Tip and Ring, X7R, Commercial Datasheet by KEMET

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E‘ectromc Components KEII/IEI' CHARGED?
1© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
One world. One KEMET
Benefits
• –55°C to +125°C operating temperature range
• Lead (Pb)-free, RoHS and REACH compliant
• EIA 0603, 0805, 1206, 1210, 1812, 1825, 2220 and 2225
case sizes
• DC voltage rating of 250 V
• Capacitanceofferingsrangingfrom180pFto.47μF
• Available capacitance tolerances of ±5%, ±10% and ±20%
• Non-polar device, minimizing installation concerns
• 100%puremattetin-platedterminationfinishthatallows
for excellent solderability
• SnPbterminationfinishoptionavailableuponrequest
(5% Pb minimum)
• Flexibleterminationoptionavailableuponrequest
Overview
TheKEMET250VDCTipandRingMLCCsinX7Rdielectric
are designed and rated for telecommunication ringer
circuits,wherethecapacitorisusedtoblock–48to–52
VDC of line voltage and pass a 16 - 25 Hz AC signal pulse
of 70 Vrms to 90 Vrms. Serving as an excellent replacement
forhighvoltageleadedfilmdevices,thesesmallersurface
mounttechnologyfootprintssavevaluableboardspace,
whichiscriticalwhencreatingnewdesigns.
TheKEMETTipandRingcapacitorsfeaturea125°C
maximum operating temperature and are considered
temperaturestable.TheElectronicsIndustriesAlliance
(EIA)characterizesX7RdielectricasaClassIImaterial.
Componentsofthisclassificationarefixed,ceramicdielectric
capacitors suited for bypass and decoupling applications or
forfrequencydiscriminatingcircuits,whereQandstability
ofcapacitancecharacteristicsarenotcritical.X7Rdielectric
exhibitsapredictablechangeincapacitancewithrespectto
timeandvoltage,andboastsaminimalchangeincapacitance
withreferencetoambienttemperature.Capacitancechangeis
limited to ±15% from –55°C to +125°C.
Thesedevicesareabletowithstandtoday’shigherlead-
freereflowprocessingtemperaturesandoffersuperiorhigh
frequencyfilteringcharacteristicsandlowESR.
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC
(Commercial Grade)
Applications
Typicalapplicationsincludetelecommunicationringingcircuits,switchmodepowersupplysnubbercircuits,highvoltage
DCblockingandhighvoltagecoupling.Marketsincludetelephonelines,analoganddigitalmodems,facsimilemachines,
wirelessbasestations,cableanddigitalvideorecordingset-topboxes,satellitedishes,highvoltagepowersupply,DC/DC
converters,andEthernet,POSandATMhardware.
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E1ccrmmc compmm KEIVIEI' summer): Rated Voltage (VDC) Failure Rale/ Design 0603 0805 1206 1210 1812 1825 2220 2225 7411 (HA 0603 and smal‘er case srzes) 7210 (EIA (1305 and larger case srzes) 7040 (EIA 0503) 7215 (EIA 0805 and larger case srzes)
2© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Ordering Information
C1825 C105 K A R A CTU
Ceramic Case Size
(L" x W")
Specification/
Series
Capacitance
Code (pF)
Capacitance
Tolerance
Rated
Voltage
(VDC)
Dielectric
Failure
Rate/
Design
TerminationFinish1Packaging/
Grade (C-Spec)
0603
0805
1206
1210
1812
1825
2220
2225
C = Standard
X = Flexible
termination
Two
significant
digits and
number of
zeros
J = ±5%
K = ±10%
M = ±20%
A = 250 V R = X7R A = N/A C = 100% Matte Sn
L = SnPb (5% Pb minimum)
See
"Packaging
C-Spec
Ordering
Options Table"
1 Additional termination finish options may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)
Bulk Bag/Unmarked
Notrequired(Blank)
7" Reel/Unmarked
TU
13" Reel/Unmarked
7411 (EIA 0603 and smaller case sizes)
7210 (EIA 0805 and larger case sizes)
7" Reel/Marked
TM
13" Reel/Marked
7040 (EIA 0603)
7215 (EIA 0805 and larger case sizes)
7"Reel/Unmarked/2mmpitch
2
7081
13"Reel/Unmarked/2mmpitch
2
7082
1 Default packaging is "Bulk Bag." An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking."
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
Qualification/Certification
Commercialgradeproductsaresubjecttointernalqualification.Detailsregardingtestmethodsandconditionsare
referenced in Table 4 , Performance and Reliability.
