TMP300 Datasheet by Texas Instruments

V'.‘ 1!. B X E I TEXAS INSTRUMENTS
RPULL-UP
210kW(1)
RSET
TSET
OUT
V+
HYSTSET
VTEMP
TMP300
3 AmProportional
to TA
1
2
3
6
5
4
V+
VTEMP
HYSTSET
TSET
GND
OUT
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
TMP300 1.8-V, Resistor-Programmable Temperature Switch and
Analog Out Temperature Sensor in SC70
1
1 Features
1• Accuracy: ±1°C (Typical at +25°C)
• Programmable Trip Point
• Programmable Hysteresis: 5°C/10°C
• Open-Drain Outputs
• Low Power: 110μA (Max)
• Wide Voltage Range: +1.8V to +18V
• Temperature Range: –40°C to +125°C
• Analog Out: 10mV/°C
• SC70-6 and SOT23-6 Packages
2 Applications
• Power-supply Systems
• DC-DC Modules
• Thermal Monitoring
• Electronic Protection Systems
3 Description
The TMP300 is a low-power, resistor-programmable,
digital output temperature switch. The device allows a
threshold point to be set by adding an external
resistor. Two levels of hysteresis are available. The
TMP300 has a VTEMP analog output that can be used
as a testing point or in temperature-compensation
loops.
With a supply voltage as low as 1.8V and low current
consumption, the TMP300 is ideal for power-sensitive
systems.
Available in two micropackages that have proven
thermal characteristics, this part gives a complete and
simple solution for users who need simple and
reliable thermal management.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TMP300 SOT-23 (6) 2.90 mm × 1.60 mm
SC70 (6) 2.00 mm × 1.25 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Pinout Application Schematic
NOTE: (1) Thinfilm resistor with
approximately 10% accuracy; however, this
accuracy error is trimmed out at the factory.
l TEXAS INSTRUMENTS
2
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description ............................................................. 1
4 Revision History..................................................... 2
5 Pin Configuration and Functions......................... 3
6 Specifications......................................................... 4
6.1 Absolute Maximum Ratings ..................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Electrical Characteristics........................................... 5
6.4 Typical Characteristics.............................................. 6
7 Detailed Description.............................................. 8
7.1 Overview ................................................................... 8
7.2 Feature Description................................................... 8
8 Device and Documentation Support.................. 12
8.1 Receiving Notification of Documentation Updates.. 12
8.2 Community Resources............................................ 12
8.3 Trademarks............................................................. 12
8.4 Electrostatic Discharge Caution.............................. 12
8.5 Glossary.................................................................. 12
9 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
Changes from Revision D (January 2016) to Revision E Page
• Added Pin Configuration and Functions section ................................................................................................................... 3
Changes from Revision C (January 2011) to Revision D Page
• Added Device Information table, ESD Ratings table, Feature Description section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section................................................................ 1
• Changed Temperature Range Features bullet ...................................................................................................................... 1
• Added package names to pinout ........................................................................................................................................... 1
• Deleted Ordering Information table ....................................................................................................................................... 4
• Changed Temperature Range, TA, Functional Range parameter name in Electrical Characteristics table.......................... 5
• Added footnote 4 to Electrical Characteristics table .............................................................................................................. 5
Changes from Revision B (November 2008) to Revision C Page
• Deleted second sentence from Description section ............................................................................................................... 1
• Added TMP300B grade device specifications to Electrical Characteristics table .................................................................. 5
l TEXAS INSTRUMENTS
1TSET 6 V+
2GND 5 VTEMP
3OUT 4 HYSTSET
Not to scale
3
TMP300
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5 Pin Configuration and Functions
DCK and DBV Package
6-Pin SOT-23 and SC70
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
TSET 1 I Temperature set pin. Connects to a resistor to set the trip point
GND 2 — Ground
OUT 3 O Trip output
HYSTSET 4 I Hystersis Set. Connect to Ground for 5°C hysteresis or connect to V+ for 10°C hysteresis
VTEMP 5 I Analog Temperature output
V+ 6 O Supply voltage: 1.8 V to 18 V
l TEXAS INSTRUMENTS
4
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
www.ti.com
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) Input pins are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5V beyond the supply rails should be
current limited to 10mA or less.
