DM74ALS10A Datasheet by onsemi

— FAIRCHII—D — EEM‘EONDUETDPW
© 2000 Fairchild Semiconductor Corporation DS006180 www.fairchildsemi.com
September 1986
Revised February 2000
DM74ALS10A Triple 3-Input NAND Gate
DM74ALS10A
Triple 3-Input NAND Gate
General Description
This device contains three independent gates, each of
which performs the logic NAND function.
Features
Switching specifications at 50 pF
Switching specifications guaranteed over full tempera-
ture and VCC range
Advanced oxide-isolated, ion-implanted Schottky TTL
process
Functionally and pin for pin compatible with Schottky
and low power Schottky TTL counterpart
Improved AC performance over Schottky and low power
Schottky counterparts
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Connection Diagram Function Table
Y = ABC
H = HIGH Logic Level
L = LOW Logic Level
X = Either LOW or HIGH Logic Level
Order Number Package Number Package Description
DM74ALS10AM M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow
DM74ALS10ASJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
DM74ALS10AN N14A 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Inputs Output
ABCY
XXLH
XLXH
LXXH
HHHL
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DM74ALS10A
Absolute Maximum Ratings(Note 1)
Note 1: The “Absolute Maximum Ratings” are those values beyond which
the safety of the device cannot be guaranteed. The device should not be
operated at these limits. The parametric values defined in the Electrical
Characteristics tables are not guaranteed at the absolute maximum ratings.
The “Recommended Operating Conditions” table will define the conditions
for actual device operation.
Recommended Operating Conditions
Electrical Characteristics
over recommended operating free air temperature range. All typical values are measured at VCC = 5V, TA = 25°C.
Switching Characteristics
over recommended operating free air temperature range.
Supply Voltage 7V
Input Voltage 7V
Operating Free Air Temperature Range 0°C to +70°C
Storage Temperature Range 65°C to +150°C
Typical θJA
N Package 86.5°C/W
M Package 116.0°C/W
Symbol Parameter Min Nom Max Units
VCC Supply Voltage 4.5 5 5.5 V
VIH HIGH Level Input Voltage 2 V
VIL LOW Level Input Voltage 0.8 V
IOH HIGH Level Output Current 0.4 mA
IOL LOW Level Output Current 8 mA
TAFree Air Operating Temperature 0 70 °C
Symbol Parameter Conditions Min Typ Max Units
VIK Input Clamp Voltage VCC = 4.5V, II = 18 mA 1.5 V
VOH HIGH Level IOH = 0.4 mA VCC 2V
Output Voltage VCC = 4.5V to 5.5V
VOL LOW Level VCC = 4.5V IOL = 4 mA 0.25 0.4 V
Output Voltage IOL = 8 mA 0.35 0.5 V
IIInput Current @ Max VCC = 5.5V, VIH = 7V 0.1 mA
Input Voltage
IIH HIGH Level Input Current VCC = 5.5V, VIH = 2.7V 20 µA
IIL LOW Level Input Current VCC = 5.5V, VIL = 0.4V 0.1 mA
IOOutput Drive Current VCC = 5.5V VO = 2.25V 30 112 mA
ICC Supply Current VCC = 5.5V Outputs HIGH 0.32 0.6 mA
Outputs LOW 1.7 2.4 mA
Symbol Parameter Conditions Min Max Units
tPLH Propagation Delay Time VCC = 4.5V to 5.5V 211ns
LOW-to-HIGH Level Output RL = 500
tPHL Propagation Delay Time CL = 50 pF 210ns
HIGH-to-LOW Level Output
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DM74ALS10A
Physical Dimensions inches (millimeters) unless otherwise noted
14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150 Narrow
Package Number M14A
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DM74ALS10A
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
Package Number M14D
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DM74ALS10A Triple 3-Input NAND Gate
Physical Dimensions inches (millimeters) unless otherwise noted (Continued)
14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300 Wide
Package Number N14A
Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and
Fairchild reserves the right at any time without notice to change said circuitry and specifications.
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT
DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD
SEMICONDUCTOR CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the
body, or (b) support or sustain life, and (c) whose failure
to perform when properly used in accordance with
instructions for use provided in the labeling, can be rea-
sonably expected to result in a significant injury to the
user.
2. A critical component in any component of a life support
device or system whose failure to perform can be rea-
sonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
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