EM7565 Tech Specifications Datasheet by Sierra Wireless AirLink

33.32?! SIERRA WIRELESS’
AirPrime EM7565
Product Technical Specification
41110788
Rev 5
Proprietary and Confidential
Contents subject to change
Product Technical Specification
Rev 5 Jul.17 2 41110788
Important
Notice
Due to the nature of wireless communications, transmission and reception of data
can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be
totally lost. Although significant delays or losses of data are rare when wireless
devices such as the Sierra Wireless modem are used in a normal manner with a
well-constructed network, the Sierra Wireless modem should not be used in
situations where failure to transmit or receive data could result in damage of any
kind to the user or any other party, including but not limited to personal injury,
death, or loss of property. Sierra Wireless accepts no responsibility for damages
of any kind resulting from delays or errors in data transmitted or received using
the Sierra Wireless modem, or for failure of the Sierra Wireless modem to
transmit or receive such data.
Safety and
Hazards
Do not operate the Sierra Wireless modem in areas where blasting is in progress,
where explosive atmospheres may be present, near medical equipment, near life
support equipment, or any equipment which may be susceptible to any form of
radio interference. In such areas, the Sierra Wireless modem MUST BE
POWERED OFF. The Sierra Wireless modem can transmit signals that could
interfere with this equipment.
Do not operate the Sierra Wireless modem in any aircraft, whether the aircraft is
on the ground or in flight. In aircraft, the Sierra Wireless modem MUST BE
POWERED OFF. When operating, the Sierra Wireless modem can transmit
signals that could interfere with various onboard systems.
Note: Some airlines may permit the use of cellular phones while the aircraft is on the
ground and the door is open. Sierra Wireless modems may be used at this time.
The driver or operator of any vehicle should not operate the Sierra Wireless
modem while in control of a vehicle. Doing so will detract from the driver or
operator's control and operation of that vehicle. In some states and provinces,
operating such communications devices while in control of a vehicle is an offence.
Limitation of
Liability
The information in this manual is subject to change without notice and does not
represent a commitment on the part of Sierra Wireless. SIERRA WIRELESS AND
ITS AFFILIATES SPECIFICALLY DISCLAIM LIABILITY FOR ANY AND ALL
DIRECT, INDIRECT, SPECIAL, GENERAL, INCIDENTAL, CONSEQUENTIAL,
PUNITIVE OR EXEMPLARY DAMAGES INCLUDING, BUT NOT LIMITED TO,
LOSS OF PROFITS OR REVENUE OR ANTICIPATED PROFITS OR REVENUE
ARISING OUT OF THE USE OR INABILITY TO USE ANY SIERRA WIRELESS
PRODUCT, EVEN IF SIERRA WIRELESS AND/OR ITS AFFILIATES HAS BEEN
ADVISED OF THE POSSIBILITY OF SUCH DAMAGES OR THEY ARE
FORESEEABLE OR FOR CLAIMS BY ANY THIRD PARTY.
Notwithstanding the foregoing, in no event shall Sierra Wireless and/or its
affiliates aggregate liability arising under or in connection with the Sierra Wireless
product, regardless of the number of events, occurrences, or claims giving rise to
liability, be in excess of the price paid by the purchaser for the Sierra Wireless
product.
Preface
Rev 5 Jul.17 3 41110788
Patents This product may contain technology developed by or for Sierra Wireless Inc. This
product includes technology licensed from QUALCOMM®. This product is
manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more
patents licensed from InterDigital Group and MMP Portfolio Licensing.
Copyright ©2017 Sierra Wireless. All rights reserved.
Trademarks Sierra Wireless®, AirPrime®, AirLink®, AirVantage® and the Sierra Wireless logo
are registered trademarks of Sierra Wireless, Inc.
Windows® and Windows Vista® are registered trademarks of Microsoft
Corporation.
QUALCOMM® is a registered trademark of QUALCOMM Incorporated. Used
under license.
Other trademarks are the property of their respective owners.
Contact
Information
Revision
History
Sales information and technical
support, including warranty and returns Web: sierrawireless.com/company/contact-us/
Global toll-free number: 1-877-687-7795
6:00 am to 6:00 pm PST
Corporate and product information Web: sierrawireless.com
Revision
number Release date Changes
1April 2017 Initial release
2June 2017 Added Power On/Off Timing for the USB section
3June 2017 Updated notes indicating how long host must wait to drive signals at power-on (in Host
Interface Pin Assignments, Power On/Off Timing for the USB, and Power On Timing
for PCIe Port)
4June 2017 Corrected appendix table/figure numbering and TOC formatting
5July 2017 Added uplink carrier aggregation combinations
Removed Bands 252/255
—>>I
Rev 5 Jul.17 4 41110788
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11
Supported RF bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Physical Features. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application Interface Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Modem Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
LTE Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Short Message Service (SMS) Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Position Location (GNSS). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Supporting Documents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Required Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Ordering Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Integration Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16
Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17
Host Interface Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
USB Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
USB Throughput Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
User-developed Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .27
PCIe Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
SIM Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
SIM Implementation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .30
Control Interface (Signals) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
WAKE_ON_WAN# — Wake Host . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .31
W_DISABLE# (Wireless Disable) and GPS_DISABLE# (GNSS Disable) . . . . . . . .32
Full_Card_Power_Off# and RESET# . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
WWAN_LED#—LED Output . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .33
Antenna Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Contents
Rev 5 Jul.17 5 41110788
RF Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
RF Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Shielding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Antenna and Cabling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Ground Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Interference and Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Interference from Other Wireless Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Host-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Device-generated RF Interference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Methods to Mitigate Decreased Rx Performance . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Radiated Spurious Emissions (RSE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Radiated Sensitivity Measurement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Sierra Wireless’ Sensitivity Testing and Desensitization Investigation . . . . . . . . . . 39
Sensitivity vs. Frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Supported Frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
Conducted Rx Sensitivity / Tx Power. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
GNSS Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Power Consumption. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Module Power States. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Power State Transitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
Power Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Power Ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Power Supply Noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
SED (Smart Error Detection) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Tx Power Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Software Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Support Tools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Host Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Product Technical Specification
Rev 5 Jul.17 6 41110788
Mechanical and Environmental Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Device Views . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Labeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Electrostatic Discharge (ESD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Thermal Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Module Integration Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 59
Regulatory Compliance and Industry Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Important Notice. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Safety and Hazards . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Important Compliance Information for North American Users . . . . . . . . . . . . . . . . . . . 61
Audio Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .64
PCM/I2S Audio Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Antenna Specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Recommended Main/Diversity Antenna Specifications. . . . . . . . . . . . . . . . . . . . . . . . 68
Recommended GNSS Antenna Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Antenna Tests . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Design Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
AT Command Entry Timing Requirement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Acceptance Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Acceptance Test Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 74
Acceptance Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Certification Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Production Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Contents
Rev 5 Jul.17 7 41110788
Functional Production Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Production Test Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
UMTS (WCDMA) RF Transmission Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78
LTE RF Transmission Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80
UMTS (WCDMA) RF Receive Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
LTE RF Receive Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
GNSS RF Receive Path Test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 86
Quality Assurance Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Suggested Testing Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Testing Assistance Provided by Sierra Wireless . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
IOT/Operator Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Extended AT Commands for Testing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 90
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Sierra Wireless Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Command Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Other Sierra Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Industry/Other Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Acronyms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Index. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
—>>I
Rev 5 Jul.17 8 41110788
List of Tables
Table 1-1: Supported RF Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 1-2: Carrier Aggregation Combinations . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 1-3: Required Host-Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . 14
Table 2-1: Standards Compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Table 3-1: Host Interface (75-pin) Connections—Module View . . . . . . . . . . . . 21
Table 3-2: Power and Ground Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 3-3: USB Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Table 3-4: PCIe Interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Table 3-5: SIM Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Table 3-6: Module Control Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Table 3-7: W_DISABLE#/GPS_DISABLE# Usage . . . . . . . . . . . . . . . . . . . . . . 32
Table 3-8: Full_Card_Power_Off# and RESET# Usage . . . . . . . . . . . . . . . . . . 33
Table 3-9: Antenna Control Signals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Table 4-1: LTE Frequency Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Table 4-2: LTE Bandwidth Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Table 4-3: WCDMA Frequency Bands Support. . . . . . . . . . . . . . . . . . . . . . . . . 42
Table 4-4: Conducted Rx (Receive) Sensitivity—LTE Bands . . . . . . . . . . . . . . 43
Table 4-5: Conducted Rx (Receive) Sensitivity—UMTS Bands . . . . . . . . . . . . 44
Table 4-6: Conducted Tx (Transmit) Power Tolerances . . . . . . . . . . . . . . . . . . 44
Table 4-7: GNSS Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Table 5-1: Averaged Standby DC Power Consumption. . . . . . . . . . . . . . . . . . . 46
Table 5-2: Averaged Call Mode DC Power Consumption . . . . . . . . . . . . . . . . . 47
Table 5-3: Miscellaneous DC Power Consumption . . . . . . . . . . . . . . . . . . . . . . 47
Table 5-4: Module Power States . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
Table 5-5: Power State Transition Trigger Levels . . . . . . . . . . . . . . . . . . . . . . . 49
Table 5-6: USB 2.0 Power-On/Off Timing Parameters (Double Enumeration) . 51
Table 5-7: USB 2.0 Power-On/Off Timing Parameters (Single Enumeration). . 51
Table 5-8: USB 3.0 Power-On/Off Timing Parameters (Single Enumeration). . 51
Table 5-9: PCIe Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table 5-10: Dynamic Power Control of SAR Backoff State . . . . . . . . . . . . . . . . 53
Contents
Rev 5 Jul.17 9 41110788
Table 7-1: Mechanical and Environmental Specifications. . . . . . . . . . . . . . . . . 55
Table 8-1: Antenna Gain Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
Table 8-2: Collocated Radio Transmitter Specifications . . . . . . . . . . . . . . . . . . 62
Table A-1: Host interface (67-pin) Connections—Module View . . . . . . . . . . . . 64
Table A-2: PCM/I2S Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Table A-3: PCM Timing. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Table A-4: Master Transmitter with Data Rate = 3.072 MHz (±10%) . . . . . . . . 67
Table B-1: Antenna Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
Table B-2: GNSS Antenna Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
Table C-1: Hardware Integration Design Considerations . . . . . . . . . . . . . . . . . 72
Table D-1: Test Settings—UMTS Transmission Path . . . . . . . . . . . . . . . . . . . 78
Table D-2: Test Settings—LTE Transmission Path . . . . . . . . . . . . . . . . . . . . . 80
Table D-3: Test Settings—UMTS Receive Path. . . . . . . . . . . . . . . . . . . . . . . . 82
Table D-4: Test Settings—LTE Receive Path . . . . . . . . . . . . . . . . . . . . . . . . . 84
Table D-5: Extended AT Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
Table G-1: Acronyms and Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
—>>I
Rev 5 Jul.17 10 41110788
List of Figures
Figure 3-1: System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 3-2: Expanded RF (Transmit) Block Diagram. . . . . . . . . . . . . . . . . . . . . 19
Figure 3-3: Expanded RF (Receive/GNSS) Block Diagram . . . . . . . . . . . . . . . 20
Figure 3-4: SIM Application Interface (applies to both SIM interfaces) . . . . . . . 29
Figure 3-5: SIM Card Contacts (Contact View) . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 3-6: Recommended WAKE_ON_WAN# Connection . . . . . . . . . . . . . . . 31
Figure 3-7: Recommended Wireless Disable Connection . . . . . . . . . . . . . . . . . 32
Figure 3-8: Example LED. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Figure 4-1: Module Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
Figure 5-1: Voltage/Temperature Monitoring State Machines. . . . . . . . . . . . . . 50
Figure 5-2: Signal Timing (Full_Card_Power_Off#, and USB Enumeration). . . 51
Figure 5-3: Signal Timing (PCIe Port Detection) . . . . . . . . . . . . . . . . . . . . . . . . 52
Figure 7-1: Top View . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 7-2: Dimensioned View. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
Figure 7-3: Unit Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
Figure 7-4: Shield Locations (Top View) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
Figure 7-5: Copper Pad Location on Bottom Side of Module . . . . . . . . . . . . . . 58
Figure A-1: PCM_SYNC Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure A-2: PCM Codec to Module Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Figure A-3: Module to PCM Codec Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Figure A-4: I2S Transmitter Timing Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure E-1: Device Placement in Module Tray . . . . . . . . . . . . . . . . . . . . . . . . . 90
Figure E-2: Shipping Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 91
Rev 5 Jul.17 11
41110788
1
1: Introduction
The Sierra Wireless EM7565 Embedded Module is an M.2 module that provides LTE,
UMTS, and GNSS connectivity for notebook, ultrabook, tablet computers, and M2M
applications over several radio frequency bands.
Supported RF bands
The modem, based on Qualcomm's MDM9250 baseband processor, supports data
operation on LTE and UMTS networks over the bands described in Table 1-1, with
LTE carrier aggregation (CA) as described in Table 1-2.
Table 1-1: Supported RF Bands
RAT Bands
1
2
3
4
5
6
7
8
9
12
13
18
19
20
26
28
29
30
32
41
42
43
46
48
66
LTEaFFFFF FFFFFFFFFFFbF FbTTTTbTb,c F
UMTSdY Y Y Y Y Y Y Y Y N/A N/A
GNSS
•GPS: 1575.42 MHz
•GLONASS: 1602 MHz
•BeiDou: 1561.098 MHz
•Galileo: 1575.42 MHz
•QZSS: 1575.42 MHz
••
a. (LTE) Downlink MIMO support (2x2; 4x2)
F=FDD; T=TDD
Data rates: Downlink (Cat 12 with 3CA, 256QAM=600 Mbps; Cat 9 with 3CA, 64QAM=450 Mbps), Uplink
(Cat 13 with 2CA contiguous, 64QAM=150 Mbps)
b. Downlink only
c. B48 support pending future release
d. UMTS (DC-HSPA+, HSPA+, HSPA, UMTS)
Diversity support
Data rates: Downlink (Cat 24, up to 42 Mbps), Uplink (Cat 6, up to 11 Mbps)
Table 1-2: Carrier Aggregation Combinations
Downlink Uplink
TBD CA_1C
TBD CA_3C
TBD CA_7C
TBD CA_41C
TBD CA_42C
Product Technical Specification
Rev 5 Jul.17 12 41110788
Physical Features
•M.2 form factor—WWAN Type 3042-S3-B (in WWAN—USB 3.0 Port
Configuration 2), as specified in [8] PCI Express NGFF (M.2) Electrome-
chanical Specification Revision 1.0. (Note: Any variations from the specifi-
cation are detailed in this document.)
•Ambient operating temperature range:
·Class A (3GPP compliant): -30°C to +TBD°C
·Class B (operational, non-3GPP compliant): -40°C to +TBD°C (reduced
operating parameters required)
Important: The internal module temperature (reported by AT!PCTEMP) must be kept
below TBD°C. For best performance, the internal module temperature should be kept
below TBD°C. Proper mounting, heat sinks, and active cooling may be required,
depending on the integrated application.
Application Interface Features
•USB interface (QMI) for Linux and Android
•MBIM for Windows 8.1, Windows 10, and Linux
•AT command interface ([1] AT Command Set for User Equipment (UE)
(Release 6) (Doc# 3GPP TS 27.007), plus proprietary extended AT
commands) in [2] AirPrime EM75xx AT Command Reference (forthcoming)
•Software Development Kits (SDK),including API (Application Program
Interface) functions:
·Windows 8.1, Windows 10
·Linux
•Support for active antenna control via dedicated antenna control signals
(ANTCTL0:3)
•Dynamic power reduction support via software and dedicated GPIO (DPR)
Note: OMA DM and FOTA
support is operator-
dependent.
•OMA DM (Open Mobile Alliance Device Management)
•FOTA (Firmware Over The Air)
Modem Features
•LTE / DC-HSPA+ / HSPA+ / HSPA / UMTS (WCDMA) operation
•Multiple (up to 16) cellular packet data profiles
•Traditional modem COM port support for AT commands
•USB suspend / resume
•Sleep mode for minimum idle power draw
•SIM application tool kit with proactive SIM commands
•Enhanced Operator Name String (EONS)
•Mobile-originated PDP context activation / deactivation
•Support QoS QCI (3GPP Release 12)
•Static and Dynamic IP address. The network may assign a fixed IP address
or dynamically assign one using DHCP (Dynamic Host Configuration
Protocol).
Introduction
Rev 5 Jul.17 13 41110788
•PAP and CHAP support
•PDP context type (IPv4, IPv6, or IPv4v6)
•RFC1144 TCP/IP header compression
LTE Features
•Carrier aggregation:
·DL LTE-FDD
·20 MHz intraband non-contiguous
·40 MHz interband
·DL LTE-TDD
·40 MHz intraband contiguous and non-contiguous
·40 MHz interband
·UL LTE
·40 MHz intraband contiguous
•CSG support (LTE Femto)
•LTE Advanced receivers (NLIC, eICIC, feICIC)
•Basic cell selection and system acquisition
·PSS/SSS/MIB decode
·SIB1–SIB16 decoding
•NAS/AS security procedures
·Snow 3G/AES/ZUC security
•CQI/RI/PMI reporting
•Paging procedures
·Paging in Idle and Connected mode
•Dedicated bearer
·Network-initiated dedicated bearer
·UE-initiated dedicated bearer
•Multiple PDN connections (IPv4 and IPv6 combinations), subject to operating
system support.
•Connected mode intra-LTE mobility
•Idle mode intra-LTE mobility
•iRAT between LTE/3G for idle and connection release with redirection
•Detach procedure
·Network-initiated detach with reattach required
·Network-initiated detach followed by connection release
Short Message Service (SMS) Features
•Mobile-originated and mobile-terminated SMS over IMS
•Mobile-originated and mobile-terminated SMS over SGs
Position Location (GNSS)
•Customizable tracking session
•Automatic tracking session on startup
•Concurrent standalone GPS, GLONASS, Galileo, BeiDou, and QZSS
•Assisted GPS (A-GPS) SUPL1.0
Product Technical Specification
Rev 5 Jul.17 14 41110788
•Assisted GPS/GLONASS SUPL2.0
•gpsOneXTRA 1.0/2.0/3.0/3.1
•GNSS reception on dedicated connector or diversity connector
Supporting Documents
Several additional documents describe module design, usage, integration, and
other features. See References on page 92.
Accessories
A hardware development kit is available for AirPrime M.2 modules. The kit
contains hardware components for evaluating and developing with the module,
including:
•Development board
•Cables
•Antennas
•Other accessories
For over-the-air LTE testing, ensure that suitable antennas are used.
Required Connectors
Table 1-3 describes the connectors used to integrate the EM7565 Embedded
Module into your host device.
Ordering Information
To order, contact the Sierra Wireless Sales Desk at +1 (604) 232-1488 between
8 AM and 5 PM Pacific Time.
Table 1-3: Required Host-Module Connectorsa
a. Manufacturers/part numbers are for reference only and are subject to change. Choose
connectors that are appropriate for your own design.