Telecom T10 & R1ng,X7R Dielectric, 250 VDC (Commercial Grade) ammm Compancnls KEIVIEI' 1211411020: 1.50 (0053) 00010032) 0.35 (0.014) 10.15 (0.005) 10.15 (0.005) 10.15 (0.005) 2.00 (0.079) 1.25 (0.049) 0.50 (0.02) 10.20 (0.005) 10.20 (0,005) 10.25 (0,010) 3.20 (0,125) 1.50 (0.053) 0.50 (0.02) 10.20 (0.005) 10.20 (0,005) 10.25 (0,010) 3.20 (0,125) 2.50 (0.090) 0.50 (0.02) 10.20 (0.005) 10.20 (0,005) 10.25 (0,010) 4.50 (0.177) 3.20 (0.125) 0.50 (0,024) 10.30 (0.012) 10.30 (0.012) 10.35 (0,014) 4.50 (0.177) 5.40 (0.252) 0.50 (0,024) 10.30 (0.012) 10.40 (0.015) 10.35 (0,014) 5.70 (0.224) 5.00 (0.197) 0.50 (0,024) 10.40 (0,015) 10.40 (0.015) 10.35 (0,014) 5.50 (0.220) 5.40 (0.240) 0.50 (0,024) 10.40 (0,015) 10.40 (0.015) 10.35 (0,014)
3© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Environmental Compliance
Lead(Pb)-freedielectricmaterial,RoHS,andREACHcompliantwithoutexemptions.
Dimensions – Millimeters (Inches) – Standard & Flexible Termination
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0603 1608
1.60 (0.063)
±0.15 (0.006)
0.80 (0.032)
±0.15 (0.006)
See Table 2 for
Thickness
0.35 (0.014)
±0.15 (0.006)
0.70 (0.028)
Solder wave or
Solderreflow
0805 2012
2.00 (0.079)
±0.20 (0.008)
1.25 (0.049)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010)
0.75 (0.030)
1206 3216
3.20 (0.126)
±0.20 (0.008)
1.60 (0.063)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010)
N/A
1210 3225
3.20 (0.126)
±0.20 (0.008)
2.50 (0.098)
±0.20 (0.008)
0.50 (0.02)
±0.25 (0.010)
Solderreflow
only
1812 4532
4.50 (0.177)
±0.30 (0.012)
3.20 (0.126)
±0.30 (0.012)
0.60 (0.024)
±0.35 (0.014)
1825 4564
4.50 (0.177)
±0.30 (0.012)
6.40 (0.252)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
2220 5650
5.70 (0.224)
±0.40 (0.016)
5.00 (0.197)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
2225 5664
5.60 (0.220)
±0.40 (0.016)
6.40 (0.248)
±0.40 (0.016)
0.60 (0.024)
±0.35 (0.014)
ammm Compancnls KEIl/IEI' Emma): 250% M rated voltage (5 11 seconds and charge/discharge not exceeding 50 mA)
4© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
Operating Temperature Range −55°Cto+125°C
CapacitanceChangewithReferenceto
+25°C and 0 VDC Applied (TCC) ±15%
1Aging Rate (Maximum % Capacitance Loss/Decade Hour) 3.0%
2DielectricWithstandingVoltage(DWV)
3Dissipation Factor (DF) Maximum Limit at 25°C 5% (6.3 V and 10 V), 3.5% (16 V and 25 V) and 2.5% (50 V to 250 V)
4Insulation Resistance (IR) Minimum Limit at 25°C See Insulation Resistance Limit Table
(Rated voltage applied for 120 ±5 seconds at 25°C)
1 Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.
