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Price & Procurement
 

Quantity
All prices are in EUR.
Price Break Unit Price Extended Price
1 0,09000 € 0,09
10 0,07600 € 0,76
50 0,06820 € 3,41
100 0,06040 € 6,04
500 0,05248 € 26,24
1.000 0,03936 € 39,36
5.000 0,03411 € 170,57

Submit a request for quotation on quantities greater than those displayed.

Product Overview
Digi-Key Part Number BER167-ND
Copy   BER167-ND
Quantity Available 18.501
Can ship immediately
Manufacturer

Copy   PartSearchCore.DksusService3.PidVid
Manufacturer Part Number

HF115AC-0.0055-AC-54

Copy   HF115AC-0.0055-AC-54
Description THERM PAD 19.05MMX12.7MM W/ADH
Copy   THERM PAD 19.05MMX12.7MM W/ADH
Manufacturer Standard Lead Time 2 Weeks
Detailed Description

Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side

Copy   Thermal Pad Gray 19.05mm x 12.70mm Rectangular Adhesive - One Side
Documents & Media
Datasheets Hi-Flow 115-AC
Other Related Documents Sil-Pad Metric Configurations
Design Resources Thermal Interface Materials Explained
PCN Packaging Henkel/Berquist Revised Brands 10/May/2016
HTML Datasheet Hi-Flow 115-AC
Catalog Page 2577 (AT2011-DE PDF)
Product Attributes Select All
Categories
Manufacturer Bergquist
Series Hi-Flow® 115-AC
Part Status Active
Usage TO-220
Type Pad, Sheet
Shape Rectangular
Outline 19.05mm x 12.70mm
Thickness 0.0055" (0.140mm)
Material Phase Change Compound
Adhesive Adhesive - One Side
Backing, Carrier Fiberglass
Color Gray
Thermal Resistivity 0.35°C/W
Thermal Conductivity 0.8 W/m-K
Shelf Life -
Shelf Life Start -
Storage/Refrigeration Temperature -
 
Environmental & Export Classifications
Lead Free Status / RoHS Status Lead free / RoHS Compliant
Moisture Sensitivity Level (MSL) 1 (Unlimited)
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Additional Resources
Standard Package ? 100
Other Names BER167
BG426641
HF115AC-54
HF115AC00055AC54
HF115TAAC-54

19:37:15 3.21.2019