TVS2700 Datasheet by Texas Instruments

l TEXAS INSTRUMENTS X rvszmo Fla‘rclamp DRV Forxprint 2mm x 2mm meenfional rvs SMB Fomprim 3 55m x 5 3m
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TVS2700
SLVSED6A –DECEMBER 2017–REVISED MARCH 2018
TVS2700 27-V Flat-Clamp Surge Protection Device
1
1 Features
1• Protection Against ±1 kV, 42 ΩIEC 61000-4-5
Surge Test for Industrial Signal Lines
• Max Clamping Voltage of 35 V at 40 A of 8/20 µs
Surge Current
• Standoff Voltage: 27 V
• Tiny 4 mm2Footprint
• Survives Over 5,000 Repetitive Strikes of 35 A
8/20 µs Surge Current at 125°C
• Robust Surge Protection:
– IEC 61000-4-5 (8/20 µs): 40 A
– IEC 61643-321 (10/1000 µs): 4 A
• Low Leakage Current
– 1.8 nA Typical at 27°C
– 14.5 nA Typical at 85°C
• Low Capacitance: 100 pF
• Integrated Level 4 IEC 61000-4-2 ESD Protection
2 Applications
• Industrial Sensor I/O
• Medical Equipment
• PLC I/O Modules
• Appliances
• Field Transmitters
3 Description
The TVS2700 robustly shunts up to 40 A of IEC
61000-4-5 fault current to protect systems from high
power transients or lightning strikes. The device
offers a solution to the common industrial signal line
EMC requirement to survive up to ±1 kV IEC 61000-
4-5 open circuit voltage coupled through a 42 Ω
impedance. The TVS2700 uses a unique feedback
mechanism to ensure precise flat clamping during a
fault, assuring system exposure below 35 V. The tight
voltage regulation allows designers to confidently
select system components with a lower voltage
tolerance, lowering system costs and complexity
without sacrificing robustness.
In addition, the TVS2700 is available in a small 2 mm
× 2 mm SON footprint which is designed for space
constrained applications, offering a 70 percent
reduction in size compared to industry standard SMA
and SMB packages. The extremely low device
leakage and capacitance ensure a minimal effect on
the protected line. To ensure robust protection over
the lifetime of the product, TI tests the TVS2700
against 5,000 repetitive surge strikes at high
temperature with no shift in device performance.
The TVS2700 is part of TI's Flat-Clamp family of
surge devices. For more information on the other
devices in the family, see the Device Comparison
Table.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TVS2700 SON (6) 2.00 mm × 2.00 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Footprint Comparison Voltage Clamp Response to 8/20 µs Surge Event
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings - JEDEC .............................................. 5
7.3 ESD Ratings - IEC .................................................... 5
7.4 Recommended Operating Conditions....................... 5
7.5 Thermal Information.................................................. 5
7.6 Electrical Characteristics........................................... 6
7.7 Typical Characteristics.............................................. 7
8 Detailed Description.............................................. 9
8.1 Overview ................................................................... 9
8.2 Functional Block Diagram......................................... 9
8.3 Feature Description................................................... 9
8.4 Reliability Testing...................................................... 9
8.5 Device Functional Modes........................................ 10
9 Application and Implementation ........................ 11
9.1 Application Information............................................ 11
9.2 Typical Application ................................................. 11
10 Power Supply Recommendations ..................... 12
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 13
12 Device and Documentation Support ................. 14
12.1 Receiving Notification of Documentation Updates 14
12.2 Community Resources.......................................... 14
12.3 Trademarks........................................................... 14
12.4 Electrostatic Discharge Caution............................ 14
12.5 Glossary................................................................ 14
13 Mechanical, Packaging, and Orderable
Information ........................................................... 14
4 Revision History
Changes from Original (December 2017) to Revision A Page
• Changed product status from Advance Information to Production Data ............................................................................... 1
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5 Device Comparison Table
Device Vrwm Vclamp at Ipp Ipp (8/20 µs) Vrwm leakage
(nA) Package Options Polarity
TVS0500 5 9.2 43 0.07 SON Unidirectional
TVS1400 14 18.4 43 2 SON Unidirectional
TVS1800 18 22.8 40 0.5 SON Unidirectional
TVS2200 22 27.7 40 3.2 SON Unidirectional
TVS2700 27 32.5 40 1.7 SON Unidirectional
TVS3300 33 38 35 19 WCSP, SON Unidirectional
‘5‘ TEXAS INSTRUMENTS
IN
IN
GND
GND
GND IN
GND
2
3
1
5
4
6
4
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6 Pin Configuration and Functions
DRV Package
6-Pin SON
Top View
Pin Functions
PIN TYPE DESCRIPTION
NAME No.