Connector type Description
RF cables •Mate with M.2-spec connectors
•Three connector jacks (I-PEX 20448-001R-081 or equivalent)
EDGE (67 pin) •Slot B compatible—Per the M.2 standard ([8] PCI Express
NGFF (M.2) Electromechanical Specification Revision 1.0), a
generic 75 pin position EDGE connector on the motherboard
uses a mechanical key to mate with the 67 pin notched module
connector.
•Manufacturers include LOTES (part #APCI0018-P001A01),
Kyocera, JAE, Tyco, and Longwell.
SIM •Industry-standard connector. See SIM Interface on page 28 for
details.
Introduction
Rev 5 Jul.17 15 41110788
Integration Requirements
Sierra Wireless provides, in the documentation suite, guidelines for successful
module integration and offers integration support services as necessary.
When integrating the EM7565 Embedded Module, the following items must be
addressed:
•Mounting—Effect on temperature, shock, and vibration performance
•Power supply—Impact on battery drain and possible RF interference
•Antenna location and type—Impact on RF performance
•Regulatory approvals—As discussed in Regulatory Compliance and Industry
Certifications on page 60.
•Service provisioning—Manufacturing process
•Software—As discussed in Software Interface on page 54.
•Host interface—Compliance with interface voltage levels
Rev 5 Jul.17 16
41110788
2
2: Standards Compliance
The EM7565 Embedded Module complies with the mandatory requirements
described in the following standards. The exact set of requirements supported is
network operator-dependent.
Table 2-1: Standards Compliance
Technology Standards
LTE •3GPP Release 12a
a. Some auxiliary functions support Release 13.
UMTS •3GPP Release 9
—>>I
Rev 5 Jul.17 17
41110788
3
3: Electrical Specifications
The system block diagram in Figure 3-1 represents the EM7565 module integrated
into a host system. The module includes the following interfaces to the host:
•Full_Card_Power_Off#—Input supplied to the module by the host—active-low to
turn the unit off, or active-high to turn the unit on.
•W_DISABLE#—Active low input from the host to the EM7565 disables the main
RF radio.
•GPS_DISABLE#—Active low input from the host to the EM7565 disables the
GNSS radio receiver.
•WAKE_ON_WAN#—Active low output used to wake the host when specific
events occur.
•WWAN_LED#—Active-low LED drive signal provides an indication of RADIO ON
state, either WWAN or GNSS.
•RESET#—Active low input from the host used to reset the module.
•Antenna—Three RF connectors (main (Rx/Tx), GNSS, and auxiliary (diversity/
MIMO/GNSS)). For details, see RF Specifications on page 35.
•Antenna control—Four signals that can be used to control external antenna
switches.
•Dynamic power control—Signal used to adjust Tx power to meet FCC SAR
requirements. For details, see Tx Power Control on page 53.).
•Dual SIM—Supported through the interface connector. The SIM cavities /
connectors must be placed on the host device for this feature.
•SIM detect—Internal pullup on the module detects whether a SIM is present or
not:
·If a SIM is not inserted, the pin must be shorted to ground.
·If a SIM is present, the pin will be an open circuit.
•USB—USB 2.0 and USB 3.0 interfaces to the host for data, control, and status
information.
•PCIe port—Interface to the host for data. (Alternative to USB 3.0 interface.)
The EM7565 has two main interface areas—the host I/O connector and the RF ports.
Details of these interfaces are described in the sections that follow.
um um Amen. Rm:
Product Technical Specification
Rev 5 Jul.17 18 41110788
Figure 3-1: System Block Diagram
External NAND and
RAM
4GB NAND
2GB RAM
NAND
W_DISABLE#
VCC
PDM9655
USIM1
USB2.0
DPR
VPH/
VBAT
CBL_PWR_N
LED_DRV_N
LED#1
RF + GRFC_GPIO
RF
BLOCK
MDM9250
HOST INTERFACE CONNECTOR
GPS_DISABLE #
WAKE_ON_WAN#
Full_Card_Power_Off#
SIM Detect1
ANTCTL/RFFE
RESIN_N
RESET#
DDR2 DRAM
USB3.0
USIM2
SIM Detect2
Audio I2C
Audio I2S/PCM
SPMI
Voltage Supply
PCI-E
LDO
2.7 / 1.8 V
APT
GPS
PWR
ESIM
EN
COEX_RXD / COEX_TXD /
COEX3
PCIe
HHHHHH H W
Electrical Specifications
Rev 5 Jul.17 19 41110788
Figure 3-2: Expanded RF (Transmit) Block Diagram
_ =5. 2 E Egg
Product Technical Specification
Rev 5 Jul.17 20 41110788
Figure 3-3: Expanded RF (Receive/GNSS) Block Diagram
Host Interface Pin Assignments
The EM7565 host I/O connector provides pins for power, serial communications,
and control. Pin assignments are listed in Table 3-1.
Refer to the following tables for pin details based on interface types:
•Table 3-2, Power and Ground Specifications, on page 26
•Table 3-3, USB Interfaces, on page 26
•Table 3-5, SIM Interface Signals, on page 28
•Table 3-6, Module Control Signals, on page 31
B32
UHB_AUX_OUT2
UHB_AUX_OUT1
HB_AUX_OUT
HUHB_OUT
B41
B42/43/48
LTE-LAA (B46)
B4/66
B2
B7
B30
LHB_LB_IN
MHUHB_OUT
MHB_OUT
DRX_UHB_LTEU_B
DRX_UHB_LTEU_A
DRX_LHB
DRX_HB
DRX_MB_B
DRX_MB_A
B3
B1
B66
B2
B1
B3/9
B29
B26
B12/13
B41
B30
B28A/B
GNSS
GNSS
GNSS
B7
B42/43/48
B32
GNSS
OUT2
OUT1
B12/13
B29
B8
B20
B28A/B
PRX_LB
B5/18/19/26
WTR5975
GNSS_L1
B20
B8
LTE-LAA
Electrical Specifications
Rev 5 Jul.17 21 41110788
Note: On any given interface (USB, SIM, etc.), leave unused inputs and outputs as no-
connects.
Note: The host should not drive any signals to the module until >100 ms from the start of
the power-on sequence.
Table 3-1: Host Interface (75-pin) Connections—Module Viewa
Pin Signal name Pin
typebDescription DirectioncActive
state
Voltage levels (V)
Min Typ Max
1CONFIG_3
(NC in default module
configuration)
Reserved—Host must
not repurpose this pin.
2VCC VPower source Input Power 3.135 3.7 4.4
3GND VGround Input Power - 0 -
4VCC VPower source Input Power 3.135 3.7 4.4
5GND VGround Input Power - 0 -
6Full_Card_Power_Off#dPD Turn modem on Input High 0.7 -4.4
Turn modem off Input Low -0.3 -0.5
7USB_D+d-USB data positive Input/Output Differential - - -
8W_DISABLE#ePU Wireless Disable (main
RF radio) Input Low - - 0.4
9USB_D-d-USB data negative Input/Output Differential - - -
10 WWAN_LED# OC LED Driver Output Low 0 - 0.15
11 GND VGround Input Power - 0 -
12 Key Notch location
13 Key Notch location
14 Key Notch location
15 Key Notch location
16 Key Notch location
17 Key Notch location
18 Key Notch location
19 Key Notch location
20 NC
(For audio interface pin usage,
see Audio Support on
page 64.)
Reserved—Host must
not repurpose this pin.
21 CONFIG_0
(GND in default module
configuration)
Reserved—Host must
not repurpose this pin. Output - 0
Product Technical Specification
Rev 5 Jul.17 22 41110788
22 NC
(For audio interface pin usage,
see Audio Support on
page 64.)
Reserved—Host must
not repurpose this pin.
23 WAKE_ON_WAN#dOC Wake Host Output Low 00.1
24 NC
(For audio interface pin usage,
see Audio Support on
page 64.)
Reserved—Host must
not repurpose this pin.
25 DPR -Dynamic power control Input High 1.17 1.80 2.10
Input Low -0.3 -0.63
26 GPS_DISABLE#ePU Wireless disable
(GNSS radio) Input Low - - 0.4
27 GND VGround Input Power - 0 -
28 NC
(For audio interface pin usage,
see Audio Support on
page 64.)
Reserved—Host must
not repurpose this pin.
29 USB3.0_TX- USB 3.0 Transmit Data
negative Output Differential - - -
30 UIM1_RESETdOSIM Reset Output Low 0 - 0.45
High 2.55
(3V SIM)
1.35
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.90
(1.8V SIM)
31 USB3.0_TX+ USB 3.0 Transmit Data
positive Output Differential - - -
32 UIM1_CLKdOSIM Clock Output Low 0 - 0.45
High 2.55
(3V SIM)
1.35
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.90
(1.8V SIM)
33 GND VGround Input Power - 0 -
Table 3-1: Host Interface (75-pin) Connections—Module Viewa (Continued)
Pin Signal name Pin
typebDescription DirectioncActive
state
Voltage levels (V)
Min Typ Max
Electrical Specifications
Rev 5 Jul.17 23 41110788
34 UIM1_DATAd-SIM IO pin Input Low -0.30
(3V SIM)
-0.30
(1.8V SIM)
-0.60
(3V SIM)
0.35
(1.8V SIM)
High 2.10
(3V SIM)
1.17
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.30
(3V SIM)
2.10
(1.8V SIM)
Output Low 0 - 0.40
High 2.55
(3V SIM)
1.35
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.90
(1.8V SIM)
35 USB3.0_RX- USB 3.0 Receive Data
negative Input Differential - - -
36 UIM1_PWRdVSIM VCC supply Output Power 2.90
(3V SIM)
1.75
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.85
(1.8V SIM)
37 USB3.0_RX+ USB 3.0 Receive Data
positive Input Differential - - -
38 NC Reserved
39 GND VGround Input Power - 0 -
40 SIM_DETECT_2 SIM2 indication Input 0 V—SIM not present
Open circuit—SIM present
41 PCIE_TXM PCIe Negative
Transmit Data Output Differential - - -
42 UIM2_DATAd-SIM2 IO pin Input Low -0.30
(3V SIM)
-0.30
(1.8V SIM)
-0.60
(3V SIM)
0.35
(1.8V SIM)
High 2.10
(3V SIM)
1.17
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.30
(3V SIM)
2.10
(1.8V SIM)
Output Low 0 - 0.40
High 2.55
(3V SIM)
1.35
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.90
(1.8V SIM)
43 PCIE_TXP PCIe Positive Transmit
Data Output Differential - - -
Table 3-1: Host Interface (75-pin) Connections—Module Viewa (Continued)
Pin Signal name Pin
typebDescription DirectioncActive
state
Voltage levels (V)
Min Typ Max
Product Technical Specification
Rev 5 Jul.17 24 41110788
44 UIM2_CLKdOSIM2 Clock Output Low 0 - 0.45
High 2.55
(3V SIM)
1.35
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.90
(1.8V SIM)
45 GND VGround Input Power - 0 -
46 UIM2_RESETdOSIM2 Reset Output Low 0 - 0.45
High 2.55
(3V SIM)
1.35
(1.8V SIM)
-3.10
(3V SIM)
1.90
(1.8V SIM)
47 PCIE_RXM PCIe Negative
Receive Data Input Differential - - -
48 UIM2_PWRdVSIM2 VCC supply Output Power 2.90
(3V SIM)
1.75
(1.8V SIM)
3.00
(3V SIM)
1.80
(1.8V SIM)
3.10
(3V SIM)
1.85
(1.8V SIM)
49 PCIE_RXP PCIe Positive Receive
Data Input Differential - - -
50 PCIE_PERST_N PCIe Reset Input Low TBD TBD TBD
51 GND VGround Input Power - 0 -
52 PCIE_CLKREQ_N PCIe Clock Request Output Low TBD TBD TBD
53 PCIE_REFCLKM PCIe Negative
Reference Clock Input Differential - - -
54 PCIE_PEWAKE_N PCIe Wake Output Low TBD TBD TBD
55 PCIE_REFCLKP PCIe Positive
Reference Clock Input Differential - - -
56 NC
(For audio interface pin usage,
see Audio Support on
page 64.)
Reserved—Host must
not repurpose this pin.
57 GND VGround Input Power - 0 -
58 NC
(For audio interface pin usage,
see Audio Support on
page 64.)
Reserved—Host must
not repurpose this pin.
59 ANTCTL0 (GPIO1) Customer-defined
external switch control
for multiple antennas
Output High 1.35 -1.80
Output Low 0 - 0.45
60 Reserved—Host must not repurpose this pin and should leave it not connected.
61 ANTCTL1 (GPIO2) Customer-defined
external switch control
for multiple antennas
Output High 1.35 -1.80
Output Low 0 - 0.45
Table 3-1: Host Interface (75-pin) Connections—Module Viewa (Continued)
Pin Signal name Pin
typebDescription DirectioncActive
state
Voltage levels (V)
Min Typ Max
Electrical Specifications
Rev 5 Jul.17 25 41110788
62 Reserved—Host must not repurpose this pin and should leave it not connected.
63 ANTCTL2 (GPIO3) Customer-defined
external switch control
for multiple antennas
Output High 1.35 -1.80
Output Low 0 - 0.45
64 Reserved—Host must not repurpose this pin and should leave it not connected.
65 ANTCTL3 (GPIO4) Customer-defined
external switch control
for multiple antennas
Output High 1.35 -1.80
Output Low 0 - 0.45
66 SIM_DETECTdPU SIM indication Input 0 V—SIM not present
Open circuit—SIM present
67 RESET# PU Reset module Input Low -0.3 0.63
68 NC Reserved
69 CONFIG_1
(GND in default module
configuration)
Reserved—Host must
not repurpose this pin. Output - 0
70 VCC VPower source Input Power 3.135 3.7 4.4
71 GND VGround Input Power - 0 -
72 VCC VPower source Input Power 3.135 3.7 4.4
73 GND VGround Input Power - 0 -
74 VCC VPower source Input Power 3.135 3.7 4.4
75 CONFIG_2
(NC in default module
configuration)
VReserved Output - - -
a. All values are preliminary and subject to change.
b. I—Input; O—Digital output; OC—Open Collector output; PU—Digital input (internal pull up); PD—Digital input (internal pull down);
V—Power or ground
c. Signal directions are from module’s point of view (e.g. ‘Output’ from module to host, ‘Input’ to module from host.)
d. Required signal
e. Sierra Wireless recommends that the host implement an open collector driver where a Low signal will turn the module off or enter
low power mode, and a high signal will turn the module on or leave low power mode.
Table 3-1: Host Interface (75-pin) Connections—Module Viewa (Continued)
Pin Signal name Pin
typebDescription DirectioncActive
state
Voltage levels (V)
Min Typ Max
Product Technical Specification
Rev 5 Jul.17 26 41110788
Power Supply
The host provides power to the EM7565 through multiple power and ground pins
as summarized in Table 3-2.
The host must provide safe and continuous power (via battery or a regulated
power supply) at all times; the module does not have an independent power
supply, or protection circuits to guard against electrical issues.
USB Interface
Important: Host support for USB 2.0 or USB 3.0 signals is required.
The device supports USB 2.0 and USB 3.0 interfaces for communication between
the host and module.
The interfaces comply with the [9] Universal Serial Bus Specification, Rev 2.0 and
[10] Universal Serial Bus Specification, Rev 3.0 (subject to limitations described
below), and the host device must be designed to the same standards.
Note: When designing the host device, careful PCB layout practices must be followed.
Table 3-2: Power and Ground Specifications
Name Pins Specification Min Typ Max Units
VCC
(3.7V) 2, 4, 70, 72, 74 Voltage range See Table 3-1 on page 21.
Ripple voltage --100 mVpp
GND 3, 5, 11, 27, 33, 39,
45, 51, 57, 71, 73 - - 0 - V
Table 3-3: USB Interfaces
Name Pin Description
USB 2.0 USB_D+ 7Data positive
USB_D- 9Data negative
USB 3.0 USB3.0-TX-a
a. Signal directions (Tx/Rx) are from device’s point of
view.
29 Transmit data negative
USB3.0-TX+a31 Transmit data positive
USB3.0-RX-a35 Receive data negative
USB3.0-RX+a37 Receive data positive
Electrical Specifications
Rev 5 Jul.17 27 41110788
USB Throughput Performance
This device has been designed to achieve optimal performance and maximum
throughput using USB superspeed mode (USB 3.0). Although the device may
operate with a high speed host, throughput performance will be on an “as is”
basis and needs to be characterized by the OEM. Note that throughput will be
reduced and may vary significantly based on packet size, host interface, and
firmware revision.
User-developed Drivers
Details for user-developed USB drivers are described in [4] AirCard/AirPrime
USB Driver Developer’s Guide (Doc# 2130634).
PCIe Interface
Important: Host support for USB 2.0 signals is required to enable use of the PCIe
interface.
The device supports a PCIe interface for communication between the host and
module.
The PCIe interface complies with the PCI Express® Card Electromechanical
Specification Revision 3.0, and the host device must be designed to the same
standards.
Note: When designing the host device, careful PCB layout practices must be followed.
Table 3-4: PCIe Interface
Name Pin Description
PCIe PCIE_TXMa
a. Signal directions (Tx/Rx) are from device’s point of view.
41 PCIe Negative Transmit Data
PCIE_TXPa43 PCIe Positive Transmit Data
PCIE_RXMa47 PCIe Negative Receive Data
PCIE_RXPa49 PCIe Positive Receive Data
PCIE_REFCLKM 53 PCIe Negative Reference Clock
PCIE_REFCLKP 55 PCIe Positive Reference Clock
PCIE_PERST_N 50 PCIe Reset
PCIE_CLKREQ_N 52 PCIe Clock Request
PCIE_PEWAKE_N 54 PCIe Wake
Product Technical Specification
Rev 5 Jul.17 28 41110788
SIM Interface
Note: Host support for
SIM interface signals is
required.
The module supports up to two SIMs (Subscriber Identity Module) (1.8 V or 3 V).
Each SIM holds information for a unique account, allowing users to optimize their
use of each account on multiple devices.
Note: The module may include an eUICC embedded SIM as one of the two supported
SIMs. (SKU-dependent)
The SIM pins (Table 3-5 on page 28) provide the connections necessary to
interface to SIM sockets located on the host device as shown in Figure 3-4 on
page 29. Voltage levels over this interface comply with 3GPP standards.
The types of SIM connectors used depends on how the host device exposes the
SIM sockets.
