TPS62740,42 Datasheet by Texas Instruments

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TPS62740
60
65
70
75
80
85
90
95
100
Output Current (mA)
Efficiency (%)
V = 3.6V
V = 3.3V
IN
OUT
Current
DCS-Control topology
TM
0.001 0.01 0.1 1 10 100 1000
TPS62740 extends
light load efficiency range
down to 10 A output currentm
GND
L 2.2 Hm
VOUT
VSEL3
SW
PG
VIN
CTRL
V
2.2V - 5.5V
IN
C
10
IN
mF
C
10 F
OUT
m
TPS62740
VSEL4
VSEL1
LOAD
VSEL2
EN
Low Power
MCU + RF
Subsystem
(Sensors)
2.1V
Main rail
Switched
supply rail
Rpull up
VCC
VCC
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Folder
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TPS6274x 360nA I
Q
Step Down Converter For Low Power Applications
1 Features 3 Description
The TPS6274x is industry's first step down converter
1• Input Voltage Range VIN from 2.2V to 5.5 featuring typ. 360nA quiescent current and operating
• Typ. 360nA Quiescent Current with a tiny 2.2µH inductor and 10µF output capacitor.
• Up to 90% Efficiency at 10µA Output Current This new DCS-Control™ based device extends the
light load efficiency range below 10µA load currents.
• Up to 300mA / 400mA Output Current TPS62740 supports output currents up to 300mA,
(TPS62740/TPS62742) TPS62742 up to 400mA. The device operates from
• RF Friendly DCS-Control TM rechargeable Li-Ion batteries, Li-primary battery
• Up to 2 MHz Switching Frequency chemistries such as Li-SOCl2, Li-MnO2 and two or
three cell alkaline batteries. The input voltage range
• Low Output Ripple Voltage up to 5.5V allows also operation from a USB port and
• 16 Selectable Output Voltages in 100mV Steps thin-film solar modules. The output voltage is user
between 1.8V to 3.3V selectable by four VSEL pins within a range from
• Automatic Transition to No Ripple 100% Mode 1.8V to 3.3V in 100mV steps. TPS6274x features low
output ripple voltage and low noise with a small
• Slew Rate Controlled Load Switch output capacitor. Once the battery voltage comes
• Discharge Function on VOUT / LOAD close to the output voltage (close to 100% duty cycle)
• Power Good Output the device enters no ripple 100% mode operation to
• Optimized for Operation with a Tiny 2.2µH prevent an increase of output ripple voltage. The
device then stops switching and the output is
Inductor and 10µF COUT connected to the input voltage. The integrated slew
• Total Solution Size <31mm2rate controlled load switch provides typ. 0.6Ωon-
• Small 2 x 3 mm2WSON Package resistance and can distribute the selected output
voltage to a temporarily used sub-system. The
2 Applications TPS6274x is available in a small 12 pin 2 × 3mm2
WSON package and supports a total solutions size of
•Bluetooth®Low Energy, RF4CE, Zigbee 31mm2.
• Industrial Metering
• Energy Harvesting Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
TPS62740 WSON 3.00 mm × 2.00 mm
TPS62742
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
4 Typical Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
9.4 Device Functional Modes........................................ 10
1 Features.................................................................. 110 Application and Implementation........................ 12
2 Applications ........................................................... 110.1 Application Information.......................................... 12
3 Description ............................................................. 110.2 Typical Application ............................................... 12
4 Typical Application................................................ 110.3 System Example ................................................... 22
5 Revision History..................................................... 211 Power Supply Recommendations ..................... 23
6 Device Comparison Table..................................... 312 Layout................................................................... 23
7 Pin Configuration and Functions......................... 312.1 Layout Guidelines ................................................. 23
8 Specifications......................................................... 412.2 Layout Example .................................................... 23
8.1 Absolute Maximum Ratings ...................................... 413 Device and Documentation Support ................. 24
8.2 Handling Ratings ...................................................... 413.1 Device Support .................................................... 24
8.3 Recommended Operating Conditions....................... 513.2 Documentation Support ....................................... 24
8.4 Thermal Information ................................................. 513.3 Related Links ........................................................ 24
8.5 Electrical Characteristics........................................... 513.4 Trademarks........................................................... 24
8.6 Typical Characteristics.............................................. 713.5 Electrostatic Discharge Caution............................ 24
9 Detailed Description.............................................. 813.6 Glossary................................................................ 24
9.1 Overview ................................................................... 814 Mechanical, Packaging, and Orderable
9.2 Functional Block Diagram......................................... 8Information ........................................................... 24
9.3 Feature Description................................................... 8
5 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision A (November 2013) to Revision B Page
• Added TPS62742 device ....................................................................................................................................................... 1
• Added efficiency graph, Figure 11........................................................................................................................................ 15
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VIN
GND
VOUT
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2
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11
10
VSEL1
49
LOAD
CTRL
8
7
5
6
VSEL2
VSEL3
VSEL4
EXPOSED
THERMAL PAD
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6 Device Comparison Table
PACKAGE
OUTPUT CURRENT
TAPART NUMBER OUTPUT VOLTAGE SETTING VSEL 1 - 4 [mA] MARKING
TPS62740 1.8V to 3.3V in 100mV steps 300mA 62740
–40°C to 85°C TPS62741(1) 1.3V to 2.8V in 100mV steps 300mA -/-
TPS62742 1.8V to 3.3V in 100mV steps 400mA 62742
(1) Device option, contact TI for more details
7 Pin Configuration and Functions
WSON PACKAGE
12-Pin
Pin Functions
PIN I/O DESCRIPTION
NAME NO
VIN 1 PWR VIN power supply pin. Connect this pin close to the VIN terminal of the input capacitor. A ceramic capacitor
of 4.7µF is required.
SW 2 OUT This is the switch pin and is connected to the internal MOSFET switches. Connect the inductor to this
terminal.
GND 3 PWR GND supply pin. Connect this pin close to the GND terminal of the input and output capacitor.
CTRL 4 IN This pin controls the output LOAD pin. With CTRL = low, the output LOAD is disabled. This pin must be
terminated.
VOUT 5 IN Feedback pin for the internal feedback divider network and regulation loop. An internal load switch is
connected between this pin and the LOAD pin. Connect this pin directly to the output capacitor with a short
trace.
LOAD 6 OUT This output is controlled by the CTRL Pin. With CTRL high, an internal load switch connects the LOAD pin
to the VOUT pin. The LOAD pin allows to connect / disconnect other system components to the output of
the DC/DC converter. This pin is pulled to GND with CTRL pin = low. The LOAD pin features a soft
switching. If not used, leave the pin open.
PG 7 OUT Power good open drain output. This pin is high impedance to indicate "Power Good". Connect a external
pull up resistor to generate a "high" level. If not used, this pin can be left open.
VSEL4 8 IN Output voltage selection pins. See Table 1 for VOUT selection. These pins must be terminated and can be
changed during operation.