(3) Short-circuit to ground.
6 Specifications
6.1 Absolute Maximum Ratings(1)
MIN MAX UNIT
V+ Supply voltage +18 V
Signal input pins, voltage(2) –0.5 (V+) + 0.5 V
Signal input pins, current(2) –10 10 mA
ISC Output short-circuit(3) Continuous
Open-drain output (V+) + 0.5 V
TAFunctional temperature –40 +150 °C
Tstg Storage temperature –55 +150 °C
TJJunction temperature +150 °C
6.2 ESD Ratings
VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM) ±4000 V
Charged-device model (CDM) ±1000
l TEXAS INSTRUMENTS
5
TMP300
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(1) 100% of production is tested at TA= +85°C. Specifications over temperature range are ensured by design.
(2) Shaded cells indicate characteristic performance difference.
(3) See Figure 1 for typical quiescent current.
(4) The TMP300 is functional over this range and no indication of performance is implied.
6.3 Electrical Characteristics
At VS= 3.3V and TA= –40°C to +125°C, unless otherwise noted.
PARAMETER TEST CONDITIONS
TMP300 TMP300B
UNITMIN(1) TYP(1) MAX(1) MIN TYP MAX
TEMPERATURE MEASUREMENT
Measurement range
VS= 2.35V to 18V –40 +125 –40 +125
°C
VS= 1.8V to 2.35V –40 100 ×
(VS– 0.95) –40 100 ×
(VS– 0.95)
TRIP POINT
Total accuracy TA= –40°C to +125°C ±2 ±4(2) ±2 ±6 °C
RSET equation TCis in °C RSET = 10 (50 + TC)/3 RSET = 10 (50 + TC)/3 kΩ
HYSTERESIS SET INPUT
LOW threshold 0.4 0.4 V
HIGH threshold VS– 0.4 VS– 0.4 V
Threshold hysteresis HYSTSET = GND 5 5 °C
HYSTSET = VS10 10
DIGITAL OUTPUT
Logic family CMOS CMOS
Open-drain leakage current OUT = VS10 10 μA
VOL Logic levels VS= 1.8V to 18V, ISINK =
5mA 0.3 0.3 V
ANALOG OUTPUT
Accuracy ±2 ±3 ±2 ±5 °C
Temperature sensitivity 10 10 mV/°C
Output voltage TA= +25°C 720 750 780 720 750 780 mV
VTEMP pin output resistance 210 210 kΩ
POWER SUPPLY
IQQuiescent current(3) VS= 1.8V to 18V,
TA= –40°C to +125°C 110 110 μA
TEMPERATURE RANGE
TA
Specified range
VS= 2.35V to 18V –40 +125 –40 +125
°C
VS= 1.8V to 2.35V –40 100 ×
(VS– 0.95) –40 100 ×
(VS– 0.95)
Functional range(4) VS= 2.35V to 18V –40 +150 –40 +150
VS= 1.8V to 2.35V –50 100 ×
(VS– 0.95) –50 100 ×
(VS– 0.95)
θJA Thermal resistance SC70 250 250 °C/W
SOT23-6 180 180
i TEXAS INSTRUMENTS \\ \ \\
-40 -25 0
3.0
2.0
-3.0
25 50 75 100 125
Temperature( C)°
Error( C)°
1.5
-2.0
1.0
-2.5
2.5
0.5
0
-0.5
-1.0
-1.5
-40 -25 0
700
600
500
400
300
200
100
0
25 50 75 100 125
Temperature(°C)
R (k )W
SET
-40 -25 0
4.0
-4.0
25 50 75 100 125
Temperature( C)°
Error( C)°
2.0
-1.0
1.0
0
-2.0
-3.0
3.0
-40 -25 0
95
85
45
25 50 75 100 125
Temperature( C)°
I ( A)m
Q
75
55
65
V =18V
S
V =3.3V
S
V =1.8V
S
-40 -25 0
2.0
1.5
1.0
0.5
0
-0.5
-1.0
-1.5
-2.0
25 50 75 100 125
Temperature( C)°
Error( C)°
T +1%
ERROR
TERROR -1%
T +0.1%
ERROR
TERROR -0.1%
6
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
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6.4 Typical Characteristics
At VS= 5V, unless otherwise noted.