IN 4, 5, 6 I ESD and surge protected channel
GND 1, 2, 3, exposed thermal
pad GND Ground
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(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7 Specifications
7.1 Absolute Maximum Ratings
TA= 27°C (unless otherwise noted)(1)
MIN MAX UNIT
Maximum
Surge
IEC 61000-4-5 Current (8/20 µs) 40 A
IEC 61000-4-5 Power (8/20 µs) 1250 W
IEC 61643-321 Current (10/1000 µs) 4 A
IEC 61643-321 Power (10/1000 µs) 120 W
Maximum
Forward Surge
IEC 61000-4-5 Current (8/20 µs) 50 A
IEC 61000-4-5 Power (8/20 µs) 80 W
IEC 61643-321 Current (10/1000 µs) 23 A
IEC 61643-321 Power (10/1000 µs) 60 W
EFT IEC 61000-4-4 EFT Protection 80 A
IBR DC Breakdown current 12 mA
IFDC Forward Current 500 mA
TAAmbient Operating Temperature -40 125 °C
Tstg Storage Temperature -65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.2 ESD Ratings - JEDEC
VALUE UNIT
V(ESD) Electrostatic discharge
Human body model (HBM), per
ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2) ±500
7.3 ESD Ratings - IEC
VALUE UNIT
V(ESD) Electrostatic discharge IEC 61000-4-2 contact discharge ±16 kV
IEC 61000-4-2 air-gap discharge ±30
7.4 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN NOM MAX UNIT
VRWM Reverse Stand-off Voltage 27 V
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
7.5 Thermal Information
THERMAL METRIC(1)
TVS2700
UNITDRV (SON)
6 PINS
RqJA Junction-to-ambient thermal resistance 70.4 °C/W
RqJC(top) Junction-to-case (top) thermal resistance 73.7 °C/W
RqJB Junction-to-board thermal resistance 40 °C/W
YJT Junction-to-top characterization parameter 2.2 °C/W
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Thermal Information (continued)
THERMAL METRIC(1)
TVS2700
UNITDRV (SON)
6 PINS
YJB Junction-to-board characterization parameter 40.3 °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance 11 °C/W
7.6 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VRWM Reverse Stand-off Voltage -0.5 27 V
ILEAK Leakage Current
Measured at VIN = VRWM, TA= 27°C 1.8 60 nA
Measured at VIN = VRWM. TA= 85°C 14.5 450 nA
Measured at VIN = VRWM,TA= 105°C 65 1500 nA
VFForward Voltage IIN = 1 mA from GND to IO 0.25 0.5 0.65 V
VBR Break-down Voltage IIN = 1 mA from IO to GND 29.3 31.2 33.9 V
VFCLAMP Forward Clamp Voltage 40 A IEC 61000-4-5 Surge (8/20 µs)
from GND to IO, 27°C 1 2 5 V
VCLAMP Clamp Voltage
24 A IEC 61000-4-5 Surge (8/20 µs)
from IO to GND, VIN = 0 V before surge,
27°C 32.2 33.9 V
40 AIEC 61000-4-5 Surge (8/20 µs) from
IO to GND, VIN = 0 V before surge, 27°C 32.5 34.1 V
35 A IEC 61000-4-5 Surge (8/20 µs)
from IO to GND, VIN = Vrwm before
surge, TA= 125°C 33 35 V
RDYN 8/20 µs surge dynamic resistance Calculated from VCLAMP at .5*Ipp and Ipp
surge current levels, 27°C 30 mΩ
CIN Input pin capacitance VIN = VRWM, f = 1 MHz, 30 mVpp, IO to
GND 100 pF
SR Maximum Slew Rate 0-VRWM rising edge, sweep rise time and
measure slew rate when IPK = 1 mA,
27°C
2.5 V/µs
0-VRWM rising edge, sweep rise time and
measure slew rate when IPK = 1 mA,
105°C 0.7 V/µs
l TEXAS INSTRUMENTS 450 my 07
Voltage (V)
Current (mA)
-5 0 5 10 15 20 25 30 35
0
0.5
1
-0.5
-1
D005
-40qC
25qC
105qC
125qC
Temperature (°C)
Voltage (V)
-40 -20 0 20 40 60 80 100 120 140
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
D006
Temperature (qC)
Leakage (nA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
100
200
300
400
500
D004
Time (Ps)
Voltage (V) / Surge Current (A)
-5
0
5
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60
D001
TVS2700 Voltage
Surge Current
Time (Ps)
Voltage (V) / Surge Current (A)
-5
0
5
10
15
20
25
30
35
40
0 10 20 30 40 50 60
D002
-40qC
25qC
105qC
125qC
Current (A)
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7.7 Typical Characteristics
