TS97x Datasheet by STMicroelectronics

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‘ ’, nienugmented SOS TSSOPS O DFNB 3x3 TSSOPM
June 2016
DocID6031 Rev 11
1/18
This is information on a product in full production.
www.st.com
TS971, TS972, TS974
Output rail-to-rail very low noise operational amplifier
Datasheet - production data
Features
Rail-to-rail output voltage swing ±2.4 V at
VCC = ±2.5 V
Very low noise level: 4 nV/√Hz
Ultra low distortion: 0.003 %
High dynamic features: 12 MHz, 4 V/µs
Operating range: 2.7 to 10 V
ESD protection (2 kV)
Latch-up immunity (class A)
Applications
Portable devices (CD players, PDAs)
Portable communication
(cell phones, pagers)
Instrumentation and sensing technology
Professional audio circuits
Description
The TS97x family of operational amplifiers
operate with voltages as low as ±1.35 V and
feature output rail-to-rail signal swing. The TS97x
devices are particularly well suited for portable
and battery-supplied equipment. Very low noise
and low distortion characteristics make them
ideal for audio pre-amplification.
The TS97x devices are available in a variety of
packages to suit all types of applications. For
applications where space saving is critical, the
SOT23-5 package (2.8 x 2.9 mm) or the DFN8
package (3 x 3 mm) simplify the board design
because they can be placed anywhere on it.
TS971, TS972, TS974
2/18
DocID6031 Rev 11
Contents
1 Package pin connections ................................................................ 3
2 Absolute maximum ratings and operating conditions ................. 4
3 Electrical characteristics ................................................................ 6
4 Electrical characteristic curves ...................................................... 7
5 Package information ....................................................................... 9
5.1 SOT23-5 package information ........................................................ 10
5.2 SO8 package information ................................................................ 11
5.3 TSSOP8 package information ......................................................... 12
5.4 DFN8 3x3 exposed pad package information ................................. 13
5.5 SO14 package information .............................................................. 14
5.6 TSSOP14 package information ....................................................... 15
6 Ordering information ..................................................................... 16
7 Revision history ............................................................................ 17
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TS971, TS972, TS974
Package pin connections
DocID6031 Rev 11
3/18
1 Package pin connections
Figure 1: Package pin connections
1. The exposed pad of the DFN8 3x3 can be connected to VCC or left floating
Absolute maximum ratings and operating
conditions
TS971, TS972, TS974
4/18
DocID6031 Rev 11
2 Absolute maximum ratings and operating conditions
Table 1: Absolute maximum ratings (AMR)
Symbol
Parameter
Value
Unit
VCC
Supply voltage (1)
12
V
Vid
Differential input voltage (2)
±1
Vin
Input voltage (3)
VDD - 0.3 to VCC + 0.3
Tstg
Storage temperature range
-65 to 150
°C
Tj
Maximum junction temperature
150
Rthja
Thermal resistance junction-to-ambient (4)
SOT23-5
250
°C/W
SO8
125
TSSOP8
120
DFN8 3x3
40
SO14
105
TSSOP14
100
Rthjc
Thermal resistance junction-to-case (4)
SOT23-5
81
SO8
40
TSSOP8
37
DFN8 3x3
5.2
SO14
31
TSSOP14
32
ESD
HBM: human body model (5)
2
kV
MM: machine model (6)
200
V
CDM: charged device model (7) (8)
1.5
kV
Lead temperature (soldering, 10 sec.)
260
°C
Notes:
(1)All voltage values, except the differential voltage are with respect to the network ground terminal.
(2)The differential voltage is the non-inverting input terminal with respect to the inverting input terminal.
(3)The magnitude of input and output voltages must never exceed VCC + 0.3 V.
(4)Short-circuits can cause excessive heating and destructive dissipation. Values are typical.
(5)Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a 1.5kΩ
resistor between two pins of the device. This is done for all couples of connected pin combinations while the other
pins are floating.
(6)Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between two
pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of connected
pin combinations while the other pins are floating.
(7) No value specified for CDM on SOT23-5 package.
(8)Charged device model: all pins and package are charged together to the specified voltage and then discharged
directly to ground through only one pin. This is done for all pins.
