74HC(T)244 Datasheet by NXP USA Inc.

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1. General description
The 74HC244; 74HCT244 is an 8-bit buffer/line driver with 3-state outputs. The device
can be used as two 4-bit buffers or one 8-bit buffer. The device features two output
enables (1OE and 2OE), each controlling four of the 3-state outputs. A HIGH on nOE
causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes
that enable the use of current limiting resistors to interface inputs to voltages in excess of
VCC.
2. Features and benefits
Input levels:
For 74HC244: CMOS level
For 74HCT244: TTL level
Octal bus interface
Non-inverting 3-state outputs
Complies with JEDEC standard no. 7 A
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
Multiple package options
Specified from 40 Cto +85C and 40 Cto +125C
3. Ordering information
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Rev. 4 — 24 September 2012 Product data sheet
Table 1. Ordering information
Type number Package
Temperature range Name Description Version
74HC244N 40 Cto+125C DIP20 plastic dual in-line package; 20 leads (300 mil) SOT146-1
74HCT244N
74HC244D 40 Cto+125C SO20 plastic small outline package; 20 leads;
body width 7.5 mm SOT163-1
74HCT244D
74HC244DB 40 Cto+125C SSOP20 plastic shrink small outline package; 20 leads;
body width 5.3 mm SOT339-1
74HCT244DB
74HC244PW 40 Cto+125C TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm SOT360-1
74HCT244PW
74HC244BQ 40 C to +125 C DHVQFN20 plastic dual-in-line compatible thermal enhanced
very thin quad flat package; no leads; 20 terminals;
body 2.5 4.5 0.85 mm
SOT764-1
74HCT244BQ
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 2 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
4. Functional diagram
Fig 1. Functional diagram
mna875
1A3
1A2
1A1
1A0
2
4
6
8
1
1Y0
1Y1
18
16
14
12
1Y2
1Y3
1OE
2A3
2A2
2A1
2A0
17
15
13
11
19
2Y0
2Y1
3
5
7
9
2Y2
2Y3
2OE
Fig 2. Logic symbol Fig 3. IEC logic symbol
mna874
8
6
4
2
1A0
1A1
1A2
1A3
1OE
18
16
1Y0
1Y1
1Y2
1Y3
14
12
1
11
13
15
17
2A0
2A1
2A2
2A3
2OE
3
5
2Y0
2Y1
2Y2
2Y3
7
9
19
12
14
2
4
6
8
18
16
1EN
mna873
3
5
11
13
15
17
9
7
19 EN
7 CCCCCCCC W U fl fl 33333333 7 3333333333 O EEEEEEEEEE 7 G
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 3 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Pinning information
5.1 Pinning
5.2 Pin description
(1) This is not a supply pin. The substrate is attached to this
pad using conductive die attach material. There is no
electrical or mechanical requirement to solder this pad.
However, if it is soldered, the solder land should remain
floating or be connected to GND.
Fig 4. Pin configuration DIP20, SO20, (T)SSOP20 Fig 5. Pin configuration DHVQFN20
74HC244
74HCT244
1OE V
CC
1A0 2OE
2Y0 1Y0
1A1 2A0
2Y1 1Y1
1A2 2A1
2Y2 1Y2
1A3 2A2
2Y3 1Y3
GND 2A3
001aae011
1
2
3
4
5
6
7
8
9
10
12
11
14
13
16
15
18
17
20
19
001aae012
74HC244
74HCT244
Transparent top view
1Y3
1A3
2Y3
2A2
2Y2 1Y2
1A2 2A1
2Y1 1Y1
1A1 2A0
2Y0 1Y0
1A0 2OE
GND
2A3
1OE
V
CC
912
8 13
7 14
6 15
5 16
4 17
3 18
2 19
10
11
1
20
terminal 1
index area
GND
(1)
Table 2. Pin description
Symbol Pin Description
1OE, 2OE 1, 19 output enable input (active LOW)
1A0, 1A1, 1A2, 1A3 2, 4, 6, 8 data input
2Y0, 2Y1, 2Y2, 2Y3 3, 5, 7, 9 bus output
GND 10 ground (0 V)
2A0, 2A1, 2A2, 2A3 17, 15, 13, 11 data input
1Y0, 1Y1, 1Y2, 1Y3 18, 16, 14, 12 bus output
VCC 20 supply voltage
la,
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 4 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
6. Functional description
[1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state.