Table 3-5: SIM Interface Signals
SIM Name Pin Description
SIM
contactaNotes
Primary UIM1_RESET 30 Reset 2Active low SIM reset
UIM1_CLK 32 Serial clock 3Serial clock for SIM data
UIM1_DATA 34 Data I/O 7Bi-directional SIM data line
UIM1_PWR 36 SIM voltage 1Power supply for SIM
SIM_DETECT 66 SIM indication -Input from host indicating whether SIM is present
or not
•Grounded if no SIM is present
•No-connect (floating) if SIM is inserted
UIM_GND Ground 5Ground reference
UIM_GND is common to module ground
Secondary UIM2_RESET 46 Reset 2Active low SIM reset
UIM2_CLK 44 Serial clock 3Serial clock for SIM data
UIM2_DATA 42 Data I/O 7Bi-directional SIM data line
UIM2_PWR 48 SIM voltage 1Power supply for SIM
SIM_DETECT_2 40 SIM indication -Input from host indicating whether SIM is present
or not
•Grounded if no SIM is present
•No-connect (floating) if SIM is inserted
UIM2_GND SIM indication -Ground reference
UIM2_GND is common to module ground
a. See Figure 3-5 on page 29 for SIM card contacts.
yr: mama . “MW. mama . rnxv
Electrical Specifications
Rev 5 Jul.17 29 41110788
Figure 3-4: SIM Application Interface (applies to both SIM interfaces)
Figure 3-5: SIM Card Contacts (Contact View)
SIM card connector
(Optional.
Locate near the
SIM socket)
47 pF, 51
4.7uF
X5R
typ
(C1)
UIM-PWR
UIM-CLK
UIM-DATA
UIM-RESET
Located near
SIM socket
Located near SIM socket.
NOTE: Carefully consider if ESD
protection is required – it may
increase signal rise time and
lead to certification failure
UIM_GND
ESD
protection
(C3)
(C7)
(C2)
(C5)
(Optional.
Locate near the
SIM socket)
15 k - 30 k
0.1uF
SIM Detect
(C9)
Note: SIM Detect
contact may vary
by vendor
NOTE: UIM signals
refer to both UIM1
and UIM2.
EM7565
C8
C7
C6
C5
C4
C3
C2
C1
GND VCC
VPP RST
I/O CLK
RFU RFU
Contact View (notched corner at top left)
Product Technical Specification
Rev 5 Jul.17 30 41110788
SIM Implementation
Note: For interface design
requirements, refer to ETSI
TS 102 230 V5.5.0, section
5.2.
When designing the remote SIM interface, you must make sure that SIM signal
integrity is not compromised.
Some design recommendations include:
•Total impedance of the VCC and GND connections to the SIM, measured at
the module connector, should be less than 1 to minimize voltage drop
(includes any trace impedance and lumped element components—inductors,
filters, etc.).
•Position the SIM connector 10 cm from the module. If a longer distance is
required because of the host device design, use a shielded wire assembly—
connect one end as close as possible to the SIM connector and the other end
as close as possible to the module connector. The shielded assembly may
help shield the SIM interface from system noise.
•Reduce crosstalk on the UIM1_DATA and UIM2_DATA lines to reduce the
risk of failures during GCF approval testing.
•Avoid routing the clock and data lines for each SIM (UIM1_CLK/UIM1_DATA,
UIM2_CLK/UIM2_DATA) in parallel over distances 2 cm—cross-coupling of
a clock and data line pair can cause failures.
•3GPP has stringent requirements for I/O rise time (<1 µs), signal level limits,
and noise immunity—consider this carefully when developing your PCB
layout.
·Keep signal rise time <1 µs—keep SIM signals as short as possible, and
keep very low capacitance traces on the data and clock signals
(UIM1_CLK, UIM1_DATA, UIM2_CLK, UIM2_DATA). High capacitance
increases signal rise time, potentially causing your device to fail certification
tests.
•Add external pull-up resistors (15 k–30 k), if required, between the data
and power lines for each SIM (UIM1_DATA/UIM1_PWR, UIM2_DATA/
UIM2_PWR) to optimize the signal rise time.
•VCC line should be decoupled close to the SIM socket.
•SIM is specified to run up to 5 MHz (SIM clock rate). Take note of this speed
in the placement and routing of the SIM signals and connectors.
•You must decide whether additional ESD protection is required for your
product, as it is dependent on the application, mechanical enclosure, and SIM
connector design. The SIM pins will require additional ESD protection if they
are exposed to high ESD levels (i.e. can be touched by a user).
•Putting optional decoupling capacitors on the SIM power lines (UIM1_PWR,
UIM2_PWR) near the SIM sockets is recommended—the longer the trace
length (impedance) from the socket to the module, the greater the capaci-
tance requirement to meet compliance tests.
•Putting an optional series capacitor and resistor termination (to ground) on
the clock lines (UIM1_CLK, UIM2_CLK) at the SIM sockets to reduce EMI
and increase signal integrity is recommended if the trace length between the
SIM socket and module is long—47 pF and 50 resistor are recommended.
•Test your first prototype host hardware with a Comprion IT3 SIM test device
at a suitable testing facility.
Electrical Specifications
Rev 5 Jul.17 31 41110788
Control Interface (Signals)
The EM7565 provides signals for:
•Waking the host when specific events occur
•Host control of the module’s radios
•Host control of module power
•LED driver output
Note: Host support for
Full_Card_Power_Off# is
required, and support for
other signals in Table 3-6
is optional.
These signals are summarized in Table 3-6 and paragraphs that follow.
WAKE_ON_WAN# — Wake Host
Note: Host support for
WAKE_ON_WAN# is
optional.
The EM7565 uses WAKE_ON_WAN# to wake the host when specific events
occur.
The host must provide a 5 k–100 k pullup resistor that considers total line
capacitance (including parasitic capacitance) such that when WAKE_ON_WAN# is
deasserted, the line will rise to 3.7 V (Host power rail) in < 100 ns.
See Figure 3-6 on page 31 for a recommended implementation.
Figure 3-6: Recommended WAKE_ON_WAN# Connection
Table 3-6: Module Control Signals
Name Pin Description Typea
a. O—Digital pin Output; OC—Open Collector output; PD—Digital pin Input,
internal pull down; PU—Digital pin Input, internal pull up
Full_Card_Power_Off# 6On/off signal PD
W_DISABLE# 8Wireless disable (Main RF) PU
WWAN_LED# 10 LED driver OC
WAKE_ON_WAN# 23 Wake host O
GPS_DISABLE# 26 Wireless disable (GNSS) PU
RESET# 67 Reset module PU
Control R
WAKE_ON_WAN#
1
2
3
Q
5k-100k
Host
VCC
Module
Product Technical Specification
Rev 5 Jul.17 32 41110788
W_DISABLE# (Wireless Disable) and
GPS_DISABLE# (GNSS Disable)
Note: Host support for
wireless/GNSS disable
signals is optional.
The host device uses W_DISABLE# to enable/disable the WWAN or radio
modem, and GPS_DISABLE# to enable/disable GNSS functionality.
Letting these signals float high allows the module to operate normally. These pins
have 100 k pull-up resistors. See Figure 3-7 on page 32 for a recommended
implementation.
When integrating with your host device, keep the following in mind:
•The signal is an input to the module and should be driven LOW to turn the
radio off, or HIGH or floating to keep it on.
•If the host never needs to assert this power state control to the module, leave
this signal unconnected from the host interface.
Figure 3-7: Recommended Wireless Disable Connection
Table 3-7: W_DISABLE#/GPS_DISABLE# Usage
Name Pin Description/notes
W_DISABLE# 8Enable/disable the WWAN or radio modema. When
disabled, the modem cannot transmit or receive.
•Leave as not connected or drive HIGH to keep the
modem always on.
•Drive LOW to turn the modem off.
GPS_DISABLE# 26 Enable/disable GNSS functionalitya
•Leave as not connected or drive HIGH to enable GNSS
functionality.
•Drive LOW to disable GNSS functionality.
•For details on enabling / disabling GNSS functionality,
see the AT!CUSTOM=”GPSENABLE” command in [2]
AirPrime EM74xx / MC74xx AT Command Reference
(Doc# 4117727).
a. Sierra Wireless recommends that the host implement an open collector driver where a Low signal
turns off the modem or disables GNSS functionality, and a high signal turns on the modem or len-
ables GNSS functionality.
Module
R
Wireless
disable control 1
2
3
Q
100k
Host
VCC PMIC for W_DISABLE#
10k
Electrical Specifications
Rev 5 Jul.17 33 41110788
Full_Card_Power_Off# and RESET#
Note: Host support for
Full_Card_Power_Off# is
required, and support for
RESET# is optional.
Full_Card_Power_Off# and RESET# are inputs to the module that the host uses
as described in Table 3-8.
For timing details, see Power On/Off Timing for the USB on page 50.
WWAN_LED#—LED Output
Note: Host support for
WWAN_LED# is optional.
The configuration for the LED shown in Figure 3-8 is customizable. Contact your
Sierra Wireless account representative for details.
Table 3-8: Full_Card_Power_Off# and RESET# Usage
Name Pin Description/notes
Full_Card_Power_Off# 6Powers the module on/off.
•Signal is required.
•Pull HIGH to keep the module on. To keep the module
always on:
·Tie the pin directly to a host GPIO (1.8V), or
·Use an external pull-up to pull signal high (10k–20k
for 1.8V, 75–100k for VCC rail). Note that a larger-
value resistor will reduce leakage current.
•Drive LOW to turn the module off.
RESET# 67 Resets the module.
•Signal is optional. The module will operate correctly if
the pin is left disconnected on the host.
•Pull the signal LOW (for minimum of 2 s) only to reset
the module (the active state); otherwise, leave the
signal floating or high impedance (the module will
remain operational because the module has a pull-up
resistor to an internal reference voltage (1.8V) in
place.).
•The signal requires an open collector input from the
host.
•This is a ‘hard’ reset, which should be used only if the
host cannot communicate with the module via the USB
port. (If the port is not working, the module may have
locked up or crashed.)
Caution: RESET# should not be driven or pulled to a logic
high level by the host, as this may cause damage to the
module.
Product Technical Specification
Rev 5 Jul.17 34 41110788
Figure 3-8: Example LED
Antenna Control
Note: Host support for
antenna control signals is
optional.
The EM7565 provides four output signals (listed in Table 3-9) that may be used
for host designs that incorporate tunable antennas. Customers can configure
these signals as appropriate for the operating band(s) using the command
AT!ANTSEL. (See [2] AirPrime EM75xx AT Command Reference (forthcoming)
for details.)
Note: To avoid detuning the PCC band, customers must make sure there are no GPIO
state conflicts between the PCC and SCC for all supported CA combinations.
Current limiting Resistor
LED
VCC
MIO
Module
LED#
Table 3-9: Antenna Control Signals
Name Pin Description
ANTCTL0 59
Customer-defined external switch controls for tunable
antennas
ANTCTL1 61
ANTCTL2 63
ANTCTL3 65
Rev 5 Jul.17 35
41110788
4
4: RF Specifications
The EM7565 includes three RF connectors for use with host-supplied antennas:
•Main RF connector—Tx/Rx path
•GNSS RF connector—Dedicated GPS, GLONASS, BeiDou, Galileo, and QZSS
•Auxiliary RF connector—Diversity, MIMO, GPS, GLONASS, BeiDou, Galileo, and
QZSS
The module does not have integrated antennas.
Figure 4-1: Module Connectors
RF Connections
When attaching antennas to the module:
•Use RF plug connectors that are compatible with the following RF receptacle
connectors: Foxconn (KK12011-02-7H), Longwell (911-002-0006R), Speedtech
(C87P101-00001-H), Murata (MM4829-2702RA4 (HSC)), IPEX (20449-001E
(MHF4)).
•Match coaxial connections between the module and the antenna to 50 .
•Minimize RF cable losses to the antenna; the recommended maximum cable loss
for antenna cabling is 0.5 dB.
•To ensure best thermal performance, use the mounting hole (if possible) to attach
(ground) the device to a metal chassis.
Note: If the antenna connection is shorted or open, the modem will not sustain permanent
damage.
Shielding
The module is fully shielded to protect against EMI and must not be removed.
I/O FPC Connector
Main RF (Rx/Tx)
GNSS RF
Auxiliary RF (Diversity/MIMO/GNSS)
Product Technical Specification
Rev 5 Jul.17 36 41110788
Antenna and Cabling
When selecting the antenna and cable, it is critical to RF performance to match
antenna gain and cable loss.
Note: For detailed electrical performance criteria, see Appendix B: Antenna Specification
on page 68.
Choosing the Correct Antenna and Cabling
When matching antennas and cabling:
•The antenna (and associated circuitry) should have a nominal impedance of
50 with a return loss of better than 10 dB across each frequency band of
operation.
•The system gain value affects both radiated power and regulatory (FCC, IC,
CE, etc.) test results.
Designing Custom Antennas
Consider the following points when designing custom antennas:
•A skilled RF engineer should do the development to ensure that the RF
performance is maintained.
•If both UMTS and CDMA modules will be installed in the same platform, you
may want to develop separate antennas for maximum performance.
Determining the Antenna’s Location
When deciding where to put the antennas:
•Antenna location may affect RF performance. Although the module is
shielded to prevent interference in most applications, the placement of the
antenna is still very important—if the host device is insufficiently shielded,
high levels of broadband or spurious noise can degrade the module’s perfor-
mance.
•Connecting cables between the module and the antenna must have 50
impedance. If the impedance of the module is mismatched, RF performance
is reduced significantly.
•Antenna cables should be routed, if possible, away from noise sources
(switching power supplies, LCD assemblies, etc.). If the cables are near the
noise sources, the noise may be coupled into the RF cable and into the
antenna. See Interference from Other Wireless Devices on page 37.
Disabling the Diversity Antenna
Use the AT command !RXDEN=0 to disable receive diversity or !RXDEN=1 to
enable receive diversity.
RF Specifications
Rev 5 Jul.17 37 41110788
Note: A diversity antenna is used to improve connection quality and reliability through
redundancy. Because two antennas may experience difference interference effects (signal
distortion, delay, etc.), when one antenna receives a degraded signal, the other may not be
similarly affected.
Ground Connection
When connecting the module to system ground:
•Prevent noise leakage by establishing a very good ground connection to the
module through the host connector.
•Connect to system ground using the mounting hole shown in Figure 4-1 on
page 35.
•Minimize ground noise leakage into the RF.
Depending on the host board design, noise could potentially be coupled to
the module from the host board. This is mainly an issue for host designs that
have signals traveling along the length of the module, or circuitry operating at
both ends of the module interconnects.
Interference and Sensitivity
Several interference sources can affect the module’s RF performance
(RF desense). Common sources include power supply noise and device-
generated RF.
RF desense can be addressed through a combination of mitigation techniques
(Methods to Mitigate Decreased Rx Performance on page 38) and radiated
sensitivity measurement (Radiated Sensitivity Measurement on page 39).
Note: The EM7565 is based on ZIF (Zero Intermediate Frequency) technologies. When
performing EMC (Electromagnetic Compatibility) tests, there are no IF (Intermediate
Frequency) components from the module to consider.
Interference from Other Wireless Devices
Wireless devices operating inside the host device can cause interference that
affects the module.
To determine the most suitable locations for antennas on your host device,
evaluate each wireless device’s radio system, considering the following:
•Any harmonics, sub-harmonics, or cross-products of signals generated by
wireless devices that fall in the module’s Rx range may cause spurious
response, resulting in decreased Rx performance.
•The Tx power and corresponding broadband noise of other wireless devices
may overload or increase the noise floor of the module’s receiver, resulting in
Rx desense.
The severity of this interference depends on the closeness of the other antennas
to the module’s antenna. To determine suitable locations for each wireless
device’s antenna, thoroughly evaluate your host device’s design.
Product Technical Specification
Rev 5 Jul.17 38 41110788
Host-generated RF Interference
All electronic computing devices generate RF interference that can negatively
affect the receive sensitivity of the module.
Proximity of host electronics to the antenna in wireless devices can contribute to
decreased Rx performance. Components that are most likely to cause this
include:
•Microprocessor and memory
•Display panel and display drivers
•Switching-mode power supplies
Device-generated RF Interference
The module can cause interference with other devices. Wireless devices such as
AirPrime embedded modules transmit in bursts (pulse transients) for set durations
(RF burst frequencies). Hearing aids and speakers convert these burst
frequencies into audible frequencies, resulting in audible noise.
Methods to Mitigate Decreased Rx
Performance
It is important to investigate sources of localized interference early in the design
cycle. To reduce the effect of device-generated RF on Rx performance:
•Put the antenna as far as possible from sources of interference. The
drawback is that the module may be less convenient to use.
•Shield the host device. The module itself is well shielded to avoid external
interference. However, the antenna cannot be shielded for obvious reasons.
In most instances, it is necessary to employ shielding on the components of
the host device (such as the main processor and parallel bus) that have the
highest RF emissions.
•Filter out unwanted high-order harmonic energy by using discrete filtering on
low frequency lines.
•Form shielding layers around high-speed clock traces by using multi-layer
PCBs.
•Route antenna cables away from noise sources.
Radiated Spurious Emissions (RSE)
When designing an antenna for use with AirPrime embedded modules, the host
device with an AirPrime embedded module must satisfy any applicable
standards/local regulatory bodies for radiated spurious emission (RSE) for
receive-only mode and for transmit mode (transmitter is operating).
Note that antenna impedance affects radiated emissions, which must be
compared against the conducted 50-ohm emissions baseline. (AirPrime
embedded modules meet the 50-ohm conducted emissions requirement.)
RF Specifications
Rev 5 Jul.17 39 41110788
Radiated Sensitivity Measurement
A wireless host device contains many noise sources that contribute to a reduction
in Rx performance.
To determine the extent of any receiver performance desensitization due to self-
generated noise in the host device, over-the-air (OTA) or radiated testing is
required. This testing can be performed by Sierra Wireless or you can use your
own OTA test chamber for in-house testing.
Sierra Wireless’ Sensitivity Testing and
Desensitization Investigation
Although AirPrime embedded modules are designed to meet network operator
requirements for receiver performance, they are still susceptible to various
performance inhibitors.
As part of the Engineering Services package, Sierra Wireless offers modem OTA
sensitivity testing and desensitization (desense) investigation. For more
information, contact your account manager or the Sales Desk (see Contact
Information on page 3).
Note: Sierra Wireless has the capability to measure TIS (Total Isotropic Sensitivity) and
TRP (Total Radiated Power) according to CTIA's published test procedure.
Sensitivity vs. Frequency
For UMTS bands, sensitivity is defined as the input power level in dBm that
produces a BER (Bit Error Rate) of 0.1%. Sensitivity should be measured at all
UMTS frequencies across each band.
For LTE bands, sensitivity is defined as the RF level at which throughput is 95% of
maximum.
Supported Frequencies
The EM7565 supports:
•Multiple-band LTE—See Table 4-1 on page 40 (supported bands) and
Table 4-2 on page 41 (LTE bandwidth support).
