BX310x Specification Datasheet

Datasheet Feedback/Errors

mMUﬂNHH“ , ”WM ,, = III-3| v SIERRA = III-1" 'W'W‘RELESS' EIIII‘ . : IIII“ BX Serles - \ nusnnm‘, -’-Yﬁx EERRA WIRELESS"

AirPrime BX310x Wi-Fi/BT

Module

Product Technical Specification

41111444

Rev 2

Product Technical Specification

Rev 2 Oct.17 2 41111444

Important

Notice Due to the nature of wireless communications, transmission and reception of data can

never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally

lost. Although significant delays or losses of data are rare when wireless devices such

as the Sierra Wireless modem are used in a normal manner with a well-constructed

network, the Sierra Wireless modem should not be used in situations where failure to

transmit or receive data could result in damage of any kind to the user or any other

party, including but not limited to personal injury, death, or loss of property. Sierra

Wireless accepts no responsibility for damages of any kind resulting from delays or

errors in data transmitted or received using the Sierra Wireless modem, or for failure

of the Sierra Wireless modem to transmit or receive such data.

Safety and

Hazards Do not operate the Sierra Wireless modem in areas where blasting is in progress,

where explosive atmospheres may be present, near medical equipment, near life

support equipment, or any equipment which may be susceptible to any form of radio

interference. In such areas, the Sierra Wireless modem MUST BE IN AIRPLANE

MODE OR POWERED OFF. The Sierra Wireless modem can transmit signals that

could interfere with this equipment.

Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is on

the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE IN

AIRPLANE MODE OR POWERED OFF. When operating, the Sierra Wireless modem

can transmit signals that could interfere with various onboard systems.

Note: Some airlines may permit the use of cellular phones while the aircraft is on the ground

and the door is open. Sierra Wireless modems may be used at this time.

The driver or operator of any vehicle should not operate the Sierra Wireless modem

while in control of a vehicle. Doing so will detract from the driver or operator's control

and operation of that vehicle. In some states and provinces, operating such

communications devices while in control of a vehicle is an offence.

Limitation of

Liability The information in this manual is subject to change without notice and does not

represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND ITS

AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL DIRECT,

INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL, PUNITIVE OR

EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO, LOSS OF PROFITS

OR REVENUE OR ANTICIPATED PROFITS OR REVENUE ARISING OUT OF THE

USE OR INABILITY TO USE ANY SIERRA WIRELESS PRODUCT, EVEN IF

SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN ADVISED OF THE

POSSIBILITY OF SUCH DAMAGES OR THEY ARE FORESEEABLE OR FOR

CLAIMS BY ANY THIRD PARTY.

Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its affiliates

aggregate liability arising under or in connection with the Sierra Wireless product,

regardless of the number of events, occurrences, or claims giving rise to liability, be in

excess of the price paid by the purchaser for the Sierra Wireless product.

Preface

Rev 2 Oct.17 3 41111444

Patents This product may contain technology developed by or for Sierra Wireless Inc. This

product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or

more patents licensed from MMP Portfolio Licensing.

Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo are

registered trademarks of Sierra Wireless, Inc.

Windows® and Windows Vista® are registered trademarks of Microsoft Corporation.

Other trademarks are the property of their respective owners.

Contact

Information

Revision

History

Sales information and technical

support, including warranty and returns Web: sierrawireless.com/company/contact-us/

Global toll-free number: 1-877-687-7795

6:00 am to 5:00 pm PST

Corporate and product information Web: sierrawireless.com

Revision

number Release date Changes

1August 2017 Creation (limited release)

2October 2017 General release

—>>I

Rev 2 Oct.17 4 41111444

Contents

1: Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

1.1 Module Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

1.2 General RF/Software Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

1.2.1 Wi-Fi . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

1.2.2 Bluetooth . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

1.2.3 Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

1.2.4 Configuration Utility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

1.3 General Hardware Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

1.3.1 Physical Dimensions and Connection Interface . . . . . . . . . . . . . . . . . . . . . . . .9

2: Functional Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

2.1 Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

2.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12

3: Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.1 Environmental . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2 Power Supply Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15

3.2.1 Power Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.2.2 Current Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16

3.3 RF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.3.1 Generic Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.3.2 Wi-Fi Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

3.3.3 Bluetooth Radio . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

3.4 Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

3.4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

3.5 Mechanical . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

3.6 Mechanical Drawings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20

3.7 Antenna . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22

4: Interfaces Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

4.1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

4.2 UART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23

Contents

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4.3 ADC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24

4.4 Voltage Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.5 I2C Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

4.5.1 Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4.6 I2S Interface (Digital Audio) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

4.7 General Purpose Input/Output (GPIO) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

4.8 SPI Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

4.9 Secure Digital IO (SDIO) Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

4.10 Module Enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

4.11 Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .29

4.12 PWM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

5: Regulatory Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

United States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Canada . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31

Bluetooth Qualification Program (BQP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

6: Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32

6.1 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

6.2 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

7: Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .37

—>>I

Rev 2 Oct.17 6 41111444

List of Figures

Figure 2-1: AirPrime BX310x Application Schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Figure 2-2: Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Figure 3-1: AirPrime BX3100 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21

Figure 3-2: AirPrime BX3105 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Figure 4-1: Example of I2C Bus Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Figure 6-1: Pin Configuration (Bottom View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

—>>I

Rev 2 Oct.17 741111444

List of Tables

Table 1-1: Supported RF Frequencies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Table 1-2: AirPrime BX310x Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Table 1-3: LGA Pad Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Table 2-1: AirPrime BX310x Capabilities. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Table 3-1: Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 3-2: Power Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Table 3-3: Power Modes—Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 3-4: Power Modes—Typical Current Consumption. . . . . . . . . . . . . . . . . . . . . . . . . 16

Table 3-5: RF Current Consumption Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Table 3-6: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 3-7: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

Table 3-8: Generic Radio Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19

Table 3-9: Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 3-10: Recommended Operating Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

Table 4-1: UART0 Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

Table 4-2: ADC Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 4-3: Voltage-measurement GPIO Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

Table 4-4: I2C Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Table 4-5: I2S Interface Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 4-6: GPIO Pins (Dedicated) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Table 4-8: SPI Pin Descriptions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 4-7: GPIO Pins (Alternate function) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

Table 4-9: SDIO Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 4-10: Enable Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

Table 6-1: Pin Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

Table 7-1: Acronyms and Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Rev 2 Oct.17 8 41111444

1: Introduction

This document defines and illustrates the AirPrime BX310x (BX3100, BX3105) Wi-Fi/

BT Host-less module’s high-level product features, interfaces, and hardware features

(including electrical and mechanical performance criteria).