VSEL3 9 IN
VSEL2 10 IN
VSEL1 11 IN
EN 12 IN High level enables the devices, low level turns the device into shutdown mode. This pin must be
terminated.
EXPOSED NC Not electrically connected to the IC, but must be soldered. Connect this pad to GND and use it as a central
THERMAL PAD GND plane.
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Table 1. Output Voltage Setting
Device VOUT VSEL 4 VSEL 3 VSEL 2 VSEL 1
1.8 0 0 0 0
1.9 0 0 0 1
2.0 0 0 1 0
2.1 0 0 1 1
2.2 0 1 0 0
2.3 0 1 0 1
2.4 0 1 1 0
2.5 0 1 1 1
TPS62740 / 42 2.6 1 0 0 0
2.7 1 0 0 1
2.8 1 0 1 0
2.9 1 0 1 1
3.0 1 1 0 0
3.1 1 1 0 1
3.2 1 1 1 0
3.3 1 1 1 1
8 Specifications
8.1 Absolute Maximum Ratings(1)
Over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN –0.3 6 V
SW (3) –0.3 VIN +0.3V V
Pin voltage(2) EN, CTRL, VSEL1-4 –0.3 VIN +0.3V V
PG –0.3 VIN +0.3V V
VOUT, LOAD –0.3 3.7 V
PG pin IPG sink current 10 mA
Maximum operating junction temperature, TJ–40 150 °C
(1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal GND.
(3) The MAX value VIN +0.3V applies for applicative operation (device switching), DC voltage applied to this pin may not exceed 4V
8.2 Handling Ratings
MIN MAX UNIT
Tstg Storage temperature range –65 150 °C
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all 2000
pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per JEDEC specification 1000
JESD22-C101, all pins(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. The human body
model is a 100-pF capacitor discharged through a 1.5-kΩresistor into each pin.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
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8.3 Recommended Operating Conditions
MIN NOM MAX UNIT
VIN Supply voltage VIN (1) 2.2 5.5 V
VOUTnom + 0.7V ≤VIN ≤5.5V TPS62740 300
IOUT +Device output current (sum of IOUT and I LOAD) 3V ≤VIN, VOUTnom + 0.7V ≤VIN ≤5.5V TPS62742 400
ILOAD mA
VOUTnom ≤VIN ≤VOUTnom +0.7V 100
ILOAD Load current (current from LOAD pin) 100
L Inductance 1.5 2.2 3.3 µH
COUT Output capacitance connected to VOUT pin (not including LOAD pin) 22 µF
CLOAD Capacitance connected to LOAD pin 10
TJOperating junction temperature range -40 125 °C
TAAmbient temperature range -40 85
(1) The minimum required supply voltage for startup is 2.15V (undervoltage lockout threshold VTH_UVLO+) . The device is functional down to
2V supply voltage (falling undervoltage lockout threshold VTH_UVLO-).
8.4 Thermal Information
THERMAL METRIC DSS / 12 PINS UNIT
RθJA Junction-to-ambient thermal resistance 61.8
RθJCtop Junction-to-case (top) thermal resistance 70.9
RθJB Junction-to-board thermal resistance 25.7 °C/W
ψJT Junction-to-top characterization parameter 1.9
ψJB Junction-to-board characterization parameter 25.7
RθJCbot Junction-to-case (bottom) thermal resistance 7.2
8.5 Electrical Characteristics
VIN = 3.6V, TA= –40°C to 85°C typical values are at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY
VIN Input voltage 2.2 5.5 V
range
EN = VIN, CTRL = GND, IOUT = 0µA, VOUT = 1.8V, device not switching, 360 1800 nA
Operating
IQEN = VIN, IOUT = 0mA, CTRL = GND, VOUT = 1.8V , device switching 460
quiescent current EN = VIN, IOUT = 0mA., CTRL = VIN, VOUT = 1.8V, device not switching 12.5 µA
ISD Shutdown current EN = GND, shutdown current into VIN 70 1000 nA
EN = GND, shutdown current into VIN, TA= 60°C 150 450
VTH_UVLO+ Undervoltage Rising VIN 2.075 2.15 V
lockout threshold
VTH_UVLO- Falling VIN 1.925 2
INPUTS EN, CTRL, VSEL 1-4
VIH TH High level input 2.2V ≤VIN ≤5.5V 1.1 V
threshold
VIL TH Low level input 2.2V ≤VIN ≤5.5V 0.4 V
threshold
IIN Input bias Current TA= 25°C 10 nA
TA= –40°C to 85°C 25
POWER SWITCHES
High side
MOSFET on- 0.6 0.85
resistance
RDS(ON) VIN = 3.6V, IOUT = 50mA Ω
Low Side
MOSFET on- 0.36 0.5
resistance
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Electrical Characteristics (continued)
VIN = 3.6V, TA= –40°C to 85°C typical values are at TA= 25°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
High side 2.2V ≤VIN ≤5.5V, TPS62740 480 600 720
MOSFET switch mA
3.0V ≤VIN ≤5.5V, TPS62742 590 650 740
current limit
ILIMF TPS62740 600
Low side MOSFET mA
switch current limit TPS62742 650
OUTPUT DISCHARGE SWITCH (VOUT)
MOSFET on- 30 65
RDSCH_VOUT VIN = 3.6V, EN = GND, IOUT = -10mA into VOUT pin Ω
resistance
Bias current into TA= 25°C 40 100
VIN = 3.6V, EN = VIN, VOUT = 2V, CTRL =
IIN_VOUT nA
VOUT pin GND TA= –40°C to 85°C 1010
LOAD OUTPUT (LOAD)
High side 0.6 1.25 Ω
RLOAD MOSFET on- ILOAD = 50mA, CTRL = VIN, VOUT = 2.0V, 2.2 V ≤VIN ≤5.5V
resistance
Low side MOSFET 30 65
RDSCH_LOAD CTRL = GND, 2.2V ≤VIN ≤5.5V, ILOAD = - 10mA
on-resistance
VLOAD rise time Starting with CTRL low to high transition, time to ramp VLOAD from 0V 315 800 µs
tRise_LOAD to 95% VOUT = 1.8V, 2.2V ≤VIN ≤5.5V, ILOAD = 1mA
AUTO 100% MODE TRANSITION
Auto 100% Mode 170 250 340 mV
Rising VIN,100% Mode is left with VIN = VOUT + VTH_100+ , max value at
VTH_100+ leave detection TJ= 85°C
threshold (1)
Auto 100% Mode 110 200 280
Falling VIN, 100% Mode is entered with VIN = VOUT + VTH_100-, max
VTH_100- enter detection value at TJ= 85°C
threshold (1)
POWER GOOD OUTPUT (PG, OPEN DRAIN)
VTH_PG+ Power good Rising output voltage on VOUT pin, referred to VVOUT 97.5%
threshold voltage
VPG_Hys Hysteresis -3%
Low level output 2.2V ≤VIN ≤5.5V, EN = GND, current into PG pin IPG = 4mA 0.3
VOL V
voltage
IIN_PG Bias current into PG pin is high impedance, VOUT = 2V, EN = TA= 25°C 0 10 nA
PG pin VIN, CTRL = GND, IOUT = 0mA TA= –40°C to 85°C 25
OUTPUT
tONmin Minimum ON time VIN = 3.6V, VOUT = 2.0V, IOUT = 0 mA 225 ns
tOFFmin Minimum OFF time VIN = 2.3V 50 ns
tStartup_delay Regulator start up VIN = 3.6V, from transition EN = low to high until device starts switching 10 25 ms
delay time
tSoftstart Softstart time with 2.2V ≤VIN ≤5.5V, EN = VIN 700 1200 µs
reduced switch
current limit
ILIM_softstart High side Reduced switch current limit during softstart TPS62740 80 150 200 mA
MOSFET switch TPS62742 150
current limit
Low side MOSFET 150
switch current limit
Output voltage Output voltages are selected with pins VSEL 1 - 4 1.8 3.3 V
range
VIN = 3.6V, IOUT = 10mA, VOUT = 1.8V -2.5 0% 2.5
Output voltage
accuracy VIN = 3.6V, IOUT = 100mA, VOUT = 1.8V –2 0% 2
VVOUT DC output voltage VOUT = 1.8V, VIN = 3.6V, CTRL = VIN 0.001 %/mA
load regulation
DC output voltage VOUT = 1.8V, CTRL = VIN, IOUT = 10 mA, 2.5V ≤VIN ≤5.5V 0 %/V
line regulation
(1) VIN is compared to the programmed output voltage (VOUT). When VIN–VOUT falls below VTH_100- the device enters 100% Mode by turning
the high side MOSFET on. The 100% Mode is exited when VIN–VOUT exceeds VTH_100+ and the device starts switching. The hysteresis
for the 100% Mode detection threshold VTH_100+ - VTH_100- will always be positive and will be approximately 50 mV(typ.)