•LTE Advanced carrier aggregation—Details TBD
•Multiple-band WCDMA/HSPA/HSPA+/DC-HSPA+—See Table 4-3 on
page 42.
•Multiple-band WCDMA receive diversity
•GPS, GLONASS, BeiDou, Galileo, QZSS—See Table 4-7 on page 45.
•Inter-RAT and inter-frequency cell reselection and handover between
supported frequency bands
Product Technical Specification
Rev 5 Jul.17 40 41110788
Table 4-1: LTE Frequency Bands
Band Frequency (Tx) Frequency (Rx)
B1 1920–1980 MHz 2110–2170 MHz
B2 1850–1910 MHz 1930–1990 MHz
B3 1710–1785 1805–1880 MHz
B4 1710–1755 2110–2155 MHz
B5 824–849 MHz 869–894 MHz
B7 2500–2570 MHz 2620–2690 MHz
B8 880–915 MHz 925–960 MHz
B9 1749.9–1784.9 MHz 1844.9–1879.9 MHz
B12 699–716 MHz 729–746 MHz
B13 777–787 MHz 746–756 MHz
B18 815–830 MHz 860–875 MHz
B19 830–845 MHz 875–890 MHz
B20 832–862 MHz 791–821 MHz
B26 814–849 MHz 859–894 MHz
B28 703–748 MHz 758–803 MHz
B29 n/a 717–728 MHz
B30 2305–2315 MHz 2350–2360 MHz
B32 n/a 1452–1496 MHz
B41 2496–2690 MHz (TDD)
B42 3400–3600 MHz (TDD)
B43 3600–3800 MHz (TDD)
B46 n/a 5150–5925 MHz (TDD)
B48a
a. B48 support pending future release
3550–3700 MHz (TDD)
B66 1710–1780 MHz 2110–2200 MHz
RF Specifications
Rev 5 Jul.17 41 41110788
Table 4-2: LTE Bandwidth Supporta
a. Table contents are derived from 3GPP TS 36.521-1 v12.6.0, table 5.4.2.1-1.
Band 1.4 MHz 3MHz 5MHz 10 MHz 15 MHz 20 MHz
B1    
B2 b
b. Bandwidth for which a relaxation of the specified UE receiver sensitivity requirement
(Clause 7.3 of 3GPP TS 36.521-1 v12.6.0) is allowed.
b
B3 bb
B4 
B5    b 
B7  c
c. Bandwidth for which uplink transmission bandwidth can be restricted by the network for
some channel assignments in FDD/TDD co-existence scenarios in order to meet
unwanted emissions requirements (Clause 6.6.3.2 of 3GPP TS 36.521-1 v12.6.0).
b,c
B8    b 
B9  bb
B12  bb 
B13 bb 
B18  bb
B19  bb
B20  bbb
B26    bb
B28  bbb,c
B30  b 
B32    
B41    
B42    
B43    
B46 
B48d
d. B48 support pending future release
   
B66    
Product Technical Specification
Rev 5 Jul.17 42 41110788
Table 4-3: WCDMA Frequency Bands Support
Band Frequency (Tx) Frequency (Rx)
Band 1 1920–1980 MHz 2110–2170 MHz
Band 2 1850–1910 MHz 1930–1990 MHz
Band 3 1710–1785 MHz 1805–1880 MHz
Band 4 1710–1755 MHz 2110–2155 MHz
Band 5 824–849 MHz 869–894 MHz
Band 6 830–840 MHz 875–885 MHz
Band 8 880–915 MHz 925–960 MHz
Band 9 1749.9–1784.9 MHz 1844.9–1879.9 MHz
Band 19 830–845 MHz 875–890 MHz
RF Specifications
Rev 5 Jul.17 43 41110788
Conducted Rx Sensitivity / Tx Power
Note: Values in the following tables are preliminary, pending transceiver matching/testing.
Table 4-4: Conducted Rx (Receive) Sensitivity—LTE Bands
LTE bands Conducted Rx sensitivity (dBm)
Primary (Typ) Secondary (Typ) SIMO (Typ) SIMOa (Worst case)
B1
Full RB on
downlink;
BW: 10 MHzb
TBD TBD TBD -96.3
B2 TBD TBD TBD -94.3
B3 TBD TBD TBD -93.3
B4 TBD TBD TBD -96.3
B5 TBD TBD TBD -94.3
B7 TBD TBD TBD -94.3
B8 TBD TBD TBD -93.3
B9 TBD TBD TBD TBD
B12 TBD TBD TBD -93.3
B13 TBD TBD TBD -93.3
B18 TBD TBD TBD -96.3
B19 TBD TBD TBD -96.3
B20 TBD TBD TBD -93.3
B26 TBD TBD TBD -93.8
B28 TBD TBD TBD -94.8
B29 TBD TBD TBD -93.3
B30 TBD TBD TBD -95.3
B32 TBD TBD TBD TBD
B41 TBD TBD TBD -94.3
B42 TBD TBD TBD TBD
B43 TBD TBD TBD TBD
B46 TBD TBD TBD TBD
B48cTBD TBD TBD TBD
B66 TBD TBD TBD TBD
a. Per 3GPP specification
b. Sensitivity values scale with bandwidth:
x_MHz_Sensitivity = 10_MHz_Sensitivity - 10*log(10 MHz/x_MHz)
Note: Bandwidth support is dependent on firmware version.
c. B48 support pending future release
Product Technical Specification
Rev 5 Jul.17 44 41110788
Table 4-5: Conducted Rx (Receive) Sensitivity—UMTS Bands
UMTS bands
Conducted Rx sensitivity (dBm)
Primary
(Typical) Secondary
(Typical)
Primary/Secondary
(Worst case)a
Band 1
0.1% BER
12.2 kbps
TBD TBD -106.0
Band 2 TBD TBD -104.0
Band 3 TBD TBD -103.0
Band 4 TBD TBD -106.0
Band 5 TBD TBD -104.0
Band 6 TBD TBD -104.0
Band 8 TBD TBD -103.0
Band 9 TBD TBD -105.0
Band 19 TBD TBD TBD
a. Per 3GPP specification
Table 4-6: Conducted Tx (Transmit) Power Tolerances
Bands Conducted Tx power Notes
LTE
LTE bands 1,2,3,4,5,8,9,12,13,18,19,20,26,28,66 +23 dBm 1dB TBD
LTE bands 7,41,42,43, 48a+22 dBm 1dB TBD
LTE band 30 +21.5 dBm 1dB TBD
UMTS
Band 1 (IMT 2100 12.2 kbps)
Band 2 (UMTS 1900 12.2 kbps)
Band 3 (UMTS 1800 12.2 kbps)
Band 4 (AWS 1700/2100 12.2 kbps)
Band 5 (UMTS 850 12.2 kbps)
Band 6 (UMTS 800 12.2 kbps)
Band 8 (UMTS 900 12.2 kbps)
Band 9 (UMTS 1700 12.2 kbps)
Band 19 (UMTS 800 12.2 kbps)
+23 dBm 1dB Connectorized
(Class 3)
a. B48 support pending future release
RF Specifications
Rev 5 Jul.17 45 41110788
GNSS Specifications
Note: For detailed electrical performance criteria, see Recommended GNSS Antenna
Specifications on page 70.
.
Table 4-7: GNSS Specifications
Parameter/feature Description
Satellite channels Maximum 30 channels (16 GPS, 14 GLONASS),
simultaneous tracking
Protocols NMEA 0183 V3.0
Acquisition timea
a. Acquisition times measured with signal strength = -135 dBm
Hot start: 1 s
Warm start: 29 s
Cold start: 32 s
Accuracy
Horizontal: < 2 m (50%); < 5 m (90%)
Altitude: < 4 m (50%); < 8 m (90%)
Velocity: < 0.2 m/s
Sensitivity
Trackingb: -160 dBm
Acquisitionc (Assisted): -158 dBm
Acquisition (Standalone): -145 dBm
b. Tracking sensitivity is the lowest GNSS signal level for which the device can still
detect an in-view satellite 50% of the time when in sequential tracking mode.
c. Acquisition sensitivity is the lowest GNSS signal level for which the device can still
detect an in-view satellite 50% of the time.
Operational limits Altitude <6000 m or velocity <100 m/s
(Either limit may be exceeded, but not both.)
Rev 5 Jul.17 46
41110788
5
5: Power
Power Consumption
Power consumption measurements in the tables below are for the EM7565 connected
to the host PC via USB.
The module does not have its own power source and depends on the host device for
power. For a description of input voltage requirements, see Power Supply on page 26.
Table 5-1: Averaged Standby DC Power Consumptiona
Signal Description BandsbCurrent Notes /
configuration
Typ MaxcUnit
VCC Standby current consumption (Sleep mode activatedd)
LTE LTE bands TBD TBD mA DRX cycle = 8 (2.56 s)
HSPA / WCDMA UMTS bands TBD TBD mA DRX cycle = 8 (2.56 s)
Standby current consumptione (Sleep mode deactivatedd)
LTE LTE bands TBD TBD mA DRX cycle = 8 (2.56 s)
HSPA / WCDMA UMTS bands TBD TBD mA DRX cycle = 8 (2.56 s)
Low Power Mode (LPM)/Offline Modee (Sleep mode activatedd)
RF disabled, but module is operational TBD TBD mA
Low Power Mode (LPM)/Offline Modee (Sleep mode deactivatedd)
RF disabled, but module is operational TBD TBD mA
Leakage current
Module powered off—
Full_Card_Power_Off# is Low, and VCC is
supplied
TBD TBD A
a. Preliminary, subject to change.
b. For supported bands, see Table 4-1, LTE Frequency Bands, on page 40 and Table 4-3, WCDMA Frequency
Bands Support, on page 42.
c. Measured at 25ºC/nominal 3.7 V voltage.
d. Assumes USB bus is fully suspended during measurements
e. LPM and standby power consumption will increase when LEDs are enabled. To reduce power consumption,
configure LEDs to remain off while in standby and LPM modes.
Power
Rev 5 Jul.17 47 41110788
Table 5-2: Averaged Call Mode DC Power Consumption
Description Tx power Currenta
Notes
Typ Unit
LTE 0dBm TBD mA CA 300/50 Mbps, 20 MHz+20 MHz BW
TBD mA CA 100/50 Mbps, 10 MHz+10 MHz BW
TBD mA 150/50 Mbps, 20 MHz BW
20 dBm TBD mA CA 300/50 Mbps, 20 MHz+20 MHz BW
TBD mA CA 100/50 Mbps, 10 MHz+10 MHz BW
TBD mA 150/50 Mbps, 20 MHz BW
23 dBm TBD mA CA 300/50 Mbps, 20 MHz+20 MHz BW
TBD mA CA 100/50 Mbps, 10 MHz+10 MHz BW
TBD mA 150/50 Mbps, 20 MHz BW
DC-HSPA/HSPA 0dBm TBD mA All speeds
20 dBm TBD mA All speeds
23 dBm TBD mA Worst case
Peak current
(averaged over 100 s) TBD AAll LTE/WCDMA bands
a. Measured at 25ºC/nominal 3.7 V voltage
Table 5-3: Miscellaneous DC Power Consumption
Signal Description
Current/Voltage
Unit Notes/configurationMin Typ Max
VCC
USB active current —TBD TBD mA High speed USB connection, CL = 50 pF
on D+ and D- signals
Inrush current —TBD TBD A
•Assumes power supply turn on time
>100µs
•Dependent on host power supply
rise time.
Maximum current — — TBD A
•Across all bands, all temperature
ranges
•3.7 V supply
GNSS Signal
connector Active bias on GNSS port
— — TBD mA Voltage applied to the GNSS antenna to
power electronics inside the antenna
(GNSS RF connector in Figure 4-1 on
page 35).
TBD TBD TBD V
Product Technical Specification
Rev 5 Jul.17 48 41110788
Module Power States
The module has five power states, as described in Table 5-4.
Table 5-4: Module Power States
State Details
Host is powered
USB interface active
RF enabled
Normal
(Default
state)
•Module is active
•Default state. Occurs when VCC is first applied, Full_Card_Power_Off# is
deasserted (pulled high), and W_DISABLE# is deasserted
•Module is capable of placing/receiving calls, or establishing data connections on the
wireless network
•Current consumption is affected by several factors, including:
•Radio band being used
•Transmit power
•Receive gain settings
•Data rate
  
Low power
(‘Airplane
mode’)
•Module is active
•Module enters this state:
•Under host interface control:
·Host issues AT+CFUN=0 ([1] AT Command Set for User Equipment (UE)
(Release 6) (Doc# 3GPP TS 27.007))), or
·Host asserts W_DISABLE#, after AT!PCOFFEN=0 has been issued.
•Automatically, when critical temperature or voltage trigger limits have been
reached))
 
Sleep •Normal state of module between calls or data connections
•Module cycles between wake (polling the network) and sleep, at network provider-
determined interval.
 
Off •Host keeps module powered off by asserting Full_Card_Power_Off# (signal pulled
low or left floating)
•Module draws minimal current
•See Full_Card_Power_Off# and RESET# on page 33 for more information.
 
Disconnected •Host power source is disconnected from the module and all voltages associated with
the module are at 0 V.
  
Power
Rev 5 Jul.17 49 41110788
Power State Transitions
The module uses state machines to monitor supply voltage and operating
temperature, and notifies the host when critical threshold limits are exceeded.
(See Table 5-5 for trigger details and Figure 5-1 for state machine behavior.)
Power state transitions may occur:
•Automatically, when critical supply voltage or module temperature trigger
levels are encountered.
•Under host control, using available AT commands in response to user
choices (for example, opting to switch to airplane mode) or operating condi-
tions.
Table 5-5: Power State Transition Trigger Levels
Transition Voltage Temperaturea
Notes
Trigger VTrigger °C
Normal to Low Power VOLT_HI_CRIT 4.4 TEMP_LO_CRIT TBD •RF activity suspended
VOLT_LO_CRIT 3.135 TEMP_HI_CRIT TBD
Low Power to Normal VOLT_HI_NORM 4.3 TEMP_NORM_LO TBD
•RF activity resumed
Low Power to Normal
or
Remain in Normal
(Remove warnings)
VOLT_LO_NORM 3.3 TEMP_HI_NORM TBD
Normal (Issue warning) VOLT_LO_WARN 3.2 TEMP_HI_WARN TBD
•In the TEMP_HI_WARN state, the
module may have reduced perfor-
mance (Class B temperature
range).
Power off/on
(Host-initiated) ----
•Power off recommended when
supply voltage or module
operating temperature is critically
low or high.
a. Module-reported temperatures at the printed circuit board.
I Narma‘ mode ‘ —C f/ \ Narma‘ mode Low cher mode [—
Product Technical Specification
Rev 5 Jul.17 50 41110788
Figure 5-1: Voltage/Temperature Monitoring State Machines
Power Interface
Power Ramp-up
On initial power up, inrush current depends on the power supply rise time—turn
on time >100 µs is required for < 3A inrush current.
The supply voltage must remain within specified tolerances while this is occurring.
Timing
Power On/Off Timing for the USB
Figure 5-2 describes the timing sequence for powering the module on and off.
.
Off mode
Handled by Power
State state machine
Normal mode
Low power mode
Handled by Power
State state machine .
current_vcc > VOLT_LO_NORM
current_temp <= TEMP_HI_NORM current_vcc < VOLT_LO_CRIT
current_temp > TEMP_HI_CRIT
current_vcc > VOLT_LO_NORM
current_temp < TEMP_HI_NORM
current_vcc < VOLT_LO_WARN
current_temp > TEMP_HI_WARN
current_vcc < VOLT_HI_NORM
current_temp > TEMP_NORM_LO
current_vcc > VOLT_HI_CRIT
current_temp < TEMP_LO_CRIT
(Manual transition)
Host deasserts
Full_Card_Power_Off#
Normal mode
Low supply voltage warning
or
High temperature warning
Power
Rev 5 Jul.17 51 41110788
Note: The host should not drive any signals to the module until >100 ms from the start of
the power-on sequence.
Figure 5-2: Signal Timing (Full_Card_Power_Off#, and USB Enumeration)
Full_Card_Power_Off#
Disconnected P ower-o n
Sequence
USB_D+
(Double enumeration)
Power-off
Sequence DisconnectedActive
DEVICE STATE
High
Low
High
Low
Off Off
High
VCC Low
t_pwr_on_seq
t_USB_active
t_USB_suspend
t_pwr_off_seq
USB_D+
(Single enumeration)
High
Low
t_pwr_on_seq
t_pwr_off_seq
USB3.0
(Single enumeration)
High
Low
t_pwr_on_seq
t_pwr_off_seq
Table 5-6: USB 2.0 Power-On/Off Timing Parameters (Double
Enumeration)
Parameter Typical (s) Maximum (s)
t_pwr_on_seq TBD TBD
t_USB_active TBD TBD
t_USB_suspend TBD TBD
t_pwr_off_seq TBD TBD
Table 5-7: USB 2.0 Power-On/Off Timing Parameters (Single
Enumeration)
Parameter Typical (s) Maximum (s)
t_pwr_on_seq TBD TBD
t_pwr_off_seq TBD TBD
Table 5-8: USB 3.0 Power-On/Off Timing Parameters (Single
Enumeration)
Parameter Typical (s) Maximum (s)
t_pwr_on_seq TBD TBD
t_pwr_off_seq TBD TBD
Product Technical Specification
Rev 5 Jul.17 52 41110788
USB Enumeration
The unit supports single and double USB enumeration with the host:
•Single enumeration:
·Applies to USB 2.0 and USB 3.0
·Enumeration starts within maximum t_pwr_on_seq seconds of power-on.
•Double enumeration—As shown in Figure 5-2:
·Applies to USB 2.0 only
·First enumeration starts within t_pwr_on_seq seconds of power-on (while
USB_D+ is high)
·Second enumeration starts after t_USB_suspend (when USB_D+ goes
high again)
Power On Timing for PCIe Port
Figure 5-2 describes the timing of PCIe port detection in the power-on sequence.
Note: The host should not drive any signals to the module until >100 ms from the start of
the power-on sequence.
Figure 5-3: Signal Timing (PCIe Port Detection)
Reset Timing
To reset the module, hold the RESET# signal low for at least 3 seconds.
Power Supply Noise
Noise in the power supply can lead to noise in the RF signal.
The power supply ripple limit for the module is no more than 100 mVp-p 1 Hz to
100 kHz. This limit includes voltage ripple due to transmitter burst activity.
Full_Card_Power_Off#
Disconnected Power-on
Sequence Active
DEVICE STATE
High
Low
Off
High
VCC Low
PCIe Port Detection High
Low
t_pci_detect
Table 5-9: PCIe Timing
Parameter Maximum (s)
t_pci_detect 4.5
Power
Rev 5 Jul.17 53 41110788
Additional decoupling capacitors can be added to the main VCC line to filter noise
into the device.