1.1 Module Variants

AirPrime BX310x module variants include:

•AirPrime BX3100—External antenna connection

•AirPrime BX3105—Embedded antenna

1.2 General RF/Software Features

The AirPrime BX310x is a low-power, small form-factor self-contained Wi-Fi/

Bluetooth (Wi-Fi/BT) module.

With an embedded software suite, the BX310x is an ideal solution for developers who

want to quickly and cost-effectively integrate Wi-Fi/BT functionality into their products.

The following table summarizes the module’s supported wireless frequencies:

1.2.1 Wi-Fi

The AirPrime BX310x supports 2.4 GHz Wi-Fi operation. Key features include:

•TCP/IP

•802.11 b/g/n/e/i

•Connection methods—BSS STA, SoftAP, Wi-Fi Direct (Wi-Fi P2P)

•Transmit power—Adjustable, up to 21 dBm (maximum)

For a list of additional supported Wi-Fi functionality, protocols, and features, see

Features on page 12.

1.2.2 Bluetooth

The AirPrime BX310x supports 2.4 GHz Bluetooth classic and BLE operation. Key

features include:

•Bluetooth v4.2 BR/EDR and BLE compliant

•SPP (Serial Port Profile)

For a list of additional supported Bluetooth functionality, protocols, and features, see

Features on page 12.

Table 1-1: Supported RF Frequencies

Technology RF band Notes

Wi-Fi •2.4GHz (2.400–2.485 GHz)

•802.11b/g/n/e/i

•Max data rate—MCS7 HT40 150 Mbps

Bluetooth •v4.2 BR/EDR and BLE compliant

Introduction

Rev 2 Oct.17 9 41111444

1.2.3 Interfaces

The AirPrime BX310x provides the following interfaces and peripheral connectivity:

•Power supply—See Power Supply Ratings on page 15.

•RF—See RF on page 18.

•UART serial link—See UART on page 23.

•ADC—See ADC on page 24.

•Voltage measurement—See Voltage Measurement on page 24.

•I2C—See I2C Interface on page 24.

•Digital audio (I2S)—See I2S Interface (Digital Audio) on page 26.

•GPIOs—See General Purpose Input/Output (GPIO) on page 26.

•SPI bus—See SPI Bus on page 27.

•SDIO—See Secure Digital IO (SDIO) Interface on page 28.

•Module enable—See Module Enable on page 28.

•System clock outputs—See Clock on page 29.

•PWM—See PWM on page 29.

1.2.4 Configuration Utility

The AirPrime BX310x includes a browser-based utility for device configuration. For

usage details, refer to the AirPrime BX Series Development Kit User Guide available

at source.sierrawireless.com (forthcoming).

1.3 General Hardware Features

1.3.1 Physical Dimensions and Connection

Interface

AirPrime BX310x modules are compact, robust, fully shielded and labeled modules

with the dimensions noted in Table 1-2.

The AirPrime BX310x module is an LGA form factor device. All electrical and

mechanical connections are made through the 70 Land Grid Array (LGA) pads on the

bottom side of the PCB. (See Figure 6-1 on page 33 for details.)

Table 1-2: AirPrime BX310x Dimensionsa

a. Dimensions are accurate as of the release date of this document.

Parameter

Nominal

Tolerance UnitsBX3100b

b. BX3100 is a CF3 xSmall module, which belongs to the Common Flexible Form Factor (CF3)

family of WWAN modules

BX3105

Length 11.5 13.5 ±0.10 mm

Width 9.5 11.5 ±0.10 mm

Thickness 2.4 2.4 ±0.20 mm

Weight TBD TBD TBD g

Product Technical Specification

Rev 2 Oct.17 10 41111444

The LGA pads have the following distribution:

Table 1-3: LGA Pad Types

Pad Type/Quantity Dimensions Pitch

Signal Pads 54 outer pads 0.75x0.35 mm 0.65 mm

Ground Pads 16 inner pads 1.0x1.0 mm 1.83 mm/1.48 mm

, A A r’H 1J7 x A m $88 H“ ‘ HHHHHHHLH

Rev 2 Oct.17 11 41111444

2: Functional Specifications

2.1 Architecture

The following figure presents an overview of the AirPrime BX310x module’s internal

architecture and external interfaces.

Figure 2-1: AirPrime BX310x Application Schematic

UART0_CTS_GPIO(19)

UART0_TXD

UART0_RTS_GPIO(22)

UART0_RXD

SD_CMD_GPIO(15)_HSPICS0

SD_DATA2_GPIO(12)_HSPIQ

SD_CLK_GPIO(14)_HSPICLK

SD_DATA3_GPIO(13)_HSPID

SD_DATA1_GPIO(4)_HSPIHD

SD_DATA0_GPIO(2)_HSPIWP

GPIO(23)_I2C1_SCL

GPIO(25)_I2C1_SDA

GPIO(16)_I2C2_SDA

GPIO(17)_I2C2_SCL

VDD_PADS3V3 3V3

GPIO(5)

GPIO(36)_SENSOR_VP

GPIO(37)_SENSOR_CAPP

GPIO(38)_SENSOR_CAPN

GPIO(39)_SENSOR_VN

GPIO(34)_VDET_1

GPIO(35)_VDET_2

I2S_LRCLK_GPIO(18)

I2S_MCLK_GPIO(0)

I2S_DI_GPIO(32)

I2S_DO_GPIO(33)

I2S_BCLK_GPIO(26)

VGPIO

2k2

VDD_PADS

2k2

UART Interface

SDIO Interface

Primary I2C Interface

Secondary I2C Interface / Spare GPIOs

Voltage/Current Measurement Interface

I2S Audio Interface

GPIO(23)_I2C1_SCL

GPIO(25)_I2C1_SDA

I2C Pull Resistors

OUT 2

GND

3GND 4

2.45GHz

BX3100 requires external filtering to provide harmonic rejection

and in situations where co-locating with LTE or cellular radios

BX3105 uses an internal PIFA Antenna leave Pin 40 unconnected

Voltage Domains

VDD_3V3_RF (2.3V to 3.6V) Analogue Supply

VDD_3V3_PA (2.3V to 3.6V) Power Amplifier Supply

VDD_PADS_BB (1.8V to 3.3V) Digital IO Supply

VGPIO(3.3V) Internal Interface Reference Voltage Output

Note VGPIO provides voltage reference for the internal SPI FLASH Interface & GPIOs 16 & 17

ENABLE

2k2

VGPIO

2k2

I2C Pull Resistors

GPIO(16)_I2C2_SDA

GPIO(17)_I2C2_SCL

(If Used)

EN 37

GND

GPIO(27) 3

3

BX310x Dual Mode Wi-Fi & BT Module(s)