2 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
3 Capacitance and dissipation factor (DF) measured under the following conditions:
1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF
120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance > 10 µF
4To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
ammmc compmm KEIl/IEI' EHARGED! 1,000 megohm 500 megohm 100 megohm microfarads or 100 an miclnlalads or 10 an microfarads or 10 an
5© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric Rated DC
Voltage
Capacitance
Value
Dissipation Factor
(Maximum %)
Capacitance
Shift
Insulation
Resistance
X7R
> 25
All
3.0
±20% 10% of Initial
limit
16/25
5.0
< 16
7.5
Insulation Resistance Limit Table
EIA Case Size Rated DC Voltage
1,000 megohm
microfarads or 100 GΩ
500 megohm
microfarads or 10 GΩ
100 megohm
microfarads or 10 GΩ
0201
ALL
N/A
ALL
N/A
0402
ALL
< .012 µF
≥.012µF
N/A
0603
≤200V
< .047 µF
≥.047µF
N/A
250 V
N/A
N/A
ALL
0805
≤200V
< 0.15 µF
≥0.15µF
N/A
250 V
< .027 µF
N/A
≥.027µF
1206
≤200V
< 0.47 µF
≥0.47µF
N/A
250 V
< 0.12 µF
N/A
≥0.12µF
1210
≤200V
< 0.39 µF
≥0.39µF
N/A
250 V
< 0.27 µF
N/A
≥0.27µF
1808
ALL
ALL
N/A
N/A
1812
ALL
< 2.2 µF
≥2.2µF
N/A
1825
ALL
ALL
N/A
N/A
2220
ALL
< 10 µF
≥10µF
N/A
2225
ALL
ALL
N/A
N/A
Enacucmc Compnncnts KEIVIEI' CHARGED? naieu Vnhage ivnn Capacitance Prcihici Availability and chip Thickness ccdcs Tolerance See Table 1 m chip Thickness Dimensions naieu Vnhage ivnn Case sixei Series
6© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 1 – Capacitance Range/Selection Waterfall (0603 – 2225 Case Sizes)
Capacitance Capacitance
Code
Case Size/
Series C0603C C0805C C1206C C1210C C1812C C1825C C2220C C2225C
Voltage Code AAAAAAAA
Rated Voltage
(VDC)
A250 250 250 250 250 250 250
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
180 pF 181 J K M DR
220 pF 221 J K M DR
270 pF 271 J K M DR
330 pF 331 J K M DR
390 pF 391 J K M DR
470 pF 471 J K M DR
560 pF 561 J K M DR
680 pF 681 J K M DR
820 pF 821 J K M DR
1,000 pF 102 J K M CJ DR EQ
1,200 pF 122 J K M CJ DR EQ
1,500 pF 152 J K M CJ DR EQ
1,800 pF 182 J K M CJ DR EQ
2,200 pF 222 J K M CJ DR EQ FN
2,700 pF 272 J K M CJ DR EQ FN
3,300 pF 332 J K M CJ DR EQ FN
3,900 pF 392 J K M CJ DR EQ FN
4,700 pF 472 J K M CJ DR EQ FN
5,600 pF 562 J K M CJ DR EQ FN
6,800 pF 682 J K M CJ DR EQ FN GB
8,200 pF 822 J K M CJ DR EQ FN GB
10,000 pF 103 J K M CJ DR EQ FN GB
12,000 pF 123 J K M DR EQ FN GB
15,000 pF 153 J K M DR EQ FN GB
18,000 pF 183 J K M DR EQ FN GB
22,000 pF 223 J K M DR EQ FN GB HB
27,000 pF 273 J K M DG EQ FN GB HB
33,000 pF 333 J K M DG EQ FN GB HB
39,000 pF 393 J K M DG EQ FN GB HB
47,000 pF 473 J K M DG ES FQ GB HB
56,000 pF 563 J K M DG ES FQ GB HB
68,000 pF 683 J K M DG ES FQ GB HB
82,000 pF 823 J K M ES FA GB HB JC
0.10 µF 104 J K M EM FZ GB HB JC KC
0.12 µF 124 J K M EM FU GB HB JC KC
0.15 µF 154 J K M EH FM GE HB JC KC
0.18 µF 184 J K M EM FK GG HB JC KC
0.22 µF 224 J K M EH FK GG HB JC KC
0.27 µF 274 J K M FP GG HB JC KC
0.33 µF 334 J K M FM GG HB JC KC
0.39 µF 394 J K M FK GG HD JC KC
0.47 µF 474 J K M FS GJ HD JC KD
0.56 µF 564 J K M HD JD KD
0.68 µF 684 J K M HD JD KD
0.82 µF 824 J K M HF JF KE
1.0 µF 105 J K MHF JF KE
1.2 µF 125 J K M KE
Capacitance Capacitance
Code
Rated Voltage
(VDC)
250 250 250 250 250 250 250 250
Voltage Code AAAAAAAA
Case Size/
Series
C0603 C0805C C1206C C1210C C1812C C1825C C2220C C2225C