Figure 1. Quiescent Current Over Temperature and Supply Figure 2. RSET Shift Resulting From RSET Tolerance
Figure 3. RSET vs Temperature Figure 4. Typical Trip Error
Figure 5. Typical Analog Output Error Figure 6. Analog PSR Over Temperature
l TEXAS INSTRUMENTS
7
TMP300
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Typical Characteristics (continued)
At VS= 5V, unless otherwise noted.
Figure 7. Trip PSR Over Temperature
l TEXAS INSTRUMENTS 3e
RINT
210kW
RSET
TSET
OUT
V+
HYSTSET
VTEMP
TMP300
3 AmProportional
toTA
Open-DrainControl
Voltagesource
totesttrippoint.
R ink =W
SET
10(50+T )
SET
3
R =
SET
(T 0.01+0.5)´
SET
3e-6
8
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
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Product Folder Links: TMP300
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7 Detailed Description
7.1 Overview
The TMP300 is a thermal sensor designed for over-temperature protection circuits in electronic systems. The
TMP300 uses a set resistor to program the trip temperature of the digital output. An additional high-impedance
(210kΩ) analog voltage output provides the temperature reading.
7.2 Feature Description
7.2.1 Calculating RSET
The set resistor (RSET) provides a threshold voltage for the comparator input. The TMP300 trips when the VTEMP
pin exceeds the TSET voltage. The value of the set resistor is determined by the analog output function and the
3μA internal bias current.
To set the TMP300 to trip at a preset value, calculate the RSET resistor value according to Equation 1 or
Equation 2:
where
• TSET is in °C; or (1)
where
• TSET is in °C. (2)
7.2.2 Using VTEMP to Trip the Digital Output
The analog voltage output can also serve as a voltage input that forces a trip of the digital output to simulate a
thermal event. This simulation facilitates easy system design and test of thermal safety circuits, as shown in
Figure 8.
Figure 8. Applying Voltage to Trip Digital Output
l TEXAS INSTRUMENTS
-50 -25 0
1.00
0.75
0.50
0.25
0
-0.25
-0.50
-0.75
-1.00
25 50 75 100 125
Temperature( C)°
TripSetVoltageError( C)°
210kW
TSET
OUT
V+
HYSTSET
VTEMP
TMP300
3 AmProportional
toTA
AnalogOut
OPA335
9
TMP300
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Feature Description (continued)
7.2.3 Analog Temperature Output
The analog out or VTEMP pin is high-impedance (210kΩ). Avoid loading this pin to prevent degrading the analog
out value or trip point. Buffer the output of this pin when used for direct thermal measurement. Figure 9 shows
buffering of the analog output signal.
Figure 9. Buffering the Analog Output Signal
7.2.4 Using a DAC to Set the Trip Point
The trip point is easily converted by changing the digital-to-analog converter (DAC) code. This technique can be
useful for control loops where a large thermal mass is being brought up to the set temperature and the OUT pin
is used to control the heating element. The analog output can be monitored in a control algorithm that adjusts the
set temperature to prevent overshoot. Trip set voltage error versus temperature is shown in Figure 10, which
shows error in °C of the comparator input over temperature. An alternative method of setting the trip point by
using a DAC is illustrated in Figure 11.
Figure 10. Trip Set Voltage Error vs Temperature
l TEXAS INSTRUMENTS
-50 -25 0
5
4
3
2
1
0
-1
-2
-3
-4
-5
25 50 75 100 125
Temperature( C)°
Error( C)°
Maximum
Average Minimum
-50 -25 0
5
4
3
2
1
0
-1
-2
-3
-4
-5
25 50 75 100 125
Temperature( C)°
Error( C)°
Maximum
Average Minimum
210kW
TSET
OUT
V+
HYSTSET
VTEMP
TMP300
3 AmProportional
toTA
Open-DrainControl
Voltagesource
totesttrippoint.
