SSM/TSM Series Board-Stacking Solutions

Samtec's large variety of board-stacking interconnects and design flexibility to solve most design challenges make it easy to find the right board-to-board interconnect system.

Samtec’s flexibility is exemplified by post height options adjustable in 0.005” (0.13 mm) increments, body positions adjustable in 0.005” (0.13 mm) increments, board stacking distances from 0.065" (1.65 mm) to 1.910" (48.51 mm), and two to 300 total pins in one to six rows. Orientations/applications available are standard, low-profile, elevated, pass-through, right-angle, coplanar, bottom entry, and self-nesting. The variety of contact offerings include high-reliability/high-mating cycles, ultra-low profile, high retention, and cost-effective options.