GPIO(36)_SENSOR_VP 31

SD_CMD_GPIO(15)_HSPICS0 42

UART0_RTS_GPIO(22) 2

UART0_CTS_GPIO(19) 3

UART0_TXD 4

UART0_RXD 5

GPIO(23)_I2C1_SCL 9

GPIO(5) 14

23 NC

I2S_DO_GPIO(32) 24

I2S_MCLK_GPIO(0) 16

GPIO(35)_VDET_2 19

SD_DATA2_GPIO(12)_HSPIQ 43

I2S_LRCLK_GPIO(18) 26

I2S_BCLK_GPIO(26) 27

GND

SD_DATA3_GPIO(13)_HSPIID 45

SD_CLK_GPIO(14)_HSPICLK 44

SD_DATA0_GPIO(2)_HSPIWP 46

11 NC

GPIO(34)_VDET_1 18

GPIO(25)_I2C1_SDA 17

GND

GPIO(37)_SENSOR_CAPP 32

GND

VGPIO 33

GPIO(39)_SENSOR_VN 36

RF_MAIN (BX3100)

(BX3100 LGA70 9.5mm x 11.5mm)

I2S_DI_GPIO(33) 25

GPIO(38) SENSOR_CAPN 34

SD_DATA1_GPIO(4)_HSPIHD 47

VDD_3V3_RF 50

VDD_3V3_PA 51

VDD_PADS_BB 52

GPIO(16)_I2C2_SDA 53

GPIO(17)_I2C2_SCL 54

GND

(BX3105 LGA70 13.5mm x 11.5mm)

NC (BX3105)

40 {

VDD_PADS_BB

{

VGPIO

VDD_PADS_BB {

{

VDD_PADS_BB

{

VDD_PADS_BB

{

VDD_PADS_BB

VDD_PADS_BB {

{

BX310x Module Schematic Symbol

GPIO(27) Spare GPIO

Product Technical Specification

Rev 2 Oct.17 12 41111444

Figure 2-2: Block diagram

2.2 Features

Table 2-1 summarizes the AirPrime BX310x module’s RF (Wi-Fi and Bluetooth),

Power, software, and hardware capabilities.

Note: Table contents are preliminary and subject to change.

SPI

UART

SDIO

I2S

I2C

ADC

GPIO

PWM

Bluetooth Link

Controller

Wi-Fi MAC

Bluetooth

Baseband

Wi-Fi Baseband

RF Transceiver

Reference

Clock

Generator

RF Front End

2x Xtensa® 32-bit LX6

Microprocessors

ROM

SRAM

Cryptographic hardware acceleration

SHA AESRSA RNG

32Mb Flash

40MHz XTAL

PMU ULP Co-

Processor

Recovery

Memory

Analog Wi-Fi Bluetooth RTC Domain Core & Memory Security I/O

Table 2-1: AirPrime BX310x Capabilities

Feature Description

Module

•Secure boot

•Secure update

•FOTA (Firmware update Over The Air)

•Sierra Wireless AirVantage support

•CF3-compliant footprint (BX3100)

Functional Specifications

Rev 2 Oct.17 13 41111444

Wi-Fi

•Protocols:

·802.11 b/g/n/e/i

·802.11 n (2.4 GHz), up to 150 Mbps; MCS0-7 in 20/40 MHz bandwidths

·Receiving STBC (Space-time Block Code) 2x1

·802.11 e: QoS for wireless multimedia technology

·Additional 802.11i security features (pre-authentication, TSN, etc.)

·WMM-PS, UAPSD

·A-MPDU, A-MSDU aggregation

·Block ACK (RTS/CTS/ACK/BA)

·Fragmentation/defragmentation

·CCMP (CBC-MAC, counter model), TKIP (MIC, RC4), WAPI (SMS4), WEP

(RC4), CRC

·Frame encapsulation (802.11h/RFC 1042)

·Pre-authentication, TSN

•Supported channels—1–14

•Autoconnection—After device reset, automatically connects to available AP

based on previous configuration

•Infrastructure BSS Station mode/SoftAP mode: AP mode, STA mode,

concurrent AP/STA mode

•Up to 8 simultaneous Wi-Fi clients

•IP configuration—IP address in STA mode via DHCP or static assignment

•Authentication (security) modes: WPA, WPA2, WPA/WPA2, WPA2 Enterprise

•UMA-compliant and certified

•Open interface for various upper layer authentication schemes over EAP (e.g.

TLS, PEAP, LEAP, SIM, AKA, customer-specific)

•Adaptive rate fallback algorithm

•Automatic retransmission/response on slow hosts

Table 2-1: AirPrime BX310x Capabilities (Continued)

Feature Description

Product Technical Specification

Rev 2 Oct.17 14 41111444

Bluetooth

•Bluetooth v4.2 BR/EDR and BLE compliant

•Supported channels: BT Classic—0–78; BLE—0–39

•Supported v4.2 modes: BR (Basic Rate); EDR (Enhanced Data Rate); LE (Low

Energy)

•BT classic mandatory features

•BT low-energy mandatory features

•Class 1/Class 2/Class 3 transmitter without external power amplifier

•Class 1 operation without external PA

•Enhanced power control (>30 dB dynamic control range)

•+10 dBm transmitting power

•NZIF receiver with -98 dBm sensitivity

•Modulation—p/4 DQPSK, 8 DPSK

•ACL, SCO, eSCO, AFH

•Adaptive Frequency Hopping (AFH)

•BT 4.2 controller and host stack

•Service Discover Protocol (SDP)

•General Access Profile (GAP)

•Security Manage Protocol (SMP)

•Bluetooth Low Energy (BLE)

•ATT/GATT

•BLE Beacon

•SPP, RFCOMM

•Profiles: SPPAutoconnection—After device reset, automatically connects to

available AP based on previous configuration.

•UART features: GATT profiles, Data transfer (HTTP, HTTPS, MQTT, TCP/

UDP), Define personal services

•Roles—Simultaneous Central (access point)/Peripheral (client)

•Simultaneous connections:

·Up to 7 (total) simultaneous connections, including up to 3 BLE connections

·Simultaneous BT Classic and BLE connections

•PCM/I2S

Configuration

Device configuration methods:

•Built-in web-based configuration utility. See Configuration Utility on page 9.

•AT commands available over UART, Wi-Fi, and BT links. Refer to AirPrime

BX310x AT Command Reference at source.sierrawireless.com.

Security

•All standard IEEE802.11 security features, including WFA, WPA/WPA2, WAPI

•Secure boot

•Flash encryption

•Cryptographic hardware acceleration: AES, HASH (SHA-2) library, RSA, ECC,

Random Number Generator (RNG)

Power management Multiple power modes to reduce power consumption: Active, Radio off, Light sleep,

Deep sleep, Hibernation

Sleep Patterns: Association sleep pattern, ULP sensor-monitored pattern

Table 2-1: AirPrime BX310x Capabilities (Continued)

Feature Description

Rev 2 Oct.17 15 41111444

3: Technical Specifications

3.1 Environmental

The environmental specifications for operation and storage of the AirPrime BX310x

are defined in Table 3-1.