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0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.1
1.2
1.8 2.2 2.6 3.0 3.4
Output Voltage VOUT (V)
T = −40°C
A
T = 25°C
A
T = 60°C
A
T = 85°C
A
R ( )
LOAD W
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage VIN (V)
T = −40°C
A
T = 25°C
A
T = 60°C
A
T = 85°C
A
0
100
200
300
400
500
600
700
800
900
1000
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage VIN (V)
Quiescent Current Iq (nA)
T = −40°C
A
T = 25°C
A
T = 60°C
A
T = 85°C
A
0
100
200
300
400
500
2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Input Voltage VIN (V)
Shutdown Current I (nA)
SD
T = −40°C
A
T = 25°C
A
T = 60°C
A
T = 85°C
A
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8.6 Typical Characteristics
EN = VIN, VOUT = 1.8V, CTRL = GND Device Not Switching EN = GND
Figure 1. Quiescent Current Figure 2. Shutdown Current ISD
Figure 4. RDSON Low Side Mosfet
Figure 3. RDSON High Side Mosfet
Figure 5. Load Switch Resistance RLOAD
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l TEXAS INSTRUMENTS Currenl mm Comp
UVLO
EN
Gate Driver
Anti
Shoot-Through
Current
Limit Comparator
SW
Limit
High Side
VIN
GND
PMOS
NMOS
PG
PG Comp
VTH_UVLO
VIN
UVLO
Comp
Softstart
Control
Logic
VOUT
VFB
Main
Comparator
Direct Control
& Compensation
Error
amplifier
Min. On
Min. OFF
VIN
VOUT
Timer
DCS
Control
Current
Limit Comparator
Limit
Low Side
Power Stage
UVLO
Slew Rate
Control
VOUT
Discharge
Load Switch
EN
UVLO
CTRL
LOAD
Internal
feedback
divider
network*
VSEL 1
VSEL 2
VSEL 3
VSEL 4
Ultra Low Power
Reference V = 1.2V
REF
VTH_100
VIN
Auto 100% Mode
Comp 100%
Mode
VTH_PG
V
Discharge
OUT
VFB
UVLO
EN
EN
CTRL
VOUT
* typical 50MW
VREF
VFB
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9 Detailed Description
9.1 Overview
The TPS6274x is the first step down converter with an ultra low quiescent current consumption (360nA typ.) and
featuring TI's DCS-Control™ topology while maintaining a regulated output voltage. The device extends high
efficiency operation to output currents down to a few micro amperes.
9.2 Functional Block Diagram
9.3 Feature Description
9.3.1 DCS-Control™
TI's DCS-Control™ (Direct Control with Seamless Transition into Power Save Mode) is an advanced regulation
topology, which combines the advantages of hysteretic and voltage mode control. Characteristics of DCS-
Control™ are excellent AC load regulation and transient response, low output ripple voltage and a seamless
transition between PFM and PWM mode operation. DCS-Control™ includes an AC loop which senses the output
voltage (VOUT pin) and directly feeds the information to a fast comparator stage. This comparator sets the
switching frequency, which is constant for steady state operating conditions, and provides immediate response to
dynamic load changes. In order to achieve accurate DC load regulation, a voltage feedback loop is used. The
internally compensated regulation network achieves fast and stable operation with small external components
and low ESR capacitors.
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Feature Description (continued)
The DCS-Control™ topology supports PWM (Pulse Width Modulation) mode for medium and high load
conditions and a Power Save Mode at light loads. During PWM mode, it operates in continuous conduction. The
switching frequency is up to 2MHz with a controlled frequency variation depending on the input voltage. If the
load current decreases, the converter seamlessly enters Power Save Mode to maintain high efficiency down to
very light loads. In Power Save Mode the switching frequency varies nearly linearly with the load current. Since
DCS-Control™ supports both operation modes within one single building block, the transition from PWM to
Power Save Mode is seamless without effects on the output voltage. The TPS6274x offers both excellent DC
voltage and superior load transient regulation, combined with very low output voltage ripple, minimizing
interference with RF circuits. At high load currents, the converter operates in quasi fixed frequency PWM mode
operation and at light loads, in PFM (Pulse Frequency Modulation) mode to maintain highest efficiency over the
full load current range. In PFM Mode, the device generates a single switching pulse to ramp up the inductor
current and recharge the output capacitor, followed by a sleep period where most of the internal circuits are
shutdown to achieve a lowest quiescent current. During this time, the load current is supported by the output
capacitor. The duration of the sleep period depends on the load current and the inductor peak current.
During the sleep periods, the current consumption of TPS6274x is reduced to 360nA. This low quiescent current
consumption is achieved by an ultra low power voltage reference, an integrated high impedance (typ. 50MΩ)
feedback divider network and an optimized DCS-Control™ block.
9.3.2 CTRL / Output Load
With the CTRL pin set to high, the LOAD pin is connected to the VOUT pin via an load switch and can power up
an additional, temporarily used sub-system. The load switch is slew rate controlled to support soft switching and
not to impact the regulated output VOUT. If CTRL pin is pulled to GND, the LOAD pin is disconnected from the
VOUT pin and internally connected to GND by an internal discharge switch. When CTRL pin is set to high, the
Quiescent current of the DCS control block is increased to typ. 12.5µA. This ensures excellent transient response
on both outputs VOUT and LOAD in case of a sudden load step at the LOAD output. The CTRL pin can be
controlled by a micro controller.