SED (Smart Error Detection)
The module uses a form of SED to track premature modem resets.
•Module tracks consecutive resets occuring soon after power-on.
•After a sixth consecutive reset, the module waits in boot-and-hold mode for a
firmware download to resolve the power-cycle problem.
Tx Power Control
The module’s Tx power limit may be controlled using either SAR backoff AT
commands, defined in [2] AirPrime EM75xx AT Command Reference
(forthcoming), or the DPR (Dynamic power control) signal. Use the
GPIOSARENABLE parameter for !CUSTOM to choose the method:
•AT commands:
·!SARSTATEDFLT—Set (or report) the default SAR backoff state that the
device uses when it powers up. This setting is persistent across power
cycles and overrides any PRI setting.
·!SARSTATE—Set (or report) the current SAR backoff state (override the
default state). This change in state is non-persistent across power cycles.
·!SARBACKOFF—Set (or report) the maximum Tx power limit for a specific
band/technology/state combination.
Note: A customization is
available to invert the DPR
logic. (e.g. make DPR low
= No SAR backoff)
•Dynamic power control— The module’s firmware monitors DPR (pin 25) and
adjusts the RF Tx power appropriately, as detailed in Table 5-10. (This state
change is equivalent to issuing the !SARSTATE AT command.)
Note: The host can implement an open collector drive for the DPR pin (if a 1.8 V-
compatible drive is not available).
Table 5-10: Dynamic Power Control of SAR Backoff State
DPR SAR backoff state
Higha
a. DPR is pulled high by default.
No SAR backof
Low Backoff 1
—>>I
Rev 5 Jul.17 54
41110788
6
6: Software Interface
Support Tools
The EM7565 is compatible with the following support tools from Sierra Wireless and
authorized third parties:
•Firmware update utilities from Sierra Wireless
•Sierra Wireless Logger
•QXDM from QUALCOMM
•QUALCOMM Product Support Tool (QPST)
•Windows and Linux SDKs (including API and drivers)
Host Interface
The device supports the following protocols for modem communication:
•MBIM (Mobile Broadband Interface Model)
•Qualcomm QMI interface. (Please contact your Sierra Wireless account repre-
sentative for QMI interface documentation.)
Rev 5 Jul.17 55
41110788
7
7: Mechanical and Environmental Specifi-
cations
The EM7565 module complies with the mechanical and environmental specifications
in Table 7-1. Final product conformance to these specifications depends on the OEM
device implementation.
Table 7-1: Mechanical and Environmental Specifications
Mode Details
Ambient temperature Operational
Class A -30ºC to +TBDºC – 3GPP compliant
Operational
Class B -40ºC to +TBDºC – non-3GPP compliant (reduced
operating parameters required)
Non-operational -40ºC to +85ºC, 96 hours
(from MIL-STD 202 Method 108)
Relative humidity Non-operational 85ºC, 85% relative humidity for 48 hours
(non-condensing)
Vibration Non-operational Random vibration, 10 to 2000 Hz, 0.1 g2/Hz to
0.0005 g2/Hz, in each of three mutually perpendicular
axes. Test duration of 60 minutes for each axis, for a total
test time of three hours.
Shock Non-operational Half sine shock, 11 ms, 30 g, 8x each axis
Half sine shock, 6 ms, 100 g, 3x each axis
Drop Non-operational 1 m on concrete on each of six faces, two times (module
only)
(Electrostatic discharge
(See Electrostatic
Discharge (ESD) on
page 57.)
Operational The RF port (antenna launch and RF connector) complies
with the IEC 61000-4-2 standard:
•Electrostatic Discharge Immunity: Test: Level3
Air Discharge: ±8 kV
Non-operational The host connector interface complies with the following
standard only:
•minimum ±500 V Human Body Model
(JESD22-A114-B)
Thermal considerations See Thermal Considerations on page 58.
Form factor M.2 Form Factor
Dimensions Length: 42±0.15 mm (max)
Width: 30±0.15 mm (max)
Thickness: Above PCB—1.50 mm (max)
PCB—0.88 mm (max)
Weight: 6.5 g
o e m. e a x o O o 9 ‘Q. a a ‘ 9 Q ,, a ‘ ‘3. mg .\.\J./.. 9 / U Q \. / m 0 m m ,.. . n O Q /..I \ \ a a a Q g, g d \ o W$ o o 0 B o i i
Product Technical Specification
Rev 5 Jul.17 56 41110788
Device Views
Figure 7-1: Top View
Figure 7-2: Dimensioned View
1.50 (max)
0.00
10.0
1.90
(Note: All dimensions shown in mm.)
0.8 ± 10%
3.72
28.43
37.68
38.00
42.00
5.08
15.00
20.02
21.22
24.92
0.00
0.32
6.20
19.30
23.80
29.68
30.00
vacuum cup
Lid assembly
orientation arrow
Shield lid
'W'ifigrfiflé‘ AirPrime EM7565 IM El 1 352678011234569 FWDWNNNN" IIIIHHHIIWHHHHHHIIIHHI rec o wwxm “Am“! WODuC’V 0‘ VENV vaw v
Mechanical and Environmental Specifications
Rev 5 Jul.17 57 41110788
Labeling
Figure 7-3: Unit Label
Note: The displayed label is an example only. The production label will vary by SKU.
The EM7565 label is non-removable, centered on the shield lid, and may contain:
•Sierra Wireless logo and product name
•IMEI number in Code-128 barcode format
•SKU number (when required)
•Factory Serial Number (FSN) in alphanumeric format
•Manufacturing date code (incorporated into FSN)
•Licensed vendor logo
•Certification marks/details
Note: The EM7565 supports OEM partner-specific label requirements.
Electrostatic Discharge (ESD)
The OEM is responsible for ensuring that the EM7565 host interface pins are not
exposed to ESD during handling or normal operation. (See Table 7-1 on page 55
for specifications.)
ESD protection is highly recommended for the SIM connector at the point where
the contacts are exposed, and for any other signals from the host interface that
would be subjected to ESD by the user of the product. (The device includes ESD
protection on the antenna.)
Product Technical Specification
Rev 5 Jul.17 58 41110788
Thermal Considerations
Embedded modules can generate significant amounts of heat that must be
dissipated in the host device for safety and performance reasons.
Figure 7-4: Shield Locations (Top View)
The amount of thermal dissipation required depends on:
•Supply voltage—Maximum power dissipation for the module can be up to
3.5 W at voltage supply limits.
•Usage—Typical power dissipation values depend on the location within the
host, amount of data transferred, etc.
Specific areas requiring heat dissipation are shown in Figure 7-5:
•RF—Bottom face of module near RF connectors. Likely to be the hottest
area.
•Baseband—Bottom face of module, below the baseband area.
Figure 7-5: Copper Pad Location on Bottom Side of Module
RF
Baseband
Baseband
RF
Mechanical and Environmental Specifications
Rev 5 Jul.17 59 41110788
To enhance heat dissipation:
•It is recommended to add a heat sink that mounts the module to the main
PCB or metal chassis (a thermal compound or pads must be used between
the module and the heat sink).
•Maximize airflow over/around the module.
•Locate the module away from other hot components.
•Module mounting holes must be used to attach (ground) the device to the
main PCB ground or a metal chassis.
•You may also need active cooling to pull heat away from the module.
Note: Adequate dissipation of heat is necessary to ensure that the module functions
properly.
Module Integration Testing
When testing your integration design:
•Test to your worst case operating environment conditions (temperature and
voltage)
•Test using worst case operation (transmitter on 100% duty cycle, maximum
power)
•Monitor temperature at all shield locations. Attach thermocouples to the areas
indicated in Figure 7-4 on page 58 (RF, Baseband).
Note: Make sure that your system design provides sufficient cooling for the module.
(For acceptance, certification, quality, and production (including RF) test
suggestions, see Testing on page 74.)
—>>I
Rev 5 Jul.17 60
41110788
8
8: Regulatory Compliance and Industry
Certifications
This module is designed to meet, and upon commercial release, will meet the
requirements of the following regulatory bodies and regulations, where applicable:
•Federal Communications Commission (FCC) of the United States
•The Certification and Engineering Bureau of Industry Canada (IC)
•The National Communications Commission (NCC) of Taiwan, Republic of China
•Ministry of Internal Affairs and Communications (MIC) of Japan
•Radio Equipment Directive (RED) of the European Union
Upon commercial release, the following industry certifications will have been
obtained, where applicable:
•GCF
•PTCRB
Additional certifications and details on specific country approvals may be obtained
upon customer request—contact your Sierra Wireless account representative for
details.
Additional testing and certification may be required for the end product with an
embedded EM7565 module and are the responsibility of the OEM. Sierra Wireless
offers professional services-based assistance to OEMs with the testing and
certification process, if required.
Important Notice
Because of the nature of wireless communications, transmission and reception of
data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or
be totally lost. Although significant delays or losses of data are rare when wireless
devices such as the Sierra Wireless module are used in a normal manner with a well-
constructed network, the Sierra Wireless module should not be used in situations
where failure to transmit or receive data could result in damage of any kind to the user
or any other party, including but not limited to personal injury, death, or loss of
property. Sierra Wireless and its affiliates accept no responsibility for damages of any
kind resulting from delays or errors in data transmitted or received using the Sierra
Wireless module, or for failure of the Sierra Wireless module to transmit or receive
such data.
Safety and Hazards
Do not operate your EM7565 module:
•In areas where blasting is in progress
•Where explosive atmospheres may be present including refuelling points, fuel
depots, and chemical plants
•Near medical equipment, life support equipment, or any equipment which may be
susceptible to any form of radio interference. In such areas, the EM7565 module
MUST BE POWERED OFF. Otherwise, the EM7565 module can transmit signals
that could interfere with this equipment.
Regulatory Compliance and Industry Certifications
Rev 5 Jul.17 61 41110788
In an aircraft, the EM7565 module MUST BE POWERED OFF. Otherwise, the
EM7565 module can transmit signals that could interfere with various onboard
systems and may be dangerous to the operation of the aircraft or disrupt the
cellular network. Use of a cellular phone in an aircraft is illegal in some
jurisdictions. Failure to observe this instruction may lead to suspension or denial
of cellular telephone services to the offender, or legal action or both.
Some airlines may permit the use of cellular phones while the aircraft is on the
ground and the door is open. The EM7565 module may be used normally at this
time.
Important Compliance Information for
North American Users
The EM7565 module, upon commercial release, will have been granted modular
approval for mobile applications. Integrators may use the EM7565 module in their
final products without additional FCC/IC (Industry Canada) certification if they
meet the following conditions. Otherwise, additional FCC/IC approvals must be
obtained.
1. At least 20 cm separation distance between the antenna and the user’s body
must be maintained at all times.
2. To comply with FCC/IC regulations limiting both maximum RF output power
and human exposure to RF radiation, the maximum antenna gain including
cable loss in a mobile-only exposure condition must not exceed the limits
stipulated in Table 8-1 on page 61.
Table 8-1: Antenna Gain Specifications
Device Technology Band Frequency
(MHz) Maximum antenna gain
(dBi)
EM7565 Embedded
Module LTE 21850–1910 TBD
41710–1755 TBD
5824–849 TBD
72500–2570 TBD
12 699–716 TBD
13 777–787 TBD
26 814–849 TBD
30 2305–2315 1 (See *Important note below.)
41 2496–2690 TBD
UMTS 21850–1910 TBD
41710–1755 TBD
5824–849 TBD
Product Technical Specification
Rev 5 Jul.17 62 41110788
*Important: The FCC and IC have a strict EIRP limit in Band 30 for mobile and portable
stations in order to protect adjacent satellite radio, aeronautical mobile telemetry, and deep
space network operations. Mobile and portable stations must not have antenna gain
exceeding 1 dBi in Band 30. Additionally, both the FCC and IC prohibit the use of external
vehicle-mounted antennas for mobile and portable stations in this band.
Fixed stations may use antennas with higher gain in Band 30 due to relaxed EIRP limits.
EM7565 modules used as fixed subscriber stations in Canada or fixed customer premises
equipment (CPE) stations in the United States may have an antenna gain up to 10 dBi in
Band 30, however, the use of outdoor antennas or outdoor station installations are
prohibited except if professionally installed in locations that are at least 20 meters from
roadways or in locations where it can be shown that the ground power level of -44 dBm per
5 MHz in the bands 2305–2315 MHz and 2350–2360 MHz or -55 dBm per 5 MHz in the
bands 2315–2320 MHz and 2345–2350 MHz will not be exceeded at the nearest roadway.
For the purposes of this notice, a roadway includes a highway, street, avenue, parkway,
driveway, square, place, bridge, viaduct or trestle, any part of which is intended for use by
the general public for the passage of vehicles.
Mobile carriers often have limits on total radiated power (TRP), which requires an efficient
antenna. The end product with an embedded module must output sufficient power to meet
the TRP requirement but not too much to exceed FCC/IC's EIRP limit. If you need assis-
tance in meeting this requirement, please contact Sierra Wireless.
3. The EM7565 module may transmit simultaneously with other collocated radio
transmitters within a host device, provided the following conditions are met:
·Each collocated radio transmitter has been certified by FCC/IC for mobile
application.
·At least 20 cm separation distance between the antennas of the collocated
transmitters and the user’s body must be maintained at all times.
·The output power and antenna gain in a collocated configuration must not
exceed the limits and configurations stipulated in Table 8-2 on page 62.
Table 8-2: Collocated Radio Transmitter Specifications
Device Technology Frequency
(MHz) EIRP Limit
(dBm)
Collocated
transmittersa
a. Valid collocated transmitter combinations: WLAN+BT; WiMAX+BT.
(WLAN+WiMAX+BT is not permitted.)
WLAN 2400–2500 25
5150–5850 27
WiMAX 2300–2400 25
2500–2700 25
3300–3800 25
BT 2400–2500 15
Regulatory Compliance and Industry Certifications
Rev 5 Jul.17 63 41110788
4. A label must be affixed to the outside of the end product into which the
EM7565 module is incorporated, with a statement similar to the following:
· This device contains FCC ID: [TBD]
Contains transmitter module IC: [TBD] where [TBD] is the module’s
certification number.
5. A user manual with the end product must clearly indicate the operating
requirements and conditions that must be observed to ensure compliance
with current FCC/IC RF exposure guidelines.
The end product with an embedded EM7565 module may also need to pass the
FCC Part 15 unintentional emission testing requirements and be properly
authorized per FCC Part 15.
Note: If this module is intended for use in a portable device, you are responsible
for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and
IC RSS-102.
Rev 5 Jul.17 64
41110788
A
A: Audio Support
The EM7565 host I/O connector provides pins to support PCM or I2S audio interfaces
as listed in Table A-1.
Table A-1: Host interface (67-pin) Connections—Module Viewa
Pin Signal name Pin
typebDescription Direction
to module Active
state
Voltage levels (V)
Min Typ Max
20 PCM_CLK / I2S_CLKc-(PCM_CLK)
PCM Clock Input High 1.17 1.80 2.10
Low -0.30 0.63
Output High 1.35 1.80 1.90
Low 00.45
(I2S_CLK)
I2S Clock Output High 1.35 1.90
Low 00.45
22 PCM_DIN / I2S DIN -PCM Data In/
I2S Data In Input High 1.17 1.80 2.10
Low -0.30 0.63
24 PCM_DOUT / I2S DOUT -PCM Data Out/
I2S Data Out Output High 1.35 1.80 1.90
Low 00.45
28 PCM_SYNC / I2S_WSc-(PCM_SYNC)
PCM Sync Input High 1.17 1.80 2.10
Low -0.30 0.63
Output High 1.35 1.80 1.90
Low 00.45
(I2S_WS)
I2S Word Select Output High 1.35 1.90
Low 00.45
56 I2C_DATAd- I2C serial bus data
(for external codec) Input High 1.17 1.80 2.10
Low -0.30 0.63
Output High 1.35 1.80 1.90
Low 00.45
58 I2C_CLKd- I2C serial bus clock
(for external codec)
Input High 1.17 1.80 2.10
Low -0.30 0.63
Output High 1.35 1.80 1.90
Low 00.45
a. The host should leave all ‘NC’ (‘no connect) pins unconnected.
b. I—Input; O—Digital output; OC—Open Collector output; PU—Digital input (internal pull up); PD—Digital input
(internal pull down); V—Power or ground
c. Functions as input when in PCM slave mode. Otherwise, functions as output in either PCM or I2S master
mode.
d. Keep this pin NC when not used (I2C function is not needed).
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Audio Support
Rev 5 Jul.17 65 41110788
PCM/I2S Audio Interface
The module implements a PCM/I2S digital audio interface using a dedicated serial
link for digital audio data; all other signals, such as subcoding and control, are
transmitted separately. Default setting is PCM slave mode, but this can be
switched, using AT commands, to PCM master mode, I2S master mode, or I2S
slave mode.
PCM/I2S signals are summarized in the following table.
PCM
The PCM interface supports the following features:
•Either master mode or slave mode
•Auxiliary PCM
•8k and 16k sampling rates
•Linear, µ-law and A-law formats
•Padding setting (enable or disable)
•8, 16, 32, 64, 128, and 256 bits per frame
•Bit frequency (sample rate * bits per frame)
The following figures and table illustrate PCM signals timing.
Figure A-1: PCM_SYNC Timing
Figure A-2: PCM Codec to Module Timing
Table A-2: PCM/I2S Interface Signals
Signal name Pin Description
PCM_CLK/I2S_CLK 20 PCM Clock/I2S Clock
PCM_DIN/I2S_DIN 22 PCM Data In/I2S Data In
PCM_DOUT/I2S_DOUT 24 PCM Data Out/I2S Data Out
PCM_SYNC/I2S_WS 28 PCM Sync/I2S Word Select
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Product Technical Specification
Rev 5 Jul.17 66 41110788
Figure A-3: Module to PCM Codec Timing
Table A-3: PCM Timinga
Parameter Description Min Typ Max Units
T(sync) PCM_FS cycle time -125 -us
T(synch) PCM_FS high time -488 -ns
T(cyncl) PCM_FS low time -124.5 -us
T(clk) PCM_CLK cycle time -488 -ns
T(clkh) PCM_CLK high time -244 -ns
T(clkl) PCM_CLK low time -244 -ns
T(sync_offset) PCM_SYNC offset time to PCM_CLK falling -122 -ns
T(sudin) PCM_DIN setup time before falling edge of PCM_CLK 60 - - ns
T(hdin) PCM_DIN hold time after falling edge of PCM_CLK 60 - - ns
T(pdout) Delay from PCM_CLK rising to PCM_DOUT valid - - 60 ns
T(zdout) Delay from PCM_CLK falling to PCM_DOUT HIGH-Z - - 60 ns
a. Maximum PCM clock rate is 2.048 MHz.