3.2 Power Supply Ratings

DC power is supplied via the pins described in Table 3-2 on page 15.

Note: Operation above the maximum specified operating voltage (see Table 3-10 on page 20)

is not recommended, and specified typical performance or functional operation of the device is

neither implied nor guaranteed.

Table 3-1: Environmental Specifications

Parameter Range

Ambient Operating Temperature -40°C to +85°C

Ambient Storage Temperature -40°C to +105°C

(Recommended)

Ambient Humidity TBD

Table 3-2: Power Supply Pins

Pin Name Voltage Direction Function

33 VGPIO 3.3V Output Supply voltage reference for secondary

I2C interface (pins 53/54)

50 VDD_3V3_RF 2.7–3.6V Input RF/Analog signal power supply

51 VDD_3V3_PA 2.7–3.6V Input Internal Power Amplifier power supply

52 VDD_3V3_BB 1.8–3.3V Input Baseband/Digital I/O power supply

Product Technical Specification

Rev 2 Oct.17 16 41111444

3.2.1 Power Management

The AirPrime BX310x switches between several power modes to minimize current

consumption. The following tables describe these modes and their typical current

consumption:

3.2.2 Current Consumption

Current consumption measurements are conducted at the module antenna port with

3.0 V supply at 25C ambient temperature.

Table 3-3: Power Modes—Descriptions

Power Mode CPU Wi-Fi/BT

radio/

baseband

RTC ULP co-

processor Notes

Active On On On On Fully functional

Radio off On Off On On

Light sleep Pause Off On On Wake up events will wake the module.

Deep sleep Off Off On On/Off Connection data stored in RTC memory

Hibernate Off Off Off Off Only RTC timer or specific RTC GPIOs

can wake the module.

Table 3-4: Power Modes—Typical Current Consumption

Power Mode Description Current Consumption

Active (RF on)

Wi-Fi Tx packet 13 dB~21 dBm 160~260 mA

Wi-Fi/BT Tx packet 0 dBm 120 mA

Wi-Fi/BT Rx and listening 80~90 mA

Association sleep patter (by Light-sleep) 0.9 mA@DTIM3, 1.2 mA@DTIM1

Modem-sleep CPU is powered on.

Max speed: 20 mA

Normal speed: 5~10 mA

Slow speed: 3 mA

Light-sleep -0.8 mA

Deep-sleep

ULP processor powered on 0.15 mA

ULP sensor-monitored pattern 25 A @ 1% duty

RTC timer + RTC memory 10 A

Hibernation RTC timer only 5A

Technical Specifications

Rev 2 Oct.17 17 41111444

All transmitter measurements are based on 90% duty cycle and continuous transmit

mode.

Table 3-5: RF Current Consumption Specifications

Mode Min Typ Max Unit

Transmit 802.11b, DSSS 1 Mbps, POUT=+18.0 dBm -225 -mA

Transmit 802.11b, CCK 11 Mbps, POUT=+18.0 dBm -205 -mA

Transmit 802.11g, OFDM 54 Mbps, POUT = +14 dBm -160 -mA

Transmit 802.11n, MCS7 HT20, POUT=+11.5 dBm -152 -mA

Transmit 802.11n, MCS7 HT40, POUT=+11.5 dBm -152 -mA

Receive 802.11b, packet length=1024 byes, -80 dBm -85 -mA

Receive 802.11g, packet length=1024 bytes, -70 dBm -85 -mA

Receive 802.11n HT20, packet length=1024 bytes, -65 dBm -80 -mA

Receive 802.11n HT40, packet length=1024 bytes, -65 dBm -80 -mA

Power Save, DTIM 1 TBD mA

Power Save, DTIM 3 TBD mA

Power Save, DTIM 10 TBD mA

Continuous Transmit Bluetooth 1 Mbps TBD mA

Continuous Transmit Bluetooth 2 Mbps TBD mA

Continuous Transmit Bluetooth 3 Mbps TBD mA

Continuous Bluetooth Receive TBD mA

1.28 sec page scan (non-interlaced) TBD mA

1.28 sec LE ADV TBD mA

1.28 sec Sniff as master TBD mA

1.28 sec Sniff as slave TBD mA

Modem Sleep 10 mA

Light Sleep 0.8 mA

Deep Sleep 25 A

Hibernation 5A

Product Technical Specification

Rev 2 Oct.17 18 41111444

3.3 RF

3.3.1 Generic Radio

Measurements conducted at 25C ambient temperature.

3.3.2 Wi-Fi Radio

Measurements conducted at 25C ambient temperature.

Table 3-6: Generic Radio Characteristics

Description Min Typ Max Unit

BX3100 RF Port Impedance 50 

Frequency Band 2.4 2.45 2.485 GHz

BX3105 Antenna Gain TBD dBi

Table 3-7: Generic Radio Characteristics

Description Min Typ Max Unit

Transmit 802.11b, CCK 11 Mbps, Output Power, EVM and

Mask Compliant 18.0 dBm

Transmit 802.11g, OFDM 54 Mbps, Output Power, EVM and

Mask Compliant 14.0 dBm

Transmit 802.11n, MCS7 HT20 72.2 Mbps, Output Power,

EVM and Mask Compliant 11.5 dBm

Transmit 802.11n, MCS7 HT40 135 Mbps, Output Power,

EVM and Mask Compliant 11.5 dBm

Receiver Sensitivity 11b DSSS, 1 Mbps TBD dBm

Receiver Sensitivity 11b CCK, 11 Mbps TBD dBm

Receiver Sensitivity 11g OFDM, 6 Mbps TBD dBm

Receiver Sensitivity 11g OFDM, 54 Mbps TBD dBm

Receiver Sensitivity 11n HT20 OFDM, 72.2 Mbps TBD dBm

Receiver Sensitivity 11n HT40 OFDM, 135 Mbps TBD dBm

BX3100 Harmonics 2F0 -35 dBm

BX3100 Harmonics 3F0 -50 dBm

Technical Specifications

Rev 2 Oct.17 19 41111444

3.3.3 Bluetooth Radio

Measurements conducted at 25C ambient temperature.