9.3.3 Enable / Shutdown
The DC/DC converter is activated when the EN pin is set to high. For proper operation, the pin must be
terminated and must not be left floating. With the EN pin set to low, the device enters shutdown mode with less
than typ. 70nA current consumption.
9.3.4 Power Good Output (PG)
The Power Good comparator features an open drain output. The PG comparator is active with EN pin set to high
and VIN is above the threshold VTH_UVLO+. It is driven to high impedance once VOUT trips the threshold VTH_PG+ for
rising VOUT. The output is pulled to low level once VOUT falls below the PG hysteresis, VPG_hys. The output is also
pulled to low level in case the input voltage VIN falls below the undervoltage lockout threshold VTH_UVLO- or the
device is disabled with EN = low. The power good output (PG) can be used as an indicator for the system to
signal that the converter has started up and the output voltage is in regulation.
9.3.5 Output Voltage Selection (VSEL1 – 4)
The TPS6274x doesn't require an external resistor divider network to program the output voltage. The device
integrates a high impedance (typ. 50MΩ) feedback resistor divider network which is programmed by the pins
VSEL 1-4. TPS6274x supports an output voltage range of 1.8V to 3.3V in 100mV steps. The output voltage can
be changed during operation and supports a simple dynamic output voltage scaling, shown in Figure 47. The
output voltage is programmed according to table Table 1.
9.3.6 Softstart
When the device is enabled, the internal reference is powered up and after the startup delay time tStartup_delay has
expired, the device enters softstart, starts switching and ramps up the output voltage. During softstart the device
operates with a reduced current limit, ILIM_softstart, of typ. 1/4 of the nominal current limit. This reduced current limit
is active during the softstart time tSoftstart. The current limit is increased to its nominal value, ILIMF, once the
softstart time has expired.
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V ,
IN
VOUT
PG
tsoftstart
VIN
Step Down Operation
100%
Mode
100%
Mode
VTH_100+
VTH_100-
VUVLO+ VUVLO-
VTH_PG+
VPG_Hys
V
tracks V
OUT
IN
V
tracks V
OUT
IN
High
Low Low
V
discharge
OUT
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Feature Description (continued)
9.3.7 Undervoltage Lockout UVLO
The device includes an under-voltage lockout (UVLO) comparator which prevents the device from misoperation
at too low input voltages. The UVLO comparator becomes active once the device is enabled with EN set to high.
Once the input voltage trips the UVLO threshold VTH_UVLO+ (typically 2.075V) for rising VIN, the UVLO comparator
releases the device for start up and operation. With a falling input voltage, the device operates down to the
UVLO threshold level VTH_UVLO- (typically 1.925V). Once this threshold is tripped, the device stops switching, the
load switch at pin LOAD is disabled and both rails, VOUT and LOAD are discharged. The converter starts
operation again once the input voltage trips the rising UVLO threshold level VTH_UVLO+.
9.4 Device Functional Modes
9.4.1 VOUT And LOAD Output Discharge
Both the VOUT pin and the LOAD pin feature a discharge circuit to connect each rail to GND, once they are
disabled. This feature prevents residual charge voltages on capacitors connected to these pins, which may
impact proper power up of the main- and sub-system. With CTRL pin pulled to low, the discharge circuit at the
LOAD pin becomes active. With the EN pin pulled to low, the discharge circuits at both pins VOUT and Load are
active. The discharge circuits of both rails VOUT and LOAD are associated with the UVLO comparator as well.
Both discharge circuits become active once the UVLO comparator triggers and the input voltage VIN has dropped
below the UVLO comparator threshold VTH_UVLO- (typ. 1.925V).
9.4.2 Automatic Transition Into 100% Mode
Once the input voltage comes close to the output voltage, the DC/DC converter stops switching and enters 100%
duty cycle operation. It connects the output VOUT via the inductor and the internal high side MOSFET switch to
the input VIN, once the input voltage VIN falls below the 100% mode enter threshold, VTH_100-. The DC/DC
regulator is turned off, not switching and therefore it generates no output ripple voltage. Because the output is
connected to the input, the output voltage tracks the input voltage minus the voltage drop across the internal high
side switch and the inductor caused by the output current. Once the input voltage increases and trips the 100%
mode leave threshold, VTH_100+ , the DC/DC regulator turns on and starts switching again. See Figure 6,
Figure 49,Figure 50,Figure 51.
Figure 6. Automatic 100% Mode Transition
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Device Functional Modes (continued)
9.4.3 Internal Current Limit
The TPS6274x integrates a current limit on the high side, as well the low side MOSFETs to protect the device
against overload or short circuit conditions. The peak current in the switches is monitored cycle by cycle. If the
high side MOSFET current limit is reached, the high side MOSFET is turned off and the low side MOSFET is
turned on until the current decreases below the low side MOSFET current limit.
9.4.4 Dynamic Voltage Scaling with VSEL Interface
During operation, the output voltage of the device can be changed, see Figure 47. The device will not actively
ramp down the output voltage from a higher to a lower level.
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 11
GND
L 2.2 Hm
VOUT
VSEL3
SW
PG
VIN
CTRL
V
4V - 5.5V
IN
C
10
IN
mF
C
10 F
OUT
m
TPS62742
VSEL4
VSEL1
LOAD
VSEL2
EN
Main System
Subsystem
3.3V
400mA
Switched
supply rail
Rpull up
VCC
VCC
GND
L 2.2 Hm
VOUT
VSEL3
SW
PG
VIN
CTRL
V
2.2V - 5.5V
IN
C
10
IN
mF
C
10 F
OUT
m
TPS62740
VSEL4
VSEL1
LOAD
VSEL2
EN
Low Power
MCU + RF
Subsystem
(Sensors)
2.1V
Main rail
Switched
supply rail
Rpull up
VCC
VCC
TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
www.ti.com
10 Application and Implementation
10.1 Application Information
The TPS6274x devices are a step down converter family featuring typ. 360nA quiescent current and operating
with a tiny 2.2µH inductor and 10µF output capacitor. This new DCS-ControlTM based devices extend the light
load efficiency range below 10µA load currents. TPS62740 supports output currents up to 300mA, TPS62742 up
to 400mA. The devices operate from rechargeable Li-Ion batteries, Li-primary battery chemistries such as Li-
SOCl2, Li-MnO2 and two or three cell alkaline batteries.
10.2 Typical Application
Figure 7. TPS62740 Typical Application Circuit
Figure 8. TPS62742 Typical Application Circuit
10.2.1 Design Requirements
The TPS6274x is a highly integrated DC/DC converter. The output voltage is set via a VSEL pin interface without
any additional external components. For proper operation only a input- and output capacitor and an inductor is
required. The integrated load switch doesn't require a capacitor on its LOAD pin. Table 2 shows the components
used for the application characteristic curves.