TS971, TS972, TS974
Absolute maximum ratings and operating
conditions
DocID6031 Rev 11
5/18
Table 2: Operating conditions
Symbol
Parameter
Value
Unit
VCC
Supply voltage
2.7 to 10
V
Vicm
Common mode input voltage range
VDD + 1.15 to VCC - 1.15
Toper
Operating free air temperature range
-40 to 125
°C
Electrical characteristics
TS971, TS972, TS974
6/18
DocID6031 Rev 11
3 Electrical characteristics
Table 3: Electrical characteristics at VCC = 2.5 V, VDD = -2.5 V, Tamb = 25 °C
(unless otherwise specified)
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
Vio
Input offset voltage
1
5
mV
Tmin ≤ Tamb ≤ Tmax
7
ΔVio/ΔT
Input offset voltage drift
Vicm = 0 V, Vo = 0 V
5
µV/°C
Iio
Input offset current
Vicm = 0 V, Vo = 0 V
10
150
nA
Iib
Input bias current
Vicm = 0 V, Vo = 0 V
200
750
Tmin ≤ Tamb ≤ Tmax
200
1000
Vicm
Common mode input voltage
range
-1.35
1.35
V
CMR
Common mode rejection ratio
Vicm = ±1.35 V
60
85
dB
SVR
Supply voltage rejection ratio
VCC = ±2 V to ±3 V
60
70
Avd
Large signal voltage gain
RL = 2 kΩ
70
80
VOH
High-level output voltage
2
2.4
V
VOL
Low-level output voltage
-2.4
-2
Isource
Output source current
1.5
mA
Isink
Output sink current
100
ICC
Supply current per amplifier
Unity gain, no load
2
2.8
GBP
Gain bandwidth product
f = 100 kHz, RL = 2 kΩ,
CL = 100 pF
8.5
12
MHz
SR
Slew rate
AV = 1, Vin = ±1 V
2.8
4
V/µs
∅m
Phase margin at unit gain
RL = 2 kΩ, CL = 100 pF
60
Degrees
Gm
Gain margin
10
dB
en
Equivalent input noise voltage
f = 100 kHz
4
nV/√Hz
in
Equivalent input noise current
f = 1 kHz
250
fA/√Hz
THD
Total harmonic distortion
f = 1 kHz, AV = -1, RL = 10 kΩ
0.003
%
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TS971, TS972, TS974
Electrical characteristic curves
DocID6031 Rev 11
7/18
4 Electrical characteristic curves
Figure 2: Input offset voltage distribution
Figure 3: Voltage gain and phase vs. frequency
VCC = 5 V
Figure 4: Voltage gain and phase vs. frequency
VCC = 2.7 V
Figure 5: THS vs. Vout, VCC = 5 V
Figure 6: THD vs. Vout, VCC = 2.7 V
Figure 7: THD vs. frequency
6 M E H 5‘5 E E 1% ‘2 i 5 s 5‘ 45 i 3 g m E E m =10 m z 4 i C 00 pF a Vet: 3‘s 5 um 01 1 w 100 .2 .1 o 1 2 Frauuem (kHz) ompm currem (mA) an m a so ? ’5— i 3““ NW :3 2 m E An g a: 3 § E 20 RL: m m § 1 An ‘ . n 2 4 a s m 12 mum current {mm Supp‘y voMage (V) so § an A g CL=SDDF g E' 40 g g CL=130pF E g 20 cL SflpF a a Sunp‘y vu‘iage (V) CL: 250 pF m ‘2 59250 pF 5 s Supp‘y vouage (v, m ‘2
Electrical characteristic curves
TS971, TS972, TS974
8/18
DocID6031 Rev 11
Figure 8: Noise voltage vs. frequency
Figure 9: Gain bandwidth product vs. Iout
Figure 10: Phase margin vs. Iout
Figure 11: Phase margin vs. VCC RL = 10 kΩ,
CL = 30 pF
Figure 12: Phase margin vs. VCC CL = 30, 130,
and 250 pF
Figure 13: Gain margin vs. VCC
TS971, TS972, TS974
Package information
DocID6031 Rev 11
9/18
5 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
Package information
TS971, TS972, TS974
10/18
DocID6031 Rev 11
5.1 SOT23-5 package information