Table 3-8: Generic Radio Characteristics

Description Min Typ Max Unit

Transmit Power BR 1 Mbps, ACR & Modulation Compliant TBD dBm

Transmit Power BR 2 Mbps, ACR & Modulation Compliant TBD dBm

Transmit Power BR 3 Mbps, ACR & Modulation Compliant TBD dBm

Transmit Power LE 1 Mbps, ACR & Modulation Compliant TBD dBm

Receiver Sensitivity BR 1 Mbps TBD dBm

Receiver Sensitivity EDR 2 Mbps TBD dBm

Receiver Sensitivity EDR 3 Mbps TBD dBm

Receiver Sensitivity LE 1 Mbps TBD dBm

Out-of-band blocking performance 30 MHz~2000 MHz TBD dBm

Out-of-band blocking performance 2500 MHz~3000 MHz TBD dBm

Out-of-band blocking performance 3000 MHz~12.5 GHz TBD dBm

Product Technical Specification

Rev 2 Oct.17 20 41111444

3.4 Electrical Specifications

3.4.1 Absolute Maximum Ratings

3.5 Mechanical

3.6 Mechanical Drawings

The AirPrime BX310x module’s LGA footprint is a 70-pad array of copper pads (see

Physical Dimensions and Connection Interface on page 9). The following drawings

illustrate the device footprint and dimensions.

Table 3-9: Absolute Maximum Ratings

Parameter Min Max Units

VIL Input low voltage -0.3 0.25VIO V

VIH Input high voltage 0.75VIO 3.3 V

IIL Input leakage current -50 nA

VOL Output low voltage -0.1VIO V

VOH Output high voltage 0.8VIO - V

Cpad Input pin capacitance - 2 pF

VIO VDDIO 1.8 3.3 V

IMAX Maximum drive capability -12 mA

TSTR Storage temperature range -40 150 C

Table 3-10: Recommended Operating Conditions

Parameter Min Typ Max Units

VBAT Battery regulator supply voltage 2.8 3.3 3.6 V

VIO I/O supply voltage 1.8 3.3 3.3 V

TOPR Operating temperature range -40 -85 C

VIL CMOS low level input voltage 0 - 0.3VIO V

VIH CMOS high level input voltage 0.7VIO - VIO V

VTH CMOS threshold voltage -0.5VIO - V

JEEVEQAEDEEEDL DJ 0 H. H. H. H. LVDDQD%DD

Technical Specifications

Rev 2 Oct.17 21 41111444

Note: Dimensions in Figure 3-1 and Figure 3-2 are preliminary and subject to change.

Figure 3-1: AirPrime BX3100 Mechanical Drawing

11.5mm ± 0.1mm

9.5mm ± 0.1mm

2.4mm ± 0.2mm

0.65mm0.35mm

0.75mm

0.30mm

0.67mm

0.5mm

0.25mm

1.825mm

1.475mm

1.0mm

Signal Pad Detail

0.35mm

0.75mm

0.05mm R

Ground Pad Detail

1mm

Pin 1 Pin 14

1.35mm

Pin 28

Pin 42

SMD

NSMD

J U 1 J J imammmmmmummmmﬁ m Dmmm WDDWDDM D WE Dmimrwx ‘ﬁWr :%mm rum— ETDDD mam Do 025mm

Product Technical Specification

Rev 2 Oct.17 22 41111444

Figure 3-2: AirPrime BX3105 Mechanical Drawing

3.7 Antenna

The AirPrime BX3100 uses an LGA pad (pin 40—RF_MAIN), which the application

must connect to an external antenna.

The AirPrime BX3105 includes an integrated PCB antenna. Leave the LGA pad

(pin 40) unconnected.

11.5mm ± 0.1mm

13.5mm ± 0.1mm

2.4mm ± 0.2mm

0.65mm

0.35mm

0.75mm

0.30mm

0.67mm

0.5mm

0.25mm

1.825mm

1.475mm

1.0mm

Signal Pad Detail

0.35mm

0.75mm

0.05mm R

Ground Pad Detail

1mm

Pin 1 Pin 14

1.35mm

Pin 28

Pin 42

SM D

NSM D

1mm ± 0.1mm

8.6mm ± 0.1mm

Rev 2 Oct.17 23 41111444

4: Interfaces Specification

4.1 Overview

This section describes the interfaces supported by the AirPrime BX310x embedded

module and provides specific voltage, timing, and circuit recommendations for each

interface.

4.2 UART

The AirPrime BX310x provides one UART interface for asynchronous communication

between the AirPrime BX310x module and a host device (e.g. a PC or host

processor):

•UART0—4-wire, RS-232-compliant interface

Note: Up to two additional UART interfaces can be added by configuring GPIOs using AT

commands.

Flow control is managed using:

•RTS/CTS signals (This method is required for higher UART interface speeds.)

•Software XON/XOFF

Table 4-1 on page 23 describes the signals used for UART0.

Note: UART signals are named with respect to the module, and directions are listed with

respect to the module. For example, UART0_RXD is an output from the module to the host.

Table 4-1: UART0 Pinsa

Pin Interface Name Direction Function Voltage Level

UART0

UART0_RTS IReady To Send, flow control

VDD_PADS_BB

3UART0_CTS OClear To Send, flow control

4UART0_TXD ITransmit Data

5UART0_RXD OReceive Data

a. If UART0 pins are not used, leave open.

Product Technical Specification

Rev 2 Oct.17 24 41111444

4.3 ADC

The AirPrime BX310x provides two general purpose ADC (Analog to Digital

Converter) inputs that are used to measure analog voltages.

4.4 Voltage Measurement

The AirPrime BX310x supports the measurement of analog voltages using the

following methods:

•ADCs—Two input pins that can be used for direct voltage measurements. See

ADC on page 24.

•Combination of four GPIOs and external capacitors—Small analog signals can

be measured by configuring (using AT commands) the pins in Table 4-3 below to

support a low-noise programmable gain amplifier with the addition of external

270 pF capacitors between pins 31/32 and pins 34/36. The internal ULP-copro-

cessor is also designed to measure the voltages while operating in the sleep

mode, to enable low power consumption; the CPU can be woken up by a

threshold setting and/or via other triggers.

4.5 I2C Interface

The AirPrime BX310x module provides two I2C (Inter-Integrated Circuit) dedicated

serial ports (bus interface) based on [8] The I2C Bus Specification, Version 2.1,

January 2000 (Phillips Semiconductor document number 9398 393 40011).

Table 4-2: ADC Interface Pinsa

a. Leave open any pins that are not used.

Pin Signal name Directionb

b. Signal direction with respect to the module.

Function Voltage Level

18 VDET_1 IAnalog to Digital Converter VDD_PADS_BB

19 VDET_2 I

Table 4-3: Voltage-measurement GPIO Pinsa

a. Leave open any pins that are not used.

Pin Signal Name Directionb

b. Signal direction with respect to the module.

Voltage level

31 SENSOR_VP I

VDD_PADS_BB

32 SENSOR_CAPP I

34 SENSOR_CAPN I

36 SENSOR_VN I

Interfaces Specification

Rev 2 Oct.17 25 41111444

The interfaces use the pins indicated in Table 4-4.