Table 2. Components for Application Characteristic Curves
Reference Description Value Manufacturer
TPS62740/42 360nA Iq step down converter Texas Instruments
CIN, COUT, CLOAD Ceramic capacitor GRM188R60J106M 10µF Murata
L Inductor LPS3314 2.2µH Coilcraft
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l TEXAS INSTRUMENTS
L
Lmax outmax
I
I = I +
2
D
L
Vout
1
Vin
I = Vout
L
-
D ´ ´ ¦
TPS62740, TPS62742
www.ti.com
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
10.2.2 Detailed Design Procedure
Table 3 shows the recommended output filter components. The TPS6274x is optimized for operation with a
2.2µH inductor and with 10µF output capacitor.
Table 3. Recommended LC Output Filter Combinations
Output Capacitor Value [µF](2)
Inductor Value [µH](1) 4.7µF 10µF 22µF
2.2 √ √(3) √
(1) Inductor tolerance and current de-rating is anticipated. The effective inductance can vary by 20% and -
30%.
(2) Capacitance tolerance and bias voltage de-rating is anticipated. The effective capacitance can vary by
20% and -50%.
(3) This LC combination is the standard value and recommended for most applications.
10.2.2.1 Inductor Selection
The inductor value affects its peak-to-peak ripple current, the PWM-to-PFM transition point, the output voltage
ripple and the efficiency. The selected inductor has to be rated for its DC resistance and saturation current. The
inductor ripple current (ΔIL) decreases with higher inductance and increases with higher VIN or VOUT and can be
estimated according to Equation 1.
Equation 2 calculates the maximum inductor current under static load conditions. The saturation current of the
inductor should be rated higher than the maximum inductor current, as calculated with Equation 2. This is
recommended because during a heavy load transient the inductor current rises above the calculated value. A
more conservative way is to select the inductor saturation current above the high-side MOSFET switch current
limit, ILIMF.
(1)
(2)
With:
f = Switching Frequency
L = Inductor Value
ΔIL= Peak to Peak inductor ripple current
ILmax = Maximum Inductor current
In DC/DC converter applications, the efficiency is essentially affected by the inductor AC resistance (i.e. quality
factor) and by the inductor DCR value. Increasing the inductor value produces lower RMS currents, but degrades
transient response. For a given physical inductor size, increased inductance usually results in an inductor with
lower saturation current.
The total losses of the coil consist of both the losses in the DC resistance (RDC) and the following frequency-
dependent components:
• The losses in the core material (magnetic hysteresis loss, especially at high switching frequencies)
• Additional losses in the conductor from the skin effect (current displacement at high frequencies)
• Magnetic field losses of the neighboring windings (proximity effect)
• Radiation losses
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 13
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TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
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The following inductor series from different suppliers have been used:
Table 4. List Of Inductors(1)
INDUCTANCE [µH] DIMENSIONS [mm3] INDUCTOR TYPE SUPPLIER
2.2 3.3 x 3.3 x 1.4 LPS3314 Coilcraft
2.2 2.5 x 3.0 x 1.5 VLF302515MT TDK
2.2 2.0 × 1.2 × 1.0 MIPSZ2012 2R2 FDK
2.2 2.5 x 2.0 x 1.2 MIPSA2520 2R2 FDK
2.2 2.0 x 1.2 x 1.0 MDT2012CH2R2 TOKO
(1) See Third-party Products Disclaimer
10.2.2.2 DC/DC Output Capacitor Selection
The DCS-Control™ scheme of the TPS6274x allows the use of tiny ceramic capacitors. Ceramic capacitors with
low ESR values have the lowest output voltage ripple and are recommended. The output capacitor requires
either an X7R or X5R dielectric. Y5V and Z5U dielectric capacitors, aside from their wide variation in capacitance
over temperature, become resistive at high frequencies. At light load currents, the converter operates in Power
Save Mode and the output voltage ripple is dependent on the output capacitor value and the PFM peak inductor
current. A larger output capacitors can be used, but it should be considered that larger output capacitors lead to
an increased leakage current in the capacitor and may reduce overall conversion efficiency. Furthermore, larger
output capacitors impact the start up behavior of the DC/DC converter.
10.2.2.3 Input Capacitor Selection
Because the buck converter has a pulsating input current, a low ESR input capacitor is required for best input
voltage filtering to ensure proper function of the device and to minimize input voltage spikes. For most
applications a 10µF is sufficient. The input capacitor can be increased without any limit for better input voltage
filtering.
Table 5 shows a list of tested input/output capacitors.
Table 5. List Of Capacitors(1)
CAPACITANCE [μF] SIZE CAPACITOR TYPE SUPPLIER
10 0603 GRM188R60J106ME84 Murata
(1) See Third-party Products Disclaimer
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l TEXAS INSTRUMENTS cum Curvlnl mm cum Curvlnl mm um cum Curvlnl mm nuwm {invent my um mm WEE: v” m
40
45
50
55
60
65
70
75
80
85
90
95
100
0.001 0.01 0.1 1 10 100 1000
Output Current (mA)
Efficiency (%)
V = 3.6V
IN
VIN = 4.2V
VIN = 5.0V
30
40
50
60
70
80
90
100
2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage V (V)
IN
Efficiency (%)
I = 1 A
OUT m
I = 2 A
OUT m
I = 5 A
OUT m
I = 10 A
OUT m
I = 100 A
OUT m
I = 50mA
OUT
I = 200mA
OUT
40
45
50
55
60
65
70
75
80
85
90
95
100
0.001 0.01 0.1 1 10 100
Efficiency (%)
Output Current I (mA)
OUT
V = 3.6V
IN
V =
IN 4.2V
V =
IN 5.0V
