NC7NZ14 Datasheet by onsemi

© Semiconductor Components Industries, LLC, 2001
January, 2021 Rev. 3
1Publication Order Number:
NC7NZ14/D
TinyLogic UHS Triple
Inverter with Schmitt
Trigger Input
NC7NZ14
Description
The NC7NZ14 is a triple inverter with Schmitt trigger input from
ON Semicoductors UltraHigh Speed (UHS) series of TinyLogic.
The device is fabricated with advanced CMOS technology to achieve
ultrahigh speed with high output drive while maintaining low static
power dissipation over a very broad VCC operating range. The device
is specified to operate over the 1.65 V to 5.5 V VCC range. The inputs
and outputs are highimpedance when VCC is 0 V. Inputs tolerate
voltages up to 5.5 V independent of VCC operating voltage.
Features
Ultra HighSpeed: tPD = 3.7 ns (Typical) into 50 pF at 5 V VCC
High Output Drive: ±24 mA at 3 V VCC
Broad VCC Operating Range: 1.65 V to 5.5 V
Power Down High Impedance Inputs / Outputs
OverVoltage Tolerance Inputs Facilitate 5 V to 3 V Translation
Proprietary Noise / EMI Reduction Circuitry
UltraSmall MicroPak Packages
SpaceSaving US8 Surface Mount Package
These Devices are PbFree, Halogen Free/BFR Free and are RoHS
Compliant
Figure 1. Logic Symbol
2A 2Y
1Y1A (1)
IEEC / IEC
3A 3Y
(7)
(3) (5)
(6) (2)
1A
VCC
123
876
4
5
3Y
1Y
2A
3A
GND
2Y
Figure 2. Connection Diagram (Top View)
See detailed ordering, marking and shipping information in the
package dimensions section on page 6 of this data sheet.
ORDERING INFORMATION
MARKING
DIAGRAMS
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P6, NZ14 = Specific Device Code
KK = 2Digit Lot Run Traceability Code
XY = 2Digit Date Code Format
Z = Assembly Plant Code
A = Assembly Site
L = Wafer Lot Number
YW = Assembly Start Week
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CASE 523AY
US8
CASE 846AN
P6KK
XYZ
NZ14
ALYW
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NC7NZ14
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2
Pin Configurations
NOTES:
1. AAA represents product code top mark (see ordering table).
2. Orientation of top mark determines pin one location. Reading the top
product code mark left to right, pin one is the lower left pin.
Figure 3. US8
Pin One
AAA
Figure 4. MicroPak (Top Through View)
1
1Y
2
3A
3
2Y
1A
7
3Y
6
2A
5
VCC 8 4 GND
PIN DEFINITIONS
Pin # US8 Pin # MicroPak Name Description
1 7 1A Input
2 6 3Y Output
3 5 2A Input
4 4 GND Ground
5 3 2Y Output
6 2 3A Input
7 1 1Y Output
8 8 VCC Supply Voltage
FUNCTION TABLE
Input Output
A Y
L H
H L
H = HIGH Logic Level
L = LOW Logic Level
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ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Min Max Unit
VCC Supply Voltage 0.5 6.5 V
VIN DC Input Voltage 0.5 6.5 V
VOUT DC Output Voltage 0.5 6.5 V
IIK DC Input Diode Current VIN < 0 V − −50 mA
IOK DC Output Diode Current VOUT < 0 V − −50 mA
IOUT DC Output Current ±50 mA
ICC / IGND DC VCC or Ground Current ±50 mA
TSTG Storage Temperature Range 65 +150 °C
TJJunction Temperature Under Bias +150 °C
TLJunction Lead Temperature (Soldering, 10 Seconds) +260 °C
PDPower Dissipation in Still Air US8 500 mW
MicroPak8539
ESD Human Body Model, JEDEC: JESD22A114 4000 V
Charge Device Model, JEDEC: JESD22C101 2000
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Conditions Min Max Unit
VCC Supply Voltage Operating 1.65 5.5 V
Supply Voltage Data Retention 1.5 5.5
VIN Input Voltage 0 5.5 V
VOUT Output Voltage 0 VCC V
TAOperating Temperature 40 +85 °C
qJA Thermal Resistance US8 250 °C/W
MicroPak8232
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. Unused inputs must be held HIGH or LOW. They may not float.