This implementation of the I2C interface includes the following characteristics:

•Supported voltage:

·Primary I2C (1.8 V/3.3 V, configurable)

·Secondary I2C (3.3 V)

•Standard-mode interface—Data transfer rates up to 100 kbit/s

•Fast-mode interface—Data transfer rates up to 400 kbit/s)

•Master mode operation

•Addressing modes—7-bit; 10-bit; Dual addressing mode

External 2.2 k pull-up resistors must be applied to I2C signals (see Figure 4-1 on

page 25).

For I2C bus details, including I2C bus waveform and timing details, refer to the

I2C Bus Specification.

4.5.1 Application

Figure 4-1: Example of I2C Bus Application

Table 4-4: I2C Interface Pinsa

a. Leave open any pins that are not used.

Pin Signal name Direction Function Voltage Level

9I2C1_SCL I/O Primary I2C interface VDD_PADS_BB

17 I2C1_SDA I/O Primary I2C interface

53 I2C2_SDA I/O Secondary I2C interface VGPIO

54 I2C2_SCL I/O Secondary I2C interface

AirPrime BX310x

Wi-Fi/BT Module Customer

Application

I2C1_SDA

I2C1_SCL 2.2K 2.2K

VDD_PADS_BB

I2C2_SCL

I2C2_SDA 2.2K

VGPIO

2.2K

Product Technical Specification

Rev 2 Oct.17 26 41111444

4.6 I2S Interface (Digital Audio)

Note: Interface support is forthcoming.

The AirPrime BX310x provides a 4-wire I2S (digital audio) interface that can be used

to transfer serial digital audio to or from an external stereo DAC/ADC, and supports

the following features:

•Modes—Master, Slave

•Transmission format—Full duplex, Half duplex

•Resolution (bits per frame)—8, 16, 32, 40, 48

•Channels—Input, Output

•Bit clock—10 kHz–40 MHz

•Supported audio interfaces (forthcoming)—PDM (Pulse Density Modulation),

BT PCM (Pulse Code Modulation)

The interface uses the pins indicated in Table 4-5.

4.7 General Purpose Input/Output (GPIO)

The AirPrime BX310x defines several GPIOs for customer use, as described in

Table 4-6 and Table 4-7.

Note: The pins carrying the ‘Alternate function’ GPIOs are multi-function. The alternate inter-

faces (SDIO or SPI) can be selected via an AT command.

Table 4-5: I2S Interface Pinsa

a. Leave open any pins that are not used.

Pin Signal name Directionb

b. Signal direction with respect to the module.

Function Voltage Level

16 I2S_MCLK OI2S MasterClock

VDD_PADS_BB

24 I2S_DO OI2S Data Out

25 I2S_DI II2S Data In

26 I2S_LRCLK I/O I2S Left-Right Clock (Word Select)

27 I2S_BCLK I/O I2S Bit Clock

Table 4-6: GPIO Pins (Dedicated)a

a. Leave open any pins that are not used.

Pin Signal Name Direction Default State Function Voltage Level

14 GPIO(5) I/O No pullb

b. Internal configuration of all GPIOs—no internal pull-ups

General purpose I/O VDD_PADS_BB

35 GPIO(27) I/O

Interfaces Specification

Rev 2 Oct.17 27 41111444

4.8 SPI Bus

Note: Interface support is forthcoming.

The AirPrime BX310x provides one 6-wire Serial Flash SPI-compatible interface.

Note: Traditional 4-wire (MOSI/MISO/SCLK/SS) SPI can also be implemented over using

appropriate pins.

Table 4-8 on page 27 describes the SPI interface pins.

Note: The pins carrying the SPI interface are multi-function. The alternate interfaces (SDIO or

GPIO) can be selected via an AT command.

Table 4-7: GPIO Pins (Alternate function)a

Pin Signal Name Direction Default State Function Voltage Level

42 GPIO(15)

I/O No pullbGeneral purpose I/O VDD_PADS_BB

43 GPIO(12)

44 GPIO(14)

45 GPIO(13)

46 GPIO(2)

47 GPIO(4)

a. Leave open any pins that are not used.

b. Internal configuration of all GPIOs—no internal pull-ups

Table 4-8: SPI Pin Descriptionsa

a. Leave open any pins that are not used.

Pin Signal Name Directionb

b. Signal direction with respect to the module.

Function Voltage Level

42 HSPICS0 I/O SPI Chip Select

VDD_PADS_BB

43 HSPIQ I/O SPI Data In

44 HSPICLK I/O SPI Clock

45 HSPID I/O SPI Data Out

46 HSPIWP OSPI Write Protect

47 HSPIHD OSPI Hold

Product Technical Specification

Rev 2 Oct.17 28 41111444

4.9 Secure Digital IO (SDIO) Interface

Note: Interface support is forthcoming.

The AirPrime BX310x defines one SDIO slave-controller interface (SD 2.0-compliant),

which allows a host controller to access the module (the slave device) on the SDIO

bus.

The following features are supported:

•Data transfer rates—0–50 MHz

•Block size—Up to 512 bytes

•Interrupts—module-initiated and host-initiated

•Module-initiated data transfer via host interrupt

•Configurable features—Sampling, driving clock edge

•Registers for direct access by host

Table 4-9 describes the signals used for SDIO.

Note: The pins carrying the SDIO interface are multi-function. The alternate interfaces (GPIO

or SPI) can be selected via an AT command.

4.10 Module Enable

The AirPrime BX310x uses the ENABLE (Module Enable) signal to turn the module

on/off:

•Turn module on—Drive ENABLE high (to VDD_PADS_BB)

•Turn module off—Drive ENABLE low (to 0V)

Table 4-9: SDIO Pin Descriptionsa

a. Leave open any pins that are not used.

Pin Signal Name Direction Function Voltage Level

42 SD_CMD I/O SDIO command

VDD_PADS_BB

43 SD_DATA2 I/O SDIO data bit 2

44 SD_CLK I/O SDIO clock

45 SD_DATA3 I/O SDIO data bit 3

46 SD_DATA0 I/O SDIO data bit 0

47 SD_DATA1 I/O SDIO data bit 1

Table 4-10: Enable Pin Descriptiona

a. Leave open any pins that are not used.

Pin Signal Name Directionb

b. Signal direction with respect to the module.

Function Voltage Level

37 ENABLE IStart/stop

module VDD_PADS_BB

Interfaces Specification

Rev 2 Oct.17 29 41111444

4.11 Clock

The AirPrime BX310x outputs the I2S Master Clock (pin 16, GPIO(0)_I2S_MCLK)

and can output a configurable RTC on some GPIOs (details TBD).