ammm Compancnls KEIVIEI' Emma): 00 DR 00 E0 E5 EM EH FN F0 FA FZ FU FP FM FK F5 00 GE GE 00 H3 H0 HF Jc JD JF Kc KD KE 0603 0805 0805 1206 1206 1206 1206 1210 1210 1210 1210 1210 1210 1210 1210 1210 1812 1812 1812 1812 1325 1325 1325 2220 2220 2220 2225 2225 2225 0.80 10.15" 0.73 10.20 1.25 10.15 0.73 10.20 1.00 10.20 1.25 10.15 1.60 10.20 0 78 10.20 0 90 10.20 1.10 10.15 1.25 10.20 1.55 10.20 1.60 10.20 1.70 10.20 2.10 10.20 2 50 10.30 1.00 10.10 1.30 10.10 1.55 10.10 1 70 10 15 1.10 10.15 1.30 10.15 1.50 10.15 1.10 10.15 1.30 10.15 1.50 10.15 1.10 10.15 1.30 10.15 1.40 10.15 4,000 4,000 4,000 o oooooooooooooooooooooooo 15,000 10,000 10,000 aoomooooooooooooooooooooo 2,500 4,000 2,500 2,500 2,000 4,000 4,000 2,500 2,500 2,000 2,000 2,000 2,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 1,000 10,000 10,000 10,000 10,000 3,000 10,000 10,000 10,000 10,000 8,000 8,000 8,000 8,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000 4,000
7© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size
Thickness ±
Range (mm)
Paper Quantity Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
CJ
0603
0.80 ±0.15*
4,000
15,000
0
0
DR
0805
0.78 ±0.20
4,000
10,000
0
0
DG
0805
1.25 ±0.15
0
0
2,500
10,000
EQ
1206
0.78 ±0.20
4,000
10,000
4,000
10,000
ES
1206
1.00 ±0.20
0
0
2,500
10,000
EM
1206
1.25 ±0.15
0
0
2,500
10,000
EH
1206
1.60 ±0.20
0
0
2,000
8,000
FN
1210
0.78 ±0.20
0
0
4,000
10,000
FQ
1210
0.90 ±0.20
0
0
4,000
10,000
FA
1210
1.10 ±0.15
0
0
2,500
10,000
FZ
1210
1.25 ±0.20
0
0
2,500
10,000
FU
1210
1.55 ±0.20
0
0
2,000
8,000
FP
1210
1.60 ±0.20
0
0
2,000
8,000
FM
1210
1.70 ±0.20
0
0
2,000
8,000
FK
1210
2.10 ±0.20
0
0
2,000
8,000
FS
1210
2.50 ±0.30
0
0
1,000
4,000
GB
1812
1.00 ±0.10
0
0
1,000
4,000
GE
1812
1.30 ±0.10
0
0
1,000
4,000
GG
1812
1.55 ±0.10
0
0
1,000
4,000
GJ
1812
1.70 ±0.15
0
0
1,000
4,000
HB
1825
1.10 ±0.15
0
0
1,000
4,000
HD
1825
1.30 ±0.15
0
0
1,000
4,000
HF
1825
1.50 ±0.15
0
0
1,000
4,000
JC
2220
1.10 ±0.15
0
0
1,000
4,000
JD
2220
1.30 ±0.15
0
0
1,000
4,000
JF
2220
1.50 ±0.15
0
0
1,000
4,000
KC
2225
1.10 ±0.15
0
0
1,000
4,000
KD
2225
1.30 ±0.15
0
0
1,000
4,000
KE
2225
1.40 ±0.15
0
0
1,000
4,000
Thickness
Code
Case
Size
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity Plastic Quantity
Package quantity based on finished chip thickness specifications.
ammmc compmm KEIVIEI' crummy:
8© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 2B – Bulk Packaging Quantities
Packaging Type Loose Packaging
Bulk Bag (default)
Packaging C-Spec1N/A2
Case Size Packaging Quantities (pieces/unit packaging)
EIA (in) Metric (mm) Minimum Maximum
0402
1005
1
50,000
0603
1608
0805
2012
1206
3216
1210
3225
1808
4520
20,000
1812
4532
1825
4564
2220
5650
2225
5664
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be
included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.
Commercial grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk
bag packaging option for automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and automotive grade products). The
15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our
standard "Bulk Bag" packaging.
E‘ucuomc Compcnonu KEIWEI' CHARGED!
9© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
1825 4564 2.15 1.60 6.90 6.90 7.90 2.05 1.40 6.80 6.00 7.30 1.95 1.20 6.70 5.30 7.00
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
2225 5664 2.70 1.70 6.90 8.10 7.90 2.60 1.50 6.80 7.20 7.30 2.50 1.30 6.70 6.50 7.00
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
E‘ucuomc Compcnonu K CHARGED!
10© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
CY X V1 V2 CY X V1 V2 CY X V1 V2
0805 2012 0.99 1.44 1.66 4.47 2.71 0.89 1.24 1.56 3.57 2.11 0.79 1.04 1.46 2.42 1.81
1206 3216 1.59 1.62 2.06 5.85 3.06 1.49 1.42 1.96 4.95 2.46 1.39 1.22 1.86 4.25 2.16
1210 3225 1.59 1.62 3.01 5.90 4.01 1.49 1.42 2.91 4.95 3.41 1.39 1.22 2.81 4.25 3.11
1812 4532 2.30 1.75 2.30 7.4 0 3.30 2.20 1.55 2.20 6.50 2.70 2.10 1.35 2.10 5.80 2.40
1825 4564 2.15 1.80 6.90 7.10 7.90 2.05 1.60 6.80 6.20 7.30 1.95 1.40 6.70 5.50 7.00
2220 5650 2.85 2.10 5.50 8.80 6.50 2.75 1.90 5.40 7.90 5.90 2.65 1.70 5.30 7.20 5.60
2225 5664 2.85 2.10 6.90 8.80 7.90 2.75 1.90 6.80 7.90 7.30 2.65 1.70 6.70 7.20 7.00
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
Eiecxmmc Compancnls KEIVIEI' mama): 5mm 5mm Smax Smax 3°C/second 3°C/second maximum maximum (VG/second (VG/second maximum maximum
11© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Soldering Process
Recommended Soldering Technique:
 •SolderwaveorsolderreflowforEIAcasesizes0603,0805and1206
 •AllotherEIAcasesizesarelimitedtosolderreflowonly
Recommended Reflow Soldering Profile:
KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereflowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedprofileconditionsforconvectionandIRreflowreflecttheprofileconditionsoftheIPC/
J-STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereflowpasses
attheseconditions.
Profile Feature Termination Finish
SnPb 100% Matte Sn
Preheat/Soak
Temperature Minimum (TSmin)
100°C
150°C
Temperature Maximum (T
Smax
)150°C 200°C
Time (tS) from TSmin to TSmax
60 – 120 seconds
60 – 120 seconds
Ramp-Up Rate (TL to TP)
3°C/second
maximum
3°C/second
maximum
LiquidousTemperature(TL)183°C 217°C
TimeAboveLiquidous(tL) 60 – 150 seconds 60 – 150 seconds
Peak Temperature (TP)235°C 260°C
TimeWithin5°CofMaximum
Peak Temperature (t
P
)
20 seconds
maximum
30 seconds
maximum
Ramp-Down Rate (TP to TL)
6°C/second
maximum
6°C/second
maximum
Time 25°C to Peak
Temperature
6 minutes
maximum
8 minutes
maximum
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum ramp up rate = 3°C/second
Maximum ramp down rate = 6°C/second
tP
tL
ts
25°C to Peak
Electronic Componcnls KEIl/IEI' EHARGED! Load humidity: 1,000 hours BET/05% RH and rated voltage. Add 100 K ohm resistor. Measurement at 24 hours :4 hours aitertest conclusion. Low volt humidity: 1,000 hours 85"C/BS% RH and 1.5 V. Add 100 K ohm resistor. Measurement at 24 hours :4 hours aitertest conclusion. M|L7STD7202 t = 24 hours/cycle. Steps 7a and 7b not required. Method 106 M|L7STD7202 755"C/+125’C. Note: Number of cycles required 7 300. Maximum translertime 7 20 Method 107 M|L7STD7202 Method 108/EIA7198 M|L7STD7202 Method 108 5 g‘s lor 20 minutes, 12 cycles each ol 3 orientations. Note: Use 3" X 5" PCB 0.031" thick 7 secure points on one long side and 2 secure points at corners of mounted Within 2" from any secure DDIHL Test from 10 7 2,000 Hz M|L7STD7202 Method 213 M|L7STD7202 Method 215
12© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress Reference Test or Inspection Method
TerminalStrength JIS–C–6429 Appendix 1, Note: Force of 1.8 kg for 60 seconds.
Board Flex JIS–C–6429
Appendix 2, Note: Standard termination system – 2.0 mm (minimum) for all except 3 mm
for C0G. Flexible termination system – 3.0 mm (minimum).