7. Limiting values
[1] For DIP20 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO20 packages: Ptot derates linearly with 8 mW/K above 70 C.
For SSOP20 and TSSOP20 packages: Ptot derates linearly with 5.5 mW/K above 60 C.
For DHVQFN20 packages: above 60 C, Ptot derates linearly with 4.5 mW/K.
8. Recommended operating conditions
Table 3. Function table[1]
Input Output
nOE nAn nYn
LLL
LHH
HXZ
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions Min Max Unit
VCC supply voltage 0.5 +7 V
IIK input clamping current VI < 0.5 V or VI>V
CC +0.5 V - 20 mA
IOK output clamping current VO<0.5 V or VO>V
CC +0.5V - 20 mA
IOoutput current 0.5 V < VO < VCC +0.5V - 35 mA
ICC supply current - 70 mA
IGND ground current 70 - mA
Tstg storage temperature 65 +150 C
Ptot total power dissipation DIP20 package [1] - 750 mW
SO20, SSOP20, TSSOP20 and
DHVQFN20 packages
[2] - 500 mW
Table 5. Recommended operating conditions
Symbol Parameter Conditions Min Typ Max Unit
74HC244
VCC supply voltage 2.0 5.0 6.0 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
t/V input transition rise and fall rate VCC = 2.0 V - - 625 ns/V
VCC = 4.5 V - 1.67 139 ns/V
VCC = 6.0 V - - 83 ns/V
Tamb ambient temperature 40 - +125 C
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 5 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
9. Static characteristics
74HCT244
VCC supply voltage 4.5 5.0 5.5 V
VIinput voltage 0 - VCC V
VOoutput voltage 0 - VCC V
t/V input transition rise and fall rate VCC = 4.5 V - 1.67 139 ns/V
Tamb ambient temperature 40 - +125 C
Table 5. Recommended operating conditions …continued
Symbol Parameter Conditions Min Typ Max Unit
Table 6. Static characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
74HC244
VIH HIGH-level
input voltage VCC = 2.0 V 1.5 1.2 - 1.5 - 1.5 - V
VCC = 4.5 V 3.15 2.4 - 3.15 - 3.15 - V
VCC = 6.0 V 4.2 3.2 - 4.2 - 4.2 - V
VIL LOW-level
input voltage VCC = 2.0 V - 0.8 0.5 - 0.5 - 0.5 V
VCC = 4.5 V - 2.1 1.35 - 1.35 - 1.35 V
VCC = 6.0 V - 2.8 1.8 - 1.8 - 1.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL
IO=20 A; VCC = 2.0 V 1.9 2.0 - 1.9 - 1.9 - V
IO=20 A; VCC = 4.5 V 4.4 4.5 - 4.4 - 4.4 - V
IO=20 A; VCC = 6.0 V 5.9 6.0 - 5.9 - 5.9 - V
IO=6.0 mA; VCC = 4.5 V 3.98 4.32 - 3.84 - 3.7 - V
IO=7.8 mA; VCC = 6.0 V 5.48 5.81 - 5.34 - 5.2 - V
VOL LOW-level
output voltage VI=V
IH or VIL
IO=20A; VCC = 2.0 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 4.5 V - 0 0.1 - 0.1 - 0.1 V
IO=20A; VCC = 6.0 V - 0 0.1 - 0.1 - 0.1 V
IO=6.0mA; V
CC = 4.5 V - 0.15 0.26 - 0.33 - 0.4 V
IO=7.8mA; V
CC = 6.0 V - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC =6.0V --0.1 - 1.0 - 1.0 A
IOZ OFF-state
output current per input pin; VI=V
IH or VIL;
VO=V
CC or GND;
other inputs at VCC or GND;
VCC =6.0V; I
O=0A
--0.5 - 5.0 - 10 A
ICC supply current VI=V
CC or GND; IO=0A;
VCC =6.0V - - 8.0 - 80 - 160 A
CIinput
capacitance -3.5 - - - - - pF
Figure 8 Figure 6
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 6 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