4.12 PWM

The AirPrime BX310x supports the use of any signal in Table 6-1 on page 33 that

includes “(GPIOx)” in its name as a PWM, via AT command configuration.

—>>I

Rev 2 Oct.17 30 41111444

5: Regulatory Certifications

Caution: Unauthorized modifications or changes not expressly approved by Sierra Wireless

could void compliance with regulatory rules, and thereby your authority to use this equipment.

The BX3100/BX3105 module is designed to meet, and upon commercial release, will

meet the requirements of the following regulatory bodies and regulations, where

applicable:

•Federal Communications Commission (FCC) of the United States

•The Certification and Engineering Bureau of Industry Canada (IC)

•Ministry of Internal Affairs and Communications (MIC) of Japan

•Radio Equipment Directive of the European Union

Upon commercial release, the following industry certification will have been obtained,

where applicable:

•Bluetooth SIG

Additional certifications and details on specific country approvals may be obtained

upon customer request — contact your Sierra Wireless account representative for

details.

Additional testing and certification may be required for the end product with an

embedded BX3100/BX3105 module and are the responsibility of the OEM. Sierra

Wireless offers professional services-based assistance to OEMs with the testing and

certification process, if required.

United States

The BX3100/BX3105 module, upon commercial release, will have been granted

modular approval by the FCC. Integrators may use the BX3100/BX3105 module in

their end products without additional FCC certification if the following conditions are

met.

•At least 20 cm separation distance between the antenna and the user’s body

must be maintained at all times.

•The BX3100/BX3105 module must not be collocated with any other transmitter

within a host device.

•The regulatory label on the end product must include the text “Contains FCC ID:

TBD” and the following compliance statement:

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions: (1) This device may not cause harmful interference,

and (2) this device must accept any interference received, including interfer-

ence that may cause undesired operation.

A user manual with the end product must clearly indicate the operating requirements

and conditions to ensure compliance with current FCC RF exposure guidelines.

The end product with an embedded BX3100/BX3105 module may also need to meet

the FCC Part 15 unintentional emission requirements and be properly authorized per

FCC Part 15 Subpart B.

Regulatory Certifications

Rev 2 Oct.17 31 41111444

Canada

The BX3100/BX3105 module, upon commercial release, will have been granted

modular approval by IC. Integrators may use the BX3100/BX3105 module in their end

products without additional IC certification if the following conditions are met.

•At least 20 cm separation distance between the antenna and the user’s body

must be maintained at all times.

•The BX3100/BX3105 module must not be collocated with any other transmitter

within a host device.

•The regulatory label on the end product must include the text “Contains IC : TBD”

and the following compliance statement:

This device complies with Industry Canada license-exempt RSS standard(s).

Operation is subject to the following two conditions: (1) this device may not cause

interference, and (2) this device must accept any interference, including

interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux

appareils radio exempts de licence. L'exploitation est autorisée aux deux

conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)

l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi, même

si le brouillage est susceptible d'en compromettre le fonctionnement.

Bluetooth Qualification Program (BQP)

•In case no other non-certified Bluetooth components are incorporated, the

BX3100/BX3105's BQP marking certification allows users to integrate the module

into products without the need to obtain subsequent and separate approval.

•The BX3100/BX3105 has been approved by the Bluetooth Qualification Body

(BQB) to use the Bluetooth trademark and to offer official Bluetooth functionality.

The approval according to the V4.2 Bluetooth specification confirms that the

module complies with the Bluetooth specification and will successfully operate

with other products supporting the same profile. BQP certification also ensures

that the module has gone through safety assessment. This certification was

granted through a combination of product performance testing and interoperability

testing. This certification applies globally.

Labelling

•Products complying with all relevant requirements are allowed to bear the official

Bluetooth logo

For further information regarding the BQP certification requirements please review the

following websites:

Bluetooth Special Interest Group:

https://www.bluetooth.org/apps/content/

—>>I

Rev 2 Oct.17 32 41111444

6: Pinout

The system interface of the AirPrime BX310x is through the LGA pattern on the

bottom of the PCB.

AirPrime BX310x pins are divided into three functional categories:

•Core functions and associated pins—Cover all the mandatory features for M2M

connectivity and will be available by default across all CF3 family of modules.

These Core functions are always available and always at the same physical pin

locations. A customer platform using only these functions and associated pins is

guaranteed to be forward and/or backward compatible with the next generation of

CF3 modules.

•Extension functions and associated pins—Bring additional capabilities to the

customer. Whenever an Extension function is available on a module, it is always

at the same pin location.

•Custom functions and associated pins—These are module-specific and make

use of specific chipset functions and I/Os.

Warning: Custom features should be used with caution as there is no guarantee that the

custom functions available on a given module will be available on other CF3 modules.

Pins marked as "Leave open" or "Reserved" should not be used or connected.

,' Pin 1 Pin 14 \ IDDEEDDDDEDDDEE IDJEDDJDDDEDD DDJKDDJDDDED \ \DDDDDDDDDDDDDI \ Pin 42 Pin 28

Pinout

Rev 2 Oct.17 33 41111444

6.1 Pin Configuration

Figure 6-1 illustrates the pin configuration of the AirPrime BX310x module.

Figure 6-1: Pin Configuration (Bottom View)

6.2 Pin Description

Table 6-1 on page 33 lists detailed information for the LGA pins.

Important: Leave open all pins that are not used.