Solderability J–STD–002
Magnification50X,conditions:
a)MethodB,4hoursat155°C,dryheatat235°C
b)MethodBcategory3at215°C
c)MethodD,category3at260°C
Temperature Cycling JESD22MethodJA–104 1,000Cycles(−55°Cto+125°C).Measurementat24hours±4hoursaftertestconclusion.
Biased Humidity MIL–STD–202
Method103
Loadhumidity:1,000hours85°C/85%RHandratedvoltage.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Lowvolthumidity:1,000hours85°C/85%RHand1.5V.Add100Kohmresistor.
Measurementat24hours±4hoursaftertestconclusion.
Moisture Resistance
MIL–STD–202
Method106
t=24hours/cycle.Steps7aand7bnotrequired.
Measurementat24hours±4hoursaftertestconclusion.
ThermalShock
MIL–STD–202
Method107
−55°C/+125°C.Note:Numberofcyclesrequired–300.Maximumtransfertime–20
seconds. Dwell time – 15 minutes. Air – air.
HighTemperatureLife
MIL–STD–202
Method108/EIA–198
1,000hoursat125°C(85°CforX5R,Z5UandY5V)with2Xratedvoltageapplied.
Storage Life
MIL–STD–202
Method108
150°C,0VDCfor1,000hours.
Vibration MIL–STD–202
Method204
5g'sfor20minutes,12cycleseachof3orientations.Note:Use8"X5"PCB0.031"thick
7 secure points on one long side and 2 secure points at corners of opposite sides. Parts
mountedwithin2"fromanysecurepoint.Testfrom10–2,000Hz
MechanicalShock
MIL–STD–202
Method213
Figure1ofMethod213,ConditionF.
Resistance to Solvents
MIL–STD–202
Method215
Addaqueouswashchemical,OKEMCleanorequivalent.
Storage & Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°Candmaximum
storagehumiditynotexceed70%relativehumidity.Temperaturefluctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.
.................... CHARGED!
13© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Construction – Standard Termination
Dielectric
Material (BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min) End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
Construction – Flexible Termination
Dielectric
Material (BaTiO3)
Detailed Cross Section
Barrier Layer
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn /
SnPb - 5% Pb min)
Inner Electrodes
(Ni)
Dielectric Material
(BaTiO3)
Epoxy Layer
(Ag)
Epoxy Layer
(Ag)
End Termination/
External Electrode
(Cu)
End Termination/
External Electrode
(Cu)
summc Con-pan m KEIVIEI' CHARGED.
14© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Capacitor Marking (Optional):
Thesesurfacemountmultilayerceramiccapacitorsare
normallysuppliedunmarked.Ifrequired,theycanbe
marked as an extra cost option. Marking is available
onmostKEMETdevices,butmustberequestedusing
thecorrectorderingcodeidentifier(s).Ifthisoptionis
requested,twosidesoftheceramicbodywillbelaser
markedwitha“K”toidentifyKEMET,followedbytwo
characters(perEIA–198-seetablebelow)toidentifythe
capacitance value. EIA 0603 case size devices are limited
tothe“K”characteronly.
Laser marking option is not available on:
• C0G,ultrastableX8RandY5Vdielectricdevices.
• EIA 0402 case size devices.
• EIA0603casesizedeviceswithflexibletermination
option.
• KPS commercial and automotive grade stacked
devices.
• X7R dielectric products in capacitance values outlined
below.
Marking appears in legible contrast. Illustrated below
isanexampleofanMLCCwithlasermarkingof“KA8”,
whichdesignatesaKEMETdevicewithratedcapacitance
of 100 µF. Orientation of marking is vendor optional.