C001
40
45
50
55
60
65
70
75
80
85
90
95
100
0.001 0.01 0.1 1 10 100 1000
Output Current (mA)
Efficiency (%)
V = 3.0V
IN
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
40.0
45.0
50.0
55.0
60.0
65.0
70.0
75.0
80.0
85.0
90.0
95.0
0.001 0.01 0.1 1 10 100 1000
Output Current (mA)
Efficiency (%)
V = 2.7V
IN
V = 3.3V
IN
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
40
45
50
55
60
65
70
75
80
85
90
95
0.001 0.01 0.1 1 10 100 1000
Output Current (mA)
Efficiency (%)
V = 2.7V
IN
V = 3.3V
IN
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
TPS62740, TPS62742
www.ti.com
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
10.2.3 Application Curves
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF (0603) CTRL = GND
L = 2.2 µH (LPS3314 2R2) L = 2.2 μH (LPS3314 2R2)
Figure 9. Efficiency VOUT = 1.8V Figure 10. Efficiency VOUT = 2.1V
COUT = 10 µF (0603) CTRL = GND
COUT = 10 µF, CTRL = GND. L = 2.2 µH (LPS3314 2R2)
L = 2.2 µH (VLF302515)
Figure 12. Efficiency VOUT = 2.5V
Figure 11. Efficiency VOUT = 3.3V TPS62742
COUT = 10 µF (0603) CTRL = GND
COUT = 10 µF (0603) CTRL = GND L = 2.2 µH (LPS3314 2R2)
L = 2.2 µH (LPS3314 2R2)
Figure 14. Efficiency VOUT = 1.8V
Figure 13. Efficiency VOUT = 3.3V
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 15
l TEXAS INSTRUMENTS mm mm mm mm vmzag. w m 1554 mpmvmxaguww Ou‘Dul em": L, (mm 2 m 2 575 Ou‘Dul em": L, mm Ou‘Dul em": w." mm)
2.037
2.058
2.079
2.1
2.121
2.142
2.163
0.001 0.01 0.1 1 10 100 1000
Output Current I (mA)
OUT
Output Voltage V (V)
OUT
V = 2.7V
IN
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
2.425
2.45
2.475
2.5
2.525
2.55
2.575
0.001 0.01 0.1 1 10 100 1000
Output Current I (mA)
OUT
Output Voltage V (V)
OUT
V = 3.3V
IN
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
20
30
40
50
60
70
80
90
100
3.5 4 4.5 5 5.5
Input Voltage V (V)
IN
Efficiency (%)
I = 1 A
OUT m
I = 2 A
OUT m
I = 5 A
OUT m
I = 10 A
OUT m
I = 100 A
OUT m
I = 1mA
OUT
I = 10mA
OUT
I = 50mA
OUT
I = 200mA
OUT
1.746
1.764
1.782
1.8
1.818
1.836
1.854
0.001 0.01 0.1 1 10 100 1000
Output Current I (mA)
OUT
Output Voltage V (V)
OUT
V = 2.7V
IN
VIN = 3.3V
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
0
10
20
30
40
50
60
70
80
90
100
2 2.5 3 3.5 4 4.5 5 5.5
Input Voltage V (V)
IN
Efficiency (%)
I = 1 A
OUT m
I = 2 A
OUT m
I = 5 A
OUT m
I = 10 A
OUT m
I = 100 A
OUT m
I = 1mA
OUT
I = 10mA
OUT
I = 50mA
OUT
I = 200mA
OUT
20
30
40
50
60
70
80
90
100
2.5 3 3.5 4 4.5 5 5.5
Input Voltage V (V)
IN
Efficiency (%)
I = 1 A
OUT m
I = 2 A
OUT m
I = 5 A
OUT m
I = 10 A
OUT m
I = 100 A
OUT m
I = 1mA
OUT
I = 10mA
OUT
I = 50mA
OUT
I = 200mA
OUT
TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
www.ti.com
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF (0603) CTRL = GND
L = 2.2 µH (LPS3314 2R2) L = 2.2 µH (LPS3314 2R2)
Figure 15. Efficiency VOUT = 2.1V Figure 16. Efficiency VOUT = 2.5V
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF (0603) CTRL = GND
L = 2.2 µH (LPS3314 2R2) L = 2.2 µH (LPS3314 2R2)
Figure 17. Efficiency VOUT = 3.3V Figure 18. Output Voltage VOUT = 1.8V
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF (0603) CTRL = GND
L = 2.2 µH (LPS3314 2R2) L = 2.2 µH (LPS3314 2R2)
Figure 19. Output Voltage VOUT = 2.1V Figure 20. Output Voltage VOUT = 2.5V
16 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
l TEXAS INSTRUMENTS W Oumul em": g, M) zuuu Ou‘Dul am": my 0mm mm (MN 2000 0mm mm mm Ouxpm cwm (MM 2500 0mm mm mm
0
5
10
15
20
25
30
35
40
45
50
0 50 100 150 200 250 300
Output Current (mA)
V = 2.7V
IN
V = 3.0V
IN
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
V peak to peak Output Ripple Voltage (mVpp)
OUTpp
0
500
1000
1500
2000
2500
0 50 100 150 200 250 300
Output Current (mA)
Switching Frequency (kHz)
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
0
5
10
15
20
25
30
35
40
45
50
0 50 100 150 200 250 300
Output Current (mA)
V peak to peak Output Ripple Voltage (mVpp)
OUTpp
V = 2.7V
IN
V = 3.0V
IN
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
0
500
1000
1500
2000
0 50 100 150 200 250 300
Output Current (mA)
Switching Frequency (kHz)
V = 2.7V
IN
V = 3.0V
IN
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
0
500
1000
1500
2000
0 50 100 150 200 250 300
Output Current (mA)
Switching Frequency (kHz)
V = 2.5V
IN
V = 3.0V
IN
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
3.201
3.234
3.267
3.3
3.333
3.366
3.399
0.001 0.01 0.1 1 10 100 1000
Output Current I (mA)
OUT
Output Voltage V (V)
OUT
VIN = 3.6V
VIN = 4.2V
VIN = 5.0V
TPS62740, TPS62742
www.ti.com
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF L = 2.2 µH
L = 2.2 µH (LPS3314 2R2)
Figure 21. Output Voltage VOUT = 3.3V Figure 22. Typical Switching Frequency VOUT = 1.8V
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF L = 2.2 µH
L = 2.2 µH
Figure 23. Typical Output Ripple Voltage VOUT = 1.8V Figure 24. Typical Switching Frequency VOUT = 2.1V
COUT = 10 µF (0603) CTRL = GND COUT = 10 µF L = 2.2 µH
L = 2.2 µH
Figure 25. Typical Output Ripple Voltage VOUT = 2.1V Figure 26. Typical Switching Frequency VOUT = 3.0V
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 17
l TEXAS INSTRUMENTS mm Curran! m) 250 \Wmag. v_ M m \Wmag. v_ M m \Wmag. v_ M m I M 7 7 Vng‘A l i—J I! I _‘:_:IW—‘
2.40
2.45
2.50
2.55
2.60
2.65
2.70
2.75
2.80
2.85
2.90
2.40 2.45 2.50 2.55 2.60 2.65 2.70 2.75 2.80 2.85 2.90
Input Voltage V (V)
IN
Output Voltage V (V)
OUT
I = 10mA, rising V
OUT IN
I = 10mA, falling V
OUT IN
I = 50mA, rising V
OUT IN
I = 50mA, falling V
OUT IN
I = 100mA, rising V
OUT IN
I = 100mA, falling V
OUT IN
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