Audio Support
Rev 5 Jul.17 67 41110788
I2S
The I2S interface can be used to transfer serial digital audio to or from an external
stereo DAC/ADC and supports the following features:
•Master mode only (follows Philips I2S bus specifications for timing)
•48K sampling rate
•16 bits per channel
•1536 kHz bit clock
Figure A-4: I2S Transmitter Timing Diagram
Table A-4: Master Transmitter with Data Rate = 3.072 MHz (±10%)a
a. maximum sample rate = 48 KHz at 3.072 MHz (32 bits per sample)
Parameter Description Condition Min Typ Max Units
TClock period I2S requirement: min T=293 293 326 359 ns
t(hc) Clock high I2S requirement: min > 0.35T 120 - - ns
t(lc) Clock low I2S requirement: min > 0.35T 120 - - ns
t(dtr) Delay I2S requirement: max < 0.8T --250 ns
t(htr) Hold time I2S requirement: min > 0 100 - - ns
Rev 5 Jul.17 68
41110788
B
B: Antenna Specification
This appendix describes recommended electrical performance criteria for main path,
diversity path, and GNSS antennas used with AirPrime embedded modules.
The performance specifications described in this section are valid while antennas are
mounted in the host device with antenna feed cables routed in their final application
configuration.
Note: Antennas should be designed before the industrial design is finished to make sure that
the best antennas can be developed
Recommended Main/Diversity Antenna
Specifications
Table B-1: Antenna Requirements a
Parameter Requirements Comments
Antenna system (LTE) External multi-band 2x2
MIMO antenna system (Ant1/
Ant2)b
(3G) External multi-band antenna
system with diversity (Ant1/Ant2)c
If Ant2 includes GNSS, then it must also satisfy
requirements in Table B-2 on page 70.
Operating bands—
Antenna 1 All supporting Tx and Rx frequency
bands.
Operating bands—
Antenna 2 All supporting Rx frequency bands,
plus GNSS frequency bands if
Antenna 2 is used in shared
Diversity/MIMO/GNSS mode.
VSWR of Ant1 and Ant2 •< 2:1 (recommended)
•< 3:1 (worst case)
On all bands including band edges
Total radiated efficiency of
Ant1 and Ant2 > 50% on all bands •Measured at the RF connector.
•Includes mismatch losses, losses in the
matching circuit, and antenna losses,
excluding cable loss.
•Sierra Wireless recommends using
antenna efficiency as the primary
parameter for evaluating the antenna
system.
Peak gain is not a good indication of
antenna performance when integrated
with a host device (the antenna does not
provide omni-directional gain patterns).
Peak gain can be affected by antenna
size, location, design type, etc.—the
antenna gain patterns remain fixed unless
one or more of these parameters change.
Antenna Specification
Rev 5 Jul.17 69 41110788
Radiation patterns of Ant1
and Ant2 Nominally Omni-directional
radiation pattern in azimuth plane.
Envelope correlation
coefficient between Ant1
and Ant2
•< 0.4 on low Rx bands (up to
1500 MHz)
•< 0.2 on high Rx bands (over
1500 MHz)
Mean Effective Gain of
Ant1 and Ant2 (MEG1,
MEG2)
-3 dBi
Ant1 and Ant2 Mean
Effective Gain Imbalance I
MEG1 / MEG2 I
< 2 dB for MIMO operation
< 6 dB for diversity operation
Maximum antenna gain Must not exceed antenna gains
due to RF exposure and ERP/
EIRP limits, as listed in the
module’s FCC grant.
See Important Compliance Information for
North American Users on page 61.
Isolation between Ant1 and
Ant2 (S21) > 10 dB •If antennas can be moved, test all
positions for both antennas.
•Make sure all other wireless devices
(Bluetooth or WLAN antennas, etc.) are
turned OFF to avoid interference.
Power handling •> 1 W •Measure power endurance over 4 hours
(estimated talk time) using a 1 W CW
signal—set the CW test signal frequency
to the middle of each supporting Tx band.
•Visually inspect device to ensure there is
no damage to the antenna structure and
matching components.
•VSWR/TIS/TRP measurements taken
before and after this test must show
similar results.
a. These worst-case VSWR figures for the transmitter bands may not guarantee RSE levels to be within regulatory limits. The
device alone meets all regulatory emissions limits when tested into a cabled (conducted) 50 ohm system. With antenna
designs with up to 2.5:1 VSWR or worse, the radiated emissions could exceed limits. The antenna system may need to be
tuned in order to meet the RSE limits as the complex match between the module and antenna can cause unwanted levels of
emissions. Tuning may include antenna pattern changes, phase/delay adjustment, passive component matching. Examples of
the application test limits would be included in FCC Part 22, Part 24 and Part 27,test case 4.2.2 for WCDMA
(ETSI EN 301 908-1), where applicable.
b. Ant1—Primary, Ant2—Secondary (Diversity/MIMO/GNSS)
c. Ant1—Primary, Ant2—Secondary (Diversity/GNSS)
Table B-1: Antenna Requirements (Continued)a
Parameter Requirements Comments
Product Technical Specification
Rev 5 Jul.17 70 41110788
Recommended GNSS Antenna
Specifications
Antenna Tests
The following guidelines apply to the requirements described in Table B-1 on
page 68 and Table B-2 on page 70:
•Perform electrical measurements at room temperature (+20°C to +26°C)
unless otherwise specified
•For main and diversity path antennas, make sure the antennas (including
contact device, coaxial cable, connectors, and matching circuit with no more
Table B-2: GNSS Antenna Requirements
Parameter Requirements Comments
Frequency range •Wide-band GNSS:
1559–1606 MHz recommended
•Narrow-band GPS:
1575.42 MHz ±2MHz minimum
•Narrow-band Galileo:
1575.42 MHz ±2MHz minimum
•Narrow-band BeiDou:
1561.098 MHz ±2 MHz minimum
•Narrow-band GLONASS:
1601.72 MHz ±4.2 MHz minimum
•Narrow-band QZSS
1575.42 MHz ±2MHz minimum
Field of view (FOV) •Omni-directional in azimuth
•-45° to +90° in elevation
Polarization
(average Gv/Gh) >0dB Vertical linear polarization is
sufficient.
Free space average gain
(Gv+Gh) over FOV > -6 dBi (preferably > -3 dBi) Gv and Gh are measured
and averaged over -45° to
+90° in elevation, and ±180°
in azimuth.
Gain •Maximum gain and uniform
coverage in the high elevation
angle and zenith.
•Gain in azimuth plane is not
desired.
Average 3D gain >-5dBi
Isolation between GNSS
and Ant1 > 10 dB in all uplink bands
Typical VSWR < 2.5:1
Polarization Any other than LHCP (left-hand
circular polarized) is acceptable.
Antenna Specification
Rev 5 Jul.17 71 41110788
than six components, if required) have nominal impedances of 50 across
supported frequency bands.
•All tests (except isolation/correlation coefficient)—Test the main or diversity
antenna with the other antenna terminated.
•Any metallic part of the antenna system that is exposed to the outside
environment needs to meet the electrostatic discharge tests per IEC61000-4-
2 (conducted discharge +8kV).
•The functional requirements of the antenna system are tested and verified
while the embedded module’s antenna is integrated in the host device.
Note: Additional testing, including active performance tests, mechanical, and accelerated
life tests can be discussed with Sierra Wireless’ engineering services. Contact your Sierra
Wireless representative for assistance.
Rev 5 Jul.17 72
41110788
C
C: Design Checklist
This chapter provides a summary of the design considerations mentioned throughout
this guide. This includes items relating to the power interface, RF integration, thermal
considerations, cabling issues, and so on.
Note: This is NOT an exhaustive list of design considerations. It is expected that you will
employ good design practices and engineering principles in your integration.
Table C-1: Hardware Integration Design Considerations
Suggestion Section where discussed
Component placement
If an ESD suppressor is not used on the host device, allow space on the
SIM connector for series resistors in layout. (Up to 100 may be used
depending on ESD testing requirements).
SIM Implementation on
page 30
Minimize RF cable losses as these affect performance values listed in
product specification documents. RF Connections on page 35
Antennas
Match the module/antenna coax connections to 50 —mismatched
antenna impedance and cable loss negatively affect RF performance. RF Connections on page 35
If installing UMTS and CDMA modules in the same device, consider using
separate antennas for maximum performance. Antenna and Cabling on
page 36
Power
Make sure the power supply can handle the maximum current specified
for the module type. Power Consumption on
page 46
Limit the total impedance of VCC and GND connections to the SIM at the
connector to less than 1 (including any trace impedance and lumped
element components—inductors, filters, etc.). All other lines must have a
trace impedance less than 2 .
SIM Implementation on
page 30
Decouple the VCC line close to the SIM socket. The longer the trace
length (impedance) from socket to module, the greater the capacitance
requirement to meet compliance tests.
SIM Implementation on
page 30
PCB signal routing
USB 2.0/3.0—Route these signals over 90 differential lines on the
PCB.
I2C port—If supported, route these signals away from noise-sensitive
signals on the PCB.
PCM port—If supported, route these signals away from noise-sensitive
signals on the PCB.
EMI/ESD
Investigate sources of localized interference early in the design cycle. Methods to Mitigate Decreased
Rx Performance on page 38
Design Checklist
Rev 5 Jul.17 73 41110788
Provide ESD protection for the SIM connector at the exposed contact
point (in particular, the CLK, VCC, IO, and RESET# lines). SIM Implementation on
page 30
Keep very low capacitance traces on the UIM_DATA and UIM_CLK
signals. SIM Implementation on
page 30
To minimize noise leakage, establish a very good ground connection
between the module and host. Ground Connection on page 37
Route cables away from noise sources (for example, power supplies,
LCD assemblies, etc.). Methods to Mitigate Decreased
Rx Performance on page 38
Shield high RF-emitting components of the host device (for example,
main processor, parallel bus, etc.). Methods to Mitigate Decreased
Rx Performance on page 38
Use discrete filtering on low frequency lines to filter out unwanted high-
order harmonic energy. Methods to Mitigate Decreased
Rx Performance on page 38
Use multi-layer PCBs to form shielding layers around high-speed clock
traces. Methods to Mitigate Decreased
Rx Performance on page 38
Thermal
Test to worst case operating conditions—temperature, voltage, and
operation mode (transmitter on 100% duty cycle, maximum power).
Thermal Considerations on
page 58
Use appropriate techniques to reduce module temperatures (for example,
airflow, heat sinks, heat-relief tape, module placement, etc.). Thermal Considerations on
page 58
Host/Modem communication
Make sure the host USB driver supports remote wakeup, resume, and
suspend operations, and serial port emulation. [4] AirCard/AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
When no valid data is being sent, do not send SOF tokens from the host
(causes unnecessary power consumption). [4] AirCard/AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
Table C-1: Hardware Integration Design Considerations (Continued)
Suggestion Section where discussed
—>>I
Rev 5 Jul.17 74
41110788
D
D: Testing
Note: All AirPrime embedded modules are factory-tested to ensure they conform to published
product specifications.
Developers of OEM devices integrating Sierra Wireless AirPrime embedded modules
should include a series of test phases in their manufacturing process to make sure
that their devices work properly with the embedded modules.
Suggested phases include:
•Acceptance Testing—Testing of modules when they are received from Sierra
Wireless
•Certification Testing—Testing of completed devices to obtain required certifica-
tions before beginning mass production
•Production Testing—Testing of completed devices with the modules embedded
•Quality Assurance Testing—Post-production
AT Command Entry Timing Requirement
Some AT commands require time to process before additional commands are
entered. For example, the modem will return “OK” when it receives AT!DAFTMACT.
However, if AT!DASBAND is received too soon after this, the modem will return an
error.
When building automated test scripts, ensure that sufficient delays are embedded
where necessary to avoid these errors.
Acceptance Testing
Note: Acceptance testing is typically performed for each shipment received.
When you receive a shipment from Sierra Wireless, you should make sure it is
suitable before beginning production.
From a random sampling of units, test that:
•Units are operational
•Units are loaded with the correct firmware version
Acceptance Test Requirements
To perform the suggested tests, you require a test system in which to temporarily
install the module, and you must be able to observe the test device’s LED indicator.
Testing
Rev 5 Jul.17 75 41110788
Acceptance Test Procedure
The following is a suggested acceptance testing procedure using Sierra Wireless’
Skylight™ software:
Note: You can perform
these tests using appro-
priate AT commands.
Test 1: Check Power-up and Initialization
1. After installing the module, start the test system.
2. Launch Skylight.
3. Check the LED—If the LED is off, there is a problem with the module or with
the connection to the LED.
Test 2: Check Version Numbers
1. From Skylight, select Help > About.
2. Verify that the firmware version in the About window is correct.
3. Close the About window.
If the module fails either of these tests, or is not recognized by Skylight:
1. Replace the module with one that is known to work correctly and repeat the
tests.
2. If the tests are successful, reinstall the original module and repeat the tests.
If the module still does not work correctly, contact your account manager.
Certification Testing
Note: Typically, certification testing of your device with the integrated module is required
one time only.
The AirPrime embedded module has been certified as described in Regulatory
Compliance and Industry Certifications on page 60.
When you produce a host device with a Sierra Wireless AirPrime embedded
module, you must obtain certifications for the final product from appropriate
regulatory bodies in the jurisdictions where it will be distributed.
The following are some of the regulatory bodies from which you may require
certification—it is your responsibility to make sure that you obtain all necessary
certifications for your product from these or other groups:
•FCC (Federal Communications Commission—www.fcc.gov)
•Industry Canada (www.ic.gc.ca)
•GCF (Global Certification Forum—www.globalcertificationforum.org) outside
of North America
•PTCRB (PCS Type Certification Review Board—www.ptcrb.com) in North
America
Product Technical Specification
Rev 5 Jul.17 76 41110788
Production Testing
Note: Production testing typically continues for the life of the product.
Production testing ensures that, for each assembled device, the module is
installed correctly (I/O signals are passed between the host and module), and the
antenna is connected and performing to specifications (RF tests).
Typical items to test include:
•Host connectivity
•Baseband (host/module connectors)
•RF assembly (Tx and/or Rx, as appropriate)
•Network availability
•Host/device configuration issues
Note: The number and types of tests to perform are your decision—the tests listed in this
section are guidelines only. Make sure that the tests you perform exercise functionality to
the degree that your situation requires.
Use an appropriate test station for your testing environment (see Acceptance Test
Requirements on page 74 for suggestions) and use AT commands to control the
integrated module.
Note: Your test location must be protected from ESD to avoid interference with the module
and antenna(s), assuming that your test computer is in a disassembled state.
Also, consider using an RF shielding box—local government regulations may prohibit
unauthorized transmissions.
Functional Production Test
This section presents a suggested procedure for performing a basic manual
functional test on a laboratory bench using an EM7565 Embedded Module and a
hardware development kit. When you have become familiar with the testing
method, use it to develop your own automated production testing procedures.
Suggested Production Tests
Consider the following tests when you design your production test procedures for
devices with the AirPrime module installed.
•Visual check of the module’s connectors and RF assemblies
•Module is operational
•USB/PCIe connection is functional
•LED is functional
•Power on/off
•Firmware revision check
•Rx tests on main and auxiliary paths
•Tx test
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Testing
Rev 5 Jul.17 77 41110788
Production Test Procedure
The following is a suggested test plan—you must decide which tests are
appropriate for your product. You may wish to add additional tests that more fully
exercise the capabilities of your product.
Using an appropriate Dev Kit-based test station, and referring to the appropriate
AT command references:
1. Visually inspect the module’s connectors and RF assemblies for obvious
defects before installing it in the test station.
2. Ensure that the module is turned off before beginning your tests—Drive
Full_Card_Power_Off# low or leave floating.
3. Test Full_Card_Power_Off#—Turn on the module by driving Full_Card_Pow-
er_Off# high.
4. Test USB functionality—Check for USB or PCIe enumeration.
·(Windows systems) The Device Manager shows the device under Network
adapters. For example:
5. Make sure your modem is connected and running, and then establish contact
with the module:
·Windows systems: Use a terminal emulation/communications program
such as Microsoft HyperTerminal® to connect to the Sierra Wireless modem
(see listings in Step 4):
a. Start HyperTerminal.
b. Select File > Connection Description. The Connection Description dialog
box appears.
i. Type Sierra in the Name box and click OK. The Connect To dialog box
appears.
ii. Click OK without changing any of the displayed information. The
Connect dialog box appears.
iii. Click Cancel.
Note: If necessary, use
AT E1
to enable echo.
iv. Type ATZ in the HyperTerminal window. If the connection is estab-
lished, the message OK appears.
6. Display the firmware version:
·AT+GMR
7. Test the LED—Set the LED in blinking mode using this command, then
visually verify that the LED turns off and on:
·AT!LDTEST=0,0 (LED on)
·AT!LDTEST=0,1 (LED off)
8. Unlock the extended AT command set. (Note: Use AT!ENTERCND? to check
command syntax, which is SKU-dependent.):
Product Technical Specification
Rev 5 Jul.17 78 41110788
·AT!ENTERCND=”<password>”
9. Put the module in diagnostic/factory test mode:
·AT!DAFTMACT
10. Communicate with the SIM using +CPIN or +CIMI.
When performing RF tests, use a test platform as described in Suggested
Testing Equipment on page 87.
11. Test RF transmission, if desired:
·(UMTS) See UMTS (WCDMA) RF Transmission Path Test on page 78.
·(LTE) See LTE RF Transmission Path Test on page 80.
12. Test RF reception, if desired:
·(UMTS) See UMTS (WCDMA) RF Receive Path Test on page 82.
·(LTE) See LTE RF Receive Path Test on page 84.
13. Test standalone GNSS functionality—See GNSS RF Receive Path Test on
page 86.
14. Drive Full_Card_Power_Off# low (or leave floating) and confirm that the
module powers down:
·Windows systems—The Sierra Wireless items under the Ports (COM &
LPT) entry in Device Manager disappear as the module powers off.
UMTS (WCDMA) RF Transmission Path Test
Note: This procedure segment is performed in Step 11 of the Production Test Procedure
on page 77.
The suggested test procedure that follows uses the parameters in Table D-1.
Table D-1: Test Settings—UMTS Transmission Path
Band Band ID Tx Channela
a. Channel values shown are at the center of the
corresponding bands.
2100 MHz Band 1 99750
1900 MHz Band 2 15b
b. Either 15 (WCDMA1900A) or 16 (WCD-
MA1900B) may be used for testing.