KEMET
ID
2-Digit
Capacitance
Code
EIA Case Size Metric Size Code Capacitance
0603
1608
≤170pF
0805
2012
≤150pF
1206
3216
≤910pF
1210
3225
≤2,000pF
1808
4520
≤3,900pF
1812
4532
≤6,700pF
1825
4564
≤0.018µF
2220
5650
≤0.027µF
2225
5664
≤0.033µF
ammmc Compononl: KEIWEI' cums): -acitance F Fur Varinus AI halNumeralldentifiers
15© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Capacitor Marking (Optional) cont’d
Capacitance (pF) For Various Alpha/Numeral Identifi ers
Alpha
Character
Numeral
9
0
1
2
3
4
5
6
7
8
Capacitance (pF)
A
0.10
1.0
10
100
1,000
10,000
100,000
1,000,000
10,000,000
100,000,000
B 0.11 1.1 11 110 1,100 11,000 110,000 1,100,000 11,000,000 110,000,000
C
0.12
1.2
12
120
1,200
12,000
120,000
1,200,000
12,000,000
120,000,000
D
0.13
1.3
13
130
1,300
13,000
130,000
1,300,000
13,000,000
130,000,000
E
0.15
1.5
15
150
1,500
15,000
150,000
1,500,000
15,000,000
150,000,000
F
0.16
1.6
16
160
1,600
16,000
160,000
1,600,000
16,000,000
160,000,000
G 0.18 1.8 18 180 1,800 18,000 180,000 1,800,000 18,000,000 180,000,000
H
0.20
2.0
20
200
2,000
20,000
200,000
2,000,000
20,000,000
200,000,000
J
0.22
2.2
22
220
2,200
22,000
220,000
2,200,000
22,000,000
220,000,000
K
0.24
2.4
24
240
2,400
24,000
240,000
2,400,000
24,000,000
240,000,000
L
0.27
2.7
27
270
2,700
27,000
270,000
2,700,000
27,000,000
270,000,000
M 0.30 3.0 30 300 3,000 30,000 300,000 3,000,000 30,000,000 300,000,000
N
0.33
3.3
33
330
3,300
33,000
330,000
3,300,000
33,000,000
330,000,000
P
0.36
3.6
36
360
3,600
36,000
360,000
3,600,000
36,000,000
360,000,000
Q
0.39
3.9
39
390
3,900
39,000
390,000
3,900,000
39,000,000
390,000,000
R
0.43
4.3
43
430
4,300
43,000
430,000
4,300,000
43,000,000
430,000,000
S 0.47 4.7 47 470 4,700 47,000 470,000 4,700,000 47,000,000 470,000,000
T
0.51
5.1
51
510
5,100
51,000
510,000
5,100,000
51,000,000
510,000,000
U
0.56
5.6
56
560
5,600
56,000
560,000
5,600,000
56,000,000
560,000,000
V
0.62
6.2
62
620
6,200
62,000
620,000
6,200,000
62,000,000
620,000,000
W
0.68
6.8
68
680
6,800
68,000
680,000
6,800,000
68,000,000
680,000,000
X 0.75 7.5 75 750 7,500 75,000 750,000 7,500,000 75,000,000 750,000,000
Y
0.82
8.2
82
820
8,200
82,000
820,000
8,200,000
82,000,000
820,000,000
Z
0.91
9.1
91
910
9,100
91,000
910,000
9,100,000
91,000,000
910,000,000
a
0.25
2.5
25
250
2,500
25,000
250,000
2,500,000
25,000,000
250,000,000
b
0.35
3.5
35
350
3,500
35,000
350,000
3,500,000
35,000,000
350,000,000
d 0.40 4.0 40 400 4,000 40,000 400,000 4,000,000 40,000,000 400,000,000
e
0.45
4.5
45
450
4,500
45,000
450,000
4,500,000
45,000,000
450,000,000
f
0.50
5.0
50
500
5,000
50,000
500,000
5,000,000
50,000,000
500,000,000
m
0.60
6.0
60
600
6,000
60,000
600,000
6,000,000
60,000,000
600,000,000
n
0.70
7.0
70
700
7,000
70,000
700,000
7,000,000
70,000,000
700,000,000
t 0.80 8.0 80 800 8,000 80,000 800,000 8,000,000 80,000,000 800,000,000
y
0.90
9.0
90
900
9,000
90,000
900,000
9,000,000
90,000,000
900,000,000
ammm Compancnls KEIVIEI' Emma): Bmm.12mm 180mm (700») mmmm camenape KPS1812 and 2220
16© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Tape & Reel Packaging Information
KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewith
EIAStandard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2for
detailsonreelingquantitiesforcommercialchips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Confi guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7" Reel 13" Reel 7" Reel 13" Reel
Pitch(P
1
)* Pitch(P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 – 1210 84444
1805 – 1808 12 4 4
≥1812 12 8 8
KPS 1210 12 8 8
KPS 1812
and 2220
16 12 12
Array 0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifi cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotive grade 7" reel unmarked
C-3191
Automotive grade 13" reel unmarked
C-7081
Commercial grade 7" reel unmarked
C-7082
Commercial grade 13" reel unmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Benefi ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Doublethepartsoneachreelresultsinfewerreel
changesandincreasedefficiency.
• Fewerreelsresultinlowerpackaging,shippingand
storage costs, reducing waste.
