DDR4 miniDIMM Sockets Datasheet by Molex

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DDR4 miniDIMM Sockets, 22.5°
Angled and Vertical SMT, Halogen-free
Angled DDR4 miniDIMM socket saves nearly half the
overhead space of the vertical equivalent in enterprise
computing and networking memory applications
Data/Communications
High-end computing
Personal computers
RAID / Storage
Telecommunications/Networking
Network Operations Center
Infrastructure
Applications
Metal grips on housing towers (patent pending)
Reduce shock or vibration to mounted memory modules
during transit
Metal-reinforced
latch tower
housing
Prevents damage to
tower bridge due to
wear and tear
Features and Advantages
Data Center Network Operations Center
(Left to right) 22.5°-angled and Vertical
SMT DDR4 miniDIMM sockets
Halogen-free housing
Meets eco-friendly
environmental requirements
The 22.5° angled DDR4 miniDIMM socket offers highly robust mating and usability features for reliable operations
The 22.5° angled DDR4 miniDIMM socket save almost half as much vertical space than its upright equivalent with module mounted
15.26mm
32.24mm
Memory Module
This ‘gain’ in height of 15.26mm
shows that the angled DDR4
miniDIMM saves 47% (close to
nearly half as much space) over
its upright equivalent
molexy I
©2016 MolexOrder No. 987651-3391 Rev. 1 APS/0k/GF/2016.11
Ordering Information
Specifications
REFERENCE INFORMATION
Packaging: Tray
Mates With JEDEC MO-309 Memory Modules
UL File Number: E29179 (151105)
CSA File Number: 1699020 (LR19980) (151105)
Designed In: Millimeters
RoHS: Yes
Halogen Free: Yes
Glow Wire Compliant: No
ELECTRICAL
Voltage (max.): 29 Volts AC (RMS) / DC
Current (max.): 0.75A per pin
Low Level Contact Resistance:
25 milliohms (151134)
20 milliohms (151105)
Dielectric Withstanding Voltage: 500V AC
Insulation Resistance (min.): 1 Megohm
MECHANICAL
Module Insertion Force (with latches): 150.0N max.
Module Rip-out Force (min.): 3.6kgf
Module Unmating Force: 2.02kgf (for 288 circuits)
Insertion Force to PCB: 25N (max.)
Terminal Retention Force (min.):
300gf (per pin); 8.0N (per forklock)
Latch Actuation Force (max.): 35N per latch
Durability: 25 cycles
PHYSICAL
Housing: LCP, Glass-filled, UL94V-0, Black
Latch: Polyamide, Glass-filled, UL94V-0, Black
Contact: Copper Alloy
Plating: Contact Area:
0.76 micron Gold (Au) over 1.25micron Nickel (Ni)
Soldertail Area: 2.54micron Tin (Sn) over
1.25micron Nickel (Ni)
PCB hold-down:2.54micron Tin (Sn) over
1.25micron Nickel (Ni)
Operating Temperature: -55 to 85°C
Series No. Description
151134 22.5°-Angled, SMT
151105 Vertical, SMT
www.molex.com/link/ddr4.html
DDR4 miniDIMM Sockets, 22.5°
Angled and Vertical SMT, Halogen-free