Figure 14: SOT23-5 package outline
Table 4: SOT23-5 mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.90
1.20
1.45
0.035
0.047
0.057
A1
0.15
0.006
A2
0.90
1.05
1.30
0.035
0.041
0.051
B
0.35
0.40
0.50
0.014
0.016
0.020
C
0.09
0.15
0.20
0.004
0.006
0.008
D
2.80
2.90
3.00
0.110
0.114
0.118
D1
1.90
0.075
e
0.95
0.037
E
2.60
2.80
3.00
0.102
0.110
0.118
F
1.50
1.60
1.75
0.059
0.063
0.069
L
0.10
0.35
0.60
0.004
0.014
0.024
K
0 degrees
10 degrees
0 degrees
10 degrees
ditljiljlr J: on. 3 ”m 5 T % u 3 u
TS971, TS972, TS974
Package information
DocID6031 Rev 11
11/18
5.2 SO8 package information
Figure 15: SO8 package outline
Table 5: SO8 mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max
A
1.75
0.069
A1
0.10
0.25
0.004
0.010
A2
1.25
0.049
b
0.28
0.48
0.011
0.019
c
0.17
0.23
0.007
0.010
D
4.80
4.90
5.00
0.189
0.193
0.197
E
5.80
6.00
6.20
0.228
0.236
0.244
E1
3.80
3.90
4.00
0.150
0.154
0.157
e
1.27
0.050
h
0.25
0.50
0.010
0.020
L
0.40
1.27
0.016
0.050
L1
1.04
0.040
k
1°
8°
1°
8°
ccc
0.10
0.004
1 n mm W: mo w m: NU‘AVJ mun 1 Md L /.
Package information
TS971, TS972, TS974
12/18
DocID6031 Rev 11
5.3 TSSOP8 package information
Figure 16: TSSOP8 package outline
Table 6: TSSOP8 mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
1.2
0.047
A1
0.05
0.15
0.002
0.006
A2
0.80
1.00
1.05
0.031
0.039
0.041
b
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.008
D
2.90
3.00
3.10
0.114
0.118
0.122
E
6.20
6.40
6.60
0.244
0.252
0.260
E1
4.30
4.40
4.50
0.169
0.173
0.177
e
0.65
0.0256
k
0°
8°
0°
8°
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1
0.039
aaa
0.1
0.004
Wm“, KME . + w-l-M Ail A“ H 3 4 LL A i U E2
TS971, TS972, TS974
Package information
DocID6031 Rev 11
13/18
5.4 DFN8 3x3 exposed pad package information
Figure 17: DFN8 3x3 package outline
Table 7: DFN8 3x3 mechanical data
Symbol
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
0.80
0.90
1.00
0.031
0.035
0.039
A1
0.02
0.0008
0.0019
A2
0.55
0.65
0.80
0.021
0.025
0.031
A3
0.20
0.008
b
0.18
0.25
0.30
0.007
0.010
0.012
D
2.85
3.00
3.15
0.112
0.118
0.124
D2
2.20
2.70
0.087
0.106
E
2.85
3.00
3.15
0.112
0.118
0.124
E2
1.40
1.75
0.055
0.069
e
0.50
0.020
L
0.30
0.40
0.50
0.012
0.016
0.020
ddd
0.08
0.003
$ ”Ll—B m =L SEAHNG PLANE cw: PLANE L_J_ 7‘“
Package information
TS971, TS972, TS974
14/18
DocID6031 Rev 11
5.5 SO14 package information
Figure 18: SO14 package outline
Table 8: SO14 mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
1.35
1.75
0.05
0.068
A1
0.10
0.25
0.004
0.009
A2
1.10
1.65
0.04
0.06
B
0.33
0.51
0.01
0.02
C
0.19
0.25
0.007
0.009
D
8.55
8.75
0.33
0.34
E
3.80
4.0
0.15
0.15
e
1.27
0.05
H
5.80
6.20
0.22
0.24
h
0.25
0.50
0.009
0.02
L
0.40
1.27
0.015
0.05
k
8° (max)
ddd
0.10
0.004
E1 1 :lf AZ‘A Q c J A1 fin n m H H fii \ WW1 ,,,,, E 5mm PLANE 025 mm GAGE PLANE D’ \ L1
TS971, TS972, TS974
Package information
DocID6031 Rev 11
15/18
5.6 TSSOP14 package information
Figure 19: TSSOP14 package outline
Table 9: TSSOP14 mechanical data
Ref.
Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
A
1.20
0.047
A1
0.05
0.15
0.002
0.004
0.006
A2
0.80
1.00
1.05
0.031
0.039
0.041
b
0.19
0.30
0.007
0.012
c
0.09
0.20
0.004
0.0089
D
4.90
5.00
5.10
0.193
0.197
0.201
E
6.20
6.40
6.60
0.244
0.252
0.260
E1
4.30
4.40
4.50
0.169
0.173
0.176
e
0.65
0.0256
L
0.45
0.60
0.75
0.018
0.024
0.030
L1
1.00
0.039
k
0°
8°
0°
8°
aaa
0.10
0.004
aaa
Ordering information
TS971, TS972, TS974
16/18
DocID6031 Rev 11
6 Ordering information
Table 10: Order codes
Order code
Temperature range
Package
Packaging
Marking
TS971IDT
-40 °C, 125 °C
SΟ8
Tape and reel
971I
TS971ILT
SOT23-5
K120
TS971IYLT (1)
SOT23-5 (automotive grade level)
K121
TS972IDT
SO8
972I
TS972IPT
TSSOP8
TS972IQT
DFN8 3x3
TS972IYDT (1)
SO8 (automotive grade level)
972IY
TS972IYPT (1)
TSSOP8 (automotive grade level)
972IY
TS972IYQT (1)
DFN8 3x3 (automotive grade level)
972Y
TS974IDT
SO14
974I
TS974IPT
TSSOP14
TS974IYPT (1)
TSSOP14 (automotive grade level)
974IY
Notes:
(1)Qualified and characterized according to AEC Q100 and Q003 or equivalent, advanced screening according to AEC Q001 and
Q 002 or equivalent.
TS971, TS972, TS974
Revision history
DocID6031 Rev 11
17/18
7 Revision history
Table 11: Document revision history
Date
Revision
Changes
15-Nov- 2002
1
First release.
9-May- 2005
2
Modifications on AMR table (explanation of Vid and Vi limits)
31-Aug-2005
3
PPAP references inserted in the datasheet, see Table 1 on page 2.
9-Dec-2005
4
Thermal resistance junction to case data added in Table 1. on page 3
Missing PPAP references inserted in the datasheet, see Table 10:
Order codes.
3-Oct-2007
5
Added Rthja and Rthjc values for DIP8 and DIP14 packages in Table 1.
ESD footnotes updated in Table 1: Absolute maximum ratings (AMR).
Description section updated on cover page.
Markings for automotive grade parts corrected in Table 10: Order
codes.
20-Dec-2007
6
Reformatted package information in Section 3: Package information.
Footnotes for automotive grade parts corrected in Table 10: Order
codes.
06-May-2010
7
Updated package information (drawings and data) in Chapter 3.
Removed DIP package order codes from Chapter 4: Ordering
information.
19-Sep-2012
8
Updated “Pin connection” figure on page 1 (removed part numbers).
Removed TS971ID, TS971IYD, TS972ID, TS972IYD, TS974ID and
TS974IYD order code from Table 10.
Qualified status of TS971IYLT and TS974IYPT order code in Table 10.
Minor corrections throughout document.
19-Jul-2013
9
Added footnote regarding NC to the DFN8 3x3 pinout
Table 10: Order codes: removed order code TS971IYDT; added
automotive qualification to order code TS972IYPT.
07-Mar-2014
10
Table 3: Electrical characteristics at VCC = +2.5 V, VDD = -2.5 V, Tamb =
25 °C (unless otherwise specified): added parameter “equivalent input
noise current”
24-Jun-2016
11
Added package silhouettes to cover page
Removed pinouts to Section 1: "Package pin connections"
Updated document layout
Table 5: updated “k” parameter in Millimeters, Min. column.
Table 6: moved “aaa” parameter to Typ. column instead of Max.
column.
Table 7: removed "0.5" from A1, Millimeters, Max column.
Table 10: "Order codes": removed obsolete order code TS974IYDT,
added order code TS972IYQT, removed “tube” packaging.
TS971, TS972, TS974
18/18
DocID6031 Rev 11
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Information in this document supersedes and replaces information previously supplied in any prior versions of this document.
© 2016 STMicroelectronics – All rights reserved

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