SMD to DIP MiniSOIC EP 10 0.020" (0.50mm) FR4 Epoxy Glass
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SMD to DIP MiniSOIC EP 10 0.020" (0.50mm) FR4 Epoxy Glass

PA0171

DigiKey Part Number
PA0171-ND
Manufacturer
Manufacturer Product Number
PA0171
Description
MINI SOIC-10 EXP PAD TO DIP-10 S
Manufacturer Standard Lead Time
2 Weeks
Customer Reference
Detailed Description
SMD to DIP MiniSOIC EP 10 0.020" (0.50mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
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Category
Package Accepted
MiniSOIC EP
Manufacturer
Chip Quik Inc.
Number of Positions
10
Series
Pitch
0.020" (0.50mm)
Packaging
Bulk
Board Thickness
0.062" (1.57mm) 1/16"
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
0.700" x 0.500" (17.78mm x 12.70mm)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
Available To Order
Check Lead Time
This product is not kept in stock at DigiKey. The lead time shown will apply to the manufacturer’s shipment to DigiKey. Upon receiving the product, DigiKey will ship to fill open orders.
All prices are in EUR
Bulk
QuantityUnit PriceExt Price
1€3.56000€3.56
Manufacturers Standard Package
Unit Price without VAT:€3.56000
Unit Price with VAT:€4.27200