9400
1800 MHz Band 3 25 1112
1700 MHz Band 4 28 1412
850 MHz Band 5 22 4182
800 MHz Band 6 TBD TBD
900 MHz Band 8 29 2787
1700 MHz Band 9 31 8837
800 MHz Band 19 TBD TBD
mm unit-3‘ m— um
Testing
Rev 5 Jul.17 79 41110788
To test the DUT’s transmitter path:
Note: This procedure
describes steps using the
"Power Meter: Gigatronics
8651A” (with Option 12
and Power Sensor
80701A).
1. Set up the power meter:
a. Make sure the meter has been given sufficient time to warm up, if
necessary, to enable it to take accurate measurements.
b. Zero-calibrate the meter.
c. Enable MAP mode.
2. Prepare the DUT using the following AT commands:
a. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
b. AT!DAFTMACT (Enter test mode.)
c. AT!DASBAND=<bandValue> (Set frequency band.)
·See Table D-1 on page 78 for appropriate <bandValue> values
d. AT!DASCHAN=<channel> (Set modem channel)
·See Table D-1 on page 78 for appropriate <channel> values
e. AT!DASTXON (Turns on the transmit path.)
f. AT!DAWSTXCW=0 (Use a modulated carrier.)
g. AT!DAWSTXPWR=1, 10 (Set the power level.)
h. Take the measurement.
i. Repeat steps g–h with different Tx power levels if desired.
j. AT!DASTXOFF (Turn off the transmitter.)
3. Test limits—Run ten or more good DUTs through this test procedure to
obtain a nominal output power value.
·Apply a tolerance of 5 to 6 dB to each measurement (assuming a good
setup design).
·Monitor these limits during mass-production ramp-up to determine if further
adjustments are needed.
Note: The module has a nominal output power of +23 dBm
1 dB in WCDMA mode.
However, the value measured by the power meter is significantly influenced (beyond the
stated
1 dB output power tolerance) by the test setup (host RF cabling loss, antenna
efficiency and pattern, test antenna efficiency and pattern, and choice of shield box).
Note: When doing the same test over the air in an RF chamber, values are likely to be
significantly lower.
Product Technical Specification
Rev 5 Jul.17 80 41110788
LTE RF Transmission Path Test
Note: This procedure segment is performed in Step 11 of the Production Test Procedure
on page 77.
The suggested test procedure that follows uses the parameters in Table D-2. .
Table D-2: Test Settings—LTE Transmission Path
Band # Band ID Tx Channela
a. Channel values shown are at the center of the corresponding bands.
2100 MHz B1 34 18300
1900 MHz B2 43 18900
1800 MHz B3 44 19575
1700 MHz B4 42 20175
850 MHz B5 45 20525
2600 MHz B7 35 21100
900 MHz B8 47 21625
1800 MHz B9 48 TBD
700 MHz B12 50 23095
700 MHz B13 36 23230
850 MHz B18 54 23925
850 MHz B19 55 24075
800 MHz B20 56 24300
850 MHz B26 62 26865
700 MHz B28 64 27435
2300 MHz B30 66 27710
2500 MHz B41 76 40620
3500 MHz B42 TBD TBD
3700 MHz B43 TBD TBD
3600 MHz B48b
b. B48 support pending future release
TBD TBD
1700 MHz B66 TBD TBD
mm unit-3‘ m— um
Testing
Rev 5 Jul.17 81 41110788
To test the DUT’s transmitter path:
Note: This procedure
describes steps using the
"Power Meter: Gigatronics
8651A” (with Option 12
and Power Sensor
80701A).
1. Set up the power meter:
a. Make sure the meter has been given sufficient time to warm up, if
necessary, to enable it to take accurate measurements.
b. Zero-calibrate the meter.
c. Enable MAP mode.
2. Prepare the DUT using the following AT commands:
a. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
b. AT!DAFTMACT (Enter test mode.)
c. AT!DASBAND=<bandValue> (Set frequency band (e.g. 34 for LTE B1).)
·See Table D-2 on page 80 for appropriate <bandValue> values
d. AT!DALSRXBW=3 (Set Rx bandwidth to 10 MHz.)
e. AT!DALSTXBW=3 (Set Tx bandwidth to 10 MHz.)
f. AT!DASCHAN=<channel> (Set modem channel (e.g. 18300 for
LTE B1).)
·See Table D-2 on page 80 for appropriate <channel> values
g. AT!DALSTXMOD=0 (Set Tx modulation type to QPSK.)
h. AT!DALSWAVEFORM=1,12,0,19 (Set the Tx waveform characteristics.)
i. AT!DALSNSVAL=1 (Set the LTE NS (Net Sig) value.)
j. AT!DASTXON (Turn on the transmit path.)
k. AT!DALSTXPWR=1, 10 (Set the power level.)Take the measurement.
l. Repeat steps k–k with different Tx power levels if desired.
m. AT!DALSTXPWR=0, 0 (Disable the transmitter output.)
n. AT!DASTXOFF (Turn off the transmitter.)
3. Test limits—Run ten or more good DUTs through this test procedure to
obtain a nominal output power value.
·Apply a tolerance of 5 to 6 dB to each measurement (assuming a good
setup design).
·Monitor these limits during mass-production ramp-up to determine if further
adjustments are needed.
Note: The module has a nominal output power of +23 dBm
1 dB in LTE mode. However,
the value measured by the power meter is significantly influenced (beyond the stated
1 dB output power tolerance) by the test setup (host RF cabling loss, antenna efficiency
and pattern, test antenna efficiency and pattern, and choice of shield box).
Product Technical Specification
Rev 5 Jul.17 82 41110788
Note: When doing the same test over the air in an RF chamber, values are likely to be
significantly lower.
UMTS (WCDMA) RF Receive Path Test
Note: This procedure segment is performed in Step 12 of Production Test Procedure on
page 77.
The suggested test procedure that follows uses the parameters in Table D-3.
Table D-3: Test Settings—UMTS Receive Path
Band # Frequencya (MHz)
a. Receive frequencies shown are 1.2 MHz offset from center
Band ID Rx Channelb
b. Channel values shown are at the center of the corresponding bands.
2100 MHz Band 1 2141.20 99750
1900 MHz Band 2 1961.20 15c
c. Either 15 (WCDMA1900A) or 16 (WCDMA1900B) may be used for testing.
9400
1800 MHz Band 3 1843.70 25 1112
1700 MHz Band 4 2133.20 28 1412
850 MHz Band 5 882.60 22 4182
800 MHz Band 6 881.20 TBD TBD
900 MHz Band 8 948.60 29 2787
1700 MHz Band 9 1863.60 31 8837
800 MHz Band 19 883.70 TBD TBD
QM:
Testing
Rev 5 Jul.17 83 41110788
To test the DUT’s receive path:
Note: This procedure
describes steps using the
Agilent 8648C signal
generator—the Rohde &
Schwarz SML03 is shown
for reference only.
1. Set up the signal generator:
a. Set the amplitude to:
·-80 dBm
b. Set the frequency for the band being tested. See Table D-3 on page 82
for frequency values.
2. Set up the DUT:
a. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
b. AT!DAFTMACT (Put modem into factory test mode.)
c. AT!DASBAND=<band> (Set frequency band.)
·See Table D-3 on page 82 for <band> values
d. AT!DASCHAN=<channel> (Set modem channel)
·See Table D-3 on page 82 for <channel> values
e. AT!DASLNAGAIN=0 (Set the LNA to maximum gain.)
f. AT!DAWGAVGAGC=9400,0 (For PCS1900, channel 9400 as an example.)
The returned value is the RSSI in dBm.
3. Test limits—Run ten or more good DUTs through this test procedure to
obtain a nominal received power value.
·Apply a tolerance of 5 to 6 dB to each measurement (assuming a good
setup design).
·Make sure the measurement is made at a high enough level that it is not
influenced by DUT-generated and ambient noise.
·The Signal Generator power level can be adjusted and new limits found if
the radiated test needs greater signal strength.
·Monitor these limits during mass-production ramp-up to determine if further
adjustments are needed.
Note: The value measured from the DUT is significantly influenced by the test setup and
DUT design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency
and pattern, and choice of shield box).
Product Technical Specification
Rev 5 Jul.17 84 41110788
4. Test diversity paths:
a. Set up the signal generator as in Step 1.
Note: Setup of the DUT is
the same as in Step 2,
except for a change to
AT!DAWGAVGAGC and
the addition of
AT!DAWSSCHAIN.
b. Set up the DUT:
i. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
ii. AT!DAFTMACT (Put modem into factory test mode.)
iii. AT!DASBAND=<band> (Set frequency band.)
See Table D-3 on page 82 for <band> values
iv. AT!DAWSSCHAIN=1 (Enable the secondary chain.)
v. AT!DASCHAN=<channel> (Set modem channel)
See Table D-3 on page 82 for <channel> values
vi. AT!DASLNAGAIN=0 (Set the LNA to maximum gain.)
vii. AT!DAWGAVGAGC=9400,0,1 (‘1’ indicates the diversity path is used.)
c. Test the limits as in Step 3.
LTE RF Receive Path Test
Note: This procedure segment is performed in Step 12 of the Production Test Procedure
on page 77.
The suggested test procedure that follows uses the parameters in Table D-4.
Table D-4: Test Settings—LTE Receive Path
Band # Frequencya (MHz) Band ID Rx Channelb
2100 MHz B1 2142.00 34 18300
1900 MHz B2 1962.00 43 18900
1800 MHz B3 1844.50 44 19575
1700 MHz B4 2134.50 42 20175
850 MHz B5 883.50 45 20525
2600 MHz B7 2657.00 35 21100
900 MHz B8 944.50 47 21625
1800 MHz B9 1864.40 TBD TBD
700 MHz B12 739.50 50 23095
700 MHz B13 753.00 36 23230
850 MHz B18 869.50 54 23925
850 MHz B19 884.50 55 24075
800 MHz B20 808.00 56 24300
850 MHz B26 878.50 62 26865
Testing
Rev 5 Jul.17 85 41110788
To test the DUT’s receive path (or diversity path, while connected to the diversity
antenna):
Note: This procedure
describes steps using the
Agilent 8648C signal
generator—the Rohde &
Schwarz SML03 is shown
for reference only.
1. Set up the signal generator:
a. Set the amplitude to -70 dBm
b. Set the frequency for the band being tested. See Table D-4 for frequency
values.
2. Set up the DUT:
a. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
b. AT!DAFTMACT (Put modem into factory test mode.)
c. AT!DASBAND=<band> (Set frequency band.)
·See Table D-4 for <band> values
700 MHz B28 782.50 64 27435
700 MHz B29 724.50 TBD TBD
2300 MHz B30 2357.00 66 27710
1500 MHz B32 1476.00 TBD TBD
2500 MHz B41 2595.00 76 40620
3500 MHz B42 3502.00 TBD TBD
3700 MHz B43 3702.00 TBD TBD
5200 MHz B46 5539.5 TBD TBD
3600 MHz B48c3627.00 TBD TBD
1700 MHz B66 2157.00 TBD TBD
a. Receive frequencies shown are 2 MHz offset from center
b. Channel values shown are at the center of the corresponding bands.
c. B48 support pending future release
Table D-4: Test Settings—LTE Receive Path (Continued)
Band # Frequencya (MHz) Band ID Rx Channelb
Product Technical Specification
Rev 5 Jul.17 86 41110788
d. AT!DALSRXBW=2 (Set Rx LTE bandwidth to 5MHz.)
e. AT!DALSTXBW=2 (Set Tx LTE bandwidth to 5MHz.)
f. AT!DASCHAN=<channel> (Set modem channel)
·See Table D-4 for <channel> values
g. AT!DALGAVGAGC=<channel>,0 (Get averaged Rx AGC)
·See Table D-4 for <channel> values
3. Test limits—Run ten or more good DUTs through this test procedure to
obtain a nominal received power value.
·Apply a tolerance of 5 to 6 dB to each measurement (assuming a good
setup design).
·Make sure the measurement is made at a high enough level that it is not
influenced by DUT-generated and ambient noise.
·The Signal Generator power level can be adjusted and new limits found if
the radiated test needs greater signal strength.
·Monitor these limits during mass-production ramp-up to determine if further
adjustments are needed.
Note: The value measured from the DUT is significantly influenced by the test setup and
DUT design (host RF cabling loss, antenna efficiency and pattern, test antenna efficiency
and pattern, and choice of shield box).
GNSS RF Receive Path Test
The GNSS receive path uses either the dedicated GNSS connector or the shared
Diversity/MIMO/GNSS connector.
To test the GNSS receive path:
1. Inject a carrier signal at -110dBm, frequency 1575.52 MHz into the GNSS Rx
path at the connector. (Note that this frequency is 100 kHz higher than the
actual GPS L1 center frequency.)
2. Test the signal carrier-to-noise level at the GNSS receiver:
a. AT!ENTERCND=”<password>” (Unlock extended AT command set.)
b. AT!DAFTMACT (Put modem into factory test mode.)
c. AT!DACGPSTESTMODE=1 (Start CGPS diagnostic task.)
d. AT!DACGPSSTANDALONE=1 (Enter standalone RF mode.)
e. AT!DACGPSMASKON (Enable log mask.)
f. AT!DACGPSCTON (Return signal-to-noise and frequency measurements.)
g. Repeat AT!DACGPSCTON five to ten times to ensure the measurements
are repeatable and stable.
3. Leave the RF connection to the embedded module intact, and turn off the
signal generator.
4. Take several more !DACGPSCTON readings. This will demonstrate a 'bad'
signal in order to set limits for testing, if needed. This frequency offset should
fall outside of the guidelines in the note below, which indicates that the CtoN
result is invalid.
Testing
Rev 5 Jul.17 87 41110788
5. (Optional) Turn the signal generator on again, and reduce the level to -
120dBm. Take more !DACGPSCTON readings and use these as a reference
for what a marginal/poor signal would be.
Note: The response to
AT!DACGPSCTON
for a good connection should show CtoN within
58 +/- 5dB and Freq (frequency offset) within 100000 Hz +/- 5000 Hz .
Quality Assurance Testing
Note: QA is an ongoing
process based on random
samples from a finished
batch of devices.
The quality assurance tests that you perform on your finished products should be
designed to verify the performance and quality of your devices.
The following are some testing suggestions that can confirm that the antenna is
interfaced properly, and that the RF module is calibrated and performs to
specifications:
•Module registration on cellular networks
•Power consumption
•Originate and terminate data and voice (if applicable) calls
•Cell hand-off
•Transmitter and receiver tests
•FER (Frame Error Rate) as an indicator of receiver sensitivity/performance
•Channel and average power measurements to verify that the device is trans-
mitting within product specifications
•RF sensitivity tests
•RF sensitivity testing—BER/BLER for different bands and modes
•Transmitter and receiver tests (based on relevant sections of the 3GPP
TS51010 and 3GPP 34121 documents)
Suggested Testing Equipment
To perform production and post-production tests, you will require appropriate
testing equipment. A test computer can be used to coordinate testing between the
integrated module (on the development kit or host) and the measurement
equipment, usually with GPIB connections. The suggested setup includes a
power meter to test RF output power and a signal generator to evaluate the
receiver.
Testing Assistance Provided by Sierra
Wireless
Extended AT commands have been implemented to assist with performing FTA
GCF tests and portions of CE Mark tests requiring radio module access. These
are documented in the [2] AirPrime EM75xx AT Command Reference
(forthcoming).
Sierra Wireless offers optional professional services based assistance to OEMs
with regulatory approvals.
Product Technical Specification
Rev 5 Jul.17 88 41110788
IOT/Operator Testing
Interoperability and Operator/Carrier testing of the finished system is the
responsibility of the OEM. The test process will be determined with the chosen
network operator(s) and will be dependent upon your business relationship with
them, as well as the product's application and sales channel strategy.
Sierra Wireless offers assistance to OEMs with the testing process, if required.
Extended AT Commands for Testing
Sierra Wireless provides the [2] AirPrime EM75xx AT Command Reference
(forthcoming), which describes proprietary AT commands that may help in
hardware integration design and testing (these commands are NOT intended for
use by end users).
Some commands from this document that may be useful for hardware integration
are listed in Table D-5 on page 88.
Table D-5: Extended AT Commands
Command Description
Password commands
!ENTERCND Enable access to password-protected commands
!SETCND Set AT command password
Modem reset and status commands
!RESET Reset the modem
!GSTATUS Return the operation status of the modem (mode, band,
channel, and so on)
Diagnostic commands
!BAND Select a set of frequency bands or reports current selection
Test commands
!DAFTMACT Put the modem into FTM (Factory Test Mode)
!DAFTMDEACT Put the modem into online mode
!DALGAVGAGC Return averaged Rx AGC value (LTE)
!DALGRXAGC Return Rx AGC value (LTE)
!DALGTXAGC Return Tx AGC value and transmitter parameters (LTE)
!DAOFFLINE Place modem offline
!DASBAND Set the frequency band (UMTS)
!DASCHAN Set the modem channel (frequency) (UMTS)
!DASLNAGAIN Set the LNA (Low Noise Amplifier) gain state
Testing
Rev 5 Jul.17 89 41110788
!DASPDM Set the PDM (Pulse Duration Modulation) value
!DASTXOFF Turn off the Tx PA (Power Amplifier)
!DASTXON Turn on the Tx PA (Power Amplifier)
!DAWGAVGAGC Return averaged RX AGC value (WCDMA)
!DAWGRXAGC Return the Rx AGC (Automatic Gain Control) value (UMTS)
!DAWINFO Return WCDMA mode RF information
!DAWSCONFIGRX Set the UMTS receiver to factory calibration settings
!DAWSPARANGE Set the PA range state machine (UMTS)
!DAWSCHAINTCM Place receive chain in test call mode (WCDMA)
!DAWSSCHAIN Enable secondary receive chain (WCDMA)
!DAWSTXCW Set the waveform used by the transmitter (UMTS)
!DAWSTXPWR Set desired Tx power level (WCDMA)
Table D-5: Extended AT Commands
Command Description
Rev 5 Jul.17 90
41110788
E
E: Packaging
Sierra Wireless AirPrime Embedded Modules are shipped in sealed boxes. The
standard packaging (see Figure E-1), contains a single tray with a capacity of 100
modules. (Note that some SKUs may have custom packaging—contact Sierra
Wireless for SKU-specific details.)
In the standard packaging, Embedded Modules are inserted, system connector first,
into the bottom portion (T1) of a two-part tray. all facing the same direction. This
allows the top edge of each Embedded Module to contact the top of the triangular
features in the top portion (T2) of the tray (see Detail A).
The top and bottom portions of the tray snap together at the four connection points.
Figure E-1: Device Placement in Module Tray
Triangular recesses hold top
edges of modules
Tray connection points
See Detail A
Detail A
System connector
Packaging
Rev 5 Jul.17 91 41110788
The tray cover is secured to the tray base with ESD-safe tape (EP1) at the
locations indicated. The tray is placed in a manufacturing box(B1), sealed with a
security tape (P1), a manufacturing label (L3) is placed on the bottom-right
corner, above the security tape, and if required a label (L4) is applied beside the
manufacturing label. (See Figure E-2.)