10. Dynamic characteristics
74HCT244
VIH HIGH-level
input voltage VCC = 4.5 V to 5.5 V 2.0 1.6 - 2.0 - 2.0 - V
VIL LOW-level
input voltage VCC = 4.5 V to 5.5 V - 1.2 0.8 - 0.8 - 0.8 V
VOH HIGH-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20 A 4.4 4.5 - 4.4 - 4.4 - V
IO=6 mA 3.98 4.32 - 3.84 - 3.7 - V
VOL LOW-level
output voltage VI=V
IH or VIL; VCC =4.5V
IO=20A - 0 0.1 - 0.1 - 0.1 V
IO= 6.0 mA - 0.16 0.26 - 0.33 - 0.4 V
IIinput leakage
current VI=V
CC or GND;
VCC =5.5V --0.1 - 1.0 - 1.0 A
IOZ OFF-state
output current per input pin; VI=V
IH or VIL;
VO=V
CC or GND;
other inputs at VCC or GND;
VCC =5.5V; I
O=0A
--0.5 - 5.0 - 10 A
ICC supply current VI=V
CC or GND;
VCC =5.5V; I
O=0A - - 8.0 - 80 - 160 A
ICC additional
supply current per input pin;
VI=V
CC 2.1 V;
other inputs at VCC or GND;
VCC = 4.5 V to 5.5 V;
IO=0A
- 70 252 - 315 - 343 A
CIinput
capacitance -3.5 - - - - - pF
Table 6. Static characteristics …continued
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).
Symbol Parameter Conditions 25 C40 C to +85 C40 C to +125 CUnit
Min Typ Max Min Max Min Max
Table 7. Dynamic characteristics
GND = 0 V; for load circuit see Figure 8.
Symbol Parameter Conditions 25 C40 C to +125 CUnit
Min Typ Max Max
(85 C) Max
(125 C)
74HC244
tpd propagation delay nAn to nYn;
see Figure 6
[1]
VCC = 2.0 V - 30 110 145 165 ns
VCC = 4.5 V - 11 22 28 33 ns
VCC = 5.0 V; CL=15pF - 9 - - - ns
VCC = 6.0 V - 9 19 24 28 ns
Figure 8 Figure 7 Figure 7 Figure 6 Figure 6 Figure 7 FIgure 7 Figure 6
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 7 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
[1] tpd is the same as tPHL and tPLH.
[2] ten is the same as tPZH and tPZL.
[3] tdis is the same as tPHZ and tPLZ.
[4] tt is the same as tTHL and tTLH.
[5] CPD is used to determine the dynamic power dissipation (PD in W):
PD=C
PD VCC2fiN+ (CLVCC2fo) where:
fi= input frequency in MHz;
fo= output frequency in MHz;
CL= output load capacitance in pF;
VCC = supply voltage in V;
N = number of inputs switching;
(CLVCC2fo) = sum of outputs.
ten enable time nOE to nYn; see Figure 7 [2]
VCC = 2.0 V - 36 150 190 225 ns
VCC = 4.5 V - 13 30 38 45 ns
VCC = 6.0 V - 10 26 33 38 ns
tdis disable time nOE to nYn or see Figure 7 [3]
VCC = 2.0 V - 39 150 190 225 ns
VCC = 4.5 V - 14 30 38 45 ns
VCC = 6.0 V - 11 26 33 38 ns
tttransition time see Figure 6 [4]
VCC = 2.0 V - 14 60 75 90 ns
VCC = 4.5 V - 5 12 15 18 ns
VCC = 6.0 V - 4 10 13 15 ns
CPD power dissipation
capacitance per buffer; VI=GNDtoV
CC [5] -35- - -pF
74HCT244
tpd propagation delay nAn to nYn;
see Figure 6
[1]
VCC = 4.5 V - 13 22 28 33 ns
VCC = 5.0 V; CL=15pF - 11 - - - ns
ten enable time nOE to nYn; VCC = 4.5 V; see
Figure 7
[2] -153038 45ns
tdis disable time nOE to nYn; VCC = 4.5 V; see
Figure 7
[3] -152531 38ns
tttransition time VCC = 4.5 V; see Figure 6 [4] - 5 12 15 18 ns
CPD power dissipation
capacitance per buffer;
VI=GNDtoV
CC 1.5 V
[5] -35- - -pF
Table 7. Dynamic characteristics …continued
GND = 0 V; for load circuit see Figure 8.
