Super Low-Profile Sockets

Mill-Max's super low-profile sockets are its lowest profile strip sockets to date. With an above-board height of just 0.083” (2.11 mm) these sockets provide a reliable and convenient way to connect boards or devices.

Many of today’s products, such as implantable and wearable devices for the medical industry, demand miniaturization along with high functionality and reliability. These requirements drive designers to find durable solutions to package more electronics into smaller spaces; these sockets can satisfy these needs. The 315-43-1XX-41-004000 (single row) and 415-43-2XX-41-004000 (double row) sockets have 0.100” (2.54 mm) pin spacing with a low profile of 0.083” (2.11 mm). They are designed for through-hole mounting in boards up to 0.062” (1.57 mm) thick, providing a secure connection to the PCB. These sockets are ideal for board stacking and wire to board applications where minimizing package height is paramount.

When mated with Mill-Max low-profile headers, 335-10-1XX-00-160000 (single row) and 435-10-2XX-00-160000 (double row), the total height between the boards is only 0.155” (3.94 mm). For wire-to-board connections the Mill-Max 380-10-1XX-00-002000 (single row) and 480-10-2XX-00-002000 (double row) solder cup headers combine with the super low-profile sockets to achieve a total height of 0.268” (6.81 mm). Each receptacle is precision turned from brass-alloy; has a highly reliable four finger, beryllium copper contact; accepts leads ranging from 0.015” to 0.022” (0.38 mm to 0.56 mm); and is designed to withstand the rigors of rugged applications associated with portability. The insulator material is high-temperature PCT, compatible with most soldering processes. Single row connectors are available in 1 position to 32 positions, double row connectors in 4 positions to 72 positions. Standard plating options include tin or gold for the outer shell and gold for the internal contact, providing optimal interconnect reliability.