Table 6-1: Pin Definitions

Pin Signal name Group I/OaVoltage

PU/

PDbActivecFunction Typed

1Reserved NoConnect - - - - E

2UART0_RTS_GPIO(22) UART0 IVDD_PADS_BB PU LUART0 Request To Send C

3UART0_CTS_GPIO(19) UART0 OVDD_PADS_BB PU LUART0 Clear To Send C

4UART0_TXD UART0 IVDD_PADS_BB PU LUART0 Transmit Data C

5UART0_RXD UART0 OVDD_PADS_BB PU LUART0 Receive Data C

6Reserved NoConnect - - - - - E

Product Technical Specification

Rev 2 Oct.17 34 41111444

7Reserved NoConnect - - - - - E

8Reserved NoConnect - - - - - E

9GPIO(23) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O C

I2C1_SCL I2C1 I/O PUE LPrimary I2C interface—Clock

10 Reserved NoConnect - - - - - C

11 Reserved NoConnect - - - - - E

12 Reserved NoConnect - - - - - E

13 Reserved NoConnect - - - - - E

14 GPIO(5) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O E

15 Reserved NoConnect - - - - - E

16 I2S_MCLK I2S OVDD_PADS_BB NP HI2S Master Clock E

GPIO(0) GPIO I/O NP SW General Purpose I/O

17 GPIO(25) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O E

I2C1_SDA I2C1 I/O PUE LPrimary I2C interface—Data

18 VDET_1 VoltMeasure IVDD_PADS_BB NP HADC input for voltage measurement C

GPIO(34) GPIO I/O NP SW General Purpose I/O

19 VDET_2 VoltMeasure IVDD_PADS_BB NP HADC input for voltage measurement C

GPIO(35) GPIO I/O NP SW General Purpose I/O

20 Reserved NoConnect - - - - - C

21 Reserved NoConnect - - - - - C

22 Reserved NoConnect - - - - - C

23 Reserved NoConnect - - - - - C

24 I2S_DO I2S OVDD_PADS_BB PD HI2S Data Out E%%

GPIO(32) GPIO I/O NP SW General Purpose I/O

25 I2S_DI I2S IVDD_PADS_BB PD HI2S Data In E%%

GPIO(33) GPIO I/O NP SW General Purpose I/O

26 I2S_LRCLK I2S I/O VDD_PADS_BB PD L/H I2S Left-Right Clock (Word Select) E

GPIO(18) GPIO I/O NP SW General Purpose I/O

27 I2S_BCLK I2S I/O VDD_PADS_BB PD HI2S Bit Clock E

GPIO(26) GPIO I/O NP SW General Purpose I/O

28 GND Ground 0V 0V - - Ground C

29 Reserved NoConnect - - - - - E

Table 6-1: Pin Definitions (Continued)

Pin Signal name Group I/OaVoltage

PU/

PDbActivecFunction Typed

Pinout

Rev 2 Oct.17 35 41111444

30 GND Ground 0V 0V - - Ground C

31 GPIO(36) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O C

SENSOR_VP VoltMeasure INP HADC input for voltage measurement

32 GPIO(37) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O C

SENSOR_CAPP VoldMeasure INP HADC input for voltage measurement

33 VGPIO Power O3.3V Reference voltage output C

34 GPIO(38) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O C

SENSOR_CAPN VoltMeasure INP HADC input for voltage measurement

35 GPIO(27) GPIO I/O VDD_PADS_BB NP LGeneral Purpose I/O E

36 GPIO(39) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O C

SENSOR_VN VoltMeasure INP HADC input for voltage measurement

37 ENABLE Control IVDD_PADS_BB LTurn module on/off C

38 Reserved NoConnect - - - - - E

39 GND Ground 0V 0V - - Ground C

40 RF_MAIN RF I/O - - (BX3100) RF antenna, DC blocked

(BX3105) Leave pin unconnected C

41 GND Ground 0V 0V - - Ground C

SD_CMD SDIO I/O

VDD_PADS_BB

NP HSDIO Command E

HSPICS0 SPI I/O NP SW SPI Chip Select C

GPIO(15) GPIO I/O NP SW General Purpose I/O E

SD_DATA2 SDIO I/O

VDD_PADS_BB

NP HSDIO Data bit 2 E

HSPIQ SPI I/O NP SW SPI Data In C

GPIO(12) GPIO I/O NP SW General Purpose I/O E

SD_CLK SDIO I/O

VDD_PADS_BB

NP HSDIO Clock E

HSPICLK SPI I/O NP SW SPI Clock (output from Master) C

GPIO(14) GPIO I/O NP SW General Purpose I/O E

SD_DATA3 SDIO I/O

VDD_PADS_BB

NP HSDIO Data bit 3 E

HSPID SPI I/O NP SW SPI Data Out C

GPIO(13) GPIO I/O NP SW General Purpose I/O E

SD_DATA0 SDIO I/O

VDD_PADS_BB

NP HSDIO Data bit 0 E

HSPIWP SPI ONP SW SPI Write Protect E

GPIO(2) GPIO I/O NP SW General Purpose I/O E

Table 6-1: Pin Definitions (Continued)

Pin Signal name Group I/OaVoltage

PU/

PDbActivecFunction Typed

Product Technical Specification

Rev 2 Oct.17 36 41111444

SD_DATA1 SDIO I/O

VDD_PADS_BB

NP HSDIO Data bit 1 E

HSPIHD SPI ONP SW SPI Hold E

GPIO(4) GPIO I/O NP SW General Purpose I/O E

48 Reserved NoConnect - - - - - E

49 Reserved NoConnect - - - - - E

50 VDD_3V3_RF Power I

2.8 (Min)

3.3V (Typ)

3.6 (Max)

- - 3.3v nominal supply for Analog/RF C

51 VDD_3V3_PA Power I

2.8 (Min)

3.3V (Typ)

3.6 (Max)

- - 3.3v nominal supply for Internal

Power Amplifier C

52 VDD_PADS_BB Power I

1.8 (Min)

3.3V (Typ)

3.6 (Max)

- - 3.3v nominal supply for Baseband

and Digital I/O C

53 GPIO(16) GPIO I/O VGPIO NP SW General Purpose I/O C

I2C2_SDA I2C2 I/O PUE LPrimary I2C interface—Data

54 GPIO(17) GPIO I/O VDD_PADS_BB NP SW General Purpose I/O C

I2C2_SCL I2C2 I/O PUE LPrimary I2C interface—Clock

G1–

G16 Ground Ground 0V 0V - - Ground C

a. I/O: Signal direction with respect to the module

b. PU/PD: NP—No Pull; PD—Pull Down; PU—Pull Up; PUE—Pull Up External

c. Active: H—High; L—Low; SW—Software defined

d. Type: C—Core; E—Extended; K—Custom

Table 6-1: Pin Definitions (Continued)

Pin Signal name Group I/OaVoltage

PU/

PDbActivecFunction Typed

Rev 2 Oct.17 37 41111444

7: Abbreviations

Table 7-1: Acronyms and Definitions

Acronym or term Definition

AFH Adaptive Frequency Rate Hopping

AP Access Point

BLE Bluetooth Low Energy

BR Basic Rate

BSS Basic Service Set

BT Bluetooth (Classic)

EDR Enhanced Data Rate

GAP Generic Access Profile

GAP General Access Profile

GATT General Attribute Profile

HTTP Hypertext Transfer Protocol

HTTPS Hypertext Transfer Protocol Secure

LE Low Energy

MQTT Message Queuing Telemetry Transport

PAN Personal Area Network

RFCOMM Radio Frequency Communication

SDP Service Discover Protocol

SMP Security Manage Protocol

SPP Bluetooth Serial Port Profile

STA Station (client)

UART Universal Asynchronous Receiver-Transmitter

Wi-Fi Wireless Networking

WPA Wi-Fi Protected Access

WPA2 Wi-Fi Protected Access 2

WPS Wi-Fi Protected Setup

BX310x Specification Datasheet

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