Figure 1. Surge Response at 40 A Figure 2. Surge Response at 35 A Across Temperature
f = 1 MHz, 30 mVpp, IO to GND
Figure 3. Capacitance vs Temperature Across Bias Figure 4. Leakage Current vs Temperature at 27 V
Figure 5. IV Across Temperature Figure 6. Forward Voltage vs Temperature Across Current
l TEXAS INSTRUMENTS 32:
Slew Rate (V/Ps)
Dynamic Leakage (mA)
0 0.5 1 1.5 2 2.5 3
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
6.5
7
7.5
8
D009
-40qC
25qC
85qC
105qC
125qC
Temperature (qC)
Voltage (V)
-40 -25 -10 5 20 35 50 65 80 95 110 125
30
30.25
30.5
30.75
31
31.25
31.5
31.75
32
32.25
32.5
D007
Temperature (qC)
IPP (A)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0
5
10
15
20
25
30
35
40
45
D008
8
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Typical Characteristics (continued)
Figure 7. Breakdown Voltage at 1 mA vs Temperature Figure 8. Max Surge Current (8/20 µs) vs Temperature
Figure 9. Maximum Leakage vs Signal Slew Rate across Temperature
l TEXAS INSTRUMENTS
Voltage Level
Detection Power FET
Driver
IN
GND
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8 Detailed Description
8.1 Overview
The TVS2700 is a precision clamp with a low, flat clamping voltage during transient overvoltage events like surge
and protecting the system with zero voltage overshoot. For a detailed overview of the Flat-Clamp family of
devices, please reference TI's Flat-Clamp surge protection technology for efficient system protection white paper.
This document explains in detail the functional operation of the devices and how they impact and improve system
design.
8.2 Functional Block Diagram
8.3 Feature Description
The TVS2700 is a precision clamp that handles 40 A of IEC 61000-4-5 8/20 µs surge pulse. The flat clamping
feature helps keep the clamping voltage very low to keep the downstream circuits from being stressed. The flat
clamping feature can also help end-equipment designers save cost by opening up the possibility to use lower-
cost lower voltage tolerant downstream ICs. The TVS2700 has minimal leakage under the standoff voltage of 27
V, making it an ideal candidate for applications where low leakage and power dissipation is a necessity. IEC
61000-4-2 and IEC 61000-4-4 ratings make it a robust protection solution for ESD and EFT events. Wide
ambient temperature range of –40°C to +125°C makes it a good candidate for most applications. Compact
packages enable it to be used in small devices and save board area.
8.4 Reliability Testing
To ensure device reliability, the TV2700 is characterized against 5000 repetitive pulses of 35 A IEC 61000-4-5
8/20 µs surge pulses at 125°C. The test is performed with less than 10 seconds between each pulse at high
temperature to simulate worst case scenarios for fault regulation. After each surge pulse, the TVS2700 clamping
voltage, breakdown voltage, and leakage are recorded to ensure that there is no variation or performance
degradation. By ensuring robust, reliable, high temperature protection, the TVS2700 enables fault protection in
applications that must withstand years of continuous operation with no performance change.
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8.5 Device Functional Modes
8.5.1 Protection Specifications
The TVS2700 is specified according to both the IEC 61000-4-5 and IEC 61643-321 standards. This enables
usage in systems regardless of which standard is required in relevant product standards or best matches
measured fault conditions. The IEC 61000-4-5 standard requires protection against a pulse with a rise time of 8
µs and a half length of 20 µs while the IEC 61643-321 standard requires protection against a much longer pulse
with a rise time of 10 µs and a half length of 1000 µs.