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DC ELECTICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°CTA = 40 to +85°C
Unit
Min Typ Max Min Max
VP Positive Threshold Voltage 1.65 1.10 1.50 1.50 V
2.30 1.40 1.80 1.80
3.00 1.75 2.20 2.20
4.50 2.45 3.10 3.10
5.50 2.90 3.60 3.60
VN Negative Threshold Voltage 1.65 0.25 0.55 0.25 V
2.30 0.40 0.75 0.40
3.00 0.60 1.00 0.60
4.50 1.00 1.43 1.00
5.50 1.20 1.70 1.20
VH Hysteresis Voltage 1.65 0.15 0.54 1.00 0.15 1.00 V
2.30 0.25 0.65 1.10 0.25 1.10
3.00 0.40 0.77 1.20 0.40 1.20
4.50 0.60 1.01 1.50 0.60 1.50
5.50 0.70 1.18 1.70 0.70 1.70
VOH HIGH Level Output Voltage 1.65 VIN = VP or VN,
IOH = 100 mA
1.55 1.65 1.55 V
2.30 2.20 2.30 2.20
3.00 2.90 3.00 2.90
4.50 4.40 4.50 4.4
1.65 IOH = 4 mA 1.29 1.52 1.29
2.30 IOH = 8 mA 1.90 2.15 1.90
3.00 IOH = 16 mA 2.40 2.80 2.40
3.00 IOH = 24 mA 2.30 2.68 2.30
4.50 IOH = 32 mA 3.80 4.20 3.80
VOL LOW Level Output Voltage 1.65 VIN = VP or VN,
IOL = 100 mA
0.00 0.10 0.10 V
2.30 0.00 0.10 0.10
3.00 0.00 0.10 0.10
4.50 0.00 0.10 0.10
1.65 IOL = 4 mA 0.08 0.24 0.24
2.30 IOL = 8 mA 0.10 0.30 0.30
3.00 IOL = 16 mA 0.15 0.40 0.40
3.00 IOL = 24 mA 0.22 0.55 0.55
4.50 IOL = 32 mA 0.22 0.55 0.55
IIN Input Leakage Current 1.65 to 5.5 VIN = 5.5 V, GND ±0.1 ±1.0 mA
IOFF Power Off Leakage Current 0 VIN or VOUT = 5.5 V − − 110 mA
ICC Quiescent Supply Current 1.65 to 5.50 VIN = 5.5 V, GND 1.0 10 mA
NC7NZ14
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AC ELECTRICAL CHARACTERISTICS
Symbol Parameter VCC (V) Conditions
TA = +25°C TA = 40 to +85°C
Unit
Min Typ Max Min Max
tPLH, tPHL Propagation Delay
(Figure 5, 6)
1.80 ±0.15 CL = 15 pF,
RL = 1 MW,
7.6 12.5 13.0 ns
2.50 ±0.20 5.0 9.0 9.5
3.30 ±0.30 3.7 6.3 6.5
5.00 ±0.50 3.1 5.2 5.5
3.30 ±0.30 CL = 50 pF,
RL = 500 W,
4.4 7.2 7.5
5.00 ±0.50 3.7 5.9 6.2
CIN Input Capacitance 0.00 2.5 pF
CPD Power Dissipation Capacitance
(Note 4) (Figure 7)
3.30 9 pF
5.00 11 − −
4. CPD is defined as the value of the internal equivalent capacitance which is derived from dynamic operating current consumption (ICCD) at
no output loading and operating at 50% duty cycle. CPD is related to ICCD dynamic operating current by the expression:
ICCD = (CPD) (VCC) (fIN) + (ICCstatic).
NOTE:
5. CL includes load and stray capacitance;
Input PRR = 1.0 MHz, tW = 500 ns.
Figure 5. AC Test Circuit Figure 6. AC Waveforms
NOTE:
6. Input = AC Waveform; tr = tf = 1.8 ns; PRR = 10 MHz;
Duty Cycle = 50%.
A
INPUT
VCC
Figure 7. ICCD Test Circuit
VCC
CLRL
INPUT OUTPUT
tr = 3 ns
50%
50%
90%
10%
90%
10%
INPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
50%
50%
tPLH tPHL
TW
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ORDERING INFORMATION
Part Number
Operating
Temperature Top Mark Package Shipping
NC7NZ14K8X 40 to +85°CNZ14 8Lead US8, JEDEC MO187, Variation CA
3.1 mm Wide
3000 / Tape & Reel
NC7NZ14L8X P6 8Lead MicroPak, 1.6 mm Wide 5000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
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CASE 523AY
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DATE 31 AUG 2016
C
SEATING
PLANE
0.05 C
SIDE VIEW
0.05 C
AB
2X
1.60
1.60
0.05 C
TOP VIEW
PIN#1 IDENT
NOTES:
A. PACKAGE CONFORMS TO JEDEC MO255
VARIATION UAAD.
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 2009.
D. LAND PATTERN RECOMMENDATION IS
EXISTING INDUSTRY LAND PATTERN.
0.025±0.025
4
123
567
80.30±0.05
(0.15)
(0.20)
0.30±0.05
0.05 C
0.50±0.05
BOTTOM VIEW
1.60±0.05
1.60±0.05
0.50
0.20±0.05 (8X)
1.00±0.05
0.30±0.05 (7X)
0.10 C A B
0.05 C
(0.20)3X
(0.09)
DETAIL A
DETAIL A
SCALE : 2X
(0.10)
RECOMMENDED
LAND PATTERN
1.60
0.45
(2X)
0.40
(6X)
1.61
0.25
(8X)
0.50
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
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the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
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DOCUMENT NUMBER:
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Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
UQFN8 1.6X1.6, 0.5P
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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DATE 31 DEC 2016
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically
disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the
rights of others.
98AON13778G
DOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
PAGE 1 OF 1
US8
© Semiconductor Components Industries, LLC, 2019 www.onsemi.com
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