3.20 3.30 3.40 3.50 3.60 3.70
Input Voltage V (V)
IN
Output Voltage V (V)
OUT
I = 10mA, rising V
OUT IN
I = 10mA, falling V
OUT IN
I = 50mA, rising V
OUT IN
I = 50mA, falling V
OUT IN
I = 100mA, rising V
OUT IN
I = 100mA, falling V
OUT IN
0
5
10
15
20
25
30
35
40
45
50
0 50 100 150 200 250 300
Output Current (mA)
V = 3.6V
IN
V = 4.2V
IN
V = 5.0V
IN
V peak to peak Output Ripple Voltage (mVpp)
OUTpp
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.20 2.25 2.30 2.35 2.40 2.45 2.50
Input Voltage V (V)
IN
Output Voltage V (V)
OUT
I = 10mA, rising V
OUT IN
I = 10mA, falling V
OUT IN
I = 50mA, rising V
OUT IN
I = 50mA, falling V
OUT IN
I = 100mA, rising V
OUT IN
I = 100mA, falling V
OUT IN
TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
www.ti.com
COUT = 10 µF (0603) CTRL = GND L = 2.2 µH (LPS3314)
L = 2.2 µH
Figure 27. Typical Output Ripple Voltage VOUT = 3.0V Figure 28. 100% Mode Transition VOUT 2.1V
L = 2.2 µH (LPS3314) L = 2.2 µH (LPS3314)
Figure 29. 100% Mode Transition VOUT 2.5V Figure 30. 100% Mode Transition VOUT 3.3V
VIN = 3.6 V IOUT = 10 µA L = 2.2 µH VIN = 3.6 V IOUT = 1 mA L = 2.2 µH
COUT = 10 µF CTRL = GND COUT = 10 µF CTRL = GND
Figure 31. Typical Operation ILoad = 10µA VOUT = 1.8V Figure 32. Typical Operation ILoad = 1ma, VOUT = 1.8V
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l TEXAS INSTRUMENTS Mu; m nu k: 5
TPS62740, TPS62742
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SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
VIN = 3.6 V IOUT = 25 mA L = 2.2 µH VIN = 3.6 V IOUT = 150 mA L = 2.2 µH
COUT = 10 µF CTRL = GND COUT = 10 µF CTRL = GND
Figure 33. Typical Operation ILoad = 25mA, VOUT = 1.8V Figure 34. Typical Operation ILoad = 150ma, VOUT = 1.8V
VIN = 3.6 V IOUT = 50 µA to 10 mA L = 2.2 µH VIN = 3.6 V IOUT = 0.5 mA to 150 mA L = 2.2 µH
COUT = 10 µF CTRL = GND COUT = 10 µF CTRL = VIN
Figure 35. Load Transient Response VOUT = 1.8V Figure 36. Load Transient Response VOUT = 2.1V
VIN = 3.6 V, VOUT = 2.1 V L = 2.2 µH COUT = 10 µF VIN = 3.6 V, VOUT = 2.1 V L = 2.2 µH, COUT = 10 µF
Loadstep at VOUT 0 mA to 100 mA, Loadstep at VOUT 0 mA to 100 mA,
1 µs rise/ fall time, 70 µs / 7 ms 1 µs rise/fall time; 70 µs / 7 ms
Figure 37. Load Transient Response CTRL = GND Figure 38. Load Transient Response CTRL = VIN
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 19
l TEXAS INSTRUMENTS mm 7 m Mm 7 (van—- m———‘ . mu m n. m f mm m m yr—m— IN .mnr ~ 3mm» SUV/3, .x MM \ ~ u‘w Wm “WM
V Discharge
LOAD
V slew rate
controlled
LOAD
TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
www.ti.com
VIN = 3.6 V / 4.2 V VOUT = 2.1 V L = 2.2 µH VIN = 3.6 V / 4.2 V VOUT = 2.1 V L = 2.2 µH
COUT = 10 µF CTRL = GND COUT = 10 µF CTRL = GND
Figure 39. Line Transient Response IOUT=10mA Figure 40. Line Transient Response IOUT = 100mA
VIN = 3.6 V IOUT = 50 µA to 300 mA L = 2.2 µH VIN = 3.6 V, VOUT = VLOAD= 2.1 V CTRL = VIN
COUT = 10 µF CTRL = GND IOUT = 0 mA CLOAD = 10 µF L = 2.2 µH
COUT = 10 µF ILOAD = 0 to 50 mA to 0 mA
Figure 41. AC Load Sweep VOUT = 2.1V Figure 42. Load Step At Load Output
VIN = 3.6 V VOUT = 2.1 V ILOAD = 0 mA VIN = 3.6 V VOUT = 2.1 V CTRL = GND
IOUT = 0 mA COUT = 10 µF CLOAD = 10 µF ROUT = 100 ΩCOUT = 10 µF L = 2.2 µH
L = 2.2 µH
Figure 43. Load Output On / Off Figure 44. Device Enable And Start Up
20 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
l TEXAS INSTRUMENTS M m"; Wm M u # m ‘ L-H'rw [— 3 h 9—- .lnnr u I H n‘ an.» mu,» sun/3» m \ ,. . .. . W; m Wm M m M m"; j . _— gm :5 m: » rv m ; m :5 m: » rv m ; mm ,' .lnnr ~. g . ~ :mm» 250/3» mm,» W my \ ,. ~ In. - rum; m m", m m, u u m 1 N ‘ N I m
100% mode operation,
high side MOSFET turned on
100% mode operation,
high side MOSFET turned on
TPS62740, TPS62742
www.ti.com
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
VIN = 3.6 V VOUT = 2.1 V CTRL = GND VIN = 3.6 V VOUT = VLOAD = 2.1 V CTRL = VIN
ROUT = 100 ΩCOUT = 10 µF L = 2.2 µH ROUT = 100 Ω, COUT = CLOAD = 10 µF L = 2.2 µH
ILOAD = 0 mA
Figure 45. VOUT Ramp Up After Enable Figure 46. VOUT Ramp Up With Activated Load Switch
VIN = 3.6 V Ramp up / Down COUT = 10 µF L = 2.2 µH CTRL = GND
COUT = 10 µF CTRL = GND VSEL 3+4 toggled VIN = ramp up/down 0 V to 5 V, 150 ms,
IOUT = 5 mA L = 2.2 µH VSEL 1+2 = GND Output resistance 50 Ω
Figure 47. Dynamic Output Voltage Scaling Figure 48. Input Voltage Ramp Up/Down
VOUT = 1.8V/3.0V VOUT = 1.8V
COUT = 10 µF L = 2.2 µH CTRL = GND COUT = 10 µF L = 2.2 µH CTRL = GND
VIN = ramp up/down 0 V to 5 V, 150 ms, VIN = ramp up/down 0 V to 5 V, 150 ms,
Output resistance 50 ΩOutput resistance 50 Ω
Figure 49. Input Voltage Ramp Up/Down VOUT = 2.6V Figure 50. Input Voltage Ramp Up/Down VOUT = 3.3V
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 21
l TEXAS INSTRUMENTS TP862740
GND
L
VSEL1
SW
PG
VIN
CTRL
VBAT
CIN
TPS62740
VOUT Main
VSEL2
VSEL3
LOAD
Control Sub-System
Main
Supply
Voltage
Selection
VSEL4
GND
EN
VOUT
Master
MCU
Radio
Sensor
Switched Supply
Sub-
System
Power Good
VOUT Main
RPull Up
High side mosfet turned on
Leave / Enter
100% Mode
TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
www.ti.com
VOUT = 3.0 V COUT = 10 µF L = 2.2 µH, CTRL = GND
VIN = ramp up /down 2.8 V to 3.7 V,
Output resistance 50 Ω
Figure 51. Enter/Leave 100% Mode Operation
10.3 System Example
Figure 52. Example Of Implementation In A Master MCU Based System
22 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
i Tans INSTRUMENTS
U1x1
U1x2
U1x3
U1x4
U1x5
U1x6 U1x7
U1x8
U1x9
U1x10
U1x11
U1x12
U1x13
C2x1
C2x2
C1x1
C1x2
L1x1
L1x2
7.2 mm
GND
VOUT
CIN
(0603)
COUT
(0603)
GND
L(0805)
TPS62740
LOAD
VIN
EN
VSEL
1-4 PG
Solution size: 31mm
Height: 1mm max.
