BGA design is supported by fully automated quality control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes. Multiple in-line vision systems, quality control product audits, and statistical process controls are all a part of our state-of-the-art manufacturing facility.

Features & Benefits:

• RoHS Compliant (Lead-Free)
• Ball Grid Array (BGA) termination for process friendly attachment
• .050" x .050" BGA interface pitch optimizes routing and electrical performance
• Stack Heights available from 4mm to 14mm (2mm increments)
• Connector sizes of 81 signals to 528 signals providing 80 usable signals per linear cm (205 signals per linear inch) allow for optimization of board space and signal requirements
• 10 Gb/s differential pair performance at less than 1% cross-talk meets the needs of high speed mezzanine applications
• Meets Telcordia GR-1217-CORE and NPS-25298-2 specifications for utilization in telecom applications
• Demonstrated solder joint reliability of greater than 22 years life (per IPC-SM-785) is unmatched for a BGA mezzanine connector
• Polarized design assures proper mating of the connector
• Back to Back testing connector (Interposer) available upon special request

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Minitek™ Series

The Minitek mezzanine system is a pin-in-socket board to board system on a 2.00mm pitch. It is part of Amphenol Communications Solutions fully modular system and includes board receptacles and headers.

Features & Benefits:

• Double row system coves 4 positions up to 100
• Through hole or surface mount
• Minimum stack height 3.8mm. Use of double body header allows completely variable stack heights up to 18mm
• Part of Amphenol Communications Solutions Basics+ range which features easy product finders, fast samples, standard parts in stock at leading distributors and other benefits.

View all Minitek products

RibCage™ Series

Rib-Cage™ connectors provide optimal precision and reliability at a competitive commercial cost. They meet high performance standards for use in applications with shock and vibration.

The versatile Rib-Cage™ system includes dual-row, pin-and-socket connectors for right-angle and mezzanine connections between printed circuit boards (PCB) or flexible printed circuits (FPC).

Features & Benefits:

• Exclusive Rib-Cage™ multi-point, gold plated receptacle contacts provide optimal reliability in high vibration and shock-prone applications
• High density 1.27mm (.050 in.) x 1.27mm (.050 in.) double row contact grid occupies only 20% of the volume of comparable .100 in. pitch systems
• Multiple stack height options offer flexibility for mezzanine connection designs
• Polarization prevents mis-mating
• Multiple PCB positioning and PCB attachment options suit customer assembly requirements
• Available sizes: 10 through 100 total positions
• Lead-free RoHS compatible plating satisfies environmental regulations

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