Symbol Parameter Conditions 25 C40 C to +125 CUnit
Min Typ Max Max
(85 C) Max
(125 C)
‘ + + . ‘ * .
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 8 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
11. Waveforms
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 6. Input (nAn) to output (nYn) propagation delays and output transition times
001aae013
tPLH
tPHL
VM
VM
VMVM
nYn output
nAn input
VI
GND
VOH
VOL
tTLH
tTHL
90 %
10 %
Measurement points are given in Table 8.
VOL and VOH are typical voltage output levels that occur with the output load.
Fig 7. 3-state enable and disable times
Table 8. Measurement points
Type Input Output
VMVMVXVY
74HC244 0.5 VCC 0.5 VCC 0.1 VCC 0.9 VCC
74HCT244 1.3 V 1.3 V 0.1 VCC 0.9 VCC
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 9 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Test data is given in Table 9.
Definitions test circuit:
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
CL = Load capacitance including jig and probe capacitance.
RL = Load resistance.
S1 = Test selection switch.
Fig 8. Test circuit for measuring switching times
V
M
V
M
t
W
t
W
10 %
90 %
0 V
V
I
V
I
negative
pulse
positive
pulse
0 V
V
M
V
M
90 %
10 %
t
f
t
r
t
r
t
f
001aad983
DUT
V
CC
V
CC
VIVO
RT
RLS1
CL
open
G
Table 9. Test data
Type Input Load S1 position
VItr, tfCLRLtPHL, tPLH tPZH, tPHZ tPZL, tPLZ
74HC244 VCC 6ns 15pF, 50 pF 1kopen GND VCC
74HCT244 3 V 6 ns 15 pF, 50 pF 1 kopen GND VCC
i WMHJURA‘HJKALJHALJ
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 10 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
12. Package outline
Fig 9. Package outline SOT146-1 (DIP20)
UNIT A
max. 1 2 b1cD E e M
H
L
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
SOT146-1 99-12-27
03-02-13
A
min. A
max. bZ
max.
w
ME
e1
1.73
1.30 0.53
0.38 0.36
0.23 26.92
26.54 6.40
6.22 3.60
3.05 0.2542.54 7.62 8.25
7.80 10.0
8.3 24.2 0.51 3.2
0.068
0.051 0.021
0.015 0.014
0.009 1.060
1.045 0.25
0.24 0.14
0.12 0.010.1 0.3 0.32
0.31 0.39
0.33 0.0780.17 0.02 0.13
SC-603MS-001
MH
c
(e )
1
ME
A
L
seating plane
A1
wM
b1
e
D
A2
Z
20
1
11
10
b
E
pin 1 index
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
(1)
(1) (1)
DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1
Er©
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 11 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 10. Package outline SOT163-1 (SO20)
UNIT A
max. A1A2A3bpcD
(1) E(1) (1)
eH
ELL
pQZ
ywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm
inches
2.65 0.3
0.1 2.45
2.25 0.49
0.36 0.32
0.23 13.0
12.6 7.6
7.4 1.27 10.65
10.00 1.1
1.0 0.9
0.4 8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.1
0.4
SOT163-1
10
20
wM
bp
detail X
Z
e
11
1
D
y
0.25
075E04 MS-013
pin 1 index
0.1 0.012
0.004 0.096
0.089 0.019
0.014 0.013
0.009 0.51
0.49 0.30
0.29 0.05
1.4
0.055
0.419
0.394 0.043
0.039 0.035
0.016
0.01
0.25
0.01 0.004
0.043
0.016
0.01
0 5 10 mm
scale
X
θ
A
A1
A2
HE
Lp
Q
E
c
L
vMA
(A )
3
A
SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
99-12-27
03-02-19
SQ
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 12 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 11. Package outline SOT339-1 (SSOP20)
UNIT A1A2A3bpcD
(1) E(1) eH
ELL
pQ(1)
Zywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.21
0.05 1.80
1.65 0.38
0.25 0.20
0.09 7.4
7.0 5.4
5.2 0.65 7.9
7.6 0.9
0.7 0.9
0.5 8
0
o
o
0.131.25 0.2 0.1
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.