Eiecxmmc Compancnls KEIVIEI' EHARGED: ‘ ' F mum: DY Minimum R Reierence SY Minimum T T‘ Note 1 Note 2 Note 3 Maximum Maximum i3Y Maximum E2 T2 W Nole4 Minimum Maximum Maximum
17© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
R Reference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single (4 mm)
4.35
(0.171)
6.25
(0.246)
3.5 ±0.05
(0.138 ±0.002)
4.0 ±0.10
(0.157 ±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single (4 mm)
and double (8 mm)
8.2
(0.323)
10.25
(0.404)
5.5 ±0.05
(0.217 ±0.002)
8.0 ±0.10
(0.315 ±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple (12 mm)
12.1
(0.476)
14.25
(0.561)
7.5 ±0.05
(0.138 ±0.002)
12.0 ±0.10
(0.157 ±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defi ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
ammm Compancnls KEIVI mam): T - V 1 f ¢¢§9 W \ +7: Tiifi‘eri / #4 j/ l ‘X J x — RRefevence NmeZ 0.10 (0.904) maXImum (afiiflig (0237) 4.0 10.10 3.3 (0.157 :a 004) (0.327)
18© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
R Reference
Note 2
8 mm 1.5 +0.10 -0.0
(0.059 +0.004 -0.0) 1.75 ±0.10
(0.069 ±0.004) 4.0 ±0.10
(0.157 ±0.004) 2.0 ±0.05
(0.079 ±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half (2 mm) 6.25
(0.246) 3.5 ±0.05
(0.138 ±0.002)
2.0 ±0.05
(0.079 ±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single (4 mm)
4.0 ±0.10
(0.157 ±0.004)
8.3
(0.327)
1. The cavity defi ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
cccccccccccccccccccc Emma): e 7/////////////////////l‘ e O @379
19© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1 to 1.0 newton (10 to 100 gf)
12 and 16 mm 0.1 to 1.3 newton (10 to 130 gf)
Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300 ±10 mm/minute.
3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
ammm Compancnls KEIVIEI' Emma): 0.4 mes/+0.0 (0331 +0 059400) 12.4 +2 0/00 (0.40:; +0 070/0 0) 15.4 +2.0/+0.0 (0.646 +0 070/0 0) 14.4 (0 567) 10.4 (0.724) 22.4 (0 882)
20© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W
3
(Includes
flange distortion
at outer edge)
W
2
(Measured at hub)
W
1
(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178 ±0.20
(7.008 ±0.008)
or
330 ±0.20
(13.000 ±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
14.4
(0.567)
Shallaccommodatetape
widthwithoutinterference
12 mm
12.4+2.0/−0.0
(0.488+0.078/−0.0)
18.4
(0.724)
16 mm
16.4+2.0/−0.0
(0.646+0.078/−0.0)
22.4
(0.882)
EHARGED! 1 fi%¢ee¢o¢¢ o¢ as» ¢¢‘eo¢»$—e¢¢ / u )) rH/mm‘ yllm‘ #e4 keH/ +4 #:4 #é+\#++ \ \LLJ LLW (Lu ‘9900099fl/60fi999wv99 \‘ 90999990 Waif¢‘W¢oe6Too‘6o1 lg: Qiiiggfi1u9M133333§L @y’émawmammm gag“? HHHHH H‘HHHHH
21© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
ammmc compmm KEIVIEI' cumin:
22© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard C1011_X7R_TIP_RING_SMD • 12/17/2018
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Telecom Tip & Ring, X7R Dielectric, 250 VDC (Commercial Grade)
KEMET Electronics Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
Disclaimer
Allproductspecifications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
checkingandverifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced.AllInformationgiven
hereinisbelievedtobeaccurateandreliable,butitispresentedwithoutguarantee,warranty,orresponsibilityofanykind,expressedorimplied.
StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecificallydisclaims–anywarrantyconcerningsuitabilityforaspecificcustomerapplicationoruse.
TheInformationisintendedforuseonlybycustomerswhohavetherequisiteexperienceandcapabilitytodeterminethecorrectproductsfortheirapplication.Any
technicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumes
noobligationorliabilityfortheadvicegivenorresultsobtained.
AlthoughKEMETdesignsandmanufacturesitsproductstothemoststringentqualityandsafetystandards,giventhecurrentstateoftheart,isolatedcomponent
failuresmaystilloccur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjury
or property damage.
Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatother
measuresmaynotberequired.
KEMET is a registered trademark of KEMET Electronics Corporation.

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