Figure E-2: Shipping Package
If required
(SKU-specific)
—>>I
Rev 5 Jul.17 92
41110788
F
F: References
This guide deals specifically with hardware integration issues that are unique to
AirPrime embedded modules.
Sierra Wireless Documents
The Sierra Wireless documents listed below are available from
www.sierrawireless.com. For additional documents describing embedded module
design, usage, and integration issues, contact your Sierra Wireless account
representative.
Command Documents
[1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.007)
[2] AirPrime EM75xx AT Command Reference (forthcoming)
Other Sierra Documents
[3] M.2 Dev Kit Welcome Letter (Doc# 2400323)
[4] AirCard/AirPrime USB Driver Developer’s Guide (Doc# 2130634)
Industry/Other Documents
The following non-Sierra Wireless references are not included in your documentation
package:
[5] FCC Regulations - Part 15 - Radio Frequency Devices
[6] IEC-61000-4-2 level 3 (Electrostatic Discharge Immunity Test)
[7] Mobile Station (MS) Conformance Specification; Part 4: Subscriber Interface
Module (Doc# 3GPP TS 11.10-4)
[8] PCI Express NGFF (M.2) Electromechanical Specification Revision 1.0
[9] Universal Serial Bus Specification, Rev 2.0
[10] Universal Serial Bus Specification, Rev 3.0
[11] JESD22-A114-B
[12] JESD22-C101
[13]MIPI Alliance Specification for RF Front-End Control Interface
Rev 5 Jul.17 93
41110788
G
G: Acronyms
Table G-1: Acronyms and Definitions
Acronym or term Definition
3GPP 3rd Generation Partnership Project
8PSK Octagonal Phase Shift Keying
AGC Automatic Gain Control
A-GPS Assisted GPS
API Application Programming Interface
BeiDou BeiDou Navigation Satellite System
A Chinese system that uses a series of satellites in geostationary and middle
earth orbits to provide navigational data.
BER Bit Error Rate—A measure of receive sensitivity
BLER Block Error Rate
bluetooth Wireless protocol for data exchange over short distances
CQI Channel Quality Indication
COM Communication port
CS Circuit-switched
CSG Closed Subscriber Group
CW Continuous waveform
dB Decibel = 10 x log10 (P1/P2)
P1 is calculated power; P2 is reference power
Decibel = 20 x log10 (V1/V2)
V1 is calculated voltage, V2 is reference voltage
dBm A logarithmic (base 10) measure of relative power (dB for decibels); relative to
milliwatts (m). A dBm value will be 30 units (1000 times) larger (less negative)
than a dBW value, because of the difference in scale (milliwatts vs. watts).
DC-HSPA+ Dual Carrier HSPA+
DCS Digital Cellular System
A cellular communication infrastructure that uses the 1.8 GHz radio spectrum.
DL Downlink (network to mobile)
DRX Discontinuous Reception
DSM Distributed Shared Memory
DUT Device Under Test
eICIC Enhanced Inter-Cell Interference Coordination
Product Technical Specification
Rev 5 Jul.17 94 41110788
EIRP Effective (or Equivalent) Isotropic Radiated Power
EMC Electromagnetic Compatibility
EMI Electromagnetic Interference
ERP Effective Radiated Power
ESD Electrostatic Discharge
FCC Federal Communications Commission
The U.S. federal agency that is responsible for interstate and foreign
communications. The FCC regulates commercial and private radio spectrum
management, sets rates for communications services, determines standards for
equipment, and controls broadcast licensing. Consult www.fcc.gov.
FDD Frequency Division Duplexing
FDMA Frequency Division Multiple Access
feICIC Further Enhanced Inter-Cell Interference Coordination
FER Frame Error Rate—A measure of receive sensitivity.
firmware Software stored in ROM or EEPROM; essential programs that remain even when
the system is turned off. Firmware is easier to change than hardware but more
permanent than software stored on disk.
FOTA Firmware Over The Air—Technology used to download firmware upgrades
directly from the service provider, over the air.
FOV Field Of View
FSN Factory Serial Number—A unique serial number assigned to the mini card during
manufacturing.
Galileo A European system that uses a series of satellites in middle earth orbit to provide
navigational data.
GCF Global Certification Forum
GLONASS Global Navigation Satellite System—A Russian system that uses a series of 24
satellites in middle circular orbit to provide navigational data.
GMSK Gaussian Minimum Shift Keying modulation
GNSS Global Navigation Satellite Systems (GPS, GLONASS, BeiDou, and Galileo)
GPS Global Positioning System
An American system that uses a series of 24 satellites in middle circular orbit to
provide navigational data.
Host The device into which an embedded module is integrated
HSDPA High Speed Downlink Packet Access
HSPA+ Enhanced HSPA, as defined in 3GPP Release 7 and beyond
Table G-1: Acronyms and Definitions (Continued)
Acronym or term Definition
Acronyms
Rev 5 Jul.17 95 41110788
HSUPA High Speed Uplink Packet Access
Hz Hertz = 1 cycle/second
IC Industry Canada
IF Intermediate Frequency
IMEI International Mobile Equipment Identity
IMS IP Multimedia Subsystem—Architectural framework for delivering IP multimedia
services.
inrush current Peak current drawn when a device is connected or powered on
inter-RAT Radio Access Technology
IOT Interoperability Testing
IS Interim Standard.
After receiving industry consensus, the TIA forwards the standard to ANSI for
approval.
ISIM IMS Subscriber Identity Module (Also referred to as a SIM card)
LED Light Emitting Diode.
A semiconductor diode that emits visible or infrared light.
LHCP Left-Hand Circular Polarized
LNA Low Noise Amplifier
LPM Low Power Mode
LPT Line Print Terminal
LTE Long Term Evolution—a high-performance air interface for cellular mobile
communication systems.
MCS Modulation and Coding Scheme
MHz Megahertz = 10e6 Hz
MIMO Multiple Input Multiple Output—wireless antenna technology that uses multiple
antennas at both transmitter and receiver side. This improves performance.
NAS/AS Network Access Server
NC No Connect
NIC Network Interface Card
NLIC Non-Linear Interference Cancellation
NMEA National Marine Electronics Association
OEM Original Equipment Manufacturer—a company that manufactures a product and
sells it to a reseller.
Table G-1: Acronyms and Definitions (Continued)
Acronym or term Definition
Product Technical Specification
Rev 5 Jul.17 96 41110788
OFDMA Orthogonal Frequency Division Multiple Access
OMA DM Open Mobile Alliance Device Management—A device management protocol.
OTA ‘Over the air’ (or radiated through the antenna)
PA Power Amplifier
packet A short, fixed-length block of data, including a header, that is transmitted as a unit
in a communications network.
PCB Printed Circuit Board
PCC Primary Component Carrier
PCS Personal Communication System
A cellular communication infrastructure that uses the 1.9 GHz radio spectrum.
PDN Packet Data Network
PMI Pre-coding Matrix Index
PSS Primary synchronisation signal
PST Product Support Tools
PTCRB PCS Type Certification Review Board
QAM Quadrature Amplitude Modulation.
This form of modulation uses amplitude, frequency, and phase to transfer data on
the carrier wave.
QCI QoS Class Identifier
QMI Qualcomm MSM/Modem Interface
QOS Quality of Service
QPSK Quadrature Phase-Shift Keying
QPST Qualcomm Product Support Tools
QZSS Quasi-Zenith Satellite System—Japanese system for satellite-based
augmentation of GPS.
RAT Radio Access Technology
RF Radio Frequency
RI Ring Indicator
roaming A cellular subscriber is in an area where service is obtained from a cellular service
provider that is not the subscriber’s provider.
RSE Radiated Spurious Emissions
RSSI Received Signal Strength Indication
Table G-1: Acronyms and Definitions (Continued)
Acronym or term Definition
Acronyms
Rev 5 Jul.17 97 41110788
SCC Secondary Component Carrier
SDK Software Development Kit
SED Smart Error Detection
Sensitivity
(Audio) Measure of lowest power signal that the receiver can measure.
Sensitivity (RF) Measure of lowest power signal at the receiver input that can provide a prescribed
BER/BLER/SNR value at the receiver output.
SG An LTE signaling interface for SMS (“SMS over SGs”)
SIB System Information Block
SIM Subscriber Identity Module. Also referred to as USIM or UICC.
SIMO Single Input Multiple Output—smart antenna technology that uses a single
antenna at the transmitter side and multiple antennas at the receiver side. This
improves performance and security.
SISO Single Input Single Output—antenna technology that uses a single antenna at
both the transmitter side and the receiver side.
SKU Stock Keeping Unit—identifies an inventory item: a unique code, consisting of
numbers or letters and numbers, assigned to a product by a retailer for purposes
of identification and inventory control.
SMS Short Message Service.
A feature that allows users of a wireless device on a wireless network to receive
or transmit short electronic alphanumeric messages (up to 160 characters,
depending on the service provider).
S/N Signal-to-noise (ratio)
SNR Signal-to-Noise Ratio
SOF Start of Frame—A USB function.
SSS Secondary synchronisation signal.
SUPL Secure User Plane Location
TDD Time Division Duplexing
TD-SCDMA Time Division Synchronous Code Division Multiple Access
TIA/EIA Telecommunications Industry Association / Electronics Industry Association.
A standards setting trade organization, whose members provide communications
and information technology products, systems, distribution services and
professional services in the United States and around the world. Consult
www.tiaonline.org.
TIS Total Isotropic Sensitivity
TRP Total Radiated Power
Table G-1: Acronyms and Definitions (Continued)
Acronym or term Definition
Product Technical Specification
Rev 5 Jul.17 98 41110788
UDK Universal Development Kit (for PCI Express Mini Cards)
UE User Equipment
UICC Universal Integrated Circuit Card (Also referred to as a SIM card.)
UL Uplink (mobile to network)
UMTS Universal Mobile Telecommunications System
USB Universal Serial Bus
USIM Universal Subscriber Identity Module (UMTS)
VCC Supply voltage
VSWR Voltage Standing Wave Ratio
WAN Wide Area Network
WCDMA Wideband Code Division Multiple Access (also referred to as UMTS)
WLAN Wireless Local Area Network
ZIF Zero Intermediate Frequency
ZUC ZUC stream cypher
Table G-1: Acronyms and Definitions (Continued)
Acronym or term Definition
—>>I
Rev 5 Jul.17 99 41110788
Numerics
3D gain, average
gain
3D average (GNSS), 70
3GPP compliance
LTE, 16
UMTS, 16
A
acceptance tests, 74
accessories, 14
accuracy (GNSS), 45
acquisition time (GNSS), 45
acronyms and definitions, 93– 98
A-GNSS, 14
A-GPS, 13
antenna
connection considerations, 35
connectors, 17
control, 17, 34
custom, design, 36
diversity antenna, disabling, 36
GNSS, specifications, recommended, 68, 70
limit, matching coaxial connections, 35
location, considerations, 36
matching, considerations, 36
maximum cable loss, 35
routing, 36
specification, 68– 71
specifications, recommended, 68
testing, 70
antennas
design checklist, 72
API, 54
application interface features, 12
approvals, regulatory and industry, 60
AT commands, 88
averaged call mode DC power consumption, 47
averaged standby DC power consumption, 46
B
bands supported, RF
summary, 11
LTE, 40, 42, 78, 80, 82, 84
bearers, dedicated, 13
BER (Bit Error Rate), 39
bit error rate (BER)
measure of sensitivity, 39
block diagram
expanded RF, 19, 20
system, 18
bottom view, 56
C
cable loss
antenna, maximum, 35
capacitors
with SIM, 30
with XIM_DATA / XIM_CLK, 30
carrier/operator testing, 88
cell selection, 13
certification tests, 75
checklist, design, 72
communications, host to modem
design checklist, 73
conducted Tx power tolerances, 44
connection
grounding, 37
connectors, required
host-module, 14
control interface, 31
CQI, 13
D
DC power consumption
averaged call mode, 47
averaged standby, 46
desense. See RF
design checklist
antennas, 72
component placement, 72
EMI/ESD, 72
host/modem communications, 73
power, 72
thermal, 73
USB3, 72
detach procedure, 13
dimensioned view, 56
dimensions, 55, 56
diversity antenna
disabling, 36
drop specifications, 55
dynamic power control, 17
E
EDGE
connector, required, 14
electrical specifications, 17
electrostatic discharge specifications, 55
electrostatic discharge. See ESD
envelope correlation coefficient, 69
environmental specifications, 55– 57
ESD
design checklist, 72
protection requirements, 57
ESD specifications, 55
expanded RF block diagram, 19, 20
F
field of view, 70
filtering, RF desense, 38
form factor, 55
FOV, 70
free space average gain, 70
Index
Product Technical Specification
Rev 5 Jul.17 100 41110788
frequencies supported, 39
frequency band support
LTE, 40, 42, 78, 80, 82, 84
Full_Card_Power_Off#, 33
G
gain
GNSS, 70
maximum, 61, 69
mean effective, 69
mean effective imbalance, 69
GNSS
antenna specifications, recommended, 68, 70
GPS
features supported, 13
specifications, 45
GPS_DISABLE#, 17, 31, 32
ground specifications, 26
grounding
connection considerations, 37
H
host interface
pin assignments, 20
humidity specifications, 55
I
I/O rise time requirements, 30
impedance
module–antenna, 36
SIM, 30
industry approvals, 60
integration requirements, 15
interface
control interface, 31
feature summary, 12
host, pin assignments, 20
QMI, 54
SIM, 28
software, 54
USB, 26, 27
interference
device generated, 38
host-generated, 38
power supply noise, 52
wireless devices, 37
Interoperability testing, 88
intra-LTE mobility, 13
IOT testing, 88
iRAT, 13
isolation, 69, 70
L
labeling, 57
LED
example, 34
LED output, 17, 31, 33
LTE
3GPP compliance, 16
bandwidth support, 41
features, 13
frequency band support, 40, 42, 78, 80, 82, 84
M
mean effective gain, 69
mean effective gain imbalance, 69
mechanical specifications, 55– 57
MIB, 13
modem features, 12
module
power states, 48– 50
N
NAS/AS security, 13
noise
leakage, minimizing, 37
RF interference, power supply, 52
O
OEM
assistance with testing, 88
labeling, 57
operator/carrier testing, 88
ordering information, 14
P
packaging, 90
paging procedures, 13
PCB
multi-layer, shielding for RF desense, 38
PCIe
detect, timing, 52
interface, description, 27
PDN connections, multiple, 13
pin assignments, host interface, 20
PMI, 13
polarization, 70
position location, 13
power
design checklist, 72
handling, 69
power-up timing, 50
ramp-up timing, 50
state machines, 49
states, module, 48– 50
supply, RF interference, 52
supply, ripple limit, 52
power consumption, DC
averaged call mode, 47
averaged standby, 46
power off signal, 17
power specifications, 26
power tolerances, conducted Tx, 44
Product Support Tool, QUALCOMM (QPST), 54
Index
Rev 5 Jul.17 101 41110788
production tests, 76
PSS, 13
Q
QMI interface, 54
QPST (QUALCOMM Product Support Tool), 54
QUALCOMM Product Support Tool (QPST), 54
quality assurance tests, 87
QXDM support, 54
R
radiated efficiency, total, 68
radiated sensitivity measurement, 39
radiated spurious emissions, 38
radiation patterns, 69
references, 92
regulatory approvals, 60
regulatory information, ??– 63
FCC, 61
limitation of liability, 60
safety and hazards, 60
reset
timing, 50
RESET#, 17, 33
resistors, external pull-up, 30
RF
antenna cable loss, maximum, 35
antenna connection, considerations, 35
connectors, required, 14
desense
device-generated, 38
harmonic energy, filtering, 38
mitigation suggestions, 38
shielding suggestions, 38
interference
other devices, 38
power supply, 52
wireless devices, 37
RF bands supported
summary, 11
LTE, 40, 42, 78, 80, 82, 84
RF block diagram, expanded, 19, 20
RF specifications, 35–??
RI, 13
RSE, 38
Rx sensitivity
conducted, 43, 44
S
sales
ordering, 14
SAR backoff, 53
SDKs available, 54
SED
see Smart Error Detection
See also GPS_DISABLE#, 32
See also W_DISABLE#, 32
sensitivity
conducted, RF parameter, 43, 44
defined, 39
radiated measurement, overview, 39
testing, overview, 39
shielding
module, compliance, 35
reducing RF desense, 38
shock specifications, 55
SIB, 13
signals, 31
Full_Card_Power_Off#, 33
RESET#, 33
WWAN_LED#, 33
SIM
capacitor recommendations, 30
card contacts, 29
clock rate, 30
connector, required, 14
electrical specifications, 30
impedance, connectors, 30
interface, 28
interface diagram, 29
operation, 30
SIM Detect, 17
Smart Error Detection
detecting module reset, 53
SMS features, 13
Snow 3G/AES security, 13
software interface, 54
specifications
electrical, 17
environmental specifications, 55– 57
GPS, 45
mechanical, 55– 57
RF, 35–??
SSS, 13
standalone mode, GPS/GLONASS, 13
standby DC power consumption, averaged, 46
state machines, 49
support
testing assistance by Sierra Wireless, 87
tools, 54
system acquisition, 13
system block diagram, 18
T
temperature specifications, 55
temperature, module. See thermal
Product Technical Specification
Rev 5 Jul.17 102 41110788
testing
overview, 74
acceptance tests, 74
assistance provided by Sierra Wireless, 87
certification tests, 75
equipment, suggested, 87
interoperability and operator/carrier testing, 88
manual functional test, suggested, 76
production tests, 76
quality assurance tests, 87
RF receive path, LTE, 84
RF receive path, UMTS, 82
RF transmission path, LTE, 80
RF transmission path, UMTS, 78
suggestions, 74– 89
thermal
considerations, 58– 59
design checklist, 73
dissipation, factors affecting, 58
dissipation, suggestions, 59
testing, module, 59
timing
PCIe detect, 52
power ramp-up, 50
power-up, 50
reset, 50
USB enumeration, 50
top view, 56
tracking session
automatic, 13
standalone, 13
Tx power tolerances, conducted, 44
U
UMTS
3GPP compliance, 16
USB
drivers, user-developed, 27
high / full speed throughput performance, 27
interface, 26, 27
USB enumeration timing, 50
USB3
design checklist, 72
V
vibration specifications, 55
VSWR, 68, 70
W
W_DISABLE#, 17, 31, 32
WAKE_ON_WAN#, 17
Wireless Disable, 31
Wireless Disable (GNSS), 32
Wireless Disable (Main RF), 32
WWAN_LED#, 31, 33
Z
ZIF (Zero Intermediate Frequency), 37