1.03
0.63
SOT339-1 MO-150 99-12-27
03-02-19
X
wM
θ
A
A1
A2
bp
D
HE
Lp
Q
detail X
E
Z
e
c
L
vMA
(A )
3
A
110
20 11
y
0.25
pin 1 index
0 2.5 5 mm
scale
SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1
A
max.
2
HHHHHHHHHH 0/ ‘ H H HHDHLH H HH- SQ
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 13 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 12. Package outline SOT360-1 (TSSOP20)
UNIT A1A2A3bpcD
(1) E(2) (1)
eH
ELL
pQZywv θ
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 0.15
0.05 0.95
0.80 0.30
0.19 0.2
0.1 6.6
6.4 4.5
4.3 0.65 6.6
6.2 0.4
0.3 0.5
0.2 8
0
o
o
0.13 0.10.21
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
0.75
0.50
SOT360-1 MO-153 99-12-27
03-02-19
wM
bp
D
Z
e
0.25
110
20 11
pin 1 index
θ
A
A1
A2
Lp
Q
detail X
L
(A )
3
HE
E
c
vMA
X
A
y
0 2.5 5 mm
scale
TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm SOT360-1
A
max.
1.1
——fi:lD 1 If \ W ,,,,,,, JV ,,,,,,,, 7 l% f i D *D+ Rem: HV/MH» L ‘ ‘ m e +iiU U U U€U U U U T 3 1 a4 «5* 777777 kflzjg flmmmmmflfl { ‘ SQ
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 14 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Fig 13. Package outline SOT764-1 (DHVQFN20)
terminal 1
index area
0.51
A1Eh
b
UNIT ye
0.2
c
REFERENCES
OUTLINE
VERSION EUROPEAN
PROJECTION ISSUE DATE
IEC JEDEC JEITA
mm 4.6
4.4
Dh
3.15
2.85
y1
2.6
2.4 1.15
0.85
e1
3.5
0.30
0.18
0.05
0.00 0.05 0.1
DIMENSIONS (mm are the original dimensions)
SOT764-1 MO-241 - - -- - -
0.5
0.3
L
0.1
v
0.05
w
0 2.5 5 mm
scale
SOT764-1
DHVQFN20: plastic dual in-line compatible thermal enhanced very thin quad flat package; no leads;
20 terminals; body 2.5 x 4.5 x 0.85 mm
A(1)
max.
AA1
c
detail X
y
y1C
e
L
Eh
Dh
e
e1
b
29
19 12
11
10
1
20
X
D
E
C
BA
terminal 1
index area
AC
C
B
vM
wM
E(1)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
D(1)
02-10-17
03-01-27
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 15 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
13. Abbreviations
14. Revision history
Table 10. Abbreviations
Acronym Description
CMOS Complementary Metal Oxide Semiconductor
DUT Device Under Test
ESD ElectroStatic Discharge
HBM Human Body Model
MM Machine Model
TTL Transistor-Transistor Logic
Table 11. Revision history
Document ID Release date Data sheet status Change notice Supersedes
74HC_HCT244 v.4 20120924 Product data sheet - 74HC_HCT244 v.3
Modifications: •The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
•Legal texts have been adapted to the new company name where appropriate.
74HC_HCT244 v.3 20051222 Product data sheet - 74HC_HCT244_CNV v.2
74HC_HCT244_CNV v.2 19901201 Product specification - -
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 16 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
15. Legal information
15.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
: hitE:I/www.nxg.com salesaddresses®nx9£0m
74HC_HCT244 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2012. All rights reserved.
Product data sheet Rev. 4 — 24 September 2012 17 of 18
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors 74HC244; 74HCT244
Octal buffer/line driver; 3-state
© NXP B.V. 2012. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 24 September 2012
Document identifier: 74HC_HCT244
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
17. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Functional description . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Recommended operating conditions. . . . . . . . 4
9 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
10 Dynamic characteristics . . . . . . . . . . . . . . . . . . 6
11 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
13 Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 15
14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15
15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 16
15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 16
15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
15.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17
16 Contact information. . . . . . . . . . . . . . . . . . . . . 17
17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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