2
4.3 mm
TPS62740, TPS62742
www.ti.com
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
11 Power Supply Recommendations
The power supply to the TPS6274x needs to have a current rating according to the supply voltage, output
voltage and output current of the TPS6274x.
12 Layout
12.1 Layout Guidelines
As for all switching power supplies, the layout is an important step in the design. Care must be taken in board
layout to get the specified performance. If the layout is not carefully done, the regulator could show poor line
and/or load regulation, stability issues as well as EMI problems and interference with RF circuits. It is critical to
provide a low inductance, impedance ground path. Therefore, use wide and short traces for the main current
paths. The input capacitor should be placed as close as possible to the IC pins VIN and GND. The output
capacitor should be placed close between VOUT and GND pins. The VOUT line should be connected to the
output capacitor and routed away from noisy components and traces (e.g. SW line) or other noise sources. The
exposed thermal pad of the package and the GND pin should be connected. See Figure 53 for the
recommended PCB layout.
12.2 Layout Example
Figure 53. Recommended PCB Layout
Copyright © 2013–2014, Texas Instruments Incorporated Submit Documentation Feedback 23
l TEXAS INSTRUMENTS
TPS62740, TPS62742
SLVSB02B –NOVEMBER 2013–REVISED JULY 2014
www.ti.com
13 Device and Documentation Support
13.1 Device Support
13.1.1 Third-Party Products Disclaimer
TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT
CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES
OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER
ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.
13.2 Documentation Support
13.2.1 Related Documentation
See also TPS62740EVM-186 Evaluation Module User's Guide,SLVU949; and application note Accurately
measuring efficiency of ultralow-IQ devices, SLYT558 for accurate efficiency measurements in PFM mode
operation.
13.3 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 6. Related Links
TECHNICAL TOOLS & SUPPORT &
PARTS PRODUCT FOLDER SAMPLE & BUY DOCUMENTS SOFTWARE COMMUNITY
TPS62740 Click here Click here Click here Click here Click here
TPS62742 Click here Click here Click here Click here Click here
13.4 Trademarks
DCS-Control is a trademark of Texas Instruments.
Bluetooth is a registered trademark of Bluetooth SIG, Inc.
13.5 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
13.6 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
14 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
24 Submit Documentation Feedback Copyright © 2013–2014, Texas Instruments Incorporated
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 11-Aug-2022
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TPS62740DSSR ACTIVE WSON DSS 12 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 62740 Samples
TPS62740DSST ACTIVE WSON DSS 12 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 62740 Samples
TPS62742DSSR ACTIVE WSON DSS 12 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 62742 Samples
TPS62742DSST ACTIVE WSON DSS 12 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 62742 Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 1
TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 11-Aug-2022
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
I TEXAS INSTRUMENTS 5:. V.’
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL INFORMATION
Reel Width (W1)
REEL DIMENSIONS
A0
B0
K0
W
Dimension designed to accommodate the component length
Dimension designed to accommodate the component thickness
Overall width of the carrier tape
Pitch between successive cavity centers
Dimension designed to accommodate the component width
TAPE DIMENSIONS
K0 P1
B0 W
A0
Cavity
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Pocket Quadrants
Sprocket Holes
Q1 Q1Q2 Q2
Q3 Q3Q4 Q4 User Direction of Feed
P1
Reel
Diameter
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TPS62740DSSR WSON DSS 12 3000 180.0 8.4 2.25 3.25 1.05 4.0 8.0 Q1
TPS62740DSST WSON DSS 12 250 180.0 8.4 2.25 3.25 1.05 4.0 8.0 Q1
TPS62742DSSR WSON DSS 12 3000 180.0 8.4 2.25 3.25 1.05 4.0 8.0 Q1
TPS62742DSST WSON DSS 12 250 180.0 8.4 2.25 3.25 1.05 4.0 8.0 Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
W
L
H
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TPS62740DSSR WSON DSS 12 3000 182.0 182.0 20.0
TPS62740DSST WSON DSS 12 250 182.0 182.0 20.0
TPS62742DSSR WSON DSS 12 3000 182.0 182.0 20.0
TPS62742DSST WSON DSS 12 250 182.0 182.0 20.0
Pack Materials-Page 2
GENERIC PACKAGE VIEW D33 12 WSON - 0.8 mm max heigm PLASTIC SMALL OUTLINE , N0 LEAD Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the product dala sheel for package details. 4209244/D I TEXAS INSTRI IMFNTS
% DSSOO12A A61 5(5) 1U 5@ hams lermmEN'rs
www.ti.com
PACKAGE OUTLINE
C
12X 0.3
0.2
2±0.1
12X 0.35
0.25
2X
2.5
0.9±0.1
10X 0.5
0.8 MAX
0.05
0.00
B2.1
1.9
A
3.1
2.9
0.35
0.25
0.3
0.2
(0.2) TYP
4X (0.2)
(0.7)
WSON - 0.8 mm max heightDSS0012A
PLASTIC SMALL OUTLINE - NO LEAD
4222684/A 02/2016
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
67
12
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
13
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SEE TERMINAL
DETAIL
SCALE 5.000
DETAIL
OPTIONAL TERMINAL
TYPICAL
DSSOO12A (¢
www.ti.com
EXAMPLE BOARD LAYOUT
(0.75)
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(0.9)
10X (0.5)
(1.9)
12X (0.25)
12X (0.5)
(2)
(R ) TYP0.05
( ) VIA TYP
NOTE 5
0.2
WSON - 0.8 mm max heightDSS0012A
PLASTIC SMALL OUTLINE - NO LEAD
4222684/A 02/2016
SYMM
1
67
12
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
13
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If some or all are implemented, recommended via locations are shown.
It is recommended that vias located under solder paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
DSSOO12A
www.ti.com
EXAMPLE STENCIL DESIGN
12X (0.25)
12X (0.5)
10X (0.5)
(0.9)
(0.9)
(1.9)
(R ) TYP0.05
WSON - 0.8 mm max heightDSS0012A
PLASTIC SMALL OUTLINE - NO LEAD
4222684/A 02/2016
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 13:
90% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
67
12
SYMM
METAL
TYP
13
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