The positive and negative surges are imposed to the TVS2700 by a combinational waveform generator (CWG)
with a 2-Ωcoupling resistor at different peak voltage levels. For powered on transient tests that need power
supply bias, inductances are usually used to decouple the transient stress and protect the power supply. The
TVS2700 is post tested by guaranteeing that there is no shift in device breakdown or leakage at Vrwm.
In addition, the TVS2700 has been tested according to IEC 61000-4-5 to pass a ±1 kV surge test through a 42-Ω
coupling resistor and a 0.5 µF capacitor. This test is a common test requirement for industrial signal I/O lines and
the TVS2700 will serve an ideal protection solution for applications with that requirement.
The TVS2700 also integrates IEC 61000-4-2 Level 4 ESD Protection and 80 A of IEC 61000-4-4 EFT Protection.
These combine to ensure that the device can protect against all transient conditions regardless of length or type.
For more information on TI's test methods for Surge, ESD, and EFT testing, reference TI's IEC 61000-4-x
Testing Application Note.
8.5.2 Minimal Derating
Unlike traditional diodes the TVS2700 has very little derating of max power dissipation and ensures robust
performance up to 125°C shown in Figure 8 . Traditional TVS diodes lose up to 50% of their current carrying
capability when at high temperatures, so a surge pulse above 85°C ambient can cause failures that are not seen
at room temperature. The TVS2700 prevents this and ensures that you will see the same level of protection
regardless of temperature.
8.5.3 Transient Performance
During large transient swings, the TVS2700 will begin clamping the input signal to protect downstream
conditions. While this prevents damage during fault conditions, it can cause leakage when the intended input
signal has a fast slew rate. In order to keep power dissipation low and remove the chance of signal distortion, it
is recommended to keep the slew rate of any input signal on the TVS2700 below 2.5 V/µs at room temperature
and below 0.7 V/µs at 125°C shown in Figure 9. Faster slew rates will cause the device to clamp the input signal
and draw current through the device for a few microseconds, increasing the rise time of the signal. This will not
cause any harm to the system or to the device, however if the fast input voltage swings occur regularly it can
cause device overheating.
l TEXAS INSTRUMENTS Vlnvul '” MUX36DO4 TVSZ700 GND GND f
11
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TVS2700 can be used to protect any power, analog, or digital signal from transient fault conditions caused
by the environment or other electrical components.
9.2 Typical Application
Figure 10. TVS2700 Application Schematic
9.2.1 Design Requirements
A typical operation for the TVS2700 would be in a multi-channel PLC protecting an analog input, shown in
Figure 10. In this example, a TVS2700 is protecting the input to a MUX36D04, a four channel input multiplexer
with a supply max at 36 V. Without any input protection, if a surge event is caused by lightning, coupling, ringing,
or any other fault condition this input voltage will rise to hundreds of volts for multiple microseconds, violating the
absolute maximum input voltage and harming the device. An ideal surge protection diode will maximize the
useable voltage range while still clamping at a safe level for the system, so TI's Flat-Clamp technology provides
the best protection solution.
9.2.2 Detailed Design Procedure
If the TVS2700 is in place to protect the device, during a surge event the voltage will rise to the breakdown of the
diode at 31.2 V, and then the TVS2700 will turn on, shunting the surge current to ground. With the low dynamic
resistance of the TVS2700, even large amounts of surge current will have minimal impact on the clamping
voltage. The dynamic resistance of the TVS2700 is around 30 mΩ, which means 40 A of surge current will cause
a voltage raise of 40 A × 30 mΩ= 1.2 V. Because the device turns on at 31 V, this means the module input will
be exposed to a maximum of 31.2 V + 1.2 V = 33.3 V during surge pulses, well within the MUX36D04 absolute
maximum. This pulse is shown in Figure 11 and ensures robust protection of the circuit.
l TEXAS INSTRUMENTS
Time (Ps)
Voltage (V) / Surge Current (A)
-5
0
5
10
15
20
25
30
35
40
45
0 10 20 30 40 50 60
D001
TVS2700 Voltage
Surge Current
12
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Typical Application (continued)
Finally, the small size of the device also improves fault protection by lowering the effect of fault current coupling
onto neighboring traces. The small form factor of the TVS2700 allows the device to be placed extremely close to
the input connector, lowering the length of the path fault current will take through the system compared to larger
protection solutions.
