MEG-Array® Connectors

Amphenol Communications Solutions MEG-Array connector is designed to meet the needs of applications requiring up to 528 signal pins per contact and up to 28 Gb/s. The combination of multiple stack heights (4 mm to 14 mm) and multiple sizes allow for optimal design flexibility while yielding less than 1% cross-talk performance when configured differentially. Amphenol Communications Solutions has shipped more than 20 billion BGA contact interfaces, illustrating Amphenol Communications Solutions extended tradition as the premier BGA innovator and supplier. Amphenol Communications Solutions patented BGA design is supported by fully automated quality-control systems featuring 100% inspections of assembly coplanarity, solder sphere size and location, as well as critical-to-function terminal component attributes.

Features

• RoHS compliant (lead free)
• Ball-grid array (BGA) termination for process-friendly attachment
• 1.27 mm x 1.27 mm, BGA interface pitch optimizes routing and electrical performance
• Demonstrated solder-joint reliability of greater than 22 years life (per IPC-SM-785) is unmatched for a BGA mezzanine connector
• Connector sizes of 81 signals to 528 signals providing 80 usable signals per linear cm (71 per cm²) allow for optimization of board space and signal requirements
• Stack heights available from 4 mm to 14 mm (2 mm increments)
• Up to 28 Gb/s differential pair performance at less than 1% cross-talk meets the needs of high-speed mezzanine applications
• Meets Telcordia GR-1217-CORE and NPS-25298-2 specifications for utilization in telecom applications
• Polarized design assures proper mating of the connector
• Online s-parameter files and signal-integrity performance reports improve design accuracy and time–to–market