DAC8560
10
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
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Feature Description (continued)
Figure 11. DAC Generates the Voltage-Driving TSET Pin
7.2.5 Hysteresis
The hysteresis pin has two settings. Grounding HYSTSET results in 5°C of hysteresis. Connecting HYSTSET to VS
results in 10°C of hysteresis. Hysteresis error variation over temperature is shown in Figure 12 and Figure 13.
Figure 12. 5°C Hysteresis Error vs Temperature Figure 13. 10°C Hysteresis Error vs Temperature
‘5‘ TEXAS INSTRUMENTS ‘W—Hi HF WWH
210kW
RSET
CBYPASS
TSET
OUT
V+
HYSTSET
VTEMP
TMP300
3 AmProportional
toTA
Open-DrainControl
CBYPASS
11
TMP300
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Feature Description (continued)
Use bypass capacitors on the supplies as well as on the RSET and analog out (VTEMP) pins when in noisy
environments, as shown in Figure 14. These capacitors reduce premature triggering of the comparator.
Figure 14. Bypass Capacitors Prevent Early Comparator Toggling Due to Circuit Board Noise
l TEXAS INSTRUMENTS
12
TMP300
SBOS335E –JUNE 2005–REVISED DECEMBER 2018
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8 Device and Documentation Support
8.1 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
8.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
8.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
8.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
8.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
9 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
I TEXAS INSTRUMENTS Samples Sample: Sample: Samples
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TMP300AIDBVR NRND SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T300
TMP300AIDBVT NRND SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 T300
TMP300AIDCKR NRND SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 BPN
TMP300AIDCKT NRND SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 BPN
TMP300BIDBVR ACTIVE SOT-23 DBV 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 DUDC
TMP300BIDBVT ACTIVE SOT-23 DBV 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 DUDC
TMP300BIDCKR ACTIVE SC70 DCK 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 QWL
TMP300BIDCKT ACTIVE SC70 DCK 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 QWL
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP300 :
•Automotive: TMP300-Q1
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I+Ko '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w OveraH Wiotn ot the carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE DOODOOOD ,,,,,,,,,,, ‘ User Direcllon 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP300AIDBVR SOT-23 DBV 6 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TMP300AIDBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TMP300AIDCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TMP300AIDCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TMP300BIDBVR SOT-23 DBV 6 3000 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TMP300BIDBVT SOT-23 DBV 6 250 179.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TMP300BIDCKR SC70 DCK 6 3000 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
TMP300BIDCKT SC70 DCK 6 250 179.0 8.4 2.2 2.5 1.2 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2021
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP300AIDBVR SOT-23 DBV 6 3000 200.0 183.0 25.0
TMP300AIDBVT SOT-23 DBV 6 250 200.0 183.0 25.0
TMP300AIDCKR SC70 DCK 6 3000 200.0 183.0 25.0
TMP300AIDCKT SC70 DCK 6 250 200.0 183.0 25.0
TMP300BIDBVR SOT-23 DBV 6 3000 200.0 183.0 25.0
TMP300BIDBVT SOT-23 DBV 6 250 200.0 183.0 25.0
TMP300BIDCKR SC70 DCK 6 3000 200.0 183.0 25.0
TMP300BIDCKT SC70 DCK 6 250 200.0 183.0 25.0
PACKAGE MATERIALS INFORMATION
www.ti.com 5-Jan-2021
Pack Materials-Page 2
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0.25
3.0
2.6
2X 0.95
1.45 MAX
0.15
0.00 TYP
6X 0.50
0.25
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.25 per side.
4. Leads 1,2,3 may be wider than leads 4,5,6 for package orientation.
5. Refernce JEDEC MO-178.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
6
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
6X (1.1)
6X (0.6)
(2.6)
2X (0.95)
(R0.05) TYP
4214840/C 06/2021
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
6
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
2X(0.95)
6X (1.1)
6X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0006A
SMALL OUTLINE TRANSISTOR
4214840/C 06/2021
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
6
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