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Product Overview
Digi-Key Part Number BER167-ND
Quantity Available 4.017
Can ship immediately
Manufacturer

Manufacturer Part Number

HF115AC-0.0055-AC-54

Description THERM PAD 19.05MMX12.7MM W/ADH
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Manufacturer Standard Lead Time 2 Weeks
Detailed Description

Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side

Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
Environmental Information Hi-Flow 115-AC Material Report
Design Resources Thermal Interface Materials Explained
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
Catalog Page 2577 (AT2011-DE PDF)
Product Attributes Select All
Categories
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Type Pad, Sheet
Shape Rectangular
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
 
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Additional Resources
Standard Package ? 100
Other Names BER167
BG426641
HF115AC-54
HF115AC00055AC54
HF115TAAC-54

15:43:36 6.24.2018

Price & Procurement
 

Quantity
All prices are in EUR.
Price Break Unit Price Extended Price
1 0,09000 € 0,09
10 0,07400 € 0,74
50 0,06660 € 3,33
100 0,05890 € 5,89
500 0,05118 € 25,59
1.000 0,03838 € 38,38
5.000 0,03326 € 166,32

Submit a request for quotation on quantities greater than those displayed.

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