9.2.3 Application Curves
Figure 11. TVS2700 Surge Response at 40 A
9.2.4 Configuration Options
The TVS2700 can be used in either unidirectional or bidirectional configuration. The TVS2700 shows
unidirectional usage to protect an input. By placing two TVS2700's in series with reverse orientation, bidirectional
operation can be utilized which will allow a working voltage of ±27 V. The TVS2700 operation in bidirectional will
be similar to unidirectional operation, with a minor increase in breakdown voltage and clamping voltage. The
TVS3300 bidirectional performance has been characterized in the TVS3300 Configurations Characterization.
While the TVS2700 in bidirectional configuration has not specifically been characterized, it will have similar
relative changes to the TVS3300 in bidirectional configuration.
10 Power Supply Recommendations
The TVS2700 is a clamping device so there is no need to power it. Be careful not to violate the recommended
VIN voltage range (0 V to 27 V) to ensure the device functions properly.
*9 TEXAS INSTRUMENTS
GND Plane
GND
GND
GND
GND
I/O
I/O
I/O
Connector
Input Protected
Input
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11 Layout
11.1 Layout Guidelines
The optimum placement is as close to the connector as possible. EMI during an ESD event can couple from the
trace being struck to other nearby unprotected traces, resulting in early system failures. The PCB designer must
minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which
are between the TVS and the connector.
Route the protected traces as straight as possible.
Eliminate any sharp corners on the protected traces between the TVS2700 and the connector by using rounded
corners with the largest radii possible. Electric fields tend to build up on corners, increasing EMI coupling.
11.2 Layout Example
Figure 12. TVS2700 Layout
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12 Device and Documentation Support
12.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Samples
PACKAGE OPTION ADDENDUM
www.ti.com 28-Sep-2021
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TVS2700DRVR ACTIVE WSON DRV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 1HTH
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
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I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “KO '«PT» Reel Diame|er AD Dimension des‘gned to accommodate the componem wwdlh E0 Dimension damned to eccemmodam the component \ength KO Dimenslun desgned to accommodate the componem thickness 7 w Overen with loe earner cape i p1 Pitch between successwe cavuy eemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pocket Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TVS2700DRVR WSON DRV 6 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Mar-2018
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TVS2700DRVR WSON DRV 6 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Mar-2018
Pack Materials-Page 2
I TEXAS INSTRUMENTS
GENERIC PACKAGE VIEW
Images above are just a representation of the package family, actual package may vary.
Refer to the product data sheet for package details.
DRV 6 WSON - 0.8 mm max height
PLASTIC SMALL OUTLINE - NO LEAD
4206925/F
% W C :1 v _ W dfiN g}gfi @ DJ
www.ti.com
PACKAGE OUTLINE
C
6X 0.35
0.25
1.6 0.1
6X 0.3
0.2
2X
1.3
1 0.1
4X 0.65
0.8
0.7
0.05
0.00
B2.1
1.9 A
2.1
1.9
(0.2) TYP
WSON - 0.8 mm max heightDRV0006A
PLASTIC SMALL OUTLINE - NO LEAD
4222173/B 04/2018
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
34
6
(OPTIONAL)
PIN 1 ID
0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
7
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 5.500
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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1)
4X (0.65)
(1.95)
6X (0.3)
6X (0.45)
(1.6)
(R0.05) TYP
( 0.2) VIA
TYP
(1.1)
WSON - 0.8 mm max heightDRV0006A
PLASTIC SMALL OUTLINE - NO LEAD
4222173/B 04/2018
SYMM
1
34
6
SYMM
LAND PATTERN EXAMPLE
SCALE:25X
7
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
www.ti.com
EXAMPLE STENCIL DESIGN
6X (0.3)
6X (0.45)
4X (0.65)
(0.7)
(1)
(1.95)
(R0.05) TYP
(0.45)
WSON - 0.8 mm max heightDRV0006A
PLASTIC SMALL OUTLINE - NO LEAD
4222173/B 04/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD #7
88% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:30X
SYMM
1
34
6
SYMM
METAL
7
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